TWI706245B - Heat dissipating device - Google Patents
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- TWI706245B TWI706245B TW108140725A TW108140725A TWI706245B TW I706245 B TWI706245 B TW I706245B TW 108140725 A TW108140725 A TW 108140725A TW 108140725 A TW108140725 A TW 108140725A TW I706245 B TWI706245 B TW I706245B
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- 230000005540 biological transmission Effects 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims description 80
- 230000000903 blocking effect Effects 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims 1
- 239000013256 coordination polymer Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
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- 230000001174 ascending effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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Abstract
Description
本發明是有關於一種散熱裝置,且特別是有關於一種實現自動開合散熱孔的散熱裝置。The present invention relates to a heat dissipation device, and in particular to a heat dissipation device that realizes automatic opening and closing of a heat dissipation hole.
現有的電子產品中,通常會配置用於降低電子產品運作溫度的散熱裝置。現有的散熱裝置多數採用風扇,可將電子產品內的高溫空氣排出電子產品,使得外部環境的低溫空氣可通過散熱孔進入電子產品中,通過高低溫空氣的循環以達到散熱降溫的功效。然而,現有的電子產品多數是在其殼體上設置開放式網孔,做為空氣循環的通道。然而,開放式網孔無法阻擋灰塵、水氣等環境中異物進入電子產品內部,其中灰塵的堆積可能造成電子產品的短路,水氣過多將使電子產品受潮。此外,開放式網孔會顯示出電子產品的內部結構,此影響電子產品的美觀。Existing electronic products are usually equipped with heat dissipation devices for reducing the operating temperature of the electronic products. Most of the existing heat dissipating devices use fans to discharge the high-temperature air in the electronic product, so that the low-temperature air in the external environment can enter the electronic product through the heat dissipation hole, and achieve the effect of heat dissipation and cooling through the circulation of high and low temperature air. However, most of the existing electronic products are provided with open meshes on their shells as channels for air circulation. However, the open mesh cannot prevent foreign objects in the environment such as dust and moisture from entering the inside of the electronic product. The accumulation of dust may cause a short circuit of the electronic product, and excessive moisture will make the electronic product damp. In addition, the open mesh will show the internal structure of the electronic product, which affects the aesthetics of the electronic product.
為此,如何發展出一種散熱裝置,當電子產品運作時,可維持網孔的連通以進行散熱。當電子產品未運作時,可自動關閉網孔,以避免灰塵、水氣等環境異物的侵入,並能提升電子產品的美觀,為當前的重要發展目標。For this reason, how to develop a heat dissipation device that can maintain the connection of the mesh for heat dissipation when the electronic product is in operation. When the electronic product is not in operation, the mesh can be automatically closed to avoid the intrusion of environmental foreign objects such as dust, moisture, etc., and to improve the aesthetics of the electronic product, which is an important current development goal.
本發明提供一種散熱裝置,適於安裝在電子產品的機殼內,散熱裝置可自動開合機殼的散熱孔,提升機殼外型的美觀且能減少環境異物的堆積。The invention provides a heat dissipation device, which is suitable for being installed in a casing of an electronic product. The heat dissipation device can automatically open and close the heat dissipation holes of the casing, improve the appearance of the casing and reduce the accumulation of environmental foreign matter.
本發明的種散熱裝置,配置於機殼中,機殼具有多個散熱孔。散熱裝置包括散熱模組、限位模組、升降模組、至少一個復位彈性件以及擋板。散熱模組具有風扇元件、傳動軸以及至少一個導向桿。傳動軸配置於風扇元件的中央處且沿風扇元件的軸向延伸,至少一個導向桿配置在風扇元件的頂面。限位模組配置於散熱模組的至少一個導向桿且間隔於風扇元件。升降模組可升降地配置於散熱模組的傳動軸且套設於至少一個導向桿,以連動於風扇元件。至少一個復位彈性件分別對應地套設於至少一個導向桿上,且各復位彈性件分別抵靠限位模組與升降模組。擋板連接於升降模組且間隔配置在散熱模組外。The heat dissipation device of the present invention is arranged in a casing, and the casing has a plurality of heat dissipation holes. The heat dissipation device includes a heat dissipation module, a limit module, a lifting module, at least one reset elastic element and a baffle. The heat dissipation module has a fan element, a transmission shaft and at least one guide rod. The transmission shaft is arranged at the center of the fan element and extends along the axial direction of the fan element, and at least one guide rod is arranged on the top surface of the fan element. The limit module is arranged on at least one guide rod of the heat dissipation module and is spaced from the fan element. The lifting module is configured to be lifted and lowered on the transmission shaft of the heat dissipation module and sleeved on at least one guide rod to be linked to the fan element. At least one reset elastic piece is correspondingly sleeved on at least one guide rod, and each reset elastic piece abuts against the limiting module and the lifting module respectively. The baffle is connected to the lifting module and is arranged at intervals outside the heat dissipation module.
當風扇元件轉動時,升降模組自初始位置朝限位模組移動並擠壓至少一個復位彈性件,且帶動擋板移動,直至擋板完全開啟機殼的多個散熱孔,當風扇元件停止轉動時,升降模組在至少一個復位彈性件的作用下返回至初始位置,並帶動擋板返回,以使擋板遮蔽機殼的多個散熱孔。When the fan element rotates, the lifting module moves from the initial position toward the limit module and squeezes at least one reset elastic member, and drives the baffle to move until the baffle completely opens the multiple heat dissipation holes of the casing. When the fan element stops When rotating, the lifting module returns to the initial position under the action of at least one reset elastic member, and drives the baffle back, so that the baffle shields the multiple heat dissipation holes of the casing.
基於上述,本發明的散熱裝置,使升降模組隨著散熱模組的轉動與否,而相對於傳動軸與導向桿進行升降,以帶動擋板開啟或遮蔽機殼的多個散熱孔。進一步而言,當散熱模組的風扇模組轉動時,可通過升降模組帶動擋板朝上移動直至完全開啟殼體的散熱孔。當散熱模組的風扇模組停止轉動時,可通過多個復位彈性件推動升降模組以帶動擋板朝下移動以遮蔽殼體的散熱孔。如此,當本發明散熱裝置未運作時,擋板可防止環境異物通過散熱孔而堆積在殼體內,亦可避免從散熱孔看見殼體內的組件以提升整體的美觀。Based on the above, the heat dissipation device of the present invention enables the lifting module to lift relative to the transmission shaft and the guide rod as the heat dissipation module rotates or not, so as to drive the baffle to open or cover the multiple heat dissipation holes of the casing. Furthermore, when the fan module of the heat dissipation module rotates, the baffle can be driven to move upward by the lifting module until the heat dissipation hole of the casing is fully opened. When the fan module of the heat dissipation module stops rotating, the lifting module can be pushed by a plurality of reset elastic members to drive the baffle to move downwards to cover the heat dissipation holes of the housing. In this way, when the heat dissipation device of the present invention is not in operation, the baffle can prevent environmental foreign matter from accumulating in the housing through the heat dissipation holes, and can also avoid seeing the components in the housing through the heat dissipation holes to improve the overall appearance.
圖1A為本發明一實施例的散熱裝置安裝於機殼的立體透視示意圖。圖1B為圖1A的散熱裝置的元件分解示意圖。圖1C為圖1A的散熱裝置的剖面示意圖。FIG. 1A is a perspective schematic diagram of a heat sink installed in a casing according to an embodiment of the present invention. FIG. 1B is an exploded schematic view of the components of the heat sink of FIG. 1A. FIG. 1C is a schematic cross-sectional view of the heat sink of FIG. 1A.
參考圖1A至圖1C,散熱裝置100配置於機殼200中,且述機殼200具有多個散熱孔210以及多個安裝座220。散熱裝置100用以將機殼200內的熱空氣自多個散熱孔210排出,使得環境中的冷空氣從多個散熱孔210進入,進而達成機殼200內的空氣循環以及散熱功效。舉例而言,機殼200例如是應用在電腦主機、伺服器或是其它電子裝置的零件容納結構。本實施例的散熱裝置100包括散熱模組110、限位模組120、升降模組130、至少一個復位彈性件140以及擋板150。1A to 1C, the
散熱模組110具有風扇元件111、傳動軸112以及至少一個導向桿113。The
風扇元件111配置在機殼200內且鄰近機殼200其中一側的多個散熱孔210。在本實施例中,風扇元件111例如是通過多個螺絲件而鎖固在相應的多個安裝座220上,以此固定風扇元件111,避免風扇元件111運作時產生晃動。The
傳動軸112配置於風扇元件111的中央處且沿風扇元件111的軸向AD朝上延伸。其中傳動軸112具有兩連接部CP以及螺紋部SP,兩連接部CP形成在傳動軸112的對向兩端且具有光滑表面,螺紋部SP成形在兩連接部CP之間。詳細而言,傳動軸112的其中一連接部CP與風扇元件111相連接,當風扇元件111轉動時將帶動傳動軸112產生同步樞轉。The
至少一個導向桿113配置在風扇元件111的頂面TS,且各導向桿113沿軸向AD朝上延伸而平行於傳動軸112。At least one
限位模組120配置於散熱模組110的至少一個導向桿113上,且限位模組120與風扇元件111存在間距D。詳細而言,限位模組120通過至少一個鎖固件而固定在至少一個導向桿113上並與風扇元件111之間存在不變的間距D。The
升降模組130可升降地配置於散熱模組110的傳動軸112且套設於至少一個導向桿113,以連動於風扇元件111。其中,升降模組130可受到傳動軸112的轉動帶動而沿軸向AD直線上升,至少一個導向桿113用以限制升降模組130於上升過程中產生慣性旋轉以及晃動等現象。The
至少一個復位彈性件140分別套設在相應的至少一個導向桿113上,且各復位彈性件140分別抵靠限位模組120與升降模組130。其中復位彈性件140於本實施例中是採用壓縮彈簧,壓縮彈簧的特性在於受到外力擠壓時,會產生彈性變形並蓄積彈力。At least one reset
擋板150連接於升降模組130且間隔配置在散熱模組110外。其中擋板150具有多個通孔151,對應於殼體200的多個散熱孔210。The
簡言之,升降模組130隨著散熱模組110的轉動與否,而相對於傳動軸112與導向桿113進行升降,以帶動擋板150的多個通孔151對位並開啟機殼200的多個散熱孔210,或錯位並遮蔽機殼200的多個散熱孔210。In short, the
圖2A至圖2B為圖1A的散熱裝置於開闔狀態下的立體剖面示意圖。圖3A至圖3B分別為圖2A至圖2B的升降模組狀態切換平面示意圖。2A to 2B are three-dimensional cross-sectional schematic diagrams of the heat dissipation device of FIG. 1A in an open and closed state. 3A to 3B are schematic plan views of the state switching of the lifting module of FIGS. 2A to 2B, respectively.
參考圖2A至圖2B,進一步而言,升降模組130包括支撐板131、固定座132(圖1B)、升降螺母133以及至少一棘爪134。Referring to FIGS. 2A to 2B, furthermore, the
請配合參考圖3A、圖3B、圖1C,支撐板131套設於至少一個導向桿113上且抵靠至少一個復位彈性件140。固定座132配置在支撐板131上。升降螺母133可旋轉地配置於固定座132中,即升降螺母133可相對於固定座132產生轉動。傳動軸112的螺紋部SP穿設於升降螺母133且兩者相互螺合。至少一個棘爪134(附圖中顯示為兩個),配置於固定座132中且面向限位模組120,各個棘爪134可相對於固定座132擺動以限位或釋放升降螺母133。Please refer to FIG. 3A, FIG. 3B, and FIG. 1C together, the
參考圖3B,進一步而言,升降螺母133具有至少一個卡槽FG(附圖中顯示為兩個),當升降模組130處於初始位置時,各個棘爪134分別卡合於相應的各個卡槽FG中,使得升降螺母133與固定座132連接為一體。當風扇元件111運作轉動時,升降螺母133隨著傳動桿112的轉動而呈螺旋狀移動。補充而言,升降螺母133是受到螺紋部SP的導引而沿軸向AD直線上升。Referring to FIG. 3B, furthermore, the lifting
參考圖1B、圖2A及圖3A,限位模組120具有至少一個解鎖柱121(附圖中顯示為兩個)。各個解鎖柱121朝向固定座132延伸,當擋板150移動至完全開啟機殼200的多個散熱孔210時,各個解鎖柱121推抵各個棘爪134以釋放升降螺母133,以使升降螺母133可因螺紋部SP的螺合而隨著傳動軸112同步轉動,且擋板150停止移動。簡言之,當各解鎖柱121使各棘爪134分離於升降螺母133的各卡槽FG時,升降螺母133不再受棘爪134的限位,而隨著傳動軸112同步轉動。Referring to FIG. 1B, FIG. 2A, and FIG. 3A, the
進一步而言,傳動軸112具有兩個連接部CP以及螺紋部SP。傳動軸112的兩連接部CP分別對應連接風扇元件111與限位模組120中,其中一連接部CP與風扇元件111相連接,另一連接部CP與限位模組120連接。傳動軸112的螺紋部SP螺合於升降螺母133,當升降螺母133相對於螺紋部SP螺旋狀移動時,升降螺母133相對於風扇元件111的高度漸增。當升降螺母133隨著螺紋部SP同步轉動時,升降螺母133相對於風扇元件111的高度不變。Furthermore, the
進一而言,固定座132具有至少一個容槽AG以及至少一個推抵彈性件SR(附圖中顯示均為兩個)。各個推抵彈性件SR的一端連接對應的各個容槽AG,各個推抵彈性件SR的另一端連接對應的各個棘爪134,當各個棘爪134相對於固定座132擺動以釋放升降螺母133時,各個棘爪134擠壓對應的各個推抵彈性件SR以進入對應的各個容槽AG。各個推抵彈性件SR例如採用壓縮彈簧,使得各推抵彈性件SR推動各棘爪134部分遠離容槽AG,則各個棘爪134卡合於相應的卡槽FG中以限位升降螺母133 。參考圖1A及圖1B,支撐板131具有兩個鎖合部135,位於升降模組130的相對兩側。兩鎖合部135用於鎖合擋板150,並隨著升降模組130升降而帶動擋板150沿軸向AD直線移動。Furthermore, the fixing
參考圖1C、圖3A及圖3B,限位模組120具有多個阻擋柱122,朝向升降模組130延伸,當升降模組130上升至特定高度時,各個阻擋柱122將抵靠於固定座132。1C, 3A and 3B, the
以下詳細說明散熱裝置100與機殼200的狀態切換過程。The state switching process of the
請參考圖1A、圖1C及圖2A,當散熱模組110的風扇元件111沿第一方向D1轉動時,風扇元件111帶動傳動軸112朝第一方向D1旋轉。此時各棘爪134卡合於升降螺母133的卡槽FG(參考圖3B),因此,升降螺母133會沿著傳動軸112的螺紋部SP螺旋上升,同時升降模組130的支撐板131也受到傳動軸112帶動,而沿著多個導向桿113自初始位置朝上移動,並擠壓多個復位彈性件140以蓄積彈力,其中,擋板150隨著升降模組130上升以開啟機殼200的多個散熱孔210。此外,當升降模組130上升至特定高度(完全開啟機殼200的多個散熱孔210)時,固定座132相對靠近限位模組120的兩解鎖柱121,各解鎖柱121推抵相應的各棘爪134以脫離卡槽FG (參考圖3A),使得各棘爪134不再限位升降螺母133,且各棘爪134擠壓各推抵彈性件SR以蓄積彈力。因此,升降螺母133因螺紋部SP的螺合固定,而隨著傳動軸112同步轉動,使升降模組130相對於風扇元件111的高度H不再上升。1A, 1C and 2A, when the
請參考圖1A、圖1C及圖2B,當散熱模組110的風扇元件111停止轉動時,多個復位彈性件140釋放蓄積彈力,使得升降模組130的支撐板131受到多個復位彈性件140的彈性推動,而沿著多個導向桿113朝下移動。同時限位模組120的兩解鎖柱121不再推抵兩棘爪134,兩棘爪134通過推抵彈性件SR的推動而返回至初始位置,並再度卡合於卡槽FG。此時下降的支撐板131會帶動升降螺母133沿著傳動軸112的螺紋部SP逐漸下降,同時造成傳動軸112朝相反於第一方向D1的第二方向D2旋轉。最終,擋板150隨著升降模組130下降直到多個復位彈性件140複歸原狀,並遮蔽機殼200的多個散熱孔210。1A, 1C and 2B, when the
綜上所述,本發明實施例的散熱裝置,使升降模組隨著散熱模組的轉動與否,而相對於傳動軸與導向桿進行升降,以帶動擋板開啟或遮蔽機殼的多個散熱孔。進一步而言,當散熱模組的風扇模組轉動時,可通過升降模組帶動擋板朝上移動直至完全開啟殼體的散熱孔。當散熱模組的風扇模組停止轉動時,可通過多個復位彈性件推動升降模組以帶動擋板朝下移動以遮蔽殼體的散熱孔。如此,當本發明實施例的散熱裝置未運作時,擋板可防止環境異物通過散熱孔而堆積在殼體內,亦可避免從散熱孔看見殼體內的組件以提升整體的美觀。In summary, the heat dissipation device of the embodiment of the present invention allows the lifting module to lift relative to the transmission shaft and the guide rod as the heat dissipation module rotates or not, so as to drive the baffle to open or cover the multiple housings. Vents. Furthermore, when the fan module of the heat dissipation module rotates, the baffle can be driven to move upward by the lifting module until the heat dissipation hole of the casing is fully opened. When the fan module of the heat dissipation module stops rotating, the lifting module can be pushed by a plurality of reset elastic members to drive the baffle to move downwards to cover the heat dissipation holes of the housing. In this way, when the heat dissipation device of the embodiment of the present invention is not in operation, the baffle can prevent environmental foreign matter from accumulating in the housing through the heat dissipation holes, and can also avoid seeing the components in the housing through the heat dissipation holes to improve the overall appearance.
100:散熱裝置 110:散熱模組 111:風扇元件 112:傳動軸 113:導向桿 120:限位模組 121:解鎖柱 122:阻擋柱 130:升降模組 131:支撐板 132:固定座 133:升降螺母 134:棘爪 135:鎖合部 140:復位彈性件 150:擋板 151:通孔 200:機殼 210:散熱孔 220:安裝座 AD:軸向 AG:容槽 D1:第一方向 D2:第二方向 FG:卡槽 CP:連接部 SP:螺紋部 SR:推抵彈性件 TS:頂面 D:間距 H:高度 100: heat sink 110: cooling module 111: Fan element 112: drive shaft 113: Guide rod 120: limit module 121: unlock column 122: blocking column 130: Lifting module 131: Support plate 132: Fixed seat 133: Lifting nut 134: Pawl 135: Locking part 140: reset elastic piece 150: baffle 151: Through hole 200: Chassis 210: cooling holes 220: Mounting seat AD: axial AG: container D1: First direction D2: second direction FG: card slot CP: Connection part SP: Threaded part SR: Push against the elastic part TS: Top surface D: Spacing H: height
圖1A為本發明一實施例的散熱裝置安裝於機殼的立體透視示意圖。 圖1B為圖1A的散熱裝置的元件分解示意圖。 圖1C為圖1A的散熱裝置的剖面示意圖。 圖2A至圖2B為圖1A的散熱裝置於開闔狀態下的立體剖面示意圖。 圖3A至圖3B分別為圖2A至圖2B的升降模組狀態切換平面示意圖。 FIG. 1A is a perspective schematic diagram of a heat sink installed in a casing according to an embodiment of the present invention. FIG. 1B is an exploded schematic view of the components of the heat sink of FIG. 1A. FIG. 1C is a schematic cross-sectional view of the heat sink of FIG. 1A. 2A to 2B are three-dimensional cross-sectional schematic diagrams of the heat dissipation device of FIG. 1A in an open and closed state. 3A to 3B are schematic plan views of the state switching of the lifting module of FIGS. 2A to 2B, respectively.
100:散熱裝置 110:散熱模組 120:限位模組 130:升降模組 140:復位彈性件 150:擋板 151:通孔 200:機殼 210:散熱孔 100: heat sink 110: cooling module 120: limit module 130: Lifting module 140: reset elastic piece 150: baffle 151: Through hole 200: Chassis 210: cooling holes
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TWI470408B (en) * | 2008-06-27 | 2015-01-21 | Wistron Corp | Electronic apparatus |
CN208159100U (en) * | 2018-04-26 | 2018-11-27 | 成都一诺金帝能源技术有限公司 | A kind of industrial production control cabinet |
CN208224969U (en) * | 2018-04-05 | 2018-12-11 | 阜阳师范学院 | A kind of new radiator of laptop |
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CN100405254C (en) * | 2004-07-23 | 2008-07-23 | 华硕电脑股份有限公司 | Electronic installation |
TWI286056B (en) * | 2004-12-30 | 2007-08-21 | Delta Electronics Inc | Heat dissipation module |
CN204305517U (en) * | 2015-01-20 | 2015-04-29 | 北京京东方多媒体科技有限公司 | Electronic equipment |
TWI561967B (en) * | 2015-12-16 | 2016-12-11 | Pegatron Corp | Heat-dissipation valve device and electronic device |
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TWI470408B (en) * | 2008-06-27 | 2015-01-21 | Wistron Corp | Electronic apparatus |
CN208224969U (en) * | 2018-04-05 | 2018-12-11 | 阜阳师范学院 | A kind of new radiator of laptop |
CN208159100U (en) * | 2018-04-26 | 2018-11-27 | 成都一诺金帝能源技术有限公司 | A kind of industrial production control cabinet |
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