TWI705914B - Host computer and computer system for vehicle - Google Patents

Abstract

The host computer for vehicle includes a case, an electronic assembly, a heat conduction block, at least one input-output assembly and at least one dust proof assembly. The opposite two sides of the case have an opening and a heat dissipation structure. The case has at least one mounting opening. The at least one mounting opening locates between the opening and the heat dissipation structure. The electronic assembly includes a circuit board, a processor and an expanding connector. The circuit board locates in the case. The processor and the expanding connector locate opposite two sides of the circuit board, respectively. The expanding connector exposes outside via the opening. The heat conduction block connects with a processor and the heat conduction of the case. The input-output assembly mounts in the at least one mounting opening. The at least one dust proof assembly locates in the at least one mounting opening and covers part of the

Description

Car host and car computer system

The invention relates to a host computer and a computer system, in particular to a host computer and a computer system for a vehicle.

In the past, consumers were mainly concerned about the performance of the car and driving safety when buying a car. But in recent years, consumers have begun to attach importance to driving entertainment experience. As a result, automakers began to integrate in-car computers with powerful entertainment functions.

As the performance of the car host increases, the heat generated by the high-power processor inside the car host will also increase. Therefore, in order to effectively dissipate the heat of the high-power processor, manufacturers generally add a fan in the chassis of the car host, and guide the external airflow through the high-power processor through the fan to dissipate the high-power processor.

However, when the car is driving on the road, the air is full of dust. If a fan is added inside the car host to dissipate the high-power processor. Undoubtedly, in the process of drawing in the outside air, a large amount of dust in the air will be inhaled. As a result, too much dust can easily affect the operating performance and service life of the motherboard of the car host. In addition, because of the comprehensive consideration of commercially available products, everything is always packed into the same chassis, resulting in a large and heavy overall size.

The present invention is to provide a vehicle host and a vehicle computer system, so as to reduce the probability of dust entering the vehicle host, thereby improving the use efficiency and service life of the vehicle host.

The vehicle host disclosed in an embodiment of the present invention includes a housing, an electronic component, a heat conducting block, at least one input and output group, and at least one dustproof component. The opposite sides of the shell are respectively provided with a through opening and a heat dissipation structure. The shell further has at least one assembly port. At least one assembly port is between the opening and the heat dissipation structure. The electronic component includes a circuit board, a processor and an expansion connector. The circuit board is located in the housing. The processor and the expansion connector are respectively located on opposite sides of the circuit board. The expansion connector is exposed through the opening. The heat conduction block connects the heat dissipation structure of the processor and the casing. The input and output assembly is arranged at at least one assembly port. At least one dustproof component is located at at least one assembly port and shields at least one part of the input and output group.

The vehicle computer system disclosed in another embodiment of the present invention includes a vehicle host and an expansion host. The vehicle host includes a housing, an electronic component, a heat conduction block, at least one input and output group, and at least one dustproof component. The opposite sides of the shell are respectively provided with a through opening and a heat dissipation structure. The shell further has at least one assembly port. At least one assembly port is between the opening and the heat dissipation structure. The electronic component includes a circuit board, a processor and an expansion connector. The circuit board is located in the housing. The processor and the expansion connector are respectively located on opposite sides of the circuit board. The expansion connector is exposed through the opening. The heat conduction block connects the heat dissipation structure of the processor and the casing. The input and output assembly is arranged at at least one assembly port. At least one dustproof component is located at at least one assembly port and shields at least one part of the input and output group. The expansion host includes a cover and a function expansion group. The function expansion group is located in the cover and has a docking connector, and the docking connector is detachably plugged into the expansion connector.

According to the vehicle host and the vehicle computer system of the above embodiment, the processor The generated heat is transferred from the heat-conducting block to the heat dissipation structure outside the casing through heat conduction. Then the external airflow is used to dissipate the heat dissipation structure outside the casing. In other words, the vehicle host does not require an additional fan to draw in the external cold air, so the probability of dust entering the vehicle host can be further reduced.

The above-mentioned dust-proof component is arranged in the assembly port of the casing, which will greatly increase the difficulty for the external dust self-assembly port or the slot of the wall to enter the casing part, thereby improving the operating efficiency and service life of the electronic component.

In addition, in the vehicle computer system, the vehicle host and expansion host are designed as a combined design, which will facilitate the expansion of users according to their needs and further reduce the overall volume of the vehicle computer system when there is no demand.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

1: Car computer system

10: Car host

20: Expansion host

22: Hood

24: Function expansion group

26: Docking connector

100: shell

101: open mouth

102: heat dissipation structure

103: assembly port

110: Carrier

111: bottom plate

112: The first side panel

120: cover

121: cover

122: second side panel

200: Electronic components

210: circuit board

220: processor

230: Expansion connector

300: Thermal block

400: input and output group

410: Wall

411: Slotting

420: Connector

500: dustproof components

510: Flexible body

520: seal ring

530: sealing sheet

531: open

600: foam

A: Direction

D1, D2: size

Fig. 1 is a three-dimensional schematic diagram of a vehicle host according to a first embodiment of the present invention.

Figure 2 is an exploded schematic diagram of Figure 1.

Fig. 3 is a schematic cross-sectional view of Fig. 1.

Fig. 4A is a partial cross-sectional view of the joint of Fig. 3 when it is not installed in the groove of the wall.

Fig. 4B is a partial enlarged view of Fig. 3.

Fig. 5 is an exploded schematic diagram of the vehicle computer system according to the second embodiment of the present invention.

Please refer to Figure 1 to Figure 3. Fig. 1 is a three-dimensional schematic diagram of a vehicle host according to a first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Fig. 3 is a schematic cross-sectional view of Fig. 1.

The vehicle host 10 of this embodiment includes a housing 100, an electronic component 200, a heat conducting block 300, two input and output groups 400, and two dustproof components 500. The two input and output groups 400 and the two dust-proof components 500 are one input and output group 400 and one dust-proof component 500 to form a group, and the two groups are respectively located at the assembly openings 103 on opposite sides of the housing 100. Since the designs of the two groups are similar, one of them will be explained below. In addition, the vehicle host 10 further includes a foam 600.

The housing 100 has a through opening 101 and a heat dissipation structure 102 on opposite sides of the housing 100 respectively. The heat dissipation structure 102 is, for example, a fin heat fin to increase the heat dissipation area of the housing 100. In addition, the housing 100 further has two assembly ports 103. The two assembly openings 103 are located between the through opening 101 and the heat dissipation structure 102 and are located on opposite sides of the housing 100.

Specifically, the housing 100 is, for example, a two-piece design and includes a carrier 110 and a cover 120. The carrier 110 includes a bottom plate 111 and two first side plates 112 connected to opposite sides of the bottom plate 111. The through opening 101 is located on the bottom plate 111. The cover 120 includes a cover plate 121 and two second side plates 122 connected to opposite sides of the cover plate 121. The cover plate 121 covers the bottom plate 111, and the heat dissipation structure 102 is connected to a side of the cover plate 121 away from the bottom plate 111. The two first side plates 112 are located between the two second side plates 122, and the two second side plates 122 are pressed against the two first side plates 112 respectively. In this embodiment, the two first side plates 112 are interposed between the two second side plates 122, and the two second side plates 122 are pressed against the two first side plates 112 respectively, so that the first side plate 112 and the second side plate 122 The overlap area is enlarged, which in turn increases the dust from the The gap between the side plate 112 and the second side plate 122 is difficult to enter. In other words, the design of the two first side plates 112 between the two second side plates 122 and the two second side plates 122 respectively pressing against the two first side plates 112 can greatly improve the difference between the first side plate 112 and the second side plate 122. The sealing effect of the gap.

In addition, the group of the supporting member 110 and the covering member 120 together surround the aforementioned assembly opening 103 on opposite sides of the housing 100.

The electronic assembly 200 includes a circuit board 210, a processor 220 and an expansion connector 230. The circuit board 210 is located in the housing 100 and is stacked on the bottom plate 111 of the carrier 110. The processor 220 and the expansion connector 230 are respectively located on opposite sides of the circuit board 210. The processor 220 is located on a side of the circuit board 210 away from the bottom plate 111. The expansion connector 230 is located on a side of the circuit board 210 close to the bottom plate 111, and the expansion connector 230 is exposed through the through opening 101.

The thermal conductive block 300 is, for example, a metal block with good thermal conductivity, such as a copper block and a silver block. One side of the heat conducting block 300 is in thermal contact with the processor 220, and the other side of the heat conducting block 300 is in thermal contact with the cover 121 of the cover 120. As a result, the heat generated by the processor 220 during operation will be conducted to the cover 121 through the heat conducting block 300, and then to the heat dissipation structure 102 through the cover 121, so that the heat generated by the processor 220 can be transferred by the heat dissipation structure 102 Dissipate outside. In the vehicle host 10 of this embodiment, the heat generated by the processor 220 is transferred from the heat conducting block 300 to the heat dissipation structure 102 outside the housing 100 through thermal conduction. Then, the external airflow is used to dissipate the heat dissipation structure 102 outside the housing 100. In other words, the vehicle host 10 of this embodiment does not require an additional fan to draw in the external cold air, thereby further reducing the probability of dust entering the vehicle host 10.

The input and output group 400 is installed in the assembly port 103 of the housing 100. The input and output group 400 includes a wall 410 and a plurality of connectors 420. The wall 410 is installed in the assembly opening 103 of the housing 100 and has a plurality of slots 411. The connectors 420 are respectively installed in the slots 411 and electrically connected to the circuit board 210.

The dustproof assembly 500 is located at the assembly opening 103 and shields part of the input and output group 400. In detail, the dust-proof component includes a flexible body 510, a sealing ring 520 and a sealing sheet 530. The flexible body 510 is, for example, a rubber body. The flexible body 510 is located in the housing 100 and wraps the joints 420 inside to cover the gaps between the joints 420 to form the first dustproof means. The sealing ring 520 is, for example, a rubber ring, which is sleeved on the wall 410 and sandwiched between the wall 410 and the housing 100 to form a second dustproof means. The sealing sheet 530 is flexible, such as a rubber sheet or a silicon film. The sealing sheet 530 is interposed between the wall body 410 and the flexible body 510 and has a plurality of openings 531.

In particular, please refer to Figures 4A to 4B. Fig. 4A is a partial cross-sectional view of the joint of Fig. 3 when it is not installed in the groove of the wall. Fig. 4B is a partial enlarged view of Fig. 3. As shown in FIG. 4A, when the joint 420 has not been inserted into the slot 411 of the wall 410, it can be seen that the size D2 of the opening 531 is smaller than the size D1 of the slot 411. In other words, the sealing sheet 530 will cover the outer edge of the slot 411. Next, when the joint 420 is inserted into the groove 411 of the wall 410 along the direction A, as shown in FIG. 4B, the joint 420 inserts the sealing sheet 530 covering the outer edge of the groove 411 into the joint 420 and the wall 410. Formed a third means of dust prevention.

Through the above-mentioned first to third dust-proof measures, the difficulty for the external dust self-assembly opening 103 or the slot 411 of the wall 410 to enter the housing 100 is greatly increased, thereby improving the operating efficiency and service life of the electronic component 200.

The foam 600 is sandwiched between the circuit board 210 and the bottom plate 111 and surrounds the expansion connector 230 to increase the difficulty of external dust entering the housing 100 through the opening 101.

Please refer to Figure 5. Fig. 5 is an exploded schematic diagram of the vehicle computer system according to the second embodiment of the present invention. The vehicle computer system 1 of this embodiment includes a vehicle host 10 and an expansion host 20. The structure and connection relationship of the various components of the vehicle host 10 have been described in the embodiment of FIG. 1, so they will not be repeated. Hereinafter, only components that are not described or have a matching relationship with the expansion host 20 will be described.

The expansion host 20 includes a cover 22 and a function expansion group 24. The function expansion group 24 is located in the cover 22 and has a docking connector 26. The docking connector 26 is detachably plugged into the expansion connector 230 of the vehicle host 10. The expansion host 20 is, for example, a display host, another processor or a storage host.

The vehicle computer system 1 of the present embodiment is a combined design of the vehicle host 10 and the expansion host 20, so that the user can choose the function of the expansion host 20 according to requirements. For example, if users want to enjoy high-quality audio-visual functions, they can choose an expansion host with display functions. Conversely, if the user does not attach importance to high-quality audio-visual functions, he can choose not to install the expansion host 20 to reduce the overall volume of the vehicle computer system 1 to the volume of the vehicle host 10.

According to the vehicle host and the vehicle computer system of the above embodiment, the heat generated by the processor is transferred from the heat conducting block to the heat dissipation structure outside the housing through thermal conduction. Then the external airflow is used to dissipate the heat dissipation structure outside the casing. In other words, the vehicle host does not require an additional fan to draw in the external cold air, so it can further reduce dust The probability of entering the vehicle's main engine.

The above-mentioned dust-proof component is arranged in the assembly port of the casing, which will greatly increase the difficulty for the external dust self-assembly port or the slot of the wall to enter the casing part, thereby improving the operating efficiency and service life of the electronic component. Furthermore, the dust-proof component adopts three dust-proof measures, such as flexible body to cover the gap between the joints, sealing ring to cover the gap between the wall and the shell, and sealing sheet to cover the slot between the wall and the joint. The gap, thereby greatly reducing the probability of external dust entering the vehicle host.

In addition, the opening around the expansion connector is shielded by foam to reduce the probability of external dust entering the vehicle host.

In addition, in the vehicle computer system, the vehicle host and expansion host are designed as a combined design, which will facilitate the expansion of users according to their needs and further reduce the overall volume of the vehicle computer system when there is no demand.

Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

100: shell

101: open mouth

102: heat dissipation structure

110: Carrier

111: bottom plate

112: The first side panel

120: cover

121: cover

122: second side panel

200: Electronic components

210: circuit board

220: processor

230: Expansion connector

300: Thermal block

400: input and output group

410: Wall

411: Slotting

420: Connector

500: dustproof components

510: Flexible body

520: seal ring

530: sealing sheet

531: open

600: foam

Claims (10)

A vehicle host, including: A housing, the opposite sides of the housing respectively have a through opening and a heat dissipation structure, the housing further has at least one assembly opening, the at least one assembly opening is between the through opening and the heat dissipation structure; An electronic component includes a circuit board, a processor, and an expansion connector. The circuit board is located in the housing. The processor and the expansion connector are located on opposite sides of the circuit board. The expansion connector passes through the Exposed to the outside; A heat conduction block connecting the processor and the heat dissipation structure of the housing; At least one input and output group installed in the at least one assembly port; and At least one dustproof component is located at the at least one assembly port and shields part of the at least one input and output group. The vehicle host according to claim 1, wherein the housing includes a bearing member and a covering member, the bearing member includes a bottom plate and two first side plates connected to opposite sides of the bottom plate, the covering member It includes a cover plate and two second side plates connected to opposite sides of the cover plate, the cover plate covers the bottom plate, and the heat dissipation structure is connected to a side of the cover plate away from the bottom plate, and the two first side plates are between Between the two second side plates, and the two second side plates are pressed against the two first side plates respectively. The vehicle host according to claim 2 further includes a foam, which is sandwiched between the circuit board and the bottom plate and surrounds the expansion connector. The vehicle host according to claim 1, wherein the at least one input and output group includes a wall and a plurality of joints, the wall is installed in the at least one assembly port of the housing and has a plurality of slots, the The connectors are respectively installed in the slots and electrically connected to the circuit board. The vehicle host according to claim 4, wherein the at least one dust-proof component includes a flexible body, the flexible body is located in the casing and the joints are covered inside. The vehicle host according to claim 5, wherein the at least one dust-proof component further includes a sealing ring, the sealing ring is sleeved on the wall and sandwiched between the wall and the housing. The vehicle host according to claim 6, wherein the at least one dust-proof component further includes a sealing sheet, the sealing sheet is interposed between the wall and the flexible body, and has a plurality of openings, and the size of the openings Less than the size of the slots, the joints are respectively penetrated through the openings and the parts of the sealing sheets are inserted between the joints and the wall. The vehicle host according to claim 1, wherein the numbers of the at least one input and output group and the at least one assembly port are both two, the two assembly ports are located on opposite sides of the casing, and the two input and output groups are respectively Set at the second assembly port. A computer system for vehicles, including: A car host, including: A housing, the opposite sides of the housing respectively have a through opening and a heat dissipation structure, the housing further has at least one assembly opening, the at least one assembly opening is between the through opening and the heat dissipation structure; An electronic component includes a circuit board, a processor, and an expansion connector. The circuit board is located in the housing. The processor and the expansion connector are located on opposite sides of the circuit board. The expansion connector passes through the Exposed to the outside; A heat conduction block connecting the processor and the heat dissipation structure of the housing; At least one input and output group installed in the at least one assembly port; and At least one first dustproof component located at the at least one assembly port and shielding part of the at least one input and output group; and An expansion host includes a cover body and a function expansion group. The function expansion group is located in the cover body and has a docking connector. The docking connector is detachably plugged into the expansion connector. The vehicle computer system according to claim 9, wherein the at least one input and output group includes a wall and a plurality of connectors, the wall has a plurality of slots, and the connectors are respectively installed in the slots and connected Sexually connected to the circuit board, the wall body is installed on the casing and covers the at least one assembly opening of the casing, and the at least one first dustproof component includes a flexible body, a sealing ring and a sealing sheet , The flexible body is located in the shell, and the joints are wrapped inside, the sealing ring is sleeved on the wall and sandwiched between the wall and the shell, and the sealing sheet is between the Between the wall and the flexible body, there are a plurality of openings, the size of the openings is smaller than the size of the grooves, the joints are respectively penetrated through the openings and the parts of the sealing sheets are inserted into the Between these joints and the wall.

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