TWI705516B - Wafer box transfer device - Google Patents
Wafer box transfer device Download PDFInfo
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- TWI705516B TWI705516B TW109102482A TW109102482A TWI705516B TW I705516 B TWI705516 B TW I705516B TW 109102482 A TW109102482 A TW 109102482A TW 109102482 A TW109102482 A TW 109102482A TW I705516 B TWI705516 B TW I705516B
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- end module
- wafer cassette
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- wafer box
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Abstract
Description
一種晶圓盒移載裝置,尤指用以將晶圓盒送至設備前端模塊(EFEM)之移載裝置。A wafer cassette transfer device, especially a transfer device used to transfer the wafer cassette to the front-end module (EFEM).
在半導體的製造製程中,為了提高產率以及品質,會於潔淨的無塵室內對晶圓進行處理,但隨著推進元件的高積體化、電路的微小化以及晶圓的大型化,就技術性與費用方面而言,難以將無塵室內整體保持為潔淨狀態,因此,即有相關業者,利用設備前端模組(Equipment Front End Module,EFEM)連接製程設備,僅對晶圓周圍的空間的潔淨度進行管理,此種設備前端模組會於一側設置裝載口(Load Port),使用者將晶圓盒置放於裝載口處後,設備前端模組再利用機器手臂將晶圓盒移入設備前端模組,但此種裝載口之設置係具有下列缺失:In the semiconductor manufacturing process, in order to improve yield and quality, wafers are processed in a clean room. However, with the advancement of higher integration of components, miniaturization of circuits, and larger wafers, In terms of technology and cost, it is difficult to keep the entire clean room in a clean state. Therefore, there are related companies that use Equipment Front End Module (EFEM) to connect process equipment, and only the space around the wafer The front-end module of this type of equipment will be equipped with a load port (Load Port) on one side. After the user places the wafer cassette at the load port, the front-end module of the equipment uses the robotic arm to place the wafer cassette Moved into the equipment front-end module, but the setting of this loading port has the following defects:
1、裝載口必須非常的靠近設備前端模組,來減少空間的佔用,但會讓使用者於擺放晶圓盒至裝載口時,由於擺放的空間狹小使得擺放不易,且容易造成晶圓盒掉落之問題產生。1. The loading port must be very close to the front-end module of the equipment to reduce the space occupation. However, when the user places the wafer cassette to the loading port, the placement is not easy due to the small space and it is easy to cause crystals. The problem of the round box falling.
2、設備前端模組之機械手臂在移動晶圓盒時,若使用者未注意而靠近裝載口,就容易發生危險,輕則對晶圓盒產生危害,重則可能造成人員受傷。2. When the mechanical arm of the front-end module of the equipment moves the wafer cassette, if the user does not pay attention and approaches the loading port, it is prone to danger, from the light to the wafer cassette, it may cause personal injury.
是以,要如何解決上述裝載口之問題與缺失,即為相關業者所亟欲研發之課題所在。Therefore, how to solve the above-mentioned problems and deficiencies of the loading port is the subject that the relevant industry urgently wants to develop.
本發明之主要目的乃在於,利用晶圓盒移載裝置讓晶圓盒的置放與進入設備前端模塊之位置不同,以確保使用者不會接近晶圓盒於進入設備前端模塊之入口處,以避免危險發生,且可使設備前端模塊以更短的距離移動晶圓盒。The main purpose of the present invention is to use the cassette transfer device to make the placement of the cassette different from the position where it enters the front-end module of the equipment, so as to ensure that the user will not approach the cassette at the entrance to the front-end module of the equipment. In order to avoid danger, the front-end module of the equipment can move the wafer cassette in a shorter distance.
本發明之次要目的乃在於,利用晶圓盒移載裝置之軌道兩端與設備前端模塊之間距不同,增加使用者擺放晶圓盒之空間,以利使用者順利的將晶圓盒擺放,且不會使設備前端模塊與晶圓盒移載裝置之整體寬度過度增加。The secondary purpose of the present invention is to use the difference between the two ends of the track of the wafer cassette transfer device and the front-end module of the equipment to increase the space for the user to place the wafer cassette, so that the user can place the wafer cassette smoothly It will not increase the overall width of the equipment front-end module and the wafer cassette transfer device excessively.
為達上述目的,本發明之晶圓盒移載裝置係設置有機架以及位移器,機架設置於設備前端模塊側方,並靠近於設備前端模塊供晶圓盒移入設備前端模塊之入口處,位移器具有軌道、位移座以及驅動器,軌道係橫向設置於機架上,其兩端分別形成有入料端以及出料端,出料端係位於前端模塊之入口處,而位移座係連接於軌道並供晶圓盒置放,且位移座係受驅動器帶動於入料端與出料端之間來回位移。To achieve the above purpose, the wafer cassette transfer device of the present invention is provided with a rack and a shifter. The rack is arranged on the side of the equipment front-end module, and is close to the entrance of the equipment front-end module for the wafer cassette to be moved into the equipment front-end module. The displacer has a rail, a displacement seat and a driver. The rail system is horizontally arranged on the frame, and its two ends are respectively formed with a feeding end and a discharging end. The discharging end is located at the entrance of the front-end module, and the displacement seat is connected to The track is also used for placing the wafer cassette, and the displacement seat is driven by the driver to move back and forth between the feeding end and the discharging end.
前述之晶圓盒移載裝置,其中該位移器之軌道的出料端與設備前端模塊之間距,係小於入料端與設備前端模塊之間距。In the aforementioned wafer cassette transfer device, the distance between the discharge end of the track of the shifter and the equipment front-end module is smaller than the distance between the feed end and the equipment front-end module.
前述之晶圓盒移載裝置,其中該機架於靠近軌道之入料端與出料端處分別設置有光電開關。In the aforementioned wafer cassette transfer device, the rack is respectively provided with a photoelectric switch at the inlet end and the outlet end near the rail.
請參閱第一圖至第四圖所示,由圖中可清楚看出,本發明係設置有機架1以及位移器2:Please refer to the first to fourth figures. It can be clearly seen from the figures that the present invention is provided with a
該機架1係位於設備前端模塊4之側方,機架1上設置有第一光電開關11與第二光電開關12,第一光電開關11為靠近於設備前端模塊4,第二光電開關12為位於第一光電開關11遠離設備前端模塊4之另側,且第一光電開關11與第二光電開關12分別位於機架1兩端,並使第一光電開關11靠近於設備前端模塊4之入口處41。The
該位移器2具有軌道21、位移座22以及驅動器23,軌道21係橫向設置於機架1上,即軌道21延伸方向相對於晶圓盒3進入設備前端模塊4之入口處41之方向呈橫向設置,而其兩端分別形成有入料端211以及出料端212,出料端212係位於設備前端模塊4之入口處41,並使出料端212與設備前端模塊4之間距L1,係小於入料端211與設備前端模塊4之間距L2;而位移座22係連接於軌道21並供晶圓盒3置放,且位移座22係受驅動器23帶動於入料端211與出料端212之間來回位移。The
請參閱第二圖至第五圖所示,由圖中可清楚看出,當本發明於使用時,驅動器23會先將位移座22移動至軌道21之入料端211,讓使用者將晶圓盒3置放於位移座22上,驅動器23在驅動位移座22移動至軌道21之出料端212,讓設備前端模塊4之機器手臂(圖中未示出)可由入口處41將晶圓盒3移入設備前端模塊4,而於晶圓盒3移入設備前端模塊4後,驅動器23再次驅動位移座22移動至軌道21之入料端211,等待使用者將晶圓盒3置放於位移座22;再者,該第一光電開關11與第二光電開關12會於位移座22運作時持續進行偵測,以確保使用者以及晶圓盒3之安全。Please refer to the second to fifth figures. It can be clearly seen from the figures that when the present invention is in use, the
是以,本發明為可解決習知技術之不足與缺失,並可增進功效,其關鍵技術在於:Therefore, the present invention can solve the shortcomings and deficiencies of the conventional technology and can improve the efficiency. The key technology of the present invention is:
一、軌道21係橫向設置於機架1上,利用驅動器23帶動位移座22於入料端211與出料端212之間來回位移,讓使用者置放晶圓盒3時遠離設備前端模塊4之入口處41,以避免使用者發生危險。1. The
二、利用軌道21之出料端212與設備前端模塊4之間距L1,小於入料端211與設備前端模塊4之間距L2,俾讓使用者於置放晶圓盒3時具有較大空間,以利使用者擺放晶圓盒3至位移座22上,而位移座22將晶圓盒3帶至設備前端模塊4之入口處41時,晶圓盒3可更加的靠近設備前端模塊4,以減少設備前端模塊4之機械手臂位移距離。2. Utilize the distance L1 between the
1:機架 11:第一光電開關 12:第二光電開關 2:位移器 21:軌道 211:入料端 212:出料端 22:位移座 23:驅動器 3:晶圓盒 4:設備前端模塊 41:入口處 L1、L2:間距 1: rack 11: The first photoelectric switch 12: The second photoelectric switch 2: Displacer 21: Orbit 211: Feeding End 212: discharge end 22: Displacement seat 23: drive 3: Wafer box 4: Equipment front-end module 41: entrance L1, L2: spacing
第一圖係本發明與設備前端模塊之外觀示意圖。 第二圖係本發明之外觀示意圖。 第三圖係本發明置放晶圓盒之示意圖。 第四圖係本發明置放晶圓盒之上視圖。 第五圖係為本發明移動晶圓盒之示意圖。 The first figure is a schematic diagram of the appearance of the present invention and the device front-end module. The second figure is a schematic diagram of the appearance of the present invention. The third figure is a schematic diagram of the wafer cassette placed in the present invention. The fourth figure is a top view of the wafer cassette placed in the present invention. The fifth figure is a schematic diagram of the mobile wafer cassette of the present invention.
1:機架 1: rack
11:第一光電開關 11: The first photoelectric switch
12:第二光電開關 12: The second photoelectric switch
2:位移器 2: Displacer
21:軌道 21: Orbit
211:入料端 211: Feeding End
212:出料端 212: discharge end
22:位移座 22: Displacement seat
23:驅動器 23: drive
3:晶圓盒 3: Wafer box
4:設備前端模塊 4: Equipment front-end module
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TW109102482A TWI705516B (en) | 2020-01-22 | 2020-01-22 | Wafer box transfer device |
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TW109102482A TWI705516B (en) | 2020-01-22 | 2020-01-22 | Wafer box transfer device |
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TW202129815A TW202129815A (en) | 2021-08-01 |
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Citations (6)
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US20060177289A1 (en) * | 2001-08-31 | 2006-08-10 | Bonora Anthony C | Unified frame for semiconductor material handling system |
TW200820368A (en) * | 2006-08-28 | 2008-05-01 | Shinko Electric Co Ltd | Load port device |
TW200843018A (en) * | 2006-12-22 | 2008-11-01 | Asyst Technologies | Loader and buffer for reduced lot size |
TW201101402A (en) * | 2009-02-27 | 2011-01-01 | Advantest Corp | Testing apparatus and testing method |
TW201320230A (en) * | 2011-11-09 | 2013-05-16 | Sinfonia Technology Co Ltd | Load port and efem |
US20140119856A1 (en) * | 2005-03-30 | 2014-05-01 | Brooks Automation, Inc. | Substrate transport apparatus with active edge gripper |
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2020
- 2020-01-22 TW TW109102482A patent/TWI705516B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060177289A1 (en) * | 2001-08-31 | 2006-08-10 | Bonora Anthony C | Unified frame for semiconductor material handling system |
US20140119856A1 (en) * | 2005-03-30 | 2014-05-01 | Brooks Automation, Inc. | Substrate transport apparatus with active edge gripper |
TW200820368A (en) * | 2006-08-28 | 2008-05-01 | Shinko Electric Co Ltd | Load port device |
TW200843018A (en) * | 2006-12-22 | 2008-11-01 | Asyst Technologies | Loader and buffer for reduced lot size |
TW201101402A (en) * | 2009-02-27 | 2011-01-01 | Advantest Corp | Testing apparatus and testing method |
TW201320230A (en) * | 2011-11-09 | 2013-05-16 | Sinfonia Technology Co Ltd | Load port and efem |
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