TWI705194B - Liquid cooling system and pump thereof - Google Patents

Abstract

A liquid cooling system and a pump thereof are provided to overcome the problem raised by the need to separate the stator from the rotor. The pump according to the present invention can be used to drive the electrically non-conductive liquid to flow. The pump includes a housing having a liquid chamber, a liquid inlet and a liquid outlet, and a fan mounted in the liquid chamber and including a fan frame having a liquid injection hole and a liquid outgoing hole. A driving member is mounted in the liquid chamber and drives an impeller to rotate. The impeller is located in the fan frame. The liquid inlet and the liquid outlet intercommunicate with the liquid chamber. The electrically non-conductive liquid flows into the liquid injection hole and the liquid outgoing hole. The liquid outgoing hole intercommunicates with the liquid outlet for the electrically non-conductive liquid to flow out.

Description

Liquid cooling system and its pump

The present invention relates to a pump and a liquid-cooled heat dissipation system for driving liquid to flow, in particular to a pump with non-conductive liquid flowing inside, and a liquid-cooled heat dissipation system with the pump.

Please refer to FIG. 1, which is a conventional pump 9. The conventional pump 9 has a housing 91, a rotor group 92 and a stator group 93. The shell 91 is composed of a shell seat 911 and a shell cover 912, and a diversion space 913 is formed between the inside of the shell seat 911 and the shell cover 912. The housing 91 further has an input port 914 and an output port 915 communicating with the diversion space 913, and the bottom end of the housing 911 has a shaft joint 916. The rotor assembly 92 is located in the diversion space 913. The rotor assembly 92 has an impeller 921 rotatably disposed on the shaft connection portion 916, and a magnet ring 922 is coupled with the impeller 921 and is located on the outer periphery of the shaft connection portion 916. The stator assembly 93 is combined with the shell base 911 and is located outside the diversion space 913, and the stator assembly 93 is diametrically opposed to the magnet ring 922 via the shell base 911. When the conventional pump 9 is operating, the magnetic field generated by the stator assembly 93 can penetrate the housing 911 and magnetically mutually repel the magnet ring 922, thereby driving the impeller 921 to rotate, so that the liquid can pass through the input port 914 It flows into the diversion space 913, and is guided and discharged from the outlet 915. An embodiment similar to the conventional pump 9 has been disclosed in the Republic of China Patent Publication No. 587784.

However, the above-mentioned conventional pump 9 needs to prevent the stator group 93 from contacting liquid and short-circuit, so the stator group 93 is chosen to be placed outside the diversion space 913 to ensure the process of guiding the liquid into and out of the diversion space 913 , The liquid will not touch the stator group 93. However, this arrangement requires the housing base 911 to be separated between the stator assembly 93 and the magnet ring 922, which makes it difficult to reduce the magnetic sensing distance between the two, which affects the driving performance.

In view of this, the conventional pump does still have to be improved.

In order to solve the above-mentioned problems, the purpose of the present invention is to provide a liquid-cooled heat dissipation system and its pump. A guide fan can pressurize the non-conductive liquid to increase the hydraulic pressure of the non-conductive liquid from the pump.

The second objective of the present invention is to provide a liquid-cooled heat dissipation system and its pump. By using non-conductive liquid, the stator and rotor of the guide fan can be located in the same space without isolation, so that the The magnetically sensitive distance between the stator and the rotor can be reduced.

Another object of the present invention is to provide a liquid-cooled heat dissipation system and its pump, which can directly apply a guide fan for driving the flow of gas to the pump to drive non-conductive liquid, so that the structure of the guide fan It does not need to be different due to driving gas or liquid.

Another object of the present invention is to provide a liquid-cooled heat dissipation system and its pump, which can be installed in small electronic products to meet the demand for thinning.

The directionality described in the full text of the present invention or its similar terms, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inner", "outer" , "Side", etc., mainly refer to the directions of the attached drawings. The directional or similar terms are only used to help explain and understand the embodiments of the present invention, and are not used to limit the present invention.

The elements and components described in the full text of the present invention use the quantifiers "one" or "one" for convenience and to provide the general meaning of the scope of the present invention; the present invention should be interpreted as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

The approximate terms such as "combination", "combination" or "assembly" mentioned in the full text of the present invention mainly include the types that can be separated without destroying the components after being connected, or the components can not be separated after being connected, which are common knowledge in the field Those can be selected based on the materials of the components to be connected or assembly requirements.

The pump of the present invention is used to drive the flow of non-conductive liquid, comprising: a housing with a liquid flow space inside, the housing having a liquid injection port and a liquid discharge port, and the liquid injection port communicates with the liquid discharge port. A liquid flow space; and a diversion fan located in the liquid flow space, the diversion fan has a fan frame, the fan frame has a liquid inlet and a liquid outlet, the liquid inlet is connected to the liquid injection port and The non-conductive liquid flows in, the liquid outlet communicates with the liquid discharge port and is used to discharge the non-conductive liquid. A driving component is located in the liquid flow space, and the driving component drives an impeller located in the fan frame to rotate.

The liquid-cooled heat dissipation system of the present invention includes: a pump as described above; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe fitting group, which is connected in series with the pump, the heat absorption unit and the heat dissipation unit to When the pump is operating, the non-conductive liquid is circulated.

The liquid-cooled heat dissipation system of the present invention includes: two of the aforementioned pumps. The liquid-cooled heat dissipation system is divided into a first quadrant, a second quadrant, and a third axis by a first axis and a second axis intersecting. Quadrant and a fourth quadrant, the two pumps are respectively located in the first quadrant and the third quadrant, or the second quadrant and the fourth quadrant; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe The group is connected in series with the two pumps, the heat absorption unit and the heat dissipation unit, so that the non-conductive liquid circulates when the two pumps are operating.

Accordingly, the liquid-cooled heat dissipation system and its pump of the present invention can be applied to liquid-cooled heat dissipation systems with various pressure requirements, and because the liquid-cooled heat dissipation system uses non-conductive liquid as the working fluid, So that the stator and rotor of the guide fan in the pump can be arranged in the same space without isolation, and there will be no short circuit problem during operation; in this way, the magnetic induction between the stator and the rotor of the guide fan The distance will be reduced, which can improve the efficiency of the stator to drive the rotor to rotate, and help reduce the overall pump volume. In addition, since the stator and rotor of the guide fan in the pump do not need to be isolated, the guide fan used to drive the flow of gas can be directly applied to the pump to drive the non-conductive liquid, so that the guide fan The structure does not differ depending on the driving gas or liquid, so the industry does not need to make a special structure of the guide fan in order to drive the liquid flow, which has the effect of reducing manufacturing and storage management costs. In addition, the liquid-cooled heat dissipation system can also be installed in small electronic products to meet the needs of thinner.

Wherein, the liquid flow space may have a diversion channel, the diversion channel may be formed in an annular wall of the housing, the diversion channel is located between the liquid injection port and the liquid inlet, and the diversion channel communicates with the injection port. The liquid port and the liquid inlet. In this way, the diversion channel can guide the flow direction of the non-conductive liquid, so that the non-conductive liquid can flow into the liquid inlet more smoothly, and has the effect of improving the smoothness of the flow of the non-conductive liquid.

Wherein, the outer shell may have a first shell and a second shell combined, the first shell has a top plate, the circumferential edge of the top plate is connected with a ring wall, and the liquid injection port and the liquid discharge port are provided in the ring Two opposite ends or two adjacent ends of the wall. In this way, the housing can be adapted to different configuration requirements of the liquid-cooled heat dissipation system, and has the effect of improving the convenience of use.

Wherein, the housing may have two conduits connected to the annular wall, and ports of the two conduits form the liquid injection port and the liquid discharge port. In this way, the two pipes can be easily connected with the pipe assembly, which has the effect of improving the convenience of assembly and the effect of preventing leakage.

Wherein, the liquid injection port of the shell may be connected to the top plate of the first shell, and the liquid injection port is axially aligned with the liquid inlet of the fan frame. In this way, the non-conductive liquid can flow directly into the liquid inlet of the fan frame from the liquid injection port, which can reduce the flow length of the non-conductive liquid, and has the effect of improving the smoothness of the non-conductive liquid.

Wherein, the fan frame may have a base plate and a shaft connection part, the shaft joint part is connected to the base plate, a side wall is located on the outer periphery of the shaft joint part, an upper cover of the fan frame may be connected to the top end of the side wall, the fan frame A drainage plate can be installed on a part of the upper cover, so that the liquid inlet is formed between the drainage plate and the upper cover, and the liquid outlet is located on the side wall. In this way, the structure is simple and easy to assemble, and has the effect of improving assembly convenience.

Wherein, the upper cover and the drainage plate are integrally formed and connected. In this way, the upper cover and the guide plate can be firmly connected, which has the effect of improving the structural strength of the fan frame.

Wherein, the driving assembly may have several electronic components, and the several electronic components are not located in the fan frame. In this way, the axial height of the guide fan can be reduced, and the configuration space can be effectively reduced.

Wherein, the drive assembly may have a circuit board connected to the inner surface of the housing, a side wall of the fan frame abuts the circuit board, the drive assembly has a certain sub-coil group wiring formed on the circuit board, and the stator coil The group is located in the fan frame. In this way, the axial height of the guide fan can be reduced, and the thickness of the overall casing can be reduced.

Wherein, the inner surface of the housing may be recessed with a containing groove, and the circuit board is accommodated in the containing groove. In this way, the axial height of the guide fan can be further reduced, and the thickness of the overall casing can be further reduced.

Wherein, the housing may have two universal joints, and the two universal joints are respectively sleeved on the two conduits of the housing, so that the liquid injection port and the liquid discharge port are formed by ports of the two universal joints. In this way, the two universal joints can be applied to different types or sizes of pipe fitting groups, and have the effect of improving the convenience of assembly when connecting with the pipe fitting groups.

Among them, the drive component has not been waterproofed. In this way, the system has the effect of reducing manufacturing costs.

Wherein, the driving assembly has a circuit board, the circuit board is located in the fan frame, and the circuit board has a certain sub-coil group and several electronic parts. In this way, the components arranged in the fan frame can be pre-assembled. When assembling the pump, the fan frame can be assembled into a predetermined position in the housing, which has the effect of improving assembly convenience.

Wherein, the two pumps are respectively arranged at diagonal positions of the liquid-cooled heat dissipation system. In this way, the liquid-cooled heat dissipation system is installed in a small electronic product. When the small electronic product is used, regardless of the angle of the small electronic product, the two pumps can operate smoothly to make the non-conductive liquid circulate. , The system has the effect of enhancing the convenience of use.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings:

Please refer to Figure 2, which is the first embodiment of the liquid-cooled heat dissipation system of the present invention, which includes a pump P, a heat absorption unit 1, a heat dissipation unit 2 and a tube set 3, which is connected to The pump P, the heat absorption unit 1 and the heat dissipation unit 2 enable non-conductive liquid (such as electronic engineering liquids and other liquids with good fluidity but not conductivity) to circulate, wherein the dielectric strength of the non-conductive liquid is not Less than 30kV.

In detail, the tube assembly 3 can be connected to the pump P and the heat absorption unit 1 by a tube 3a, and the heat absorption unit 1 can be attached to a heat source H of an electronic device, for example; the tube assembly 3 can also consist of a tube 3b connects the pump P and the heat dissipation unit 2, and then connects the heat absorption unit 1 and the heat dissipation unit 2 by a tube 3c; the pump P and the tube assembly 3 contain non-conductive liquid. Accordingly, the non-conductive liquid in the pipe assembly 3 and located at the heat absorption unit 1 can absorb heat energy to increase the temperature, and is guided to the heat dissipation unit 2 by the operation of the pump P, so as to pass through the heat dissipation unit 2 When the temperature is lowered, the temperature is lowered, and after the temperature is lowered, it is guided to the heat absorption unit 1 again; in this way, the temperature of the heat source H can be effectively lowered.

Wherein, the present invention does not limit the types of the heat absorption unit 1 and the heat dissipation unit 2, and does not limit the circulation direction of the non-conductive liquid; that is, the non-conductive liquid after the temperature rises can flow through the pump P and then be directed The heat dissipation unit 2 (circulates in a clockwise direction as shown in Figure 2) or reverses circulation, so that the cooled non-conductive liquid flows through the pump P and then is directed to the heat absorption unit 1.

Please refer to Figure 3, which is the first embodiment of the pump P of the present invention. It includes a casing 4 and a diversion fan 5, the diversion fan 5 is located in the casing 4, and the casing 4 can be used for the aforementioned The pipe fitting set 3 (marked in Figure 2) is assembled and connected so that the non-conductive liquid can flow into the housing 4 and be pumped out by the guide fan 5 under pressure.

Please refer to Figures 3 and 4, the housing 4 has a liquid flow space S inside, the housing 4 has a liquid injection port 41 and a liquid discharge port 42, the liquid injection port 41 and the liquid discharge port 42 are connected to the Between the liquid flow space S and the outside, the liquid injection port 41 is for the non-conductive liquid to flow in, and the drain port 42 is for the non-conductive liquid to drain out. The present invention does not limit the type of the shell 4; in this embodiment, the shell 4 may have a first shell 4a and a second shell 4b, and the first shell 4a and the second shell 4b may be plastic or metal The first shell 4a and the second shell 4b can be combined with other materials. Wherein, when the second shell 4b and the first shell 4a are made of metal, the first shell 4a and the second shell 4b may be selected to be combined by laser welding to improve the structural strength of the shell 4.

The shape of the first shell 4a and the second shell 4b is not limited by the present invention. In this embodiment, the first shell 4a may be a rectangular shell with an open lower end, that is, the first shell 4a has A top plate 43, the circumferential edge of the top plate 43 is connected with a ring wall 44, the liquid injection port 41 and the liquid discharge port 42 can be optionally provided at two opposite ends of the ring wall 44 for the aforementioned pipe fitting group 3 (labeled As shown in Figure 2), or preferably, as shown in the figure, the liquid injection port 41 and the liquid discharge port 42 are formed by the ports of the two conduits 45 connected to the ring wall 44 to enhance the connection with the pipe assembly 3 The ease of assembly and leak-proof effect. The two conduits 45 can be integrally formed and connected with the ring wall 44, or can be assembled and combined with the ring wall 44 in a liquid-tight manner. The second shell 4b may be generally plate-shaped, and the second shell 4b may be connected to the ring wall 44 of the first shell 4a to close the opening formed by the bottom end of the ring wall 44.

Please refer to Figures 3 and 5. In addition, in this embodiment, the liquid flow space S may have a diversion channel S1 formed on the ring wall 44 of the first shell 4a, and the guide channel S1 The flow channel S1 is preferably aligned with the liquid injection port 41 so that the diversion channel S1 can communicate with the liquid injection port 41.

Please refer to Figures 3, 4, and 5, the guide fan 5 is located in the liquid flow space S of the housing 4, the guide fan 5 has a fan frame 51, and the fan frame 51 has a liquid inlet 511 and A liquid outlet 512, the liquid inlet 511 is for non-conductive liquid to flow in, and the liquid outlet 512 is for the non-conductive liquid to drain out. The diversion channel S1 is located between the liquid injection port 41 and the liquid inlet 511, The liquid inlet 511 can communicate with the diversion channel S1 so that the liquid inlet 511 can communicate with the liquid injection port 41. A drive assembly 52 is located in the liquid flow space S of the housing 4, and the drive assembly 52 can drive an impeller 53 located in the fan frame 51 to rotate so that non-conductive liquid can flow into the fan frame 51 from the liquid inlet 511 , And then flow out from the liquid outlet 512.

In detail, the fan frame 51 may have a base plate 513 and a shaft connection portion 514, the shaft connection portion 514 is connected to the base plate 513, a side wall 515 is located on the outer periphery of the shaft connection portion 514, and an upper cover 516 of the fan frame 51 Connecting to the top of the side wall 515, a drainage plate 517 of the fan frame 51 can be installed on a part of the upper cover 516, so that the liquid inlet 511 and the liquid outlet 512 are formed between the drainage plate 517 and the upper cover 516 It is located at the side wall 515; preferably, the upper cover 516 is connected with the drainage plate 517 in an integral form, which can improve the structural strength of the fan frame 51.

Please refer to Figures 4 and 5, the driving assembly 52 may have a circuit board 521 and a certain sub-coil group 522. The stator coil group 522 is preferably formed on the circuit board 521 in a wiring manner to reduce the axial height. The driving assembly 52 may have a plurality of electronic components 523, and the plurality of electronic components 523 are located on the circuit board 521; in this way, the components arranged in the fan frame 51 can be pre-assembled. When assembling the pump P, only It suffices to align the fan frame 51 into a predetermined place in the housing 4. Wherein, the electronic component 523 can be, for example, a Hall sensor or a drive control IC. In addition, since the working liquid flowing through the liquid flow space S is non-conductive liquid when the pump P is operating, the driving component 52 can be selected without water-proof treatment, which will not only prevent short circuit conditions, but also reduce manufacturing cost.

The impeller 53 may have a hub 531 and a plurality of blades 532, the hub 531 is rotatably connected to the shaft portion 514 of the fan frame 51, the plurality of blades 532 are connected to the outer periphery of the hub 531, and a magnetic part of the impeller 53 533 is connected to the hub 531 and opposite to the stator coil assembly 522. After the drive assembly 52 is energized, the magnetic field generated by the stator coil assembly 522 can magnetically repel the magnetic member 533, thereby pushing the hub 531 to drive the plurality of blades 532 to rotate synchronously, so that non-conductive liquid can pass through the liquid inlet 511 flows into the fan frame 51 and then flows out from the liquid outlet 512.

Please refer to Figures 2 and 5, according to the aforementioned structure, when the liquid-cooled heat dissipation system with the pump P of this embodiment operates, the non-conductive liquid located at the heat absorption unit 1 can absorb heat energy, so that the The temperature of the conductive liquid rises. When the pump P is operating, by discharging the non-conductive liquid originally in the liquid flow space S of the housing 4, the liquid flow space S can form a negative pressure to introduce the high-temperature non-conductive liquid from the heat absorption unit 1 High-temperature non-conductive liquid flows into the liquid injection port 41 of the housing 4, and after passing through the diversion channel S1, it can flow into the fan frame 51 through the liquid inlet 511 of the diversion fan 5, and pressurized by the impeller 53 Then it flows out from the liquid outlet 512 of the guide fan 5, and finally leaves the casing 4 through the liquid discharge port 42 of the casing 4 and is guided to the heat dissipation unit 2. The high-temperature non-conductive liquid can cool down when passing through the heat dissipation unit 2, and then be guided to the heat absorption unit 1 again after cooling; in this way, the heat source H at the heat absorption unit 1 can effectively cool down.

Please refer to Figure 6, which is the second embodiment of the pump P of the present invention. In this embodiment, the electronic components 523 of the drive assembly 52 can be moved to other positions in the housing 4 to make the electronic components The part 523 is not located in the fan frame 51, which helps to reduce the axial height of the guide fan 5. Preferably, the frame 51 of the guide fan 5 can also omit the substrate 513 (marked in FIG. 5), and choose to connect the circuit board 521 to the inner surface of the second shell 4b of the housing, so that Further reducing the axial height of the guide fan 5 helps reduce the thickness of the overall casing 4. In detail, the inner surface of the second shell 4b can be recessed with a recess D, so that the circuit board 521 can be received in the recess D, which can further help reduce the thickness of the entire housing 4; and, the fan A part of the side wall 515 of the frame 51 can abut the circuit board 521 to improve the bonding stability of the circuit board 521 and prevent the circuit board 521 from detaching from the cavity D.

Please refer to Figure 7, which is the third embodiment of the pump P of the present invention. In this embodiment, the liquid injection port 41 of the housing 4 can be selectively connected to the top plate 43 of the first housing 4a, so that the The liquid injection port 41 is axially aligned with the liquid inlet 511 of the fan frame 51, and the non-conductive liquid can directly flow into the liquid inlet 511 of the fan frame 51 from the liquid injection port 41, which can reduce the flow length of the non-conductive liquid , In order to improve the smoothness of the non-conductive liquid delivery. In addition, the liquid injection port 41 and the liquid discharge port 42 can be respectively located on the top plate 43 and the ring wall 44, so that the housing 4 can be adapted to different configuration requirements of a liquid-cooled heat dissipation system.

Please refer to Figures 8 and 9, which are the fourth embodiment of the pump P of the present invention. In this embodiment, the liquid injection port 41 and the liquid discharge port 42 can be selected to be located on the ring wall 44. Adjacent to the two ends, the housing 4 can be adapted to different configuration requirements of the liquid-cooled heat dissipation system. In addition, the housing 4 may also have two universal joints 46. The two universal joints 46 can be sleeved on the two conduits 45 respectively, so that the liquid injection port 41 and the liquid discharge port 42 are formed by the ports of the two universal joints 46. . Wherein, the combination of the universal joint 46 and the conduit 45 can be selected to attach the inner wall of the two conduits 45 to the outer wall of the two general joints 46, or alternatively, the two conduits 45 can be selected as shown in Figure 9. The inner wall of the universal joint 46 is attached to the outer wall of the two conduits 45, and the present invention is not limited. In this way, the two universal joints 46 can be applied to different types or sizes of pipe fitting groups 3 (marked in FIG. 2) to improve the convenience of assembly when connecting with the pipe fitting groups 3.

Please refer to FIG. 10, which is the second embodiment of the liquid-cooled heat dissipation system of the present invention. In this embodiment, the number of pumps P can be two. In detail, the liquid-cooled heat dissipation system has a first axis X1 and a second axis X2 orthogonal to a center point C, so that the first axis X1 and the second axis X2 divide the liquid-cooled heat dissipation system Is a first quadrant Q1, a second quadrant Q2, a third quadrant Q3, and a fourth quadrant Q4 arranged counterclockwise so that the first quadrant Q1, the second quadrant Q2, the third quadrant Q3, and the The four quadrants Q4 can form four equal parts, and the two pumps P can be located in the first quadrant Q1 and the third quadrant Q3, or the second quadrant Q2 and the fourth quadrant Q4 respectively; preferably, the present In the embodiment, the two pumps P are respectively arranged at diagonal positions of the liquid-cooled heat dissipation system for description. In this way, the liquid-cooled heat dissipation system is installed in a small electronic product (such as a portable mobile device). When the small electronic product is used, regardless of the angle at which the small electronic product is placed, the two pumps P It can operate smoothly to circulate the non-conductive liquid, so that the heat source H at the heat absorption unit 1 can effectively cool down.

In summary, the liquid-cooled heat dissipation system and its pump of the present invention can be applied to liquid-cooled heat dissipation systems with various pressure requirements, and because the liquid-cooled heat dissipation system uses non-conductive liquid as its work Liquid, so that the stator and rotor of the guide fan in the pump can be located in the same space without isolation, and there will be no short-circuit problem during operation; in this way, the stator of the guide fan (the aforementioned drive assembly) The magnetically sensitive distance between the stator coil set) and the rotor (the aforementioned magnetic part of the impeller) will be reduced, which can improve the efficiency of the stator to drive the rotor to rotate and help reduce the overall pump volume. In addition, since the stator and rotor of the guide fan in the pump do not need to be isolated, the guide fan used to drive the flow of gas can be directly applied to the pump to drive the non-conductive liquid, so that the guide fan The structure does not differ depending on the driving gas or liquid, so the industry does not need to make a special structure of the guide fan in order to drive the liquid flow, which has the effect of reducing manufacturing and storage management costs. In addition, the liquid-cooled heat dissipation system can also be installed in small electronic products to meet the needs of thinner.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art without departing from the spirit and scope of the present invention may make various changes and modifications relative to the above-mentioned embodiments. The technical scope of the invention is protected. Therefore, the scope of protection of the invention shall be subject to the scope of the attached patent application.

﹝this invention﹞ 1: Heat absorption unit 2: Cooling unit 3: Pipe fitting group 3a: pipe fittings 3b: pipe fittings 3c: pipe fittings 4: shell 4a: The first shell 4b: second shell 41: Liquid injection port 42: Drain 43: top plate 44: Ring Wall 45: Catheter 46: Universal connector 5: Diversion fan 51: fan frame 511: Liquid inlet 512: Liquid Outlet 513: substrate 514: Shaft joint 515: side wall 516: upper cover 517: Drain Board 52: drive components 521: Circuit Board 522: Stator coil group 523: electronic parts 53: impeller 531: Wheel Hub 532: blade 533: magnetic parts C: center point D: Tolerance H: heat source P: pump S: Liquid flow space S1: diversion channel X1: the first axis X2: second axis Q1: The first quadrant Q2: The second quadrant Q3: The third quadrant Q4: The fourth quadrant ﹝Used ﹞ 9: Pump 91: shell 911: Shell seat 912: shell cover 913: Diversion Space 914: input port 915: output port 916: Shaft joint 92: Rotor group 921: Impeller 922: Magnet Ring 93: stator group

[Figure 1] A sectional view of a combination of conventional pumps. [Figure 2] Architecture diagram of the first embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 3] An exploded perspective view of the pump of the first embodiment of the present invention. [Figure 4] A top view of the pump in the first embodiment of the present invention. [Figure 5] A cross-sectional view along the line A-A in Figure 4. [Figure 6] The combined cross-sectional view of the pump of the second embodiment of the present invention. [Figure 7] The combined cross-sectional view of the pump of the third embodiment of the present invention. [Figure 8] A top view of the pump of the fourth embodiment of the present invention. [Figure 9] A cross-sectional view along the line B-B in Figure 8. [Figure 10] Architecture diagram of the second embodiment of the liquid-cooled heat dissipation system of the present invention.

4: shell

4a: The first shell

4b: second shell

41: Liquid injection port

42: Drain

43: top plate

44: Ring Wall

45: Catheter

5: Diversion fan

51: fan frame

511: Liquid inlet

512: Liquid Outlet

513: substrate

515: side wall

516: upper cover

517: Drain Board

53: impeller

P: pump

S: Liquid flow space

S1: diversion channel

Claims (16)

A pump used to drive the flow of non-conductive liquid, including: A casing with a liquid flow space inside, the casing having a liquid injection port and a liquid discharge port, the liquid injection port and the liquid discharge port communicate with the liquid flow space; and A diversion fan is located in the liquid flow space. The diversion fan has a fan frame. The fan frame has a liquid inlet and a liquid outlet. The liquid inlet communicates with the liquid injection port and supplies the non-conductive liquid. Inflow, the liquid outlet communicates with the liquid discharge port and discharges the non-conductive liquid. A driving component is located in the liquid flow space, and the driving component drives an impeller located in the fan frame to rotate. The pump described in item 1 of the scope of patent application, wherein the liquid flow space has a diversion channel formed on an annular wall of the housing, and the diversion channel is located between the liquid injection port and the liquid inlet Between the ports, the diversion channel communicates the liquid injection port and the liquid inlet. The pump described in item 1 of the scope of the patent application, wherein the outer shell has a first shell and a second shell that are combined, the first shell has a top plate, the peripheral edge of the top plate is connected with a ring wall, the The liquid injection port and the liquid discharge port are arranged at two opposite ends or two adjacent ends of the ring wall. The pump described in item 3 of the scope of patent application, wherein the housing has two conduits connected to the annular wall, and the ports of the two conduits form the liquid injection port and the liquid discharge port. The pump described in item 3 of the scope of patent application, wherein the liquid injection port of the casing is connected to the top plate of the first casing, and the liquid injection port is axially aligned with the liquid inlet of the fan frame. The pump described in item 1 of the scope of patent application, wherein the fan frame has a base plate and a shaft connection portion, the shaft connection portion is connected to the base plate, a side wall is located on the outer periphery of the shaft connection portion, and a side wall of the fan frame The upper cover is connected to the top of the side wall, and a drainage plate of the fan frame is arranged on a part of the upper cover, so that the liquid inlet is formed between the drainage plate and the upper cover, and the liquid outlet is located on the side wall. The pump described in item 6 of the scope of patent application, wherein the upper cover and the drainage plate are integrally formed and connected. The pump described in item 1 of the scope of patent application, wherein the driving assembly has a plurality of electronic components, and the plurality of electronic components are not located in the fan frame. The pump described in item 8 of the scope of patent application, wherein the drive assembly has a circuit board connected to the inner surface of the housing, a side wall of the fan frame abuts against the circuit board, and the drive assembly has a certain sub-coil The group wiring is formed on the circuit board, and the stator coil group is located in the fan frame. For the pump described in item 9 of the scope of patent application, wherein the inner surface of the housing is recessed with a cavity, and the circuit board is accommodated in the cavity. The pump described in item 1 of the scope of patent application, wherein the housing has two universal joints, and the two universal joints are respectively sleeved on the two conduits of the housing, so that the ports of the two universal joints form the injection port and The drain. The pump described in item 1 of the scope of patent application, wherein the driving component is not waterproofed. For the pump described in item 1 of the scope of the patent application, the driving component has a circuit board, the circuit board is located in the fan frame, and the circuit board has a certain sub-coil group and several electronic components. A liquid-cooled heat dissipation system, including: One of the pumps described in any one of items 1 to 13 in the scope of patent application; A heat absorption unit; A heat dissipation unit; A non-conductive liquid; and A tube set is connected in series with the pump, the heat absorption unit and the heat dissipation unit, so that the non-conductive liquid circulates during the operation of the pump. A liquid-cooled heat dissipation system, including: Such as the second pump described in any one of items 1 to 13 in the scope of the patent application, the liquid-cooled heat dissipation system is divided into a first quadrant, a second quadrant, and a second quadrant by intersecting a first axis and a second axis. A third quadrant and a fourth quadrant, the two pumps are respectively located in the first quadrant and the third quadrant, or the second quadrant and the fourth quadrant; A heat absorption unit; A heat dissipation unit; A non-conductive liquid; and A tube set is connected in series with the two pumps, the heat absorption unit and the heat dissipation unit, so that the non-conductive liquid circulates when the two pumps operate. The liquid-cooled heat dissipation system described in item 15 of the scope of patent application, wherein the two pumps are respectively arranged at diagonal positions of the liquid-cooled heat dissipation system.

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