CN112901507A - Liquid cooling type heat dissipation system and pump thereof - Google Patents
Liquid cooling type heat dissipation system and pump thereof Download PDFInfo
- Publication number
- CN112901507A CN112901507A CN201911200743.2A CN201911200743A CN112901507A CN 112901507 A CN112901507 A CN 112901507A CN 201911200743 A CN201911200743 A CN 201911200743A CN 112901507 A CN112901507 A CN 112901507A
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- liquid
- pump
- fan frame
- flow
- heat dissipation
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- 239000007788 liquid Substances 0.000 title claims abstract description 212
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 52
- 238000001816 cooling Methods 0.000 title abstract description 21
- 238000002347 injection Methods 0.000 claims abstract description 34
- 239000007924 injection Substances 0.000 claims abstract description 34
- 238000010521 absorption reaction Methods 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000006698 induction Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/44—Fluid-guiding means, e.g. diffusers
- F04D29/445—Fluid-guiding means, e.g. diffusers especially adapted for liquid pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
Abstract
A liquid cooling type heat dissipation system and a pump thereof are used for solving the problem that the stator of the existing pump needs to be isolated from the rotor. The pump of the invention can be used for driving the flow of the non-conductive liquid, and comprises: the shell is internally provided with a liquid flow space and is provided with a liquid injection port and a liquid discharge port, and the liquid injection port and the liquid discharge port are communicated with the liquid flow space; and a diversion fan, located in the liquid flow space, the diversion fan having a fan frame, the fan frame having a liquid inlet and a liquid outlet, the liquid inlet communicating with the liquid injection port and allowing the non-conductive liquid to flow in, the liquid outlet communicating with the liquid discharge port and allowing the non-conductive liquid to be discharged, a driving assembly located in the liquid flow space, the driving assembly driving an impeller located in the fan frame to rotate.
Description
Technical Field
The present invention relates to a pump for driving liquid to flow and a liquid cooling heat dissipation system, and more particularly, to a pump with an internal portion capable of flowing a non-conductive liquid and a liquid cooling heat dissipation system having the same.
Background
Referring to fig. 1, a conventional pump 9 is shown, the conventional pump 9 includes a housing 91, a rotor set 92 and a stator set 93. The housing 91 is formed by assembling a housing seat 911 and a housing cover 912, and a flow guiding space 913 is formed between the interior of the housing seat 911 and the housing cover 912. The housing 91 further has an input port 914 and an output port 915 which are connected to the guiding space 913, and the bottom end of the housing 911 has a shaft portion 916. The rotor assembly 92 is disposed in the guiding space 913, the rotor assembly 92 has an impeller 921 rotatably disposed on the coupling portion 916, and a magnet ring 922 is coupled to the impeller 921 and disposed on the outer periphery of the coupling portion 916. The stator assembly 93 is coupled to the housing seat 911 and located outside the guiding space 913, and the stator assembly 93 is radially opposite to the magnet ring 922 across the housing seat 911. When the conventional pump 9 is operated, the magnetic field generated by the stator assembly 93 can penetrate through the housing 911 and magnetically repel each other with the magnet ring 922, so as to drive the impeller 921 to rotate, so that the liquid can flow into the guiding space 913 through the input port 914 and then be guided to be discharged from the output port 915. An embodiment similar to the conventional pump 9 is disclosed in taiwan patent No. 587784.
However, since the conventional pump 9 needs to avoid the short circuit of the stator set 93 due to the contact with the liquid, the stator set 93 is optionally disposed outside the guiding space 913, so as to ensure that the liquid does not contact the stator set 93 during the process of guiding the liquid into and out of the guiding space 913. However, this arrangement makes the magnetic distance between the stator 93 and the magnet ring 922 difficult to reduce and affects the driving performance because the housing 911 is required to be separated between the stator and the magnet ring 922.
In view of the above, there is a need for improvement of the existing pump.
Disclosure of Invention
To solve the above problems, an objective of the present invention is to provide a liquid-cooled heat dissipation system and a pump thereof, which can pressurize a non-conductive liquid by a flow guiding fan to increase the hydraulic pressure of the non-conductive liquid leaving the pump.
Another objective of the present invention is to provide a liquid-cooled heat dissipation system and a pump thereof, which can reduce the magnetic induction distance between the stator and the rotor by using a non-conductive liquid, so that the stator and the rotor of the fan can be disposed in the same space without isolation.
It is another object of the present invention to provide a liquid-cooled heat dissipation system and a pump thereof, which can directly apply a fan for driving a gas to flow in the pump to drive a non-conductive liquid, so that the structure of the fan can be different for driving the gas or the liquid.
Another objective of the present invention is to provide a liquid-cooled heat dissipation system and a pump thereof, which can be installed in a small electronic product to achieve the requirement of thin-type.
All directions or similar expressions such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc. are mainly used to refer to the directions of the drawings, and are only used to assist the description and understanding of the embodiments of the present invention, and are not used to limit the present invention.
The use of the terms a or an for the elements and components described throughout this disclosure are for convenience only and provide a general sense of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.
The terms "combined", "combined" and "assembled" as used herein include the separation of the components without damaging the components after connection, and the inseparability of the components after connection, which can be selected by those skilled in the art according to the material and assembly requirements of the components to be connected.
The pump of the present invention is used for driving the non-conductive liquid to flow, and comprises: the shell is internally provided with a liquid flow space and is provided with a liquid injection port and a liquid discharge port, and the liquid injection port and the liquid discharge port are communicated with the liquid flow space; and a diversion fan, located in the liquid flow space, the diversion fan having a fan frame, the fan frame having a liquid inlet and a liquid outlet, the liquid inlet communicating with the liquid injection port and allowing the non-conductive liquid to flow in, the liquid outlet communicating with the liquid discharge port and allowing the non-conductive liquid to be discharged, a driving assembly located in the liquid flow space, the driving assembly driving an impeller located in the fan frame to rotate.
The liquid cooling type heat dissipation system of the present invention comprises: a pump as described above; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe assembly, which is connected in series with the pump, the heat absorption unit and the heat dissipation unit, so as to make the non-conductive liquid flow circularly when the pump is in operation.
The liquid cooling type heat dissipation system of the present invention comprises: the liquid cooling heat dissipation system comprises two pumps, wherein the liquid cooling heat dissipation system is divided into a first quadrant, a second quadrant, a third quadrant and a fourth quadrant by a first axis and a second axis which are intersected, and the two pumps are respectively positioned in the first quadrant and the third quadrant or the second quadrant and the fourth quadrant; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe set, which connects two pumps, the heat absorption unit and the heat dissipation unit in series, so as to make the non-conductive liquid flow circularly when the two pumps are operated.
Therefore, the liquid cooling type heat dissipation system and the pump thereof can be suitable for the liquid cooling type heat dissipation systems with various pressurization requirements, and because the liquid cooling type heat dissipation system adopts non-conductive liquid as working liquid, the stator and the rotor of the flow guide fan in the pump can be arranged in the same space without isolation, and the problem of short circuit can not occur during operation; therefore, the magnetic induction distance between the stator and the rotor of the flow guiding fan can be reduced, the efficiency of the stator driving the rotor to rotate can be improved, and the volume of the whole pump can be reduced. In addition, because the stator and the rotor of the guide fan in the pump do not need to be isolated, the guide fan for driving the gas to flow can be directly applied to the pump to drive the non-conductive liquid, so that the structure of the guide fan can be different without driving the gas or the liquid, and a manufacturer does not need to additionally manufacture the guide fan with a specific structure for driving the liquid to flow, and the guide fan has the effects of reducing the manufacturing and storage management cost and the like. In addition, the liquid-cooled heat dissipation system can also be installed in small electronic products to achieve the requirement of thinning.
The liquid flow space can be provided with a flow guide channel, the flow guide channel can be formed on an annular wall of the shell, the flow guide channel is positioned between the liquid injection port and the liquid inlet, and the flow guide channel is communicated with the liquid injection port and the liquid inlet. Therefore, the flow guide channel can guide the flowing direction of the non-conductive liquid, so that the non-conductive liquid can flow into the liquid inlet more smoothly, and the effect of improving the flowing smoothness of the non-conductive liquid is achieved.
The shell can be provided with a first shell and a second shell which are combined, the first shell is provided with a top plate, the circumferential edge of the top plate is connected with a ring wall, and the liquid injection port and the liquid discharge port are arranged at two opposite ends or two adjacent ends of the ring wall. Therefore, the shell can meet different configuration requirements of the liquid cooling type heat dissipation system, and has the effect of improving the use convenience.
Wherein, the shell can be provided with two guide pipes which are connected with the annular wall, and the ports of the two guide pipes form the liquid injection port and the liquid discharge port. Therefore, the two guide pipes can be easily connected with the pipe fitting set, and the pipe fitting set has the effects of improving the assembling convenience and the leakage-proof effect.
The liquid injection port of the shell can be connected to the top plate of the first shell, and the liquid injection port is axially aligned to the liquid inlet of the fan frame. Therefore, the non-conductive liquid can directly flow into the liquid inlet of the fan frame from the liquid inlet, the flowing length of the non-conductive liquid can be reduced, and the effect of improving the smooth guiding and conveying degree of the non-conductive liquid is achieved.
Wherein, this fan frame can have a base plate and an axle junction portion, and this base plate is connected to this axle junction portion, and a side wall is located the periphery of this axle junction portion, and the top of this side wall can be connected to an upper cover of this fan frame, and the part of this upper cover can be located to a drainage plate of this fan frame lid, makes and forms this income liquid mouth between this drainage plate and this upper cover, and this liquid outlet then is located this side wall. Therefore, the structure is simple and convenient to assemble, and has the effect of improving the assembly convenience.
Wherein, this upper cover is connected for integrated into one piece with this drainage plate. Therefore, the upper cover and the drainage plate can be stably connected, and the fan frame has the effect of improving the structural strength of the fan frame.
The driving assembly may have a plurality of electronic components, and the plurality of electronic components are not located in the fan frame. Therefore, the axial height of the flow guide fan can be reduced, and the effect of effectively reducing the configuration space is achieved.
The driving assembly can be provided with a circuit board connected to the inner surface of the shell, one side wall of the fan frame is abutted to the circuit board, the driving assembly is provided with a stator coil group wiring formed on the circuit board, and the stator coil group is positioned in the fan frame. Therefore, the axial height of the flow guide fan can be reduced, and the thickness of the whole shell can be reduced.
Wherein, the inner surface of the shell can be concavely provided with a containing groove, and the circuit board is contained in the containing groove. Therefore, the axial height of the flow guide fan can be further reduced, and the thickness of the whole shell can be further reduced.
The shell can be provided with two universal joints which are respectively sleeved on the two guide pipes of the shell so as to form the liquid injection port and the liquid discharge port by the ports of the two universal joints. Therefore, the two universal joints can be suitable for pipe sets of different models or sizes, and the effect of improving the assembling convenience when the universal joints are connected with the pipe sets is achieved.
Wherein, this drive assembly does not receive water repellent treatment. Therefore, the manufacturing cost is reduced.
The driving assembly is provided with a circuit board, the circuit board is positioned in the fan frame, and a stator coil group and a plurality of electronic parts are arranged on the circuit board. Therefore, the components arranged in the fan frame can be assembled in advance, when the pump is assembled, the fan frame is only required to be arranged at the preset position in the shell in an opposite mode, and the pump has the effect of improving the assembling convenience.
Wherein, two pumps are respectively arranged at the diagonal positions of the liquid cooling type heat dissipation system. So, this liquid cooling formula cooling system installs in small-size electronic product, and when this small-size electronic product used, no matter this small-size electronic product's the angle of placing why, two pumps all can operate smoothly and make this non-conducting liquid circulation flow, have the efficiency that promotes the convenience in use.
Drawings
FIG. 1: a combined cross-sectional view of a prior pump;
FIG. 2: the architecture diagram of the first embodiment of the liquid cooling heat dissipation system of the present invention;
FIG. 3: an exploded perspective view of the pump of the first embodiment of the present invention;
FIG. 4: a top view of the pump of the first embodiment of the present invention;
FIG. 5: a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6: a combined cross-sectional view of a pump of a second embodiment of the invention;
FIG. 7: a combined cross-sectional view of a pump of a third embodiment of the invention;
FIG. 8: a top view of a pump of a fourth embodiment of the invention;
FIG. 9: a cross-sectional view taken along line B-B of FIG. 8;
FIG. 10: the architecture diagram of the second embodiment of the liquid cooling heat dissipation system of the present invention.
Description of the reference numerals
[ invention ]
1 Heat absorption Unit
2 Heat dissipation Unit
3 pipe fitting group
3a pipe fitting
3b pipe fitting
3c pipe fitting
4 outer cover
4a first shell
4b second shell
41 liquid filling opening
42 liquid discharge port
43 Top plate
44 ring wall
45 guide tube
46 universal joint
5 flow guiding fan
51 fan frame
511 liquid inlet
512 liquid outlet
513 base plate
514 coupling part
515 side wall
516 upper cover
517 drainage plate
52 drive assembly
521 circuit board
522 stator coil group
523 electronic component
53 impeller
531 wheel hub
532 blade
533 magnetic element
Center point of C
D-shaped containing groove
H heat source
P pump
Space for S liquid flow
S1 diversion channel
First axis of X1
Second axis X2
Q1 first quadrant
Q2 second quadrant
Third quadrant of Q3
Quadrant IV of Q4
[ Prior Art ]
9 pumps
91 casing
911 case base
912 casing cover
913 flow guiding space
914 input port
915 output port
916 shaft connecting part
92 rotor set
921 impeller
922 magnetic ring
93 stator groups.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below:
referring to fig. 2, a liquid-cooled heat dissipation system according to a first embodiment of the present invention includes a pump P, a heat absorption unit 1, a heat dissipation unit 2, and a tube assembly 3, where the tube assembly 3 connects the pump P, the heat absorption unit 1, and the heat dissipation unit 2, so that a non-conductive liquid (e.g., a liquid with good fluidity but no conductivity, such as an electronic engineering liquid) can flow circularly, and a dielectric strength of the non-conductive liquid is not less than 30 kV.
In detail, the tube assembly 3 can connect the pump P and the heat absorption unit 1 through a tube 3a, and the heat absorption unit 1 can be attached to a heat source H of an electronic device; the tube assembly 3 can further include a tube 3b connecting the pump P and the heat dissipating unit 2, and a tube 3c connecting the heat absorbing unit 1 and the heat dissipating unit 2; the pump P and the tube assembly 3 have a non-conductive liquid therein. Accordingly, the non-conductive liquid in the tube assembly 3 and located at the heat absorption unit 1 can absorb heat energy to raise the temperature, and is guided to the heat dissipation unit 2 through the operation of the pump P, so as to be cooled when passing through the heat dissipation unit 2, and is guided to the heat absorption unit 1 again after being cooled; the circulation is continuously carried out, so that the heat source H can be effectively cooled.
The invention does not limit the shapes of the heat absorption unit 1 and the heat dissipation unit 2, and does not limit the circulating direction of the non-conductive liquid; that is, the heated non-conductive liquid may flow through the pump P and then be guided to the heat dissipation unit 2 (clockwise circulation as shown in fig. 2), or reversely circulate, so that the cooled non-conductive liquid flows through the pump P and then is guided to the heat absorption unit 1.
Referring to fig. 3, it is shown that the first embodiment of the pump P of the present invention includes a housing 4 and a guiding fan 5, the guiding fan 5 is located in the housing 4, the housing 4 can be assembled and connected with the pipe assembly 3 (shown in fig. 2), so that the non-conductive liquid can flow into the housing 4 and be pumped out by the guiding fan 5.
Referring to fig. 3 and 4, the housing 4 has a liquid flow space S therein, the housing 4 has a liquid injection port 41 and a liquid discharge port 42, the liquid injection port 41 and the liquid discharge port 42 communicate the liquid flow space S with the outside, the liquid injection port 41 is used for the non-conductive liquid to flow in, and the liquid discharge port 42 is used for the non-conductive liquid to discharge. The present invention does not limit the form of the housing 4; in this embodiment, the housing 4 may have a first shell 4a and a second shell 4b, the first shell 4a and the second shell 4b may be made of plastic or metal, and the first shell 4a and the second shell 4b may be combined. When the second shell 4b and the first shell 4a are made of metal, the first shell 4a and the second shell 4b can be selected to be laser welded and combined, so as to improve the structural strength of the housing 4.
The form of the first shell 4a and the second shell 4b, the invention is not limited, in this embodiment, the first shell 4a may be a rectangular shell with an open lower end, that is, the first shell 4a has a top plate 43, a ring wall 44 is connected to the circumferential edge of the top plate 43, the liquid injection port 41 and the liquid discharge port 42 may be selectively disposed at two opposite ends of the ring wall 44, so as to respectively allow the pipe assembly 3 (shown in fig. 2) to pass through; or preferably, as shown in fig. 3, the liquid injection port 41 and the liquid discharge port 42 are formed by the ports of the two conduits 45 connecting the annular wall 44, so as to improve the assembly convenience and the leakage-proof effect when connecting the pipe assembly 3. The two conduits 45 can be integrally connected to the annular wall 44 or can be assembled in a fluid-tight manner in conjunction with the annular wall 44. The second shell 4b may be substantially plate-shaped, and the second shell 4b may be connected to the annular wall 44 of the first shell 4a to close the opening formed at the bottom end of the annular wall 44.
Referring to FIGS. 3 and 5, in addition, in this embodiment, the liquid flow space S may have a flow guide channel S1, the flow guide channel S1 is formed on the annular wall 44 of the first casing 4a, and the flow guide channel S1 is preferably aligned with the liquid inlet 41, so that the flow guide channel S1 can communicate with the liquid inlet 41.
Referring to fig. 3, 4 and 5, the guiding fan 5 is located in the liquid flow space S of the housing 4, the guiding fan 5 has a fan frame 51, the fan frame 51 has a liquid inlet 511 and a liquid outlet 512, the liquid inlet 511 is used for flowing non-conductive liquid, the liquid outlet 512 is used for discharging non-conductive liquid, the guiding channel S1 is located between the liquid injection port 41 and the liquid inlet 511, the liquid inlet 511 can be communicated with the guiding channel S1, so that the liquid inlet 511 can be communicated with the liquid injection port 41. A driving component 52 is disposed in the liquid flow space S of the housing 4, the driving component 52 can drive an impeller 53 disposed in the fan frame 51 to rotate, so that the non-conductive liquid can flow into the fan frame 51 from the liquid inlet 511 and then flow out from the liquid outlet 512.
In detail, the fan frame 51 may have a substrate 513 and a shaft connecting portion 514, the shaft connecting portion 514 is connected to the substrate 513, a side wall 515 is located at the periphery of the shaft connecting portion 514, an upper cover 516 of the fan frame 51 is connected to the top end of the side wall 515, a drainage plate 517 of the fan frame 51 may be covered on a part of the upper cover 516, such that the liquid inlet 511 is formed between the drainage plate 517 and the upper cover 516, and the liquid outlet 512 is located on the side wall 515; preferably, the upper cover 516 and the drainage plate 517 are integrally formed and connected, so as to improve the structural strength of the fan frame 51.
Referring to fig. 4 and 5, the driving assembly 52 may have a circuit board 521 and a stator coil set 522, the stator coil set 522 is preferably formed on the circuit board 521 in a wiring manner to reduce the axial height, the driving assembly 52 may have a plurality of electronic components 523, and the plurality of electronic components 523 are located on the circuit board 521; in this way, the components disposed in the fan frame 51 may be assembled in advance, and the fan frame 51 may be positioned at a predetermined position in the housing 4 when the pump P is assembled. The electronic component 523 may be a hall sensor or a driving control IC, for example. In addition, since the working fluid flowing through the fluid space S is a non-conductive fluid when the pump P is operating, the driving assembly 52 can be free from water-proof treatment, so that not only is no short circuit occurring, but also the manufacturing cost can be reduced.
The impeller 53 may have a hub 531 and a plurality of blades 532, the hub 531 is rotatably connected to the coupling portion 514 of the fan frame 51, the plurality of blades 532 are connected to the outer periphery of the hub 531, and a magnetic member 533 of the impeller 53 is connected to the hub 531 and is opposite to the stator coil set 522. After the driving assembly 52 is powered on, the magnetic field generated by the stator coil set 522 and the magnetic member 533 repel magnetically, so as to push the hub 531 to drive the plurality of blades 532 to rotate synchronously, so that the non-conductive liquid can flow into the fan frame 51 through the liquid inlet 511 and then flow out from the liquid outlet 512.
Referring to fig. 2 and 5, according to the above structure, when the liquid cooling heat dissipation system having the pump P of the present embodiment operates, the non-conductive liquid located at the heat absorption unit 1 can absorb heat energy, so as to raise the temperature of the non-conductive liquid. When the pump P is operated, the non-conductive liquid in the liquid flow space S of the housing 4 is discharged, so that the liquid flow space S forms a negative pressure to introduce the high-temperature non-conductive liquid from the heat absorbing unit 1; the high-temperature non-conductive liquid flows into the liquid injection port 41 of the housing 4 and passes through the diversion channel S1, and then flows into the fan frame 51 through the liquid inlet 511 of the diversion fan 5, is pressurized by the impeller 53, then flows out from the liquid outlet 512 of the diversion fan 5, and finally leaves the housing 4 through the liquid outlet 42 of the housing 4 and is guided to the heat dissipation unit 2. The high-temperature non-conductive liquid can be cooled when passing through the heat dissipation unit 2, and is guided to the heat absorption unit 1 again after being cooled; the circulation is continued, so that the heat source H at the heat absorption unit 1 can be effectively cooled.
Referring to fig. 6, which is a second embodiment of the pump P of the present invention, in this embodiment, the electronic component 523 of the driving assembly 52 can be selectively moved to other positions in the housing 4, so that the electronic component 523 is not located in the fan frame 51, which helps to reduce the axial height of the guide fan 5. Preferably, the base plate 513 (shown in fig. 5) may be omitted from the fan frame 51 of the flow guiding fan 5, and the circuit board 521 is optionally connected to the inner surface of the second casing 4b of the housing, so as to further reduce the axial height of the flow guiding fan 5, which is beneficial to reducing the thickness of the entire housing 4. In detail, the inner surface of the second casing 4b may be recessed with a receiving slot D, so that the circuit board 521 can be received in the receiving slot D, which is more conducive to reducing the thickness of the entire casing 4; moreover, a part of the sidewall 515 of the fan frame 51 may abut against the circuit board 521, so as to improve the combining stability of the circuit board 521 and prevent the circuit board 521 from separating from the accommodating groove D.
Referring to fig. 7, which is a third embodiment of the pump P of the present invention, in this embodiment, the liquid injection port 41 of the housing 4 can be selectively connected to the top plate 43 of the first casing 4a, so that the liquid injection port 41 is axially aligned with the liquid inlet 511 of the fan frame 51, and the non-conductive liquid can directly flow downward into the liquid inlet 511 of the fan frame 51 through the liquid injection port 41, so as to reduce the flow length of the non-conductive liquid and improve the smoothness of the guiding of the non-conductive liquid. In addition, the liquid injection port 41 and the liquid discharge port 42 can be respectively positioned on the top plate 43 and the annular wall 44, so that the housing 4 can adapt to different configuration requirements of a liquid cooling type heat dissipation system.
Referring to fig. 8 and 9, which are fourth embodiments of the pump P of the present invention, in this embodiment, the liquid injection port 41 and the liquid discharge port 42 can be selectively disposed at two adjacent ends of the annular wall 44, so that the housing 4 can be adapted to different configuration requirements of a liquid cooling heat dissipation system. The casing 4 may further include two universal joints 46, and the two universal joints 46 may be respectively fitted to the two pipes 45 to form the liquid injection port 41 and the liquid discharge port 42 from the ports of the two universal joints 46. The combination of the universal joint 46 and the conduit 45 may be selected to attach the inner walls of the two conduits 45 to the outer walls of the two universal joints 46, or may be selected to attach the inner walls of the two universal joints 46 to the outer walls of the two conduits 45 as shown in fig. 9, which is not limited in the present invention. Thus, the two universal couplings 46 can be adapted to different types or sizes of tubing sets 3 (shown in fig. 2) to facilitate ease of assembly when connecting to the tubing sets 3.
Referring to fig. 10, which shows a second embodiment of the liquid-cooled heat dissipation system of the present invention, in this embodiment, the number of the pumps P may be two. In detail, the liquid-cooled heat dissipation system is orthogonal to a center point C by a first axis X1 and a second axis X2, such that the first axis X1 and the second axis X2 divide the liquid-cooled heat dissipation system into a first quadrant Q1, a second quadrant Q2, a third quadrant Q3, and a fourth quadrant Q4, which are arranged counterclockwise, such that the first quadrant Q1, the second quadrant Q2, the third quadrant Q3, and the fourth quadrant Q4 can form equal four equal parts, and two pumps P can be respectively located in the first quadrant Q1 and the third quadrant Q3, or the second quadrant Q2 and the fourth quadrant Q4; preferably, the two pumps P are respectively disposed at opposite corners of the liquid-cooled heat dissipation system in the embodiment. Thus, the liquid-cooled heat dissipation system is installed in a small electronic product (e.g., a portable mobile device), and when the small electronic product is used, the two pumps P can operate smoothly to circulate the non-conductive liquid no matter the angle at which the small electronic product is placed, so that the heat source H at the heat absorption unit 1 can be effectively cooled.
In summary, the liquid-cooled heat dissipation system and the pump thereof of the present invention can be applied to liquid-cooled heat dissipation systems with various pressurization requirements, and the liquid-cooled heat dissipation system uses non-conductive liquid as the working liquid, so that the stator and the rotor of the flow guiding fan in the pump can be disposed in the same space without isolation, and the short circuit problem during operation is avoided; therefore, the magnetic induction distance between the stator (the stator coil group of the driving assembly) and the rotor (the magnetic part of the impeller) of the flow guiding fan is reduced, the efficiency of the stator driving the rotor to rotate is improved, and the volume of the whole pump is reduced. In addition, because the stator and the rotor of the guide fan in the pump do not need to be isolated, the guide fan for driving the gas to flow can be directly applied to the pump to drive the non-conductive liquid, so that the structure of the guide fan can be different without driving the gas or the liquid, and a manufacturer does not need to additionally manufacture the guide fan with a specific structure for driving the liquid to flow, and the guide fan has the effects of reducing the manufacturing and storage management cost and the like. In addition, the liquid-cooled heat dissipation system can also be installed in small electronic products to achieve the requirement of thinning.
Claims (16)
1. A pump for driving a flow of a non-conductive fluid, comprising:
the shell is internally provided with a liquid flow space and is provided with a liquid injection port and a liquid discharge port, and the liquid injection port and the liquid discharge port are communicated with the liquid flow space; and
a water conservancy diversion fan is located this liquid flow space, and this water conservancy diversion fan has a fan frame, and this fan frame has one and goes into liquid mouth and a liquid outlet, should go into the liquid mouth intercommunication should annotate the liquid mouth and supply this electrically non-conductive liquid to flow in, and this liquid outlet intercommunication this leakage fluid dram supplies this electrically non-conductive liquid to discharge, and a drive assembly is located this liquid flow space, and this drive assembly drive is located an impeller rotation in this fan frame.
2. The pump of claim 1, wherein the flow space has a flow guide channel formed in an annular wall of the housing, the flow guide channel being located between the injection port and the inlet port, the flow guide channel communicating the injection port and the inlet port.
3. The pump of claim 1, wherein the housing has a first shell and a second shell coupled together, the first shell having a top plate with a circumferential wall coupled to a perimeter of the top plate, the liquid injection port and the liquid discharge port being disposed at or adjacent opposite ends of the circumferential wall.
4. The pump of claim 3, wherein the housing has two conduits, the two conduits being connected to the annular wall, the ports of the two conduits forming the liquid injection port and the liquid discharge port.
5. The pump of claim 3, wherein the fluid inlet of the housing is coupled to the top plate of the first casing, the fluid inlet being axially aligned with the fluid inlet of the fan frame.
6. The pump of claim 1, wherein the fan frame has a base plate and an axial connection portion, the axial connection portion is connected to the base plate, a side wall is located at an outer periphery of the axial connection portion, an upper cover of the fan frame is connected to a top end of the side wall, a drainage plate of the fan frame is covered on a part of the upper cover, so that the liquid inlet is formed between the drainage plate and the upper cover, and the liquid outlet is located on the side wall.
7. The pump of claim 6, wherein the upper cover is integrally connected to the flow guide plate.
8. The pump of claim 1, wherein the drive assembly has a plurality of electronic components that are not located in the fan frame.
9. The pump of claim 8, wherein the drive assembly has a circuit board attached to the inner surface of the housing, a side wall of the fan frame abuts the circuit board, the drive assembly has a stator coil assembly wiring formed on the circuit board, and the stator coil assembly is located in the fan frame.
10. The pump of claim 9, wherein the inner surface of the housing is recessed with a pocket, and the circuit board is received in the pocket.
11. The pump of claim 1, wherein the housing has two universal joints, and the two universal joints are respectively sleeved on the two guide pipes of the housing to form the liquid injection port and the liquid discharge port by ports of the two universal joints.
12. The pump of claim 1, wherein the drive assembly is not waterproofed.
13. The pump of claim 1, wherein the drive assembly has a circuit board disposed in the fan frame, the circuit board having a stator coil assembly and a plurality of electronic components thereon.
14. A liquid-cooled heat dissipation system, comprising:
a pump as claimed in any one of claims 1 to 13;
a heat absorbing unit;
a heat dissipating unit;
a non-conductive liquid; and
and the pipe group is connected in series with the pump, the heat absorption unit and the heat dissipation unit so as to enable the non-conductive liquid to flow circularly when the pump operates.
15. A liquid-cooled heat dissipation system, comprising:
the pump of any of claims 1 to 13, having two, the liquid-cooled heat dissipation system being divided into a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant by a first axis and a second axis intersecting, the two pumps being located in the first quadrant and the third quadrant, or the second quadrant and the fourth quadrant, respectively;
a heat absorbing unit;
a heat dissipating unit;
a non-conductive liquid; and
and the pipe group is connected with the two pumps, the heat absorption unit and the heat dissipation unit in series so as to enable the non-conductive liquid to flow circularly when the two pumps operate.
16. The liquid-cooled heat dissipating system of claim 15, wherein two pumps are disposed at opposite corners of the liquid-cooled heat dissipating system.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108141952A TWI705194B (en) | 2019-11-19 | 2019-11-19 | Liquid cooling system and pump thereof |
| TW108141952 | 2019-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112901507A true CN112901507A (en) | 2021-06-04 |
Family
ID=72172774
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922115074.0U Active CN211370750U (en) | 2019-11-19 | 2019-11-29 | Liquid cooling type heat dissipation system and pump thereof |
| CN201911200743.2A Withdrawn CN112901507A (en) | 2019-11-19 | 2019-11-29 | Liquid cooling type heat dissipation system and pump thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922115074.0U Active CN211370750U (en) | 2019-11-19 | 2019-11-29 | Liquid cooling type heat dissipation system and pump thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN211370750U (en) |
| TW (1) | TWI705194B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI705194B (en) * | 2019-11-19 | 2020-09-21 | 建準電機工業股份有限公司 | Liquid cooling system and pump thereof |
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| CN205841310U (en) * | 2016-08-03 | 2016-12-28 | 韩荣泽 | A kind of air-water mixing pump |
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- 2019-11-19 TW TW108141952A patent/TWI705194B/en active
- 2019-11-29 CN CN201922115074.0U patent/CN211370750U/en active Active
- 2019-11-29 CN CN201911200743.2A patent/CN112901507A/en not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202120802A (en) | 2021-06-01 |
| TWI705194B (en) | 2020-09-21 |
| CN211370750U (en) | 2020-08-28 |
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Application publication date: 20210604 |