TWI704101B - Adjustable sensing capacitance microelectromechanical system (mems) apparatus - Google Patents

Adjustable sensing capacitance microelectromechanical system (mems) apparatus Download PDF

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TWI704101B
TWI704101B TW108111375A TW108111375A TWI704101B TW I704101 B TWI704101 B TW I704101B TW 108111375 A TW108111375 A TW 108111375A TW 108111375 A TW108111375 A TW 108111375A TW I704101 B TWI704101 B TW I704101B
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electrode
movable
capacitance value
electrode units
inductive
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TW202035273A (en
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許郁文
黃肇達
郭秦輔
葉哲愷
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財團法人工業技術研究院
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A Adjustable Sensing Capacitance Microelectromechanical System (MEMS) Apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is movable relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working state of each of the electrical switches, thereby changing a sensing capacitance of the MEMS sensor.

Description

一種可調整感應電容值的微機電感測裝置Microcomputer inductance measuring device capable of adjusting inductive capacitance value

本發明是關於一種微機電感測裝置,特別是一種可調整感應電容值的微機電感測裝置。The invention relates to a microcomputer inductance measuring device, in particular to a microcomputer inductance measuring device that can adjust the value of the inductive capacitance.

微機電感測器是將被測量的物理量變化轉換為電容量變化的一種裝置。微機電感測器本身就是一種可變電容器,由於這種感測器具有結構簡單、體積小、靈敏度高、解析度高、能實現非接觸測量等特點,因而被廣泛應用於偵測位移、加速度、振動、壓力、壓差、液體高度等機械物理量的變化。Microcomputer inductance detector is a device that converts the change of the measured physical quantity into the change of capacitance. The microcomputer inductance sensor itself is a variable capacitor. Because this sensor has the characteristics of simple structure, small size, high sensitivity, high resolution, and non-contact measurement, it is widely used to detect displacement and acceleration. , Vibration, pressure, pressure difference, liquid height and other mechanical physical changes.

傳統的電容式微機電感測器包含上下電極,其中一個為固定電極,且另外一個為可動電極。當可動電極受外力作用時,可動電極會發生一定程度的變形而接近固定電極。電容式微機電感測器的電容值會受到固定電極與可動電極之間距離大小的影響。經由兩電極之間的距離發生一定的變化量,從而使電容值改變,進而電極之間的電位差發生變化。藉由電路分別讀取電極變形前以及變形後的電位差,使用者可以推斷物理量的變化程度。The traditional capacitive microcomputer inductance sensor includes upper and lower electrodes, one of which is a fixed electrode, and the other is a movable electrode. When the movable electrode is subjected to an external force, the movable electrode will deform to a certain degree and approach the fixed electrode. The capacitance value of the capacitive microcomputer inductance sensor is affected by the distance between the fixed electrode and the movable electrode. A certain amount of change occurs through the distance between the two electrodes, so that the capacitance value changes, and then the potential difference between the electrodes changes. By reading the electric potential difference before and after the electrode is deformed, the user can infer the degree of change of the physical quantity.

由於微量偵測的需求日益增加,電容式微機電感測器需要擁有高靈敏度,以便能夠偵測出微小的物理量變化。一般而言,會讓微機電感測器的固定電極與可動電極之間的距離有很小的改變就能產生明顯的電位差變化,藉此提高微機電感測器的靈敏度。然而,若使用適用於微量偵測的電容式微機電感測器來偵測較大的物理量變化,電容式微機電感測器中的積體電路可能會因為電位差變化過大而燒毀。因此,現有適用於微量偵測的電容式微機電感測器無法兼用於偵測較大的物理量變化。Due to the increasing demand for trace detection, capacitive microcomputer inductance sensors need to have high sensitivity in order to be able to detect small changes in physical quantities. Generally speaking, a small change in the distance between the fixed electrode and the movable electrode of the microcomputer inductance sensor can produce a significant potential difference change, thereby improving the sensitivity of the microcomputer inductance sensor. However, if a capacitive microcomputer inductance sensor suitable for micro-detection is used to detect a large physical quantity change, the integrated circuit in the capacitive microcomputer inductance sensor may be burned due to the excessive change in the potential difference. Therefore, the existing capacitive microcomputer inductance sensor suitable for micro-detection cannot also be used for detecting large physical quantity changes.

鑒於以上的問題,本發明揭露一種可調整感應電容值的微機電感測裝置,其感應電容值可適當調整,而有助於解決現有微機電感測器無法兼顧偵測微小的物理量變化以及較大的物理量變化的問題。In view of the above problems, the present invention discloses a microcomputer inductance measuring device capable of adjusting the inductive capacitance value. The inductive capacitance value can be adjusted appropriately, which helps to solve the problem that the existing microcomputer inductance sensor cannot simultaneously detect small physical changes and relatively The problem of large changes in physical quantities.

本發明所揭露可調整感應電容值的微機電感測裝置,包含一特殊應用積體電路晶片以及一感測元件。特殊應用積體電路晶片包含一上表面、一讀取電路以及多個電性開關。感測元件用以偵測物理量並且包含一固定電極以及一可動電極。固定電極包含多個電極單元。可動電極可相對固定電極移動。該些電性開關分別電性耦接至各該些電極單元,用以控制該些電極單元的一工作狀態,進而可調整微機電感測器的一感應電容值。The invention discloses a microcomputer inductance measuring device capable of adjusting the value of inductive capacitance, including a special application integrated circuit chip and a sensing element. The special application integrated circuit chip includes an upper surface, a reading circuit and a plurality of electrical switches. The sensing element is used to detect physical quantities and includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode can move relative to the fixed electrode. The electrical switches are electrically coupled to the electrode units, respectively, for controlling a working state of the electrode units, so as to adjust an induction capacitance value of the microcomputer inductance sensor.

本發明另揭露可調整感應電容值的微機電感測裝置,包含一基板、一特殊應用積體電路晶片、用於偵測第一物理量的一第一感測元件以及用於偵測第二物理量的一第二感測元件。特殊應用積體電路晶片設置於基板,且特殊應用積體電路晶片包含一讀取電路、多個第一電性開關以及多個第二電性開關。第一感測元件設置於該基板,且第一感測元件包含一第一固定電極以及一第一可動電極。第一固定電極包含多個第一電極單元。第一可動電極可相對第一固定電極移動。各該些第一電性開關分別電性耦接至各該些第一電極單元,用以控制各該些第一電極單元的工作狀態,進而可調整第一固定電極與第一可動電極之間的感應電容值。第二感測元件設置於基板,且第二感測元件包含一第二固定電極以及一第二可動電極。第二固定電極包含多個第二電極單元。第二可動電極可相對第二固定電極移動。各該些第二電性開關分別電性耦接至各該些第二電極單元,用以控制各該些第二電極單元的工作狀態,進而可調整第二固定電極與第二可動電極之間的感應電容值。The present invention also discloses a microcomputer inductive sensing device capable of adjusting the value of the sensing capacitance, which includes a substrate, a special application integrated circuit chip, a first sensing element for detecting a first physical quantity, and a second physical quantity for detecting的一 second sensing element. The special application integrated circuit chip is arranged on the substrate, and the special application integrated circuit chip includes a reading circuit, a plurality of first electrical switches and a plurality of second electrical switches. The first sensing element is disposed on the substrate, and the first sensing element includes a first fixed electrode and a first movable electrode. The first fixed electrode includes a plurality of first electrode units. The first movable electrode is movable relative to the first fixed electrode. Each of the first electrical switches is electrically coupled to each of the first electrode units, so as to control the working state of each of the first electrode units, so as to adjust the distance between the first fixed electrode and the first movable electrode. The value of the sensing capacitance. The second sensing element is disposed on the substrate, and the second sensing element includes a second fixed electrode and a second movable electrode. The second fixed electrode includes a plurality of second electrode units. The second movable electrode is movable relative to the second fixed electrode. Each of the second electrical switches is electrically coupled to each of the second electrode units to control the working state of each of the second electrode units, so as to adjust the distance between the second fixed electrode and the second movable electrode The value of the sensing capacitance.

根據本發明所揭露的可調整感應電容值的微機電感測裝置,多個電性開關分別電性耦接於多個電極單元而能控制這些電極單元的工作狀態。透過獨立控制這些電極單元的工作狀態,能夠調整微機電感測器的感應電容值大小,進而準確量測出待偵測物理量的變化程度並防止特殊應用積體電路晶片失效。當要偵測微量的物理量變化時,可讓多數的電極單元處於開啟狀態(即電性開關導通而有供應電荷給電極單元)。當要偵測較大的物理量變化時,可讓少數的電極單元處於開啟狀態以降低微機電感測器的感應電容值,進而避免特殊應用積體電路晶中的讀取電路失效。According to the microcomputer inductance measuring device capable of adjusting the inductive capacitance value disclosed in the present invention, a plurality of electrical switches are respectively electrically coupled to a plurality of electrode units to control the working state of these electrode units. By independently controlling the working status of these electrode units, the inductive capacitance value of the microcomputer inductance sensor can be adjusted to accurately measure the degree of change of the physical quantity to be detected and prevent the failure of the integrated circuit chip for special applications. When detecting a slight change in physical quantity, most of the electrode units can be turned on (that is, the electrical switches are turned on to supply charge to the electrode units). When a large physical quantity change is to be detected, a small number of electrode units can be turned on to reduce the inductive capacitance value of the microcomputer inductance sensor, thereby avoiding failure of the reading circuit in the integrated circuit chip for special applications.

以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the content of the disclosure and the description of the following embodiments are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with the relevant art can easily understand the related purpose and advantages of the present invention. The following examples further illustrate the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

根據本發明的一實施例,微機電感測器包含一特殊應用積體電路晶片(Application Specific Integrated Circuit,ASIC)、一固定電極以及一可動電極。請參照圖1,為根據本發明第一實施例之可調整感應電容值的微機電感測裝置的立體示意圖。在本實施例中,可調整感應電容值的微機電感測裝置1包含一特殊應用積體電路晶片10以及一感測元件11。According to an embodiment of the present invention, the microcomputer inductance sensor includes an Application Specific Integrated Circuit (ASIC), a fixed electrode, and a movable electrode. Please refer to FIG. 1, which is a three-dimensional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to the first embodiment of the present invention. In this embodiment, the microcomputer inductance sensing device 1 capable of adjusting the value of inductive capacitance includes a special application integrated circuit chip 10 and a sensing element 11.

特殊應用積體電路晶片10是由特定使用者要求和特定電子系統的需要而設計並且製造。特殊應用積體電路晶片10包含一上表面110。The application-specific integrated circuit chip 10 is designed and manufactured by specific user requirements and specific electronic system requirements. The application-specific integrated circuit chip 10 includes an upper surface 110.

感測元件11包含一固定電極20以及一可動電極30。固定電極20設置於特殊應用積體電路晶片10的上表面110。固定電極20包含間隔設置的多個電極單元210。電極單元210例如為金屬導電墊,其設置於特殊應用積體電路晶片10的上表面110。圖1中繪示的電極單元210的數量並非用以限制本發明。The sensing element 11 includes a fixed electrode 20 and a movable electrode 30. The fixed electrode 20 is disposed on the upper surface 110 of the integrated circuit chip 10 for special applications. The fixed electrode 20 includes a plurality of electrode units 210 arranged at intervals. The electrode unit 210 is, for example, a metal conductive pad, which is disposed on the upper surface 110 of the integrated circuit chip 10 for special applications. The number of electrode units 210 shown in FIG. 1 is not used to limit the present invention.

可動電極30可相對固定電極20移動。詳細來說,可動電極30包含相連的一固定部310以及一可動部320。固定部310設置於特殊應用積體電路晶片10的上表面110,且可動部320對應於電極單元210。可動電極30之可動部320的一端連接於固定部310,且可動部320的相對另一端懸空設置。當外力施加於可動電極30而使可動部320變形時,可動部320懸空設置的一端可相對固定電極20移動接近或遠離電極單元210,而使可動部320懸空設置的一端與電極單元210之間的間距改變,進而可改變可調整感應電容值的微機電感測裝置1的感應電容值。The movable electrode 30 can move relative to the fixed electrode 20. In detail, the movable electrode 30 includes a fixed portion 310 and a movable portion 320 connected to each other. The fixed portion 310 is disposed on the upper surface 110 of the integrated circuit chip 10 for special applications, and the movable portion 320 corresponds to the electrode unit 210. One end of the movable portion 320 of the movable electrode 30 is connected to the fixed portion 310, and the opposite end of the movable portion 320 is suspended. When an external force is applied to the movable electrode 30 to deform the movable portion 320, the suspended end of the movable portion 320 can move closer to or away from the electrode unit 210 relative to the fixed electrode 20, and the suspended end of the movable portion 320 is between the electrode unit 210 When the distance between φ is changed, the sensing capacitance value of the microcomputer inductance measuring device 1 that can adjust the sensing capacitance value can be changed.

請一併參照圖2,為圖1之可調整感應電容值的微機電感測裝置中特殊應用積體電路晶片與電極單元的電性連接關係示意圖。在本實施例中,特殊應用積體電路晶片10還包含一讀取電路120以及多個電性開關130。電性開關130的數量對應電極單元210的數量。Please also refer to FIG. 2, which is a schematic diagram of the electrical connection relationship between the special application integrated circuit chip and the electrode unit in the microcomputer inductance measuring device with adjustable inductive capacitance value in FIG. 1. In this embodiment, the special application integrated circuit chip 10 further includes a reading circuit 120 and a plurality of electrical switches 130. The number of electrical switches 130 corresponds to the number of electrode units 210.

讀取電路120電性耦接於固定電極20的電極單元210,以便讀取固定電極20與可動電極30之間的電位差,進而確認電容式感測器1的電容值。The reading circuit 120 is electrically coupled to the electrode unit 210 of the fixed electrode 20 in order to read the potential difference between the fixed electrode 20 and the movable electrode 30 to confirm the capacitance value of the capacitive sensor 1.

這些電性開關130分別電性耦接於固定電極20的這些電極單元210,並且電性開關130用以控制對應的電極單元210的一工作狀態。在一實施例中,電性開關130為電容式感應開關。在另一實施例中,電性開關130為可恢復式熔斷開關。The electrical switches 130 are respectively electrically coupled to the electrode units 210 of the fixed electrode 20, and the electrical switches 130 are used to control a working state of the corresponding electrode unit 210. In one embodiment, the electrical switch 130 is a capacitive sensor switch. In another embodiment, the electrical switch 130 is a recoverable fuse switch.

電極單元210的工作狀態包含一開啟狀態(On state)及一關閉狀態(Off state)。當特殊應用積體電路晶片10的電性開關130導通而供應電荷至電極單元210時,此電極單元210的工作狀態可定義為開啟狀態。於開啟狀態之下,固定電極20與可動電極30之間存在電位差。相對地,當電性開關130不供應電荷至電極單元210時,此電極單元210的工作狀態可定義為關閉狀態。於關閉狀態之下,固定電極20與可動電極30之間沒有存在電位差。The working state of the electrode unit 210 includes an on state and an off state. When the electrical switch 130 of the integrated circuit chip 10 for a special application is turned on to supply charge to the electrode unit 210, the working state of the electrode unit 210 can be defined as an on state. In the open state, there is a potential difference between the fixed electrode 20 and the movable electrode 30. In contrast, when the electrical switch 130 does not supply charge to the electrode unit 210, the working state of the electrode unit 210 can be defined as the off state. In the closed state, there is no potential difference between the fixed electrode 20 and the movable electrode 30.

電性開關130控制電極單元210之工作狀態的具體方式並非用以限制本發明。舉例來說,使用者可以手動調整電性開關130是否要導通以供應電荷給電極單元210,或是特殊應用積體電路晶片10根據外部暫存器(未繪示)中的運作指令以自動化控制方式來決定是否要讓電性開關130導通以供應電荷給電極單元210。The specific manner in which the electrical switch 130 controls the working state of the electrode unit 210 is not intended to limit the present invention. For example, the user can manually adjust whether the electrical switch 130 is to be turned on to supply charge to the electrode unit 210, or the integrated circuit chip 10 for a special application can be automatically controlled according to the operation instructions in the external register (not shown) It is determined whether to turn on the electrical switch 130 to supply electric charge to the electrode unit 210.

以下說明使用可調整感應電容值的微機電感測裝置1偵測理量變化的方式。請參照圖3和圖4。圖3為圖1之可調整感應電容值的微機電感測裝置於偵測微小的物理量變化時電極單元的工作狀態示意圖。圖4為圖1之可調整感應電容值的微機電感測裝置於偵測較大的物理量變化時電極單元的工作狀態示意圖。於圖3和圖4中,被塗黑的電極單元210處於關閉狀態,未被塗黑的電極單元210處於開啟狀態。The following describes the method of detecting the change of the physical quantity using the microcomputer inductance measuring device 1 that can adjust the inductive capacitance value. Please refer to Figure 3 and Figure 4. FIG. 3 is a schematic diagram of the working state of the electrode unit when the microcomputer inductance measuring device with adjustable sensing capacitance value of FIG. 1 detects a small physical quantity change. 4 is a schematic diagram of the working state of the electrode unit when the microcomputer inductive sensing device with adjustable sensing capacitance value of FIG. 1 detects a large physical quantity change. In FIGS. 3 and 4, the electrode unit 210 that is painted in black is in a closed state, and the electrode unit 210 that is not painted in black is in an open state.

根據本發明的一實施例,各個電性開關130分別控制固定電極20的各個電極單元210。進一步來說,固定電極20的電極單元210於特殊應用積體電路晶片10的上表面110上排列而形成一電極陣列。依據電極陣列中每個電極單元210的工作狀態,這些電極單元210進一步包含了多個電極組合。圖3和圖4中繪示4列×4行的電極陣列,但電極陣列的列數與行數並非用以限制本發明。According to an embodiment of the present invention, each electrical switch 130 controls each electrode unit 210 of the fixed electrode 20 respectively. Furthermore, the electrode units 210 of the fixed electrodes 20 are arranged on the upper surface 110 of the integrated circuit chip 10 for special applications to form an electrode array. According to the working state of each electrode unit 210 in the electrode array, these electrode units 210 further include multiple electrode combinations. 3 and 4 show the electrode array with 4 columns×4 rows, but the number of columns and rows of the electrode array are not used to limit the present invention.

圖3繪示出電極單元210所組成的數個電極組合21、22、23以及24。在此實施例中,每一電極組合21、22、23、24包含多個沿Y軸方向設置的電極單元210。藉由特殊應用積體電路晶片10的控制,可使多個電性開關130各自形成電性通路,以供應電荷至電極組合21、22、23中的每一電極單元210,進而使電極組合21、22、23中的每一電極單元210的工作狀態處於開啟狀態。同時地,特殊應用積體電路晶片10可使多個電性開關130各自而形成電性斷路,而無法供應電荷至電極組合24中的每一電極單元210,進而使電極組合24中的每一電極單元210的工作狀態處於關閉狀態。FIG. 3 illustrates several electrode combinations 21, 22, 23 and 24 formed by the electrode unit 210. In this embodiment, each electrode combination 21, 22, 23, 24 includes a plurality of electrode units 210 arranged along the Y-axis direction. Through the control of the integrated circuit chip 10 in a special application, the plurality of electrical switches 130 can each form an electrical path to supply electric charge to each electrode unit 210 in the electrode assembly 21, 22, 23, thereby enabling the electrode assembly 21 The working state of each electrode unit 210 in, 22, and 23 is in an on state. At the same time, the special application integrated circuit chip 10 can make each of the plurality of electrical switches 130 form an electrical disconnection, and cannot supply electric charge to each electrode unit 210 in the electrode assembly 24, thereby making each electrode assembly 24 The working state of the electrode unit 210 is in a closed state.

圖4繪示出電極單元210所組成的數個電極組合25、26、27以及28。相同地,藉由特殊應用積體電路晶片10的控制,可使多個電性開關130導通而供應電荷至電極組合25中的每一電極單元210,進而使電極組合25中的每一電極單元210的工作狀態處於開啟狀態。同時地,特殊應用積體電路晶片10可使多個電性開關130不導通,而無法供應電荷至電極組合26、27、28中的每一電極單元210,進而使電極組合26、27、28中的每一電極單元210的工作狀態處於關閉狀態。FIG. 4 illustrates several electrode combinations 25, 26, 27 and 28 formed by the electrode unit 210. Similarly, through the control of the integrated circuit chip 10 in a special application, a plurality of electrical switches 130 can be turned on to supply electric charges to each electrode unit 210 in the electrode assembly 25, so that each electrode unit in the electrode assembly 25 The working state of 210 is on. At the same time, the special application integrated circuit chip 10 can make the multiple electrical switches 130 non-conducting, and cannot supply electric charge to each electrode unit 210 in the electrode combinations 26, 27, 28, thereby making the electrode combinations 26, 27, 28 The working state of each electrode unit 210 is in a closed state.

電極單元210所組成的電極組合的實施態樣並不以圖3和圖4中繪示的態樣為限。在另一實施例中,二相鄰的電極組合中的所有電極單元210是處於開啟狀態,另外二相鄰的電極組合中的所有電極單元210是處於關閉狀態。又在另一實施例中,可以是所有的電極單元210都處於開啟狀態。The implementation aspect of the electrode assembly formed by the electrode unit 210 is not limited to the aspect illustrated in FIGS. 3 and 4. In another embodiment, all electrode units 210 in two adjacent electrode combinations are in an open state, and all electrode units 210 in another two adjacent electrode combinations are in an off state. In yet another embodiment, all the electrode units 210 may be in an on state.

如上所述,特殊應用積體電路晶片10的部分電性開關130被分別控制而形成電性通路,以分別供應電荷至部分的電極單元210。另一部分電性開關130被分別控制而形成電性斷路,而無法供應電荷至另一部分的電極單元210。藉由控制電極單元210或是電極組合的工作狀態,可改變可調整感應電容值的微機電感測裝置1的感應電容值。如此,便能使可調整感應電容值的微機電感測裝置1可適用於偵測不同的物理量,而防止特殊應用積體電路晶片10讀取到過大的感應電容值而失效。As described above, part of the electrical switches 130 of the integrated circuit chip 10 for special applications are controlled separately to form electrical paths to supply electric charges to part of the electrode units 210 respectively. The other part of the electrical switches 130 are controlled separately to form an electrical disconnection, and cannot supply charge to the other part of the electrode unit 210. By controlling the working state of the electrode unit 210 or the electrode assembly, the sensing capacitance value of the microcomputer inductive sensing device 1 with adjustable sensing capacitance value can be changed. In this way, the microcomputer inductance measuring device 1 capable of adjusting the inductive capacitance value can be adapted to detect different physical quantities, and prevent the integrated circuit chip 10 for special applications from reading an excessively large inductive capacitance value and failing.

以下,以可調整感應電容值的微機電感測裝置1應用於偵測壓力為例子做較具體的說明,但並非用以限制可調整感應電容值的微機電感測裝置1所能偵測的物理量。可調整感應電容值的微機電感測裝置1也能夠偵測位移、加速度、振動、氣壓等物理量。In the following, the application of the microcomputer inductance measuring device 1 with adjustable inductive capacitance value to detect pressure is taken as an example for more specific description, but it is not used to limit what can be detected by the microcomputer inductance measuring device 1 with adjustable inductive capacitance value. Physical quantity. The microcomputer inductance measuring device 1 that can adjust the inductive capacitance value can also detect physical quantities such as displacement, acceleration, vibration, and air pressure.

先描述使用可調整感應電容值的微機電感測裝置1偵測微小的壓力變化(例如,100~1000帕斯卡的壓力差)的情況。當壓力施加於可調整感應電容值的微機電感測裝置1的可動電極30上時,可動部320變形而使可動部320與電極單元210之間的間距發生改變。由於施加於可動電極30上的壓力較小,因此可動部320與電極單元210之間的間距變化也會較少。此時,可調整感應電容值的微機電感測裝置1需要擁有較大的靈敏度,以使特殊應用積體電路晶片10的讀取電路120能夠成功取得較大的感應電容。如圖3所示,三組電性開關130分別控制相對應的三電極組合21、22、23中的電極單元210的工作狀態,使這些電極單元210處於開啟狀態。同時地,另一組電性開關130控制相對應的電極組合24中的電極單元210,使這些電極單元210處於關閉狀態。當量測微小的壓力變化時,由於多數電極單元210都處於開啟狀態,可調整感應電容值的微機電感測裝置1會產生較高的感應電容值。此時,可動部320與電極單元210之間的間距只需要很少的變化就能產生一定程度的明顯電位差變化。如此一來,圖3中大部分電極單元210都處於開啟狀態的可調整感應電容值的微機電感測裝置1適合用於偵測微量的壓力變化。First, the case of using the microcomputer inductance measuring device 1 with an adjustable inductive capacitance value to detect a small pressure change (for example, a pressure difference of 100~1000 Pa) is described. When pressure is applied to the movable electrode 30 of the microcomputer inductive sensing device 1 with an adjustable inductive capacitance value, the movable portion 320 is deformed and the distance between the movable portion 320 and the electrode unit 210 is changed. Since the pressure applied to the movable electrode 30 is small, the gap between the movable portion 320 and the electrode unit 210 will also change less. At this time, the microcomputer inductance measuring device 1 capable of adjusting the value of the inductive capacitance needs to have greater sensitivity, so that the reading circuit 120 of the integrated circuit chip 10 for special applications can successfully obtain a larger inductive capacitance. As shown in FIG. 3, the three sets of electrical switches 130 respectively control the working states of the electrode units 210 in the corresponding three-electrode combinations 21, 22, and 23, so that these electrode units 210 are in an open state. At the same time, another set of electrical switches 130 controls the electrode units 210 in the corresponding electrode assembly 24, so that these electrode units 210 are in a closed state. When measuring small pressure changes, since most of the electrode units 210 are in the on state, the microcomputer inductance measuring device 1 that can adjust the inductive capacitance value will produce a higher inductive capacitance value. At this time, the distance between the movable portion 320 and the electrode unit 210 requires only a small change to produce a certain degree of significant potential difference change. In this way, the microcomputer inductance sensing device 1 with adjustable sensing capacitance value in which most of the electrode units 210 in FIG. 3 are in the on state is suitable for detecting slight pressure changes.

然而,圖3的可調整感應電容值的微機電感測裝置1卻不適合偵測較大的壓力變化(例如,10 5帕斯卡以上的壓力差)。當較大的壓力施加於可動電極30上時,由於可調整感應電容值的微機電感測裝置1所產生的感應電容值過大,導致讀取電路120有失效的可能。此時,需透過改變電極單元210的工作狀態來調整感應電容值的微機電感測裝置1的感應電容值。 However, the microcomputer inductive sensing device 1 with adjustable sensing capacitance value in FIG. 3 is not suitable for detecting large pressure changes (for example, a pressure difference of more than 10 5 Pa). When a relatively large pressure is applied to the movable electrode 30, the sensing capacitance value generated by the microcomputer inductance measuring device 1 that can adjust the sensing capacitance value is too large, which may cause the reading circuit 120 to fail. At this time, it is necessary to adjust the inductive capacitance value of the microcomputer inductance measuring device 1 by changing the working state of the electrode unit 210.

如圖4所示,一組電性開關130控制相對應電極組合25中的多個電極單元210的工作狀態,使這些電極單元210處於開啟狀態。同時地,另外三組電性開關130控制相對應電極組合26、27、28中的電極單元210,使之保持在關閉狀態。由於只有少數電極單元210有被供應電荷而處於開啟狀態,可調整感應電容值的微機電感測裝置1會具有較低的感應電容值。此時,即便可動部320與電極單元210之間的間距變化較大,其所產生的電容變化(感應電容值)也不會過大,進而防止讀取電路120失效。如此一來,圖4中大部分電極單元210都處於關閉狀態的微機電感測器1適合用於偵測較大的壓力變化。As shown in FIG. 4, a group of electrical switches 130 control the working states of the electrode units 210 in the corresponding electrode assembly 25, so that the electrode units 210 are in an open state. Simultaneously, the other three sets of electrical switches 130 control the electrode units 210 in the corresponding electrode combinations 26, 27, 28 to keep them in the closed state. Since only a few electrode units 210 are supplied with electric charges and are in an on state, the microcomputer inductive sensing device 1 that can adjust the inductive capacitance value will have a lower inductive capacitance value. At this time, even if the distance between the movable portion 320 and the electrode unit 210 changes greatly, the capacitance change (inductive capacitance value) generated thereby will not be too large, thereby preventing the reading circuit 120 from failing. In this way, the microcomputer inductance sensor 1 in which most of the electrode units 210 in FIG. 4 are closed is suitable for detecting large pressure changes.

綜上所述,透過多個電性開關130分別控制多個電極單元210的工作狀態,能夠調整可調整感應電容值的微機電感測裝置1的感應電容值大小,進一步可讓使用者或是控制系統能夠根據待偵測物理量的變化程度來提高或降低可調整感應電容值的微機電感測裝置1的感應電容值。當要偵測微量的物理量變化時,讓多數的電極單元210處於開啟狀態以提高可調整感應電容值的微機電感測裝置1的感應電容值,而可以在物理量變化較微小的情況下就能成功讀取固定電極20與可動電極30之間的電容變化。當要偵測較大的物理量變化時,讓少數的電極單元210處於開啟狀態以降低可調整感應電容值的微機電感測裝置1的感應電容值,而可以避免因為物理量變化過大而導致讀取電路120毀損。In summary, by controlling the working states of the electrode units 210 through the plurality of electrical switches 130, the inductive capacitance value of the microcomputer inductance measuring device 1 with adjustable inductive capacitance value can be adjusted, which further allows the user to or The control system can increase or decrease the inductive capacitance value of the microcomputer inductive sensing device 1 that can adjust the inductive capacitance value according to the degree of change of the physical quantity to be detected. When detecting a slight change in physical quantity, leave most of the electrode units 210 in an on state to increase the inductive capacitance value of the microcomputer inductive sensing device 1 that can adjust the inductive capacitance value, and it can be used when the physical quantity changes slightly. The capacitance change between the fixed electrode 20 and the movable electrode 30 was successfully read. When a large physical quantity change is to be detected, a small number of electrode units 210 are turned on to reduce the sensing capacitance value of the microcomputer inductive sensing device 1 which can adjust the sensing capacitance value, so as to avoid reading due to excessive physical change The circuit 120 is damaged.

以下揭露本發明之微機電感測器的其他態樣。圖5為根據本發明第二實施例之可調整感應電容值的微機電感測裝置的立體示意圖。圖6為圖5之可調整感應電容值的微機電感測裝置的上視示意圖。在本實施例中,可調整感應電容值的微機電感測裝置1a包含一特殊應用積體電路晶片10以及一感測元件11a。特殊應用積體電路晶片10的進一步說明請參照第一實施例,以下不重複贅述。Other aspects of the microcomputer inductance sensor of the present invention are disclosed below. FIG. 5 is a three-dimensional schematic diagram of a microcomputer inductance measuring device capable of adjusting inductive capacitance according to a second embodiment of the present invention. 6 is a schematic top view of the microcomputer inductance measuring device capable of adjusting the inductive capacitance value of FIG. 5. In this embodiment, the microcomputer inductance sensing device 1a capable of adjusting the inductive capacitance value includes a special application integrated circuit chip 10 and a sensing element 11a. For further description of the integrated circuit chip 10 for special applications, please refer to the first embodiment, which will not be repeated below.

特殊應用積體電路晶片10包含上表面110、讀取電路以及多個電性開關。感測元件11a包含一固定電極20a以及一可動電極30a。固定電極20a包含間隔設置的多個第一電極單元210a以及間隔設置的多個第二電極單元220a。The application-specific integrated circuit chip 10 includes an upper surface 110, a reading circuit, and a plurality of electrical switches. The sensing element 11a includes a fixed electrode 20a and a movable electrode 30a. The fixed electrode 20a includes a plurality of first electrode units 210a arranged at intervals and a plurality of second electrode units 220a arranged at intervals.

第一電極單元210a與第二電極單元220a皆設置於特殊應用積體電路晶片10的上表面110。讀取電路電性耦接於第一電極單元210a以及第二電極單元220a,以便讀取固定電極20a與可動電極30a之間的電位差。這些電性開關當中的一部分分別電性耦接於這些第一電極單元210a,並且另一部分電性開關分別電性耦接於這些第二電極單元220a。電性開關用以控制對應的第一電極單元210a或是第二電極單元220a的工作狀態。第一電極單元210a與第二電極單元220a的數量並非用以限制本發明。Both the first electrode unit 210a and the second electrode unit 220a are disposed on the upper surface 110 of the integrated circuit chip 10 for special applications. The reading circuit is electrically coupled to the first electrode unit 210a and the second electrode unit 220a so as to read the potential difference between the fixed electrode 20a and the movable electrode 30a. Some of the electrical switches are electrically coupled to the first electrode units 210a, and the other part of the electrical switches are electrically coupled to the second electrode units 220a. The electrical switch is used to control the working state of the corresponding first electrode unit 210a or the second electrode unit 220a. The number of the first electrode unit 210a and the second electrode unit 220a is not used to limit the present invention.

可動電極30a包含相連的一固定部310a、一可動部320a以及一撓曲部330a。固定部310a設置於特殊應用積體電路晶片10的上表面110,並且可動部320a經由撓曲部330a連接於固定部310a。第一電極單元210a與第二電極單元220a分別位於可動部320a的相對二側。可動電極30a可沿著垂直上表面110之法線的方向相對固定電極20a移動。The movable electrode 30a includes a fixed portion 310a, a movable portion 320a, and a flexible portion 330a connected to each other. The fixed portion 310a is provided on the upper surface 110 of the integrated circuit chip 10 for special applications, and the movable portion 320a is connected to the fixed portion 310a via the flexure 330a. The first electrode unit 210a and the second electrode unit 220a are respectively located on two opposite sides of the movable portion 320a. The movable electrode 30a can move relative to the fixed electrode 20a along a direction perpendicular to the normal of the upper surface 110.

在本實施例中,固定電極20a與可動電極30a的配置構成了梳狀電極結構。如圖6所示,每個第一電極單元210a包含多個第一梳狀齒211a,並且每個第二電極單元220a包含多個第二梳狀齒221a。可動電極30a的可動部320a包含多個第三梳狀齒321a。當可動部320a相對固定電極20a移動時,能改變可調整感應電容值的微機電感測裝置1a的電容值。透過特殊應用積體電路晶片10控制各個第一電極單元210a以及第二電極單元220a的工作狀態,能夠根據待偵測物理量的變化程度來提高或降低可調整感應電容值的微機電感測裝置1a的感應電容值。In this embodiment, the arrangement of the fixed electrode 20a and the movable electrode 30a constitutes a comb-shaped electrode structure. As shown in FIG. 6, each first electrode unit 210a includes a plurality of first comb-shaped teeth 211a, and each second electrode unit 220a includes a plurality of second comb-shaped teeth 221a. The movable portion 320a of the movable electrode 30a includes a plurality of third comb-shaped teeth 321a. When the movable part 320a moves relative to the fixed electrode 20a, the capacitance value of the microcomputer inductance sensing device 1a that can adjust the inductive capacitance value can be changed. The working state of each first electrode unit 210a and second electrode unit 220a is controlled through the special application integrated circuit chip 10, and the microcomputer inductance measuring device 1a that can adjust the inductive capacitance value can be increased or decreased according to the change degree of the physical quantity to be detected The value of the sensing capacitance.

圖7為根據本發明第三實施例之可調整感應電容值的微機電感測裝置的立體剖切示意圖。在本實施例中,可調整感應電容值的微機電感測裝置1b包含一特殊應用積體電路晶片10以及一感測元件11b。特殊應用積體電路晶片10的進一步說明請參照第一實施例,以下不重複贅述。FIG. 7 is a three-dimensional cross-sectional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to a third embodiment of the present invention. In this embodiment, the microcomputer inductance sensing device 1b capable of adjusting the inductive capacitance value includes a special application integrated circuit chip 10 and a sensing element 11b. For further description of the integrated circuit chip 10 for special applications, please refer to the first embodiment, which will not be repeated below.

特殊應用積體電路晶片10包含上表面110、讀取電路以及多個電性開關。感測元件11b包含一固定電極20以及一可動電極30b,並且固定電極20包含間隔設置的多個電極單元210。The application-specific integrated circuit chip 10 includes an upper surface 110, a reading circuit, and a plurality of electrical switches. The sensing element 11b includes a fixed electrode 20 and a movable electrode 30b, and the fixed electrode 20 includes a plurality of electrode units 210 arranged at intervals.

電極單元210設置於特殊應用積體電路晶片10的上表面110。讀取電路電性耦接於電極單元210,以便讀取固定電極20與可動電極30b之間的電位差。這些電性開關分別電性耦接於這些電極單元210,用以控制對應的電極單元210的工作狀態。The electrode unit 210 is disposed on the upper surface 110 of the integrated circuit chip 10 for special applications. The reading circuit is electrically coupled to the electrode unit 210 for reading the potential difference between the fixed electrode 20 and the movable electrode 30b. The electrical switches are respectively electrically coupled to the electrode units 210 to control the working state of the corresponding electrode units 210.

可動電極30b的固定部310b圍繞固定電極20的電極單元210。可動電極30b的可動部320b懸置於電極單元210上方。可動電極30b與特殊應用積體電路晶片10接合以形成一氣密空間,並且電極單元210容置於此氣密空間內。藉此,有助於防止電極單元210因為暴露於空氣中而沾染到灰塵。The fixed portion 310 b of the movable electrode 30 b surrounds the electrode unit 210 of the fixed electrode 20. The movable portion 320b of the movable electrode 30b is suspended above the electrode unit 210. The movable electrode 30b is joined with the integrated circuit chip 10 for special applications to form an airtight space, and the electrode unit 210 is accommodated in the airtight space. This helps prevent the electrode unit 210 from being contaminated with dust due to exposure to the air.

在本實施例中,可調整感應電容值的微機電感測裝置1b適用於高度計。可調整感應電容值的微機電感測裝置1b用於量測高度的變化時,可利用電性開關使大部分的電極單元210之工作狀態處於開啟狀態。如此,當大氣壓力因高度變化而產生微小的氣壓變化時,可調整感應電容值的微機電感測裝置1b會產生較大的感應電容,使特殊應用積體電路晶片10能計準確算出高度的變化。In this embodiment, the microcomputer inductance measuring device 1b capable of adjusting the value of the inductive capacitance is suitable for an altimeter. When the microcomputer inductance measuring device 1b capable of adjusting the inductive capacitance value is used to measure the change of height, the working state of most of the electrode units 210 can be turned on by using an electrical switch. In this way, when the atmospheric pressure changes slightly due to the altitude change, the microcomputer inductance measuring device 1b that can adjust the inductive capacitance value will generate a larger inductive capacitance, so that the integrated circuit chip 10 for special applications can accurately calculate the altitude Variety.

在本實施例中,可調整感應電容值的微機電感測裝置1b也適用於氣壓計。可調整感應電容值的微機電感測裝置1b應用於量測高壓氣體時,可利用電性開關使大部分的電極單元210之工作狀態處於關閉狀態。如此,當氣壓計量測容器內的高壓氣體時,可調整感應電容值的微機電感測裝置1b不會產生過大的感應電容,而防止特殊應用積體電路晶片10失效。In this embodiment, the microcomputer inductance measuring device 1b that can adjust the inductive capacitance value is also suitable for barometers. When the microcomputer inductance measuring device 1b with adjustable inductive capacitance value is applied to measure high-pressure gas, the working state of most of the electrode units 210 can be turned off by using an electrical switch. In this way, when the high-pressure gas in the container is measured by gas pressure, the microcomputer inductance measuring device 1b that can adjust the inductive capacitance value will not generate an excessively large inductive capacitance, and prevent the integrated circuit chip 10 for special applications from failing.

請一併參照圖8和圖9。圖8為根據本發明第四實施例之可調整感應電容值的微機電感測裝置的立體剖切示意圖。圖9為圖8之可調整感應電容值的微機電感測裝置的剖切示意圖。在本實施例中,可調整感應電容值的微機電感測裝置1c包含一特殊應用積體電路晶片10以及一感測元件11c。特殊應用積體電路晶片10的進一步說明請參照第一實施例,以下不重複贅述。Please refer to Figure 8 and Figure 9 together. FIG. 8 is a three-dimensional cross-sectional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to a fourth embodiment of the present invention. 9 is a schematic cross-sectional view of the microcomputer inductance measuring device capable of adjusting the inductive capacitance value of FIG. 8. In this embodiment, the microcomputer inductance sensing device 1c capable of adjusting the inductive capacitance value includes a special application integrated circuit chip 10 and a sensing element 11c. For further description of the integrated circuit chip 10 for special applications, please refer to the first embodiment, which will not be repeated below.

特殊應用積體電路晶片10包含上表面110、讀取電路以及多個電性開關。感測元件11c包含一固定電極20c以及一可動電極30c。The application-specific integrated circuit chip 10 includes an upper surface 110, a reading circuit, and a plurality of electrical switches. The sensing element 11c includes a fixed electrode 20c and a movable electrode 30c.

固定電極20c包含間隔設置的一中央電極單元210c以及多個環形電極單元220c,且環形電極單元220c圍繞中央電極單元210c。詳細來說,這些環形電極單元220c以及中央電極單元210c為中心呈同心圓排列。中央電極單元210c以及環形電極單元220c設置於特殊應用積體電路晶片10的上表面110。讀取電路電性耦接於中央電極單元210c以及環形電極單元220c,以便讀取固定電極20c與可動電極30c之間的電位差。這些電性開關當中的其中之一電性耦接於中央電極單元210c,並且其餘電性開關分別電性耦接於這些環形電極單元220c。電性開關用以控制對應的中央電極單元210c或是環形電極單元220c的工作狀態。環形電極單元220c的數量並非用以限制本發明。The fixed electrode 20c includes a central electrode unit 210c and a plurality of ring electrode units 220c arranged at intervals, and the ring electrode unit 220c surrounds the central electrode unit 210c. In detail, the ring electrode units 220c and the central electrode unit 210c are arranged in concentric circles with the center. The central electrode unit 210c and the ring electrode unit 220c are disposed on the upper surface 110 of the integrated circuit chip 10 for special applications. The reading circuit is electrically coupled to the central electrode unit 210c and the ring electrode unit 220c to read the potential difference between the fixed electrode 20c and the movable electrode 30c. One of the electrical switches is electrically coupled to the central electrode unit 210c, and the remaining electrical switches are electrically coupled to the ring electrode units 220c, respectively. The electrical switch is used to control the working state of the corresponding central electrode unit 210c or the ring electrode unit 220c. The number of ring electrode units 220c is not used to limit the present invention.

可動電極30c的固定部310c圍繞固定電極20c的中央電極單元210c以及環形電極單元220c,並且可動電極30c的可動部320c懸置於中央電極單元210c以及環形電極單元220c的上方。The fixed portion 310c of the movable electrode 30c surrounds the central electrode unit 210c and the ring electrode unit 220c of the fixed electrode 20c, and the movable portion 320c of the movable electrode 30c is suspended above the central electrode unit 210c and the ring electrode unit 220c.

請一併參照圖10和圖11。圖10為根據本發明第五實施例之可調整感應電容值的微機電感測裝置的立體示意圖。圖11為圖10之可調整感應電容值的微機電感測裝置中特殊應用積體電路晶片與電極單元的電性連接關係示意圖。Please refer to Figure 10 and Figure 11 together. 10 is a three-dimensional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to a fifth embodiment of the present invention. FIG. 11 is a schematic diagram of the electrical connection relationship between a special application integrated circuit chip and an electrode unit in the microcomputer inductance measuring device with adjustable inductive capacitance value of FIG. 10.

在本實施例中,可調整感應電容值的微機電感測裝置1d包含一基板2d、一特殊應用積體電路晶片10d、一第一感測元件11d以及一第二感測元件11e。In this embodiment, the microcomputer inductance sensing device 1d capable of adjusting the inductive capacitance value includes a substrate 2d, a special application integrated circuit chip 10d, a first sensing element 11d, and a second sensing element 11e.

基板2d例如為矽基板,其具有一上表面21。特殊應用積體電路晶片10d、第一感測元件11d以及第二感測元件11e皆設置於基板2d的上表面21。The substrate 2d is, for example, a silicon substrate, which has an upper surface 21. The special application integrated circuit chip 10d, the first sensing element 11d, and the second sensing element 11e are all disposed on the upper surface 21 of the substrate 2d.

第一感測元件11d包含一第一固定電極20d以及一第一可動電極30d。第一固定電極20d包含間隔設置的多個第一電極單元210d。第一可動電極30d包含一第一固定部310d以及一第一可動部320d。第一固定部310d設置於基板2d並且圍繞這些第一電極單元210d,且第一可動部320d懸置於第一電極單元210d上方。第一可動電極30d與特殊應用積體電路晶片10d接合以形成一氣密空間,並且第一電極單元210d容置於此氣密空間內。當外力施加於第一可動電極30d而使第一可動部320d變形時,第一可動部320d可相對第一固定電極20d移動,而使第一可動部320d與第一電極單元210d之間的間距改變,進而改變第一固定電極20d與第一可動電極30d之間的感應電容值。The first sensing element 11d includes a first fixed electrode 20d and a first movable electrode 30d. The first fixed electrode 20d includes a plurality of first electrode units 210d arranged at intervals. The first movable electrode 30d includes a first fixed portion 310d and a first movable portion 320d. The first fixed portion 310d is disposed on the substrate 2d and surrounds the first electrode unit 210d, and the first movable portion 320d is suspended above the first electrode unit 210d. The first movable electrode 30d is joined with the special application integrated circuit chip 10d to form an airtight space, and the first electrode unit 210d is accommodated in the airtight space. When an external force is applied to the first movable electrode 30d to deform the first movable portion 320d, the first movable portion 320d can move relative to the first fixed electrode 20d, so that the distance between the first movable portion 320d and the first electrode unit 210d Change, thereby changing the value of the sensing capacitance between the first fixed electrode 20d and the first movable electrode 30d.

第二感測元件11e包含一第二固定電極20e以及一第二可動電極30e。第二固定電極20e包含間隔設置的多個第二電極單元210e。第二可動電極30e包含多個第二固定部310e以及一第二可動部320e。這些第二固定部310e設置於基板2d,並且第二可動部320e介於多個第二固定部310e之間。第二可動部320e包含一可動質量塊321e以及多個彈性件322e。可動質量塊321e經由多個彈性件322e而連接於多個第二固定部310e,且可動質量塊321e懸置於第二電極單元210e上方。可動質量塊321e可相對第二固定電極20e移動而進而改變第二固定電極20e與第二可動電極30e之間的感應電容值。The second sensing element 11e includes a second fixed electrode 20e and a second movable electrode 30e. The second fixed electrode 20e includes a plurality of second electrode units 210e arranged at intervals. The second movable electrode 30e includes a plurality of second fixed portions 310e and a second movable portion 320e. The second fixed portions 310e are provided on the substrate 2d, and the second movable portion 320e is interposed between the plurality of second fixed portions 310e. The second movable portion 320e includes a movable mass 321e and a plurality of elastic members 322e. The movable mass 321e is connected to the plurality of second fixing portions 310e via the plurality of elastic members 322e, and the movable mass 321e is suspended above the second electrode unit 210e. The movable mass 321e can move relative to the second fixed electrode 20e to thereby change the inductive capacitance value between the second fixed electrode 20e and the second movable electrode 30e.

特殊應用積體電路晶片10d包含一讀取電路120d、多個第一電性開關130d以及多個第二電性開關130e。第一電性開關130d的數量對應第一電極單元210d的數量,並且第二電性開關130e的數量對應第二電極單元210e的數量。讀取電路120d電性耦接於第一電極單元210d以及第二電極單元210e,以便讀取第一固定電極20d與第一可動電極30d之間的電位差,進而確認第一感測元件11d的電容值。此外,讀取電路120d也電性耦接於第二電極單元210e,以便讀取第二固定電極20e與第二可動電極30e之間的電位差,進而確認第二感測元件11e的電容值。The special application integrated circuit chip 10d includes a reading circuit 120d, a plurality of first electrical switches 130d, and a plurality of second electrical switches 130e. The number of first electrical switches 130d corresponds to the number of first electrode units 210d, and the number of second electrical switches 130e corresponds to the number of second electrode units 210e. The reading circuit 120d is electrically coupled to the first electrode unit 210d and the second electrode unit 210e, so as to read the potential difference between the first fixed electrode 20d and the first movable electrode 30d, thereby confirming the capacitance of the first sensing element 11d value. In addition, the reading circuit 120d is also electrically coupled to the second electrode unit 210e, so as to read the potential difference between the second fixed electrode 20e and the second movable electrode 30e to confirm the capacitance value of the second sensing element 11e.

這些第一電性開關130d分別電性耦接於這些第一電極單元210d,並且第一電性開關130d用以控制對應的第一電極單元210d的工作狀態。另外,這些第二電性開關130e分別電性耦接於這些第二電極單元210e,並且第二電性開關130e用以控制對應的第二電極單元210e的工作狀態。The first electrical switches 130d are respectively electrically coupled to the first electrode units 210d, and the first electrical switches 130d are used to control the working state of the corresponding first electrode units 210d. In addition, the second electrical switches 130e are respectively electrically coupled to the second electrode units 210e, and the second electrical switches 130e are used to control the working state of the corresponding second electrode units 210e.

第一電極單元210d和第二電極單元210e的工作狀態包含開啟狀態及關閉狀態。當特殊應用積體電路晶片10d的第一電性開關130d導通而供應電荷至第一電極單元210d時,此第一電極單元210d的工作狀態可定義為開啟狀態。同樣地,當特殊應用積體電路晶片10d的第二電性開關130e導通而供應電荷至第二電極單元210e時,此第二電極單元210e的工作狀態可定義為開啟狀態。於開啟狀態之下,第一固定電極20d與第一可動電極30d之間或是第二固定電極20e與第二可動電極30e之間存在電位差。The working states of the first electrode unit 210d and the second electrode unit 210e include an open state and a closed state. When the first electrical switch 130d of the integrated circuit chip 10d for the special application is turned on to supply electric charge to the first electrode unit 210d, the working state of the first electrode unit 210d can be defined as an on state. Similarly, when the second electrical switch 130e of the integrated circuit chip 10d for the special application is turned on to supply electric charge to the second electrode unit 210e, the working state of the second electrode unit 210e can be defined as an on state. In the open state, there is a potential difference between the first fixed electrode 20d and the first movable electrode 30d or between the second fixed electrode 20e and the second movable electrode 30e.

相對地,當第一電性開關130d不供應電荷至第一電極單元210d時,此第一電極單元210d的工作狀態定義為關閉狀態。當特殊應用積體電路晶片10d的第二電性開關130e不供應電荷至第二電極單元210e時,此第二電極單元210e的工作狀態可定義為關閉狀態。於關閉狀態之下,第一固定電極20d與第一可動電極30d之間或是第二固定電極20e與第二可動電極30e之間沒有存在電位差。In contrast, when the first electrical switch 130d does not supply electric charge to the first electrode unit 210d, the working state of the first electrode unit 210d is defined as the off state. When the second electrical switch 130e of the integrated circuit chip 10d for the special application does not supply charge to the second electrode unit 210e, the working state of the second electrode unit 210e can be defined as the off state. In the closed state, there is no potential difference between the first fixed electrode 20d and the first movable electrode 30d or between the second fixed electrode 20e and the second movable electrode 30e.

在本實施例中,第一感測元件11d用以偵測第一物理量,且第二感測元件11e用以偵測與第一物理量相異的第二物理量。進一步來說,第一感測元件11d為氣壓計,且第二感測元件11e為加速度計。In this embodiment, the first sensing element 11d is used to detect a first physical quantity, and the second sensing element 11e is used to detect a second physical quantity different from the first physical quantity. Furthermore, the first sensing element 11d is a barometer, and the second sensing element 11e is an accelerometer.

如圖10所示,透過第一電性開關130d分別控制第一電極單元210d,使得部分第一電極單元210d的工作狀態處於開啟狀態,且另一部分第一電極單元210d的工作狀態處於關閉狀態。當微機電感測器1d周圍的氣壓增加時,第一可動部320d變形而使第一可動部320d與第一電極單元210d之間的間距發生改變。第一可動部320d與第一電極單元210d之間的間距變化使得第一固定電極20d與第一可動電極30d之間產生電位差變化。As shown in FIG. 10, the first electrode unit 210d is controlled by the first electrical switch 130d, so that the working state of part of the first electrode unit 210d is in the on state, and the working state of the other part of the first electrode unit 210d is in the off state. When the air pressure around the microcomputer inductance sensor 1d increases, the first movable portion 320d is deformed to change the distance between the first movable portion 320d and the first electrode unit 210d. The change in the distance between the first movable portion 320d and the first electrode unit 210d causes a change in the potential difference between the first fixed electrode 20d and the first movable electrode 30d.

此外,透過第二電性開關130e分別控制第二電極單元210e,使得部分第二電極單元210e的工作狀態處於開啟狀態,且另一部分第二電極單元210e的工作狀態處於關閉狀態。當搭載可調整感應電容值的微機電感測裝置1d的載具(例如汽車)的加速度發生變化時,第二可動部320e移動接近其中一個第二固定部310e,使得第二固定電極20e與第二可動電極30e之間產生電位差變化。In addition, the second electrode units 210e are respectively controlled through the second electrical switches 130e, so that the working states of part of the second electrode units 210e are in the on state, and the working states of the other part of the second electrode units 210e are in the off state. When the acceleration of the vehicle (for example, a car) equipped with the microcomputer inductive sensing device 1d with adjustable inductive capacitance value changes, the second movable part 320e moves closer to one of the second fixed parts 310e, so that the second fixed electrode 20e and the first The potential difference changes between the two movable electrodes 30e.

在本實施例中,每一第一電極單元210d的面積A1等於每一第二電極單元210e的面積A2。當第一感測元件11d與第二感測元件11e同時進行偵測時,處於開啟狀態的第一電極單元210d的數量為N1,處於開啟狀態的第二電極單元210e的數量為N2,且滿足下列條件:N1>N2。如此一來,當第一感測元件11d偵測微小的氣壓變化且第二感測元件11e偵測加速度變化,第二感測元件11e不會產生過大的感應電容,而有助於防止特殊應用積體電路晶片10d失效。在另一實施例中,當第一感測元件11d偵測較大的的第一物理量變化且第二感測元件11e偵測較小的第二物理量變化時,可使每一第一電極單元210d的面積等於每一第二電極單元210e的面積,且讓處於開啟狀態的第一電極單元210d的數量(N1)小於處於開啟狀態的第二電極單元210e的數量(N2)。In this embodiment, the area A1 of each first electrode unit 210d is equal to the area A2 of each second electrode unit 210e. When the first sensing element 11d and the second sensing element 11e perform detection at the same time, the number of the first electrode units 210d in the open state is N1, and the number of the second electrode units 210e in the open state is N2, and satisfies The following conditions: N1>N2. In this way, when the first sensing element 11d detects a slight air pressure change and the second sensing element 11e detects an acceleration change, the second sensing element 11e does not generate an excessively large sensing capacitance, which helps prevent special applications The integrated circuit chip 10d fails. In another embodiment, when the first sensing element 11d detects a larger first physical quantity change and the second sensing element 11e detects a smaller second physical quantity change, each first electrode unit The area of 210d is equal to the area of each second electrode unit 210e, and the number (N1) of the first electrode unit 210d in the open state is smaller than the number (N2) of the second electrode unit 210e in the open state.

在另一實施例中,當第一感測元件11d與第二感測元件11e同時進行偵測時,處於開啟狀態的多個第一電極單元210d的面積總和為TA1,處於開啟狀態的多個第二電極單元210e的面積總和為TA2,且滿足下列條件:TA1>TA2。如此一來,當第一感測元件11d偵測微小的氣壓變化且第二感測元件11e偵測加速度變化,第二感測元件11e不會產生過大的感應電容,而有助於防止特殊應用積體電路晶片10d失效。In another embodiment, when the first sensing element 11d and the second sensing element 11e are simultaneously detecting, the total area of the plurality of first electrode units 210d in the open state is TA1, and the plurality of open state The total area of the second electrode unit 210e is TA2, and the following condition is satisfied: TA1>TA2. In this way, when the first sensing element 11d detects a slight air pressure change and the second sensing element 11e detects an acceleration change, the second sensing element 11e does not generate an excessively large sensing capacitance, which helps prevent special applications The integrated circuit chip 10d fails.

在另一實施例中,當第一感測元件11d偵測較大的的第一物理量變化且第二感測元件11e偵測較小的第二物理量變化時,可使處於開啟狀態的多個第一電極單元210d的面積總和(TA1)小於處於開啟狀態的多個第二電極單元210e的面積總和(TA2)。In another embodiment, when the first sensing element 11d detects a larger change in the first physical quantity and the second sensing element 11e detects a smaller change in the second physical quantity, a plurality of The total area (TA1) of the first electrode unit 210d is smaller than the total area (TA2) of the plurality of second electrode units 210e in the open state.

綜上所述,本發明所揭露的可調整感應電容值的微機電感測裝置中,多個電性開關分別電性耦接於多個電極單元而能控制這些電極單元的工作狀態。透過獨立控制這些電極單元的工作狀態,能夠調整微機電感測器的感應電容值大小,進而準確量測出待偵測物理量的變化程度並防止特殊應用積體電路晶片失效。當要偵測微量的物理量變化時,可讓多數的電極單元處於開啟狀態(即電性開關導通而有供應電荷給電極單元)。當要偵測較大的物理量變化時,可讓少數的電極單元處於開啟狀態以降低微機電感測器的感應電容值,進而避免特殊應用積體電路晶中的讀取電路失效。In summary, in the microcomputer inductance measuring device capable of adjusting the inductive capacitance value disclosed in the present invention, a plurality of electrical switches are electrically coupled to a plurality of electrode units to control the working state of these electrode units. By independently controlling the working status of these electrode units, the inductive capacitance value of the microcomputer inductance sensor can be adjusted to accurately measure the degree of change of the physical quantity to be detected and prevent the failure of the integrated circuit chip for special applications. When detecting a slight change in physical quantity, most of the electrode units can be turned on (that is, the electrical switches are turned on to supply charge to the electrode units). When a large physical quantity change is to be detected, a small number of electrode units can be turned on to reduce the inductive capacitance value of the microcomputer inductance sensor, thereby avoiding failure of the reading circuit in the integrated circuit chip for special applications.

雖然本發明以前述之實施例揭露如上,然而這些實施例並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention is disclosed in the foregoing embodiments, these embodiments are not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent scope.

1、1a、1b、1c、1d:可調整感應電容值的微機電感測裝置1. 1a, 1b, 1c, 1d: microcomputer inductance measuring device that can adjust the value of inductive capacitance

2d:基板2d: substrate

21:上表面21: upper surface

10、10d:特殊應用積體電路晶片10.10d: Special application integrated circuit chip

110:上表面110: upper surface

120、120d:讀取電路120, 120d: reading circuit

130:電性開關130: electrical switch

130d:第一電性開關130d: The first electrical switch

130e:第二電性開關130e: The second electrical switch

11、11a、11b、11c:感測元件11, 11a, 11b, 11c: sensing element

11d:第一感測元件11d: the first sensing element

11e:第二感測元件11e: second sensing element

20、20a、20c:固定電極20, 20a, 20c: fixed electrode

20d:第一固定電極20d: first fixed electrode

20e:第二固定電極20e: second fixed electrode

210:電極單元210: Electrode unit

210a、210d:第一電極單元210a, 210d: the first electrode unit

211a:第一梳狀齒211a: first comb tooth

220a、210e:第二電極單元220a, 210e: second electrode unit

221a:第二梳狀齒221a: second comb tooth

210c:中央電極單元210c: Central electrode unit

220c:環形電極單元220c: Ring electrode unit

21、22、23、24、25、26、27、28:電極組合21, 22, 23, 24, 25, 26, 27, 28: electrode combination

30、30a、30b、30c:可動電極30, 30a, 30b, 30c: movable electrode

30d:第一可動電極30d: first movable electrode

30e:第二可動電極30e: second movable electrode

310、310a、310b、310c:固定部310, 310a, 310b, 310c: fixed part

310d:第一固定部310d: The first fixed part

310e:第二固定部310e: second fixed part

320、320a、320b、320c:可動部320, 320a, 320b, 320c: movable part

320d:第一可動部320d: the first movable part

320e:第二可動部320e: second movable part

321a:第三梳狀齒321a: third comb tooth

321e:電極件321e: Electrode parts

322e:彈性件322e: elastic part

330a:撓曲部330a: Flexure

圖1為根據本發明第一實施例之可調整感應電容值的微機電感測裝置的立體示意圖。 圖2為圖1之可調整感應電容值的微機電感測裝置中特殊應用積體電路晶片與電極單元的電性連接關係示意圖。 圖3為圖1之可調整感應電容值的微機電感測裝置於偵測微小的物理量變化時電極單元的工作狀態示意圖。 圖4為圖1之可調整感應電容值的微機電感測裝置於偵測較大的物理量變化時電極單元的工作狀態示意圖。 圖5為根據本發明第二實施例之可調整感應電容值的微機電感測裝置的立體示意圖。 圖6為圖5之可調整感應電容值的微機電感測裝置的上視示意圖。 圖7為根據本發明第三實施例之可調整感應電容值的微機電感測裝置的立體剖切示意圖。 圖8為根據本發明第四實施例之可調整感應電容值的微機電感測裝置的立體剖切示意圖。 圖9為圖8之可調整感應電容值的微機電感測裝置的剖切示意圖。 圖10為根據本發明第五實施例之可調整感應電容值的微機電感測裝置的立體示意圖。 圖11為圖10之可調整感應電容值的微機電感測裝置中特殊應用積體電路晶片與電極單元的電性連接關係示意圖。 FIG. 1 is a three-dimensional schematic diagram of a microcomputer inductance measuring device capable of adjusting inductive capacitance according to a first embodiment of the present invention. 2 is a schematic diagram of the electrical connection relationship between a special application integrated circuit chip and an electrode unit in the microcomputer inductance measuring device with adjustable inductive capacitance value of FIG. 1. FIG. 3 is a schematic diagram of the working state of the electrode unit when the microcomputer inductance measuring device with adjustable sensing capacitance value of FIG. 1 detects a small physical quantity change. 4 is a schematic diagram of the working state of the electrode unit when the microcomputer inductive sensing device with adjustable sensing capacitance value of FIG. 1 detects a large physical quantity change. FIG. 5 is a three-dimensional schematic diagram of a microcomputer inductance measuring device capable of adjusting inductive capacitance according to a second embodiment of the present invention. 6 is a schematic top view of the microcomputer inductance measuring device capable of adjusting the inductive capacitance value of FIG. 5. FIG. 7 is a three-dimensional cross-sectional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to a third embodiment of the present invention. FIG. 8 is a three-dimensional cross-sectional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to a fourth embodiment of the present invention. 9 is a schematic cross-sectional view of the microcomputer inductance measuring device capable of adjusting the inductive capacitance value of FIG. 8. 10 is a three-dimensional schematic diagram of a microcomputer inductance measuring device capable of adjusting the inductive capacitance value according to a fifth embodiment of the present invention. FIG. 11 is a schematic diagram of the electrical connection relationship between a special application integrated circuit chip and an electrode unit in the microcomputer inductance measuring device with adjustable inductive capacitance value of FIG. 10.

1:可調整感應電容值的微機電感測裝置 1: Microcomputer inductance measuring device with adjustable inductive capacitance value

10:特殊應用積體電路晶片 10: Special application integrated circuit chip

110:上表面 110: upper surface

11:感測元件 11: sensing element

20:固定電極 20: fixed electrode

210:電極單元 210: Electrode unit

30:可動電極 30: movable electrode

310:固定部 310: fixed part

320:可動部 320: movable part

Claims (20)

一種可調整感應電容值的微機電感測裝置,包含:一特殊應用積體電路晶片,包含:一上表面;一讀取電路;以及多個電性開關;以及一感測元件,用以偵測一物理量,該感測元件包含:一固定電極,包含多個電極單元;以及一可動電極,可相對該固定電極移動;其中,各該多個電性開關分別電性耦接至各該多個電極單元,透過控制各該多個電極單元處於一工作狀態的數量,進而可改變該感測元件的一感應電容值。 A microcomputer inductance measurement device capable of adjusting the value of inductive capacitance includes: a special application integrated circuit chip, including: an upper surface; a reading circuit; and a plurality of electrical switches; and a sensing element for detecting To measure a physical quantity, the sensing element includes: a fixed electrode including a plurality of electrode units; and a movable electrode that can move relative to the fixed electrode; wherein each of the plurality of electrical switches is electrically coupled to each of the plurality of electrical switches. Each electrode unit can change a sensing capacitance value of the sensing element by controlling the number of each electrode unit in a working state. 如申請專利範圍第1項所述之可調整感應電容值的微機電感測裝置,其中該工作狀態包含一開啟狀態及一關閉狀態,當該特殊應用積體電路晶片經由各該多個電性開關供應電荷至各該多個電極單元時,各該多個電極單元的工作狀態可定義為該開啟狀態,當該特殊應用積體電路晶片藉由各該多個電性開關不供應電荷至各該多個電極單元時,各該多個電極單元的工作狀態可定義為該關閉狀態。 As described in the first item of the scope of patent application, the microcomputer inductance measuring device with adjustable inductive capacitance value, wherein the working state includes an open state and a closed state, when the special application integrated circuit chip passes through each of the plurality of electrical When the switch supplies charge to each of the plurality of electrode units, the working state of each of the plurality of electrode units can be defined as the open state. When the special application integrated circuit chip does not supply charge to each of the plurality of electrical switches In the case of the plurality of electrode units, the working state of each of the plurality of electrode units can be defined as the closed state. 如申請專利範圍第2項所述之可調整感應電容值的微機電感測裝置,其中一部份該多個電極單元可形成一電極組合,一部份該多個電性開關可使得該電極組合中的該多個電極單元具有相同的該工作狀態。 As described in the second item of the scope of patent application, the microcomputer inductance measuring device that can adjust the inductive capacitance value, in which a part of the plurality of electrode units can form an electrode combination, and a part of the plurality of electrical switches can make the electrode The multiple electrode units in the combination have the same working state. 如申請專利範圍第2項所述之可調整感應電容值的微機電感測裝置,其中該多個電性開關為電容式感應開關。 As described in item 2 of the scope of patent application, the microcomputer inductance measurement device capable of adjusting the value of the inductive capacitance, wherein the plurality of electrical switches are capacitive inductive switches. 如申請專利範圍第2項所述之可調整感應電容值的微機電感測裝置,其中該多個電性開關為可恢復式熔斷開關。 As described in item 2 of the scope of patent application, the microcomputer inductance measuring device capable of adjusting the value of the inductive capacitance, wherein the plurality of electrical switches are resettable fuse switches. 如申請專利範圍第1項所述之可調整感應電容值的微機電感測裝置,其中該多個電極單元設置於該特殊應用積體電路晶片的該上表面。 As described in the first item of the scope of patent application, the microcomputer inductance measuring device capable of adjusting the inductive capacitance value, wherein the plurality of electrode units are arranged on the upper surface of the integrated circuit chip for the special application. 如申請專利範圍第1項所述之可調整感應電容值的微機電感測裝置,另包含一基板,其中該多個電極單元及該特殊應用積體電路晶片皆設置於該基板上。 As described in the first item of the patent application, the microcomputer inductance measuring device capable of adjusting the inductive capacitance value further includes a substrate, wherein the plurality of electrode units and the special application integrated circuit chip are all disposed on the substrate. 如申請專利範圍第6項所述之可調整感應電容值的微機電感測裝置,其中該可動電極包含一固定部以及一可動部,該固定部設置於該特殊應用積體電路晶片的該上表面,且該可動部對應於該多個電極單元。 As described in item 6 of the scope of patent application, the microcomputer inductance measuring device with adjustable inductive capacitance value, wherein the movable electrode includes a fixed part and a movable part, and the fixed part is arranged on the integrated circuit chip for the special application Surface, and the movable part corresponds to the plurality of electrode units. 如申請專利範圍第8項所述之可調整感應電容值的微機電感測裝置,其中該可動電極之該可動部的一端連接該固定部,該可動部的相對另一端懸空設置。 As described in item 8 of the scope of patent application, the microcomputer inductance measuring device capable of adjusting the inductive capacitance value, wherein one end of the movable part of the movable electrode is connected to the fixed part, and the opposite end of the movable part is suspended. 如申請專利範圍第8項所述之可調整感應電容值的微機電感測裝置,其中該可動電極的該固定部圍繞該多個電極單元。 As described in item 8 of the scope of patent application, the microcomputer inductive sensing device capable of adjusting the inductive capacitance value, wherein the fixed portion of the movable electrode surrounds the plurality of electrode units. 如申請專利範圍第8項所述之可調整感應電容值的微機電感測裝置,其中該固定電極的該多個電極單元包含一中央電極單元以及至少一環形電極單元,且該至少一環形電極單元圍繞該中央電極單元。 The microcomputer inductive sensing device capable of adjusting the inductive capacitance value as described in item 8 of the scope of patent application, wherein the plurality of electrode units of the fixed electrode include a central electrode unit and at least one ring electrode unit, and the at least one ring electrode The cell surrounds the central electrode cell. 如申請專利範圍第8項所述之可調整感應電容值的微機電感測裝置,其中且該可動電極可沿著垂直該上表面之法線的方向相對該固定電極移動。 As described in item 8 of the scope of patent application, the microcomputer inductive sensing device capable of adjusting the inductive capacitance value, wherein the movable electrode can move relative to the fixed electrode along a direction perpendicular to the normal line of the upper surface. 如申請專利範圍第12項所述之可調整感應電容值的微機電感測裝置,其中該固定電極的該多個電極單元包含至少一第一電極單元以及至少一第二電極單元,該可動電極包含一固定部、一撓曲部以及一可動部,該可動部經由該撓曲部連接於該固定部,且該至少一第一電極單元與該至少一第二電極單元分別位於該可動部的相對二側。 As described in item 12 of the scope of patent application, the microcomputer inductive sensing device capable of adjusting the inductive capacitance value, wherein the plurality of electrode units of the fixed electrode include at least one first electrode unit and at least one second electrode unit, and the movable electrode It includes a fixed portion, a flexible portion, and a movable portion. The movable portion is connected to the fixed portion via the flexible portion, and the at least one first electrode unit and the at least one second electrode unit are respectively located on the movable portion Opposite two sides. 一種可調整感應電容值的微機電感測裝置,包含:一基板;一特殊應用積體電路晶片,設置於該基板,且該特殊應用積體電路晶片包含一讀取電路、多個第一電性開關以及多個第二電性開關;一第一感測元件,設置於該基板,該第一感測元件用以偵測一第一物理量,包含:一第一固定電極,包含多個第一電極單元;以及一第一可動電極,可相對該第一固定電極移動,各該多個第一電性開關分別電性耦接至各該多個第一電極單元,用以控制各該多個第一電極單元的工作狀態,進而可改變該第一感測元件的感應電容值;以及一第二感測元件,設置於該基板,該第二感測元件用以偵測一第二物理量,包含:一第二固定電極,包含多個第二電極單元;以及 一第二可動電極,可相對該第二固定電極移動,各該多個第二電性開關分別電性耦接至各該多個第二電極單元,用以控制各該多個第二電極單元的工作狀態,進而可改變該第二感測元件的感應電容值。 A microcomputer inductance measurement device capable of adjusting inductive capacitance value includes: a substrate; a special application integrated circuit chip arranged on the substrate, and the special application integrated circuit chip includes a reading circuit and a plurality of first circuits And a plurality of second electrical switches; a first sensing element disposed on the substrate, the first sensing element is used to detect a first physical quantity, including: a first fixed electrode, including a plurality of first An electrode unit; and a first movable electrode movable relative to the first fixed electrode, each of the plurality of first electrical switches is electrically coupled to each of the plurality of first electrode units, for controlling each of the plurality The working state of the first electrode unit can further change the sensing capacitance value of the first sensing element; and a second sensing element is disposed on the substrate, and the second sensing element is used to detect a second physical quantity , Including: a second fixed electrode, including a plurality of second electrode units; and A second movable electrode can move relative to the second fixed electrode, and each of the plurality of second electrical switches is electrically coupled to each of the plurality of second electrode units to control each of the plurality of second electrode units The working state of the second sensor can change the sensing capacitance value of the second sensing element. 如申請專利範圍第14項所述之可調整感測電容值的微機電感裝置,其中該第一可動電極包含一第一固定部以及一第一可動部,該第一固定部設置於該基板並且圍繞該多個第一電極單元,且該第一可動部懸置於該多個第一電極單元上方。 The microcomputer inductance device capable of adjusting the sensing capacitance value as described in claim 14, wherein the first movable electrode includes a first fixed part and a first movable part, and the first fixed part is disposed on the substrate And surround the plurality of first electrode units, and the first movable part is suspended above the plurality of first electrode units. 如申請專利範圍第15項所述之可調整感應電容值的微機電感測裝置,其中該第二可動電極包含多個第二固定部以及一第二可動部,該多個第二固定部設置於該基板,該第二可動部介於該多個第二固定部之間,該第二可動部包含一可動質量塊以及多個彈性件,各該多個彈性件分別連接該可動質量塊及各該多個第二固定部,該可動質量塊懸置於該多個第二電極單元上方。 As described in item 15 of the scope of patent application, the microcomputer inductive sensing device capable of adjusting the inductive capacitance value, wherein the second movable electrode includes a plurality of second fixed parts and a second movable part, and the plurality of second fixed parts are arranged On the substrate, the second movable portion is interposed between the plurality of second fixed portions, and the second movable portion includes a movable mass and a plurality of elastic members, and each of the plurality of elastic members is respectively connected to the movable mass and For each of the plurality of second fixed parts, the movable mass is suspended above the plurality of second electrode units. 如申請專利範圍第16項所述之可調整感應電容值的微機電感測裝置,其中該第一物理量為氣壓,且該第二物理量為加速度。 As described in item 16 of the scope of patent application, the microcomputer inductance measuring device capable of adjusting the inductive capacitance value, wherein the first physical quantity is air pressure, and the second physical quantity is acceleration. 如申請專利範圍第14項所述之可調整感應電容值的微機電感測裝置,其中,當該特殊應用積體電路晶片經由各該多個第一電性開關供應電荷至各該多個第一電極單元時,各該多個第一電極單元的工作狀態定義為開啟狀態,當該特殊應用積體電路晶片藉由各該多個第一電性開關 不供應電荷至各該多個第一電極單元時,各該多個第一電極單元的工作狀態定義為關閉狀態,當該特殊應用積體電路晶片經由各該多個第二電性開關供應電荷至各該多個第二電極單元時,各該多個第二電極單元的工作狀態定義為開啟狀態,當該特殊應用積體電路晶片藉由各該多個第二電性開關不供應電荷至各該多個第二電極單元時,各該多個第二電極單元的工作狀態定義為關閉狀態,且處於開啟狀態的該多個第一電極單元的面積總和不等於處於開啟狀態的該多個第二電極單元的面積總和。 As described in item 14 of the scope of patent application, the microcomputer inductance measuring device capable of adjusting the inductive capacitance value, wherein when the special application integrated circuit chip supplies electric charge to each of the plurality of first electrical switches through each of the plurality of first electrical switches In the case of an electrode unit, the working state of each of the plurality of first electrode units is defined as an open state, and when the special application integrated circuit chip uses each of the plurality of first electrical switches When the electric charge is not supplied to each of the plurality of first electrode units, the working state of each of the plurality of first electrode units is defined as the off state, when the special application integrated circuit chip supplies electric charge through each of the plurality of second electrical switches To each of the plurality of second electrode units, the working state of each of the plurality of second electrode units is defined as an open state. When the special application integrated circuit chip does not supply electric charge to each of the plurality of second electrical switches For each of the plurality of second electrode units, the working state of each of the plurality of second electrode units is defined as a closed state, and the total area of the plurality of first electrode units in the open state is not equal to the plurality of open state The total area of the second electrode unit. 如申請專利範圍第18項所述之可調整感應電容值的微機電感測裝置,其中處於開啟狀態的該多個第一電極單元的面積總和大於處於開啟狀態的該多個第二電極單元的面積總和。 As described in item 18 of the scope of patent application, the microcomputer inductive sensing device with adjustable sensing capacitance, wherein the total area of the plurality of first electrode units in the open state is larger than that of the plurality of second electrode units in the open state The total area. 如申請專利範圍第19項所述之可調整感應電容值的微機電感測裝置,其中每一該多個第一電極單元的面積等於每一該多個第二電極單元的面積,並且處於開啟狀態的該多個第一電極單元的數量大於處於開啟狀態的該多個第二電極單元的數量。As described in item 19 of the scope of patent application, the microcomputer inductance measuring device capable of adjusting the inductive capacitance value, wherein the area of each of the plurality of first electrode units is equal to the area of each of the plurality of second electrode units, and is turned on The number of the plurality of first electrode units in the state is greater than the number of the plurality of second electrode units in the open state.
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Publication number Priority date Publication date Assignee Title
CN1813328A (en) * 2003-06-26 2006-08-02 皇家飞利浦电子股份有限公司 Micro-electromechanical device and module and method of manufacturing same
CN103187947A (en) * 2012-01-03 2013-07-03 国际商业机器公司 Switchable filters and design structures
TW201810852A (en) * 2016-06-29 2018-03-16 通用電機股份有限公司 System and method for fault interruption with MEMS switches

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1813328A (en) * 2003-06-26 2006-08-02 皇家飞利浦电子股份有限公司 Micro-electromechanical device and module and method of manufacturing same
CN103187947A (en) * 2012-01-03 2013-07-03 国际商业机器公司 Switchable filters and design structures
TW201810852A (en) * 2016-06-29 2018-03-16 通用電機股份有限公司 System and method for fault interruption with MEMS switches

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