TWI703905B - Serial position sensor - Google Patents

Serial position sensor Download PDF

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TWI703905B
TWI703905B TW108121538A TW108121538A TWI703905B TW I703905 B TWI703905 B TW I703905B TW 108121538 A TW108121538 A TW 108121538A TW 108121538 A TW108121538 A TW 108121538A TW I703905 B TWI703905 B TW I703905B
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layer
substrate
resistance
connecting end
position sensor
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TW108121538A
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Chinese (zh)
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TW202102071A (en
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黃子軒
劉韋良
蔡信村
詹皇釗
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台灣艾華電子工業股份有限公司
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Abstract

A serial position sensor is disclosed in the present invention. The connected position sensor includes a first resistance assembly and a second resistance assembly. The first resistance assembly includes a first substrate, a first resistance layer, a second substrate, a first conduction layer, and a first spacer. The second resistance assembly includes a third substrate, a second resistance layer, a fourth substrate, a second conduction layer, and a second spacer. At least one part of the second resistance assembly is overlapping with the first resistance assembly.

Description

串接式位置感測器 Tandem position sensor

本發明係有關於一種感測器,尤其是指一種串接式位置感測器。 The present invention relates to a sensor, in particular to a serial position sensor.

一般來說,位置感測器係利用電阻的變化反映了位移的量值,而阻值的增加或減少則表明了位移的方向。然而,先前技術中的位置感測器皆為一體成型,需要不同長度的位置感測器就需要不同長度的模具,一種模具只能製造出其特定長度的位置感測器,在製造與使用上來說相當不便。在位置感測器所形成的測試系統已成為目前生產過程檢測以及實現生產自動化不可缺少的手段後,極需解決先前技術中一種模具只能製造其特定長度的位置感測器或是一種位置感測器僅具有固定長度所衍生出的種種問題。 Generally speaking, the position sensor uses the change of resistance to reflect the magnitude of displacement, and the increase or decrease of resistance indicates the direction of displacement. However, the position sensors in the prior art are all integrally formed. If position sensors of different lengths are required, molds of different lengths are required. One type of mold can only produce position sensors of a specific length. In terms of manufacturing and use, It is quite inconvenient to say. After the test system formed by the position sensor has become an indispensable method for the current production process detection and realization of production automation, it is extremely necessary to solve the problem that a mold in the prior art can only produce a position sensor with a specific length or a position sensor. The detector only has various problems derived from a fixed length.

有鑒於在先前技術中,模具僅能製造特定長度的位置感測器或是位置感測器僅具有固定長度所衍生出的主種問題。本發明之一主要目的係提供一種串接 式位置感測器以解決先前技術中的至少一個問題。 In view of the prior art, the mold can only manufacture a position sensor with a specific length or the position sensor has only a fixed length. One of the main objects of the present invention is to provide a series connection Type position sensor to solve at least one problem in the prior art.

本發明為解決先前技術之問題,所採用之必要技術手段為提供一種串接式位置感測器,包含一第一電阻組件與一第二電阻組件。第一電阻組件係具有一第一連結端部,並包含一第一基板、一第一電阻層、一第二基板、一第一導電層與一第一間隔層。 In order to solve the problems of the prior art, the necessary technical means adopted by the present invention is to provide a series-connected position sensor, which includes a first resistance element and a second resistance element. The first resistance component has a first connection end and includes a first substrate, a first resistance layer, a second substrate, a first conductive layer and a first spacer layer.

第一基板,係具有一第一感測區。第一電阻層,係連結第一基板,並設置於第一感測區。第二基板,係具有一對應第一感測區之第二感測區。第一導電層,係連結第二基板,並設置於第二感測區。第一間隔層,係連結第一基板與第二基板,並具有一第一間隔區,使第一電阻層與第一導電層相間隔。 The first substrate has a first sensing area. The first resistance layer is connected to the first substrate and is arranged in the first sensing area. The second substrate has a second sensing area corresponding to the first sensing area. The first conductive layer is connected to the second substrate and arranged in the second sensing area. The first spacer layer connects the first substrate and the second substrate, and has a first spacer area to space the first resistive layer and the first conductive layer.

第二電阻組件,係具有一第二連結端部,且第二連結端部至少部分疊合並連結於第一電阻組件之第一連結端部,第二電阻組件並包含一第三基板、一第二電阻層、一第四基板、一第二導電層與一第二間隔層。 The second resistance component has a second connection end, and the second connection end is at least partially overlapped and connected to the first connection end of the first resistance component. The second resistance component includes a third substrate and a first connection end. Two resistance layers, a fourth substrate, a second conductive layer and a second spacer layer.

第三基板,係具有一第三感測區。第二電阻層,係連結第三基板,並設置於第三感測區,且串接第一電阻層。第四基板,係具有一對應第三感測區之第四感測區。第二導電層,係連結第四基板,並設置於第四感測區,且串接第一導電層。第二間隔層,係連結第三基板與第四基板,並具有一第二間隔區,使第二電阻層與第二導電層相間隔。 The third substrate has a third sensing area. The second resistance layer is connected to the third substrate, is disposed in the third sensing area, and is connected to the first resistance layer in series. The fourth substrate has a fourth sensing area corresponding to the third sensing area. The second conductive layer is connected to the fourth substrate, is disposed in the fourth sensing area, and is connected to the first conductive layer in series. The second spacer layer connects the third substrate and the fourth substrate, and has a second spacer area to separate the second resistance layer from the second conductive layer.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器,更包含 一導電黏膠層,且導電黏膠層係用以黏接並導通第一電阻組件與第二電阻組件。 On the basis of the above-mentioned necessary technical means, one of the subsidiary technical means derived from the present invention is to make a tandem position sensor, including A conductive adhesive layer, and the conductive adhesive layer is used for bonding and conducting the first resistance component and the second resistance component.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器,更包含至少一鉚接元件,且鉚接元件係貫穿第一電阻組件與第二電阻組件,用以鉚接第一電阻組件與第二電阻組件。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the series-connected position sensor further include at least one riveting element, and the riveting element penetrates the first resistance element and the second resistance element. Used for riveting the first resistance component and the second resistance component.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第一基板,係於第一連結端部具有一自第一連結端部之一第一本體段沿一第一側向延伸後再沿一第一延伸方向延伸出之第一延伸段,且第一電阻層係跨越第一間隔層並延伸至第一延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the first substrate in the tandem position sensor have one of the first connecting ends at the first connecting end. The first body section extends along a first lateral direction and then extends along a first extension direction. The first resistance layer crosses the first spacer layer and extends to the first extension section.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第三基板,係於第二連結端部具有一自第二連結端部之一第三本體段沿一與第一側向相反之第二側向延伸後再沿一與第一延伸方向相反之第二延伸方向延伸出之第三延伸段,且第二電阻層與第二間隔層係延伸至第三延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the third substrate in the tandem position sensor have one of the second connecting ends at the second connecting end. The third body section extends along a second lateral direction opposite to the first lateral direction and then a third extension section extends along a second extension direction opposite to the first extension direction, and the second resistance layer is separated from the second The layer system extends to the third extension section.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第二基板,係於第一連結端部具有一自第一連結端部之一第二本體段沿第二側向延伸後再沿第一延伸方向延伸出之第二延伸段,且第一導電層與第一間隔層係延伸至第二延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the second substrate in the tandem position sensor have one of the first connecting ends at the first connecting end. The second body section extends along the second lateral direction and then extends out of the second extension section along the first extension direction, and the first conductive layer and the first spacer layer extend to the second extension section.

在上述必要技術手段的基礎下,本發明所 衍生之一附屬技術手段為使串接式位置感測器中之第四基板,係於第二連結端部具有一自第二連結端部之一第四本體段沿第二側向延伸後再沿第二延伸方向延伸出之第四延伸段,且第二導電層係跨越第二間隔層並延伸至第四延伸段。 On the basis of the above necessary technical means, the present invention A derivative technical means is that the fourth substrate in the tandem position sensor is provided with a fourth body section at the second connecting end that extends in the second lateral direction from the second connecting end. The fourth extension section extends along the second extension direction, and the second conductive layer crosses the second spacer layer and extends to the fourth extension section.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第二電阻組件,更具有一對應第二連結端部之第三連結端部。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the second resistance element in the series-connected position sensor further have a third connecting end corresponding to the second connecting end.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第三基板,係於第三連結端部具有一自第三連結端部之一第三本體段沿一第一側向延伸後再沿一第一延伸方向延伸出之第五延伸段,且第二電阻層與第二間隔層係延伸至第五延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the third substrate in the tandem position sensor have a third connecting end at the third connecting end. The third body section extends along a first lateral direction and then a fifth extension section extending along a first extension direction, and the second resistance layer and the second spacer layer extend to the fifth extension section.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第四基板,係於第三連結端部具有一自第三連結端部之一第四本體段沿一與該第一側向相反之第二側向延伸後再沿該第一延伸方向延伸出之第六延伸段,且第二導電層係跨越第二間隔層並延伸至第六延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the fourth substrate in the tandem position sensor have one of the third connecting ends at the third connecting end. The fourth body section extends along a second lateral direction opposite to the first lateral direction and then extends along the first extension direction to a sixth extension section, and the second conductive layer extends across the second spacer layer to the first Six extensions.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器,更包含一第三電阻組件,第三電阻組件係具有一第四連結端部,且第四連結端部至少部分疊合並連結第二電阻組件之第三連結端部。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the series-connected position sensor further include a third resistance element, the third resistance element has a fourth connecting end, and The fourth connecting end is at least partially overlapped and connected to the third connecting end of the second resistance component.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第三電阻組件,係包含一第五基板、一第三電阻層、一第六基板、一第三導電層與一第三間隔層。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the third resistance component in the tandem position sensor include a fifth substrate, a third resistance layer, and a sixth The substrate, a third conductive layer and a third spacer layer.

第五基板,係具有一第五感測區。第三電阻層,係連結第五基板,並設置於第五感測區,且串接於第二電阻層。第六基板,係具有一對應第五感測區之第六感測區。第三導電層,係連結第六基板,並設置於第六感測區,且串接於第二導電層。第三間隔層,係連結第三電阻層與第三導電層,並具有一第三間隔區,使第三電阻層與第三導電層相間隔。 The fifth substrate has a fifth sensing area. The third resistance layer is connected to the fifth substrate, is disposed in the fifth sensing area, and is serially connected to the second resistance layer. The sixth substrate has a sixth sensing area corresponding to the fifth sensing area. The third conductive layer is connected to the sixth substrate, is disposed in the sixth sensing area, and is serially connected to the second conductive layer. The third spacer layer connects the third resistive layer and the third conductive layer, and has a third spacer area to separate the third resistive layer and the third conductive layer.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第五基板,於第四連結端部係具有一自第四連結端部之一第五本體段沿該第一側向延伸後再沿一與該第一延伸方向相反之第二延伸方向延伸出之第七延伸段,且第三電阻層係跨越第三間隔層並延伸至第七延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the fifth substrate in the tandem position sensor have one of the fourth connecting ends at the fourth connecting end. The fifth body segment extends along the first lateral direction and then along a seventh extension segment extending in a second extension direction opposite to the first extension direction, and the third resistive layer crosses the third spacer layer and extends to the first Seven extensions.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器中之第六基板,於第四連結端部係具有一自第四連結端部之一第六本體段沿第二側向延伸後再沿第二延伸方向延伸出之第八延伸段,且第三導電層與第三間隔層係延伸至第八延伸段。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the sixth substrate in the tandem position sensor have one of the fourth connecting ends at the fourth connecting end. The sixth body section extends along the second lateral direction and then extends along the second extension direction to an eighth extension section, and the third conductive layer and the third spacer layer extend to the eighth extension section.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器,更包含 一第二導電黏膠層,且第二導電黏膠層係用以黏接並導通第二電阻組件與第三電阻組件。 On the basis of the above-mentioned necessary technical means, one of the subsidiary technical means derived from the present invention is to make a tandem position sensor, including A second conductive adhesive layer, and the second conductive adhesive layer is used for bonding and conducting the second resistance element and the third resistance element.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器,更包含至少一第二鉚接元件,且第二鉚接元件係貫穿第二電阻組件與第三電阻組件,用以鉚接第二電阻組件與第三電阻組件。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the series-connected position sensor further include at least one second riveting element, and the second riveting element penetrates the second resistance element and the first The three resistance components are used for riveting the second resistance component and the third resistance component.

在上述必要技術手段的基礎下,本發明所衍生之一附屬技術手段為使串接式位置感測器,更包含一焊接層,且焊接層係用以焊接第一電阻組件與第二電阻組件。 On the basis of the above-mentioned necessary technical means, an auxiliary technical means derived from the present invention is to make the series-connected position sensor further include a welding layer, and the welding layer is used to weld the first resistance component and the second resistance component .

承上所述,本發明所提供串接式位置感測器,係利用第一電阻組件與第二電阻組件至少部分疊合地相互連結,可以解決先前技術中的位置感測器僅有固定長度,無法延長或縮短所衍生出的問題。此外,本發明的串接式位置感測器更利用第三電阻組件,使得可以不斷連結至使用者所需求的長度,也解決先前技術中,每一長度需要一種模具製造所衍生出的問題。 As mentioned above, the tandem position sensor provided by the present invention utilizes the first resistance component and the second resistance component to be at least partially overlapped and connected to each other, which can solve the problem that the position sensor in the prior art has only a fixed length , Unable to extend or shorten the resulting problems. In addition, the tandem position sensor of the present invention further utilizes a third resistance component, so that it can be continuously connected to the length required by the user, and also solves the problem that the prior art requires a mold for each length.

100、100a、100b‧‧‧串接式位置感測器 100, 100a, 100b‧‧‧Tandem position sensor

1、1b‧‧‧第一電阻組件 1, 1b‧‧‧The first resistance component

11‧‧‧第一基板 11‧‧‧First substrate

111‧‧‧第一延伸段 111‧‧‧First extension

112‧‧‧第一本體段 112‧‧‧The first body segment

12‧‧‧第二基板 12‧‧‧Second substrate

121‧‧‧第二延伸段 121‧‧‧Second extension

122‧‧‧第二本體段 122‧‧‧Second body section

13‧‧‧第一電阻層 13‧‧‧First resistance layer

14‧‧‧第一導電層 14‧‧‧First conductive layer

15‧‧‧第一間隔層 15‧‧‧The first compartment

2、2a、2b‧‧‧第二電阻組件 2, 2a, 2b‧‧‧Second resistor assembly

21、21a‧‧‧第三基板 21, 21a‧‧‧Third substrate

211‧‧‧第三延伸段 211‧‧‧The third extension

213‧‧‧第三本體段 213‧‧‧The third body segment

212a‧‧‧第五延伸段 212a‧‧‧The fifth extension

214a‧‧‧第五本體段 214a‧‧‧Fifth body segment

22、22a‧‧‧第四基板 22, 22a‧‧‧Fourth substrate

221‧‧‧第四延伸段 221‧‧‧ Fourth extension

223‧‧‧第四本體段 223‧‧‧The fourth body segment

222a‧‧‧第六延伸段 222a‧‧‧The sixth extension

23‧‧‧第二電阻層 23‧‧‧Second resistance layer

24、24a‧‧‧第二導電層 24, 24a‧‧‧Second conductive layer

25‧‧‧第二間隔層 25‧‧‧Second compartment

3a、3b‧‧‧第三電阻組件 3a, 3b‧‧‧The third resistance component

31a‧‧‧第五基板 31a‧‧‧Fifth substrate

311a‧‧‧第七延伸段 311a‧‧‧The seventh extension

32a‧‧‧第六基板 32a‧‧‧Sixth substrate

321a‧‧‧第八延伸段 321a‧‧‧The eighth extension

322a‧‧‧第八本體段 322a‧‧‧The eighth body segment

33a‧‧‧第三電阻層 33a‧‧‧The third resistance layer

4b‧‧‧鉚接元件 4b‧‧‧Riveting components

5b‧‧‧第二鉚接元件 5b‧‧‧Second riveting element

D1‧‧‧第一延伸方向 D1‧‧‧First extension direction

D2‧‧‧第二延伸方向 D2‧‧‧Second extension direction

DS1‧‧‧第一側向 DS1‧‧‧First side

DS2‧‧‧第二側向 DS2‧‧‧Second side

E1‧‧‧第一連結端部 E1‧‧‧First connection end

E2‧‧‧第二連結端部 E2‧‧‧Second connection end

E3‧‧‧第三連結端部 E3‧‧‧third connecting end

E4‧‧‧第四連結端部 E4‧‧‧The fourth connecting end

L‧‧‧導電黏膠層 L‧‧‧Conductive adhesive layer

S1‧‧‧第一感測區 S1‧‧‧First sensing area

S2‧‧‧第二感測區 S2‧‧‧Second sensing area

S3‧‧‧第三感測區 S3‧‧‧The third sensing area

S4‧‧‧第四感測區 S4‧‧‧The fourth sensing area

S5‧‧‧第五感測區 S5‧‧‧Fifth sensing area

S6‧‧‧第六感測區 S6‧‧‧Sixth sensing area

SE1‧‧‧第一間隔區 SE1‧‧‧The first compartment

SE2‧‧‧第二間隔區 SE2‧‧‧Second compartment

第一圖係顯示本發明第一實施例所提供之串接式位置感測器之第一電阻組件之立體分解圖;第二圖係顯示本發明第一實施例所提供之串接式位置感測器之第一電阻組件之立體圖; 第三圖係顯示本發明第一實施例所提供之串接式位置感測器之第二電阻組件之立體分解圖;第四圖係顯示本發明第一實施例所提供之串接式位置感測器之第二電阻組件之立體圖;第五圖係顯示本發明第一實施例所提供之串接式位置感測器之立體分解圖;第六圖係顯示第五圖之A-A剖面圖;第七圖係顯示本發明第一實施例所提供之串接式位置感測器之立體圖;第八圖係顯示第七圖之B-B剖面圖;第八A圖係顯示第八圖圈D所示區域之局部放大圖;第九圖係顯示第七圖之C-C剖面圖;第九A圖係顯示第九圖圈E所示區域之局部放大圖;第十圖係顯示本發明第二實施例所提供之串接式位置感測器之立體分解圖;第十一圖係顯示本發明第二實施例所提供之串接式位置感測器之立體圖;第十二圖係顯示本發明第三實施例所提供之串接式位置感測器之立體分解圖;以及第十三圖係顯示本發明第三實施例所提供之串接式位置感測器之立體圖。 The first figure shows a three-dimensional exploded view of the first resistance component of the tandem position sensor provided by the first embodiment of the present invention; the second figure shows the tandem position sensor provided by the first embodiment of the present invention The three-dimensional view of the first resistance component of the tester; The third figure is a three-dimensional exploded view of the second resistance component of the tandem position sensor provided by the first embodiment of the present invention; the fourth figure is a three-dimensional exploded view of the tandem position sensor provided by the first embodiment of the present invention A perspective view of the second resistance component of the sensor; Figure 5 is a perspective exploded view showing the tandem position sensor provided by the first embodiment of the present invention; Figure 6 is a cross-sectional view AA of Figure 5; Figure 7 is a three-dimensional view of the tandem position sensor provided by the first embodiment of the present invention; Figure 8 is a BB cross-sectional view of Figure 7; Figure A is a region shown by circle D in Figure 8 A partial enlarged view of Fig. 9; Fig. 9 is a cross-sectional view of CC of Fig. 7; Fig. 9A is a partial enlarged view of the area indicated by circle E in Fig. 9; Fig. 10 is a diagram showing the second embodiment of the present invention. The three-dimensional exploded view of the tandem position sensor; the eleventh figure shows the three-dimensional view of the tandem position sensor provided by the second embodiment of the present invention; the twelfth figure shows the third embodiment of the present invention The three-dimensional exploded view of the provided tandem position sensor; and the thirteenth figure is a three-dimensional view of the tandem position sensor provided by the third embodiment of the present invention.

下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範 圍,本發明的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本發明實施例的目的。 The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagram. According to the following description and patent application Therefore, the advantages and features of the present invention will be clearer. It should be noted that the drawings all adopt very simplified forms and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

請參閱第一圖至第四圖,其中,第一圖係顯示本發明第一實施例所提供之串接式位置感測器之第一電阻組件之立體分解圖;第二圖係顯示本發明第一實施例所提供之串接式位置感測器之第一電阻組件之立體圖;第三圖係顯示本發明第一實施例所提供之串接式位置感測器之第二電阻組件之立體分解圖;以及,第四圖係顯示本發明第一實施例所提供之串接式位置感測器之第二電阻組件之立體圖。如圖所示,一種串接式位置感測器100(標示於第五圖)包含一第一電阻組件1與一第二電阻組件2。 Please refer to the first to fourth figures, where the first figure is a three-dimensional exploded view of the first resistance component of the tandem position sensor provided by the first embodiment of the present invention; the second figure shows the present invention The three-dimensional view of the first resistance component of the tandem position sensor provided by the first embodiment; the third figure shows the three-dimensional view of the second resistance component of the tandem position sensor provided by the first embodiment of the present invention Exploded view; and, the fourth diagram is a perspective view of the second resistance component of the tandem position sensor provided by the first embodiment of the present invention. As shown in the figure, a series-connected position sensor 100 (marked in the fifth figure) includes a first resistance element 1 and a second resistance element 2.

第一電阻組件1係具有一第一連結端部E1,並包含一第一基板11、一第二基板12、一第一電阻層13、一第一導電層14與一第一間隔層15。 The first resistance element 1 has a first connection end E1 and includes a first substrate 11, a second substrate 12, a first resistance layer 13, a first conductive layer 14 and a first spacer layer 15.

第一基板11係具有一第一感測區S1,而第一電阻層13連結第一基板11,並設置於第一感測區S1。第二基板12係具有一對應第一感測區S1的第二感測區S2,而第一導電層14係連結第二基板12,並設置於第二感測區S2。第一間隔層15則是連結第一基板11與第二基板12,並且具有一第一間隔區SE1,使第一電阻層13與第一導電層14相間隔,不會接觸到彼此。 The first substrate 11 has a first sensing area S1, and the first resistance layer 13 is connected to the first substrate 11 and is disposed in the first sensing area S1. The second substrate 12 has a second sensing area S2 corresponding to the first sensing area S1, and the first conductive layer 14 is connected to the second substrate 12 and disposed in the second sensing area S2. The first spacer layer 15 connects the first substrate 11 and the second substrate 12, and has a first spacer region SE1, so that the first resistive layer 13 and the first conductive layer 14 are spaced apart and do not touch each other.

第一基板11在第一連結端部E1係具有一第一延伸段111,且第一電阻層13係跨越第一間隔層15 並延伸至第一延伸段111。第一延伸段111係自第一連結端部E1的一第一本體段112延伸出。 The first substrate 11 has a first extension 111 at the first connection end E1, and the first resistance layer 13 spans the first spacer layer 15 And extends to the first extension section 111. The first extension section 111 extends from a first body section 112 of the first connecting end E1.

第二基板12在第一連結端部E1係具有一第二延伸段121,且第一導電層14與第一間隔層15係對應地延伸至第二延伸段121。第二延伸段121係自第一連結端部E1的一第二本體段122延伸出。 The second substrate 12 has a second extension section 121 at the first connection end E1, and the first conductive layer 14 and the first spacer layer 15 extend to the second extension section 121 correspondingly. The second extension section 121 extends from a second body section 122 of the first connecting end E1.

因此,當第一基板11、第一電阻層13、第一間隔層15、第一導電層14與第二基板12依序連結時,第一延伸段111及延伸至其的第一電阻層13係會外露第二基板12外,而第二延伸段121及延伸至其的第一導電層14與第一間隔層15係會外露於第一基板11外。 Therefore, when the first substrate 11, the first resistive layer 13, the first spacer layer 15, the first conductive layer 14 and the second substrate 12 are sequentially connected, the first extension 111 and the first resistive layer 13 extending therefrom The second substrate 12 is exposed outside, and the second extension section 121 and the first conductive layer 14 and the first spacer layer 15 extending to it are exposed outside the first substrate 11.

第二電阻組件2係具有一第二連結端部E2,且至少部分疊合並連結於第一電阻組件1,在本實施例中,第二電阻組件2的第二連結端部E2係疊合並連結於第一電阻組件1的第一連結端部E1。而第二電阻組件2包含一第三基板21、一第四基板22、一第二電阻層23、一第二導電層24與一第二間隔層25。 The second resistance element 2 has a second connecting end E2, and is at least partially overlapped and connected to the first resistance element 1. In this embodiment, the second connecting end E2 of the second resistance element 2 is overlapped and connected At the first connecting end E1 of the first resistance element 1. The second resistance component 2 includes a third substrate 21, a fourth substrate 22, a second resistance layer 23, a second conductive layer 24 and a second spacer layer 25.

第三基板21係具有一第三感測區S3,而第二電阻層23係連結第三基板21,並設置於第三感測區S3,且串接第一電阻層13。第四基板22係具有一對應第三感測區S3的第四感測區S4,而第二導電層24係連結第四基板22,並設置於第四感測區S4,且串接第一導電層14。第二間隔層25則是連結第三基板21與第四基板22,並且具有一第二間隔區SE2,使第二電阻層23與第二導電層24相間隔,不會接觸到彼此。 The third substrate 21 has a third sensing area S3, and the second resistance layer 23 is connected to the third substrate 21, is disposed in the third sensing area S3, and is connected to the first resistance layer 13 in series. The fourth substrate 22 has a fourth sensing area S4 corresponding to the third sensing area S3, and the second conductive layer 24 is connected to the fourth substrate 22 and disposed in the fourth sensing area S4, and is connected in series to the first Conductive layer 14. The second spacer layer 25 connects the third substrate 21 and the fourth substrate 22, and has a second spacer region SE2, so that the second resistive layer 23 and the second conductive layer 24 are spaced apart and do not contact each other.

第三基板21在第二連結端部E2具有一第三延伸段211,且第二電阻層23與第二間隔層25係一同延伸至第三延伸段211。第三延伸段211係自第二連結端部E2的一第三本體段213延伸出。 The third substrate 21 has a third extension section 211 at the second connection end E2, and the second resistance layer 23 and the second spacer layer 25 extend to the third extension section 211 together. The third extension section 211 extends from a third body section 213 of the second connecting end E2.

第四基板22在第二連結端部E2具有一第四延伸段221,且第二導電層24係跨越第二間隔層25並延伸至第四延伸段221。第四延伸段221係自第二連結端部E2的一第四本體段223延伸出。 The fourth substrate 22 has a fourth extension 221 at the second connecting end E2, and the second conductive layer 24 spans the second spacer layer 25 and extends to the fourth extension 221. The fourth extension section 221 extends from a fourth body section 223 of the second connecting end E2.

因此,當第三基板21、第二電阻層23、第二間隔層25、第二導電層24與第四基板22依序連結時,第三延伸段211及延伸至其的第二電阻層23與第二間隔層25係外露於第四基板22外,而第四延伸段221及延伸至其的第二導電層24係位於第三基板21外。 Therefore, when the third substrate 21, the second resistive layer 23, the second spacer layer 25, the second conductive layer 24, and the fourth substrate 22 are sequentially connected, the third extension 211 and the second resistive layer 23 extending therefrom The second spacer layer 25 is exposed outside the fourth substrate 22, and the fourth extension section 221 and the second conductive layer 24 extending to it are outside the third substrate 21.

接著,請一併參閱第五圖至第九圖,其中,第五圖係顯示本發明第一實施例所提供之串接式位置感測器之立體分解圖;第六圖係顯示第五圖之A-A剖面圖;第七圖係顯示本發明第一實施例所提供之串接式位置感測器之立體圖;第八圖係顯示第七圖之B-B剖面圖;第八A圖係顯示第八圖圈D所示區域之局部放大圖;第九圖係顯示第七圖之C-C剖面圖;以及,第九A圖係顯示第九圖圈E所示區域之局部放大圖。如圖所示,第二電阻組件2的第二連結端部E2係至少部分疊合並連結於第一電阻組件1的第一連結端部E1,以形成串接式位置感測器100。 Next, please refer to the fifth to ninth figures together, wherein the fifth figure is a three-dimensional exploded view of the tandem position sensor provided by the first embodiment of the present invention; the sixth figure is the fifth figure The AA cross-sectional view; the seventh diagram is a perspective view showing the tandem position sensor provided by the first embodiment of the present invention; the eighth diagram is a BB cross-sectional view of the seventh diagram; the eighth A diagram is the eighth Fig. 9 is a partial enlarged view of the area shown in circle D; Fig. 9 is a cross-sectional view of CC in Fig. 7; and Fig. 9A is a partial enlarged view of the area shown in circle E of Fig. 9. As shown in the figure, the second connecting end E2 of the second resistance element 2 is at least partially overlapped and connected to the first connecting end E1 of the first resistance element 1 to form a series-connected position sensor 100.

第一延伸段111係自第一本體段112沿一 第一側向DS1延伸後再沿一第一延伸方向D1延伸出,第二延伸段121係自第二本體段122沿一與第一側向DS1相反之第二側向DS2延伸後再沿第一延伸方向D1延伸出。第三延伸段211係自第三本體段213沿第一側向DS1延伸後再沿一與第一延伸方向D1相反之第二延伸方向D2延伸出,第四延伸段221則是自第四本體段223沿第二側向DS2延伸後再沿第二延伸方向D2延伸出。 The first extension section 111 is from the first body section 112 along a The first side extends toward DS1 and then extends along a first extension direction D1. The second extension section 121 extends from the second body section 122 in a second lateral direction DS2 that is opposite to the first lateral direction DS1 and then along the first lateral direction DS2. An extension direction D1 extends out. The third extension section 211 extends from the third body section 213 along the first lateral direction DS1 and then extends along a second extension direction D2 opposite to the first extension direction D1. The fourth extension section 221 is from the fourth body The segment 223 extends along the second lateral direction DS2 and then extends along the second extension direction D2.

當第二電阻組件2係至少部分疊合並連結於第一電阻組件1時,第四延伸段221係疊合連結於第二延伸段121,使得第二導電層24係串接第一導電層14(標示於第一圖),而第三延伸段211係疊合連結於第一延伸段111,使得第二電阻層23(標示於第三圖)係串接第一電阻層13。而在本實施例中,串接式位置感測器100更包含一導電黏膠層L,導電黏膠層L係用以黏接並導通第二電阻組件2與第一電阻組件1,通常為一導電膠。導電黏膠層L也可使用一具有導通效果的雙面膠。 When the second resistance element 2 is at least partially overlapped and connected to the first resistance element 1, the fourth extension 221 is overlapped and connected to the second extension 121, so that the second conductive layer 24 is connected to the first conductive layer 14 in series (Marked in the first figure), and the third extension section 211 is overlapped and connected to the first extension section 111, so that the second resistance layer 23 (marked in the third figure) is serially connected to the first resistance layer 13. In this embodiment, the tandem position sensor 100 further includes a conductive adhesive layer L. The conductive adhesive layer L is used to bond and conduct the second resistance element 2 and the first resistance element 1, usually One conductive glue. The conductive adhesive layer L can also use a double-sided tape with a conductive effect.

在本發明其他實施例中,更包含一焊接層(圖未標示),焊接層係用以焊接第二電阻組件2的第二連結端部E2與第一電阻組件1的第一連結端部E1。雖然圖未標示焊接層,但是焊接層與導電黏膠層L的導電膠結構相似,在固化前不具特定形狀,而固化後會在第二連結端部E2與第一電阻組件1之間形成一層狀結構。焊接層可為一般常見的無鉛焊料、含鉛銲料或錫膏等。 In other embodiments of the present invention, a welding layer (not shown in the figure) is further included. The welding layer is used to weld the second connecting end E2 of the second resistance element 2 and the first connecting end E1 of the first resistance element 1. . Although the soldering layer is not shown in the figure, the conductive adhesive structure of the soldering layer is similar to that of the conductive adhesive layer L. It does not have a specific shape before curing. After curing, it forms a gap between the second connecting end E2 and the first resistance element 1. Layered structure. The soldering layer can be common lead-free solder, lead-containing solder or tin paste.

需說明的是,導電黏膠層L係同時具有結構上實體連結的功效與電路上電性連接的功效。導電黏 膠層L塗布的範圍至少包含第一電阻層13、第二電阻層23、第一導電層14與第二導電層24,當然導電黏膠層L也可以塗布至第一延伸段111、第三延伸段211、第二延伸段121、第四延伸段221、第一間隔層15或第二間隔層25。 It should be noted that the conductive adhesive layer L has both the function of physical connection on the structure and the function of electrical connection on the circuit. Conductive adhesive The coating range of the adhesive layer L includes at least the first resistive layer 13, the second resistive layer 23, the first conductive layer 14 and the second conductive layer 24. Of course, the conductive adhesive layer L can also be applied to the first extension 111 and the third extension. The extension section 211, the second extension section 121, the fourth extension section 221, the first spacer layer 15 or the second spacer layer 25.

需特別說明的是,第二延伸段121與第四延伸段221以及第一延伸段111與第三延伸段211的疊合關係相異。在本實施例中,第一電阻組件1的第二延伸段121係位於第二電阻組件2的第四延伸段221的上方,而第一電阻組件1的第一延伸段111則是位於第二電阻組件2的第三延伸段211的下方。此種疊合關係,可以使得第二電阻組件2係至少部分疊合並連結於第一電阻組件1後,厚度不會因此增加。 It should be particularly noted that the overlapping relationship between the second extension section 121 and the fourth extension section 221 and the first extension section 111 and the third extension section 211 are different. In this embodiment, the second extension section 121 of the first resistance component 1 is located above the fourth extension section 221 of the second resistance component 2, and the first extension section 111 of the first resistance component 1 is located at the second Below the third extension section 211 of the resistance component 2. Such a stacking relationship can make the thickness of the second resistor element 2 at least partially stacked and connected to the first resistor element 1 without increasing.

可從第八圖與第八A圖中看出,第三延伸段211疊合連結於第一延伸段111的厚度與第二電阻組件2的厚度相同。同理,亦可從第九圖與第九A圖中看出,第二延伸段121疊合連結於第四延伸段221的厚度與第一電阻組件1的厚度實質相同。又,第一電阻組件1的厚度與第二電阻組件2的厚度亦實質相同,故第二電阻組件2係至少部分疊合並連結於第一電阻組件1形成串接式位置感測器100時,整體的厚度不會增加,而是會實質相等。實質相等為扣除掉一些不可抗力的誤差後的相等,並非一定要完全一模一樣。 It can be seen from the eighth figure and the eighth figure A that the thickness of the third extension section 211 overlapped and connected to the first extension section 111 is the same as the thickness of the second resistance component 2. Similarly, it can be seen from FIGS. 9 and 9A that the thickness of the second extension section 121 superimposed and connected to the fourth extension section 221 is substantially the same as the thickness of the first resistance element 1. In addition, the thickness of the first resistance element 1 and the thickness of the second resistance element 2 are also substantially the same, so when the second resistance element 2 is at least partially overlapped and connected to the first resistance element 1 to form a series-connected position sensor 100, The overall thickness will not increase, but will be substantially equal. Substantial equality refers to equality after deducting some force majeure errors, and does not necessarily have to be exactly the same.

接著,請一併參閱第十圖與第十一圖,其中,第十圖係顯示本發明第二實施例所提供之串接式位 置感測器之立體分解圖;以及,第十一圖係顯示本發明第二實施例所提供之串接式位置感測器之立體圖。如圖所示,一種串接式位置感測器100a包含一第一電阻組件1、一第二電阻組件2a與一第三電阻組件3a。本實施例的第一電阻組件1與第一實施例中的第一電阻組件1完全相同,故不多加贅述。 Next, please refer to the tenth and eleventh figures, in which the tenth figure shows the serial position provided by the second embodiment of the present invention The three-dimensional exploded view of the sensor; and, the eleventh figure is a three-dimensional view of the tandem position sensor provided by the second embodiment of the present invention. As shown in the figure, a series-connected position sensor 100a includes a first resistance element 1, a second resistance element 2a, and a third resistance element 3a. The first resistance component 1 in this embodiment is exactly the same as the first resistance component 1 in the first embodiment, so it will not be repeated.

本實施例的第二電阻組件2a與第一實施例中的第二電阻組件2的差異在於,第二電阻組件2a更具有一對應第二連結端部E2的第三連結端部E3。 The difference between the second resistance element 2a of this embodiment and the second resistance element 2 of the first embodiment is that the second resistance element 2a further has a third connecting end E3 corresponding to the second connecting end E2.

第三基板21a在第三連結端部E3係具有一第五延伸段212a,而第二電阻層(如第三圖中的第二電阻層23)與第二間隔層(如第三圖中的第二間隔層25)係一同延伸至第五延伸段212a。第五延伸段212a係自第三連結端部E3的一第五本體段214a沿第一側向DS1(標示於第五圖)延伸後再沿第一延伸方向D1(標示於第五圖)延伸出。 The third substrate 21a has a fifth extension 212a at the third connecting end E3, and the second resistive layer (such as the second resistive layer 23 in the third figure) and the second spacer layer (such as the second resistive layer 23 in the third figure) The second spacer layer 25) extends to the fifth extension section 212a together. The fifth extension section 212a extends from a fifth body section 214a of the third connecting end E3 along the first lateral direction DS1 (marked in the fifth figure) and then extends along the first extension direction D1 (marked in the fifth figure) Out.

第四基板22a在第三連結端部E3係具有一第六延伸段222a,而第二導電層24a係跨越第二間隔層並延伸至第六延伸段222a。第六延伸段222a係自第三連結端部E3的一第六本體段(圖式中為被第五本體段214a所遮住的下方的元件)沿第二側向DS2(標示於第五圖)延伸後再沿第一延伸方向D1(標示於第五圖)延伸出。第二導電層24a於第二連結端部E2的一端與第一實施例相同,係跨越第二間隔層並延伸至第四延伸段221。 The fourth substrate 22a has a sixth extension 222a at the third connecting end E3, and the second conductive layer 24a spans the second spacer layer and extends to the sixth extension 222a. The sixth extension section 222a is from a sixth body section of the third connecting end E3 (in the figure, the element underneath the fifth body section 214a) along the second lateral direction DS2 (marked in the fifth figure) ) After extending, it then extends along the first extending direction D1 (marked in the fifth figure). The second conductive layer 24 a at one end of the second connecting end E2 is the same as in the first embodiment, and it spans the second spacer layer and extends to the fourth extension section 221.

第二電阻組件2a鄰近於第一電阻組件1的 前半部分,可以視為與第一實施例中的第二電阻組件2的前半部分完全相同,而第二電阻組件2a遠離於第一電阻組件1的後半部分,可以視為是對稱於前半部分。在本實施例中為線對稱,但不以此為限。在本發明其他實施例中,也可為點對稱,亦即第五延伸段係位於本實施例第六延伸段222a的位置,而第六延伸段係位於本實施例第五延伸段212a的位置,但是第三基板21a仍位於第四基板22a的上方,彼此不會接觸與交錯。 The second resistance component 2a is adjacent to the first resistance component 1 The first half can be regarded as completely the same as the first half of the second resistance component 2 in the first embodiment, and the second resistance component 2a is far away from the second half of the first resistance component 1 and can be regarded as symmetrical to the first half. In this embodiment, it is line symmetry, but not limited to this. In other embodiments of the present invention, it may also be point-symmetrical, that is, the fifth extension section is located at the position of the sixth extension section 222a in this embodiment, and the sixth extension section is located at the position of the fifth extension section 212a in this embodiment. , But the third substrate 21a is still located above the fourth substrate 22a, and will not touch or stagger each other.

第三電阻組件3a與第一電阻組件1的結構類似,包含一第五基板31a、一第六基板32a、一第三電阻層33a、一第三導電層與一第三間隔層,並具有一第四連結端部E4,且至少部分疊合並連結於第二電阻組件2a。 The third resistance component 3a is similar in structure to the first resistance component 1, and includes a fifth substrate 31a, a sixth substrate 32a, a third resistance layer 33a, a third conductive layer, and a third spacer layer, and has a The fourth connecting end E4 is at least partially overlapped and connected to the second resistance element 2a.

第五基板31a係具有一第五感測區S5,而第三電阻層33a係連結第五基板31a並設置於第五感測區S5。第六基板32a係具有一對應第五感測區S5的第六感測區S6,而第三導電層係連結第六基板32a並設置於第六感測區S6。第三間隔層係連結第五基板31a與第六基板32a,並具有一第三間隔區,使第三電阻層33a與第三導電層相間隔,不會接觸到彼此。 The fifth substrate 31a has a fifth sensing area S5, and the third resistive layer 33a is connected to the fifth substrate 31a and disposed in the fifth sensing area S5. The sixth substrate 32a has a sixth sensing area S6 corresponding to the fifth sensing area S5, and the third conductive layer is connected to the sixth substrate 32a and disposed in the sixth sensing area S6. The third spacer layer connects the fifth substrate 31a and the sixth substrate 32a, and has a third spacer region, so that the third resistive layer 33a and the third conductive layer are spaced apart and will not contact each other.

第五基板31a在第四連結端部E4具有一位於第六基板32a外的第七延伸段311a,且第三電阻層33a係跨越第三間隔層並延伸至第七延伸段311a。第七延伸段311a係自第四連結端部E4的一第七本體段(圖式為被第八本體段322a所遮住的下方的元件)沿第一側向DS1 (標示於第五圖)延伸後再沿第二延伸方向D2(標示於第五圖)延伸出。 The fifth substrate 31a has a seventh extension 311a located outside the sixth substrate 32a at the fourth connection end E4, and the third resistive layer 33a crosses the third spacer layer and extends to the seventh extension 311a. The seventh extension section 311a is derived from a seventh body section of the fourth connecting end E4 (the figure shows the lower element covered by the eighth body section 322a) along the first lateral direction DS1 (Marked in the fifth figure) and then extend along the second extension direction D2 (marked in the fifth figure).

第六基板32a在第四連結端部E4具有一第八延伸段321a,且第三導電層與第三間隔層係一同延伸至第八延伸段321a。第八延伸段321a係自第四連結端部E4的一第八本體段322a沿第二側向DS2(標示於第五圖)延伸後再沿第二延伸方向D2(標示於第五圖)延伸出。 The sixth substrate 32a has an eighth extension section 321a at the fourth connection end E4, and the third conductive layer and the third spacer layer extend together to the eighth extension section 321a. The eighth extension section 321a extends from an eighth body section 322a of the fourth connecting end E4 along the second lateral direction DS2 (marked in the fifth figure) and then extends along the second extension direction D2 (marked in the fifth figure) Out.

在第三電阻組件3a部分疊合並連結於第二電阻組件2a時,第七延伸段311a係疊合連結於第五延伸段212a,第八延伸段321a則是疊合連結於第六延伸段222a。與第一實施例相同的疊合關係,第八延伸段321a係位於第六延伸段222a的上方,而第七延伸段311a則是位於第五延伸段212a的下方。因此,疊合後的厚度仍與單一組件的厚度實質相同。需說明的是,本實施例中第一電阻組件1、第二電阻組件2a與第三電阻組件3a的疊合,可利用如第一實施例中的導電黏膠層L,使第一電阻組件1、第二電阻組件2a與第三電阻組件3a彼此黏接並導通。 When the third resistor element 3a is partially overlapped and connected to the second resistor element 2a, the seventh extension section 311a is overlapped and connected to the fifth extension section 212a, and the eighth extension section 321a is overlapped and connected to the sixth extension section 222a . In the same overlapping relationship as the first embodiment, the eighth extension section 321a is located above the sixth extension section 222a, and the seventh extension section 311a is located below the fifth extension section 212a. Therefore, the thickness after being laminated is still substantially the same as the thickness of a single component. It should be noted that in this embodiment, the first resistance element 1, the second resistance element 2a and the third resistance element 3a can be overlapped by using the conductive adhesive layer L as in the first embodiment to make the first resistance element 1. The second resistance component 2a and the third resistance component 3a are glued to each other and connected.

最後,請參閱第十二圖與第十三圖,其中,第十二圖係顯示本發明第三實施例所提供之串接式位置感測器之立體分解圖;以及,第十三圖係顯示本發明第三實施例所提供之串接式位置感測器之立體圖。如圖所示,一種串接式位置感測器100b包含一第一電阻組件1b、一第二電阻組件2b、一第三電阻組件3b、至少一鉚接元件4b與至少一第二鉚接元件5b。 Finally, please refer to Figures 12 and 13, where Figure 12 is a three-dimensional exploded view of the tandem position sensor provided by the third embodiment of the present invention; and Figure 13 is The three-dimensional view of the tandem position sensor provided by the third embodiment of the present invention is shown. As shown in the figure, a tandem position sensor 100b includes a first resistance element 1b, a second resistance element 2b, a third resistance element 3b, at least one riveting element 4b, and at least one second riveting element 5b.

第一電阻組件1b、第二電阻組件2b、第三電阻組件3b與第一實施例、第二實施例的結構類似,都具有二基板(第一基板與第二基板、第三基板與第四基板或第五基板與第六基板)、一電阻層(第一電阻層、第二電阻層或第三電阻層)、一導電層(第一導電層、第二導電層或第三導電層)與一間隔層(第一間隔層、第二間隔層或第三間隔層)。 The first resistance component 1b, the second resistance component 2b, and the third resistance component 3b are similar in structure to the first and second embodiments. They all have two substrates (the first substrate and the second substrate, the third substrate and the fourth substrate). Substrate or fifth substrate and sixth substrate), a resistive layer (first resistive layer, second resistive layer or third resistive layer), one conductive layer (first conductive layer, second conductive layer or third conductive layer) And a spacer layer (the first spacer layer, the second spacer layer or the third spacer layer).

主要差異在於,第一電阻組件1b、第二電阻組件2b、第三電阻組件3b皆不具有延伸段(第一延伸段與第二延伸段、第三延伸段與第四延伸段或第五延伸段與第六延伸段)。第二電阻組件2b部分疊合並連結於第一電阻組件1b,且第三電阻組件3b部分疊合並連結於第二電阻組件2b後,係利用鉚接元件4b與第二鉚接元件5b將第一電阻組件1b、第二電阻組件2b與第三電阻組件3b依序鉚接。鉚接之後,第一電阻層係利用鉚接元件4b串接於第二電阻層,第二電阻層也是利用第二鉚接元件5b串接於第三電阻層,同理,各導電層也是利用鉚接元件4b與第二鉚接元件5b進行串接。而鉚接元件4b與第二鉚接元件5b可為鉚釘。 The main difference is that the first resistance component 1b, the second resistance component 2b, and the third resistance component 3b do not have extension sections (the first extension section and the second extension section, the third extension section and the fourth extension section or the fifth extension section). Paragraph and sixth extension). After the second resistance component 2b is partially stacked and connected to the first resistance component 1b, and the third resistance component 3b is partially stacked and connected to the second resistance component 2b, the first resistance component is connected by the riveting element 4b and the second riveting element 5b 1b. The second resistance component 2b and the third resistance component 3b are riveted in sequence. After riveting, the first resistive layer is connected in series to the second resistive layer by the riveting element 4b, and the second resistive layer is also connected in series to the third resistive layer by the second riveting element 5b. Similarly, the conductive layers are also connected to the third resistive layer by riveting elements 4b. It is connected in series with the second riveting element 5b. The riveting element 4b and the second riveting element 5b can be rivets.

在本實施例中,因為第一電阻組件1b、第二電阻組件2b、第三電阻組件3b皆不具有延伸段,所以串接式位置感測器100b的寬度會小於第一實施例中的串接式位置感測器100與第二實施例中的串接式位置感測器100a。串接式位置感測器100b也可包含一第二導電黏膠層,替代第二鉚接元件5b,黏接並導通第二電阻組件 2b與第三電阻組件3b。第二導電黏膠層與第一實施例中的導電黏膠層L實質相同,係同時具有實體連結與電性連接的功效。 In this embodiment, because the first resistance component 1b, the second resistance component 2b, and the third resistance component 3b do not have extensions, the width of the series-connected position sensor 100b is smaller than that of the series in the first embodiment. The connection type position sensor 100 is the same as the series connection type position sensor 100a in the second embodiment. The tandem position sensor 100b may also include a second conductive adhesive layer, instead of the second riveting element 5b, to bond and conduct the second resistance element 2b and the third resistance component 3b. The second conductive adhesive layer is substantially the same as the conductive adhesive layer L in the first embodiment, and has the functions of physical connection and electrical connection at the same time.

上述三個實施例的導電層,通常都包含銀漆,而上述三個實施例的電阻層,通常都包含碳粉。部分電阻層或部分導電層會跨越間隔層至延伸段,但是電阻層與導電層的厚度跟整體厚度相比極小,僅約10微米,因此並不會影響厚度的實質相同。 The conductive layers of the above three embodiments usually contain silver paint, while the resistive layers of the above three embodiments usually contain carbon powder. Part of the resistive layer or part of the conductive layer spans the spacer layer to the extension section, but the thickness of the resistive layer and the conductive layer is very small compared to the overall thickness, only about 10 microns, so it does not affect the substantially same thickness.

此外,鉚接元件4b與第二鉚接元件5b也可替代第一實施例中的導電黏膠層L,藉以依序鉚接第一電阻組件1與第二電阻組件2。鉚接元件4b與第二鉚接元件5b也可替代至第二實施例,藉以依序鉚接第一電阻組件1、第二電阻組件2a與第三電阻組件3a。而導電黏膠層L也可替代本實施例中的鉚接元件4b,導電黏膠層L與第二導電黏膠層實質上為相同的東西,鉚接元件4b與第二鉚接元件5b實質上亦為相同的東西。在實務上,當各自的電阻層彼此無法面對面疊合或是各自的導電層彼此無法面對面疊合時,就必須使用鉚接元件4b(第二鉚接元件5b)。反之,當各自的電阻層可以面對面疊合或是各自的導電層可以面對面疊合時,則可以使用導電黏膠層L(第二導電黏膠層)、焊接層或是鉚接元件4b(第二鉚接元件5b),用以黏接並導通、焊接或鉚接各自的電阻層與各自的導電層。 In addition, the riveting element 4b and the second riveting element 5b can also replace the conductive adhesive layer L in the first embodiment, so that the first resistance element 1 and the second resistance element 2 can be riveted in sequence. The riveting element 4b and the second riveting element 5b can also be substituted to the second embodiment, whereby the first resistance element 1, the second resistance element 2a, and the third resistance element 3a can be riveted in sequence. The conductive adhesive layer L can also replace the riveting element 4b in this embodiment. The conductive adhesive layer L and the second conductive adhesive layer are substantially the same thing, and the riveting element 4b and the second riveting element 5b are also substantially the same. The same thing. In practice, when the respective resistance layers cannot be overlapped face to face or the respective conductive layers cannot be overlapped face to face, the riveting element 4b (the second riveting element 5b) must be used. Conversely, when the respective resistive layers can be laminated face to face or the respective conductive layers can be laminated face to face, the conductive adhesive layer L (second conductive adhesive layer), solder layer or riveting element 4b (second The riveting element 5b) is used for bonding and conducting, welding or riveting respective resistance layers and respective conductive layers.

此外,僅採用第三實施例中的第一電阻組件1b、第二電阻組件2b與鉚接元件4b亦可形成另一實施 例。若第一電阻組件1b的導電層與電阻層以及第二電阻組件2b的導電層與電阻層又屬於可以面對面疊合的,則鉚接元件4b又可被導電黏膠層L替代,亦可被焊接層取代。而除了上述導電黏膠層L、焊接層與鉚接元件4b以外,也可採用其他同時具有結構連結與電性連接功能的連結方式。 In addition, only the first resistance component 1b, the second resistance component 2b and the riveting element 4b in the third embodiment can be used to form another implementation. example. If the conductive layer and the resistance layer of the first resistance component 1b and the conductive layer and the resistance layer of the second resistance component 2b can be laminated face to face, the riveting element 4b can be replaced by the conductive adhesive layer L, or welded Layer replacement. In addition to the above-mentioned conductive adhesive layer L, welding layer and riveting element 4b, other connection methods having both structural connection and electrical connection functions can also be used.

此外,第二實施例中係揭示三段的第一電阻組件1、第二電阻組件2a與第三電阻組件3a,但並不以此為限。當第三電阻組件3a與第二電阻組件2a結構類似,更具有一與第四連結端部E4相對稱的第五連結端部時,串接式位置感測器就可以再多連結一第四電阻組件。如果第四電阻組件與第二電阻組件2a的結構完全相同,則串接式位置感測器又可以再多連結一第五電阻組件。同理,若第五電阻組件的結構與具有第五連結端部的第三電阻組件相同,則串接式位置感測器可以繼續連結其他電阻組件。因此,串接式位置感測器係可以包含複數個的電阻組件。 In addition, the second embodiment discloses three segments of the first resistance element 1, the second resistance element 2a, and the third resistance element 3a, but it is not limited thereto. When the third resistance element 3a is similar in structure to the second resistance element 2a, and there is a fifth connecting end symmetrical to the fourth connecting end E4, the tandem position sensor can be connected to a fourth Resistance components. If the structure of the fourth resistance element and the second resistance element 2a are exactly the same, the series-connected position sensor can be connected to a fifth resistance element. In the same way, if the structure of the fifth resistance component is the same as the third resistance component with the fifth connection end, the series-connected position sensor can continue to be connected to other resistance components. Therefore, the series-connected position sensor may include a plurality of resistance components.

電阻組件的數量、採用鉚接元件、導電黏膠層或焊料層、各自電阻組件的電阻層是否可以面對面疊合、各自電阻組件的導電層是否可以面對面疊合、各自電阻組件是否具有延伸段以及具有二延伸段的電阻組件是線對稱或是點對稱等因素考量的排列組合結果,本發明至少包含十種以上的實施例,將不予以贅述,僅由上述三個實施例作為主要實施例進行說明。 The number of resistance components, the use of riveting elements, conductive adhesive layers or solder layers, whether the resistance layers of the respective resistance components can be stacked face to face, whether the conductive layers of the respective resistance components can be stacked face to face, whether the respective resistance components have extensions, and have The resistance components of the two extension sections are the result of permutation and combination considering factors such as line symmetry or point symmetry. The present invention includes at least more than ten embodiments, which will not be repeated, and only the above three embodiments are used as the main embodiments for description. .

綜上所述,本發明所提供之串接式位置感 測器,係利用第一電阻組件與第二電阻組件部分疊合地連結,故可以解決先前技術中位置感測器僅有固定長度的問題。而串接式位置感測器也可利用第一電阻組件、第二電阻組件與第三電阻組件彼此連結串接,而達到要求的長度,以解決先前技術中,模具僅能製造其特定長度的位置感測器,且製造出來的位置感測器也僅具有單一長度無法延長及其所衍生出的種種問題。相較於先前技術,本發明的串接式位置感測器可以利用各電阻組件之間的連結,而達到所需要的長度,不需要為了該特定長度再購買其模具,也使得串接式位置感測器在長度方面得以延長或縮短,更具機動性與使用的靈活性。 In summary, the tandem position sense provided by the present invention The sensor uses the first resistance component and the second resistance component to be partially overlapped and connected, so it can solve the problem that the position sensor in the prior art has only a fixed length. The series-connected position sensor can also use the first resistance component, the second resistance component and the third resistance component to be connected in series to reach the required length, so as to solve the problem that in the prior art, the mold can only be manufactured with a specific length. The position sensor, and the manufactured position sensor has only a single length that cannot be extended and various problems derived therefrom. Compared with the prior art, the tandem position sensor of the present invention can use the connection between the resistance components to reach the required length. There is no need to purchase the mold for the specific length, which also makes the tandem position The length of the sensor can be extended or shortened, making it more maneuverable and flexible in use.

藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。 Through the detailed description of the preferred embodiments above, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, its purpose is to cover various changes and equivalent arrangements within the scope of the patent application for the present invention.

100‧‧‧串接式位置感測器 100‧‧‧Tandem position sensor

1‧‧‧第一電阻組件 1‧‧‧First resistor assembly

11‧‧‧第一基板 11‧‧‧First substrate

111‧‧‧第一延伸段 111‧‧‧First extension

12‧‧‧第二基板 12‧‧‧Second substrate

121‧‧‧第二延伸段 121‧‧‧Second extension

122‧‧‧第二本體段 122‧‧‧Second body section

13‧‧‧第一電阻層 13‧‧‧First resistance layer

2‧‧‧第二電阻組件 2‧‧‧Second resistor assembly

21‧‧‧第三基板 21‧‧‧Third substrate

211‧‧‧第三延伸段 211‧‧‧The third extension

213‧‧‧第三本體段 213‧‧‧The third body segment

22‧‧‧第四基板 22‧‧‧Fourth substrate

221‧‧‧第四延伸段 221‧‧‧ Fourth extension

24‧‧‧第二導電層 24‧‧‧Second conductive layer

D1‧‧‧第一延伸方向 D1‧‧‧First extension direction

D2‧‧‧第二延伸方向 D2‧‧‧Second extension direction

DS1‧‧‧第一側向 DS1‧‧‧First side

DS2‧‧‧第二側向 DS2‧‧‧Second side

E1‧‧‧第一連結端部 E1‧‧‧First connection end

E2‧‧‧第二連結端部 E2‧‧‧Second connection end

L‧‧‧導電黏膠層 L‧‧‧Conductive adhesive layer

S1‧‧‧第一感測區 S1‧‧‧First sensing area

S2‧‧‧第二感測區 S2‧‧‧Second sensing area

S3‧‧‧第三感測區 S3‧‧‧The third sensing area

S4‧‧‧第四感測區 S4‧‧‧The fourth sensing area

Claims (17)

一種串接式位置感測器,包含:一第一電阻組件,係具有一第一連結端部,並包含:一第一基板,係具有一第一感測區;一第一電阻層,係連結該第一基板,並設置於該第一感測區;一第二基板,係具有一對應該第一感測區之第二感測區;一第一導電層,係連結該第二基板,並設置於該第二感測區;以及一第一間隔層,係連結該第一基板與該第二基板,並具有一第一間隔區,使該第一電阻層與該第一導電層相間隔;以及一第二電阻組件,係具有一第二連結端部,且該第二連結端部至少部分疊合並連結於該第一電阻組件之該第一連結端部,該第二電阻組件並包含:一第三基板,係具有一第三感測區;一第二電阻層,係連結該第三基板,並設置於該第三感測區,且串接該第一電阻層;一第四基板,係具有一對應該第三感測區之第四感測區;一第二導電層,係連結該第四基板,並設置於該第四感測區,且串接該第一導電層;以及一第二間隔層,係連結該第三基板與該第四基板,並具有一第二間隔區,使該第二電阻層與該第二導電 層相間隔; A series-connected position sensor includes: a first resistance component having a first connection end, and including: a first substrate having a first sensing area; a first resistance layer Connect the first substrate and be arranged in the first sensing area; a second substrate has a second sensing area corresponding to the first sensing area; a first conductive layer is connected to the second substrate , And disposed in the second sensing region; and a first spacer layer, which connects the first substrate and the second substrate, and has a first spacer region, so that the first resistance layer and the first conductive layer Spaced apart; and a second resistance element having a second connecting end, and the second connecting end is at least partially overlapped and connected to the first connecting end of the first resistance element, the second resistance element It also includes: a third substrate having a third sensing area; a second resistive layer connected to the third substrate, disposed in the third sensing area, and serially connected to the first resistive layer; The fourth substrate has a fourth sensing area corresponding to the third sensing area; a second conductive layer is connected to the fourth substrate, is disposed in the fourth sensing area, and is connected in series to the first Conductive layer; and a second spacer layer, which connects the third substrate and the fourth substrate, and has a second spacer region, so that the second resistive layer and the second conductive Layer interval 如申請專利範圍第1項所述之串接式位置感測器,更包含一導電黏膠層,且該導電黏膠層係用以黏接並導通該第一電阻組件與該第二電阻組件。 The series-connected position sensor described in the first item of the scope of patent application further includes a conductive adhesive layer, and the conductive adhesive layer is used to bond and conduct the first resistance element and the second resistance element . 如申請專利範圍第1項所述之串接式位置感測器,更包含至少一鉚接元件,且該至少一鉚接元件係貫穿該第一電阻組件與該第二電阻組件,用以鉚接該第一電阻組件與該第二電阻組件。 As described in the first item of the scope of patent application, the serial position sensor further includes at least one riveting element, and the at least one riveting element penetrates the first resistance element and the second resistance element for riveting the first resistance element A resistance component and the second resistance component. 如申請專利範圍第1項所述之串接式位置感測器,其中,該第一基板於該第一連結端部具有一自該第一連結端部之一第一本體段沿一第一側向延伸出後再沿一第一延伸方向延伸出之第一延伸段,且該第一電阻層係跨越該第一間隔層並延伸至該第一延伸段。 The serial position sensor according to claim 1, wherein the first substrate has a first body section along the first connecting end portion from the first connecting end portion along the first A first extension section that extends laterally and then along a first extension direction, and the first resistance layer spans the first spacer layer and extends to the first extension section. 如申請專利範圍第4項所述之串接式位置感測器,其中,該第三基板於該第二連結端部具有一自該第二連結端部之一第三本體段沿一與該第一側向相反之第二側向延伸後再沿一與該第一延伸方向相反之第二延伸方向延伸出之第三側向延伸段,且該第二電阻層與該第二間隔層係延伸至該第三延伸段。 The tandem position sensor according to claim 4, wherein the third substrate has a third body section along the second connecting end portion and the second connecting end portion. The first side extends in the opposite second side direction and then the third side extension section extends in a second extension direction opposite to the first extension direction, and the second resistance layer and the second spacer layer are Extend to the third extension section. 如申請專利範圍第5項所述之串接式位置感 測器,其中,該第二基板於該第一連結端部具有一自該第一連結端部之一第二本體段沿該第二側向延伸後再沿該第一延伸方向延伸出之第二延伸段,且該第一導電層與該第一間隔層係延伸至該第二延伸段。 Tandem position sense as described in item 5 of the scope of patent application The detector, wherein the second substrate has a second body section at the first connecting end portion that extends along the second lateral direction from a second body section of the first connecting end portion and then extends along the first extension direction. Two extension sections, and the first conductive layer and the first spacer layer extend to the second extension section. 如申請專利範圍第6項所述之串接式位置感測器,其中,該第四基板於該第二連結端部具有一自該第二連結端部之一第四本體段沿該第二側向延伸後再沿該第二延伸方向延伸出之第四延伸段,且該第二導電層係跨越該第二間隔層並延伸至該第四延伸段。 According to the serial position sensor described in item 6 of the scope of patent application, wherein the fourth substrate has a fourth body section at the second connecting end along the second connecting end. A fourth extension section extending along the second extension direction after lateral extension, and the second conductive layer spans the second spacer layer and extends to the fourth extension section. 如申請專利範圍第1項所述之串接式位置感測器,其中,該第二電阻組件更具有一對應該第二連結端部之第三連結端部。 As described in the first item of the scope of patent application, the serial position sensor, wherein the second resistance component further has a third connecting end corresponding to the second connecting end. 如申請專利範圍第8項所述之串接式位置感測器,其中,該第三基板於該第三連結端部具有一自該第三連結端部之一第三本體段沿一第一側向延伸後再沿一第一延伸方向延伸出之第五延伸段,且該第二電阻層與該第二間隔層係延伸至該第五延伸段。 The tandem position sensor according to item 8 of the scope of patent application, wherein the third substrate has a third body section from the third connecting end along a first After lateral extension, a fifth extension section extends along a first extension direction, and the second resistance layer and the second spacer layer extend to the fifth extension section. 如申請專利範圍第9項所述之串接式位置感測器,其中,該第四基板於該第三連結端部具有一自該第三連結端部之一第四本體段沿一與該第一側向相反之第二側向延伸後再沿該第一延伸方向延伸出之第六 延伸段,且該第二導電層係跨越該第二間隔層並延伸至該第六延伸段。 The tandem position sensor according to claim 9, wherein the fourth substrate has a fourth body section along the third connecting end and the third connecting end. The first side extends to the opposite second side and then extends along the first extending direction. An extension section, and the second conductive layer spans the second spacer layer and extends to the sixth extension section. 如申請專利範圍第10項所述之串接式位置感測器,更包含一第三電阻組件,該第三電阻組件係具有一第四連結端部,且該第四連結端部係至少部分疊合並連結該第二電阻組件之該第三連結端部。 The series-connected position sensor described in item 10 of the scope of patent application further includes a third resistance element, the third resistance element has a fourth connecting end, and the fourth connecting end is at least partially The third connecting end of the second resistance component is stacked and connected. 如申請專利範圍第11項所述之串接式位置感測器,其中,該第三電阻組件係包含:一第五基板,係具有一第五感測區;一第三電阻層,係連結該第五基板,並設置於該第五感測區,且串接於該第二電阻層;一第六基板,係具有一對應該第五感測區之第六感測區;一第三導電層,係連結該第六基板,並設置於該第六感測區,且串接於該第二導電層;以及一第三間隔層,係連結該第三電阻層與該第三導電層,並具有一第三間隔區,使該第三電阻層與該第三導電層相間隔。 The serial position sensor described in claim 11, wherein the third resistance component includes: a fifth substrate having a fifth sensing area; and a third resistance layer connected The fifth substrate is disposed in the fifth sensing area and connected in series to the second resistance layer; a sixth substrate has a sixth sensing area corresponding to the fifth sensing area; and a third A conductive layer is connected to the sixth substrate, is disposed in the sixth sensing area, and is connected in series to the second conductive layer; and a third spacer layer is connected to the third resistive layer and the third conductive layer , And has a third spacer area, which separates the third resistance layer from the third conductive layer. 如申請專利範圍第12項所述之串接式位置感測器,其中,該第五基板於該第四連結端部係具有一自該第四連結端部之一第五本體段沿該第一側向延伸後再沿一與該第一延伸方向相反之第二延伸方向延伸 出之第七延伸段,且該第三電阻層係跨越該第三間隔層並延伸至該第七延伸段。 According to the tandem position sensor described in item 12 of the scope of patent application, wherein the fifth substrate has a fifth body section along the fourth connecting end at the fourth connecting end. After extending from one side, it then extends along a second extension direction opposite to the first extension direction The seventh extension section is formed, and the third resistance layer crosses the third spacer layer and extends to the seventh extension section. 如申請專利範圍第13項所述之串接式位置感測器,其中,該第六基板於該第四連結端部係具有一自該第四連結端部之一第六本體段沿該第二側向延伸後再沿該第二延伸方向延伸出之第八延伸段,且該第三導電層與該第三間隔層係延伸至該第八延伸段。 According to the tandem position sensor described in item 13 of the scope of application, the sixth substrate at the fourth connecting end has a sixth body section from the fourth connecting end along the first After two lateral extensions, the eighth extension section extends along the second extension direction, and the third conductive layer and the third spacer layer extend to the eighth extension section. 如申請專利範圍第11項所述之串接式位置感測器,更包含一第二導電黏膠層,且該第二導電黏膠層係用以黏接並導通該第二電阻組件與該第三電阻組件。 As described in item 11 of the scope of patent application, the serial position sensor further includes a second conductive adhesive layer, and the second conductive adhesive layer is used to bond and conduct the second resistance element and the The third resistance component. 如申請專利範圍第11項所述之串接式位置感測器,更包含至少一第二鉚接元件,且該至少一第二鉚接元件係貫穿該第二電阻組件與該第三電阻組件,用以鉚接該第二電阻組件與該第三電阻組件。 As described in item 11 of the scope of patent application, the serial position sensor further includes at least one second riveting element, and the at least one second riveting element penetrates the second resistance element and the third resistance element, and To riveted the second resistance component and the third resistance component. 如申請專利範圍第1項所述之串接式位置感測器,更包含一焊接層,且該焊接層係用以焊接該第一電阻組件與該第二電阻組件。 The tandem position sensor as described in the first item of the scope of patent application further includes a welding layer, and the welding layer is used for welding the first resistance component and the second resistance component.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100342639C (en) * 2004-06-15 2007-10-10 大同股份有限公司 Rotor position sensor of DC brushless motor
CN106734778A (en) * 2016-12-26 2017-05-31 长春东离合器股份有限公司 Diaphragm spring electricity servo power press
TWI612456B (en) * 2017-06-13 2018-01-21 友達光電股份有限公司 Sensor element and electronic device having the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100342639C (en) * 2004-06-15 2007-10-10 大同股份有限公司 Rotor position sensor of DC brushless motor
CN106734778A (en) * 2016-12-26 2017-05-31 长春东离合器股份有限公司 Diaphragm spring electricity servo power press
TWI612456B (en) * 2017-06-13 2018-01-21 友達光電股份有限公司 Sensor element and electronic device having the same

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