TWI702442B - Display panel - Google Patents

Abstract

The invention discloses a display panel comprising a first substrate, a second substrate, a high resistance film, a conductive material layer, a ground electrode and a conductive structure. The first substrate includes a side portion. The second substrate is disposed on the first substrate. The side portion protrudes from the second substrate, the high resistance film is disposed on the second substrate, and the conductive material layer is disposed along the edge of the high resistance film. The ground electrode is disposed on the side portion, and the conductive structure electrically connects the conductive material layer and the ground electrode. In the display panel of the present invention, by placing the conductive material layer on the high-resistance film along the edge of the high-resistance film, the static electricity on the high-resistance film can be sufficiently released in a short time, and the manufacturing process is simple and the cost is low.

Description

Display panel

The present invention relates to the technical field of display devices, specifically, to a display panel.

Self-capacitive (incell) display is a display that embeds touch panel functions into liquid crystal pixels. The touch-sensitive liquid crystal display in the prior art generally includes an upper polarizer, a high resistance film, and a color filter from top to bottom. , Liquid crystal layer, array substrate and lower polarizer. Among them, the high-resistance film provided on the color filter plate generally needs to be connected to the grounding solder joints on the array substrate through silver glue to release static electricity on the high-resistance film. However, due to the thickness of the substrate of the color filter plate, there is a height difference between the high-resistance film of the silver glue and the ground solder joint, which may cause the silver glue to be disconnected or fail to be connected to the ground solder joint. In addition, since only one corner of the high-resistance film has silver glue to connect to the grounding solder joints, the static electricity generated at certain locations of the existing high-resistance film must be conducted to the grounding solder joints through a longer path, making it difficult for static electricity to dissipate in a short time. Although the prior art improves the release speed of static electricity by increasing the area of the silver glue, this not only increases the process difficulty, but also causes the risk of glue overflow.

The object of the present invention is to provide a display panel that has improved the ability to dissipate static electricity on a high-resistance film and has excellent reliability.

In order to achieve the above object, the display panel of the present invention includes a first substrate, a second substrate, a high resistance film, a conductive material layer, a ground electrode, and a conductive structure. The first substrate includes side portions, the second substrate is disposed on the first substrate, the side portions protrude from the second substrate, the high-resistance film is disposed on the second substrate, and the conductive material layer is disposed on the high-resistance film along the edge of the high-resistance film. On the resist film, the ground electrode is arranged on the side part, and the conductive structure is electrically connected to the conductive material layer and the ground electrode.

In an embodiment of the aforementioned display panel, the conductive material layer is disposed on the high-resistance film around the edge of the high-resistance film.

In an embodiment of the above-mentioned display panel, the high-resistance film completely covers the outer surface of the second substrate.

In an embodiment of the aforementioned display panel, the outer edge of the high-resistance film is aligned with the outer edge of the second substrate.

In an embodiment of the above-mentioned display panel, the outer edge of the conductive material layer is aligned with the outer edge of the high resistance film.

In an embodiment of the aforementioned display panel, the inner edge of the conductive material layer has a plurality of protrusions.

In an embodiment of the aforementioned display panel, the conductive material layer is a closed loop.

In an embodiment of the above-mentioned display panel, the ground electrode includes a first pad and a second pad, which are respectively disposed at both ends of the side portion, and the conductive structure includes a first conductive portion and a second conductive portion. Corresponding to the ground electrode settings.

In an embodiment of the aforementioned display panel, the conductive material layer has at least one fracture, and the fracture is located between the first conductive portion and the second conductive portion.

In an embodiment of the aforementioned display panel, the conductive material layer is a transparent conductive material.

The beneficial effect of the present invention is that, by disposing the conductive material layer on the high-resistance film along the edge of the high-resistance film, the display panel of the present invention can not only fully discharge the static electricity on the high-resistance film in a short time, but also the manufacturing process Simple and low cost.

The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments, but not as a limitation to the present invention.

100: display panel

110: first substrate

111: side

120: second substrate

120a‧‧‧Outer edge

130‧‧‧High resistance film

130a‧‧‧Outer edge

140‧‧‧Conductive material layer

140a‧‧‧Outer edge

141‧‧‧Fracture

142‧‧‧Outer edge

143a, 143b‧‧‧inner edge

150‧‧‧Ground electrode

151‧‧‧First pad

152‧‧‧Second pad

160‧‧‧Conductive structure

161‧‧‧The first conductive part

162‧‧‧Second conductive part

170‧‧‧Flexible circuit board

181、182、183‧‧‧Wire

S11, S12, S13, S21, S22, S23

E, F‧‧‧Detection point

1 is a schematic top view of the structure of an embodiment of the display panel of the present invention; FIG. 2 is a schematic cross-sectional view taken along line AA of FIG. 1; FIG. 3 is a schematic view of the top structure of an embodiment of the display panel of the present invention; A schematic top view of an embodiment of the display panel; FIG. 5 is an enlarged schematic view of an embodiment at B of FIG. 4; FIG. 6 is an enlarged schematic view of an embodiment at B of FIG. 4.

The technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments to further understand the purpose, solutions and effects of the present invention, but not as a limitation of the protection scope of the appended claims of the present invention.

References in the specification to "embodiment", "another embodiment", "this embodiment", etc. mean that the described embodiment may include specific features, structures or characteristics, but not every embodiment must include These specific features, structures or characteristics. In addition, such expressions do not refer to the same embodiment. Further, when describing specific features, structures or characteristics in conjunction with embodiments, whether there is a clear description or not, it has been shown that combining such features, structures or characteristics into other embodiments is within the knowledge of those skilled in the art .

In the specification and subsequent claims, certain words are used to refer to specific components or parts. Those of ordinary skill in the art should understand that technical users or manufacturers can refer to the same component or part with different terms or terms. . This specification and subsequent claims do not use differences in names as a way to distinguish components or parts, but use differences in functions of components or parts as a criterion for distinction. The "including" and "including" mentioned in the entire specification and the subsequent claims are open-ended terms and should be interpreted as "including but not limited to". In addition, the term "connection" here includes any direct and indirect means of connection.

It should be noted that in the description of the present invention, if the terms "horizontal", "vertical", "upper", "lower", "front", "rear", "left", "right", "vertical" appear The orientation or positional relationship indicated by “straight”, “horizontal”, “top”, “bottom”, “inner” and “outer” are based on the attached The orientation or positional relationship shown in the figure is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as Restrictions on the utility model. For the sake of clarity, the terms "first", "second", "third", "fourth" and other terms mentioned herein are used to refer to an element, region, or part that is the same or similar to another element or region. , Parts are distinguished, not to limit specific elements, regions, or parts.

As shown in FIGS. 1 and 2, FIG. 1 is a schematic top view of an embodiment of the display panel of the present invention, and FIG. 2 is a schematic cross-sectional view taken along line AA of FIG. 1. The display panel 100 of this embodiment includes a first substrate 110, a second substrate 120, a high-resistance film 130, a conductive material layer 140, a ground electrode 150, and a conductive structure 160. The first substrate 110 includes a side portion 111, the second substrate 120 is disposed on the first substrate 110, and the side portion 111 of the first substrate 110 protrudes from the second substrate 120. The high-resistance film 130 is disposed on the second substrate 120, and its resistance is, for example, about 10 ⁸ Ω. The conductive material layer 140 is disposed on the high-resistance film 130 along the edge of the high-resistance film 130, and its resistance is, for example, less than 10 ² Ω. The ground electrode 150 is disposed on the side 111 of the first substrate 110, and the conductive structure 160 is electrically connected to the conductive material layer 140 and the ground electrode 150. In other words, the first substrate 110, the second substrate 120, the high resistance film 130, and the conductive material layer 140 are stacked from bottom to top.

It should be noted that in this embodiment, the display panel 100 is rectangular, and the outer contour of the conductive material layer 140 is also rectangular. However, in other embodiments, such as the display panel is a special-shaped cut panel (such as with bangs, cut corners, open Curved groove) or round panel, etc., the outer contour of the conductive material layer changes in coordination.

In this embodiment, the first substrate 110 is, for example, a TFT (Thin Film Transistor, thin film transistor) substrate, the second substrate 120 is, for example, a CF (Color Filter, color filter) substrate, and the conductive structure 160 is, for example, silver glue or other materials. Type of conductive adhesive. Among them, the first substrate 110 and the second substrate 120 can be attached to optical plates such as polarizers, which are common structural forms in the art, and will not be repeated here. The touch function of this embodiment can be integrated in a module composed of the first substrate 110 and the second substrate 120. For example, the touch function is integrated between the liquid crystal layer and the second substrate 120.

The high-resistance film 130 has high impedance, and the static electricity generated thereon is not easily dissipated. Since static electricity has the characteristic of automatically finding the path with the least impedance for transmission, the static electricity on the high-resistance film 130 automatically finds the shortest path to the conductive material layer 140 with the closest distance, and is guided along the conductive material layer 140 to the conductive structure 160 and The ground electrode 150 is used to quickly dissipate the static electricity on the high resistance film 130.

As shown in FIG. 1, in this embodiment, the conductive material layer 140 is disposed on the high-resistance film 130 around the edge of the high-resistance film 130. Therefore, assuming that the static electricity on the high-resistance film 130 occurs at the S11 position, the static electricity will be first Move to the left, along the shortest path to the conductive material layer 140 and then down, and finally guided to the ground electrode 150 through the conductive structure 160; assuming that the static electricity on the high-resistance film 130 occurs at the S12 position, the static electricity will move upward first, along The shortest path is transmitted to the conductive material layer 140 and then guided to the ground electrode 150 through the conductive structure 160; assuming that the static electricity on the high-resistance film 130 occurs at the S13 position, the static electricity will first move to the right and be transmitted to the conductive material layer 140 along the shortest path Then, it is guided to the ground electrode 150 through the conductive structure 160.

As shown in FIG. 1, the display panel 100 of this embodiment further includes a flexible circuit board 170, and the flexible circuit board 170 is connected to the side portion 111 of the first substrate 110. At the same time, the ground electrode 150 and the flexible circuit board 170 located at the side portion 111 are connected through a wire 181, for example. When detecting the conductive structure 160 of the display panel 100 of this embodiment, the resistance value between the two points E and F can be detected to determine whether the conductive structure 160 is connected to the conductive material layer 140 and the ground electrode 150, where point E is conductive At any point on the material layer 140, point F is the conduction point on the flexible circuit board 170, which can be detected by an ordinary multimeter. This embodiment can conveniently and effectively detect the grounding effect of the high-resistance film.

In an embodiment of the present invention, the high-resistance film 130 completely covers the outer surface of the second substrate 120, in other words, the high-resistance film 130 completely covers the surface of the second substrate 120 opposite to the first substrate 110, and the high-resistance film 130 The shape and size correspond to the shape and size of the outer surface of the second substrate 120. Therefore, in this embodiment, the high-resistance film 130 can be directly formed on the outer surface of the second substrate 120, and there is no need to perform other operations on the high-resistance film 130.

As shown in FIG. 2, in this embodiment, the outer edge 130 a of the high resistance film 130 is aligned with the outer edge 120 a of the second substrate 120.

Please continue to refer to FIG. 2. In this embodiment, the outer edge 140 a of the conductive material layer 140 is aligned with the outer edge 130 a of the high resistance film 130.

The conductive material layer 140 is, for example, a transparent conductive material. In actual operation, after the high-resistance film 130 is disposed, the conductive material layer 140 is disposed on the high-resistance film 130 and along the outer edge of the high-resistance film 130. In this embodiment, the conductive material layer 140 is located outside the display area of the display panel 100, whereby the conductive material The layer 140 can share the UV mask with the light shielding layer (not shown) of the display panel 100, which saves the cost of a new mask.

In the embodiment shown in FIG. 1, the ground electrode 150 and the conductive structure 160 are provided on one side of the first panel 110, but the present invention is not limited thereto. As shown in FIG. 3, in another embodiment of the present invention, the ground electrode 150 includes a first pad 151 and a second pad 152, which are respectively disposed on both ends of the side 111 of the first substrate 110, and the conductive structure 160 includes a first conductive portion 161 and a second conductive portion 162 respectively corresponding to the first pad 151 and the second pad 152. The first conductive portion 161 is electrically connected to the first pad 151 and the conductive material layer 140, and the second conductive The portion 162 is electrically connected to the second pad 152 and the conductive material layer 140. In this embodiment, by arranging conductive structures and ground electrodes on both sides to increase the conduction path of static electricity, the dissipation speed of static electricity is further improved.

Similarly, in this embodiment, the first pad 151 and the flexible circuit board 170 can be connected through the wire 182, for example, by detecting the resistance of the conductive material layer 140 and the two points on the flexible circuit board 170 to determine the first conductive portion 161 whether the conductive material layer 140 and the first pad 151 are connected. Or, connect the second pad 152 and the flexible circuit board 170 through the wire 183, for example, by detecting the resistance of the conductive material layer 140 and the two points on the flexible circuit board 170 to determine whether the second conductive portion 162 is connected to the conductive material layer 140 And second pad 152.

As shown in FIG. 4, the conductive material layer 140 has at least one fracture 141, for example, the fracture 141 is located between the first conductive portion 161 and the second conductive portion 162, which can reduce the material usage of the conductive material layer 140 and has the purpose of saving cost.

The inner edge of the conductive material layer 140 may have a plurality of protrusions. As shown in FIG. 5, in an embodiment of the present invention, the conductive material layer 140 includes an outer edge 142 and an inner edge 143a, wherein the outer edge 142 is aligned with the edge of the high-resistance film 130, and the inner edge 143a has a zigzag structure. , The static electricity on the high resistance film 130 can be induced to be conducted to the tip of the zigzag structure of the inner edge 143a, which further accelerates the dissipation speed of static electricity.

As shown in FIG. 6, in an embodiment of the present invention, the conductive material layer 140 includes an outer edge 142 and an inner edge 143b, wherein the outer edge 142 is aligned with the edge of the high-resistance film 130, and the inner edge 143b has a concave-convex structure. , The static electricity on the high resistance film 130 can be quickly conducted to the tip of the concave-convex structure of the inner edge 143b, which further accelerates the dissipation speed of static electricity.

Of course, in other embodiments, the protrusions may also have various forms, and the present invention is not limited.

Of course, the present invention can also have various other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and All deformations should fall within the protection scope of the appended claims of the present invention.

100‧‧‧Display Panel

111‧‧‧Side

130‧‧‧High resistance film

140‧‧‧Conductive material layer

150‧‧‧Ground electrode

160‧‧‧Conductive structure

170‧‧‧Flexible circuit board

181‧‧‧Wire

S11, S12, S13‧‧‧Assumed location of static electricity

E, F‧‧‧Detection point

Claims (9)

A display panel includes: a first substrate including a side portion; a second substrate disposed on the first substrate, and the side portion protrudes from the second substrate; a high resistance film disposed on the second substrate On the second substrate, the high-resistance film completely covers the outer surface of the second substrate; a conductive material layer is disposed on the high-resistance film along the edge of the high-resistance film; and a ground electrode is disposed on the side portion; And a conductive structure, electrically connecting the conductive material layer and the ground electrode. The display panel according to claim 1, wherein the conductive material layer is disposed on the high-resistance film around an edge of the high-resistance film. The display panel according to claim 1, wherein the outer edge of the high resistance film is aligned with the outer edge of the second substrate. The display panel according to claim 1, wherein the outer edge of the conductive material layer is aligned with the outer edge of the high resistance film. The display panel according to claim 1, wherein the inner edge of the conductive material layer has a plurality of protrusions. The display panel according to claim 1, wherein the conductive material layer is a closed loop. The display panel of claim 1, wherein the ground electrode includes a first pad and a second pad, which are respectively disposed at both ends of the side portion, and the conductive structure includes a first conductive portion and a The second conductive parts are respectively provided corresponding to the ground electrodes. The display panel according to claim 7, wherein the conductive material layer has at least one fracture, and the fracture is located between the first conductive portion and the second conductive portion. The display panel according to claim 1, wherein the conductive material layer is a transparent conductive material.

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