TWI702195B - Alkali-free, low softening point glass and compositions and methods thereof - Google Patents
Alkali-free, low softening point glass and compositions and methods thereof Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 176
- 239000000203 mixture Substances 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title description 11
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 6
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 27
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 24
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 239000011368 organic material Substances 0.000 abstract description 5
- 239000000654 additive Substances 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910011255 B2O3 Inorganic materials 0.000 abstract 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 15
- 238000007789 sealing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229910000629 Rh alloy Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000004093 laser heating Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 3
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005352 clarification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000156 glass melt Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Abstract
Description
本揭露與無鹼低軟化點玻璃及組成物、以及其製造和使用方法有關。該玻璃可用於密封有機發光二極體(OLED)顯示器,以延長用於製造二極體的有機材料的壽命。 The present disclosure is related to alkali-free low-softening point glass and its composition, and its manufacturing and use methods. The glass can be used to seal organic light emitting diode (OLED) displays to extend the life of the organic materials used to make the diodes.
新一代的有機發光二極體已經吸引大眾注意,因為它們是自身發光、超薄、可撓、快速回應、並且具有能量效率。在開發OLED技術期間面臨的一個最大的技術挑戰是用於製造二極體的有機材料的有限壽命。然而,當研究者發現OLED可被密封於低軟化點玻璃中以提供比傳統薄膜封裝和背蓋封裝更佳的優點時,解決了這個問題。例如,密封於低軟化點玻璃中的OLED具有絕佳的防浸水性和氣體阻絕特性。 The new generation of organic light-emitting diodes has attracted public attention because they are self-luminous, ultra-thin, flexible, fast response, and energy efficient. One of the biggest technical challenges faced during the development of OLED technology is the limited lifetime of the organic materials used to make the diodes. However, when researchers discovered that OLEDs can be sealed in low-softening point glass to provide better advantages than traditional thin film packaging and back cover packaging, this problem was solved. For example, OLEDs sealed in low-softening point glass have excellent water-soaking and gas barrier properties.
然而,低軟化點玻璃的使用已經產生一組不同挑戰。一般而言,低軟化點玻璃含有SiO2-B2O3-ZnO、Bi2O3-B2O3、釩酸鹽、磷酸鹽和鹼性玻璃系統。鉍酸鹽和釩酸鹽是相對昂貴,磷酸鹽玻璃缺乏化學穩定性。相較於Bi2O3-B2O3、釩酸鹽、磷酸鹽和鹼性玻璃系統,SiO2-B2O3-ZnO玻璃系統具有較高的軟化點。最低軟化點玻璃含有大量的鹼金屬氧化物以降低軟化點。然而,大量的鹼金屬氧化物將增加熱膨脹係數並降低玻璃組成物的耐候能力。同時,鹼金屬離子在高溫熱處理期間會傾向於遷移或擴散至其他材料中。 However, the use of low softening point glass has created a different set of challenges. Generally speaking, low softening point glass contains SiO 2 -B 2 O 3 -ZnO, Bi 2 O 3 -B 2 O 3 , vanadate, phosphate, and alkaline glass systems. Bismuthate and vanadate are relatively expensive, and phosphate glass lacks chemical stability. Compared with Bi 2 O 3 -B 2 O 3 , vanadate, phosphate and alkaline glass systems, the SiO 2 -B 2 O 3 -ZnO glass system has a higher softening point. The lowest softening point glass contains a large amount of alkali metal oxides to lower the softening point. However, a large amount of alkali metal oxide will increase the thermal expansion coefficient and reduce the weather resistance of the glass composition. At the same time, alkali metal ions tend to migrate or diffuse into other materials during high-temperature heat treatment.
一般而言,OLED玻璃基板是無鹼的且具有低熱膨脹係數(CTE)(α=30 x 10-7/℃至38 x 10-7/℃)、絕佳的耐熱性(應變點溫度高於650℃)、高機械穩定性、以及高軟化點(高於900℃)。因此,存在用於密封具有低熱膨脹係數和低軟化點的此種OLED玻璃基板的玻璃的需要。此外,存在可通過部分雷射加熱方法處理以保護電子組件的有機材料免於受熱破壞的玻璃的需要。 Generally speaking, OLED glass substrates are alkali-free and have low coefficient of thermal expansion (CTE) (α=30 x 10 -7 /℃ to 38 x 10 -7 /℃), excellent heat resistance (strain point temperature higher than 650℃), high mechanical stability, and high softening point (above 900℃). Therefore, there is a need for glass for sealing such OLED glass substrates with low thermal expansion coefficient and low softening point. In addition, there is a need for glass that can be treated by a partial laser heating method to protect the organic materials of electronic components from damage by heat.
於此提出一種無鹼、低軟化點玻璃。該無鹼、低軟化點玻璃可用於密封OLED玻璃基板,以延長OLED玻璃基板中包含的有機材料的壽命。 An alkali-free, low-softening point glass is proposed here. The alkali-free, low-softening point glass can be used to seal the OLED glass substrate to extend the life of the organic materials contained in the OLED glass substrate.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物包括:從約6.0wt%至約28.0wt%的SiO2;從約20.0wt%至約45.0wt%的B2O3;從約25.0wt%至約48.0wt%的ZnO;從約0.0wt%至約15.0wt%的Al2O3;從約3.0wt%至約15.0wt%的CuO;從約0.0wt%至約10.0wt%的SrO;及從約0.0wt%至約5.0wt%的MgO。 According to several example embodiments, the alkali-free, low-softening point glass has a composition including: from about 6.0 wt% to about 28.0 wt% of SiO 2 ; from about 20.0 wt% to about 45.0 wt% of B 2 O 3 From about 25.0wt% to about 48.0wt% of ZnO; from about 0.0wt% to about 15.0wt% of Al 2 O 3 ; from about 3.0wt% to about 15.0wt% of CuO; from about 0.0wt% to about 10.0wt% SrO; and from about 0.0wt% to about 5.0wt% MgO.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物特徵在於:含量從8.0wt%至30.0wt%的SiO2+Al2O3,wt%的比例從0.1至1.5的B2O3/ZnO,及wt%的比例從0.2至1.5的(SiO2+Al2O3)/B2O3。 According to several exemplary embodiments, the alkali-free, low-softening point glass has a composition characterized in that the content of SiO 2 +Al 2 O 3 is from 8.0 wt% to 30.0 wt %, and the ratio of B is from 0.1 to 1.5 wt %. 2 O 3 /ZnO, and (SiO 2 +Al 2 O 3 )/B 2 O 3 with a wt% ratio from 0.2 to 1.5.
根據數個示例實施方式,該玻璃具有的組成物包括:從約6.0wt%至約28.0wt%、從約8.0wt%至約28.0wt%、或從約8.0wt%至約19.0%的SiO2; 從約20.0wt%至約45.0wt%、或從約23.0wt%至約42.0wt%的B2O3;從約25.0wt%至約48.0wt%、或從約27.0wt%至約48.0wt%的ZnO;從約0.0wt%至約15.0wt%、或從約2.0wt%至約11.0wt%的Al2O3;從約3.0wt%至約15.0wt%、或從約3.0wt%至約10.0wt%的CuO;從約0.0wt%至約10.0wt%、或從約0.5wt%至約10.0wt%的SrO;及從約0.0wt%至約5.0wt%、或從約0.5wt%至約5.0wt%的MgO。 According to several example embodiments, the glass has a composition including: from about 6.0 wt% to about 28.0 wt%, from about 8.0 wt% to about 28.0 wt%, or from about 8.0 wt% to about 19.0% SiO 2 ; From about 20.0wt% to about 45.0wt%, or from about 23.0wt% to about 42.0wt% of B 2 O 3 ; from about 25.0wt% to about 48.0wt%, or from about 27.0wt% to about 48.0wt % ZnO; from about 0.0wt% to about 15.0wt%, or from about 2.0wt% to about 11.0wt% Al 2 O 3 ; from about 3.0wt% to about 15.0wt%, or from about 3.0wt% to About 10.0wt% CuO; from about 0.0wt% to about 10.0wt%, or from about 0.5wt% to about 10.0wt% of SrO; and from about 0.0wt% to about 5.0wt%, or from about 0.5wt% To about 5.0wt% of MgO.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物特徵在於:含量從8.0wt%至30.0wt%、或從9.0wt%至約28.0wt%的SiO2+Al2O3;wt%的比例從0.5至1.5、或從0.5至1.1的B2O3/ZnO;及wt%的比例從0.2至1.5、或從0.2至1.2的(SiO2+Al2O3)/B2O3。 According to several exemplary embodiments, the alkali-free, low-softening point glass has a composition characterized by: SiO 2 +Al 2 O 3 in a content ranging from 8.0 wt% to 30.0 wt %, or from 9.0 wt% to about 28.0 wt% ; B 2 O 3 /ZnO with a weight% ratio of from 0.5 to 1.5, or from 0.5 to 1.1; and a weight ratio of (SiO 2 +Al 2 O 3 )/B from 0.2 to 1.5, or from 0.2 to 1.2 2 O 3 .
根據數個示例實施方式,該無鹼、低軟化點玻璃在從約800nm至約1400nm的波長下具有大於約2/mm的吸收係數。 According to several example embodiments, the alkali-free, low-softening point glass has an absorption coefficient greater than about 2/mm at a wavelength from about 800 nm to about 1400 nm.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物包含低於約1000ppm(百萬分之一)的鹼金屬。 According to several example embodiments, the alkali-free, low-softening point glass has a composition that contains less than about 1000 ppm (parts per million) of alkali metals.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有從約600℃至約700℃的軟化點。 According to several example embodiments, the alkali-free, low-softening point glass has a softening point from about 600°C to about 700°C.
下述第1圖說明與揭露的實施方式有關、並且不應被視為限制。第1圖是表3中的實例1代表的組成物的UV-VIS圖,其中「T%」是穿透百分比,「R%」是反射百分比,且「A」為吸收。 The description of Figure 1 below is related to the disclosed embodiments and should not be considered as limiting. Figure 1 is a UV-VIS image of the composition represented by Example 1 in Table 3, where "T%" is the transmission percentage, "R%" is the reflection percentage, and "A" is the absorption.
當用於描述單一數字時,用語「約」是表示包括±5%的範圍。在應用至一範圍時,用語「約」是表示該範圍包括數值下限的-5%及數值上限的+5%,除非下限是0。例如,從約100℃至約200℃的範圍包括從95℃至210℃的範圍。然而,當用語「約」修飾一百分比時,例如wt%,則該用語是指數字或數值邊界的±1%,除非下限值小於1。因此,約5-10%的範圍包括4-11%,約0-5%的範圍包括0-6%。 When used to describe a single number, the term "about" means a range including ±5%. When applied to a range, the term "about" means that the range includes -5% of the lower limit of the value and +5% of the upper limit of the value, unless the lower limit is zero. For example, the range from about 100°C to about 200°C includes the range from 95°C to 210°C. However, when the term "about" modifies a percentage, such as wt%, the term means ±1% of the number or value boundary, unless the lower limit is less than 1. Therefore, the range of about 5-10% includes 4-11%, and the range of about 0-5% includes 0-6%.
用語「無鹼(alkali-free或alkali free)」是指包括低於約1000ppm鹼金屬(包括氧化物中所含的鹼金屬)的玻璃組成物。鹼金屬包括鋰、鈉、鉀、銣、銫、鍅。 The term "alkali-free (alkali free)" refers to a glass composition containing less than about 1000 ppm of alkali metals (including alkali metals contained in oxides). Alkali metals include lithium, sodium, potassium, rubidium, cesium, and thorium.
用語「低軟化點」是指玻璃組成物具有從約600℃至約700℃的軟化點。 The term "low softening point" means that the glass composition has a softening point from about 600°C to about 700°C.
用語「軟化點」是指以ASTM C-338纖維加長方法測得的玻璃樣品黏度為107.6泊的溫度。 The term "softening point" refers to the temperature at which the viscosity of a glass sample measured by ASTM C-338 fiber lengthening method is 10 7.6 poise.
除非另外指明,所有測量都是公制單位。 Unless otherwise specified, all measurements are in metric units.
除非另有陳述,玻璃組成物的組成的用語「wt%」或「重量百分比」是指該組成相對於玻璃組成物重量的重量百分比。本領域的技術人員可理解wt%的總和必須加總至100.0wt%,且不能超過100.0wt%。 Unless otherwise stated, the term "wt%" or "weight percentage" of the composition of the glass composition refers to the weight percentage of the composition relative to the weight of the glass composition. Those skilled in the art can understand that the sum of wt% must be added to 100.0 wt%, and cannot exceed 100.0 wt%.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為玻璃網絡形成組成的SiO2,其幾乎是全部以[SiO4]存在、且對於提供低熱膨脹係數玻璃是必要的。根據數個實施方式,玻璃組成物的SiO2含量是從約6.0wt%至約28.0wt%、從約8.0wt%至約28.0wt%、或從約8.0wt%至約19.0wt%。若該玻璃組成物的SiO2含量下降至低於6.0wt%,則難以從該組成物形成玻璃。相反地,若玻璃組成物的SiO2含量上升至高於28.0wt%,則該玻璃的軟化點會增加至過高的程度、並且在使用玻璃組成物密封OLED基板時會導 致對OLED基板的損害。 According to several example embodiments, the alkali-free, low-softening point glass has a composition including SiO 2 as a glass network forming composition, which is almost entirely present as [SiO 4 ] and is useful for providing glass with a low thermal expansion coefficient necessary. According to several embodiments, the SiO 2 content of the glass composition is from about 6.0 wt% to about 28.0 wt %, from about 8.0 wt% to about 28.0 wt %, or from about 8.0 wt% to about 19.0 wt %. If the SiO 2 content of the glass composition falls below 6.0 wt%, it will be difficult to form glass from the composition. Conversely, if the SiO 2 content of the glass composition rises to more than 28.0 wt%, the softening point of the glass will increase to an excessively high degree, and the OLED substrate will be damaged when the glass composition is used to seal the OLED substrate.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為玻璃網絡形成組成的B2O3,其是以[BO3]和[BO4]存在,可降低玻璃的熱膨脹係數並且增加玻璃結構的完整度。同時,B2O3可降低玻璃的黏度與軟化點,加速澄清。根據數個示例實施方式,玻璃組成物的B2O3含量是從約20.0wt%至約45.0wt%,或從23.0wt%至約42.0wt%。然而,若玻璃組成物中的B2O3的量超過45.0wt%,則玻璃的穩定性降低,並且熱膨脹係數會增加至過高的程度。若玻璃組成物的B2O3含量降至低於20.0wt%,則玻璃的軟化點會增加至過高的程度、且在玻璃組成物被用來密封OLED基板時會導致對OLED基板的損害。 According to several example embodiments, the alkali-free, low-softening point glass has a composition including B 2 O 3 as a glass network forming composition, which is present in [BO 3 ] and [BO 4 ], which can reduce The coefficient of thermal expansion of glass increases the integrity of the glass structure. At the same time, B 2 O 3 can reduce the viscosity and softening point of glass and accelerate clarification. According to several example embodiments, the B 2 O 3 content of the glass composition is from about 20.0 wt% to about 45.0 wt %, or from 23.0 wt% to about 42.0 wt %. However, if the amount of B 2 O 3 in the glass composition exceeds 45.0 wt %, the stability of the glass decreases, and the thermal expansion coefficient increases to an excessively high degree. If the B 2 O 3 content of the glass composition is reduced to less than 20.0wt%, the softening point of the glass will increase to an excessively high level, and the glass composition will cause damage to the OLED substrate when the glass composition is used to seal the OLED substrate .
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為玻璃網絡改質劑的ZnO。在玻璃組成物中,ZnO的含量傾向於降低玻璃的軟化點、並且能夠微調玻璃的熱膨脹係數至想要的範圍。根據數個示例實施方式,玻璃組成物的ZnO含量是從約25.0wt%至約48wt%,或是從約27.0wt%至約48.0wt%。然而,若玻璃組成物的ZnO含量上升至48.0wt%以上,則難以從該組成物形成玻璃。若玻璃組成物的ZnO含量下降至低於25.0wt%,則微調玻璃熱膨脹係數至所需範圍的能力會受影響,且玻璃的軟化點也將增加至不希望的程度。 According to several example embodiments, the alkali-free, low-softening point glass has a composition including ZnO as a glass network modifier. In the glass composition, the content of ZnO tends to lower the softening point of the glass, and can fine-tune the thermal expansion coefficient of the glass to a desired range. According to several example embodiments, the ZnO content of the glass composition is from about 25.0 wt% to about 48 wt%, or from about 27.0 wt% to about 48.0 wt%. However, if the ZnO content of the glass composition increases to 48.0 wt% or more, it is difficult to form glass from the composition. If the ZnO content of the glass composition drops below 25.0wt%, the ability to fine-tune the thermal expansion coefficient of the glass to a desired range will be affected, and the softening point of the glass will also increase to an undesirable level.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為玻璃網絡中間體的Al2O3,其是以[AlO4]存在。在玻璃組成物中含有Al2O3可增加玻璃的黏度、降低玻璃失透的可能性、並且增加玻璃的穩定性。根據數個示例實施方式,玻璃組成物的Al2O3含量是從0wt%至約15.0wt%,或從約2.0wt%至約11wt%。若玻璃組成物的Al2O3含量大於15.0wt%,則玻璃的軟化點會增加至過高的程度、且在玻璃組成物被用來密封OLED基板時會導致 對OLED基板的損害。 According to several example embodiments, the alkali-free, low-softening point glass has a composition including Al 2 O 3 as an intermediate of the glass network, which exists as [AlO 4 ]. The inclusion of Al 2 O 3 in the glass composition can increase the viscosity of the glass, reduce the possibility of devitrification of the glass, and increase the stability of the glass. According to several example embodiments, the Al 2 O 3 content of the glass composition is from 0 wt% to about 15.0 wt %, or from about 2.0 wt% to about 11 wt %. If the Al 2 O 3 content of the glass composition is greater than 15.0 wt%, the softening point of the glass will increase to an excessively high level, and damage to the OLED substrate will be caused when the glass composition is used to seal the OLED substrate.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為著色劑的CuO。根據數個示例實施方式,將CuO加入玻璃組成物中可使玻璃有效地吸收長波長的光,長波長的光適用於雷射加熱玻璃密封製程。然而,CuO也可改變玻璃的軟化點。根據數個示例實施方式,玻璃組成物中的CuO含量是從約3.0wt%至約15.0wt%,或從約3.0wt%至約10.0wt%。若玻璃組成物的CuO含量低於3.0wt%,則玻璃會變得難以吸收雷射加熱玻璃密封製程中必需的雷射輻射波長。然而,若玻璃組成物中的CuO含量上升至高於15.0wt%,則難以從該組成物形成玻璃。根據數個示例實施方式,該無鹼、低軟化點玻璃具有高雷射輻射吸收能力,其在波長為從約800nm至1400nm的波長下的吸收係數大於2/mm。 According to several example embodiments, the alkali-free, low-softening point glass has a composition including CuO as a colorant. According to several exemplary embodiments, adding CuO to the glass composition can effectively absorb long-wavelength light, and the long-wavelength light is suitable for the laser heating glass sealing process. However, CuO can also change the softening point of glass. According to several example embodiments, the CuO content in the glass composition is from about 3.0 wt% to about 15.0 wt%, or from about 3.0 wt% to about 10.0 wt%. If the CuO content of the glass composition is less than 3.0wt%, the glass becomes difficult to absorb the laser radiation wavelength necessary for the laser heating glass sealing process. However, if the CuO content in the glass composition increases to more than 15.0% by weight, it is difficult to form glass from the composition. According to several example embodiments, the alkali-free, low-softening point glass has high laser radiation absorption capacity, and its absorption coefficient at a wavelength from about 800 nm to 1400 nm is greater than 2/mm.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為可選添加物的SrO。在玻璃組成物中含有SrO可降低玻璃的軟化點,減少玻璃失澄的發生,並且降低玻璃的液化溫度。根據數個示例實施方式,玻璃組成物中的SrO含量是從約0.0wt%至約10.0wt%,或從約0.5wt%至約10.0wt%。若玻璃組成物中的SrO含量大於10.0wt%,則玻璃的密度將會過高而使玻璃過重,並且玻璃的熱膨脹係數也將過高,於玻璃組成物被用來密封OLED時將產生應力而對玻璃的密封效果產生不良影響。 According to several example embodiments, the alkali-free, low-softening point glass has a composition that includes SrO as an optional additive. The inclusion of SrO in the glass composition can lower the softening point of the glass, reduce the occurrence of glass loss, and lower the liquefaction temperature of the glass. According to several example embodiments, the SrO content in the glass composition is from about 0.0 wt% to about 10.0 wt%, or from about 0.5 wt% to about 10.0 wt%. If the SrO content in the glass composition is greater than 10.0wt%, the density of the glass will be too high and the glass will be too heavy, and the thermal expansion coefficient of the glass will be too high, which will cause stress when the glass composition is used to seal the OLED. It adversely affects the sealing effect of the glass.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有組成物,該組成物包括作為可選添加物的MgO,其可促進玻璃澄清。根據數個實施方式,玻璃組成物中的MgO含量是從約0.0wt%至約5.0wt%,或從約0.5wt%至約5.0wt%。若玻璃組成物中的MgO的含量高於5.0wt%,則玻璃的熱膨脹係數將會過高,於玻璃組成物被用來密封OLED時將產生應力而對玻璃的密封效果產生不良影響。 According to several example embodiments, the alkali-free, low-softening point glass has a composition that includes MgO as an optional additive, which can promote glass refining. According to several embodiments, the content of MgO in the glass composition is from about 0.0 wt% to about 5.0 wt%, or from about 0.5 wt% to about 5.0 wt%. If the content of MgO in the glass composition is higher than 5.0wt%, the thermal expansion coefficient of the glass will be too high, and stress will be generated when the glass composition is used to seal the OLED, which will adversely affect the sealing effect of the glass.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物特徵在於具有從8.0wt%至30.0wt%、或從9.0wt%至28.0wt%的SiO2和Al2O3集合體含量。根據數個示例實施方式,SiO2和Al2O3的集合體含量大於8.0wt%,使得玻璃在從50℃至300℃的溫度範圍下具有低於55 x 10-7/℃的熱膨脹係數。然而,若SiO2和Al2O3的集合體含量大於30.0wt%,則玻璃的軟化點會高於700℃,在玻璃組成物被用來密封OLED基板時會導致對OLED基板的損害。 According to several example embodiments, the alkali-free, low-softening point glass has a composition characterized by having from 8.0 wt% to 30.0 wt%, or from 9.0 wt% to 28.0 wt% of SiO 2 and Al 2 O 3 aggregates content. According to several example embodiments, the aggregate content of SiO 2 and Al 2 O 3 is greater than 8.0 wt %, so that the glass has a thermal expansion coefficient lower than 55 x 10 -7 /°C in a temperature range from 50°C to 300°C. However, if the aggregate content of SiO 2 and Al 2 O 3 is greater than 30.0 wt %, the softening point of the glass will be higher than 700° C., which may cause damage to the OLED substrate when the glass composition is used to seal the OLED substrate.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物特徵在於具有從0.5至1.5、或從0.5至1.1之B2O3/ZnO的wt%比例。若玻璃組成物中的B2O3/ZnO的wt%比例小於0.5wt%,則玻璃的熱膨脹係數將會過高,於該玻璃組成物被用來密封OLED時將產生應力而對玻璃的密封效果產生不良影響。若玻璃組成物中的B2O3/ZnO的wt%比例大於1.5wt%,則玻璃的穩定性會衰減,並且會發生玻璃組成物中的氧化物材料的結晶化。 According to several exemplary embodiments, the alkali-free, low-softening point glass has a composition characterized by having a B 2 O 3 /ZnO wt% ratio of from 0.5 to 1.5, or from 0.5 to 1.1. If the wt% ratio of B 2 O 3 /ZnO in the glass composition is less than 0.5 wt%, the thermal expansion coefficient of the glass will be too high, and stress will be generated when the glass composition is used to seal the OLED, which will seal the glass The effect has an adverse effect. If the wt% ratio of B 2 O 3 /ZnO in the glass composition is greater than 1.5 wt%, the stability of the glass may be reduced, and crystallization of the oxide material in the glass composition may occur.
根據數個示例實施方式,該無鹼、低軟化點玻璃具有的組成物特徵在於具有從0.2至1.5、或從0.2至1.2的wt%比例之(SiO2+Al2O3)/B2O3。若玻璃組成物中的(SiO2+Al2O3)/B2O3的wt%比例小於0.2wt%,則變成難以從組成物形成玻璃。相反地,若玻璃組成物中的(SiO2+Al2O3)/B2O3的wt%比例大於1.5wt%,則玻璃的軟化點會高於700℃,在玻璃組成物被用來密封OLED基板時會導致對OLED基板的損害。 According to several example embodiments, the alkali-free, low-softening point glass has a composition characterized by having a weight% ratio of (SiO 2 +Al 2 O 3 )/B 2 O ranging from 0.2 to 1.5, or from 0.2 to 1.2 3 . If the ratio by weight of (SiO 2 +Al 2 O 3 )/B 2 O 3 in the glass composition is less than 0.2 wt %, it becomes difficult to form glass from the composition. Conversely, if the weight% ratio of (SiO 2 +Al 2 O 3 )/B 2 O 3 in the glass composition is greater than 1.5% by weight, the softening point of the glass will be higher than 700 ℃, and the glass composition is used Sealing the OLED substrate will cause damage to the OLED substrate.
根據數個示例實施方式,提供了一種用於製造無鹼低軟化點玻璃的方法。根據數個示例實施方式,該方法包括:秤重並且混合原料;軟化該原料,以形成均質的玻璃熔融體;及冷卻或以水淬冷該玻璃熔融體。 According to several example embodiments, a method for manufacturing alkali-free low-softening point glass is provided. According to several example embodiments, the method includes: weighing and mixing raw materials; softening the raw materials to form a homogeneous glass melt; and cooling or quenching the glass melt with water.
根據上述的用於製造無鹼低軟化點玻璃的方法的數個示例實施方 式,玻璃組成物是在約1100℃下熔化達約12小時、達約6小時、或達約4小時。 According to several exemplary embodiments of the above-mentioned method for manufacturing alkali-free low-softening point glass Formula, the glass composition is melted at about 1100°C for about 12 hours, for about 6 hours, or for about 4 hours.
根據上述的用於製造無鹼低軟化點玻璃的方法的數個示例實施方式,玻璃組成物是在450℃的溫度下退火約2小時,然後以大約每小時1.0℃的速率冷卻,直到玻璃達到400℃為止,然後使該玻璃組成物冷卻至室溫(或約21℃)。 According to several exemplary embodiments of the method for manufacturing alkali-free low-softening point glass described above, the glass composition is annealed at a temperature of 450°C for about 2 hours, and then cooled at a rate of about 1.0°C per hour until the glass reaches After reaching 400°C, the glass composition is cooled to room temperature (or about 21°C).
根據上述無鹼低軟化點玻璃的數個示例實施方式,玻璃是用於密封有機發光二極體(OLED)的基板。根據上述無鹼低軟化點玻璃的數個示例實施方式,該玻璃是被用於生產觸控顯示器,包括行動電話、平板、ATM機器、以及包含觸控顯示器的其他電子裝置。 According to several example embodiments of the above-mentioned alkali-free low-softening point glass, the glass is a substrate for sealing an organic light emitting diode (OLED). According to several example embodiments of the above-mentioned alkali-free low-softening point glass, the glass is used to produce touch displays, including mobile phones, tablets, ATM machines, and other electronic devices including touch displays.
下述實例為上述組成物和方法的說明。 The following examples are illustrations of the above compositions and methods.
測試樣品的製備 Preparation of test samples
依下述製備包括如下表1所示組成的無鹼低軟化點玻璃組成物:
在將表2所示的批次材料加入2公升的塑膠容器之前,先秤重並混合。使用的批次材料具有化學藥劑等級品質。 Before adding the batch materials shown in Table 2 to a 2-liter plastic container, weigh and mix them. The batch materials used are of chemical grade quality.
表2
砂的顆粒尺寸是介於0.045與0.25mm之間。使用轉鼓來混合原料,以產生均質批次且破壞軟質集結體。混合的批次從塑膠容器被轉送至800毫升的鉑銠合金坩堝以進行玻璃熔融。鉑銠合金坩堝被放置在氧化鋁背墊中、並且被載入配備有在1000℃的溫度下操作的MoSi加熱元件的高溫爐中。將爐溫逐漸增加至1100℃,並使鉑銠合金坩堝與其背墊保持在此溫度1至3小時。在將溫度保持在1100℃時,攪拌玻璃以加速氣泡消除與玻璃澄清。接著將熔化的批次材料從鉑銠合金坩堝澆注至不鏽鋼板上以形成玻璃餅材,從而形成玻璃樣品。在玻璃餅材仍然為熱時,將其轉移至退火器、保持在450℃的溫度兩小時、且接著以1℃/min的速率冷卻至400℃。然後,使樣品自然冷卻至室溫(21℃)而達更為一致的測試結果。 The particle size of sand is between 0.045 and 0.25 mm. A drum is used to mix the raw materials to produce homogeneous batches and destroy soft aggregates. The mixed batch is transferred from the plastic container to an 800 ml platinum-rhodium alloy crucible for glass melting. The platinum-rhodium alloy crucible was placed in an alumina backing pad and loaded into a high-temperature furnace equipped with MoSi heating elements operating at a temperature of 1000°C. The furnace temperature is gradually increased to 1100°C, and the platinum-rhodium alloy crucible and its back pad are maintained at this temperature for 1 to 3 hours. While maintaining the temperature at 1100°C, stir the glass to accelerate the elimination of bubbles and the clarification of the glass. Then, the molten batch of material was poured from the platinum-rhodium alloy crucible onto the stainless steel plate to form a glass cake, thereby forming a glass sample. While the glass cake was still hot, it was transferred to an annealer, kept at a temperature of 450°C for two hours, and then cooled to 400°C at a rate of 1°C/min. Then, let the sample cool down to room temperature (21°C) to achieve more consistent test results.
上表1所示組成物的結果顯示於下表3中「實例1」表示的欄位中。表3中所示且以「實例2」至「實例8」表示的其他組成物是以與上述實例1所表示組成物相同的方式來製備。 The results of the composition shown in Table 1 above are shown in the column indicated by "Example 1" in Table 3 below. The other compositions shown in Table 3 and represented by "Example 2" to "Example 8" were prepared in the same manner as the composition represented by Example 1 above.
測量玻璃樣品的物理性質、並將其列於表3中。圖式為表3中的實例1表示的組成物的UV-VIS圖,其中「T%」是穿透百分比,「R%」是反射百分比,而「A」為吸收。 The physical properties of the glass samples were measured and listed in Table 3. The diagram is the UV-VIS diagram of the composition shown in Example 1 in Table 3, where "T%" is the transmission percentage, "R%" is the reflection percentage, and "A" is the absorption.
表3中使用的每一個符號的定義顯示於下:α:熱膨脹係數(CTE)是由ASTM-228膨脹儀測量的從50至300℃的線性維度變化量; β:由下列等式計算的波長810nm處的吸收係數β=-log10[T/(1-R2)]/t,其中β代表吸收係數,T表示通過樣品厚度(t)的光比例,以及R是指反射性比例。 The definition of each symbol used in Table 3 is shown below: α: Coefficient of Thermal Expansion (CTE) is the linear dimensional change from 50 to 300°C measured by ASTM-228 dilatometer; β: Wavelength calculated by the following equation The absorption coefficient at 810 nm β=-log 10 [T/(1-R 2 )]/t, where β represents the absorption coefficient, T represents the proportion of light passing through the thickness (t) of the sample, and R refers to the reflectivity ratio.
雖然已經參考某些實施方式來說明本發明,但本領域的技術人員將了可用在如附申請專利範圍的精神與範圍內的修飾來實施本發明。 Although the present invention has been described with reference to certain embodiments, those skilled in the art will be able to implement the present invention with modifications within the spirit and scope of the attached patent application.
任何空間上的參考用語,例如「上」、「下」、「上方」、「下方」、「之間」、「底部」、「垂直」、「水平」、「傾斜」、「向上」、「向下」、「並排」、「左至右」、「上下」、「左」、「右」、「右至左」、「上至下」、「下至上」、「頂部」、「底部」、「底部-頂部」、「頂部-底部」等,僅是用於說明目的、且不限制上述結構的特定方位或位置。 Reference terms in any space, such as "up", "down", "above", "below", "between", "bottom", "vertical", "horizontal", "tilt", "up", " "Down", "Side by Side", "Left to Right", "Up and Down", "Left", "Right", "Right to Left", "Top to Bottom", "Bottom to Top", "Top", "Bottom" , "Bottom-Top", "Top-Bottom", etc., are for illustrative purposes only and do not limit the specific orientation or position of the above structure.
已經相對於某些實施方式來說明本發明。本領域的技術人員僅在閱讀本揭露後可得知的改進或修飾是在本申請案的精神與範圍內。要理解的是,數種修飾、變化與替代都是包含在前述揭露中,且在某些例子中,將能應用本發明的某些特徵,而不對應使用其他特徵。因此,應知可以與本發明範圍一致的方式來廣泛的解釋所附申請專利範圍。 The present invention has been described with respect to certain embodiments. Improvements or modifications that can be learned by those skilled in the art only after reading this disclosure are within the spirit and scope of this application. It should be understood that several modifications, changes, and substitutions are included in the foregoing disclosure, and in some examples, certain features of the present invention can be applied without corresponding use of other features. Therefore, it should be understood that the scope of the attached patent application can be broadly interpreted in a manner consistent with the scope of the present invention.
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