TWI700969B - Cable-type cable and method of making the same - Google Patents

Cable-type cable and method of making the same Download PDF

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Publication number
TWI700969B
TWI700969B TW107103008A TW107103008A TWI700969B TW I700969 B TWI700969 B TW I700969B TW 107103008 A TW107103008 A TW 107103008A TW 107103008 A TW107103008 A TW 107103008A TW I700969 B TWI700969 B TW I700969B
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strip
layer
structures
flat
manufacturing
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TW107103008A
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Chinese (zh)
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TW201933953A (en
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葉子建
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大陸商鵬鼎控股（深圳）股份有限公司
大陸商宏啟勝精密電子（秦皇島）有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H01B13/222—Sheathing; Armouring; Screening; Applying other protective layers by electro-plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/0009—Details relating to the conductive cores
    • H01B7/0018—Strip or foil conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0853—Juxtaposed parallel wires, fixed to each other without a support layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to a cable-type cable. The cable-type cable includes a plurality of strip-shaped structures, a plurality of conductive layers, and a glue layer. The plurality of conductive layers is coated on the surface of the plurality of strip structures. The glue layer is positioned among the plurality of conductive layers and bonds the plurality of strip-shaped structures. The plurality of strip-shaped structures is arranged in parallel. Each strip-shaped structure includes at least one signal line and an insulating layer. The insulating layer covers the signal line. The present invention also relates to a method of making a cable-type cable.

Description

排線型電纜線及其製作方法 Arrangement type cable wire and manufacturing method thereof

本發明涉及電纜線及其製作領域，尤其涉及一種排線型電纜線及其製作方法。 The invention relates to the field of cables and their production, in particular to a flat-wire cable and a production method thereof.

眾所周知，電纜係用於傳輸電訊號的載體。一種通用型的電纜係同軸電纜。同軸電纜通常包括由絕緣體圍繞的電導線。線和絕緣體被屏蔽件圍繞，並且線、絕緣體和屏蔽件被護套圍繞。另一種通用型的電纜係包括一個或複數例如由金屬箔形成的屏蔽層圍繞的絕緣訊號導體的屏蔽電纜。為了便於電連接屏蔽層，有時在屏蔽層和一個或複數訊號導體的絕緣體之間設置另外的非絕緣導體。 As we all know, cables are used to transmit electrical signals. A general-purpose cable is a coaxial cable. Coaxial cables usually include electrical wires surrounded by an insulator. The wire and the insulator are surrounded by the shield, and the wire, the insulator, and the shield are surrounded by the sheath. Another general type of cable is a shielded cable that includes one or more insulated signal conductors surrounded by a shield layer formed of metal foil, for example. In order to facilitate the electrical connection of the shielding layer, sometimes another non-insulated conductor is arranged between the shielding layer and the insulator of one or more signal conductors.

先前的同軸電纜的尺寸都在毫米數量級。隨著電子通訊產品朝向輕薄短小、微型化方向發展，先前的同軸電纜尺寸已無法滿足市場的變化趨勢。 The size of previous coaxial cables is on the order of millimeters. With the development of electronic communication products in the direction of light, thin, short and miniaturized, the previous coaxial cable size can no longer meet the changing trend of the market.

有鑒於此，有必要提供一種克服上述問題的排線型電纜線及其製作方法。 In view of this, it is necessary to provide a flat-wire cable and a manufacturing method thereof that overcome the above-mentioned problems.

一種排線型電纜線的製作方法，包括步驟：提供一基板，所述基板包括多條訊號線以及包覆所述多條訊號線的一絕緣層；將所述基板分割形成複數條狀結構，每個條狀結構包括至少一條所述訊號線；在所述複數條狀結構表面均包覆一屏蔽層，並在所述屏蔽層上壓覆一膠層使複數條狀結構相互黏接從而形成排線型電纜線。 A method for manufacturing a flat cable wire includes the steps of: providing a substrate including a plurality of signal lines and an insulating layer covering the plurality of signal lines; dividing the substrate into a plurality of strip-like structures, each Each strip structure includes at least one of the signal line; a shielding layer is coated on the surface of the plurality of strip structures, and an adhesive layer is laminated on the shielding layer to bond the plurality of strip structures to each other to form a row In-line cable.

一種排線型電纜線，包括複數條狀結構、複數屏蔽層及膠層，所述複數屏蔽層包覆在所述複數條狀結構表面，所述膠層設置在所述複數屏蔽層之間並黏接所述複數條狀結構，所述複數條狀結構平行排列，每個條狀結構包括至少一條訊號線及絕緣層，所述絕緣層包覆在所述訊號線。 An arranging wire cable includes a plurality of strip-like structures, a plurality of shielding layers, and a glue layer. The plurality of shielding layers are coated on the surface of the plurality of strip-like structures, and the glue layer is arranged between the plurality of shielding layers and adhered. Connecting to the plurality of strip-like structures, the plurality of strip-like structures are arranged in parallel, each of the strip-like structures includes at least one signal line and an insulating layer, and the insulating layer covers the signal line.

與先前技術相比，與先前技術相比，本發明提供的電纜線運用電路板的製作方法製作而成，減小了電纜的尺寸，實現了電纜線製作的微型化。 Compared with the prior art, compared with the prior art, the cable provided by the present invention is manufactured using a circuit board manufacturing method, which reduces the size of the cable and realizes the miniaturization of the cable manufacturing.

110:第一絕緣層 110: first insulating layer

120、220、320、420:訊號線 120, 220, 320, 420: signal line

130:第二絕緣層 130: second insulating layer

140、230、330、430:條狀結構 140, 230, 330, 430: strip structure

150、240:屏蔽層 150, 240: shielding layer

160、250、350、450:膠層 160, 250, 350, 450: glue layer

100:單芯排線形電纜線 100: Single core flat wire cable

210:單面銅箔基板 210: Single-sided copper foil substrate

212:第三絕緣層 212: third insulating layer

213、313、413:覆膠層 213, 313, 413: Overlay

214:第一銅箔層 214: The first copper foil layer

216:第二導電層 216: second conductive layer

200、300、400:雙芯排線形電纜線 200, 300, 400: double-core flat cable

310:雙面銅箔基板 310: Double-sided copper foil substrate

312:第四絕緣層 312: fourth insulating layer

314:第二銅箔層 314: The second copper foil layer

316:第三銅箔層 316: The third copper foil layer

340:圓環套狀結構 340: Ring sleeve structure

410:第五絕緣層 410: fifth insulating layer

440:導電材料層 440: Conductive material layer

圖1係本發明第一實施方式提供的第一絕緣層的剖面示意圖。 FIG. 1 is a schematic cross-sectional view of a first insulating layer provided by the first embodiment of the present invention.

圖2係圖1中第一絕緣層表面鍍上第一導電層後的剖面示意圖。 2 is a schematic cross-sectional view of the surface of the first insulating layer in FIG. 1 after the first conductive layer is plated.

圖3係圖2中的第一絕緣層及第一導電層壓合第二絕緣層後的剖面示意圖。 3 is a schematic cross-sectional view of the first insulating layer and the first conductive layer in FIG. 2 after the second insulating layer is laminated.

圖4係圖3中的第一、第二絕緣層及第一導電層被沖孔形成複數條狀結構後的剖面示意圖。 4 is a schematic cross-sectional view of the first and second insulating layers and the first conductive layer in FIG. 3 after being punched to form a plurality of strip-shaped structures.

圖5係圖4中的複數條狀結構被滾壓後的剖面示意圖。 Fig. 5 is a schematic cross-sectional view of the plurality of strip structures in Fig. 4 after being rolled.

圖6係圖5中的複數條狀結構表面電鍍或化學鍍形成屏蔽層並在屏蔽層表面及複數條狀結構之間壓覆膠層後的剖面示意圖。 6 is a schematic cross-sectional view of the surface of the plurality of strip-shaped structures in FIG. 5 after electroplating or electroless plating to form a shielding layer and laminating an adhesive layer between the surface of the shielding layer and the plurality of strip-shaped structures.

圖7係圖6中的複數條狀結構經模治具熱滾壓後的剖面示意圖。 FIG. 7 is a schematic cross-sectional view of the plurality of strip structures in FIG. 6 after being hot rolled by a mold fixture.

圖8係本發明第二實施方式提供的包括第三絕緣層及第一銅箔層的單面板的剖面示意圖。 8 is a schematic cross-sectional view of a single panel including a third insulating layer and a first copper foil layer provided by the second embodiment of the present invention.

圖9係圖8中的第一銅箔層被蝕刻成第二導電層後的剖面示意圖。 9 is a schematic cross-sectional view of the first copper foil layer in FIG. 8 after being etched into a second conductive layer.

圖10係圖9中的兩個單面板對接覆膠壓合後形成具有雙層導電層的線路板後的剖面示意圖。 FIG. 10 is a schematic cross-sectional view of the two single-sided boards in FIG. 9 after butting, covering and pressing, to form a circuit board with a double-layer conductive layer.

圖11係圖10中的線路板形成複數條狀結構後的剖面示意圖後的剖面示意圖。 11 is a schematic cross-sectional view of the circuit board in FIG. 10 after forming a plurality of strip-shaped structures.

圖12係圖11中的複數條狀結構被滾壓並在複數條狀結構表面電鍍形成電屏蔽層後的剖面示意圖。 12 is a schematic cross-sectional view of the plurality of strip-shaped structures in FIG. 11 after being rolled and electroplating to form an electrical shielding layer on the surface of the plurality of strip-shaped structures.

圖13係圖12中的複數條狀結構之間覆膠並經模治具熱滾壓後的剖面示意圖。 13 is a schematic cross-sectional view of the plurality of strip-shaped structures in FIG. 12 after being covered with glue and hot rolled by a mold fixture.

圖14係本發明第三實施方式提供的包括第四絕緣層及第二、第三銅箔層的雙面板的剖面示意圖。 14 is a schematic cross-sectional view of a double panel including a fourth insulating layer and a second and third copper foil layer provided by the third embodiment of the present invention.

圖15係圖14中的第二銅箔層被蝕刻成第三導電層後的剖面示意圖。 15 is a schematic cross-sectional view of the second copper foil layer in FIG. 14 after being etched into a third conductive layer.

圖16係圖15中的兩個雙面板對接覆膠壓合後形成具有雙層導電層的線路板後的剖面示意圖。 FIG. 16 is a schematic cross-sectional view of the two double-sided boards in FIG. 15 after butting, covering and pressing, to form a circuit board with a double-layer conductive layer.

圖17係圖16中的線路板被沖孔形成複數條狀結構後的剖面示意圖後的剖面示意圖。 17 is a schematic cross-sectional view of the circuit board in FIG. 16 after being punched to form a plurality of strip-shaped structures.

圖18係圖17中的複數條狀結構被滾壓後的剖面示意圖。 Fig. 18 is a schematic cross-sectional view of the plurality of strip structures in Fig. 17 after being rolled.

圖19係圖18中的複數條狀結構之間覆膠並經模治具熱滾壓後的剖面示意圖。 19 is a schematic cross-sectional view of the plurality of strip-shaped structures in FIG. 18 after being coated with glue and hot rolled by a mold fixture.

圖20係本發明第四實施方式提供的第五絕緣層的剖面示意圖。 20 is a schematic cross-sectional view of a fifth insulating layer provided by the fourth embodiment of the present invention.

圖21係圖20中的第五絕緣層表面塗覆導電材料層後的剖面示意圖。 FIG. 21 is a schematic cross-sectional view of the surface of the fifth insulating layer in FIG. 20 after being coated with a conductive material layer.

圖22係圖21中的兩個塗覆有導電材料層的第五絕緣層對接覆膠壓合後形成具有雙層導電層的線路板後的剖面示意圖。 FIG. 22 is a schematic cross-sectional view of the two fifth insulating layers coated with conductive material layers in FIG. 21 after butting and pressing to form a circuit board with a double-layer conductive layer.

圖23係圖22中的線路板被沖孔形成複數條狀結構後的剖面示意圖後的剖面示意圖。 23 is a schematic cross-sectional view of the circuit board in FIG. 22 after being punched to form a plurality of strip-shaped structures.

圖24係圖23中的複數條狀結構表面塗覆導電材料層後的剖面示意圖。 24 is a schematic cross-sectional view of the plurality of strip structures in FIG. 23 after being coated with a conductive material layer.

圖25係圖24中的複數條狀結構被滾壓並在複數條狀結構之間塗覆膠層後的剖面示意圖。 25 is a schematic cross-sectional view of the plurality of strip-shaped structures in FIG. 24 after being rolled and a glue layer is applied between the plurality of strip-shaped structures.

圖26係圖25中的複數條狀結構經模治具熱滾壓後的剖面示意圖。 Fig. 26 is a schematic cross-sectional view of the plurality of strip structures in Fig. 25 after being hot rolled by a mold fixture.

下面將結合附圖，對本發明作進一步的詳細說明。 The present invention will be further described in detail below in conjunction with the accompanying drawings.

本技術方案第一實施方式提供的單芯排線形電纜線100的製作方法包括如下步驟： The manufacturing method of the single-core flat-wire cable 100 provided in the first embodiment of the technical solution includes the following steps:

第一步，請參閱圖1及圖2，提供一第一絕緣層110，在所述第一絕緣層110的一表面電鍍多條訊號線120。本實施方式中，多條訊號線120彼此之間相互平行。 In the first step, referring to FIGS. 1 and 2, a first insulating layer 110 is provided, and a plurality of signal lines 120 are plated on a surface of the first insulating layer 110. In this embodiment, the multiple signal lines 120 are parallel to each other.

在本實施方式中，所述第一絕緣層110的材料可以為聚醯亞胺(Polyimide,PI)、聚乙烯對苯二甲酸乙二醇酯(Polyethylene Terephthalate,PET)或聚萘二甲酸乙二醇酯(Polyethylene naphthalate，PEN)、PP(Prepreg)或ABF(Ajinomoto Build-up film)等，優選為PI或PP。 In this embodiment, the material of the first insulating layer 110 may be polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate. Polyethylene naphthalate (PEN), PP (Prepreg), ABF (Ajinomoto Build-up film), etc., preferably PI or PP.

本實施方式中，任意兩個相鄰訊號線120之間的間隔距離相等。 In this embodiment, the separation distance between any two adjacent signal lines 120 is equal.

在其它實施中，所述多條相平行的訊號線120可以由單面銅箔基板藉由蝕刻的方式製作而成。 In other implementations, the plurality of parallel signal lines 120 may be fabricated from a single-sided copper foil substrate by etching.

第二步，請參閱圖3，提供一第二絕緣層130，將所述第二絕緣層130壓覆在所述第一絕緣層110及所述訊號線120上。 In the second step, referring to FIG. 3, a second insulating layer 130 is provided, and the second insulating layer 130 is press-coated on the first insulating layer 110 and the signal line 120.

第三步，請參閱圖4，將所述第一絕緣層110、所述訊號線120及所述第二絕緣層130分割形成複數條狀結構140。 In the third step, referring to FIG. 4, the first insulating layer 110, the signal line 120 and the second insulating layer 130 are divided to form a plurality of strip-like structures 140.

其中，所述複數條狀結構140均呈長方體狀，其截面形狀為矩形。 Wherein, the plurality of strip-shaped structures 140 are all rectangular parallelepiped shapes, and the cross-sectional shape is rectangular.

本實施例中，所述複數條狀結構140藉由機械鑽孔、沖孔、鐳射銑切或機械銑切中的任意一種方式形成。每個條狀結構140均包含一條訊號線120。每個條狀結構140的形狀大小實質上相同。所述訊號線120位於所述條狀結構140的中心位置。 In this embodiment, the plurality of strip-like structures 140 are formed by any one of mechanical drilling, punching, laser milling or mechanical milling. Each strip structure 140 includes a signal line 120. The shape and size of each strip structure 140 are substantially the same. The signal line 120 is located at the center of the strip structure 140.

第四步，請參閱圖5，壓制所述複數條狀結構140，從而改變所述複數條狀結構140的截面形狀。本實施方式中，所述複數條狀結構140採用熱滾壓或模治具(圖未示)熱壓的方式改變截面形狀(改變後的截面形狀為圓形或橢圓形)。每個所述訊號線120位於相應的所述條狀結構140的中心軸位置。 In the fourth step, referring to FIG. 5, the plurality of strip-shaped structures 140 are pressed, so as to change the cross-sectional shape of the plurality of strip-shaped structures 140. In this embodiment, the plurality of strip-like structures 140 are changed in cross-sectional shape (the changed cross-sectional shape is circular or elliptical) by hot rolling or hot pressing with a mold (not shown). Each of the signal lines 120 is located at the central axis of the corresponding strip structure 140.

第五步，請參閱圖6，在所述複數條狀結構140圓柱外表面鍍上一層屏蔽層150，並在所述複數條狀結構140上壓覆一膠層160使複數條狀結構140相互黏接。 The fifth step, please refer to FIG. 6, a shielding layer 150 is plated on the cylindrical outer surface of the plurality of strip-like structures 140, and an adhesive layer 160 is laminated on the plurality of strip-like structures 140 so that the plurality of strip-like structures 140 are mutually Glued.

其中，所述屏蔽層150包覆所述條狀結構140的圓柱形外表面。所述屏蔽層150藉由化學鍍或電鍍的方式形成。所述膠層160壓覆在所述複數條狀結構140上黏接所述複數條狀結構140，使所述複數條狀結構140平行排列，且使任意兩個相鄰條狀結構140之間的距離實質上相等。 Wherein, the shielding layer 150 covers the cylindrical outer surface of the strip structure 140. The shielding layer 150 is formed by electroless plating or electroplating. The adhesive layer 160 is laminated on the plurality of strip structures 140 to bond the plurality of strip structures 140 so that the plurality of strip structures 140 are arranged in parallel, and between any two adjacent strip structures 140 The distances are essentially equal.

第六步，請參閱圖7，將所述複數條狀結構140壓制作形成單芯排線形電纜線100。 In the sixth step, referring to FIG. 7, the plurality of strip structures 140 are pressed into a single-core flat-wire cable 100.

本實施例中，所述熱滾壓步驟藉由模治具(圖未示)操作完成。 In this embodiment, the hot rolling step is completed by the operation of a mold fixture (not shown).

所述單芯排線形電纜線100包括所述複數條狀結構140，包覆在所述複數條狀結構140表面的所述屏蔽層150以及設置在複數所述屏蔽層150之間並黏接所述複數條狀結構140的所述膠層160。每個條狀結構140包括一個所述訊號線120以及包覆在所述訊號線120週邊的絕緣層。所述訊號線120位於所述條狀結構140的中軸線上。所述屏蔽層150位於所述條狀結構140 的圓柱形外表面。所述複數條狀結構140彼此之間相互平行。所述訊號線120之間也相互平行。 The single-core flat-wire cable 100 includes the plurality of strip-shaped structures 140, the shielding layer 150 covering the surface of the plurality of strip-shaped structures 140, and the shielding layer 150 arranged between the plurality of shielding layers 150 and bonded to each other. The adhesive layer 160 of the plurality of strip structures 140 is described. Each strip structure 140 includes a signal line 120 and an insulating layer covering the periphery of the signal line 120. The signal line 120 is located on the central axis of the strip structure 140. The shielding layer 150 is located in the strip structure 140 The cylindrical outer surface. The plurality of strip structures 140 are parallel to each other. The signal lines 120 are also parallel to each other.

本技術方案第二實施方式提供的雙芯排線形電纜線200的製作方法包括如下步驟： The manufacturing method of the dual-core flat-wire cable 200 provided in the second embodiment of the technical solution includes the following steps:

第一步，請參閱圖8及圖9，提供一單面銅箔基板210，將所述單面銅箔基板210的銅箔層蝕刻成多條訊號線220。本實施方式中，多條訊號線220彼此之間相互平行。 In the first step, referring to FIGS. 8 and 9, a single-sided copper foil substrate 210 is provided, and the copper foil layer of the single-sided copper foil substrate 210 is etched into a plurality of signal lines 220. In this embodiment, the multiple signal lines 220 are parallel to each other.

所述單面銅箔基板210包括一第三絕緣層212以及一第一銅箔層214。所述第一銅箔層214設置在所述第三絕緣層212表面。所述第三絕緣層212的材料結構與所述第一絕緣層110的材料結構相同。本實施方式中，所述第三絕緣層212由所述聚醯亞胺製作而成。 The single-sided copper foil substrate 210 includes a third insulating layer 212 and a first copper foil layer 214. The first copper foil layer 214 is disposed on the surface of the third insulating layer 212. The material structure of the third insulating layer 212 is the same as the material structure of the first insulating layer 110. In this embodiment, the third insulating layer 212 is made of the polyimide.

所述訊號線220在所述第三絕緣層212表面平行設置。任意兩個相鄰訊號線220之間的間隔距離實質上相等。 The signal lines 220 are arranged in parallel on the surface of the third insulating layer 212. The separation distance between any two adjacent signal lines 220 is substantially equal.

在其它實施中，所述多條相平行的訊號線220可以由在絕緣層上電鍍導電線路層的方式製作而成。 In other implementations, the plurality of parallel signal lines 220 may be fabricated by electroplating a conductive circuit layer on an insulating layer.

第二步，請參閱圖10，提供另一相同的蝕刻後的單面銅箔基板210，在兩個所述單面銅箔基板210設置有訊號線220的表面塗覆膠以對接壓合形成兩層所述訊號線220。在兩個所述單面銅箔基板210之間形成有覆膠層213。 The second step, please refer to FIG. 10, provide another identical etched single-sided copper foil substrate 210, and apply glue on the surfaces of the two single-sided copper foil substrates 210 provided with signal lines 220 for butt-bonding and forming Two layers of the signal line 220. An adhesive layer 213 is formed between the two single-sided copper foil substrates 210.

其中，所述第三絕緣層212覆蓋兩層所述訊號線220及所述覆膠層213。兩層所述訊號線220的形狀大小實質上相同，彼此相互平行，位置也相互對應。其中任一層的訊號線220朝另一層訊號線220方向的投影恰好落在另一層訊號線220上，且投影形狀大小與所述訊號線220的形狀大小實質上相一致。 Wherein, the third insulating layer 212 covers two layers of the signal line 220 and the adhesive layer 213. The shape and size of the signal lines 220 on the two layers are substantially the same, parallel to each other, and positions corresponding to each other. The projection of the signal line 220 of any layer toward the signal line 220 of the other layer just falls on the signal line 220 of the other layer, and the projected shape and size are substantially the same as the shape and size of the signal line 220.

第三步，請參閱圖11，將所述第三絕緣層212和兩層所述訊號線220分割形成複數條狀結構230。 In the third step, referring to FIG. 11, the third insulating layer 212 and the two layers of the signal lines 220 are divided to form a plurality of strip-shaped structures 230.

其中，所述複數條狀結構230藉由機械鑽孔、沖孔、鐳射銑切或機械銑切中的任意一種方式形成。每兩條訊號線220被相應製作形成一個條狀結構230。所述兩條訊號線220位於所述條狀結構230的中心位置。每個條狀結構230的形狀大小相同。每個條狀結構230均呈長方體狀，其截面形狀為矩形。 Wherein, the plurality of strip structures 230 are formed by any one of mechanical drilling, punching, laser milling or mechanical milling. Every two signal lines 220 are made correspondingly to form a strip structure 230. The two signal lines 220 are located at the center of the strip structure 230. Each strip structure 230 has the same shape and size. Each strip structure 230 has a rectangular parallelepiped shape, and its cross-sectional shape is rectangular.

第四步，請參閱圖12，壓制所述複數條狀結構230，從而改變所述複數條狀結構230的截面形狀，然後在所述複數條狀結構230表面鍍上一屏蔽層240。 In the fourth step, referring to FIG. 12, the plurality of strip structures 230 are pressed to change the cross-sectional shape of the plurality of strip structures 230, and then a shielding layer 240 is plated on the surface of the plurality of strip structures 230.

本實施方式中，複數條狀結構230採用熱滾壓及模治具(圖未示)熱壓的方式改變截面形狀(改變後的截面形狀為圓形或橢圓形)。每兩個所述訊號線220位於相應所述條狀結構230的中心位置，彼此相互平行。 In this embodiment, the plurality of strip-like structures 230 are changed in cross-sectional shape (the changed cross-sectional shape is circular or elliptical) by hot rolling and hot pressing with a mold tool (not shown). Every two of the signal lines 220 are located at the center of the corresponding strip structure 230 and are parallel to each other.

所述屏蔽層240包覆所述條狀結構230的圓柱形外表面。所述屏蔽層240藉由化學鍍或電鍍的方式生成。 The shielding layer 240 covers the cylindrical outer surface of the strip structure 230. The shielding layer 240 is formed by electroless plating or electroplating.

第五步，請參閱圖13，在所述屏蔽層240上壓覆一膠層250使複數條狀結構230相互黏接並對所述複數條狀結構230進行熱滾壓制作形成雙芯排線形電纜線200。所述複數條狀結構230平行排列。其中，所述熱滾壓步驟藉由模治具(圖未示)操作完成。 The fifth step, please refer to FIG. 13, a glue layer 250 is pressed on the shielding layer 240 to bond the plurality of strip-like structures 230 to each other, and the plurality of strip-like structures 230 are hot-rolled to form a double-core flat line shape Cable line 200. The plurality of strip-shaped structures 230 are arranged in parallel. Wherein, the hot rolling step is completed by the operation of a mold fixture (not shown).

所述雙芯排線形電纜線200包括所述複數條狀結構230、包覆在所述複數條狀結構230表面的所述屏蔽層240以及設置在複數所述屏蔽層240之間並黏接所述複數條狀結構230的膠層250。每個條狀結構230包括兩個平行設置的訊號線220、所述覆膠層213以及包覆在所述訊號線220及所述覆膠層213週邊的第三絕緣層212。所述兩條訊號線218位於所述條狀結構230的中心位置。所述屏蔽層240位於所述第三絕緣層212表面。所述複數條狀結構230彼此之間相互平行。任意兩個相鄰條狀結構230之間的距離相等。相鄰兩個條狀結構230之間的所述訊號線220也相互平行。 The dual-core flat-wire cable 200 includes the plurality of strip-shaped structures 230, the shielding layer 240 covering the surface of the plurality of strip-shaped structures 230, and the shielding layer 240 arranged between the plurality of shielding layers 240 and bonded together. The adhesive layer 250 of a plurality of strip-shaped structures 230 is described. Each strip structure 230 includes two signal lines 220 arranged in parallel, the coating layer 213 and a third insulating layer 212 covering the periphery of the signal lines 220 and the coating layer 213. The two signal lines 218 are located at the center of the strip structure 230. The shielding layer 240 is located on the surface of the third insulating layer 212. The plurality of strip structures 230 are parallel to each other. The distance between any two adjacent strip structures 230 is equal. The signal lines 220 between two adjacent strip structures 230 are also parallel to each other.

本技術方案第三實施方式提供的雙芯排線形電纜線300的製作方法包括如下步驟： The manufacturing method of the dual-core flat-wire cable 300 provided by the third embodiment of the technical solution includes the following steps:

第一步，請參閱圖14及圖15，提供一雙面銅箔基板310，蝕刻所述雙面銅箔基板310的其中一銅箔層為多條相平行的訊號線320。 In the first step, referring to FIGS. 14 and 15, a double-sided copper foil substrate 310 is provided, and one of the copper foil layers of the double-sided copper foil substrate 310 is etched into a plurality of parallel signal lines 320.

所述雙面銅箔基板310包括一第四絕緣層312、一第二銅箔層314以及一第三銅箔層316。所述第二銅箔層314及所述第三銅箔層316分別設置在所述第四絕緣層312的相背的兩個表面上。所述第四絕緣層312的材料結 構與所述第一絕緣層110的材料結構相同。本實施方式中，所述第四絕緣層312由所述聚醯亞胺製作而成。 The double-sided copper foil substrate 310 includes a fourth insulating layer 312, a second copper foil layer 314, and a third copper foil layer 316. The second copper foil layer 314 and the third copper foil layer 316 are respectively disposed on two opposite surfaces of the fourth insulating layer 312. The material structure of the fourth insulating layer 312 The structure is the same as the material structure of the first insulating layer 110. In this embodiment, the fourth insulating layer 312 is made of the polyimide.

所述第二銅箔層314被製作成多條相平行的訊號線320。所述訊號線320在所述第四絕緣層312表面平行設置。任意兩個相鄰訊號線320之間的間隔距離實質上相等。 The second copper foil layer 314 is fabricated into a plurality of parallel signal lines 320. The signal lines 320 are arranged in parallel on the surface of the fourth insulating layer 312. The separation distance between any two adjacent signal lines 320 is substantially equal.

第二步，請參閱圖16，提供另一相同的蝕刻後的雙面銅箔基板310，在兩個所述雙面銅箔基板310設置有所述訊號線320的表面塗覆膠用以對接並壓合，形成兩層所述訊號線320及兩個所述第三銅箔層316。在兩個所述雙面銅箔基板310之間形成有覆膠層313。 In the second step, please refer to FIG. 16 to provide another identical etched double-sided copper foil substrate 310. The surfaces of the two double-sided copper foil substrates 310 provided with the signal lines 320 are coated with glue for docking And pressed together to form two layers of the signal line 320 and two layers of the third copper foil 316. An adhesive layer 313 is formed between the two double-sided copper foil substrates 310.

其中，所述第四絕緣層312覆蓋在所述訊號線320及所述覆膠層313上，所述第三銅箔層316設置在所述第四絕緣層312相背兩個表面上。所述兩層訊號線320形狀大小相同、位置相互對應，彼此相互平行。其中任一層訊號線320朝另一層訊號線320方向的投影恰好落在另一層訊號線320上，且投影形狀大小與另一層訊號線320的形狀大小相一致。 Wherein, the fourth insulating layer 312 covers the signal line 320 and the adhesive layer 313, and the third copper foil layer 316 is disposed on two opposite surfaces of the fourth insulating layer 312. The two layers of signal lines 320 have the same shape and size, have corresponding positions, and are parallel to each other. The projection of the signal line 320 of any layer toward the signal line 320 of the other layer just falls on the signal line 320 of the other layer, and the projection shape and size are consistent with the shape and size of the signal line 320 of the other layer.

第三步，請參閱圖17，將對接壓合後的兩個所述雙面銅箔基板310分割形成複數條狀結構330。 In the third step, referring to FIG. 17, the two double-sided copper foil substrates 310 after butting and pressing are divided into a plurality of strip-shaped structures 330.

其中，所述複數條狀結構330藉由機械鑽孔、沖孔、鐳射銑切或機械銑切中的任意一種方式形成。每兩條訊號線320被相應製作形成一個條狀結構330。所述兩條訊號線320位於所述條狀結構330的中心位置，彼此相互平行。每個條狀結構330的形狀大小實質上相同。每個條狀結構330均呈長 方體狀，其截面形狀為矩形。每個條狀結構330的相背的兩個平行表面設置有所述第三銅箔層316。 Wherein, the plurality of strip-shaped structures 330 are formed by any one of mechanical drilling, punching, laser milling or mechanical milling. Every two signal lines 320 are made correspondingly to form a strip structure 330. The two signal lines 320 are located at the center of the strip structure 330 and are parallel to each other. The shape and size of each strip structure 330 are substantially the same. Each strip structure 330 is long Cuboid shape, its cross-sectional shape is rectangular. The third copper foil layer 316 is provided on two opposite parallel surfaces of each strip structure 330.

第四步，請參閱圖18，壓制所述複數條狀結構330，從而改變所述複數條狀結構330的截面形狀。 In the fourth step, referring to FIG. 18, the plurality of strip-shaped structures 330 are pressed to change the cross-sectional shape of the plurality of strip-shaped structures 330.

本實施方式中，複數條狀結構330採用熱滾壓及模治具(圖未示)熱壓的方式改變截面形狀(改變後的截面形狀為圓形或橢圓形)。在滾壓過程中，所述兩個第三銅箔層316逐漸向內收縮兩兩拼接形成圓環套狀結構340。每個所述圓環套狀結構340包覆所述兩條訊號線320。所述兩條訊號線320位於相應所述條狀結構330的中心軸位置。所述圓環套狀結構340作為用於屏蔽電磁干擾的外層銅箔設置在所述複數條狀結構330的圓條狀外表面，取代了製作過程中電鍍及化學鍍形成屏蔽層的制程。 In this embodiment, the plurality of strip-like structures 330 are changed in cross-sectional shape (the changed cross-sectional shape is circular or elliptical) by hot rolling and hot pressing with a mold tool (not shown). During the rolling process, the two third copper foil layers 316 gradually shrink inward and are joined by two to form a ring-shaped sleeve structure 340. Each of the annular sleeve-like structures 340 covers the two signal lines 320. The two signal lines 320 are located at the central axis of the corresponding strip structure 330. The annular sleeve-like structure 340 is used as an outer layer of copper foil for shielding electromagnetic interference and is provided on the round strip-shaped outer surface of the plurality of strip-like structures 330, replacing the process of forming a shielding layer by electroplating and electroless plating during the manufacturing process.

第五步，請參閱圖19，在所述複數圓環套狀結構340上壓覆一膠層350使複數條狀結構330相互黏接並對所述複數條狀結構330進行熱滾壓制作形成雙芯排線形電纜線300。所述膠層350壓覆在所述複數圓環套狀結構340上並黏接所述複數條狀結構330，使所述複數條狀結構330平行排列。其中，所述熱滾壓步驟藉由模治具(圖未示)的操作完成。 The fifth step, referring to FIG. 19, a glue layer 350 is pressed on the plurality of annular sleeve-shaped structures 340 to bond the plurality of strip-shaped structures 330 to each other, and the plurality of strip-shaped structures 330 are formed by hot rolling. Double-core flat wire cable 300. The glue layer 350 is pressed on the plurality of annular sleeve-shaped structures 340 and bonded to the plurality of strip-shaped structures 330 so that the plurality of strip-shaped structures 330 are arranged in parallel. Wherein, the hot rolling step is completed by the operation of a mold fixture (not shown).

所述雙芯排線形電纜線300包括所述複數條狀結構330以及設置在所述複數條狀結構330之間並黏接所述複數條狀結構330的膠層350。每個條狀結構330包括兩個平行設置的訊號線320、包覆在所述訊號線320週邊的第四絕緣層312與所述覆膠層313以及包覆在所述第四絕緣層312及所述覆膠層313表面的所述圓環套狀結構340。兩個所述訊號線320位於所述條狀結構 330的中心位置。所述複數條狀結構330彼此之間相互平行。任意相鄰兩個條狀結構330之間的距離實質上相等。任意相鄰兩個條狀結構330之間的所述訊號線320也相互平行。 The dual-core flat-wire cable 300 includes the plurality of strip-shaped structures 330 and an adhesive layer 350 arranged between the plurality of strip-shaped structures 330 and bonded to the plurality of strip-shaped structures 330. Each strip structure 330 includes two signal lines 320 arranged in parallel, a fourth insulating layer 312 and the coating layer 313 covering the periphery of the signal line 320, and the fourth insulating layer 312 and The annular sleeve structure 340 on the surface of the rubber layer 313. The two signal lines 320 are located in the strip structure The central location of 330. The plurality of strip structures 330 are parallel to each other. The distance between any two adjacent strip structures 330 is substantially equal. The signal lines 320 between any two adjacent strip structures 330 are also parallel to each other.

本技術方案第四實施方式提供的雙芯排線形電纜線400的製作方法包括如下步驟： The manufacturing method of the dual-core flat cable 400 provided in the fourth embodiment of the technical solution includes the following steps:

第一步，請參閱圖20及圖21，提供一個第五絕緣層410，在所述第五絕緣層410的一表面塗覆多條相平行的訊號線420。 In the first step, referring to FIGS. 20 and 21, a fifth insulating layer 410 is provided, and a plurality of parallel signal lines 420 are coated on one surface of the fifth insulating layer 410.

在本實施方式中，所述第五絕緣層410的材料可以為聚醯亞胺(Polyimide,PI)、聚乙烯對苯二甲酸乙二醇酯(Polyethylene Terephthalate,PET)或聚萘二甲酸乙二醇酯(Polyethylene naphthalate，PEN)、PP(Prepreg)或ABF(Ajinomoto Build-up film)等，優選為PI或PP。 In this embodiment, the material of the fifth insulating layer 410 may be polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate. Polyethylene naphthalate (PEN), PP (Prepreg), ABF (Ajinomoto Build-up film), etc., preferably PI or PP.

所述訊號線420的材料為金屬。 The material of the signal line 420 is metal.

所述多條訊號線420在所述第五絕緣層410表面平行設置。任意兩個相鄰訊號線420之間的間隔距離相等。 The plurality of signal lines 420 are arranged in parallel on the surface of the fifth insulating layer 410. The separation distance between any two adjacent signal lines 420 is equal.

第二步，請參閱圖22，提供兩個相同塗覆訊號線420後的所述第五絕緣層410，在兩個所述第五絕緣層410表面覆膠，在兩個所述第五絕緣層410塗覆有所述訊號線420的表面塗覆膠以對接並壓合形成雙層所述訊號線420。在兩個所述第五絕緣層410之間形成有覆膠層413。 In the second step, please refer to FIG. 22. Two fifth insulating layers 410 are provided after the same coating of the signal line 420. The surfaces of the two fifth insulating layers 410 are coated with glue, and the two fifth insulating layers 410 are coated with glue. The surface of the layer 410 coated with the signal line 420 is coated with glue to connect and press to form a double layer of the signal line 420. A coating layer 413 is formed between the two fifth insulating layers 410.

其中，所述第五絕緣層410包覆在所述訊號線420上。兩層所述訊號線420形狀大小相同、位置相互對應，彼此相互平行。其中任一層訊號線 420朝另一層訊號線420方向的投影恰好落在另一層訊號線420上，且投影形狀大小與所述訊號線420的形狀大小相一致。 Wherein, the fifth insulating layer 410 is coated on the signal line 420. The signal lines 420 of the two layers have the same shape and size, corresponding positions, and parallel to each other. Any signal line The projection of the 420 toward the signal line 420 of another layer just falls on the signal line 420 of the other layer, and the projected shape and size are consistent with the shape and size of the signal line 420.

第三步，請參閱圖23，將所述第五絕緣層410、雙層所述訊號線420製作形成複數條狀結構430。 In the third step, referring to FIG. 23, the fifth insulating layer 410 and the double-layer signal line 420 are fabricated to form a plurality of strip-shaped structures 430.

其中，所述複數條狀結構430藉由機械鑽孔、沖孔、鐳射銑切或機械銑切中的任意一種方式形成。每兩條訊號線420被相應製作形成一個條狀結構430。所述訊號線420位於所述條狀結構430的中心位置。每個條狀結構430的形狀大小相同。每個條狀結構430均呈長方體狀。 Wherein, the plurality of strip-shaped structures 430 are formed by any one of mechanical drilling, punching, laser milling or mechanical milling. Every two signal lines 420 are made to form a strip structure 430 accordingly. The signal line 420 is located at the center of the strip structure 430. Each strip structure 430 has the same shape and size. Each strip structure 430 has a rectangular parallelepiped shape.

第四步，請參閱圖24，在所述複數條狀結構430表面塗覆導電材料層440，使所述導電材料層440包覆所述複數條狀結構430。本實施方式中，所述導電材料層440的材料為導電聚醯亞胺。 In the fourth step, referring to FIG. 24, a conductive material layer 440 is coated on the surface of the plurality of strip structures 430 so that the conductive material layer 440 covers the plurality of strip structures 430. In this embodiment, the material of the conductive material layer 440 is conductive polyimide.

第五步，請參閱圖25，壓制所述複數條狀結構430，從而改變所述複數條狀結構430的截面形狀，並在所述複數條狀結構430上壓覆一膠層450使複數條狀結構430相互黏接。本實施方式中，複數條狀結構430採用熱滾壓及模治具(圖未示)熱壓的方式改變截面形狀(改變後的截面形狀為圓形或橢圓形)。每兩個所述訊號線420位於相應所述條狀結構430的中心位置。 The fifth step, please refer to FIG. 25, pressing the plurality of strip-shaped structures 430, thereby changing the cross-sectional shape of the plurality of strip-shaped structures 430, and pressing a glue layer 450 on the plurality of strip-shaped structures 430 to make a plurality of strips The shaped structures 430 are bonded to each other. In this embodiment, the plurality of strip-like structures 430 are changed in cross-sectional shape (the changed cross-sectional shape is a circle or an ellipse) by hot rolling and hot pressing with a mold tool (not shown). Every two of the signal lines 420 are located at the center of the corresponding strip structure 430.

其中，所述膠層450壓覆在所述導電材料層440上並黏接所述複數條狀結構430，使所述複數條狀結構430平行排列。 Wherein, the adhesive layer 450 is laminated on the conductive material layer 440 and adheres to the plurality of strip structures 430 so that the plurality of strip structures 430 are arranged in parallel.

第六步，請參閱圖26，對所述複數條狀結構430進行熱滾壓制作形成雙芯排線形電纜線400。其中，所述熱滾壓步驟藉由模治具(圖未示)操作完成。 In the sixth step, referring to FIG. 26, the plurality of strip-shaped structures 430 are hot-rolled to form a dual-core flat-wire cable 400. Wherein, the hot rolling step is completed by the operation of a mold fixture (not shown).

所述雙芯排線形電纜線400包括所述複數條狀結構430，包覆在所述複數條狀結構430表面的所述導電材料層440，以及設置在所述導電材料層440之間並黏接所述複數條狀結構430的膠層450。每個條狀結構430包括兩個所述訊號線420以及包覆在兩個所述訊號線420週邊的所述第五絕緣層410與所述覆膠層413。所述訊號線420位於所述條狀結構430的中心位置。所述膠層450位於所述導電材料層440表面。所述複數條狀結構430彼此之間相互平行。每個條狀結構430內的所述訊號線420也相互平行。 The dual-core flat-wire cable 400 includes the plurality of strip-shaped structures 430, the conductive material layer 440 covering the surface of the plurality of strip-shaped structures 430, and the conductive material layer 440 arranged between and bonded Connect the adhesive layer 450 of the plurality of strip structures 430. Each strip structure 430 includes two signal lines 420 and the fifth insulating layer 410 and the adhesive layer 413 covering the periphery of the two signal lines 420. The signal line 420 is located at the center of the strip structure 430. The glue layer 450 is located on the surface of the conductive material layer 440. The plurality of strip structures 430 are parallel to each other. The signal lines 420 in each strip structure 430 are also parallel to each other.

可以理解地，在其它實施方式中，所述訊號線120、220、320、420也可以以非平行或者非等間距的方式設置製作排線型電纜線。 It can be understood that, in other embodiments, the signal lines 120, 220, 320, 420 may also be arranged in a non-parallel or non-equal spaced manner to make a flat cable line.

可以理解地，在其它實施方式中，每個條狀結構內包含的所述訊號線數量可以根據實際需要進行調整，三個、四個或者更多。 It is understandable that in other embodiments, the number of the signal lines included in each strip structure can be adjusted according to actual needs, three, four or more.

與先前技術相比，本發明提供的電纜線運用電路板的製作方法製作而成，減小了電纜的尺寸，實現了電纜線製作的微型化。 Compared with the prior art, the cable provided by the present invention is manufactured by using a circuit board manufacturing method, which reduces the size of the cable and realizes the miniaturization of cable manufacturing.

可以理解的係，對於本領域具有通常知識者來說，可以根據本發明的技術構思做出其他各種相應的改變與變形，而所有這些改變與變形都應屬於本發明的保護範圍。 It is understandable that for those with ordinary knowledge in the field, various other corresponding changes and modifications can be made according to the technical concept of the present invention, and all these changes and modifications should fall within the protection scope of the present invention.

120:訊號線 120: signal line

150:鍍層 150: Plating

160:膠層 160: Glue layer

100:單芯排線形電纜線 100: Single core flat wire cable

Claims (7)

一種排線型電纜線的製作方法，包括步驟：提供一基板，所述基板包括多條訊號線以及包覆所述多條訊號線的一絕緣層；將所述基板分割形成複數條狀結構，每個條狀結構包括至少一條所述訊號線；在所述複數條狀結構表面均包覆一屏蔽層，並在所述屏蔽層上壓覆一膠層使複數條狀結構相互黏接從而形成排線型電纜線。 A method for manufacturing a flat cable line includes the steps of: providing a substrate including a plurality of signal lines and an insulating layer covering the plurality of signal lines; dividing the substrate into a plurality of strip-like structures, each Each strip structure includes at least one of the signal line; a shielding layer is coated on the surface of the plurality of strip structures, and an adhesive layer is laminated on the shielding layer to bond the plurality of strip structures to each other to form a row In-line cable. 如請求項1所述的排線型電纜線的製作方法，其中，在所述複數條狀結構表面包覆屏蔽層步驟之前，所述條狀結構的截面形狀由長方形製作成為圓形或橢圓形。 The method for manufacturing a flat-wire cable according to claim 1, wherein, before the step of covering the surface of the plurality of strip-shaped structures with a shielding layer, the cross-sectional shape of the strip-shaped structure is made from a rectangle to a circle or an ellipse. 如請求項1所述的排線型電纜線的製作方法，其中，所述屏蔽層採用化學鍍、電鍍和塗覆導電材料層中的任意一種方式製作而成。 The method for manufacturing a flat-wire cable according to claim 1, wherein the shielding layer is manufactured by any one of electroless plating, electroplating, and coating of a conductive material layer. 如請求項1所述的排線型電纜線的製作方法，其中，所述屏蔽層藉由在每個條狀結構表面設置相互間隔的至少兩個銅箔層並以熱滾壓使所述至少兩個銅箔層向內收縮拼接的方式形成。 The method for manufacturing a flat-wire cable according to claim 1, wherein the shielding layer is formed by arranging at least two copper foil layers spaced apart from each other on the surface of each strip structure and hot rolling to make the at least two Each copper foil layer is formed by shrinking and splicing inward. 如請求項1所述的排線型電纜線的製作方法，其中，在所述屏蔽層上壓覆一膠層使複數條狀結構相互黏接的步驟之後還包括步驟：對所述複數條狀結構進行熱壓製作。 The method for manufacturing a flat-wire cable according to claim 1, wherein after the step of pressing an adhesive layer on the shielding layer to bond the plurality of strip-like structures to each other, the method further includes the step of: Perform hot pressing. 如請求項5所述的排線型電纜線的製作方法，其中，在對所述複數條狀結構進行熱壓製作形成排線型電纜線步驟中，所述排線型電纜線藉由模治具熱滾壓的方式形成。 The method for manufacturing a flat-wire cable according to claim 5, wherein, in the step of hot-pressing the plurality of strip-shaped structures to form a flat-wire cable, the flat-wire cable is hot rolled by a mold fixture Formed by pressure. 如請求項1所述的排線型電纜線的製作方法，其中，在將所述絕緣層及所述多條訊號線製作形成複數條狀結構步驟中，所述複數條狀結構採用機械鑽孔、沖孔、鐳射銑切或機械銑切中的任意一種方式形成。 The method for manufacturing a flat cable wire according to claim 1, wherein, in the step of manufacturing the insulating layer and the plurality of signal lines to form a plurality of strip-shaped structures, the plurality of strip-shaped structures adopt mechanical drilling, It is formed by any one of punching, laser milling or mechanical milling.
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