TWI699537B - Current sensing module and current sensing structure thereof - Google Patents

Current sensing module and current sensing structure thereof Download PDF

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TWI699537B
TWI699537B TW108117878A TW108117878A TWI699537B TW I699537 B TWI699537 B TW I699537B TW 108117878 A TW108117878 A TW 108117878A TW 108117878 A TW108117878 A TW 108117878A TW I699537 B TWI699537 B TW I699537B
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current sensing
chamfer
predetermined
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TW202043783A (en
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林繼謙
閻柏均
蕭家祥
李國榮
江在民
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威剛科技股份有限公司
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Abstract

The present invention provides a current sensing module and a current sensing structure thereof. The current sensing structure includes a ring body portion, a first end portion, a second end portion, and a groove. The first end portion is connected with one end of the ring body portion, and the first end portion includes a first chamfer. The second end portion is connected with the other end of the ring body portion, and the second end portion includes a second chamfer. The groove is located between the first end portion and the second end portion.

Description

電流感測模組及其電流感測結構Current sensing module and current sensing structure

本發明涉及一種感測模組及其感測結構,特別是涉及一種電流感測模組及其電流感測結構。The invention relates to a sensing module and a sensing structure thereof, in particular to a current sensing module and a current sensing structure thereof.

首先,隨著節能減碳之全球性議題,各國對於新能源車的品質及性能的要求也越來越高,而為了因應不同法規及不同客群的需求,各種零部件的規格需求也越來越高。First of all, with the global issue of energy saving and carbon reduction, countries have increasingly higher requirements for the quality and performance of new energy vehicles. In order to meet the needs of different regulations and different customer groups, the specifications for various parts are also increasing. Higher.

但是,隨著電動車性能的提高,代表著電動車驅動器所輸出的電壓及/或電流也提高,故衍生了控制電路隔離議題與高電流感測範圍需求的問題。現有技術的電流感測結構的材質多為氧化鐵體,其除了電流感測範圍不高外也容易脆裂。舉例來說,現有技術的電流感測結構,其最高量測範圍僅約200Arms。However, as the performance of the electric vehicle increases, it means that the voltage and/or current output by the electric vehicle driver also increases, which leads to the issue of control circuit isolation and the need for high current sensing range. The current sensing structure in the prior art is mostly made of iron oxide, which is prone to brittle fracture in addition to the low current sensing range. For example, the current sensing structure of the prior art has a maximum measurement range of only about 200 Arms.

故,如何通過結構設計的改良,來提升電流感測結構的量測範圍,並提高電流感測結構的得可靠度,以克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Therefore, how to improve the measurement range of the current sensing structure and improve the reliability of the current sensing structure through the improvement of the structure design to overcome the above-mentioned shortcomings has become one of the important issues to be solved by this business. .

本發明所要解決的技術問題在於,針對現有技術的不足提供一種電流感測模組及其電流感測結構。The technical problem to be solved by the present invention is to provide a current sensing module and a current sensing structure for the shortcomings of the prior art.

為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種電流感測結構,其包括:一環形本體部、一第一端部、一第二端部以及一開槽。所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角。所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角。所述開槽位於所述第一端部與所述第二端部之間。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a current sensing structure, which includes: a ring-shaped body portion, a first end portion, a second end portion, and a slot. The first end is connected to one end of the annular body, and the first end has a first chamfer. The second end is connected to the other end of the annular body, and the second end has a second chamfer. The slot is located between the first end and the second end.

為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種電流感測模組,其包括:一載板、一電流感測結構以及一電流感測元件。所述電流感測結構設置在所述載板上,所述電流感測結構包括一環形本體部、一第一端部、一第二端部以及一開槽,其中,所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角,所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角,所述開槽位於所述第一端部與所述第二端部之間。所述電流感測元件設置在所述載板上且耦接於所述載板,且所述電流感測元件設置在所述開槽中。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a current sensing module, which includes: a carrier board, a current sensing structure, and a current sensing element. The current sensing structure is arranged on the carrier board, and the current sensing structure includes an annular body portion, a first end portion, a second end portion, and a slot, wherein the first end portion Is connected to one end of the ring body, and the first end has a first chamfer, the second end is connected to the other end of the ring body, and the second end The upper has a second chamfer, and the slot is located between the first end and the second end. The current sensing element is disposed on the carrier board and coupled to the carrier board, and the current sensing element is disposed in the slot.

本發明的其中一有益效果在於,本發明所提供的電流感測模組及其電流感測結構,其能通過“所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角”以及“所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角”的技術方案,以提高氣隙磁通密度的均勻性,並提高電流值的量測範圍。One of the beneficial effects of the present invention is that the current sensing module and the current sensing structure provided by the present invention can be connected to one end of the ring-shaped body through the "first end, and the The first end has a first chamfer" and "the second end is connected to the other end of the annular body, and the second end has a second chamfer", In order to improve the uniformity of the air gap magnetic flux density, and increase the measurement range of the current value.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“電流感測模組及其電流感測結構”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following are specific examples to illustrate the implementation of the “current sensing module and its current sensing structure” disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. . The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[第一實施例][First Embodiment]

首先,請參閱圖1至圖4所示,圖1及圖2分別為本發明第一實施例的電流感測模組的立體組合示意圖,圖3及圖4分別為本發明第一實施例的電流感測模組的立體分解示意圖,本發明提供一種電流感測模組U及其電流感測結構2。舉例來說,本發明實施例所提供的電流感測模組U及其電流感測結構2優選可應用於電動車的驅動器,然本發明不以此為限。另外,須說明的是,第一實施例將先介紹電流感測模組U的主要架構,後續實施例再行介紹電流感測結構2的構造。First, please refer to Figures 1 to 4. Figures 1 and 2 are respectively a three-dimensional assembly diagram of the current sensing module according to the first embodiment of the present invention, and Figures 3 and 4 are respectively the three-dimensional assembly diagrams of the first embodiment of the present invention. A three-dimensional exploded schematic diagram of a current sensing module. The present invention provides a current sensing module U and a current sensing structure 2 thereof. For example, the current sensing module U and the current sensing structure 2 provided by the embodiment of the present invention can preferably be applied to the driver of an electric vehicle, but the present invention is not limited thereto. In addition, it should be noted that the first embodiment will first introduce the main structure of the current sensing module U, and subsequent embodiments will introduce the structure of the current sensing structure 2.

承上述,請復參閱圖1至圖4所示,電流感測模組U包括:一載板1、一電流感測結構2以及一電流感測元件3。電流感測結構2及電流感測元件3可設置在載板1上,且電流感測元件3可耦接於載板1。另外,須說明的是,雖然圖式中的電流感測結構2及電流感測元件3是設置在相同的載板1上,但是,須說明的是,在其他實施方式中,電流感測結構2以及電流感測元件3可以設置在不同的載板1上。換句話說,電流感測結構2可以固定在另外一載板(圖中未示出)。In view of the above, please refer to FIGS. 1 to 4 again. The current sensing module U includes: a carrier board 1, a current sensing structure 2 and a current sensing element 3. The current sensing structure 2 and the current sensing element 3 can be disposed on the carrier board 1, and the current sensing element 3 can be coupled to the carrier board 1. In addition, it should be noted that although the current sensing structure 2 and the current sensing element 3 in the drawing are arranged on the same carrier board 1, it should be noted that in other embodiments, the current sensing structure 2 and the current sensing element 3 can be arranged on different carrier boards 1. In other words, the current sensing structure 2 can be fixed on another carrier board (not shown in the figure).

承上述,舉例來說,載板1可為一印刷電路板(Printed circuit board,PCB),電流感測結構2可為一C型磁環,電流感測元件3可為一霍爾電流感測元件(Hall Current Sensor)。進一步來說,電流感測結構2的材質可為一導磁材料、矽鋼或氧化鐵體,然本發明不以此為限。此外,電流感測結構2具有一開槽24(或可稱氣隙(Air gap)),電流感測元件3可設置在開槽24中,以感應電流值大小。此外,電流感測元件3是與電流感測結構2彼此分離的。In view of the above, for example, the carrier 1 can be a printed circuit board (PCB), the current sensing structure 2 can be a C-shaped magnetic ring, and the current sensing element 3 can be a Hall current sensing Components (Hall Current Sensor). Furthermore, the material of the current sensing structure 2 can be a magnetic material, silicon steel or iron oxide, but the invention is not limited thereto. In addition, the current sensing structure 2 has a slot 24 (or air gap), and the current sensing element 3 can be disposed in the slot 24 to sense the magnitude of the current. In addition, the current sensing element 3 and the current sensing structure 2 are separated from each other.

[第二實施例][Second Embodiment]

首先,請參閱圖5至圖7所示,圖5為本發明第二實施例的電流感測結構的立體示意圖,圖6為本發明第二實施例的電流感測結構的前視示意圖,圖7為圖6的VII部分的局部放大示意圖。以下將進一步說明電流感測結構2的構造。詳細來說,電流感測結構2可包括一環形本體部21、一第一端部22、一第二端部23以及一開槽24,此外,環形本體部21可圍繞出一感測空間210,且開槽24可位於第一端部22與第二端部23之間。進一步來說,第一端部22可連接於環形本體部21的其中一端,且第一端部22上可具有一第一倒角221(chamfer),第二端部23可連接於環形本體部21的另外一端,且第二端部23上具有一第二倒角231。此外,環形本體部21可包括一環形外表面211以及一對應於環形外表面211的環形內表面212,第一端部22可包括一連接於環形外表面211及環形內表面212之間的第一端面220,第二端部23可包括一連接於環形外表面211及環形內表面212之間的第二端面230。第一倒角221可位於第一端面220與環形內表面212之間,且第二倒角231可位於第二端面230與環形內表面212之間,即,第一倒角221及第二倒角231可鄰近於感測空間210。此外,舉例來說,第一倒角221及/或第二倒角231可為一倒斜角或倒圓角,然本發明不以此為限。First, please refer to FIGS. 5-7. FIG. 5 is a three-dimensional schematic diagram of a current sensing structure according to a second embodiment of the present invention, and FIG. 6 is a front schematic view of a current sensing structure according to the second embodiment of the present invention. 7 is a partial enlarged schematic diagram of part VII in FIG. 6. The structure of the current sensing structure 2 will be further explained below. In detail, the current sensing structure 2 can include a ring-shaped body portion 21, a first end portion 22, a second end portion 23, and a slot 24. In addition, the ring-shaped body portion 21 can surround a sensing space 210. , And the slot 24 can be located between the first end 22 and the second end 23. Furthermore, the first end portion 22 can be connected to one end of the annular body portion 21, and the first end portion 22 can have a first chamfer 221 (chamfer), and the second end portion 23 can be connected to the annular body portion. The other end of 21 and the second end 23 has a second chamfer 231. In addition, the annular body portion 21 may include an annular outer surface 211 and an annular inner surface 212 corresponding to the annular outer surface 211, and the first end 22 may include a first end connected between the annular outer surface 211 and the annular inner surface 212. One end surface 220, the second end portion 23 may include a second end surface 230 connected between the annular outer surface 211 and the annular inner surface 212. The first chamfer 221 may be located between the first end surface 220 and the annular inner surface 212, and the second chamfer 231 may be located between the second end surface 230 and the annular inner surface 212, that is, the first chamfer 221 and the second chamfer The corner 231 may be adjacent to the sensing space 210. In addition, for example, the first chamfer 221 and/or the second chamfer 231 may be a chamfered corner or a rounded corner, but the invention is not limited thereto.

承上述,請復參閱圖5至圖7所示,通過第一倒角221及第二倒角231的設置,第一端面220與環形內表面212之間可具有一第一連接面2210,且第二端面230與環形內表面212之間具有一第二連接面2310。進一步來說,當第一倒角221及第二倒角231為倒斜角時,第一連接面2210及第二連接面2310為一斜面,當第一倒角221及第二倒角231為倒圓角時,第一連接面2210及第二連接面2310為一弧面。另外,須說明的是,本發明實施例是以倒斜角作為舉例說明,但是,在其他實施態樣中,第一倒角221及第二倒角231也可以為倒圓角。In view of the above, please refer to FIGS. 5 to 7 again. Through the arrangement of the first chamfer 221 and the second chamfer 231, a first connecting surface 2210 can be formed between the first end surface 220 and the annular inner surface 212, and A second connecting surface 2310 is formed between the second end surface 230 and the annular inner surface 212. Furthermore, when the first chamfer 221 and the second chamfer 231 are chamfers, the first connecting surface 2210 and the second connecting surface 2310 are inclined surfaces, and when the first chamfer 221 and the second chamfer 231 are When rounding the corners, the first connecting surface 2210 and the second connecting surface 2310 are curved surfaces. In addition, it should be noted that the embodiment of the present invention uses a chamfer as an example. However, in other embodiments, the first chamfer 221 and the second chamfer 231 may also be rounded corners.

承上述,請復參閱圖5至圖7所示,以本發明實施例而言,第一端部22上還可具有一對應於第一倒角221的第三倒角222,且第二端部23上可具有一對應於第二倒角231的第四倒角232。第三倒角222可位於第一端面220與環形外表面211之間,且第四倒角232可位於第二端面230與環形外表面211之間。此外,舉例來說,第三倒角222及/或第四倒角232可為一倒斜角或倒圓角,然本發明不以此為限。進一步來說,通過第三倒角222及第四倒角232的設置,第一端面220與環形外表面211之間可具有一第三連接面2220,且第二端面230與環形外表面211之間具有一第四連接面2320。更一步來說,當第三倒角222及第四倒角232為倒斜角時,第三連接面2220及第四連接面2320為一斜面,當第三倒角222及第四倒角232為倒圓角時,第三連接面2220及第四連接面2320為一弧面。另外,須說明的是,本發明實施例是以倒斜角作為舉例說明,但是,在其他實施態樣中,第三倒角222及第四倒角232也可以為倒圓角。此外,值得說明的是,第一端面220可位於第一連接面2210及第三連接面2220之間,且第二端面230可位於第二連接面2310及第四連接面2320之間。In view of the above, please refer to FIGS. 5 to 7 again. According to the embodiment of the present invention, the first end 22 may also have a third chamfer 222 corresponding to the first chamfer 221, and the second end The portion 23 may have a fourth chamfer 232 corresponding to the second chamfer 231. The third chamfer 222 may be located between the first end surface 220 and the annular outer surface 211, and the fourth chamfer 232 may be located between the second end surface 230 and the annular outer surface 211. In addition, for example, the third chamfer 222 and/or the fourth chamfer 232 may be a chamfered corner or a rounded corner, but the invention is not limited thereto. Furthermore, by providing the third chamfer 222 and the fourth chamfer 232, a third connecting surface 2220 can be formed between the first end surface 220 and the annular outer surface 211, and the second end surface 230 and the annular outer surface 211 There is a fourth connecting surface 2320 therebetween. More specifically, when the third chamfer 222 and the fourth chamfer 232 are chamfers, the third connection surface 2220 and the fourth connection surface 2320 are inclined surfaces. When the third chamfer 222 and the fourth chamfer 232 are When the corners are rounded, the third connecting surface 2220 and the fourth connecting surface 2320 are curved surfaces. In addition, it should be noted that the embodiment of the present invention uses a chamfer as an example. However, in other embodiments, the third chamfer 222 and the fourth chamfer 232 may also be rounded corners. In addition, it is worth noting that the first end surface 220 may be located between the first connection surface 2210 and the third connection surface 2220, and the second end surface 230 may be located between the second connection surface 2310 and the fourth connection surface 2320.

承上述,請復參閱圖5至圖7所示,環形本體部21可具有一預定外徑D、一預定內徑d以及一預定寬度B,預定寬度B可為環形本體部21的寬度,即,預定外徑D與預定內徑d之間的差值的二分之一。此外,舉例來說,預定外徑D大於9毫米(millimeter,mm),預定內徑d可大於5毫米,預定寬度B可大於2毫米,環形本體部21的一截面面積可大於25平方毫米,開槽24可具有一預定間隙G,預定間隙G可介於3毫米至5毫米之間,然本發明不以此為限。另外,在其他實施態樣中,預定寬度B的尺寸可介於5毫米至10毫米之間,然本發明不以此為限。In view of the above, please refer to FIGS. 5 to 7 again. The annular body portion 21 may have a predetermined outer diameter D, a predetermined inner diameter d, and a predetermined width B. The predetermined width B may be the width of the annular body portion 21, namely , Half of the difference between the predetermined outer diameter D and the predetermined inner diameter d. In addition, for example, the predetermined outer diameter D may be greater than 9 millimeters (millimeter, mm), the predetermined inner diameter d may be greater than 5 mm, the predetermined width B may be greater than 2 mm, and a cross-sectional area of the annular body portion 21 may be greater than 25 square millimeters, The slot 24 may have a predetermined gap G, and the predetermined gap G may be between 3 mm and 5 mm, but the present invention is not limited thereto. In addition, in other embodiments, the size of the predetermined width B may be between 5 mm and 10 mm, but the invention is not limited thereto.

承上述,第一倒角221可具有一第一預定邊寬L1及一第二預定邊寬L2,第二倒角231可具有一第三預定邊寬L3及一第四預定邊寬L4。進一步來說,本發明的第一倒角221及第二倒角231以倒斜角作為舉例說明,且倒斜角的角度可為45度,所以,第一預定邊寬L1的尺寸與第二預定邊寬L2的尺寸可彼此相同,且第三預定邊寬L3的尺寸與第四預定邊寬L4的尺寸可彼此相同,然本發明不以此為限。在其他實施態樣中,倒斜角的角度可介於4.76度至85度之間,又或者是倒斜角的角度也可以是介於30度至60度之間,因此,第一預定邊寬L1的尺寸與第二預定邊寬L2的尺寸可彼此相異,且第三預定邊寬L3的尺寸與第四預定邊寬L4的尺寸可彼此相異。進一步來說,第一預定邊寬L1及第二預定邊寬L2的尺寸可小於預定寬度B的尺寸,且第三預定邊寬L3及第四預定邊寬的尺寸可小於預定寬度B的尺寸。舉例來說,第一預定邊寬L1的尺寸可介於預定寬度B的尺寸的5%至60%之間,且第三預定邊寬L3的尺寸可介於預定寬度B的尺寸的5%至60%之間。此外,第二預定邊寬L2的尺寸可介於預定寬度B的尺寸的5%至60%之間,且第四預定邊寬L4的尺寸可介於預定寬度B的尺寸的5%至60%之間。然而,上述所舉的例子只是其中一可行的實施方式而並非用以限定本發明。In view of the above, the first chamfer 221 may have a first predetermined side width L1 and a second predetermined side width L2, and the second chamfer 231 may have a third predetermined side width L3 and a fourth predetermined side width L4. Furthermore, the first chamfer 221 and the second chamfer 231 of the present invention take the chamfer angle as an example, and the angle of the chamfer angle may be 45 degrees. Therefore, the size of the first predetermined side width L1 is the same as that of the second chamfer. The size of the predetermined side width L2 may be the same as each other, and the size of the third predetermined side width L3 and the size of the fourth predetermined side width L4 may be the same as each other, but the present invention is not limited thereto. In other embodiments, the angle of the chamfer angle may be between 4.76 degrees and 85 degrees, or the angle of the chamfer angle may also be between 30 degrees and 60 degrees. Therefore, the first predetermined side The size of the width L1 and the size of the second predetermined side width L2 may be different from each other, and the size of the third predetermined side width L3 and the size of the fourth predetermined side width L4 may be different from each other. Furthermore, the size of the first predetermined side width L1 and the second predetermined side width L2 may be smaller than the size of the predetermined width B, and the size of the third predetermined side width L3 and the fourth predetermined side width may be smaller than the size of the predetermined width B. For example, the size of the first predetermined side width L1 may be between 5% and 60% of the size of the predetermined width B, and the size of the third predetermined side width L3 may be between 5% and 60% of the size of the predetermined width B. Between 60%. In addition, the size of the second predetermined side width L2 may be between 5% and 60% of the size of the predetermined width B, and the size of the fourth predetermined side width L4 may be between 5% and 60% of the size of the predetermined width B between. However, the above-mentioned example is only one of the feasible implementations and is not intended to limit the present invention.

承上述,進一步來說,第三倒角222可具有一第五預定邊寬L5及一第六預定邊寬L6,第四倒角232可具有一第七預定邊寬L7及一第八預定邊寬L8。本發明的第三倒角222及第四倒角232以倒斜角作為舉例說明,且倒斜角的角度可為45度,所以,第五預定邊寬L5的尺寸與第六預定邊寬L6的尺寸可彼此相同,且第七預定邊寬L7的尺寸與第八預定邊寬L8的尺寸可彼此相同,然本發明不以此為限。在其他實施態樣中,倒斜角的角度可介於0度至90度之間,又或者是倒斜角的角度也可以是介於30度至60度之間,因此,第五預定邊寬L5的尺寸與第六預定邊寬L6的尺寸可彼此相異,且第七預定邊寬L7的尺寸與第八預定邊寬L8的尺寸可彼此相異。進一步來說,第五預定邊寬L5及第六預定邊寬L6的尺寸可小於預定寬度B的尺寸,且第七預定邊寬L7及第八預定邊寬的尺寸可小於預定寬度B的尺寸。舉例來說,第五預定邊寬L5的尺寸可小於預定寬度B的尺寸的50%,且第七預定邊寬L7的尺寸可小於預定寬度B的尺寸的50%。此外,第六預定邊寬L6的尺寸可小於預定寬度B的尺寸的50%,且第八預定邊寬L8的尺寸可小於預定寬度B的尺寸的50%。更進一步來說,第五預定邊寬L5的尺寸可小於預定寬度B的尺寸的30%,且第七預定邊寬L7的尺寸可小於預定寬度B的尺寸的30%。此外,第六預定邊寬L6的尺寸可小於預定寬度B的尺寸的30%,且第八預定邊寬L8的尺寸可小於預定寬度B的尺寸的30%。然而,上述所舉的例子只是其中一可行的實施方式而並非用以限定本發明。Based on the above, further, the third chamfer 222 may have a fifth predetermined side width L5 and a sixth predetermined side width L6, and the fourth chamfer 232 may have a seventh predetermined side width L7 and an eighth predetermined side. Wide L8. The third chamfer 222 and the fourth chamfer 232 of the present invention take the chamfer angle as an example, and the angle of the chamfer angle can be 45 degrees. Therefore, the size of the fifth predetermined side width L5 and the sixth predetermined side width L6 The sizes of may be the same as each other, and the size of the seventh predetermined side width L7 and the size of the eighth predetermined side width L8 may be the same as each other, but the present invention is not limited thereto. In other embodiments, the angle of the chamfer angle may be between 0 degrees and 90 degrees, or the angle of the chamfer angle may also be between 30 degrees and 60 degrees. Therefore, the fifth predetermined side The size of the width L5 and the size of the sixth predetermined side width L6 may be different from each other, and the size of the seventh predetermined side width L7 and the size of the eighth predetermined side width L8 may be different from each other. Furthermore, the fifth predetermined side width L5 and the sixth predetermined side width L6 may be smaller than the predetermined width B, and the seventh predetermined side width L7 and the eighth predetermined side width may be smaller than the predetermined width B. For example, the size of the fifth predetermined side width L5 may be less than 50% of the size of the predetermined width B, and the size of the seventh predetermined side width L7 may be less than 50% of the size of the predetermined width B. In addition, the size of the sixth predetermined side width L6 may be less than 50% of the size of the predetermined width B, and the size of the eighth predetermined side width L8 may be less than 50% of the size of the predetermined width B. Furthermore, the size of the fifth predetermined side width L5 may be less than 30% of the size of the predetermined width B, and the size of the seventh predetermined side width L7 may be less than 30% of the size of the predetermined width B. In addition, the size of the sixth predetermined side width L6 may be less than 30% of the size of the predetermined width B, and the size of the eighth predetermined side width L8 may be less than 30% of the size of the predetermined width B. However, the above-mentioned example is only one of the feasible implementations and is not intended to limit the present invention.

接著,請參閱圖8所示,圖8為本發明第二實施例的電流感測結構的另外一實施態樣的立體示意圖。由圖8與圖5的比較可知,在圖8的實施態樣中,電流感測結構2還可進一步包括:一阻隔層25,阻隔層25可披覆在環形本體部21、第一端部22以及第二端部23上,且阻隔層25的材質為非導磁材料或絕緣材料。藉此,可避免導磁材料的環形本體部21、第一端部22以及第二端部23氧化、短路或觸電。此外,值得說明的是,在其他實施態樣中,當前述實施例的電流感測元件3設置在電流感測結構2的開槽24中時,阻隔層25也可以同時包覆電流感測元件3,以定位電流感測元件3相對於開槽24的位置。Next, please refer to FIG. 8, which is a three-dimensional schematic diagram of another implementation aspect of the current sensing structure of the second embodiment of the present invention. It can be seen from the comparison between FIG. 8 and FIG. 5 that in the embodiment of FIG. 8, the current sensing structure 2 may further include: a barrier layer 25, which may cover the annular body portion 21 and the first end portion 22 and the second end 23, and the barrier layer 25 is made of non-magnetic material or insulating material. In this way, the ring-shaped body portion 21, the first end portion 22, and the second end portion 23 of the magnetic conductive material can be prevented from being oxidized, short-circuited or electric shocked. In addition, it is worth noting that in other embodiments, when the current sensing element 3 of the foregoing embodiment is disposed in the slot 24 of the current sensing structure 2, the barrier layer 25 can also cover the current sensing element at the same time. 3. To locate the position of the current sensing element 3 relative to the slot 24.

接著,請參閱圖9所示,9為本發明第二實施例的電流感測結構的另外一實施態樣的前視示意圖。由圖9與圖6的比較可知,在圖9的實施態樣中,電流感測結構2可以僅包括第一倒角221及第二倒角231,而不設置第三倒角222及第四倒角232。另外,須說明的是,圖9中的第一倒角221及第二倒角231的結構特徵與前述實施例相仿,在此不再贅述。Next, please refer to FIG. 9, which is a schematic front view of another implementation aspect of the current sensing structure of the second embodiment of the present invention. From the comparison between FIG. 9 and FIG. 6, it can be seen that in the embodiment of FIG. 9, the current sensing structure 2 may only include the first chamfer 221 and the second chamfer 231, instead of the third chamfer 222 and the fourth chamfer. Chamfer 232. In addition, it should be noted that the structural features of the first chamfer 221 and the second chamfer 231 in FIG. 9 are similar to the foregoing embodiment, and will not be repeated here.

接著,請參閱圖10所示,圖10為本發明第二實施例的電流感測結構的再一實施態樣的立體分解示意圖。由圖10與圖6的比較可知,在圖6的實施態樣中,電流感測結構2可以是例如但不限於利用粉末冶金壓制燒結成型的一體成型方式製作,而在圖10的實施態樣中,電流感測結構2可由多個片狀結構20所組成,每一個片狀結構20依序堆疊以形成電流感測結構2,且每一個片狀結構20的形狀彼此相同。此外,每一個片狀結構20可分別包括環形本體部21、第一端部22、第二端部23以及開槽24,且每一個片狀結構20是沿著感測空間210的中心軸(圖中未標號)依序堆疊而形成電流感測結構2。進一步來說,每一個片狀結構20可為矽鋼片,藉此,片狀結構20可利用衝壓裁切的方式進行製作,且由於每一個片狀結構20是沿著感測空間210的中心軸(圖中未標號)依序堆疊而形成電流感測結構2,所以,每一個片狀結構20的形狀彼此相同,進而能夠增加電流感測結構2的組裝效率。另外,值得說明的是,相鄰的兩個片狀結構20之間可利用一黏著膠體(圖中未示出),將相鄰的片狀結構20彼此接合,而形成電流感測結構2。Next, please refer to FIG. 10, which is a three-dimensional exploded schematic view of still another implementation aspect of the current sensing structure of the second embodiment of the present invention. It can be seen from the comparison between FIG. 10 and FIG. 6 that in the embodiment of FIG. 6, the current sensing structure 2 can be fabricated by, for example, but not limited to, an integral molding method using powder metallurgy pressing and sintering molding, while in the embodiment of FIG. 10 Here, the current sensing structure 2 may be composed of a plurality of sheet structures 20, each sheet structure 20 is sequentially stacked to form the current sensing structure 2, and each sheet structure 20 has the same shape. In addition, each sheet structure 20 may respectively include an annular body portion 21, a first end portion 22, a second end portion 23, and a slot 24, and each sheet structure 20 is along the central axis of the sensing space 210 ( (Not numbered in the figure) stacked in sequence to form the current sensing structure 2. Furthermore, each sheet structure 20 can be a silicon steel sheet, whereby the sheet structure 20 can be manufactured by stamping and cutting, and since each sheet structure 20 is along the central axis of the sensing space 210 (No numbers in the figure) are stacked in order to form the current sensing structure 2. Therefore, the shape of each sheet structure 20 is the same as each other, which can increase the assembly efficiency of the current sensing structure 2. In addition, it is worth noting that an adhesive (not shown in the figure) can be used between two adjacent sheet structures 20 to join the adjacent sheet structures 20 to each other to form the current sensing structure 2.

[第三實施例][Third Embodiment]

首先,請參閱圖11及圖12所示,圖11為本發明第三實施例的電流感測結構的立體示意圖,圖12為本發明第三實施例的電流感測結構的前視示意圖。由圖11與圖6的比較可知,第三實施例與第一實施例最大的差別在於,第三實施例與第二實施例最大的差別在於,第三實施例所提供的電流感測結構2還可進一步包括一第一定位結構26以及一第二定位結構27,第一定位結構26可設置在環形本體部21上,第二定位結構27可設置在環形本體部21上且對應於第一定位結構26。First, please refer to FIGS. 11 and 12. FIG. 11 is a three-dimensional schematic diagram of a current sensing structure according to a third embodiment of the present invention, and FIG. 12 is a front schematic view of a current sensing structure according to the third embodiment of the present invention. It can be seen from the comparison between FIG. 11 and FIG. 6 that the biggest difference between the third embodiment and the first embodiment is that the biggest difference between the third embodiment and the second embodiment is that the current sensing structure 2 provided by the third embodiment is It may further include a first positioning structure 26 and a second positioning structure 27. The first positioning structure 26 may be provided on the annular body portion 21, and the second positioning structure 27 may be provided on the annular body portion 21 and corresponding to the first positioning structure. Positioning structure 26.

承上述,進一步來說,第一定位結構26及第二定位結構27可設置在環形本體部21的環形外表面211上,也就是說,環形本體部21為完整的C形環,而第一定位結構26及第二定位結構27是設置在C形環的外側。此外,也可以利用第一定位結構26及第二定位結構27將電流感測結構2設置在前述實施例的載板1上,然本發明不以此為限。此外,第一定位結構26可包括一連接於環形本體部21的第一定位本體261以及一設置在第一定位本體261上的第一定位部262。第二定位結構27可包括一連接於環形本體部21的第二定位本體271以及一設置在第二定位本體271上的第二定位部272。In view of the above, furthermore, the first positioning structure 26 and the second positioning structure 27 can be arranged on the annular outer surface 211 of the annular body portion 21, that is, the annular body portion 21 is a complete C-ring, and the first The positioning structure 26 and the second positioning structure 27 are arranged outside the C-ring. In addition, the first positioning structure 26 and the second positioning structure 27 may also be used to arrange the current sensing structure 2 on the carrier board 1 of the foregoing embodiment, but the present invention is not limited thereto. In addition, the first positioning structure 26 may include a first positioning body 261 connected to the annular body portion 21 and a first positioning portion 262 provided on the first positioning body 261. The second positioning structure 27 may include a second positioning body 271 connected to the annular body portion 21 and a second positioning portion 272 provided on the second positioning body 271.

接著,請參閱圖13所示,圖13為本發明第三實施例的電流感測結構的另外一實施態樣的立體分解示意圖。由圖13與圖11的比較可知,在圖11的實施態樣中,電流感測結構2可以是例如但不限於利用粉末冶金壓制燒結成型的一體成型方式製作,而在圖13的實施態樣中,電流感測結構2可由多個片狀結構20所組成,每一個片狀結構20依序堆疊以形成電流感測結構2,且每一個片狀結構20的形狀彼此相同。此外,每一個片狀結構20可分別包括環形本體部21、第一端部22、第二端部23、開槽24、第一定位結構26以及第二定位結構27。此外,相鄰的兩個片狀結構20中的其中一個片狀結構20的第一定位結構26可抵靠在相鄰的兩個片狀結構20中的另外一個片狀結構20的第一定位結構26,且相鄰的兩個片狀結構20中的其中一個片狀結構20的第二定位結構27可抵靠在相鄰的兩個片狀結構20中的另外一個片狀結構的第二定位結構27。Next, please refer to FIG. 13, which is a three-dimensional exploded schematic diagram of another implementation aspect of the current sensing structure of the third embodiment of the present invention. From the comparison between FIG. 13 and FIG. 11, it can be seen that in the embodiment of FIG. 11, the current sensing structure 2 can be manufactured by, for example, but not limited to, an integral molding method using powder metallurgy pressing and sintering molding, while in the embodiment of FIG. Here, the current sensing structure 2 may be composed of a plurality of sheet structures 20, each sheet structure 20 is sequentially stacked to form the current sensing structure 2, and each sheet structure 20 has the same shape. In addition, each sheet structure 20 may include an annular body portion 21, a first end portion 22, a second end portion 23, a slot 24, a first positioning structure 26, and a second positioning structure 27, respectively. In addition, the first positioning structure 26 of one of the two adjacent sheet structures 20 can abut against the first positioning of the other one of the two adjacent sheet structures 20 Structure 26, and the second positioning structure 27 of one sheet structure 20 of the two adjacent sheet structures 20 can abut against the second positioning structure 27 of the other sheet structure of the two adjacent sheet structures 20 Positioning structure 27.

承上述,舉例來說,以圖13的實施態樣而言,第一定位結構26的第一定位部262及第二定位結構27的第二定位部272可為一鉚點。藉此,第一定位部262及第二定位部272相對於電流感測結構2的其中一表面可呈凸出狀設置,且第一定位部262及第二定位部272相對於電流感測結構2的另外一表面可呈凹陷狀設置。所以,當相鄰的兩個片狀結構20彼此抵靠時,其中一個片狀結構20的凸出狀設置的第一定位部262及第二定位部272,可以抵靠在另外一個片狀結構20的凹陷狀設置的第一定位部262及第二定位部272,以使得多個片狀結構20能依序堆疊而形成電流感測結構2。換句話說,第一定位結構26及第二定位結構27具有定位相鄰的兩個片狀結構20之間的位置關係的效果。另外,值得說明的是,相鄰的兩個片狀結構20之間除了利用第一定位結構26及第二定位結構27彼此卡合之外,還可利用一黏著膠體(圖中未示出),將相鄰的片狀結構20彼此接合,而形成電流感測結構2。In view of the above, for example, taking the embodiment of FIG. 13, the first positioning portion 262 of the first positioning structure 26 and the second positioning portion 272 of the second positioning structure 27 may be a riveting point. Thereby, the first positioning portion 262 and the second positioning portion 272 can be arranged in a convex shape with respect to one of the surfaces of the current sensing structure 2, and the first positioning portion 262 and the second positioning portion 272 are opposed to the current sensing structure The other surface of 2 can be recessed. Therefore, when two adjacent sheet structures 20 abut against each other, the protruding first positioning portion 262 and the second positioning portion 272 of one sheet structure 20 can abut the other sheet structure The first positioning portion 262 and the second positioning portion 272 are arranged in a recessed shape of the 20 so that a plurality of sheet structures 20 can be stacked in sequence to form the current sensing structure 2. In other words, the first positioning structure 26 and the second positioning structure 27 have the effect of positioning the positional relationship between two adjacent sheet structures 20. In addition, it is worth noting that in addition to using the first positioning structure 26 and the second positioning structure 27 to engage with each other between two adjacent sheet structures 20, an adhesive (not shown in the figure) can also be used. , The adjacent sheet structures 20 are joined to each other to form a current sensing structure 2.

接著,請復參閱圖1至圖4所示,並請一併參閱圖14所示,圖14為本發明實施例的電流感測模組應用在控制器裝置上的使用狀態示意圖。舉例來說,本發明的電流感測模組U及其電流感測結構2優選可應用於一控制器裝置E,例如但不限於電動車的驅動器。控制器裝置E可包括一第一導電元件C1、一第二導電元件C2、一第三導電元件C3、一第四導電元件C4及一第五導電元件C5,控制器裝置E的第一導電元件C1、第二導電元件C2以及第三導電元件C3可分別連接於馬達,而第四導電元件C4及第五導電元件C5可分別作為直流電的正極及負極。藉此,當第一導電元件C1、第二導電元件C2、第三導電元件C3、第四導電元件C4及第五導電元件C5分別穿過電流感測模組U的載板1的貫穿孔10及電流感測結構2的感測空間210時,電流感測模組U可感測流經第一導電元件C1、第二導電元件C2、第三導電元件C3、第四導電元件C4及/或第五導電元件C5的電流值。Next, please refer to FIG. 1 to FIG. 4 again, and also refer to FIG. 14 together. FIG. 14 is a schematic diagram of the use state of the current sensing module applied to the controller device according to the embodiment of the present invention. For example, the current sensing module U and the current sensing structure 2 of the present invention can preferably be applied to a controller device E, such as but not limited to a driver of an electric vehicle. The controller device E may include a first conductive element C1, a second conductive element C2, a third conductive element C3, a fourth conductive element C4, and a fifth conductive element C5, the first conductive element of the controller device E C1, the second conductive element C2, and the third conductive element C3 can be respectively connected to the motor, and the fourth conductive element C4 and the fifth conductive element C5 can be respectively used as the positive and negative electrodes of the direct current. Thereby, when the first conductive element C1, the second conductive element C2, the third conductive element C3, the fourth conductive element C4, and the fifth conductive element C5 respectively pass through the through hole 10 of the carrier board 1 of the current sensing module U And the sensing space 210 of the current sensing structure 2, the current sensing module U can sense the flow through the first conductive element C1, the second conductive element C2, the third conductive element C3, the fourth conductive element C4 and/or The current value of the fifth conductive element C5.

另外,須說明的是,雖然圖14中的電流感測結構2是以圖6所提供的電流感測結構2作為舉例說明,但是,在其他實施態樣中,也可以利用其他實施例中的電流感測結構2。此外,圖14中的電流感測結構2的結構特徵與前述實施例相仿,在此不再贅述。In addition, it should be noted that although the current sensing structure 2 in FIG. 14 is exemplified by the current sensing structure 2 provided in FIG. 6, in other embodiments, the current sensing structure 2 in other embodiments can also be used. Current sensing structure 2. In addition, the structural features of the current sensing structure 2 in FIG. 14 are similar to the foregoing embodiment, and will not be repeated here.

[實施例的有益效果][Beneficial effects of the embodiment]

本發明的其中一有益效果在於,本發明所提供的電流感測模組U及其電流感測結構2,其能通過“第一端部22連接於環形本體部21的其中一端,且第一端部22上具有一第一倒角221”以及“第二端部23連接於環形本體部21的另外一端,且第二端部23上具有一第二倒角231”的技術方案,以提高氣隙磁通密度的均勻性,並提高電流值的量測範圍。此外,通過上述技術特徵,本發明所提供的電流感測結構2的飽和電流可大於800Arms,且線性誤差小於0.2%。One of the beneficial effects of the present invention is that the current sensing module U and the current sensing structure 2 provided by the present invention can be connected to one end of the annular body portion 21 through the "first end 22, and the first The end 22 has a first chamfer 221" and the technical solution of “the second end 23 is connected to the other end of the annular body 21, and the second end 23 has a second chamfer 231” to improve The uniformity of the air gap magnetic flux density and the improvement of the measurement range of the current value. In addition, through the above technical features, the saturation current of the current sensing structure 2 provided by the present invention can be greater than 800 Arms, and the linearity error is less than 0.2%.

更進一步來說,當電流感測結構2由多個片狀結構20所組成時,不僅能夠增加製程上的便利性,同時,相較於現有技術利用粉末冶金壓制燒結的電流感測結構,也能達到不易脆裂的效果。Furthermore, when the current sensing structure 2 is composed of a plurality of sheet-like structures 20, it can not only increase the convenience of the manufacturing process, but also, compared with the current sensing structure using powder metallurgy pressing and sintering in the prior art, It can achieve the effect of not being brittle.

更進一步來說,相較於現有技術利用奈米非晶材質,本發明所利用的矽鋼片不僅成本較低,同時,還能利用第一倒角221及第二倒角的設置,而達到高線性、高電流量測範圍的技術效果。再者,也解決了奈米非晶之粉末冶金製程之容易脆裂問題。Furthermore, compared with the prior art using nano-amorphous materials, the silicon steel sheet used in the present invention not only has a lower cost, but also uses the first chamfer 221 and the second chamfer to achieve high The technical effect of linear, high current measurement range. In addition, it also solves the problem of easy embrittlement in the powder metallurgy process of nano-amorphous.

更進一步來說,第一定位結構26及第二定位結構27是設置在環形本體部21的外側,因此,能夠避免應力提高、鐵損提高所造成的感測線性度變差的問題產生。Furthermore, the first positioning structure 26 and the second positioning structure 27 are arranged on the outer side of the annular body portion 21. Therefore, the problem of the deterioration of the sensing linearity caused by the increased stress and the increased iron loss can be avoided.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

U:電流感測模組 1:載板 10:貫穿孔 2:電流感測結構 20:片狀結構 21:環形本體部 210:感測空間 211:環形外表面 212:環形內表面 22:第一端部 220:第一端面 221:第一倒角 2210:第一連接面 222:第三倒角 2220:第三連接面 23:第二端部 230:第二端面 231:第二倒角 2310:第二連接面 232:第四倒角 2320:第四連接面 24:開槽 25:阻隔層 26:第一定位結構 261:第一定位本體 262:第一定位部 27:第二定位結構 271:第二定位本體 272:第二定位部 3:電流感測元件 D:預定外徑 d:預定內徑 B:預定寬度 G:預定間隙 L1:第一預定邊寬 L2:第二預定邊寬 L3:第三預定邊寬 L4:第四預定邊寬 L5:第五預定邊寬 L6:第六預定邊寬 L7:第七預定邊寬 L8:第八預定邊寬 C1:第一導電元件 C2:第二導電元件 C3:第三導電元件 C4:第四導電元件 C5:第五導電元件 E:控制器裝置 U: Current sensing module 1: carrier board 10: Through hole 2: Current sensing structure 20: sheet structure 21: Ring body 210: Sensing Space 211: Annular outer surface 212: ring inner surface 22: first end 220: first end face 221: first chamfer 2210: The first connection surface 222: third chamfer 2220: third connection surface 23: second end 230: second end face 231: second chamfer 2310: second connection surface 232: fourth chamfer 2320: fourth connection surface 24: Slotting 25: barrier layer 26: The first positioning structure 261: The first positioning body 262: first positioning part 27: The second positioning structure 271: The second positioning body 272: second positioning part 3: Current sensing element D: predetermined outer diameter d: predetermined inner diameter B: predetermined width G: predetermined gap L1: The first predetermined side width L2: second predetermined side width L3: The third predetermined side width L4: Fourth predetermined side width L5: The fifth predetermined side width L6: The sixth predetermined side width L7: The seventh predetermined side width L8: Eighth predetermined side width C1: The first conductive element C2: second conductive element C3: third conductive element C4: Fourth conductive element C5: Fifth conductive element E: Controller device

圖1為本發明第一實施例的電流感測模組的其中一立體組合示意圖。FIG. 1 is a three-dimensional assembly diagram of the current sensing module according to the first embodiment of the present invention.

圖2為本發明第一實施例的電流感測模組的另外一立體組合示意圖。2 is another three-dimensional assembly diagram of the current sensing module according to the first embodiment of the invention.

圖3為本發明第一實施例的電流感測模組的其中一立體分解示意圖。3 is an exploded perspective view of the current sensing module according to the first embodiment of the invention.

圖4為本發明第一實施例的電流感測模組的另外一立體分解示意圖。4 is another three-dimensional exploded schematic view of the current sensing module according to the first embodiment of the invention.

圖5為本發明第二實施例的電流感測結構的立體示意圖。5 is a three-dimensional schematic diagram of the current sensing structure according to the second embodiment of the present invention.

圖6為本發明第二實施例的電流感測結構的前視示意圖。6 is a schematic front view of the current sensing structure according to the second embodiment of the present invention.

圖7為圖6的VII部分的局部放大示意圖。Fig. 7 is a partial enlarged schematic diagram of part VII of Fig. 6.

圖8為本發明第二實施例的電流感測結構的另外一實施態樣的立體示意圖。FIG. 8 is a three-dimensional schematic diagram of another implementation aspect of the current sensing structure of the second embodiment of the present invention.

圖9為本發明第二實施例的電流感測結構的另外一實施態樣的前視示意圖。9 is a schematic front view of another implementation aspect of the current sensing structure of the second embodiment of the present invention.

圖10為本發明第二實施例的電流感測結構的再一實施態樣的立體分解示意圖。10 is a three-dimensional exploded schematic diagram of still another implementation aspect of the current sensing structure according to the second embodiment of the present invention.

圖11為本發明第三實施例的電流感測結構的立體示意圖。FIG. 11 is a three-dimensional schematic diagram of a current sensing structure according to a third embodiment of the present invention.

圖12為本發明第三實施例的電流感測結構的前視示意圖。FIG. 12 is a schematic front view of a current sensing structure according to a third embodiment of the present invention.

圖13為本發明第三實施例的電流感測結構的另外一實施態樣的立體分解示意圖。FIG. 13 is a three-dimensional exploded schematic diagram of another implementation aspect of the current sensing structure of the third embodiment of the present invention.

圖14為本發明實施例的電流感測模組應用在控制器裝置上的使用狀態示意圖。FIG. 14 is a schematic diagram of the use state of the current sensing module applied to the controller device according to the embodiment of the present invention.

2:電流感測結構 2: Current sensing structure

21:環形本體部 21: Ring body

210:感測空間 210: Sensing Space

211:環形外表面 211: Annular outer surface

212:環形內表面 212: ring inner surface

22:第一端部 22: first end

220:第一端面 220: first end face

221:第一倒角 221: first chamfer

222:第三倒角 222: third chamfer

23:第二端部 23: second end

230:第二端面 230: second end face

231:第二倒角 231: second chamfer

232:第四倒角 232: fourth chamfer

24:開槽 24: Slotting

Claims (9)

一種電流感測結構,其包括:一環形本體部;一第一端部,所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角;一第二端部,所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角;以及一開槽,所述開槽位於所述第一端部與所述第二端部之間;其中,所述環形本體部包括一環形外表面以及一對應於所述環形外表面的環形內表面,所述第一端部包括一連接於所述環形外表面及所述環形內表面的第一端面,所述第二端部包括一連接於所述環形外表面及所述環形內表面的第二端面;其中,所述第一倒角位於所述第一端面與所述環形內表面之間,且所述第一端面與所述環形內表面之間具有一第一連接面,所述第二倒角位於所述第二端面與所述環形內表面之間,且所述第二端面與所述環形內表面具有一第二連接面;其中,所述環形本體部具有一預定外徑、一預定內徑以及一預定寬度,所述第一倒角具有一第一預定邊寬及一第二預定邊寬,所述第二倒角具有一第三預定邊寬及一第四預定邊寬;其中,所述第一預定邊寬的尺寸小於所述預定寬度的尺寸,且所述第三預定邊寬的尺寸小於所述預定寬度的尺寸;其中,所述第一預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間,且所述第三預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間;其中,所述第二預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間,且所述第四預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間。 A current sensing structure, comprising: a ring-shaped body portion; a first end portion, the first end portion is connected to one end of the ring-shaped body portion, and the first end portion has a first inverted Angle; a second end, the second end is connected to the other end of the annular body, and the second end has a second chamfer; and a slot, the slot is located Between the first end and the second end; wherein the annular body includes an annular outer surface and an annular inner surface corresponding to the annular outer surface, and the first end includes a A first end surface connected to the annular outer surface and the annular inner surface, and the second end portion includes a second end surface connected to the annular outer surface and the annular inner surface; wherein, the first The chamfer is located between the first end surface and the annular inner surface, and there is a first connecting surface between the first end surface and the annular inner surface, and the second chamfer is located on the second end surface And the annular inner surface, and the second end surface and the annular inner surface have a second connecting surface; wherein the annular body portion has a predetermined outer diameter, a predetermined inner diameter and a predetermined width, The first chamfer has a first predetermined side width and a second predetermined side width, and the second chamfer has a third predetermined side width and a fourth predetermined side width; wherein, the first predetermined side The size of the width is smaller than the size of the predetermined width, and the size of the third predetermined side width is smaller than the size of the predetermined width; wherein the size of the first predetermined side width is within 5 of the size of the predetermined width % To 60%, and the third predetermined side width is between 5% and 60% of the predetermined width; wherein, the second predetermined side width is between the predetermined The size of the width is between 5% and 60%, and the size of the fourth predetermined side width is between 5% and 60% of the size of the predetermined width. 如申請專利範圍第1項所述的電流感測結構,其中,所述第一倒角為一倒斜角或倒圓角,所述第二倒角為一倒斜角或倒圓角。 According to the current sensing structure described in item 1 of the scope of patent application, wherein the first chamfer is a chamfer or a rounded corner, and the second chamfer is a chamfer or a rounded corner. 如申請專利範圍第1項所述的電流感測結構,其中,所述電流感測結構的材質為矽鋼。 According to the current sensing structure described in item 1 of the scope of patent application, the material of the current sensing structure is silicon steel. 如申請專利範圍第1項所述的電流感測結構,其中,所述電流感測結構由多個片狀結構所組成,每一所述片狀結構依序堆疊以形成所述電流感測結構;其中,每一所述片狀結構分別包括所述環形本體部、所述第一端部、所述第二端部以及所述開槽。 The current sensing structure according to claim 1, wherein the current sensing structure is composed of a plurality of sheet structures, and each of the sheet structures is sequentially stacked to form the current sensing structure ; Wherein, each of the sheet-like structures includes the annular body portion, the first end portion, the second end portion, and the slot. 如申請專利範圍第1項所述的電流感測結構,還進一步包括:一阻隔層,所述阻隔層披覆在所述環形本體部、所述第一端部以及所述第二端部上,其中,所述阻隔層的材質為非導磁材料或絕緣材料。 The current sensing structure as described in item 1 of the scope of the patent application further includes: a barrier layer covering the annular body portion, the first end portion, and the second end portion , Wherein the material of the barrier layer is a non-magnetic material or an insulating material. 如申請專利範圍第1項所述的電流感測結構,還進一步包括:一第一定位結構以及一第二定位結構,所述第一定位結構設置在所述環形本體部上,所述第二定位結構設置在所述環形本體部上且對應於所述第一定位結構;其中,所述第一定位結構包括一連接於所述環形本體部的第一定位本體以及一設置在所述第一定位本體上的第一定位部;其中,所述第二定位結構包括一連接於所述環形本體部的第二定位本體以及一設置在所述第二定位本體上的第二定位部。 The current sensing structure described in item 1 of the scope of patent application further includes: a first positioning structure and a second positioning structure, the first positioning structure is disposed on the annular body portion, and the second The positioning structure is arranged on the annular body portion and corresponds to the first positioning structure; wherein, the first positioning structure includes a first positioning body connected to the annular body portion and a first positioning body arranged on the first positioning structure. A first positioning portion on the positioning body; wherein the second positioning structure includes a second positioning body connected to the annular body portion and a second positioning portion provided on the second positioning body. 如申請專利範圍第1項所述的電流感測結構,還進一步包括:一第一定位結構以及一第二定位結構,所述第一定位結構設置在所述環形本體部上,所述第二定位結構設置在所述環形本體部上且對應於所述第一定位結構;其中,所述電流感測結構由多個片狀結構所組成,每一個片狀結構依序堆疊以形成所述電流感測結構;其中,每一所述片狀結構分別包括所述環形本體 部、所述第一端部、所述第二端部、所述開槽、所述第一定位結構以及所述第二定位結構;其中,相鄰的兩個所述片狀結構中的其中一個所述片狀結構的所述第一定位結構抵靠在相鄰的兩個所述片狀結構中的另外一個所述片狀結構的所述第一定位結構,且相鄰的兩個所述片狀結構中的其中一個所述片狀結構的所述第二定位結構抵靠在相鄰的兩個所述片狀結構中的另外一個所述片狀結構的所述第二定位結構。 The current sensing structure described in item 1 of the scope of patent application further includes: a first positioning structure and a second positioning structure, the first positioning structure is disposed on the annular body portion, and the second The positioning structure is provided on the annular body portion and corresponds to the first positioning structure; wherein, the current sensing structure is composed of a plurality of sheet structures, and each sheet structure is stacked in sequence to form the current Sensing structure; wherein, each of the sheet-like structures includes the annular body Section, the first end, the second end, the slot, the first positioning structure, and the second positioning structure; wherein one of the two adjacent sheet-like structures The first positioning structure of one sheet structure abuts against the first positioning structure of the other of the two adjacent sheet structures, and the two adjacent sheet structures The second positioning structure of one of the sheet-like structures abuts against the second positioning structure of the other of the two adjacent sheet-like structures. 如申請專利範圍第1項所述的電流感測結構,其中,所述第一端部還進一步包括一第三倒角,所述第二端部還進一步包括一第四倒角;其中,所述第三倒角位於所述第一端面與所述環形外表面之間,且所述第一端面與所述環形外表面之間具有一第三連接面,所述第四倒角位於所述第二端面與所述環形外表面之間,且所述第二端面與所述環形外表面具有一第四連接面。 The current sensing structure according to the first item of the scope of patent application, wherein the first end portion further includes a third chamfer, and the second end portion further includes a fourth chamfer; wherein The third chamfer is located between the first end surface and the annular outer surface, and there is a third connecting surface between the first end surface and the annular outer surface, and the fourth chamfer is located at the Between the second end surface and the annular outer surface, and the second end surface and the annular outer surface have a fourth connecting surface. 一種電流感測模組,其包括:一載板;一電流感測結構,所述電流感測結構設置在所述載板上,所述電流感測結構包括一環形本體部、一第一端部、一第二端部以及一開槽,其中,所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角,所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角,所述開槽位於所述第一端部與所述第二端部之間;以及一電流感測元件,所述電流感測元件設置在所述載板上且耦接於所述載板,且所述電流感測元件設置在所述開槽中;其中,所述環形本體部包括一環形外表面以及一對應於所述環形外表面的環形內表面,所述第一端部包括一連接於所述環形外表面及所述環形內表面的第一端面,所述第二端部包括 一連接於所述環形外表面及所述環形內表面的第二端面;其中,所述第一倒角位於所述第一端面與所述環形內表面之間,且所述第一端面與所述環形內表面之間具有一第一連接面,所述第二倒角位於所述第二端面與所述環形內表面之間,且所述第二端面與所述環形內表面具有一第二連接面;其中,所述環形本體部具有一預定外徑、一預定內徑以及一預定寬度,所述第一倒角具有一第一預定邊寬及一第二預定邊寬,所述第二倒角具有一第三預定邊寬及一第四預定邊寬;其中,所述第一預定邊寬的尺寸小於所述預定寬度的尺寸,且所述第三預定邊寬的尺寸小於所述預定寬度的尺寸;其中,所述第一預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間,且所述第三預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間;其中,所述第二預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間,且所述第四預定邊寬的尺寸介於所述預定寬度的尺寸的5%至60%之間。 A current sensing module includes: a carrier board; a current sensing structure, the current sensing structure is arranged on the carrier board, the current sensing structure includes a ring-shaped body portion, a first end Part, a second end and a slot, wherein the first end is connected to one end of the annular body part, and the first end has a first chamfer, the second The end is connected to the other end of the annular body, and the second end has a second chamfer, and the slot is located between the first end and the second end; and A current sensing element, the current sensing element is arranged on the carrier board and coupled to the carrier board, and the current sensing element is arranged in the slot; wherein, the annular body part It includes a ring-shaped outer surface and a ring-shaped inner surface corresponding to the ring-shaped outer surface. The first end portion includes a first end surface connected to the ring-shaped outer surface and the ring-shaped inner surface. The second end Department includes A second end surface connected to the annular outer surface and the annular inner surface; wherein the first chamfer is located between the first end surface and the annular inner surface, and the first end surface is There is a first connecting surface between the annular inner surface, the second chamfer is located between the second end surface and the annular inner surface, and the second end surface and the annular inner surface have a second Connecting surface; wherein the annular body portion has a predetermined outer diameter, a predetermined inner diameter and a predetermined width, the first chamfer has a first predetermined side width and a second predetermined side width, the second The chamfer has a third predetermined side width and a fourth predetermined side width; wherein the size of the first predetermined side width is smaller than the size of the predetermined width, and the size of the third predetermined side width is smaller than the predetermined size. The size of the width; wherein the size of the first predetermined side width is between 5% and 60% of the size of the predetermined width, and the size of the third predetermined side width is between the size of the predetermined width The size of the second predetermined side width is between 5% and 60% of the size of the predetermined width, and the size of the fourth predetermined side width is between 5% and 60% of the 5% to 60% of the size of the predetermined width.
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