TWI699537B - Current sensing module and current sensing structure thereof - Google Patents
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Abstract
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本發明涉及一種感測模組及其感測結構,特別是涉及一種電流感測模組及其電流感測結構。The invention relates to a sensing module and a sensing structure thereof, in particular to a current sensing module and a current sensing structure thereof.
首先,隨著節能減碳之全球性議題,各國對於新能源車的品質及性能的要求也越來越高,而為了因應不同法規及不同客群的需求,各種零部件的規格需求也越來越高。First of all, with the global issue of energy saving and carbon reduction, countries have increasingly higher requirements for the quality and performance of new energy vehicles. In order to meet the needs of different regulations and different customer groups, the specifications for various parts are also increasing. Higher.
但是,隨著電動車性能的提高,代表著電動車驅動器所輸出的電壓及/或電流也提高,故衍生了控制電路隔離議題與高電流感測範圍需求的問題。現有技術的電流感測結構的材質多為氧化鐵體,其除了電流感測範圍不高外也容易脆裂。舉例來說,現有技術的電流感測結構,其最高量測範圍僅約200Arms。However, as the performance of the electric vehicle increases, it means that the voltage and/or current output by the electric vehicle driver also increases, which leads to the issue of control circuit isolation and the need for high current sensing range. The current sensing structure in the prior art is mostly made of iron oxide, which is prone to brittle fracture in addition to the low current sensing range. For example, the current sensing structure of the prior art has a maximum measurement range of only about 200 Arms.
故,如何通過結構設計的改良,來提升電流感測結構的量測範圍,並提高電流感測結構的得可靠度,以克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Therefore, how to improve the measurement range of the current sensing structure and improve the reliability of the current sensing structure through the improvement of the structure design to overcome the above-mentioned shortcomings has become one of the important issues to be solved by this business. .
本發明所要解決的技術問題在於,針對現有技術的不足提供一種電流感測模組及其電流感測結構。The technical problem to be solved by the present invention is to provide a current sensing module and a current sensing structure for the shortcomings of the prior art.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種電流感測結構,其包括:一環形本體部、一第一端部、一第二端部以及一開槽。所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角。所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角。所述開槽位於所述第一端部與所述第二端部之間。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a current sensing structure, which includes: a ring-shaped body portion, a first end portion, a second end portion, and a slot. The first end is connected to one end of the annular body, and the first end has a first chamfer. The second end is connected to the other end of the annular body, and the second end has a second chamfer. The slot is located between the first end and the second end.
為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種電流感測模組,其包括:一載板、一電流感測結構以及一電流感測元件。所述電流感測結構設置在所述載板上,所述電流感測結構包括一環形本體部、一第一端部、一第二端部以及一開槽,其中,所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角,所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角,所述開槽位於所述第一端部與所述第二端部之間。所述電流感測元件設置在所述載板上且耦接於所述載板,且所述電流感測元件設置在所述開槽中。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a current sensing module, which includes: a carrier board, a current sensing structure, and a current sensing element. The current sensing structure is arranged on the carrier board, and the current sensing structure includes an annular body portion, a first end portion, a second end portion, and a slot, wherein the first end portion Is connected to one end of the ring body, and the first end has a first chamfer, the second end is connected to the other end of the ring body, and the second end The upper has a second chamfer, and the slot is located between the first end and the second end. The current sensing element is disposed on the carrier board and coupled to the carrier board, and the current sensing element is disposed in the slot.
本發明的其中一有益效果在於,本發明所提供的電流感測模組及其電流感測結構,其能通過“所述第一端部連接於所述環形本體部的其中一端,且所述第一端部上具有一第一倒角”以及“所述第二端部連接於所述環形本體部的另外一端,且所述第二端部上具有一第二倒角”的技術方案,以提高氣隙磁通密度的均勻性,並提高電流值的量測範圍。One of the beneficial effects of the present invention is that the current sensing module and the current sensing structure provided by the present invention can be connected to one end of the ring-shaped body through the "first end, and the The first end has a first chamfer" and "the second end is connected to the other end of the annular body, and the second end has a second chamfer", In order to improve the uniformity of the air gap magnetic flux density, and increase the measurement range of the current value.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“電流感測模組及其電流感測結構”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following are specific examples to illustrate the implementation of the “current sensing module and its current sensing structure” disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. . The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
[第一實施例][First Embodiment]
首先,請參閱圖1至圖4所示,圖1及圖2分別為本發明第一實施例的電流感測模組的立體組合示意圖,圖3及圖4分別為本發明第一實施例的電流感測模組的立體分解示意圖,本發明提供一種電流感測模組U及其電流感測結構2。舉例來說,本發明實施例所提供的電流感測模組U及其電流感測結構2優選可應用於電動車的驅動器,然本發明不以此為限。另外,須說明的是,第一實施例將先介紹電流感測模組U的主要架構,後續實施例再行介紹電流感測結構2的構造。First, please refer to Figures 1 to 4. Figures 1 and 2 are respectively a three-dimensional assembly diagram of the current sensing module according to the first embodiment of the present invention, and Figures 3 and 4 are respectively the three-dimensional assembly diagrams of the first embodiment of the present invention. A three-dimensional exploded schematic diagram of a current sensing module. The present invention provides a current sensing module U and a
承上述,請復參閱圖1至圖4所示,電流感測模組U包括:一載板1、一電流感測結構2以及一電流感測元件3。電流感測結構2及電流感測元件3可設置在載板1上,且電流感測元件3可耦接於載板1。另外,須說明的是,雖然圖式中的電流感測結構2及電流感測元件3是設置在相同的載板1上,但是,須說明的是,在其他實施方式中,電流感測結構2以及電流感測元件3可以設置在不同的載板1上。換句話說,電流感測結構2可以固定在另外一載板(圖中未示出)。In view of the above, please refer to FIGS. 1 to 4 again. The current sensing module U includes: a carrier board 1, a
承上述,舉例來說,載板1可為一印刷電路板(Printed circuit board,PCB),電流感測結構2可為一C型磁環,電流感測元件3可為一霍爾電流感測元件(Hall Current Sensor)。進一步來說,電流感測結構2的材質可為一導磁材料、矽鋼或氧化鐵體,然本發明不以此為限。此外,電流感測結構2具有一開槽24(或可稱氣隙(Air gap)),電流感測元件3可設置在開槽24中,以感應電流值大小。此外,電流感測元件3是與電流感測結構2彼此分離的。In view of the above, for example, the carrier 1 can be a printed circuit board (PCB), the
[第二實施例][Second Embodiment]
首先,請參閱圖5至圖7所示,圖5為本發明第二實施例的電流感測結構的立體示意圖,圖6為本發明第二實施例的電流感測結構的前視示意圖,圖7為圖6的VII部分的局部放大示意圖。以下將進一步說明電流感測結構2的構造。詳細來說,電流感測結構2可包括一環形本體部21、一第一端部22、一第二端部23以及一開槽24,此外,環形本體部21可圍繞出一感測空間210,且開槽24可位於第一端部22與第二端部23之間。進一步來說,第一端部22可連接於環形本體部21的其中一端,且第一端部22上可具有一第一倒角221(chamfer),第二端部23可連接於環形本體部21的另外一端,且第二端部23上具有一第二倒角231。此外,環形本體部21可包括一環形外表面211以及一對應於環形外表面211的環形內表面212,第一端部22可包括一連接於環形外表面211及環形內表面212之間的第一端面220,第二端部23可包括一連接於環形外表面211及環形內表面212之間的第二端面230。第一倒角221可位於第一端面220與環形內表面212之間,且第二倒角231可位於第二端面230與環形內表面212之間,即,第一倒角221及第二倒角231可鄰近於感測空間210。此外,舉例來說,第一倒角221及/或第二倒角231可為一倒斜角或倒圓角,然本發明不以此為限。First, please refer to FIGS. 5-7. FIG. 5 is a three-dimensional schematic diagram of a current sensing structure according to a second embodiment of the present invention, and FIG. 6 is a front schematic view of a current sensing structure according to the second embodiment of the present invention. 7 is a partial enlarged schematic diagram of part VII in FIG. 6. The structure of the
承上述,請復參閱圖5至圖7所示,通過第一倒角221及第二倒角231的設置,第一端面220與環形內表面212之間可具有一第一連接面2210,且第二端面230與環形內表面212之間具有一第二連接面2310。進一步來說,當第一倒角221及第二倒角231為倒斜角時,第一連接面2210及第二連接面2310為一斜面,當第一倒角221及第二倒角231為倒圓角時,第一連接面2210及第二連接面2310為一弧面。另外,須說明的是,本發明實施例是以倒斜角作為舉例說明,但是,在其他實施態樣中,第一倒角221及第二倒角231也可以為倒圓角。In view of the above, please refer to FIGS. 5 to 7 again. Through the arrangement of the
承上述,請復參閱圖5至圖7所示,以本發明實施例而言,第一端部22上還可具有一對應於第一倒角221的第三倒角222,且第二端部23上可具有一對應於第二倒角231的第四倒角232。第三倒角222可位於第一端面220與環形外表面211之間,且第四倒角232可位於第二端面230與環形外表面211之間。此外,舉例來說,第三倒角222及/或第四倒角232可為一倒斜角或倒圓角,然本發明不以此為限。進一步來說,通過第三倒角222及第四倒角232的設置,第一端面220與環形外表面211之間可具有一第三連接面2220,且第二端面230與環形外表面211之間具有一第四連接面2320。更一步來說,當第三倒角222及第四倒角232為倒斜角時,第三連接面2220及第四連接面2320為一斜面,當第三倒角222及第四倒角232為倒圓角時,第三連接面2220及第四連接面2320為一弧面。另外,須說明的是,本發明實施例是以倒斜角作為舉例說明,但是,在其他實施態樣中,第三倒角222及第四倒角232也可以為倒圓角。此外,值得說明的是,第一端面220可位於第一連接面2210及第三連接面2220之間,且第二端面230可位於第二連接面2310及第四連接面2320之間。In view of the above, please refer to FIGS. 5 to 7 again. According to the embodiment of the present invention, the
承上述,請復參閱圖5至圖7所示,環形本體部21可具有一預定外徑D、一預定內徑d以及一預定寬度B,預定寬度B可為環形本體部21的寬度,即,預定外徑D與預定內徑d之間的差值的二分之一。此外,舉例來說,預定外徑D大於9毫米(millimeter,mm),預定內徑d可大於5毫米,預定寬度B可大於2毫米,環形本體部21的一截面面積可大於25平方毫米,開槽24可具有一預定間隙G,預定間隙G可介於3毫米至5毫米之間,然本發明不以此為限。另外,在其他實施態樣中,預定寬度B的尺寸可介於5毫米至10毫米之間,然本發明不以此為限。In view of the above, please refer to FIGS. 5 to 7 again. The
承上述,第一倒角221可具有一第一預定邊寬L1及一第二預定邊寬L2,第二倒角231可具有一第三預定邊寬L3及一第四預定邊寬L4。進一步來說,本發明的第一倒角221及第二倒角231以倒斜角作為舉例說明,且倒斜角的角度可為45度,所以,第一預定邊寬L1的尺寸與第二預定邊寬L2的尺寸可彼此相同,且第三預定邊寬L3的尺寸與第四預定邊寬L4的尺寸可彼此相同,然本發明不以此為限。在其他實施態樣中,倒斜角的角度可介於4.76度至85度之間,又或者是倒斜角的角度也可以是介於30度至60度之間,因此,第一預定邊寬L1的尺寸與第二預定邊寬L2的尺寸可彼此相異,且第三預定邊寬L3的尺寸與第四預定邊寬L4的尺寸可彼此相異。進一步來說,第一預定邊寬L1及第二預定邊寬L2的尺寸可小於預定寬度B的尺寸,且第三預定邊寬L3及第四預定邊寬的尺寸可小於預定寬度B的尺寸。舉例來說,第一預定邊寬L1的尺寸可介於預定寬度B的尺寸的5%至60%之間,且第三預定邊寬L3的尺寸可介於預定寬度B的尺寸的5%至60%之間。此外,第二預定邊寬L2的尺寸可介於預定寬度B的尺寸的5%至60%之間,且第四預定邊寬L4的尺寸可介於預定寬度B的尺寸的5%至60%之間。然而,上述所舉的例子只是其中一可行的實施方式而並非用以限定本發明。In view of the above, the
承上述,進一步來說,第三倒角222可具有一第五預定邊寬L5及一第六預定邊寬L6,第四倒角232可具有一第七預定邊寬L7及一第八預定邊寬L8。本發明的第三倒角222及第四倒角232以倒斜角作為舉例說明,且倒斜角的角度可為45度,所以,第五預定邊寬L5的尺寸與第六預定邊寬L6的尺寸可彼此相同,且第七預定邊寬L7的尺寸與第八預定邊寬L8的尺寸可彼此相同,然本發明不以此為限。在其他實施態樣中,倒斜角的角度可介於0度至90度之間,又或者是倒斜角的角度也可以是介於30度至60度之間,因此,第五預定邊寬L5的尺寸與第六預定邊寬L6的尺寸可彼此相異,且第七預定邊寬L7的尺寸與第八預定邊寬L8的尺寸可彼此相異。進一步來說,第五預定邊寬L5及第六預定邊寬L6的尺寸可小於預定寬度B的尺寸,且第七預定邊寬L7及第八預定邊寬的尺寸可小於預定寬度B的尺寸。舉例來說,第五預定邊寬L5的尺寸可小於預定寬度B的尺寸的50%,且第七預定邊寬L7的尺寸可小於預定寬度B的尺寸的50%。此外,第六預定邊寬L6的尺寸可小於預定寬度B的尺寸的50%,且第八預定邊寬L8的尺寸可小於預定寬度B的尺寸的50%。更進一步來說,第五預定邊寬L5的尺寸可小於預定寬度B的尺寸的30%,且第七預定邊寬L7的尺寸可小於預定寬度B的尺寸的30%。此外,第六預定邊寬L6的尺寸可小於預定寬度B的尺寸的30%,且第八預定邊寬L8的尺寸可小於預定寬度B的尺寸的30%。然而,上述所舉的例子只是其中一可行的實施方式而並非用以限定本發明。Based on the above, further, the
接著,請參閱圖8所示,圖8為本發明第二實施例的電流感測結構的另外一實施態樣的立體示意圖。由圖8與圖5的比較可知,在圖8的實施態樣中,電流感測結構2還可進一步包括:一阻隔層25,阻隔層25可披覆在環形本體部21、第一端部22以及第二端部23上,且阻隔層25的材質為非導磁材料或絕緣材料。藉此,可避免導磁材料的環形本體部21、第一端部22以及第二端部23氧化、短路或觸電。此外,值得說明的是,在其他實施態樣中,當前述實施例的電流感測元件3設置在電流感測結構2的開槽24中時,阻隔層25也可以同時包覆電流感測元件3,以定位電流感測元件3相對於開槽24的位置。Next, please refer to FIG. 8, which is a three-dimensional schematic diagram of another implementation aspect of the current sensing structure of the second embodiment of the present invention. It can be seen from the comparison between FIG. 8 and FIG. 5 that in the embodiment of FIG. 8, the
接著,請參閱圖9所示,9為本發明第二實施例的電流感測結構的另外一實施態樣的前視示意圖。由圖9與圖6的比較可知,在圖9的實施態樣中,電流感測結構2可以僅包括第一倒角221及第二倒角231,而不設置第三倒角222及第四倒角232。另外,須說明的是,圖9中的第一倒角221及第二倒角231的結構特徵與前述實施例相仿,在此不再贅述。Next, please refer to FIG. 9, which is a schematic front view of another implementation aspect of the current sensing structure of the second embodiment of the present invention. From the comparison between FIG. 9 and FIG. 6, it can be seen that in the embodiment of FIG. 9, the
接著,請參閱圖10所示,圖10為本發明第二實施例的電流感測結構的再一實施態樣的立體分解示意圖。由圖10與圖6的比較可知,在圖6的實施態樣中,電流感測結構2可以是例如但不限於利用粉末冶金壓制燒結成型的一體成型方式製作,而在圖10的實施態樣中,電流感測結構2可由多個片狀結構20所組成,每一個片狀結構20依序堆疊以形成電流感測結構2,且每一個片狀結構20的形狀彼此相同。此外,每一個片狀結構20可分別包括環形本體部21、第一端部22、第二端部23以及開槽24,且每一個片狀結構20是沿著感測空間210的中心軸(圖中未標號)依序堆疊而形成電流感測結構2。進一步來說,每一個片狀結構20可為矽鋼片,藉此,片狀結構20可利用衝壓裁切的方式進行製作,且由於每一個片狀結構20是沿著感測空間210的中心軸(圖中未標號)依序堆疊而形成電流感測結構2,所以,每一個片狀結構20的形狀彼此相同,進而能夠增加電流感測結構2的組裝效率。另外,值得說明的是,相鄰的兩個片狀結構20之間可利用一黏著膠體(圖中未示出),將相鄰的片狀結構20彼此接合,而形成電流感測結構2。Next, please refer to FIG. 10, which is a three-dimensional exploded schematic view of still another implementation aspect of the current sensing structure of the second embodiment of the present invention. It can be seen from the comparison between FIG. 10 and FIG. 6 that in the embodiment of FIG. 6, the
[第三實施例][Third Embodiment]
首先,請參閱圖11及圖12所示,圖11為本發明第三實施例的電流感測結構的立體示意圖,圖12為本發明第三實施例的電流感測結構的前視示意圖。由圖11與圖6的比較可知,第三實施例與第一實施例最大的差別在於,第三實施例與第二實施例最大的差別在於,第三實施例所提供的電流感測結構2還可進一步包括一第一定位結構26以及一第二定位結構27,第一定位結構26可設置在環形本體部21上,第二定位結構27可設置在環形本體部21上且對應於第一定位結構26。First, please refer to FIGS. 11 and 12. FIG. 11 is a three-dimensional schematic diagram of a current sensing structure according to a third embodiment of the present invention, and FIG. 12 is a front schematic view of a current sensing structure according to the third embodiment of the present invention. It can be seen from the comparison between FIG. 11 and FIG. 6 that the biggest difference between the third embodiment and the first embodiment is that the biggest difference between the third embodiment and the second embodiment is that the
承上述,進一步來說,第一定位結構26及第二定位結構27可設置在環形本體部21的環形外表面211上,也就是說,環形本體部21為完整的C形環,而第一定位結構26及第二定位結構27是設置在C形環的外側。此外,也可以利用第一定位結構26及第二定位結構27將電流感測結構2設置在前述實施例的載板1上,然本發明不以此為限。此外,第一定位結構26可包括一連接於環形本體部21的第一定位本體261以及一設置在第一定位本體261上的第一定位部262。第二定位結構27可包括一連接於環形本體部21的第二定位本體271以及一設置在第二定位本體271上的第二定位部272。In view of the above, furthermore, the
接著,請參閱圖13所示,圖13為本發明第三實施例的電流感測結構的另外一實施態樣的立體分解示意圖。由圖13與圖11的比較可知,在圖11的實施態樣中,電流感測結構2可以是例如但不限於利用粉末冶金壓制燒結成型的一體成型方式製作,而在圖13的實施態樣中,電流感測結構2可由多個片狀結構20所組成,每一個片狀結構20依序堆疊以形成電流感測結構2,且每一個片狀結構20的形狀彼此相同。此外,每一個片狀結構20可分別包括環形本體部21、第一端部22、第二端部23、開槽24、第一定位結構26以及第二定位結構27。此外,相鄰的兩個片狀結構20中的其中一個片狀結構20的第一定位結構26可抵靠在相鄰的兩個片狀結構20中的另外一個片狀結構20的第一定位結構26,且相鄰的兩個片狀結構20中的其中一個片狀結構20的第二定位結構27可抵靠在相鄰的兩個片狀結構20中的另外一個片狀結構的第二定位結構27。Next, please refer to FIG. 13, which is a three-dimensional exploded schematic diagram of another implementation aspect of the current sensing structure of the third embodiment of the present invention. From the comparison between FIG. 13 and FIG. 11, it can be seen that in the embodiment of FIG. 11, the
承上述,舉例來說,以圖13的實施態樣而言,第一定位結構26的第一定位部262及第二定位結構27的第二定位部272可為一鉚點。藉此,第一定位部262及第二定位部272相對於電流感測結構2的其中一表面可呈凸出狀設置,且第一定位部262及第二定位部272相對於電流感測結構2的另外一表面可呈凹陷狀設置。所以,當相鄰的兩個片狀結構20彼此抵靠時,其中一個片狀結構20的凸出狀設置的第一定位部262及第二定位部272,可以抵靠在另外一個片狀結構20的凹陷狀設置的第一定位部262及第二定位部272,以使得多個片狀結構20能依序堆疊而形成電流感測結構2。換句話說,第一定位結構26及第二定位結構27具有定位相鄰的兩個片狀結構20之間的位置關係的效果。另外,值得說明的是,相鄰的兩個片狀結構20之間除了利用第一定位結構26及第二定位結構27彼此卡合之外,還可利用一黏著膠體(圖中未示出),將相鄰的片狀結構20彼此接合,而形成電流感測結構2。In view of the above, for example, taking the embodiment of FIG. 13, the
接著,請復參閱圖1至圖4所示,並請一併參閱圖14所示,圖14為本發明實施例的電流感測模組應用在控制器裝置上的使用狀態示意圖。舉例來說,本發明的電流感測模組U及其電流感測結構2優選可應用於一控制器裝置E,例如但不限於電動車的驅動器。控制器裝置E可包括一第一導電元件C1、一第二導電元件C2、一第三導電元件C3、一第四導電元件C4及一第五導電元件C5,控制器裝置E的第一導電元件C1、第二導電元件C2以及第三導電元件C3可分別連接於馬達,而第四導電元件C4及第五導電元件C5可分別作為直流電的正極及負極。藉此,當第一導電元件C1、第二導電元件C2、第三導電元件C3、第四導電元件C4及第五導電元件C5分別穿過電流感測模組U的載板1的貫穿孔10及電流感測結構2的感測空間210時,電流感測模組U可感測流經第一導電元件C1、第二導電元件C2、第三導電元件C3、第四導電元件C4及/或第五導電元件C5的電流值。Next, please refer to FIG. 1 to FIG. 4 again, and also refer to FIG. 14 together. FIG. 14 is a schematic diagram of the use state of the current sensing module applied to the controller device according to the embodiment of the present invention. For example, the current sensing module U and the
另外,須說明的是,雖然圖14中的電流感測結構2是以圖6所提供的電流感測結構2作為舉例說明,但是,在其他實施態樣中,也可以利用其他實施例中的電流感測結構2。此外,圖14中的電流感測結構2的結構特徵與前述實施例相仿,在此不再贅述。In addition, it should be noted that although the
[實施例的有益效果][Beneficial effects of the embodiment]
本發明的其中一有益效果在於,本發明所提供的電流感測模組U及其電流感測結構2,其能通過“第一端部22連接於環形本體部21的其中一端,且第一端部22上具有一第一倒角221”以及“第二端部23連接於環形本體部21的另外一端,且第二端部23上具有一第二倒角231”的技術方案,以提高氣隙磁通密度的均勻性,並提高電流值的量測範圍。此外,通過上述技術特徵,本發明所提供的電流感測結構2的飽和電流可大於800Arms,且線性誤差小於0.2%。One of the beneficial effects of the present invention is that the current sensing module U and the
更進一步來說,當電流感測結構2由多個片狀結構20所組成時,不僅能夠增加製程上的便利性,同時,相較於現有技術利用粉末冶金壓制燒結的電流感測結構,也能達到不易脆裂的效果。Furthermore, when the
更進一步來說,相較於現有技術利用奈米非晶材質,本發明所利用的矽鋼片不僅成本較低,同時,還能利用第一倒角221及第二倒角的設置,而達到高線性、高電流量測範圍的技術效果。再者,也解決了奈米非晶之粉末冶金製程之容易脆裂問題。Furthermore, compared with the prior art using nano-amorphous materials, the silicon steel sheet used in the present invention not only has a lower cost, but also uses the
更進一步來說,第一定位結構26及第二定位結構27是設置在環形本體部21的外側,因此,能夠避免應力提高、鐵損提高所造成的感測線性度變差的問題產生。Furthermore, the
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.
U:電流感測模組 1:載板 10:貫穿孔 2:電流感測結構 20:片狀結構 21:環形本體部 210:感測空間 211:環形外表面 212:環形內表面 22:第一端部 220:第一端面 221:第一倒角 2210:第一連接面 222:第三倒角 2220:第三連接面 23:第二端部 230:第二端面 231:第二倒角 2310:第二連接面 232:第四倒角 2320:第四連接面 24:開槽 25:阻隔層 26:第一定位結構 261:第一定位本體 262:第一定位部 27:第二定位結構 271:第二定位本體 272:第二定位部 3:電流感測元件 D:預定外徑 d:預定內徑 B:預定寬度 G:預定間隙 L1:第一預定邊寬 L2:第二預定邊寬 L3:第三預定邊寬 L4:第四預定邊寬 L5:第五預定邊寬 L6:第六預定邊寬 L7:第七預定邊寬 L8:第八預定邊寬 C1:第一導電元件 C2:第二導電元件 C3:第三導電元件 C4:第四導電元件 C5:第五導電元件 E:控制器裝置 U: Current sensing module 1: carrier board 10: Through hole 2: Current sensing structure 20: sheet structure 21: Ring body 210: Sensing Space 211: Annular outer surface 212: ring inner surface 22: first end 220: first end face 221: first chamfer 2210: The first connection surface 222: third chamfer 2220: third connection surface 23: second end 230: second end face 231: second chamfer 2310: second connection surface 232: fourth chamfer 2320: fourth connection surface 24: Slotting 25: barrier layer 26: The first positioning structure 261: The first positioning body 262: first positioning part 27: The second positioning structure 271: The second positioning body 272: second positioning part 3: Current sensing element D: predetermined outer diameter d: predetermined inner diameter B: predetermined width G: predetermined gap L1: The first predetermined side width L2: second predetermined side width L3: The third predetermined side width L4: Fourth predetermined side width L5: The fifth predetermined side width L6: The sixth predetermined side width L7: The seventh predetermined side width L8: Eighth predetermined side width C1: The first conductive element C2: second conductive element C3: third conductive element C4: Fourth conductive element C5: Fifth conductive element E: Controller device
圖1為本發明第一實施例的電流感測模組的其中一立體組合示意圖。FIG. 1 is a three-dimensional assembly diagram of the current sensing module according to the first embodiment of the present invention.
圖2為本發明第一實施例的電流感測模組的另外一立體組合示意圖。2 is another three-dimensional assembly diagram of the current sensing module according to the first embodiment of the invention.
圖3為本發明第一實施例的電流感測模組的其中一立體分解示意圖。3 is an exploded perspective view of the current sensing module according to the first embodiment of the invention.
圖4為本發明第一實施例的電流感測模組的另外一立體分解示意圖。4 is another three-dimensional exploded schematic view of the current sensing module according to the first embodiment of the invention.
圖5為本發明第二實施例的電流感測結構的立體示意圖。5 is a three-dimensional schematic diagram of the current sensing structure according to the second embodiment of the present invention.
圖6為本發明第二實施例的電流感測結構的前視示意圖。6 is a schematic front view of the current sensing structure according to the second embodiment of the present invention.
圖7為圖6的VII部分的局部放大示意圖。Fig. 7 is a partial enlarged schematic diagram of part VII of Fig. 6.
圖8為本發明第二實施例的電流感測結構的另外一實施態樣的立體示意圖。FIG. 8 is a three-dimensional schematic diagram of another implementation aspect of the current sensing structure of the second embodiment of the present invention.
圖9為本發明第二實施例的電流感測結構的另外一實施態樣的前視示意圖。9 is a schematic front view of another implementation aspect of the current sensing structure of the second embodiment of the present invention.
圖10為本發明第二實施例的電流感測結構的再一實施態樣的立體分解示意圖。10 is a three-dimensional exploded schematic diagram of still another implementation aspect of the current sensing structure according to the second embodiment of the present invention.
圖11為本發明第三實施例的電流感測結構的立體示意圖。FIG. 11 is a three-dimensional schematic diagram of a current sensing structure according to a third embodiment of the present invention.
圖12為本發明第三實施例的電流感測結構的前視示意圖。FIG. 12 is a schematic front view of a current sensing structure according to a third embodiment of the present invention.
圖13為本發明第三實施例的電流感測結構的另外一實施態樣的立體分解示意圖。FIG. 13 is a three-dimensional exploded schematic diagram of another implementation aspect of the current sensing structure of the third embodiment of the present invention.
圖14為本發明實施例的電流感測模組應用在控制器裝置上的使用狀態示意圖。FIG. 14 is a schematic diagram of the use state of the current sensing module applied to the controller device according to the embodiment of the present invention.
2:電流感測結構 2: Current sensing structure
21:環形本體部 21: Ring body
210:感測空間 210: Sensing Space
211:環形外表面 211: Annular outer surface
212:環形內表面 212: ring inner surface
22:第一端部 22: first end
220:第一端面 220: first end face
221:第一倒角 221: first chamfer
222:第三倒角 222: third chamfer
23:第二端部 23: second end
230:第二端面 230: second end face
231:第二倒角 231: second chamfer
232:第四倒角 232: fourth chamfer
24:開槽 24: Slotting
Claims (9)
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