TWI697272B - Heat dissipation module and electronic device - Google Patents

Abstract

A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a forth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.

Description

Heat dissipation module and electronic device

The invention relates to a module and a device, and particularly relates to a heat dissipation module and an electronic device.

With the continuous advancement of technology, the development of various electronic products is more rapid. Among them, in addition to being able to make calls, handheld electronic devices such as mobile phones have also developed the function of using a variety of applications. Applications include shooting with electronic device lenses and audiovisual entertainment. When using various applications, electronic components such as lenses or processors quickly generate heat. Therefore, how to dissipate the heat generated by electronic components to reduce the high temperature and discomfort experienced by users in holding electronic devices is an important research direction.

The invention provides a heat dissipation module and an electronic device, which can improve the problem that the electronic device is locally overheated and causes user discomfort.

The heat dissipation module of the present invention includes a first heat transfer element and a second heat transfer element And consistent cold components. The first heat transfer member has a first end and a second end opposite to each other. The second heat transfer member has a third end and a fourth end opposite to each other. The refrigeration element is disposed between the second end and the third end to allow or block the transfer of heat between the second end and the third end.

In an embodiment of the present invention, wherein the first heat transfer element and the second heat transfer element are heat pipes or soaking plates.

In an embodiment of the invention, the cooling element is used to allow one-way transfer of heat between the second end and the third end.

The electronic device of the present invention includes a first heating element, a second heating element and a heat dissipation module. The heat dissipation module includes a first heat transfer element, a second heat transfer element, and a uniform cooling element. The first heat transfer member has a first end and a second end opposite to each other. The second heat transfer member has a third end and a fourth end opposite to each other. The refrigeration element is disposed between the second end and the third end to allow or block the transfer of heat between the second end and the third end.

In an embodiment of the present invention, when the first heating element generates heat, the cooling element blocks heat transfer between the second end and the third end.

In an embodiment of the invention, the electronic device further includes a control element. When the power consumption of the second heating element is greater than a preset value, the control element controls the refrigeration element to allow heat transfer between the second end and the third end.

In an embodiment of the invention, the first heat transfer element and the second heat transfer element are a heat pipe (Heat Pipe) or a soaking plate (Vapor chamber).

In an embodiment of the invention, the cooling element is used to allow one-way transfer of heat between the second end and the third end.

In an embodiment of the invention, the electronic device further includes a printed circuit board. The first heating element and the second heating element are arranged on the printed circuit board.

In an embodiment of the invention, the electronic device further includes a housing and a cover. The printed circuit board, the first heating element, the second heating element and the heat dissipation module are arranged in the casing, and the cover plate is combined with the casing.

Based on the above, the heat dissipation module and the electronic device of the present invention can control the transfer direction and range of heat in the electronic device through the control element, so that the user can get good comfort in different holding states.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

100: electronic device

110: shell

120: Cover

130: printed circuit board

140: the first heating element

150: second heating element

160: cooling module

161: The first heat transfer

161A: First end

161B: Second end

162: Second heat transfer element

162A: Third end

162B: Fourth end

163: Cooling element

163A: Condensation surface

163B: Heating surface

170: control element

300: Flow chart

301, 302, 303, 304, 305, 306: square

L: Long side

S: Short side

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention.

Fig. 2 is a partial cross-sectional view of the vicinity of the refrigeration element in Fig. 1.

FIG. 3 is a flowchart of the electronic device determining the heat transfer range according to an embodiment of the invention.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention. Please refer to the picture 1. The electronic device 100 of this embodiment includes a first heating element 140, a second heating element 150, and a heat dissipation module 160. The electronic device 100 may optionally further include a housing 110, a cover 120, and一 Printed circuit board 130. In order to make the internal components of the electronic device 100 more clear, the cover 120 and/or the touch panel (not shown) and/or the display panel (not shown) of the electronic device 100 are separated in FIG. Used to display internal components. The first heating element 140 and the second heating element 150 are disposed on the printed circuit board 130. The printed circuit board 130, the first heating element 140, the second heating element 150 and the heat dissipation module 160 are all disposed in the housing 110. The cover plate 120 is combined with the housing 110. The electronic device 100 is, for example, a mobile phone or a tablet computer, and the invention is not limited thereto.

The printed circuit board 130 is provided with a first heating element 140, a second heating element 150 and a heat dissipation module 160. The heat dissipation module 160 of this embodiment includes a first heat transfer element 161, a second heat transfer element 162, and a uniform cooling element 163. The first heat transfer element 161 has a first end 161A and a second end 161B opposite to each other, wherein the first end 161A thermally contacts the first heating element 140. The second heat transfer element 162 has a third end 162A and a fourth end 162B opposite to each other, wherein the fourth end 162B thermally contacts the second heating element 150. In this embodiment, the first heating element 140 is, for example, a camera module of the electronic device 100. The second heating element is, for example, a central processing unit (Central Processing Unit; CPU) or other element that operates with high efficiency. Compared with the second heating element 150, the first heating element 140 generates less power and heat. The heat generated by the first heating element 140 and the second heating element 150 can The heat is conducted through the heat dissipation module 160 to dissipate heat from the first heating element 140 and the second heating element 150.

Fig. 2 is a partial cross-sectional view of the vicinity of the refrigeration element in Fig. 1. Please refer to Figure 1 and Figure 2. The cooling element 163 is, for example, a thermoelectric cooling unit (thermoelectric cooling unit), and has a condensing surface 163A and a heating surface 163B. The cooling element 163 is disposed between the second end 161B of the first heat transfer member 161 and the third end 162A of the second heat transfer member 162. In this embodiment, the condensing surface 163A of the cooling element 163 is attached to the second heat transfer element 162, and the heating surface 163B of the cooling element 163 is attached to the first heat transfer element 161. Therefore, the cooling element 163 is used to allow one-way heat transfer from the third end 162A of the second heat transfer member 162 to the second end 161B of the first heat transfer member 161. However, through different design schemes, heat can also be transferred unidirectionally from the second end 161B of the first heat transfer member 161 to the third end 162A of the second heat transfer member 162, or the heat can be transferred in both directions. No restrictions on this.

In addition, the electronic device 100 further includes a control element 170 connected to the cooling element 163 to control the cooling element 163 to allow or block heat transfer between the second end 161B and the third end 162A. In detail, when the power consumption of the second heating element 150 is greater than a preset value, for example, when the electronic device 100 is used for some high-performance applications, the control element 170 controls the cooling element 163 to allow the heat to be at the second end The transfer between the portion 161B and the third end portion 162A enables heat to be dispersed from the second heat transfer member 162 to the first heat transfer member 161 to accelerate the heat dissipation efficiency. Conversely, when the power consumption of the second heating element 150 is less than a preset value, for example, only the electronic device is used Set 100 to perform some applications that can be executed by the first heating element 140 without additional power-on or by operating the second heating element 150 with low power consumption. The control element 170 controls the cooling element 163 to block heat The transfer between the second end 161B and the third end 162A keeps the heat within the range covered by the first heat transfer member 161 for heat dissipation. That is, when the first heating element 140 serves as the main operating unit of the electronic device 100 and generates heat, the cooling element 163 is controlled by the control element 170 to block the heat between the second end 161B and the third end 162A Transfer between. In this embodiment, the first heat transfer member 161 and the second heat transfer member 162 may be heat pipes (Heat Pipe) or a heat distribution plate (Vapor chamber), but it is not limited thereto.

FIG. 3 is a flowchart of the electronic device determining the heat transfer range according to an embodiment of the invention. To more clearly describe the operation principle of the heat dissipation module 160 of the electronic device 100 in the present invention, please refer to FIGS. 1 and 3.

As shown in block 301 of the flowchart 300, the electronic device 100 uses, for example, an inertial measurement unit (IMU) to turn on the function of detecting the user's gripping mode after booting. The holding mode mentioned here is generally divided into an upright holding shown in block 302 to make the electronic device 100 stand upright, and a holding holding mode shown in block 303 to make the electronic device 100 roll horizontally. In detail, the upright grip refers to the user holding the long side L of the electronic device 100 to make the electronic device 100 stand upright, while the horizontal grip refers to the user holding the short side S of the electronic device 100 to cause the electronic The device 100 swings sideways. In this embodiment, the first heat transfer member 161 is disposed near the short side S of the electronic device 100. Therefore, when the user holds the When the electronic device 100 is held in a manner, it is not easy to encounter the heat radiation range covered by the first heat transfer member 161. In contrast, the second heat transfer member 162 is disposed near the long side L of the electronic device 100. When the user holds the electronic device 100 in a horizontal holding manner, it is not easy to encounter the heat dissipation range covered by the second heat transfer member 162.

In the upright holding state, the electronic device 100 determines that the electronic device 100 is in a low power consumption state, for example, through a central processing unit or other components, such as photographing, video recording, or text transmission. The function that can be achieved by operating the second heating element 150 with power consumption, and as the block 304 stops the operation of the cooling element 163. At this time, since the heat generated by the first heating element 140 is only dissipated through the first heat transfer member 161, the user is less likely to contact the electrons caused by the heat dissipation of the first heat transfer member 161 in the state of being held upright The local temperature rise of the device 100 maintains the user's comfortable grip in the upright position.

In the horizontal holding state, the control element 170 in the electronic device 100 determines the power consumption of the electronic device 100 as shown in block 305. Generally speaking, the application programs used by the user in the horizontal holding state are functions that can be completed only through the operation of the second heating element 150, such as watching videos, game programs, or graphic design. At this time, if the power consumption is lower than a preset value, the control element 170 determines that the electronic device 100 is in a low power consumption state, and then stops the operation of the cooling element 163 as shown in block 304, so that the second heating element 150 generates The heat is only dissipated through the second heat transfer member 162. Therefore, the user is less likely to contact the second heat transfer member due to heat dissipation in the state of lateral holding, and the local temperature rise of the electronic device is maintained. This improves the user's comfortable grip in the horizontal position.

When the power consumption is higher than the preset value, the control element determines that the electronic device is in a high power consumption state, and turns on the cooling element 163 as shown in block 306, so that the heat generated by the second heating element 150 can pass through at the same time The first heat transfer element 161 and the second heat transfer element 162 dissipate heat, thereby avoiding the situation that the heat is too late to escape and overheat. Since the electronic device 100 simultaneously dissipates heat quickly and over a large area through the first heat transfer member 161 and the second heat transfer member 162, the local temperature rise of the electronic device 100 is not particularly noticeable, and can maintain the user’s grip Comfort.

In summary, the heat dissipation module and the electronic device of the present invention determine the heat dissipation path of the first heating element and the second heating element through the operation of the cooling element. Different heat dissipation schemes are adopted in different holding states, so that the user can maintain a certain degree of comfort regardless of the holding state.

Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

100: electronic device

110: shell

120: Cover

130: printed circuit board

140: the first heating element

150: second heating element

160: cooling module

161: The first heat transfer

161A: First end

161B: Second end

162: Second heat transfer element

162A: Third end

162B: Fourth end

163: Cooling element

170: control element

L: Long side

S: Short side

Claims (10)

A heat dissipation module, including: A first heat transfer member having a first end and a second end opposite to each other; A second heat transfer member having a third end and a fourth end opposite to each other; and A uniform cooling element is provided between the second end and the third end to allow or block heat transfer between the second end and the third end. The heat dissipation module as described in item 1 of the patent application scope, wherein the first heat transfer element and the second heat transfer element are heat pipes or a uniform heat plate. The heat dissipation module as described in item 1 of the patent application scope, wherein the cooling element is used to allow one-way transfer of heat between the second end and the third end. An electronic device, including: A first heating element; A second heating element; and A cooling module, including: A first heat transfer element having a first end and a second end opposite to each other, wherein the first end thermally contacts the first heating element; A second heat transfer member having a third end and a fourth end opposite to each other, wherein the fourth end thermally contacts the second heating element; and A uniform cooling element is provided between the second end and the third end to allow or block heat transfer between the second end and the third end. The electronic device as claimed in item 4 of the patent application range, wherein when the first heating element generates heat, the cooling element blocks heat transfer between the second end and the third end. The electronic device as described in item 4 of the patent application scope further includes a control element, wherein when the power consumption of the second heating element is greater than a preset value, the control element controls the cooling element to allow heat in the second Transfer between the end and the third end. The electronic device as described in item 6 of the patent application range, wherein the first heat transfer member and the second heat transfer member are heat pipes or a heat spreader. An electronic device as described in item 6 of the patent application range, wherein the cooling element is used to allow one-way transfer of heat between the second end and the third end. The electronic device as described in item 4 of the patent application scope further includes a printed circuit board, wherein the first heating element and the second heating element are disposed on the printed circuit board. The electronic device as described in item 9 of the patent application scope further includes a housing and a cover plate, wherein the printed circuit board, the first heating element, the second heating element and the heat dissipation module are disposed in the housing , And the cover plate is combined with the housing.

Images