TWI694126B - Resin composition, adhesive film and semiconductor device - Google Patents

Abstract

The present invention provides a resin composition excellent in thermal conductivity, adhesiveness and film formation properties, in particular, a resin composition with excellent thermal conductivity after curing.

The resin composition of this invention comprises: (A) aminophenol epoxy resin, (B) at least one selected from the group consisting of phenoxy resin and thermal plastic elastomer, and (C) high-thermal-conductive inorganic filler, and with respect to 1 part by mass of the (A) component, (B) component is 0.5 to 5 parts by mass.

Description

Resin composition, adhesive film and semiconductor device

The present invention relates to a resin composition, an adhesive film, and a semiconductor device, in particular, a resin composition capable of forming a semiconductor device with excellent heat dissipation and high reliability, and an adhesive film, and the resin composition by the adhesive film The manufactured semiconductor device.

In recent years, as modules and electronic components have become more functional and denser, heat generated by heating elements such as modules or electronic components will increase. The heat from these heating elements is conducted to the substrate and the like, and is dissipated. In order to efficiently conduct this heat, the adhesive between the heating element and the substrate is made of a material with high thermal conductivity. In addition, from the viewpoint of good operability, an adhesive film with high thermal conductivity can be used instead of the adhesive.

Here, when the thermal conductivity of the film is not good, heat will accumulate in the semiconductor device of the assembled module or electronic component, and it will cause the problem of failure of the semiconductor device. Therefore, companies are developing thin films with high thermal conductivity.

In the above adhesive film, not only thermal conductivity is required, It also requires insulation, heat resistance, and connection reliability (adhesion strength). In the adhesive film, if a large amount of filler with high thermal conductivity is used, although the related thermal conductivity can be improved, as the filling amount of the filler increases, the amount of the resin component in the adhesive film will be relatively reduced, so it is difficult to obtain The question of strength follows expectations. In addition, with the increase in the filling amount of the filler, the problem of lowering the strength is not limited to the adhesive film with high thermal conductivity. For example, from the viewpoint of lowering the thermal expansion rate, when the filler is filled in the composition, The problem.

As an epoxy resin with high thermal conductivity, Patent Document 1 has disclosed an epoxy resin which is suitable for processes such as film forming and coating, and has sufficient film-forming properties, extensibility, thermal conductivity, and heat resistance. , Flexible and other physical properties are also excellent epoxy resins, epoxy resins with biphenyl skeleton; Patent Document 2 has disclosed an epoxy resin, whether it is introduced into the liquid crystal original group (mesogenic group), It is easy to manufacture and can obtain a hardened product with excellent solubility in organic solvents, strong toughness, and excellent thermal conductivity.

[Prior Technical Literature] (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open No. 2012-107215

Patent Document 2: Japanese Patent Application Publication No. 2010-001427

However, it is required to have the thermal conductivity of the above epoxy resin to Epoxy resin with thermal conductivity. The present invention was made in view of the above facts, and an object of the present invention is to provide a resin composition having excellent thermal conductivity, adhesiveness, and film formability, especially a resin composition having excellent thermal conductivity after curing.

The present invention relates to a resin composition, an adhesive film, and a semiconductor device that solve the above problems by having the following structure.

[1] A resin composition containing (A) an aminophenol-type epoxy resin, (B) at least one selected from the group consisting of phenoxy resins and thermoplastic elastomers, and (C) high thermal conductivity An inorganic filler, and the component (B) is 0.5 to 5 parts by mass relative to 1 part by mass of the component (A).

[2] The resin composition according to the above [1], wherein the component (A) is represented by the following chemical formula (1).

[3] The resin composition according to the above [1] or [2], wherein the glass transition temperature of the component (B) is less than 50°C.

[4] The resin composition according to any one of the above [1] to [3], wherein the (C) component is selected from MgO, Al ₂ O ₃ , AlN, BN, diamond filler, ZnO, and SiC At least one of the groups formed.

[5] An adhesive film formed from the resin composition according to any one of the above [1] to [4].

[6] A semiconductor device using the cured body of the adhesive film described in [5] above.

According to the present invention [1], it is possible to provide a resin composition excellent in thermal conductivity, adhesiveness, and film formability, in particular, a resin composition excellent in thermal conductivity after curing.

According to the present invention [5], it is possible to provide an adhesive film having excellent thermal conductivity and adhesiveness, especially, excellent thermal conductivity after hardening. According to the present invention [6], a highly reliable semiconductor device can be provided by a cured body of an adhesive film having excellent thermal conductivity, adhesion, and thermal conductivity.

Figures 1 (A) to (E) show schematic diagrams for explaining the method of blade coating.

The resin composition of the present invention contains (A) an aminophenol-type epoxy resin, (B) at least one selected from the group consisting of phenoxy resins and thermoplastic elastomers, and (C) high thermal conductivity inorganic The filler is 0.5 to 5 parts by mass relative to 1 part by mass of (A) component. Here, (C) inorganic filler with high thermal conductivity means an inorganic filler of 5 W/m‧K or more.

(A) The component is in the resin composition after hardening, and can impart high thermal conductivity. In the present invention, the aminophenol epoxy resin of component (A) Refers to those who have epoxidized various aminophenols by known methods. Examples of aminophenols include 2-aminophenol, 3-aminophenol, 4-aminophenol, 2-amino-m-cresol, 2-amino-p-cresol, Aminophenols such as 3-amino-o-cresol, 4-amino-m-cresol, 6-amino-m-cresol, and aminocresols are not limited thereto.

(A) The component is the following chemical formula (1):

In order to make the cured resin composition highly thermally conductive, an aminophenol-type epoxy resin is preferred. Examples of the commercially available product of component (A) include aminophenol-type epoxy resins (product name: 630) manufactured by Mitsubishi Chemical Corporation. (A) The component may be used alone, or two or more kinds may be used in combination.

(B) The component system can impart film formability to the resin composition. (B) The phenoxy resin of the component is not particularly limited, and examples thereof include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, phenolic skeleton, biphenyl skeleton, and fluorene skeleton. , Dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, trimethylcyclohexane skeleton, one or more skeletons. As a commercially available product of the phenoxy resin of the component (B), a flexible phenoxy resin (product name: YL7178, glass transition temperature: 15°C) made by Mitsubishi Chemicals can be cited.

Examples of the thermoplastic elastomer as component (B) include Polyurethane rubber, acrylic rubber, polysiloxane rubber, vinyl alkyl ether rubber, polyvinyl alcohol rubber, polyvinylpyrrolidone rubber, polypropylene amide rubber, cellulose rubber, natural rubber, butadiene rubber, chloroprene Ene rubber, styrene/butadiene rubber (SBR), acrylonitrile/butadiene rubber (NBR), styrene/ethylene/butadiene/styrene rubber, styrene/isoprene/styrene rubber, Synthetic acrylic rubber obtained by polymerization of styrene/isobutylene rubber, isoprene rubber, polyisobutylene rubber, butyl rubber, alkyl (meth)acrylate-containing monomer, styrene-butadiene block copolymerization (SBS), styrene-ethylene/butene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), polybutadiene (PB), benzene Ethylene-(ethylene-ethylene/propylene)-styrene block copolymer (SEEPS), ethylene-unsaturated carboxylic acid copolymer (for example, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, etc.), ethylene-not Saturated carboxylic acid ester copolymers (for example, ethylene-ethyl acrylate copolymers, ethylene-ethyl methacrylate copolymers, etc.), and carboxylic anhydride modified products (such as maleic anhydride modified products) selected from these Form at least one of the groups. As a commercially available product of the thermoplastic elastomer of component (B), an acrylate copolymer (product name: SG790, glass transition temperature: -32°C) manufactured by Nagasechemtex Corporation can be cited. (B) The component may be used alone, or two or more kinds may be used in combination.

The component (B) system is preferred because it has film formability of the resin composition, moderate flexibility in the resin composition after curing, and a glass transition temperature (Tg) of less than 50°C. In addition, from the viewpoint of film formability and adhesiveness of the resin composition, the component (B) is the glass transition temperature The phenoxy resin whose (Tg) is less than 50°C is more preferable.

As the component (C), if the thermal conductivity is 5 W/m‧K or more, from the viewpoint of maintaining insulation, a general inorganic filler can be used. From the viewpoint of thermal conductivity, insulation and thermal expansion coefficient, if it is at least one inorganic filler selected from the group consisting of MgO, Al ₂ O ₃ , AlN, BN, diamond filler, ZnO, and SiC It is preferable to use the component (C). In addition, in ZnO and SiC, insulation treatment may be performed as necessary. As an example of the measurement results of the thermal conductivity of each material (unit is W/m‧K), MgO is 37, Al ₂ O ₃ is 30, AlN is 200, BN is 30, diamond is 2000, ZnO is 54 and SiC is 90. Examples of commercially available products of component (C) include magnesium oxide powder (product names: SMO-5, SMO-1, SMO-02, and SMO-2) manufactured by Sakai Chemical Industries, and alumina (Al ₂ O ₃ ) manufactured by Showa Denko. Powder (product name: CBA09S), alumina (Al ₂ O ₃ ) powder (product name: DAW-03, ASFP-20) manufactured by the Electric Chemical Industry.

(C) The average particle diameter of the component (when it is not granular, refers to the average maximum diameter), although not particularly limited, it is preferably 0.05 to 50 μm in terms of uniformly dispersing the (C) component in the resin composition . If it is less than 0.05 μm, the viscosity of the resin composition will increase, and the moldability may deteriorate. If it exceeds 50 μm, it may be difficult for the (C) component to be uniformly dispersed in the resin composition. Here, the average particle diameter of the component (C) is measured by a dynamic light scattering nano-track particle size analyzer. (C) The component may be used alone, or two or more kinds may be used in combination.

(A) Component system relative to resin composition (without solvent): 100 parts by mass, preferably 1.5 to 15 parts by mass, and 2 to 10 parts by mass The portion is better.

(B) The component system is 0.5 to 5 parts by mass relative to 1 part by mass of (A) component from the viewpoints of the film formability of the resin composition, the thermal conductivity of the cured resin composition, and the heat resistance. (B) The component system is less than 0.5 parts by mass relative to 1 part by mass of the (A) component, and the resin composition film cannot be formed. When it exceeds 5 parts by mass, the thermal conductivity of the cured resin composition becomes low. In addition, the total of (A) and (B), from the viewpoint of the film formability, adhesiveness of the resin composition, and the thermal conductivity of the cured resin composition, relative to the resin composition (without solvent): 100 mass Parts, preferably 4 to 20 parts by mass.

From the viewpoints of adhesiveness of the resin composition, insulation of the cured resin composition, and thermal expansion coefficient, (C) component relative to the resin composition (excluding solvent): 100 parts by mass, 40 to 95 parts by mass Better. (C) If the component exceeds 95 parts by mass, the adhesive force of the resin composition tends to decrease. On the other hand, if the component (C) is less than 40 parts by mass, even if the thermal conductivity of the high thermal conductivity inorganic filler is high, the thermal conductivity of the cured resin composition may not be sufficient.

The resin composition preferably contains (D) hardener. Examples of component (D) include phenol-based hardeners, acid anhydride-based hardeners, amine-based hardeners, imidazole-based hardeners, carboxylic acid dihydrazine hardeners, etc., selected from phenol-based hardeners and amine-based hardeners At least one of the group consisting of an acid anhydride hardener and an imidazole hardener is preferred. In addition, from the viewpoint of adhesiveness of the resin composition, a phenol-based hardener is more preferable, and from the viewpoint of fluidity and adhesiveness of the resin composition, an acid anhydride-based hardener is more preferable. From From the viewpoint of storage stability of the resin composition, an imidazole-based hardener is more preferable.

Examples of the phenolic hardener include phenol novolak and cresol novolak, and phenol novolak is preferred. In addition, phenol-based hardeners have a slower curing rate than other hardeners such as anhydride-based hardeners, amine-based hardeners, and imidazole-based hardeners. Therefore, when other hardeners are used, the curing rate of the resin composition becomes peracetylene In this case, a phenolic curing agent can be used in combination to slow down the curing speed of the resin composition.

Examples of the acid anhydride include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, and hydrogenated methyl Kinadike anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene tetracarboxylic dianhydride, phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic diacid Anhydride, ethylene glycol bis-dehydrated trimellitate, glycerol bis(dehydrated trimellitate) monoacetate, dodecenyl succinic anhydride, aliphatic dibasic acid polyanhydride, Chlorendic anhydride , Methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl humic (HIMIC) anhydride, succinic anhydride substituted with alkenyl, glutaric anhydride, etc., with methyl Butenyl tetrahydrophthalic anhydride is preferred.

Examples of the amine-based hardener include chain aliphatic amines, cyclic aliphatic amines, aliphatic aromatic amines, and aromatic amines, and aromatic amines are preferred. Examples of carboxylic acid dihydrazine hardeners include adipic acid dihydrazine, isophthalic acid dihydrazine, sebacic acid dihydrazine, and dodecanoic acid dihydrazine. Adipic acid dihydrazine is preferred.

As the imidazole-based hardener, from the viewpoint of storage stability of the resin composition, it is preferably an imidazole compound hardener microencapsulated and an amine addition molding hardener. From the workability of the resin composition, the curing speed, From the viewpoint of preservation of stability, a microencapsulated imidazole compound hardener dispersed in liquid epoxy resin such as liquid bisphenol A type is more preferable. Examples of the imidazole hardener include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-benzene 4-methylimidazole, 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-triazine, 2-phenyl-4,5-di Hydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrole[1,2-a]benzimidazole, etc., of which 2,4- Diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-( 1)]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine It is preferable from the viewpoint of curing speed, workability, and moisture resistance of the resin composition.

Examples of commercially available products of component (D) include phenolic hardeners manufactured by Meiwa Chemicals (product names: MEH8000, MEH8005), acid anhydrides manufactured by Mitsubishi Chemical Corporation (grades: YH306, H307), and Hitachi Chemical Co., Ltd. 3 or 4-methyl- Hexahydrophthalic anhydride (product name: HN-5500), amine hardener made by Nippon Kayaku (product name: Kayahard AA), adipic acid dihydrazine (product name: ADH) made by Finechem Japan, microcapsules made by Asahi Kasei E-materials Imidazole compound hardener (product name: HX3722, HX3742, HX3932HP, HX3941HP), amine addition molding hardener (product name: PN-40J) manufactured by Ajinomoto Finetechno Corporation, 2-ethyl-4-methyl manufactured by Shikoku Chemical Industry Imidazole Name: 2E4MZ), etc., (D) ingredients are not limited to products of this name. (D) The component may be used alone, or two or more kinds may be used in combination.

(D) The component is preferably 0.1 to 5 parts by mass relative to 100 parts by mass of the resin composition (excluding the solvent) from the viewpoint of storage stability and curability of the resin composition.

In addition, the resin composition may contain additives such as coupling agents, tackifiers, defoamers, flow regulators, film-forming auxiliary agents, dispersants, or organic solvents as long as the effects of the present invention are not impaired.

Examples of organic solvents include aromatic solvents such as toluene and xylene, and ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone. The organic solvents may be used alone or in combination of two or more. In addition, although the amount of the organic solvent used is not particularly limited, the solid content is preferably used so as to be 20 to 50% by mass. From the viewpoint of workability of the resin composition, the resin composition preferably has a viscosity range of 200 to 3000 mPa‧s. The viscosity is a value measured using an E-type viscometer at a rotation speed of 10 rpm and 25°C.

[Then film]

The above-mentioned resin composition is suitable for the formation of an adhesive film. The resin composition can be obtained by dissolving or dispersing raw materials containing components (A) to (C) in an organic solvent. The apparatus for dissolving or dispersing these raw materials is not particularly limited, but a crusher, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. equipped with a stirring and heating device can be used. In addition, these devices may be appropriately combined and used.

Next, the film is obtained by applying the above-mentioned resin composition on a desired support and drying it. The supporting system is not particularly limited, and examples include metal foils such as copper and aluminum, organic resins such as polyester resin, polyethylene resin, and polyethylene terephthalate resin. The support can also be released from polysilicon compounds.

The method of applying the resin composition to the support is not particularly limited, but from the viewpoint of thinning/thickness control, the microgravure printing method, the slit die method, and the doctor blade method are preferred. By the slit die method, an adhesive film with a thickness of 10 to 300 μm after heat curing can be obtained.

The drying conditions can be appropriately set according to the type, amount, or thickness of the organic solvent used in the resin composition, and for example, it can be set to about 50 to 120° C. for about 1 to 30 minutes. The adhesive film obtained in this way has good storage stability. Then, the film can be peeled from the support at a desired time.

Then, the film is thermally hardened at 130 to 200° C. for 30 to 180 minutes, for example, and can be adhered. When the adherend of the heating element and the adherend of the heating element are connected, the hardened adhesive film escapes the heat of the adherend from the heating element toward the adherend side of the heating element, and the adherend of the heating element The side plays the role of heat transfer to dissipate heat. In addition, the hardened adhesive film functions to relax the stress caused by the difference in thermal expansion rate between the adherend of the heating element and the adherend of the heated body.

Next, the thickness of the film is preferably 10 μm or more and 300 μm or less, more preferably 10 μm or more and 100 μm or less, and still more preferably 10 μm or more and 50 μm or less. When it is less than 10μm, I may not get what I expect Insulation. If it exceeds 300 μm, the object to be heated may not be able to dissipate heat sufficiently. As the thickness of the adhesive film becomes thinner, the distance between the adherend of the heating element and the adherend of the heat receiving body becomes shorter, so from the viewpoint of efficient heat conduction, the thinner the adhesive film is, the better.

In addition, the cured adhesive film preferably has a thermal conductivity of 2 W/m‧K or more. In addition, when the thermal conductivity of the hardened adhesive film is less than 2W/m‧K, the heat transfer from the heat receiver of the heating element may be insufficient. The volume resistivity and thermal conductivity of the cured film can be controlled by the type and content of (C) component.

The peel strength of the hardened adhesive film is preferably more than 5N/cm. If the peeling strength of the cured adhesive film exceeds 5 N/cm, the use of a cured body of the adhesive film can improve the reliability of the semiconductor device.

The cured adhesive film preferably has a volume resistivity of 1×10 ¹⁰ Ω‧cm or more. When the volume resistivity of the hardened adhesive film is less than 1×10 ¹⁰ Ω‧cm, the insulation required by the semiconductor device may not be satisfied.

[Semiconductor device]

The semiconductor device of the present invention uses the cured product of the aforementioned adhesive film. The cured product of the adhesive film having excellent thermal conductivity and adhesive strength can provide a highly reliable semiconductor device. Examples of semiconductor devices include those in which a heating element such as a module or an electronic component, and a heating element such as a substrate are connected with a hardened material that adheres to a thin film; or a substrate that receives heat from the heating element and further The heat dissipation plate of this substrate is attached to the film And the hardener.

[Example]

Although the present invention is explained by the examples, the present invention is not limited to these. In the following examples, parts and% represent mass parts and mass% unless otherwise specified.

[Examples 1 to 12, Comparative Examples 1 to 4]

According to the formulation shown in Table 1 and Table 2, (A) component, (B) component, and an appropriate amount of toluene are metered and mixed, then put these into a reaction kettle heated to 80 ℃, with a rotation number of 150rpm While rotating, mix at normal pressure for 3 hours to produce a varnish. To the produced varnish, component (C), component (D), and other components are added, and dispersed by a planetary mixer to produce a resin composition for an adhesive film.

[assessment method]

1. Determination of thermal conductivity

The obtained resin composition for an adhesive film was applied on a 50 μm-thick PET film subjected to a release agent so that the film thickness after drying was 200 to 400 μm. Fig. 1 is a schematic diagram for explaining the method of blade coating. First, on the PET film to which the release agent is applied, two rows of spacers are stacked so as to have an appropriate thickness, and then pasted with an adhesive tape (Figure 1(A)). On the PET film to which the release agent is attached, an appropriate amount of the composition for adhesive film is injected (Figure 1 (B)). Place the watch glass on the spacer, scrape and apply the composition for the next film and apply it (1st Figures (C) to (E)). Next, after the applied adhesive film composition was sufficiently dried, the resulting adhesive film was cured using a vacuum press at 180° C.×60 minutes and 0.1 MPa. The cured adhesive film was cut into 10×10 mm, and a test piece for measuring thermal conductivity was prepared. The thermal conductivity of the prepared test piece for thermal conductivity measurement was measured with a thermal conductivity meter (Xe flash analyzer, model: LFA 447 Nano flash) manufactured by NETZSCH. Tables 1 and 2 show the measurement results of thermal conductivity.

2. Determination of peel strength

Prepare copper foil that has been roughened on one side. In the same manner as the thermal conductivity evaluation, the two sides of the film are adhered, and the inner side is the roughened surface and the copper foil is adhered. Using a vacuum press, it was heated and pressure-bonded at 180°C for 60 minutes at 0.1 MPa to harden it. This hardened body was cut to a width of 10 mm to prepare a sample for measuring peel strength. The prepared sample for peel strength measurement was peeled with a precision universal testing machine (model: ASG-J-5 k NJ) manufactured by Shimadzu Corporation, and the peel strength was measured. Regarding the measurement results, the average value of each N=5 was calculated. Tables 1 and 2 show the results of peel strength.

3. Film formability

The obtained composition for an adhesive film was coated on a 50 μm-thick PET film to which a release agent had been applied using a coater to have a width of 20 cm and a film thickness of 30 to 200 μm after drying. The applied adhesive film composition was dried at 80°C for 20 minutes. This film was wound into a reel of 50 mmφ and 40 cm width, and the film formability was evaluated. Set to prevent cracking even if it is bent "5", if it is bent, part of it will crack, set to "4", if it is completely cracked, set to "3", when it becomes a film, but it is easy to crack, set to "2", not become a film. Set to "1" when not available. Tables 1 and 2 show the results of film formability.

1) Mitsubishi Chemical, product name: 630

2) DIC, product name: HP4032D

3) DIC, product name: HP4700

4) Mitsubishi Chemical, product name: EXA4816

5) Mitsubishi Chemical, product name: YL7178, glass transition temperature: 15℃

6) Made by Nagase Chemical Technology, product name: SG790, copolymer of acrylic acid n-butyl and acrylonitrile, glass transition temperature: -32℃

7) Nippon Steel & Sumitomo Chemical Co., Ltd., product name: YP50S, glass transition temperature: 84℃

8) Sakai Chemical Industry, product name: SMO-5, average particle size: 5 μm

9) manufactured by Sakai Chemical Industry, product name: SMO-1, average particle size: 1 μm

10) Sakai Chemical Industry, product name: SMO-02, average particle size: 0.2 μm

11) Sakai Chemical Industry, product name: SMO-2, average particle size: 2 μm

12) Showa Denko Industries, product name: CBA09S, average particle diameter: 9 μm

13)Electrochemical system, product name: DAW-03, average particle size: 3.7μm

14)Electrochemical system, product name: ASFP-20, average particle size: 0.3μm

15) 2-ethyl-4-methylimidazole manufactured by Shikoku Chemical Industry Co., Ltd., product name: 2E4MZ

16) Asahi Kasei E-Materials, product name: HX3941HP

17) Novolac type phenol hardener made by DIC, product name: KA1160

18) 3-Epoxypropyltrimethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM403

19) BYK system, product name: BYK111

As is clear from Tables 1 and 2, all the results of thermal conductivity, peel strength, and film formability were good in all of Examples 1 to 12. In contrast to this, Comparative Example 1 using a naphthalene-type epoxy resin in place of an aminophenol-type epoxy resin has a low thermal conductivity. In Comparative Example 2 in which a naphthalene type multifunctional epoxy resin was used instead of an aminophenol type epoxy resin, the thermal conductivity was also low. In Comparative Example 3 in which bisphenol A type epoxy resin was used instead of aminophenol type epoxy resin, the thermal conductivity was also low. (B) The comparative example 4 whose component is too small with respect to (A) component cannot form the composition for adhesive films into a thin film, and therefore cannot measure thermal conductivity and peel strength.

As described above, the composition of the present invention can provide a resin composition excellent in thermal conductivity, adhesiveness, and film formability, and particularly can provide a resin composition excellent in thermal conductivity after curing.

Claims (7)

A resin composition containing (A) an aminophenol-type epoxy resin, (B) a phenoxy resin with a glass transition temperature of less than 50°C, and (C) selected from MgO, Al ₂ O ₃ , AlN, BN , Diamond filler, ZnO and SiC at least one kind of high thermal conductivity inorganic filler, and relative to (A) component 1 part by mass, (B) component is 0.5 to 5 parts by mass, relative to resin The composition (excluding the solvent) is 100 parts by mass, and the component (C) is 40 to 95 parts by mass. The resin composition as described in item 1 of the scope of patent application, wherein component (A) is represented by the following chemical formula (1),

An adhesive film formed from the resin composition as described in the first or second patent application. A cured product of a resin composition as described in item 1 or 2 of the patent application. A cured product of an adhesive film as described in item 3 of the patent application. A semiconductor device using the cured product of an adhesive film as described in item 3 of the patent application. A semiconductor device that uses the cured product of the resin composition as described in the first or second patent application.

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