TWI693999B - Method for attaching optical film to touch sensor unit - Google Patents

Abstract

Provided is a method that can be easily applied to an optical film attached to a touch sensor unit of a display device with a touch sensor, and can be attached with high efficiency. It is a method of bonding the optical film to the bonding area of the touch sensor unit. The touch sensor unit includes: a sensor area in which the touch sensor is arranged, a connection area in which an electrical terminal for electrical connection is arranged, and a wiring in which a wire connecting the touch sensor and the electrical terminal is arranged Wiring area. Provided is a method of using a touch sensor unit assembly mother board and an optical film laminate roller; the touch sensor unit assembly mother board arranges a plurality of touch sensor units on a substrate And the structure; the optical film laminate roller rolls the optical film laminate into a roll shape; the optical film laminate has a continuous mesh shape, and the carrier film is attached to the optical film; the optical film contains at least A layer having a polarizer having a width corresponding to the width in the lateral direction of the bonding area of the touch sensor units arranged in a longitudinal direction on the motherboard of the touch sensor unit assembly.

Description

Method for attaching optical film to touch sensor unit

The invention relates to a method for attaching a touch sensor to an optical film used for touch panel manufacturing. In particular, the present invention relates to a method of bonding an optical film to a touch sensor unit formed on one side of a plurality of connection regions having electrical terminals for electrical connection.

For example, it is known from International Publication Patent Publication WO2009/128241A1 (Patent Document 1) that an optical film containing a polarizer formed into a long continuous mesh with a specified width is successively sent out from the roller of the optical film according to a specified The length is cut, and the cut pieces of the optical film are sequentially bonded to a roll-to-panel (RTP) bonding system composed of liquid crystal display units that are sequentially sent to the bonding position And methods.

This well-known method is suitable for use in relatively large-sized and rigid optical display units such as liquid crystal display units for televisions or liquid crystal display units for personal computers, and optical cut-offs to conventional sheet sizes. Compared with the method of attaching the diaphragm piece by piece to the display unit, it is advantageous in that the manufacturing process can be made more efficient and tends to be widely adopted. However, this method is suitable for comparisons such as smart phones or small tablets It is inconvenient to attach the optical film of the optical display panel with a small size, and there is room for improvement in practical use. Furthermore, in the case of having an optical display unit that is thin and flexible like an electromechanical excitation light display unit, it is difficult to perform bonding of optical films using the method described in Patent Document 1 above for its flexibility. , Not practical. In particular, when the organic electroluminescence display unit is a relatively small size such as a smart phone or a small tablet, it is not easy to apply the method described in Patent Document 1 above for laminating optical films.

As a document describing a method for industrially manufacturing an organic electroluminescence display unit with a relatively small screen size, there is Korean Patent Application Publication No. 10-1174834 (Patent Document 2). According to the method described in Patent Document 2, a resin film is formed on a glass substrate as a base material for forming a film-shaped display unit using the resin film. Next, on the substrate, a plurality of display cells arranged in a plurality of rows arranged in a vertical and horizontal direction are formed, and the entire surface thereof is covered with a process film. Next, the substrate on which the display cells have been formed is peeled off from the glass substrate. After that, the film-like display units are cut off in a state where the process film is attached, such as exposing the electrical terminals for electrical connection formed on one side of the film-like display units As with the terminal part, at the place corresponding to the terminal part, the process film is peeled off to form a film-like display unit one by one.

This Patent Document 2 discloses a method of manufacturing a rectangular-shaped film-shaped optical display unit having a terminal portion having an electrical terminal for electrical connection formed on one side, but attaching an optical film to the optical display unit For example, the bonding of optical films containing polarizers is completely There is no teaching. However, in the case of a liquid crystal display unit, it is necessary to attach an optical film containing a polarizer to the unit for image display. In the case of an organic electroluminescence display unit, in order to suppress internal reflection, the It is necessary to attach the circular polarizer with the retardation film laminated on the polarizer to the unit. Moreover, the development of a touch panel-attached display device that forms a touch sensor on an optical display unit such as an organic electroluminescence unit is prevalent, and in recent years, as a related touch panel-attached display device Manufacturing method, it is proposed to attach an optical film including a polarizing film to a touch sensor unit in which a touch sensor is arranged on a base film in a vertical and horizontal row, and further, the touch feeling of an optical film that has been attached The detector unit is attached to the optical display unit. Therefore, an effective method for attaching the optical film to the touch sensor unit is still necessary.

[Prior Technical Literature]

[Patent Literature]

[Patent Literature 1] International Publication Patent Publication WO2009/128241A1

[Patent Document 2] Korean Patent Application Publication Patent Publication No. 10-1174834

[Patent Document 3] Japanese Patent Laid-Open No. 2014-194720

[Patent Document 4] Japanese Patent Laid-Open No. 2014-211633

[Patent Document 5] Japanese Patent Laid-Open No. 2007-157501

[Patent Document 6] Japanese Patent Application Publication No. 2013-63892

[Patent Document 7] Japanese Patent Laid-Open No. 2010-13250

[Patent Document 8] Japanese Patent Application Publication No. 2013-35158

[Patent Document 9] International Publication Patent Publication WO2009/104371A1

[Patent Document 10] Japanese Patent Application Publication No. 2013-070787

[Patent Document 11] Japanese Patent Application Publication No. 2013-070789

[Patent Document 12] Japanese Patent No. 5204200

[Patent Document 13] Japanese Patent No. 5448264

As a problem to be solved, the present invention provides a touch sensor unit that can be easily applied to a relatively small-sized display device with a touch sensor such as a smart phone or a small tablet Optical film, and a method of efficient bonding.

The present invention is a method of bonding an optical film to a bonding area of a touch sensor unit in the same state. The above-mentioned touch sensor unit is provided with: a sensor area in which the touch sensor is arranged, a connection area provided with an electrical terminal for electrical connection and positioned on one side of the touch sensor unit, And a wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal. Furthermore, although the bonding area includes the sensor area, at least a part of the connection area is not included. The method of the present invention provides a method of using a touch sensor unit assembly mother board and an optical film laminate roller; the touch sensor unit assembly mother board is A plurality of touch sensor units are arranged in a row in the longitudinal direction and arranged on the substrate in a state where the side position of the connection area is in the horizontal direction; and the optical film laminate roller, The optical film laminate is rolled into a roll shape; the optical film laminate is in the form of a continuous net, and the carrier film is attached to the optical film via an adhesive layer; the optical film includes at least A layer of polarizers having a width corresponding to the width in the lateral direction of the bonding area of the touch sensor units arranged in a row in the longitudinal direction is arranged on the motherboard of the sensor unit assembly.

The method includes the following stages: a stage in which a plurality of touch sensor unit assembly mother boards are sequentially sent to the bonding position; the optical film laminate is successively sent out from the optical film laminate roller and sent to the bonding The stage of closing the position; the optical film and the adhesive layer of the optical film laminate that are successively sent out are arranged in a vertical row of touch sensing on the motherboard of the touch sensor unit assembly The interval in the longitudinal direction corresponding to the longitudinal dimension of the bonding area of the device unit is sequentially formed in the horizontal direction, and between the two adjacent cuts in the longitudinal direction, the support layer is supported on the carrier via the adhesive layer The stage of the optical film on the film; and in the bonding position, the optical film is peeled from the carrier film with the adhesive layer remaining on the optical film side, and the peeled optical film is sequentially bonded to the vertical The stage of aligning the bonding area of the touch sensor units in the longitudinal direction of the mother board of the touch sensor unit assembly in the longitudinal direction.

Furthermore, in this method, the touch sensor units arranged in a row in the longitudinal direction on the mother board of the touch sensor unit assembly are aligned with the first touch sensor unit from the longitudinal direction The fitting area of the light Before laminating the diaphragm, adjust the horizontal position and azimuth angle of the motherboard of the touch sensor unit assembly relative to the feed direction. The touch sensor unit is sent to the bonding position. The optical film is integrated with respect to the lateral direction and the azimuth angle. By adjusting the feed of the touch sensor unit assembly motherboard and the feed of the optical film, the end of the optical film piece by piece, and The end of the bonding area of the touch sensor unit corresponding to the motherboard of the touch sensor unit assembly is aligned.

In another aspect of the present invention, the following stage is performed: instead of the portion formed by cutting the lateral direction where the optical film is formed, the state where the adhesive layer remains on the optical film side at the bonding position The optical film is peeled off from the carrier film, and the peeled optical film is continuously attached to a plurality of touch sensors arranged in a row in the longitudinal direction of the motherboard of the touch sensor unit assembly moving in the feed direction The stage of the fitting area of the sensor unit. Next, the plurality of touch sensor units on the mother board of the touch sensor unit assembly to which the optical film has been continuously attached are cut into one unit, and at the same time, on the touch sensor unit At the end in the longitudinal direction, the optical film attached to each unit is cut.

Also in any state, a plurality of longitudinal rows composed of a plurality of touch sensor units can be arranged in parallel on the motherboard of the touch sensor unit assembly, and the touch included in each row can be arranged The sensor unit performs bonding of the optical diaphragm. In this case, the bonding of the optical films of the touch sensor units included in the rows that have been arranged in parallel is performed sequentially for each row.

Moreover, in the optical cut to the size specified in advance In the aspect that the diaphragm is attached to the touch sensor unit, the plurality of touch sensor units on the mother board of the touch sensor unit assembly is made up of a plurality of touch sensors The vertical columns formed by the units are arranged in parallel to form a plurality of rows and columns, and the first touch sensing of the feed direction in the first column in the vertical direction of the right or left end when viewed from the feed direction In the bonding area of the sensor unit, after bonding the optical film, move the touch sensor unit assembly mother board to the horizontal direction and the rear, and the second row adjacent to the first row in the longitudinal direction The end of the bonding area of the touch sensor unit with the first feed direction is sent to the bonding position to be positioned at the end of the optical film, and the optical film is bonded to the touch sensor unit according to Perform the same bonding in sequence, and when the bonding of the optical film of the touch sensor unit in the first row of all the columns is completed, advance the touch sensor unit assembly mother board in the feed direction, Through the same operation, the optical film of the touch sensor unit in the second row of each column is laminated, and the same operation is repeated in sequence, all the motherboards of the touch sensor unit assembly The touch sensor unit performs bonding of the optical film.

Furthermore, in any of the above-mentioned aspects of the present invention, the optical film system can be configured using a polarizer and a retardation film attached to the polarizer. In this case, the optical film constitutes a phase difference film on the side facing the adhesive layer, and the phase difference film is bonded to the bonding area of the touch sensor unit. Furthermore, the absorption axis of the polarizer and the slow axis of the retardation film are ideally arranged so as to intersect at an angle within a range of 45°±5°. Further, ideally, the absorption axis of the polarizer is arranged parallel to the longitudinal direction of the optical film, and the slow axis of the phase difference film is arranged to be inclined obliquely with respect to the longitudinal direction of the optical film oblique. In this case, the retardation film can be used as an abnormal dispersion film whose phase difference with respect to short-wavelength light is smaller than that with respect to long-wavelength light.

In still another aspect of the present invention, instead of laminating the display unit of the optical film in the longitudinal direction of the display unit, laminating the optical film in the horizontal direction is performed. This aspect is a method of attaching an optical film to a rectangular-shaped touch sensor unit having terminal portions with electrical terminals for electrical connection formed on one side, in which touch sensing is used Unit assembly mother board and optical film laminate roller; the touch sensor unit assembly mother board has a rectangular shape in which a plurality of terminal portions having electrical terminals for electrical connection are formed on one side The touch sensor unit has a side area with a connecting area in a horizontal direction, at least arranged in a row in the longitudinal direction and arranged on the substrate; the optical film laminate roller is a The film laminate is rolled into a roll shape; the optical film laminate is in the form of a continuous net, and the carrier film is attached to the optical film via an adhesive layer; the optical film includes at least a touch sensor A layer of polarizers with a width corresponding to the longitudinal dimension of the bonding area of the plurality of rows of the touch sensor units arranged in the longitudinal direction of the unit assembly mother board is arranged.

The method includes the following stages: a stage in which a plurality of touch sensor unit assembly mother boards are sequentially sent to the bonding position; the optical film laminate is successively sent out from the optical film laminate roller and sent to the foregoing The step of attaching the position; the optical film and the adhesive layer of the optical film laminate that are successively delivered are separated at the longitudinal direction corresponding to the lateral direction of the terminal portion of the touch sensor unit, in the longitudinal direction Cuts are formed in order, adjacent to horizontal Between the two cuts in the direction, the stage of forming the optical film supported on the carrier film via the adhesive layer is formed; in the bonding position, the adhesive layer is peeled from the carrier film with the adhesive layer remaining on the optical film side Optical film, the continuous bonding of the peeled optical film to the longitudinal direction of the array of touch sensor units arranged on the motherboard of the touch sensor unit assembly moving in the horizontal direction The stage of closing the area; and cutting the plurality of touch sensor units on the motherboard of the above-mentioned touch sensor unit assembly to which the optical film has been continuously bonded into one unit, and at the same time, Control the longitudinal end of the sensor unit to cut off the optical film attached to each unit.

Furthermore, in this method, the touch sensor units arranged in a row on the motherboard of the touch sensor unit assembly in the longitudinal direction are aligned with the first Before laminating the optical film, the touch sensor unit adjusts the longitudinal position and azimuth angle of the motherboard of the touch sensor unit assembly. The touch sensor unit is sent to the lamination The position of the optical film is integrated with respect to the longitudinal direction and azimuth angle. By adjusting the feed of the touch sensor unit assembly mother board and the optical film, the end of the optical film piece by piece And the end of the bonding area of the touch sensor unit corresponding to the motherboard of the touch sensor unit assembly for alignment.

In another aspect of the present invention, after a plurality of optical films are attached to the touch sensor unit, the longitudinal direction is cut. In this aspect, it includes the following stages: the stage of sequentially sending the plurality of touch sensor unit assembly mother boards to the bonding position; the optical film layered body is successively sent out from the optical film layered roller And sent to the stage of the aforementioned bonding position; In the closed position, the optical film is peeled off from the carrier film with the adhesive layer remaining on the optical film side, and the peeled optical film is continuously bonded to the touch sensor unit assembly mother board moving in the feed direction The step of arranging the lamination area of the rows of a plurality of rows of touch sensor units in the longitudinal direction on the top; the sense of touch on the motherboard of the assembly of touch sensor units to which the optical film is attached The horizontal end of the row of sensor units, the stage of cutting the optical film to form an optical film; and the plurality of touches on the motherboard of the touch sensor unit assembly that has been continuously bonded to the optical film The sensor unit is cut into units one by one, and at the same time, at the longitudinal end of the touch sensor unit, the optical film attached to the units one by one is cut. In this method, in particular, it is desirable that the position of the terminal portion is on the feed end side in the lateral direction of the optical film.

Furthermore, in other aspects of the invention, a plurality of optical film laminates are used. In this aspect, a plurality of optical film laminate rollers are used. The plurality of optical film laminate rollers form a row of a plurality of touch sensor units and have a plurality of The width in the longitudinal direction of the bonding area of each partial row corresponds to the width, wherein a plurality of optical film laminates in a continuous mesh shape are rolled into a roll shape, and the plurality of optical film laminate systems are interposed through adhesion The agent layer adheres the carrier film to the optical film of the layer containing at least the polarizer.

This aspect includes the following stages: the stage of sequentially sending the plurality of touch sensor unit assembly mother boards to the bonding position; the plurality of optical film laminates are successively sent out from the plurality of optical film laminate rollers The body is sent to the aforementioned bonding position stage; the optical film and the adhesive layer of the plurality of optical film laminates that are successively sent out are to be bonded to the touch sensor unit The interval in the longitudinal direction corresponding to the lateral direction of the domain is sequentially cut in the longitudinal direction, and between the two adjacent cuts in the lateral direction, an optical film supported on the carrier film via the adhesive layer is formed At the bonding position, with the adhesive layer remaining on the optical film side, a plurality of optical films are peeled from the carrier film, and the plurality of optical films that have been peeled off are successively bonded to the moving in the lateral direction The stage of arranging the bonding areas of the plural partial rows of the touch sensor unit in the longitudinal direction of the mother board of the touch sensor unit assembly; and the aforementioned touch which has been continuously bonded to the optical film The plurality of touch sensor units on the mother board of the control sensor unit assembly are cut into one unit, and at the same time, at the longitudinal end of the touch sensor unit, cut and attached to one unit The optical film stage of the unit. In this method, the bonding positions of at least a part of the plurality of optical film laminate rollers are preferably different in the lateral direction, and ideally the bonding positions of the plurality of optical film laminate rollers adjacent in the longitudinal direction It is different in the horizontal direction.

Furthermore, in still another aspect of the present invention, the optical film laminate roller having a width corresponding to the longitudinal dimension of the partial rows is used to sequentially bond the respective partial rows. In this mode, an optical film laminate roller is used. The optical film laminate roller rolls the optical film laminate into a roll shape. The optical film laminate is in the form of a continuous net with an adhesive interposed therebetween. The layer attaches the carrier film to the optical film; the optical film includes at least a layer of polarizers; the layer of polarizers has a plurality of parts constituting a row of a plurality of touch sensor units and a touch sensor unit The width corresponding to the longitudinal dimension of a fitting area in the column.

This aspect includes the following stages: sequentially put a plurality of touch senses The stage where the motherboard of the detector unit assembly is sent to the bonding position; the stage where the optical film layered body is successively sent out from the optical film layered roller and sent to the bonding position; the optical film layered body successively sent out The optical film and the adhesive layer are formed in the longitudinal direction with a gap in the longitudinal direction corresponding to the lateral direction of the connection area of the touch sensor unit, between the two adjacent cuts in the lateral direction , Forming the stage of the optical film supported on the carrier film via the adhesive layer; in the bonding position, the optical film is peeled from the carrier film with the adhesive layer remaining on the optical film side, and the peeled The stage of bonding the optical film to the bonding area of the touch sensor units arranged in a row in the longitudinal direction of the motherboard of the touch sensor unit assembly moving in the horizontal direction, wherein, by changing the optical The relative position of the diaphragm and the longitudinal direction of the motherboard of the touch sensor unit assembly is sequentially attached to each part row; and the aforementioned touch sensor unit to which the optical diaphragm has been continuously attached The plurality of touch sensor units on the assembly mother board are cut into one unit, and at the same time, at the longitudinal end of the touch sensor unit, the optical film attached to each unit is cut off Stage.

In this state, by moving the touch sensor unit assembly mother board, the optical film and the touch sensor unit assembly mother board can also be moved relatively in the longitudinal direction; by making the optical film In the manner of sheet movement, the optical film and the motherboard of the touch sensor unit assembly may be relatively moved in the longitudinal direction.

Based on the use of a motherboard with a touch sensor unit assembly According to the above-mentioned aspect of the invention, the plurality of touch sensor units arranged in a row in the longitudinal direction on the substrate can be sequentially or continuously bonded to the optical film containing the polarizer, or the smaller The size of the touch sensor unit is suitable for roll-to-board (RTP) method for efficient bonding. Moreover, the alignment of the touch sensor and the optical diaphragm is performed by adjusting the motherboard of the touch sensor unit assembly. Compared with the case of individually adjusting the position of the touch sensor unit, the position adjustment becomes Easy, but also improve the adjustment accuracy.

Furthermore, in any aspect, the optical film is attached avoiding the connection area. For this reason, as described in FIG. 7 of Patent Document 2, after the bonding of the optical film, the operation of peeling off the film becomes unnecessary in covering the terminal portion.

I: position adjustment workstation

II: Surface protection film peeling workstation

III: The first surface inspection workstation

IV: Laminated body laminating station for polarizers

V: cut off the workstation

W: horizontal width

L: length in the longitudinal direction

B: Motherboard of touch sensor unit assembly

1: Touch sensor unit

1a: Short side

1b: Long side

1c: Sensor area

1d: wiring area

1e: connection area

1f: substrate film

1g: ITO film

1h: touch sensor

1hx: touch sensor for horizontal position detection

1hy: Touch sensor for longitudinal position detection

1i: wiring

1j: connection terminal

1k: Alignment mark

1l: Cross-linked conductive part

1m: Insulation

1n: fit area

3: glass substrate

4: COP film with ITO film

4a: COP film

4b: ITO film

4c: resistance material

4d: mask

4e: ultraviolet light

5: Surface protective film

7: Motherboard transfer table

8: Motherboard position adjustment disk

10: Suction holding disc for fitting

10a: hole for attraction

12: Reference position of the motherboard of the touch sensor unit assembly

20: Fitting institutions

21: Optical film

21a: polarizer

21c: 1/4 wavelength retardation film

21e: carrier film

21f: Optical diaphragm

22: Optical film roller

28: Cutting forming mechanism

28a: cutting

29: Cutting blade

38: Laminating roller

39: Carrier film peeling mechanism

40: winding roller

46: Vacuum suction table

47: template for cutting

47a: Cutting groove

47b: Vacuum suction hole

49: Vacuum attraction source

70: Column of touch sensor unit

Fig. 1 is a schematic diagram showing the overall configuration of one type of optical film bonding system for implementing the optical film bonding method of the present invention.

[FIG. 2] It is an example of the touch sensor which can be used in the method of one embodiment of the present invention; (a) is a plan view; (b) is a cross-sectional view.

3 is a perspective view schematically showing an example of a manufacturing process of a touch sensor unit assembly mother board.

4 is a side view schematically showing an example of a circuit pattern forming process performed on an ITO film.

[FIG. 5] is a diagram showing a touch sensor used in the method of the present invention. One example of the element assembly mother board; (a) is a plan view; (b) is a cross-sectional view.

[FIG. 6(a)] is a schematic diagram showing the operation in the position adjustment workstation and showing the movement of the touch sensor unit assembly mother board from the mother board transfer table to the mother board position adjustment plate.

[FIG. 6(b)] is a schematic diagram showing the operation in the position adjustment workstation, and showing the movement of the touch sensor unit assembly mother board from the mother board transfer table to the mother board position adjustment plate.

[FIG. 6(c)] is a schematic diagram showing the operation of the position adjustment workstation and showing the operation of adjusting the position of the motherboard.

[FIG. 6(d)] is a schematic diagram showing the operation in the position adjustment workstation and showing the operation in the mother board transfer position.

7 is a plan view showing the reference position of the mother board of the touch sensor unit assembly on the suction holding disk for bonding.

[Fig. 8] (a) and (b) are diagrams showing the transfer operation from the motherboard position adjustment plate to the mother plate of the suction holding plate for bonding.

[Fig. 9] (a) (b) (c) (d) is a diagram showing each stage of the peeling operation of the surface protective film.

[Fig. 10] is a perspective view showing a surface protection film peeling mechanism.

11 is a schematic view of an optical film bonding apparatus.

12 is a cross-sectional view of a film laminate in which a carrier film is bonded to an optical film.

[FIG. 13] (a) (b) (c) (d) (e) is a schematic diagram showing the bonding sequence of the optical film in the motherboard of the touch sensor unit assembly according to one embodiment of the present invention .

14 is a perspective view showing an example of a cutting device used in a cutting workstation.

[Fig. 15] A schematic diagram showing a conveying mechanism that conveys a display unit that has been cut off.

[Fig. 16] (a) (b) (c) is a schematic diagram showing a bonding sequence of optical films in a motherboard of a touch sensor unit assembly according to another embodiment of the present invention.

[Fig. 17] Fig. 17 is a perspective view showing an example of bonding of optical films in an embodiment in which display units are arranged in a row in a longitudinal direction.

18 is a schematic diagram of an optical film bonding apparatus in another embodiment of the present invention.

[FIG. 19] (a) (b) (c) is a schematic diagram showing the bonding sequence of the optical films in the touch sensor unit assembly mother board of the embodiment shown in FIG.

20 is a schematic view of an optical film bonding apparatus in another embodiment of the present invention.

[FIG. 21] (a) (b) (c) (d) is a schematic diagram showing the bonding sequence of the optical films in the master panel of the touch sensor unit assembly of the embodiment shown in FIG.

22 is a schematic diagram of an optical film bonding apparatus in another embodiment of the present invention.

[FIG. 23] (a) (b) (c) (d) (e) is a schematic diagram showing the lamination order of the optical films in the motherboard of the touch sensor unit assembly of the embodiment shown in FIG. 22. Figure.

[Fig. 24] An optical film bonding device in another embodiment of the present invention Set the schematic diagram.

[FIG. 25] (a) (b) (c) (d) (e) is a schematic diagram showing the bonding order of the optical films in the motherboard of the touch sensor unit assembly of the embodiment shown in FIG. Figure.

FIG. 1 is a schematic diagram showing the overall configuration of one type of optical film bonding system for implementing the optical film bonding method of the present invention. The optical film bonding system of this embodiment is provided in the following order: a position adjustment workstation I, a surface protection film peeling workstation II, a surface inspection workstation III, a polarizer laminate bonding workstation IV, and a cutting workstation V. The touch sensor unit 1 is, as will be described later, in the form of an assembly mother board B, and is sent to each workstation in sequence from the workstation I to the workstation V via a guide with a self-propelled function walking along the guide rail .

In FIG. 2a, one example of the touch sensor unit 1 that can be used in the method of one embodiment of the present invention is shown. Moreover, the cross-sectional view of FIG. 2b shows a partial cross-section of the present embodiment indicated in FIG. 2a. The touch sensor unit 1 has a slightly rectangular shape with a short side 1a and a long side 1b in a planar shape. In order to form a connection terminal 1j for electrical connection with the outside, it has a part protruding from one of the short sides 1a Protrusions. In this embodiment, protrusions are formed, but the shape of the touch sensor unit used in the present invention may be a complete rectangle without protrusions, or may be other shapes. As shown in FIG. 2b, the touch sensor unit 1 is mainly used by a COP (cycloolefin polymer) film The formed base film 1f and the contact with foreign objects that sense human fingers or even the proximity touch sensor 1h are arranged in a horizontal and vertical row and the transparent conductive material patterned on the base film 1f is ITO 1g film, composed. The touch sensor unit 1 is equipped with a touch sensor 1h, and is divided into: a transparent sensor area 1c through which the image projected by the display unit passes, along the touch sensor unit 1 One of the short sides 1a and one of the long sides 1b are located at the wiring area 1d and the connection area 1e where the connection terminals 1j including the protrusions are arranged. That is, the main areas except the wiring area 1d and the connection area 1e of the touch sensor unit 1 become the sensor area 1c. In the sensor area 1c, the touch sensor 1h composed of an ITO film is arranged in two directions with an angle of 45 degrees with respect to the side to be covered. The sensor area 1c is an area where an image is displayed when it is used as a display device with a touch panel. Therefore, it is necessary to attach an optical film to the sensor area 1c. On the other hand, the connection area 1e is a contact with the outside, and the optical film cannot be bonded to the entire connection area 1e, but as long as the contact with the outside can be ensured, it can be in at least a part of the connection area 1e Does not fit the optical film. In the remaining area including the wiring area 1d, it is not necessary to bond the optical film, but it is not because of the arrangement of the connection terminal, and the optical film may be bonded in accordance with the manufacturing situation and the like. In the case where the optical film is cut after bonding the optical film, the optical film is cut along the sensor region 1c because it is likely to damage the touch sensor unit 1 and is usually along the end of the touch sensor unit 1 Cut off. As a result, not only the sensor area 1c but also the wiring area 1d is also pasted with an optical film. Therefore, the conclusion is that the bonding area 1n of the bonding optical film must contain The entire sensor area 1c, on the other hand, cannot be included in the connection area 1e. In the present embodiment, the connection region 1e is located on a part of one side and does not include a part along one side related to the sensor region 1c. It is possible to avoid the connection region 1e and attach the optical film to the included sensor The bonding area 1n of the detector area 1c. Regarding the bonding area 1n, the width W in the horizontal direction and the length L in the vertical direction are defined.

In the wiring area 1d, a metal wiring 1i such as copper or gold is formed. The wiring 1i electrically connects the arranged touch sensor 1h and the plurality of connection terminals 1j formed in the connection area 1e. The connection terminal 1j is electrically connected to an external processing device such as an FPC (Flexible Printed Circuit) forming a processing device, and can transmit the contact or proximity of a foreign object detected by the touch sensor 1h to the external processing device, etc. .

The touch sensor unit 1 is disposed on an optical display unit (not shown), and is used as an optical display panel with a touch sensor. The optical display unit is ideally an organic electroluminescence display unit, but it may also be a liquid crystal display unit or other display unit. Furthermore, in this embodiment, ITO is used as the transparent conductive material, but other transparent conductive materials such as IZO, ZnO, polythiophene, polyaniline, nano silver wire, metal thin wire, etc. may also be used .

In the embodiment shown in FIG. 2(a), the wiring 1i is positioned along one side of the connection region side of the short side 1a and one side of the long side 1b; Reasons such as being hard to be affected by external interference may also be located along the four or three sides of the touch sensor unit 1 or arranged at other positions. As not For the reason of the additional manufacturing process, the wiring 1i and the connection terminal 1j can be formed by an ITO film. In the wiring area 1d or the connection area 1e, there is no need to transmit the image projected by the display unit. The non-permeable material is metal. For this reason, the wiring 1i and the connection terminal 1j are desirably formed of metal or carbon having a low resistance value such as copper, silver, gold, aluminum, and palladium. Alternatively, a metal wiring may be formed on the wiring formed by the ITO film, and a two-layer wiring structure may be used. Further, in the vicinity of the corner portion of the touch sensor unit 1, an alignment mark 1 k used for alignment at the time of bonding of the optical film is formed. The position or direction of the touch sensor unit 1 can be detected by detecting related alignment marks via a photo sensor or the like. In this embodiment, the alignment marks are formed on all four corner portions, but the alignment marks may be formed on only three or two corner portions. Furthermore, the alignment mark may be arranged beyond the corner portion.

For the touch sensor arranged in the touch sensor unit 1 of the sensor area 1c, for example, Japanese Patent Laid-Open No. 2014-194720 (Patent Document 3) and Japanese Patent Laid-Open No. 2014-211633 ( Known touch sensors such as Patent Document 4), and the touch sensor 1h of the present embodiment measure changes in capacitance and detect whether foreign objects such as human fingers are in contact or even approaching. The touch sensor 1h forms a flat conductive body with a certain area in order to detect changes in capacitance. In this embodiment, each touch sensor has a diamond shape, but if the area between the sensors can be reduced and arranged as closely as possible, it may be rectangular, square, hexagonal, or the like. Moreover, there are a plurality of touch sensors 1h, and it is possible to detect the presence of foreign objects at any place on the sensor area 1c. The touch sensor 1h is divided into: a touch sensor 1hy for longitudinal position detection that is electrically connected to each other in the horizontal direction in order to detect the position (coordinates) in the vertical direction of the contact portion; and a lateral direction for the contact portion Position (coordinates), and a touch sensor 1hx for horizontal position detection that is electrically connected to each other in the vertical direction. If a foreign object comes into contact or approaches, the capacitance between the touch sensor 1hy for vertical position detection and the touch sensor 1hx for horizontal position detection changes. A current flows as the capacitance changes. Specify the vertical position and horizontal position. If the touch sensors 1hy for longitudinal position detection are electrically connected to each other in the same plane, the touch sensors 1hx for horizontal position detection cannot be electrically connected to each other. Therefore, one of the sensors is electrically connected to each other. The wiring of the sensor includes a cross-linked conductive portion 11 that electrically connects the other sensor that is formed in the same plane as the sensor, and crosses the non-contact way. Between the cross-linked conductive portion 11 and the wiring that electrically connects the other sensor, there is an insulating portion 1m, so the two wirings are not electrically connected. In this embodiment, the cross-linked conductive portion 11 is capable of sputtering or vapor-depositing a metal film of gold, gold alloy, copper, copper alloy, silver alloy, etc. with a thin thickness of about 2 nm to 20 nm that can transmit light To the insulating part. Further, various transparent conductive materials such as nanowires and ITO may be used as the cross-link conductive portion 11. Furthermore, nano-carbon materials called so-called carbon nanotubes can also be used as the cross-link conductive portion 11. At this time, by adjusting the content of the material, the conductivity can be adjusted on the one hand and the reflectivity on the other hand. Furthermore, a metal layer can be further formed on the cross-linked electrode to ensure conductivity. The insulating portion 1m can be made using an insulating thin film material with high light transmittance. For example, an inorganic material such as SiO ₂ can be used to produce it by sputtering through a mask pattern. Furthermore, photosensitive acrylic resin, photosensitive methacrylic resin, photosensitive polyimide resin, photosensitive polysiloxane resin, photosensitive polyethylene resin, photosensitive acrylic urethane are used. For photosensitive resins such as resins, photosensitive novolac-type phenol resins, etc., an insulating layer formed into a pattern through a photolithography process can be obtained. Furthermore, uniform inorganic materials such as SiN, SiO ₂ , and SiON may be formed on the entire surface by photolithography by CVD to form a pattern. Furthermore, it is also possible to use ink jetting to eject liquid droplets and dry them to make them, and it is also possible to form an insulating layer using methods such as offset printing and screen printing.

FIG. 3 is a perspective view showing an example of a method of manufacturing a touch sensor unit assembly mother board B having a plurality of touch sensor units 1 arranged in rows and columns arranged side by side. In one example of this manufacturing method, first, a glass substrate 3 is prepared, and an ITO film-attached COP film is formed on a heat-resistant resin material, that is, a cycloolefin polymer (COP) sheet 4a in which an amorphous ITO film 4b is formed The sheet 4 is bonded to the glass substrate 3. As the heat-resistant resin material, in addition to COP, polyimide (polyimide), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), or the like can be used. Next, the glass substrate 3 to which the diaphragm 4 is attached is heated in an oven at 150° C. for 1 hour to crystallize the ITO film. The circuit pattern is formed for the crystallized ITO film to function as a touch sensor. The circuit pattern forming process can be performed by a known method, and an example of wet etching is shown in FIG. 4. As shown in FIG. 4(a), first, the resist material 4c is coated on the surface of the ITO film, dried, and cured. Pick up As shown in FIG. 4(b), a mask 4d corresponding to the touch sensor unit having circuit patterns arranged in rows and columns is arranged on the resist material 4c, and the ultraviolet rays are interposed through the mask 4d. The light 4e is exposed to the ITO film 4b coated with the resist 4c. In the resist material 4c, there are an irradiated portion irradiated with ultraviolet light 4e and a non-irradiated portion, so that the resist material 4c is immersed in the developer for a certain period of time, as shown in FIG. 4(c), only the resist located in the irradiated portion can be removed材4c. After removing the resist 4c located in the irradiated part, the ITO film 4b is immersed in the etching solution. Since there is no resist, the etchant can directly contact and remove the ITO film 4b corresponding to the irradiated part. Therefore, as shown in FIG. 4(d), only the ITO film 4b corresponding to the non-irradiated portion remains. Next, as shown in FIG. 4( e ), the circuit pattern of the ITO film is formed on the COP film 4 so as to remove the resist 4 c remaining in the non-irradiated portion. The circuit pattern is designed to correspond to the arrangement of multiple touch sensor units 1. Then, in the wiring region 1d and the connection region 1e of the touch sensor unit 1, the metal wiring 1i or the connection terminal 1j are formed in the subsequent process, a circuit pattern is formed, and the ITO film 4b is removed by etching. Moreover, there is an unused portion that is unused as the touch sensor unit 1 between the arranged touch sensor units 1, so that the mask can be designed to place the ITO film in the relevant unused portion By removing all or part of it, it can be designed that the touch sensor units 1 are not electrically connected to each other. In this embodiment, ITO is used as the material of the transparent conductive film, but other materials may be used, and a transparent touch sensor circuit may be formed using nanowires such as silver.

After the circuit pattern is formed, the wiring 1i is formed in the wiring area 1d by a conductive material such as metal, and the connection terminal is formed in the connection area 1e 1j. Furthermore, an insulating portion 1m and a cross-linked conductive portion 11 are formed at a predetermined location in the sensor area, and are electrically connected to the horizontal or vertical position detection touch sensors 1hx and 1hy.

In this embodiment, the COP film 4 with the ITO film is attached to the glass substrate 3 to make the touch sensor unit assembly mother board B; however, instead of the COP film 4, it can be used as disclosed in Japan. The flexible ceramic sheet described in Patent Publication No. 2007-157501 (Patent Document 5), or as disclosed in Japanese Patent Laid-Open No. 2013-63892 (Patent Document 6) and Japanese Patent Laid-Open No. 2010-13250 ( Patent Document 7), Japanese Patent Laid-Open No. 2013-35158 (Patent Document 8) as described in the flexible glass. When a flexible ceramic sheet or flexible glass is used as a base material, it is not necessary to use the glass substrate 3.

After the touch sensor unit 1 is formed on the diaphragm 4 in a row-and-column arrangement, the surface protective film 5 is attached to cover the touch sensor unit 1 formed on the diaphragm 4 . Next, the glass substrate 3 is peeled from the diaphragm 4 by a known method such as laser irradiation. The technique of peeling a glass substrate from a diaphragm by laser irradiation is, for example, as described in International Publication Patent Publication WO2009/104371 (Patent Document 9). In the description of this embodiment, the term “touch sensor unit assembly mother board B” refers to the use of the diaphragm 4 and the glass substrate in which a plurality of touch sensor units 1 are formed in addition to the surface protection film 3. The laminated structure constituted by the user, as described above, when a flexible glass sheet or ceramic sheet is used as a base material, the glass substrate is not an essential requirement.

Fig. 5(a) shows the touch that has not been attached to the surface protection film 5 The top view of the sensor unit assembly mother board B; the same figure (b) is a cross-sectional view taken along the line bb of FIG. 5, showing the touch sensor unit assembly mother board in a state where the surface protection film 5 has been attached B. As shown in FIG. 5(a), in the mother board B of the touch sensor unit assembly, with the short side 1a facing the horizontal direction, a plurality of touch sensor units 1 are arranged in rows and columns to form a vertical direction Columns and horizontal rows. As shown in FIG. 5(a), the motherboard B of the touch sensor unit assembly is a rectangular shape having a short side B-1 and a long side B-2, and is printed, engraved, or other appropriate methods. In the vicinity of both ends of one of the short sides B-1, a reference mark m which becomes a reference point of the mother board B is attached. When the optical film is attached, the touch sensor unit assembly mother board B is delivered in the direction indicated by arrow A in FIG. 5(a), that is, in the longitudinal direction.

FIG. 6 shows the configuration of the position adjustment workstation I. FIG. 6 is a schematic diagram showing the stage of adjusting the position of the mother board before bonding in the position adjustment workstation 1. The touch sensor unit assembly mother board B shown in FIG. 5(a) is placed on the mother board transfer table 7 with the surface protective film 5 attached, and delivered as indicated by the arrow A The feed direction reaches the position below the mother plate position adjustment disk 8. The mother board position adjusting disc 8 has a plurality of suction holes (not shown) on the lower surface, and constitutes a vacuum suction disc that is internally connected to a vacuum suction device (not shown), and is movable in the up-down direction. Furthermore, the mother board position adjusting plate 8 is supported to be movable in the lateral direction and the longitudinal direction with respect to the feed direction, and is configured to be able to adjust the position in the rotational position, that is, in the azimuth direction.

Set of touch sensor units mounted on the mother board transfer table 7 When the combined mother board B reaches the position below the mother board position adjusting plate 8, the mother board position adjusting plate 8 is moved downward as shown in FIG. 6(a) until its lower surface contacts the mother board transfer table 7 The surface protection film 5 of the mother board B of the touch sensor unit assembly actuates the vacuum suction device at its position, and attracts the mother board B of the touch sensor unit assembly through the vacuum attraction. In this state, the mother board position adjusting plate 8 is raised upward from the mother board transfer table 7 and delivered to the mother board position detection unit shown in FIG. 6(b). In the motherboard position detection section, an optical reading device 9 for reading the reference mark m on the motherboard B is arranged in advance, and the device 9 reads the reference mark m on the motherboard B to determine the position of the motherboard B .

FIG. 6(c) is a schematic diagram exemplarily showing the read position AP of the touch sensor unit assembly motherboard B and the reference position RP of the motherboard B. FIG. By comparing the reading position AP and the reference position RP, the horizontal displacement d1, d2 and the vertical displacement d3, d4 in the left and right reference marks m are calculated, and the calculated displacement is memorized to the memory Means (not shown). Next, the mother board position adjusting disk 8 is delivered to the transfer position where the suction holding disk 10 for lamination stands by.

Fig. 6(d) is a schematic diagram showing the operation at the reprint position. In the reprinted position, the motherboard position adjustment disc 8 is calculated, and the length and width positions and the rotation orientation of the motherboard position adjustment disc 8 are adjusted according to the displacement amounts d1, d2, d3, and d4 memorized by the memory means to make the displacement The amount is reset to zero. As shown in the top view in FIG. 7, the suction holding disk 10 for bonding is a rectangular shape having a short side 10a and a long side 10b, and is printed on one of the short sides by printing, marking, or other appropriate means. Near both ends of the shape A pair of reference marks n is used to represent one of the reference points. At the transfer position, an optical reading device 11 that reads the reference mark n of the suction holding disk 10 for bonding and detects the position of the suction holding disk 10 for bonding is arranged.

As shown in FIG. 7, in the suction holding disk 10 for bonding, a plurality of suction holes 10c are formed in a row and column shape on the upper surface, and these suction holes 10c pass through the internal cavity of the suction holding disk 10 for bonding Connect to a vacuum suction device (not shown). What is shown by the broken line 12 in FIG. 7 is the reference position of the motherboard B of the touch sensor unit assembly in the suction holding disk 10 for this bonding. Like the mother board position adjusting disk 8, the suction holding disk 1 for bonding 1 is supported so as to be capable of horizontal and vertical position adjustment and azimuth adjustment of the rotation direction. Next, in the reprinting position, the suction holding disk 10 for bonding reads the position of the reference mark n via the optical reading device 11, and the description related to the position adjustment of the motherboard B of the touch sensor unit assembly Similarly, adjust the position to the reference position. In this state, the touch sensor unit assembly mother board B adjusted to the reference position in the transfer position becomes the broken line 12 with respect to the suction holding disk 10 for bonding that has been adjusted to the reference position, and the position is integrated into The state above.

In this state, as shown in FIG. 8(a), holding the motherboard position adjustment dial 8 of the touch sensor unit assembly mother board B, it moves down to the touch sensor unit assembly mother board The lower surface of B contacts the upper surface of the suction holding disk 10 for bonding. Next, the vacuum suction device connected to the suction holding disk 10 for bonding is operated, and at the same time, the operation of the vacuum suction device connected to the mother board position adjusting disk 8 is stopped. the result, The touch sensor unit assembly mother board B is positioned at the reference position indicated by the broken line 12 on the suction holding disk 10 for bonding, and is in a state of being vacuum-held by the suction holding disk 10 for bonding. In other words, the touch sensor unit assembly mother board B is reproduced from the mother board position adjusting disk 8 to the suction holding disk 10 for bonding. After that, as shown in FIG. 8(b), the motherboard position adjusting plate 8 of the motherboard B of the touch sensor unit assembly is freed, and it moves away from the suction holding plate 10 for bonding and moves upward, repeating the same action .

The suction holding disk 10 for bonding holding the touch sensor unit assembly mother board B at a designated position is delivered to the surface protection film peeling workstation II. FIG. 9 is a schematic diagram showing the structure of a peeling device in the surface protection film peeling workstation II. The suction and holding disk 10 for lamination is supported by the support mechanism 13 so that the position and rotation direction of the horizontal and vertical directions can be adjusted; the support mechanism 13 is provided with a lifting mechanism (not shown) to hold and hold the lamination for suction The disk 10 moves up and down. The support mechanism 13 is supported by a guide 15 that runs along the guide rail 14, and the guide 15 can be configured as a self-propelled device having a linear motor (not shown).

In the surface protection film peeling workstation II, the adhesive tape driving device 16 for peeling is disposed above the guide rail 14. The peeling adhesive tape drive device 16 includes a tape feed roller 16a, a tape winding roller 16b, and a pair of pressing rollers 16c; these rollers are arranged to successively feed the peeling adhesive tape 16d from the tape feed roller 16a. With the adhesive surface facing downward, it passes under the pair of pressing rollers 16c and reaches the winding roller 16b. The pair of pressing rollers 16c are arranged such that the rollers 16a and The winding roller 16b has a predetermined height downward, and there is a gap in the extending direction of the guide rail 14, that is, the feeding direction of the touch sensor unit assembly mother board B. Although not shown, these pressing rollers 16 are desirably urged downward by elastic means such as a spring.

The touch sensor unit assembly mother board B supported by the guide holding member 15 and the supporting suction disk 10 of the supporting mechanism 13 is fed to the surface protective film at the position shown in FIG. 9(a) In the peeling position, in the position shown in FIG. 9(b), it is raised to a specified height via the lifting mechanism. The specified height is the height at which the upper surface of the surface protection film 5 of the touch sensor unit assembly mother board B can contact the adhesive tape 16d positioned between the pair of pressing rollers 16c at a specified contact pressure.

The touch sensor unit assembly mother board B that has risen to a predetermined height via the lifting mechanism is delivered as it is to a position below the adhesive tape driving device 16 for peeling. Here, the upper surface of the surface protection film 5 of the mother board B is tied between the pair of pressing rollers 16c, and contacts the adhesive surface of the adhesive tape 16d in a pressed state. The adhesive force of the surface protective film 5 relative to the adhesive tape 16d is greater than the adhesive force of the touch sensor unit 1 relative to the surface protective film 5, so the surface protective film 5 is attached to the adhesive tape 16d from the The touch sensor unit 1 on the diaphragm 4 is peeled off. The peeled surface protective film 5 is wound together with the adhesive tape 16d via the winding roller 16b. The mother board B from which the surface protective film 5 is peeled off is lowered to the height when fed in the position shown in FIG. 9(a) via the lifting mechanism at the position shown in FIG. 9(d), and delivered to the next process .

FIG. 10 is a diagram showing an adhesive tape driving device 16 for peeling A perspective view of an example of a specific structure is shown in FIG. 9 as a side view of the tape drive device 16 in two groups, which are arranged in parallel. In order not to complicate the representation of the drawing, in FIG. 10, the touch sensor unit and the like are omitted for the purpose of showing only necessary requirements. The peeling of the surface protective film 5 is not limited to the form of using adhesive tape for peeling as shown in FIGS. 9 and 10, and may also be adopted, for example, the front corner of the surface protective film in the feeding direction is slightly passed through, for example, an adhesive roller Peeling, peeling off the corners of the peeling, for example, with a clamp, and pulling it diagonally backward to perform other peeling mechanisms such as peeling.

The process of peeling off the protective film on the surface is the process of surface inspection. The touch sensor unit assembly mother board B on the suction holding disk 10 for lamination sent from the surface protection film peeling workstation II is delivered to the surface inspection workstation III via the guide 15 that runs along the guide rail 14. At this time, the touch sensor unit assembly mother board B is in a state where the touch sensor unit 1 formed on the diaphragm 4 has been exposed. An optical surface inspection is performed on the touch sensor unit 1. As shown in the example of FIG. 1, the first surface inspection workstation III includes: a light source 17 that irradiates light for surface inspection; and a light-receiving element that receives light reflected by the object to be inspected, that is, the touch sensor unit 1 18. After the inspection, the touch sensor unit assembly mother board B is delivered to the polarizer laminate bonding station IV for the next process while being supported on the suction holding disk 10 for bonding.

FIG. 11 shows an example of the bonding station IV. The suction holding disk 10 for lamination on which the assembly mother board B is placed is guided by The guide 15 on which the rail 14 travels is delivered from the surface inspection workstation III to the bonding workstation IV. In the bonding station IV, a motherboard position detection device 19 is provided in advance. The motherboard position detection device 19 optically reads the reference mark n of the motherboard B fed to the bonding station IV to generate the position of the motherboard B News. The position information is stored in the memory section of the control device that has not been shown in FIG. 11. Next, the suction holding disk 10 for lamination on which the assembly mother board B is placed is moved to the lamination position, and is raised to a predetermined lamination height via the lifting mechanism of the support mechanism 13. The control device controls the operation of the support mechanism 13 and the guide 15 of the suction and holding disk 10 for bonding.

A bonding mechanism 20 is provided at the bonding station IV. The bonding mechanism 20 includes an optical film roll 22 that rolls a long optical film 21 into a roll shape. The optical film 21 is successively sent out from the optical film roller 22 via a pair of driving rollers 23 at a constant speed. FIG. 12 shows a laminated structure of the optical film 21 used in this embodiment. The optical film 21 is a long mesh-shaped polarizing film bonded with a protective film 21b such as a TAC film to both sides of the polarizer 21a, and a long mesh-shaped mesh bonded to the polarizing film via an adhesive layer 21d The 1/4 wavelength (λ) retardation film 21c has a laminated structure. On the outer side of the retardation film 21c, the carrier film 21e is bonded via another adhesive layer 21d. The polarizer 21a and the retardation film 21c are arranged such that the absorption axis of the polarizer 21a and the slow axis or the fast axis of the retardation film 21c intersect at an angle ranging from 45°±5°. The optical film 21 has a long continuous mesh shape, and its width is a size corresponding to the width W in the lateral direction of each bonding region disposed on the mother board B.

In the case of this embodiment, the absorption of the polarizer 21a The axis is parallel to the longitudinal direction of the polarizer 21a, and the slow axis of the retardation film 21c is inclined at an angle within a range of 45°±5° with respect to the longitudinal direction of the retardation film 21c. For this reason, at the manufacturing stage of the retardation film 21c, it is necessary to extend the film obliquely. This oblique extension is described in detail in Japanese Patent Application No. 2013-070787 (Patent Document 10) and Japanese Patent Application No. 2013-070789 (Patent Document 11), and the phase extended by the method described in these documents can be used Poor film. Furthermore, as the retardation film 21c, a film having an abnormal dispersion characteristic such that the retardation corresponds to the wavelength on the short wavelength side can be used. The retardation film having abnormal dispersion characteristics is described in Japanese Patent No. 5204200 (Patent Document 12), Japanese Patent No. 5448264 (Patent Document 13), etc. The method of this embodiment can be used in these patent applications The described retardation film of abnormal dispersion characteristics.

Further referring to FIG. 11, the optical film 21 successively sent out from the optical film roller 22 via a pair of driving rollers 23 passes through the guide roller 24, the floating roller 25 and the guide roller 26 and the guide roller 27 that are movable in the up-down direction,送切切形成机构28。 Send to the cutting mechanism 28. The cutting forming mechanism 28 is composed of a cutting blade 29 and a pair of drive rollers 30 for delivery. This cutting forming mechanism 28 stops the driving roller 30 at the cutting forming position, and actuates the cutting blade 29 in a state where the feeding of the optical film 21 is stopped, and the remaining carrier film 21e only faces the optical film 21. A cut 28a is formed in the width direction. The interval of the cut 28a is a distance corresponding to the longitudinal length L of the bonding region 1n of each touch sensor unit 1 on the motherboard B. Therefore, the optical film is cut in the width direction via the cut 28a, and is shaped to fit the bonding region 1n The matched shape becomes an optical film 21f having a width W in the horizontal direction and a length L in the vertical direction. In this manner, on the carrier film 21e, a plurality of optical film sheets 21f are continuously formed, and these optical film sheets 21f are delivered to the bonding position by the carrier film 21e.

The floating roller 25 is elastically pushed upwards, continuously drives the pair of drive rollers 23 in the feeding direction of the optical film 21, and stops the feeding of the optical film 21 during cutting and only drives after the cutting is completed One of the specified distances between the driving rollers 30 is an adjustment roller that functions to adjust the film feed. That is, during the stop of the driving roller 30, the floating roller 25 is moved upward by an elastic force to absorb the feed amount of the driving roller 23, and when the operation of the driving roller 30 starts, the optical film applied to the optical film via the driving roller 30 is used. The tension of 21 resists the thrust of the bullet and moves downward.

A series of optical film sheets 21f formed by cutting 28a pass through the guide roller 31 and the guide roller 32 while being supported by the carrier film 21e, and passes through the floating roller 33 having the same configuration as the floating roller 25. The delivery is guided to the fitting position via guide rollers 34, 35, 36, 37.

At the bonding position, a bonding roller 38 and a carrier film peeling mechanism 39 are provided. The bonding roller 38 is movably arranged between the upper introduction position and the lower pressing position, and the continuous optical film 21f supported by the carrier film 21e is integrated into the bonding at the end position of the first optical film 21f In the state of the end of the bonding area 1n of the object's touch sensor unit 1, the touch sensor which is lowered from the upper position to the lower pressing position and presses the optical film 21f and is bonded to the motherboard B Unit 1.

The carrier film peeling mechanism 39 is provided with: function in the bonding position Then, the carrier film 21e is folded at an acute angle to peel off the first optical film 21f from the carrier film 21e. In order to retract the carrier film 21e that has been folded at an acute angle, a carrier film winding roller 40 is provided. The carrier film 21e from which the optical film sheet 21f is peeled off passes through the guide roller 41 and the pair of winding drive rollers 42 and is delivered to the winding roller 40 and wound around the winding roller 40.

The operation of the driving roller 30 and the cutting blade 29 is controlled by the aforementioned control device not shown in FIG. 11. That is, the request item device stores information about the size and position of the bonding area 1n of the touch sensor unit 1 on the motherboard B in advance, according to the bonding area 1n of the touch sensor unit 1 For the information of the longitudinal length L, the control device controls the driving of the driving roller 30 and the operation of the cutting blade 29 to form a cut 28a in the optical film 21 at a longitudinal interval corresponding to the longitudinal length L of the bonding region 1n. Further, on the upstream side of the bonding position, a film detection device 43 that detects the end of the optical film 21f is provided in advance, and information about the end position of the optical film 21f delivered to the bonding position is provided to the control device. The position information of the optical film end is stored in the control device, and the control device controls the driving roller 30 and the position information of the mother board B obtained from the suction holding disk 10 for bonding according to the position information of the optical film end The operation of the driving roller 42 for winding corresponds to the operation of the suction and holding disk 10 for bonding, and the end of the optical film 21f peeled off from the carrier film 21e is adjusted, and the position is integrated into the bonding position for bonding on the mother board B In short, the tip side of the bonding region 1n of the touch sensor unit 1 is. If position integration is achieved, the optical film 21f and the motherboard B are delivered at a synchronous speed. The bonding roller 38 is lowered to the downward pressing position, and the optical film 21f is pressed to the touch sensor unit The bonding area of element 1 is 1n. In this manner, the optical film 21f of the touch sensor unit 1 is bonded.

FIG. 13 is a schematic diagram showing an example of the sequence of bonding the optical films 21f to the motherboard B in a row-and-row-like arrangement of the touch sensor units 1 in sequence. In this example, the bonding mechanism 20 is fixed at a position in the lateral direction relative to the feed direction, and the suction holding disk 10 for bonding holding the mother board B is installed so as to be movable in the lateral direction on the support mechanism 13. As shown in FIG. 13(a), the position of the motherboard B is controlled so that the first touch sensor unit 1 in the row of touch sensor units at the left end is positioned at the bonding position. In this state, as previously described in connection with FIG. 11, the optical film 21f is bonded to the bonding area 1n of the first display unit 1 in the left end row.

Next, by moving the suction holding disk 10 for lamination in the lateral direction, the mother board B is shifted to the left lateral direction with respect to the feed direction, and is only displaced by a distance corresponding to the lateral interval of the row of touch sensor units. As shown in FIG. 13(b), this lateral displacement, the first touch sensor unit 1 in the second row from the left is positioned to the bonding position. Next, through the same operation as described above, the optical film 21f is bonded to the bonding area 1n of the touch sensor unit 1. Thereafter, the mother board B is displaced in the left lateral direction through the same operation, and the optical film 21f is bonded. In the case where the touch sensor unit 1 is configured with the example of the three-column diagram, the bonding of the optical film 21f of the first touch sensor unit is completed. This state is shown in Fig. 13(c).

Next, the suction holding disk 10 for bonding is driven in the feed direction only by a distance corresponding to the distance between the touch sensor units 1 in each column, right The second touch sensor unit 1 from the beginning of the end row is positioned to the bonding position. Similarly, as shown in FIG. 13(d), the optical film 21f is bonded to the bonding area of the unit 1 1n. Thereafter, as shown in FIG. 13(e), the mother board B is driven in the feed direction, and the optical film 21f is bonded by the same operation.

When the bonding of the optical films 21f of all the touch sensor units 1 is completed, the mother board B is sent to the cutting station V while being held on the suction holding disk 10 for bonding.

14 is a perspective view showing one example of a cutting device used in a cutting workstation. The cutting device includes a vacuum suction table 46 that is internally connected to a vacuum suction source 49, and a cutting template 47 that is attached to the vacuum suction table 46 and can be removed. It has the cutting groove 47 a formed by the shape of the touch sensor unit 1 and the interval corresponding to the arrangement interval of the touch sensor units 1 on the motherboard B. Furthermore, the cutting template 47 has a plurality of vacuum suction holes 47b similar to the suction holding disk 10 for bonding. Further, along these cutting grooves 47a, a plurality of cutting blades (not shown) for punching objects placed on the cutting template 47 out of a predetermined shape are provided. The cutting template 47 can be prepared with a plurality of shapes suitable for the touch sensor unit 1 in advance, and a suitable shape can be selected according to the shape of the touch sensor unit 1 to be cut to be attached to the vacuum suction Taiwan 46 to use.

The mother board B transferred to the cutting station V is transferred from the suction holding disk 10 for bonding to the cutting template 47 on the vacuum suction table 46. The reprint system can be used in connection with the position adjustment workstation I and the aforementioned Reprinted in the same way. The mother board B positioned on the cutting template 47 and held in a vacuum is cut by cutting with a cutting edge formed by the cutting groove 47a of the cutting template 47 and punching. The shape corresponding to the touch sensor units 1 one by one. In this way, the touch sensor unit 1 obtained by bonding the optical film 21f to the bonding area 1n is obtained.

The cutting system is not limited to pressing. For example, the cutting may be performed by the laser cutting mechanism illustrated in the cutting station V shown in FIG. 1. The cut-off touch sensor units 1 can be transported to the next process by the vacuum suction type transport mechanism 52 shown in FIG. 15, for example.

In the above-mentioned embodiment, the optical film of the laminated structure supported by the carrier film 21e is first cut by the cutting forming mechanism 28 according to a specified length to become the shape of the optical film 21f, and then bonded to The bonding area 1n of the touch sensor unit 1 on the motherboard B, but in other aspects of the present invention, without first cutting into pieces, the optical film is in the form of a continuous strip-shaped film, transitioning to The entire column of touch sensor units is attached. In this embodiment, the length of the continuous strip-shaped film to be bonded, that is, to match the touch from the longitudinal end of the bonding region 1n of the first touch sensor unit 1 in the column to the end of the touch The size up to the trailing end side of the bonding area 1n of the sensor unit 1 is first cut by the cutting forming mechanism 28, or by the cutting mechanism located near the bonding position Cut off after closing. The bonding of this embodiment is shown in Fig. 16. As shown in FIG. 16( a ), the mother board B, the end of the first touch sensor unit 1 in the row at the left end in the feed direction, is positioned to a specified position in the bonding position. As shown in Figure 13 As described above, the carrier film 21e is peeled off from the optical film 21, and the optical film is continuously attached to the touch sensor unit 1 in the left end row. Next, move the motherboard B to the left lateral direction and rearward, as shown in FIG. 16(b), the state in which the first touch sensor unit 1 in the second row is integrated into the bonding position is achieved, and the same fit. Similarly, as shown in FIG. 16(b), the motherboard B is moved to the left lateral direction and rearward, and the state where the first touch sensor unit 1 in the right end row is integrated into the bonding position is performed, and the same bonding is performed. The mother board B bonded in this way is cut by the cutting mechanism shown in FIG. 14 to obtain the touch sensor units 1 one by one. Through this cutting, the optical film 21 that has been continuously bonded is cut to a size corresponding to the size of the bonding area 1n of the touch sensor unit.

The method of the present invention can also be applied to the bonding of the optical films of the touch sensor unit 1 arranged in a row on the motherboard B. One example is shown in FIG. 17. In this case, the touch sensor unit 1 is arranged on the motherboard B such that the connection area 1e is lateral with respect to the direction of the column. The bonding system can bond the optical film 21f cut in advance to the bonding of the touch sensor unit 1 in the same order as the operation described in connection with FIG. 11 from the first in the row. Region 1n. Instead, the entire touch sensor unit 1 covering the column is bonded with the optical film 21 to its bonding area 1n. In the subsequent cutting process, the remaining portion of the optical film 21 may also be cut off.

Moreover, in the embodiment described using FIG. 16, the optical film is bonded in the longitudinal direction with respect to the touch sensor unit, but in still another aspect of the present invention, the bonding is in the horizontal direction Optical diaphragm. Fig 18 is a schematic diagram of the bonding in this embodiment. As shown in FIG. 18, in this aspect, the touch sensor unit 1 is arranged in rows and columns so that the terminal portion is positioned in the feed direction 72. That is, in this embodiment, the feed direction 72 is the lateral direction of the touch sensor unit 1, and the direction perpendicular to the feed direction 72 is the longitudinal direction of the touch sensor unit 1. Moreover, in this embodiment, for the entire row 70 of touch sensor units arranged in the vertical direction, the width of the optical film 21 is aligned with the length of the optical film 21 because the optical film 21f is bonded to the horizontal direction. The vertical dimension of the column 70 of the direction-oriented touch sensor unit corresponds. Here, the "correspondence" with the vertical dimension of the row 70 of the touch sensor unit does not mean strictly coincide, and the vertical dimension of the row 70 of the touch sensor unit may be roughly matched, for example, there may be Based on this longitudinal dimension, the remaining dimension of the optical film width is determined. In this aspect, the optical film 21 is cut by the forming mechanism 28, and the carrier film 21e remains, and the optical film 21f is formed. The interval of cutting corresponds to the width W in the lateral direction of the bonding region 1n of the touch sensor unit 1. Therefore, the optical film 21 is cut in the width direction by the cut 28a, and becomes a row 70 having a lateral width W of the bonding region 1n with the touch sensor unit 1 and the touch sensor unit 1 The overall longitudinal length corresponds to the length of the side of the optical film 21f.

FIG. 19 is a schematic diagram showing an example of the bonding sequence related to the aspect shown in FIG. 18. As shown in FIG. 19(a), the suction holding substrate 10 for bonding is moved, and the end of the bonding area 1n of the touch sensor unit 1 in the first row is positioned to the end of the optical film 21f, that is, bonding position. As the adhesive layer 21d remains on the side of the optical film 21f, The carrier film 21e is peeled from the optical film 21f, and the optical film 21f is continuously bonded in the lateral direction to the bonding area 1n of the touch sensor unit 1 in the first row. Next, the motherboard B is moved forward, and as shown in FIG. 19( b ), the state where the touch sensor unit 1 in the second row is integrated into the bonding position is achieved, and the same bonding is performed. Similarly, by moving the motherboard B forward, as shown in FIG. 19(c), the state in which the touch sensor unit 1 in the third row is integrated into the bonding position is performed, and the same bonding is performed. The mother board B thus bonded is cut by the cutting mechanism shown in FIG. 14 to obtain the touch sensor units 1 one by one. Through this cutting, the optical film 21 that has been continuously bonded is cut to a size corresponding to the size of the bonding area 1n of the touch sensor unit 1. In this embodiment, the motherboard B only moves forward, and there is no need to move the motherboard B back and forth. Therefore, a plurality of touch sensor units arranged in rows and columns on the motherboard can be attached in a short time. Even if a plurality of bonding mechanisms for bonding the optical film in the longitudinal direction are moved only forward, all the touch sensor units 1 on the motherboard can be bonded, but if a plurality of bonding mechanisms are used It will enlarge the area occupied by the equipment. Even if there is a laminating mechanism, if it fails, it will stop the laminating device as a whole and cause unstable operation. Moreover, most of the bonding mechanisms increase the cost of manufacturing devices. In addition, the embodiment shown in FIG. 19 is the same as the embodiment shown in FIG. 11 except for the bonding method.

In addition, in the embodiment shown in FIG. 18, before the bonding, the optical film 21 is cut according to the width in the lateral direction of the bonding area 1n to form the optical film 21f; Go further In the embodiment, after the optical film 21 is continuously bonded to the bonding region 1n of the touch sensor unit 1 in the lateral direction, the optical film 21 is cut to form an optical film 21f. The optical film 21 may be cut to match the rear end of the touch sensor unit 1 in the lateral direction, but the remaining portion of the optical film 21f may be cut off by the cutting process of the subsequent cutting station V For some reasons, the remaining portion of the optical film 21 may be left and cut near the rear end of the bonding region 1n. If there is a connection region 1e at the rear in the lateral direction, the optical film 21 is cut on the connection region 1e so as not to damage the connection region 1e, and the connection region 1e is ideally arranged to be positioned on the lateral end side.

Moreover, in other aspects of the present invention, the point that the optical film is bonded to the lateral direction of the touch sensor unit is the same as the embodiment shown in FIG. 18, but a plurality of optical films are used The roll is different. Fig. 20 shows a schematic view of the bonding in this manner. In this embodiment, the widths of the two optical film rollers 22-1 and 22-2 are respectively related to the two partial rows 70-1 of the touch sensor unit constituting the row 70 of the touch sensor unit and The longitudinal dimension of 70-2 corresponds to the overall width of the two optical film rollers 22-1 and 22-2, which corresponds to the longitudinal dimension of the row 70 of the touch sensor unit. Also in this aspect, the optical films 21-1 and 21-2 are cut by the forming mechanism 28, and the carrier films 21e-1 and 21e-2 remain to be cut to form optical films 21f-1 and 21f- 2. The interval of cutting corresponds to the width W in the lateral direction of the bonding region 1n of the touch sensor unit 1. Therefore, the optical films 21-1 and 21-2 are cut to form a lateral width W and a touch sensor unit 1 having a bonding area 1n with the touch sensor unit 1 The optical films 21f-1 and 21f-2 of the side corresponding to the longitudinal length of the partial row 70-1 (70-2). In this aspect, two identical optical film rolls are used, but three or other number of film rolls may be used, or optical film rolls of different widths may be used. Furthermore, as in the case of using one optical film roller, it may be configured that the optical film is cut after the optical film is attached to the touch sensor unit.

FIG. 21 is a schematic diagram showing an example of the bonding sequence related to the aspect shown in FIG. 20. Lamination is performed by the same lamination method as described in FIG. 18. That is, the mother board B is moved forward (horizontal direction), as shown in FIG. 21(a), the end of the optical film 21f-1 is positioned so as to match the position of the touch sensor unit 1 in the first row The ends of the bonding area 1n are aligned, and bonding is performed to the touch sensor unit 1 belonging to the partial row 70-1. As described above in connection with FIG. 13, the carrier film 21e-1 is peeled off from the optical film 21f-1, and the optical film 21f-1 is continuously bonded to the first row of the partial row 70-1 in the lateral direction The bonding area 1n of the touch sensor unit 1. At this time, the bonding position of the optical film 21f-2 is in the lateral direction (feeding direction) than the two-row portion of the optical film 21f-1 on the feed end side, and belongs to the partial row 70- The touch sensor unit 1 of 2 does not perform bonding of the optical film 21f-2. Next, the motherboard B is moved forward, and as shown in FIG. 21(b), the touch sensor unit 1 that achieves the partial row 70-1 of the second row is integrated into the bonding of the optical film 21f-1 The position of the position is the same. Furthermore, the motherboard B is moved forward, as shown in FIG. 21(c), and the state where the touch sensor unit 1 in the third row is integrated into the bonding position is achieved. At this time, because the end positions of the optical film 21f-2 are integrated To the end of the bonding area 1n of the touch sensor unit in the first row of the partial row 70-2, the touch sensor unit in the partial row 70-1 of the third row and the first in the partial row 70-2 The rows of touch sensor units are attached simultaneously. Furthermore, as shown in FIG. 21(d), the motherboard B is moved forward, and the touch sensor unit 1 of the partial row 70-1 of the fourth row is integrated into the optical film 21f-1. Position, the state where the touch sensor unit 1 of the partial row 70-2 in the second row is integrated into the bonding position of the optical film 21f-2, and the same bonding is performed. In this way, the mother board B to which all the touch sensor units have been bonded by the optical film is cut by the cutting mechanism shown in FIG. 14 to obtain the touch sensor units 1 one by one. Unlike the above-described embodiment, the bonding mechanism may be arranged in the same position in relation to the horizontal direction. However, although not shown in FIG. 20, there are bonding mechanisms such as a peeling means, a supporting member of the bonding roller, etc. around the actual bonding position. For this reason, by arranging the bonding positions of the optical films to be different in the lateral direction of each optical film roller, it becomes easy to secure the arrangement space of the related bonding mechanism. In particular, the adjacent bonding mechanism is a problem in order to secure the space for arrangement. Ideally, it is desirable to set only the bonding positions corresponding to the adjacent optical film rollers to be different in the lateral direction. In the present embodiment, the bonding positions of the optical film rolls 22-1 and 22-2 are different by 2 lines in the lateral direction, but it is not limited thereto. For example, the bonding positions may be different by only 1 line.

In other aspects of the invention, an optical film roll having a width corresponding to a partial row of the touch sensor unit is used to move the bonding position of the optical film and the motherboard in the longitudinal direction, according to each A part of the column is sequentially bonded to the optical film, and the optical film is bonded to a row of contacts Control sensor unit. That is, in some rows of the touch sensor unit, after the optical film is bonded, the relative movement of the touch sensor unit assembly mother board and the optical film in the longitudinal direction is only with the touch sensing The partial rows of the sensor units are at a considerable distance, so that the ends of the bonding area of the touch sensor units constituting the partial rows that have not been bonded with the optical film are integrated into the bonding position of the optical films. FIG. 22 shows an embodiment in which the longitudinal movement of the optical film 21f and the motherboard B is performed by moving the motherboard B. In the aspect shown in FIG. 22, the optical film roller 22 corresponds to the longitudinal dimension of the partial row 70-1 (70-2). Then, the optical film 21 is cut by the cutting forming mechanism 28, and the carrier film 21e remains, and an optical film 21f is formed. The interval of cutting corresponds to the width W in the lateral direction of the bonding region 1n of the touch sensor unit 1. Therefore, the optical film 21 is cut in the width direction by the cut 28a and has a width in the horizontal direction corresponding to the longitudinal length of the partial row 70-1 (70-2) of the touch sensor unit 1边之光光片21f。 Edge optical film 21f.

FIG. 23 is a schematic diagram showing an example of the bonding sequence related to the aspect shown in FIG. 22. As shown in FIG. 23(a), by moving the suction holding plate 10 for bonding, the motherboard B is moved, and the touch sensor units in the first column arranged in rows and columns on the motherboard B are aligned To the bonding position of the optical film 21f. Next, as shown in FIG. 23(b), from the feeding direction of the first row of the touch sensor unit, the left partial row 70-1 is aligned to the bonding position of the optical film 21f. That is, the end of the bonding region 1n of the touch sensor unit 1 belonging to the partial row 70-1 is integrated with the end of the optical film 21f. Next, continuous bonding of optics in the horizontal direction The bonding area 1n of the diaphragm 21f to the touch sensor unit 1 belonging to the partial row 70-1. After the relevant bonding, the mother board B is moved in the longitudinal direction (to the left of the feed direction) by only a part of the longitudinal dimension of the row, as shown in FIG. 23(c), from the feed direction of the first row, Fit the touch sensor unit in the part row 70-2 on the right side to the bonding position of the optical film. In order to move the mother board B in the lateral direction, the mother board B is moved not only in the longitudinal direction but also in the rear direction (the direction opposite to the bonding direction) by the width W of the bonding region 1n. Next, the optical film 21f is attached to the touch sensor unit 1 belonging to the partial row 70-2. When the optical film 21f is attached to all the touch sensor units in the first row, move the motherboard B in FIG. 23(d) in the vertical direction (right side of the feed direction) and forward, and move the part belonging to the second row The touch sensor unit 1 of the partial row 70-1 is bonded to the bonding position, and the optical film is bonded to the touch sensor unit 1 of the partial row 70-1 belonging to the second row. As in the first row, the motherboard B is moved, and as shown in FIG. 23(e), the optical film 21f is bonded to the touch sensor unit of the partial row 70-2 belonging to the second row. In this way, the mother board B on which the optical film 21f is bonded to all the touch sensor units 1 is cut by the cutting mechanism shown in FIG. 14 to obtain one touch sensor unit 1 This is the same as other types.

FIG. 24 shows an embodiment in which the above-mentioned relative movement in the vertical direction is performed by moving the optical film. In this embodiment, in addition to designing that the bonding mechanism 20 is movable in the vertical direction, by moving the bonding mechanism 20 in the vertical direction, the bonding position of the optical film is aligned to the touch sensing which becomes the bonding object The position of the end side of the 22 and 23 are the same.

FIG. 25 is a schematic diagram showing an example of the bonding sequence related to the aspect shown in FIG. 24. As shown in FIG. 25(a), the motherboard B is moved, and the bonding area 1n of the touch sensor unit 1 in the first row of the touch sensor units 1 arranged in rows and columns on the motherboard B The end of the, and the end of the optical film 21f is the bonding position, and the position is integrated in the relevant lateral direction. Next, as shown in FIG. 25(b), and by using the movement of the bonding mechanism 20, by moving the optical film 21f in the longitudinal direction, the end of the optical film is integrated into the relevant longitudinal direction to the position The first column is part column 70-1. That is, the bonding area 1n of the touch sensor unit belonging to the partial row 70-1 and the end of the optical film 21f are positionally integrated. Next, the optical film is continuously bonded in the lateral direction to the partial row 70-1 located on the left side in the feed direction of the first row. After the relevant bonding, the movement of the bonding mechanism 20 causes the optical film 21f to move in the vertical direction (to the right of the feed direction) by only the longitudinal dimension of a part of the row, as shown in FIG. 25(c) The closed position is aligned with the touch sensor unit 1 of the partial row 70-2 to the right of the feed direction of the first row. In order to move the mother board B in the lateral direction, the mother board B moves backward (in the opposite direction to the bonding direction) by the width W of the bonding region 1n in the horizontal direction. Next, the optical film 21f is attached to the touch sensor unit 1 belonging to the partial row 70-2. When the optical film 21f is bonded to all the touch sensor units in the first row, the bonding mechanism 20 is moved in the vertical direction (to the left in the feed direction), and the motherboard B is moved forward, such as As shown in FIG. 25(d), the partial row 70-1 of the second row is aligned to the bonding position, and an optical film is applied to the touch sensor unit of the partial row 70-1 belonging to the second row 'S fit. Next, as in the first row, the motherboard B is moved, and as shown in FIG. 25(e), the optical film 21f is bonded to the touch sensor unit 1 of the partial row 70-2 belonging to the second row. In this mode, the vertical size of the bonding workstation IV can be reduced without moving the motherboard B in the vertical direction, so space can be saved.

The bonding sequence shown in FIGS. 23 and 25 is that the touch sensor unit 1 belonging to the partial row 70-1 performs the bonding of each row, but the bonding may also be performed in order according to the row. For example, it is not necessary to make the motherboard B or optical when moving the column from the first column to the second column by touching the second column with the touch sensor unit belonging to the partial column 70-2 The diaphragm moves longitudinally. That is, when the position integration of the optical display film between the columns and the touch sensor unit is performed, the position integration in the longitudinal direction can be omitted. In addition, in the configuration shown in FIGS. 23 and 25, there are 6 touch sensor units 1 in a row. By bonding the 3 touch sensor units 1 twice, the The optical film 21f is attached to the touch sensor units 1 in a row; however, it is also possible to attach two touch sensor units three times. In addition, it is possible to perform lamination to one touch sensor unit 6 times, and there is no need to cut off the workstation V when there is no remaining optical film remaining outside the touch sensor unit. Cut the optical film. Furthermore, in any type, the number of touch sensor units in each column may be plural, not limited to six.

In addition, in the embodiment shown in FIGS. 18 to 24, the configuration other than the bonding station IV is the same as the embodiment used and described in FIGS. 1 to 16.

The specific embodiments of the present invention have been illustrated and described above, but the present invention is not limited to the illustrated embodiments. The scope of the present invention is determined according to the claims of the scope of patent application.

1‧‧‧Touch sensor unit

3‧‧‧Glass substrate

4‧‧‧COP film with ITO film

10‧‧‧Suspension holding disc

13‧‧‧Supporting mechanism

14‧‧‧rail

15‧‧‧Guide

19‧‧‧ Motherboard position detection device

20‧‧‧Facilities

21‧‧‧Optical film

21e‧‧‧Carrier film

21f‧‧‧Optical diaphragm

22‧‧‧Optical film roller

23‧‧‧Drive roller

24‧‧‧Guide roller

25‧‧‧floating roller

26‧‧‧Guide roller

27‧‧‧Guide roller

28‧‧‧Cut forming mechanism

28a‧‧‧Cut

29‧‧‧cutting blade

30‧‧‧Drive roller

31‧‧‧Guide roller

32‧‧‧Guide roller

33‧‧‧floating roller

34, 35, 36, 37 ‧‧‧ Guide roller

38‧‧‧ Laminating roller

39‧‧‧Carrier film peeling mechanism

40‧‧‧winding roller

41‧‧‧Guide roller

42‧‧‧Drive roller

43‧‧‧membrane detection device

B‧‧‧Touch sensor unit assembly mother board

Claims (23)

A method for bonding an optical film to a bonding area of a touch sensor unit, wherein the touch sensor unit is provided with: a sensor area where a touch sensor is arranged, and an electrical connection The electrical terminals used are located on the connection area of one side of the touch sensor unit, and the wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal; the bonding area is Contains the aforementioned sensor area, and does not include at least a part of the aforementioned connection area; using a touch sensor unit assembly mother board and an optical film laminate roller; the touch sensor unit assembly mother board is a handle A plurality of the above-mentioned touch sensor units are formed by arranging at least in the longitudinal direction and arranging on the substrate in a state in which the side position of the connection region is in the horizontal direction; the optical film laminate roller, The optical film laminate is rolled into a roll shape; the optical film laminate is in the form of a continuous net, and the carrier film is attached to the optical film via an adhesive layer; the optical film includes at least A layer of polarizers with a width corresponding to the width in the horizontal direction of the bonding area of the aforementioned touch sensor units arranged on the mother board of the control sensor unit assembly in a longitudinal direction; including the following stages: The stage of sending a plurality of the motherboards of the touch sensor unit assembly to the laminating position in sequence; the stage of successively sending out the optical film laminate from the optical film laminate roller to the laminating position; The optical film and the adhesive layer of the optical film laminate that are successively delivered are arranged in a longitudinal row of the touch sensor unit on the motherboard of the touch sensor unit assembly The longitudinal interval corresponding to the longitudinal dimension of the aforementioned bonding area is sequentially cut in the lateral direction, and between the two adjacent cuts in the longitudinal direction, a support is supported on the carrier via an adhesive layer The stage of the optical film on the film; and in the bonding position, the optical film is peeled from the carrier film with the adhesive layer remaining on the optical film side, and the peeled optical film is removed in accordance with The step of sequentially attaching to the bonding area of the touch sensor units arranged one by one in the longitudinal direction of the motherboard of the touch sensor unit assembly moving in the vertical direction; The longitudinal direction of the touch sensor units arranged on the mother board of the touch sensor unit assembly in the longitudinal direction is performed on the bonding area of the first touch sensor unit from the longitudinal direction Before the bonding of the optical film, the lateral position and the azimuth angle of the motherboard of the touch sensor unit assembly relative to the feed direction are adjusted. The touch sensor unit is delivered to the paste The optical films in the closed position are integrated with respect to the lateral direction and azimuth angle. By adjusting the feed of the mother board of the touch sensor unit assembly and the feed of the optical film, the optical films one by one The end of the sheet and the end of the bonding area of the touch sensor unit corresponding to the motherboard of the touch sensor unit assembly are aligned. A method for bonding an optical film to a bonding area of a touch sensor unit, wherein, The aforementioned touch sensor unit is provided with: a sensor area in which a touch sensor is arranged, a connection area provided with an electrical terminal for electrical connection and positioned on one side of the touch sensor unit, And a wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal; the bonding area includes the sensor area and does not include at least a portion of the connection area; using touch sensing Sensor unit assembly mother board and optical film laminate roller; the touch sensor unit assembly mother board is composed of a plurality of the above-mentioned touch sensor units at the side with the connection area in the lateral direction In the state, it is arranged at least in the longitudinal direction and arranged on the substrate; the optical film laminate roller rolls the optical film laminate into a roll shape; the optical film laminate is a continuous web Shape, the carrier film is attached to the optical film via an adhesive layer; the optical film at least includes the aforementioned touch sense having a row shape arranged in a longitudinal direction on the motherboard of the aforementioned touch sensor unit assembly A layer of polarizers with a width corresponding to the lateral width of the bonding area of the sensor unit; including the following stages: the stage of sequentially sending a plurality of the motherboards of the aforementioned touch sensor unit assembly to the bonding position ; The optical film laminate is successively fed out from the optical film laminate roller and sent to the stage of the bonding position; in the bonding position, with the adhesive layer remaining on the side of the optical film from the aforementioned state The carrier film peels off the optical film, and the peeled optical film is continuously attached to the contact moving in the feed direction The stage of arranging the aforesaid bonding areas of a plurality of touch sensor units in a row in the longitudinal direction of the mother board of the control sensor unit assembly; and the aforesaid touch sensing that has been continuously bonded with the optical film The plurality of touch sensor units on the mother board of the sensor unit assembly are cut into one touch sensor unit, and at the same time, at the longitudinal end of the touch sensor unit, cut and attached to The stage of the optical film of the touch sensor units one by one; the longitudinal direction of the touch sensor units arranged in a row in the longitudinal direction on the motherboard of the touch sensor unit assembly is seen from the longitudinal direction Before bonding the optical film to the first touch sensor unit, adjust the lateral position and azimuth angle of the motherboard of the touch sensor unit assembly relative to the feed direction. The control sensor unit is to integrate the position of the optical film sent to the bonding position with respect to the horizontal direction and the azimuth angle, and adjust the feed of the touch sensor unit assembly mother board to the optical The feeding of the diaphragm aligns the end of the optical film and the end of the bonding area of the touch sensor unit corresponding to the motherboard of the touch sensor unit assembly. A method according to claim 1 or claim 2, wherein a plurality of longitudinal rows formed by the plurality of touch sensor units are arranged in parallel on the motherboard of the touch sensor unit assembly , Bonding the optical film to the aforementioned touch sensor units included in each column. The method according to claim 3, wherein the bonding of the optical films of the touch sensor units included in each row that have been arranged in parallel is performed for each row in sequence. The method of claim 1, wherein, The plurality of touch sensor units on the motherboard of the touch sensor unit assembly is made up of a plurality of touch sensor units formed in parallel and arranged in parallel in a plurality of rows The arrangement of the rows and columns is to perform the optical film on the bonding area of the first touch sensor unit in the first row in the longitudinal direction of the right or left end when viewed from the feeding direction After bonding, the motherboard of the touch sensor unit assembly is moved laterally and rearward, and the first touch sense of the feeding direction adjacent to the first row of the longitudinal direction and the second row of the longitudinal direction The end of the bonding area of the sensor unit is sent to the bonding position to be positioned at the end of the optical film, and the optical film is bonded to the bonding area of the touch sensor unit in order In the same bonding, when the bonding of the optical films of the touch sensor units in the first row of all columns is completed, advance the motherboard of the touch sensor unit assembly in the feed direction, via In the same operation, apply the optical film to the touch sensor units located in the second row of each column, and repeat the same operation in sequence, for all of the motherboards of the aforementioned touch sensor unit assembly. The aforementioned bonding area of the touch sensor unit performs bonding of the optical film. The method according to claim 1 or claim 2, wherein the optical film is composed of a polarizer and a retardation film attached to the polarizer; the optical film is the position of the retardation film on the surface For the configuration of the side of the adhesive layer, the retardation film is bonded to the bonding area of the touch sensor unit. The method according to claim 6, wherein the absorption axis of the polarizer and the slow axis of the retardation film intersect at an angle within a range of 45°±5°. The method of claim 7, wherein, The absorption axis of the polarizer is parallel to the longitudinal direction of the optical film, and the slow axis of the retardation film is arranged obliquely to the longitudinal direction of the optical film. The method according to claim 6, wherein the aforementioned retardation film is an abnormal dispersion film whose phase difference for short-wavelength light is smaller than that for long-wavelength light. A method for bonding an optical film to a bonding area of a touch sensor unit, wherein the touch sensor unit is provided with: a sensor area where a touch sensor is arranged, and an electrical connection The electrical terminals used are located on the connection area of one side of the touch sensor unit, and the wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal; the bonding area is Contains the aforementioned sensor area, and does not include at least a part of the aforementioned connection area; using a touch sensor unit assembly mother board and an optical film laminate roller; the touch sensor unit assembly mother board is a handle A plurality of the above-mentioned touch sensor units are formed by arranging at least in the longitudinal direction and arranging on the base material in a state where the side position of the connection area is in the horizontal direction; The optical film laminate is rolled into a roll shape; the optical film laminate has a continuous mesh shape, and the carrier film is attached to the optical film via an adhesive layer; the optical film includes at least A layer of polarizers with a width corresponding to the longitudinal dimension of the abutting area of the plurality of rows of the touch sensor units arranged in a longitudinal direction on the motherboard of the control sensor unit assembly; It includes the following stages: the stage of sequentially sending the plurality of motherboards of the touch sensor unit assembly to the bonding position; the optical film laminate is successively sent out from the optical film laminate roller and sent to the adhesive At the stage of closing the position; the optical film and the adhesive layer of the optical film layered body that are successively delivered are separated by a longitudinal interval corresponding to the lateral direction of the bonding area of the touch sensor unit at The longitudinal direction is sequentially formed with cuts, and between the two adjacent cuts in the horizontal direction, the stage of forming the optical film supported on the carrier film via the adhesive layer is formed; With the adhesive layer remaining on the optical film side, the optical film is peeled off from the carrier film, and the peeled optical film is continuously bonded to the assembly of the touch sensor unit moving in the lateral direction The step of arranging the bonding regions of the rows of the touch sensor units in the longitudinal direction on the mother board; and the mother board of the assembly of the touch sensor units to which the optical film has been bonded The plurality of touch sensor units on the above are cut into one touch sensor unit, and at the same time, at the longitudinal end of the touch sensor unit, the touch sensor attached to each one is cut off The stage of the optical film of the sensor unit; the longitudinal direction of the touch sensor units arranged in a row on the mother board of the touch sensor unit assembly is viewed from the lateral direction to the first touch Before the bonding region of the control sensor unit performs the bonding of the optical film, the longitudinal position and azimuth angle of the motherboard of the touch sensor unit assembly are adjusted. The touch sensor The unit is for the optical film sent to the bonding position, with respect to the longitudinal direction and Azimuth angle, position integration, by adjusting the feed of the touch sensor unit assembly mother board and the feed of the optical film, the end of the piece of the optical film one by one, and the touch sensing The end of the bonding area of the corresponding touch sensor unit on the motherboard of the sensor unit assembly is aligned. A method for bonding an optical film to a bonding area of a touch sensor unit, wherein the touch sensor unit is provided with: a sensor area where a touch sensor is arranged, and an electrical connection The electrical terminals used are located on the connection area of one side of the touch sensor unit, and the wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal; the bonding area is Contains the aforementioned sensor area, and does not include at least a part of the aforementioned connection area; using a touch sensor unit assembly mother board and an optical film laminate roller; the touch sensor unit assembly mother board is a handle A plurality of the above-mentioned touch sensor units are formed by arranging at least in the longitudinal direction and arranging on the substrate in a state in which the side position of the connection region is in the horizontal direction; the optical film laminate roller, The optical film laminate is rolled into a roll shape; the optical film laminate is in the shape of a continuous net, and the carrier film is bonded to the optical film via an adhesive layer; the optical film includes at least a plurality of A layer of polarizers with a width corresponding to the longitudinal dimension of the abutting area of the row of touch sensor units; including the following stages: sequentially sending a plurality of the motherboards of the touch sensor unit assembly to The stage of the bonding position; the stage where the optical film laminate is successively sent out from the optical film laminate roller and sent to the bonding position; in the bonding position, the adhesive layer remains on the optical film side The optical film is peeled off from the carrier film in a state where the peeled optical film is continuously bonded to the longitudinal direction of the motherboard of the touch sensor unit assembly moving in the feed direction and arranged in a row The stage of the bonding area of the row of the plurality of touch sensor units; corresponding to the touch sensor unit on the motherboard of the touch sensor unit assembly to which the optical film is bonded The horizontal end of the bonding area of the row of the row, the stage of cutting the optical film to form an optical film; and the mother board of the touch sensor unit assembly to which the optical film has been continuously bonded A plurality of touch sensor units are cut into one touch sensor unit, and at the same time, at the end of the longitudinal direction of the touch sensor unit, the aforementioned optical unit attached to each unit is cut off Film stage; the longitudinal direction of the touch sensor units arranged on the motherboard of the touch sensor unit assembly in the longitudinal direction is performed on the first touch sensor unit from the lateral direction Before the bonding of the optical film, the longitudinal position and azimuth angle of the motherboard of the touch sensor unit assembly are adjusted. The touch sensor unit is sent to the bonding position. The optical film is integrated with respect to the longitudinal direction and the azimuth angle. By adjusting the feed of the touch sensor unit assembly mother board and the feed of the optical film, the optical films End and corresponding to the motherboard of the touch sensor unit assembly The end of the aforementioned bonding area of the touch sensor unit is aligned. The method according to claim 11, wherein the position of the connection region is on the feed end side of the optical film in the lateral direction. A method for bonding an optical film to a bonding area of a touch sensor unit, wherein the touch sensor unit is provided with: a sensor area where a touch sensor is arranged, and an electrical connection The electrical terminals used are located on the connection area of one side of the touch sensor unit, and the wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal; the bonding area is Including the aforementioned sensor area, and excluding at least a part of the aforementioned connection area; using a touch sensor unit assembly mother board and a plurality of optical film laminate rollers; the touch sensor unit assembly mother board, A plurality of the above-mentioned touch sensor units, in a state where the side position with the connection area is in the horizontal direction, at least arranged in a row in the longitudinal direction and arranged on the substrate; the plurality of optical film layers The integrated roller is a row that constitutes the plurality of rows of the touch sensor units, and has a width corresponding to the longitudinal dimension of the bonding area of the plurality of partial rows of the touch sensor units, wherein, A plurality of optical film laminates in the shape of a continuous web are rolled into a roll shape, and the plurality of optical film lamination systems adheres the carrier film to the optical film of the layer containing at least the polarizer via the adhesive layer; The following stages: Sequentially send a plurality of motherboards of the aforementioned touch sensor unit assembly to The stage of the laminating position; the stage in which the plurality of optical film laminates are successively sent out from the plurality of optical film laminate rollers and sent to the laminating position; the stage of the plurality of optical film laminates successively sent out The optical film and the adhesive layer are sequentially cut in the longitudinal direction at intervals in the longitudinal direction corresponding to the lateral direction of the bonding area of the touch sensor unit, and in two adjacent slits in the lateral direction Between the cuts, the stage of forming the optical film supported on the carrier film via the adhesive layer is formed; in the bonding position, the adhesive layer is peeled from the carrier film with the adhesive layer remaining on the optical film side The plurality of optical films, the peeled plurality of optical films are successively attached to the longitudinal direction of the touch sensor unit assembly mother board moving in the horizontal direction and arranged in a row in a row The stage of controlling the bonding area of the plurality of partial rows of the sensor unit; and the plurality of touch sensors on the mother board of the assembly of the touch sensor unit to which the optical film has been bonded The unit is cut into touch sensor units one by one, and at the same time, at the longitudinal end of the touch sensor unit, the stage of the aforementioned optical film attached to the touch sensor units one by one is cut ; The optical sensor film of the first touch sensor unit is arranged in the longitudinal direction of the touch sensor units arranged in a row in the longitudinal direction on the motherboard of the touch sensor unit assembly Before bonding the sheets, the longitudinal position and azimuth angle of the motherboard of the touch sensor unit assembly are adjusted. The touch sensor unit is the optical film sent to the bonding position Sheet, with regard to the longitudinal direction and azimuth angle, position integration, by adjusting the above-mentioned touch sensor unit assembly motherboard The feeding and the feeding of the aforementioned optical film, to the end of the piece of the optical film one by one, and the aforementioned bonding area of the touch sensor unit corresponding to the mother board of the touch sensor unit assembly Align the ends. The method according to claim 13, wherein the bonding positions of the plurality of optical film laminates adjacent in the longitudinal direction are different in the lateral direction. A method for bonding an optical film to a bonding area of a touch sensor unit, wherein the touch sensor unit is provided with: a sensor area where a touch sensor is arranged, and an electrical connection The electrical terminals used are located on the connection area of one side of the touch sensor unit, and the wiring area configured with wiring electrically connecting the touch sensor and the electrical terminal; the bonding area is Contains the aforementioned sensor area, and does not include at least a part of the aforementioned connection area; using a touch sensor unit assembly mother board and an optical film laminate roller; the touch sensor unit assembly mother board is a handle A plurality of the above-mentioned touch sensor units are formed by arranging at least in the longitudinal direction and arranging on the substrate in a state in which the side position of the connection region is in the horizontal direction; the optical film laminate roller, The optical film laminate is rolled into a roll shape; the optical film laminate is in the form of a continuous net, and the carrier film is attached to the optical film via an adhesive layer; the optical film includes at least a layer of polarizers; The layer of the polarizer has a width corresponding to the longitudinal dimension of one bonding area in the plurality of rows of the touch sensor units constituting the plurality of rows of the touch sensor units; It includes the following stages: the stage of sequentially sending a plurality of the motherboards of the touch sensor unit assembly to the bonding position; the optical film laminate is successively sent out from the optical film laminate roller and sent to the adhesive The stage of closing the position; the optical film and the adhesive layer of the optical film laminate that are successively delivered are separated by a longitudinal interval corresponding to the lateral direction of the bonding area of the touch sensor unit at In the longitudinal direction, a cut is formed, and between two cuts adjacent in the horizontal direction, an optical film supported on the carrier film via the adhesive layer is formed; in the bonding position, in the adhesive With the layer remaining on the optical film side, the optical film is peeled off from the carrier film, and the peeled optical film is bonded to the motherboard of the touch sensor unit assembly moving in the lateral direction In the stage of arranging the aforesaid bonding area of the touch sensor units in a longitudinal direction, wherein the optical film and the motherboard of the touch sensor unit assembly are relatively moved in the longitudinal direction The above-mentioned optical film to the sequence of each part in sequence; cut off the plurality of touch sensor units on the motherboard of the set of the touch sensor units to which the optical film has been attached into One by one touch sensor unit, if there is remaining the aforementioned optical film, at the same time, at the longitudinal end of the touch sensor unit, cut off and attach to one by one touch sensor unit The stage of the optical film; the longitudinally arranged touch sensor units on the motherboard of the touch sensor unit assembly are aligned with the first touch sensor when viewed from the horizontal direction Before the unit performs the bonding of the optical film, before The adjustment of the longitudinal position and azimuth angle of the motherboard of the touch sensor unit assembly, the touch sensor unit is about the longitudinal direction and orientation of the optical film sent to the bonding position Angle, position integration, by adjusting the feed of the touch sensor unit assembly mother board and the feed of the optical film, the end of the piece of the optical film one by one, and the touch sensor The end of the bonding area of the corresponding touch sensor unit on the motherboard of the unit assembly is aligned. The method according to claim 15, wherein by moving the touch sensor unit assembly mother board, the optical film and the touch sensor unit assembly mother board relatively move in the longitudinal direction. The method of claim 15, wherein by moving the optical film, the optical film and the touch sensor unit assembly mother board are relatively moved in the longitudinal direction. The method according to any one of claim 10 to claim 17, wherein a plurality of longitudinal directions formed by the plurality of the touch sensor units are arranged in parallel on the motherboard of the touch sensor unit assembly In the direction column, the optical film is bonded to the touch sensor unit included in each column. The method according to claim 18, wherein the bonding of the optical film included in the bonding area of the touch sensor unit of each row that has been arranged in parallel is performed sequentially for each row. The method according to any one of claim 10 to claim 17, wherein, The optical film is composed of a polarizer and a phase difference film attached to the polarizer; the optical film is a structure where the phase difference film is positioned on the side facing the adhesive layer, the phase difference film It is attached to the bonding area of the touch sensor unit. The method of claim 20, wherein the absorption axis of the polarizer and the slow axis of the retardation film intersect at an angle within a range of 45°±5°. The method of claim 21, wherein the absorption axis of the polarizer is parallel to the longitudinal direction of the optical film, and the slow axis of the retardation film is arranged to be inclined obliquely with respect to the longitudinal direction of the optical film. The method according to claim 20, wherein the aforementioned retardation film is an abnormal dispersion film whose phase difference for short-wavelength light is smaller than that for long-wavelength light.

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