TWI691095B - Dual band photodetector and manufacturing method thereof - Google Patents
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本發明是關於一種光檢測器及其製備方法,特別是一種雙波段光檢測器及其製備方法。The invention relates to a photodetector and a preparation method thereof, in particular to a dual-band photodetector and a preparation method thereof.
請參閱第1圖,其係為習知的金屬-半導體-金屬(Metal-semiconductor-metal, MSM)光檢測器結構,習知結構的基板O1上設置有單一層的主動層O2,在主動層O2上設置有感測響應變化的電極部O3。Please refer to FIG. 1, which is a conventional metal-semiconductor-metal (MSM) photodetector structure. A single-layer active layer O2 is provided on the substrate O1 of the conventional structure. An electrode portion O3 that senses a change in response is provided on O2.
為說明第1圖所繪示的光檢測器結構,請進一步參閱第2圖,其係為第1圖之金屬-半導體-金屬(Metal-semiconductor-metal, MSM)光檢測器結構以波長為320nm至400nm的UV-A波段為入射波段,週期性的切換照射光開關照射檢測器所產生的動態頻譜響應圖,其中,X軸為量測時間,單位為秒,Y軸為正規化電流(a.u.)。如第2圖所示,習知的光檢測器結構在UV-A波段的光照射下,量測電流持續提升直至關閉UV-A波段的光,當UV-A波段的光關閉後,量測電流逐漸降低直至UV-A波段重新開啟而又重新上升,代表量測電流的變化與UV-A波段的開關變化同步,藉此,可藉由量測電流值的變化判斷光檢測器結構是否接收UV-A波段入射光。In order to explain the structure of the photodetector shown in Figure 1, please refer to Figure 2, which is the metal-semiconductor-metal (MSM) photodetector structure of Figure 1 with a wavelength of 320nm The UV-A band up to 400nm is the incident band, and the dynamic spectrum response graph generated by periodically switching the illumination light switch to illuminate the detector, where the X axis is the measurement time in seconds and the Y axis is the normalized current (au ). As shown in Figure 2, the conventional photodetector structure is irradiated with light in the UV-A band, and the measurement current continues to increase until the light in the UV-A band is turned off. When the light in the UV-A band is turned off, the measurement The current gradually decreases until the UV-A band is turned on again and then rises again, which means that the change of the measurement current is synchronized with the change of the switch of the UV-A band. By this, the change of the measurement current value can be used to determine whether the photodetector structure is received. UV-A band incident light.
為進一步說明第1圖所繪示的光檢測器結構在除了UV-A波段的其他波段光照射下亦有響應,請參閱第3圖,其係習知的光檢測器結構入射波長為270nm至450nm的波段的光所繪示的靜態頻譜響應圖,其中,X軸的入射光波長(wavelength)單位為奈米(nm),Y軸的響應度(responsivity)單位為每瓦/每安培(W/A),係代表入射光的強度的單位是瓦(W),所產生的電流單位是安培(A)。如圖所示,習知的光檢測器除了UV-A波段外,在270nm至450nm的入射波段照射下均有電流響應,然而,由於下述因素導致除320nm至400nm波段外的其他波段難以鑑別:To further illustrate that the photodetector structure shown in Figure 1 also responds to light in other wavelength bands than the UV-A band, please refer to Figure 3, which is a conventional photodetector structure with an incident wavelength of 270nm to The static spectrum response graph of light in the 450nm band, where the wavelength of the incident light on the X axis is in nanometers and the unit of responsivity on the Y axis is per watt/ampere (W /A), the unit representing the intensity of incident light is watt (W), and the unit of current generated is ampere (A). As shown in the figure, in addition to the UV-A band, the conventional photodetector has a current response under the irradiation of the incident wave band of 270nm to 450nm, however, due to the following factors, it is difficult to identify other wave bands except the 320nm to 400nm band :
首先,習知的光檢測器照射可見光之響應度隨波長的變化趨勢,相較於照射UV-A波段的光之響應度隨波長的變化趨勢不明顯,如第3圖所示,在照射光波長範圍在400nm至450nm之間的可見光所呈現的響應度隨波長的變化趨勢接近水平,因此以習知的光檢測器結構鑑別UV-A入射波段與可見光入射波段時,對可見光波段的響應範圍的感測回饋機制必須與UV-A波段響應範圍的感測回饋機制不同,且可見光波段的響應範圍的感測回饋機制必須滿足鑑別微小響應度變化的精準度要求。First of all, the conventional photodetector's responsivity of irradiated visible light varies with wavelength. Compared with the irradiated UV-A band, the responsivity of light responsive to wavelength does not change significantly. As shown in Figure 3, the irradiated light Visible light in the wavelength range of 400nm to 450nm exhibits a responsivity with wavelength that is close to horizontal. Therefore, when the conventional photodetector structure is used to distinguish the UV-A incident band and the visible light incident band, the response range to the visible light band The sensing feedback mechanism must be different from the sensing feedback mechanism in the UV-A band response range, and the sensing feedback mechanism in the visible light band response range must meet the accuracy requirements for identifying small response changes.
除此之外,習知的光檢測器照射在照射入射波長範圍約270nm至320nm之間的UV-B光時,響應度隨波長的變化趨勢與入射波長範圍約320nm至400nm之間UV-A光相反,導致習知的光檢測器接收被UV-B光照射時可能會產生與UV-A光相同的響應,而無法透過響應度區分入射波長在270nm至320nm之間的UV-B光以及320nm至400nm之間UV-A光。In addition, when the conventional photodetector irradiates UV-B light with an incident wavelength range of about 270nm to 320nm, the responsivity changes with the wavelength and the incident wavelength range of about 320nm to 400nm UV-A The light is reversed, which causes the conventional photodetector to receive the same response as UV-A light when it is irradiated by UV-B light, and it is impossible to distinguish UV-B light with an incident wavelength between 270nm and 320nm through the responsivity. UV-A light between 320nm and 400nm.
綜上所述,習知的光檢測器結構能產生響應電流的入射波段範圍雖廣,但僅特定波段有較明顯的響應變化,且入射波段的響應電流變化趨勢可能與特定波段不一致。因此,習知的光檢測器結構針對分辨入射光波段設計感測機制時,感測波段範圍易受限於特定波段內。In summary, although the range of incident wavebands that a conventional photodetector structure can generate a response current is wide, only a specific waveband has a significant response change, and the trend of the response current of the incident waveband may not be consistent with the specific waveband. Therefore, when the conventional photodetector structure designs a sensing mechanism for resolving the incident light band, the range of the sensing band is easily limited to a specific band.
為改善上述習知技術問題,本發明提供一種雙波段光檢測器,其包含基板、第一主動層、第二主動層以及電極層。第一主動層設置於基板上,具有第一預設厚度,第一主動層包含第一半導體材料。第二主動層設置於第一主動層上,具有第二預設厚度,第二主動層包含第二半導體材料。電極層設置於第一主動層與第二主動層之間。第一預設厚度大於或等於第二預設厚度,第二主動層能隙較第一主動層能隙大。To improve the above-mentioned conventional technical problems, the present invention provides a dual-band photodetector, which includes a substrate, a first active layer, a second active layer, and an electrode layer. The first active layer is disposed on the substrate and has a first predetermined thickness. The first active layer includes a first semiconductor material. The second active layer is disposed on the first active layer and has a second predetermined thickness. The second active layer includes a second semiconductor material. The electrode layer is disposed between the first active layer and the second active layer. The first predetermined thickness is greater than or equal to the second predetermined thickness, and the energy gap of the second active layer is larger than the energy gap of the first active layer.
可選地,第一半導體材料包含氧化鋅。Optionally, the first semiconductor material contains zinc oxide.
可選地,第一預設厚度在50nm至150nm之間。Optionally, the first preset thickness is between 50 nm and 150 nm.
可選地,第二半導體材料包含氧化鎂鋅。Optionally, the second semiconductor material contains magnesium zinc oxide.
可選地,氧化鎂鋅的氧(O):鎂(Mg):鋅(Zn)的莫耳數比為1:0.3~0.5:0.5~0.7。Optionally, the molar ratio of oxygen (O):magnesium (Mg):zinc (Zn) of magnesium zinc oxide is 1:0.3~0.5:0.5~0.7.
可選地,第二主動層厚度在20nm至80nm之間。Optionally, the thickness of the second active layer is between 20 nm and 80 nm.
可選地,電極層包含鋁、鎳或金。Optionally, the electrode layer contains aluminum, nickel or gold.
基於上述目的,本發明另提供一種製備雙波段光檢測器之方法,包含下列步驟:沉積第一主動層於基板上,且第一主動層具有第一預設厚度;在第一主動層上透過黃光微影製程定義電極區域;沉積電極材料於電極區域上以形成電極層;沉積第二主動層於第一主動層及電極層上,且第二主動層具有第二預設厚度;以及蝕刻以移除第二主動層的一部分;其中,第一預設厚度大於或等於第二預設厚度,且第二主動層的能隙較第一主動層的能隙大。Based on the above purpose, the present invention also provides a method for preparing a dual-band photodetector, which includes the following steps: depositing a first active layer on a substrate, and the first active layer having a first predetermined thickness; transmitting on the first active layer The yellow photolithography process defines the electrode area; depositing electrode material on the electrode area to form an electrode layer; depositing a second active layer on the first active layer and the electrode layer, and the second active layer has a second predetermined thickness; and etching to shift Except for a part of the second active layer; wherein, the first predetermined thickness is greater than or equal to the second predetermined thickness, and the energy gap of the second active layer is larger than the energy gap of the first active layer.
可選地,其中第一主動層及第二主動層分別透過包含濺鍍、化學氣相沉積或噴霧製程來沉積。Optionally, the first active layer and the second active layer are deposited by a process including sputtering, chemical vapor deposition or spraying.
可選地,沉積該電極材料於該電極區域上以形成電極層的步驟進一步包含:在第一主動層上透過黃光微影製程定義非電極區域之步驟;以及當電極區域與非電極區域上皆沉積電極材料時,移除在非電極區域上的電極材料,以露出第一主動層之步驟。Optionally, the step of depositing the electrode material on the electrode area to form an electrode layer further includes: a step of defining a non-electrode area through the yellow photolithography process on the first active layer; and when both the electrode area and the non-electrode area are deposited When the electrode material is used, the electrode material on the non-electrode area is removed to expose the first active layer.
本發明之優點如下所述:The advantages of the present invention are as follows:
(1)本發明的雙波段光檢測器具有複數層主動層,由於光檢測器入射光的檢測波段是根據主動層的材料能隙而決定,在本發明的雙波段光檢測器中,雙波段光檢測器包含複數層主動層,其中,每一層主動層具有不同能隙,因此本發明之雙波段光檢測器的感測波段取決於各主動層所對應的檢測波段涵蓋的範圍組合,而使本發明的雙波段光檢測器可具有較大的檢測波段範圍並兼顧檢測精確性。(1) The dual-band photodetector of the present invention has a plurality of active layers. Since the detection band of incident light of the photodetector is determined according to the material energy gap of the active layer, in the dual-band photodetector of the present invention, the dual-band photodetector The photodetector includes a plurality of active layers, wherein each active layer has a different energy gap, so the sensing band of the dual-band photodetector of the present invention depends on the combination of ranges covered by the detection bands corresponding to the active layers, so that The dual-band photodetector of the present invention can have a larger detection band range and take into account detection accuracy.
(2)替換本發明的雙波段光檢測器第一主動層及第二主動層材料,即可替換欲感測的檢測波段組合,而便於根據檢測波段設計光檢測器的感測機制。(2) By replacing the materials of the first active layer and the second active layer of the dual-band photodetector of the present invention, the combination of the detection band to be sensed can be replaced, and it is convenient to design the sensing mechanism of the photodetector according to the detection band.
本發明之優點、特徵以及達到之技術方法將參照例示性實施例及圖式進行更詳細地描述而更容易理解,且本發明可以不同形式來實現,故不應被理解僅限於此處所陳述的實施例,相反地,對所屬技術領域具有通常知識者而言,所提供的實施例將使本揭露更加透徹與全面且完整地傳達本發明的範疇,且本發明將僅為申請專利範圍所定義。The advantages, features, and technical methods of the present invention will be described in more detail with reference to exemplary embodiments and drawings to make it easier to understand, and the present invention can be implemented in different forms, so it should not be understood that it is limited to what is stated here Embodiments, on the contrary, for those with ordinary knowledge in the technical field, the provided embodiments will make the disclosure more thorough and comprehensive and complete to convey the scope of the present invention, and the present invention will only be defined by the scope of the patent application .
本發明的目的在於提出一種光檢測器的結構,使其能夠具有偵測不同波段入射光的能力,且能夠藉由感測響應入射光所產生的光電流大小來判定入射光的種類。The object of the present invention is to provide a structure of a photodetector, which can detect incident light in different wavebands, and can determine the type of incident light by sensing the magnitude of the photocurrent generated in response to the incident light.
請參閱第4圖,其係為本發明雙波段光檢測器一實施例之結構立體圖,如圖所示,本發明的雙波段光檢測器1包含基板10、第一主動層20、電極層30以及第二主動層40。其中,第一主動層20設置於基板10上,第一主動層20具有第一預設厚度,第一主動層20包含第一半導體材料。第二主動層40設置於第一主動層20上,具有第二預設厚度,第二主動層40包含第二半導體材料,其中,第二主動層40較遠離基板10,亦即第二主動層40較接近照光側。而電極層30設置於第一主動層20與第二主動層40之間。Please refer to FIG. 4, which is a perspective view of the structure of an embodiment of the dual-band photodetector of the present invention. As shown in the figure, the dual-band photodetector 1 of the present invention includes a
其中,第二主動層40的能隙較第一主動層20的能隙大。當符合第一主動層20能隙的波段光照射到本發明雙波段之光檢測器時,第一主動層20產生響應電流。當符合第二主動層波段光照射到雙波段光檢測器1時,由於第二主動層20與第一主動層10存在能隙的差異,所以滿足第二主動層40的能隙,而使第二主動層40產生響應電流的入射光照射第一主動層20時,亦能滿足第一主動層20能隙,從而使第一主動層20產生電流,因此第一主動層20及第二主動層40皆產生響應電流。舉例而言,由於UV-B波段的光的波長較UV-A波段的光的波長更短,因此具有較大的能量,所以能夠提供較大的能量以克服較大之能隙。藉由上述設置,將具有較大能階而需要接收較短波長的入射光才能響應的第二主動層40設置於接近照光側的位置,並將具有較小能階而僅需接收較長波長的入射光即能響應的第一主動層20設置於遠離照光側的位置,來改善入射光穿透率差而導致之主動層不易接收具有適當波長的光的問題。The energy gap of the second
在本發明的一實施例中,第一主動層20的第一預設厚度介於在50nm至150nm之間,較佳地於80nm至100nm之間;第二主動層40的第二預設厚度介於20nm至80nm之間,較佳地於30nm至50nm之間,當第二預設厚度大於80nm時,本發明之雙波段光檢測器無法作用。In an embodiment of the invention, the first predetermined thickness of the first
其中,在本發明雙波段光檢測器1結構中,透過調整第一主動層20的厚度影響本發明雙波段光檢測器1的檢測特性,舉例來說,在第一預設厚度大於第二預設厚度的情況下,固定第一預設厚度,當接近照光側的第二主動層40之第二預設厚度越薄,第二主動層40的光響應越好,但響應速度可能越差,亦即靜態頻譜響應越好,動態響應越差;而在本發明的另一實施例中,當第一預設厚度與第二預設厚度接近的時候,雙波段光檢測器1的響應度較小,但響應速度較快,亦即靜態頻譜響應較差,動態響應較好。此外,在本發明的另一實施例中,當第一預設厚度小於第二預設厚度的情況下,本發明之雙波段光檢測器無法作用。換言之,在本發明的不同實施例中,第一預設厚度與第二預設厚度可根據所設計的光檢測器用途而調整。In the structure of the dual-band photodetector 1 of the present invention, the detection characteristics of the dual-band photodetector 1 of the present invention are affected by adjusting the thickness of the first
在本發明的一實施例中,第二主動層40具有較電極層30小的面積,使電極層30部分露出於第二主動層40外,以便於量測探針接觸露出之電極層30進行電性量測;然而在本發明的另一實施例中,電極層30可設置為與第二主動層40、第一主動層20以及導電層30相同大小,量測探針透過接觸電極層30側面進行電性量測;或透過與導電層30外部突出的導電部與電極層30側面接觸;或者,在本發明的另一實施例中係透過將電極層30設置為露出至少二接觸部與量測探針接觸。In an embodiment of the invention, the second
在本發明的一實施例中,導電層30可為網狀簍空、條狀間隔簍空或其他具有空隙部分的簍空結構,這樣入射光可穿透第二主動層40後,經由空隙部分再進一步照射第一主動層20。In an embodiment of the present invention, the
以本發明雙波段光檢測器1的檢測波段為UV-A波段及UV-B波段為例,在本發明的一實施例中,氧化鋅(ZnO)的能隙對應到的波段接近UV-A波段,所以遠離照光側的第一主動層20的第一半導體材料包含氧化鋅(ZnO);氧化鎂鋅(MgZnO)的能隙對應到的波段接近UV-B波段,所以接近照光側的第二主動層40的第二半導體材料包含氧化鎂鋅(MgZnO),電極層30包含金、鎳、金、鈦金,鋁或其他的電極金屬。Taking the detection band of the dual-band photodetector 1 of the present invention as the UV-A band and the UV-B band as an example, in an embodiment of the present invention, the band corresponding to the energy gap of zinc oxide (ZnO) is close to UV-A Band, so the first semiconductor material of the first
針對雙波段光檢測器1的檢測波段為UV-A波段及UV-B波段進一步說明,當接近照光側的第二主動層40其第二預設厚度設置的越薄,雙波段光檢測器1被UV-B波段的光照射時的光響應越好,但相對地,被UV-B波段的光照射時響應速度較差,亦即靜態頻譜響應越好,動態響應越差;而在本發明的另一實施例中,當第一預設厚度與第二預設厚度接近的時候,雙波段光檢測器1被UV-A波段的光及UV-B波段的光照射後的響應度較小,但響應速度較快,亦即靜態頻譜響應較差,動態響應較好。此外,在本發明的另一實施例中,當第一預設厚度小於第二預設厚度的情況下,雙波段光檢測器無法鑑別UV-A波段的光以及UV-B波段的光。換言之,設計者僅須透過調整第一預設厚度與第二預設厚度之間的關係,即可使所設計的雙波段光檢測器1適用於不同的UV-A波段及UV-B波檢測場域或檢測用途。The detection bands of the dual-band photodetector 1 are the UV-A and UV-B bands. Further explanation, the thinner the second preset thickness of the second
其中,在本發明的第二半導體材料包含氧化鎂鋅(MgZnO)的部分實施例中,氧化鎂鋅的氧(O):鎂(Mg):鋅(Zn)的莫耳數比為1:0.3~0.5:0.5~0.7。其中,能夠藉由調整氧化鎂鋅中氧、鎂、鋅的比例,來調整氧化鎂鋅的能隙大小,進而調整第二主動層40所檢測的頻譜範圍。其中,當第二主動層中鎂與氧的莫耳數比值低於0.3,則使得氧化鎂鋅的能隙過小,導致其響應波長為UV-A波段的光,代表著包含含有氧化鎂鋅之第二半導體材料之第二主動層對UV-B波段的光沒有響應,使得光檢測器整體仍僅對UV-A波段的光有響應,而無法達成同時檢測UV-A及UV-B波段光的效果。In some embodiments of the second semiconductor material of the present invention containing magnesium zinc oxide (MgZnO), the molar ratio of oxygen (O): magnesium (Mg): zinc (Zn) of magnesium oxide to zinc is 1:0.3 ~0.5: 0.5~0.7. Among them, the energy gap of magnesium zinc oxide can be adjusted by adjusting the ratio of oxygen, magnesium and zinc in magnesium oxide zinc, and then the spectrum range detected by the second
以下將在第5圖中進一步說明本發明的雙波段光檢測器1關於響應電流的量測方式。The measurement method of the response current of the dual-band photodetector 1 of the present invention will be further described in FIG. 5 below.
請進一步參照第5圖,其係為本發明雙波段光檢測器一實施例之靜態頻譜響應圖,在第5圖的實施例中,選用的第二半導體材料為Mg 0.3Zn 0.7O、電極層30之陰極與陽極為金、第一半導體材料為ZnO、基板的材料為矽,且第二主動層之厚度為100nm,第一主動層之厚度為30nm。如圖所示,當照射不同波長的光,本發明雙波段光檢測器1產生的電流也不相同。其中,Y軸的響應度單位為每瓦/每安培,係代表入射光的強度是瓦,所產生的電流安培。如圖所示,將照射入本發明雙波段光檢測器的入射光大致區分為可見光波段(400nm~450nm)、UV-A波段(320nm~400nm)、以及UV-B波段(250nm~320nm)。 Please further refer to FIG. 5, which is a static spectrum response diagram of an embodiment of the dual-band photodetector of the present invention. In the embodiment of FIG. 5, the selected second semiconductor material is Mg 0.3 Zn 0.7 O, electrode layer The cathode and anode of 30 are gold, the first semiconductor material is ZnO, the substrate material is silicon, and the thickness of the second active layer is 100 nm, and the thickness of the first active layer is 30 nm. As shown in the figure, when light of different wavelengths is irradiated, the current generated by the dual-band photodetector 1 of the present invention is also different. Among them, the responsivity unit of the Y axis is per watt/ampere, which means that the intensity of the incident light is watts, and the current is amperes. As shown in the figure, the incident light irradiated to the dual-band photodetector of the present invention is roughly divided into a visible light band (400 nm to 450 nm), a UV-A band (320 nm to 400 nm), and a UV-B band (250 nm to 320 nm).
進一步說明,其與第3圖的差異在於,習知的光檢測器僅在UV-A波段產生接近線性圖形的響應變化趨勢,而在本發明中,在照射可見光波段(400nm~450nm)、UV-A波段(320nm~400nm)、UV-B波段(250nm~320nm時,光檢測器除具有不同響應度之外,且響應度的變化趨勢大致為線性的隨著入射光的波長減少而響應度增加。To further explain, the difference from FIG. 3 is that the conventional photodetector produces a response change trend close to a linear pattern only in the UV-A band, and in the present invention, in the visible light band (400nm~450nm), UV -A-band (320nm~400nm), UV-B-band (250nm~320nm, in addition to different responsivity of the photodetector, and the change trend of responsivity is roughly linear as the wavelength of incident light decreases and the responsivity increase.
請進一步參照第6圖,其係為本發明雙波段光檢測器一實施例之動態頻譜響應圖,其中所照射的UV-A光波長為360nm,UV-B光波長為300nm,X軸為量測時所花費的時間,Y軸為正規化電流(normalized current) (a.u.),量測時間為大約600秒,在量測期間內交替切換所照射的入射光UV-A開啟、UV-A關閉及UV-B開啟、UV-B關閉。Please further refer to FIG. 6, which is a dynamic spectrum response diagram of an embodiment of the dual-band photodetector of the present invention, in which the wavelength of the irradiated UV-A light is 360 nm, the wavelength of the UV-B light is 300 nm, and the X axis is the amount The time it takes to measure, the Y axis is the normalized current (au), the measurement time is about 600 seconds, and the incident light UV-A is turned on and UV-A is turned off during the measurement period. And UV-B is turned on, UV-B is turned off.
在本發明的實施例中,由於UV-A波段的光的波長較UV-B波段的光的波長更長,因此具有較小的能量,而僅能滿足能隙較小的第一主動層20,以使第一主動層20產生光電流,換句話說,在UV-A開啟時,僅第一主動層20產生光電流,所以量測到的電流較低;而由於UV-B波段的光的波長較UV-A波段的光的波長更短,因此具有較大的能量,而能同時滿足能隙較小的第一主動層20及能隙較大的第二主動層40,以使第一主動層20及第二主動層40均產生光電流,換句話說,在UV-B開啟時,由於第一主動層20及第二主動層40皆產生光電流,所以量測到的電流較高。In the embodiment of the present invention, since the wavelength of the light in the UV-A band is longer than the wavelength of the light in the UV-B band, it has a smaller energy and can only satisfy the first
在UV-A開啟(UV-A on)時,量測電流逐漸提升至UV-A關閉(UV-A off),UV-A關閉後,量測電流降低,隨後UV-B開啟(UV-B on),量測電流逐漸提升至UV-B關閉(UV-B off),UV-B關閉後,量測電流降低。其中,在UV-B開啟期間量測電流增加的速度以及響應程度大於UV-A開啟期間,並且UV-B關閉期間的量測電流大於UV-A關閉關閉期間的量測電流。藉此,使用者可透過響應的電流變化區別入射光波段是UV-A或UV-B。When UV-A is turned on (UV-A on), the measurement current is gradually increased to UV-A off (UV-A off), after UV-A is turned off, the measurement current is reduced, and then UV-B is turned on (UV-B on), the measurement current is gradually increased to UV-B off (UV-B off), after UV-B is turned off, the measurement current is reduced. Among them, the speed and response of the measurement current increase during the UV-B turn-on period is greater than that during the UV-A turn-on period, and the measurement current during the UV-B turn-off period is greater than the measurement current during the UV-A turn-off period. In this way, the user can distinguish whether the incident light band is UV-A or UV-B through the corresponding current change.
請進一步參照第7圖,其係為本發明雙波段光檢測器一實施例之製作流程圖。如圖所示,其係為一種製備雙波段光檢測器之方法,其包含下述步驟:Please further refer to FIG. 7, which is a manufacturing flowchart of an embodiment of the dual-band photodetector of the present invention. As shown in the figure, it is a method for preparing a dual-band photodetector, which includes the following steps:
步驟S1:沉積第一主動層於基板上,且第一主動層具有第一預設厚度。在步驟S1中,沉積第一主動層20的方式包含:噴塗、層狀塗佈、化學氣相沉積(CVD)或濺鍍。Step S1: deposit a first active layer on the substrate, and the first active layer has a first predetermined thickness. In step S1, the method for depositing the first
步驟S2:在第一主動層上透過黃光微影製程定義電極區域。在步驟S2中,電極的設置透過微影及顯影定義限定的電極位置。Step S2: define an electrode area on the first active layer through the yellow photolithography process. In step S2, the placement of electrodes defines the electrode positions defined by lithography and development.
步驟S3:沉積電極材料於電極區域上以形成電極層。在步驟S3中,透過舉離形成差異的電極部分。電極層包含金、鎳、鈦金,鋁或對於所屬技術領域中具有通常知識者為習知的其他的電極金屬。其中,舉離可使用丙酮作為用來移除的溶劑。Step S3: Deposit electrode material on the electrode area to form an electrode layer. In step S3, the electrode portions that form a difference are lifted off. The electrode layer includes gold, nickel, titanium gold, aluminum, or other electrode metals known to those having ordinary knowledge in the technical field. Among them, acetone can be used as a solvent for removal.
步驟S4:沉積第二主動層於第一主動層及電極層上,且第二主動層具有第二預設厚度。在步驟S4中,沉積第二主動層的方式包含:噴塗、層狀塗佈、化學氣相沉積(CVD)、濺鍍。其中,在本發明的一實施例中,第一主動層20以及第二主動層40的成長環境大約在環境溫度500度下。其中,沉積所用之載氣氣體為空氣。Step S4: deposit a second active layer on the first active layer and the electrode layer, and the second active layer has a second predetermined thickness. In step S4, the method for depositing the second active layer includes spray coating, layer coating, chemical vapor deposition (CVD), and sputtering. In one embodiment of the present invention, the growth environment of the first
步驟S5:蝕刻以移除一部分的第二主動層。例如,仍具有光阻劑的部分第二主動層。其中,蝕刻液包含體積比為1:100之硫酸與水。Step S5: Etching to remove a part of the second active layer. For example, there is still a portion of the second active layer of the photoresist. The etching solution contains sulfuric acid and water in a volume ratio of 1:100.
其中,沉積之第一預設厚度大於或等於第二預設厚度,且第二主動層的能隙較第一主動層的能隙大。The deposited first predetermined thickness is greater than or equal to the second predetermined thickness, and the energy gap of the second active layer is larger than the energy gap of the first active layer.
在本發明之另一實施例中,步驟S3進一步包含在第一主動層上透過黃光微影製程定義非電極區域之步驟,以及當電極區域與非電極區域上皆沉積電極材料時,移除在非電極區域上的電極材料,以露出第一主動層之步驟。因此,本發明之電極層的面積大小可相同或小於第一主動層之面積大小。In another embodiment of the present invention, step S3 further includes the step of defining a non-electrode region through the yellow photolithography process on the first active layer, and removing electrode material when electrode material is deposited on both the electrode region and the non-electrode region The step of exposing the electrode material on the electrode area to expose the first active layer. Therefore, the area of the electrode layer of the present invention may be the same or smaller than the area of the first active layer.
綜上所述,本發明的雙波段光檢測器具有複數主動層而可具有較大的感測波段範圍並兼顧檢測精確性,除此之外,藉由替換本發明的雙波段光檢測器第一主動層及第二主動層材料,即可感測任二種落入對應能隙感測範圍的入射光,而便於根據感測光波段設計光檢測器的感測機制。In summary, the dual-band photodetector of the present invention has a plurality of active layers and can have a larger sensing band range while taking into account detection accuracy. In addition, by replacing the dual-band photodetector of the present invention An active layer and a second active layer material can sense any two kinds of incident light falling into the corresponding energy gap sensing range, and it is convenient to design the sensing mechanism of the photodetector according to the sensing light band.
本發明可以不同形式來實現,故不應被理解僅限於此處所陳述的實施例,相反地,對所屬技術領域具有通常知識者而言,所提供的實施例將使本揭露更加透徹與全面且完整地傳達本發明的範疇,且本發明係依申請專利範圍來定義。The present invention can be implemented in different forms, so it should not be understood that it is limited to the embodiments set forth herein. On the contrary, for those of ordinary skill in the art, the provided embodiments will make the disclosure more thorough and comprehensive and The scope of the present invention is fully communicated, and the present invention is defined according to the scope of the patent application.
1:雙波段光檢測器 10、O1:基板 20:第一主動層 30:電極層 40:第二主動層 S1~S5:步驟 O2:主動層 O3:電極部1: Dual band photodetector 10.O1: substrate 20: The first active layer 30: electrode layer 40: Second active layer S1~S5: Step O2: Active layer O3: electrode part
第1圖係為先前技術之金屬-半導體-金屬之光檢測器結構示意圖。Figure 1 is a schematic diagram of the metal-semiconductor-metal photodetector of the prior art.
第2圖係為先前技術之金屬-半導體-金屬結構之光檢測器動態頻譜響應圖。Figure 2 is a dynamic spectrum response diagram of a metal-semiconductor-metal structure photodetector of the prior art.
第3圖係為先前技術之金屬-半導體-金屬結構之光檢測器靜態頻譜響應圖。Figure 3 is a static spectrum response diagram of a prior art metal-semiconductor-metal structure photodetector.
第4圖係為本發明雙波段光檢測器一實施例之結構立體圖。FIG. 4 is a perspective view of the structure of an embodiment of the dual-band photodetector of the present invention.
第5圖係為本發明雙波段光檢測器一實施例之靜態頻譜響應圖。Figure 5 is a static spectrum response diagram of an embodiment of the dual-band photodetector of the present invention.
第6圖係為本發明雙波段光檢測器一實施例之動態頻譜響應圖。FIG. 6 is a dynamic spectrum response diagram of an embodiment of the dual-band photodetector of the present invention.
第7圖係為本發明雙波段光檢測器一實施例之製作流程圖。FIG. 7 is a manufacturing flowchart of an embodiment of the dual-band photodetector of the present invention.
1:雙波段光檢測器 1: Dual band photodetector
10:基板 10: substrate
20:第一主動層 20: The first active layer
30:電極層 30: electrode layer
40:第二主動層 40: Second active layer
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20110049566A1 (en) * | 2005-10-21 | 2011-03-03 | Georgia State University Research Foundation, Inc. | Dual Band Photodetector |
TW201126737A (en) * | 2010-01-26 | 2011-08-01 | Univ Kun Shan | Transparent photodetector and method for manufacture the same |
US8748862B2 (en) * | 2009-07-06 | 2014-06-10 | University Of Seoul Industry Cooperation Foundation | Compound semiconductors |
TW201436267A (en) * | 2013-02-22 | 2014-09-16 | Samsung Electronics Co Ltd | Photoelectronic device and image sensor |
US20150179832A1 (en) * | 2013-06-06 | 2015-06-25 | University Of Central Florida Research Foundation, Inc. | PHOTODETECTORS BASED ON WURTZITE MgZnO |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110049566A1 (en) * | 2005-10-21 | 2011-03-03 | Georgia State University Research Foundation, Inc. | Dual Band Photodetector |
US8748862B2 (en) * | 2009-07-06 | 2014-06-10 | University Of Seoul Industry Cooperation Foundation | Compound semiconductors |
TW201126737A (en) * | 2010-01-26 | 2011-08-01 | Univ Kun Shan | Transparent photodetector and method for manufacture the same |
TW201436267A (en) * | 2013-02-22 | 2014-09-16 | Samsung Electronics Co Ltd | Photoelectronic device and image sensor |
US20150179832A1 (en) * | 2013-06-06 | 2015-06-25 | University Of Central Florida Research Foundation, Inc. | PHOTODETECTORS BASED ON WURTZITE MgZnO |
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