TWI690923B - Memory and operating method thereof - Google Patents

Memory and operating method thereof Download PDF

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TWI690923B
TWI690923B TW108121803A TW108121803A TWI690923B TW I690923 B TWI690923 B TW I690923B TW 108121803 A TW108121803 A TW 108121803A TW 108121803 A TW108121803 A TW 108121803A TW I690923 B TWI690923 B TW I690923B
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search
value
coupled
memory cell
memory
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TW108121803A
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TW202101460A (en
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李明修
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旺宏電子股份有限公司
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Abstract

A memory includes a memory array, multiple match lines and multiple sets of search lines. The memory array includes multiple memory cells. Each memory cell includes an output terminal, two rectifier elements and two resistor elements. The two resistor elements are configured to store two bits representing a data status. The match lines are coupled to output terminals of the memory cells respectively. Each set of search lines includes a first search line and a second search line. A first resistor element and a first rectifier element of the same memory cell are connected in series between the first search line of the same set of search lines and the output terminal. A second resistor element and a second rectifier element of the same memory cell are connected in series between the second search line of the same set of search lines and the output terminal.

Description

記憶體與其操作方法 Memory and operation method

本揭示內容是關於一種記憶體與其操作方法,且特別是有關於一種內容可定址記憶體與其操作方法。 This disclosure relates to a memory and its operating method, and in particular to a content addressable memory and its operating method.

隨著科技發展,能夠進行快速且大量的資料運算是越來越多產品追求的目標。而且為了延長電子產品的待機時間,在進行大量運算的同時,還需要降低功率消耗。 With the development of science and technology, the ability to carry out fast and massive data operations is the goal pursued by more and more products. And in order to extend the standby time of electronic products, while performing a large number of calculations, it is also necessary to reduce power consumption.

內容可定址記憶體(Content addressable memory)為一種特殊類型的記憶體。可根據使用者提供的數據字,搜尋記憶體內全部的儲存單元以產生儲存這個數據字的儲存單元的位址。因此,內容可定址記憶體較低耗能且適用於高速搜尋程序的特性,可望能達到前述需求。而如何兼顧操作的可靠性和記憶體單元的尺寸是本領域重要的課題之一。 Content addressable memory is a special type of memory. According to the data word provided by the user, all storage units in the memory can be searched to generate the address of the storage unit storing this data word. Therefore, the features of content-addressable memory with lower power consumption and suitable for high-speed search procedures are expected to meet the aforementioned requirements. How to balance the reliability of the operation and the size of the memory unit is one of the important topics in this field.

本揭示內容的一態樣係關於一種記憶體,包含:記憶胞陣列、複數條匹配線和複數對搜尋線。記憶胞陣列包含複數個記憶胞。記憶胞之任一者包含輸出端、二個整流元件和 二個電阻元件。二個電阻元件經配置以儲存代表資料狀態之二個位元值。匹配線分別耦接記憶胞的輸出端。搜尋線分別耦接記憶胞。複數對搜尋線之任一者包含第一搜尋線和第二搜尋線。同一個記憶胞的第一電阻元件和第一整流元件串聯於同一對搜尋線的第一搜尋線和此記憶胞的輸出端之間。同一個記憶胞的第二電阻元件和第二整流元件串聯於同一對搜尋線的第二搜尋線和此記憶胞的該輸出端之間。 An aspect of the present disclosure relates to a memory, including: a memory cell array, a plurality of matching lines, and a plurality of pairs of search lines. The memory cell array includes a plurality of memory cells. Any one of the memory cells includes an output terminal, two rectifier elements and Two resistance elements. The two resistance elements are configured to store two bit values representing the state of the data. The matching lines are respectively coupled to the output ends of the memory cells. The search lines are respectively coupled to the memory cells. Any one of the plural search lines includes a first search line and a second search line. The first resistive element and the first rectifying element of the same memory cell are connected in series between the first search line of the same pair of search lines and the output end of the memory cell. The second resistance element and the second rectifying element of the same memory cell are connected in series between the second search line of the same pair of search lines and the output end of the memory cell.

本揭示內容的一態樣係關於一種記憶體的操作方法,包含:配置複數個記憶胞各自的第一電阻元件和第二電阻元件的阻值以儲存代表資料狀態之二個位元值;複數個多工電路分別接收搜尋資料的複數個搜尋字元值並根據複數個搜尋字元值分別輸出偏壓至複數對搜尋線中的第一搜尋線或第二搜尋線;透過第一搜尋線或第二搜尋線分別提供偏壓至複數個記憶胞中的第一電阻元件或第二電阻元件,以產生讀取電流值至複數條匹配線中相應一者;以及偵測讀取電流值以輸出代表搜尋字元值與資料狀態是否匹配的搜尋結果。 An aspect of the present disclosure relates to a method of operating a memory, including: configuring the resistance values of the first resistance element and the second resistance element of each of the plurality of memory cells to store two bit values representing the data state; The multiplexing circuits respectively receive the plural search character values of the search data and output the bias voltage to the first search line or the second search line of the plural pair search lines according to the plural search character values; through the first search line or The second search line provides a bias voltage to the first resistance element or the second resistance element in the plurality of memory cells, respectively, to generate a reading current value to a corresponding one of the plurality of matching lines; and detect the reading current value to output Represents search results that match the value of the search character with the status of the data.

100、100a、100b‧‧‧內容可定址記憶體 100, 100a, 100b ‧‧‧ addressable memory

120‧‧‧記憶胞陣列 120‧‧‧Memory Cell Array

122、C[1,1]~C[3,4]‧‧‧記憶胞 122、C[1,1]~C[3,4]‧‧‧memory cell

140‧‧‧控制電路 140‧‧‧Control circuit

142、U[1]~U[3]‧‧‧多工電路 142、U[1]~U[3]‧‧‧multiplex circuit

160‧‧‧偵測電路 160‧‧‧detection circuit

W1~W4‧‧‧儲存資料 W1~W4‧‧‧Save data

DIN‧‧‧搜尋資料 DIN‧‧‧Search data

RS‧‧‧搜尋結果 RS‧‧‧Search results

DIN[1]~DIN[3]、DIN[k]‧‧‧搜尋字元值 DIN[1]~DIN[3], DIN[k]‧‧‧ search character value

BIA[1]~BIA[3]、BIA[k]、INH[k]‧‧‧偏壓 BIA[1]~BIA[3], BIA[k], INH[k]‧‧‧bias

SLn[1]~SLn[3]、SL[1]~SL[3]、SLn[k]、SL[k]‧‧‧搜尋線 SLn[1]~SLn[3], SL[1]~SL[3], SLn[k], SL[k]‧‧‧Search line

ML[1]~ML[4]、ML[j]‧‧‧匹配線 ML[1]~ML[4], ML[j]‧‧‧‧matching line

OUT[1]~OUT[4]‧‧‧讀取電流值 OUT[1]~OUT[4]‧‧‧Read current value

Ra、Rb‧‧‧電阻元件 Ra, Rb‧‧‧resistance element

122a、122b‧‧‧整流元件 122a, 122b‧‧‧Rectifier

Dia、Dib‧‧‧二極體元件 Dia, Dib‧‧‧Diode components

N1‧‧‧輸出端 N1‧‧‧ output

Io‧‧‧輸出電流 Io‧‧‧Output current

A1、A2、A3‧‧‧區域 A1, A2, A3

第1圖係根據本揭示內容之部分實施例繪示一種內容可定址記憶體的方塊示意圖。 FIG. 1 is a block diagram of a content addressable memory according to some embodiments of the present disclosure.

第2圖係根據本揭示內容之部分實施例繪示一種內容可定址記憶體的電路示意圖。 FIG. 2 is a schematic circuit diagram of a content addressable memory according to some embodiments of the present disclosure.

第3A圖係根據本揭示內容之部分實施例繪示一種多工電 路和記憶胞的電路示意圖。 FIG. 3A illustrates a multi-purpose power supply according to some embodiments of the present disclosure Circuit diagram of circuit and memory cell.

第3B圖係根據本揭示內容之其他部分實施例繪示另一種多工電路和記憶胞的電路示意圖。 FIG. 3B is a schematic circuit diagram of another multiplex circuit and memory cell according to other embodiments of the present disclosure.

第4圖係根據本揭示內容之其他部分實施例繪示另一種多工電路和記憶胞的電路示意圖。 FIG. 4 is a schematic circuit diagram of another multiplex circuit and memory cell according to other embodiments of the present disclosure.

第5A圖係根據本揭示內容之部分實施例繪示一種多工電路和記憶胞的操作示意圖。 FIG. 5A is a schematic diagram illustrating the operation of a multiplexed circuit and a memory cell according to some embodiments of the present disclosure.

第5B圖係根據本揭示內容之其他部分實施例繪示另一種多工電路和記憶胞的操作示意圖。 FIG. 5B is a schematic diagram illustrating the operation of another multiplexing circuit and memory cell according to other embodiments of the present disclosure.

第6圖係根據本揭示內容之部分實施例繪示一種內容可定址記憶體的立體示意圖。 FIG. 6 is a perspective view of a content addressable memory according to some embodiments of the present disclosure.

第7圖係根據本揭示內容之其他部分實施例繪示另一種內容可定址記憶體的立體示意圖。 FIG. 7 is a perspective view showing another addressable memory according to other embodiments of the present disclosure.

下文係舉實施例配合所附圖式作詳細說明,但所描述的具體實施例僅用以解釋本案,並不用來限定本案,而結構操作之描述非用以限制其執行之順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭示內容所涵蓋的範圍。 The following is a detailed description of the embodiments in conjunction with the drawings, but the specific embodiments described are only used to explain the case, not to limit the case, and the description of the structural operation is not used to limit the order of execution, any component The recombined structure and the resulting devices with equal effects are all covered by the disclosure.

在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭示之內容中與特殊內容中的平常意義。 Terms used throughout the specification and the scope of patent application, unless otherwise specified, usually have the ordinary meaning that each term is used in this field, in the content disclosed herein, and in special content.

在本文中所使用的用詞『包含』、『具有』等等, 均為開放性的用語,即意指『包含但不限於』。此外,本文中所使用之『及/或』,包含相關列舉項目中一或多個項目的任意一個以及其所有組合。 The words "include", "have", etc. used in this article, Both are open terms, meaning "including but not limited to". In addition, "and/or" as used in this article includes any one or more of the listed items and all combinations thereof.

關於本文中所使用之『耦接』或『連接』,均可指二或多個元件相互直接作實體或電性接觸,或是相互間接作實體或電性接觸,亦可指二或多個元件相互操作或動作。 With regard to "coupled" or "connected" as used in this article, it can mean that two or more elements are in direct physical or electrical contact with each other, or indirect physical or electrical contact with each other, or two or more Elements interoperate or act.

關於本文中所使用之『第一』、『第二』、『第三』...等,並非特別指稱次序或順位的意思,亦非用以限定本揭示,其僅僅是為了區別以相同技術用語描述的元件或操作而已。 The terms "first", "second", "third", etc. used in this article do not specifically refer to order or order, nor are they intended to limit this disclosure. They are merely used to distinguish the same technology The term describes the element or operation only.

請參考第1圖。第1圖係根據本揭示內容之部分實施例繪示一種內容可定址記憶體100的方塊示意圖。如第1圖所示,內容可定址記憶體100包含記憶胞陣列120、控制電路140和偵測電路160。記憶胞陣列120包含以陣列方式排列的複數個記憶胞122。操作上,控制電路140用以接收搜尋資料DIN,並根據搜尋資料DIN選擇性地輸出偏壓至記憶胞陣列120中相應的記憶胞以進行資料比對。當偏壓被施加於記憶胞陣列120中的記憶胞時,記憶胞會根據自身所儲存的資料狀態不同而輸出對應的輸出電流。偵測電路160接收記憶胞陣列120輸出的多個輸出電流,並根據多個輸出電流相應的讀取電流值OUT[1]~OUT[4]輸出搜尋結果RS。於一實施例中,偵測電路160包含電流偵測放大電路(sense amplifier)以及編碼電路(encoder),電流偵測放大電路將讀取電流值OUT[1] ~OUT[4]放大,編碼電路基於放大後的讀取電流值OUT[1]~OUT[4]產生搜尋結果RS。 Please refer to Figure 1. FIG. 1 is a block diagram of a content addressable memory 100 according to some embodiments of the present disclosure. As shown in FIG. 1, the content addressable memory 100 includes a memory cell array 120, a control circuit 140, and a detection circuit 160. The memory cell array 120 includes a plurality of memory cells 122 arranged in an array. In operation, the control circuit 140 is used to receive the search data DIN and selectively output the bias voltage to the corresponding memory cells in the memory cell array 120 for data comparison according to the search data DIN. When a bias voltage is applied to the memory cells in the memory cell array 120, the memory cells will output corresponding output currents according to the state of the data stored in the memory cells. The detection circuit 160 receives a plurality of output currents output by the memory cell array 120, and outputs search results RS according to the corresponding reading current values OUT[1] to OUT[4] of the plurality of output currents. In an embodiment, the detection circuit 160 includes a current detection amplifier circuit (sense amplifier) and an encoder circuit (encoder). The current detection amplifier circuit will read the current value OUT[1] ~OUT[4] amplification, the encoding circuit generates the search result RS based on the amplified read current value OUT[1]~OUT[4].

舉例來說,如第1圖中所示,記憶胞陣列120當中的記憶胞122共儲存了四筆儲存資料,分別為第一筆儲存資料W1「110」、第二筆儲存資料W2「101」、第三筆儲存資料W3「111」和第四筆儲存資料W4「000」,於此例示性說明中每一筆儲存資料W1~W4分別包含三個字元,分別由三個不同的記憶胞122加以儲存,但本揭示文件並不以單筆儲存資料包含三個字元為限,可依實際應用而決定每筆儲存資料的字元數目,例如每筆包含8個字元、16個字元或32個字元或其他正整數個字元數。 For example, as shown in FIG. 1, the memory cells 122 in the memory cell array 120 store a total of four stored data, which are respectively the first stored data W1 "110" and the second stored data W2 "101" 3. The third stored data W3 "111" and the fourth stored data W4 "000". In this exemplary description, each stored data W1~W4 contains three characters, each composed of three different memory cells 122. It is stored, but this document does not limit the single stored data to three characters. The number of characters in each stored data can be determined according to the actual application, for example, each pen contains 8 characters and 16 characters Or 32 characters or other positive integer characters.

於第1圖所示的實施例中,假設搜尋資料DIN包含三個字元值「101」,由於儲存第一筆儲存資料W1「110」的記憶胞中只有第一個字元值相符,因此,偵測電路160接收到的讀取電流值OUT[1]為一單位大小。由於儲存第二筆儲存資料W2「101」的記憶胞中第一、第二和第三個字元值皆相符,因此,偵測電路160接收到的讀取電流值OUT[2]為三單位大小。由於儲存第三筆儲存資料W3「111」的記憶胞中第一和第三字元值相符,因此,偵測電路160接收到的讀取電流值OUT[3]為二單位大小。由於儲存第四筆儲存資料W4「000」的記憶胞中第二個字元值相符,因此,偵測電路160接收到的讀取電流值OUT[4]為一單位大小。如此一來,藉由偵測電路160接收的讀取電流值OUT[1]~OUT[4]並以其中的最大者(如:讀取電流值OUT[2])作為搜尋結果RS,便能找到符合 搜尋資料DIN「101」的記憶胞(即,儲存有第二筆儲存資料W2的三個記憶胞)所在的位址。 In the embodiment shown in FIG. 1, it is assumed that the search data DIN includes three character values "101". Since only the first character value in the memory cell storing the first stored data W1 "110" matches, so The read current value OUT[1] received by the detection circuit 160 is a unit size. Since the first, second, and third character values in the memory cell storing the second stored data W2 "101" all match, the read current value OUT[2] received by the detection circuit 160 is three units size. Since the first and third character values in the memory cell storing the third storage data W3 "111" match, the read current value OUT[3] received by the detection circuit 160 is two units in size. Since the second character value in the memory cell storing the fourth stored data W4 "000" matches, the read current value OUT[4] received by the detection circuit 160 is a unit size. In this way, by reading the current values OUT[1] to OUT[4] received by the detection circuit 160 and using the largest of them (such as: reading the current value OUT[2]) as the search result RS, Find match Search the address of the memory cell of the data DIN "101" (ie, the three memory cells storing the second stored data W2).

其中,於內容可定址記憶體100的一些實施例中,記憶胞122所儲存的字元值允許儲存資料狀態「X」,其代表為「隨意(don’t care)」。當記憶胞122字元值設定為「X」時,不論搜尋字元值為「1」或「0」,對應的此記憶胞122的比對結果皆為相符。 In some embodiments of the content addressable memory 100, the character value stored in the memory cell 122 allows the data state "X" to be stored, which is represented as "don't care". When the character value of the memory cell 122 is set to "X", regardless of the search character value being "1" or "0", the comparison result of the corresponding memory cell 122 is consistent.

舉例來說,假設記憶胞陣列120中某一筆儲存資料為「10X」,則不論搜尋資料DIN為「101」或「100」時,儲存「10X」的多個記憶胞的資料狀態皆為相符,因此,不論搜尋資料DIN為「101」或「100」時,偵測電路160接收到相應的讀取電流值都為三單位大小。 For example, assuming that a certain stored data in the memory cell array 120 is "10X", no matter whether the search data DIN is "101" or "100", the data states of the multiple memory cells storing "10X" are all consistent. Therefore, regardless of whether the search data DIN is "101" or "100", the corresponding read current value received by the detection circuit 160 is three units in size.

請參考第2圖。第2圖係根據本揭示內容之部分實施例繪示一種內容可定址記憶體100的電路示意圖。如第2圖所示,內容可定址記憶體100包含記憶胞陣列120、控制電路140、搜尋線和匹配線。記憶胞陣列120包含以陣列方式排列的複數個記憶胞122。控制電路140包含複數個多工電路142。記憶胞陣列120中每一列所包含的記憶胞122的個數與匹配線的數量相同,也就是與內容可定址記憶體100的總儲存資料筆數有關。記憶胞陣列120中每一行所包含的記憶胞122的個數與搜尋線的對數相同,也就是與每筆儲存資料所包含的位元數目有關。例如,內容可定址記憶體100若包含1024筆儲存資料,則每一列的記憶胞122可為1024個。若每筆儲存資料包含8個位元數,則每一行的記憶胞122可為8個。 Please refer to Figure 2. FIG. 2 is a schematic circuit diagram of a content addressable memory 100 according to some embodiments of the present disclosure. As shown in FIG. 2, the content addressable memory 100 includes a memory cell array 120, a control circuit 140, a search line, and a match line. The memory cell array 120 includes a plurality of memory cells 122 arranged in an array. The control circuit 140 includes a plurality of multiplex circuits 142. The number of memory cells 122 included in each row of the memory cell array 120 is the same as the number of matching lines, that is, it is related to the total number of data stored in the addressable memory 100. The number of memory cells 122 included in each row of the memory cell array 120 is the same as the logarithm of the search line, that is, related to the number of bits included in each stored data. For example, if the content addressable memory 100 includes 1024 pieces of stored data, the number of memory cells 122 in each row may be 1024. If each stored data contains 8 bits, then each row of memory cells 122 can be 8.

在本實施例中,為了方便說明起見,將以內容可定址記憶體100包含4筆儲存資料,且每筆儲存資料包含3個位元數為例進行說明,但本案不以此為限。換句話說,在本案說明書和圖式中,將以內容可定址記憶體100包含三對搜尋線SLn[1]~SLn[3]和SL[1]~SL[3]和四條匹配線ML[1]~ML[4],控制電路140包含三個多工電路U[1]~U[3],記憶胞陣列120包含十二個記憶胞C[1,1]~C[3,4]為例進行說明,但本案不以此為限。 In this embodiment, for convenience of description, the content addressable memory 100 includes 4 pieces of stored data, and each piece of stored data includes 3 bits as an example for description, but this case is not limited to this. In other words, the content addressable memory 100 will include three pairs of search lines SLn[1]~SLn[3] and SL[1]~SL[3] and four matching lines ML[ 1]~ML[4], the control circuit 140 includes three multiplex circuits U[1]~U[3], and the memory cell array 120 includes twelve memory cells C[1,1]~C[3,4] For example, but this case is not limited to this.

如第2圖所示,結構上,多工電路U[1]透過第一對搜尋線SLn[1]和SL[1]耦接記憶胞C[1,1]~C[1,4]。多工電路U[2]透過第二對搜尋線SLn[2]和SL[2]耦接記憶胞C[2,1]~C[2,4]。多工電路U[3]透過第三對搜尋線SLn[3]和SL[3]耦接記憶胞C[3,1]~C[3,4]。匹配線ML[1]耦接記憶胞C[1,1]~C[3,1]的輸出端。匹配線ML[2]耦接記憶胞C[1,2]~C[3,2]的輸出端。匹配線ML[3]耦接記憶胞C[1,3]~C[3,3]的輸出端。匹配線ML[4]耦接記憶胞C[1,4]~C[3,4]的輸出端。 As shown in FIG. 2, in structure, the multiplex circuit U[1] is coupled to the memory cells C[1,1]~C[1,4] through the first pair of search lines SLn[1] and SL[1]. The multiplex circuit U[2] is coupled to the memory cells C[2,1]~C[2,4] through the second pair of search lines SLn[2] and SL[2]. The multiplex circuit U[3] is coupled to the memory cells C[3,1]~C[3,4] through the third pair of search lines SLn[3] and SL[3]. Matching line ML[1] is coupled to the output of memory cells C[1,1]~C[3,1]. Matching line ML[2] is coupled to the output of memory cells C[1,2]~C[3,2]. The matching line ML[3] is coupled to the output of memory cells C[1,3]~C[3,3]. Matching line ML[4] is coupled to the output of memory cells C[1,4]~C[3,4].

操作上,以搜尋資料DIN包含三個搜尋字元值DIN[1]~DIN[3]為例。多工電路U[1]用以根據搜尋資料DIN中的搜尋字元值DIN[1]選擇性地導通第一對搜尋線中的搜尋線SLn[1]或搜尋線SL[1],以將搜尋字元值DIN[1]和記憶胞C[1,1]~C[1,4]所儲存的資料狀態進行比對。相似地,多工電路U[2]用以根據搜尋資料DIN中的搜尋字元值DIN[2]選擇性地導通第二對搜尋線中的搜尋線SLn[2]或搜尋線SL[2],以將搜尋字元值DIN[2]和記憶胞C[2,1]~C[2,4]所儲存的資料狀 態進行比對。多工電路U[3]用以根據搜尋資料DIN中的搜尋字元值DIN[3]選擇性地導通第三對搜尋線中的搜尋線SLn[3]或搜尋線SL[3],以將搜尋字元值DIN[3]和記憶胞C[3,1]~C[3,4]所儲存的資料狀態進行比對。 In operation, the search data DIN contains three search character values DIN[1]~DIN[3] as an example. The multiplexing circuit U[1] is used to selectively turn on the search line SLn[1] or the search line SL[1] in the first pair of search lines according to the search character value DIN[1] in the search data DIN, so that The search character value DIN[1] is compared with the state of the data stored in memory cells C[1,1]~C[1,4]. Similarly, the multiplexing circuit U[2] is used to selectively turn on the search line SLn[2] or the search line SL[2] in the second pair of search lines according to the search character value DIN[2] in the search data DIN , To search the data value stored in the character value DIN[2] and memory cells C[2,1]~C[2,4] To compare. The multiplexing circuit U[3] is used to selectively turn on the search line SLn[3] or the search line SL[3] in the third pair of search lines according to the search character value DIN[3] in the search data DIN, so that The search character value DIN[3] is compared with the state of the data stored in memory cells C[3,1]~C[3,4].

換言之,耦接於同一對搜尋線的記憶胞共用多工電路中的同一者。例如,耦接於搜尋線SLn[1]和SL[1]的記憶胞C[1,1]~C[1,4]共用多工電路U[1]。耦接於搜尋線SLn[2]和SL[2]的記憶胞C[2,1]~C[2,4]共用多工電路U[2]。耦接於搜尋線SLn[3]和SL[3]的記憶胞C[3,1]~C[3,4]共用多工電路U[3]。也就是說,記憶胞C[1,1]~C[1,4]中任一者所儲存的資料狀態與搜尋字元值DIN[1]進行比對,記憶胞C[2,1]~C[2,4]中任一者所儲存的資料狀態與搜尋字元值DIN[2]進行比對,記憶胞C[3,1]~C[3,4]中任一者所儲存的資料狀態與搜尋字元值DIN[3]進行比對。 In other words, the memory cells coupled to the same pair of search lines share the same one in the multiplex circuit. For example, memory cells C[1,1]~C[1,4] coupled to the search lines SLn[1] and SL[1] share the multiplex circuit U[1]. The memory cells C[2,1]~C[2,4] coupled to the search lines SLn[2] and SL[2] share the multiplex circuit U[2]. The memory cells C[3,1]~C[3,4] coupled to the search lines SLn[3] and SL[3] share the multiplex circuit U[3]. In other words, the state of the data stored in any one of memory cells C[1,1]~C[1,4] is compared with the search character value DIN[1], memory cell C[2,1]~ The state of the data stored in any one of C[2,4] is compared with the search character value DIN[2], and the memory stored in any one of C[3,1]~C[3,4] The data status is compared with the search character value DIN[3].

具體而言,關於記憶胞的詳細電路請參考第3A圖。第3A圖係根據本揭示內容之部分實施例繪示一種多工電路142和記憶胞122的電路示意圖。如第3A圖所示,記憶胞122包含二個整流元件122a和122b、二個電阻元件Ra和Rb、以及輸出端N1。值得說明的是,第2圖的記憶胞陣列120中的任一個記憶胞122皆可由第3A圖中的記憶胞122據以實施。為了便於說明起見,第3A圖中所繪示的記憶胞122所耦接的搜尋線SLn[k]、SL[k]和匹配線ML[j]沒有指明數字索引係代表記憶胞陣列120中不特定的記憶胞122所相應耦接的搜尋線和匹配線。 Specifically, please refer to Figure 3A for the detailed circuit of the memory cell. FIG. 3A is a schematic circuit diagram of a multiplexing circuit 142 and a memory cell 122 according to some embodiments of the present disclosure. As shown in FIG. 3A, the memory cell 122 includes two rectifying elements 122a and 122b, two resistive elements Ra and Rb, and an output terminal N1. It is worth noting that any memory cell 122 in the memory cell array 120 in FIG. 2 can be implemented by the memory cell 122 in FIG. 3A. For ease of description, the search lines SLn[k], SL[k] and the matching lines ML[j] coupled to the memory cell 122 shown in FIG. 3A do not indicate that the digital index system represents the memory cell array 120 The search line and the matching line to which the unspecified memory cells 122 are correspondingly coupled.

如第3A圖所示,結構上,多工電路142透過一對搜尋線SLn[k]和SL[k]耦接記憶胞122。記憶胞122的輸出端N1耦接匹配線ML[j]。具體而言,耦接於同一對搜尋線之記憶胞122的電阻元件Ra和整流元件122a串聯於搜尋線SLn[k]和記憶胞122的輸出端N1之間。耦接於同一對搜尋線之記憶胞122的電阻元件Rb和整流元件122b串聯於搜尋線SL[k]和記憶胞的輸出端N1之間。換言之,同一個記憶胞122的電阻元件Ra和整流元件122a串聯於同一對搜尋線的搜尋線SLn[k]和此記憶胞122的輸出端N1之間。同一個記憶胞122的電阻元件Rb和整流元件122b串聯於同一對搜尋線的搜尋線SL[k]和此記憶胞的輸出端N1之間。 As shown in FIG. 3A, in structure, the multiplexing circuit 142 is coupled to the memory cell 122 through a pair of search lines SLn[k] and SL[k]. The output terminal N1 of the memory cell 122 is coupled to the matching line ML[j]. Specifically, the resistive element Ra and the rectifying element 122a coupled to the memory cell 122 of the same pair of search lines are connected in series between the search line SLn[k] and the output terminal N1 of the memory cell 122. The resistance element Rb and the rectifying element 122b of the memory cell 122 coupled to the same pair of search lines are connected in series between the search line SL[k] and the output terminal N1 of the memory cell. In other words, the resistance element Ra and the rectifying element 122a of the same memory cell 122 are connected in series between the search line SLn[k] of the same pair of search lines and the output terminal N1 of the memory cell 122. The resistance element Rb and the rectifying element 122b of the same memory cell 122 are connected in series between the search line SL[k] of the same pair of search lines and the output terminal N1 of the memory cell.

舉例來說,在部分實施例中,如第3A圖所示,電阻元件Ra的第一端耦接搜尋線SLn[k],電阻元件Ra的第二端耦接整流元件122a的第一端,整流元件122a的第二端耦接輸出端N1。電阻元件Rb的第一端耦接搜尋線SL[k],電阻元件Rb的第二端耦接整流元件122b的第一端,整流元件122b的第二端耦接輸出端N1。 For example, in some embodiments, as shown in FIG. 3A, the first end of the resistive element Ra is coupled to the search line SLn[k], and the second end of the resistive element Ra is coupled to the first end of the rectifying element 122a, The second terminal of the rectifying element 122a is coupled to the output terminal N1. The first end of the resistance element Rb is coupled to the search line SL[k], the second end of the resistance element Rb is coupled to the first end of the rectification element 122b, and the second end of the rectification element 122b is coupled to the output end N1.

在其他部分實施例中,如第3B圖所示,整流元件122a的第一端耦接搜尋線SLn[k],整流元件122a的第二端耦接電阻元件Ra的第一端,電阻元件Ra的第二端耦接輸出端N1。整流元件122b的第一端耦接搜尋線SL[k],整流元件122b的第二端耦接電阻元件Rb的第一端,電阻元件Rb的第二端耦接輸出端N1。 In some other embodiments, as shown in FIG. 3B, the first end of the rectifying element 122a is coupled to the search line SLn[k], and the second end of the rectifying element 122a is coupled to the first end of the resistive element Ra, and the resistive element Ra The second terminal of is coupled to the output terminal N1. The first end of the rectifying element 122b is coupled to the search line SL[k], the second end of the rectifying element 122b is coupled to the first end of the resistance element Rb, and the second end of the resistance element Rb is coupled to the output end N1.

值得注意的是,在其他部分實施例中,搜尋線SLn[k]和輸出端N1之間可如第3A圖所示,而搜尋線SL[k]和輸出端N1之間可如第3B圖所示。或者,搜尋線SLn[k]和輸出端N1之間可如第3B圖所示,而搜尋線SL[k]和輸出端N1之間可如第3A圖所示。 It is worth noting that in some other embodiments, the search line SLn[k] and the output terminal N1 may be as shown in FIG. 3A, and the search line SL[k] and the output terminal N1 may be as shown in FIG. 3B. As shown. Alternatively, the search line SLn[k] and the output terminal N1 may be as shown in FIG. 3B, and the search line SL[k] and the output terminal N1 may be as shown in FIG. 3A.

此外,在本案中,整流元件122a和122b可由如第4圖所示之二極體元件Dia和Dib來實作。舉例來說,二極體元件Dia和Dib可為p-n接面二極體(p-n junction)、蕭特基二極體(schottky diode)、雙向定限開關(ovonic threshold switch)或莫特絕緣體(Mott insulator)等等。 In addition, in this case, the rectifying elements 122a and 122b can be implemented by the diode elements Dia and Dib as shown in FIG. For example, the diode elements Dia and Dib may be pn junction diodes, schottky diodes, ovonic threshold switches or Mott insulators. insulator) etc.

操作上,記憶胞122中的電阻元件Ra和Rb經配置用以儲存代表資料狀態的第一位元值和第二位元值。具體而言,電阻元件Ra的電阻值代表第一位元值。電阻元件Rb的電阻值代表第二位元值。在本揭示文件中,低電阻值代表邏輯值「1」,高電阻值代表邏輯值「0」。 In operation, the resistive elements Ra and Rb in the memory cell 122 are configured to store the first bit value and the second bit value representing the data state. Specifically, the resistance value of the resistance element Ra represents the first bit value. The resistance value of the resistance element Rb represents the second bit value. In this disclosure, the low resistance value represents the logical value "1", and the high resistance value represents the logical value "0".

在部分實施例中,記憶胞122可以儲存兩種資料狀態中之一者。兩種資料狀態包含資料狀態「0」和資料狀態「1」。代表不同資料狀態「0」或「1」的記憶胞122的電阻元件Ra和Rb分別的電阻值高低如表一所示。 In some embodiments, the memory cell 122 can store one of two data states. The two data states include data state "0" and data state "1". The resistance values of the resistive elements Ra and Rb of the memory cell 122 representing different data states "0" or "1" are shown in Table 1 below.

Figure 108121803-A0101-12-0010-16
Figure 108121803-A0101-12-0010-16

當記憶胞122儲存的資料狀態為「0」,電阻元件Ra的電阻值設定為低,其代表的第一位元值具有邏輯值「1」,電阻元件Rb的電阻值設定為高,其代表的第二位元值具有邏輯值「0」。 When the state of the data stored in the memory cell 122 is "0", the resistance value of the resistance element Ra is set to low, the first bit value it represents has a logical value of "1", and the resistance value of the resistance element Rb is set to high, which represents The second bit value of has a logical value "0".

當記憶胞122的資料狀態為「1」,電阻元件Ra的電阻值設定為高,其代表的第一位元值具有邏輯值「0」,電阻元件Rb的電阻值設定為低,其代表的第二位元值具有邏輯值「1」。 When the data state of the memory cell 122 is "1", the resistance value of the resistance element Ra is set to high, the first bit value it represents has a logic value of "0", and the resistance value of the resistance element Rb is set to low, which represents The second bit value has a logical value "1".

此外,在其他部分實施例中,記憶胞122可以儲存三種資料狀態中之一者。三種資料狀態包含資料狀態「0」、資料狀態「1」和資料狀態「X」。代表不同資料狀態「0」、「1」或「X」的記憶胞122的電阻元件Ra和Rb分別的電阻值高低如表二所示。 In addition, in some other embodiments, the memory cell 122 may store one of three data states. The three data states include data state "0", data state "1" and data state "X". The resistance values of the resistance elements Ra and Rb of the memory cells 122 representing different data states "0", "1" or "X" are shown in Table 2 respectively.

Figure 108121803-A0101-12-0011-2
Figure 108121803-A0101-12-0011-2

當記憶胞122儲存的資料狀態為「0」,電阻元件Ra的電阻值設定為低,其代表的第一位元值具有邏輯值「1」,電阻元件Rb的電阻值設定為高,其代表的第二位元值具有邏輯值「0」。 When the state of the data stored in the memory cell 122 is "0", the resistance value of the resistance element Ra is set to low, the first bit value it represents has a logical value of "1", and the resistance value of the resistance element Rb is set to high, which represents The second bit value of has a logical value "0".

當記憶胞122的資料狀態為「1」,電阻元件Ra的電阻值設定為高,其代表的第一位元值具有邏輯值「0」,電阻元件Rb的電阻值設定為低,其代表的第二位元值具有邏輯值「1」。 When the data state of the memory cell 122 is "1", the resistance value of the resistance element Ra is set to high, the first bit value it represents has a logic value of "0", and the resistance value of the resistance element Rb is set to low, which represents The second bit value has a logical value "1".

當記憶胞122的資料狀態為「X」,電阻元件Ra的電阻值設定為低,其代表的第一位元值具有邏輯值「1」,電阻元件Rb的電阻值設定為低,其代表的第二位元值具有邏輯值「1」。 When the data state of the memory cell 122 is "X", the resistance value of the resistance element Ra is set to low, the first bit value it represents has a logical value of "1", and the resistance value of the resistance element Rb is set to low, which represents The second bit value has a logical value "1".

請參考第5A圖。第5A圖係根據本揭示內容之部分實施例繪示一種多工電路142和記憶胞122的操作示意圖。多工電路142用以根據搜尋字元值DIN[k]選擇性地導通相耦接的一對搜尋線中的第一搜尋線SLn[k]或第二搜尋線SL[k],以將搜尋字元值DIN[k]和記憶胞122所儲存的資料狀態進行比對。 Please refer to Figure 5A. FIG. 5A is a schematic diagram illustrating the operation of a multiplexing circuit 142 and a memory cell 122 according to some embodiments of the present disclosure. The multiplexing circuit 142 is used to selectively turn on the first search line SLn[k] or the second search line SL[k] of the coupled pair of search lines according to the search character value DIN[k] to search for The character value DIN[k] is compared with the state of the data stored in the memory cell 122.

具體而言,在部分實施例中,如第5A圖所示,當搜尋字元值DIN[k]為「1」時,多工電路142根據為「1」的搜尋字元值DIN[k]將偏壓BIA[k]經由對應於「1」的搜尋線SL[k]施加至記憶胞122,而對應於「0」的搜尋線SLn[k]為空接(floating)狀態。當搜尋字元值DIN[k]為「0」時(圖中未示),多工電路142根據為「0」的搜尋字元值DIN[k]將偏壓BIA[k]經由對應於「0」的搜尋線SLn[k]施加至記憶胞122,而對應於「1」的搜尋線SL[k]為空接狀態。如此一來,接收到偏壓BIA[k]的記憶胞122便會根據相應的電阻元件Ra或Rb輸出相應的輸出電流Io至匹配線ML[j]。 Specifically, in some embodiments, as shown in FIG. 5A, when the search character value DIN[k] is "1", the multiplexing circuit 142 uses the search character value DIN[k] as "1" The bias voltage BIA[k] is applied to the memory cell 122 through the search line SL[k] corresponding to “1”, and the search line SLn[k] corresponding to “0” is in a floating state. When the search character value DIN[k] is "0" (not shown in the figure), the multiplexing circuit 142 will bias the bias voltage BIA[k] according to "0" search character value DIN[k] by corresponding to " The search line SLn[k] of "0" is applied to the memory cell 122, and the search line SL[k] corresponding to "1" is in an open state. In this way, the memory cell 122 receiving the bias voltage BIA[k] outputs the corresponding output current Io to the matching line ML[j] according to the corresponding resistance element Ra or Rb.

在其他部分實施例中,如第5B圖所示,當搜尋字元值DIN[k]為「1」時,多工電路142用以將正偏壓BIA[k]經由搜尋線SL[k]施加至記憶胞122,並用以將非正偏壓INH[k]施加在對應於「0」的搜尋線SLn[k]。當搜尋字元值DIN[k]為「0」時(圖中未示),多工電路142用以將正偏壓BIA[k]經由搜尋線SLn[k]施加至記憶胞122,並用以將非正偏壓INH[k]施加在對應於「1」的搜尋線SL[k]。其中,非正偏壓INH[k]可為負偏壓或者近似於零的電壓。如此一來,藉由非正偏壓INH[k]便能使得記憶胞122中非對應的電阻元件和整流元件不會輸出額外的電流至匹配線ML[j],而造成輸出電流Io不準確。 In other partial embodiments, as shown in FIG. 5B, when the search character value DIN[k] is "1", the multiplexing circuit 142 is used to apply the positive bias voltage BIA[k] through the search line SL[k] It is applied to the memory cell 122 and used to apply the non-positive bias INH[k] to the search line SLn[k] corresponding to “0”. When the search character value DIN[k] is "0" (not shown in the figure), the multiplexing circuit 142 is used to apply the positive bias voltage BIA[k] to the memory cell 122 through the search line SLn[k], and used The non-positive bias INH[k] is applied to the search line SL[k] corresponding to "1". Among them, the non-positive bias INH[k] may be a negative bias or a voltage close to zero. In this way, by non-positive bias INH[k], the non-corresponding resistive elements and rectifying elements in the memory cell 122 will not output extra current to the matching line ML[j], resulting in an inaccurate output current Io .

關於記憶胞如何根據相應的電阻元件Ra或Rb輸出相應的輸出電流Io,請一併參考第5A圖和表三。 Regarding how the memory cell outputs the corresponding output current Io according to the corresponding resistance element Ra or Rb, please refer to FIG. 5A and Table 3 together.

Figure 108121803-A0101-12-0013-17
Figure 108121803-A0101-12-0013-17

如表三所示,於部分實施例中,由於記憶胞122具有兩個電阻元件Ra或Rb,當兩個電阻元件Ra或Rb均被設置於高電阻值時,其儲存的資料狀態為禁能(disabled)。當記憶胞122儲存資料狀態為禁能時,不論搜尋字元值為何,均會輸出低電流,視為比對不相符。 As shown in Table 3, in some embodiments, since the memory cell 122 has two resistance elements Ra or Rb, when both resistance elements Ra or Rb are set to a high resistance value, the state of the stored data is disabled (disabled). When the storage state of the memory cell 122 is disabled, no matter what the value of the search character is, it will output a low current, which is regarded as a mismatch.

如第5A圖所示,當搜尋字元值DIN[k]為「1」時,記憶胞122中的電阻元件Rb將接收到偏壓BIA[k],且整流元件122a將使得偏壓BIA[k]不會流過電阻元件Ra。由於偏壓BIA[k]經過的電阻值越大則輸出電流Io越小,而偏壓BIA[k]經過的電阻值越小則輸出電流Io越大。因此,當記憶胞122中的資料狀態為「0」時,電阻元件Rb為高電阻,輸出電流Io為低電流,而當記憶胞122中的資料狀態為「1」時,電阻元件Rb為低電阻,輸出電流Io為高電流。換言之,如表三所示,當搜尋字元值為「1」時,輸出電流Io的高低與電阻元件Rb的電阻值高低相反。因此,根據輸出電流Io為高電流者便能判斷此記憶胞122中的資料狀態與搜尋字元值相符。另一方面,當輸出電流Io為低電流時,便能判斷此記憶胞122中的資料狀態與搜尋字元值不符。 As shown in FIG. 5A, when the search character value DIN[k] is "1", the resistive element Rb in the memory cell 122 will receive the bias voltage BIA[k], and the rectifying element 122a will cause the bias voltage BIA[ k] Does not flow through the resistive element Ra. Because the larger the resistance value through the bias voltage BIA[k], the smaller the output current Io, and the smaller the resistance value through the bias voltage BIA[k], the larger the output current Io. Therefore, when the data state in the memory cell 122 is "0", the resistance element Rb is high resistance, the output current Io is low current, and when the data state in the memory cell 122 is "1", the resistance element Rb is low Resistance, output current Io is high current. In other words, as shown in Table 3, when the search character value is "1", the level of the output current Io is opposite to the level of the resistance of the resistance element Rb. Therefore, according to the output current Io being a high current, the state of the data in the memory cell 122 can be determined to match the search character value. On the other hand, when the output current Io is a low current, it can be determined that the data state in the memory cell 122 does not match the value of the search character.

相似地,如第5A圖所示,當搜尋字元值DIN[k]為「0」時,記憶胞122中的電阻元件Ra將接收到偏壓BIA[k],且整流元件122b將使得偏壓BIA[k]不會流過電阻元件Rb。因此,當記憶胞122中的資料狀態為「0」時,電阻元件Ra為低電阻,輸出電流Io為高電流,而當記憶胞122中的資料狀態為「1」時,電阻元件Ra為高電阻,輸出電流Io為低電流。換言 之,如表三所示,當搜尋字元值為「0」時,輸出電流Io的高低與電阻元件Ra的電阻值高低相反。因此,根據輸出電流Io為高電流者便能判斷此記憶胞122中的資料狀態與搜尋字元值相符。另一方面,當輸出電流Io為低電流時,便能判斷此記憶胞122中的資料狀態與搜尋字元值不符。 Similarly, as shown in FIG. 5A, when the search character value DIN[k] is "0", the resistive element Ra in the memory cell 122 will receive the bias voltage BIA[k], and the rectifying element 122b will cause the bias The voltage BIA[k] does not flow through the resistance element Rb. Therefore, when the data state in the memory cell 122 is "0", the resistance element Ra is low resistance, and the output current Io is high current, and when the data state in the memory cell 122 is "1", the resistance element Ra is high Resistance, output current Io is low current. In other words In other words, as shown in Table 3, when the search character value is "0", the level of the output current Io is opposite to that of the resistance element Ra. Therefore, according to the output current Io being a high current, the state of the data in the memory cell 122 can be determined to match the search character value. On the other hand, when the output current Io is a low current, it can be determined that the data state in the memory cell 122 does not match the value of the search character.

由此可知,當記憶胞自身所儲存的資料狀態與相應的搜尋字元值相符時,此記憶胞將輸出高電流。反之,當記憶胞自身所儲存的資料狀態與相應的搜尋字元值不相符時,此記憶胞將輸出低電流。 It can be seen that when the state of the data stored in the memory cell itself matches the corresponding search character value, the memory cell will output a high current. Conversely, when the state of the data stored in the memory cell itself does not match the corresponding search character value, the memory cell will output a low current.

如此一來,藉由記憶胞122中的電阻元件Ra和Rb分別儲存相應第一位元值和第二位元值以代表不同資料狀態,並透過多工電路142根據搜尋字元值為「1」將偏壓BIA[k]經由搜尋線SL[k]施加至記憶胞122中的電阻元件Rb,或根據搜尋字元值為「0」將偏壓BIA[k]經由搜尋線SLn[k]施加至記憶胞122中的電阻元件Ra,便能根據相應的輸出電流Io得知記憶胞122的資料狀態是否與搜尋字元值相符。此外,藉由整流元件122a和122b,便能確保不會有漏電流從非施加偏壓側的電阻元件流出。 In this way, the resistance elements Ra and Rb in the memory cell 122 respectively store the corresponding first bit value and second bit value to represent different data states, and the multiplex circuit 142 according to the search character value is "1 "Apply the bias voltage BIA[k] to the resistive element Rb in the memory cell 122 through the search line SL[k], or the bias voltage BIA[k] through the search line SLn[k] according to the value of the search character "0" The resistance element Ra applied to the memory cell 122 can know whether the data state of the memory cell 122 matches the search character value according to the corresponding output current Io. In addition, by the rectifying elements 122a and 122b, it can be ensured that no leakage current flows from the resistance element on the non-biased side.

請回頭參考第2圖。如第2圖所示,當搜尋字元值DIN[1]為「1」時,多工電路U[1]導通搜尋線SL[1]以將偏壓BIA[1]經由搜尋線SL[1]施加至記憶胞C[1,1]~C[1,4],以分別比對記憶胞C[1,1]~C[1,4]各自的第二位元值和搜尋字元值DIN[1]是否相符。反之,當搜尋字元值DIN[1]為「0」時,多工電路U[1]導通搜尋線SLn[1]以將偏壓BIA[1]經由搜尋線 SLn[1]施加至記憶胞C[1,1]~C[1,4],以分別比對記憶胞C[1,1]~C[1,4]各自的第一位元值和搜尋字元值DIN[1]是否相符。 Please refer back to Figure 2. As shown in Figure 2, when the search character value DIN[1] is "1", the multiplex circuit U[1] turns on the search line SL[1] to bias the bias BIA[1] through the search line SL[1 ] Is applied to memory cells C[1,1]~C[1,4] to compare the second bit value and search character value of memory cells C[1,1]~C[1,4] respectively Whether DIN[1] matches. Conversely, when the search character value DIN[1] is "0", the multiplex circuit U[1] turns on the search line SLn[1] to bias the BIA[1] through the search line SLn[1] is applied to memory cells C[1,1]~C[1,4] to compare the first bit value and search of memory cells C[1,1]~C[1,4] Whether the character value DIN[1] matches.

舉例來說,假設搜尋字元值DIN[1]~DIN[3]為「1」、「0」、「1」,而記憶胞C[1,1]~C[3,1]分別儲存的資料狀態為「1」、「1」、「0」。根據表三,記憶胞C[1,1]~C[3,1]的輸出電流分別為「高」、「低」、「低」,因此,匹配線ML[1]所接收到來自記憶胞C[1,1]~C[3,1]的電流總和的讀取電流值OUT[1]為一單位大小。 For example, suppose the search character values DIN[1]~DIN[3] are "1", "0", "1", and memory cells C[1,1]~C[3,1] are stored separately. The data status is "1", "1", "0". According to Table 3, the output currents of memory cells C[1,1]~C[3,1] are "high", "low", and "low", respectively. Therefore, the matching line ML[1] received from the memory cells The reading current value OUT[1] of the total current of C[1,1]~C[3,1] is a unit size.

依此類推,假設記憶胞C[1,2]~C[3,2]、C[1,3]~C[3,3]、C[1,4]~C[3,4]分別儲存的資料狀態為「1」、「0」、「1」和「1」、「1」、「1」和「0」、「0」、「0」,則記憶胞C[1,2]~C[3,2]、C[1,3]~C[3,3]、C[1,4]~C[3,4]的輸出電流分別為「高」、「高」、「高」和「高」、「低」、「高」和「低」、「高」、「低」。因此,匹配線ML[2]~ML[4]所接收到的讀取電流值OUT[2]~OUT[4]分別為三、二、一單位大小。 By analogy, suppose the memory cells C[1,2]~C[3,2], C[1,3]~C[3,3], C[1,4]~C[3,4] are stored separately The data status is "1", "0", "1" and "1", "1", "1" and "0", "0", "0", then memory cell C[1,2]~ The output currents of C[3,2], C[1,3]~C[3,3], C[1,4]~C[3,4] are "high", "high", and "high" respectively And "high", "low", "high" and "low", "high", "low". Therefore, the read current values OUT[2]~OUT[4] received by the matching lines ML[2]~ML[4] are respectively three, two, and one unit size.

如此一來,偵測電路160根據自匹配線ML[1]~ML[4]所接收到的讀取電流值OUT[1]~OUT[4]中最大者(即,三單位大小的讀取電流值OUT[2])作為搜尋結果RS輸出,便能找到符合搜尋資料DIN為「101」的記憶胞C[1,2]~C[3,2]。 As a result, the detection circuit 160 is based on the largest of the read current values OUT[1] to OUT[4] received from the self-matching lines ML[1] to ML[4] (that is, a three-unit read The current value OUT[2]) is output as the search result RS, and the memory cells C[1,2]~C[3,2] matching the search data DIN of “101” can be found.

請參考第6圖。第6圖係根據本揭示內容之部分實施例繪示一種內容可定址記憶體100a的立體示意圖。在部分實 施例中,第2圖中的內容可定址記憶體100可由第6圖中的內容可定址記憶體100a據以實施。在第6圖之實施例中,與第2圖之實施例相似的元件係以相同的元件符號表示。如第6圖所示,包含在第一區域A1中的搜尋線SL[1]~SL[3]可設置於基板或第一導電層上。包含在第二區域A2中傳輸搜尋字元值DIN[1]~DIN[3]的傳輸線、多工電路和匹配線ML[1]、ML[2]可設置於第二導電層上。包含在第三區域A3中的搜尋線SLn[1]~SLn[3]可設置於第三導電層上。在部分實施例中,導電層可為多晶矽材料、金屬材料或其他導電材料製成。而搜尋線、匹配線、傳輸線或其他連接線可由在導體層中鋪設圖案化的金屬導線據以實施。 Please refer to Figure 6. FIG. 6 is a perspective view of a content addressable memory 100a according to some embodiments of the present disclosure. In part In the embodiment, the content addressable memory 100 in FIG. 2 can be implemented based on the content addressable memory 100a in FIG. 6. In the embodiment of FIG. 6, elements similar to the embodiment of FIG. 2 are denoted by the same element symbols. As shown in FIG. 6, the search lines SL[1] to SL[3] included in the first area A1 may be disposed on the substrate or the first conductive layer. The transmission line, the multiplex circuit and the matching lines ML[1] and ML[2] included in the second area A2 transmitting the search character values DIN[1] to DIN[3] can be disposed on the second conductive layer. The search lines SLn[1]~SLn[3] included in the third area A3 may be disposed on the third conductive layer. In some embodiments, the conductive layer may be made of polysilicon material, metal material or other conductive materials. The search line, matching line, transmission line or other connecting lines can be implemented by laying patterned metal wires in the conductor layer.

請參考第7圖。第7圖係根據本揭示內容之其他部分實施例繪示另一種內容可定址記憶體100b的立體示意圖。在部分實施例中,第2圖中的內容可定址記憶體100可由第7圖中的內容可定址記憶體100b據以實施。在第7圖之實施例中,與第2圖之實施例相似的元件係以相同的元件符號表示。如第7圖所示,包含在第一區域A1中的傳輸搜尋字元值DIN[1]~DIN[3]的傳輸線、多工電路和搜尋線SL[1]~SL[3]可設置於基板或第一導電層上。包含在第二區域A2中匹配線ML[1]、ML[2]可設置於第二導電層上。包含在第三區域A3中的搜尋線SLn[1]~SLn[3]可設置於第三導電層上。 Please refer to Figure 7. FIG. 7 is a schematic perspective view of another content-addressable memory 100b according to other embodiments of the present disclosure. In some embodiments, the content addressable memory 100 in FIG. 2 can be implemented based on the content addressable memory 100b in FIG. 7. In the embodiment of FIG. 7, elements similar to the embodiment of FIG. 2 are denoted by the same element symbols. As shown in FIG. 7, the transmission line, the multiplexing circuit, and the search lines SL[1]~SL[3] included in the first area A1 of the transmission search character value DIN[1]~DIN[3] can be set at On the substrate or the first conductive layer. The matching lines ML[1] and ML[2] included in the second area A2 may be disposed on the second conductive layer. The search lines SLn[1]~SLn[3] included in the third area A3 may be disposed on the third conductive layer.

值得注意的是,上述第1圖~第7圖所描述的內容可定址記憶體100的電路結構及/或操作,在其他部分實施例中,亦可使用於其他型態的記憶體中,本揭示內容並不以此為 限。 It is worth noting that the content described in Figures 1 to 7 above can address the circuit structure and/or operation of the memory 100. In other embodiments, it can also be used in other types of memory. Reveal content is not based on limit.

雖然本文將所公開的方法示出和描述為一系列的步驟或事件,但是應當理解,所示出的這些步驟或事件的順序不應解釋為限制意義。例如,部分步驟可以以不同順序發生和/或與除了本文所示和/或所描述之步驟或事件以外的其他步驟或事件同時發生。另外,實施本文所描述的一個或多個態樣或實施例時,並非所有於此示出的步驟皆為必需。此外,本文中的一個或多個步驟亦可能在一個或多個分離的步驟和/或階段中執行。 Although the disclosed method is shown and described herein as a series of steps or events, it should be understood that the order of the steps or events shown should not be interpreted as limiting. For example, some steps may occur in a different order and/or simultaneously with other steps or events other than those shown and/or described herein. In addition, not all of the steps shown here are necessary to implement one or more aspects or embodiments described herein. In addition, one or more steps herein may also be performed in one or more separate steps and/or stages.

需要說明的是,在不衝突的情況下,在本揭示內容各個圖式、實施例及實施例中的特徵與電路可以相互組合。圖式中所繪示的電路僅為示例之用,係簡化以使說明簡潔並便於理解,並非用以限制本案。此外,上述各實施例中的各個裝置、單元及元件可以由各種類型的數位或類比電路實現,亦可分別由不同的積體電路晶片實現,或整合至單一晶片。上述僅為例示,本揭示內容並不以此為限。 It should be noted that, in the case of no conflict, the various drawings, embodiments, and features and circuits in the present disclosure may be combined with each other. The circuits shown in the drawings are for illustrative purposes only, and are simplified to make the description concise and easy to understand, and are not intended to limit the case. In addition, the various devices, units, and components in the foregoing embodiments may be implemented by various types of digital or analog circuits, or may be implemented by different integrated circuit chips, or integrated into a single chip. The above is only an example, and the disclosure is not limited thereto.

綜上所述,本案透過應用上述各個實施例中,藉由記憶胞122中的電阻元件Ra和Rb分別儲存相應第一位元值和第二位元值以代表不同資料狀態,並透過多工電路142根據搜尋字元值為「1」或「0」將偏壓BIA[k]施加至記憶胞122中的電阻元件Ra或Rb,便能根據相應的輸出電流Io得知記憶胞122的資料狀態是否與搜尋字元值相符。此外,藉由整流元件122a和122b,便能確保不會有漏電流從非施加偏壓側的電阻元件流出。 To sum up, in this case, through the application of the above embodiments, the resistance elements Ra and Rb in the memory cell 122 respectively store the corresponding first bit value and second bit value to represent different data states, and through multiplexing The circuit 142 applies the bias voltage BIA[k] to the resistive element Ra or Rb in the memory cell 122 according to the search character value "1" or "0", and then the data of the memory cell 122 can be obtained according to the corresponding output current Io Whether the status matches the search character value. In addition, by the rectifying elements 122a and 122b, it can be ensured that no leakage current flows from the resistance element on the non-biased side.

雖然本揭示內容已以實施方式揭露如上,然其並非用以限定本揭示內容,所屬技術領域具有通常知識者在不脫離本揭示內容之精神和範圍內,當可作各種更動與潤飾,因此本揭示內容之保護範圍當視後附之申請專利範圍所界定者為準。 Although this disclosure has been disclosed as above by way of implementation, it is not intended to limit this disclosure. Those with ordinary knowledge in the technical field can make various changes and modifications within the spirit and scope of this disclosure, so this The scope of protection of the disclosure shall be deemed as defined by the scope of the attached patent application.

122‧‧‧記憶胞 122‧‧‧Memory Cell

142‧‧‧多工電路 142‧‧‧multiplex circuit

DIN[k]‧‧‧搜尋字元值 DIN[k]‧‧‧Search character value

BIA[k]‧‧‧偏壓 BIA[k]‧‧‧bias

SLn[k]、SL[k]‧‧‧搜尋線 SLn[k], SL[k]‧‧‧ search line

Ra、Rb‧‧‧電阻元件 Ra, Rb‧‧‧resistance element

122a、122b‧‧‧整流元件 122a, 122b‧‧‧Rectifier

N1‧‧‧輸出端 N1‧‧‧ output

ML[j]‧‧‧匹配線 ML[j]‧‧‧ Matching line

Claims (9)

一記憶體,包含:一記憶胞陣列,包含複數個記憶胞,該些記憶胞中之任一者包含:一輸出端;一第一整流元件和一第二整流元件;以及一第一電阻元件和一第二電阻元件,該二個電阻元件經配置以儲存代表一資料狀態之二個位元值;複數條匹配線,該複數條匹配線分別耦接該些記憶胞的該些輸出端;以及複數對搜尋線,該複數對搜尋線分別耦接該些記憶胞,該複數對搜尋線中之任一者包含一第一搜尋線和一第二搜尋線,同一個記憶胞的該第一電阻元件和該第一整流元件串聯於同一對搜尋線的該第一搜尋線和該同一個記憶胞的該輸出端之間,同一個記憶胞的該第二電阻元件和該第二整流元件串聯於同一對搜尋線的該第二搜尋線和該同一個記憶胞的該輸出端之間。 A memory, including: a memory cell array, including a plurality of memory cells, any one of the memory cells includes: an output terminal; a first rectifying element and a second rectifying element; and a first resistance element And a second resistive element, the two resistive elements are configured to store two bit values representing a data state; a plurality of matching lines, the plurality of matching lines are respectively coupled to the output terminals of the memory cells; And a plurality of pairs of search lines, the plurality of pairs of search lines are respectively coupled to the memory cells, any one of the plurality of pairs of search lines includes a first search line and a second search line, the same memory cell of the first The resistance element and the first rectification element are connected in series between the first search line of the same pair of search lines and the output end of the same memory cell, and the second resistance element and the second rectification element of the same memory cell are connected in series Between the second search line of the same pair of search lines and the output end of the same memory cell. 如請求項1所述之記憶體,其中該二個位元值包含一第一位元值和一第二位元值,該資料狀態包含一第一資料狀態和一第二資料狀態中之一者,該第一位元值具有一第一邏輯值及該第二位元值具有一第二邏輯值之情況下代表該第一資料狀態,該第一位元值具有該第二邏輯值及該第二位元值具有該第一邏輯值之情況下代表該第二資料狀態。 The memory according to claim 1, wherein the two bit values include a first bit value and a second bit value, and the data state includes one of a first data state and a second data state In addition, when the first bit value has a first logical value and the second bit value has a second logical value, it represents the first data state, and the first bit value has the second logical value and When the second bit value has the first logical value, it represents the second data state. 如請求項1所述之記憶體,其中該二個位元值包含一第一位元值和一第二位元值,該資料狀態包含一第一資料狀態、一第二資料狀態和一第三資料狀態中之一者,該第一位元值具有一第一邏輯值及該第二位元值具有一第二邏輯值之情況下代表該第一資料狀態,該第一位元值具有該第二邏輯值及該第二位元值具有該第一邏輯值之情況下代表該第二資料狀態,該第一位元值具有該第一邏輯值及該第二位元值具有該第一邏輯值之情況下代表該第三資料狀態。 The memory according to claim 1, wherein the two bit values include a first bit value and a second bit value, and the data state includes a first data state, a second data state, and a first One of the three data states, where the first bit value has a first logical value and the second bit value has a second logical value represents the first data state, the first bit value has When the second logical value and the second bit value have the first logical value, the second data state is represented. The first bit value has the first logical value and the second bit value has the first In the case of a logical value, it represents the state of the third data. 如請求項1所述之記憶體,更包含:複數個多工電路,該複數個多工電路分別耦接該複數對搜尋線,該複數個多工電路用以根據一搜尋資料選擇性地導通該複數對搜尋線中相應的該第一搜尋線或該第二搜尋線。 The memory according to claim 1, further comprising: a plurality of multiplex circuits, the plurality of multiplex circuits are respectively coupled to the plurality of search lines, and the plurality of multiplex circuits are used to selectively conduct according to a search data The first search line or the second search line corresponding to the search lines of the plural pairs. 如請求項4所述之記憶體,其中耦接於同一對搜尋線的該些記憶胞共用該複數個多工電路中的同一者。 The memory according to claim 4, wherein the memory cells coupled to the same pair of search lines share the same one of the multiplex circuits. 如請求項4所述之記憶體,其中該搜尋資料包含複數個搜尋字元值,該些搜尋字元值中任一者包含一第一邏輯值和一第二邏輯值中之一者,當該複數個搜尋字元值之一者為該第一邏輯值時,該複數個多工電路中之相應一者導通該第一搜尋線,當該複數個搜尋字元值之一者為該第二邏輯值時,該複 數個多工電路中之相應一者導通該第二搜尋線。 The memory according to claim 4, wherein the search data includes a plurality of search character values, and any one of the search character values includes one of a first logical value and a second logical value, when When one of the plurality of search character values is the first logic value, the corresponding one of the plurality of multiplex circuits turns on the first search line, and when one of the plurality of search character values is the first logic value When two logical values The corresponding one of the multiplexed circuits turns on the second search line. 如請求項4所述之記憶體,其中該搜尋資料包含複數個搜尋字元值,該些搜尋字元值中任一者包含一第一邏輯值和一第二邏輯值中之一者,當該複數個搜尋字元值之一者為該第一邏輯值時,該複數個多工電路中之相應一者輸出一正偏壓至該第一搜尋線並輸出一非正偏壓至該第二搜尋線,當該複數個搜尋字元值之一者為該第二邏輯值時,該複數個多工電路中之相應一者輸出該正偏壓至該第二搜尋線並輸出該非正偏壓至該第一搜尋線。 The memory according to claim 4, wherein the search data includes a plurality of search character values, and any one of the search character values includes one of a first logical value and a second logical value, when When one of the plurality of search character values is the first logic value, a corresponding one of the plurality of multiplex circuits outputs a positive bias to the first search line and outputs a non-positive bias to the first Two search lines, when one of the plurality of search character values is the second logical value, the corresponding one of the plurality of multiplex circuits outputs the positive bias to the second search line and outputs the non-positive bias Press to the first search line. 如請求項1所述之記憶體,其中該第一電阻元件的一第一端耦接該第一搜尋線,該第一電阻元件的一第二端耦接該第一整流元件的一第一端,該第一整流元件的一第二端耦接該輸出端,該第二電阻元件的一第一端耦接該第二搜尋線,該第二電阻元件的一第二端耦接該第二整流元件的一第一端,該第二整流元件的一第二端耦接該輸出端。 The memory according to claim 1, wherein a first end of the first resistance element is coupled to the first search line, and a second end of the first resistance element is coupled to a first end of the first rectifier element End, a second end of the first rectifying element is coupled to the output end, a first end of the second resistive element is coupled to the second search line, and a second end of the second resistive element is coupled to the first A first end of the two rectifying elements, a second end of the second rectifying element are coupled to the output end. 如請求項1所述之記憶體,其中該第一整流元件的一第一端耦接該第一搜尋線,該第一整流元件的一第二端耦接該第一電阻元件的一第一端,該第一電阻元件的一第二端耦接該輸出端,該第二整流元件的一第一端耦接該第二搜尋線,該第二整流元件的一第二端耦接該第二電阻元件的一第一端,該第二電阻元件的一第二端耦接該輸出端。 The memory according to claim 1, wherein a first end of the first rectifying element is coupled to the first search line, and a second end of the first rectifying element is coupled to a first end of the first resistive element End, a second end of the first resistance element is coupled to the output end, a first end of the second rectification element is coupled to the second search line, and a second end of the second rectification element is coupled to the first A first end of the two resistance elements, a second end of the second resistance element are coupled to the output end.
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US20150206586A1 (en) * 2014-01-20 2015-07-23 National Tsing Hua University Non-volatile ternary content-addressable memory 4t2r cell with rc-delay search
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US20150206586A1 (en) * 2014-01-20 2015-07-23 National Tsing Hua University Non-volatile ternary content-addressable memory 4t2r cell with rc-delay search
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