TWI690739B - Optical device - Google Patents

Abstract

An optical device having a ceramic substrate and an insulation cup wall is provided in the present disclosure. The ceramic substrate has a top surface and a set of metal leads is disposed on the top surface. The insulation cup wall is up-right arranged on the top surface and the set of metal leads is disposed within a range surrounded by a boundary line between the insulation cup wall and the ceramic substrate. The metal leads have circuit blocks and engaging strips. The circuit blocks are disposed within a range enclosed by the insulation cup wall, the respective strips are embedded in the insulation cup wall, and at least a portion of the engaging strips are arranged in a non-parallel to a portion of the insulation cup wall where embedded. Thereby, the insulating cup wall could resist respective forces along a longitudinal direction and a lateral direction thereof.

Description

Optical device

The present invention relates to, especially an optical device, which has a molding to embed an insulating cup wall on a ceramic substrate.

A general optical device (such as a photo sensor) includes a substrate and optical elements provided on the substrate. As the heat generated by electronic components increases with performance, the use of ceramic substrates as circuit boards has gradually become the driving force for the future. In addition, in general, when an optical device is mounted on a ceramic substrate, in order for the optical element to operate smoothly, the optical element and the glass covering it need to be spaced apart. Therefore, a cup-shaped structure needs to be formed on the substrate for placing glass, and the optical device and its connected circuit are arranged in the cup-shaped structure. However, the shortcoming of the prior art is that the cup-shaped structure formed on the ceramic substrate and the ceramic substrate have insufficient bite force and easily fall off.

In view of this, the present inventors have made great efforts to study the above-mentioned prior art and cooperate with the application of academic principles, and try their best to solve the above-mentioned problems, which becomes the improvement goal of the present inventors.

The invention provides an optical device with a metal line inserting strip on a ceramic substrate to embed the insulating cup wall on the ceramic substrate.

The invention provides an optical device including a ceramic substrate and an insulating cup wall. The ceramic substrate has a top surface, and the printed cloth on the top surface is provided with a metal circuit. The insulating cup wall is erected on the top surface And the metal circuit is arranged in the range surrounded by the boundary line between the insulating cup wall and the ceramic substrate. The metal circuit includes a plurality of circuit blocks and a plurality of embedded strips, at least a part of the circuit blocks are arranged within the range surrounded by the insulating cup wall, each embedded strip is respectively embedded in the insulating cup wall, at least a part of the embedded strip and the insulating cup The parts embedded on the wall are arranged non-parallel.

In the optical device of the present invention, a part of the embedded strip and the part of the insulating cup wall that are embedded and fixed are arranged perpendicular to each other. The other part of the embedded strip and the part of the insulating cup wall that are embedded and fixed are arranged parallel to each other. The inlays can be connected to each other in a grid configuration.

In the optical device of the present invention, at least a part of the embedded strip and the portion of the insulating cup wall that are embedded and fixed are inclined to each other. The inserts can be connected to each other in a zigzag configuration.

In the optical device of the present invention, the inserts are arranged separately. At least one circuit block of the circuit block is connected to at least one of the embedded strips. The inserting strip connecting the circuit block and the portion of the insulating cup wall that are embedded and fixed are non-parallel. A part of the embedded strip and the part of the insulating cup wall which are embedded and fixed are arranged in parallel with each other and are separated from the circuit block and the embedded strip connecting the circuit block.

In the optical device of the present invention, a second metal circuit is disposed on the metal circuit, and the second circuit is located within a range surrounded by the edges of the inserts. The second metal circuit includes a plurality of second inserts, each of the second inserts The strips are respectively embedded in the wall of the insulating cup, and at least a part of the second embedded strips and the portions of the insulating cup wall that are embedded and fixed are non-parallel. At least a portion of the second inserts are arranged in a ring shape for the insulating cup wall to be embedded therein.

In the optical device of the present invention, the ceramic substrate is printed with an inlay strip to embed the insulating cup wall on the ceramic substrate, and at least a portion of the inlay strip is non-parallel to the portion of the insulative cup wall that is embedded and fixed. It can resist the longitudinal and transverse forces along the wall of the insulating cup.

100: ceramic substrate

101: top surface

200: metal line

210: circuit block

220/220a: molding

300: insulating cup wall

400: extended circuit

410: Chemical copper layer

420: plating layer

430: Surface treatment layer

500: glass

600: second metal line

610/610a: second molding

FIG. 1 is a schematic perspective view of an optical device according to a preferred embodiment of the present invention.

FIG. 2 is a cross-sectional view of the ceramic substrate and the molding on the optical device in the optical device according to the preferred embodiment of the present invention.

3 is a schematic view of the arrangement of the ceramic substrate and the metal circuit on the optical device in the preferred embodiment of the present invention.

4 and 5 are cross-sectional views of optical devices according to preferred embodiments of the present invention.

6 to 8 are schematic diagrams showing various configurations of the ceramic substrate and the metal circuit thereon in the optical device according to the preferred embodiment of the present invention.

9 and 10 are schematic diagrams of optical devices according to preferred embodiments of the present invention.

FIG. 11 is a schematic diagram of a change configuration of the second metal circuit in the optical device of the preferred embodiment of the present invention.

1 to 3, a preferred embodiment of the present invention provides an optical device, which includes a ceramic substrate 100 and an insulating cup wall 300. The ceramic substrate 100 has a top surface 101, and a printed circuit on the top surface 101 is provided with a metal circuit 200. The insulating cup wall 300 is directly coupled to the top surface 101 of the ceramic substrate 100 by plastic molding, and the insulating cup wall 300 is erected on the top surface 101 and the metal circuit 200 is laid on the outer edge of the insulating cup wall 300 and the ceramic substrate 100 Within the area enclosed by the boundary line. A specific material may be further added to the plastic forming the insulating cup wall 300, thereby limiting the thermal expansion coefficient of the plastic to a specific range, to prevent the plastic temperature from being too high and excessive expansion to cause the insulating cup wall 300 to separate from the ceramic substrate 100. Coefficient of thermal expansion (CTE) is limited to 5 to 35 ppm/°C in the machine direction (MD) and 5 to 35 ppm/°C in the transverse direction (TD). The specific material includes at least one of the following: Liquid Crystal Polymer (Liquid Crystal Polymer; LCP), Polyamide (Polyamide; PA), polyamide 6T (Polyamide 6T; PA6T), polyamide 9T: (Polyamide 9T; PA9T), silicone molding compound (SMC), epoxy molding compound (Epoxy molding compound; EMC), not Unsaturated polyester (UP), glass fiber or mineral fiber (whose weight percentage is between 20~50wt%), mineral fiber containing silicon or calcium component. In addition, TiO2 (whose weight percentage ranges from 0 to 30 wt%), carbon black (whose weight percentage ranges from 0 to 30 wt%) and other components can be selectively added to the plastic to make the insulating cup wall 300 exhibit different colors.

The metal circuit 200 includes a plurality of circuit blocks 210 and a plurality of embedded strips 220/220a. At least a part of the circuit block 210 is disposed within the range surrounded by the insulating cup wall 300. The portions of the circuit block 210 exposed within the range surrounded by the insulating cup wall 300 are used to provide optical elements (FIG. (Not shown), such as a photosensitive element or a light-emitting element. The circuit block 210 can also be selectively embedded in the bottom of the insulating cup wall 300. Each inserting strip 220/220a is embedded in the bottom of the insulating cup wall 300, respectively, and at least a part of the inserting strip 220 and the portion of the insulating cup wall 300 that are embedded and fixed are non-parallel.

Referring to FIGS. 4 and 5, the top of the insulating cup wall 300 may be covered with a glass 500 plate to protect the optical elements contained in the insulating cup wall 300.

Referring to FIGS. 3 to 5, in this embodiment, a part of the embedded strips 220/220a and the insulating cup wall 300 are fixed perpendicularly to each other, and another part of the embedded strip 220a and the insulating cup wall The parts embedded on the 300 are arranged parallel to each other. Adjacent slats 220/220a are arranged vertically and in this embodiment, the slats 220/220a are preferably connected to each other in a grid configuration.

However, the arrangement of the moldings 220/220a according to the present invention is not limited to the foregoing. According to different circuit configurations, structural strength requirements, or space requirements, the inlays 220/220a can be correspondingly arranged in different arrangements, and various possible configurations are further exemplified in the following.

Referring to FIGS. 6 and 7, a part of the inlay 220 and the portion of the insulating cup wall 300 that are embedded and fixed to each other are perpendicular to each other, and another part of the inlay 220a and the portion of the insulating cup wall 300 that are embedded and fixed are Configured parallel to each other. Adjacent slats 220/220a are arranged vertically and are separated from each other in the present embodiment. At least one of the circuit blocks 210 can be selectively connected to at least one of the inlays 220/220a. The embedded strips 220/220a connected to the circuit block 210 and the insulating cup wall 300 are non-parallel arranged. The inlays 220 a arranged parallel to the insulating cup wall 300 are separated from the circuit block 210 and the inlay 220 connected to the circuit block 210.

Referring to FIG. 8, in the optical device of the present invention, at least a part of the inlaid strips 220/220a and the insulating cup wall 300 are slanted to each other, and the adjacent inlaid strips 220/220a are inclined in opposite directions. Moreover, the inserts 220/220a can be connected to each other in a zigzag configuration. The inclined moldings 220/220a may also be inclined in the same direction to be arranged parallel to each other and spaced apart, and the present invention is not limited thereto.

Referring to FIG. 5, the optical device of the present invention includes an extension circuit 400 that bridges the internal and external circuits of the insulating cup wall 300. The extension circuit 400 is preferably formed by extending a chemical copper layer 410 covering at least a portion of the circuit block 210, which extends to the surface of the insulating cup wall 300 and further extends beyond the insulating cup wall 300 . An electroplated layer 420 may be coated on the chemical copper layer 410, and thereby the electroplated layer 420 may strengthen the structural strength of the chemical copper layer 410 to prevent the chemical copper layer 410 from cracking. A surface treatment layer 430 may be formed on the outermost surface of the extension circuit 400. The surface treatment layer 430 is preferably electroless nickel-palladium gold, which has good adhesion and can protect the plating layer 420 from corrosion.

In the optical device of the present invention, the ceramic substrate 100 is printed with inlays 220/220a to embed the insulating cup wall 300 on the ceramic substrate 100, and at least a portion of the inlays 220/220a are embedded in the insulating cup wall 300 The fixed parts are arranged in a non-parallel manner, thereby being able to resist the forces along the longitudinal and lateral directions of the insulating cup wall 300. Since the moldings 220/220a are formed in the metal circuit 200, the moldings 220/220a can be set according to different requirements only by modifying the printing configuration.

Referring to FIGS. 9 and 10, a second metal circuit 600 is disposed on the metal circuit 200, and the second metal circuit 600 is located within the range surrounded by the edges of the inserts 220/220a. The second metal circuit includes a plurality of second inserts 610/610a, each second insert 610/610a is embedded in the insulating cup wall 300, and at least a portion of the second inserts 610 are embedded on the insulating cup wall 300 The solid parts are arranged in non-parallel. Specifically, in this embodiment, a portion of the second inserts 610 are perpendicular to the portions of the insulating cup wall 300 that are fixed to each other; the other portion of the second inserts and the 610a insulating cup The parts embedded on the wall are parallel. Moreover, in this embodiment, the second inserts 610/610a are arranged in an I-shape.

Referring to FIG. 11, in order to increase the bonding force, at least a part of the second inserting strips 610/610a may be arranged in a ring shape for the insulating cup wall 300 to be embedded therein. Specifically, the second inserts 610/610a are arranged in a chevron shape. When the insulating cup wall 300 is molded, the plastic can be injected into the second inserts 610/610a arranged in a ring shape. This allows the cured edge cup wall 300 to be embedded therein.

The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all fall within the patent scope of the present invention.

100: ceramic substrate

101: top surface

200: metal line

210: circuit block

220/220a: molding

300: insulating cup wall

Claims (11)

An optical device includes: a ceramic substrate having a top surface, and a printed circuit on the top surface is provided with a metal circuit; and an insulating cup wall is erected on the top surface and the metal circuit is disposed on the insulation Within the range surrounded by the boundary line between the cup wall and the ceramic substrate, wherein the metal circuit includes a plurality of circuit blocks and a plurality of embedded strips, at least a part of the circuit blocks is disposed within the range surrounded by the insulating cup wall Each of the inserts is embedded in the insulating cup wall, at least a portion of the inserts and the insulating cup wall are fixed in a non-parallel configuration, at least one of the circuit block and at least one of the The inlays are connected. The optical device according to claim 1, wherein a part of the inserting strips and portions of the insulating cup wall that are embedded and fixed are arranged perpendicular to each other. The optical device according to claim 2, wherein another part of the inserting strips and the part of the insulating cup wall that are embedded and fixed are arranged parallel to each other. The optical device according to claim 3, wherein the inserts are connected to each other in a grid configuration. The optical device according to claim 1, wherein at least a part of the inserting strips and the portion of the insulating cup wall that are embedded and fixed are arranged obliquely to each other. The optical device according to claim 5, wherein the inserts are connected in a zigzag configuration. The optical device according to claim 1, wherein the moldings are arranged separately. The optical device according to claim 1, wherein the embedded portion connecting the circuit block and the insulating cup wall are non-parallel arranged. The optical device according to claim 1, wherein a portion of the inserts and the portion of the insulating cup wall that are embedded and fixed are parallel to each other and are connected to the circuit block and the insert connected to the circuit block Separate configuration. The optical device according to claim 1, wherein a second metal circuit is disposed on the metal circuit, and the second metal circuit is within a range surrounded by the edges of the moldings, the second metal circuit includes a plurality of Two inlay strips, each of the second inlay strips is respectively embedded in the wall of the insulating cup, and at least a part of the second inlay strips and the portion of the insulative cup wall that are embedded and fixed are non-parallel. The optical device according to claim 10, wherein at least a part of the second inserts are arranged in a ring shape for the insulating cup wall to be embedded therein.

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