TWI689861B - Display panel and opposite substrate thereof - Google Patents

Display panel and opposite substrate thereof Download PDF

Info

Publication number
TWI689861B
TWI689861B TW108109683A TW108109683A TWI689861B TW I689861 B TWI689861 B TW I689861B TW 108109683 A TW108109683 A TW 108109683A TW 108109683 A TW108109683 A TW 108109683A TW I689861 B TWI689861 B TW I689861B
Authority
TW
Taiwan
Prior art keywords
layer
conductive
insulating layer
sensing
pads
Prior art date
Application number
TW108109683A
Other languages
Chinese (zh)
Other versions
TW202036259A (en
Inventor
鄭貿薰
陳奕冏
黃正翰
陳勇志
鄭景升
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW108109683A priority Critical patent/TWI689861B/en
Application granted granted Critical
Publication of TWI689861B publication Critical patent/TWI689861B/en
Publication of TW202036259A publication Critical patent/TW202036259A/en

Links

Images

Abstract

An opposite substrate is provided. The opposite substrate includes a support board, a plurality of touch-sensing pads, a plurality of first conductive layers, at least one photo-sensing layer, and at least one second conductive layer. The touch-sensing pads, the first conductive layers and the photo-sensing layer are formed on the flat surface of the support board. The touch-sensing pads are transparent. The first conductive layers are connected to the touch-sensing pads respectively, whereas the second conductive layer is connected to the photo-sensing layer. In addition, a display panel including the opposite substrate is provided.

Description

顯示面板及其對向基板Display panel and its opposite substrate

本發明是有關於一種顯示器,且特別是有關於一種顯示面板及其對向基板。 The present invention relates to a display, and particularly to a display panel and its counter substrate.

目前有些手機已具備螢幕亮度調變(screen brightness adjustment)的功能,而這種手機的螢幕亮度可隨著環境光(ambient light)的強度而改變。這種具環境光調變功能的手機通常具備環境光感測器(ambient light sensor,ALS),其例如是光二極體(photo diode)。環境光感測器能接收從外界環境而來的光線,以感測環境光的強度。如此,手機得以根據環境光的強度變化來調整螢幕亮度。 At present, some mobile phones already have the function of screen brightness adjustment, and the screen brightness of such mobile phones can change with the intensity of ambient light. Such a mobile phone with an ambient light modulation function usually has an ambient light sensor (ALS), which is, for example, a photo diode. The ambient light sensor can receive light from the external environment to sense the intensity of ambient light. In this way, the mobile phone can adjust the screen brightness according to the change of the ambient light intensity.

本發明提供一種顯示面板的對向基板,其包括觸控感測墊與光感測層,以使顯示面板能提供觸控與環境光調變的功能。 The invention provides a counter substrate of a display panel, which includes a touch sensing pad and a light sensing layer, so that the display panel can provide touch and ambient light modulation functions.

本發明提供一種顯示面板,其包括上述對向基板。 The present invention provides a display panel including the above-mentioned counter substrate.

本發明所提供的對向基板包括支撐板、多個觸控感測墊、多個第一導電層、至少一光感測層以及至少一第二導電層。支撐板具有平面。這些觸控感測墊、這些第一導電層與至少一光感測層皆形成於支撐板的平面上。這些觸 控感測墊皆為透明的。這些第一導電層分別電連接這些觸控感測墊,而第二導電層電連接光感測層。 The counter substrate provided by the present invention includes a supporting plate, a plurality of touch sensing pads, a plurality of first conductive layers, at least one light sensing layer, and at least one second conductive layer. The support plate has a flat surface. The touch sensing pads, the first conductive layers and the at least one light sensing layer are all formed on the plane of the support plate. These touches The control sensing pads are all transparent. The first conductive layers are electrically connected to the touch sensing pads, respectively, and the second conductive layer is electrically connected to the light sensing layer.

在本發明的一實施例中,上述對向基板還包括第一絕緣層與第二絕緣層。第一絕緣層與第二絕緣層皆形成於支撐板的平面上。第一絕緣層覆蓋這些觸控感測墊與至少一光感測層。第二絕緣層覆蓋第一絕緣層,其中至少一第二導電層配置於第二絕緣層上,並依序穿過第二絕緣層與第一絕緣層而電連接至少一光感測層。 In an embodiment of the invention, the counter substrate further includes a first insulating layer and a second insulating layer. Both the first insulating layer and the second insulating layer are formed on the plane of the support plate. The first insulating layer covers the touch sensing pads and at least one light sensing layer. The second insulating layer covers the first insulating layer, wherein at least one second conductive layer is disposed on the second insulating layer, and sequentially passes through the second insulating layer and the first insulating layer to electrically connect to the at least one light sensing layer.

在本發明的一實施例中,各個第一導電層的一部分形成於第一絕緣層與第二絕緣層之間。 In an embodiment of the invention, a portion of each first conductive layer is formed between the first insulating layer and the second insulating layer.

在本發明的一實施例中,上述對向基板還包括多個導電接墊。這些導電接墊電連接這些第一導電層,其中平面具有顯示區以及位於顯示區周圍的非顯示區,而這些導電接墊配置於非顯示區內。 In an embodiment of the invention, the counter substrate further includes a plurality of conductive pads. The conductive pads are electrically connected to the first conductive layers, wherein the plane has a display area and a non-display area around the display area, and the conductive pads are disposed in the non-display area.

在本發明的一實施例中,這些第一導電層與這些觸控感測墊皆由透明導電層所製成。 In an embodiment of the invention, the first conductive layers and the touch sensing pads are made of transparent conductive layers.

在本發明的一實施例中,當這些觸控感測墊未進行觸控感測時,第二導電層供應偏壓給光感測層。當這些觸控感測墊進行觸控感測時,第二導電層停止供應偏壓給光感測層。 In an embodiment of the present invention, when the touch sensing pads are not performing touch sensing, the second conductive layer supplies a bias voltage to the light sensing layer. When these touch sensing pads perform touch sensing, the second conductive layer stops supplying the bias voltage to the light sensing layer.

在本發明的一實施例中,各個光感測層位於相鄰的第二導電層與觸控感測墊之間。 In an embodiment of the present invention, each light sensing layer is located between the adjacent second conductive layer and the touch sensing pad.

本發明所提供的顯示面板包括上述對向基板以及控制基板,其中控制基板連接對向基板,並經由這些導電接墊而電連接對向基板。 The display panel provided by the present invention includes the above-mentioned counter substrate and a control substrate, wherein the control substrate is connected to the counter substrate, and the counter substrate is electrically connected via the conductive pads.

在本發明的一實施例中,上述控制基板還包括多個導電凸塊,其中這些導電凸塊分別與這些導電接墊電性導通。 In an embodiment of the invention, the control substrate further includes a plurality of conductive bumps, wherein the conductive bumps are electrically connected to the conductive pads, respectively.

本發明的對向基板因採用觸控感測墊與光感測層,以使對向基板不僅能觸控感測物件(例如手或觸控筆)的所在位置,而且還能感測環境光的強度,讓顯示面板具有觸控以及依據環境光調變螢幕亮度的功能。 The counter substrate of the present invention uses a touch sensing pad and a light sensing layer, so that the counter substrate can not only touch the position of an object (such as a hand or a stylus), but also sense ambient light The intensity of the display panel allows the display panel to touch and adjust the brightness of the screen according to the ambient light.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。 To make the above and other objects, features, and advantages of the present invention more comprehensible, embodiments are described below in conjunction with the accompanying drawings, which are described in detail below.

10:手 10: Hand

20:訊號處理單元 20: signal processing unit

100:顯示面板 100: display panel

200、400:對向基板 200, 400: opposite substrate

210:支撐板 210: support plate

211:平面 211: Flat

212:觸控表面 212: Touch surface

220:觸控感測墊 220: Touch sensing pad

230:光感測層 230: Light sensing layer

241、441:第一導電層 241, 441: first conductive layer

242:第二導電層 242: second conductive layer

242a:表面 242a: surface

251:第一絕緣層 251: first insulating layer

252:第二絕緣層 252: Second insulating layer

260:導電接墊 260: conductive pad

300:控制基板 300: control board

310:承載板 310: carrier board

314:緩衝層 314: buffer layer

320:通道層 320: channel layer

321、341b、342b、343b、361:墊層 321, 341b, 342b, 343b, 361: cushion

341:閘極 341: Gate

342d:汲極 342d: Drain

342s:源極 342s: source

343:導電層 343: conductive layer

344:導電圖案層 344: conductive pattern layer

344a:陽極 344a: anode

345:陰極 345: cathode

351:第一閘極絕緣層 351: First gate insulating layer

352:第二閘極絕緣層 352: Second gate insulating layer

353:層間絕緣層 353: Interlayer insulation

354:平坦層 354: Flat layer

354b:凸塊 354b: bump

356:畫素定義層 356: Pixel definition layer

360:導電凸塊 360: conductive bump

369:層間金屬層 369: Interlayer metal layer

370:有機發光層 370: Organic light-emitting layer

390:間隔件 390: spacer

A11:顯示區 A11: Display area

A12:非顯示區 A12: Non-display area

H56:開口 H56: opening

I21:光電流 I21: Photocurrent

LH3、LL3:環境光 LH3, LL3: ambient light

圖1A是本發明一實施例的顯示面板的俯視示意圖。 FIG. 1A is a schematic top view of a display panel according to an embodiment of the invention.

圖1B是圖1A中沿線1B-1B剖面所繪製的剖面示意圖。 FIG. 1B is a schematic cross-sectional view taken along the line 1B-1B in FIG. 1A.

圖2是圖1B中的顯示面板在進行觸控感測時的剖面示意圖。 FIG. 2 is a schematic cross-sectional view of the display panel in FIG. 1B when performing touch sensing.

圖3A與圖3B是圖1B中的顯示面板在依據環境光進行螢幕亮度調變時的剖面示意圖。 3A and 3B are schematic cross-sectional views of the display panel in FIG. 1B when adjusting screen brightness according to ambient light.

圖4是本發明另一實施例的對向基板的剖面示意圖。 4 is a schematic cross-sectional view of an opposite substrate according to another embodiment of the invention.

在以下的內文中,將以相同的元件符號表示相同的元件。其次,為了清楚呈現本案的技術特徵,圖式中的元件(例如層、膜、基板以及區域等)的尺寸(例如長度、寬度、厚度與深度)會以不等比例的方式放大。因此,下文實施例的說明與解釋不受限於圖式中的元件所呈現的尺寸與形狀,而應涵蓋如實際製程及/或公差所導致的尺寸、形狀以及兩者的偏差。例如,圖式所示的平坦表面可以具有粗糙及/或非線性的特徵,而圖式所示的銳角可以是圓的。所以,本案圖式所呈示的元件主要是用於示意,並非旨在精準地描繪出元件的實際形狀,也非用於限制本案的申請專利範圍。 In the following text, the same element will be denoted by the same element symbol. Secondly, in order to clearly present the technical features of the present case, the dimensions (such as length, width, thickness, and depth) of elements (such as layers, films, substrates, and regions, etc.) in the drawings will be enlarged in unequal proportions. Therefore, the description and explanation of the following embodiments are not limited to the sizes and shapes presented by the elements in the drawings, but should cover the sizes, shapes, and deviations of the two due to actual manufacturing processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or non-linear characteristics, and the acute angle shown in the drawings may be round. Therefore, the elements presented in the drawings in this case are mainly for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of patent applications in this case.

其次,本案內容中所出現的「約」、「近似」或「實質上」等這類用字不僅涵蓋明確記載的數值與數值範圍,而且也涵蓋發明所屬技術領域中具有通常知識者所能理解的可允許偏差範圍,其中此偏差範圍可由測量時所產生的誤差來決定,而此誤差例如是起因於測量系統或製程條件兩者的限制。此外,「約」可表示在上述數值的一個或多個標準偏差內,例如±30%、±20%、±10%或±5%內。本案文中所出現的「約」、「近似」或「實質上」等這類用字可依光學性質、蝕刻性質、機械性質或其他性質來選擇可以接受的偏差範圍或標準偏差,並非單以一個標準偏差來套用以上光學性質、蝕刻性質、機械性質以及其他性質等所有性質。 Secondly, the words "about", "approximately", or "substantially" appearing in the content of this case not only cover the clearly stated values and range of values, but also include those with ordinary knowledge in the technical field to which the invention belongs. The allowable deviation range, which can be determined by the error generated during the measurement, and the error is caused by the limitation of both the measurement system or the process conditions, for example. In addition, "about" may be expressed within one or more standard deviations of the above values, such as within ±30%, ±20%, ±10%, or ±5%. The words "about", "approximately" or "substantially" appearing in this text can choose acceptable deviation range or standard deviation according to optical properties, etching properties, mechanical properties or other properties, not just one Standard deviation to apply all the above optical properties, etching properties, mechanical properties and other properties.

圖1A是本發明一實施例的顯示面板的俯視示意圖,而圖1B是圖1A中沿線1B-1B剖面所繪製的剖面示意圖,其中圖1B僅繪示出顯示面板100的局部剖面結構。請參閱圖1A與圖1B,顯示面板100包括對向基板200與控制基板300,其中對向基板200與控制基板300彼此面對面地配置,而控制基板300連接對向基板200。例如,對向基板200與控制基板300兩者可用框膠(未繪示)來彼此連接。 FIG. 1A is a schematic top view of a display panel according to an embodiment of the present invention, and FIG. 1B is a schematic cross-sectional view taken along the line 1B-1B in FIG. 1A, where FIG. 1B only shows a partial cross-sectional structure of the display panel 100. 1A and 1B, the display panel 100 includes a counter substrate 200 and a control substrate 300, wherein the counter substrate 200 and the control substrate 300 are arranged to face each other, and the control substrate 300 is connected to the counter substrate 200. For example, both the counter substrate 200 and the control substrate 300 can be connected to each other with a sealant (not shown).

對向基板200具有觸控感測與環境光感測的功能。詳細而言,對向基板200包括支撐板210、多個觸控感測墊220與至少一光感測層230,其中支撐板210可以是透明的。例如,支撐板210可以是玻璃板或藍寶石基板。支撐板210具有平面211,其面向控制基板300,而平面211具有顯示區A11以及位於顯示區A11周圍的非顯示區A12。這些觸控感測墊220與光感測層230皆形成於支撐板210的平面211上,並且皆可位於顯示區A11內。此外,觸控感測墊220可以配置於光感測層230與支撐板210的平面211之間,如圖1B所示。 The counter substrate 200 has functions of touch sensing and ambient light sensing. In detail, the counter substrate 200 includes a supporting plate 210, a plurality of touch sensing pads 220 and at least one light sensing layer 230, wherein the supporting plate 210 may be transparent. For example, the support plate 210 may be a glass plate or a sapphire substrate. The support plate 210 has a flat surface 211 facing the control substrate 300, and the flat surface 211 has a display area A11 and a non-display area A12 located around the display area A11. The touch-sensing pad 220 and the light-sensing layer 230 are both formed on the plane 211 of the support plate 210, and both can be located in the display area A11. In addition, the touch sensing pad 220 may be disposed between the light sensing layer 230 and the plane 211 of the support plate 210, as shown in FIG. 1B.

雖然圖1A未繪示光感測層230,而圖1B僅繪示一個光感測層230,但在本實施例中,至少兩個觸控感測墊220可各自位在對應的光感測層230與平面211之間。換句話說,至少兩個觸控感測墊220可以一對一地與至少兩個光感 測層230彼此堆疊。因此,對向基板200可以包括一個或至少兩個光感測層230,而圖1B中的單一個光感測層230並不限制對向基板200所包括的光感測層230的數量。此外,圖1A所示的八個觸控感測墊220也同樣不限制對向基板200所包括的觸控感測墊220的數量。 Although FIG. 1A does not show the light-sensing layer 230, and FIG. 1B only shows one light-sensing layer 230, in this embodiment, at least two touch-sensing pads 220 can each be located in the corresponding light-sensing layer. Between layer 230 and plane 211. In other words, at least two touch-sensing pads 220 can be in one-to-one contact with at least The measurement layers 230 are stacked on each other. Therefore, the opposite substrate 200 may include one or at least two light sensing layers 230, and the single light sensing layer 230 in FIG. 1B does not limit the number of the light sensing layers 230 included in the opposite substrate 200. In addition, the eight touch sensing pads 220 shown in FIG. 1A also do not limit the number of touch sensing pads 220 included in the counter substrate 200.

支撐板210還具有觸控表面212,其相對於平面211。在顯示面板100中,觸控表面212不僅可供使用者進行觸控操作,而且顯示面板100所產生的影像也會顯示於觸控表面212,即使用者可從觸控表面212觀賞顯示面板100所提供的影像,而從外界而來的環境光(繪示於後續圖式)會從觸控表面212進入支撐板210。這些觸控感測墊220皆為透明的。例如,這些觸控感測墊220可以是透明導電層,其可由氧化銦錫(Indium tin oxide,ITO)或氧化銦鋅(Indium Zinc Oxide)等透明導電氧化物(Transparent Conducting Oxides,TCO)所製成。 The support plate 210 also has a touch surface 212 which is opposite to the plane 211. In the display panel 100, the touch surface 212 is not only available for the user to perform touch operations, but also the image generated by the display panel 100 is displayed on the touch surface 212, that is, the user can view the display panel 100 from the touch surface 212 The provided image, and ambient light from outside (shown in subsequent drawings) enters the support plate 210 from the touch surface 212. These touch sensing pads 220 are all transparent. For example, the touch sensing pads 220 may be transparent conductive layers, which may be made of transparent conductive oxides (TCO) such as indium tin oxide (ITO) or indium zinc oxide (Indium Zinc Oxide). to make.

由於觸控感測墊220是透明的,因此環境光從觸控表面212進入後,可穿透觸控感測墊220而入射於光感測層230。如此,光感測層230能接收環境光,從而對環境光進行感測。光感測層230可具有光電效應的特性,並具有對光敏感的材料,例如富矽氧化物(Silicon-Rich Oxide,SRO)或矽材料,其中此矽材料可以是非晶矽、單晶矽或多晶矽。當外界的環境光照射於光感測層230時,光感測層230能產生光電子,其中光電子的數量會依據環境光的強度而改變。環境光的強度越高,光電子的數量越多。反之,環境光的強度越低,光電子的數量越少。 Since the touch sensing pad 220 is transparent, when ambient light enters from the touch surface 212, it can penetrate the touch sensing pad 220 and be incident on the light sensing layer 230. In this way, the light-sensing layer 230 can receive ambient light, thereby sensing the ambient light. The light-sensing layer 230 may have the characteristics of photoelectric effect, and have a material sensitive to light, such as silicon-rich oxide (SRO) or silicon material, wherein the silicon material may be amorphous silicon, single crystal silicon or Polycrystalline silicon. When external ambient light irradiates the light sensing layer 230, the light sensing layer 230 can generate photoelectrons, and the number of photoelectrons changes according to the intensity of the ambient light. The higher the intensity of ambient light, the greater the number of photoelectrons. Conversely, the lower the intensity of ambient light, the fewer the number of photoelectrons.

對向基板200還包括多個第一導電層241與至少一第二導電層242,其中這些第一導電層241與第二導電層242皆形成於支撐板210的平面211上。這些第一導電層241分別電連接這些觸控感測墊220,而光感測層230位於相鄰的第二導電層242與觸控感測墊220之間。第二導電層242電連接光感測層230,並能供應偏壓(bias)給光感測層230,以驅使上述光電子移動,從而形成光電流。 The counter substrate 200 further includes a plurality of first conductive layers 241 and at least one second conductive layer 242, wherein the first conductive layers 241 and the second conductive layers 242 are formed on the plane 211 of the support plate 210. The first conductive layers 241 are electrically connected to the touch sensing pads 220 respectively, and the light sensing layer 230 is located between the adjacent second conductive layer 242 and the touch sensing pad 220. The second conductive layer 242 is electrically connected to the photo-sensing layer 230 and can supply a bias to the photo-sensing layer 230 to drive the photoelectrons to move, thereby forming a photocurrent.

雖然圖1A未繪示第二導電層242,而圖1B僅繪示一個第二導電層242,但在本實施例中,對向基板200可包括多個第二導電層242與多個光感測層230,其中這些第二導電層242分別電連接這些光感測層230,而各個光感測層230位於相鄰的第二導電層242與觸控感測墊220之間。所以,圖1B中的單一個第二導電層242並不限制對向基板200所包括的第二導電層242的數量。 Although FIG. 1A does not show the second conductive layer 242, and FIG. 1B only shows one second conductive layer 242, in this embodiment, the opposite substrate 200 may include a plurality of second conductive layers 242 and a plurality of light sensing The sensing layer 230, wherein the second conductive layers 242 are electrically connected to the light sensing layers 230, respectively, and each light sensing layer 230 is located between the adjacent second conductive layer 242 and the touch sensing pad 220. Therefore, the single second conductive layer 242 in FIG. 1B does not limit the number of second conductive layers 242 included in the opposite substrate 200.

對向基板200可以還包括第一絕緣層251與第二絕緣層252,其中第一絕緣層251與第二絕緣層252皆形成於支撐板210的平面211上。第一絕緣層251與第二絕緣層252兩者可為氧化物層或氮化物層,例如氧化矽或氮化矽,而第一絕緣層251與第二絕緣層252兩者構成材料可以相同或不同。第一絕緣層251覆蓋這些觸控感測墊220與這些光感測層230,而第二絕緣層252覆蓋第一絕緣層251。各個第一導電層241的一部分可形成於第一絕緣層251與第二絕緣層252之間,而各個第一導電層241的另一部分會穿過第一絕緣層251而電連接觸控感測墊220,如圖1B所示。第二導電層242配置於第二絕緣層252上,並依序穿過第二絕緣層252與第一絕緣層251而電連接光感測層230。 The opposite substrate 200 may further include a first insulating layer 251 and a second insulating layer 252, wherein the first insulating layer 251 and the second insulating layer 252 are both formed on the plane 211 of the support plate 210. Both the first insulating layer 251 and the second insulating layer 252 may be oxide layers or nitride layers, such as silicon oxide or silicon nitride, and the first insulating layer 251 and the second insulating layer 252 may be made of the same material or different. The first insulating layer 251 covers the touch sensing pads 220 and the light sensing layers 230, and the second insulating layer 252 covers the first insulating layer 251. A part of each first conductive layer 241 may be formed between the first insulating layer 251 and the second insulating layer 252, and another part of each first conductive layer 241 may pass through the first insulating layer 251 to be electrically connected to the touch sensing Pad 220, as shown in FIG. 1B. The second conductive layer 242 is disposed on the second insulating layer 252 and sequentially passes through the second insulating layer 252 and the first insulating layer 251 to be electrically connected to the light sensing layer 230.

對向基板200還包括多個配置於非顯示區A12內的導電接墊260,而控制基板300包括多個導電凸塊360。這些導電凸塊360可分別對準這些導電接墊260,並接觸這些導電接墊260。例如,這些導電凸塊360可以一對一地對準及接觸這些導電接墊260。如此,這些導電凸塊360分別與這些導電接墊260電性導通,以使控制基板300能經由這些導電接墊260而電連接對向基板200。 The opposite substrate 200 further includes a plurality of conductive pads 260 disposed in the non-display area A12, and the control substrate 300 includes a plurality of conductive bumps 360. The conductive bumps 360 can be aligned with the conductive pads 260 and contact the conductive pads 260 respectively. For example, the conductive bumps 360 can be aligned and contacted with the conductive pads 260 one-to-one. As such, the conductive bumps 360 are electrically connected to the conductive pads 260 respectively, so that the control substrate 300 can be electrically connected to the counter substrate 200 via the conductive pads 260.

多個導電接墊260電連接這些第一導電層241,以使這些第一導電層241能電連接這些導電接墊260與這些觸控感測墊220,其中導電接墊260可以穿透第二絕緣層252而電連接第一導電層241。在本實施例中,利用這些第一導電層241,多個導電接墊260可以一對一地電連接這些觸控感測墊220,但這種導電 接墊260與觸控感測墊220之間的電連接方式不用於限制其他實施例,如圖1B所示。 A plurality of conductive pads 260 are electrically connected to the first conductive layers 241, so that the first conductive layers 241 can electrically connect the conductive pads 260 and the touch sensing pads 220, wherein the conductive pads 260 can penetrate the second The insulating layer 252 is electrically connected to the first conductive layer 241. In this embodiment, using the first conductive layers 241, a plurality of conductive pads 260 can be electrically connected to the touch-sensing pads 220 one-to-one, but such conductive The electrical connection between the pad 260 and the touch sensing pad 220 is not used to limit other embodiments, as shown in FIG. 1B.

須說明的是,在至少一實施例中,一些導電接墊260可以分別電連接所有第一導電層241,但其他導電接墊260並不電連接第一導電層241。也就是說,不是每一個導電接墊260都會電連接第一導電層241與觸控感測墊220。此外,導電接墊260的數量可以相等於導電凸塊360的數量,但導電接墊260的數量可以大於觸控感測墊220的數量。 It should be noted that, in at least one embodiment, some conductive pads 260 may be electrically connected to all the first conductive layers 241, but other conductive pads 260 are not electrically connected to the first conductive layer 241. That is to say, not every conductive pad 260 will electrically connect the first conductive layer 241 and the touch sensing pad 220. In addition, the number of conductive pads 260 may be equal to the number of conductive bumps 360, but the number of conductive pads 260 may be greater than the number of touch sensing pads 220.

第一導電層241可以是金屬層,並具有良好的導電率。當金屬製成的第一導電層241的導電率比透明導電氧化物製成的觸控感測墊220的導電率高時,第一導電層241的阻抗會低於觸控感測墊220的阻抗,以利於傳遞由觸控感測墊220所產生的觸控訊號,有助於保持觸控訊號的完整。 The first conductive layer 241 may be a metal layer, and has good conductivity. When the conductivity of the first conductive layer 241 made of metal is higher than that of the touch sensing pad 220 made of transparent conductive oxide, the impedance of the first conductive layer 241 will be lower than that of the touch sensing pad 220 The impedance facilitates the transmission of the touch signal generated by the touch sensing pad 220, and helps to maintain the integrity of the touch signal.

請參閱圖1B,顯示面板100可以是液晶顯示面板(Liquid Crystal Display Panel,LCD Panel)、有機發光二極體(Organic Light-Emitting Diode,OLED)顯示面板或微型發光二極體(micro-LED,μLED)顯示面板,而在圖1B所示的實施例中,顯示面板100是以有機發光二極體(OLED)顯示面板作為舉例說明。因此,在此先強調,圖1B僅用於舉例說明,而顯示面板100不限制只能是有機發光二極體顯示面板。 1B, the display panel 100 may be a liquid crystal display panel (Liquid Crystal Display Panel, LCD Panel), an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel or a micro-LED, μLED) display panel, and in the embodiment shown in FIG. 1B, the display panel 100 is an organic light emitting diode (OLED) display panel as an example. Therefore, it is emphasized here that FIG. 1B is for illustration only, and the display panel 100 is not limited to an organic light-emitting diode display panel.

在顯示面板100中,控制基板300還包括承載板310、形成在承載板310上的緩衝層(buffer layer)314,其中緩衝層314可全面性地覆蓋承載板310。控制基板300還包括多個通道層320、多個墊層321以及第一閘極絕緣層351。由於圖1B僅繪示出顯示面板100的局部剖面結構,因此圖1B僅畫出一個通道層320與一個墊層321。然而,在實際情況中,控制基板300包括多個通道層320與多個墊層321。這些通道層320、這些墊層321與第一閘極絕緣層351皆形成在緩衝層314上,其中通道層320與墊層321可由同一層半導體層經微影與蝕刻後而形成。 In the display panel 100, the control substrate 300 further includes a carrier board 310, and a buffer layer 314 formed on the carrier board 310, wherein the buffer layer 314 can cover the carrier board 310 in its entirety. The control substrate 300 further includes a plurality of channel layers 320, a plurality of pad layers 321, and a first gate insulating layer 351. Since FIG. 1B only shows a partial cross-sectional structure of the display panel 100, FIG. 1B only shows one channel layer 320 and one cushion layer 321. However, in an actual situation, the control substrate 300 includes a plurality of channel layers 320 and a plurality of pad layers 321. The channel layer 320, the pad layer 321 and the first gate insulating layer 351 are all formed on the buffer layer 314, wherein the channel layer 320 and the pad layer 321 can be formed by lithography and etching of the same semiconductor layer.

控制基板300還包括多個閘極341、多個墊層341b與第二閘極絕緣層352。礙於圖1B僅繪示出顯示面板100的局部剖面結構,所以圖1B僅繪示一個閘極341與一個墊層341b。這些閘極341、這些墊層341b與第二閘極絕緣層352皆形成於第一閘極絕緣層351上,其中第二閘極絕緣層352可覆蓋這些閘極341、這些墊層341b與第一閘極絕緣層351,而閘極341與墊層341b可由同一層金屬層經微影與蝕刻後而形成。 The control substrate 300 further includes a plurality of gate electrodes 341, a plurality of pad layers 341b and a second gate insulating layer 352. Since FIG. 1B only shows a partial cross-sectional structure of the display panel 100, FIG. 1B only shows one gate electrode 341 and one pad layer 341b. The gate electrodes 341, the pad layers 341b and the second gate insulating layer 352 are all formed on the first gate insulating layer 351, wherein the second gate insulating layer 352 can cover the gate electrodes 341, the pad layers 341b and the first A gate insulating layer 351, and the gate 341 and the pad layer 341b can be formed by lithography and etching of the same metal layer.

控制基板300還包括多個層間金屬層(interlayer metal layer)369與層間絕緣層(interlayer dielectric layer)353,而在圖1B所示的顯示面板100的局部剖面結構中,圖1B僅繪示一個層間金屬層369,但實際的控制基板300是包括多個層間金屬層369。這些層間金屬層369與層間絕緣層353皆形成於第二閘極絕緣層352上,其中層間絕緣層353覆蓋這些層間金屬層369與第二閘極絕緣層352。 The control substrate 300 further includes a plurality of interlayer metal layers (interlayer metal layer) 369 and interlayer dielectric layers (interlayer dielectric layer) 353. In the partial cross-sectional structure of the display panel 100 shown in FIG. 1B, FIG. 1B only shows one interlayer The metal layer 369, but the actual control substrate 300 includes a plurality of interlayer metal layers 369. The interlayer metal layer 369 and the interlayer insulating layer 353 are formed on the second gate insulating layer 352, wherein the interlayer insulating layer 353 covers the interlayer metal layer 369 and the second gate insulating layer 352.

控制基板300還包括多個墊層342b、多個源極342s、多個汲極342d以及平坦層354。雖然圖1B所示的控制基板300所包括的墊層342b、源極342s與汲極342d三者個別的數量皆為一個,但實際的控制基板300是包括多個墊層342b、多個源極342s以及多個汲極342d。平坦層354與這些墊層342b形成於層間絕緣層353上,而平坦層354覆蓋這些墊層342b、這些源極342s與這些汲極342d。此外,這些墊層342b、這些源極342s與這些汲極342d可由同一個金屬材料經微影與蝕刻後而形成,其中此金屬材料可用物理氣相沉積(Physical Vapor Deposition,PVD)來生成,而前述物理氣相沉積例如是濺鍍或蒸鍍。 The control substrate 300 further includes a plurality of pad layers 342b, a plurality of source electrodes 342s, a plurality of drain electrodes 342d, and a flat layer 354. Although the control substrate 300 shown in FIG. 1B includes the pad layer 342b, the source electrode 342s, and the drain electrode 342d, the number of each is one, but the actual control substrate 300 includes a plurality of pad layers 342b, a plurality of source electrodes 342s and multiple drains 342d. The flat layer 354 and the pad layers 342b are formed on the interlayer insulating layer 353, and the flat layer 354 covers the pad layers 342b, the source electrodes 342s, and the drain electrodes 342d. In addition, the pad layers 342b, the source electrodes 342s and the drain electrodes 342d can be formed by lithography and etching of the same metal material, where the metal material can be generated by physical vapor deposition (PVD), and The aforementioned physical vapor deposition is, for example, sputtering or evaporation.

各個源極342s的一部分形成在平坦層354與層間絕緣層353之間,而各個源極342s的其他部分則穿過層間絕緣層353、第二閘極絕緣層352與第一閘極絕緣層351而電連接通道層320。同樣地,各個汲極342d的一部分形成在平坦層354與層間絕緣層353之間,而各個汲極342d的其他部分則穿過層間絕緣層353、第二閘極絕緣層352與第一閘極絕緣層351而電連接通道層320,其中層間絕緣層 353、第二閘極絕緣層352與第一閘極絕緣層351是利用蝕刻而形成多個孔洞(未標示),而源極342s與汲極342d可分別延伸至這些孔洞,並經由這些孔洞而穿過層間絕緣層353、第二閘極絕緣層352與第一閘極絕緣層351。 A part of each source 342s is formed between the flat layer 354 and the interlayer insulating layer 353, and the other part of each source 342s passes through the interlayer insulating layer 353, the second gate insulating layer 352, and the first gate insulating layer 351 Whereas, the channel layer 320 is electrically connected. Similarly, a portion of each drain 342d is formed between the flat layer 354 and the interlayer insulating layer 353, while the other portion of each drain 342d passes through the interlayer insulating layer 353, the second gate insulating layer 352, and the first gate The insulating layer 351 is electrically connected to the channel layer 320, in which the interlayer insulating layer 353. The second gate insulating layer 352 and the first gate insulating layer 351 are formed by etching to form a plurality of holes (not shown), and the source electrode 342s and the drain electrode 342d can extend to the holes and pass through the holes. Through the interlayer insulating layer 353, the second gate insulating layer 352 and the first gate insulating layer 351.

閘極341位於相鄰的汲極342d與源極342s之間,如圖1B所示。由於閘極341位於相鄰的汲極342d與源極342s之間,汲極342d與源極342s皆電連接通道層320,且第二閘極絕緣層352夾置於閘極341與通道層320之間,因此閘極341、汲極342d、源極342s以及通道層320能形成場效電晶體(Field-Effect Transistor,FET)。 The gate electrode 341 is located between the adjacent drain electrode 342d and source electrode 342s, as shown in FIG. 1B. Since the gate electrode 341 is located between the adjacent drain electrode 342d and the source electrode 342s, the drain electrode 342d and the source electrode 342s are both electrically connected to the channel layer 320, and the second gate insulating layer 352 is sandwiched between the gate electrode 341 and the channel layer 320 Therefore, the gate electrode 341, the drain electrode 342d, the source electrode 342s, and the channel layer 320 can form a field-effect transistor (FET).

在圖1B所示的顯示面板100的局部剖面結構中,控制基板300還包括導電層343、墊層343b、導電圖案層344、有機發光層370、陰極345以及畫素定義層356,其中在實際情況中,控制基板300所包括的導電層343、墊層343b與有機發光層370三者個別的數量皆為多個。墊層343b、導電圖案層344、有機發光層370、陰極345以及畫素定義層356皆形成在平坦層354上,其中導電層343一部分形成在平坦層354上,而導電層343其他部分則穿過平坦層354而電連接汲極342d。平坦層354具有多個孔洞(未標示),而導電層343可經由此孔洞而穿過平坦層354,其中這些孔洞可利用蝕刻而形成。此外,控制基板300還可包括多個間隔件390,其中這些間隔件390配置於畫素定義層356上,並可由光阻製成。 In the partial cross-sectional structure of the display panel 100 shown in FIG. 1B, the control substrate 300 further includes a conductive layer 343, a pad layer 343b, a conductive pattern layer 344, an organic light-emitting layer 370, a cathode 345, and a pixel definition layer 356. In this case, the number of the conductive layer 343, the pad layer 343b, and the organic light-emitting layer 370 included in the control substrate 300 are multiple. The pad layer 343b, the conductive pattern layer 344, the organic light emitting layer 370, the cathode 345, and the pixel definition layer 356 are all formed on the flat layer 354, wherein a part of the conductive layer 343 is formed on the flat layer 354, and the other part of the conductive layer 343 is worn The drain electrode 342d is electrically connected through the flat layer 354. The flat layer 354 has a plurality of holes (not labeled), and the conductive layer 343 can pass through the flat layer 354 through the holes, wherein the holes can be formed by etching. In addition, the control substrate 300 may further include a plurality of spacers 390, wherein the spacers 390 are disposed on the pixel definition layer 356, and may be made of photoresist.

導電圖案層344可由同一層導電層經微影與蝕刻後而形成,並可包括多個墊層361與多個陽極344a(圖1B繪示一個墊層361與一個陽極344a)。陽極344a形成於導電層343上,並電連接導電層343。由於導電層343電連接汲極342d,因此陽極344a可經由導電層343而電連接汲極342d。有機發光層370形成在陽極344a,並且具有有機發光二極體的結構,而陰極345形成在有機發光層370上,以使有機發光層370形成在陰極345與陽極344a之間。有機發光層370電連接陽極344a,而陽極344a電連接汲極342d,因此由閘極341、汲極342d、源極342s 與通道層320所形成的場效電晶體能電連接有機發光層370與陽極344a,並能控制有機發光層370的發光,以使顯示面板100得以顯示影像。 The conductive pattern layer 344 may be formed by lithography and etching of the same conductive layer, and may include a plurality of pad layers 361 and a plurality of anodes 344a (FIG. 1B shows one pad layer 361 and one anode 344a). The anode 344a is formed on the conductive layer 343, and is electrically connected to the conductive layer 343. Since the conductive layer 343 is electrically connected to the drain electrode 342d, the anode 344a may be electrically connected to the drain electrode 342d via the conductive layer 343. The organic light emitting layer 370 is formed on the anode 344a and has an organic light emitting diode structure, and the cathode 345 is formed on the organic light emitting layer 370 so that the organic light emitting layer 370 is formed between the cathode 345 and the anode 344a. The organic light-emitting layer 370 is electrically connected to the anode 344a, and the anode 344a is electrically connected to the drain 342d, so the gate 341, the drain 342d, and the source 342s The field effect transistor formed with the channel layer 320 can electrically connect the organic light emitting layer 370 and the anode 344a, and can control the light emission of the organic light emitting layer 370, so that the display panel 100 can display an image.

畫素定義層356具有多個開口H56(圖1B僅繪示一個),而這些有機發光層370分別配置在這些開口H56中。這些開口H56會延伸至陽極344a,以使畫素定義層356局部覆蓋陽極344a,不完全覆蓋陽極344a,讓開口H56內的有機發光層370得以電連接陽極344a。此外,陰極345也會延伸至開口H56內部,以電連接有機發光層370,讓有機發光層370能位在陰極345與陽極344a之間,並且電連接陰極345與陽極344a。 The pixel definition layer 356 has a plurality of openings H56 (only one is shown in FIG. 1B), and the organic light-emitting layers 370 are respectively disposed in the openings H56. These openings H56 extend to the anode 344a, so that the pixel definition layer 356 partially covers the anode 344a, but not completely covers the anode 344a, so that the organic light-emitting layer 370 in the opening H56 can be electrically connected to the anode 344a. In addition, the cathode 345 also extends into the opening H56 to electrically connect the organic light-emitting layer 370 so that the organic light-emitting layer 370 can be positioned between the cathode 345 and the anode 344a, and electrically connect the cathode 345 and the anode 344a.

平坦層354可具有多個凸塊354b,而這些凸塊354b會凸出於畫素定義層356。這些墊層343b與這些墊層361分別形成於這些凸塊354b上,並且覆蓋這些凸塊354b,其中墊層343b夾置於墊層361與凸塊354b之間,而這些凸塊354b、這些墊層343b與這些墊層361能形成多個導電凸塊360。墊層361可電連接控制基板300內的線路,例如導電層343,以使導電凸塊360與導電接墊260電性導通。如此,利用這些導電接墊260與這些導電凸塊360,對向基板200可以電連接控制基板300,而觸控訊號能從對向基板200經由導電接墊260與導電凸塊360而傳遞至控制基板300。 The flat layer 354 may have a plurality of bumps 354b, and these bumps 354b will protrude from the pixel definition layer 356. The pad layers 343b and the pad layers 361 are respectively formed on the bumps 354b and cover the bumps 354b, wherein the pad layer 343b is sandwiched between the pad layers 361 and the bumps 354b, and the bumps 354b, the pads The layer 343b and the pad layers 361 can form a plurality of conductive bumps 360. The pad layer 361 can be electrically connected to the circuit in the control substrate 300, such as the conductive layer 343, so that the conductive bump 360 and the conductive pad 260 are electrically connected. In this way, by using the conductive pads 260 and the conductive bumps 360, the opposite substrate 200 can be electrically connected to the control substrate 300, and touch signals can be transferred from the opposite substrate 200 to the control via the conductive pads 260 and the conductive bumps 360 Substrate 300.

圖2是圖1B中的顯示面板在進行觸控感測時的剖面示意圖。請參閱圖1B與圖2,顯示面板100能電連接訊號處理單元20,其中訊號處理單元20可電連接控制基板300,並具有處理觸控感測墊220所產生的觸控訊號的功能。例如,訊號處理單元20可以是觸控顯示驅動元件(Touch and Display Driver Integration,TDDI),但這不限制訊號處理單元20的種類。訊號處理單元20可直接裝設(mounted)在控制基板300上,或是經由電連接器(未繪示)而連接於控制基板300,其中此電連接器例如是軟性印刷電路板(Flexible Printed Circuit,FPC)。 FIG. 2 is a schematic cross-sectional view of the display panel in FIG. 1B when performing touch sensing. Please refer to FIGS. 1B and 2, the display panel 100 can be electrically connected to the signal processing unit 20, wherein the signal processing unit 20 can be electrically connected to the control substrate 300 and has a function of processing touch signals generated by the touch sensing pad 220. For example, the signal processing unit 20 may be a Touch and Display Driver Integration (TDDI), but this does not limit the type of the signal processing unit 20. The signal processing unit 20 can be directly mounted on the control substrate 300 or connected to the control substrate 300 via an electrical connector (not shown), wherein the electrical connector is, for example, a flexible printed circuit board (Flexible Printed Circuit) , FPC).

當有物件,例如圖2所示的手10或觸控筆(stylus),接觸對向基板200的觸控表面212時,物件(例如手10)與其正下方的觸控感測墊220之間會形成電容,以使此觸控感測墊220能產生觸控訊號。由於導電凸塊360與導電接墊260電性導通,因此上述觸控訊號可依序經由第一導電層241、導電接墊260與導電凸塊360而傳遞至控制基板300。訊號處理單元20可從控制基板300接收觸控訊號,並對觸控訊號進行處理。如此,訊號處理單元20能從觸控訊號得知物件(例如手10)在觸控表面212上的所在位置,從而讓使用者能觸控操作顯示面板100。 When an object, such as the hand 10 or stylus shown in FIG. 2, touches the touch surface 212 of the opposite substrate 200, the object (such as the hand 10) and the touch sensing pad 220 directly below it Capacitors are formed so that the touch sensing pad 220 can generate touch signals. Since the conductive bump 360 and the conductive pad 260 are electrically connected, the above-mentioned touch signal can be sequentially transmitted to the control substrate 300 through the first conductive layer 241, the conductive pad 260 and the conductive bump 360. The signal processing unit 20 can receive the touch signal from the control substrate 300 and process the touch signal. In this way, the signal processing unit 20 can know the position of the object (such as the hand 10) on the touch surface 212 from the touch signal, so that the user can touch and operate the display panel 100.

須說明的是,在本實施例中,觸控感測墊220可以電連接光感測層230。例如,觸控感測墊220與光感測層230可以因為兩者之間的接觸而彼此電連接。當這些觸控感測墊220進行觸控感測時,這些第二導電層242會停止供應偏壓給這些光感測層230,以避免被光感測層230所產生的光電流干擾。反之,當這些觸控感測墊220未進行觸控感測時,這些第二導電層242供應偏壓給這些光感測層230,以感測環境光的強度,讓訊號處理單元20能依據環境光的強度來調亮或調暗(dimming)顯示面板100的螢幕亮度。 It should be noted that, in this embodiment, the touch sensing pad 220 may be electrically connected to the light sensing layer 230. For example, the touch sensing pad 220 and the light sensing layer 230 may be electrically connected to each other due to the contact between the two. When the touch-sensing pads 220 perform touch sensing, the second conductive layers 242 stop supplying bias to the light-sensing layers 230 to avoid interference by the photocurrent generated by the light-sensing layer 230. Conversely, when the touch-sensing pads 220 are not touch-sensing, the second conductive layers 242 supply bias to the light-sensing layers 230 to sense the intensity of ambient light, so that the signal processing unit 20 can The intensity of the ambient light is used to brighten or dimme the screen brightness of the display panel 100.

具體而言,在這些觸控感測墊220進行觸控感測的過程中,訊號處理單元20是在一段週期時間內掃描這些觸控感測墊220。在相鄰兩個週期時間之間的間隔(interval)中,訊號處理單元20可以暫停掃描觸控感測墊220。此時,第二導電層242可供應偏壓給光感測層230,以對環境光的強度進行感測。第二導電層242可以是在經過至少一個週期時間之後供應偏壓給光感測層230。例如,第二導電層242可以是在每經過一、二、三或四個週期時間之後,供應偏壓給光感測層230。此外,光感測層230感測環境光強度的所需時間可以約在10微秒至100微秒之間,但光感測層230感測環境光強度的所需時間也可在其他時間範圍,即上述的時間範圍並不用於限制光感測層230對環境光強度的感測。 Specifically, during the touch sensing process of the touch sensing pads 220, the signal processing unit 20 scans the touch sensing pads 220 within a period of time. In the interval between two adjacent cycle times, the signal processing unit 20 may suspend scanning the touch sensing pad 220. At this time, the second conductive layer 242 may supply a bias voltage to the light sensing layer 230 to sense the intensity of ambient light. The second conductive layer 242 may supply a bias voltage to the light sensing layer 230 after at least one cycle time has passed. For example, the second conductive layer 242 may supply a bias voltage to the light sensing layer 230 after one, two, three, or four cycle times have passed. In addition, the time required for the light sensing layer 230 to sense the ambient light intensity may be between about 10 microseconds and 100 microseconds, but the time required for the light sensing layer 230 to sense the ambient light intensity may also be in other time ranges That is, the above time range is not used to limit the sensing of the ambient light intensity by the light sensing layer 230.

圖3A與圖3B是圖1B中的顯示面板在進行環境光調變時的剖面示意圖,其中圖3A繪示處於明亮環境下的顯示面板100,而圖3B繪示處於昏暗環境下的顯示面板100。請參閱圖3A,當顯示面板100處於明亮環境時,從外界而來的環境光LH3在穿透支撐板210與觸控感測墊220後入射於光感測層230,其中環境光LH3具有較高的強度,所以光感測層230能被環境光LH3激發出較多的光電子。 3A and 3B are schematic cross-sectional views of the display panel in FIG. 1B when ambient light is adjusted, wherein FIG. 3A illustrates the display panel 100 in a bright environment, and FIG. 3B illustrates the display panel 100 in a dim environment. . Referring to FIG. 3A, when the display panel 100 is in a bright environment, ambient light LH3 from the outside is incident on the light sensing layer 230 after penetrating the support plate 210 and the touch sensing pad 220, wherein the ambient light LH3 has a relatively With high intensity, the light sensing layer 230 can be excited by ambient light LH3 with more photoelectrons.

此時,光感測層230從第二導電層242所接收到的偏壓能驅使這些光電子,以產生較大的光電流I21,其中光電流I21會依序經過觸控感測墊220、第一導電層241、導電接墊260以及導電凸塊360(請參考圖1B)而傳遞至控制基板300,並且形成環境光訊號。訊號處理單元20接收及處理環境光訊號,並依據此環境光訊號來調整顯示面板100的螢幕亮度。在圖3A所示的實施例中,由於環境光LH3具有較高的強度,因此訊號處理單元20可以調亮顯示面板100的螢幕亮度,以提升在高環境光強度下的螢幕對比度。 At this time, the bias voltage received by the light-sensing layer 230 from the second conductive layer 242 can drive these photoelectrons to generate a larger photocurrent I21, wherein the photocurrent I21 will sequentially pass through the touch-sensing pad 220, the first A conductive layer 241, a conductive pad 260, and a conductive bump 360 (please refer to FIG. 1B) are transferred to the control substrate 300, and an ambient light signal is formed. The signal processing unit 20 receives and processes the ambient light signal, and adjusts the screen brightness of the display panel 100 according to the ambient light signal. In the embodiment shown in FIG. 3A, since the ambient light LH3 has a high intensity, the signal processing unit 20 can brighten the screen brightness of the display panel 100 to improve the screen contrast under high ambient light intensity.

請參閱圖3B,當顯示面板100處於昏暗環境時,具有較低強度的環境光LL3在穿透支撐板210與觸控感測墊220後入射於光感測層230,所以光感測層230能被環境光LH3激發出較少的光電子,以至於接收偏壓的光感測層230會產生較小的光電流I21,其也會依序經過觸控感測墊220、第一導電層241、導電接墊260以及導電凸塊360(請參考圖1B)而傳遞至控制基板300,並形成環境光訊號。訊號處理單元20接收及處理此環境光訊號,並依據此環境光訊號來調整顯示面板100的螢幕亮度。在圖3B所示的實施例中,由於環境光LL3具有較低的強度,因此訊號處理單元20可以調暗顯示面板100的螢幕亮度,以節省顯示面板100所需之電力。 Referring to FIG. 3B, when the display panel 100 is in a dim environment, ambient light LL3 having a lower intensity is incident on the light sensing layer 230 after penetrating the support plate 210 and the touch sensing pad 220, so the light sensing layer 230 Less photoelectrons can be excited by the ambient light LH3, so that the light-sensing layer 230 that receives the bias voltage will generate a smaller photocurrent I21, which will also pass through the touch-sensing pad 220 and the first conductive layer 241 in sequence , The conductive pad 260 and the conductive bump 360 (please refer to FIG. 1B) are transferred to the control substrate 300, and an ambient light signal is formed. The signal processing unit 20 receives and processes the ambient light signal, and adjusts the screen brightness of the display panel 100 according to the ambient light signal. In the embodiment shown in FIG. 3B, since the ambient light LL3 has a low intensity, the signal processing unit 20 can dim the screen brightness of the display panel 100 to save the power required by the display panel 100.

特別一提的是,在圖3A與圖3B所示的實施例中,當顯示面板100在進行環境光調變時,這些觸控感測墊220不會進行觸控感測,即訊號處理單元20 會暫停掃描這些觸控感測墊220,直到第二導電層242暫停供應偏壓給光感測層230,以避免干擾光感測層230對環境光(例如環境光LH3或LL3)的感測。 In particular, in the embodiments shown in FIGS. 3A and 3B, when the display panel 100 is undergoing ambient light modulation, the touch sensing pads 220 will not perform touch sensing, that is, the signal processing unit 20 Scanning the touch sensing pads 220 will be suspended until the second conductive layer 242 suspends the supply of the bias voltage to the light sensing layer 230 to avoid interference with the light sensing layer 230's sensing of ambient light (such as ambient light LH3 or LL3) .

圖4是本發明另一實施例的對向基板的剖面示意圖。請參閱圖4,本實施例的對向基板400與前述實施例的對向基板200相似,而且對向基板400也可連接於控制基板300或其他種類的控制基板以形成顯示面板,例如液晶顯示面板(LCD Panel)、有機發光二極體顯示面板或微型發光二極體顯示面板。對向基板400與對向基板200兩者之間的主要差異在於:對向基板400沒有金屬製的第一導電層241,而對向基板400所包括的多個第一導電層441以及多個觸控感測墊220皆由透明導電層所製成。 4 is a schematic cross-sectional view of an opposite substrate according to another embodiment of the invention. Referring to FIG. 4, the counter substrate 400 of this embodiment is similar to the counter substrate 200 of the previous embodiment, and the counter substrate 400 can also be connected to the control substrate 300 or other types of control substrates to form a display panel, such as a liquid crystal display LCD panel, organic light-emitting diode display panel or miniature light-emitting diode display panel. The main difference between the counter substrate 400 and the counter substrate 200 is that the counter substrate 400 does not have a first conductive layer 241 made of metal, and the counter substrate 400 includes a plurality of first conductive layers 441 and a plurality of The touch sensing pads 220 are all made of transparent conductive layers.

在本實施例中,上述透明導電層可以是透明導電氧化物,例如氧化銦錫(ITO)或氧化銦鋅(IZO),但不限制透明導電層只能是透明導電氧化物。第一導電層441與觸控感測墊220可以是由同一層透明導電氧化物經微影與蝕刻後而形成,因此第一導電層441與觸控感測墊220可以是一體成型(be integrally formed into one)。換句話說,第一導電層441與觸控感測墊220兩者不僅是用相同材料(即透明導電層)所製成,而且第一導電層441與觸控感測墊220之間也沒有形成明顯的界面(boundary)。 In this embodiment, the transparent conductive layer may be a transparent conductive oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO), but the transparent conductive layer is not limited to a transparent conductive oxide. The first conductive layer 441 and the touch sensing pad 220 may be formed by the same layer of transparent conductive oxide after lithography and etching, so the first conductive layer 441 and the touch sensing pad 220 may be integrally formed (be integrally formed into one). In other words, both the first conductive layer 441 and the touch-sensing pad 220 are not only made of the same material (ie, transparent conductive layer), but also between the first conductive layer 441 and the touch-sensing pad 220 Form an obvious boundary.

綜上所述,在以上實施例所揭露的顯示面板中,由於對向基板包括觸控感測墊與光感測層,因此對向基板不僅能觸控感測物件(例如手10或觸控筆)的所在位置,而且還能感測環境光的強度,以使顯示面板具有觸控以及依據環境光調變螢幕亮度的功能。 In summary, in the display panel disclosed in the above embodiments, since the counter substrate includes the touch sensing pad and the light sensing layer, the counter substrate can not only touch the sensing object (such as the hand 10 or touch The location of the pen), and can also sense the intensity of the ambient light, so that the display panel has functions of touch control and screen brightness adjustment according to the ambient light.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不脫離本發明精神和範圍內,當可作些許更動與潤飾,因此本發明保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection of invention shall be subject to the scope defined in the appended patent application.

20:訊號處理單元 20: signal processing unit

100:顯示面板 100: display panel

200:對向基板 200: counter substrate

210:支撐板 210: support plate

211:平面 211: Flat

212:觸控表面 212: Touch surface

220:觸控感測墊 220: Touch sensing pad

230:光感測層 230: Light sensing layer

241:第一導電層 241: first conductive layer

242:第二導電層 242: second conductive layer

251:第一絕緣層 251: first insulating layer

252:第二絕緣層 252: Second insulating layer

I21:光電流 I21: Photocurrent

LH3:環境光 LH3: ambient light

Claims (11)

一種顯示面板的對向基板,包括:一支撐板,具有一平面;多個觸控感測墊,形成於該支撐板的該平面上,且該些觸控感測墊皆為透明的;多個第一導電層,形成於該支撐板的該平面上,並分別電連接該些觸控感測墊;至少一光感測層,形成於該支撐板的該平面上;以及至少一第二導電層,電連接該至少一光感測層。 A counter substrate of a display panel, comprising: a support board with a plane; a plurality of touch sensing pads formed on the plane of the support board, and the touch sensing pads are all transparent; A first conductive layer formed on the plane of the support plate and electrically connected to the touch sensing pads; at least one light-sensing layer formed on the plane of the support plate; and at least a second The conductive layer is electrically connected to the at least one light sensing layer. 如請求項第1項所述的對向基板,還包括:一第一絕緣層,形成於該支撐板的該平面上,並覆蓋該些觸控感測墊與該至少一光感測層;以及一第二絕緣層,形成於該支撐板的該平面上,並覆蓋該第一絕緣層,其中該至少一第二導電層配置於該第二絕緣層上,並依序穿過該第二絕緣層與該第一絕緣層而電連接該至少一光感測層。 The counter substrate of claim 1, further comprising: a first insulating layer formed on the plane of the support plate and covering the touch sensing pads and the at least one light sensing layer; And a second insulating layer formed on the plane of the support plate and covering the first insulating layer, wherein the at least one second conductive layer is disposed on the second insulating layer and sequentially passes through the second The insulating layer and the first insulating layer are electrically connected to the at least one light sensing layer. 如請求項第2項所述的對向基板,其中各該第一導電層的一部分形成於該第一絕緣層與該第二絕緣層之間。 The counter substrate of claim 2, wherein a part of each first conductive layer is formed between the first insulating layer and the second insulating layer. 如請求項第1項所述的對向基板,還包括:多個導電接墊,電連接該些第一導電層,其中該平面具有一顯示區以及一位於該顯示區周圍的非顯示區,而該些導電接墊配置於該非顯示區內。 The counter substrate of claim 1, further comprising: a plurality of conductive pads electrically connected to the first conductive layers, wherein the plane has a display area and a non-display area around the display area, The conductive pads are arranged in the non-display area. 如請求項第1項所述的對向基板,其中該些第一導電層與該些觸控感測墊皆由透明導電層所製成。 The counter substrate of claim 1, wherein the first conductive layers and the touch sensing pads are made of transparent conductive layers. 如請求項第1項所述的對向基板,其中當該些觸控感測墊未進行觸控感測時,該至少一第二導電層供應偏壓給該至少一光感測層;當該些觸控感測墊進行觸控感測時,該至少一第二導電層停止供應偏壓給該至少一光感測層。 The counter substrate of claim 1, wherein when the touch sensing pads are not touch-sensed, the at least one second conductive layer supplies a bias voltage to the at least one light-sensing layer; when When the touch sensing pads perform touch sensing, the at least one second conductive layer stops supplying the bias voltage to the at least one light sensing layer. 如請求項第1項所述的對向基板,其中各該至少一光感測層位於相鄰的該至少一第二導電層與該觸控感測墊之間。 The counter substrate according to claim 1, wherein each of the at least one light sensing layer is located between the adjacent at least one second conductive layer and the touch sensing pad. 一種顯示面板,包括:一對向基板,包括:一支撐板,具有一平面,其中該平面具有一顯示區以及一位於該顯示區周圍的非顯示區;多個觸控感測墊,形成於該支撐板的該平面上,且該些觸控感測墊皆為透明的;多個第一導電層,形成於該支撐板的該平面上,並分別電連接該些觸控感測墊;至少一光感測層,形成於該支撐板的該平面上;至少一第二導電層,分別電連接該至少一光感測層;多個導電接墊,電連接該些第一導電層,並配置於該非顯示區內;以及一控制基板,連接該對向基板,並經由該些導電接墊而電連接該對向基板。 A display panel includes: a pair of facing substrates, including: a support plate having a plane, wherein the plane has a display area and a non-display area around the display area; a plurality of touch sensing pads are formed in The plane of the support board, and the touch sensing pads are all transparent; a plurality of first conductive layers are formed on the plane of the support board, and are electrically connected to the touch sensing pads, respectively; At least one light-sensing layer is formed on the plane of the support plate; at least one second conductive layer is respectively electrically connected to the at least one light-sensing layer; a plurality of conductive pads are electrically connected to the first conductive layers, And disposed in the non-display area; and a control substrate, connected to the opposite substrate, and electrically connected to the opposite substrate through the conductive pads. 如請求項第8項所述的顯示面板,其中該對向基板還包括: 一第一絕緣層,形成於該支撐板的該平面上,並覆蓋該些觸控感測墊與該至少一光感測層;以及一第二絕緣層,形成於該支撐板的該平面上,並覆蓋該第一絕緣層,其中該至少一第二導電層配置於該第二絕緣層上,並依序穿過該第二絕緣層與該第一絕緣層而電連接該至少一光感測層。 The display panel according to claim 8, wherein the counter substrate further includes: A first insulating layer formed on the plane of the support plate and covering the touch sensing pads and the at least one light sensing layer; and a second insulating layer formed on the plane of the support plate And cover the first insulating layer, wherein the at least one second conductive layer is disposed on the second insulating layer, and sequentially passes through the second insulating layer and the first insulating layer to electrically connect the at least one light sensor Measured layer. 如請求項第9項所述的顯示面板,其中各該第一導電層的一部分形成於該第一絕緣層與該第二絕緣層之間。 The display panel according to claim 9, wherein a part of each first conductive layer is formed between the first insulating layer and the second insulating layer. 如請求項第8項所述的顯示面板,其中該控制基板還包括多個導電凸塊,其中該些導電凸塊分別與該些導電接墊電性導通。The display panel according to claim 8, wherein the control substrate further includes a plurality of conductive bumps, wherein the conductive bumps are electrically connected to the conductive pads, respectively.
TW108109683A 2019-03-21 2019-03-21 Display panel and opposite substrate thereof TWI689861B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108109683A TWI689861B (en) 2019-03-21 2019-03-21 Display panel and opposite substrate thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108109683A TWI689861B (en) 2019-03-21 2019-03-21 Display panel and opposite substrate thereof

Publications (2)

Publication Number Publication Date
TWI689861B true TWI689861B (en) 2020-04-01
TW202036259A TW202036259A (en) 2020-10-01

Family

ID=71134271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109683A TWI689861B (en) 2019-03-21 2019-03-21 Display panel and opposite substrate thereof

Country Status (1)

Country Link
TW (1) TWI689861B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM472244U (en) * 2013-01-22 2014-02-11 Wintek Corp Touch-sensitive panel
TWI430012B (en) * 2011-12-05 2014-03-11 Hannspree Inc Image-capturing touch panel
TWI631699B (en) * 2017-04-19 2018-08-01 創王光電股份有限公司 Light emitting device
CN109196524A (en) * 2018-02-23 2019-01-11 深圳市汇顶科技股份有限公司 Optical imagery under screen in equipment with Organic Light Emitting Diode (OLED) screen or other screens for shielding upper fingerprint sensing in optical sensor module via imaging len and image pinhole

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI430012B (en) * 2011-12-05 2014-03-11 Hannspree Inc Image-capturing touch panel
TWM472244U (en) * 2013-01-22 2014-02-11 Wintek Corp Touch-sensitive panel
TWI631699B (en) * 2017-04-19 2018-08-01 創王光電股份有限公司 Light emitting device
CN109196524A (en) * 2018-02-23 2019-01-11 深圳市汇顶科技股份有限公司 Optical imagery under screen in equipment with Organic Light Emitting Diode (OLED) screen or other screens for shielding upper fingerprint sensing in optical sensor module via imaging len and image pinhole

Also Published As

Publication number Publication date
TW202036259A (en) 2020-10-01

Similar Documents

Publication Publication Date Title
CN109103231B (en) Display substrate, manufacturing method thereof and display device
US11417716B2 (en) Organic light emitting display substrate and panel with photodetector for light compensation of subpixel
CN107342370B (en) Display panel and display device
US10817696B2 (en) Fingerprint sensor package and display device including the same
CN100483731C (en) System for displaying images including electroluminescent device and method for fabricating the same
US11437411B2 (en) Thin film transistor drive backplane and micro-light emitting diode display
US8183769B2 (en) Organic electroluminescent display unit and method for fabricating the same
US11508786B2 (en) Display backplane, method of manufacturing the same and display device using the same
KR20150061851A (en) Display device
WO2016015421A1 (en) Array substrate, organic light-emitting diode display panel and display apparatus
US10910605B2 (en) Display device and method of manufacturing the same
CN109728060B (en) Array substrate, electroluminescent panel and display device
CN106886107B (en) Display panel
CN108231847A (en) Display panel and its manufacturing method, display device
CN109300944B (en) Display panel, manufacturing method thereof and display device
CN101964353A (en) Organic electro-luminescence display unit and manufacturing thereof
CN110197834A (en) Array substrate and preparation method thereof, display panel and fingerprint recognition display device
US9778530B2 (en) Thin film transistor array substrate and manufacturing method thereof
WO2021104050A1 (en) Display substrate, display panel and display apparatus
CN109166892A (en) Oled display substrate and its manufacturing method, OLED display panel
TWI689861B (en) Display panel and opposite substrate thereof
TWI297210B (en) System for displaying images including electroluminescent device and method for fabricating the same
WO2022233203A1 (en) Driving substrate and preparation method therefor, and display panel and electronic device
KR100721575B1 (en) Flat panel display device and method for fabricating the same
CN106125440B (en) Array substrate, preparation method thereof and display device