TWI689131B - Electronic device and multiband flexible pcb antenna structure thereof - Google Patents
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本發明涉及一種天線及使用天線的電子裝置,特別是涉及一種多頻段柔性電路板天線結構及使用其的電子裝置。 The invention relates to an antenna and an electronic device using the antenna, in particular to a multi-band flexible circuit board antenna structure and an electronic device using the same.
隨著通訊技術的發展,人們對電子裝置(如智慧型手機、平板電腦、筆記型電腦等)的功能要求也越來越多元化,舉例來說,電子裝置需支援近場通信(Near Field Communication,NFC)、GPS、3G、WIFI、藍牙等通訊功能。因此,需要在電子裝置上設置天線,以實現訊號的收發。然而,在電子裝置朝向小型化設計的同時,其內部空間大大限制了天線設計,最直接的影響是,無法操作於多個不同頻段。 With the development of communication technology, the functional requirements of electronic devices (such as smart phones, tablets, notebook computers, etc.) are becoming more and more diversified. For example, electronic devices need to support Near Field Communication (Near Field Communication) , NFC), GPS, 3G, WIFI, Bluetooth and other communication functions. Therefore, an antenna needs to be installed on the electronic device to realize signal transmission and reception. However, while the electronic device is being designed toward miniaturization, its internal space greatly limits the antenna design. The most direct impact is that it cannot operate in multiple different frequency bands.
另外,我國地處高溫高濕的亞熱帶地區,高頻信號一旦在高溫高濕的環境條件下進行傳輸,可能會產生變異並影響到信號的完整性。而且以現有的印刷電路板的基板的結構組成,很難在10GHz的頻率時達到低介電損耗,更不用說要兼顧耐高溫與低吸濕性能。 In addition, my country is located in a high-temperature and high-humidity subtropical region. Once high-frequency signals are transmitted under high-temperature and high-humidity environmental conditions, there may be variation and affect the signal integrity. Moreover, with the structure of the substrate of the existing printed circuit board, it is difficult to achieve low dielectric loss at a frequency of 10 GHz, not to mention the high temperature resistance and low moisture absorption performance.
因此,需要一種多功能天線,其既具備多種頻段,又能克服電子裝置內部有限空間的限制,還能確保高頻信號在嚴苛的環境條件下的傳輸質量與穩定性。 Therefore, there is a need for a multi-functional antenna that not only has multiple frequency bands, but also overcomes the limitations of the limited space inside the electronic device, and can also ensure the transmission quality and stability of high-frequency signals under harsh environmental conditions.
本發明針對現有技術的不足提供一種多頻段柔性電路板天線結構,以解決天線功能單一及無法充分利用電子裝置內部空間的問題。並且,提供一種使用此多頻段柔性電路板天線結構的電子裝置。 The present invention provides a multi-band flexible circuit board antenna structure to address the deficiencies of the prior art, in order to solve the problem that the antenna has a single function and cannot fully utilize the internal space of the electronic device. Moreover, an electronic device using the multi-band flexible circuit board antenna structure is provided.
為了解決上述的技術問題,本發明所採用的其中一技術方案是:一種多頻段柔性電路板天線結構,其包括一第一基板層、一第一金屬層、一第二基板層以及一第二金屬層。所述第一基板層包括一第一樹脂層,所述第一金屬層形成於所述第一樹脂層上,以構成一第一天線。所述第二基板層與所述第一基板層呈堆疊設置,且包括一第二樹脂層,所述第二金屬層形成於所述第二樹脂層上,以構成一第二天線。其中,所述第一天線與所述第二天線在一垂直方向上的投影不重合,所述第一樹脂層與所述第二樹脂層具有不同的介電係數,以使所述第一天線與所述第二天線具有不同的頻段。 In order to solve the above technical problems, one of the technical solutions adopted by the present invention is: a multi-band flexible circuit board antenna structure, which includes a first substrate layer, a first metal layer, a second substrate layer and a second Metal layer. The first substrate layer includes a first resin layer, and the first metal layer is formed on the first resin layer to form a first antenna. The second substrate layer and the first substrate layer are stacked and include a second resin layer. The second metal layer is formed on the second resin layer to form a second antenna. Wherein the projections of the first antenna and the second antenna in a vertical direction do not overlap, the first resin layer and the second resin layer have different dielectric coefficients, so that the first An antenna and the second antenna have different frequency bands.
進一步地,所述多頻段柔性電路板天線具有一第一開槽以及一第二開槽,所述第一開槽的位置對應所述第二天線,且所述第一開槽貫穿所述第一基板層與所述第一金屬層,所述第二開槽的位置對應所述第一天線,且所述第二開槽貫穿所述第二基板層與所述第二金屬層。 Further, the multi-band flexible circuit board antenna has a first slot and a second slot, the position of the first slot corresponds to the second antenna, and the first slot penetrates the The first substrate layer and the first metal layer, the position of the second slot corresponds to the first antenna, and the second slot penetrates the second substrate layer and the second metal layer.
進一步地,所述第一基板層還包括一第一芯層,且所述第一樹脂層與所述第一金屬層分別形成於所述第一芯層的相對二表面上,所述第二基板層還包括一第二芯層,且所述第二樹脂層與所述第二金屬層分別形成於所述第二芯層的相對二表面上。 Further, the first substrate layer further includes a first core layer, and the first resin layer and the first metal layer are formed on opposite surfaces of the first core layer, the second The substrate layer further includes a second core layer, and the second resin layer and the second metal layer are respectively formed on opposite surfaces of the second core layer.
進一步地,所述第一樹脂層與所述第二樹脂層的材料包含一改質液晶聚合物、一改質聚醯亞胺或一改質環氧樹脂,所述改質液晶聚合物、所述改質聚醯亞胺與所述改質環氧樹脂具有一修飾官能基,且所述修飾官能基為胺基、醯胺基、亞胺基、脒基、胺 基羰基胺基、胺基硫代羰基、胺基羰基氧基、胺基磺醯基、胺基磺醯氧基、羧酸酯、羧酸酯胺基、烷氧基羰基、烷氧基羰基氧基、烷氧基胺基、羥胺基、氰胺基或異氰酸基。 Further, the materials of the first resin layer and the second resin layer include a modified liquid crystal polymer, a modified polyimide, or a modified epoxy resin. The modified polyimide and the modified epoxy resin have a modified functional group, and the modified functional group is an amine group, an amido group, an imino group, an amidine group, an amine Carboxycarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, carboxylate, carboxylate amine, alkoxycarbonyl, alkoxycarbonyloxy Group, alkoxyamine group, hydroxylamine group, cyanamide group or isocyanate group.
進一步地,所述多頻段柔性電路板天線還包括一第三基板層以及一第三金屬層,所述第三基板層形成於所述第一基板層與所述第二基板層之間,所述第三金屬層形成於所述第三基板層上,且與所述第一金屬層和所述第二金屬層電性連接。 Further, the multi-band flexible circuit board antenna further includes a third substrate layer and a third metal layer. The third substrate layer is formed between the first substrate layer and the second substrate layer. The third metal layer is formed on the third substrate layer and electrically connected to the first metal layer and the second metal layer.
進一步地,所述第一金屬層包括一第一輻射部以及一連接於所述第一輻射部的第一連接部,所述第二金屬層包括一第二輻射部以及一連接於所述第二輻射部的第二連接部,且所述第一連接部和所述第二連接部與所述第三金屬層電性連接。 Further, the first metal layer includes a first radiation portion and a first connection portion connected to the first radiation portion, and the second metal layer includes a second radiation portion and a connection to the first radiation portion The second connection portion of the two radiating portions, and the first connection portion and the second connection portion are electrically connected to the third metal layer.
進一步地,所述多頻段柔性電路板天線還包括一第一導電柱以及一第二導電柱,所述第一導電柱貫穿所述第一基板層,且所述第一導電柱的兩端分別接觸所述第一金屬層的所述第一連接部與所述第三金屬層,所述第二導電柱貫穿所述第二基板層與所述第三基板層,且所述第二導電柱的兩端分別接觸所述第二金屬層的所述第二連接部與所述第三金屬層。 Further, the multi-band flexible circuit board antenna further includes a first conductive pillar and a second conductive pillar, the first conductive pillar penetrates the first substrate layer, and the two ends of the first conductive pillar are respectively The first connection portion and the third metal layer contacting the first metal layer, the second conductive pillar penetrates the second substrate layer and the third substrate layer, and the second conductive pillar The two ends of the are respectively in contact with the second connection portion of the second metal layer and the third metal layer.
進一步地,所述多頻段柔性電路板天線還包括一第三基板層以及一第三金屬層,所述第二基板層與所述第二金屬層形成於所述第三基板層的一表面上,所述第一基板層與第一金屬層形成於所述第二金屬層上,所述第三金屬層形成於所述第三基板層的相對另一表面上,且與所述第一金屬層和所述第二金屬層電性連接。 Further, the multi-band flexible circuit board antenna further includes a third substrate layer and a third metal layer, and the second substrate layer and the second metal layer are formed on a surface of the third substrate layer , The first substrate layer and the first metal layer are formed on the second metal layer, the third metal layer is formed on the opposite surface of the third substrate layer, and is in contact with the first metal The layer is electrically connected to the second metal layer.
進一步地,所述第一金屬層包括一第一輻射部以及一連接於所述第一輻射部的第一連接部,所述第二金屬層包括一第二輻射部以及一連接於所述第二輻射部的第二連接部,且所述第一連接部和所述第二連接部與所述第三金屬層電性連接。 Further, the first metal layer includes a first radiation portion and a first connection portion connected to the first radiation portion, and the second metal layer includes a second radiation portion and a connection to the first radiation portion The second connection portion of the two radiating portions, and the first connection portion and the second connection portion are electrically connected to the third metal layer.
進一步地,所述多頻段柔性電路板天線還包括一第一導電柱以及一第二導電柱,所述第一導電柱貫穿所述第一基板層、所述 第二基板層與所述第三基板層,且所述第一導電柱的兩端分別接觸所述第一金屬層的所述第一連接部與所述第三金屬層,所述第二導電柱貫穿所述第二基板層與所述第三基板層,且所述第二導電柱的兩端分別接觸所述第二金屬層的所述第二連接部與所述第三金屬層。 Further, the multi-band flexible circuit board antenna further includes a first conductive pillar and a second conductive pillar, the first conductive pillar penetrates the first substrate layer, the A second substrate layer and a third substrate layer, and two ends of the first conductive pillar respectively contact the first connection portion of the first metal layer and the third metal layer, the second conductive The pillar penetrates the second substrate layer and the third substrate layer, and two ends of the second conductive pillar respectively contact the second connection portion of the second metal layer and the third metal layer.
為了解決上述的技術問題,本發明所採用的另外一技術方案是:一種電子裝置,其使用所述多頻段柔性電路板天線結構。 In order to solve the above technical problem, another technical solution adopted by the present invention is: an electronic device that uses the multi-band flexible circuit board antenna structure.
本發明的其中一有益效果在於,本發明所提供的電子裝置及其多頻段柔性電路板天線結構,其能通過“所述第二金屬層與所述第一金屬層在一垂直方向上的投影不重合”以及“所述第一樹脂層與所述第二樹脂層具有不同的介電係數”的技術方案,以將多種不同頻段的天線做在同一個柔性電路板的不同板層上,既實現了實現多合一天線的架構,又可以充分利用電子裝置的內部空間,有利於產品更多功能的設計。 One of the beneficial effects of the present invention is that the electronic device and its multi-band flexible circuit board antenna structure provided by the present invention can pass through the projection of the second metal layer and the first metal layer in a vertical direction "Do not overlap" and "The first resin layer and the second resin layer have different dielectric coefficients" technical solutions, to make a variety of different frequency band antennas on the same flexible circuit board on different layers, both The architecture for realizing the all-in-one antenna is realized, and the internal space of the electronic device can be fully utilized, which is beneficial to the design of more functions of the product.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and explanation only, and are not intended to limit the present invention.
D‧‧‧電子裝置 D‧‧‧Electronic device
B‧‧‧多頻段柔性電路板天線結構 B‧‧‧Multi-band flexible circuit board antenna structure
1‧‧‧第一基板層 1‧‧‧First substrate layer
11‧‧‧第一芯層 11‧‧‧The first core layer
12‧‧‧第一樹脂層 12‧‧‧The first resin layer
2‧‧‧第一金屬層 2‧‧‧First metal layer
21‧‧‧第一輻射部 21‧‧‧ First Radiation Department
22‧‧‧第一連接部 22‧‧‧First connection
3‧‧‧第二基板層 3‧‧‧Second substrate layer
31‧‧‧第二芯層 31‧‧‧The second core layer
32‧‧‧第二樹脂層 32‧‧‧Second resin layer
4‧‧‧第二金屬層 4‧‧‧Second metal layer
41‧‧‧第二輻射部 41‧‧‧ Second Radiation Department
42‧‧‧第二連接部 42‧‧‧Second connection
5‧‧‧第三基板層 5‧‧‧The third substrate layer
6‧‧‧第三金屬層 6‧‧‧The third metal layer
7‧‧‧第四金屬層 7‧‧‧ Fourth metal layer
A1‧‧‧第一天線 A1‧‧‧ First antenna
A2‧‧‧第二天線 A2‧‧‧Second antenna
A3‧‧‧第三天線 A3‧‧‧Third antenna
A4‧‧‧第四天線 A4‧‧‧The fourth antenna
C‧‧‧控制單元 C‧‧‧Control unit
L‧‧‧訊號傳輸線路 L‧‧‧Signal transmission line
P1‧‧‧第一導電柱 P1‧‧‧The first conductive column
P2‧‧‧第二導電柱 P2‧‧‧Second conductive column
S1‧‧‧第一開槽 S1‧‧‧First slot
S2‧‧‧第二開槽 S2‧‧‧Second slot
圖1為本發明的多頻段柔性電路板天線結構的俯視示意圖。 FIG. 1 is a schematic top view of a multi-band flexible circuit board antenna structure of the present invention.
圖2為圖1的多頻段柔性電路板天線結構沿I-I剖面線的其中一剖面示意圖。 2 is a schematic cross-sectional view of the multi-band flexible circuit board antenna structure of FIG. 1 along the I-I section line.
圖3為圖1的多頻段柔性電路板天線結構沿I-I剖面線的另外一剖面示意圖。 FIG. 3 is another schematic cross-sectional view of the multi-band flexible circuit board antenna structure of FIG. 1 along the I-I section line.
圖4為根據本發明的多頻段柔性電路板天線結構的電子裝置的結構示意圖。 4 is a schematic structural view of an electronic device with a multi-band flexible circuit board antenna structure according to the present invention.
由於柔性電路板(FPC)在使用上具備可自由彎折與可依照空間佈局要求任意安排等優勢,本發明遂利用FPC來實現多合一天線的設計,以滿足電子產品的多種功能要求。 Because the flexible circuit board (FPC) has the advantages of being freely bendable and arbitrarily arranged according to space layout requirements, the present invention uses FPC to realize the design of an all-in-one antenna to meet various functional requirements of electronic products.
以下是通過特定的具體實施例來說明本發明所公開有關“電子裝置及其多頻段柔性電路板天線結構”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following is a description of the implementation of the "electronic device and its multi-band flexible circuit board antenna structure" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification . The present invention can be implemented or applied through other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual sizes, and are declared in advance. The following embodiments will further describe the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" as used herein may include any combination of any one or more of the associated listed items, depending on the actual situation.
[第一實施例] [First embodiment]
請參閱圖1及圖2,本發明第一實施例提供一種多頻段柔性電路板天線結構B,其是將至少兩種不同頻段的天線做在同一個柔性電路板的不同板層上,以滿足電子裝置對天線功能需求的多樣化。多頻段柔性電路板天線結構B為一多層佈線板,其至少包括堆疊設置的一第一基板層1、一第一金屬層2、一第二基板層3、一第二金屬層4、一第三基板層5及一第三金屬層6。
Referring to FIGS. 1 and 2, the first embodiment of the present invention provides a multi-band flexible circuit board antenna structure B, which uses at least two antennas of different frequency bands on different layers of the same flexible circuit board to meet The diversification of antenna functions required by electronic devices. The multi-band flexible circuit board antenna structure B is a multilayer wiring board, which at least includes a
第一金屬層2形成於第一基板層1上,且具有一預定天線圖
案,如此,第一金屬層2與第一基板層1可構成一第一天線A1。第二金屬層4形成於第二基板層3上,且具有另一預定天線圖案,如此,第二金屬層4與第二基板層3可構成一第二天線A2。為避免第一天線A1與第二天線A2之間相互干擾,多頻段柔性電路板天線結構B可具有一對應第二天線A2的第一開槽S1及一對應第一天線A1的第二開槽S2。第一開槽S1至少貫穿第一基板層1與第一金屬層2,第二開槽S2至少貫穿第二基板層3與第二金屬層4,以使第一金屬層2與第二金屬層4在一垂直方向上的投影不重合。
The
進一步來說,第一基板層1包括一第一芯層11及一第一樹脂層12,第一樹脂層12與第一金屬層2分別形成於第一芯層11的相對二表面上。第二基板層3包括一第二芯層31及一第二樹脂層32,第二樹脂層32與第二金屬層4分別形成於第二芯層31的相對二表面上。值得注意的是,在第一天線A1與第二天線A2分別形成於不同板層的架構下,可通過控制第一樹脂層12與第二樹脂層32的介電係數,以根據電子裝置對天線功能的需要進行多種組合,也就是說,當第一樹脂層12與第二樹脂層32具有不同的介電係數時,第一天線A1與第二天線A2可具有不同的頻段。舉例來說,第一天線A1可為GPS天線、NFC天線、藍芽天線及wifi天線之中的其中一種,第二天線A2可為GPS天線、NFC天線、藍芽天線及wifi天線之中的另外一種。然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本發明。
Further, the
在本實施例中,第一樹脂層12與第二樹脂層32的厚度可根據天線所需的匹配頻寬來做調整,第一樹脂層12與第二樹脂層32的厚度可介於12μm至105μm之間,但不受限於此。第一樹脂層12與第二樹脂層32可具有單層或多層結構。第一樹脂層12與第二樹脂層32的材料可包含氟樹脂、聚苯醚樹脂(PPO/PPE)、芳烷型環氧樹脂或其任意組合。作為氟樹脂,可採用聚四氟乙烯
(PTFE)、四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)、四氟乙烯-六氟丙烯共聚物(FEP)及乙烯-四氟乙烯共聚物(ETFE)。作為芳烷型環氧樹脂,可採用聯苯型環氧樹脂。
In this embodiment, the thicknesses of the
第一樹脂層12與第二樹脂層32的材料優選包含改質液晶聚合物(modified LCP)、改質聚醯亞胺(modified PI)或改質環氧樹脂(modified epoxy),但不受限於此。第一金屬層2與第二金屬層4的厚度可介於2μm至105μm之間,但不受限於此。第一金屬層2與第二金屬層4的材料可為高導電性金屬例如銅、鎳、銀、金或其合金,但不受限於此。
The materials of the
另外,第一樹脂層12與第二樹脂層32視需要可使用陶瓷粉體。陶瓷粉體在第一樹脂層12或第二樹脂層32中所佔比例可介於40wt%至70wt%,較佳介於25wt%至35wt%。
In addition, ceramic powder may be used for the
進一步來說,不論是改質液晶聚合物、改質聚醯亞胺還是改質環氧樹脂,都具有至少一個修飾官能基,修飾官能基可為胺基(amino)、醯胺基(carboxamido)、亞胺基(imido或imino)、脒基(amidino)、胺基羰基胺基(aminocarbonylamino)、胺基硫代羰基(amino thiocarbonyl)、胺基羰基氧基(aminocarbonyloxy)、胺基磺醯基(aminosulfonyl)、胺基磺醯氧基(aminosulfonyloxy)、羧酸酯(carboxyl ester)、羧酸酯胺基((carboxyl ester)amino)、烷氧基羰基(alkoxy carbonyl)、烷氧基羰基氧基(alkoxy carbonyloxy)、烷氧基胺基(alkoxy amino)、羥胺基(hydroxyamino)、氰胺基(cyanato)或異氰酸基(isocyanato),但不受限於此。 Furthermore, whether it is a modified liquid crystal polymer, a modified polyimide or a modified epoxy resin, it has at least one modification functional group, and the modification functional group may be an amino group or a carboxamido group. , Imido (imido or imino), amidino (amidino), aminocarbonylamino (aminocarbonylamino), aminothiothio (aminothiothio), aminocarbonyloxy (aminocarbonyloxy), aminosulfonamide ( aminosulfonyl), aminosulfonyloxy, carboxyl ester, carboxyl ester amino, alkoxy carbonyl, alkoxycarbonyloxy ( alkoxy carbonyloxy, alkoxy amino, hydroxyamino, cyanato or isocyanato, but not limited thereto.
上述改質液晶聚合物、改質聚醯亞胺與改質環氧樹脂可隨特定溶劑一同被施加到第一芯層11或第二芯層31的其中一表面上,之後將特定溶劑移除,即可形成第一樹脂層12或第二樹脂層32。值得注意的是,上述改質液晶聚合物、改質聚醯亞胺與改質環氧樹脂相較於未經改質之前,在特定溶劑中有較高的溶解度,從而可以提高可加工性。特定溶劑的具體例包括:N-甲基-2-吡咯
烷酮(NMP)、二甲基乙醯胺(DMAC)、二甲基甲醯胺(DMF)、γ-丁內酯(GBL)、2-丁氧基乙醇、2-乙氧基乙醇等。在第一樹脂層12/第二樹脂層32的材料中,改質液晶聚合物、改質聚醯亞胺或改質環氧樹脂的固含量可介於1wt%至85wt%之間,例如5wt%、15wt%、25wt%、35wt%、45wt%、55wt%、65wt%或75wt%。
The above modified liquid crystal polymer, modified polyimide and modified epoxy resin can be applied to one surface of the
再者,由於第一樹脂層12與第二樹脂層32採用改質液晶聚合物、改質聚醯亞胺或改質環氧樹脂,第一樹脂層12與第二樹脂層32的吸水率可降低到0.8%以下,遠小於現有技術中相關應用的樹脂層的吸水率(約2%),如此,多頻段柔性電路板天線結構B可適應嚴苛的高濕環境,也就是說,即便在高濕環境下,多頻段柔性電路板天線結構B仍可正常使用。
Furthermore, since the
另外,第一樹脂層12或第二樹脂層32的材料視需要可與一種或多種添加劑配合使用。添加劑可選自高介電填充劑、無機填充劑、有機填充劑、晶鬚(whisker)、矽烷偶合劑、抗氧化劑及UV吸收劑之中的一種或兩種以上的組合,但不受限於此。作為高介電填充劑,可使用鈦酸鋇及鈦酸鍶。作為無機填充劑,可使用二氧化矽、氫氧化鋁及碳酸鈣。作為有機填充劑,可使用固化的環氧樹脂、苯并鳥糞胺樹脂及丙烯酸系聚合物。作為晶鬚,可使用鈦酸鉀及硼酸鋁。然而,本發明不以上述所舉的例子為限。
In addition, the material of the
在本實施例中,第一芯層11與第二芯層31的厚度可介於8μm至200μm之間,但不受限於此。第一芯層11與第二芯層31的材料優選和第一樹脂層12與第二樹脂層32的材料相同,也就是說,第一芯層11與第二芯層31的材料可包含氟樹脂、聚苯醚樹脂(PPO/PPE)、芳烷型環氧樹脂或其任意組合,其具體例已如前述,在此不再贅述。並且,第一芯層11與第二芯層31的材料優選包含改質液晶聚合物、改質聚醯亞胺或改質環氧樹脂,其具有至少一個修飾官能基,已如前述,在此不再贅述。
In this embodiment, the thickness of the
請複參閱圖2,第三基板層5形成於第一基板層1與第二基板
層3之間,第三金屬層6形成於第三基板層5的一表面上,且具有一預定線路圖案,第一金屬層2與第二金屬層4均與第三金屬層6電性連接,如此,第三金屬層6可構成一訊號傳輸線路,而在實際使用中,可通過第三金屬層6對位在其相對二側的第一天線A1與第二天線A2進行組合控制。
Please refer to FIG. 2 again, the
進一步來說,第一金屬層2包括一第一輻射部21及一連接於第一輻射部21的第一連接部22,其中第一連接部22可通過一貫穿第一基板層1的第一導電柱P1與第三金屬層電性連接。第二金屬層4包括一第二輻射部41及一連接於第二輻射部41的第二連接部42,其中第二連接部42可通過一貫穿第二基板層3的第二導電柱P2與第三金屬層6電性連接。
Further, the
需要說明的是,可在第三基板層5的相對另一表面上形成另一第四金屬層7,且第四金屬層7具有另一預定線路圖案,以因應更加複雜的電路設計與功能需求。
It should be noted that another
在本實施例中,第三基板層5主要起到承載與和支撐作用,第三基板層5的厚度可介於8μm至200μm之間,但不受限於此。第三基板層5的材料優選和第一樹脂層12與第二樹脂層32的材料相同,也就是說,第三基板層5的材料優選包含改質液晶聚合物、改質聚醯亞胺或改質環氧樹脂,其具有至少一個修飾官能基,已如前述,在此不再贅述。第三金屬層6與第四金屬層7的厚度可介於2μm至105μm之間,但不受限於此。第三金屬層6與第四金屬層7的材料可為高導電性金屬例如銅、鎳、銀、金或其合金,但不受限於此。
In this embodiment, the
[第二實施例] [Second Embodiment]
請參閱圖3,本發明第二實施例提供一種多頻段柔性電路板天線結構B,其是將至少兩種不同頻段的天線做在同一個柔性電路板的不同板層上,以滿足電子裝置對天線功能需求的多樣化。多
頻段柔性電路板天線結構B為一多層佈線板,其至少包括堆疊設置的一第一基板層1、一第一金屬層2、一第二基板層3、一第二金屬層4、一第三基板層5及一第三金屬層6。關於第一、第二和第三基板層1、3、5與第一、第二和第三金屬層2、4、6的技術細節,可參考第一實施例所述,在此不再贅述。
Referring to FIG. 3, a second embodiment of the present invention provides a multi-band flexible circuit board antenna structure B. At least two different frequency band antennas are made on different layers of the same flexible circuit board to meet the requirements of electronic devices. The diversification of antenna functional requirements. many
The frequency band flexible circuit board antenna structure B is a multilayer wiring board, which at least includes a
本實施例與第一實施例的主要差異在於:第一天線A1與第二天線A2都是均位在第三基板層5的上方。進一步來說,第二基板層3與第二金屬層4形成於第三基板層5的一表面上,第一基板層1與第一金屬層2形成於第二金屬層4上,第三金屬層6形成於第三基板層5的相對另一表面上。並且,第一金屬層2的第一連接部22可通過一貫穿第一、第二和第三基板層1、3、5的第一導電柱P1與第三金屬層6電性連接,第二金屬層4的第二連接部42可通過一貫穿第二和第三基板層3、5的第二導電柱P2與第三金屬層6電性連接。
The main difference between this embodiment and the first embodiment is that the first antenna A1 and the second antenna A2 are both located above the
[第三實施例] [Third Embodiment]
請參閱圖4,本發明還提供一種電子裝置D,其使用多頻段柔性電路板天線結構B。進一步來說,電子裝置D包括一控制單元C以及不同頻段的第一天線A1、第二天線A2、第三天線A3以及第四天線A4。控制單元24可為任意種類的處理器或可程式化電路。第一天線A1、第二天線A2、第三天線A3與第四天線A4分別位在不同板層,且均電性連接至一訊號傳輸線路L。如此,控制單元C可通過訊號傳輸線路L對第一天線A1、第二天線A2、第三天線A3與第四天線A4進行組合控制,且根據需要切換至不同頻段,以適應不同的通訊要求。 Referring to FIG. 4, the present invention also provides an electronic device D that uses a multi-band flexible circuit board antenna structure B. Further, the electronic device D includes a control unit C and first antenna A1, second antenna A2, third antenna A3 and fourth antenna A4 in different frequency bands. The control unit 24 can be any kind of processor or programmable circuit. The first antenna A1, the second antenna A2, the third antenna A3, and the fourth antenna A4 are located on different layers, and are all electrically connected to a signal transmission line L. In this way, the control unit C can control the first antenna A1, the second antenna A2, the third antenna A3 and the fourth antenna A4 through the signal transmission line L, and switch to different frequency bands as needed to adapt to different communications Claim.
[實施例的有益效果] [Beneficial effect of embodiment]
本發明的其中一有益效果在於,本發明所提供的電子裝置及 其多頻段柔性電路板天線結構,其能通過“第一金屬層形成於第一樹脂層上以構成一第一天線,第二金屬層形成於第二樹脂層上以構成一第二天線”以及“第一樹脂層與第二樹脂層具有不同的介電係數,以使第一天線與第二天線具有不同的頻段”的技術方案,以將多種不同頻段的天線整合到同一個FPC,既實現了多合一天線,又可以充分利用電子裝置的內部空間,有利於產品更多功能的設計。 One of the beneficial effects of the present invention is that the electronic device provided by the present invention and Its multi-band flexible circuit board antenna structure can form a first antenna through the "first metal layer formed on the first resin layer, and a second metal layer formed on the second resin layer to form a second antenna "And "The first resin layer and the second resin layer have different dielectric coefficients, so that the first antenna and the second antenna have different frequency bands" technical solution to integrate multiple different frequency band antennas into the same FPC not only realizes the all-in-one antenna, but also makes full use of the internal space of the electronic device, which is conducive to the design of more functions of the product.
更進一步來說,第一樹脂層與第二樹脂層採用改質液晶聚合物、改質聚醯亞胺或改質環氧樹脂,其吸水率可降低到0.8%以下,遠小於現有技術中相關應用的樹脂層的吸水率(約2%),從而本發明的多頻段柔性電路板天線結構可適應嚴苛的高濕環境。 Furthermore, the first resin layer and the second resin layer use modified liquid crystal polymer, modified polyimide or modified epoxy resin, and the water absorption rate can be reduced to less than 0.8%, which is far less than the related art. The water absorption rate (approximately 2%) of the applied resin layer, so that the multi-band flexible circuit board antenna structure of the present invention can be adapted to severe high humidity environments.
更進一步來說,本發明的多頻段柔性電路板天線結構中,天線組數並不侷限,其可根據電子裝置對天線功能的需要進行多種組合,以涵蓋5G應用。 Furthermore, in the multi-band flexible circuit board antenna structure of the present invention, the number of antenna groups is not limited, and it can be combined in various ways according to the needs of the antenna function of the electronic device to cover 5G applications.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the scope of the patent application of the present invention, so any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.
1‧‧‧第一基板層 1‧‧‧First substrate layer
11‧‧‧第一芯層 11‧‧‧The first core layer
12‧‧‧第一樹脂層 12‧‧‧The first resin layer
2‧‧‧第一金屬層 2‧‧‧First metal layer
21‧‧‧第一輻射部 21‧‧‧ First Radiation Department
22‧‧‧第一連接部 22‧‧‧First connection
3‧‧‧第二基板層 3‧‧‧Second substrate layer
31‧‧‧第二芯層 31‧‧‧The second core layer
32‧‧‧第二樹脂層 32‧‧‧Second resin layer
4‧‧‧第二金屬層 4‧‧‧Second metal layer
41‧‧‧第二輻射部 41‧‧‧ Second Radiation Department
42‧‧‧第二連接部 42‧‧‧Second connection
5‧‧‧第三基板層 5‧‧‧The third substrate layer
6‧‧‧第三金屬層 6‧‧‧The third metal layer
7‧‧‧第四金屬層 7‧‧‧ Fourth metal layer
A1‧‧‧第一天線 A1‧‧‧ First antenna
A2‧‧‧第二天線 A2‧‧‧Second antenna
P1‧‧‧第一導電柱 P1‧‧‧The first conductive column
P2‧‧‧第二導電柱 P2‧‧‧Second conductive column
S1‧‧‧第一開槽 S1‧‧‧First slot
S2‧‧‧第二開槽 S2‧‧‧Second slot
Claims (10)
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CN101316005A (en) * | 2008-07-10 | 2008-12-03 | 华南理工大学 | Double-frequency band lamination medium loading helical antenna |
CN102299408A (en) * | 2010-06-22 | 2011-12-28 | 佳邦科技股份有限公司 | Soft board antenna structure |
TW201803043A (en) * | 2016-07-01 | 2018-01-16 | 英特爾公司 | Semiconductor packages with antennas |
Also Published As
Publication number | Publication date |
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JP2019213181A (en) | 2019-12-12 |
JP6697044B2 (en) | 2020-05-20 |
TW202002395A (en) | 2020-01-01 |
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