TWI687695B - Method for expanding and upgrading functions of automatic test system - Google Patents

Abstract

A method for expanding and upgrading the functions of an automatic test system, electrically connecting a spring pin lap device to an expansion instrument device and a spring pin interface of an automatic test system, that is, to expand the interface between the instrument device and the automatic test system Establish a signal path between them to achieve automatic test system function expansion or performance upgrade. The method of the present invention is hardly subject to the original design framework inside the automatic test system, so it has a very good degree of freedom in expansion, and can avoid the adverse effects of the expansion of the instrumentation on the internal circuit of the test system, and is directly compatible with the existing The needle card is also easy to adjust or cancel the expansion equipment according to the change of test requirements, which is a convenient, practical, fully reversible and non-destructive system function expansion and upgrade method.

Description

Method for expanding and upgrading functions of automatic test system

The present invention is a method of function expansion and upgrade, especially a method of function expansion and upgrade of an automatic test system, which uses a spring pin lap device to be electrically connected to the expansion instrument and the spring pin of the spring pin interface of the automatic test system. , Integrate the expansion equipment into the automatic test system to achieve the purpose of automatic test system function expansion or performance upgrade.

The component test production lines of semiconductor fabs and the optoelectronic industry sometimes face the automatic test systems purchased in the past whose performance does not meet the latest test application requirements or production capacity requirements, so it is necessary to consider whether to replace the test system Or upgrade and expand the function of the test system.

For the automatic test system function expansion, there are the following two common methods:

1. When designing the automatic test system, the original manufacturer of the test system reserves an expansion slot inside the system or reserves some expansion interfaces on the external side panel of the system.

2. The supporting scheme can be designed in the test carrier board or probe card, and the expansion instrument can be connected to the test system and the object to be tested through the intermediary transfer of the test carrier board or probe card.

However, the current common difficulties are as follows:

1. Not all the original design of the automatic test system has reserved slots or interfaces with sufficient specifications or sufficient quantity. After all, the original manufacturer of the test system may not be able to fully predict the future new application of the client in advance, so it is difficult to anticipate various possibilities at the system design stage, and the original manufacturer of the system will inevitably have cost reduction considerations, so it is inconvenient to add too many reserved designs.

2. It is easy to be limited by the mechanism design of the test system itself, or the test system administrator's considerations for the convenience of equipment management and cost control, and may not be suitable for integrating and expanding the instrument and equipment by modifying the test carrier board or modifying the probe card. To expand and upgrade system functions.

3. The probe card is a consumable that needs to be frequently replaced and maintained. If the expansion instrument is connected to the probe card, it will often face the trouble of having to remove and reinstall the instrument cable.

Therefore, with years of relevant practical experience, the inventor finally developed a more practical test system function expansion and upgrade method after active thinking, prototype testing and continuous improvement.

The invention discloses a method for expanding and upgrading functions of an automatic test system, and electrically connecting at least one pogo pin lap device used for system function expansion to an expanded instrument and a pogo pin interface of a pogo pin interface of an automatic test system The pogo pin lap device has at least one metal lap piece and at least one signal line, and both ends of the signal line are electrically connected to the metal lap piece and the expansion instrument respectively, and the metal lap piece is overlapped with the pogo pin; When the automatic test system is in operation, the pogo pin will be electrically connected to a test object, so that the test signal path can be established between the test object and the expansion instrument through the pogo pin overlapping device to transmit electrical signals. The function expansion and upgrading of the automatic test system can be realized.

With the above test system function expansion method, the advantages of the present invention are as follows:

1. There is no need to pass through the internal circuit board or auxiliary interface of the test system, so it can achieve the greatest degree of scalability, and is not easily subject to the expansion limitations that may be caused by the original design framework inside the test system.

2. There is no need to change the existing probe card of the automatic test system, which will not increase the related purchase cost or maintenance cost of the probe card.

3. It is an expansion path outside the system by overlapping the pogo pin without passing through the internal circuit of the test system, so it helps to avoid the possible adverse effects of the expansion instrument on the internal circuit of the test system.

4. Because there is no change to the original design of the automatic test system or the probe card, system users can release this expansion solution at any time and easily restore the automatic test system to the original state of the original design. So this is a completely reversible and completely non-destructive expansion and upgrade program.

10‧‧‧Spring pin overlapping device

101‧‧‧Spring pin overlapping device

102‧‧‧Spring pin overlapping device

12‧‧‧Insulation fixings

121‧‧‧Sleeve

122‧‧‧Sleeve

123‧‧‧Sleeve

14‧‧‧Metal lap joint

18‧‧‧Signal line

20‧‧‧Expansion of equipment

22‧‧‧ Junction box

221‧‧‧Relay module

222‧‧‧ Relay drive unit

23‧‧‧spring needle magazine

231‧‧‧sensitive measuring equipment

24‧‧‧ pogo pin

25‧‧‧Probe card

26‧‧‧ Pogo pin interface

30‧‧‧System instrument control computer

40‧‧‧ test object

S1‧‧‧Step 1

S2‧‧‧Step 2

FIG. 1 is a block diagram of a method of function expansion and upgrade of an automatic test system of the present invention

FIG. 2 is a schematic diagram of the pogo pin overlapping device of the present invention combined with an expanded instrument and pogo pin interface

Figure 3 shows the spring pin lap device of the present invention is first used as a relay through the junction box, and then connected to the expansion

Instrument and equipment, and the schematic diagram of connecting the extended instrument and equipment to the system instrument control computer

4 is a schematic diagram of the built-in relay module of the junction box of the present invention

5 is a schematic diagram of the present invention is the relay drive unit is installed outside the junction box

6 is a perspective view of a first embodiment of a spring pin overlapping device of the present invention

7 is a schematic exploded view of FIG. 6

8 is a schematic perspective view of a second embodiment of a spring pin overlapping device of the present invention

9 is a schematic exploded view of FIG. 8

10 is a schematic perspective view of a third embodiment of the spring pin overlapping device of the present invention

11 is a schematic exploded view of FIG. 10

FIG. 12 is a pogo pin interface device of the present invention to be connected to a pogo pin interface of an automatic test system Schematic diagram of electrical connection with the probe card

13 is a schematic view of the first embodiment of the present invention, the spring pin overlapping device is installed on the spring pin

14 is a schematic view of a second embodiment of the present invention, the spring pin overlapping device is installed on the spring pin

15 is a schematic view of a third embodiment of the present invention, the spring pin overlapping device is installed in the spring pin

The various embodiments of the present case will be described in detail below, with the help of the drawings. In addition to these detailed descriptions, the present invention can be widely implemented in other embodiments, and any easy replacement, modification, and equivalent change of any of the embodiments described herein are included in the scope of this case, and the following patents The scope shall prevail. In the description of the specification, in order to allow the reader to have a more complete understanding of the present invention, many specific details are provided; however, the present invention may be implemented on the premise that some or all of these feature details are omitted. In addition, well-known steps or elements are not described in detail to avoid unnecessary limitation of the invention. The same or similar elements in the drawings will be represented by the same or similar symbols. It is important to note that the drawings are for illustrative purposes only and do not represent the actual size or number of elements unless otherwise specified.

Referring to FIG. 1 and accompanying FIGS. 2-6, it is a method for expanding and upgrading the function of an automatic test system disclosed in the present invention: Step 1 S1: electrically connect at least one pogo pin lap device 10 to an expansion instrument device 20 and an automatic A pogo pin 24 of a pogo pin interface 26, one of the test systems, the pogo pin connecting device 10 has at least one metal connecting piece 14 and at least one signal line 18, and the two ends of the signal line 18 are electrically connected to the metal connecting piece respectively 14 and the expansion instrument 20, the metal lap 14 overlaps the pogo pin 24.

Step 2 S2: According to the original operation mode of the automatic test system, the pogo pin 24 is electrically connected to an object under test 40, so that the signal path required for measurement can be established between the object under test 40 and the expansion instrument 20 through the pogo pin lap device 10, and the electrical signal is transmitted, so Realize the function expansion and upgrade of the automatic test system. In this embodiment, the DUT 40 is a semiconductor silicon wafer, and a probe card 25 is used as an intermediary aid.

Referring to FIG. 2, the expansion instrument device 20 is connected to a system instrument control computer 30, and the system instrument control computer 30 can control the expansion instrument device 20 to automatically perform related test tasks.

Referring to FIG. 3, a junction box 22 can be electrically connected between the expansion instrument device 20 and the pogo pin lap device 10, and the junction box 22 is used to relay the signal cable of the expansion instrument device 20, thereby It can be avoided that the fragile pogo pin 24 or the pogo pin overlapping device 10 directly bears excessive tension of the instrument connection cable and may cause damage.

Referring to FIG. 4, a relay module 221 which can be controlled by a program is additionally provided inside the junction box 22. The relay module 221 is connected to the system instrument control computer 30. The system instrument control computer 30 can control the relay module through a software program The switch of 221 achieves the connection or disconnection of the signal line between the pogo pin lap device 10 and the expansion instrument equipment 20, so as to reduce the lap path of the pogo pin lap device 10 to a sensitive amount built into the automatic test system Test the interference level of the device 231. For example, some automatic test systems have a built-in sensitive small current or small capacitance measurement function. If the overlap path of the pogo pin attachment device 10 is not properly isolated, it may interfere with the sensitive measurement equipment 231 test function. In addition, if it is worried that the expansion instrument 20 is very sensitive and fragile, it is not suitable to always be attached to the pogo pin 24 at any time, and the necessary isolation protection can also be provided by using the relay module 221.

Referring to FIG. 5, in order to simplify the internal circuit design of the junction box 22, a relay driving unit 222 may be provided outside the junction box 22, and the relay driving unit 222 is electrically connected Connect the relay module 221 and the system instrument control computer 30 inside the junction box 22, and then carry out the programmable control of the relay driving unit 222 through the system instrument control computer 30, which can simplify the setting inside the junction box 22 The circuit of the relay module 221 reduces the heat dissipation requirements of the junction box 22 and can reduce the volume of the junction box 22.

6 and 7 in conjunction with FIG. 2, a first embodiment of a pogo pin lap device 10 of the present invention is disclosed. The pogo pin lap device 10 is composed of a metal lap 14 and a signal line 18. The signal wire 18 is connected to the metal connecting member 14 to form an electrical connection. The metal connecting member 14 has a set of holes 121 that can be connected to a pogo pin 24.

8 and 9 in conjunction with FIG. 2, a second embodiment of a pogo pin lap device 101 of the present invention is disclosed. The pogo pin lap device 101 has an insulating fixing member 12, a metal lap member 14 and a signal Wire 18, the metal strap 14 forms an electrical connection with the signal wire 18, the metal strap 14 uses a wire forming spring, the metal strap 14 is covered with the insulating fixing member 12, the metal strap A hole 122 is formed between the member 14 and the insulating fixing member 12, and the hole 122 can be sleeved on a pogo pin 24.

10 and 11 together with FIG. 2, a third embodiment of a pogo pin lap device 102 of the present invention is disclosed. The pogo pin lap device 102 has an insulating fixing member 12, a metal lap member 14 and a signal wire 18 The metal strap 14 is formed by bending an elastic metal sheet. The metal strap 14 is electrically connected to the signal line 18. The metal strap 14 is covered with the insulating fixing member 12. A set of holes 123 is formed between the metal connecting member 14 and the insulating fixing member 12, and the periphery of the set of holes 123 is formed by the metal connecting member 14 and the insulating fixing member 12 together, the set of holes 123 can be sleeved on a pogo pin 24.

Referring to FIG. 12, it is revealed that the pogo pin lap device 10 will lap with the pogo pin Any of the pogo pins 24 on the interface 26.

In the above, the probe card 25 or a test carrier (not shown) is further included between the pogo pin 24 and the object under test 40. If the object under test 40 is a wafer of a semiconductor factory, usually an automatic test system The probe card 25 is used to detect circuit elements. When the automatic test system operates to perform a test task, the pogo pin interface 26 is interfaced with the probe card 25 or the test carrier board as an intermediary, so that each pogo pin 24 is formed with the probe card 25 or the test carrier board The electrical connection further forms an electrical connection between the object to be measured 40 and the pogo pin overlapping device 10.

Referring to FIG. 13 in conjunction with FIGS. 6, 7 and 12, the sleeve hole 121 of the pogo pin attachment device 10 is sleeved on the pogo pin 24 of a pogo pin cartridge 23, and the user can snap the pogo pin The connecting device 10 is pushed against the root of the spring pin 24, and the peripheral wall of the spring pin 24 contacts the metal strap 14 in an electrically connected state.

Referring to FIG. 14 together with FIG. 8, FIG. 9 and FIG. 12, the sleeve hole 122 of the pogo pin overlapping device 101 is sleeved on the pogo pin 24 of the pogo pin cartridge 23, and the user can fix the insulating fixing member 12 pushes against the root of the pogo pin 24, the peripheral wall of the pogo pin 24 contacts the metal strap 14, and the pogo pin 24 and the metal strap 14 are electrically connected.

Referring to FIG. 15 together with FIGS. 10-12, the sleeve hole 123 of the pogo pin overlapping device 102 is sleeved on the pogo pin 24 of the pogo pin cartridge 23, and the user can push the insulating fixing member 12 against To the root of the pogo pin 24, the peripheral wall of the pogo pin 24 contacts the side of the metal strap 14 and the inner side wall surface of the insulating fixing member 12, and the pogo pin 24 and the metal strap 14 are electrically connected.

The material of the insulating fixing member 12 can be heat-resistant and electrically insulating Good Teflon (PTFE) or other thermoplastic insulating materials; if the insulating fixing member 12 is made of thermoplastic insulating materials, such as perfluoroalkylate (PFA), it can be manufactured by metal injection molding or compression molding .

10‧‧‧Spring pin overlapping device

20‧‧‧Expansion of equipment

24‧‧‧ pogo pin

26‧‧‧ Pogo pin interface

40‧‧‧ test object

S1‧‧‧Step 1

S2‧‧‧Step 2

Claims (10)

A method for expanding and upgrading functions of an automatic test system. The method includes: electrically connecting at least one spring pin lap device to an expansion instrument and a spring pin of a spring pin interface of an automatic test system, the spring pin lap device It has at least one metal connecting piece and at least one signal line, and the two ends of the signal line are electrically connected to the metal connecting piece and the expansion instrument respectively, and the metal connecting piece is connected to the pogo pin; when the test system is in operation, The pogo pin is electrically connected to a test object, so that a measurement path can be established between the test object and the expansion instrument through the pogo pin lap device to transmit electrical signals, so that the function of the automatic test system can be expanded and upgraded . The method for expanding and upgrading the function of the automatic test system as described in item 1 of the patent application scope, wherein the metal lap joint has a set of holes. The method for expanding and upgrading the function of the automatic test system as described in item 1 of the patent application scope, wherein an insulating fixing member is covered on the outside of the metal bonding member, and the metal bonding member and the insulating fixing member are combined to form a set The set of holes can be set to the pogo pin. The method for expanding and upgrading the function of the automatic test system as described in item 1 or item 3 of the patent application scope, wherein the expansion instrument is electrically connected to a system instrument control computer, and the system instrument control computer can control the expansion instrument. The method for expanding and upgrading the function of the automatic test system as described in item 1 of the patent application scope, wherein a junction box is provided between the expansion instrument and the spring pin lap device, and the junction box is used to relay the relay Expand the signal cable of the equipment. The method for expanding and upgrading the function of the automatic test system as described in item 5 of the patent application scope, in which a relay module with programmable control is provided inside the junction box, and the relay module can be connected Or separate the signal lines of the expansion instrument and the spring pin lap device to reduce the interference degree of the spring pin lap device to the sensitive measurement function of the original automatic test and test system. The method for expanding and upgrading the function of the automatic test system as described in item 6 of the patent application scope, wherein a relay drive unit is provided outside the junction box, and the relay drive unit is electrically connected to the relay module and the system instrument control computer. The system instrument control computer carries out the programmable control of the relay drive unit. The method for expanding and upgrading the function of the automatic test system as described in item 1 of the patent application scope, wherein the metal lap part of the pogo pin lap device uses a wire forming spring or an elastic metal sheet. The method for expanding and upgrading the function of the automatic test system as described in item 1 of the patent application scope, wherein the metal lap member is lapped on the pogo pin in a manner of nesting contact or side contact. The method for expanding and upgrading the function of the automatic test system as described in item 1 of the patent application scope, wherein a probe card or a test carrier is further included between the pogo pin and the object to be tested, and the test task is performed when the test system is in operation At this time, the pogo pin will contact the probe card or the test carrier as an intermediary to indirectly electrically connect the object to be tested.

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