TWI687530B - Method for preventing gold plating undercut and gold finger copper exposing of printed circuit board - Google Patents
Method for preventing gold plating undercut and gold finger copper exposing of printed circuit board Download PDFInfo
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- TWI687530B TWI687530B TW108100929A TW108100929A TWI687530B TW I687530 B TWI687530 B TW I687530B TW 108100929 A TW108100929 A TW 108100929A TW 108100929 A TW108100929 A TW 108100929A TW I687530 B TWI687530 B TW I687530B
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本發明有關於一種印刷電路板之製程方法，尤指一種防止印刷電路板之鍍金側蝕和金手指露銅之方法。The invention relates to a manufacturing method of a printed circuit board, in particular to a method for preventing the gold-plated side corrosion of the printed circuit board and the gold finger from being exposed to copper.
隨著世界各國工業發展能力的快速提升，消費市場愈來愈大，印刷電路板(PCB)企業正飛速成長。With the rapid improvement of industrial development capabilities of countries around the world, the consumer market is getting bigger and bigger, and printed circuit board (PCB) companies are growing rapidly.
習知印刷電路板的製作流程，主要包含下列步驟：於印刷電路板表面進行防焊處理，而後貼上乾膜，而後進行鍍金處理。The manufacturing process of the conventional printed circuit board mainly includes the following steps: performing solder mask treatment on the surface of the printed circuit board, then pasting a dry film, and then performing gold plating treatment.
由於防焊處理是利用油墨保護不需要焊接的部位，因此上述習知方法的缺失主要包含： (1)先進行防焊，而後再進行鍍金，於鍍金的過程中，金槽的浸泡時間長短和金槽電流的波動，皆會影響防焊附著效果，造成金手指根部側蝕。 (2)先進行防焊，而後再進行鍍金，因油墨未被顯影乾淨或油墨反黏，會導致於進行鍍金時，金手指無法上金，造成金手指露銅。 Since the solder mask treatment uses ink to protect parts that do not require welding, the lack of the above-mentioned conventional methods mainly includes: (1) Welding first, and then gold plating. During the gold plating process, the length of the gold bath soaking time and the fluctuation of the current in the gold bath will affect the adhesion of the solder mask, causing lateral corrosion of the root of the gold finger. (2) Solder-proof first, and then gold-plated, because the ink has not been developed or the ink is back-tacky, which will cause the gold fingers to fail to gold on the gold plating, resulting in gold fingers exposed copper.
針對上述缺失，業者一般的做法是對於鍍金側蝕和金手指露銅進行修補，雖然可改善鍍金側蝕和金手指露銅，但卻必須耗費額外的人工，導致印刷電路板成本提高。In response to the above defects, the general practice of the industry is to repair the gold-plated undercut and gold finger exposed copper, although it can improve the gold-plated undercut and gold finger exposed copper, but it must consume additional labor, resulting in an increase in the cost of the printed circuit board.
此外，上述修補的方式雖然可改善鍍金側蝕和金手指露銅，但是仍會因為修補不完善而存在瑕疵，導致印刷電路板的故障率高。In addition, although the above-mentioned repairing method can improve gold-plated undercut and gold finger exposed copper, it still has defects due to imperfect repair, resulting in a high failure rate of the printed circuit board.
據此，如何能有一種『防止印刷電路板之鍍金側蝕和金手指露銅之方法』，是相關技術領域人士亟待解決之課題。According to this, how to have a "method to prevent gold-plated side corrosion of printed circuit boards and gold fingers exposed to copper" is a subject urgently needed to be solved by those in the relevant technical field.
於一實施例中，本發明提出一種防止印刷電路板之鍍金側蝕和金手指露銅之方法，包含下列步驟： (a) 於電路板表面進行鍍金處理；以及 (b) 於完成鍍金處理之電路板表面進行防焊處理。 In one embodiment, the present invention provides a method for preventing gold-plated undercut on a printed circuit board and gold finger exposed copper, including the following steps: (a) Gold plating on the surface of the circuit board; and (b) Carry out solder mask treatment on the surface of the circuit board after gold plating.
於另一實施例中，本發明提出一種防止印刷電路板之鍍金側蝕和金手指露銅之方法，包含下列步驟： 步驟101：於電路板表面不需要鍍金處覆蓋乾膜； 步驟102：於該電路板表面進行鍍金處理； 步驟103：於完成該鍍金處理之該電路板表面進行防焊處理； 步驟104：於完成該防焊處理之該電路板進行成型處理。 步驟105：對完成該成型處理之該電路板進行電測； 步驟106：於完成該電測之該電路板表面進行有機保焊膜(Organic Solderability Preservative，OSP)處理。 In another embodiment, the present invention provides a method for preventing gold-plated undercut on a printed circuit board and gold finger exposed copper, including the following steps: Step 101: Cover the dry film on the surface of the circuit board without gold plating; Step 102: performing gold plating on the surface of the circuit board; Step 103: Perform solder mask treatment on the surface of the circuit board after the gold plating process is completed; Step 104: Perform molding process on the circuit board after completing the solder resist process. Step 105: Perform electrical measurement on the circuit board that has completed the molding process; Step 106: Organic Solderability Preservative (OSP) treatment is performed on the surface of the circuit board after completing the electrical test.
請參閱圖1所示，本發明所提供之一種防止印刷電路板之鍍金側蝕和金手指露銅之方法流程100，其包含以下步驟：
步驟101：於電路板表面覆蓋乾膜；於不需要鍍金處覆蓋乾膜；
步驟102：於電路板表面進行鍍金處理；
步驟103：於完成鍍金處理之電路板表面進行防焊處理；防焊處理是利用油墨保護不需要焊接的部位；
步驟104：於完成防焊處理之電路板表面進行成型處理；
步驟105：對完成成型處理之電路板進行電測；
步驟106：於完成電測之電路板表面進行有機保焊膜(Organic Solderability Preservative，OSP)處理；
步驟107：對完成有機保焊膜(Organic Solderability Preservative，OSP)處理之電路板依序進行自動光學檢測(Auto Visual Inspection，AVI)。
步驟108：對完成自動光學檢測之電路板進行目檢。
完成上述步驟的印刷電路板為成品，即可進行包裝並出貨。
Please refer to FIG. 1, a
其中，步驟102於電路板表面進行鍍金處理；便於客戶打件安插的良好接觸和導電性。Among them,
必須強調說明的是，本發明所提供之防止印刷電路板之鍍金側蝕和金手指露銅之方法，是經過多次實做樣品驗證而得出的結果，而非簡單的步驟順序變化而已。It must be emphasized that the method provided by the present invention to prevent gold-plated undercut on printed circuit boards and gold fingers from being exposed to copper is the result of multiple practical sample verifications, rather than a simple step sequence change.
綜上所述，本發明之防止印刷電路板之鍍金側蝕和金手指露銅之方法，其最主要的兩個步驟包括：對於電路板表面先進行鍍金處理，而後再於完成鍍金處理之電路板表面進行防焊處理，因此：於鍍金的過程中，不致於因為金槽的浸泡時間長短和金槽電流的波動而影響防焊附著效果，因此不會造成金手指根部側蝕；以及，不致於因為油墨未被顯影乾淨或油墨反黏而導致於進行鍍金時，金手指無法上金，造成金手指露銅；確實可防止印刷電路板之鍍金側蝕和金手指露銅。To sum up, the method of the present invention for preventing the gold-plated side corrosion of printed circuit boards and gold fingers from exposing copper includes two main steps: firstly, the surface of the circuit board is gold-plated, and then the gold-plated circuit is completed The surface of the board is welded, so that: during the gold plating process, it will not affect the welding adhesion effect due to the length of the gold bath soaking time and the fluctuation of the current in the gold bath, so it will not cause side corrosion of the root of the gold finger; Because the ink is not developed or the ink is sticky, the gold fingers cannot be gold-plated, which causes the gold fingers to be exposed to copper; it can indeed prevent the gold-plated side corrosion of the printed circuit board and the gold fingers from being exposed to copper.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.
100:防止印刷電路板之鍍金側蝕和金手指露銅之方法流程
101~108:防止印刷電路板之鍍金側蝕和金手指露銅之方法流程之步驟
100: Method flow to prevent gold-plated undercut on printed circuit board and gold finger exposed
圖1為本發明之方法流程圖。Figure 1 is a flowchart of the method of the present invention.
無no
100:防止印刷電路板之鍍金側蝕和金手指露銅之方法 100: Method to prevent gold-plated undercut on printed circuit board and gold finger exposed copper
101~108:防止印刷電路板之鍍金側蝕和金手指露銅之方法流程之步驟 101~108: The steps of the method flow to prevent the gold-plated side corrosion of the printed circuit board and the gold finger exposed copper
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| TW108100929A TWI687530B (en) | 2019-01-10 | 2019-01-10 | Method for preventing gold plating undercut and gold finger copper exposing of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| TW108100929A TWI687530B (en) | 2019-01-10 | 2019-01-10 | Method for preventing gold plating undercut and gold finger copper exposing of printed circuit board |
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| TWI687530B true TWI687530B (en) | 2020-03-11 |
| TW202026440A TW202026440A (en) | 2020-07-16 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
| CN104968163A (en) * | 2015-05-29 | 2015-10-07 | 胜宏科技（惠州）股份有限公司 | Golden finger processing method characterized by no lead wire residues |
| CN107230670A (en) * | 2016-03-24 | 2017-10-03 | 英飞凌科技股份有限公司 | Package surface can visually be checked by being redirected to welding material |
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- 2019-01-10 TW TW108100929A patent/TWI687530B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
| CN104968163A (en) * | 2015-05-29 | 2015-10-07 | 胜宏科技（惠州）股份有限公司 | Golden finger processing method characterized by no lead wire residues |
| CN107230670A (en) * | 2016-03-24 | 2017-10-03 | 英飞凌科技股份有限公司 | Package surface can visually be checked by being redirected to welding material |
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| TW202026440A (en) | 2020-07-16 |
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