TWI686127B - High performance cooling system - Google Patents

Abstract

This disclosure is related to a high performance cooling system comprising a casing, wherein a sealing body, a compressor, a condenser, a refrigerant controller and a power module are arranged in the casing. Further the sealing body includes at least one server circuit board and a condensation tube installed inside the sealing body and the entire server circuit board is immersed in an engineered fluid. The condensing tube is installed above the inside of the esling body and connected to the refrigerant controller and the compressor through an input port and an output port of the sealing body. The condenser is maintained at a low temperature through the operation of the compressor. This disclosure can not only effectively achieve the improvement of the cooling effect of the rack server, but also greatly save the space required for the cooling project and the cost of the hardware device. This disclosure is a highly efficient and economy heat dissipation cooling system for the rack server.

Description

High-efficiency cooling system

The invention relates to a high-efficiency heat-dissipating cooling system, in particular to a high-efficiency heat-dissipating cooling system with a compressor and an enclosed body accommodated in a limited space to cool a rack-type server circuit.

In the prior art, for the general immersion cooling device, most of them use multiple immersion cooling server machines, and then cooperate with a single high-power large compressor to operate, by the setting of the one large compressor , And then individually connected to each server host to perform immersion cooling operation. However, this prior art often requires a larger compressor body or a larger space volume to complete an overall cooling system, and is not a server host is an independent cooling system, at this time in the assembly server room At times, there are often restrictions on the setting of volumes of different sizes, which needs to be improved.

The invention discloses a high-efficiency heat dissipation and cooling system. By proposing an independent device for immersing the cooling server host in a single rack-type server, the cooling effect can be effectively increased by multiples and can be greatly improved It saves the space required for the cooling project and the cost of the hardware device. It not only has the independent operation function of complete immersion cooling in a single rack server, it does not need to be connected to the external compressor pump. Taiwan is a highly efficient cooling system with a highly economical server host.

The high-efficiency heat dissipation and cooling system of the present invention includes a casing; a sealed body is installed in the casing, the sealed body is filled with an engineering fluid, and the sealed body includes; at least one server circuit board, installed Inside the enclosed body and immersed in the In the engineering fluid; a condensing tube is installed above the inside of the sealed body; a sealed body input port is installed on one side of the outside of the sealed body and is the sealed body input port of the condensed tube; a sealed The body outlet is installed on one side of the sealed body and is the sealed body outlet of the condenser; and a power supply and signal interface are installed on the other side of the sealed body; a compressor , Installed in the casing, and one end of the compressor is connected to the inlet of the sealed body, the other end is connected to the outlet of the sealed body; a condenser, installed in the casing, the condenser The input is connected to the other end of the compressor; a refrigerant controller is installed in the casing, the input of the refrigerant controller is connected to the output of the condenser, and the output of the refrigerant controller is connected to a sealed body input pipe, The sealed body input pipe is connected to the sealed body input port; and a power supply module, electrically coupled to the power supply and signal interface, the compressor and the refrigerant controller.

10‧‧‧Chassis

11‧‧‧Cover

12‧‧‧Base

13‧‧‧Ventilation holes

14‧‧‧Signal hole

20‧‧‧closed body

20a‧‧‧cover

21‧‧‧Enclosed body input

22‧‧‧Closed body outlet

23‧‧‧Power interface

24‧‧‧Condenser

25‧‧‧Server circuit board

26‧‧‧Engineering fluid

30‧‧‧Compressor

31‧‧‧Compressor A

31a‧‧‧Compressor output

32‧‧‧Compressor B

32a‧‧‧Compressor input

33‧‧‧Condenser

34‧‧‧Refrigerant controller

311‧‧‧Enclosed body input tube

322‧‧‧Closed body output tube

40‧‧‧Power Module

50‧‧‧Fan module

60‧‧‧System frame

61‧‧‧ lattice

H‧‧‧Chassis height

1 is a perspective schematic view of the first embodiment of the present invention; FIG. 2 is an internal schematic view of the first embodiment of the present invention. FIG. 3 is a top schematic view of the first embodiment of the present invention; FIG. 4A is a side view of the dual-phase embodiment of the present invention; 4B is a schematic cross-sectional side view of a single-phase embodiment of the present invention; FIG. 5A is a schematic top view of a compressor in the first embodiment of the present invention; FIG. 5B is a schematic side view of the compressor in the first embodiment of the present invention FIG. 6 It is a schematic diagram of the implementation of the sealed body in the first embodiment of the present invention; FIG. 7 is a schematic diagram of the second embodiment of the present invention; FIG. 8 is an implementation of the present invention with two sets of condensers, compressors, condensers and refrigerant controllers Schematic.

FIG. 9 is a schematic diagram of the first embodiment of the present invention applied in an equipment room.

In the following, reference will be made to the accompanying drawings for explanation, so as to more fully describe various exemplary embodiments, and some exemplary embodiments are shown in the accompanying drawings. However, this The concept of the invention may be embodied in many different forms and should not be interpreted as being limited to the exemplary embodiments set forth herein. Rather, providing these exemplary embodiments will make the invention detailed and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the size of each device or element within the cooling system of this case and the size of the relative entities between the devices can be exaggerated for clarity, and similar numbers always indicate similar elements.

It should be understood that although the terms "a", module, interface, etc. may be used herein to describe various devices, components, or targets, such devices, components, or targets should not be limited by these terms. These terms are used to clearly distinguish one component from another component, or to distinguish a set of devices from another set of devices; and from another perspective, the description of the upper (or lower) part of the component can be renamed It is below (or above) without affecting the essence of the technology. The plural, plural, each or each term discussed below is used to distinguish the composition of elements without departing from the teachings of the inventive concept. As used herein, the term "at least one element" means the possibility of having one element or possibly multiple elements. Also, the term "and/or" may be used to include any and all combinations of one or more of the associated listed items. As also mentioned above, the term "plural" or "plurality" is used herein to describe having multiple elements, but these plural elements are not limited to the implementation of two, three, or four and more than four elements. The technology implemented.

Referring to FIG. 1, FIG. 2 and FIG. 3, the high-efficiency heat dissipation and cooling system of the present invention includes a casing 10, a sealed body 20, a compressor 30, a condenser 33, a refrigerant controller 34 and a power supply module Group 40. As shown in FIG. 1, the casing 10 of the present invention includes a base 12 and an upper cover 11, wherein a plurality of heat dissipation holes 13 (as shown in FIG. 2) are provided on the side behind the base 12. In an embodiment, the heat dissipation holes 13 of the present invention can also be arranged on the front side and/or the rear side, so that the heat dissipation effect is more. As shown in FIG. 2, the sealed body 20 is mainly installed in the casing 10. The sealed body 20 includes a sealed body input port 21, a sealed body output port 22, a power supply and a signal interface 23 (as shown in FIG. 3) ), a condenser 24 and at least one server circuit board 25 (as shown in FIG. 4), and the sealed body 20 is filled with an engineering fluid 26; the server circuit board 25 is installed inside the sealed body 20, the actual implementation of the server circuit board 25 is installed in the sealed The bottom of the body 20, and the entire submerged in the engineering fluid 26, that is, the engineering fluid 26 is entirely covered on the server circuit board 25. The condensing tube 24 is installed above the inside of the sealed body 20 and above the level of the liquid surface of the engineering liquid 26. As shown in FIG. 4A, the condensing tube 24 is not immersed in the engineering liquid 26. This embodiment is Two-phase (Two-Phase) immersion cooling embodiment. In addition, the inside of the condenser tube 24 is filled with a refrigerant, and the refrigerant flows through the inside of the condenser tube 24. The enclosed body inlet 21 is installed on one side of the exterior of the enclosed body 20 and is one of the enclosed body inlet 21 of the condenser 20; the enclosed body outlet 22 is installed on one side of the enclosed body 20 On the side, it is the sealed body outlet of the condenser 20. The aforementioned power supply and signal interface 23 are installed on the other side of the sealing body 20 (the rear side as shown in FIG. 3 ).

The compressor 30 is installed in the casing 10 and outside the sealed body 20. One end of the compressor 30 is the compressor output end 31a, the other end is the compressor input end 32a, and the compressor input end 32a is connected to the sealed body output port 22, that is, the compressor input end 32a of the compressor 30 and the condenser The closed body output port 22 of 24 is connected, and the refrigerant of the condenser tube 24 is converted by the pump function of the compressor 30 into low-pressure gas into high-pressure gas. The condenser 33 is installed in the casing 10 and outside the sealed body 20. The input of the condenser 33 is connected to the compressor output 31a of the compressor 30. The function of the condenser 33 is to convert high-pressure gas into High-pressure liquid. The refrigerant controller 34 is installed in the casing 10 and outside the sealed body 20; the input of the refrigerant controller 34 is connected to the output of the condenser 33, and the output of the refrigerant controller 34 is connected to a sealed body input The tube 311 is connected to the sealed body inlet 21 of the sealed body input pipe 311. The refrigerant controller 34 functions to control the flow rate of the refrigerant to adjust the temperature. In this way, the compressor 30, the condenser 33, and the refrigerant controller 34 keep the condenser tube 24 at a low temperature. The power module 40 is electrically coupled to the power supply and the signal interface 23 and electrically coupled to the compressor 30 and the refrigerant controller 34. The function of the power module 40 is to It can supply the power source required for the operation of the server circuit board 25 inside the sealed body 20 and provide the power required for the operation of the compressor 30 and the refrigerant controller 34.

In FIG. 2, the base 12 in the casing 10 is used to carry the sealed body 20, the compressor 30, the power module 40 and other related devices on the base 12. The upper cover 11 covers the base 12. In actual production, the structure of the side of the upper cover 11 presents a "one" flat structure; and in practical use, a signal hole 14 (as shown in FIG. 3) connected externally is provided behind the base 12 and The signal hole 14 is electrically coupled to the power supply and the signal interface 23 provided in the sealed body 20. That is to say, the power and signal interface 23 connects the signal line and power line inside the server circuit board 25 to the outside of the sealed body 20, and the signal hole 14 further connects the inside of the server circuit board 25 The signal cable and the power cable are connected outside the casing 10.

In practical application, the height H of the casing 10 (marked in FIG. 1) of the present invention is 88 mm, and preferably the height H of the casing 10 is 90 mm or less. In addition, the width of the chassis 10 is 438 mm, and the length of the chassis is 750 mm, which is the size of a standard rack-mounted server 2U machine, that is, within the size of the 2U machine, the present invention also accommodates airtight The body 20, the compressor 30, the power module 40 and other components. It should be stated that the sizes and sizes described here are only for an embodiment, and they should not be used to limit the scope of protection of the present invention in actual implementation.

In FIGS. 2 and 3, the sealing body 20 includes a cover 20a, which is mainly sealed by waterproofing, for example, by special screws, or by waterproof snap-fitting, for example, using a combination of waterproof tenon and hook They are installed above the sealed body 20. The function of the cover body 20a is to provide the user with the ability to remove the cover body 20a and open the sealed body 20 to facilitate taking the entire server circuit board 25 out of the sealed body 20, and then repair the server circuit board 25.

FIG. 4A shows an embodiment of the two-phase immersion cooling. From the side sectional view of the present invention, it can be seen that the liquid level of the engineering fluid 26 is actually three-fifths of the overall height of the sealed body 20 when actually implemented. To a height between three quarters to cover the entire server circuit board 25, that is, the engineering fluid 26 does not fill the inside of the sealed body 20, but There is some space reserved for the height, so that the space above the horizontal surface of the liquid surface can be arranged with the condenser tube 24. That is, the condenser pipe 24 of the present invention is installed above the liquid level of the engineering fluid 26. The structure of the curved structure of the condenser tube 24 is a continuous U-shaped curved structure when viewed from above, and covers the entire liquid surface, as shown in FIG. 3. If viewed from the side, the condenser tube 24 assumes a horizontal line configuration, as shown in FIG. 4. At the same time, the condenser tube 24 is filled with refrigerant, and the refrigerant is operated through the compressor 30, the condenser 33, and the refrigerant controller 34, so that the condenser tube 24 maintains a low temperature state. In this embodiment, the boiling point of the engineering fluid 26 is between 60 and 70 degrees C, and the engineering fluid is an electrically insulating liquid, so that the server circuit board 25 is completely submerged in the engineering fluid 26 without There will be doubts about short circuit conduction.

In the actual operation of the present invention shown in FIG. 4A, when the server circuit board 25 starts to operate, the temperature of the server circuit board 25 will slowly increase. When a certain temperature is reached, for example, 60 to 70 degrees C, this At this time, the engineering fluid 26 will start to boil, and will convert the liquid engineering fluid 26 into a gaseous engineering fluid, and vaporize the gas upward. Then, when the vaporized gas meets the low-temperature condensing tube 24, it will form a liquid on the surface of the condensing tube 24 and fall into the original engineering fluid 26 in a recirculating manner. In this way, the server circuit board 25 is continuously immersed in the engineering fluid 26 that can maintain a low temperature, which can effectively achieve the temperature of cooling the server circuit board 25. In addition to greatly improving the cooling effect, it can effectively save and reduce traditional Space required for air-cooled cooling.

4B is an embodiment of single-phase immersion cooling. From the side sectional view of the present invention, it can be seen that the liquid level of the engineering fluid 26 fills the entire internal space of the sealed body 20 to cover the entire server circuit board 25. That is, all the engineering fluid 26 fills the entire sealed body 20. That is, the condenser pipe 24 of the present invention is installed in the engineering fluid 26. If the structure of the curved structure of the condenser tube 24 is viewed from above, the condenser tube 24 has a continuous U-shaped curved structure and covers the entire server circuit board 25 as shown in FIG. 3. If viewed from the side, the condenser tube 24 assumes a horizontal line configuration, as shown in FIG. 4B. At the same time, the condensing tube 24 is filled with refrigerant and penetrates The operating refrigerant of the compressor 30, the condenser 33 and the refrigerant controller 34 maintains the condenser tube 24 at a low temperature. In this single-phase embodiment, the boiling point of the engineering fluid 26 is above 100 degrees C, and the engineering fluid is an electrically insulating liquid, so that the server circuit board 25 is completely immersed in the engineering fluid 26 without Doubts about short circuit conduction.

5A and 5B, to further illustrate the implementation of the compressor of the present invention, which shows that the compressor 30 includes a compressor A portion 31 and a compressor B portion 32, the compressor A portion 31 is extended with a compression The machine output 31a is mainly connected to the condenser 33; at the same time, a compressor input 32a is extended in the compressor B, the compressor input 32a is provided with a sealed body output pipe 322, and the sealed body output pipe 322 is mainly connected to the sealed body outlet 22 of the sealed body 20; and the compressor B part 32 and the compressor A part 31 are connected by another connecting pipe, as shown in FIGS. 5A and 5B. In actual production, the combined structure and device of the compressor A part 31 and the compressor B part 32 are combined into a rotary compressor, and the entire compressor 30 can be accommodated in the casing 10; that is, After the compressor 30, the condenser 33 and the refrigerant controller 34 proposed in the present invention are assembled as a whole, the overall height thereof will be less than 85mm. Therefore, the high-efficiency heat dissipation and cooling system proposed by the present invention can be used in a rack-type server structure, that is, in the commonly-known 2U structure, with independent operation of complete immersion cooling, and does not need to be In addition to the rack-mounted server device, an external compressor pumping machine is additionally connected. The invention not only has excellent cooling effect, but also can greatly save the space required for cooling engineering.

FIG. 6 is a perspective view of the sealed body 20 in the embodiment in which the top view of FIG. 3 and the side view of the dual-phase immersion cooling of FIG. 4A are integrated, showing the sealed body inlet 21 and the sealed body in the sealed body 20. Body outlet 22, power and signal interface 23, condenser tube 24, server circuit board 25 and engineering fluid 36. It shows that the engineering fluid 26 covers the entire server circuit board 25, and the liquid surface of the engineering fluid 26 has some height space reserved, so that the space above the horizontal surface of the liquid surface can accommodate the setting of the condenser tube 24. The condenser tube has a continuous U-shaped curved structure and covers the entire liquid surface. On the server circuit board 25 shown in FIG. 6, different circuit components are drawn. The drawing and setting of these components are only an example, and are not necessarily the actual implementation of the structure of the components on the server circuit board 25 of FIG. 6, which is only an example. Limitation of the invention The actual implementation of the circuit components of the server circuit board 25 when the present invention is actually used.

In another embodiment, as shown in FIG. 7, the present invention is provided with at least one set of fan modules 50 inside the casing 10. In practice, the fan modules 50 may be implemented as a single set alone, or may be provided as a set There are multiple sets of fan modules 50 whose main function is to dissipate the heat energy of the condenser 33 out of the casing 10. The position of the fan module 50 may be installed at the rear end inside the casing 10 and close to the rear side of the casing 10 (as shown in FIG. 7, and a plurality of heat dissipation is provided on the rear side of the casing 10 The hole 13 can dissipate the heat energy of the condenser 33.

FIG. 8 is an embodiment of the present invention with two sets of condenser tubes 24, two sets of compressors 30, two sets of condensers 33, and two sets of refrigerant controllers 34. Basically, the second set of condenser tubes 24 The connection method of the compressor 30, the condenser 33 and the refrigerant controller 34 is the same as the connection method of the first group of the condenser pipe 24, the compressor 30, the condenser 33 and the refrigerant controller 34. However, it should be emphasized that the two sets of compressor 30, the two sets of condenser 33, and the two sets of refrigerant controller 34 are all arranged inside the casing 10, but they are all arranged outside the sealed body 20, that is to say The heights of the condenser tubes 24, the compressor 30, the condenser 33 and the refrigerant controller 34 of the two groups are all less than 85mm. On the other hand, it should be noted that the two sets of condenser tubes 24 are arranged inside the same sealed body 20. As shown in FIG. 8, there is only one sealed body 20 in this embodiment.

As shown in FIG. 9, the high-efficiency heat dissipation and cooling system described in the present invention is used in a server room. The system room is mainly provided with a system rack body 60. The system rack body 60 includes a plurality of cells 61, that is, the system frame 60 is composed of a plurality of lattices 61; and the accommodation space of each lattice 61 is equivalent to the volume of a casing 10 accommodating a high-efficiency cooling system In size, each casing 10 includes the aforementioned sealed body 20, compressor 30, power module 40 and other devices and components. In this way, a server master with multiple high-efficiency cooling is formed Machine room.

In summary, the present invention proposes a high-efficiency heat dissipation and cooling system, which can be effectively used in a rack-type server machine by using the sealed body 20, the compressor 30, the condenser 33, the refrigerant controller 34, and the power supply Modules 40 and other devices and components are installed in the chassis 10 of the 2U rack server. Not only does it have the function of independent operation with complete immersion cooling, it does not need to be connected to the external compression. The pumping machine can achieve a cooling effect that is more than 4 times higher than that of the air-cooled type; and the present invention not only has excellent cooling effect, but also can greatly save the space and hardware devices required by the air-cooled cooling project cost. Obviously, the case of the present invention has the essential requirements for patent application.

However, the description of the present invention is only an example of the preferred embodiment. When it cannot be used to limit the scope of protection of the present invention, any local changes, modifications or additions of the technology still do not deviate from the scope of protection of the present invention in.

10‧‧‧Chassis

11‧‧‧Cover

12‧‧‧Base

13‧‧‧Ventilation holes

20‧‧‧closed body

20a‧‧‧cover

30‧‧‧Compressor

33‧‧‧Condenser

34‧‧‧Refrigerant controller

40‧‧‧Power Module

Claims (9)

A high-efficiency heat dissipation and cooling system is used in the structure of a rack-type server. The high-efficiency heat dissipation and cooling system includes: a casing; a sealed body installed in the casing, and the sealed body is filled with a project Liquid, and the enclosed body includes: at least one server circuit board installed inside the enclosed body and immersed in the engineering liquid; at least one condenser tube installed above the enclosed body; one sealed The body inlet is installed on one side of the outside of the enclosed body and is the inlet of the closed body of the condenser; a sealed body outlet is installed on one side of the enclosed body and is the condensation The output of the sealed body of the tube; and a power and signal interface installed on the other side of the sealed body; at least one compressor, installed in the casing, one end of the compressor is connected to the sealed body Output port; at least one condenser, installed in the casing, the condenser input connected to the other end of the compressor; at least one refrigerant controller, installed in the casing, the refrigerant controller input Connected to the output of the condenser, the output of the refrigerant controller is connected to a sealed body input pipe, the sealed body input pipe is connected to the sealed body input port; and at least one power supply module, electrically coupled to the power supply and signal The interface, the compressor and the refrigerant controller; wherein the condenser tube is installed above the liquid surface of the engineering fluid and is continuously bent to cover the liquid surface; the condenser tube is filled with refrigerant and compressed by the compressor The machine operates the refrigerant to make the condenser tube in a low temperature state; and the height of the casing is 90 mm or less. The high-efficiency heat dissipation and cooling system according to claim 1, wherein the cabinet includes: A base for carrying the sealed body, the compressor and the power supply module; a plurality of heat dissipation holes are provided on one side of the base; and an upper cover for covering above and behind the base and behind the upper cover The side is provided with a signal hole for external connection; wherein the signal hole is electrically coupled with the power supply and the signal interface. The high-efficiency heat dissipation and cooling system according to claim 1, wherein the sealing body includes a cover body, which is installed above the sealing body with a waterproof lock or a waterproof snap-fit for the user to open the sealing body and repair the Server circuit board. The high-efficiency heat dissipation and cooling system as described in claim 1, wherein the boiling point of the engineering fluid is between 60 and 70 degrees C, the engineering fluid is an electrically insulating liquid, and the liquid level of the engineering fluid is the closed The body height is between three-fifths and three-quarters. The high-efficiency heat dissipation and cooling system according to claim 1, wherein the boiling point of the engineering fluid is above 100 degrees C, the engineering fluid is an electrically insulating fluid, and the engineering fluid fills the inside of the sealed body. The high-efficiency heat dissipation and cooling system according to claim 4, wherein the continuous bending of the condenser tube is a continuous U-shaped bend covering the liquid surface. The high-efficiency heat dissipation and cooling system according to claim 1, wherein the compressor includes: a compressor A part, the compressor A part is extendedly provided with a compressor output end, and the compressor output end is connected to the condenser Input; and a compressor B part, the compressor B part is extended with a compressor input end, the compressor input end is connected to a sealed body output tube, and the sealed body output tube is connected to the sealed body output port; And the compressor B and the compressor A are connected by a connecting pipe; wherein the compressor A and the compressor B are combined into a rotary compressor, and are accommodated in the casing. The high-efficiency heat dissipation and cooling system according to claim 1, wherein at least one group of fan modules is provided inside the cabinet, and the fan module is assembled between the condenser and one side of the cabinet. A machine room with a high-efficiency heat dissipation and cooling system is provided with a system rack body in the machine room. The system rack body is provided with a plurality of lattices, each of which is used for accommodating a high efficiency as described in claim 1 Can dissipate cooling system.

Images