TWI685859B - Frameless inductor - Google Patents

Abstract

A frameless inductor comprises a first signal connection plate, a choke core and a wire set, the choke core has a hole penetrating through both sides of the choke core, the first signal connection plate has a signal input connection portion and a signal output connection portion on both sides of the hole respectively, the wire set has a wire, and both ends of the wire are disposed on a surface of the signal input connection portion and a surface of the signal output connection portion of the first signal connection plate respectively and inside the hole of the choke core between both ends of the wire, and the wire set passes through the choke core to achieve the effects of improving the degree of automation, reducing the production cycle, and stabilizing the quality of the inductor, as well as overcoming the drawback of the conventional inductor incapable of controlling the interval and length of wire winding.

Description

Inductor without mold base

An inductance device without mold base, especially an inductance device without mold base.

Inductors are widely used in aerospace, electronic products, electronic switches, solar power generation and other fields. They are electronic devices that provide inductive performance (ie, store energy in a magnetic field) in AC circuits. Among them, the common mode inductance (Common mode Choke), also known as the common mode choke, is often used to filter common mode electromagnetic interference signals in computer switching power supplies. In the design of the board, the common-mode inductance also plays the role of EMI filtering, which is used to suppress the electromagnetic waves generated by high-speed signal lines from radiating outward.

Inductor is a well-known inductance device, which is usually composed of wire wound on the iron core. The winding of the wire generally needs to be matched with the mold frame, and then the core is assembled on the mold frame. The common mode noise of this structure of the inductor When flowing through, it will produce low impedance, hinder the flow of differential mode signals, and in the production process of the inductor, its degree of automation is low, making the quality of the inductor unstable, long production cycle, and the distance between the wire wound on the magnetic core and The length cannot be controlled. Therefore, it is necessary to improve the current inductance.

The main purpose of the present invention is to use the wire set to pass through the iron core in a crossing way to improve the automation of the production of the inductance device, reduce the production cycle, stabilize the quality of the inductance device, and can solve the current inductance whose wire winding distance and length cannot be controlled Question.

To achieve the above purpose, the moldless inductor device of the present invention is provided with a first signal connection plate, an iron core and a wire set, the iron core has holes penetrating through both sides, and the first signal connection plate is provided with signals on both sides of the hole The input connection part and the signal output connection part, and the wire set has a wire, the two ends of the wire are respectively located on the surface of the signal input connection part and the signal output connection part of the first signal connection board, and the two ends of the wire are located in the hole of the iron core .

In the aforementioned moldless inductance device, the first signal connecting plate is connected between the signal input connecting portion and the signal output connecting portion, and the iron core is connected to the surface of the base.

In the aforementioned moldless inductance device, the first signal connection board is provided with a first pad on the surface of the signal input connection part, and the second pad is provided on the surface of the signal output connection part, and the two ends of the wires of the wire set are electrically connected respectively The first pad and the second pad.

In the aforementioned moldless inductance device, the first signal connection plate is provided with a third pad on the bottom surface of the signal input connection portion, the fourth output pad is provided on the bottom surface of the signal output connection portion, and the first signal connection plate is connected with the signal input A first through hole is provided on the portion, a second through hole is provided on the signal output connection portion, the first pad and the third pad are electrically connected through the first via, and the second pad and the fourth pad are electrically connected It is electrically connected through the second via hole.

In the aforementioned moldless inductor device, wherein the wire set has an insulating substrate, the wires are arranged on the insulating substrate, the insulating substrate is located in the hole of the iron core, and the two sides of the insulating substrate extend out of the two sides of the hole, and the first The signal input connection part of the signal connection board is provided with a first conductive terminal, and the signal output connection part is provided with a second conductive terminal, and the first conductive terminal and the second conductive terminal are electrically connected to both ends of the wire respectively.

In the aforementioned moldless inductance device, a second signal connection board is provided below the first signal connection board, a positioning hole is provided on the second signal connection board, and a signal input connection portion of the first signal connection board is connected to a signal output A positioning post extends separately under the part, and the positioning post is positioned in the positioning hole, so that the first signal connection board is positioned on the second signal connection board.

In the aforementioned moldless inductance device, a second signal connection board is provided below the first signal connection board, the first signal connection board is positioned on the surface of the second signal connection board, and two sides of the second signal connection board surface are respectively provided The first bonding pad and the second bonding pad, the first conductive terminal of the first signal connection board is electrically connected to the first bonding pad, and the second conductive terminal is electrically connected to the second bonding pad.

In the aforementioned moldless inductance device, the signal input connection part and the signal output connection part of the first signal connection board are connected to each other by the connection part, so that the signal input connection part, the signal output connection part and the connection part are connected A positioning space is formed for the iron core to be inserted to form a positioning.

Please refer to the first to fourth figures. It can be clearly seen from the figure that the first embodiment of the present invention is provided with a first signal connection board 1, an iron core 2 and a wire group 3, in which:

The first signal connection board 1 is provided with a signal input connection part 12 and a signal output connection part 13 on both sides, a base 11 is connected between the signal input connection part 12 and the signal output connection part 13, and a surface of the signal input connection part 12 is provided with The first pad 121 is provided with a third pad 122 on the bottom surface, the second pad 131 is provided on the surface of the signal output connection portion 13 and the fourth pad 132 is provided on the bottom surface, and the first signal connection board 1 is in the signal input connection portion 12 is provided with a first through hole 123, a signal output connection portion 13 is provided with a second through hole 133, the first pad 121 and the third pad 122 are electrically connected through the first through hole 123, the second pad 131 and the fourth pad 132 are electrically connected through the second via 133. In this embodiment, the first pad 121, the second pad 131, the third pad 122, and the fourth pad 132 are all arranged side by side.

The iron core 2 has holes 21 penetrating on both sides. In this embodiment, the holes 21 are arranged side by side, and the iron core 2 is fixed to the surface of the base 11 of the first signal connection board 1 by means of bonding, and the holes 21 Align the signal input connector 12 and the signal output connector 13 respectively.

At least one wire group 3 is arranged in the hole 21 of the iron core 2, the wire group 3 has a plurality of wires 31, the two ends of the wire 31 are respectively penetrated through the hole 21, and are respectively connected with the first pads 121 and The second pad 131 is electrically connected. Furthermore, the wire 31 is a copper wire or other metal wire, which is not limited.

The assembly process of the first embodiment is detailed as follows:

First, take a first signal connection board 1 and an iron core 2; as shown in the second figure, fix the iron core 2 on the surface of the base 11 of the first signal connection board 1 by bonding, and make the iron core 2 Is located between the first pad 121 and the second pad 131; then, each group of wires 3 is arranged in each hole 21, and the ends of the wires 31 of each wire group 3 are respectively connected to the corresponding group of first pads 121 Welding with the second pad 131.

Borrowing above, by placing the iron core 2 on the surface of the first signal connection board 1, and then arranging the wire groups 3 in the holes 21 corresponding to the iron core 2 respectively, and making the ends of the wires 31 of each wire group 3 Welding with the corresponding first pad 121 and the second pad 131 respectively, so as to replace the original way of winding the wire, so that the impedance when the common mode noise flows increases, the differential mode signal can flow more smoothly, and based on this Structural design, in the production process, you can use an automatic mechanism to pass the wire 31 through the hole 21 of the iron core 2 and weld the wire 31 to the first signal connection board 1, the degree of automation is greatly improved, ensuring the stability of production quality, Shorten the production cycle and reduce the cost of production.

Please refer to the fifth to ninth figures. It can be clearly seen from the figure that the difference between the second embodiment of the present invention and the first embodiment described above is that the lead group 6 has an insulating substrate 62 and the lead 61 is provided On the insulating substrate 62, in the present embodiment, two insulating substrates 62 are provided in the holes 51 of each iron core 5, the two insulating substrates 62 are U-shaped and are arranged symmetrically horizontally, and the insulating substrate 62 is provided on both sides Both sides of the hole 51 are extended, and the signal input connection part 41 and the signal output connection part 42 of the first signal connection board 4 are all arranged side by side, and the signal input connection part 41 and the signal output connection part 42 are respectively located in the iron core 5 On both sides, a first conductive terminal 411 is provided on the signal input connection portion 41, and both ends of the first conductive terminal 411 are exposed from the surface and side of the signal input connection portion 41, and a second conductive terminal is provided on the signal output connection portion 42 421, the two ends of the second conductive terminal 421 are exposed from the surface and side of the signal output connection part 42 respectively, and the first conductive terminal 411 and the second conductive terminal 421 are electrically connected to the two ends of the wire 61 respectively. Furthermore, a second signal connection board 7 is provided below the first signal connection board 4, a positioning hole 75 is provided on the second signal connection board 7, and a signal input connection part 41 of the first signal connection board 4 is connected to a signal output A positioning post 43 extends from below the portion 42. The positioning post 43 is positioned in the positioning hole 75 to position the first signal connecting plate 4 on the second signal connecting plate 7, and the surface of the second signal connecting plate 7 is provided on both sides There are a first pad 71 and a second pad 72, and a third pad 73 and a fourth pad 72 are provided on both sides of the bottom surface, and the first conductive terminal 411 of the first signal connection board 4 is electrically connected to The first bonding pad 71 and the second conductive terminal 421 are electrically connected to the second bonding pad 72, and the iron core 5 is fixed on the surface of the second signal connection board 7 by an adhesive method.

Please refer to the tenth figure. It can be clearly seen from the figure that the difference between the third embodiment of the present invention and the aforementioned second embodiment is that the signal input connection portion 82 and the signal output connection portion of the first signal connection board 8 Both ends of 83 are connected to each other by a connecting portion 81, so that a positioning space 84 is formed between the signal input connecting portion 82, the signal output connecting portion 83 and the connecting portion 81 for the iron core 5 to be inserted to form a positioning, and the first conductive terminal 821 is a plurality of groups disposed on the signal input connection portion 82, and second conductive terminals 831 are a plurality of groups disposed on the signal output connection portion 83.

1‧‧‧ First signal connection board 11‧‧‧Base 12‧‧‧Signal input connector 121‧‧‧First pad 122‧‧‧third pad 123‧‧‧First via 13‧‧‧Signal output connector 131‧‧‧Second pad 132‧‧‧ Fourth pad 133‧‧‧Second via 2‧‧‧Iron core 21‧‧‧hole 3‧‧‧ Lead set 31‧‧‧Wire 4‧‧‧ First signal connection board 41‧‧‧Signal input connector 411‧‧‧ First conductive terminal 42‧‧‧Signal output connector 421‧‧‧Second conductive terminal 43‧‧‧Positioning column 5‧‧‧Iron core 51‧‧‧hole 6‧‧‧ Lead set 61‧‧‧Wire 62‧‧‧Insulation substrate 7‧‧‧Second signal connection board 71‧‧‧First pad 72‧‧‧Second pad 73‧‧‧third pad 74‧‧‧ Fourth pad 75‧‧‧Locating hole 8‧‧‧ First signal connection board 81‧‧‧ Connection 82‧‧‧Signal input connector 821‧‧‧First conductive terminal 83‧‧‧Signal output connector 831‧‧‧Second conductive terminal 84‧‧‧ Positioning space

The first figure is a perspective external view of the first embodiment of the present invention. The second figure is a perspective view of partial components of the first embodiment of the present invention. The third figure is a perspective view of a partial component of another perspective of the first embodiment of the present invention. The fourth figure is a top view of the first embodiment of the present invention. The fifth figure is a perspective external view of a second embodiment of the present invention. The sixth figure is a schematic diagram of the assembly of the iron core and the wire group in the second embodiment of the present invention. The seventh figure is a schematic diagram of the assembly of the first signal connecting plate and the guide wire set of the second embodiment of the present invention. The eighth figure is a three-dimensional appearance of the first signal connecting plate and the guide wire assembly after being assembled in the second embodiment of the present invention. The ninth figure is a perspective external view of another perspective of the second embodiment of the present invention. The tenth figure is a perspective external view of a third embodiment of the present invention.

1‧‧‧ First signal connection board

11‧‧‧Base

12‧‧‧Signal input connector

121‧‧‧First pad

13‧‧‧Signal output connector

2‧‧‧Iron core

21‧‧‧hole

3‧‧‧ Lead set

31‧‧‧Wire

Claims (3)

A moldless inductance device has a first signal connection plate, an iron core and a wire set, characterized in that the iron core has holes penetrating on both sides, and the first signal connection plate is provided with signal input connections on both sides of the hole And the signal output connection part, and the wire set has wires, the two ends of the wire are respectively located on the surface of the signal input connection part and the signal output connection part of the first signal connection board, and the two ends of the wire are located in the hole of the iron core; and The lead set has an insulating substrate, the lead is disposed on the insulating substrate, the insulating substrate is located in the hole of the iron core, and the two sides of the insulating substrate extend out of the two sides of the hole, and the signal input connection portion of the first signal connection board is provided There is a first conductive terminal, a second conductive terminal is provided on the signal output connection portion, and the first conductive terminal and the second conductive terminal are electrically connected to both ends of the wire respectively; furthermore, a first signal connection plate is provided below The second signal connection board is provided with positioning holes, and the signal input connection part and the signal output connection part of the first signal connection board are respectively extended with positioning posts. The positioning posts are positioned in the positioning holes so that The first signal connection board is positioned on the second signal connection board. The moldless inductor device according to claim 1, wherein a second signal connection board is provided under the first signal connection board, the first signal connection board is positioned on the surface of the second signal connection board, and the second signal connection board surface A first pad and a second pad are provided on both sides. The first conductive terminal of the first signal connection board is electrically connected to the first pad, and the second conductive terminal is electrically connected to the second pad. The moldless inductor device according to claim 1, wherein both ends of the signal input connection part and the signal output connection part of the first signal connection board are connected to each other by a connection part, so that the signal input connection part and the signal output connection part A positioning space is formed between the connecting part and the iron core is inserted to form a positioning.

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