TWI683175B - Detecting method of circuit board - Google Patents

Abstract

A detecting method of circuit board includes a filtering step, a rejoining step, and an exposing step. The filtering step is implemented by determining the number of suitable circuit boards, which can be exposed under a first predetermined condition defined by a first film, and determining the number of unsuitable circuit boards, which cannot be exposed under the first predetermined condition. The rejoining step is implemented by finding a second predetermined condition defined by a second film, which can be used to expose at least one of the unsuitable circuit boards. The exposing step is implemented in an exposing apparatus, and the exposing apparatus has an environmental control mechanism to cool an ambient temperature in the exposing apparatus, so that when Y number of the suitable circuit boards, the first film, at least one of the unsuitable circuit boards, and the second film are in the exposing process at an ambient temperature, the ambient temperature can be maintained to be less than a predetermined temperature by the environmental control mechanism.

Description

Circuit board inspection method

The invention relates to a detection method, and also relates to a circuit board detection method.

Nowadays, the development of science and technology has driven the development of various electronic products, and most of the electronic products use printed circuit boards as their basic components. Therefore, providing excellent printed circuit boards is the development direction that various manufacturers want to pursue. In the existing circuit board production method, the exposure operation of the circuit board needs to be implemented with a negative film, but the circuit board often deforms the circuit board due to errors in the manufacturing process, thereby causing the size of each circuit board to be not exactly the same. Furthermore, when the circuit board is exposed to negative film, the most critical factor affecting the quality of the negative film is often the problem of expansion and contraction. If the negative film is too often shrinking or the expansion and contraction of the negative film are too large, it is easy to shorten the life of the negative film. . However, in the existing circuit board production process, there is no corresponding improvement plan for the expansion and contraction of the negative film.

Therefore, the inventor believes that the above-mentioned defects can be improved, and Naite devotes himself to research and cooperates with the application of scientific principles, and finally proposes a reasonable design and effectively improves the above-mentioned defects of the present invention.

An embodiment of the present invention is to provide a circuit board inspection method, which can effectively improve the defects generated by the existing circuit board production methods.

An embodiment of the present invention discloses a circuit board inspection method, including: a screening step: carrying out inspection on X circuit boards to be tested with a first preset value relative to a first negative film, screening out the first pre Y qualified circuit boards performing exposure operation under the set value, and Z elimination circuits that cannot perform exposure operation under the first preset value Board, and X=Y+Z; where X is a positive integer, and Y and Z are both integers not less than zero; a regeneration step: find out that at least one of the Z eliminated circuit boards can be eliminated A second preset value for the exposure operation of the circuit board; wherein, the second preset value is relative to a second negative film; and an exposure step: according to the first preset value and using the first negative film Sequentially performing exposure operations on the Y qualified circuit boards, and performing exposure operations on at least one of the eliminated circuit boards corresponding to the second negative film according to the second preset value; wherein, the exposure The steps are implemented in an exposure device, and the exposure device uses an environmental control mechanism to cool an ambient temperature in the exposure device, so that the Y qualified circuit boards, the first negative film, and at least One of the eliminated circuit board and the second negative film can maintain the ambient temperature below a predetermined temperature during the exposure operation in the exposure apparatus.

In summary, the circuit board detection method disclosed in the embodiments of the present invention is to cool the ambient temperature in the exposure device through the environmental control mechanism and maintain it below a predetermined temperature, thereby controlling the negative film (eg, the first negative film and (Second negative film) Perform exposure operation at an ambient temperature below the predetermined temperature, thereby preventing the negative film from greatly expanding and contracting, so as to increase the service life of the negative film.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limits.

1‧‧‧ Testing equipment

11‧‧‧Camera device

12‧‧‧Calculating device

2‧‧‧ film

21‧‧‧First film

21P‧‧‧Center

22‧‧‧Second negative

3‧‧‧Standard glass negative

4‧‧‧ circuit board to be tested

41‧‧‧ qualified circuit board

42‧‧‧ Elimination of circuit boards

4P‧‧‧Center

R1‧‧‧ First preset value

R2‧‧‧ Second preset value

W‧‧‧Width direction

L‧‧‧Long

100‧‧‧Exposure equipment

5‧‧‧Environmental Control Agency

51‧‧‧Temperature sensor

52‧‧‧cooling device

53‧‧‧Humidity controller

54‧‧‧Humidity sensor

61‧‧‧ exposure environment

62‧‧‧Bearing platform

FIG. 1 is a schematic flowchart of the circuit board inspection method of the present invention.

2 is a functional block diagram of a testing device used in the circuit board testing method of the present invention.

FIG. 3 is a schematic diagram of a film and a preset value of the circuit board detection method of the present invention.

4 is a schematic diagram (1) of the screening steps of the circuit board inspection method of the present invention.

5 is a schematic diagram (2) of the screening steps of the circuit board inspection method of the present invention.

6 is a schematic diagram of regeneration steps of the circuit board inspection method of the present invention.

7 is a schematic flowchart of the circuit board exposure method of the present invention.

FIG. 8 is a schematic flowchart of the circuit board detection method of the present invention.

9 is a schematic diagram of the functional block in FIG. 8.

[Example 1]

Please refer to FIG. 1 to FIG. 6, which is the first embodiment of the present invention. It should be noted that this embodiment corresponds to the relevant quantity and appearance mentioned in the drawings, and is only used to specifically describe the embodiment of the present invention. In order to understand the content of the present invention, it is not used to limit the protection scope of the present invention.

As shown in FIG. 1, this embodiment discloses a circuit board inspection method, and particularly refers to a circuit board inspection method before performing an exposure operation. The circuit board inspection method includes the following steps: a preparation step, a screening step, a regeneration step, and an exposure step. The specific implementation of each step will be described below, but the following description does not limit the necessary implementation order of each step.

Preparation steps: Please refer to FIG. 2 and FIG. 3 to provide a detection device 1 including an imaging device 11 and an arithmetic device 12 electrically connected to the imaging device 11 to pass the imaging device 11 of the detection device 1 The following various comparison or selection operations are performed with the arithmetic device 12. Among them, the camera device 11 can capture images of N kinds of negative films 2 and X images of the circuit board 4 to be tested and send them to the computing device 12. In this embodiment, the negative film 2 and the circuit board 4 to be tested are substantially quadrilateral. In this embodiment, the circuit board to be tested 4 refers to a circuit board that has not been exposed to the negative film 2 for exposure.

Furthermore, the arithmetic device 12 can compare the above-mentioned N kinds of negative films 2 and a Standard glass film 3 (N is a positive integer greater than 1), and each film 2 defines a coefficient of expansion and contraction related to the exposure operation of the circuit board. For example, the expansion and contraction coefficients of the standard glass negative film 3 in the mutually perpendicular width direction W and length direction L are both preset to 1, and the computing device 12 can be based on various images of the negative film 2 and the image of the standard glass negative film 3, By comparing the dimensions in the width direction W and the length direction L, the expansion and contraction coefficients of the various backsheets 2 in the width direction W and the length direction L (eg, 0.995, 1.005) are defined.

Furthermore, the standard glass negative 3 of this embodiment may be transparent, so as to facilitate the positioning of the two types of negatives 2 on the opposite surfaces of the standard glass negative 3, so that the imaging device 11 can obtain the standard glass at the same time The images of the negative film 3 and the two negative films 2 placed thereon can enable the computing device 12 to perform the expansion and contraction coefficient calculation of the two negative films 2 at the same time. It should be noted that although this embodiment uses the camera device 11 to simultaneously capture images of the standard glass film 3 and the two types of film 2 placed on it as the criterion for determining the expansion and contraction coefficient of the film 2, the present invention does not exclude Implement in other ways. For example, the image of the standard glass negative film 3 can be preset in the computing device 12 so that the camera device 11 only needs to capture images of various negative films 2, and then the computing device 12 can perform the expansion and contraction coefficient calculation of the negative film 2.

Screening steps: Please refer to FIG. 4 and FIG. 5 to perform the detection of the X number of circuit boards 4 under test with a first preset value R1, and screen out those that can perform exposure operations under the first preset value R1 Y eligible circuit boards 41 and Z eliminated circuit boards 42 that cannot perform exposure operations under the first preset value R1. Among them, X=Y+Z, X is a positive integer, and Y and Z are both integers not less than zero. In this embodiment, the first predetermined value R1 is defined as a virtual size range in which the size of a first negative film 21 shrinks inwards and expands outwards with respect to an allowable error (eg, less than 35 microns) (eg In FIG. 3, the area enclosed by the inner rectangular dashed line and the outer rectangular dashed line adjacent to the edge of the first negative film 21). Furthermore, the N kinds of negative films 2 include the above-mentioned first negative film 21, that is to say, the camera 11 has captured the image of the first negative film 21 and transmitted it to the transport 算装置12。 Computing device 12.

In more detail, the computing device 12 selects the circuit board to be tested 4 that can perform the exposure operation within the allowable error based on the images of the X circuit boards to be tested The number of the first negative film 21 is the largest. Moreover, the computing device 12 determines the Y eligible circuit boards 41 and the Z eliminated circuit boards 42 according to the image of the first negative film 21 and the images of the X circuit boards 4 to be tested transmitted from the camera device 11.

Further, in this embodiment, the screening step is to sequentially stack the first negative film 21 on each circuit board 4 to be tested, and the center point 21P of the first negative film 21 is substantially aligned or adjacent to The center point 4P of the circuit board under test 4 stacked on top of each other; then, when the size difference between the first negative film 21 and the circuit board under test 4 stacked on each other is larger or smaller than the allowable error (see FIG. 5), Then the circuit board 4 under test is determined to be an obsolete circuit board 42. On the contrary, when the size difference between the first film 21 and the circuit board 4 under test is within the allowable error (as shown in FIG. 4), the circuit board to be tested 4 stacked on top of each other is determined to be a suitable circuit board 41. In addition, although the above is an example in which the center point 21P of the first negative film 21 is substantially aligned with or adjacent to the center point 4P of the circuit board 4 to be stacked, the present invention is not limited thereto. In this embodiment, the center point 21P and the center point 4P are generally defined as intersections of lines connecting all vertices with respect to the center of the plane.

To put it another way, the process of determining the difference in size between the first negative film 21 and the circuit board 4 to be tested can also be: the first negative film 21 is provided with alignment parts at four corners (not shown in the figure). Marked), and the four corners of the circuit board 4 to be tested are also preset with corresponding alignment parts (not marked in the figure). Align one of the alignment portions of the first negative film 21 with one of the alignment portions of the circuit board 4 to be tested, and then obtain the other alignment portions of the first negative film 21 and the overlapping of the circuit board to be tested 4 The distance between the adjacent alignment parts, and then compare the above distance with the allowable error; if one of the distances measured by the first film 21 and the circuit board under test 4 at the four corners is greater than the allowable error, Then the circuit board 4 to be tested is judged to be a phase-out circuit board 42.

Regeneration step: Please refer to FIG. 6 to find a second preset value R2 that enables at least one of the Z eliminated circuit boards 42 to perform an exposure operation. When Z is greater than 1, the Z eliminated circuit boards 42 can perform exposure operations according to M preset values (M is greater than 1 and a positive integer less than Z), and the M preset values include the second The preset value R2 may further include a third preset value, a fourth preset value, a fifth preset value, and so on. Furthermore, among the M preset values, the second preset value R2 is the largest number of eliminated circuit boards 42 capable of performing exposure operations. In this embodiment, the second preset value R2 is defined as a virtual size range in which the size of a second negative film 22 shrinks inward and expands outward relative to the allowable error, and the N kinds of negative films 2 include The second film 22 above.

In more detail, the computing device 12 determines, based on the images of the Z obsolete circuit boards 42, the second negative film 22 that can perform exposure operations on at least one of the obsolete circuit boards 42 within the allowable error. For example, the expansion and contraction coefficient of the first negative film 21 is 1.005, and the size difference of the eliminated circuit board 42 shown in FIG. 5 is smaller than the allowable error compared to the size difference of the first negative film 21, so the computing device 12 is less than The expansion and contraction coefficient of the first negative film 21 is one of the screening conditions, and then the remaining negative film 2 is selected. For example, in this embodiment, the second negative film 22 shown in FIG. 6 having the expansion and contraction coefficient of 0.995 is selected.

In this way, since the size of each circuit board is not exactly the same, the circuit board under test 4 of this embodiment performs the above-mentioned circuit board inspection method before performing the exposure operation with the film 2 to avoid the circuit board under test 4 and the film 2 The alignment problem occurs during the exposure operation, and the circuit board inspection method can select other suitable negatives according to the above-mentioned obsolete circuit board 42 through the regeneration step, thereby effectively reducing the elimination rate of the circuit board and saving production time.

[Example 2]

Please refer to FIG. 7, which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the same points will not be described again. The main differences between the two embodiments are as follows.

Specifically, this embodiment discloses a circuit board exposure method, including the circuit board inspection method described in embodiment 1 and an exposure step. Wherein, the exposure step is: sequentially performing exposure operations on the Y suitable circuit boards 41 according to the first preset value R1, and enabling at least one of the corresponding ones according to the second preset value R2 The circuit board 42 is eliminated for exposure operation. Further, according to the M preset values, the corresponding eliminated circuit boards 42 are respectively exposed to light.

It should be noted that if the number of obsolete circuit boards 42 corresponding to a certain preset value is too small (eg, less than three), the manufacturing cost of the exposure step only for the too few obsolete circuit boards 42 mentioned above, On the contrary, it is higher than directly discarding the excessively small elimination circuit board 42, so the excessively low elimination circuit board 42 can be directly discarded without further performing the above-mentioned exposure step.

[Embodiment 3]

Please refer to FIG. 8 and FIG. 9, which is the third embodiment of the present invention. This embodiment is similar to the above-mentioned second embodiment, and the same parts will not be repeated here. The main differences between this embodiment and the above two embodiments are as follows .

Specifically, this embodiment discloses a circuit board inspection method, which includes a preparation step, a screening step, a regeneration step, and an exposure step. Among them, the content of the above preparation steps, screening steps, regeneration steps, and exposure steps that have been recorded in Embodiments 1 and 2 will not be repeated in this embodiment, and this embodiment mainly further describes how to improve the exposure step in the following .

Further, the exposure step is implemented in an exposure apparatus 100 in this embodiment. Wherein, the exposure apparatus 100 includes an exposure machine (not shown in the figure), an environmental control mechanism 5, and at least one carrying platform 62.

The exposure machine (not shown) is used to provide negative film for exposure and development operations And the circuit board totem layout equipment, the exposure machine usually forms an exposure area and is relatively in an independent environment (generally belongs to a high temperature and low humidity environment), and the inside of the exposure apparatus 100 is defined as an exposure in this embodiment Environment 61. Wherein, the temperature of the exposure environment 61 is defined as an exposure temperature, and the exposure temperature is an ambient temperature under an exposure operation, and the humidity of the exposure environment 61 is defined as an ambient humidity.

The carrying platform 62 is used to carry the above-mentioned negative film 2 (such as the first negative film 21 or the second negative film 22) for exposure. Either of the first negative film 21 and the second negative film 22 can be divided into silver halide (commonly known as black and white film), azo (commonly known as brown film), metal negative film, or glass according to different materials before exposure. Glass (mask), but the invention is not limited to this.

That is to say, under a specific relative humidity, the size of the above-mentioned negative film 2 will increase with the increase of the ambient temperature, and shrink with the decrease of the ambient temperature, thus forming a phenomenon of ups and downs. Furthermore, the negative film 2 cannot be controlled in advance due to its own material during manufacturing, so the humidity of the negative film 2 is consistent with the humidity of each production area. Therefore, during the exposure operation, the ambient temperature of the negative film 2 should be kept as low as possible. Pre-set the temperature to avoid the phenomenon of large expansion and contraction.

In this embodiment, the predetermined temperature refers to a safe temperature value in which the above-mentioned negative film 2 (including the first negative film 21 and the second negative film 22) can be kept in a position in which the phenomenon of substantial expansion and contraction is less likely to occur. In addition, in this embodiment, the first negative film 21 and the second negative film 22 may have different deformation temperatures according to different materials, that is, the first negative film 21 has a deformation temperature, and the second negative film 22 also has One deformation temperature. According to this, the predetermined temperature is not greater than the deformation temperature of the first negative film 21 nor the deformation temperature of the second negative film 22.

To put it another way, when the temperature value of the first negative film 21 reaches its deformation temperature, the first negative film 21 will deform, that is, the deformation temperature is, for example, a critical temperature value at which the first negative film 21 deforms; if the first A film 21 itself is too often deformed with the rise or fall of the ambient temperature, it is easy to shorten the first bottom The life of the film 21. Therefore, the preset temperature is used to prevent the temperature value of the first negative film 21 from reaching its deformation temperature as much as possible, thereby reducing the probability of deformation of the first negative film 21.

Furthermore, when the second negative film 22 also produces the same expansion and contraction deformation as the first negative film 21, the preset temperature is used to make the temperature value of the second negative film 22 itself not reach its deformation temperature as much as possible to reduce The probability of deformation of the second negative film 22.

In addition, the circuit board detection method in this embodiment defines a first preset value and a second preset value, and the first preset value R1 is defined relative to the first negative film 21, and the second preset value R2 It is defined relative to the second negative film 22. In this embodiment, the first preset value R1 is defined as the virtual size range in which the size of the first negative film 21 shrinks inwards and expands outwards with respect to the allowable error (eg, less than 35 microns) (as shown in FIG. 3, adjacent The area enclosed by the inner rectangular dashed line and the outer rectangular dashed line at the edge of the first negative film 21), and the second preset value R2 is defined as the virtual size of the second negative film 22 shrinking inwards and expanding outwards relative to the allowable error Size range.

The environmental control mechanism 5 includes a temperature sensor 51, a cooling device 52, a humidity controller 53, and a humidity sensor 54. It should be noted that, in this embodiment, the environmental control mechanism 5 includes the above components as an example, but in other embodiments not shown in the present invention, the environmental control mechanism 5 may also include At least one of the temperature sensor 51, the cooling device 52, the humidity controller 53, and the humidity sensor 54.

The temperature sensor 51 is used to detect the temperature of the carrying platform 62; the cooling device 52 in this embodiment includes an ice water machine or an atomizing cooling device for cooling the ambient temperature, and the environmental control mechanism 5 According to the temperature value detected by the temperature sensor 51, the operation of the cooling device 52 (such as the air output of the ice water machine or the atomizing cooling device) is adjusted accordingly.

In more detail, the above ice water machine is generally provided with an air outlet and a vent, and an air flow fan is provided in the vent, which is controlled by the environmental control mechanism 5 The air flow fan blows out the slightly moist cold air generated in the machine through the air outlet, which can blow the cold air toward the exposure environment 61, so that the ambient temperature can achieve a non-pure dry cooling effect, but the present invention is not limited to this. In addition, the above-mentioned atomization temperature reducer can also control the appropriate blowing of atomized cold wind according to the ambient temperature and relative environmental humidity of the exposure environment 61, so that the ambient temperature achieves a non-pure dry cooling effect.

The humidity controller 53 is used to control the ambient humidity of the exposure environment 61 in the exposure apparatus 100. The humidity sensor 54 is used to detect the ambient humidity, so that the environmental control mechanism 5 can adjust the operation of the humidity controller 53 according to the humidity value detected by the humidity sensor 54.

As described above, in this embodiment, the exposure apparatus 100 uses the environment control mechanism 5 to cool the ambient temperature of the exposure environment 61 in the exposure apparatus 100, so that the Y qualified circuit boards 41 and at least one The elimination circuit board 42 can maintain the ambient temperature below a predetermined temperature during the exposure operation in the exposure apparatus 100.

For example, in this embodiment, the environmental control mechanism 5 can maintain the ambient temperature below a predetermined temperature by the ice water machine or the atomizing temperature reducer of the temperature reducing device 52. In this embodiment, the environmental control mechanism 5 controls the ice machine or mist of the cooling device 52 according to the ambient temperature and relative ambient humidity of the exposure environment 61 measured by the temperature sensor 51 and the humidity sensor 54 The desuperheater (or humidity controller 53) generates a slight amount of moist cold air or atomized cold air to blow towards the supporting platform 62 to achieve a non-pure and dry cooling effect on the exposure environment 61 to maintain the ambient temperature below a predetermined temperature.

In addition, although the circuit board detection method is described in this embodiment by including at least part of the content contained in the second embodiment, the present invention is not limited to this. For example, the circuit board inspection method may also include: performing an exposure operation on at least one circuit board 4 and a negative film 2 in an exposure apparatus 100. Wherein, the exposure apparatus 100 uses an environmental control mechanism 5 to cool an ambient temperature in the exposure apparatus 100, so that at least one of the circuit board 4 and the negative film 2 can be During the exposure operation in the exposure apparatus 100, the ambient temperature is maintained below a predetermined temperature.

[Technical Effects of Embodiments of the Invention]

According to the above embodiment, since the size of each circuit board is not exactly the same, the circuit board 4 to be tested in this embodiment performs the above steps of circuit board inspection before performing the exposure operation with the negative film 2.

In summary, the circuit board detection method disclosed in the embodiment of the present invention is to cool the ambient temperature in the exposure apparatus 100 through the environmental control mechanism 5 and maintain the ambient temperature below a predetermined temperature to control the negative film ( For example, the first negative film and the second negative film) are exposed at an ambient temperature below the predetermined temperature to prevent the negative film from greatly expanding and contracting, so as to increase the service life of the negative film.

Wherein, the exposure step is implemented in the exposure apparatus 100, and the environmental control mechanism 5 controls the ambient temperature and the ambient humidity of the exposure environment 61 during the exposure process (for example: cooling the temperature of the supporting platform 62 where the negative film 2 is located and the surrounding vicinity Temperature), so that the negative film 2 can be at a uniform temperature and humidity during the exposure operation, thereby reducing the probability of the negative film 2 from rising and shrinking, achieving the effect of maintaining the size stability of the negative film 2, and increasing the service life of the negative film 2.

Furthermore, since at least one circuit board 4 effectively performs the exposure operation at an ambient temperature below a predetermined temperature, thereby avoiding the problem of abnormal alignment between the circuit board 4 to be tested and the negative film 2 during the exposure operation, and through the regeneration step Other suitable negatives can be selected according to the above-mentioned obsolete circuit board 42 to effectively reduce the elimination rate of the circuit board and save production time. With this, the embodiment can further greatly improve the production quality and efficiency.

The above are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent changes and modifications made in accordance with the patent application scope of the present invention shall fall within the scope of the present invention.

100‧‧‧Exposure equipment

5‧‧‧Environmental Control Agency

51‧‧‧Temperature sensor

52‧‧‧cooling device

53‧‧‧Humidity controller

54‧‧‧Humidity sensor

61‧‧‧ exposure environment

62‧‧‧Bearing platform

2‧‧‧ film

Claims (9)

A circuit board detection method includes: a screening step: performing detection of X circuit boards to be tested with a first preset value relative to a first negative film, and screening for exposure under the first preset value Y qualified circuit boards for operation and Z eliminated circuit boards that cannot be exposed under the first preset value, and X=Y+Z; where X is a positive integer, and Y and Z are not less than An integer of zero; a regeneration step: find a second preset value that enables at least one of the Z eliminated circuit boards to perform an exposure operation; wherein, the second preset value is Relative to a second negative film; and an exposure step: according to the first preset value and sequentially using the first negative film to expose the Y suitable circuit boards, and according to the second preset value And use the second negative film to expose at least one of the corresponding eliminated circuit boards; wherein, the exposure step is performed in an exposure device, and the exposure device uses an environmental control mechanism to perform the exposure An ambient temperature in the device is cooled so that the Y qualified circuit boards, the first negative film, at least one of the eliminated circuit boards, and the second negative film can be exposed in the exposure device During the operation, the ambient temperature is maintained below a predetermined temperature. The circuit board inspection method according to claim 1, wherein the first preset value is defined as a virtual size range in which the size of the first negative film shrinks inward and expands outward with respect to an allowable error, and The second preset value is defined as a virtual size range in which the size of the second negative film shrinks inward and expands outward relative to the allowable error; wherein the predetermined temperature is not greater than the first negative film A deformation temperature is also not greater than a deformation temperature of the second negative film. The circuit board detection method according to claim 2, wherein the environmental control mechanism includes an ice water machine or an atomizing temperature reducer to maintain the ambient temperature at all Said below the predetermined temperature. The circuit board inspection method according to claim 3, wherein the exposure apparatus includes at least one carrying platform for carrying the first negative film or the second negative film; the environmental control mechanism includes a temperature sensor For detecting the temperature of at least one of the carrying platforms, and the environmental control mechanism adjusts the ice machine or the atomizer accordingly according to the temperature value detected by the temperature sensor The air volume of the desuperheater. The circuit board detection method according to any one of claims 2 to 4, which further provides a camera device and an arithmetic device electrically connected to the camera device; before the screening step, the camera device captures Taking images of N kinds of negative films and X images of the circuit board to be tested and transmitting them to the computing device; in the screening step, the computing device is based on X images of the circuit board to be tested Among the N kinds of negative films, the first negative film with the largest number of the circuit boards to be tested that can perform the exposure operation within the allowable error is selected, and N is a positive integer greater than 1. The circuit board inspection method according to claim 5, wherein the N kinds of negative films include the second negative film; before the screening step, the arithmetic device compares the N kinds of negative films and a standard glass negative film, and Each of the negative films defines a coefficient of expansion and contraction related to the exposure operation of the circuit board. The circuit board inspection method according to any one of claims 2 to 4, wherein, in the screening step, the first negative film is sequentially stacked on each of the circuit boards to be tested, and the The center point of the first negative film is aligned with or adjacent to the center point of the stacked circuit boards under test, when the size difference between the first negative film and the stacked circuit boards under test is larger or smaller than the allowable When there is an error, the stacked circuit boards under test are determined to be one of the eliminated circuit boards. The circuit board detection method according to claim 1, wherein the environmental control mechanism includes a humidity controller for controlling an environmental humidity in the exposure device. The circuit board detection method according to claim 8, wherein the environmental control mechanism includes a humidity sensor for detecting the environmental humidity, and the environmental control mechanism is detected based on the humidity sensor The measured humidity value adjusts the operation of the humidity controller accordingly.

Images