TWI682604B - Package structure for edge-emitting laser - Google Patents
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Description
本發明是有關於一種封裝結構,且特別是有關於一種邊射型雷射之封裝結構。The present invention relates to a packaging structure, and in particular to an edge-emitting laser packaging structure.
傳統的雷射發光元件以引腳型封裝結構安裝在基板上,其安裝面與準直透鏡之間的垂直距離過大(大於9mm),使得封裝結構的整體高度增加,體積相對增加,因而產生佔用空間過大等缺點。The traditional laser light emitting element is mounted on the substrate in a lead-type packaging structure, and the vertical distance between the mounting surface and the collimating lens is too large (greater than 9mm), so that the overall height of the packaging structure is increased, and the volume is relatively increased, resulting in occupation Shortcomings such as too much space.
因此,如何減少封裝結構的整體高度,為業界亟欲克服之課題。Therefore, how to reduce the overall height of the packaging structure is an issue that the industry urgently wants to overcome.
本發明係有關於一種邊射型雷射之封裝結構,使用兩個反射元件改變邊射型雷射的傳輸路徑,可減少封裝結構的整體高度,並可保持出光軸在封裝結構的中心,更適合應用於可攜式電子裝置。The invention relates to a package structure of an edge-beam laser. Using two reflective elements to change the transmission path of the edge-beam laser can reduce the overall height of the package structure and keep the optical axis at the center of the package structure. Suitable for portable electronic devices.
根據本發明之一方面,提出一種邊射型雷射之封裝結構,包括一載板、一殼體、一邊射型雷射、一第一反射元件、一第二反射元件以及一繞射光學鏡片。載板具有一承載面。殼體設置於承載面上,殼體內部具有一容置槽,殼體的頂面具有一開口以及垂直頂面和承載面的一中心線。邊射型雷射設置於容置槽中,且位於承載面上,邊射型雷射具有一出光面,用以發射一雷射光。第一反射元件設置於容置槽中,與出光面間隔相對。第二反射元件設置於容置槽中,且位於邊射型雷射上方的中心線上。繞射光學鏡片設置於殼體的頂面,其中雷射光經由第一反射元件及第二反射元件反射後,並通過繞射光學鏡片以射出殼體之外。According to one aspect of the present invention, an edge-type laser package structure is provided, which includes a carrier board, a housing, an edge-type laser, a first reflective element, a second reflective element, and a diffractive optical lens . The carrier board has a bearing surface. The casing is arranged on the bearing surface, the casing has an accommodating groove, the top surface of the casing has an opening, and a vertical top surface and a center line of the bearing surface. The side-firing laser is disposed in the accommodating groove and located on the bearing surface. The side-firing laser has a light-emitting surface for emitting a laser light. The first reflective element is disposed in the accommodating groove, and is spaced apart from the light exit surface. The second reflective element is disposed in the accommodating groove and located on the center line above the edge-fired laser. The diffractive optical lens is disposed on the top surface of the housing, wherein the laser light is reflected by the first reflective element and the second reflective element, and passes through the diffractive optical lens to exit the housing.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above and other aspects of the present invention, the following examples are specifically described in conjunction with the accompanying drawings as follows:
以下係提出實施例進行詳細說明,實施例僅用以作為範例說明,並非用以限縮本發明欲保護之範圍。以下是以相同/類似的符號表示相同/類似的元件做說明。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考所附圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。The following is an example for detailed description. The example is only used as an example, not intended to limit the scope of the present invention. The following description uses the same/similar symbols to indicate the same/similar components. Directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions referring to the drawings. Therefore, the directional terminology is used to illustrate rather than limit the invention.
依照本發明之一實施例,提出一種邊射型雷射(Edge Emitting Laser,EEL)之封裝結構。邊射型雷射為一種半導體元件,例如是砷化鎵晶片,其藉由光子在共振腔中來回反射產生共振放大(resonance),再使同調性(coherence)的高能量光束由晶片側邊的出光面射出,以產生雷射光,所以稱之為「邊射型雷射」。此種雷射功率高,且投射出來的光場可呈橢圓形。相對於面射型雷射(Surface Emitting Laser,SEL),其雷射光由晶片的表面射出,所以稱為「面射型雷射」,此種雷射功率較低,且投射出來的光場可呈正圓形。According to an embodiment of the invention, an edge emitting laser (EEL) packaging structure is proposed. An edge-emitting laser is a semiconductor device, such as a gallium arsenide chip, which generates resonance resonance by photon reflection back and forth in the resonant cavity, and then enables a coherence (coherence) high-energy beam from the side of the chip The light exit surface is emitted to produce laser light, so it is called "edge-shot laser". The laser power is high, and the projected light field can be elliptical. Compared with the surface emitting laser (SEL), the laser light is emitted from the surface of the wafer, so it is called "surface emitting laser". This kind of laser has low power and the projected light field can be It is a perfect circle.
在應用上,邊射型雷射或面射型雷射之封裝結構可做為一點陣投射器(dot projector),用以投射結構光在目標物上,以供影像感測器進行三維立體影像的深度識別或人臉辨識等。In application, the package structure of the edge-beam laser or the surface-beam laser can be used as a dot projector to project the structured light on the target object for the image sensor to carry out three-dimensional stereoscopic images Depth recognition or face recognition, etc.
請參照第1及2圖,依照本發明一實施例之邊射型雷射之封裝結構100,包括一載板110、一殼體120、一邊射型雷射130、一第一反射元件140以及一第二反射元件150。載板110具有一承載面112。殼體120設置於承載面112上,殼體120的底面121例如以黏著膠固定在承載面112上,以使殼體120內部構成一密封空間。Referring to FIGS. 1 and 2, the
在一實施例中,殼體120之剖面例如為ㄇ字形結構,其內部具有一容置槽124。殼體120的頂面122具有一開口123,開口123與容置槽124相連通。殼體120的頂面122較佳為平行承載面112,且相隔一預定距離。開口123位於殼體120遠離載板110的一側,且開口123之中心大致上位於中心線C上。中心線C大致上位於殼體120的中央,且中心線C垂直於殼體120的頂面122與承載面112。In one embodiment, the cross-section of the
請參照第2圖,在一實施例中,邊射型雷射之封裝結構100更可包括一準直透鏡160、一固定件162以及一繞射光學鏡片164。準直透鏡160設置於開口123中,且準直透鏡160的中心大致上位於中心線C上。準直透鏡160可使雷射光L形成平行中心線C的光束,也就是雷射光平行光軸,以減少光傳播的能量損失。繞射光學鏡片164可設置於固定件162內並經由固定件162設置殼體120的頂面122上。然而,繞射光學鏡片164亦可經由其他方式設置於殼體120的頂面122,不限定圖式中所繪示的實施方式。繞射光學鏡片164用以對通過準直透鏡160的光束進行整型並向外輸出,透過繞射光學鏡片164的紋路設計,可使封裝結構產生特定結構光。Please refer to FIG. 2. In an embodiment, the edge-type
邊射型雷射130設置於容置槽124中,且位於載板110的承載面112上。邊射型雷射130具有一出光面132,用以發射一雷射光L。邊射型雷射130例如以固晶膠表面黏著方式固定於承載面112上,載板110例如是電路板,其利用導線與邊射型雷射130電性連接。然而,邊射型雷射130亦可經由其他方式設置於承載面112上,不限定圖式中所繪示的實施方式。The edge-
第一反射元件140設置於容置槽124中,且位於載板110的承載面112上。也就是說,第一反射元件140與邊射型雷射130共平面設置,且相隔一預定間距。在一實施例中,第一反射元件140可利用黏膠或插接的方式固定在承載面112上,且第一反射元件140具有一第一反射面142,第一反射面142例如為一反射鏡面或一反光塗層。第一反射元件140較佳為反射率大於80%的反射鏡或菱鏡,以減少光損耗。The first
第二反射元件150設置於容置槽124中,且位於邊射型雷射130上方的中心線C上。也就是說,第一反射元件140與邊射型雷射130非共平面設置,且第一反射元件140與第二反射元件150相隔一預定間距,第一反射元件140與第二反射元件150具有一高度差。The second
第一反射元件140及第二反射元件150例如為錐形或直角三角形,其尺寸可根據實際需求調整。在一實施例中,第二反射元件150的高度及斜面長度例如為第一反射元件140的高度及斜面長度的至少3倍,以使第二反射元件150具有足夠大的反射面積將雷射光L導向殼體120的中央。The first
請參照第2圖,在一實施例中,一固定架114設置於容置槽124中,第二反射元件150可設置於固定架114上,使第二反射元件150位於邊射型雷射130上方。固定架114例如以黏膠或插接的方式固定在承載面112上。第二反射元件150可利用黏膠或插接的方式固定在固定架114上,使第二反射元件150的底面相對於承載面112具有一高度差。在一實施例中,固定架114例如為T型,固定架114包括一水平面114a以及一垂直面114b,第二反射元件150設置於水平面114a上方,水平面114a與承載面112平行且具有一高度差,垂直面114b連接於水平面114a與承載面112之間,上述的高度差大致上與邊射型雷射130的高度相當,以減少封裝結構100的整體高度。此外,第二反射元件150具有一第二反射面152,第二反射面152例如為一反射鏡面或一反光塗層。第二反射元件150較佳為反射率大於80%的反射鏡或稜鏡,以減少光損耗。Please refer to FIG. 2, in an embodiment, a
請參照第3圖,其繪示雷射光L之光路圖。邊射型雷射130具有一出光面132,朝向第一反射元件140。雷射光L由出光面132出射之後,經由第一反射面142反射而到達第二反射面152。第一反射面142相對於出光軸C具有一第一夾角θ,第二反射面152相對於出光軸C具有一第二夾角α,第一夾角θ和第二夾角α的總合為45度。Please refer to FIG. 3, which shows the optical path diagram of the laser light L. The edge-emitting
請參照第3圖,雷射光L以一第一入射角θ到達第一反射面142,再以一第一反射角θ反射。接著,當雷射光L以一第二入射角到達第二反射面152時,雷射光L相對於水平線H的夾角與第一入射角及第一反射角之和互為內錯角,因此可得知雷射光L相對於水平線H的夾角可為第一夾角θ的兩倍,即等於2θ。定義雷射光L與第二反射面152的夾角為第二夾角α,其中第二入射角可定義為第二夾角α的餘角。Please refer to FIG. 3, the laser light L reaches the first reflecting
接著,雷射光L再以一第二反射角反射之後,雷射光L大致上在垂直軸向上沿著中心線C出光。由圖可知,第二反射面152與水平線H的夾角為第一反射角的兩倍與第二夾角α之和,即等於2θ+α,其對頂角也同樣為2θ+α。此外,由於第二反射面152與水平線H的夾角(2θ+α)與第二夾角α之和等於90度,即2(θ+α)=90度,因此可得知第一夾角θ與第二夾角α之和為45度。Then, after the laser light L is reflected at a second reflection angle, the laser light L is emitted along the center line C substantially in the vertical axis. It can be seen from the figure that the included angle between the second reflecting
根據上述的公式推導,當第一夾角θ與第二夾角α之和為45度時,即第一反射面142與出光軸C的夾角以及第二反射面152與出光軸C的夾角之和為45度時,雷射光L之光路可沿著出光軸C射出,且雷射光L之光路大致上維持在封裝結構100的中央,而不會偏移至第一反射元件140的上方。因此,可避免雷射光L之光路偏移,進而減少調校的時間。According to the above formula, when the sum of the first included angle θ and the second included angle α is 45 degrees, the sum of the included angle between the first
此外,邊射型雷射130之雷射光L經過二次反射之後,光程距離增加,因此,殼體120的頂面122至載板110的承載面112的垂直距離可大幅縮小,例如小於5mm,以減少封裝結構100的整體高度,且封裝結構100的體積也相對減少,以符合市場的需求。In addition, after the laser light L of the edge-emitting
接著,請參照第4圖,其繪示具有多個準直透鏡160的邊射型雷射之封裝結構100的示意圖,其配置方式與上述實施例大致相同,不同之處在於:多個準直透鏡160設置於開口123中,且第二反射元件150的外型及高度可改變,其符合封裝結構100的整體高度。在本實施例中,雖然第二反射元件150的高度減少,但雷射光L仍可經由第一反射元件140及第二反射元件150反射後,穿過準直透鏡160及繞射光學鏡片164,並沿著出光軸C射出殼體120之外。本實施例使用多個準直透鏡160,相較於使用一個準直鏡160可得到較佳的光型。Next, please refer to FIG. 4, which illustrates a schematic diagram of an edge-type
接著,請參照第5圖,其繪示具有結合為一體的繞射光學鏡片164及準直透鏡160的邊射型雷射之封裝結構100的示意圖,其配置方式與上述實施例大致相同,不同之處在於:繞射光學鏡片164與準直透鏡160結合為單一元件165,如此,繞射光學鏡片164與準直透鏡160可直接設置於殼體120的開口123中,無須再安裝用以固定繞射光學鏡片164的固定件162,以減少元件的數量,且能進一步減少封裝結構100的整體高度。Next, please refer to FIG. 5, which illustrates a schematic diagram of a
接著,請參照第6圖,其繪示固定架114一體成形於殼體120內部的邊射型雷射之封裝結構100的示意圖,其配置方式與上述實施例大致相同,不同之處在於:固定架114與殼體120結合為單一元件,例如以射出成形的方式一體成形,如此,可減少元件的數量且減少元件安裝的時間。此外,上述實施例中,開口123的孔徑小於容置槽124的寬度尺寸,而在本實施例中,殼體120例如為一中空圓柱體,其開口123的孔徑例如與容置槽124的尺寸相等,以進一步減少封裝結構100的體積。Next, please refer to FIG. 6, which shows a schematic diagram of a
本發明上述實施例所揭露之邊射型雷射之封裝結構,可克服習知邊射型雷射的安裝面與準直透鏡之間的垂直距離過大的問題,以減少封裝結構的整體高度。此外,邊射型雷射之雷射光經過二次反射之後,可將雷射光之光路大致上維持在封裝結構的中央,因此可避免傳統雷射光之光路需再經過光路偏移誤差的調校,進而減少調校的時間。The package structure of the edge-type laser disclosed in the above embodiments of the present invention can overcome the problem that the vertical distance between the mounting surface of the conventional edge-type laser and the collimator lens is too large, so as to reduce the overall height of the package structure. In addition, after the secondary reflection, the laser light can maintain the optical path of the laser light roughly in the center of the package structure, thus avoiding the need to adjust the optical path offset error of the traditional laser light path. In turn, the adjustment time is reduced.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.
100‧‧‧邊射型雷射之封裝結構
110‧‧‧載板
112‧‧‧承載面
114‧‧‧固定架
114a‧‧‧水平面
114b‧‧‧垂直面
120‧‧‧殼體
121‧‧‧底面
122‧‧‧頂面
123‧‧‧開口
124‧‧‧容置槽
130‧‧‧邊射型雷射
132‧‧‧出光面
140‧‧‧第一反射元件
142‧‧‧第一反射面
150‧‧‧第二反射元件
152‧‧‧第二反射面
160‧‧‧準直透鏡
162‧‧‧固定件
164‧‧‧繞射光學鏡片
165‧‧‧單一元件
C‧‧‧出光軸
L‧‧‧雷射光
θ‧‧‧第一夾角
α‧‧‧第二夾角
H‧‧‧水平線100‧‧‧Package structure of side-firing
第1圖繪示依照本發明一實施例的邊射型雷射之封裝結構的示意圖。 第2圖繪示具有雙反射元件的邊射型雷射之封裝結構的內部示意圖。 第3圖繪示雷射光的光路圖。 第4圖繪示具有多個準直透鏡的邊射型雷射之封裝結構的內部示意圖。 第5圖繪示具有一體成形的繞射光學鏡片及準直透鏡的邊射型雷射之封裝結構的內部示意圖。 第6圖繪示固定架一體成形於殼體內部的邊射型雷射之封裝結構的內部示意圖。FIG. 1 is a schematic diagram of a package structure of an edge-firing laser according to an embodiment of the invention. FIG. 2 shows an internal schematic diagram of an edge-beam laser package structure with dual reflective elements. Figure 3 shows the optical path diagram of laser light. FIG. 4 shows an internal schematic diagram of an edge-type laser package structure with multiple collimating lenses. FIG. 5 shows an internal schematic diagram of an edge-type laser package structure with integrally formed diffractive optical lens and collimating lens. FIG. 6 is an internal schematic view of a package structure of an edge-beam laser in which the fixing frame is integrally formed inside the casing.
100‧‧‧邊射型雷射之封裝結構 100‧‧‧Package structure of side-firing laser
110‧‧‧載板 110‧‧‧ carrier board
112‧‧‧承載面 112‧‧‧ Bearing surface
114‧‧‧固定架 114‧‧‧Fixing frame
114a‧‧‧水平面 114a‧‧‧horizontal
114b‧‧‧垂直面 114b‧‧‧Vertical
120‧‧‧殼體 120‧‧‧Housing
121‧‧‧底面 121‧‧‧Bottom
122‧‧‧頂面 122‧‧‧Top
123‧‧‧開口 123‧‧‧ opening
124‧‧‧容置槽 124‧‧‧Accommodation slot
130‧‧‧邊射型雷射 130‧‧‧Laser fire
132‧‧‧出光面 132‧‧‧Glossy
140‧‧‧第一反射元件 140‧‧‧First reflection element
142‧‧‧第一反射面 142‧‧‧First reflection surface
150‧‧‧第二反射元件 150‧‧‧Second reflection element
152‧‧‧第二反射面 152‧‧‧Second reflection surface
160‧‧‧準直透鏡 160‧‧‧collimating lens
162‧‧‧固定件 162‧‧‧Fixed parts
164‧‧‧繞射光學鏡片 164‧‧‧diffractive optical lens
C‧‧‧中心線(光軸) C‧‧‧Centerline (optical axis)
L‧‧‧雷射光 L‧‧‧Laser
Claims (10)
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TW107141662A TWI682604B (en) | 2018-11-22 | 2018-11-22 | Package structure for edge-emitting laser |
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TW202021217A TW202021217A (en) | 2020-06-01 |
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Citations (1)
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US20020041562A1 (en) * | 1999-06-23 | 2002-04-11 | Ian Redmond | Beamshaper for optical head |
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US20020041562A1 (en) * | 1999-06-23 | 2002-04-11 | Ian Redmond | Beamshaper for optical head |
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