TWI680632B - Circuit structure of high power power supply - Google Patents

Abstract

A circuit structure of a high-power power supply, which has at least one first-stage voltage supply module and one-stage voltage supply module and provides multiple output voltage functions. The secondary voltage supply module is provided with a second resonance. Converter, a second synchronous rectifier, an OR gate and a buck, the second synchronous rectifier is electrically connected to the second resonant converter, the OR gate and the buck, the second resonant converter The converter uses the conversion voltage of the first-stage voltage supply module to form a first-stage voltage, so that the second synchronous rectifier, the OR gate, and the step-down converter respectively output a first-stage voltage and a second-stage voltage With a third secondary voltage.

Description

Circuit structure of high power power supply

The invention belongs to the technical field of power supply equipment, and particularly relates to a circuit structure of a high-power power supply. The secondary side uses a LLC converter with a synchronous rectifier (SR Rect.). The circuit architecture improves the energy conversion efficiency of the overall power supply.

For applications with a wide range of input voltages and high output currents, compared to linear regulators, Switch Power Supply (SPS) has a significant high efficiency advantage and presents a stronger market applicability And its common circuit architecture is nothing more than Flyback, Buck, Boost, Forward and Push-pull. For example, as shown in FIG. 1, the current power supply 1 with multiple output voltage functions may include an EMI Filter 10, a bridge rectifier 11, and a Power Factor Corrector Converter. PFC Converter) 12, an LLC Converter 13, an SR Rect. 14, at least one step-down converter 15 and a flyback converter 16, and the bridge rectifier 11 is electrically connected to the EMI Filter 10 and the PFC Converter 12, the LLC Converter 13 is electrically connected to the PFC Converter 12, the SR Rect. 14 and the flyback converter 16, and the SR Rect. 14 is electrically connected to the step-down 15. The bridge rectifier 11 receives an input voltage through the EMI Filter 10 and rectifies to form a rectified voltage, so that the PFC Converter 12 performs power correction to form a converted voltage and then provides it to the LLC Converter 13 and the flyback converter 16 Moreover, the LLC Converter 13 and the flyback converter 16 respectively use the converted voltage to output a primary voltage and a secondary voltage of 5Vsb (volts) /2.01A (amps). In addition, the LLC Converter 13 rectifies and outputs 12V / 58.85A through the SR Rect. 14 One of the first primary voltages and 5V / 18.19A-a second primary voltage and 3.3V / 18.19A-a third primary voltage are stepped down by the step-down devices 15 of a plurality of use types. In this way, the energy conversion efficiency of the bridge rectifier 11, the PFC Converter 12, the LLC Converter 13, the step-down 15 outputting 5V, the step-down 15 outputting 3.3V, and the flyback converter 16 (Eff ) Will be shown in the following table (a).

The power supply 1 can be described as a function of forming multiple sets of output voltages through the LLC Converter 13 and the flyback converter 16 in the subsequent stage to magnetically sense the conversion voltage. At the same time, the flyback converter 16 is used to output a working voltage to the PFC Converter 12 for power factor regulation after feedback stabilization to achieve output voltage stability. However, in this architecture, the first primary voltage is reduced to 5Vsb, and the secondary voltage only exhibits an energy conversion efficiency of about 80%. In other words, when the difference between the secondary voltage and the primary voltage is greater, the The lower the energy conversion efficiency of the secondary voltage, the lower the current trend of environmental protection and green energy. In addition, in order to use the primary voltage conversion to form output voltages of different voltage values, the power supply 1 uses a circuit architecture of the step-down 15 with a complex type added to the back end of the SR Rect. 14 except for affecting energy conversion. In addition to efficiency, the complexity of the overall circuit structure is greatly increased, which is not conducive to miniaturization of the product. In view of this, how to improve the circuit architecture of the power supply 1 so as to provide multiple sets of stable output voltages while improving energy conversion efficiency is a subject that the present invention is desperately exploring.

In view of the problems of conventional techniques, the object of the present invention is to provide a circuit structure of a high-power power supply, which uses LLC Converter with SR Rect. And Or-ring as a secondary-side secondary voltage circuit structure to achieve energy Improved conversion efficiency.

According to the purpose of the present invention, the circuit structure of the high-power power supply has at least a first-stage voltage supply module and a first-stage voltage supply module to provide multiple output voltage functions, and the first-stage voltage supply module A bridge rectifier, a power factor correction converter, a first resonant converter, and a first synchronous rectifier are provided. The power factor correction converter is electrically connected to the bridge rectifier and the first resonant converter. The first resonant converter is electrically connected to the first synchronous rectifier. After the power factor correction converter uses the rectified voltage of the bridge rectifier to form a conversion voltage, the first resonant converter is converted to form a first stage. The voltage is output through the first synchronous rectifier, which is characterized in that the secondary voltage supply module is provided with a second resonant converter, a second synchronous rectifier, an OR-ing and a step-down converter. The second resonant converter is electrically connected to the power factor correction converter, the first resonant converter and the second synchronous rectifier, and the second synchronous rectifier is electrically connected to the OR gate and the drop Converter, the second resonant converter uses the converted voltage to form a primary voltage, so that the second synchronous rectifier and the OR gate respectively output a first secondary voltage and a second secondary voltage, and the step-down voltage The device steps down to output a third secondary voltage after receiving the first secondary voltage.

In addition, the secondary voltage supply module is provided with a voltage doubler and a switch, the voltage doubler is electrically connected to the bridge rectifier and the switch, and the switch is electrically connected to the power factor correction converter, the A first resonant converter and the second resonant converter for switching the second resonant converter to receive an input voltage received by the bridge rectifier via the switch and the voltage doubler, or from the power The correction converter receives this conversion voltage. The switcher is provided with a diode, a capacitor and a control switch. The anode of the diode is electrically connected to the output of the voltage doubler, and the cathode of the diode is electrically connected to the capacitor and the control. One end of the switch and the input end of the second resonant converter, the other end of the control switch is electrically connected to the output end of the power factor correction converter, and the control switch is turned on when the input voltage is greater than 150 volts (Vac), so that the The second resonant converter receives the conversion voltage from the power factor correction converter; otherwise, when the input voltage is less than 150Vac When the second resonant converter is enabled to receive the input voltage from the voltage doubler.

The first resonant converter and the second resonant converter are both frequency modulation (Frequency Modulation, FM) resonant converters. The first-stage voltage supply module outputs a first-stage voltage of 12 volts, the second synchronous rectifier outputs a first-stage voltage of 5 volts, the OR gate outputs a second-stage voltage of 5 volts, and the step-down voltage The device outputs a third secondary voltage of 3.3 volts. A graphene body is provided on a conductive circuit extending from the power factor correction converter and the first resonant converter to use the graphene body for heat dissipation, and the graphene body further has at least one graphene circuit for transmission. Electrical energy. There is also a piezoelectric oscillation plate between the conductive circuit and the graphene body. When the thermal energy generated by the power conversion of both the correction converter and the first resonant converter is passed through the conductive circuit and the piezoelectric oscillation plate, The graphene body is transmitted to the graphene body, and the piezoelectric oscillation plate changes the electric field of the piezoelectric oscillation plate to continuously oscillate the piezoelectric oscillation plate to drive the graphene body to oscillate, so as to achieve an active cooling effect.

The circuit structure of the high-power power supply further has a temperature sensor. When the temperature sensor reaches a preset temperature, the piezoelectric vibration plate is started to oscillate and dissipate heat; when the temperature sensor senses a temperature higher than the temperature sensor, At the preset temperature, in addition to the piezoelectric oscillation plate oscillating, the conductive circuit is switched off to conduct the graphene circuit to transfer electrical energy, so as to reduce the impedance generated by the conductive circuit, and at the same time, heat is dissipated by the graphene body to Reduce thermal resistance. The graphene body is provided with at least one graphene capacitor at one end for storing electric energy and supplying electric energy when the power is cut off at high temperature.

According to another object of the present invention, the circuit structure of the high-power power supply is characterized in that the circuit structure of the high-power power supply has a graphene body, a piezoelectric oscillation plate and a graphene capacitor, An electric oscillating plate is provided on the graphene body, and the graphene capacitor is provided on one end of the graphene body. The piezoelectric oscillating plate changes the electric field of the piezoelectric oscillating plate to continuously oscillate the piezoelectric oscillating plate to drive the graphene body to oscillate. The active cooling effect is achieved. When the power is turned off, the graphene capacitor uses the stored power to provide power.

In summary, the present invention uses the second resonant converter and the second synchronous rectifier to replace the flyback converter in the conventional technology as a secondary voltage conversion circuit, and improves the energy conversion efficiency of the secondary voltage of 5Vsb. And use the OR gate to replace the design of a voltage reducer in the conventional art. In addition to being able to effectively improve the conversion efficiency to 99%, the conversion efficiency of the 3.3V third secondary voltage in this configuration is also significantly improved, achieving the effect of reducing the complexity of the overall circuit and benefiting the market adaptability of the product.

Learning skills

1‧‧‧ Power Supply

10‧‧‧ electromagnetic filter

11‧‧‧Bridge Rectifier

12‧‧‧ Power Factor Correction Converter

13‧‧‧LLC Converter

14‧‧‧SR Rect.

15‧‧‧ Buck

16‧‧‧ Flyback Converter

this invention

2‧‧‧Circuit Structure of High Power Power Supply

20‧‧‧First-level voltage supply module

200‧‧‧EMI Filter

201‧‧‧Bridge Rectifier

202‧‧‧Power Factor Correction Converter

203‧‧‧First Resonant Converter

204‧‧‧The first synchronous rectifier

21‧‧‧ secondary voltage supply module

210‧‧‧Second resonant converter

211‧‧‧Second synchronous rectifier

212‧‧‧OR

213‧‧‧Buck

214‧‧‧Switcher

2140‧‧‧diode

2141‧‧‧Capacitor

2142‧‧‧Control switch

215‧‧‧Voltage Doubler

216‧‧‧Conductive circuit

3‧‧‧graphene body

31‧‧‧ heat radiation surface

32‧‧‧graphene circuit

4‧‧‧ Piezoelectric Oscillator

5‧‧‧ Thermally Conductive Insulator

6‧‧‧graphene capacitor

7‧‧‧Temperature Sensor

Figure 1 is a schematic diagram of the structure of a power supply of conventional technology.

FIG. 2 is a schematic structural diagram of an implementation aspect of a preferred embodiment of the present invention.

FIG. 3 is a schematic structural diagram of a second implementation aspect of the preferred embodiment of the present invention.

FIG. 4 is a schematic diagram of a partial architecture of a third embodiment of the preferred embodiment of the present invention.

FIG. 5 is a schematic diagram of a partial architecture of the fourth implementation aspect of the preferred embodiment of the present invention.

FIG. 6A is a schematic diagram of vibration compression compression of a partial structure section according to a fourth embodiment of the present invention.

FIG. 6B is a schematic drawing of a partial structural section of a fourth embodiment of the present invention in a vibration stretching state.

In order to make your reviewers understand the content of the present invention clearly, please refer to the following description with drawings.

Please refer to FIG. 2, which is a schematic structural diagram of an implementation aspect of a preferred embodiment of the present invention. As shown in the figure, the circuit structure 2 of the high-power power supply has at least a first-stage voltage supply module 20 and a first-stage voltage supply module 21 and provides a plurality of sets of output voltage functions. The first-stage voltage supply module 20 is provided with an EMI Filter 200, a bridge rectifier 201, a power factor correction converter 202, a first resonant converter 203, and a first synchronous rectifier 204, and the secondary voltage supply The module 21 is provided with a second resonant converter 210, a second synchronous rectifier 211, an OR gate 212, and a voltage step-down 213. The EMI Filter 200 is electrically connected to an external power source (not shown), the bridge rectifier 201 is electrically connected to the EMI Filter 200 and the power factor correction converter 202, and the first resonant converter 203 is electrically connected This work factor correction The converter 202 and the first synchronous rectifier 204. The second resonant converter 210 is electrically connected to the power factor correction converter 202, the first resonant converter 203 and the second synchronous rectifier 211, and the second synchronous rectifier 211 is electrically connected to the OR gate. 212 and the step-down 213.

After the bridge rectifier 201 receives an input voltage of the external power source through the EMI Filter 200 and rectifies to form a rectified voltage, the work factor correction converter 202 uses the rectified voltage to convert magnetic induction and perform power correction to form a converted voltage. For the first resonant converter 203 to form and output a first-stage voltage of 12V / 58.85A through the first synchronous rectifier 204, and also provide the second resonant converter 210 for conversion and pass through the first The two synchronous rectifiers 211 output a first secondary voltage of 5Vsb / 2.01A. Then, the OR gate 212 receives the first secondary voltage and outputs a second secondary voltage of 5V / 18.19A, and the voltage step-down 213 receives the first secondary voltage and steps down to form 3.3V / 18.19A. Output after one of the third secondary voltages. Thus, in the circuit structure 2 of the high-power power supply, the bridge rectifier 201, the power factor correction converter 202, the first resonant converter 203, the second resonant converter 210, and an output of 5V The energy conversion efficiency (Eff) of the OR gate 212 and the step-down 213 outputting 3.3V will be shown in the following table (2), which does have higher efficiency and lower input power requirements.

Please refer to FIG. 3, which is a frame according to a second embodiment of the present invention. Schematic diagram. As shown in the figure, the circuit structure 2 of the high-power power supply has at least a first-stage voltage supply module 20 and a first-stage voltage supply module 21 and provides a plurality of sets of output voltage functions. The first-stage voltage supply module 20 is provided with an EMI Filter 200, a bridge rectifier 201, a power factor correction converter 202, a first resonant converter 203, and a first synchronous rectifier 204, and the secondary voltage supply The module 21 is provided with a second resonant converter 210, a second synchronous rectifier 211, an OR gate 212, a voltage reducer 213, a switch 214 and a voltage doubler 215. The switch 214 is provided with a A diode 2140, a capacitor 2141, and a control switch 2142. The EMI Filter 200 is electrically connected to an external power source (not shown), the bridge rectifier 201 is electrically connected to the EMI Filter 200, the power factor correction converter 202 and the voltage doubler 215, and the first resonant converter 203 is electrically connected to the power factor correction converter 202, the first synchronous rectifier 204, and the switch 214. The second resonant converter 210 is electrically connected to the second synchronous rectifier 211 and the switch 214, the second synchronous rectifier 211 is electrically connected to the OR gate 212 and the step-down 213, and the power factor correction converter 202 is a power factor correction converter for Continuous Conduction Mode (CCM). The first resonant converter 203 and the second resonant converter 210 may both be frequency-modulated resonant converters and forward converters. Converter or full-bridge phase-shift converter. The anode of the diode 2140 is electrically connected to the output of the voltage doubler 215, and the cathode of the diode 2140 is electrically connected to the capacitor 2141, one end of the control switch 2142 and the input of the second resonant converter 210. Terminal, the other end of the control switch 2142 is electrically connected to the output terminal of the power factor correction converter 202.

After the bridge rectifier 201 receives an input voltage of the external power source through the EMI Filter 200 and rectifies to form a rectified voltage, the work factor correction converter 202 uses the rectified voltage to magnetically convert and perform power correction to form a converted voltage. For the first resonant converter 203 to convert and form a first-stage voltage of 12V / 58.85A through the first synchronous rectifier 204. At this time, the control switch 2142 is turned on when the input voltage is greater than 150V _ac , so that the second resonant converter 210 receives the conversion voltage from the power factor correction converter 202, otherwise, when the control switch 2142 is less than 140V _ac When the input voltage is turned off, and when the input voltage is in the hysteresis interval of 140 ~ 150V _ac, it is turned off. In other words, when the input voltage is less than 150V _ac , the control switch 2142 is turned off to make the second resonant converter 210 The diode 2140 receives the input voltage from the voltage doubler 215 to convert and output a first secondary voltage of 5Vsb / 2.01A through the second synchronous rectifier 211.

Then, the OR gate 212 receives the first secondary voltage and outputs a second secondary voltage of 5V / 18.19A to the voltage step-down 213, and the voltage step-down 213 also steps down the first level voltage to form 3.3. V / 18.19A is a third secondary voltage. Thus, in the circuit structure 2 of the high-power power supply, the bridge rectifier 201, the power factor correction converter 202, the first resonant converter 203, the second resonant converter 210, and the output of 5V The energy conversion efficiency of the OR gate 212 and the step-down 213 outputting 3.3V will be shown in the following table (3). It does have higher efficiency and lower input power requirements.

Please refer to FIG. 4, which is a schematic diagram of a partial architecture of the third implementation aspect of the preferred embodiment of the present invention. As shown in the figure, the circuit structure 2 of the high-power power supply has at least one graphene body 3, in which the thickness of the graphene body 3 is between 2 mm mm and 10 nm, which is arranged in a place where electrical energy is easily converted into heat energy. The power factor correction converter 202 and the first resonant converter 203 are extended on a conductive circuit 216. The graphene body 3 can be attached, coated, or connected to the conductive circuit 216 (the thickness of the conductive circuit 216 is between 1mm mm and 5um microns), which can achieve the high heat radiation characteristics of the graphene body 3 and achieve high thermal conductivity. The effect of high heat dissipation. The outer surface of the graphene body 3 has a heat radiation surface 31 with high heat radiation characteristics. The surface of the graphene body 3 may be a non-planar uneven surface with a height difference of 150 micrometers to 5 nanometers. The radiation coefficient is approximately 0.95, copper is approximately 0.09, and aluminum is approximately 0.02. Therefore, the thermal conductivity of the graphene body 3 exceeds 4,000 Wm ^-1 K ^-1 . In contrast, the general thermal conductivity of aluminum metal is only 237 Wm ^-1 K ^-1 or the thermal conductivity of copper metal is only 401Wm ^-1 K ^-1 has poor heat dissipation effect. The graphene body 3 with high thermal conductivity and high heat dissipation further has at least one graphene circuit 32 with high electrical conductivity for transmitting electrical energy.

Please refer to FIGS. 5 to 6B, which are schematic diagrams of a partial structure, a schematic diagram of a partial structure section, vibration compression, and extension, respectively, according to a fourth embodiment of the present invention. As shown in the figure, there is a piezoelectric oscillating plate 4 between the conductive circuit 216 and the graphene body 3, wherein the thickness of the piezoelectric oscillating plate 4 is between 0.5 mm mm and 1 um microns. The thermal energy generated by the electric energy conversion of the converter 202 and the first resonant converter 203 is transmitted to the piezoelectric oscillation plate 4 through the conductive circuit 216 and finally transmitted to the graphene body 3. The electric field of the piezoelectric oscillating plate 4 changes to cause the piezoelectric oscillating plate 4 to continue to oscillate and deform, even if the piezoelectric oscillating plate 4 repeatedly oscillates and compresses and expands to achieve the effect of high heat conduction and heat dissipation. A thermally conductive insulator 5 may be added between the conductive circuit 216, the piezoelectric oscillating plate 4 and the graphene body 3, which may be connected in the form of a thermally conductive glue or a thermally conductive adhesive, but is not limited thereto, or , The form of insulation and self-bonding between components and components to improve thermal conductivity and adhesion.

In addition, the circuit structure 2 of the high-power power supply may further include a temperature sensor 7 such as a thermistor, etc., and the piezoelectric oscillator plate 4 is activated when the temperature sensor 7 senses that the circuit temperature reaches a preset temperature. And when the temperature sensor 7 senses that the circuit temperature is higher than the preset temperature, the piezoelectric oscillation plate 4 switches to the graphene circuit 32 and closes the conductive circuit 216 in addition to continuously starting the oscillation, and changes to conduct The highly conductive graphene circuit 32 transfers electric energy to reduce the impedance generated by the conductive circuit 216, and at the same time conducts heat and heat directly from the graphene body 3 to reduce the generation of thermal resistance and prevent the conductive circuit 216 from passing the voltage through different media. The high thermal resistance generated by the electrically oscillating sheet 4 and transmitted to the graphene body 3 of different media.

Therefore, when the circuit structure 2 of the high-power power supply is in the normal mode, the graphene body 3 can replace the heat dissipation fins. When the temperature is high, the piezoelectric oscillating plate 4 is activated to oscillate the graphene circuit 32 to dissipate heat. Further, when the temperature continues to be high, in addition to continuously activating the piezoelectric oscillating plate oscillation 4, the highly conductive graphene circuit 32 is turned on to transmit electrical energy to reduce impedance and reduce thermal resistance caused by different materials between the media. In summary, this technology can replace Heat dissipation fins, general circuits and fans, and greatly improve the characteristics of circuit conductivity and heat dissipation, and can provide corresponding conductivity and heat dissipation measures for different environments. In addition, one end of the graphene body 3 is provided with at least one graphene capacitor 6 for supplying electric energy by using the stored electric energy when the power is cut off at a high temperature. In addition to the above, a part of the circuit of the circuit structure 3 of the high-power power supply can also use the graphene circuit 32 of the graphene body 3 instead of the conventional conductive circuit 216, and the graphene body 3 is provided with The piezoelectric oscillating plate 4 is provided with a graphene capacitor 6 at one end of the graphene body 3. The electric field of the piezoelectric oscillating plate 4 is changed to continuously oscillate the piezoelectric oscillating plate 4 to drive the graphene body 3 to oscillate. The active cooling effect is achieved. When the circuit structure 2 of the high-power power supply is powered off, the graphene capacitor 6 uses the stored electrical energy to provide electrical energy.

The above descriptions are merely exemplary preferred embodiments, but not limiting. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the attached patent application.

Claims (10)

A circuit structure of a high-power power supply, which has at least one first-stage voltage supply module and a first-stage voltage supply module and provides multiple output voltage functions, and the first-stage voltage supply module is provided with a bridge Type rectifier, a power factor correction converter, a first resonance type converter and a first synchronous rectifier, the power factor correction converter is electrically connected to the bridge rectifier and the first resonance type converter, the first resonance The converter is electrically connected to the first synchronous rectifier. After the power factor correction converter uses the rectified voltage of the bridge rectifier to form a conversion voltage, the first resonant converter is converted into a first-stage voltage and passes through the first rectifier. The output of the first synchronous rectifier is characterized in that the secondary voltage supply module is provided with a second resonant converter, a second synchronous rectifier, an OR-ing and a step-down, and the second A resonant converter is electrically connected to the power factor correction converter, the first resonant converter and the second synchronous rectifier, and the second synchronous rectifier is electrically connected to the OR gate and the step-down converter, and the second The vibratory converter uses the converted voltage to form a primary voltage, so that the second synchronous rectifier and the OR gate respectively output a first secondary voltage and a second secondary voltage, and the step-down converter receives the first Stepping down the secondary voltage outputs a third secondary voltage. According to the circuit structure of the high-power power supply described in item 1 of the patent application scope, the secondary voltage supply module is provided with a voltage doubler and a switcher, and the voltage doubler is electrically connected to the bridge rectifier and The switch, and the switch is electrically connected to the power factor correction converter, the first resonant converter and the second resonant converter for switching the second resonant converter via the switch and the second resonant converter; The voltage doubler receives an input voltage received by the bridge rectifier or the conversion voltage from the power factor correction converter. According to the circuit structure of the high-power power supply device described in item 2 of the patent application scope, wherein the switch is provided with a diode, a capacitor and a control switch, and the anode of the diode is electrically connected to the voltage doubler. And the cathode of the control switch is electrically connected to the capacitor, one end of the control switch and the input end of the second resonant converter, the other end of the control switch is electrically connected to the output end of the power factor correction converter, and the The control switch is turned on when the input voltage is greater than 150 volts, so that the second resonant converter receives the conversion voltage from the power factor correction converter, and conversely, when the input voltage is less than 150 volts, the second resonant type The converter receives the input voltage from the voltage doubler. According to the circuit structure of the high-power power supply described in item 3 of the patent application scope, wherein the first resonant converter and the second resonant converter are both frequency-modulated resonant converters. According to the circuit structure of the high-power power supply described in item 4 of the patent application scope, wherein the first-stage voltage supply module outputs a first-stage voltage of 12 volts, and the second synchronous rectifier outputs a first-stage voltage of 5 volts. The secondary voltage, the OR gate outputs a second secondary voltage of 5 volts, and the buck outputs a third secondary voltage of 3.3 volts. According to the circuit structure of the high-power power supply described in item 5 of the patent application scope, a graphene body is provided on the conductive circuit of the power factor correction converter and an extension of the first resonant converter to make use of the The graphene body dissipates heat, and the graphene body further has at least one graphene circuit for transmitting electric energy. According to the circuit structure of the high-power power supply as described in item 6 of the scope of the patent application, a piezoelectric oscillating plate is further provided between the conductive circuit and the graphene body. When the power factor correction converter and the first resonance The thermal energy generated by the electrical conversion between the two converters is transferred to the graphene body through the conductive circuit and the piezoelectric oscillation plate, and the piezoelectric oscillation plate changes the electric field of the piezoelectric oscillation plate to cause the piezoelectric oscillation plate to continuously oscillate and deform to drive the graphene body. Shock for active cooling. According to the circuit structure of the high-power power supply described in item 7 of the scope of the patent application, wherein the thickness of the conductive circuit is between 1 mm mm and 5 μm, and the thickness of the graphene body is between 2 mm mm and 10 nm. The thickness of the piezoelectric oscillating plate is between 0.5 mm mm and 1 um micrometer. The surface of the graphene body can be a non-planar uneven surface with a height difference of 150 micrometers to 5 nanometers to increase the surface heat dissipation area by a large amount. For example, the circuit structure of the high-power power supply described in item 8 of the patent application scope further includes a temperature sensor. When the temperature sensor reaches a preset temperature, the piezoelectric vibration plate is started to oscillate and dissipate heat; When the temperature sensor senses that the temperature is higher than the preset temperature, in addition to the piezo-oscillating plate oscillating, it also switches off the conductive circuit and turns on the graphene circuit to transfer electrical energy to reduce the impedance generated by the conductive circuit. At the same time, heat is dissipated by the graphene body to reduce thermal resistance. According to the circuit structure of the high-power power supply described in item 9 of the scope of the patent application, one end of the graphene body is provided with at least one graphene capacitor, which is used to store electrical energy and supply electrical energy during high temperature power failure.