TWI680301B - Probe card - Google Patents

Abstract

[Objective] The present invention is to provide a probe card that allows a large space between a probe and a wall surface of a holding portion facing the probe. [Configuration] A probe card includes a holding portion 100a, a holding portion 100g, a cantilevered first probe 200a, and a cantilevered second probe 200g. The probe 200a is held on the holding portion 100a at intervals in the Y-Y 'direction so that the tip portion 210a protrudes from the first wall surface 110a of the holding portion 100a. The probe 200g is held on the holding portion 100g in the X-X 'direction at a distance such that the distal end portion 210g projects from the first wall surface 110g of the holding portion 100g. The tip of the probe 200g is located at the tip 211g of the tip 210g of the probe 200g at the extreme end on the side closest to the X ′ direction, and is located closer to the root 212g of the tip 210g than the tip of the probe 200g at the extreme end. X 'direction side.

Description

Probe card Field of invention

The invention relates to a probe card having a cantilever type probe.

Background of the invention

The plurality of semiconductor devices are formed in a matrix on a semiconductor wafer. A plurality of electrodes are provided on each side of each side of the semiconductor device 4 in a row or a plurality of rows. As a conventional probe card capable of inspecting a plurality of semiconductor devices of such a semiconductor wafer at a time, there are the following first and second probe cards. The first probe card is described in Japanese Patent Application Laid-Open No. 07-302820. The second probe card is described in Japanese Patent Application Laid-Open No. 2006-145402.

The first probe card is capable of testing a plurality of semiconductor devices of the semiconductor wafer in each row while tilting the semiconductor wafer by 45 ° with the orientation plane (OF) as a reference. The first probe card includes a substrate and a plurality of probes. The substrate is provided with a plurality of openings corresponding to a roughly rhombic plane view of the semiconductor device. Probes are provided at four edges of each opening of the substrate. The probes on each edge extend through the openings toward the electrodes on the corresponding side of the semiconductor device in a reverse radial pattern.

The second probe card can test 4 semiconductor devices of the semiconductor wafer at a time. The second probe card includes a substrate and a plurality of probes. The substrate is provided with four openings that are roughly rectangular in plan view corresponding to the semiconductor device. The probe is provided on the outer edge of each opening. The probes at each edge are inclined by 30 ° with reference to a predetermined axis, and extend toward the electrodes on the four sides of the semiconductor device through the openings.

In recent years, semiconductor devices have been miniaturized and increased in stacking. The probe card used to inspect the semiconductor device is generally required to narrow the probe pitch and increase the number of probes. However, in the first probe card, since the probes on each edge are extended in a radial shape, it is impossible to cope with the narrowing of the probe pitch and increasing the number of probes. In the second probe card, since the probe extends from one edge of the opening toward the electrodes on the four sides of the semiconductor device, it cannot cope with the narrowing of the probe pitch and increasing the number of probes.

Then, the inventors of the present invention invented the third probe card shown in FIG. 10. The third probe card can test two semiconductor devices D1 and D2 among the plurality of semiconductor devices D of the semiconductor wafer U shown in FIG. 11 at a time. For convenience of explanation, an example of the two semiconductor devices D1 and D2 inspected by the third probe card is shown in FIG. 11 with a dotted line on one side and a solid line on the other.

The third probe card includes a holding frame, a plurality of cantilever probes 20 a to 20 h, and a substrate 30. The holding frame is made of an insulating resin. The holding frame includes holding portions 10a to 10h and rectangular openings 10i and 10j.

The openings 10i and 10j are provided at the central portion of the holding frame so that the corner portions on the Y 'direction and the X direction side of the opening 10i and the corner portions on the Y direction and the X' direction side of the opening 10j communicate with each other.

The holding portion 10a is a resin block having a rectangular shape as viewed from the bottom surface inside the opening 10i of the holding frame. The holding portion 10a includes a first wall surface 11a, a second wall surface 12a that intersects the first wall surface 11a at a right angle, and a third wall surface 13a that intersects the first wall surface 11a at a right angle. The holding portion 10b is a portion on the X 'direction side of the opening 10i of the holding frame, and is continuous with the holding portion 10a. The holding portion 10b includes a first wall surface 11b and a second wall surface 12b on the opposite side of the first wall surface 11b. The holding portion 10c is a portion on the Y 'direction side of the opening 10i of the holding frame, and is a portion on the X' direction side of the opening 10j of the holding frame. The holding portion 10c includes a first wall surface 11c, a second wall surface 12c that intersects the first wall surface 11c at a right angle, and a third wall surface 13c on the opposite side of the first wall surface 11c. The first wall surface 11c of the holding portion 10c faces the second wall surface 12a of the holding portion 10a at an interval. The holding portion 10d is a portion on the Y-direction side of the opening 10i of the holding frame. The holding portion 10d includes a first wall surface 11d and a second wall surface 12d on the opposite side of the first wall surface 11d. The first wall surface 11d of the holding portion 10d faces the third wall surface 13a of the holding portion 10a with a gap therebetween.

The holding portion 10e is a resin block having a rectangular shape as viewed from the bottom surface provided in the opening 10j of the holding frame. The holding portion 10e includes a first wall surface 11e, a second wall surface 12e that intersects the first wall surface 11e at a right angle, and a third wall surface 13e that intersects the first wall surface 11e at a right angle. The first wall surface 11e of the holding portion 10e faces the second wall surface 12c of the holding portion 10c via a gap. The holding portion 10f is a portion on the X-direction side of the opening 10j of the holding frame, and is continuous with the holding portion 10e. The holding portion 10f includes a first wall surface 11f and a second wall surface 12f on the opposite side of the first wall surface 11f. The holding portion 10g is a portion on the Y-direction side of the opening 10j of the holding frame, and is a portion on the X-direction side of the opening 10i of the holding frame. The holding portion 10g has a first wall surface 11g, a second wall surface 12g that intersects the first wall surface 11g at a right angle, and a first wall surface on the opposite side to the first wall surface 11g. 3 wall surface 13g. The first wall surface 11g of the holding portion 10g faces the second wall surface 12e of the holding portion 10e via a gap. The second wall surface 12g of the holding portion 10g faces the first wall surface 11a of the holding portion 10a via a gap. The holding portion 10h is a portion on the Y-direction side of the opening 10j of the holding frame. The holding portion 10h includes a first wall surface 11h and a second wall surface 12h on the opposite side of the first wall surface 11h. The first wall surface 11h of the holding portion 10h faces the third wall surface 13e of the holding portion 10e via a gap.

The probes 20a to 20h have a front end portion and a rear end portion. The probe 20a is held by the holding portion 10a and the holding portion 10a at intervals in the Y-Y 'direction so that the front end portion projects from the first wall surface 11a of the holding portion 10a and the rear end portion projects from the second wall surface 12b of the holding portion 10b.部 10b。 10b. The probe 20b is held on the holding portion 10b at intervals in the Y-Y 'direction so that the front end portion protrudes from the first wall surface 11b of the holding portion 10b and the rear end portion protrudes from the second wall surface 12b of the holding portion 10b. The probe 20c is held in the X-X 'direction at intervals by the holding portion 10c so that the front end portion projects from the first wall surface 11c of the holding portion 10c and the rear end portion projects from the third wall surface 13c of the holding portion 10c. The probe 20d is held in the X-X 'direction at intervals by the holding portion 10d such that the front end portion projects from the first wall surface 11d of the holding portion 10d and the rear end portion projects from the second wall surface 12d of the holding portion 10d.

The probe 20e is held by the holding portion 10e and the holding portion 10e at intervals in the Y-Y 'direction so that the front end portion protrudes from the first wall surface 11e of the holding portion 10e and the rear end portion protrudes from the second wall surface 12f of the holding portion 10f. 10f. The probe 20f is held by the holding portion 10f at intervals in the Y-Y 'direction so that the front end portion protrudes from the first wall surface 11f of the holding portion 10f and the rear end portion protrudes from the second wall surface 12f of the holding portion 10f. The probe 20g is such that the front end portion protrudes from the first wall surface 11g of the holding portion 10g and the rear end portion protrudes from the third wall surface 13g of the holding portion 10g. The holding portion 10g is held at intervals in the X-X 'direction. The probe 20h is held in the X-X 'direction at intervals by the holding portion 10h so that the front end portion protrudes from the first wall surface 11h of the holding portion 10h and the rear end portion protrudes from the second wall surface 12h of the holding portion 10h. The front ends of the probes 20a to 20h extend in a protruding direction and then extend downward (in a direction away from the substrate 30). The ends of the probes 20a to 20h are connected to the substrate 30, respectively.

[Advanced technical literature]

[Patent Literature]

[Patent Document 1] Japanese Unexamined Patent Publication No. 07-302820

[Patent Document 2] Japanese Patent Laid-Open No. 2006-145402

[Summary of Invention]

[Problems to be Solved by the Invention]

Summary of invention

In the third probe card, when the distance between the probes 20a to 20h is narrowed and the number of probes is further increased, the space between the probe 20a and the second wall surface 12g of the holding portion 10g becomes smaller. When the space becomes small, when the front end portion of the probe 20a contacts the electrode of the semiconductor device D1, and when the front end portion of the probe 20a is elastically deformed in the thickness direction of the third probe card, the front end portion of the probe 20a contacts the holding portion 10g of the second wall surface may be 12g. In addition, the same problem occurs in the space between the probe 20e and the second wall surface 12c of the holding portion 10c as the space between the probe 20a and the second wall surface 12g of the holding portion 10g.

The present invention has been made in view of the foregoing circumstances, and an object thereof is to provide a space between a probe and a wall surface of a holding portion facing the probe. Space for larger probe cards.

A probe card according to one aspect of the present invention includes: a first holding portion having insulation; a second holding portion having insulation; a plurality of cantilevered first probes; and a plurality of cantilevered second probes. Probe. The first holding portion has a first wall surface extending in a first direction. The second holding portion has a first wall surface and a second wall surface. The first wall surface of the second holding portion extends in a second direction crossing the first direction. The second wall surface of the second holding portion intersects the first wall surface of the second holding portion, and faces the first wall surface of the first holding portion at an interval. The plurality of first probes have tip portions. The plurality of first probes are held on the first holding portion at intervals in the first direction so that the tip portion protrudes from the first wall surface of the first holding portion. The plurality of second probes have tip portions. The plurality of second probes are held in the second holding portion at intervals in the second direction so that the tip portions of the plurality of second probes protrude from the first wall surface of the second holding portion. The distal ends of the plurality of second probes have a distal end and a root. The plurality of second probes include a second probe positioned at the outermost end on the second wall surface side of the second holding portion. At least the front end of the second probe at the extreme end is located closer to the first wall surface side of the first holding portion than the root of the second probe at the extreme end.

With such a probe card, the space between the front end portion of the first probe and the second wall surface of the second holding portion is large. The reason is as follows. The distal end of the distal end of the second-most probe is positioned closer to the first wall surface side of the first holding portion than the root of the front-end of the second-most probe. Therefore, the portion rearward of the root of the front end of the second probe at the extreme end can be positioned closer to the first wall surface side of the first holding portion than the position of the front end of the second probe at the extreme end. On the opposite side, the second wall surface of the second holding portion can be moved to the side opposite to the first wall surface side of the first holding portion. This increases the space between the front end portion of the first probe and the second wall surface of the second holding portion.

At least the front end portion of the second probe at the extreme end may be inclined or bent toward the first wall surface side of the first holding portion. With such a probe card, the space between the front end portion of the first probe and the second wall surface of the second holding portion is large. The reason is as follows. The distal end portion of the second-most probe is inclined or bent toward the first wall surface side of the first holding portion. Therefore, the portion rearward of the front end of the second probe at the extreme end can be positioned on the opposite side of the first wall surface side of the first holding portion from the position of the front end of the second probe at the extreme end. Therefore, the second wall surface of the second holding portion can be moved to the side opposite to the first wall surface side of the first holding portion. This increases the space between the front end portion of the first probe and the second wall surface of the second holding portion.

The second holding portion may have a structure having a third wall surface on the opposite side to the first wall surface of the second holding portion. The second probe at the extreme end may further include a bent portion that is bent toward the first wall surface side of the first holding portion. The second probe at the extreme end can be configured to have a middle portion provided in the second holding portion. The second probe at the extreme end can be configured to further have a rear end portion protruding from the third wall surface of the second holding portion.

The bent portion may be a first wall surface located on the second holding portion. In this case, a configuration in which the tip end portion of the second probe at the extreme end is inclined toward the first wall surface side of the first holding portion can be made. Alternatively, the bent portion may be provided in the second holding portion. In this case, it is possible to have a configuration in which a portion on the front end side of the bent portion including the front end portion of the second probe at the extreme end is inclined toward the first wall surface side of the first holding portion. Alternatively, the bent portion may be provided at the middle portion and the rear end portion. And located on the third wall surface of the second holding portion. In this case, a configuration in which the middle portion and the front end portion of the second probe at the extreme end are inclined toward the first wall surface side of the first holding portion can be made.

The second probe at the extreme end may be configured to have a bent portion instead of the bent portion. The curved portion may be configured to be curved toward the first wall surface side of the first holding portion. The starting point of the curved portion may be located on the first wall surface of the second holding portion. In this case, the curved portion becomes the distal end portion of the second probe at the extreme end. Alternatively, the starting point of the bent portion may be located in the second holding portion. In this case, the curved portion may be configured to include a portion closer to the front end side than the start point of the bending of the front end portion and the middle portion of the second probe at the extreme end. Alternatively, the starting point of the curved portion may be the third wall surface of the second holding portion. The curved portion may be configured to include a tip portion and a middle portion of the second probe at the outermost end.

The plurality of second probes can be made to have the same structure as the second probe at the extreme end. The front ends of the front ends of the plurality of second probes may be located closer to the first wall surface side of the first holding portion than the roots of the front ends of the plurality of second probes, respectively. With such a probe card, the space between the front end portion of the first probe and the second wall surface of the second holding portion is large. The reason is as follows. The front ends of the front ends of the plurality of second probes are respectively located closer to the first wall surface side of the first holding portion than the roots of the front ends of the plurality of second probes. Therefore, the portions further behind the front ends of the plurality of second probes can be positioned on the opposite sides of the first wall surface side of the first holding portion than the positions of the front ends of the plurality of second probes, respectively. The second wall surface of the two holding portions moves to the side opposite to the first wall surface side of the first holding portion. This increases the space between the front end portion of the first probe and the second wall surface of the second holding portion.

The probe card according to any one of the aspects described above may be configured to further include a first support portion and a second support portion. The plurality of first probes may have a structure having a first flat surface extending in the length direction of the plurality of first probes. In a state where the first flat surface is in contact with the first support portion, a plurality of first probes may be fixed to the first support portion by the first holding portion. The plurality of second probes may have a structure having a second flat surface extending in the length direction of the plurality of second probes. In a state where the second flat surface is in contact with the second support portion, a plurality of second probes may be fixed to the second support portion by the second holding portion. According to such a probe card, the first and second probes can be easily arranged on the first and second support portions.

Any of the above-mentioned probe cards can be prepared with a third holding portion with insulation, a fourth holding portion with insulation, a plurality of cantilever type third probes, and a plurality of cantilever type fourth probes. The composition of the needle. The first holding portion can be configured to have a second wall surface. The second wall surface of the first holding portion may be configured to cross the first wall surface of the first holding portion and extend in the second direction. The third holding portion may be configured to have a first wall surface and a second wall surface. The first wall surface of the third holding portion may be configured to extend in the first direction. The second wall surface of the third holding portion may intersect the first wall surface of the third holding portion and be opposed to the first wall surface of the second holding portion via a gap. The fourth holding portion may be configured to have a first wall surface and a second wall surface. The first wall surface of the fourth holding portion may be configured to extend in the second direction and face the second wall surface of the first holding portion through a gap. The second wall surface of the fourth holding portion may intersect the first wall surface of the fourth holding portion and face the first wall surface of the third holding portion through a gap. The plurality of third probes can be configured to have a tip portion. A plurality of third probes can be made with the complex The structure in which the front ends of the plurality of third probes protrude from the first wall surface of the third holding portion is held in the third holding portion at intervals in the first direction. The plurality of fourth probes can be configured to have a tip portion. The plurality of fourth probes may have a configuration in which the front ends of the plurality of fourth probes protrude from the first wall surface of the fourth holding portion and are held in the fourth holding portion at intervals in the second direction. The front end portion of the plurality of fourth probes may be configured to have a front end and a root portion. The plurality of fourth probes may include a fourth probe located at the outermost end on the second wall surface side closest to the fourth holding portion. A configuration in which at least the tip of the fourth probe at the extreme end is positioned closer to the first wall surface side of the third holding portion than the root of the fourth probe at the extreme end can be made.

With such a probe, the space between the front end portion of the third probe and the second wall surface of the fourth holding portion is large. The reason is as follows. The front end of the front end of the fourth probe at the extreme end is located closer to the first wall surface side of the third holding portion than the root of the front end of the fourth probe at the extreme end. Therefore, the portion located behind the root of the front end of the fourth probe at the outermost end can be positioned closer to the first wall surface of the third holding portion than the position of the front end of the fourth probe at the outermost end. The second wall surface of the fourth holding portion can be moved to the side opposite to the first wall surface side of the third holding portion. Thereby, the space between the front end portion of the third probe and the second wall surface of the fourth holding portion becomes larger.

At least the front end portion of the fourth probe at the extreme end may be inclined or bent toward the first wall surface side of the third holding portion. The fourth holding portion may have a configuration having a third wall surface on the opposite side to the first wall surface of the fourth holding portion. The fourth probe at the extreme end can be made to have a bent portion that is bent toward the first wall surface of the third holding portion. The fourth probe at the extreme end can be made to have The composition of the middle part of the department. It is possible to have a structure having a rear end portion protruding from the third wall surface of the fourth holding portion.

The bent portion may be a first wall surface located on the fourth holding portion. In this case, it is possible to make a configuration in which the distal end portion of the fourth probe at the extreme end is inclined toward the first wall surface side of the third holding portion. Alternatively, the bent portion may be provided in the fourth holding portion. In this case, a portion closer to the front end side than the bent portion of the front end of the fourth probe including the outermost end can be made to be inclined toward the first wall surface side of the third holding portion. Alternatively, the bent portion may be provided between the middle portion and the rear end portion and located on the third wall surface. In this case, the middle portion and the front end portion of the fourth probe at the outermost end may be configured to be inclined toward the first wall surface side of the third holding portion.

The fourth probe at the extreme end can be made to have a bent portion instead of a bent portion. The bent portion may be configured to be bent toward the first wall surface side of the third holding portion. The starting point of the curved portion may be located on the first wall surface of the fourth holding portion. In this case, the curved portion becomes the distal end portion of the fourth probe at the extreme end. Alternatively, the starting point of the bent portion may be located in the fourth holding portion. In this case, the curved portion may be configured to have a portion closer to the front end side than the bending start point of the front end portion and the middle portion of the fourth probe at the extreme end. Alternatively, the starting point of the bay curved portion may be located on the third wall surface of the fourth holding portion. The curved portion may be configured to have a tip portion and a middle portion of the fourth probe having the outermost end.

The plurality of fourth probes can be made to have the same structure as the fourth probe at the extreme end. The front ends of the front ends of the plurality of fourth probes may be located on the first wall surface side of the third holding portion than the roots of the front ends of the plurality of fourth probes, respectively.

Any of the above-mentioned probe cards can be prepared with a fifth holding portion with insulation, a sixth holding portion with insulation, a seventh holding portion with insulation, an eighth holding portion with insulation, and a plurality of The configuration of the fifth probes of the cantilever type, the sixth probes of the cantilever type, the seventh probes of the cantilever type, and the eighth probes of the cantilever type. The first holding portion may be configured to have a third wall surface that intersects the first wall surface of the first holding portion and extends in the second direction. The third holding portion may have a structure having a third wall surface that intersects with the first wall surface of the third holding portion and extends in the second direction. The fifth holding portion may be configured to have a first wall surface extending in the first direction. The sixth holding portion may have a configuration having a first wall surface extending in the second direction and facing the third wall surface of the first holding portion via a gap. The seventh holding portion may be configured to have a first wall surface extending in the first direction. The eighth holding portion may have a structure having a first wall surface extending in the second direction and facing the third wall surface of the third holding portion via a gap. The plurality of fifth probes can be configured to have a tip portion. The plurality of fifth probes may be configured such that the front ends of the plurality of fifth probes protrude from the first wall surface of the fifth holding portion and are held in the fifth holding portion at intervals in the first direction. The plurality of sixth probes can be configured to have a tip portion. The plurality of sixth probes may have a configuration in which the front ends of the plurality of sixth probes protrude from the first wall surface of the sixth holding portion and are held in the sixth holding portion at intervals in the second direction. The plurality of seventh probes can be configured to have a tip portion. The plurality of seventh probes may have a configuration in which the front ends of the plurality of seventh probes protrude from the first wall surface of the seventh holding portion and are held in the seventh holding portion at intervals in the first direction. The plurality of eighth probes can be configured to have a tip portion. The plurality of eighth probes can be made from the eighth holding portion with the front ends of the plurality of eighth probes. The aspect in which the first wall surface protrudes is configured to be held by the eighth holding portion at intervals in the second direction.

4‧‧‧ semiconductor device

10a ~ 10h‧‧‧Holding Department

10i‧‧‧ opening

10j‧‧‧ opening

11a‧‧‧The first wall surface

11b‧‧‧The first wall surface

11c‧‧‧The first wall surface

11d‧‧‧The first wall surface

11e‧‧‧The first wall surface

11f‧‧‧The first wall surface

11g‧‧‧The first wall surface

11h‧‧‧The first wall surface

12a‧‧‧Second wall surface

12b‧‧‧Second wall surface

12c‧‧‧Second wall surface

12d‧‧‧Second wall surface

12e‧‧‧Second wall surface

12f‧‧‧The second wall surface

12g‧‧‧Second wall surface

12h‧‧‧The second wall surface

13a‧‧‧3rd wall surface

13c‧‧‧The third wall surface

13e‧‧‧3rd wall surface

13g‧‧‧3rd wall surface

20a ~ 20h‧‧‧ Probe

100a‧‧‧holding department

100b‧‧‧holding department

100c‧‧‧holding department

100d‧‧‧holding department

100e‧‧‧holding department

100f‧‧‧ Holding Department

100g‧‧‧ holding section

100h‧‧‧holding department

100i‧‧‧ opening

100j‧‧‧ opening

110a‧‧‧The first wall surface

110b‧‧‧The first wall surface

110c‧‧‧The first wall surface

110d‧‧‧The first wall surface

110e‧‧‧The first wall surface

110g‧‧‧The first wall surface

110h‧‧‧The first wall surface

120a‧‧‧Second wall surface

120b‧‧‧ 2nd wall surface

120c‧‧‧Second wall surface

120d‧‧‧Second wall surface

120e‧‧‧Second wall surface

120f‧‧‧ 2nd wall surface

120g‧‧‧Second wall surface

120h‧‧‧Second wall surface

130a‧‧‧3rd wall surface

130c‧‧‧3rd wall surface

130e‧‧‧3rd wall surface

130g‧‧‧3rd wall surface

200a ~ 200h‧‧‧Probe

200a’‧‧‧ Probe

200c’‧‧‧The fourth probe

200d’‧‧‧6th probe

200e‧‧‧ Probe

200f‧‧‧ Probe

210a‧‧‧Front end

210b‧‧‧Front end

210c‧‧‧Front end

210d‧‧‧Front end

210e‧‧‧Front end

210f‧‧‧Front end

210g‧‧‧Front end

210h‧‧‧Front end

211a‧‧‧Contact

211b‧‧‧Contact

211c‧‧‧Contact

211c1‧‧‧Front

211d‧‧‧Contact

211e‧‧‧Contact

211g‧‧‧Contact

211g1‧‧‧Front

212a‧‧‧Elastic deformation part

212b‧‧‧Elastic deformation part

212c‧‧‧Elastic deformation part

212c1‧‧‧root

212d‧‧‧Elastic deformation part

212e‧‧‧Elastic deformation part

212g‧‧‧Elastic deformation part

212g1‧‧‧root

220a‧‧‧Middle

220a’‧‧‧ middle

220b‧‧‧Middle

220c‧‧‧Middle

220c’‧‧‧ middle

220d‧‧‧Middle

220d’‧‧‧ middle

221a’‧‧‧The first flat surface

221c’‧‧‧Fourth flat surface

230a‧‧‧back end

230b‧‧‧ rear

230c‧‧‧Back end

230d‧‧‧ rear

240c‧‧‧ Bend

250c‧‧‧ starting point

300‧‧‧ substrate

400‧‧‧ support plate

400’‧‧‧ support plate

401’‧‧‧first support

402’‧‧‧ 4th support

403’‧‧‧6th support

410‧‧‧ trench

420‧‧‧ trench

430‧‧‧ trench

440‧‧‧ trench

450‧‧‧ trench

460‧‧‧ trench

500‧‧‧ Reinforcing board

C‧‧‧ Probe Card

D‧‧‧Semiconductor device

D1‧‧‧Semiconductor device

D2‧‧‧Semiconductor device

F‧‧‧Retain frame

L1‧‧‧The first imaginary line

L2‧‧‧The second imaginary line

L3‧‧‧The third imaginary line

L4‧‧‧The fourth imaginary line

S1‧‧‧Space

S2‧‧‧Space

U‧‧‧Semiconductor wafer

X, X’‧‧‧ direction

Y, Y’‧‧‧ direction

FIG. 1 is a schematic bottom view of the probe card of the invention according to the first embodiment of the present invention.

FIG. 2 is an enlarged 2-2 end view of the probe card in FIG. 1.

FIG. 3 is an enlarged 3-3 end view of the aforementioned probe card.

FIG. 4A is a schematic enlarged bottom view showing an example of a portion 4A in FIG. 1 of the probe card. FIG.

FIG. 4B is a schematic enlarged bottom view showing another example of a portion 4A in FIG. 1 of the probe card.

5A is an explanatory diagram showing a first design modification example of the arrangement of the first probes of the probe card.

5B is an explanatory diagram showing a second design modification example of the arrangement of the first probes of the probe card.

6A is an explanatory diagram showing a first example of the relationship between the fourth probe and the fourth holding portion of the probe card.

6B is an explanatory diagram showing a second example of the relationship between the fourth probe and the fourth holding portion of the probe card.

6C is an explanatory diagram showing a third example of the relationship between the fourth probe and the fourth holding portion of the probe card.

FIG. 6D is an explanatory diagram showing a fourth example of the relationship between the fourth probe and the fourth holding portion of the probe card.

FIG. 7 is a schematic bottom view of the supporting plate of the probe card.

FIG. 8A is an enlarged end view corresponding to FIG. 2 showing a design modification example of the probe card.

FIG. 8B is an enlarged end view corresponding to FIG. 3 showing a probe card of the aforementioned design modification.

FIG. 9 is an end view in the short side direction of the middle portion of the first probe in the probe card of the design modification example.

FIG. 10 is a schematic bottom view of a conventional probe card.

FIG. 11 is a schematic bottom view of a semiconductor wafer.

Detailed description of the preferred embodiment [Form for Implementing Invention] [Example 1]

Hereinafter, the probe card C according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 6C. The probe card C includes a probe unit, a substrate 300, a support plate 400, and a reinforcing plate 500. Hereinafter, each component of the probe card C will be described in detail. The Y-Y 'direction shown in Figs. 1 and 3 corresponds to the short-side direction of the probe card C and is the first direction corresponding to the scope of patent application. The X-X 'direction shown in Figs. 1 and 2 corresponds to the long side direction of the probe card C and is the second direction corresponding to the scope of patent application. The X-X 'direction intersects perpendicularly to the Y-Y' direction. The Z-Z 'direction shown in Figs. 2 and 3 corresponds to the thickness direction of the probe card C.

The reinforcing plate 500 is made of a material (for example, aluminum or SUS) that is harder than the supporting plate 400. The base plate 300 is fixed to the reinforcing plate as shown in FIGS. 1 to 3 500. The substrate 300 has a corner frame shape. A plurality of electrodes (not shown) on the substrate 300 are provided at positions corresponding to the rear ends of the probes 200a to 200h described later in the probe unit. The support plate 400 is fixed to the reinforcing plate 500 so as to be positioned inside the substrate 300. The support plate 400 is sandwiched between the reinforcing plate 500 and the probe unit. The support plate 400 is a base that supports the probe unit. The support plate 400 is made of a material harder than the holding frame F (for example, an alumina ceramic or a metal material).

As best shown in FIG. 7, the support plate 400 includes a groove 410, a groove 420, a groove 430, a groove 440, a groove 450, and a groove 460. The groove 410 extends in the Y-Y 'direction. The groove 410 has an end portion in the Y direction and an end portion in the Y 'direction. The groove 420 extends in the X-X 'direction. The groove 420 has an end portion in the X direction and an end portion in the X 'direction. An end portion in the X direction of the groove 420 communicates with an end portion in the Y 'direction of the groove 410. The groove 430 extends in the X-X 'direction. The groove 430 has an end portion in the X direction and an end portion in the X 'direction. An end portion in the X direction of the groove 430 communicates with an end portion in the Y direction of the groove 410. The groove 440 extends in the Y-Y 'direction. The groove 440 has an end portion in the Y direction and an end portion in the Y 'direction. An end portion in the Y direction of the groove 440 communicates with an end portion in the Y 'direction of the groove 410 and an end portion in the X direction of the groove 420. The groove 450 extends in the X-X 'direction. The groove 450 has an end portion in the X direction and an end portion in the X 'direction. The ends in the X 'direction of the groove 450 communicate with the ends in the Y' direction of the groove 410, the ends in the X direction of the groove 420, and the ends in the Y direction of the groove 440. The groove 460 extends in the X-X 'direction. The groove 460 has an end portion in the X direction and an end portion in the X 'direction. The end in the X 'direction of the groove 460 communicates with the end in the Y' direction of the groove 440.

The probe unit includes a holding frame F, a plurality of probes 200a (first probe), a plurality of probes 200b (fifth probe), a plurality of probes 200c (fourth probe), and a plurality of probes 200d ( 6th probe), multiple probes 200e (3rd probe Needle), a plurality of probes 200f (seventh probe), a plurality of probes 200g (second probe), and a plurality of probes 200h (eighth probe). Moreover, because the illustration is simplified, the number of each of the probes 200a to 200h of FIG. 1 and the number of each of the probes 200a to 200h of FIG. 4 are not consistent. The number of the probes 200a of FIG. 1, the number of the probes 200a of FIG. 5A, and the number of the probes 200a of FIG. 5B are not the same. In addition, in FIG. 3, the probe 200a is omitted from illustration.

The holding frame F is made of an insulating resin. The holding frame F is fixed to the support plate 400. The holding frame F includes a holding portion 100a, a holding portion 100b, a holding portion 100c, a holding portion 100d, a holding portion 100e, a holding portion 100f, a holding portion 100g, a holding portion 100h, a rectangular opening 100i, and a rectangular opening 100j. The openings 100i and 100j are provided in the central portion of the holding frame F so that the corner portions on the Y 'direction and the X direction side of the opening 100i and the corner portions on the Y and X' direction sides of the opening 100j communicate with each other. As shown in FIGS. 2 and 3, the opening 100 i communicates with the groove 410, the groove 420, and the groove 430 of the support plate 400. The opening 100j communicates with the groove 440, the groove 450, and the groove 460 of the support plate 400.

The holding portion 100a (first holding portion) is a resin block having a rectangular shape as viewed from the bottom surface inside the opening 100i of the holding frame F. The end in the X 'direction of the holding portion 100a, as best shown in Fig. 2, is a portion (holding portion 100b) that is integrally continuous to the X' direction side of the opening 100i of the holding frame F. The bottom surface of the holding portion 100a is inclined from the end in the X direction to the end in the X 'direction toward the Z direction. As shown in FIG. 1, the holding portion 100 a preferably includes a first wall surface 110 a, a second wall surface 120 a, and a third wall surface 130 a. The first wall surface 110a is an end surface in the X direction of the holding portion 100a. The second wall surface 120a is an end face in the Y 'direction of the holding portion 100a, At right angles to the first wall surface 110a. The third wall surface 130a is an end surface in the Y direction of the holding portion 100a, and intersects the first wall surface 110a at a right angle. The third wall surface 130a is an opposite surface of the second wall surface 120a.

The holding portion 100b (the fifth holding portion) is a portion on the X 'direction side of the opening 100i of the holding frame F, and is located on the X' direction side of the holding portion 100a. The holding portion 100b includes a first wall surface 110b and a second wall surface 120b. The first wall surface 110b is an end surface in the X direction of the holding portion 100b, and is an inner wall surface in the X 'direction of the opening 100i. The second wall surface 120b is an end face in the X 'direction of the holding portion 100b (the opposite surface of the first wall surface 110b).

The holding portion 100c (the fourth holding portion) is a portion on the Y 'direction side of the opening 100i of the holding frame F, and is a portion on the X' direction side of the opening 100j of the holding frame F. The holding portion 100c includes a first wall surface 110c, a second wall surface 120c, and a third wall surface 130c. The first wall surface 110c is an end surface in the Y direction of the holding portion 100c, and is an inner wall surface in the Y 'direction of the opening 100i. The first wall surface 110c faces the second wall surface 120a of the holding portion 100a with a gap therebetween. The second wall surface 120c is an end surface in the X direction of the holding portion 100c, and is an inner wall surface in the X 'direction of the opening 100j. The third wall surface 130c is an end face in the Y 'direction of the holding portion 100c (the opposite surface of the first wall surface 110c).

The holding portion 100d (sixth holding portion) is a portion on the Y-direction side of the opening 100i of the holding frame F. The holding portion 100d includes a first wall surface 110d and a second wall surface 120d. The first wall surface 110d is an end surface on the Y 'direction side of the holding portion 100d, and is an inner wall surface in the Y direction of the opening 100i. The first wall surface 110d faces the third wall surface 130a of the holding portion 100a with a gap therebetween. The second wall surface 120d is an end surface in the Y direction of the holding portion 100d (opposite to the first wall surface 110d).

The holding portion 100e (the third holding portion) is a resin block having a rectangular shape as viewed from the bottom surface provided in the opening 100j of the holding frame F. The X-direction end of the holding portion 100e is a portion (holding portion 100f) that is integrally continuous with the X-direction side of the opening 100j of the holding frame F. The bottom surface of the holding portion 100e is inclined from the end in the X 'direction to the end in the X direction toward the Z direction (refer to FIG. 2). As shown in FIG. 1, the holding portion 100 e preferably includes a first wall surface 110 e, a second wall surface 120 e, and a third wall surface 130 e. The first wall surface 110e is an end face in the X 'direction of the holding portion 100e. The first wall surface 110e faces the second wall surface 120c of the holding portion 100c with a gap therebetween. The second wall surface 120e is an end surface in the Y direction of the holding portion 100e and intersects the first wall surface 110e at a right angle. The third wall surface 130e is an end face in the Y 'direction of the holding portion 100e, and intersects the first wall surface 110e at a right angle. The third wall surface 130e is an opposite surface of the second wall surface 120e.

The holding portion 100f (seventh holding portion) is a portion on the X direction side of the opening 100j of the holding frame F, and is located on the X direction side from the holding portion 100e. The holding portion 100f includes a first wall surface 110f and a second wall surface 120f. The first wall surface 110f is an end surface in the X 'direction of the holding portion 100f, and is an inner wall surface in the X direction of the opening 100j. The second wall surface 120f is an end face in the X direction of the holding portion 100f (opposite surface of the first wall surface 110f).

The holding portion 100g (second holding portion) is a portion on the Y direction side of the opening 100j of the holding frame F, and is a portion on the X direction side of the opening 100i of the holding frame F. The holding portion 100g includes a first wall surface 110g, a second wall surface 120g, and a third wall surface 130g. The first wall surface 110g is an end surface in the Y 'direction of the holding portion 100g, and is an inner wall surface in the Y direction of the opening 100j. The first wall surface 110g faces the second wall surface 120e of the holding portion 100e with a gap therebetween. 120g of the second wall surface is a holding portion The end face in the X 'direction of 100g is the inner wall face in the X direction of the opening 100i. The third wall surface 130g is an end face in the Y direction of the holding portion 100g (opposite to the first wall surface 110g).

The holding portion 100h (the eighth holding portion) is a portion on the Y 'direction side of the opening 100j of the holding frame F. The holding portion 100h includes a first wall surface 110h and a second wall surface 120h. The first wall surface 110h is an end surface in the Y direction of the holding portion 100h, and is an inner wall surface in the Y 'direction of the opening 100j. The first wall surface 110h faces the third wall surface 130e of the holding portion 100e via a gap. The second wall surface 120h is an end face in the Y 'direction of the holding portion 100h (opposite to the first wall surface 110h).

The probes 200a to 200h are cantilevered needles. Each probe 200a has a front end portion 210a, an intermediate portion 220a, and a rear end portion 230a, as best shown in FIG. 2. The probe 200a is held in the holding portion 100a and the holding portion 100b at intervals in the Y-Y 'direction. More specifically, the intermediate portion 220a of the probe 200a is held by the holding portion 100a and the holding portion 100b at intervals in the Y-Y 'direction. The intermediate portion 220a is embedded in the holding portion 100a and the holding portion 100b. The rear end portion 230a projects in the X 'direction from the second wall surface 120b of the holding portion 100b. The rear end portion 230 a is connected to a corresponding electrode of the substrate 300.

The distal end portion 210a projects from the first wall surface 110a of the holding portion 100a in the X direction. The front end portion 210a is disposed on the Z 'direction side of the groove 410 of the support plate 400. The tip portion 210a includes a contact portion 211a and an elastically deformed portion 212a. The elastically deformed portion 212a extends from the first wall surface 110a in the X direction. The elastically deformable portion 212a is elastically deformable in the Z-Z 'direction. The contact portion 211a extends from the X-direction end of the elastically deformed portion 212a in the Z 'direction. The tip of the contact portion 211a (hereinafter, also referred to as the tip of the probe 200a) is located below the bottom of the holding portion 100a and the holding portion 100g. The surface is also on the Z 'direction side. The front end of the contact portion 211 a is a portion that can contact an electrode (not shown) on the X-direction side of the semiconductor device D of the semiconductor wafer U. Portions other than the contact portion 211a of the probe 200a are inclined in an inclined direction between the X 'direction and the Z direction.

The front end of the probe 200a may be arranged in one or more rows in the Y-Y 'direction. Examples are shown in FIGS. 4A, 4B, 5A, and 5B. As shown in FIG. 4A and FIG. 4B, the probe 200a may be held on the holding portion 100a so that the tip of the probe 200a is arranged in two rows of thousands of birds in the Y-Y 'direction.

Alternatively, as shown in FIG. 5A, the probe 200a may be held at the front end of the probe 200a in the Y-Y 'direction by four rows of thousands of birds arranged in the Y-Y' direction. In this case, the probes 200a of the first column are arranged along the first imaginary line L1 extending in the direction in which the probes are arranged, so that the probes 200a of the first column are spaced apart in the Y-Y 'direction. The interval is held by the holding portion 100a. The probe 200a of the third row is aligned along the third imaginary line L3 extending in the arrangement direction, so that the probe 200a of the third row is positioned on the Z′-direction side of the probe 200a of the first row and the first The probes 200a of one row are held in the holding portion 100a at the same interval. The probe 200a of the second column is aligned along the first imaginary line L2 extending in the direction in which the probe is arranged, so that the probe 200a of the second column is held in the Y-Y 'direction at intervals.部 100a。 100a. The probes 200a in the second row are located between the probes 200a in the first row adjacent to each other in the Y-Y 'direction. The probe 200a of the fourth row is aligned along the fourth imaginary line L4 extending in the arrangement direction, so that the probe 200a of the fourth row is positioned on the Z 'direction side of the probe 200a of the third row and the first The three rows of probes 200a are held in the holding portion 100a at the same interval. In addition, the first imaginary line L1 to the fourth imaginary line L4 intersect at right angles in the arrangement direction and face the probe. The long sides are arranged at intervals.

Alternatively, as shown in FIG. 5B, the probe 200a may be held in the holding portion 100a so that its tip is aligned in four rows in the Y-Y 'direction. In this case, the arrangement is repeated from the Y direction side in the order of the probe 200a in the first row, the probe 200a in the fourth row, the probe 200a in the second row, and the probe 200a in the third row. The probe 200a is held in the holding portion 100a at intervals in the Y-Y 'direction. The tip of the probe 200a in the second row is positioned closer to the X 'direction than the tip of the probe 200a in the first row. The tip of the probe 200a in the third row is positioned closer to the X 'direction than the tip of the probe 200a in the second row. The front end of the probe 200a in the fourth row is positioned closer to the X 'direction than the front end of the probe 200a in the third row.

Furthermore, the probe 200a of the first group in the array direction (for example, a group of probes at one end of the array direction) among the plurality of probes 200a may be aligned in a row, and the probe 200a of the second group in the array direction may be arranged. (For example, a group of probes at the central portion in the alignment direction) or the tips of the remaining probes 200a are arranged in a plurality of rows, and the plurality of probes 200a are held in the holding portion 100a. Alternatively, the front ends of the probes 200a in the first group of the plurality of probes 200a may be arranged in a plurality of columns, and the second ends of the arrays or the ends of the remaining probes 200a may be different from the plurality of columns. The method of arranging a plurality of columns is to hold the plurality of probes 200a on the holding portion 100a.

As shown in FIGS. 4A and 4B, the space between the probe 200 a and the second wall surface 120 g of the holding portion 100 g is denoted by S1.

Each probe 200b, as best shown in FIG. 2, includes a front end portion 210b, a middle portion 220b, and a rear end portion 230b. The probe 200b is held in the holding portion 100b at intervals in the Y-Y 'direction. More specifically, the middle of the probe 200b The portion 220b is held in the Y-Y 'direction at a distance from the intermediate portion 220a of the probe 200a in the Z' direction by a distance to the holding portion 100b. The intermediate portion 220b is embedded in the holding portion 100b. The rear end portion 230b protrudes from the second wall surface 120b of the holding portion 100b in the X 'direction. The rear end portion 230b is positioned closer to the Z 'direction than the rear end portion 230a. The rear end portion 230 b is connected to a corresponding electrode of the substrate 300.

The distal end portion 210b protrudes from the first wall surface 110b of the holding portion 100b in the X direction. The front end portion 210b is located on the Z 'direction side of the holding portion 100a. The front end portion 210b includes a contact portion 211b and an elastically deformed portion 212b. The elastically deformed portion 212b extends from the first wall surface 110b in the X direction. The elastically deformable portion 212b is elastically deformable in the Z-Z 'direction. The contact portion 211b extends from the X-direction end of the elastically deformed portion 212b in the Z 'direction. The tip of the contact portion 211a (hereinafter, also referred to as the tip of the probe 200b) is located closer to the Z 'direction than the bottom surfaces of the holding portion 100b and the holding portion 100a. The tip of the contact portion 211b is an electrode (not shown) on the X'-direction side of the semiconductor device D that can contact the semiconductor wafer U. Portions other than the contact portion 211b of the probe 200b are inclined in the inclination direction between the X 'direction and the Z direction.

In addition, the probe 200b may be held in the holding portion 100b so that its tip is aligned in one or more rows in the Y-Y 'direction similarly to the probe 200a. In addition, similar to the probe 200a, the front ends of some of the probes 200b of the plurality of probes 200b may be arranged in a row, and the front ends of the other parts or the remaining probes 200b may be arranged in a plurality of rows to maintain the retention.部 100b。 100b. In addition, similar to the probe 200a, a plurality of probes 200b may be arranged with a plurality of probes 200b at the front ends of the probes 200b in a plurality of rows, and the other ends or the tips of the remaining probes 200b may be different from the foregoing plurality of trains. The method of arranging plural numbers is held in the holding portion 100b.

Each of the probes 200c has a front end portion 210c, an intermediate portion 220c, a rear end portion 230c, and a bent portion 240c, as best shown in FIG. 3. The probe 200c is held in the X-X 'direction at intervals by the holding portion 100c. More specifically, the intermediate portion 220c of the probe 200c is held by the holding portion 100c at intervals in the X-X 'direction. The intermediate portion 220c is embedded in the holding portion 100c. The rear end portion 230c projects in the Y 'direction from the third wall surface 130c of the holding portion 100c. The rear end portion 230 c is connected to a corresponding electrode of the substrate 300.

The tip portion 210c projects from the first wall surface 110c of the holding portion 100c in the Y direction. The front end portion 210c is located on the Z 'direction side of the groove 420 of the support plate 400. The distal end portion 210c includes a contact portion 211c and an elastically deformed portion 212c. The elastically deformed portion 212c extends from the first wall surface 110c in the Y direction. The elastically deformable portion 212c is elastically deformable in the Z-Z 'direction. The elastically deformed portion 212c has an end in the Y direction and an end in the Y 'direction. The end in the Y 'direction of the elastically deformed portion 212c corresponds to the root portion 212c1 of the tip portion 210c. The height position in the Y-Y 'direction of the root portion 212c1 of the tip portion 210c is the same as the height position in the Y-Y' direction of the first wall surface 110c of the holding portion 100c. The contact portion 211c extends from the Y-direction end of the elastically deformed portion 212c in the Z 'direction. The front end of the contact portion 211c is the front end of the front end portion 210c (hereinafter also referred to as the front end of the front end portion 210c or the front end of the probe 200c.). The contact portion 211c is positioned closer to the Z 'direction than the bottom surfaces of the holding portion 100c and the holding portion 100a. The front end 211c1 of the contact portion 211c is a portion that can contact an electrode (not shown) on the Y'-direction side of the semiconductor device D of the semiconductor wafer U. Portions other than the contact portion 211c of the probe 200c are inclined in the inclination direction between the Y 'direction and the Z direction.

Also, the probe 200c may be the same as the probe 200a, so that The front end thereof is held in the holding portion 100c so as to be aligned in the X-X 'direction in one or more rows. Also, similar to the probe 200a, the tips of some of the probes 200c among the plurality of probes 200c are arranged in a row, and the tips of the other or the remaining probes 200c are arranged in a plurality of rows, and are held and held.部 100c. Also, similar to the probe 200a, a part of the probes 200c of the plurality of probes 200c may be arranged in a plurality of columns at the front end, and the other part or the ends of the remaining probes 200c may be different from the above-mentioned plurality of columns. The plural arrays are held in the holding unit 100c.

The front end 211c1 of the front end portion 210c is located closer to the first wall surface 110e of the holding portion 100e than the root portion 212c1 of the front end portion 210c. This is achieved by tilting or bending a part of the probe 200c described later, but it is not limited to this.

As shown in FIG. 6A, the bent portion 240c may be provided between the front end portion 210c and the middle portion 220c. In other words, the bent portion 240c is the first wall surface 110c located on the holding portion 100c. In this case, the bent portion 240c is bent in the X direction (the first wall surface 110e side of the holding portion 100e) on the first wall surface 110c. The front end portion 210c is inclined in the X direction. The intermediate portion 220c and the rear end portion 230c extend linearly in the Y-Y 'direction. Alternatively, as shown in FIG. 6B, the bent portion 240 c may be provided in the intermediate portion 220 c. In other words, the bent portion 240c is located in the holding portion 100c. In this case, the bent portion 240c is bent in the X direction in the holding portion 100c. The portion of the probe 200c that is closer to the front end than the bent portion 240c (including the portion of the front end portion 210c and the intermediate portion 220c that is closer to the front end than the bent portion 240c) is inclined in the X direction. The portion of the probe 200c that is closer to the rear end portion than the bent portion 240c (including the portion of the rear end portion 230c and the intermediate portion 220c that is closer to the rear end portion than the bent portion 240c) is The Y-Y 'direction extends straight. Alternatively, as shown in FIG. 6C, the bent portion 240 c may be provided between the intermediate portion 220 c and the rear end portion 230 c. In other words, the bent portion 240c is located on the third wall surface 130c of the holding portion 100c. In this case, the bent portion 240c is bent in the X direction on the third wall surface 130c. The front end portion 210c and the intermediate portion 220c are inclined in the X direction (on the first wall surface 110e side of the holding portion 100e). The rear end portion 230a extends linearly in the Y-Y 'direction.

Further, the tip portion 210c may be bent in the X direction (the first wall surface 110e side of the holding portion 100e) without being inclined. In this case, the bent portion 240c is omitted. As shown in FIG. 6D, the start point 250c (start point of a bent portion described later) of the probe 200c may be provided between the tip portion 210c and the intermediate portion 220c. That is, the starting point 250c of bending may be located on the first wall surface 110a of the holding portion 100c. In this case, the distal end portion 210c becomes a curved portion. The intermediate portion 220c and the rear end portion 230c extend linearly in the Y-Y 'direction. Alternatively, the bending start point 250c may be provided at the intermediate portion 220c. That is, the bending start point 250c may be located in the holding portion 100c. In this case, the portion of the probe 200c that is closer to the start point 250c than the bending point (including the portion of the tip portion 210c and the intermediate portion 220c that is closer to the tip side than the bent portion 240c) becomes a bent portion. The portion of the probe 200c that is closer to the rear end than the bent portion 240c (including the portion of the rear end 230c and the intermediate portion 220c that is closer to the rear end than the bent portion 240c) extends linearly in the Y-Y 'direction. . Alternatively, the bending start point 250c may be provided between the intermediate portion 220c and the rear end portion 230c. That is, the bending start point 250c may be located on the third wall surface 130c of the holding portion 100c. In this case, the front end portion 210c and the middle portion 220c become curved portions. The rear end portion 230a extends linearly in the Y-Y 'direction. Moreover, the bend of the above-mentioned probe 200c The end point of the curve is the Y-direction end of the elastically deformed portion 212c of the tip portion 210c.

The front end portion 210c of all the probes 200c, the front end portion 210c of the bent portion 240c of the middle portion 220c and the front end portion 210c of all the probes 200c, or the middle portion of all the probes 200c may be used. 220c and front end portion 210c are inclined or bent in the X direction as shown in FIG. 4A. Alternatively, as shown in FIG. 4B, the probe 200c may include a probe 200c (located in the X-most direction) on the side of the X direction (the first wall surface 110e of the holding portion 100e) in the probe 200c. The most distal probe 200c on the side) or a plurality of probes 200c (including the most distal probe 200c located on the side in the most X-direction side), and the remaining probes 200c. Hereinafter, one or a plurality of probes 200c are referred to as probes 200c on the X-direction side. The tip portion 210c of the probe 200c on the X-direction side and the tip portion 210c of the probe 200c on the X-direction side may be closer to the front-end portion and the tip portion 210c than the bent portion 240c of the intermediate portion 220c, or may be on the X-direction side. The middle portion 220c and the front end portion 210c of the probe 200c are inclined or bent more in the X direction than the remaining probes 200c. Alternatively, the tip portion 210c of the probe 200c on the X-direction side and the tip portion 210c of the probe 200c on the X-direction side may be closer to the front-end portion and the tip portion 210c than the bent portion 240c of the intermediate portion 220c, or only The middle portion 220c and the tip portion 210c of the probe 200c on the X direction side are inclined or bent in the X direction, and the remaining probe 200c is not inclined or bent.

As best shown in FIG. 3, each probe 200d has a front end portion 210d, a middle portion 220d, and a rear end portion 230d. The probe 200d is held in the holding portion 100d in the X-X 'direction at intervals. More specifically, the intermediate portion 220d of the probe 200d is held by the holding portion 100d in the X-X 'direction at intervals. Middle 220d is embedded in the holding part 100d. The rear end portion 230d protrudes from the second wall surface 120d of the holding portion 100d in the Y direction. The rear end portion 230 d is connected to a corresponding electrode of the substrate 300.

The distal end portion 210d projects from the first wall surface 110d of the holding portion 100d in the Y 'direction. The front end portion 210d is located on the Z 'direction side of the groove 430 of the support plate 400. The distal end portion 210d includes a contact portion 211d and an elastically deformed portion 212d. The elastically deformed portion 212d extends from the first wall surface 110d in the Y 'direction. The elastically deformable portion 212d is elastically deformable in the Z-Z 'direction. The contact portion 211d extends from the Y 'direction end of the elastically deformed portion 212d toward the Z' direction. The tip of the contact portion 211d (hereinafter also referred to as the tip of the probe 200d.) Is located closer to the Z 'direction than the bottom surfaces of the holding portion 100d and the holding portion 100a. The tip of the contact portion 211d is a portion that can contact an electrode (not shown) on the Y-direction side of the semiconductor device D of the semiconductor wafer U. The portions other than the contact portion 211d of the probe 200d are inclined in the inclination direction between the Y direction and the Z direction.

Further, the probe 200d may be held in the holding portion 100d such that the tip of the probe 200d is arranged in one or more rows in the X-X 'direction similarly to the probe 200a. Also, similar to the probe 200a, the tips of some of the probes 200d among the plurality of probes 200d may be arranged in a row, and the tips of the other or the remaining probes 200d may be arranged in a plurality of rows. Department 100d. In addition, similar to the probe 200a, a plurality of probes 200d may be arranged such that the tips of some of the probes 200d are arranged in a plurality of columns, and the other portions or the tips of the remaining probes 200d may be different from the plurality of sequences. The method of arranging plural numbers is held in the holding portion 100d.

As described below, the probe 200e is held in the holding portion 100e and Except for the holding portion 100f, the configuration is the same as that of the probe 200a. Each probe 200e includes a front end portion 210e, a middle portion 220e, and a rear end portion 230e. The probe 200e is held in the holding portion 100e and the holding portion 100f at intervals in the Y-Y 'direction. More specifically, the intermediate portion 220e of the probe 200e is held in the holding portion 100e and the holding portion 100f at intervals in the Y-Y 'direction. The intermediate portion 220e is embedded in the holding portion 100e and the holding portion 100e. The rear end portion 230e protrudes from the second wall surface 120f of the holding portion 100f in the X direction. The rear end portion 230e is connected to a corresponding electrode of the substrate 300.

The front end portion 210e protrudes from the first wall surface 110e of the holding portion 100e in the X 'direction. The front end portion 210e is disposed on the Z 'direction side of the groove 440 of the support plate 400. The tip portion 210e includes a contact portion 211e and an elastically deformed portion 212e. The elastically deformed portion 212e extends from the first wall surface 110e in the X 'direction. The elastically deformable portion 212e is elastically deformable in the Z-Z 'direction. The contact portion 211e extends from the X 'direction end of the elastic deformation portion 212e toward the Z' direction. The front end of the contact portion 211e (hereinafter, also referred to as the front end of the probe 200e) is located closer to the Z 'direction side than the bottom surfaces of the holding portion 100e and the holding portion 100c. The tip of the contact portion 211e is a portion that can contact an electrode (not shown) on the X 'direction side of the other semiconductor device D of the semiconductor wafer U. The portion other than the contact portion 211e of the probe 200e is inclined in the inclination direction between the X direction and the Z direction.

Further, the probe 200e may be held in the holding portion 100e such that the tip of the probe 200e is arranged in one or more rows in the Y-Y 'direction similarly to the probe 200a. Also, similar to the probe 200a, the tips of some of the probes 200e among the plurality of probes 200e may be arranged in a row, and the tips of the other or remaining probes 200e may be arranged in a plurality of rows. Holding section 100e. Also, similar to the probe 200a, a part of the probe 200e of the plurality of probes 200e may be arranged in a plurality of columns at the tip, and the other part or the tips of the remaining probes 200e may be different from the complex sequence. The method of arranging plural numbers is held in the holding portion 100e.

In FIGS. 4A and 4B, the space between the probe 200 e and the second wall surface 120 c of the holding portion 100 c is indicated by S2.

The probe 200f has the same structure as that of the probe 200b except that it is held by the holding portion 100f as described later. Each probe 200f includes a front end portion 210f, a middle portion 220f, and a rear end portion 230f. The probe 200f is held in the holding portion 100f at intervals in the Y-Y 'direction. More specifically, the middle portion 220f of the probe 200f is held in the Y-Y 'direction at a distance from the holding portion 100f by a distance from the middle portion 220e of the probe 200e in the Z' direction. The intermediate portion 220f is embedded in the holding portion 100f. The rear end portion 230f protrudes from the second wall surface 120f of the holding portion 100f in the X direction. The rear end portion 230f is positioned closer to the Z 'direction than the rear end portion 230e. The rear end portion 230f is connected to a corresponding electrode of the substrate 300.

The distal end portion 210f projects from the first wall surface 110f of the holding portion 100f in the X 'direction. The front end portion 210f is positioned on the Z 'direction side of the holding portion 100e. The distal end portion 210f includes a contact portion 211f and an elastically deformed portion 212f. The elastically deformed portion 212f extends from the first wall surface 110f in the X 'direction. The elastically deformable portion 212f is elastically deformable in the Z-Z 'direction. The contact portion 211f extends from the X 'direction end of the elastically deformed portion 212f in the Z' direction. The tip of the contact portion 211f (hereinafter, also referred to as the tip of the probe 200f.) Is located closer to the Z 'direction than the bottom surfaces of the holding portion 100f and the holding portion 100e. The tip of the contact portion 211f is a portion that can contact an electrode (not shown) on the X-direction side of the other semiconductor device D of the semiconductor wafer U. Of probe 200f Portions other than the contact portion 211f are inclined in the inclination direction between the X direction and the Z direction.

In addition, the probe 200f may be held in the holding portion 100f so that its tip is arranged in one or more rows in the Y-Y 'direction similarly to the probe 200a. Also, similar to the probe 200a, the front ends of some of the probes 200f of the plurality of probes 200f may be arranged in a row, and the front ends of the other or remaining probes 200f may be arranged in a plurality of rows. Holding section 100f. Also, similar to the probe 200a, a plurality of probes 200f may be arranged at the front ends of a plurality of probes 200f in a plurality of columns, and the other ends or the ends of the remaining probes 200f may be different from the above-mentioned plurality of columns. The method of arranging plural numbers is held in the holding portion 100f.

The probe 200g has the same configuration as that of the probe 200c except that the probe 200g is held in the holding portion 100g and the direction of bending or bending of the probe 200g is different, as described later. Each probe 200g has a front end portion 210g, a middle portion 220g, a rear end portion 230g, and a bent portion (not shown). 200 g of the probes are held in the X-X 'direction at intervals of 100 g on the holding portion. More specifically, 220 g of the middle portion of the probe 200 g is held in the holding portion 100 g at intervals in the X-X 'direction. 220 g of intermediate parts are embedded in 100 g of holding | maintenance parts. The rear end portion 230g protrudes from the third wall surface 130g of the holding portion 100g in the Y direction. The rear end portion 230 g is connected to a corresponding electrode of the substrate 300.

The tip portion 210g protrudes from the first wall surface 110g of the holding portion 100g in the Y 'direction. The distal end portion 210g is disposed on the Z 'direction side of the groove 450 of the support plate 400. The distal end portion 210g includes a contact portion 211g and an elastically deformed portion 212g. The elastically deformed portion 212g extends from the first wall surface 110g in the Y 'direction. Elastic deformation 212g can be elastically deformed in the Z-Z 'direction. The elastically deformed portion 212g has an end in the Y direction and an end in the Y 'direction. The end in the Y 'direction of the elastically deformed portion 212g corresponds to the root portion 212g1 of the tip portion 210g. The height position in the Y-Y 'direction of the root portion 212g1 of the tip portion 210g is the same as the height position in the Y-Y' direction of the first wall surface 110g of the holding portion 100g. The contact portion 211g extends from the Y 'direction end of the elastically deformed portion 212g toward the Z' direction. The front end of the contact portion 211g is the front end 211g1 of the front end portion 210g (hereinafter, also referred to as the front end of the front end portion 210g and the front end of the probe 200g). The leading end of the contact portion 211g is positioned closer to the Z 'direction than the bottom surfaces of the holding portion 100g and the holding portion 100e. The front end of the contact portion 211g is a portion that can contact an electrode (not shown) on the Y-direction side of the other semiconductor device D of the semiconductor wafer U. The portion other than the contact portion 211g of the probe 200g is inclined in the tilt direction between the Y direction and the Z direction.

In addition, the probe 200g may be held in the holding portion 100g in a manner such that the probe 200a is arranged in one or more rows in the X-X 'direction, similarly to the probe 200a. Also, similar to the probe 200a, the tips of some of the probes 200g among the plurality of probes 200g may be arranged in a row, and the tips of the other or the remaining probes 200g may be arranged in a plurality of rows. 100g. Also, similar to the probe 200a, the front ends of some of the probes 200g among the plurality of probes 200g may be arranged in a plurality of columns, and the other ends or the tips of the remaining probes 200g may be different from the above-mentioned plurality of columns. The arrangement of plural numbers is held in the holding portion 100 g.

The front end 211g1 of the front end portion 210g is located on the 110g side of the first wall surface of the holding portion 100g rather than the root portion 212g1 of the front end portion 210g. This is achieved by inclination or bending of a part of the probe 200g described later, but this is not the case. limit.

The bent portion of the probe 200g can be configured in the same manner as the bent portion 240c of the probe 200c except that the bent portion of the probe 200g faces the X 'direction (the first wall surface 110a side of the holding portion 100a). When the bent portion of the probe 200g is provided between the front end portion 210g and the middle portion 220g (refer to FIG. 6A), the front end portion 210g is inclined in the X 'direction. The middle portion 220g and the rear end portion 230g extend linearly in the Y-Y 'direction. Or, in the case where the bent portion of the probe 200g is provided at the middle portion 220g (refer to FIG. 6B), the probe 200g is located closer to the front side than the bent portion (including the ratio of the front portion 210g and the middle portion 220g) The bent portion is further inclined toward the X ′ direction. The portion of the probe 200g that is closer to the rear end than the bent portion (including the portion of the rear end 230g and the intermediate portion 220g that is closer to the rear end than the bent portion) extends straight in the Y-Y 'direction. Alternatively, when the bent portion of the probe 200g is provided between the middle portion 220g and the rear end portion 230g (refer to FIG. 6C), the front end portion 210g and the middle portion 220g are inclined in the X 'direction. The rear end portion 230g extends linearly in the Y-Y 'direction.

Further, the tip portion 210g may not be inclined, but may be bent in the X 'direction (the first wall surface 110a side of the holding portion 100a). In this case, the bent portion of 200 g of the probe is omitted. When the starting point of the bending of the probe 200g (the starting point of the bent portion described later) is provided between the tip portion 210g and the middle portion 220g (refer to FIG. 6D), the tip portion 210g becomes a bent portion. The middle portion 220g and the rear end portion 230g extend linearly in the Y-Y 'direction. Or, when the starting point of bending is set at the middle portion 220a, the probe 200g is located closer to the front side than the starting point of bending (including the front end portion 210g and the middle portion 220g is closer to the front side than the bent portion). Part) becomes a bent portion. 200g of probe is more than bent part The rear-end portion (including the rear-end portion of the rear-end portion 230g and the intermediate portion 220g that is closer to the rear-end side than the bent portion) extends linearly in the Y-Y 'direction. Alternatively, when the start point of the bend is provided between the intermediate portion 220g and the rear end portion 230g, the front end portion 210g and the intermediate portion 220g become a bent portion. The rear end portion 230g extends linearly in the Y-Y 'direction. The end point of the bend of the probe 200g is the end in the Y 'direction of the elastically deformed portion 212g of the tip portion 210g.

It may be 210 g of the front end portion of all the probes 200 g, 220 g of the middle portion of all the probes 200 g, and 210 g of the front end side than the bent portion, or the middle of all the 200 g of the probes. The portion 220g and the tip portion 210g are inclined or bent in the X ′ direction. Alternatively, the above-mentioned probe 200g may include a probe 200g (located at the extreme end of the most X'-direction side) of the probe 200g located at the end in the X 'direction (the first wall surface 110a side of the holding portion 100a). 200g of needles) or 200g of probes (including the 200g of probes located at the extreme end on the X'-direction side), and 200g of the remaining probes. Hereinafter, one or a plurality of probes 200g will be referred to as a probe 200g on the X 'direction side. The distal end portion 210g of the probe 200g on the X 'direction side and the bent portion on the distal end portion 220g of the probe 200g on the X' direction side may be closer to the distal end portion and the distal end portion 210g than the bent portion 220g, or X ' The middle portion 220 g and the front end portion 210 g of the probe 200 g on the direction side are inclined more toward the X ′ direction than the remaining probes 200 g. Alternatively, the tip portion 210g of the probe 200g on the X 'direction side and the tip portion 200g of the probe 200g on the X' direction side may be closer to the tip portion and the tip portion 210g than the bent portion of the intermediate portion 220g. Only the middle portion 220g and the front end portion 210g of the 200g probe 200g on the X 'direction side are inclined or bent in the X' direction, and the remaining 200g probes are not inclined or bent.

The probe 200h has the same structure as the probe 200d except that it is held in the holding portion 100h as described later. Each probe 200h includes a front end portion 210h, a middle portion 220h, and a rear end portion 230h. The probe 200h is held in the holding portion 100h in the X-X 'direction at intervals. More specifically, the middle portion 220h of the probe 200h is held in the holding portion 100h at intervals in the X-X 'direction. The intermediate portion 220h is embedded in the holding portion 100h. The rear end portion 230h projects in the Y 'direction from the second wall surface 120h of the holding portion 100h. The rear end portion 230h is connected to a corresponding electrode of the substrate 300.

The front end portion 210h projects from the first wall surface 110h of the holding portion 100h in the Y direction. The front end portion 210h is located on the Z 'direction side of the groove 460 of the support plate 400. The tip portion 210h includes a contact portion 211h and an elastically deformed portion 212h. The elastically deformed portion 212h extends from the first wall surface 110h in the Y direction. The elastically deformable portion 212h is elastically deformable in the Z-Z 'direction. The contact portion 211h extends from the Y-direction end of the elastically deformed portion 212h in the Z 'direction. The front end of the contact portion 211h (hereinafter, also referred to as the front end of the probe 200h) is located closer to the Z 'direction side than the bottom surfaces of the holding portion 100h and the holding portion 100e. The tip of the contact portion 211h is a portion that can contact an electrode (not shown) on the Y'-direction side of the other conductor device D of the semiconductor wafer U. The portion other than the contact portion 211h of the probe 200h is inclined in the tilt direction between the Y 'direction and the Z direction.

In addition, the probe 200h may be held in the holding portion 100h so that its tip is aligned in one or more rows in the X-X 'direction similarly to the probe 200a. Also, similar to the probe 200a, the tips of some of the probes 200h of the plurality of probes 200h may be arranged in a row, and the tips of the other or remaining probes 200h may be arranged in a plurality of rows. Holding section 100b. Also, similar to the front end of the probe 200h, a part of the probe 200h of the plurality of probes 200h may be arranged in a plurality of rows, and the other part or the remaining probe 200h may be arranged in a manner corresponding to the aforementioned plurality of rows The arrangement of different plural numbers is held in the holding portion 100h.

Hereinafter, the manufacturing direction of the probe card C will be described in detail. Here, a description will be given of a state in which only the tip portion 210c of the probe 200c and the tip portion 210g of the probe 200g are inclined or bent. When the probe 200c and the probe 200g are tilted or bent, the probe card C can be produced in the same manner.

Prepare the probe 200a. The probe 200a is arranged on the first base (not shown) at intervals in the Y-Y 'direction. After that, a part of the middle portion 220a of the probe 200a is coated with a first insulating resin, and a part of the middle portion 220a of the probe 200a is embedded in the first insulating resin and fixed to the first insulating resin. Remove the hardened first insulating resin from the first base. After that, the support plate 400 is prepared. The probe 200a and the first insulating resin are arranged on the support plate 400 so that the tip portion 210a of the probe 200a is positioned on the groove 410 of the support plate 400. After that, the first insulating resin is fixed to the support plate 400 with the second insulating resin. The second insulating resin and the first insulating resin after curing become the holding portion 100a. The front end portion 210a of the probe 200a protrudes from the first wall surface 110a of the holding portion 100a, and the remaining portion of the middle portion 220a and the rear end portion 230a of the probe 200a protrudes from the opposite surface of the first wall surface 110a of the holding portion 100a.

After that, the probe 200b is prepared. The probe 200b is arranged on the second base (not shown) at intervals in the Y-Y 'direction. Thereafter, a third insulating resin is applied to the central portion 220b of the probe 200b, and the middle portion of the probe 200b is applied. 220b is embedded in the third insulating resin and fixed to the third insulating resin. Remove the hardened third insulating resin from the second base. Thereafter, the probe 200b and the third insulating resin are arranged on the support plate 400 so that the front end portion 210b of the probe 200b is located on the holding portion 100a. After that, the fourth insulating resin is applied to the third insulating resin and the remaining portion of the intermediate portion 220a of the probe 200a, and the remaining portion of the intermediate portion 220a of the probe 200a is buried in the fourth insulating resin. 4 Insulating resin A third insulating resin is fixed to the support plate 400. At this time, the fourth insulating resin is in contact with the holding portion 100a. The fourth insulating resin and the third insulating resin after curing become the holding portion 100b, and the holding portion 100b and the holding portion 100a are integrated. The distal end portion 210b of the probe 200b protrudes from the first wall surface 110b of the holding portion 100b, and the rear end portion 230a of the probe 200a and the rear end portion 230b of the probe 200b protrudes from the second wall surface 120b of the holding portion 100b.

After that, the probe 200c is prepared. The probe 200c is arranged on the third base (not shown) at intervals in the X-X 'direction. At this time, the inclination direction or bending direction of the distal end portion 210c of the probe 200c is directed toward the X direction. Thereafter, a fifth insulating resin is applied to the middle portion 220c of the probe 200c, and the middle portion 220c of the probe 200c is embedded in the fifth insulating resin and fixed to the fifth insulating resin. Remove the hardened fifth insulating resin from the third base. Thereafter, the probe 200c and the fifth insulating resin are arranged on the support plate 400 so that the front end portion 210c of the probe 200c is located on the groove 420 of the support plate 400. Thereafter, the fifth insulating resin is fixed to the support plate 400 with the sixth insulating resin. At this time, the sixth insulating resin is in contact with the holding portion 100b. The sixth insulating resin and the fifth insulating resin after curing become the holding portion 100c, and the holding portion 100c and the holding portion 100b are integrated. The distal end portion 210c of the probe 200c is first from the holding portion 100c. The wall surface 110c protrudes, and the rear end portion 230c of the probe 200c protrudes from the third wall surface 130c of the holding portion 100c.

After that, the probe 200d is prepared. The probe 200d is arranged on the fourth base (not shown) at intervals in the X-X 'direction. Thereafter, a seventh insulating resin is applied to the middle portion 220d of the probe 200d, and the middle portion 220d of the probe 200d is embedded in the seventh insulating resin in the support plate 400 and fixed to the seventh insulating resin. Remove the hardened seventh insulating resin from the fourth base. Thereafter, the probe 200d and the seventh insulating resin are arranged on the support plate 400 so that the front end portion 210d of the probe 200d is located on the groove 430 of the support plate 400. After that, the seventh insulating resin is fixed to the support plate 400 with the eighth insulating resin. At this time, the eighth insulating resin is in contact with the holding portion 100b. The eighth insulating resin and the seventh insulating resin after curing become the holding portion 100d, and the holding portion 100d and the holding portion 100b are integrated. The front end portion 210d of the probe 200d protrudes from the first wall surface 110d of the holding portion 100d, and the rear end portion 230d of the probe 200d protrudes from the second wall surface 120d of the holding portion 100d.

After that, the probe 200e is prepared. The probe 200e is arranged on the fifth base (not shown) at intervals in the Y-Y 'direction. After that, a part of the middle portion 220e of the probe 200e is coated with a ninth insulating resin, and a part of the middle portion 220e of the probe 200e is embedded in the ninth insulating resin and fixed to the ninth insulating resin. Remove the hardened 9th insulating resin from the 5th base. Thereafter, the probe 200e and the ninth insulating resin are arranged on the support plate 400 so that the front end portion 210e of the probe 200e is positioned on the groove 440 of the support plate 400. After that, the ninth insulating resin is fixed to the support plate 400 with the tenth insulating resin. The tenth insulating resin and the ninth insulating resin after curing become the holding portion 100e. The front end portion 210e of the probe 200e protrudes from the first wall surface 110e of the holding portion 100e, and the remaining portion of the middle portion 220e and the rear end portion 230e of the probe 200e protrudes from the opposite surface of the first wall surface 110e of the holding portion 100e.

After that, the probe 200f is prepared. The probe 200f is arranged on the sixth base (not shown) at intervals in the Y-Y 'direction. After that, the eleventh insulating resin is applied to the middle portion 220f of the probe 200f, and the middle portion 220f of the probe 200f is buried in the eleventh insulating resin and fixed to the eleventh insulating resin. Remove the hardened 11th insulating resin from the 6th base. Thereafter, the probe 200f and the eleventh insulating resin are arranged on the support plate 400 so that the front end portion 210f of the probe 200f is located on the holding portion 100e. Thereafter, the twelfth insulating resin is applied to the eleventh insulating resin and the remaining portion of the middle portion 220e of the probe 200e, and the remaining portion of the middle portion 220e of the probe 200e is buried in the twelfth insulating resin. The twelfth insulating resin fixes the eleventh insulating resin to the support plate 400. At this time, the twelfth insulating resin is in contact with the holding portion 100e. The twelfth insulating resin and the eleventh insulating resin after curing become the holding portion 100f, and the holding portion 100f and the holding portion 100e are integrated. The distal end portion 210f of the probe 200f projects from the first wall surface 110f of the holding portion 100f, and the rear end portion 230e of the probe 200e and the rear end portion 230f of the probe 200f project from the second wall surface 120f of the holding portion 100f.

Then, 200 g of probes were prepared. 200 g of probes were arranged on the seventh base (not shown) at intervals in the X-X 'direction. At this time, the oblique direction or bending direction of the front end portion 210g of the probe 200g is directed toward the X 'direction. Thereafter, a 13th insulating resin was applied to 220 g of the middle portion of the probe 200 g, and 220 g of the middle portion of the probe 200 g was buried in the 13th insulating resin and fixed to the 13th insulating resin. Remove the 13th insulating resin after hardening from the 7th base. Of Thereafter, the probe 200 g and the 13th insulating resin are arranged on the support plate 400 so that the front end portion 210 g of the probe 200 g is located on the groove 450 of the support plate 400. After that, the 13th insulating resin is fixed to the support plate 400 with the 14th insulating resin. At this time, the fourteenth insulating resin is in contact with the holding portion 100d and the holding portion 100f. The 14th insulating resin and the 13th insulating resin after curing become the holding portion 100g, and are integrated with the holding portion 100d and the holding portion 100f. The front end portion 210g of the probe 200g projects from the first wall surface 110g of the holding portion 100g, and the rear end portion 230g of the probe 200g projects from the third wall surface 130g of the holding portion 100g.

After that, the probe was prepared for 200h. 200 g of probes were arranged on the eighth base (not shown) at intervals in the X-X 'direction. After that, the 15th insulating resin is coated on the middle portion 220h of the probe 200h, and the middle 220h of the probe 200h is buried in the 15th insulating resin and fixed to the 15th insulating resin. Remove the hardened 15th insulating resin from the 8th base. Thereafter, the probe 200h and the 15th insulating resin are arranged on the support plate 400 so that the front end portion 210h of the probe 200h is located on the groove 460 of the support plate 400. After that, the fifteenth insulating resin is fixed to the support plate 400 with the sixteenth insulating resin. At this time, the 16th insulating resin is in contact with the holding portion 100c and the holding portion 100f. The 16th insulating resin and 15th insulating resin after curing become the holding portion 100h, and are integrated with the holding portion 100c and the holding portion 100h. The front end portion 210h of the probe 200h protrudes from the first wall surface 110h of the holding portion 100h, and the rear end portion 230h of the probe 200h protrudes from the second wall surface 120h of the holding portion 100h. In this way, a probe unit is manufactured.

The substrate 300 is prepared. The substrate 300 is fixed to the reinforcing plate 500. After that, the support plate 400 of the probe unit is arranged in the substrate 300, and the support The supporting plate 400 is disposed on the reinforcing plate 500. Thereafter, the rear ends 230a to 230h of the probes 200a to 200h are connected to the electrodes of the substrate 300 by soldering, respectively.

The probe card C is used for inspecting the semiconductor wafer U shown in FIG. 11 as described below. First, the probe card C is mounted on a spot tester of an inspection device (not shown). Thereafter, the semiconductor wafer U is set on a stage of a spot tester. After that, the probe card C and the semiconductor wafer U are relatively approached by a spot tester. Once this is done, the probes 200a to 200d of the probe card C are in contact with the electrodes of the semiconductor device D1 of the semiconductor wafer U, and the probes 200e to 200h of the probe card C are in contact with the semiconductors of the semiconductor wafer U, respectively. The electrode of device D2. At this time, the electrical characteristics of the semiconductor devices D1 and D2 are inspected once by the inspection device through the probe card C. Thereafter, the probe card C and the semiconductor wafer U are relatively separated from each other by a spot tester. After that, the probe card C and the semiconductor wafer U are relatively horizontally moved, and the electrical characteristics of the two semiconductor devices D under the semiconductor wafer U are checked. By repeating this operation, the inspection of all the semiconductor devices D of the semiconductor wafer U is performed.

The probe card C as described above has the following technical features and effects. The first is to make the space S2 between the spot measuring machine 200e and the second wall surface 120c of the holding portion 100c larger. The reason is as follows.

When all of the probes 200c have tip portions 210c, all of the probes 200c are closer to the front side than the bent portion 240c, or all of the probes 200c have a middle portion 220c and a tip portion 210c inclined or bent The front ends 211c1 of the front ends 210c of all the probes 200c are arranged according to the positions of the electrodes of the semiconductor device D, and the front ends of all the probes 200c The root portion 212c1 of 210c is located closer to the X 'direction side than the front end 211c1 of the front end portion 210c of all the probes 200c. That is, the probe 200c is located closer to the rear end side than the root portion 212c1 of the front end portion 210c on the X 'direction side than the front end 211c1 of the front end portion 210c, so that the second wall surface 120c of the holding portion 100c can be The position is moved to the X ′ direction (a direction away from the first wall surface 110e of the holding portion 100e). Therefore, the space S2 can be made larger.

When one or more probes 200c on the X-direction side are inclined or bent in the X-direction more than the remaining probes 200c, the front ends 211c1 of the front ends 210c of all the probes 200c are arranged according to the positions of the electrodes of the semiconductor device D. And the root 212c1 of the front end 210c of the remaining probe 200c is located on the X 'direction side than the front end 211c1 of the front end 210c of the remaining probe 200c, and the front end 210c of the probe 200c on the X direction side The root portion 212c1 is located further on the X ′ direction side than the front end 211c1 of the front end portion 210c of the probe 200c on the X direction side. That is, the probe 200c is located closer to the rear end than the root portion 212c1 of the front end portion 210c, and is positioned closer to the X ′ direction side than the front end 211c1 of the front end portion 210c, so that the The position is moved to the X ′ direction (a direction away from the first wall surface 110e of the holding portion 100e). Therefore, the space S2 can be made larger.

The tip portion 210c of the probe 200c on the X direction side and the tip portion 210c of the probe 200c on the X direction side are located closer to the tip portion, or only the middle portion 220c and the tip portion 210c of the probe 200c on the X direction side face toward When the X direction is inclined or bent, the front ends 211c1 of the front ends 210c of all the probes 200c are arranged according to the positions of the electrodes of the semiconductor device D, and the roots 212c1 of the front ends 210c of the probes 200c on the X direction side are positioned more than the X direction Side probe 200c The front end 211c1 of the front end portion 210c is also closer to the X 'direction side. Because the probe 200c on the X direction side is located closer to the rear end than the root portion 212c1 of the front end portion 210c, the front end 211c1 of the front end 210c on the X 'direction side is located on the X' direction Therefore, the position of the second wall surface 120c of the holding portion 100c can be moved to the X ′ direction (a direction away from the first wall surface 110e of the holding portion 100e). Therefore, the space S2 can be made larger.

The second is to make the space S1 between the probe 200a and the second wall surface 120g of the holding portion 100g larger. The reason is the same as the reason for the space S2.

The third is that the probe card C can cope with the narrow pitch of the probes 200a and 200e and increase the number of the probes 200a and 200e. This is because the spaces S1 and S2 can be made larger as described above.

In addition, the above-mentioned probe card is not limited to the above-mentioned embodiments, and design changes can be made arbitrarily within the scope of the patent application. This will be described in detail below.

In the case where the probe card of the present invention includes a first holding portion having insulating properties described later, a second holding portion having insulating properties, a plurality of first probes of a cantilever type, and a plurality of second probes of a cantilever type Next, design changes can be made arbitrarily.

The first holding portion of the present invention can be arbitrarily changed in design when the first holding portion has insulation and has a first wall surface extending in the first direction. The first holding portion can be configured to have a second wall surface. The second wall surface of the first holding portion may be configured to cross the first wall surface of the first holding portion and extend in the second direction. The first holding portion can be made to have a first The wall surfaces intersect, and the third wall surface is a third wall surface that is opposite to the second wall surface of the first holding portion and extends in the second direction. In addition, the first holding portion may be configured to further have a fourth wall surface, and the fourth wall surface is an opposite surface of the first wall surface of the first holding portion. For example, the opposite surface of the first wall surface 110a of the holding portion 100a and the holding portion 100b may be arranged at intervals in the X-X 'direction.

The second holding portion of the present invention has a first wall surface extending in a second direction crossing the first direction, and a first wall surface intersecting the first wall surface of the second holding portion and intersecting the first holding surface with a gap. In the case of the second wall surface facing the wall surface, the design can be arbitrarily changed.

The plurality of first probes of the present invention can be arbitrarily changed in the case of having the following matters. 1) The first probe is a cantilever probe and has a tip portion. 2) The first probe is held by the first holding portion at intervals in the first direction such that the tip portion protrudes from the first wall surface of the first holding portion in any one of the aspects described above. For example, a configuration in which the rear end portion 230a of the probe 200a protrudes from the first holding portion in any one of the above-mentioned directions in the Z direction and is connected to a substrate or the like can be made. Moreover, the rear end part 230a of the probe 200a may protrude from the opposite surface of the 1st wall surface 110a of the holding part 100a. The middle portion and the elastically deformed portion of the first probe of any one of the above aspects may extend in parallel with the substrate.

The first probe of any one of the aspects described above may be configured to further have a first flat surface extending in the length direction of the first probe. In this case, the probe card may further include a first support portion. In a state where the first flat surface is in contact with the first support portion, the first probe may be fixed to the first support portion by the first holding portion. For example, the probe 200a 'shown in Figs. 8A and 9 is provided with a first flat surface 221a' at the middle portion 220a '. The first flat surface 221a 'abuts on the support In a state of the inclined surface of the first support portion 401 'of the plate 400', the probe 200a 'is fixed to the first support portion 401' by the holding portion 100a. The inclined surface of the first support portion 401 'may be a parallel surface parallel to the substrate.

The plurality of second probes of the present invention can be arbitrarily changed in design in the following cases. 1) The second probe is a cantilever probe and has a tip portion. 2) The second probe is held on the second holding portion at a distance in the second direction so that the tip portion protrudes from the first wall surface of the second holding portion in any one of the aspects described above. 3) The second probe includes the second probe located at the outermost end on the second wall surface side of the second holding portion, and at least the front end of the front end portion of the second probe located at least the outermost end is located at the outermost end. The root of the distal end portion of the second probe is also closer to the first wall surface side of the first holding portion. For example, a structure in which the end portion 230 g of the probe 200 g and the end portion 230 g protrude from the second holding portion in any one of the above-mentioned aspects in the Z direction and are connected to a substrate or the like may be used. The middle portion and the elastically deformed portion of the second probe of any one of the above aspects may extend parallel to the substrate.

The second probe according to any one of the aspects described above may have a configuration having a second flat surface extending in the length direction of the second probe. In this case, the probe card may further include a second support portion. In a state where the second flat surface is in contact with the second support portion, the second probe may be fixed to the second support portion by the second holding portion. The second flat surface may be provided in the middle portion of the second probe in the same manner as the first flat surface 221a '. The second support portion may be provided on the support plate. The second support portion may have an inclined surface that abuts the second flat surface. The inclined surface of the second support portion may be a parallel surface parallel to the substrate.

The third holding portion of the present invention can arbitrarily make design changes in the following cases. 1) The third holding portion is insulating. 2) 3rd Guarantee When the holding portion has a first wall surface extending in the first direction, the design is arbitrarily changed. 3) The third holding portion further includes a second wall surface that intersects the first wall surface of the third holding portion and faces the first wall surface of the second holding portion via a gap. The third holding portion may be configured to further include a third wall surface that intersects with the first wall surface of the third holding portion and is an opposite surface of the second wall surface of the third holding portion and extends in the second direction. The third holding portion may have a fourth wall surface structure, and the fourth wall surface may be an opposite surface of the first wall surface of the third holding portion. For example, the opposite surface of the first wall surface 110e of the holding portion 100e and the holding portion 100f may be arranged at intervals in the X-X 'direction.

The plurality of third probes of the present invention can be arbitrarily changed in design in the following cases. 1) The third probe is a cantilever probe and has a tip portion. 2) The third probe is held by the third holding portion at intervals in the first direction such that the tip portion protrudes from the first wall surface of the third holding portion in any one of the aspects described above. For example, a configuration in which the rear end portion 230e of the probe 200e protrudes from the third holding portion of any of the above-mentioned aspects in the Z direction and is connected to a substrate or the like may be made. The rear end portion 230e of the probe 200e may protrude from the opposite surface of the first wall surface 110g of the holding portion 100g. The middle portion and the elastically deformed portion of the third probe of any one of the above aspects may extend parallel to the substrate.

The third probe according to any one of the aspects described above may have a structure having a third flat surface extending in the length direction of the third probe. In this case, the probe card may further include a third support portion. In a state where the third flat surface is in contact with the third support portion, the third probe may be fixed to the third support portion by the third holding portion. The third flat surface may be the same as the first flat surface 221a '. Ground is provided in the middle of the third probe. The third support portion may be provided on the support plate. The third support portion may be an inclined surface having a third flat surface. The inclined surface of the third support portion may be a parallel surface parallel to the substrate.

The fourth holding portion of the present invention can arbitrarily make design changes in the following cases. 1) The fourth holding portion has a first wall surface extending in the second direction and facing the second wall surface of the first holding portion via a gap. The fourth holding portion has a second wall surface that intersects the first wall surface of the fourth holding portion and faces the first wall surface of the third holding portion via a gap.

The plurality of fourth probes of the present invention can be arbitrarily changed in design in the following cases. 1) The fourth probe is a cantilever probe and has a tip portion. 2) The fourth probe is held by the fourth holding portion at intervals in the second direction such that the tip portion protrudes from the first wall surface of the fourth holding portion in any one of the aspects described above. 3) The fourth probe includes the fourth probe located at the outermost end on the second wall surface side of the fourth holding portion, and at least the front end of the fourth probe of the outermost end is located at the front end of the fourth probe. The root of the distal end portion of the fourth probe is also closer to the first wall surface side of the third holding portion. For example, a configuration in which the rear end portion 230c of the probe 200c protrudes from the fourth holding portion of any of the above-mentioned aspects in the Z direction and is connected to a substrate or the like can be made. The middle portion and the elastically deformed portion of the fourth probe of any one of the above aspects may extend parallel to the substrate.

The fourth probe according to any one of the aspects described above can be configured to have a fourth flat surface extending in the length direction of the fourth probe. In this case, the probe card may further include a fourth support portion. In a state where the fourth flat surface is in contact with the fourth support portion, the fourth probe may be fixed to the fourth support portion by the fourth holding portion. For example, as shown in FIG. 8B, the fourth flat surface 221c 'may be It is provided in the middle portion 220c 'of the fourth probe 200c' similarly to the first flat surface 221a '. The fourth support portion 402 'may be provided on the support plate 400'. The fourth support portion may have an inclined surface that abuts the fourth flat surface. The inclined surface of the fourth support portion may be a parallel surface parallel to the substrate.

The fifth holding portion of the present invention can arbitrarily make design changes in the following cases. 1) The fifth holding portion is insulating. 2) The fifth holding portion is disposed on the X 'side of the first holding portion in any one of the above aspects. 3) The fifth holding portion may be configured to have a first wall surface extending in the first direction.

The fifth probe of the present invention can be arbitrarily changed in design in the following cases. 1) The fifth probe is a cantilever probe and has a tip portion. 2) The fifth probe is held by the fifth holding portion at intervals in the first direction so that the tip portion protrudes from the first wall surface of the fifth holding portion in any one of the aspects described above. For example, a configuration in which the rear end portion 230b of the probe 200b protrudes from the fifth holding portion in any one of the above-mentioned directions in the Z direction and is connected to a substrate or the like can be made. The middle portion and the elastically deformed portion of the fifth probe of any one of the aspects described above may extend parallel to the substrate.

The fifth probe according to any one of the aspects described above may have a structure having a fifth flat surface extending in the length direction of the fifth probe. In this case, the probe card may further include a fifth support portion. In a state where the fifth flat surface is in contact with the fifth support portion, the fifth probe may be fixed to the fifth support portion by the fifth holding portion. The fifth flat surface may be provided at an intermediate portion of the fifth probe. The 5th support part may be provided in a support plate. The fifth support portion may have an inclined surface that abuts the fifth flat surface. The inclined surface of the fifth support portion may be a parallel surface parallel to the substrate.

The sixth holding portion of the present invention can arbitrarily make design changes in the following cases. 1) The sixth holding portion has insulation properties. 2) The sixth holding portion has a first wall surface extending in the second direction and facing the third wall surface of the first holding portion via a gap.

The plurality of sixth probes of the present invention can be arbitrarily changed in design in the following cases. 1) The sixth probe is a cantilever probe and has a tip portion. 2) The sixth probe is held by the sixth holding portion at intervals in the second direction so that the tip portion protrudes from the first wall surface of the sixth holding portion in any one of the above aspects. For example, a configuration in which the rear end portion 230d of the probe 200d protrudes from the sixth holding portion in any one of the above-mentioned directions in the Z direction and is connected to a substrate or the like can be made. The middle part and the elastic deformation part of the sixth probe of any one of the above aspects may extend in parallel with the substrate.

The sixth probe according to any one of the above aspects can be configured to have a sixth flat surface extending in the length direction of the sixth probe. In this case, the probe card may further include a sixth support portion. In a state where the sixth flat surface is in contact with the sixth support portion, the sixth probe may be fixed to the sixth support portion by the sixth holding portion. For example, as shown in FIG. 8B, the sixth flat surface 221d 'may be provided in the middle portion 220d' of the sixth probe 200d 'similarly to the first flat surface 221a'. The sixth support portion 403 'may be provided on the support plate 400'. The sixth support portion may have an inclined surface that abuts the sixth flat surface. The inclined surface of the sixth support portion may be a parallel surface parallel to the substrate.

The seventh holding portion of the present invention can arbitrarily make design changes in the following cases. 1) The seventh holding portion is insulating. 2) The seventh holding portion is arranged on the X side of the first holding portion in any one of the above aspects. 3) 7th hold The part may be configured to have a first wall surface extending in the first direction.

The plurality of seventh probes of the present invention can be arbitrarily changed in design in the following cases. 1) The seventh probe is a cantilever probe and has a tip portion. 2) The seventh probe is held by the seventh holding portion at intervals in the first direction such that the tip portion protrudes from the first wall surface of the seventh holding portion in any one of the aspects described above. For example, a configuration in which the rear end portion 230f of the probe 200f protrudes from the fifth holding portion in any one of the above-mentioned directions in the Z direction and is connected to a substrate or the like can be made. The middle portion and the elastically deformed portion of the seventh probe of any one of the aspects described above may extend parallel to the substrate.

The seventh probe according to any one of the above aspects can be configured to have a seventh flat surface extending in the length direction of the seventh probe. In this case, the probe card may further include a seventh support portion. In a state where the seventh flat surface is in contact with the seventh support portion, the seventh probe may be fixed to the seventh support portion by the seventh holding portion. The seventh flat surface may be provided at an intermediate portion of the seventh probe. The seventh support portion may be provided on the support plate. The seventh support portion may have an inclined surface that abuts the seventh flat surface. The inclined surface of the seventh support portion may be a parallel surface parallel to the substrate.

The eighth holding portion of the present invention can arbitrarily make design changes in the following cases. 1) The eighth holding portion is insulating. 2) The eighth holding portion has a first wall surface extending in the second direction and facing the third wall surface of the third holding portion via a gap.

The plurality of eighth probes of the present invention can be arbitrarily changed in design in the following cases. 1) The eighth probe is a cantilever probe and has a tip portion. 2) The eighth probe has a tip from any of the above. An aspect in which the first wall surface of the eighth holding portion protrudes is held on the eighth holding portion at intervals in the second direction. For example, a configuration in which the end portion 230h after the probe 200h protrudes from the eighth holding portion in any one of the above aspects in the Z direction and is connected to a substrate or the like can be made. The intermediate portion and the elastically deformed portion of the eighth probe of any one of the aspects described above may extend parallel to the substrate.

The eighth probe according to any one of the aspects described above may be configured to have an eighth flat surface extending in the length direction of the eighth probe. In this case, the probe card may further include an eighth support portion. In a state where the eighth flat surface is in contact with the eighth support portion, the eighth probe may be fixed to the eighth support portion by the eighth holding portion. The eighth flat surface may be provided in the middle portion of the eighth probe similarly to the first flat surface 221a '. The eighth support portion may be provided on the support plate. The eighth support portion may have an inclined surface that abuts the eighth flat surface. The inclined surface of the eighth support portion may be a parallel surface parallel to the substrate.

The first to eighth holding portions in any of the above aspects need not be integrated, and may be other objects to each other. A part of the first to eighth holding parts may be integrated, and the remaining part may be used as another object. The height position in the Y-Y 'direction of the root portion of the tip portion of the second probe of any one of the aspects may be a height position different from the first wall surface of the second holding portion of any of the aspects. The height position of the root of the front end of the fourth probe in any of the above aspects may be set to be the same.

In addition, the materials, shapes, sizes, numbers, and arrangements of the constituent elements constituting the probe card in the above-mentioned embodiment and the design modification are examples of the description, and can be arbitrarily performed if the same function can be achieved Design changes. The above embodiments and design changes do not contradict each other. In this case, they can be combined with each other. In the case where the first direction of the present invention corresponds to the alignment direction of the first probe, design changes can be made arbitrarily. When the second direction of the present invention intersects the first direction and corresponds to the alignment direction of the second probe, the design change can be arbitrarily made. When the third direction of the present invention is orthogonal to the first direction and the second direction, design changes can be made arbitrarily.

Claims (9)

A probe card includes: a first holding portion having insulation; a second holding portion having insulation; a plurality of cantilever-type first probes; and a plurality of cantilever-type second probes, wherein the first The holding portion has a first wall surface extending in a first direction, the second holding portion has a first wall surface extending in a second direction crossing the first direction, and the first wall surface intersects with the first wall surface of the second holding portion and A second wall surface facing the first wall surface of the first holding portion through a gap, the plurality of first probes have a front end portion, and the plurality of first probes are separated from the first holding portion by the front end portion. In the aspect in which the first wall surface protrudes, the first holding portion is held by the first holding portion at intervals in the first direction. The plurality of second probes have a tip portion. In a manner that the front end portion protrudes from the first wall surface of the second holding portion, the front end portion of the plurality of second probes has a front end and a root portion, and is held by the second holding portion at intervals in the second direction. , The aforementioned plurality of second probes are located closest to the aforementioned first probe The 2nd probe of the 2nd wall surface side of the 2 holding portion, at least the front end of the 2nd probe of the outermost end is located closer to the root of the 2nd probe than the 2nd probe of the outermost end. The first wall surface side of the 1 holding portion. The probe card according to claim 1, wherein at least the front end portion of the secondmost probe at the extreme end is inclined or bent toward the first wall surface side of the first holding portion. For example, the probe card of claim 2, wherein the second probe at the extreme end further has a bent portion provided in the second holding portion and bent toward the first wall surface side of the first holding portion, rather than The front end portion of the bent portion including the front end portion of the second probe including the outermost end is inclined toward the first wall surface side of the first holding portion. For example, the probe card of claim 2, wherein the second holding portion further has a third wall surface on the opposite side of the first wall surface of the second holding portion, and the second most distal probe further includes: a middle portion, a In the second holding portion; the rear end portion protrudes from the third wall surface of the second holding portion; and the bent portion is provided between the intermediate portion and the rear end portion, and the third wall surface faces the foregoing The first wall surface side of the first holding portion is bent, and the middle portion and the front end portion of the outermost second probe are inclined toward the first wall surface side of the first holding portion. For example, the probe card of claim 2, wherein the secondmost probe at the extreme end further includes a curved portion including the front end portion of the second probe at the extreme end, and the curved portion faces the first holding portion. The first wall surface side is curved, and the starting point of the curved portion is disposed in the second holding portion. For example, the probe card of claim 2, wherein the second holding portion further has a third wall surface on the opposite side of the first wall surface of the second holding portion, and the secondmost probe at the extreme end further has a rear end portion. Protruding from the third wall surface of the second holding portion; and a curved portion including the distal end portion of the second probe at the outermost end, the curved portion being bent toward the first wall surface side of the first holding portion, The starting point of the curved portion is located on the third wall surface. For example, the probe card of any one of claims 1 to 6, wherein the front ends of the plurality of second probes are respectively located at the front of the plurality of second probes, and the front ends of the plurality of second probes rely on the first holding portion. The first wall surface side. For example, the probe card of any one of claims 1 to 6 further includes a first support portion and a second support portion, and the plurality of first probes further extend in a length direction of the plurality of first probes. The first flat surface, and in a state where the first flat surface is in contact with the first support portion, the plurality of first probes are fixed to the first support portion by the first holding portion, and the plurality of The second probe further includes a second flat surface extending in the length direction of the plurality of second probes, and the plurality of second probes are in a state where the second flat surface is in contact with the second support portion. It is fixed to the said 2nd support part by the said 2nd holding part. For example, the probe card of claim 7 further includes a first support portion and a second support portion, and the plurality of first probes further includes a first flat surface extending in a length direction of the plurality of first probes, In a state where the first flat surface is in contact with the first support portion, the plurality of first probes are fixed to the first support portion by the first holding portion, and the plurality of second probes further include The second flat surfaces extending in the length direction of the plurality of second probes are held in the state where the second flat surfaces are in contact with the second support portion by the second The portion is fixed to the second support portion.