TWI678766B - A method for making a system on an active-controllable substrate - Google Patents

Abstract

The present invention discloses a method for manufacturing a system on an actively controllable substrate. The steps include: providing an actively controllable substrate having opposite upper and lower surfaces, and the actively controllable substrate includes at least one An active control unit and an interconnect structure electrically connected to the active control unit; forming a first and a second rewiring layer on the upper and lower surfaces of the actively controllable substrate respectively, and the first and second rewiring layers The wiring layer is electrically connected to the interconnect structure; a plurality of first and second conductive bonding structures are respectively formed on the first and second rewiring layers; a functional bare chip and a sensor are provided, and the The functional bare chip and the sensor are bonded to the first and second redistribution layers by the first and second conductive bonding structures, respectively, and the first redistribution layer and the interconnect structure are used to make the sensor The functional bare chip is electrically connected to the active control unit, and the sensor is electrically connected to the active control unit through the second redistribution layer and the interconnect structure.

Description

Method for manufacturing a system on an actively controllable substrate

The invention relates to a method for manufacturing a system on an actively controllable substrate, and more particularly to a method for manufacturing a functional system on an actively controllable substrate.

The application of the Internet of Things (IoT) includes a variety of usage conditions, so it is necessary to integrate various software and hardware through the connection of different integrated circuits (ICs) and chips, and provide multiple functions, such as logic integration. Circuit (Logic IC) plus radio frequency integrated circuit (RF IC) plus sensor. However, different functional sensors such as current sensors, voltage sensors, optical sensors, magnetic sensors, temperature sensors, thermal sensors, humidity sensors, gas sensors, pressure Sensors, level sensors, immersion sensors, illuminance sensors, weight sensors, ultrasonic sensors, image sensors, linear displacement sensors, tilt sensors, acceleration sensors Sensors, collision sensors, vibration sensors, biometric sensors, etc. usually have different structures and are manufactured using a unique integrated circuit process, so it is difficult for these sensors to be system-on-a-chip (System-on-Chip; SOC) mode manufacturing.

In view of this, therefore, for practical applications that require multiple / synchronized sensor data to facilitate users or artificial intelligence (AI) to make a correct judgment, it is better to integrate it on a single substrate with a small area to provide Better efficiency, better energy planning, smaller size, and data synchronization. Therefore, a person who can integrate different functional chips and various sensors into a single system chip is eagerly expected by the industry.

One feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate. The steps include: providing an actively controllable substrate having opposite upper and lower surfaces, and the actively controllable substrate The substrate includes at least one active control unit and an interconnect structure electrically connected to the active control unit; forming a first and a second redistribution layer on the upper and lower surfaces of the actively controllable substrate respectively, and the first The second redistribution layer is electrically connected to the interconnect structure; a plurality of first and second conductive bonding structures are formed on the first and second redistribution layers respectively; a functional bare chip and a sensor are provided; And enable the functional bare chip and the sensor to be bonded to the first and second redistribution layers through the first and second conductive bonding structures, respectively, and then through the first redistribution layer and the interconnect The structure enables the functional bare chip to be electrically connected with the active control unit, and the sensor and the active control unit are electrically connected through the second redistribution layer and the interconnect structure.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the actively controllable substrate is an insulating substrate or a semiconductor substrate.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the semiconductor substrate is a silicon substrate, a silicon carbide substrate, a sapphire substrate, a (II)-(VI) substrate or (III)-(V) substrates.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the interconnect structure includes at least one wire and at least one via.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the active control unit includes an active element and / or a multiplexer.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the active element includes a transistor, an active switch, a modulator, and programmable logic. One of a programmable logic, a switch array, or a combination thereof.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the transistor can be a metal-oxide-semiconductor field-effect transistor (MOS) or a bipolar junction transistor (BJT ).

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the functional bare chip includes a microcontroller (MCU), a logic integrated circuit (Logic IC), and a driving integrated circuit. (Driving IC) or radio frequency integrated circuit (RF IC) or a combination thereof.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the sensor includes a current sensor, a voltage sensor, an optical sensor, and a magnetic sensor. , Temperature sensor, thermal sensor, humidity sensor, gas sensor, pressure sensor, liquid level sensor, immersion sensor, illuminance sensor, weight sensor, ultrasonic sensor One or a combination of a sensor, an image sensor, a linear displacement sensor, a tilt sensor, an acceleration sensor, a collision sensor, a vibration sensor, a biometric sensor.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the first and second conductive bonding structures include one of a solder ball, a conductive bump, a conductive pillar, or one of them. combination.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the substrate further includes at least one passive element.

Another feature of the present invention is to disclose a method for manufacturing a system on an actively controllable substrate as described above, wherein the passive component includes a resistor, a capacitor, an inductor, a memristor, an antenna, and a heat sink. (heat-spreader), diode (diode), light-emitting diode (LED), waveguide (waveguide), filter (filter) one or a combination thereof.

The following will explain in detail the manufacturing and using methods of the embodiments of the present invention. It should be noted, however, that the invention provides many applicable inventive concepts that can be embodied in a number of specific forms. The specific embodiments discussed by way of example are merely specific ways of making and using the invention, and are not intended to limit the scope of the invention.

First, please refer to FIG. 1A and provide an actively controllable substrate 100 as shown in FIG. 1A. The actively controllable substrate 100 has opposite upper and lower surfaces 100A and 100B, and the actively controllable substrate includes an active control unit 110 and 120 and an interconnect structure (not shown) electrically connected to the active control unit 110 and 120. Drawing).

The aforementioned actively controllable substrate 100 may be an insulating substrate, such as, but not limited to, a glass substrate or a plastic substrate, or a semi-conductive substrate, such as, but not limited to, a silicon substrate, a silicon carbide substrate, a sapphire substrate, and (II)-(VI) families Substrate or (III)-(V) substrate.

The above active control units 110 and 120 may be active control units having the same or different functions, and each of the active control units 110 and 120 may include an active element and / or a multiplexer (MUX), respectively. The active element may include one or a combination of a transistor, an active switch, a modulator, a programmable logic controller, a switch array, and the transistor such as but Not limited to Metal Oxide Half Field Effect Transistor (MOS) or BJT, or.

The above-mentioned interconnect structure (not shown) includes at least one wire (not shown) and at least one via (not shown). The wire (not shown) may be made of a material having a high electrical conductivity, such as, but not limited to, gold, silver or copper wires commonly used in the semiconductor industry, and the via (not shown) may be formed by For example, but not limited to, damascene, through silicon via (TSV), or metal plug (Metal Plug) and other manufacturing processes, will not be repeated here.

Next, referring to FIG. 1B, a conventional re-distribution layer process (RDL process) is used to form a first and a second re-distribution layer (RDL) 140A and 140B respectively. The upper and lower surfaces 100A and 100B of the substrate 100 can be actively controlled, and the first and second redistribution layers 140A and 140B are electrically connected to the interconnect structure (not shown), respectively. Then, a plurality of first and second conductive bonding structures 150A and 150B are formed on the first and second redistribution wiring layers 140A and 140B, respectively. The above-mentioned first and second conductive bonding structures 150A, 150B may be, for example, but not limited to, one of a solder ball, a conductive bump, a conductive pillar, or a combination thereof.

Finally, referring to FIG. 1C, a functional bare chip 200 and a sensor 300 are provided, and the functional bare chip 200 and the sensor 300 are respectively passed through the first and second conductive bonding structures 150A, 150B is bonded to the first and second redistribution layers 140A and 140B, and then the functional bare chip 200 and the active control unit 110, through the first redistribution layer 140A and the interconnect structure (not shown), 120 is electrically connected, and the sensor 300 is electrically connected to the active control units 110 and 120 through the second redistribution layer 140B and the interconnect structure (not shown) to form a function integration system. According to other embodiments of the present invention, more than one functional bare chip 200 having different functions and more than one sensor 300 having different functions may be selected and passed through the first redistribution layer 140A and the interconnect structure (not shown). (Illustrated) and the functional bare chips 200 having different functions are electrically connected to the active control units 110 and 120 having different functions, and through the second redistribution layer 140B and the interconnect structure (not shown) The sensors 300 with different functions are electrically connected to the active control units 110 and 120 to form a multi-function integration system 1000.

The functional bare chip 200 described above may be, for example, but not limited to, one or a combination of a microcontroller (MCU), a logic integrated circuit (Logic IC), a driving integrated circuit (Driving IC), or a radio frequency integrated circuit (RF IC).

The sensor 300 may be, for example, but not limited to, a current sensor, a voltage sensor, an optical sensor, a magnetic sensor, a temperature sensor, a thermal sensor, a humidity sensor, and a gas sensor. , Pressure sensor, liquid level sensor, immersion sensor, illuminance sensor, weight sensor, ultrasonic sensor, image sensor, linear displacement sensor, tilt sensor, Acceleration sensors, collision sensors, vibration sensors, biometric sensors, etc.

In addition, the above-mentioned actively controllable substrate 100 may further include at least one passive element, which may be, for example, but not limited to, a resistor, a capacitor, an inductor, a memristor, an antenna, and a heat-spreader. ), A diode (LED), a light emitting diode (LED), a waveguide (waveguide), a filter (filter), or a combination thereof. As shown in FIG. 1C, the above-mentioned actively controllable substrate 100 further includes a capacitor 130 and an antenna 330, and one of the functional bare chips 200 is conducted through the first and second redistribution layers 140A, 140B, and the second conductive layer. The bonding structure 150B is electrically connected to the capacitor 130 and the antenna 330. The above-mentioned antenna 330 can be applied to wireless communication, such as but not limited to near field wireless communication (NFC).

As described above, according to a method for manufacturing a system on an actively controllable substrate disclosed in the present invention, one or more functional bare chips with different functions and one or more sensors may be selected as required, and the like. The functional bare chip and the sensors are respectively bonded to a substrate containing an active control unit, and the functional bare chip and the sensors are made by a redistribution layer and an interconnect structure in the substrate. It is electrically connected to the active control unit and integrated on a single substrate with a small area to form a multiple function integration system that can provide better efficiency, better energy planning, smaller area, and data synchronization.

In summary, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

 100  Active control of substrate  150A  First conductive bonding structure  100A  Upper surface  150B  Second conductive bonding structure  100B  lower surface  200  Functional bare chip  110, 120  Active control unit  300  Sensor  130  Capacitance  330  Antenna  140A  First rewiring layer  1000  Multiple function integration system  140B  Second wiring layer

Figures 1A to 1C show a cross-sectional process of manufacturing a system on a substrate that can be actively controlled according to an embodiment of the present invention.

Claims (11)

A method for manufacturing a system on an actively controllable substrate includes the following steps: step (1): providing an actively controllable substrate having opposite upper and lower surfaces, and the actively controllable substrate includes At least one active control unit and an interconnect structure electrically connected to the active control unit; step (2): forming a first and a second redistribution layer on the upper and lower surfaces of the actively controllable substrate, respectively; and The first and second redistribution layers are electrically connected to the interconnect structure respectively; step (3): forming a plurality of first and second conductive bonding structures on the first and second redistribution layers respectively; and step ( 4): Provide a functional bare chip and a sensor, and enable the functional bare chip and the sensor to communicate with the first and second rewiring layers through the first and second conductive bonding structures, respectively. Bonding, further electrically connecting the functional bare chip with the active control unit through the first rewiring layer and the interconnect structure, and enabling the sensor through the second rewiring layer and the interconnect structure Electrically connected to the active control unit ; Wherein the functionality of the microcontroller comprising a bare wafer (the MCU), wherein the logic one integrated circuit (Logic IC), a driving integrated circuit (Driving IC) or radio frequency integrated circuit (RF IC), or a combination thereof. The method for manufacturing a system on an actively controllable substrate as described in item 1 of the scope of patent application, the actively controllable substrate is an insulating substrate or a semiconductor substrate. The method for manufacturing a system on an actively controllable substrate as described in item 2 of the scope of the patent application, the semiconductor substrate is a silicon substrate, a silicon carbide substrate, a sapphire substrate, a (II)-(VI) substrate or (III) -(V) Group substrate. According to the method for manufacturing a system on an actively controllable substrate as described in item 1 of the scope of patent application, the interconnect structure includes at least one wire and at least one via. The method for manufacturing a system on an actively controllable substrate as described in item 1 of the scope of patent application, the active control unit includes an active element and / or a multiplexer (MUX). The method for manufacturing a system on an actively controllable substrate as described in item 5 of the scope of patent application, the active element includes a transistor, an active switch, a modulator, and a programmable logic controller ( programmable logic), switch array, or a combination thereof. According to the method for manufacturing a system on an actively controllable substrate as described in item 6 of the scope of patent application, the transistor may be a metal-oxide-semiconductor field-effect transistor (MOS) or a bipolar junction transistor (BJT). The method for manufacturing a system on a substrate that can be actively controlled as described in item 1 of the scope of patent application, the sensor includes a current sensor, a voltage sensor, an optical sensor, a magnetic sensor, and a temperature sensor. Sensor, thermal sensor, humidity sensor, gas sensor, pressure sensor, liquid level sensor, immersion sensor, illuminance sensor, weight sensor, ultrasonic sensor, One or a combination of an image sensor, a linear displacement sensor, a tilt sensor, an acceleration sensor, a collision sensor, a vibration sensor, a biometric sensor. According to the method for manufacturing a system on a substrate that can be actively controlled as described in item 1 of the scope of patent application, the first and second conductive bonding structures may be solder balls, conductive bumps, or conductive pillars. The method for manufacturing a system on an actively controllable substrate as described in any one of claims 1 to 9 of the scope of patent application, the actively controllable substrate further includes at least one passive element. The method for manufacturing a system on a substrate that can be actively controlled as described in item 10 of the scope of patent application, the passive component includes a resistor, a capacitor, an inductor, a memristor, an antenna, and a heat-sink one of a spreader), a diode, a light emitting diode (LED), a waveguide, a filter, or a combination thereof.