TWI678542B - Circuit board editing test method - Google Patents

Abstract

The invention is a circuit board editing test method, which comprises the following steps: a. Obtaining a digital circuit board; b. Specifying a component type; c. Receiving a pin selection instruction to establish a component pin; d. Establishing an operation file; the invention Through the circuit board editing device, various component types and their pin positions are generated and input to the test machine, which allows the test machine to accurately and quickly touch the pins of each component, reducing time cost and improving the circuit. The quality of the board.

Description

Circuit board editing test method

The invention relates to a circuit board testing method, in particular to a circuit board editing and testing method for using a circuit board editing device to digitize a circuit board to be tested, so that the testing machine can accurately perform pin-to-pin testing according to the digitized circuit board.

With the development of technology, the use of electronic products is becoming more frequent, and the use of mobile phones, tablets, notebook computers, desktop computers and other products is increasing. The market demand is gradually leading to composite products. As for smart phones, consumers are increasingly hoping to have more multi-functional mobile phones under the condition that the volume and weight do not increase significantly. It has the function of making a call. Until now, high-tech anti-theft functions such as face recognition or iris unlocking have made the circuits in electronic products more and more complicated. Or the space between the wires to accommodate more components and wires.

When designing various circuits and components in a new type of electronic product, the electrical connection points of the wires must be measured to ensure that each line is effectively connected, reducing signal problems caused by short circuits or open circuits.

The current stage of contact testing is to first use a photocoupler to take a picture of the position of all components on a newly tested circuit board and their contact positions. After entering a flying probe test machine, use the flying probe test machine to treat Touch and contact the contact points of the test circuit board and make sure that the voltage and current of the contact points are normal values, but the recorded data may have errors, making the flying probe test machine unable to accurately touch each contact point. One pin.

In addition, in order to save costs, users generally first copy the circuit board under test to another new circuit board for testing. However, one circuit board may have tens of thousands of electronic components. It often takes more than two weeks for the circuit board, so it is impossible to know the quality of the circuit board under test in real time, and there are defects in use.

In order to test the circuit board to be tested in time, the present invention proposes a circuit board editing test method. The circuit board editing device generates an operation file, so that the mechanical arm of the test machine can accurately determine the pin of each component in the operation file. And test quickly to reduce time costs.

In order to achieve the above object, the present invention provides a circuit board editing test method, which uses an editing host including a circuit board editing device and a component database, the editing host is electrically connected to a display, and the circuit board editing device is in the An operating interface is provided on the display. The test method includes the following steps: a. Obtaining a digital circuit board: using a photosensitive coupling element to photograph a circuit board under test to obtain a digital circuit board of the circuit board under test, and The digital circuit board is stored in the editing host, wherein different electronic components are provided on the circuit board under test; the editing host performs editing operations on the digital circuit board according to various instructions received by the operation interface, and edits the digital circuit board. The digital circuit board is converted into an operation file; the digital circuit board graphically stores the shape of the plurality of electronic components and the relative position on the circuit board under test; the circuit board editing device has a built-in complex digital component model, Each digital component model has a component category, a component appearance, and a plurality of basic pins; b. Specifying the component category: According to the plurality of electronic components on the digital circuit board, the circuit board editing device receives a component selection instruction from the operation interface, and reads a component type and component appearance of one of the digital component models according to the component selection instruction; c. Receive pin selection instructions to establish component pins: The circuit board editing device receives a pin selection instruction from the operation interface, and sets a standard position of each basic pin on the digital circuit board. The length and width of the digital electronic component are set in order to set each basic pin in sequence. The circuit board editing device receives a pin number command from the operation interface to create all pins of the digital component category, wherein the pin number command Contains the total number of pins of the digital component model, and assigns all pins to numbers; d. Creates an operation file; After the pins of all digital component models on the digital circuit board are created, the circuit board editing device converts the digital The circuit board is integrated into the operation file, and the operation file is input into a test machine, and a mechanical arm of the test machine is used to sequentially lower the pins according to the position and number of each pin in the operation file.

Through the above steps, the time for establishing the operation file of the circuit board under test can be reduced, and the position and quantity of each digital electronic component pin are clearly displayed on the digital circuit board. After entering the flying needle machine, The mechanical arm of the flying needle machine can accurately and quickly lower the needle on each pin, which can reduce the probability of misjudgment. At the same time, the digital circuit board only takes about 2 to 3 hours to build, compared with the actual construction of a piece in the past. The new circuit board takes more than 2 weeks, and the time cost is greatly reduced.

10‧‧‧test machine

20‧‧‧Editing host

21‧‧‧Circuit board editing device

23‧‧‧Component Library

30, 30A, 30B, 30C, 30D, 30E‧‧‧ digital electronic components

31, 31A, 31B, 31C

32, 32A, 32B, 32C‧‧‧Second base pin

33, 33A, 33B, 33C

34A‧‧‧ Fourth base pin

50‧‧‧ Display

51‧‧‧Interface

Fig. 1: Circuit block diagram of the present invention.

Figure 2: Flow chart of the steps of the present invention.

FIG. 3 is a schematic diagram of a first embodiment of the present invention.

FIG. 4 is a schematic diagram of a second embodiment of the present invention.

FIG. 5A is a schematic diagram of a third embodiment of the present invention.

FIG. 5B is a schematic diagram of a fourth embodiment of the present invention.

6A-6D are schematic diagrams of ball grid array packaged electronic components with different pin numbers according to the present invention.

Referring to FIG. 1, the circuit board editing and testing system of the present invention includes: a testing machine 10, an editing host 20 and a display 50.

The test machine 10 can be a flying needle machine and includes a robotic arm that can test the pins of various components on a circuit board under test, such as a short-circuit test. The circuit board under test is usually fabricated There are different plural electronic components.

The editing host 20 has a circuit board editing device 21 and a component database 23. The editing host 20 is electrically connected to the testing machine 10 and the display 50 in a wired or wireless manner. The circuit board editing device 21 can display an operation interface 51 on the display 50; the circuit board editing device 21 can receive a digital circuit board, and according to various instructions received by the operation interface 51, the digital circuit board The editing operation is performed. After the editing is completed, the circuit board editing device 21 may convert the digital circuit board into an operation file, and enter the operation file into the test machine 10 for the robot arm to test the circuit board to be tested. The digital circuit board is obtained by photographing the circuit board under test with a photosensitive-coupled device (CCD). The digital circuit board stores the appearance of the plurality of electronic components and the components in the standby mode in an imaged manner. Measure the relative position on the circuit board. The operation file can be a file that can be read and operated by the flying needle machine. In a preferred embodiment, the operation file is a TXT file or an INI format. Files (.INI files).

The component database 23 includes a plurality of digital component models, each of which has a corresponding component type, a component appearance, and a plurality of basic pins.

The types of digital component models built in the component database 23 may include, but are not limited to: electronic components made in a non-standard package (SPIC); electronic components made in a small outline (SOIC); Most of the shapes are rectangular; electronic components made of plastic leaded chip carrier (PLCC), most of which are trapezoidal; electronic components made of ball grid array (BGA) The shape of such electronic components is mostly rectangular.

With the test machine 10 and the circuit board editing device 21 described above, the circuit board editing test method of the present invention can be performed. The flow of the test method is as follows:

Creating a digital circuit board (S101): using a photosensitive-coupled device (CCD) to photograph the circuit board under test to generate a digital circuit board for the circuit board under test, and storing the digital circuit board to the Circuit board editing device 21, wherein different electronic components are fabricated on the circuit board under test; the digital circuit board graphically records the shape of the multiple electronic components and the relative position of each component on the circuit board under test Position; the component database 23 has a built-in complex digital component model, and each digital component model has a corresponding component type, a component appearance, and a plurality of basic pins.

Specifying a component type (S102): According to the plurality of electronic components on the digital circuit board, the circuit board editing device 21 receives a component selection instruction from the operation interface 51, so that the circuit board editing device 21 reads the component database One of the digital component models of 23 is the component type and component appearance.

Receive pin selection instructions to establish component pins (S103): The circuit board editing device 21 receives a pin selection instruction from the operation interface 51 to establish the appearance of the component and the plural basic pins in a coordinate manner. Generally, In other words, the plurality of basic pins can be divided into three basic pin shapes and four basic pin types, of which the three basic pins are a first basic pin, a second basic pin, and a Types of the third basic pin and the four basic pins are a first basic pin, a second basic pin, a third basic pin, and a fourth basic pin; The position will sequentially receive a pin selection instruction. The pin selection instruction sets a standard position of each basic pin on the digital circuit board, and then sets the size of each digital component model and on the digital circuit board. Of the coordinate position of the digital component model of the three basic pins, the distance between the first basic pin and the second basic pin is the long side of the digital component model, and the second basic pin and the The distance of the third base pin Is the short side of the digital component model; wherein for the digital component model of four basic pins, the distance between the first basic pin and the second basic pin is the long side of the digital component model, and the third The distance between the basic pin and the fourth basic pin is the short side of the digital component model; then the circuit board editing device 21 receives a pin number command from the operation interface 51, and the pin number command includes the digital bit. The number of pins on at least one side of the component model to establish the coordinate positions of all non-basic pins on the long and short sides of the digital component model, and assign all pins to numbers.

Create operation file (104): After the coordinate positions of pins of all digital component models on the digital circuit board are established, the circuit board editing device 21 aggregates all the coordinate positions of the digital circuit board into one for correspondence. An operation file executed by a test machine, and the operation file is input into the test machine 10, so that the mechanical arm of the test machine 10 lowers the needle in order according to the coordinate position and number of each pin in the operation file, To accurately contact each pin of each electronic component on the circuit board under test; wherein the operation file includes the coordinate positions of all the pins and an action instruction capable of controlling the movement of the robot arm; a preferred embodiment The test machine 10 is a flying needle machine.

By the above test method, the types of electronic components that can be matched by the present invention are as follows:

1. Electronic components made in a non-standard package (SPIC); such components include integrated circuits (IC), resistors, inductors, capacitors, and transistors. The circuit board editing device 21 selects the components after receiving the component selection instruction. Corresponding to the digital component category, the component appearance and all basic pins are then established. The components used in this embodiment are those with two pins, three pins, or more than three pins.

2. Electronic components manufactured in a small outline (SOIC); please refer to FIG. 3, such electronic components are mostly rectangular, and the pins are symmetrically distributed on both sides of the electronic components. Component 30, the circuit board editing device 21 selects the digital component model corresponding to the electronic part after receiving the component selection instruction, and the circuit board editing device 21 generates the first basic pin 31, the first base pin on the digital electronic component Two basic pins 32 and the third basic pin 33, wherein the first basic pin 31 and the second basic pin 32 are respectively located on corresponding sides of the digital electronic component 30 to create the digital electronic component 30 wide side, the third base pin 33 is on the same side as the second base pin 32 to create the long side of the digital electronic component 30; the circuit board editing device 21 receives the pin selection order and sequentially Set the first base pin 31, the second base pin 32, and the third base pin 33 Position, then the circuit board editing device 21 receives the pin number instruction. Taking this embodiment as an example, since the pins of this embodiment are symmetrically distributed on both sides, when the pin number instruction is set to 7, The circuit board editing device 21 will automatically set the digital electronic component 30 to include 14 pins (2 * 7 = 14), which means that the components used in this embodiment have 14 pins in total. The position coordinates of the 14 pins of the digital electronic component 30 can be automatically established, and all pins are assigned numbers.

3. Electronic components manufactured with plastic leaded chip carrier (PLCC); please refer to FIG. 4, such electronic component pins are distributed on all sides. According to this embodiment, the digital electronic component 30A is After the circuit board editing device 21 selects the digital component type corresponding to the electronic part, the circuit board editing device 21 generates the first base pin 31A, the second base pin 32A, the third base pin 33A, and the A fourth base pin 34A, wherein the first base pin 31A and the second base pin 32A are set on the same side of the digital electronic component 30A to establish a long side of the digital electronic component 30A; the third The base pin 33A and the fourth base pin 34A are set on the other side of the digital electronic component 30A to establish the short side of the digital electronic component 30A; the long and short sides of the digital electronic component 30A are perpendicular to each other ; After receiving the pin selection instruction, the circuit board editing device 21 sequentially sets the first basic pin 31A, the second basic pin 32A, the third basic pin 33A, and the fourth basic pin 34A. Position followed by the circuit board The editing device 21 receives the pin number command. Taking this embodiment as an example, the digital electronic component 30A has 5 pins on each of the long side and the short side. One of the pin number commands is 5 pins, and the other One pin quantity instruction is also 5 pins. The circuit board editing device 21 calculates the digital electronic component 30A to have 20 pins (5 * 2 + 5 * 2 = 20) based on the two pin quantity instructions. The component used in this embodiment has a total of 20 pins. The circuit board editing device 21 can establish the coordinate positions of all the pins of the digital electronic component 30A, and assign all pins to numbers.

4. Electronic components made with a ball grid array (BGA); see Figure 5A. Most of these electronic components are rectangular, and the pins are distributed in the center of the electronic component. After the digital electronic component 30B of the embodiment selects the digital component type corresponding to the electronic part by the circuit board editing device 21, the circuit board editing device 21 generates the first basic pin 31B, the second basic pin 32B, and The third basic pin 33B; after receiving the pin selection instruction, the circuit board editing device 21 sets the first basic pin 31B, the second basic pin 32B, and the third basic pin 33B to the digital position On the three corner pins of the electronic component 30B, the first basic pin 31B and the second basic pin 32B can establish the long side of the digital electronic component 30B and the number of all pins in the long side. And position; the second base pin 32B and the third base pin 33B can establish the short side of the digital electronic component 30B, the number of all pins in the short side, and the coordinate position; in this embodiment, The long and short sides of the digital electronic component 30B are equal and perpendicular to each other, and the number of pins of the long and short sides of the digital electronic component 30B is the same. In another preferred embodiment, the long sides of the digital electronic component 30B And short sides with different lengths and long And pin short side are not the same number.

As shown in FIG. 5A, there are 14 pins (including the first base pin 31B and the second base pin 32B) between the first base pin 31B and the second base pin 32B, and the There are 14 pins between the second base pin 32B and the third base pin 33B (including the second base pin 32B and the third base pin 33B), then the digital electronic component 30B can generate 196 Pin. As shown in FIG. 5B, there are 16 pins (including the first base pin 31C and the second base pin 32C) between the first base pin 31C and the second base pin 32C, and There are 16 pins between the second basic pin 32C and the third basic pin 33C (including the second basic pin 32C and the third basic pin 33C). When the number of pins command is set to 16 When there are only pins, the circuit board editing device 21 can automatically calculate that the digital electronic component 30C has 256 pins (16 * 16 = 256), and the circuit board editing device 21 establishes the coordinate positions of all the pins. Finally, all pins are numbered.

In this embodiment, since the digital electronic components 30B, 30C, 30D, and 30E form pins in only a part of the area, as shown in FIGS. 6A to 6D, the circuit board editing device 21 can further delete the redundant pins through a delete command. Coordinate position, taking the digital electronic component 30C of FIG. 6A as an example. Let 9 * 9 = 81 pins in the center of the digital electronic component 30C be deleted; and taking the digital electronic component 30D in FIG. 6C as an example, the delete instruction can delete 12 * 12 = 144 pins in the center of the digital electronic component 30D. After deleting, the circuit board editing device 21 will automatically rearrange the numbers of all the pins according to a received arrangement instruction.

Claims (4)

A circuit board editing test method uses an editing host including a circuit board editing device and a component database. The editing host is electrically connected to a display. The circuit board editing device provides an operation interface on the display. The test method includes the following steps: a. Obtaining a digital circuit board: using a photosensitive coupling element to photograph a circuit board under test to obtain a digital circuit board of the circuit board under test, and storing the digital circuit board to the editing host Wherein the circuit board under test is provided with different plural electronic components; the editing host performs editing operations on the digital circuit board according to various instructions received by the operation interface, and converts the digital circuit board into an operation file; The digital circuit board graphically stores the shape of the plurality of electronic components and the relative position on the circuit board under test; the circuit board editing device has a built-in complex digital component model, and each digital component model has a component Category, appearance of a component, plural basic pins; b. Designation of the component category: A plurality of electronic components, the circuit board editing device receives a component selection instruction from the operation interface, and reads a component type and component appearance of one of the digital component models according to the component selection instruction; c. Receives a pin selection instruction to establish a component pin : The circuit board editing device receives a pin selection instruction from the operation interface, sets a standard position of each basic pin on the digital circuit board, and then sequentially sets each basic pin to establish the length of the digital electronic component. Wide, the circuit board editing device receives a pin number instruction from the operation interface to create all pins of the digital component type, wherein the pin number instruction includes the total pin number of the digital component model, and D. Establish an operation file; After the pins of all digital component models on the digital circuit board are established, the circuit board editing device integrates the digital circuit board into the operation file, and enters the operation file into a In the test machine, let a mechanical arm of the test machine sequentially lower the needle according to the position and number of each pin in the operation file. The method for editing and testing a circuit board as described in claim 1, in step b: the component category includes non-standard packaged electronic components, electronic components manufactured in small-size packages, electronic components manufactured in plastic die-carrying packages, or Electronic components fabricated in a ball grid array package. The circuit board editing test method as described in claim 2, in step c: if an electronic component made by a non-standard package is selected, the circuit board editing device establishes the shape of the digital component and two basic pins, three basic pins or Three or more basic pins; if an electronic component made in a small-size package is selected, the circuit board editing device generates a first basic pin, a second basic pin, and a third basic pin. The circuit board editing device After receiving a pin selection instruction, the positions of the first base pin, the second base pin, and the third base pin are set, wherein the first base pin and the second base pin are respectively located in the digital electronics. The corresponding two sides of the component are used to establish the wide side of the digital electronic component, and the third basic pin is on the same side as the second basic pin to establish the long side of the digital electronic component. The circuit board editing device generates the first basic pin, the second basic pin, the third basic pin, and a fourth basic pin, and the circuit board editing device receives the electronic component produced by the package. Set the positions of the first base pin, the second base pin, the third base pin, and the fourth base pin after the pin selection instruction, where the first base pin and the second base pin are set. On the same side of the digital electronic component to establish the long side of the digital electronic component; the third basic pin and the fourth basic pin are set on the other side of the digital electronic component; if a ball is selected For the electronic component manufactured by the grid array package, the circuit board editing device generates the first basic pin, the second basic pin, the third basic pin, and the fourth basic pin, and the circuit board editing device receives the connection. The position of the first basic pin, the second basic pin, and the third basic pin is set after the pin selection instruction, wherein the first basic pin and the second basic pin are set to the same position of the digital electronic component. Side to establish the long side of the digital electronic component; the third basic pin and the fourth basic pin are set on the other side of the digital electronic component. According to the circuit board editing test method described in claim 3, in step c, the circuit board editing device can further delete the coordinate position of the extra pin through a delete instruction. After deletion, the circuit board editing device will receive the A sequence command automatically rearranges the numbers of all pins.