TWI677395B - Separating brittle material method and device thereof - Google Patents

Abstract

A method for cutting hard and brittle materials, including the following steps: providing an ultra-fast laser beam and a non-ultra-fast laser beam; making the ultra-fast laser beam and a non-ultra-fast laser beam time-correlated; and shaping an ultra-fast laser beam Become a vertical linear beam with a non-ultrafast laser beam; and Inject the vertical linear beam into the material so that the vertical linear beam covers the entire material thickness. The material irradiated by the vertical linear beam is modified to form high-density defects in the modified area. Defects such as holes and micro-cracks can extend the cracks and achieve cutting effects. In addition, a cutting device for hard and brittle materials has also been proposed.

Description

Method and device for cutting hard and brittle materials

The present invention relates to a laser cutting technology, and more particularly, to a method and device for cutting hard and brittle materials by non-contact laser cutting.

The smart car thick glass market is becoming more and more popular with the promotion of connected cars and electric vehicles. Smart cars will grow significantly, driving demand for automotive glass processing applications, such as car lights or car mirror glass cutting. In addition, with the popularity of 3C products, the demand for processing glass cover plates such as mobile phones, panels, and wearable devices is endless. In recent years, the thickness of glass cover plates has ranged from 1.0 mm to 0.4 mm. The thickness of glass is reduced, and the difficulty of cutting technology is also increased, so non-contact laser cutting is more important. In addition, due to the stable physical properties (mechanical, electrical, optical, and thermal properties) of glass, it is widely used in three-dimensional wafers (3D ICs), radio frequency wafers (RFs) and image sensors or optical sensors (Optical sensor) products, which correspond to the wafer dicing process required for integrated circuit (IC), non-contact laser cutting is also important when the thickness of semiconductor glass is 0.4 mm to 0.2 mm.

In addition, the current problem facing the industry is that when performing special-shaped cutting, the cutting and slicing are separated into separate machines, which makes the path complicated, it is impossible to continue to use mechanical slicing, and it is easy to increase the overall process time.

Therefore, in view of the aforementioned various needs of vehicle-mounted glass, optoelectronic glass and semiconductor glass, how to provide a "hard and brittle material cutting method" to solve the above-mentioned needs is a technical issue that people in the technical field are desperately trying to solve.

The invention provides a method and a device for cutting hard and brittle materials, which can increase and increase the defect density of the area where the material is cut, so that the cut area is extended by cracks to complete the cutting.

An embodiment of the present invention provides a method for cutting hard and brittle materials, which includes the following steps: providing an ultrafast laser beam and a non-ultrafast laser beam; making the ultrafast laser beam and the non-ultrafast laser beam a time Correlation; an integral ultrafast laser beam and a non-ultrafast laser beam form a vertical linear beam; and a vertical linear beam is incident on a material, and the material is modified in the thickness direction of the material to form in one of the modified regions of the material For multiple defects, the absorption rate of non-ultrafast laser beams to the material is increased based on the ultrafast laser beams in the vertical linear beam, so as to increase the density of forming multiple defects in the modified region, and to extend the multiple defects to generate A cracked structure.

An embodiment of the present invention provides a cutting device for hard and brittle materials, including an ultra-fast laser source, a non-ultra-fast laser source, a time adjustment unit, and an optical adjustment unit. An ultrafast laser source provides an ultrafast laser beam. A non-ultrafast laser source provides a non-ultrafast laser beam. The time adjustment unit connects the ultra-fast laser source and the non-ultra-fast laser source. The time adjustment unit makes the ultra-fast laser beam and the non-ultra-fast laser beam have a time correlation. The optical adjustment unit forms an ultra-fast laser beam and a non-ultra-fast laser beam into a vertical linear beam, and enters the vertical linear beam into a material, and a plurality of defects are formed in the reforming area of one of the modified materials in the thickness direction of the material Increasing the absorptivity of the non-ultrafast laser beam to the material according to the ultrafast laser beam in the vertical linear beam, so as to increase the density of forming the plurality of defects in the modified region, and can extend the plurality of Defects to create a cracked structure.

Based on the above, in the method and device for cutting hard and brittle materials of the present invention, by designing a time correlation between an ultrafast laser beam and a non-ultrafast laser beam, the ultrafast laser beam and the non-ultrafast laser beam are designed. It can interact with each other, so that the vertical linear beam incident on the material reforms the material in the thickness direction of the material, so that the vertical linear beam covers the entire material thickness, the material illuminated by the vertical linear beam is modified, and high-density defects are formed in the modified area ( Voids, microcracks, etc.) and cracks extend to achieve the effect of cutting lobes. In addition, the present invention enhances the absorption rate of materials by non-ultrafast laser beams by ultrafast laser beams in vertical linear beams, and forms high-density defects (voids, micro-cracks, etc.) and crack extensions in the modified region to The crack structure is generated, so that the user can easily perform the split along the modified area of the material.

In order to make the present invention more comprehensible, embodiments are described below in detail with reference to the accompanying drawings.

The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, but cannot limit the protection scope of the present invention.

FIG. 1 is a flowchart of a method for cutting hard and brittle materials according to the present invention. FIG. 2 is a schematic diagram of an embodiment of a cutting device for hard and brittle materials according to the present invention. FIG. 3 is a schematic diagram of an embodiment of a hard and brittle material. FIG. 4A is a schematic diagram of a modified region after cutting glass by using the hard and brittle material cutting method of the present invention. FIG. 4B is an enlarged schematic view of a modified region of the glass of FIG. 4A. FIG. 5 is a cross-sectional view of a glass cut by the hard and brittle material cutting method of the present invention. It should be noted that the hard and brittle material cutting device 10 of FIG. 2 can be used to split the material 50 according to the hard and brittle material cutting method S10 of FIG. 1, but the present invention is not limited to the hard and brittle material cutting device 10 of FIG. The material is split, and the present invention can perform laser cutting on different materials 50 according to different industries, such as glass, sapphire, silicon carbide (SiC), or silicon (Silicon). .

Please refer to FIG. 1 first. The hard and brittle material cutting method S10 in this embodiment includes the following steps S11 to S15. Go to step S11 to provide an ultra-fast laser beam and a non-ultra-fast laser beam. As shown in FIG. 2, the hard and brittle material cutting device 10 of the present invention includes an ultra-fast laser source 11, a non-ultra-fast laser source 12, a time adjustment unit 13, a light combining unit 14 and an optical adjustment unit 15.

The ultrafast laser source 11 is a femtosecond laser source or a picosecond laser source, which can provide an ultrafast laser beam S1. In this embodiment, the wavelength range of the ultra-fast laser beam S1 is corresponding to different materials 50. For example, if the material 50 is glass, the wavelength of the ultra-fast laser beam S1 may be between about 350 nm and 2600 nm. If the material 50 is sapphire, the wavelength of the ultra-fast laser beam S1 can be between about 250 nm and 5000 nm; if the material is silicon, the wavelength of the ultra-fast laser beam S1 can be between about 1500 nm and 6500 nm If the material is silicon carbide, the wavelength of the ultra-fast laser beam S1 can be between about 350 nm and 1100 nm. The wavelength of the ultra-fast laser beam S1 completely or partially penetrates the material 50, and the wavelength of the ultra-fast laser beam S1 partially penetrates the material 50 between 20% and 100%. The pulse width of the ultra-fast laser beam S1 is 100 ps or less, and the energy of the ultra-fast laser beam S1 is between 1 W and 100 W.

The non-ultrafast laser source 12 series can be a continuous wave (CW) laser source or a long pulse (Pulse) laser source. The non-ultrafast laser source 12 may provide a non-ultrafast laser beam S2, and the non-ultrafast laser beam S2 may be a continuous wave laser or a long pulse laser. In this embodiment, the wavelength range of the non-ultrafast laser beam S2 is corresponding to different materials 50. For example, if the material 50 is glass, the wavelength of the non-ultrafast laser beam S2 may be between about 350 nm and 2600. nm; if the material 50 is sapphire, the wavelength of the non-superfast laser beam S2 can be between about 250 nm and 5000 nm; if the material is silicon, the wavelength of the non-superfast laser beam S2 can be between about 1500 nm to 6500 nm; if the material is silicon carbide, the wavelength of the non-ultrafast laser beam S2 may be between about 350 nm and 1100 nm. The wavelength of the non-ultrafast laser beam S2 penetrates all or part of the material, and the wavelength of the non-ultrafast laser beam S2 partially penetrates the material 50 between 20% and 100%. The pulse width of the non-ultrafast laser beam S2 is greater than 100 ps, and the energy of the non-ultrafast laser beam S2 is between 1 W and 200 W.

After step S11, step S12 is performed to make the ultra-fast laser beam S1 and the non-ultra-fast laser beam S2 have a time correlation. Taking FIG. 2 as an example, the time adjustment unit 13 in the hard and brittle material cutting device 10 connects the ultra-fast laser source 11 and the non-ultra-fast laser source 12, and the time adjustment unit 13 makes the ultra-fast laser beam S1 and non-ultra-fast The laser beam S2 has a time correlation. It should be noted that the time correlation mentioned here means that the time for the non-ultrafast laser beam S2 to enter the material 50 must be completed at least within a certain time range after the ultrafast laser beam S1 irradiates the material 50. That is, the time adjustment unit 13 causes the non-ultrafast laser beam S2 to delay the ultrafast laser beam S1 to be incident at a delay time, in other words, the ultrafast laser beam S1 is incident first, rather than the ultrafast laser beam S2 to be delayed, where The incident time is between 1 ps and 1 ms, so that the non-ultrafast laser beam S2 can still interact with the ultrafast laser beam S1. The non-ultrafast laser beam S2 may be a pulsed laser or a continuous wave laser.

In another embodiment, the time adjustment unit 13 causes the non-superfast laser beam S1 and the ultra-fast laser beam S2 to be incident at the same time. The non-superfast laser beam S2 may be a pulsed laser or a continuous wave laser.

After step S12, step S13 is performed to make the ultra-fast laser beam S1 and the non-ultra-fast laser beam S2 coaxial with each other. Taking FIG. 2 as an example, the light combining unit 14 in the hard and brittle material cutting device 10 is coaxial with the ultra-fast laser beam S1 and the non-ultra-fast laser beam S2 to form a combined light beam S3. In this embodiment, the light combining unit 14 is, for example, a polarization beam splitter (PBC), and the ultra-fast laser beam S1 provided by the ultra-fast laser source 11 and the non-ultra-fast laser provided by the non-ultra-fast laser source 12 The laser beam S2 can be collected by the reflectors to be collectively collected to the light combining unit 14, and the polarization direction of the ultra-fast laser beam S1 and the non-ultra-fast laser beam S2 can be changed through a half-wave plate to adjust the energy. The present invention It is not limited, and the optical lens combination may be selected according to the actual settings of the two laser sources and the required settings of the laser cutting material.

After step S13, step S14 is then performed, and the shaped ultra-fast laser beam S1 and the non-ultra-fast laser beam S2 form a vertical linear beam S4. Taking FIG. 2 as an example, the optical adjustment unit 15 in the hard and brittle material cutting device 10 shapes the ultra-fast laser beam S1 and the non-ultra-fast laser beam S2 into a vertical linear beam S4. In this embodiment, the vertical linear beam S4 is, for example, a Bessel beam. The optical adjustment unit 15 includes a rotating triangular prism (Axicon), a set of beam reducing mirrors, and an ultrafast laser beam S1. The ultra-fast laser beam S2 is coaxially formed into a combined light beam S3. The combined light beam S3 generates a Bessel beam through an optical interference method after rotating the triangular prism, and can be reduced to an image of 50 through a group of beam reducing mirrors. However, the present invention is not limited to the formation manner and type of the vertical linear beam S4. In other embodiments, the vertical linear beam is, for example, a multi-focus beam or an extended beam. For example, if the vertical linear beam is, for example, a multi-focus beam, the multi-focus beam is generated through imaging optics, and through the imaging optics of a diffractive optical element (DOE) and an aspherical mirror, multiple rays can be formed inside the material. If the vertical linear beam is an extended beam, the element design of the diffractive optical element can be used to provide an energy point source between the focal points to form a desired extended beam.

After step S14, step S15 is performed, and a vertical linear beam S4 is incident on a material 50, and the material 50 is modified in the thickness direction L1 of the material 50. Since the wavelength of the ultra-fast laser beam S1 and the wavelength of the non-ultra-fast laser beam S2 have been set in step S11, the wavelength of the ultra-fast laser beam S1 completely or partially penetrates the material 50, so that the vertical line shape can be made. The light beam S4 covers the thickness direction L1 of the material 50. It should be noted that the thickness direction L1 described herein is parallel to the direction in which the vertical linear light beam S4 is incident on the material 50. Therefore, as shown in FIG. 3, in step S15, the material 50 irradiated by the vertical linear beam S4 is modified to form a plurality of defects in the modified region 51 of the material 50. The defects may be voids ( void empty 53 and micro-cracks 54. The hard and brittle material cutting method S10 of the present invention can enhance the absorption of material 50 by the non-ultrafast laser beam S2 according to the ultrafast laser beam S1 in the vertical linear beam S4. Rate to increase the density of forming a plurality of defects (such as voids 53 and micro-cracks 54) in the modified region 51, and extend the plurality of defects to form crack extensions to generate a crack structure 52. It should also be noted that the shapes and sizes of the modified region 51, the pores 53, the micro-cracks 54 and the crack structures 52 in FIG. 3 are merely examples for ease of description, and are not intended to limit the present invention.

In addition to cutting the material 50 at one time to improve the productivity, the method S10 for cutting hard and brittle materials of the present invention does not directly cut the material 50, but improves the material 50 as a whole, and uses ultra-fast laser The beam S1 and the non-ultrafast laser beam S2 interact with each other to form high-density defects (such as voids, micro-cracks) and crack extensions in the modified area to generate a crack structure 52, so that the user can easily pierce or tear the material. 50. As shown in FIG. 4A, the glass 20 is modified by using the hard and brittle material cutting method S10 of the present invention, so that the crack structure 21 is generated in the modified region 22 of the glass 20. FIG. 4B can be seen by enlarging the modified region 22 of FIG. 4A. It is shown that many defects such as voids or micro-cracks can be formed in the modified region 22 through the present invention, and cracks 21 can be generated through the defects to achieve the purpose of crack extension. As shown in FIG. 5, it is a cross-sectional view of the glass 20 after being cut by using the hard and brittle material cutting method S10 of the present invention. The cross-section 23 is generated by a user to open or tear the crack structure of the glass 20. It can be seen that through the cutting method S10 of the hard and brittle material of the present invention, the user can easily pull or tear the glass 20 to reduce the doubt of clipping, and can reduce the occurrence of burrs after cutting the glass 20 without leaving a residue easily. Material and chipping angle to have better cutting effect.

In summary, in the method and device for cutting hard and brittle materials of the present invention, by designing a time correlation between the ultrafast laser beam and the non-ultrafast laser beam, the ultrafast laser beam and the non-ultrafast laser beam are designed. The beams can interact with each other, so that the vertical linear beams incident on the material modify the material in the thickness direction of the material to form a crack structure in the material. In addition, the present invention can increase the absorptivity of non-ultrafast laser beams to materials by using ultrafast laser beams, and form high-density defects (voids, micro-cracks, etc.) and crack extensions in modified regions to generate crack structures, It enables users to easily split the material along the crack structure of the material.

Furthermore, the method and device for cutting hard and brittle materials according to the present invention are to modify the material in its thickness direction as a whole, and can perform a one-time cutting of the material, which can not only increase the production capacity but also instantly increase the defect density of the material. And crack extension to create a cracked structure, which makes the material easier to peel or tear after processing.

In addition, the present invention can be used for special-shaped cutting, and the method and device for cutting hard and brittle materials of the present invention synchronize the cutting of the material with the sliver, so the process time of cutting the material can be effectively shortened.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

 10  Cutting device for hard and brittle materials  11  Ultra-fast laser source  12  Non-ultrafast laser source  13  Time adjustment unit  14  Light combining unit  15  Optical adjustment unit  20  Glass  twenty one  Crack structure  twenty two  Reformed area  twenty three  Section  50  Material  51  Reformed area  52  Crack structure  53  Hole  54  Microcrack  L1  Thickness direction  S1  Ultra-fast laser beam  S2  Non-ultrafast laser beam  S3  Combined light beam  S4  Vertical linear beam  S10  Cutting method for hard and brittle materials  S11 ~ S15  Steps

FIG. 1 is a flowchart of a method for cutting hard and brittle materials according to the present invention. FIG. 2 is a schematic diagram of an embodiment of a cutting device for hard and brittle materials according to the present invention. FIG. 3 is a schematic diagram of an embodiment of a hard and brittle material. FIG. 4A is a schematic diagram of a modified region after cutting glass by using the hard and brittle material cutting method of the present invention. FIG. 4B is an enlarged schematic view of a modified region of the glass of FIG. 4A. FIG. 5 is a cross-sectional view of a glass cut by the hard and brittle material cutting method of the present invention.

Claims (29)

A method for cutting hard and brittle materials includes the following steps: providing an ultra-fast laser beam and a non-ultra-fast laser beam so that the wavelength of the ultra-fast laser beam and the wavelength of the non-ultra-fast laser beam respectively Penetrating or partially penetrating; making the ultra-fast laser beam and the non-ultra-fast laser beam have a time correlation; shaping the ultra-fast laser beam and the non-ultra-fast laser beam into a vertical linear beam; and incident on the A vertical linear beam reaches the material so that the vertical linear beam covers the thickness direction of the material, and the material is modified in the thickness direction of the material to form a plurality of defects in one of the modified regions of the material, wherein according to the vertical line type The ultrafast laser beam in the beam enhances the absorptivity of the material by the non-ultrafast laser beam to increase the density of forming the plurality of defects in the modified region, and can extend the plurality of defects to generate a crack structure. The method for cutting a hard and brittle material as described in item 1 of the scope of patent application, wherein the step of making the ultrafast laser beam and the non-ultrafast laser beam have the time correlation includes the following steps: making the non-ultrafast The laser beam delays the ultrafast laser beam to be incident at a delay time. The method for cutting hard and brittle materials according to item 2 of the scope of patent application, wherein the delay time is between 1 ps and 1 ms. The method for cutting a hard and brittle material as described in item 1 of the scope of patent application, wherein the step of making the ultrafast laser beam and the non-ultrafast laser beam have the time correlation includes the following steps: making the non-ultrafast The laser beam is incident simultaneously with the ultrafast laser beam. The cutting method for hard and brittle materials according to item 1 of the scope of patent application, wherein the wavelength of the ultra-fast laser beam and the wavelength of the non-ultra-fast laser beam are between 20% and 100% for the material. between. The cutting method for hard and brittle materials as described in item 1 of the scope of patent application, wherein the material is glass, sapphire, silicon or silicon carbide, and if the material is glass, the wavelength of the ultrafast laser beam is between 350nm and 2600nm. If the material is sapphire, the wavelength of the ultrafast laser beam is between 250nm and 5000nm; if the material is silicon, the wavelength of the ultrafast laser beam is between 1500nm and 6500nm; if the The material is silicon carbide, and the wavelength of the ultra-fast laser beam is between 350nm and 1100nm. The cutting method for hard and brittle materials according to item 1 of the scope of patent application, wherein the pulse width of the ultra-fast laser beam is less than or equal to 100 ps. The method for cutting hard and brittle materials according to item 1 of the scope of the patent application, wherein the energy of the ultra-fast laser beam is between 1W and 100W. The method for cutting hard and brittle materials according to item 1 of the scope of the patent application, wherein the non-ultrafast laser beam is a continuous wave laser or a long pulse laser. The method for cutting hard and brittle materials according to item 1 of the scope of patent application, wherein the material is glass, sapphire, silicon or silicon carbide, and if the material is glass, the wavelength of the non-ultrafast laser beam is between 350nm and 2600nm. If the material is sapphire, the wavelength of the non-ultrafast laser beam is between 250nm and 5000nm; if the material is silicon, the wavelength of the non-ultrafast laser beam is between 1500nm and 6500nm; if the The material is silicon carbide, and the wavelength of the non-ultrafast laser beam is between 350nm and 1100nm. The method for cutting hard and brittle materials as described in item 1 of the scope of patent application, wherein the pulse width of the non-ultrafast laser beam is greater than 100 ps. The cutting method for hard and brittle materials according to item 1 of the scope of patent application, wherein the energy of the non-ultrafast laser beam is between 1W and 200W. The method for cutting hard and brittle materials according to item 1 of the scope of patent application, wherein the step of providing the ultra-fast laser beam and the non-ultra-fast laser beam includes the following steps: making the ultra-fast laser beam and the non-fast laser beam Ultrafast laser beams are coaxial with each other. The method for cutting hard and brittle materials according to item 1 of the scope of patent application, wherein in the step of shaping the ultrafast laser beam and the non-ultrafast laser beam into the vertical linear beam, the vertical linear beam is a Bessel beam, Multi-focus beam or Elongated beam. The method for cutting hard and brittle materials according to item 1 of the scope of patent application, wherein the step of making the ultrafast laser beam and the non-ultrafast laser beam have the time correlation means that the non-ultrafast laser beam is made incident The time for entering the material needs to be completed at least within a certain time range after the ultrafast laser beam irradiates the material. A cutting device for hard and brittle materials, comprising: an ultrafast laser source, providing an ultrafast laser beam, wherein the wavelength of the ultrafast laser beam penetrates all or part of a material; a non-ultrafast laser Source, providing a non-ultrafast laser beam, wherein the wavelength of the non-ultrafast laser beam penetrates the material in whole or in part; a time adjustment unit connects the ultrafast laser source and the non-ultrafast laser Source, the time adjustment unit makes the ultra-fast laser beam and the non-ultra-fast laser beam have a time correlation; an optical adjustment unit that shapes the ultra-fast laser beam and the non-ultra-fast laser beam into a vertical line Light beam, so that the vertical linear beam covers the thickness direction of the material, and the vertical linear beam is incident on a material, and the material is modified in the thickness direction of the material to form a plurality of defects in one of the modified regions of the material, The absorptance of the non-ultrafast laser beam to the material is increased according to the ultrafast laser beam in the vertical linear beam, so as to increase the density of forming the plurality of defects in the modified region, and to extend the complex number. Generating a crack defect structure. According to the hard and brittle material cutting device described in claim 16, wherein the time adjusting unit delays the non-ultrafast laser beam to enter the ultrafast laser beam at a delay time. The cutting device for hard and brittle materials according to item 17 of the scope of patent application, wherein the delay time is between 1 ps and 1 ms. The cutting device for hard and brittle materials according to item 16 of the scope of the patent application, wherein the time adjustment unit causes the non-ultrafast laser beam and the ultrafast laser beam to be incident simultaneously. The cutting device for hard and brittle materials as described in item 16 of the scope of patent application, wherein the wavelength of the ultrafast laser beam and the wavelength of the non-ultrafast laser beam are between 20% and 100% of the material's transmission rate %between. The cutting device for hard and brittle materials as described in item 16 of the scope of patent application, wherein the material is glass, sapphire, silicon or silicon carbide. If the material is glass, the wavelength of the ultra-fast laser beam is between 350nm and 2600nm. If the material is sapphire, the wavelength of the ultrafast laser beam is between 250nm and 5000nm; if the material is silicon, the wavelength of the ultrafast laser beam is between 1500nm and 6500nm; if the The material is silicon carbide, and the wavelength of the ultra-fast laser beam is between 350nm and 1100nm. The cutting device for hard and brittle materials as described in item 16 of the scope of the patent application, wherein the pulse width of the ultra-fast laser beam is less than or equal to 100 ps. The cutting device for hard and brittle materials according to item 16 of the scope of patent application, wherein the energy of the ultra-fast laser beam is between 1W and 100W. The cutting device for hard and brittle materials according to item 16 of the patent application scope, wherein the non-ultrafast laser beam is a continuous wave laser or a long pulse laser. The hard and brittle material cutting device according to item 16 of the scope of the patent application, wherein the material is glass, sapphire, silicon or silicon carbide. If the material is glass, the wavelength of the non-ultrafast laser beam is between 350nm and 2600nm. If the material is sapphire, the wavelength of the non-ultrafast laser beam is between 250nm and 5000nm; if the material is silicon, the wavelength of the non-ultrafast laser beam is between 1500nm and 6500nm; if the The material is silicon carbide, and the wavelength of the non-ultrafast laser beam is between 350nm and 1100nm. The cutting device for hard and brittle materials as described in item 16 of the scope of patent application, wherein the pulse width of the non-ultrafast laser beam is greater than 100 ps. The cutting device for hard and brittle materials according to item 16 of the scope of patent application, wherein the energy of the non-ultrafast laser beam is between 1W and 200W. The cutting device for cutting hard and brittle materials as described in item 16 of the scope of patent application, further includes: a light combining unit that is coaxial with the ultra-fast laser beam and the non-ultra-fast laser beam. The hard and brittle material cutting device according to item 16 of the application, wherein said making the ultra-fast laser beam and the non-ultra-fast laser beam have a time correlation means that the non-ultra-fast laser beam is incident into the The time of the material must be completed at least within a certain time range after the ultrafast laser beam irradiates the material.