TWI674192B - Hardcoat layer system and method for manufacturing a hardcoat layer system in a continuous roll-to-roll process - Google Patents

Hardcoat layer system and method for manufacturing a hardcoat layer system in a continuous roll-to-roll process Download PDF

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TWI674192B
TWI674192B TW106144910A TW106144910A TWI674192B TW I674192 B TWI674192 B TW I674192B TW 106144910 A TW106144910 A TW 106144910A TW 106144910 A TW106144910 A TW 106144910A TW I674192 B TWI674192 B TW I674192B
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layer
hard coating
soft substrate
adhesion
coating system
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TW201838815A (en
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奈爾 蒙利遜
喬斯曼紐 地古坎柏
海格 藍德葛瑞夫
史德分 海恩
透比斯 史投利
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美商應用材料股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • C23C16/545Apparatus specially adapted for continuous coating for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0272Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C23C16/029Graded interfaces
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32Carbides
    • C23C16/325Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/042Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/048Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with layers graded in composition or physical properties
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

一種適用於在一觸控螢幕面板中使用之硬塗層系統(100)。硬塗層系統(100)包括一軟質基材(101)及一層堆疊(110),層堆疊設置於軟質基材(101)上。層堆疊(110)包括一黏附促進層(111)及一無機硬塗上層(113),黏附促進層設置於軟質基材(101)上。黏附促進層(111)係裝配以共價鍵結於軟質基材之表面,其中黏附促進層(111)於至軟質基材(101)之一界面(102)的一機械性質係適用於軟質基材(101)之一機械性質。 A hard coating system (100) suitable for use in a touch screen panel. The hard coating system (100) includes a soft substrate (101) and a layer stack (110). The layer stack is disposed on the soft substrate (101). The layer stack (110) includes an adhesion promotion layer (111) and an inorganic hard coating upper layer (113). The adhesion promotion layer is disposed on the soft substrate (101). The adhesion-promoting layer (111) is assembled and covalently bonded to the surface of the soft substrate, and a mechanical property of the adhesion-promoting layer (111) to an interface (102) to the soft substrate (101) is suitable for the soft substrate One of the mechanical properties of wood (101).

Description

硬塗層系統及用以於一連續卷對卷製程中製造一硬 塗層系統之方法 Hard coating system and method for manufacturing a hard coating in a continuous roll-to-roll process Coating system method

本揭露之數個實施例是有關於數種適用於在一光電裝置中使用之硬塗層系統及數種用以在一連續卷對卷製程中製造此些硬塗層系統之方法。特別是,本揭露之數個實施例是有關於數種硬塗層系統,包括沈積於一軟質基材上之數層之一堆疊。更特別是,本揭露之數個實施例是有關於數種藉由一連續卷對卷真空沈積製程製造之硬塗層系統。 The embodiments disclosed herein are related to several hard coating systems suitable for use in an optoelectronic device and several methods for manufacturing such hard coating systems in a continuous roll-to-roll process. In particular, the embodiments of the present disclosure relate to several hard coating systems, including a stack of one of several layers deposited on a soft substrate. More specifically, the embodiments of the present disclosure relate to several hard coating systems manufactured by a continuous roll-to-roll vacuum deposition process.

於封裝產業、半導體產業及其他產業中係對軟質基材之處理有高需求,軟質基材例如是塑膠膜或箔。處理可由利用所需材料塗佈軟質基材、蝕刻及針對所需應用於基材上執行其他製程步驟所組成。所需材料例如是金屬,特別是鋁、半導體及介電材料。執行任務之系統一般包括處理鼓,舉例為圓柱滾軸。處理鼓耦接於處理系統,用以傳送基材,及至少一部份之基材係於 處理鼓上處理。因此,卷對卷塗佈系統(roll-to-roll,R2R)可提供高產量系統。 In the packaging industry, semiconductor industry, and other industries, there is a high demand for the processing of soft substrates, such as plastic films or foils. The process can consist of coating a soft substrate with the required material, etching, and performing other process steps for the desired application on the substrate. The required materials are, for example, metals, in particular aluminum, semiconductors and dielectric materials. A system for performing a task typically includes a processing drum, such as a cylindrical roller. The processing drum is coupled to the processing system for transferring the substrate, and at least a part of the substrate is Processing on the drum. Therefore, a roll-to-roll (R2R) coating system can provide a high-throughput system.

一般來說,處理舉例為物理氣相沈積(physical vapor deposition,PVD)製程、化學氣相沈積(chemical vapor deposition,CVD)製程、及電漿輔助化學氣相沈積(plasma enhanced chemical vapor deposition,PECVD)製程。處理可利用於沈積金屬薄層,金屬薄層可塗佈於軟質基材上。特別是,卷對卷沈積系統係在顯示產業及光電(photovoltaic,PV)產業中面臨需求強烈增加的情況。 Generally, the processing examples are physical vapor deposition (PVD) process, chemical vapor deposition (CVD) process, and plasma enhanced chemical vapor deposition (PECVD). Process. Treatment can be used to deposit a thin metal layer, which can be coated on a soft substrate. In particular, the roll-to-roll deposition system is facing a strong increase in demand in the display industry and the photovoltaic (PV) industry.

已塗佈之軟質基材所製成之產品的例子係為觸控面板或有機發光二極體(organic light emitting diode,OLED)顯示器。在顯示器應用中,相較於液晶顯示器(liquid crystal displays,LCD),有機發光二極體顯示器近日係有鑑於它們的較快響應時間、較大視角、較高對比、較輕重量、較低功率、及對軟質基材之順應性(amenability)而受到顯著重視。 Examples of products made from coated soft substrates are touch panels or organic light emitting diode (OLED) displays. In display applications, compared to liquid crystal displays (LCDs), organic light emitting diode displays have recently enjoyed faster response times, larger viewing angles, higher contrast, lighter weight, and lower power due to their faster response times. , And compliance with soft substrates (amenability) has received significant attention.

因此,經過此些年,舉例為顯示裝置或觸控面板之光電裝置已經發展成多層系統。於此些多層系統中,不同層具有不同功能。然而,傳統之多層系統之品質仍需改善,舉例為抗刮性(scratch resistance)仍需改善。 Therefore, after these years, optoelectronic devices such as display devices or touch panels have been developed into multilayer systems. In these multi-layer systems, different layers have different functions. However, the quality of traditional multilayer systems still needs to be improved. For example, scratch resistance still needs to be improved.

有鑑於前述,提供適用於在光電裝置中使用之硬塗層系統及用以製造此些硬塗層系統之方法係有需求,而克服此領域中之至少一些問題。 In view of the foregoing, there is a need to provide a hard coating system suitable for use in an optoelectronic device and a method for manufacturing such hard coating systems to overcome at least some of the problems in this field.

有鑑於上述,提供根據獨立申請專利範圍之一種硬塗層系統及一種用以製造一硬塗層系統之方法。本揭露之其他方面、優點、及特徵係從申請專利範圍、說明、及所附之圖式更為清楚。 In view of the foregoing, a hard coating system and a method for manufacturing a hard coating system are provided according to the scope of the independent patent application. Other aspects, advantages, and features of this disclosure are clearer from the scope, description, and accompanying drawings of the patent application.

根據本揭露之一方面,提出一種適用於在一觸控螢幕面板中使用之硬塗層系統。硬塗層系統包括一軟質基材及一層堆疊,層堆疊設置於軟質基材上。層堆疊包括一黏附促進層及一無機硬塗上層,黏附促進層設置於軟質基材上。黏附促進層係裝配以共價鍵結於軟質基材之表面,其中黏附促進層於至軟質基材之一界面的一機械性質係適用於軟質基材之一機械性質。 According to one aspect of the present disclosure, a hard coating system suitable for use in a touch screen panel is proposed. The hard coating system includes a soft substrate and a layer stack, and the layer stack is disposed on the soft substrate. The layer stack includes an adhesion promotion layer and an inorganic hard coating layer. The adhesion promotion layer is disposed on a soft substrate. The adhesion-promoting layer is assembled and covalently bonded to the surface of the soft substrate. A mechanical property of the adhesion-promoting layer at an interface to the soft substrate is suitable for a mechanical property of the soft substrate.

根據本揭露之另一方面,提出一種適用於在一觸控螢幕面板中使用之硬塗層系統。硬塗層系統包括一軟質基材,選自由聚碳酸酯(polycarbonate)、聚對苯二甲酸乙二酯(polyethylene terephthalate)、聚甲基丙烯酸甲酯(poly(methacrylic acid methyl ester))、三醋酸纖維素(triacetyl cellulose)、環烯烴聚合物(cyclo olefin polymer)、聚(對酞酸乙二酯)(poly(ethylene naphthalate))所組成之群組。再者,硬塗層系統包括一層堆疊,設置於軟質基材上,其中層堆疊包括一黏附促進層及一無機硬塗上層,黏附促進層設置於軟質基材上。黏附促進層係裝配以共價鍵結於軟質基材之表面,及其中黏附促進層之硬度係裝配,以從軟質基材至無機硬塗上層逐漸 地增加。無機硬塗上層具有從2H至9H之一鉛筆硬度。黏附促進層及無機硬塗上層係藉由使用一個且相同之前驅物之一卷對卷電漿輔助化學氣相沈積(PECVD)製程沈積。 According to another aspect of the present disclosure, a hard coating system suitable for use in a touch screen panel is proposed. The hard coating system includes a soft substrate, selected from the group consisting of polycarbonate, polyethylene terephthalate, poly (methacrylic acid methyl ester), and triacetic acid. Cellulose (triacetyl cellulose), cyclo olefin polymer (cyclo olefin polymer), poly (ethylene terephthalate) (poly (ethylene naphthalate)) group. Furthermore, the hard coating system includes a layer stack disposed on a soft substrate, wherein the layer stack includes an adhesion promotion layer and an inorganic hard coating upper layer, and the adhesion promotion layer is disposed on the soft substrate. The adhesion-promoting layer is assembled by covalent bonding on the surface of the soft substrate, and the hardness of the adhesion-promoting layer is assembled from the soft substrate to the inorganic hard coating layer. To increase. The inorganic hard coating upper layer has a pencil hardness from 2H to 9H. The adhesion promoting layer and the inorganic hard coating layer are deposited by using a roll-to-roll plasma-assisted chemical vapor deposition (PECVD) process using one and the same precursor.

根據本揭露之再另一方面,提出一種光電裝置,具有根據此處所述任何實施例之一硬塗層系統。 According to yet another aspect of this disclosure, a photovoltaic device is provided having a hard coating system according to any of the embodiments described herein.

根據本揭露之再其他方面,提出一種用以於一連續卷對卷製程中製造一硬塗層系統之方法。方法包括在不破壞真空之情況下,提供一軟質基材到至少一第一處理區域及至少一第二處理區域;於此至少一第一處理區域中沈積一黏附促進層於軟質基材上;以及於此至少一第二處理區域中沈積一無機硬塗上層,其中沈積黏附促進層包括形成共價鍵結於軟質基材及黏附促進層之間。再者,沈積黏附促進層包括使黏附促進層之機械性質適用於軟質基材之機械性質。 According to still other aspects of the present disclosure, a method for manufacturing a hard coating system in a continuous roll-to-roll process is proposed. The method includes providing a soft substrate to at least one first processing region and at least one second processing region without breaking the vacuum; depositing an adhesion promoting layer on the soft substrate in the at least one first processing region; And depositing an inorganic hard coating layer in the at least one second processing region, wherein depositing the adhesion promotion layer includes forming a covalent bond between the soft substrate and the adhesion promotion layer. Furthermore, depositing the adhesion-promoting layer includes adapting the mechanical properties of the adhesion-promoting layer to the mechanical properties of the soft substrate.

數個實施例係亦有關於用以執行所揭露之方法之設備,且包括用以執行所述之各方法方面之設備部件。此些方法方面可藉由硬體元件、由合適軟體程式化之電腦、兩者之任何結合或任何其他方式執行。再者,根據本揭露之數個實施例係亦有關於用以操作所述之設備的方法。用以操作所述之設備的此些方法包括數個方法方面,用以執行設備之各功能。為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: Several embodiments are also related to equipment for performing the disclosed methods, and include equipment components for performing each of the method aspects described. These method aspects may be implemented by hardware components, a computer programmed with suitable software, any combination of the two, or any other means. Furthermore, several embodiments according to the present disclosure also relate to a method for operating the device described. These methods for operating the described device include several method aspects for performing various functions of the device. In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

100‧‧‧硬塗層系統 100‧‧‧hard coating system

101‧‧‧軟質基材 101‧‧‧ soft substrate

102‧‧‧界面 102‧‧‧ interface

108‧‧‧箭頭 108‧‧‧ Arrow

110‧‧‧層堆疊 110‧‧‧layer stacking

111‧‧‧黏附促進層 111‧‧‧ Adhesion promoting layer

112‧‧‧其他黏附促進層 112‧‧‧Other adhesion promoting layers

113‧‧‧無機硬塗上層 113‧‧‧ inorganic hard coating

120‧‧‧抗反射層堆疊 120‧‧‧Anti-reflective layer stack

121‧‧‧第一層 121‧‧‧ First floor

122‧‧‧第二層 122‧‧‧Second floor

123‧‧‧第三層 123‧‧‧Third floor

124‧‧‧第四層 124‧‧‧Fourth floor

150‧‧‧光電裝置 150‧‧‧ Photoelectric device

200‧‧‧方法 200‧‧‧ Method

210、220、230‧‧‧流程步驟 210, 220, 230‧‧‧ process steps

300‧‧‧處理系統 300‧‧‧treatment system

302A‧‧‧第一腔室部份 302A‧‧‧First chamber part

302A1‧‧‧夾層腔室部份單元 302A1‧‧‧Some units of mezzanine chamber

302A2‧‧‧基材腔室部份單元 302A2‧‧‧Part of the substrate chamber

302B‧‧‧第二腔室部份 302B‧‧‧Second Chamber Section

302C‧‧‧第三腔室部份 302C‧‧‧The third chamber part

305、766、766’‧‧‧夾層滾軸 305, 766, 766’‧‧‧ mezzanine roller

312‧‧‧真空凸緣 312‧‧‧vacuum flange

392‧‧‧預處理電漿源 392‧‧‧ pretreatment plasma source

394‧‧‧預熱單元 394‧‧‧preheating unit

430‧‧‧蝕刻站 430‧‧‧etching station

492‧‧‧離子化單元 492‧‧‧ionization unit

494‧‧‧光學測量單元 494‧‧‧Optical measurement unit

630‧‧‧沈積源 630‧‧‧Sedimentary source

701‧‧‧分隔牆 701‧‧‧partition wall

710‧‧‧塗佈鼓 710‧‧‧coating drum

740‧‧‧縫隙閘 740‧‧‧Gap gate

764‧‧‧第一滾軸 764‧‧‧first roller

764’‧‧‧第二滾軸 764’‧‧‧Second Roller

THTL、TAPL‧‧‧厚度 T HTL , T APL ‧‧‧ thickness

為了使本揭露之上述特徵可詳細地瞭解,簡要摘錄於上之本揭露之更特有之說明可參照數個實施例。所附之圖式係有關於本揭露之數個實施例且係說明於下方:第1及2圖繪示根據此處所述實施例之硬塗層系統之示意圖;第3圖繪示根據此處所述其他實施例之硬塗層系統之示意圖;第4至6圖繪示根據此處所述再其他實施例之硬塗層系統之示意圖;第7圖繪示根據此處所述實施例之用以製造硬塗層系統之處理系統之示意圖;第8圖繪示根據此處所述實施例之具有硬塗層系統之光電裝置之示意圖;以及第9圖繪示根據此處所述實施例之用以於連續卷對卷製程中製造硬塗層系統之方法之流程圖。 In order to make the above-mentioned features of the present disclosure understandable in detail, a more specific description briefly extracted from the above disclosure may refer to several embodiments. The attached drawings are related to several embodiments of the disclosure and are described below: Figures 1 and 2 show schematic diagrams of a hard coating system according to the embodiments described herein; Figure 3 shows a diagram based on this Schematic diagrams of hard coating systems according to other embodiments described herein; Figures 4 to 6 illustrate schematic diagrams of hard coating systems according to yet other embodiments described herein; and Figure 7 illustrates embodiments according to the embodiments described herein A schematic diagram of a processing system for manufacturing a hard coating system; FIG. 8 illustrates a schematic diagram of an optoelectronic device having a hard coating system according to the embodiments described herein; and FIG. 9 illustrates an implementation according to the description herein An example flowchart of a method for manufacturing a hard coating system in a continuous roll-to-roll process.

詳細的參照將以數種實施例達成,數種實施例的一或多個例子係繪示於各圖式中。各例子係藉由說明的方式提供且不意味為一限制。舉例來說,所說明或敘述而做為一實施例之部份之特徵可用於任何其他實施例或與任何其他實施例結合,以取得再進一步之實施例。此意指本揭露包括此些調整及變化。 Detailed reference will be made in several embodiments, and one or more examples of several embodiments are shown in the drawings. The examples are provided by way of illustration and are not meant to be limiting. For example, features illustrated or described as part of one embodiment can be used in or combined with any other embodiment to obtain yet further embodiments. This means that this disclosure includes such adjustments and changes.

在圖式之下方說明中,相同參考編號係意指相同或類似之元件。一般來說,僅有有關於個別實施例之相異處係進行 說明。除非另有說明,一實施例中之一部份或方面之說明可亦應用於另一實施例中之對應部份或方面。 In the description below the drawings, the same reference numerals refer to the same or similar elements. Generally, only the differences regarding individual embodiments are performed. Instructions. Unless stated otherwise, the description of one part or aspect in one embodiment can also be applied to the corresponding part or aspect in another embodiment.

在本揭露之數種實施例係更詳細說明之前,有關於此處使用之一些名稱及表示之一些方面係解說。 Before the embodiments of the present disclosure are described in more detail, some aspects of the names and representations used herein are explained.

於本揭露中,「硬塗層系統」係理解為數層之堆疊。於數層之堆疊中,至少最上層包括硬塗層。特別是,「硬塗層系統」可理解為包括無機硬塗上層之數層之堆疊。更特別是,硬塗層可以硬塗層具有至少2H之鉛筆硬度來作為特徵。就此點而言,將理解的是,塗佈之抗性也就是已塗佈之層的硬度,可決定為最硬鉛筆之等級,不會在以45度之角度穩固地壓抵於已塗佈之層時永久地留下記號。一般來說,鉛筆係利用7.5N之力壓抵於將測試之表面。鉛筆硬度測試係亦已知為「Wolff-Wilborn測試」。 In this disclosure, "hard coating system" is understood as a stack of several layers. In a stack of several layers, at least the uppermost layer includes a hard coating. In particular, a "hard coating system" can be understood as a stack of several layers including an inorganic hard coating layer. More particularly, the hard coating may be characterized by a hard coating having a pencil hardness of at least 2H. In this regard, it will be understood that the resistance to coating, that is, the hardness of the coated layer, can be determined as the level of the hardest pencil, and will not be firmly pressed against the coated at an angle of 45 degrees Marks are left permanently on the floor. Generally, the pencil is pressed against the surface to be tested with a force of 7.5N. The pencil hardness test system is also known as the "Wolff-Wilborn test".

於本揭露中,「層堆疊」係理解為數層之堆疊,具有至少兩層之不同材料成份。特別是,如此處所述之數層之堆疊可為透明的。如此處所使用之名稱「透明」可特別是包括以相對低散射之方式傳送光之結構的能力,使得舉例為於其傳送通過之光可以實質上清楚之方式看見。 In the present disclosure, "layer stacking" is understood as a stack of several layers with different material compositions of at least two layers. In particular, a stack of several layers as described herein may be transparent. The name "transparent" as used herein may include, in particular, the ability of a structure to transmit light in a relatively low scattering manner such that, for example, the light through which it is transmitted can be seen in a substantially clear manner.

於本揭露中,「軟質基材」可具有基材係可彎曲的特徵。舉例來說,軟質基材可為箔。特別是,將理解的是,如此處所述之軟質基材可如此處所述之於連續卷對卷製程中處理,舉例為在如此處所述之卷對卷處理系統中處理。特別是,如此處所述之軟質基材係適用於在軟質基材上製造塗層或電子裝置。特別 是,如此處所述之軟質基材可為透明的,舉例為軟質基材可以透明聚合物材料製成。更特別是,如此處所述之軟質基材可包括材料,例如是聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚碳酸酯(polycarbonate,PC)、聚乙烯(polyethylene,PE)、聚醯亞胺(polyimide,PI)、聚氨酯(polyurethane,PU)、聚甲基丙烯酸甲酯(poly(methacrylic acid methyl ester))、三醋酸纖維素(triacetyl cellulose)、三醋酸纖維素(cellulose triacetate,TAC)、環烯烴聚合物(cyclo olefin polymer)、聚對苯二甲酸乙二酯(poly(ethylene naphthalate))、一或多個金屬、紙、其之組合、及已塗佈之基材。已塗佈之基材像是硬塗PET(Hard Coated PET,HC-PET)或硬塗TAC(Hard Coated TAC,HC-TAC)及類似物。 In the present disclosure, the “soft substrate” may have a feature that the substrate is flexible. For example, the soft substrate may be a foil. In particular, it will be understood that a soft substrate as described herein may be processed in a continuous roll-to-roll process as described herein, for example, in a roll-to-roll processing system as described herein. In particular, soft substrates as described herein are suitable for making coatings or electronic devices on soft substrates. particular Yes, the soft substrate as described herein may be transparent, for example, the soft substrate may be made of a transparent polymer material. More specifically, the soft substrate as described herein may include materials such as polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), Polyimide (PI), polyurethane (PU), poly (methacrylic acid methyl ester), triacetyl cellulose, cellulose triacetate, TAC), cyclo olefin polymer, poly (ethylene naphthalate), one or more metals, paper, combinations thereof, and coated substrates. The coated substrates are like Hard Coated PET (HC-PET) or Hard Coated TAC (HC-TAC) and the like.

於本揭露中,「黏附促進層」係理解為設置於兩個結構之間的層,舉例為基材及層之間的層或兩層之間的層,及黏附促進層係裝配以促進所述之兩個結構之間的黏附。舉例來說,黏附促進層APL可裝配,以共價鍵結於此兩個結構之至少一者,黏附促進層設置於此兩個結構之間。因此,黏附促進層APL可裝配,以共價鍵結於如此處所述之軟質基材及/或共價鍵結於沈積於黏附促進層APL上之接續層。再者,黏附促進層之機械性質可適用於如處所述之軟質基材之機械性質。舉例來說,黏附促進層APL之可撓性可適用於軟質基材之機械性質,可撓性舉例為彈性模 數。因此,既然黏附促進層APL可跟隨軟質基材之變形,黏附促進層APL至基材之黏附可改善。 In this disclosure, "adhesion promoting layer" is understood as a layer disposed between two structures, such as a substrate and a layer between layers or a layer between two layers, and an assembly of adhesion promoting layers to promote Describe the adhesion between the two structures. For example, the adhesion promoting layer APL can be assembled and covalently bonded to at least one of the two structures, and the adhesion promoting layer is disposed between the two structures. Therefore, the adhesion-promoting layer APL can be assembled to be covalently bonded to a soft substrate as described herein and / or covalently bonded to a splicing layer deposited on the adhesion-promoting layer APL. Furthermore, the mechanical properties of the adhesion promoting layer can be applied to the mechanical properties of the soft substrate as described herein. For example, the flexibility of the adhesion-promoting layer APL can be applied to the mechanical properties of soft substrates, and the flexibility is exemplified by elastic molds. number. Therefore, since the adhesion-promoting layer APL can follow the deformation of the soft substrate, the adhesion of the adhesion-promoting layer APL to the substrate can be improved.

於本揭露中,「硬塗上層」將瞭解為數層之堆疊之最上層。特別是,硬塗上層可以硬塗上層具有至少2H之鉛筆硬度作為特徵。 In this disclosure, "hard-coated upper layer" will be understood as the uppermost layer of a stack of several layers. In particular, the hard-coated layer may be characterized as having a pencil hardness of at least 2H.

第1圖繪示根據此處所述實施例之硬塗層系統之示意圖。根據可與此處所述任何其他實施例結合之數個實施例,硬塗層系統係適用於在觸控螢幕面板中使用。特別是,硬塗層系統包括軟質基材101及層堆疊110,層堆疊110設置於軟質基材101上。舉例來說,軟質基材101可包括聚合物材料,選自由聚碳酸酯(polycarbonate)、聚對苯二甲酸乙二酯(polyethylene terephthalate)、聚甲基丙烯酸甲酯(poly(methacrylic acid methyl ester))、三醋酸纖維素(triacetyl cellulose)、環烯烴聚合物(cyclo olefin polymer)、及聚(對酞酸乙二酯)(poly(ethylene naphthalate))所組成之群組。如第1圖中範例性所示,層堆疊110包括黏附促進層111及無機硬塗上層113,黏附促進層111設置於軟質基材101上。黏附促進層111係裝配以共價鍵結於軟質基材之表面。再者,於至軟質基材101之界面102之黏附促進層111之機械性質係適用於軟質基材101之機械性質。舉例來說,黏附促進層APL之可撓性可適用於軟質基材之機械性質,可撓性舉例為彈性模數。 FIG. 1 is a schematic diagram of a hard coating system according to the embodiment described herein. According to several embodiments that can be combined with any of the other embodiments described herein, the hard coating system is suitable for use in a touch screen panel. In particular, the hard coating system includes a soft substrate 101 and a layer stack 110, and the layer stack 110 is disposed on the soft substrate 101. For example, the soft substrate 101 may include a polymer material selected from the group consisting of polycarbonate, polyethylene terephthalate, and poly (methacrylic acid methyl ester). ), Triacetyl cellulose, cyclo olefin polymer, and poly (ethylene naphthalate). As exemplarily shown in FIG. 1, the layer stack 110 includes an adhesion promotion layer 111 and an inorganic hard coating upper layer 113. The adhesion promotion layer 111 is disposed on the soft substrate 101. The adhesion promoting layer 111 is assembled and covalently bonded to the surface of the soft substrate. Furthermore, the mechanical properties of the adhesion promoting layer 111 at the interface 102 to the soft substrate 101 are suitable for the mechanical properties of the soft substrate 101. For example, the flexibility of the adhesion promoting layer APL can be applied to the mechanical properties of a soft substrate, and the flexibility is exemplified by the elastic modulus.

因此,如此處所述之數個實施例係提供改善之硬塗層系統。特別是,相較於傳統之硬塗層系統,如此處所述之硬塗層系統具有改善之結構穩定性及完整性(integrity)。因此,藉由應用如此處所述的硬塗層系統之數個實施例於光電裝置中,且舉例為顯示裝置或觸控面板,結構穩定性及抗刮性可改善,使得光電裝置之改善之產品耐久性可達成。 Therefore, several embodiments as described herein provide improved hard coating systems. In particular, compared to traditional hard coating systems, hard coating systems as described herein have improved structural stability and integrity. Therefore, by applying several embodiments of the hard coating system as described herein in an optoelectronic device, and for example a display device or a touch panel, the structural stability and scratch resistance can be improved, making the improvement of the optoelectronic device Product durability can be achieved.

範例性參照第2圖,根據可與此處所述任何其他實施例結合之數個實施例,黏附促進層111可具有100nmTAPL 800nm之厚度TAPLExemplarily referring to FIG. 2, according to several embodiments that can be combined with any other embodiments described herein, the adhesion promotion layer 111 may have 100 nm T APL 800 nm thickness T APL .

舉例來說,黏附促進層111之厚度TAPL可選自具有一下限及一上限之範圍。下限為100nm,特別是200nm,更特別是300nm及上限為600nm,特別是700nm,更特別是800nm。因此,藉由提供具有如此處所述之厚度TAPL之黏附促進層之硬度層系統,整個硬塗層系統穩定性可改善。 For example, the thickness T APL of the adhesion promotion layer 111 may be selected from a range having a lower limit and an upper limit. The lower limit is 100 nm, particularly 200 nm, more particularly 300 nm, and the upper limit is 600 nm, particularly 700 nm, and more particularly 800 nm. Therefore, by providing a hardness layer system having an adhesion promoting layer having a thickness T APL as described herein, the stability of the entire hard coating system can be improved.

再者,範例性參照第2圖,根據可與此處所述任何其他實施例結合之數個實施例,無機硬塗上層113之厚度THTL可為100nmTHTL 1μm。舉例來說,無機硬塗上層之厚度THTL可選自具有一下限及一上限之範圍。下限為100nm,特別是200nm,更特別是300nm及上限為600nm,特別是800nm,更特別是1μm。因此,藉由提供具有如此處所述之厚度THTL之無機硬塗上層之硬塗層系統,整個硬塗層系統穩定性可改善,特別是抗刮性可改善。 Furthermore, referring to FIG. 2 as an example, according to several embodiments that can be combined with any other embodiments described herein, the thickness T HTL of the inorganic hard coating upper layer 113 may be 100 nm. T HTL 1 μm. For example, the thickness T HTL of the inorganic hard coating upper layer may be selected from a range having a lower limit and an upper limit. The lower limit is 100 nm, particularly 200 nm, more particularly 300 nm, and the upper limit is 600 nm, particularly 800 nm, and more particularly 1 μm. Therefore, by providing a hard-coating system having an inorganic hard-coating layer having a thickness T HTL as described herein, the stability of the entire hard-coating system can be improved, and especially the scratch resistance can be improved.

根據可與此處所述任何其他實施例結合之數個實施例,黏附促進層111包括碳氧化矽SiOxCy。特別是,黏附促進層111可以碳氧化矽SiOxCy組成。因此,藉由應用具有如此處所述之材料組成之黏附促進層,黏附促進層係裝配以共價鍵結於如此處所述之軟質基材之表面,而有利於改善硬塗層系統之結構穩定性。 According to several embodiments that can be combined with any of the other embodiments described herein, the adhesion promotion layer 111 includes silicon oxycarbide SiO x C y . In particular, the adhesion promotion layer 111 may be composed of silicon oxycarbide SiO x C y . Therefore, by applying an adhesion-promoting layer having a material composition as described herein, the adhesion-promoting layer is assembled to covalently bond to the surface of a soft substrate as described herein, which is beneficial to improving the structure of the hard coating system. stability.

根據可與此處所述任何其他實施例結合之數個實施例,無機硬塗上層113包括氧化矽SiOx。特別是,無機硬塗上層113可以氧化矽SiOx組成。或者,無機硬塗上層113可包括碳化矽SiC,特別是無機硬塗上層113可以碳化矽SiC組成。 According to several embodiments that can be combined with any of the other embodiments described herein, the inorganic hard coat overlayer 113 includes silicon oxide SiO x . In particular, the inorganic hard coat upper layer 113 may be composed of silicon oxide SiO x . Alternatively, the inorganic hard coating upper layer 113 may include silicon carbide SiC, and in particular, the inorganic hard coating upper layer 113 may be composed of silicon carbide SiC.

根據可與任何其他實施例結合之數個實施例,無機硬塗上層具有從2H至9H之鉛筆硬度。舉例來說,無機硬塗上層之鉛筆硬度可為2H、3H、4H、5H、6H、7H、8H或9H。無機硬塗上層之鉛筆硬度可使用鉛筆硬度測試測量,鉛筆硬度測試亦已知為Wolff-Wilborn測試。特別是,無機硬塗上層之硬度可決定為最硬鉛筆之等級,不會在以45度之角度穩固地壓抵於無機硬塗上層時,在無機硬塗上層永久地留下記號。一般來說,鉛筆係利用7.5N之力壓抵於將測試之表面,舉例為無機硬塗上層之表面。 According to several embodiments that can be combined with any of the other embodiments, the inorganic hard coating has a pencil hardness from 2H to 9H. For example, the pencil hardness of the inorganic hard coating layer can be 2H, 3H, 4H, 5H, 6H, 7H, 8H, or 9H. The pencil hardness of the inorganic hard coating can be measured using a pencil hardness test, which is also known as the Wolff-Wilborn test. In particular, the hardness of the inorganic hard coating layer can be determined as the grade of the hardest pencil, and it will not permanently leave a mark on the inorganic hard coating layer when it is firmly pressed against the inorganic hard coating layer at an angle of 45 degrees. Generally, the pencil is pressed against the surface to be tested with a force of 7.5N, for example, the surface of an inorganic hard coating.

範例性參照第4及5圖,根據可與此處所述任何其他實施例結合之數個實施例,層堆疊110可更包括抗反射層堆疊120,設置於黏附促進層111及無機硬塗上層113之間。舉例來說,抗反射層堆疊120可包括設置於黏附促進層111上之SiOx之第一 層121、設置於第一層121上之NbOx之第二層122、及設置於第二層122上之SiOx之第三層123,如第4圖中範例性所示。再者,抗反射層堆疊120可包括設置於第三層123上之氧化銦錫(inidium tin oxide,ITO)之第四層124,如第5圖中範例性所示。 Exemplarily referring to FIGS. 4 and 5, according to several embodiments that can be combined with any of the other embodiments described herein, the layer stack 110 may further include an anti-reflection layer stack 120 disposed on the adhesion promotion layer 111 and the inorganic hard coating upper layer. 113. For example, the anti-reflection layer stack 120 may include a first layer 121 of SiO x disposed on the adhesion promotion layer 111, a second layer 122 of NbO x disposed on the first layer 121, and a second layer 122 disposed The third layer 123 of SiO x is shown as an example in FIG. 4. Furthermore, the anti-reflection layer stack 120 may include a fourth layer 124 of indium tin oxide (ITO) disposed on the third layer 123, as shown by way of example in FIG. 5.

舉例來說,第一層121可具有5nmT1 10nm之厚度T1。舉例來說,第一層121之厚度T1可選自具有一下限及一上限之範圍。下限為5nm,特別是6nm,更特別是7nm及上限為8nm,特別是9nm,更特別是10nm。 For example, the first layer 121 may have 5 nm T 1 A thickness T 1 of 10 nm. For example, the thickness T 1 of the first layer 121 may be selected from a range having a lower limit and an upper limit. The lower limit is 5 nm, particularly 6 nm, more particularly 7 nm, and the upper limit is 8 nm, particularly 9 nm, and more particularly 10 nm.

第二層122可具有5nmT2 10nm之厚度T2。舉例來說,第二層122之厚度T2可選自具有一下限及一上限之範圍。下限為5nm,特別是6nm,更特別是7nm及上限為8nm,特別是9nm,更特別是10nm。 The second layer 122 may have 5 nm T 2 10 nm thickness T 2 . For example, the thickness T 2 of the second layer 122 may be selected from a range having a lower limit and an upper limit. The lower limit is 5 nm, particularly 6 nm, more particularly 7 nm, and the upper limit is 8 nm, particularly 9 nm, and more particularly 10 nm.

第三層123可具有40nmT3 80nm之厚度T3。舉例來說,第三層123之厚度T3可選自具有一下限及一上限之範圍。下限為40nm,特別是45nm,更特別是50nm及上限為60nm,特別是70nm,更特別是80nm。 The third layer 123 may have 40 nm T 3 A thickness T 3 of 80 nm. For example, the thickness T 3 of the third layer 123 may be selected from a range having a lower limit and an upper limit. The lower limit is 40 nm, particularly 45 nm, more particularly 50 nm, and the upper limit is 60 nm, particularly 70 nm, and more particularly 80 nm.

第四層124可具有20nmT4 60nm之厚度T4。舉例來說,第四層124之厚度T4可選自具有一下限及一上限之範圍。下限為20nm,特別是25nm,更特別是30nm及上限為40nm,特別是50nm,更特別是60nm。 The fourth layer 124 may have 20 nm T 4 60 nm thickness T 4 . For example, the thickness T 4 of the fourth layer 124 may be selected from a range having a lower limit and an upper limit. The lower limit is 20 nm, especially 25 nm, more particularly 30 nm, and the upper limit is 40 nm, especially 50 nm, and more particularly 60 nm.

相較於傳統之層結構,提供具有如此處所述之抗反射層堆疊120之硬塗層系統可有利於加強硬塗層系統之光學表現,特別是用於在光電裝置中使用,光電裝置例如是OLED顯示 器。舉例來說,如此處所述之層堆疊可有利於取得具有抗反射性質之硬塗層系統。 Compared to the conventional layer structure, providing a hard coating system with an anti-reflection layer stack 120 as described herein can be beneficial to enhance the optical performance of the hard coating system, especially for use in photovoltaic devices, such as Is OLED display Device. For example, layer stacks as described herein can be advantageous for obtaining hard coating systems with anti-reflective properties.

範例性參照第6圖,根據可與此處所述其他實施例結合之一些實施例,其他黏附促進層112可設置於抗反射層堆疊120及無機硬塗上層113之間。舉例來說,其他黏附促進層112之厚度可選自具有一下限及一上限之範圍。下限為100nm,特別是200nm,更特別是300nm及上限為600nm,特別是700nm,更特別是800nm。因此,藉由提供具有其他黏附促進層之硬塗層系統,且其他黏附促進層具有如此處所述之厚度,整個硬塗層系統穩定性可改善。 Referring to FIG. 6 as an example, according to some embodiments that can be combined with other embodiments described herein, other adhesion promoting layers 112 may be disposed between the anti-reflection layer stack 120 and the inorganic hard coating upper layer 113. For example, the thickness of the other adhesion promoting layer 112 may be selected from a range having a lower limit and an upper limit. The lower limit is 100 nm, particularly 200 nm, more particularly 300 nm, and the upper limit is 600 nm, particularly 700 nm, and more particularly 800 nm. Therefore, by providing a hard coating system having other adhesion promoting layers, and the other adhesion promoting layers have a thickness as described herein, the stability of the entire hard coating system can be improved.

再者,根據可與此處所述其他實施例結合之一些實施例,其他黏附促進層112可裝配,以共價鍵結於抗反射層堆疊120之最上層,舉例為共價鍵結於第三層123或第四層124。再者,其他黏附促進層112之機械性質可適用於抗反射層堆疊120之最上層之機械性質,舉例為第三層123或第四層124。舉例來說,其他黏附促進層之可撓性可適用於抗反射層堆疊120之最上層之機械性質,可撓性舉例為彈性模數。因此,相較於傳統之硬塗層系統,如此處所述之硬塗層系統之結構穩定性及完整性可改善更多。 Furthermore, according to some embodiments that can be combined with other embodiments described herein, other adhesion promoting layers 112 can be assembled and covalently bonded to the uppermost layer of the anti-reflection layer stack 120, for example, covalently bonded to Three layers 123 or fourth layer 124. Furthermore, the mechanical properties of other adhesion promoting layers 112 may be applicable to the mechanical properties of the uppermost layer of the anti-reflection layer stack 120, such as the third layer 123 or the fourth layer 124. For example, the flexibility of other adhesion-promoting layers can be applied to the mechanical properties of the uppermost layer of the anti-reflection layer stack 120, and the flexibility is exemplified by the elastic modulus. Therefore, the structural stability and integrity of the hard coating system as described herein can be improved more than the traditional hard coating system.

根據可與此處所述其他實施例結合之一例子,適用於於觸控螢幕面板中使用之硬塗層系統100包括軟質基材101。軟質基材101選自由聚碳酸酯(polycarbonate)、聚對苯二甲酸乙二酯(polyethylene terephthalate)、聚甲基丙烯酸甲酯(poly(methacrylic acid methyl ester))、三醋酸纖維素(triacetyl cellulose)、環烯烴聚合物(cyclo olefin polymer)、 聚(對酞酸乙二酯)(poly(ethylene naphthalate))所組成之群組。再者,硬塗層系統100包括層堆疊110,層堆疊110設置於軟質基材101上,其中層堆疊110包括黏附促進層111及無機硬塗上層113,黏附促進層111設置於軟質基材101上。特別是,黏附促進層111係裝配以共價鍵結於軟質基材之表面,其中黏附促進層之硬度可裝配,以從軟質基材至無機硬塗上層113逐漸地增加。無機硬塗上層113可具有從2H至9H之鉛筆硬度。一般來說,黏附促進層111及無機硬塗上層113係藉由使用一個及相同之前驅物之卷對卷PECVD製程沈積。 According to an example that can be combined with other embodiments described herein, a hard coating system 100 suitable for use in a touch screen panel includes a soft substrate 101. The soft substrate 101 is selected from the group consisting of polycarbonate, polyethylene terephthalate, poly (methacrylic acid methyl ester), and triacetyl cellulose. Cyclo olefin polymer, A group of poly (ethylene naphthalate). Furthermore, the hard coating system 100 includes a layer stack 110, which is disposed on the soft substrate 101, wherein the layer stack 110 includes an adhesion promotion layer 111 and an inorganic hard coating upper layer 113, and the adhesion promotion layer 111 is disposed on the soft substrate 101. on. In particular, the adhesion promotion layer 111 is assembled and covalently bonded to the surface of the soft substrate, and the hardness of the adhesion promotion layer can be assembled to gradually increase from the soft substrate to the inorganic hard-coated upper layer 113. The inorganic hard coating upper layer 113 may have a pencil hardness from 2H to 9H. Generally, the adhesion promoting layer 111 and the inorganic hard coat upper layer 113 are deposited by a roll-to-roll PECVD process using one and the same precursor.

因此,有鑑於此處所述之硬塗層系統之實施例,將瞭解的是,硬塗層系統係非常適合用於在連續卷對卷製程中製造,特別是在連續真空沈積卷對卷製程中製造。 Therefore, in view of the embodiments of the hard coating system described herein, it will be appreciated that the hard coating system is very suitable for manufacturing in a continuous roll-to-roll process, especially in a continuous vacuum deposition roll-to-roll process.中 Manufacture.

作為一例子來說,根據此處所述實施例之用以製造硬塗層系統之處理系統300係繪示於第7圖中。特別是,第7圖係繪示卷對卷處理系統,裝配以用於執行根據此處所述實施例之於連續卷對卷製程中製造硬塗層系統之方法。 As an example, the processing system 300 for manufacturing a hard coating system according to the embodiment described herein is shown in FIG. 7. In particular, FIG. 7 illustrates a roll-to-roll processing system assembled for performing a method for manufacturing a hard coating system in a continuous roll-to-roll process according to the embodiments described herein.

如第7圖中所示,處理系統300可包括至少三個腔室部份,例如是第一腔室部份302A、第二腔室部份302B及第三腔室部份302C。在第三腔室部份302C,一或多個沈積源630及選擇之蝕刻站430可設置成處理工具。軟質基材101舉例為此處所述之軟質基材,設置於舉例為具有捲軸之第一滾軸764上。軟質基材係從第一滾軸764退捲,如由箭頭108所繪示之基材運動方向所示。分隔牆701係設置而用於分隔第一腔室部份302A及第二腔室部份302B。分隔牆701可更提供有縫隙閘740,以提供軟質基材101於 其通過。設置於第二腔室部份302B及第三腔室部份302C之間的真空凸緣312可提供有開孔,以取出至少一些處理工具。 As shown in FIG. 7, the processing system 300 may include at least three chamber portions, such as a first chamber portion 302A, a second chamber portion 302B, and a third chamber portion 302C. In the third chamber portion 302C, one or more deposition sources 630 and selected etching stations 430 may be provided as processing tools. The soft substrate 101 is exemplified as the soft substrate described herein, and is disposed on the first roller 764 having a scroll. The soft substrate is unrolled from the first roller 764, as shown by the direction of movement of the substrate as indicated by arrow 108. The partition wall 701 is provided to partition the first chamber portion 302A and the second chamber portion 302B. The partition wall 701 may further be provided with a slit gate 740 to provide a soft substrate 101 to Its passed. The vacuum flange 312 disposed between the second chamber portion 302B and the third chamber portion 302C may be provided with an opening for taking out at least some processing tools.

軟質基材101係移動通過設置於塗佈鼓710及對應於沈積源630之位置之沈積區域。在操作期間,塗佈鼓710繞著軸旋轉,使得軟質基材101於箭頭108之方向中移動。根據一些實施例,軟質基材101係從第一滾軸764經由一、二或多個滾軸導引至塗佈鼓710及從塗佈鼓710導引至舉例為具有捲軸之第二滾軸764’。軟質基材101係在其之處理之後捲於第二滾軸764'上。 The soft substrate 101 moves through a deposition area provided on the coating drum 710 and a position corresponding to the deposition source 630. During operation, the coating drum 710 rotates around the axis, so that the soft substrate 101 moves in the direction of the arrow 108. According to some embodiments, the soft substrate 101 is guided from the first roller 764 to the coating drum 710 via one, two, or more rollers and from the coating drum 710 to a second roller, for example, having a roller. 764 '. The soft substrate 101 is wound on the second roller 764 'after the processing.

根據一些實施例,沈積源630可裝配以用於沈積如此處所述之硬塗層系統之層。作為一例子來說,至少一沈積源可適用於沈積黏附促進層111,及至少一沈積源可適用於沈積無機硬塗上層113。再者,可提供個別之沈積源,個別之沈積源適用以沈積第一層121、第二層122、第三層123、第四層124及其他黏附促進層112。 According to some embodiments, the deposition source 630 may be assembled for depositing layers of a hard coating system as described herein. As an example, at least one deposition source may be suitable for depositing the adhesion promoting layer 111, and at least one deposition source may be suitable for depositing the inorganic hard coating layer 113. Furthermore, individual deposition sources can be provided, and the individual deposition sources are suitable for depositing the first layer 121, the second layer 122, the third layer 123, the fourth layer 124, and other adhesion promoting layers 112.

於一些應用中,第一腔室部份302A係分隔成夾層(interleaf)腔室部份單元302A1及基材腔室部份單元302A2。舉例來說,夾層滾軸766/766’及夾層滾軸305可設置成處理系統300之模組元件。處理系統300可更包括預熱單元394,以加熱軟質基材。再者,預處理電漿源392可額外地或選擇地設置,以在進入第三腔室部份302C之前利用電漿處理基材。預處理電漿源392舉例為射頻(radio frequency,RF)電漿源。 In some applications, the first chamber portion 302A is separated into an interleaf chamber portion unit 302A1 and a substrate chamber portion unit 302A2. For example, the mezzanine rollers 766/766 'and the mezzanine rollers 305 may be provided as module components of the processing system 300. The processing system 300 may further include a preheating unit 394 to heat the soft substrate. Furthermore, the pre-treatment plasma source 392 may be additionally or alternatively disposed to treat the substrate with the plasma before entering the third chamber portion 302C. The pre-treatment plasma source 392 is, for example, a radio frequency (RF) plasma source.

根據可與此處所述其他實施例結合之再其他實施例,可亦選擇地提供光學測量單元494及/或一或多個離子化單元 492。光學測量單元494用以評估基材處理之結果,離子化單元492用以調整(adapting)基材上之電荷。 According to yet other embodiments that may be combined with other embodiments described herein, an optical measurement unit 494 and / or one or more ionization units may also be optionally provided 492. The optical measurement unit 494 is used to evaluate the result of substrate processing, and the ionization unit 492 is used to adapt the charge on the substrate.

根據一些實施例,沈積材料可根據沈積製程及已塗佈之基材之後續應用選擇。舉例來說,沈積源之沈積材料可根據如此所述之黏附促進層111、無機硬塗上層113、第一層121、第二層122、第三層123、第四層124及其他黏附促進層112之個別材料選擇。 According to some embodiments, the deposition material may be selected based on the deposition process and subsequent applications of the coated substrate. For example, the deposition material of the deposition source can be based on the adhesion promotion layer 111, the inorganic hard coating layer 113, the first layer 121, the second layer 122, the third layer 123, the fourth layer 124, and other adhesion promotion layers as described above. Individual material selection of 112.

範例性參照第8圖,根據本揭露一方面,提出具有根據此處所述任何實施例之硬塗層系統100之光電裝置150。因此,將瞭解的是,此處所述之硬塗層系統可有利地使用於光學應用中,舉例為OLEDs之保護。 Referring exemplarily to FIG. 8, according to one aspect of the present disclosure, a photovoltaic device 150 having a hard coating system 100 according to any of the embodiments described herein is proposed. Therefore, it will be appreciated that the hard coating systems described herein can be advantageously used in optical applications, such as the protection of OLEDs.

範例性參照第9圖,用以於連續卷對卷製程中製造硬塗層系統之方法200係說明。根據可與此處所述任何其他實施例結合之數個實施例,方法200包括在無需破壞真空的情況下,提供(見方塊210)軟性基材到至少一第一處理區域及至少一第二處理區域。再者,此方法包括於此至少一第一處理區域中沈積(見方塊220)黏附促進層於軟質基材上,及於此至少一第二處理區域中沈積(見方塊230)無機硬塗上層。 Exemplarily referring to FIG. 9, a method 200 for manufacturing a hard coating system in a continuous roll-to-roll process is illustrated. According to several embodiments that can be combined with any of the other embodiments described herein, method 200 includes providing (see box 210) a soft substrate to at least one first processing area and at least one second without breaking the vacuum. Processing area. Further, the method includes depositing (see box 220) an adhesion promoting layer on the soft substrate in the at least one first processing region, and depositing (see box 230) an inorganic hard-coating layer on the at least one second processing region. .

特別是,沈積黏附促進層可包括形成共價鍵結於軟質基材及黏附促進層之間。再者,沈積黏附促進層可包括使黏附促進層之機械性質適用於軟質基材之機械性質。舉例來說,黏附促進層之可撓性可適用於軟質基材之機械性質,可撓性舉例為彈性模數。 In particular, depositing the adhesion-promoting layer may include forming a covalent bond between the soft substrate and the adhesion-promoting layer. Furthermore, depositing the adhesion-promoting layer may include adapting the mechanical properties of the adhesion-promoting layer to the mechanical properties of the soft substrate. For example, the flexibility of the adhesion promoting layer can be applied to the mechanical properties of a soft substrate, and the flexibility is exemplified by the elastic modulus.

根據可與此處所述任何其他實施例結合之此方法的數個實施例,沈積黏附促進層及沈積無機硬塗上層可包括使用PECVD製程及/或熱燈絲化學氣相沈積(Hot Wire Chemical Vapor Deposition,HWCVD)製程。再者,沈積抗反射層堆疊120可亦包括利用PECVD製程及/或HWCVD製程。舉例來說,如此處所述之黏附促進層及/或無機硬塗上層及/或抗反射層堆疊120可利用低溫微波PECVD製程沈積。 According to several embodiments of this method that can be combined with any of the other embodiments described herein, depositing the adhesion promotion layer and the deposited inorganic hard coat overcoat layer may include using a PECVD process and / or hot filament chemical vapor deposition (Hot Wire Chemical Vapor) Deposition, HWCVD) process. Furthermore, depositing the anti-reflection layer stack 120 may also include using a PECVD process and / or a HWCVD process. For example, the adhesion promoting layer and / or the inorganic hard coating upper layer and / or the anti-reflection layer stack 120 described herein may be deposited using a low-temperature microwave PECVD process.

根據可與此處所述任何其他實施例結合之此方法的其他實施例,沈積黏附促進層包括使用至少一前驅物,選自由六甲基二矽氧烷(HMDSO Hexamethyldisiloxane);電漿聚合六甲基二矽氧烷(ppHMDSO plasmapolymer Hexamethyldisiloxane);四甲基環四矽氧烷(C4H16O4Si4)(TOMCATS Tetramethyl Cyclotetrasiloxane(C4H16O4Si4));六甲基二矽氮烷([(CH3)3Si]2NH)(HMDSN Hexamethyldisilazane([(CH3)3Si]2NH));及四乙氧基矽烷(Si(OC2H5)4)(TEOS Tetraethyl Orthosilicate(Si(OC2H5)4))所組成之群組。 According to other embodiments of this method that can be combined with any of the other embodiments described herein, depositing the adhesion promoting layer includes using at least one precursor selected from the group consisting of HMDSO Hexamethyldisiloxane; PpHMDSO plasmapolymer Hexamethyldisiloxane; tetramethylcyclotetrasiloxane (C 4 H 16 O 4 Si 4 ) (TOMCATS Tetramethyl Cyclotetrasiloxane (C 4 H 16 O 4 Si 4 )); hexamethyldisiloxane Nitrosane ([(CH 3 ) 3 Si] 2 NH) (HMDSN Hexamethyldisilazane ([(CH 3 ) 3 Si] 2 NH))); and tetraethoxysilane (Si (OC 2 H 5 ) 4 ) (TEOS Tetraethyl Orthosilicate (Si (OC 2 H 5 ) 4 )).

再者,沈積無機硬塗上層可亦包括利用至少一前驅物,選自由HMDSO;ppHMDSO;四甲基環四矽氧烷(C4H16O4Si4)(TOMCATS Tetramethyl Cyclotetrasiloxane(C4H16O4Si4));六甲基二矽氮烷([(CH3)3Si]2NH)(HMDSN Hexamethyldisilazane([(CH3)3Si]2NH));及四乙氧基矽烷(Si(OC2H5)4)(TEOS Tetraethyl Orthosilicate(Si(OC2H5)4))所組 成之群組。特別是,沈積黏附促進層及沈積無機硬度上層可包括使用相同之前驅物。 Furthermore, depositing the inorganic hard coating upper layer may also include using at least one precursor selected from the group consisting of HMDSO; ppHMDSO; tetramethylcyclotetrasiloxane (C 4 H 16 O 4 Si 4 ) (TOMCATS Tetramethyl Cyclotetrasiloxane (C 4 H 16 O 4 Si 4 )); hexamethyldisilazane ([(CH 3 ) 3 Si] 2 NH) (HMDSN Hexamethyldisilazane ([(CH 3 ) 3 Si] 2 NH))); and tetraethoxysilane ( Si (OC 2 H 5 ) 4 ) (TEOS Tetraethyl Orthosilicate (Si (OC 2 H 5 ) 4 )). In particular, depositing the adhesion promoting layer and the deposited inorganic hardness upper layer may include using the same precursor.

特別是,沈積黏附促進層可更包括使用至少一試劑,選自由作為起始劑之過氧化物,特別是三丁基氧化膦(TBPO(tert-butyl peroxide));丙烯酸酯單體(acrylate monomers),特別是丙烯酸乙基己酯(ethyl-hexyl acrylate);以及交聯劑(crosslinking agent),特別是丁二醇二丙烯酸酯(BDDA(butanediol-diacrylate))所組成之群組。因此,藉由使用選自上述之群組的至少一試劑,黏附促進層之黏附能力可改善。再者,使用選自所述群組之至少一試劑可有利於改善此處所述之硬塗層系統之結構穩定性。 In particular, depositing the adhesion-promoting layer may further include using at least one reagent selected from the group consisting of peroxides, especially tributylphosphine oxide (TBPO (tert-butyl peroxide)); acrylate monomers ), Especially ethyl-hexyl acrylate; and a crosslinking agent, especially butanediol-diacrylate (BDDA). Therefore, by using at least one agent selected from the above group, the adhesion ability of the adhesion promotion layer can be improved. Furthermore, the use of at least one agent selected from the group can be beneficial to improve the structural stability of the hard coating system described herein.

有鑑於前述,將瞭解的是,此處所述之數個實施例係提供改善之硬塗層系統及用以製造此種改善之硬塗層系統之方法,特別是用以於光電裝置中使用。光電裝置舉例為觸控面板。 In view of the foregoing, it will be appreciated that the several embodiments described herein provide improved hard coating systems and methods for making such improved hard coating systems, particularly for use in photovoltaic devices. . The optoelectronic device is an example of a touch panel.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

特別是,此書面說明係使用包括最佳模式之數個例子來揭露本揭露,且亦讓此技術領域中任何具有通常知識者能夠實施所述之標的,包括製造及使用任何裝置或系統及執行任何併入之方法。當數種特定之實施例係已經於前述中揭露時,上述實施例之非互斥之特徵可彼此結合。可專利之範圍係由申請專利範 圍定義,且如果申請專利範圍具有非相異於申請專利範圍之字面語言之結構元件時,或如果申請專利範圍包括等效結構元件,且等效結構元件與申請專利範圍之字面語言具有非實質差異時,其他例子係意欲包含於申請專利範圍之範疇中。 In particular, this written description uses several examples including the best mode to disclose this disclosure, and also enables anyone with ordinary knowledge in this technical field to implement the stated subject matter, including the manufacture and use of any device or system and implementation Any method of incorporation. When several specific embodiments have been disclosed in the foregoing, the non-exclusive features of the above embodiments may be combined with each other. Patentable scope If the scope of the patent application has structural elements that are not different from the literal language of the scope of the patent application, or if the scope of the patent application includes equivalent structural elements and the equivalent language of the equivalent structural element and the literal language of the scope of the patent application are non-essential In the case of differences, other examples are intended to be included in the scope of the patent application.

Claims (14)

一種硬塗層系統(100),適用於在一觸控螢幕面板中使用,該硬塗層系統包括:一軟質基材(101);及一層堆疊(110),設置於該軟質基材(101)上,其中該層堆疊(110)包括一黏附促進層(111)、一無機硬塗上層(113)及一抗反射層堆疊(120),該黏附促進層(111)設置於該軟質基材(101)上,該抗反射層堆疊(120)包括NbOx設置於該黏附促進層(111)與該無機硬塗上層(113)之間;其中該黏附促進層(111)係裝配以共價鍵結於該軟質基材之表面,及其中該黏附促進層(111)於至該軟質基材(101)之一界面(102)的一機械性質係適用於該軟質基材(101)之一機械性質,其中該黏附促進層(111)具有可撓性質。 A hard coating system (100) suitable for use in a touch screen panel. The hard coating system includes: a soft substrate (101); and a layer stack (110) disposed on the soft substrate (101). ), Wherein the layer stack (110) includes an adhesion promotion layer (111), an inorganic hard coating upper layer (113), and an anti-reflection layer stack (120), and the adhesion promotion layer (111) is disposed on the soft substrate (101), the anti-reflection layer stack (120) includes NbO x disposed between the adhesion promotion layer (111) and the inorganic hard coating upper layer (113); wherein the adhesion promotion layer (111) is assembled to be covalent A mechanical property of bonding to the surface of the soft substrate and the adhesion promoting layer (111) to an interface (102) of the soft substrate (101) is suitable for one of the soft substrate (101) Mechanical properties, wherein the adhesion promoting layer (111) has flexible properties. 如申請專利範圍第1項所述之硬塗層系統(100),其中該黏附促進層(111)具有100nmTAPL 800nm之一厚度(TAPL)。 The hard coating system (100) according to item 1 of the patent application scope, wherein the adhesion promotion layer (111) has a thickness of 100 nm T APL One thickness of 800 nm (T APL ). 如申請專利範圍第1或2項所述之硬塗層系統(100),其中該無機硬塗上層(113)具有100nmTHTL 1μm之一厚度(THTL)。 The hard coating system (100) according to item 1 or 2 of the patent application scope, wherein the inorganic hard coating layer (113) has a thickness of 100 nm T HTL One thickness of 1 μm (T HTL ). 如申請專利範圍第1或2項所述之硬塗層系統(100),其中該黏附促進層(111)包括碳氧化矽SiOxCyThe hard coating system (100) according to item 1 or 2 of the patent application scope, wherein the adhesion promotion layer (111) comprises silicon oxycarbide SiO x C y . 如申請專利範圍第1或2項所述之硬塗層系統(100),其中該黏附促進層(111)係由碳氧化矽SiOxCy組成。 The hard coat application system (100) of the first two patents, or range, wherein the adhesion promoting layer (111) consists of carbon-based silicon oxide SiO x C y components. 如申請專利範圍第1或2項所述之硬塗層系統(100),其中該無機硬塗上層(113)包括氧化矽SiOx或其中該無機硬塗上層(113)包括碳化矽SiC。 The hard coat application system (100) of the first two patents, or range, wherein the inorganic hard coat layer (113) comprises a silicon oxide or SiO x wherein the inorganic hard coat layer (113) comprises silicon carbide SiC. 如申請專利範圍第1或2項所述之硬塗層系統(100),其中該無機硬塗上層(113)係由氧化矽SiOx組成或該無機硬塗上層(113)係由碳化矽SiC組成。 The hard coating system (100) according to item 1 or 2 of the patent application scope, wherein the inorganic hard coating upper layer (113) is composed of silicon oxide SiO x or the inorganic hard coating upper layer (113) is composed of silicon carbide SiC composition. 如申請專利範圍第1或2項所述之硬塗層系統(100),其中該無機硬塗上層具有從2H至9H之一鉛筆硬度(pencil hardness)。 The hard coating system (100) according to item 1 or 2 of the patent application scope, wherein the inorganic hard coating upper layer has a pencil hardness from 2H to 9H. 一種硬塗層系統(100),適用於在一觸控螢幕面板中使用,該硬塗層系統包括:一軟質基材(101),選自由聚碳酸酯(polycarbonate)、聚對苯二甲酸乙二酯(polyethylene terephthalate)、聚甲基丙烯酸甲酯(poly(methacrylic acid methyl ester))、三醋酸纖維素(triacetyl cellulose)、環烯烴聚合物(cyclo olefin polymer)、聚(對酞酸乙二酯)(poly(ethylene naphthalate))所組成之群組;及一層堆疊(110),設置於該軟質基材(101)上,其中該層堆疊(110)包括一黏附促進層(111)、一無機硬塗上層(113)及一抗反射層堆疊(120),該黏附促進層(111)設置於該軟質基材(101)上,該 抗反射層堆疊(120)包括NbOx設置於該黏附促進層(111)與該無機硬塗上層(113)之間;其中該黏附促進層(111)係裝配以共價鍵結於該軟質基材之表面,及其中該黏附促進層(111)之硬度係裝配,以從該軟質基材至該無機硬塗上層(113)逐漸地增加,其中該無機硬塗上層(113)具有從2H至9H之一鉛筆硬度(pencil hardness)。 A hard coating system (100) is suitable for use in a touch screen panel. The hard coating system includes: a soft substrate (101) selected from the group consisting of polycarbonate and polyethylene terephthalate. Polyethylene terephthalate, poly (methacrylic acid methyl ester), triacetyl cellulose, cyclo olefin polymer, poly (ethylene terephthalate) ) (poly (ethylene naphthalate)); and a layer stack (110) disposed on the soft substrate (101), wherein the layer stack (110) includes an adhesion promotion layer (111), an inorganic layer A hard-coated upper layer (113) and an anti-reflection layer stack (120), the adhesion promotion layer (111) is disposed on the soft substrate (101), and the anti-reflection layer stack (120) includes NbO x disposed on the adhesion promotion Between the layer (111) and the inorganic hard coating upper layer (113); wherein the adhesion promoting layer (111) is assembled and covalently bonded to the surface of the soft substrate, and the hardness of the adhesion promoting layer (111) It is assembled to gradually increase from the soft substrate to the inorganic hard coating layer (113), wherein the inorganic hard coating The coating layer (113) has a pencil hardness from 2H to 9H. 一種光電裝置(150),具有如申請專利範圍第1至9項之任一者所述之硬塗層系統(100)。 A photovoltaic device (150) having a hard coating system (100) as described in any one of claims 1 to 9 of the scope of patent application. 一種用以於一連續卷對卷製程中製造一硬塗層系統之方法(200),該方法包括:在不破壞真空之情況下,提供(210)一軟質基材到至少一第一處理區域及至少一第二處理區域;於該至少一第一處理區域中沈積(220)一黏附促進層於該軟質基材上;以及於該至少一第二處理區域中沈積(230)一無機硬塗上層;其中沈積(220)該黏附促進層包括形成共價鍵結於該軟質基材及該黏附促進層之間,及其中沈積(220)該黏附促進層更包括使該黏附促進層之機械性質適用於該軟質基材之機械性質,其中該黏附促進層具有可撓性質。 A method (200) for manufacturing a hard coating system in a continuous roll-to-roll process, the method comprising: providing (210) a soft substrate to at least one first processing area without breaking a vacuum And at least a second processing region; depositing (220) an adhesion promoting layer on the soft substrate in the at least one first processing region; and depositing (230) an inorganic hard coating in the at least one second processing region Upper layer; wherein depositing (220) the adhesion promotion layer includes forming a covalent bond between the soft substrate and the adhesion promotion layer, and depositing (220) the adhesion promotion layer further includes mechanical properties of the adhesion promotion layer Suitable for mechanical properties of the soft substrate, wherein the adhesion promoting layer has flexible properties. 如申請專利範圍第11項所述之方法(200),其中沈積(220)該黏附促進層及沈積(230)該無機硬塗上層包括利用一 電漿輔助化學氣相沈積(PECVD)製程及/或一熱燈絲化學氣相沈積(HWCVD)製程。 The method (200) according to item 11 of the scope of patent application, wherein depositing (220) the adhesion promoting layer and depositing (230) the inorganic hard coating upper layer includes using an Plasma-assisted chemical vapor deposition (PECVD) process and / or a hot filament chemical vapor deposition (HWCVD) process. 如申請專利範圍第11項或第12項所述之方法(200),其中沈積(220)該黏附促進層更包括使用至少一前驅物,選自由六甲基二矽氧烷(HMDSO);四甲基環四矽氧烷(C4H16O4Si4)(TOMCATS Tetramethyl Cyclotetrasiloxane(C4H16O4Si4));六甲基二矽氮烷([(CH3)3Si]2NH)(HMDSN Hexamethyldisilazane([(CH3)3Si]2NH));及四乙氧基矽烷(Si(OC2H5)4)(TEOS Tetraethyl Orthosilicate(Si(OC2H5)4))所組成之群組,及其中沈積(220)該黏附促進層更包括使用至少一試劑,選自由作為複數個起始劑之複數個過氧化物;複數個丙烯酸酯單體(acrylate monomers);以及一交聯劑(crosslinking agent)所組成之群組。 The method (200) as described in claim 11 or 12, wherein depositing (220) the adhesion-promoting layer further comprises using at least one precursor selected from hexamethyldisilaxane (HMDSO); four Methylcyclotetrasiloxane (C 4 H 16 O 4 Si 4 ) (TOMCATS Tetramethyl Cyclotetrasiloxane (C 4 H 16 O 4 Si 4 )); Hexamethyl disilazane ([(CH 3 ) 3 Si] 2 NH) (HMDSN Hexamethyldisilazane ([(CH 3 ) 3 Si] 2 NH)); and tetraethoxysilane (Si (OC 2 H 5 ) 4 ) (TEOS Tetraethyl Orthosilicate (Si (OC 2 H 5 ) 4 )) The formed group, and depositing (220) the adhesion promoting layer further comprises using at least one reagent selected from a plurality of peroxides as a plurality of initiators; a plurality of acrylate monomers; and A group of crosslinking agents. 如申請專利範圍第13項所述之方法(200),其中作為該些起始劑之該些過氧化物包括三丁基氧化膦(TBPO(tert-butyl peroxide)),其中該些丙烯酸酯單體包括丙烯酸乙基己酯(ethyl-hexyl acrylate),及其中該交聯劑包括丁二醇二丙烯酸酯(BDDA(butanediol-diacrylate))。 The method (200) according to item 13 of the application, wherein the peroxides as the initiators include tributylphosphine oxide (TBPO (tert-butyl peroxide)), wherein the acrylate monoesters The body includes ethyl-hexyl acrylate, and the cross-linking agent includes butanediol-diacrylate (BDDA).
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