TWI674053B - Module stack - Google Patents
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- TWI674053B TWI674053B TW107144862A TW107144862A TWI674053B TW I674053 B TWI674053 B TW I674053B TW 107144862 A TW107144862 A TW 107144862A TW 107144862 A TW107144862 A TW 107144862A TW I674053 B TWI674053 B TW I674053B
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Abstract
一種堆疊模組,包含第一及第二電子模組、第一及第二解除裝置。第一電子模組包括限位柱,朝第一方向延伸。第二電子模組包括定位孔,滑動地套設於限位柱。第一解除裝置包括第一本體及導引件。第一本體設置於第一電子模組之側壁上,且包括滑槽。導引件滑動地耦合於第一本體之滑槽。導引件包括卡合部。第二解除裝置包括第二本體,設置於第二電子模組之側壁上。第二本體包括具有凸緣的凹槽。當堆疊模組位於鎖定狀態時,卡合部伸入凹槽中與凸緣卡合。當堆疊模組進入解除狀態時,導引件相對於第一本體沿第二方向滑動,使卡合部與凸緣分離。A stacked module includes first and second electronic modules, and first and second release devices. The first electronic module includes a limiting post and extends in a first direction. The second electronic module includes a positioning hole and is slidably sleeved on the limiting post. The first release device includes a first body and a guide. The first body is disposed on a side wall of the first electronic module and includes a sliding groove. The guide is slidably coupled to the chute of the first body. The guide includes an engaging portion. The second release device includes a second body disposed on a side wall of the second electronic module. The second body includes a groove having a flange. When the stacking module is in the locked state, the engaging portion protrudes into the groove to engage with the flange. When the stacking module enters the released state, the guide member slides in a second direction relative to the first body to separate the engaging portion from the flange.
Description
本發明是有關於一種具有解除裝置的堆疊模組。The invention relates to a stacking module with a release device.
以往在解鎖具有多個模組互相鎖固的堆疊模組時,必須克服具有多個接腳的連接器本身的結合力。而人工拆解時施力不均的問題,以及由機構輔助拆解時產生水平方向分力的問題,皆容易造成連接器損壞。In the past, when unlocking a stacked module having multiple modules locked to each other, the binding force of the connector with multiple pins must be overcome. However, the problem of uneven force application during manual disassembly and the problem of horizontal component force during disassembly assisted by the mechanism can easily cause damage to the connector.
本揭露之一技術態樣為一種堆疊模組。One technical aspect of this disclosure is a stacked module.
根據本揭露一些實施例,一種堆疊模組包含第一電子模組、第二電子模組、第一解除裝置以及第二解除裝置。第一電子模組包括限位柱,朝第一方向延伸。第二電子模組包括定位孔,其中定位孔滑動地套設於限位柱。第一解除裝置包括第一本體以及導引件。第一本體設置於第一電子模組之側壁上,且第一本體包括滑槽。導引件滑動地耦合於第一本體之滑槽,且導引件包括卡合部。第二解除裝置包括第二本體。第二本體設置於第二電子模組之側壁上。第二本體包括凹槽,且凹槽包括凸緣。當堆疊模組位於鎖定狀態時,卡合部伸入凹槽中並與凸緣卡合。當堆疊模組由鎖定狀態進入解除狀態時,導引件相對於第一本體沿第二方向滑動,使卡合部與凸緣分離。According to some embodiments of the present disclosure, a stacked module includes a first electronic module, a second electronic module, a first release device, and a second release device. The first electronic module includes a limiting post and extends in a first direction. The second electronic module includes a positioning hole, wherein the positioning hole is slidably sleeved on the limiting post. The first release device includes a first body and a guide. The first body is disposed on a side wall of the first electronic module, and the first body includes a sliding groove. The guide is slidably coupled to the chute of the first body, and the guide includes an engaging portion. The second release device includes a second body. The second body is disposed on a side wall of the second electronic module. The second body includes a groove, and the groove includes a flange. When the stacking module is in the locked state, the engaging portion protrudes into the groove and engages with the flange. When the stacking module enters the unlocked state from the locked state, the guide member slides in the second direction relative to the first body to separate the engaging portion from the flange.
於本揭露之一些實施例中,第一方向垂直於第二方向,定位孔與限位柱用以限制第一電子模組與第二電子模組在第二方向上的位移。In some embodiments of the present disclosure, the first direction is perpendicular to the second direction, and the positioning hole and the limiting post are used to limit the displacement of the first electronic module and the second electronic module in the second direction.
於本揭露之一些實施例中,導引件之卡合部包括第一斜面,凹槽包括第二斜面,當堆疊模組位於解除狀態時,第一斜面抵接第二斜面。In some embodiments of the present disclosure, the engaging portion of the guide includes a first inclined surface and the groove includes a second inclined surface. When the stacking module is in a released state, the first inclined surface abuts against the second inclined surface.
於本揭露之一些實施例中,第一斜面與第二斜面平行。In some embodiments of the present disclosure, the first inclined plane is parallel to the second inclined plane.
於本揭露之一些實施例中,第一本體包括容置區,設置在第一本體面對第一電子模組之內表面,且導引件設置於容置區。In some embodiments of the present disclosure, the first body includes an accommodation area disposed on an inner surface of the first body facing the first electronic module, and the guide is disposed in the accommodation area.
於本揭露之一些實施例中,容置區沿第二方向的寬度大於導引件沿第二方向的寬度。In some embodiments of the present disclosure, the width of the accommodating region in the second direction is greater than the width of the guide member in the second direction.
於本揭露之一些實施例中,第一解除裝置還包括推鈕。推鈕包括凸塊。導引件包括開孔。推鈕之凸塊穿過滑槽而與導引件之開孔卡合,其中推鈕外露於第一本體之外表面。In some embodiments of the present disclosure, the first release device further includes a push button. The push button includes a bump. The guide includes an opening. The projection of the push button passes through the chute and engages with the opening of the guide, wherein the push button is exposed on the outer surface of the first body.
於本揭露之一些實施例中,第一本體包括容置孔,係與容置區連通。導引件更包括凸柱,凸柱鄰近於容置孔設置。第一解除裝置更包括設置於容置孔與凸柱之間的彈性件。In some embodiments of the present disclosure, the first body includes a receiving hole, which is in communication with the receiving region. The guide further includes a convex post, and the convex post is disposed adjacent to the accommodation hole. The first release device further includes an elastic member disposed between the accommodation hole and the convex post.
於本揭露之一些實施例中,第一本體包括凸出部,第二本體包括凹陷部,當堆疊模組位於鎖定狀態時,凸出部與凹陷部卡合。In some embodiments of the present disclosure, the first body includes a protruding portion and the second body includes a recessed portion. When the stacking module is in a locked state, the protruding portion is engaged with the recessed portion.
於本揭露之一些實施例中,第一電子模組包括接腳區,第二電子模組包括對應於接腳區的插槽區,限位柱鄰近於接腳區設置。In some embodiments of the present disclosure, the first electronic module includes a pin area, the second electronic module includes a slot area corresponding to the pin area, and the limiting post is disposed adjacent to the pin area.
於本揭露之上述實施例中,在第一電子模組與第二電子模組從連接到分離的過程中,第二電子模組之定位孔仍滑動地套設於第一電子模組之限位柱,並沿著第一方向滑動。因此,可限制第二電子模組與第一電子模組分離時在與第一方向垂直的第二方向上的移動,進而避免第一電子模組上之元件(例如:接腳)於解除過程中損壞。In the above-mentioned embodiment of the present disclosure, during the process of connecting and disconnecting the first electronic module and the second electronic module, the positioning hole of the second electronic module is still slidably fitted on the limit of the first electronic module. Position the post and slide it along the first direction. Therefore, the movement of the second electronic module in the second direction perpendicular to the first direction when the second electronic module is separated from the first electronic module can be restricted, thereby preventing components (such as pins) on the first electronic module from being released. Medium damage.
以下將以圖式揭露本發明之多個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Several embodiments of the present invention will be disclosed in the following drawings. For the sake of clear description, many practical details will be described in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner.
第1圖為根據本揭露一實施例之堆疊模組100組裝時的立體圖。堆疊模組100包含第一電子模組110、第二電子模組120以及第三電子模組130、第一解除裝置140a以及第二解除裝置140b。第一電子模組110、第二電子模組120以及第三電子模組130沿著第一方向Y堆疊,且第二電子模組120位於第一電子模組110與第三電子模組130之間。FIG. 1 is a perspective view of a stacked module 100 according to an embodiment of the present disclosure when assembled. The stacked module 100 includes a first electronic module 110, a second electronic module 120 and a third electronic module 130, a first release device 140a and a second release device 140b. The first electronic module 110, the second electronic module 120, and the third electronic module 130 are stacked along the first direction Y, and the second electronic module 120 is located between the first electronic module 110 and the third electronic module 130. between.
第一解除裝置140a設置於第一電子模組110之側壁上,用以解鎖(unlock)第一電子模組110與第二電子模組120,使第二電子模組120自第一電子模組110分離。第二解除裝置140b也設置於第二電子模組120之側壁上,用以解鎖第二電子模組120與第三電子模組130,使第三電子模組130自第二電子模組120分離。第一解除裝置140a與第二解除裝置140b也堆疊於第一方向Y上。於一些實施例中,堆疊模組100也可包含三個以上的模組以及兩個以上的解除裝置。The first release device 140a is disposed on a side wall of the first electronic module 110, and is used to unlock the first electronic module 110 and the second electronic module 120, so that the second electronic module 120 is removed from the first electronic module. 110 separation. The second release device 140b is also disposed on the side wall of the second electronic module 120, and is used to unlock the second electronic module 120 and the third electronic module 130, so that the third electronic module 130 is separated from the second electronic module 120. . The first release device 140a and the second release device 140b are also stacked in the first direction Y. In some embodiments, the stacked module 100 may also include three or more modules and two or more release devices.
第2圖為第1圖之堆疊模組100於一視角的拆解圖。為了清楚說明,第二電子模組120以及第三電子模組130之底板以及各模組內之部分元件將於第2圖中省略。於本實施例中,第一電子模組110的外殼包括側壁111a、側壁111b以及頂板112。頂板112包括一頂表面1122係面對第二電子模組120。側壁111a與側壁111b相對,且側壁111a及側壁111b分別連接於頂板112相對之兩側邊。第二電子模組120的外殼包括側壁121a、側壁121b以及頂板122。頂板122包括一頂表面1222係面對第三電子模組130。側壁121a與側壁121b相對,且側壁121a及側壁121b分別連接於頂板122相對之兩側邊。FIG. 2 is an exploded view of the stacked module 100 of FIG. 1 from an angle of view. For clarity, the bottom plate of the second electronic module 120 and the third electronic module 130 and some components in each module will be omitted in FIG. 2. In this embodiment, the casing of the first electronic module 110 includes a side wall 111 a, a side wall 111 b, and a top plate 112. The top plate 112 includes a top surface 1122 facing the second electronic module 120. The side wall 111a is opposite to the side wall 111b, and the side wall 111a and the side wall 111b are respectively connected to opposite sides of the top plate 112. The housing of the second electronic module 120 includes a side wall 121 a, a side wall 121 b, and a top plate 122. The top plate 122 includes a top surface 1222 facing the third electronic module 130. The side wall 121a is opposite to the side wall 121b, and the side wall 121a and the side wall 121b are respectively connected to opposite sides of the top plate 122.
兩第一解除裝置140a、140c分別組裝於第一電子模組110之外殼的側壁111b以及側壁111a上,兩第二解除裝置140b、140d分別組裝於第二電子模組120之外殼的側壁121b以及側壁121a上。於一些實施例中,第一解除裝置140a、140c以及第二解除裝置140b、140d可透過螺絲分別鎖附於側壁111b、111a以及側壁121b、121a上,但其並非用以限制本發明。The two first release devices 140a and 140c are respectively assembled on the side wall 111b and the side wall 111a of the housing of the first electronic module 110, and the two second release devices 140b and 140d are respectively assembled on the side wall 121b and the housing of the second electronic module 120. On the side wall 121a. In some embodiments, the first release devices 140a, 140c and the second release devices 140b, 140d may be respectively fixed to the side walls 111b, 111a and the side walls 121b, 121a by screws, but they are not intended to limit the present invention.
第一電子模組110還包括兩限位柱113a、113b,限位柱113a、113b之一末端穿過第一電子模組110之頂板112而固定,限位柱113a、113b之另一末端沿第一方向Y往第二電子模組120延伸。第一電子模組110還包括接腳區114,接腳區114包括多個接腳1142。接腳區114設置在頂板112之頂表面1122上,且限位柱113a、113b鄰近於接腳區114設置。第一解除裝置140a、140c自頂表面1122於第一方向Y上延伸之高度H1小於限位柱113a、113b自頂表面1122於第一方向Y上延伸之一高度H2。接腳1142於第一方向Y上之高度H3小於限位柱113a、113b自頂表面1122於第一方向Y上延伸之高度H2。The first electronic module 110 further includes two limiting posts 113a and 113b. One end of the limiting posts 113a and 113b passes through the top plate 112 of the first electronic module 110 and is fixed. The other ends of the limiting posts 113a and 113b follow The first direction Y extends toward the second electronic module 120. The first electronic module 110 further includes a pin region 114, and the pin region 114 includes a plurality of pins 1142. The pin region 114 is disposed on the top surface 1122 of the top plate 112, and the limiting pillars 113 a and 113 b are disposed adjacent to the pin region 114. The height H1 of the first release devices 140a and 140c extending from the top surface 1122 in the first direction Y is smaller than a height H2 of the limiting posts 113a and 113b extending from the top surface 1122 in the first direction Y. The height H3 of the pin 1142 in the first direction Y is smaller than the height H2 of the limiting posts 113a and 113b extending from the top surface 1122 in the first direction Y.
第二電子模組120還包括兩限位柱123a、123b,限位柱123a、123b之一末端穿過第二電子模組120之頂板122,限位柱123a、123b之另一末端沿第一方向Y往第三電子模組130延伸。第二電子模組120還包括接腳區124,接腳區包括多個接腳1242。接腳區124設置在頂板122之頂表面1222上,且限位柱123a、123b鄰近於接腳區124設置。第二解除裝置140b、140d與第二電子模組120間的結構關係與第一解除裝置140a、140c與第一電子模組110間的結構雷同,於此不再贅述。The second electronic module 120 further includes two limiting posts 123a, 123b. One end of the limiting posts 123a, 123b passes through the top plate 122 of the second electronic module 120, and the other ends of the limiting posts 123a, 123b follow the first The direction Y extends toward the third electronic module 130. The second electronic module 120 further includes a pin region 124, and the pin region includes a plurality of pins 1242. The pin region 124 is disposed on the top surface 1222 of the top plate 122, and the limiting posts 123 a and 123 b are disposed adjacent to the pin region 124. The structural relationship between the second release devices 140b, 140d and the second electronic module 120 is similar to the structure between the first release devices 140a, 140c and the first electronic module 110, and details are not described herein again.
第3圖為第1圖之堆疊模組100於另一視角的拆解圖。第一電子模組110之頂板112還包括一底表面1124係背對第二電子模組120。第一電子模組110包括插槽區115以及固定結構116,其中插槽區115包括多個插槽1152,固定結構116包括沿第一方向Y延伸的定位孔117a、117b。插槽區115設置在頂板112之底表面1124上,固定結構116設置在頂板112之底表面1124上且部分環繞插槽區115。插槽區115於背對第二電子模組120之一側面延伸凸出於固定結構116。接腳區114(見第2圖)與插槽區115於第一方向Y上重疊。FIG. 3 is an exploded view of the stacked module 100 of FIG. 1 from another perspective. The top plate 112 of the first electronic module 110 further includes a bottom surface 1124 facing away from the second electronic module 120. The first electronic module 110 includes a slot area 115 and a fixing structure 116, wherein the slot area 115 includes a plurality of slots 1152, and the fixing structure 116 includes positioning holes 117a and 117b extending in the first direction Y. The slot area 115 is disposed on the bottom surface 1124 of the top plate 112, and the fixing structure 116 is disposed on the bottom surface 1124 of the top plate 112 and partially surrounds the slot area 115. The slot area 115 extends from one side of the second electronic module 120 facing away from the fixing structure 116. The pin area 114 (see FIG. 2) and the slot area 115 overlap in the first direction Y.
第二電子模組120之頂板122還包括一底表面1224係面對第一電子模組110。第二電子模組120包括插槽區125以及固定結構126,其中插槽區125包括多個插槽1252,固定結構126包括沿第一方向Y延伸的定位孔127a、127b。插槽區125設置在頂板122之底表面1224上,固定結構126設置在頂板122之底表面1224上且部分環繞插槽區125。插槽區125於背對第三電子模組130之一側面延伸凸出於固定結構126。接腳區124(見第2圖)與插槽區125(見第3圖)於第一方向Y上重疊。The top plate 122 of the second electronic module 120 further includes a bottom surface 1224 facing the first electronic module 110. The second electronic module 120 includes a slot area 125 and a fixing structure 126, wherein the slot area 125 includes a plurality of slots 1252, and the fixing structure 126 includes positioning holes 127a and 127b extending in the first direction Y. The slot area 125 is disposed on the bottom surface 1224 of the top plate 122, and the fixing structure 126 is disposed on the bottom surface 1224 of the top plate 122 and partially surrounds the slot area 125. The slot area 125 extends from the fixing structure 126 on a side facing away from the third electronic module 130. The pin area 124 (see FIG. 2) and the slot area 125 (see FIG. 3) overlap in the first direction Y.
參照第1圖至第3圖,當堆疊模組100處於鎖定(lock)狀態時,接腳區114之接腳1142對應卡合於插槽區125之插槽1252並電性連接。此外,第二電子模組120之定位孔127a、127b分別滑動地套設於第一電子模組110之限位柱113a、113b。同樣地,第三電子模組130也包括相同的定位孔,且分別滑動地套設於第二電子模組120之限位柱123a、123b。Referring to FIGS. 1 to 3, when the stacking module 100 is in a locked state, the pins 1142 of the pin area 114 are correspondingly engaged with the slots 1252 of the slot area 125 and are electrically connected. In addition, the positioning holes 127 a and 127 b of the second electronic module 120 are slidably sleeved on the limiting posts 113 a and 113 b of the first electronic module 110, respectively. Similarly, the third electronic module 130 also includes the same positioning hole and is slidably sleeved on the limiting posts 123a and 123b of the second electronic module 120, respectively.
為了避免接腳區114之接腳1142損壞,當藉由第一解除裝置140a、140c將第二電子模組120自第一電子模組110分離時,需要穩定地沿著第一方向Y移動。因此,在第一電子模組110之接腳區114之接腳1142與第二電子模組120之插槽區125之插槽1252從連接到分離的過程中,第二電子模組120之定位孔127a、127b仍可滑動地套設於第一電子模組110之限位柱113a、113b,並沿著第一方向Y滑動。因此,可限制第二電子模組120與第一電子模組110分離時在與第一方向Y垂直的第二方向X上的位移,避免接腳1142於解除過程中損壞。In order to prevent the pins 1142 of the pin area 114 from being damaged, when the second electronic module 120 is separated from the first electronic module 110 by the first release devices 140a and 140c, it is necessary to move stably along the first direction Y. Therefore, in the process of connecting and disconnecting the pins 1142 of the pin area 114 of the first electronic module 110 and the socket 1252 of the slot area 125 of the second electronic module 120 from the second electronic module 120, The holes 127 a and 127 b are still slidably fitted on the limiting posts 113 a and 113 b of the first electronic module 110 and slide along the first direction Y. Therefore, the displacement of the second electronic module 120 in the second direction X that is perpendicular to the first direction Y when the second electronic module 120 is separated from the first electronic module 110 can be restricted, and the pins 1142 can be prevented from being damaged during the release process.
同樣地,在第二電子模組120之接腳區124之接腳1242與第三電子模組130之插槽區的插槽從連接到分離的過程中,第三電子模組130之定位孔仍可滑動地套設於第二電子模組120之限位柱123a、123b,並沿著第一方向Y滑動。因此,可限制第三電子模組130與第二電子模組120分離時於第二方向X上的位移,避免接腳1242於解除過程中損壞。上述之解除裝置的結構以及將模組分離的方法將於下文中詳細介紹。Similarly, in the process of connecting the pin 1242 of the pin area 124 of the second electronic module 120 and the slot of the slot area of the third electronic module 130 from the connection to the separation, the positioning hole of the third electronic module 130 It is still slidably sleeved on the limiting posts 123 a and 123 b of the second electronic module 120 and slides along the first direction Y. Therefore, the displacement of the third electronic module 130 in the second direction X when the third electronic module 130 is separated from the second electronic module 120 can be restricted, and the pins 1242 can be prevented from being damaged during the lifting process. The structure of the above-mentioned release device and the method for separating the modules will be described in detail below.
第4圖為根據本揭露一實施例之解除裝置240之爆炸圖。第4圖是解除裝置240面對其所連接之模組之一側的視角。解除裝置240可為前述之第一解除裝置140a、140c或第二解除裝置140b、140d。解除裝置240包括本體242、導引件244、推鈕246以及彈性件248。本體242設置於所對應的電子模組之側壁上。本體242包括容置區2421,其中容置區2421是設置在本體242面對電子模組之內表面。導引件244設置於本體242之容置區2421內,容置區2421於第二方向X上具有寬度L1,導引件244於第二方向X上具有寬度L2。寬度L1大於寬度L2,且寬度L1與寬度L2之差異大約等於導引件244可移動的範圍。FIG. 4 is an exploded view of the release device 240 according to an embodiment of the disclosure. FIG. 4 is a perspective view of the releasing device 240 facing one side of the module to which it is connected. The release device 240 may be the first release device 140a, 140c or the second release device 140b, 140d. The release device 240 includes a body 242, a guide 244, a push button 246, and an elastic member 248. The body 242 is disposed on a side wall of the corresponding electronic module. The main body 242 includes an accommodating area 2421. The accommodating area 2421 is disposed on an inner surface of the main body 242 facing the electronic module. The guide 244 is disposed in the accommodating area 2421 of the body 242. The accommodating area 2421 has a width L1 in the second direction X, and the guide 244 has a width L2 in the second direction X. The width L1 is greater than the width L2, and the difference between the width L1 and the width L2 is approximately equal to the range in which the guide 244 can move.
本體242包括滑槽2423,且滑槽2423於第三方向Z上穿透本體242。導引件244包括開孔2442,且滑槽2423之位置對應開孔2442之位置。導引件244滑動地耦合於本體242之滑槽2423。滑槽2423於第二方向X上之寬度L3大於開孔2442於第二方向X上的寬度L4。推鈕246包括凸塊2462,且凸塊2462於第二方向X上的寬度L5略小於或等於導引件244之開孔2442於第二方向X上的寬度L4。推鈕246之凸塊2462穿過本體242之滑槽2423與導引件244之開孔2442卡合,且推鈕246外露於本體242之外表面。由於導引件244之開孔2442的寬度L4略大於或等於推鈕246之凸塊2462的寬度L5,導引件244可與推鈕246相對於本體242固定。此外,由於本體242之滑槽2423的寬度L3大於推鈕246之凸塊2462的寬度L5,且容置區2421之寬度L1大於導引件244之寬度L2,因此當使用者於第二方向X上施加力量於推鈕246時,推鈕246可於第二方向X上沿著滑槽2423滑動,並進而帶動導引件244在容置區2421內沿第二方向X上滑動。The main body 242 includes a sliding groove 2423, and the sliding groove 2423 penetrates the main body 242 in the third direction Z. The guide 244 includes an opening 2442, and the position of the sliding slot 2423 corresponds to the position of the opening 2442. The guide 244 is slidably coupled to the slide groove 2423 of the body 242. The width L3 of the sliding groove 2423 in the second direction X is greater than the width L4 of the opening 2442 in the second direction X. The push button 246 includes a protrusion 2462, and a width L5 of the protrusion 2462 in the second direction X is slightly smaller than or equal to a width L4 of the opening 2442 of the guide member 244 in the second direction X. The projection 2462 of the push button 246 passes through the sliding slot 2423 of the main body 242 and engages with the opening 2442 of the guide 244, and the push button 246 is exposed on the outer surface of the main body 242. Since the width L4 of the opening 2442 of the guide 244 is slightly larger than or equal to the width L5 of the projection 2462 of the push button 246, the guide 244 can be fixed with the push button 246 relative to the body 242. In addition, since the width L3 of the sliding groove 2423 of the body 242 is larger than the width L5 of the projection 2462 of the push button 246, and the width L1 of the accommodating area 2421 is larger than the width L2 of the guide 244, when the user is in the second direction X When a force is applied to the push button 246, the push button 246 can slide along the sliding slot 2423 in the second direction X, and then drive the guide member 244 to slide in the second direction X in the accommodating area 2421.
本體242還包括容置孔2422,且與容置區2421連通。容置孔2422是沿第二方向X自本體242遠離容置區2421而凹陷的柱狀空間。導引件244還包括往第二方向X延伸的凸柱2443,其中凸柱2443本身係可容置於容置孔2422中。彈性件248是設置於容置孔2422與凸柱2443之間,並套設於凸柱2443上。當無外力推動推鈕246時,凸柱2443位在導引件244的可移動範圍內。當推鈕246受外力F作用並帶動導引件244於第二方向X上往靠近容置孔2422之一端移動之過程中,凸柱2443之前端先進入容置孔2422,接著彈性件248於碰觸到本體242後被壓縮,使導引件244於移動的反方向上受到彈性件248之彈性恢復力推擠。當外力F移除後,導引件244藉由彈性件248之彈性恢復力而滑動到原先的位置,也就是凸柱2443退出容置孔2422,且彈性件248之壓縮量也回復到無外力作用時之狀態。The body 242 further includes a receiving hole 2422 and communicates with the receiving area 2421. The accommodating hole 2422 is a columnar space recessed from the accommodating area 2421 away from the body 242 along the second direction X. The guide 244 further includes a protruding post 2443 extending in the second direction X, wherein the protruding post 2443 itself can be received in the receiving hole 2422. The elastic member 248 is disposed between the accommodating hole 2422 and the protruding post 2443 and is sleeved on the protruding post 2443. When the push button 246 is pushed without external force, the protrusion 2443 is located within the movable range of the guide 244. When the push button 246 is subjected to an external force F and drives the guide member 244 to move toward one end of the accommodation hole 2422 in the second direction X, the front end of the protruding post 2443 enters the accommodation hole 2422 first, and then the elastic member 248 is After being in contact with the body 242, it is compressed, so that the guide member 244 is pushed by the elastic restoring force of the elastic member 248 in the opposite direction of the movement. When the external force F is removed, the guide member 244 slides to the original position by the elastic restoring force of the elastic member 248, that is, the protrusion 2443 exits the accommodation hole 2422, and the compression amount of the elastic member 248 returns to no external force. The state when it works.
於第4圖之實施例中,解除裝置240朝向第一方向Y之一端為頂部,而解除裝置240於第一方向Y上與頂部相對之一端為底部。本體242包括凹槽2424,凹槽2424包括凸緣2425以及斜面2426,位在本體242之底部。導引件244包括卡合部2444,卡合部2444包括斜面2445,位在導引件244之頂部。以下將以兩組解除裝置間的組合作動描述本揭露之堆疊模組的解鎖機制。In the embodiment of FIG. 4, one end of the releasing device 240 facing the first direction Y is a top, and one end of the releasing device 240 opposite to the top in the first direction Y is a bottom. The body 242 includes a groove 2424. The groove 2424 includes a flange 2425 and a slope 2426. The groove 2424 is located at the bottom of the body 242. The guide 244 includes an engaging portion 2444, and the engaging portion 2444 includes an inclined surface 2445 located on the top of the guide 244. The unlocking mechanism of the stacking module disclosed in the present disclosure will be described below with a group cooperation between two sets of release devices.
第5A圖為根據本揭露一實施例之第一解除裝置240a與第二解除裝置240b處於鎖定狀態時面對模組之一側(由模組內向外觀之)的側視圖。第5B圖第5A圖之第一解除裝置240a與第二解除裝置240b背對模組之一側(由模組外向內觀之)的側視圖。為了清楚說明,第一解除裝置240a之第一本體242a於第5B圖中省略。於本實施例中,第一解除裝置240a與第二解除裝置240b皆具有如第4圖所描述之結構。第一解除裝置240a之第一導引件244a包括卡合部2444a,卡合部2444a包括第一斜面2445a,係位在靠近第二解除裝置240b之一側。第二解除裝置240b之第二本體242b包括凹槽2424b,凹槽包括凸緣2425b以及第二斜面2426b,第二斜面2426b位在第二本體242b靠近第一解除裝置240a之一側,且第一斜面2445a與第二斜面2426b平行。FIG. 5A is a side view of the first release device 240a and the second release device 240b facing one side of the module (from the inside to the outside of the module) when the first release device 240a and the second release device 240b are in a locked state according to an embodiment of the disclosure. 5B and 5A are a side view of the first release device 240a and the second release device 240b facing away from one side of the module (viewed from the outside to the inside of the module). For clarity, the first body 242a of the first release device 240a is omitted in FIG. 5B. In this embodiment, both the first release device 240a and the second release device 240b have a structure as described in FIG. The first guide 244a of the first releasing device 240a includes an engaging portion 2444a, and the engaging portion 2444a includes a first inclined surface 2445a, which is located near one side of the second releasing device 240b. The second body 242b of the second release device 240b includes a groove 2424b. The groove includes a flange 2425b and a second inclined surface 2426b. The second inclined surface 2426b is located on one side of the second body 242b near the first release device 240a. The inclined surface 2445a is parallel to the second inclined surface 2426b.
當堆疊模組處於鎖定狀態,且無外力推動推鈕246a時,卡合部2444a伸入凹槽2424b中並與所對應的凸緣2425b於第二方向X上卡合,且第一斜面2445a與第二斜面2426b彼此無接觸。此外,雖然圖中未繪示,位在第一解除裝置240a之底部的另一解除裝置之導引件也可透過對應的卡合部與第一解除裝置240a之第一本體242a的凸緣對應地卡合連接。而位在第二解除裝置240b之頂部的另一解除裝置之本體也可透過其凹槽的凸緣與第二解除裝置240b之第二導引件244b之卡合部對應地卡合連接。When the stacking module is in the locked state and there is no external force to push the push button 246a, the engaging portion 2444a extends into the groove 2424b and engages with the corresponding flange 2425b in the second direction X, and the first inclined surface 2445a and The second inclined surfaces 2426b are not in contact with each other. In addition, although not shown in the figure, a guide of another releasing device located at the bottom of the first releasing device 240a may also correspond to a flange of the first body 242a of the first releasing device 240a through a corresponding engaging portion. Ground snap connection. And the body of another releasing device located on the top of the second releasing device 240b can also be engaged and connected with the engaging portion of the second guide 244b of the second releasing device 240b through the flange of the groove.
第6A圖為第5A圖中之第一解除裝置240a的推鈕246a受外力F作用時位於靠近面對模組之一側(由模組內向外觀之)的側視圖。第6B圖為第6A圖之第一解除裝置240a與第二解除裝置240b位於背對模組之一側(由模組外向內觀之)的側視圖。為了清楚說明,第一解除裝置240a之第一本體242a於第6B圖中省略。當外力F於第二方向X(也就是外力F的方向)上推動推鈕246a時,堆疊模組由鎖定狀態進入解除狀態,第一導引件244a相對於第一本體242a沿第二方向X滑動,使第一解除裝置240a之卡合部2444a與所對應的第二解除裝置240b之凸緣2425b分離,且第一斜面2445a抵接於第二斜面2426b並產生水平分力FX以及垂直分力FY。因此,水平分力FX應當會使第一斜面2445a自外力F之方向推動第二斜面2426b。此時,如同前述,第一解除裝置240a對應的電子模組上的限位柱(見第1圖)可抵消解除過程中的水平分力FX,以避免對接腳造成損壞。垂直分力FY可使得第二解除裝置240b沿第一方向Y移動並與第一解除裝置240a分離。FIG. 6A is a side view of the push button 246a of the first release device 240a in FIG. 5A, which is located near one side facing the module (from the module inward appearance) when the external force F is applied. Fig. 6B is a side view of the first release device 240a and the second release device 240b of Fig. 6A located on one side facing away from the module (viewed from outside to inside of the module). For clarity, the first body 242a of the first release device 240a is omitted in FIG. 6B. When the external force F pushes the push button 246a in the second direction X (that is, the direction of the external force F), the stacking module enters the unlocked state from the locked state, and the first guide 244a is in the second direction X relative to the first body 242a Slide to separate the engaging portion 2444a of the first release device 240a from the flange 2425b of the corresponding second release device 240b, and the first inclined surface 2445a abuts against the second inclined surface 2426b and generates a horizontal component force FX and a vertical component force FY. Therefore, the horizontal component force FX should cause the first inclined surface 2445a to push the second inclined surface 2426b from the direction of the external force F. At this time, as mentioned above, the limiting post (see FIG. 1) on the electronic module corresponding to the first release device 240 a can offset the horizontal component force FX during the release process to avoid damage to the pin. The vertical component force FY can cause the second release device 240b to move in the first direction Y and be separated from the first release device 240a.
此外,如第6B圖所示,第二解除裝置240b之第二本體242b還包括自頂部往第一方向Y凸出的凸出部2427b,以及自底部往第一方向Y之反向凸出的兩個凸出部2428b。同樣地,第一解除裝置240a之第一本體242a也包括自頂部往第一方向Y凸出的凸出部,以及自底部往第一方向Y之反向凸出的凸出部2428a。第二解除裝置240b之第二本體242b還包括自底部往第一方向Y凹陷的凹陷部2429b。當堆疊模組位於鎖定狀態時,第二解除裝置240b之凹陷部2429b可與第一解除裝置240a之凸出部對應卡合。In addition, as shown in FIG. 6B, the second body 242b of the second release device 240b further includes a protruding portion 2427b protruding from the top toward the first direction Y, and a protruding portion protruding from the bottom toward the first direction Y. Two projections 2428b. Similarly, the first body 242a of the first releasing device 240a also includes a protruding portion protruding from the top toward the first direction Y, and a protruding portion 2428a protruding from the bottom toward the opposite direction Y. The second body 242b of the second release device 240b further includes a recessed portion 2429b recessed from the bottom toward the first direction Y. When the stack module is in the locked state, the recessed portion 2429b of the second release device 240b can be correspondingly engaged with the projected portion of the first release device 240a.
於本實施例中,凸出部2427b以及凸出部2428b之兩側皆與第二方向X形成一鈍角。也就是說,凸出部2427b以及凸出部2428b為梯形結構,但其並非用以限制本揭露。In this embodiment, both sides of the protruding portion 2427b and the protruding portion 2428b form an obtuse angle with the second direction X. That is, the protruding portions 2427b and the protruding portions 2428b are trapezoidal structures, but they are not intended to limit the present disclosure.
如第6A圖所示,第一解除裝置240a之第一本體242a也包括自頂部往第一方向Y之反向凹陷的凹陷部2430a,可與第二解除裝置240b之凸出部2428b對應地於第一方向Y上卡合。第二解除裝置240b之第二本體242b也包括自頂部往第一方向Y之反向凹陷的凹陷部2430b,可與位在第二解除裝置240b之頂部的另一解除裝置對應的凸出部卡合。As shown in FIG. 6A, the first body 242a of the first release device 240a also includes a recessed portion 2430a that is recessed in the reverse direction from the top to the first direction Y, which may correspond to the convex portion 2428b of the second release device 240b. Engage in the first direction Y. The second body 242b of the second release device 240b also includes a recessed portion 2430b which is recessed in the reverse direction from the top to the first direction Y, and a protruding portion card corresponding to another release device located on the top of the second release device 240b. Together.
如此一來,上述卡合部與凹陷部之結構設計,可使解除裝置間易於對位連接,避免造成模組間於組裝與解除時額外需克服的作用力。In this way, the structural design of the above-mentioned engaging portion and the recessed portion can facilitate the alignment connection between the releasing devices, and avoid causing an additional force to be overcome between the modules during assembly and disassembly.
第7圖至第10圖為根據本揭露一實施例之堆疊模組200於不同解除階段時之側視圖。於本實施例中,第5A圖至第6B圖中的第一解除裝置240a及第二解除裝置240b是分別設置於第一電子模組210與第二電子模組220上。請同時參照第5A圖、第5B圖與第7圖,堆疊模組200之第一電子模組210、第二電子模組220以及第三電子模組230皆組裝在一起時,第一解除裝置240a之第一導引件244a之卡合部2444a伸入第二解除裝置240b之第二本體242b之凹槽2424b中並與所對應的凸緣2425b卡合,且第一解除裝置240a之第一導引件244a之第一斜面2445a與第二解除裝置240b之第二本體242b之第二斜面2426b無接觸。此時,第二電子模組220上的定位孔227a、227b分別套設於第一電子模組210上的限位柱213a、213b,且第三電子模組230上的定位孔237a、237b分別套設於第二電子模組220上的限位柱223a、223b。7 to 10 are side views of the stacking module 200 according to an embodiment of the present disclosure at different release stages. In this embodiment, the first release device 240 a and the second release device 240 b in FIGS. 5A to 6B are respectively disposed on the first electronic module 210 and the second electronic module 220. Please refer to FIG. 5A, FIG. 5B, and FIG. 7 at the same time. When the first electronic module 210, the second electronic module 220, and the third electronic module 230 of the stacked module 200 are assembled together, the first release device The engaging portion 2444a of the first guide 244a of 240a extends into the recess 2424b of the second body 242b of the second release device 240b and engages with the corresponding flange 2425b, and the first of the first release device 240a The first inclined surface 2445a of the guide 244a is not in contact with the second inclined surface 2426b of the second body 242b of the second release device 240b. At this time, the positioning holes 227a and 227b on the second electronic module 220 are respectively set on the limiting posts 213a and 213b on the first electronic module 210, and the positioning holes 237a and 237b on the third electronic module 230 are respectively The limiting posts 223 a and 223 b are sleeved on the second electronic module 220.
請同時參照第4圖與第8圖,當外力F施加於第一解除裝置240a之推鈕246a時,推鈕246a帶動導引件244於本體242之容置區2421內沿外力F之方向滑動。此外,導引件244之凸柱2443部分伸入本體242之容置孔2422內,而彈性件248於接觸到本體242後開始被壓縮。Please refer to FIG. 4 and FIG. 8 at the same time, when the external force F is applied to the push button 246a of the first release device 240a, the push button 246a drives the guide 244 to slide in the direction of the external force F in the accommodation area 2421 of the body 242 . In addition, a portion of the protrusion 2443 of the guide member 244 extends into the accommodation hole 2422 of the main body 242, and the elastic member 248 begins to be compressed after contacting the main body 242.
請同時參照第6A圖、第6B圖與第8圖,第一解除裝置240a之第一導引件244a之卡合部2444a於外力F之方向上與所對應的第二解除裝置240b之第二本體242b之凸緣2425b分離,而第一解除裝置240a之第一導引件244a之第一斜面2445a與所對應的第二解除裝置240b之第二本體242b之第二斜面2426b抵接,但此時第二電子模組220尚未與第一電子模組210分離。第二電子模組220上的定位孔227a、227b仍分別套設於第一電子模組210上的限位柱213a、213b,且第三電子模組230上的定位孔237a、237b仍分別套設於第二電子模組220上的限位柱223a、223b。Please refer to FIG. 6A, FIG. 6B, and FIG. 8 at the same time. The engaging portion 2444a of the first guide 244a of the first release device 240a is in the direction of the external force F with the second of the corresponding second release device 240b. The flange 2425b of the body 242b is separated, and the first inclined surface 2445a of the first guide 244a of the first release device 240a abuts the second inclined surface 2426b of the second body 242b of the corresponding second release device 240b, but this At this time, the second electronic module 220 has not been separated from the first electronic module 210. The positioning holes 227a and 227b on the second electronic module 220 are still fitted on the limiting posts 213a and 213b on the first electronic module 210, respectively, and the positioning holes 237a and 237b on the third electronic module 230 are still fitted respectively. The limiting posts 223 a and 223 b provided on the second electronic module 220.
請同時參照第4圖與第9圖,當外力F持續推動推鈕246a時,導引件244之凸柱2443更伸入本體242之容置孔2422內,而彈性件248持續地被壓縮並對導引件244施加反向的彈性恢復力。Please refer to FIG. 4 and FIG. 9 at the same time, when the external force F continues to push the push button 246a, the protrusion 2443 of the guide member 244 extends into the accommodation hole 2422 of the body 242, and the elastic member 248 is continuously compressed and A reverse elastic restoring force is applied to the guide 244.
請同時參照第6A圖、第6B圖與第9圖,第一解除裝置240a之第一導引件244a之第一斜面2445a與所對應的第二解除裝置240b之第二本體242b之第二斜面2426b間產生水平分力FX與垂直分力FY。此外,第二電子模組220與第二解除裝置240b受到垂直分力FY作用開始往第一方向Y移動。第一電子模組210上的限位柱213a、213b與第二電子模組220之定位孔227a、227b間隨著第一電子模組210與第二電子模組220間的相對滑動而開始於第一方向Y上彼此遠離,但第一電子模組210上的限位柱213a、213b之末端仍維持套設於第二電子模組220之定位孔227a、227b內。因此,從第8圖到第9圖所示之過程中,限位柱213a、213b可持續地抵消水平分力FX並進而避免第一電子模組210之接腳1142(請參考第2圖及第3圖)受到損壞。Please refer to FIG. 6A, FIG. 6B, and FIG. 9 at the same time, the first inclined surface 2445a of the first guide 244a of the first release device 240a and the second inclined surface of the second body 242b of the corresponding second release device 240b A horizontal component force FX and a vertical component force FY are generated between 2426b. In addition, the second electronic module 220 and the second release device 240b receive the vertical component force FY and start to move in the first direction Y. The positioning posts 213a, 213b on the first electronic module 210 and the positioning holes 227a, 227b of the second electronic module 220 start with the relative sliding movement between the first electronic module 210 and the second electronic module 220. The first direction Y is far from each other, but the ends of the limiting posts 213 a and 213 b on the first electronic module 210 are still sleeved in the positioning holes 227 a and 227 b of the second electronic module 220. Therefore, from the process shown in FIG. 8 to FIG. 9, the limit posts 213 a and 213 b can continuously offset the horizontal component force FX and thus avoid the pin 1142 of the first electronic module 210 (please refer to FIG. 2 and (Figure 3) Damaged.
此外,同時參照第2圖及第10圖可看出,限位柱213a、213b之高度H2大於第一解除裝置240a之凸出部的高度H1,也大於接腳之高度H3,第二電子模組220只能沿第一方向Y相對於第一電子模組210移動,第二電子模組220之插槽區之插槽與所對應的第一電子模組210之接腳區之接腳彼此會先分離,最後才是整個第二電子模組220與第一電子模組210彼此完全分離。如此一來,此結構設計,可確保第二電子模組220自第一電子模組210解除的過程中,第二方向X上的分力皆可確實地被抵消,進而避免第一電子模組210上之接腳於解除過程中損壞。In addition, referring to FIG. 2 and FIG. 10 at the same time, it can be seen that the height H2 of the limiting posts 213a, 213b is greater than the height H1 of the protruding portion of the first release device 240a, and also greater than the height H3 of the pin. The group 220 can only move relative to the first electronic module 210 in the first direction Y, and the pins of the slot area of the second electronic module 220 and the pins of the corresponding pin area of the first electronic module 210 are relative to each other. First, the second electronic module 220 and the first electronic module 210 are completely separated from each other. In this way, this structural design can ensure that during the process of disengaging the second electronic module 220 from the first electronic module 210, the component forces in the second direction X can be positively cancelled, thereby avoiding the first electronic module The pins on 210 were damaged during lifting.
如第10圖所示,當第一電子模組210之限位柱213a、213b完全自第二電子模組220之定位孔227a、227b脫離後,即完成將第二電子模組220自第一電子模組210解除之過程。請同時參照第4圖,當外力F移除後,彈性件248因受到壓縮而產生對導引件244施加的反向彈性恢復力,可使與導引件244連接的推鈕246a回到如第7圖所示之位置。As shown in FIG. 10, when the limiting posts 213a and 213b of the first electronic module 210 completely disengage from the positioning holes 227a and 227b of the second electronic module 220, the second electronic module 220 is completed from the first The electronic module 210 is released. Please refer to FIG. 4 at the same time. After the external force F is removed, the elastic member 248 is compressed to generate a reverse elastic restoring force on the guide member 244, so that the push button 246a connected to the guide member 244 can return to Figure 7 shows the position.
綜上所述,在第一電子模組與第二電子模組從連接到分離的過程中,第二電子模組之定位孔仍滑動地套設於第一電子模組之限位柱,並沿著第一方向滑動。因此,可限制第二電子模組與第一電子模組分離時在第二方向上的移動,進而避免第一電子模組上之接腳於解除過程中損壞。In summary, during the process of connecting and separating the first electronic module and the second electronic module, the positioning hole of the second electronic module is still slidably fitted on the limiting post of the first electronic module, and Slide in the first direction. Therefore, the second electronic module can be restricted from moving in the second direction when it is separated from the first electronic module, thereby preventing the pins on the first electronic module from being damaged during the lifting process.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be determined by the scope of the attached patent application.
100、200‧‧‧堆疊模組100, 200‧‧‧ stacked modules
110、210‧‧‧第一電子模組 110, 210‧‧‧The first electronic module
120、220‧‧‧第二電子模組 120, 220‧‧‧Second electronic module
130、230‧‧‧第三電子模組 130, 230‧‧‧Third Electronic Module
111a、111b、121a、121b‧‧‧側壁 111a, 111b, 121a, 121b ‧‧‧ side walls
112、122‧‧‧頂板 112, 122‧‧‧ Top plate
1122、1222‧‧‧頂表面 1122, 1222‧‧‧ Top surface
1124、1224‧‧‧底表面 1124, 1224‧‧‧ bottom surface
113a、113b、123a、123b、213a、213b、223a、223b‧‧‧限位柱 113a, 113b, 123a, 123b, 213a, 213b, 223a, 223b
114、124‧‧‧接腳區 114, 124‧‧‧pin area
1142、1242‧‧‧接腳 1142, 1242‧‧‧ pins
115、125‧‧‧插槽區 115, 125‧‧‧slot area
1152、1252‧‧‧插槽 1152, 1252‧‧‧ slots
116、126‧‧‧固定結構 116, 126‧‧‧ fixed structure
117a、117b、127a、127b、227a、227b、237a、237b‧‧‧定位孔 117a, 117b, 127a, 127b, 227a, 227b, 237a, 237b
140a、140c、240a‧‧‧第一解除裝置 140a, 140c, 240a ‧‧‧ First release device
140b、140d、240b‧‧‧第二解除裝置 140b, 140d, 240b‧‧‧Second lifting device
240‧‧‧解除裝置 240‧‧‧Unlock device
242‧‧‧本體 242‧‧‧ Ontology
242a‧‧‧第一本體 242a‧‧‧First Body
242b‧‧‧第二本體 242b‧‧‧Second Body
2421‧‧‧容置區 2421‧‧‧accommodation area
2422‧‧‧容置孔 2422‧‧‧Receiving hole
2423‧‧‧滑槽 2423‧‧‧Chute
2424、2424b‧‧‧凹槽 2424, 2424b ‧‧‧ groove
2425、2425b‧‧‧凸緣 2425, 2425b‧‧‧ flange
2426‧‧‧斜面 2426‧‧‧ bevel
2426b‧‧‧第二斜面 2426b‧‧‧Second bevel
2427b、2428a、2428b‧‧‧凸出部 2427b, 2428a, 2428b ‧‧‧ protrusions
2429b、2430a、2430b‧‧‧凹陷部 2429b, 2430a, 2430b ‧‧‧ recess
244‧‧‧導引件 244‧‧‧Guide
244a‧‧‧第一導引件 244a‧‧‧First guide
244b‧‧‧第二導引件 244b‧‧‧Second Guide
2442‧‧‧開孔 2442‧‧‧Opening
2443‧‧‧凸柱 2443‧‧‧ convex post
2444、2444a‧‧‧卡合部 2444, 2444a‧‧‧ Engagement Department
2445‧‧‧斜面 2445‧‧‧ bevel
2445a‧‧‧第一斜面 2445a‧‧‧First slope
246、246a‧‧‧推鈕 246, 246a‧‧‧Push button
2462‧‧‧凸塊 2462‧‧‧ bump
248‧‧‧彈性件 248‧‧‧Elastic piece
X‧‧‧第二方向 X‧‧‧ second direction
Y‧‧‧第一方向 Y‧‧‧ first direction
Z‧‧‧第三方向 Z‧‧‧ Third direction
F‧‧‧外力 F‧‧‧ external force
FX‧‧‧水平分力 FX‧‧‧horizontal component
FY‧‧‧垂直分力 FY‧‧‧Vertical Force
H1、H2、H3‧‧‧高度 H1, H2, H3‧‧‧‧ height
L1、L2、L3、L4、L5‧‧‧寬度 L1, L2, L3, L4, L5‧‧‧Width
第1圖為根據本揭露一實施例之堆疊模組處於鎖定狀態時的立體圖。 第2圖為第1圖之堆疊模組於一視角的拆解圖。 第3圖為第1圖之堆疊模組於另一視角的拆解圖。 第4圖為根據本揭露一實施例之解除裝置之爆炸圖。 第5A圖為根據本揭露一實施例之第一解除裝置與第二解除裝置處於鎖定狀態時面對模組之一(由模組內向外觀之)的側視圖。 第5B圖為第5A圖之第一解除裝置與第二解除裝置背對模組之一側(由模組外向內觀之)的側視圖。 第6A圖為第5A圖中之第一解除裝置的推鈕受外力F作用時面對模組之一側(由模組內向外觀之)的側視圖。 第6B圖為第6A圖之第一解除裝置與第二解除裝置背對模組之一側(由模組外向內觀之)的側視圖。 第7圖至第10圖為根據本揭露一實施例之堆疊模組於不同解除階段時之側視圖。FIG. 1 is a perspective view of a stacked module in a locked state according to an embodiment of the disclosure. Figure 2 is an exploded view of the stacked module of Figure 1 from a perspective. Figure 3 is a disassembled view of the stacked module of Figure 1 from another perspective. FIG. 4 is an exploded view of a release device according to an embodiment of the disclosure. FIG. 5A is a side view of one of the modules (from the module inward appearance) when the first release device and the second release device are in a locked state according to an embodiment of the disclosure. FIG. 5B is a side view of the first release device and the second release device of FIG. 5A facing away from one side of the module (viewed from outside to inside of the module). FIG. 6A is a side view of the push button of the first release device in FIG. 5A facing one side of the module (from the module inward to the outward appearance) when an external force F is applied. Fig. 6B is a side view of the first release device and the second release device of Fig. 6A facing away from one side of the module (viewed from outside to inside of the module). 7 to 10 are side views of a stacked module according to an embodiment of the present disclosure at different release stages.
Claims (10)
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070119793A1 (en) * | 2005-11-25 | 2007-05-31 | Hon Hai Precision Industry Co., Ltd. | Mounting apparatus for data storage devices |
TW200908856A (en) * | 2007-08-01 | 2009-02-16 | Inventec Corp | Circuit board guiding and securing mechanism |
CN202840911U (en) * | 2012-08-30 | 2013-03-27 | 联昌电子企业股份有限公司 | Thin-type converter device |
TWM530511U (en) * | 2016-05-31 | 2016-10-11 | Chroma Ate Inc | Circuit board holder |
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2018
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070119793A1 (en) * | 2005-11-25 | 2007-05-31 | Hon Hai Precision Industry Co., Ltd. | Mounting apparatus for data storage devices |
TW200908856A (en) * | 2007-08-01 | 2009-02-16 | Inventec Corp | Circuit board guiding and securing mechanism |
CN202840911U (en) * | 2012-08-30 | 2013-03-27 | 联昌电子企业股份有限公司 | Thin-type converter device |
TWM530511U (en) * | 2016-05-31 | 2016-10-11 | Chroma Ate Inc | Circuit board holder |
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