TWI673639B - A panel module structure and a manufacturing method thereof - Google Patents

Abstract

The invention provides a panel module, which can improve the curing rate of the gap filling glue of the panel module; and a method for manufacturing the panel module. The panel includes a panel module structure including a substrate; a frame disposed on one side of the substrate; a panel disposed on the substrate; a gap formed between the substrate, the frame, and the panel, It is used for filling a gap filling glue; and a reflective layer is disposed on the substrate of the gap. The manufacturing method includes the steps of: covering a reflective layer on a substrate before filling a gap filling glue in the gap, wherein the surface of the reflective layer has protrusions. By using the reflective layer, a UV light source is reflected to other areas of the gap-fill glue, and the reflection path of the UV light in the gap-fill glue is changed, thereby improving the curing rate of the gap-fill glue.

Description

Panel module structure and manufacturing method thereof

The invention relates to the field of a method for improving the curing rate of a photosensitive adhesive, in particular to the field of a method for improving the curing rate of a photosensitive module as a filler for assembling a panel module.

There is a structure of a flexible printed circuit in a cover glass sensor (CGS). The structure of the flexible board will cause the uneven distribution of the weight of the flexible board and increase the instability of the overall structure. The gap between the soft board and the frame is generally filled with a gap-filling glue to strengthen the strength of the soft board joining to the overall structure to achieve a strengthening effect.

The disadvantage of the current gap-filling technology is that after the gap-filling colloid is injected into the gap and irradiated with the UV light source, the light source irradiates the gap-filling colloid in a direction perpendicular to the surface of the substrate, so that some areas of the colloid will be covered by soft boards or other structures It is impossible to be irradiated by UV light, resulting in incomplete curing of the gap-filled colloid (curing rate << 100%). This will cause the structural strength of the soft board to be insufficient on the entire CGS, and a small force will cause the bonding pad to peel or delaminate.

Therefore, the present invention provides a method and a structure that can improve the curing rate of the gap-filling adhesive in areas where UV light cannot be directly irradiated.

In view of this, an object of the present invention is to improve the curing rate of a photosensitive adhesive as a gap filler. To achieve the above object, the present invention covers a reflective layer on a gap substrate. When UV light enters the gap-filling colloid and encounters the reflective layer, the light will advance along the reflection path in the gap-filling colloid, thus increasing the amount of light entering the bottom of the flexible board (underneath), thereby improving the curing rate of the gap-filling colloid .

To achieve the above object, the present invention provides a panel module structure including a substrate; a frame disposed on one side of the substrate; a panel disposed on the substrate; the substrate, the frame and the panel formed between A gap for filling a gap-filling glue; a soft board disposed on the panel, and the soft board protruding from the induction layer and partially covering the gap; and a reflective layer disposed on the gap On the substrate.

The invention further provides a method for manufacturing a panel module structure, which can improve the curing rate of the gap-fill adhesive. The method includes the steps of: providing a substrate, a frame, and a panel, and forming a gap between the substrate, the frame, and the panel; A reflective layer is disposed on the substrate of the gap; a soft board is disposed on the panel, and the soft board partially covers the gap; and a gap filling glue is filled in the gap.

The surface of the reflective layer preferably has a plurality of protrusions.

In order to achieve the above-mentioned object and effect, the technical means and structure adopted in the present invention are described in detail below with reference to the preferred embodiments of the present invention. The features and functions are as follows. It is fully understood, but it must be noted that these contents This constitutes the limitation of the present invention.

Please refer to FIG. 1 for the main structure of the CGS. It mainly includes a frame 1, a substrate 2, a panel 3, and a flexible printed circuit 4. The panel 3 may further include a sensing layer 31 and a bonding agent 32. The sensing layer 31 is attached to the substrate 2 through the bonding agent 32. The flexible board 4 is bonded to the panel 3 through a bonding pad 5, and a solid glue 6 is provided at the end of the sensing layer 31 to fix and strengthen the angle of the flexible board 4.

Please refer to the cross-sectional schematic diagram of FIG. 2. A gap-filling area (the area enclosed by the dotted line in FIG. 2) under the flexible board 4 is an area that cannot be directly irradiated by UV light. The gap-filling colloid 7 is generally a UV-curable type. Photocurable colloids are made by adding a photoinitiator (or photosensitizer) to the colloid. After the colloid absorbs ultraviolet (UV) light, it generates active free radicals or ionic groups, which then initiates polymerization, cross-linking, and subsequent reactions. Converted to solid.

Please refer to FIG. 3. FIG. 3A is an enlarged schematic side view of the gap filling glue 7 and various positions, T: top; B: bottom; U: underneath. FIG. 3B is a box diagram of the curing rate of the gap-filling glue at different positions. As can be seen from FIG. 3B, the curing rate of the gap-filling glue at the position of U is significantly lower than that of the positions of B and T.

Therefore, the present invention provides a method for manufacturing a panel structure. The panel manufactured by the method can improve the curing rate of the photosensitive adhesive used in the structure, especially the position of U shown in FIG. 3, thereby the overall structure will be more stable. . The method includes: covering a gap on a substrate of a panel structure with a reflective layer; and adding a gap-filling glue to the gap. This embodiment can refer to FIG. 4 and FIG. 5. Referring first to FIG. 4, first, a substrate 2 is provided; a frame 1 is disposed on one side of the substrate 2; and a panel 3 is disposed above the substrate 2. A U-shaped gap is formed between the substrate 2, the frame 1 and the panel 3. A reflective layer 8 is then disposed above the substrate 2 in the gap. The reflective layer 8 can be covered on the substrate surface by means of etching, deposition, sputtering, or the like. The panel 3 includes a sensing layer 31 and a bonding agent 32, and the sensing layer 31 and the substrate 2 are bonded by the bonding agent 32. The laminating method can be oral or full-plane lamination. It is preferably a full-plane lamination. The bonding agent 32 is preferably an optically clear adhesive (Optically Clear Adhesive, OCA).

The material of the reflective layer 8 may be a metal material, a surface with metallic luster, or a surface with high reflectance of UV light (light absorption <10%), such as a metal such as aluminum, zinc, magnesium, or an oxide film thereof. The oxide film has a metallic luster.

Referring to FIG. 5, after the reflective layer 8 is disposed on the substrate 2 in the gap, a soft board 4 is attached on the panel 3, the soft board 4 protrudes from the panel 3 and partially covers the gap. The flexible board 4 can be connected to the panel 3 with a fixing glue 6 for fixing the angle of the flexible board 4. Then, a gap filling glue 7 is filled in the gap. The gap-filling adhesive 7 is a photosensitive adhesive, so it will be cured after being irradiated with ultraviolet light. At this time, the area covered by the gap filler 7 by the soft board 4 (the shaded area is the area enclosed by the dashed line in FIG. 2, that is, the U area in FIG. 3A) cannot receive sufficient ultraviolet light, so Incomplete curing. Therefore, the reflective layer 8 can reflect the ultraviolet light to the U region of the gap-filling colloid 7 under the flexible board 4, so that the photosensitive adhesive in this region can also achieve a good curing effect.

The gap-fill adhesive 7 is a photosensitive adhesive, and its prepolymer includes, but is not limited to, polyacrylate, epoxy acrylate, polyurethane acrylate, unsaturated polyester, or polyolefin / thiol. In a preferred embodiment, the prepolymer of the gap-filling colloid is polyacrylate.

In addition to the above-mentioned covering method, the reflective layer 8 can also be prepared separately and then attached to a polyethylene terephthalate film (PET or PETE) by tape and reel, using the adsorption function The corresponding pressing block is used to adsorb the reflective layer, and then the adhesive surface of the reflective layer is laminated on the substrate.

In another embodiment, the back surface of the reflective layer 8 can be provided with a layer of adhesive, which can be directly attached to the substrate 2. Preferably, the glue is Pressure Sensitive Adhesive (PSA).

Please refer to Figure 5. In one embodiment, the panel structure of the present invention includes: a substrate 2; a frame 1 disposed on one side of the substrate 2; a panel 3 disposed on the substrate 2, the substrate 2, and the frame 1 And the panel 3 forms a concave gap for filling a gap-filling adhesive 7; and a reflective layer 8 is disposed on the substrate 2 of the gap.

The reflective layer 8 can be provided on a material such as glass, metal surface, silicon substrate, PET, polyimide (PI), and the like.

The panel structure further includes a flexible board 4 disposed on the panel 3, and the flexible board 4 protrudes from the panel 3 and partially covers the gap. The panel further includes a sensing layer 31, which is attached to the flexible board 4 through a bonding pad 5.

The gap-fill adhesive 7 is a photosensitive adhesive, and its prepolymer includes, but is not limited to, polyacrylate, epoxy acrylate, polyurethane acrylate, unsaturated polyester, or polyolefin / thiol. In a preferred embodiment, the prepolymer of the gap-filling colloid is polyacrylate.

In one embodiment, the reflective layer 8 is planar.

In another preferred embodiment, the reflective layer 8 has a rough surface and covers the substrate 2 uniformly. After the reflective layer 8 covers the substrate 2, the flexible board 4 and the gap-filling adhesive 7 are affixed. At this time, a gap light source 7 is irradiated with a UV light source to cure it. The UV light encounters the rough surface of the reflective layer 8 and thereby changes the angle of the light exit angle to increase the chance of the UV light reflecting to the Underneath region in the gap-filling adhesive 7, thereby improving the curing rate of the gap-filling adhesive.

The material of the reflective layer 8 can be a metal material, a surface with metallic luster, or a highly reflective surface of UV light. The light absorption of this material is less than 10%, that is, the material can reflect at least 90% of light, such as aluminum, zinc, magnesium and other metal films, or its oxide film, which has a metallic luster. A thin film of aluminum and / or its oxide is preferred. The commonly used material for high light reflectivity is aluminum, which can be highly reflective from purple light to infrared light.

In one embodiment, the surface of the reflective layer 8 has protrusions, and the protrusions may be, for example, triangular protrusions, circular protrusions, or other irregular shaped protrusions.

As shown in FIG. 5, preferably, the protrusion is a triangular tooth protrusion. The angle of the top inner angle 81 of the triangular tooth protrusion is preferably 30 degrees or more and less than 180 degrees. It is preferably 60-150 degrees. The angle of the top inner angle 81 may be 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170 degrees. More preferably, it is 90 degrees.

FIG. 6 shows an example in which the protrusions of the reflective layer 8 are triangular protrusions. As shown in FIG. 6A, in an embodiment, the left and right bottom angles of the triangular tooth protrusion are 45-degree angles, respectively. As shown in FIG. 6B, in another embodiment, the angles of the left and right bottom angles of the triangular tooth protrusion are 30 degrees and 60 degrees, respectively. This design can greatly reflect the incident UV light to the area of the underneath, and increase the reach of the light source in the gap-filling glue.

In another embodiment, different internal angles may exist at the top corners of the triangular tooth protrusions at the same time, so that the reflective layer has multiple angles of UV light reflection paths.

In one embodiment, the size of the reflective layer is 0.4 x 20 mm (tolerance ± 0.1 mm). The length of the teeth can be from 0.05 to 0.1 mm.

The angle design is mainly to allow the UV light to reach the area of the underneath after being reflected by the reflective layer, so the above angle is not used for limitation, but is adjusted according to actual needs.

In another embodiment, the reflective layer may be disposed on the frame, and the reflective layer has protrusions, which can reflect incident light to the area of the underneath.

In summary, the panel structure provided by the present invention can increase the curing rate of the gap filling adhesive; and the manufacturing method of the panel structure provided by the present invention can also effectively make the gap filling photosensitive adhesive of the panel comprehensive in different areas. The ground is irradiated with UV light, and the curing rate of the photosensitive adhesive is improved, so that the overall structure is more stable. In the present invention, a reflective layer is provided on a substrate, and a light source is reflected to other areas of the gap-filling glue to change the reflection path of the UV light in the gap-filling glue, thereby improving the curing rate of the gap-filling glue.

After the above detailed description, it has been fully shown that the present invention has a progressive nature for implementation, and it is a new creation never seen before, which fully meets the requirements of the invention patent, and has filed an application according to law. However, the above is only a preferred embodiment of the present invention. When it cannot be used to limit the scope of the implementation of the invention, that is, equal changes and modifications made in accordance with the scope of the patent of the invention, all should fall within the scope of the invention patent .

1‧‧‧ border

2‧‧‧ substrate

3‧‧‧ Panel

31‧‧‧ induction layer

32‧‧‧ Sticker

4‧‧‧ soft board

5‧‧‧Joint pad

6‧‧‧Fixing glue

7‧‧‧ Gap Filler

8‧‧‧Reflective layer

81‧‧‧Top inner corner

Fig. 1 is a schematic cross-sectional view of the structure of the present invention; Fig. 2 is a schematic diagram of the gap-filling glue exposed to UV light and areas that cannot be illuminated; Enlarged schematic diagram of the side of the gap-filling glue and the indication of each position; 3B is a box diagram of the curing rate of each position; Figure 4 shows a schematic diagram of the position of the reflective layer of the present invention; The reflection path of the reflection layer; Figure 6 shows a schematic view of the mode of action of the reflection layer; 6A is an embodiment of a tooth-like protrusion; 6B is another embodiment of a tooth-like protrusion.

Claims (10)

A panel module structure includes a substrate, a frame disposed on one side of the substrate, and a panel disposed on the substrate. A gap is formed between the substrate, the frame and the panel to fill a gap. A gap-filling glue; and a reflective layer disposed on the substrate of the gap. For example, the structure of the first patent application scope further includes a flexible printed circuit (Flexible Printed Circuit) disposed on the panel, and the panel includes a sensing layer, which is connected to the flexible board. For example, the structure of the first patent application scope, wherein the absorbance of the reflective layer material is <10%. For example, the structure of the first scope of the patent application, wherein the material of the reflective layer is aluminum, zinc, magnesium, or an oxide film thereof. For example, the structure of the first patent application range, wherein the reflective layer has triangular tooth protrusions. For example, the structure of claim 5 of the patent scope, wherein the angle of the inner angle of the top of the triangular tooth protrusion is 30 degrees or more and less than 180 degrees. A method for manufacturing a panel module structure includes the steps of: i. Providing a substrate; a frame disposed on a side of the substrate; and a panel layer disposed above the substrate, the substrate, the frame, and the panel layer A gap is formed between the two; ii. A reflective layer is disposed on the substrate of the gap; and iii. A flexible printed circuit (Flexible Printed Circuit) is disposed on the panel layer, the flexible plate protrudes from the panel layer and partially Cover the gap. For example, the method of claim 7 in the patent application range, wherein the material of the reflective layer is aluminum, zinc, magnesium, or an oxide film thereof. The method according to item 7 of the patent application, wherein the surface of the reflective layer has protrusions. For example, the method of claim 7 in the patent scope, wherein the setting method of step ii includes: etching, deposition, sputtering, or attaching.