TWI671682B - High temperature RFID tag - Google Patents

Abstract

A high-temperature resistant RFID tag includes: a carrier including a groove, the groove including a plurality of electrode contacts, and a plurality of antennas are arranged on the surface of the carrier, and the plurality of electrode contacts are connected to the plurality of antennas; an RFID A die is disposed in the groove, and the RFID die is connected to a plurality of electrode contacts through a plurality of connecting lines; a cover body covering the groove; and a protective structure layer covering the carrier, the plurality of antennas, and Cover.

Description

High temperature RFID tag

The present invention relates to a radio frequency identification (RFID) tag, and particularly to an RFID tag capable of withstanding extremely high temperatures of, for example, 300 ° C or more, or even 1000 ° C.

In the conventional technology, the antennas of traditional RFID tag designs are usually manufactured by printing or etching on paper, plastic film, circuit board (PCB) or ceramic carrier (Alumina). It is placed on the carrier of the antenna by using flip chip technology. Another method is to first package the RFID die into a general IC packaging structure, such as SOT or QFN, to protect the IC, and then use Surface Mount Technology (SMT) to place the RFID components on the antenna carrier. In this way, a conventional structured RFID tag can be completed.

However, the conventional application environment of the conventional RFID tag structure is generally a room temperature environment such as a storage environment, a semiconductor manufacturing line environment, etc. If the conventional RFID tag structure is to be applied to a high temperature environment, the conventional RFID tag structure is used. Structures can fail due to high temperatures and can even be burned.

On the other hand, Industry 4.0 is the goal of industries around the world. It aims to integrate existing industry-related technologies, sales and product experience, and to build smart factories with adaptability, resource efficiency and human factors engineering. Therefore, product identification is required in each production process and step in the factory to ensure analysis of production quality and production efficiency, and to improve the manufacturing process to increase efficiency, reduce costs, and increase benefits, but many products often need to be at high temperatures in the production process. Environment. Therefore, the RFID tag representing the identity of the product must also be able to survive in an ultra-high temperature (> 300 degrees C) environment.

Based on the above reasons, how to provide a high temperature resistant RFID device, so that industrial production that needs to work in a high temperature environment can also use RFID sensing technology to achieve intelligent inductive reading behavior is a problem to be solved.

To achieve the foregoing object, the present invention provides a high-temperature resistant RFID tag, including: a carrier including a groove, the groove including a plurality of electrode contacts, and a plurality of antennas on the surface of the carrier, and a plurality of electrode contacts A point is connected to a plurality of antennas; an RFID chip is arranged in the groove, and the RFID chip is connected to a plurality of electrode contacts through a plurality of connecting lines; a cover body is covered on the groove; and a protective structure Layer, covering the carrier, the plurality of antennas and the cover.

Preferably, the RFID die is in a bare state, and the RFID die is disposed in the groove by an adhesive layer.

Preferably, the adhesion layer is a eutectic alloy.

Preferably, the eutectic alloy is one of a gold / silicon alloy or a gold / germanium alloy.

Preferably, the protective structure layer includes an external thermal insulation layer and an internal thermal insulation layer. The external thermal insulation layer has a first thickness and the internal thermal insulation layer has a second thickness.

Preferably, the outer heat-insulating layer and the inner heat-insulating layer are liquid coatings. After the liquid coating covers the carrier, the plurality of antennas, and the cover body, it will cure and form a protective structure layer.

Preferably, the cover and the groove are hermetically sealed.

Preferably, the material of the carrier and the cover is ceramic.

Preferably, the connecting wire is a gold wire.

The following describes the embodiments of the present invention in more detail with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying this specification.

FIG. 1a is a perspective perspective view for explaining a high-temperature resistant RFID tag without a protective structure layer according to an embodiment of the present invention; FIG. 1b is a perspective perspective view for explaining a structure including a protective structure layer according to an embodiment of the present invention High temperature RFID tag. Please refer to FIG. 1 a and FIG. 1 b. In one embodiment of the present invention, the high-temperature resistant RFID tag 1 includes a carrier 10, an RFID die 20, a cover 30, and a protective structure layer 40. It can be seen from FIG. 1a that the carrier 10 includes a groove 101, and the RFID die 20 is disposed in the groove 101, and a plurality of antennas 103 are printed on the carrier 10 and the groove 101, and the RFID die 20 is The structure of the RFID die 20 connected to the antenna 103 and disposed in the groove 101 will be described in detail later. It can be seen from FIG. 1b that the cover 30 is covered on the groove 101, and the cover 30 and the groove 101 are hermetically sealed. When the cover 30 covers the groove 101, a protection is provided. The structural layer 40 and the protective structural layer 40 cover the entire carrier 10, the antenna 103 and the cover 30.

In addition, in an embodiment of the present invention, the material of the carrier 10 and the cover 30 is ceramic, and the ceramic material can withstand a high temperature of more than 300 degrees C. It should be understood that the overall size of the high temperature resistant RFID tag 1 of the present invention is not large. The length of the high temperature resistant RFID tag 1 may be 5 to 8 cm, the width may be 2 to 4 cm, and the height may be 1 to 3 cm. Therefore, the high temperature resistant RFID tag 1 of the present invention can be applied to various industries due to its miniature size.

On the other hand, the design concept of the structure of the high-temperature resistant RFID tag 1 of the present invention is that a groove 101 is first designed on the carrier 10, and then the RFID die 20 is placed inside as a place to connect the antenna 103, and then covered. The previous cover 30 covers the groove 101 and is hermetically sealed to protect the RFID die 20 from being oxidized due to the high temperature and enhance the heat insulation effect.

In addition, due to the limitation of the volume of the high temperature resistant RFID tag and its metal resistance, the antenna 103 is an antenna structure using a ceramic substrate Planar inverted-F antenna (PIFA). Therefore, the antenna 103 includes a coaxial feed line 1030. The advantages of PIFA antennas are that PIFA antennas can be regarded as small and thin antennas that use λ / 4 resonance, have a relatively small volume, are suitable for various industries, and are very suitable for use as hidden antennas.

Fig. 2a is a schematic diagram for explaining a side sectional structure of a high-temperature-resistant RFID tag according to an embodiment of the present invention; Fig. 2b is an enlarged schematic diagram for explaining the structure of a region A of the high-temperature-resistant RFID tag in Fig. 2a according to the present invention; . 2a and 2b, the groove 103 on the carrier 10 includes a plurality of electrode contacts 105, and an antenna 103 is printed on the surface of the carrier 10. The antenna 103 extends into the groove 103, and the electrode contacts 105 are connected. To the antenna 103. The RFID die 20 is connected to the electrode contact 105 through a plurality of connection lines 201. The connection line 201 may be a gold wire, and is directly connected to the electrode contact 105 from a solder joint on the RFID die 20.

It should be noted that at this time, the RFID die 20 is a bare die package, but in order to protect the surface of the RFID die 20 and to meet the requirements of ultra-high temperature resistance, it must not be placed in the RFID die 20 The surface is covered with anything to prevent the covering from expanding and squeezing at high temperatures, thereby damaging the RFID die 20. Therefore, in an embodiment of the present invention, the cover body 30 is covered above the groove 101 and is hermetically sealed to protect the RFID die 20 from being oxidized by the high temperature and enhance the heat insulation effect. A protective structure layer 40 covers the carrier 10, the antenna 103, and the cover 30.

On the other hand, in an embodiment of the present invention, the RFID die 20 is disposed in the groove 101 by an adhesive layer 203. The adhesive layer 203 may be an eutectic alloy with a high temperature melting point characteristic. Its melting point can reach 380 ° C, for example, it is one of gold / silicon alloy or gold / germanium alloy, in order to prevent the RFID chip 20 from sliding when melting at high temperature. The setting method of the present invention can make the RFID chip 20 It can also be fixed in the groove 101 under a high temperature environment. It should be understood that, in other embodiments of the present invention, other high temperature resistant materials may also be used for adhesion or other fixing to set the RFID die 20 in the groove 101.

FIG. 2c is a schematic top view illustrating a high-temperature resistant RFID tag without a protective structure layer according to an embodiment of the present invention; FIG. 2d is a schematic top view illustrating a protective structure layer including a protective layer according to an embodiment of the present invention High temperature RFID tag. Please refer to FIG. 2b, FIG. 2c, and FIG. 2d. As can be seen from the top view, in an embodiment of the present invention, the RFID die 20 is connected to the four electrode contacts 105 by four connecting wires 201, and further by The four electrode contacts 105 are connected to the antenna 103, and then the groove 101 is covered by a cover 30, and finally the carrier 10, the antenna 103, and the cover 30 are covered by a protective structure layer 40. Wherein, the protective structure layer 40 may be a liquid coating, and may be applied by a wet coating method, a slot coating method, an immersion coating method, a spin coating method, a spray coating method, or a slit coating method. One of the coating methods is coated on the carrier 10, the antenna 103, and the cover 30, and then the liquid coating is cured and forms a protective structure layer 40. In another embodiment of the present invention, the protective structure can be formed by After the layer 40 is used as a solid film, a layer of glue is applied to the carrier 10, the antenna 103, and the cover 30, and then the protective structure layer 40 and the carrier 10, the antenna 103, and the cover 30 are glued together to make the protective structure. The layer 40 covers the carrier 10, the antenna 103, and the cover 30. Furthermore, the protective structure layer 40 has a thermal insulation effect. When the temperature rises to a certain high temperature, the protective structure layer 40 will rapidly expand, allowing air to flow in, so that the high temperature will not directly heat up to the inner objects such as the RFID chip 20, And has a cooling effect. The volume of the protective structure layer 40 can be designed and adjusted according to the temperature of the use environment and the heat resistance of the RFID die 20.

FIG. 3 is an enlarged schematic diagram for explaining the structure of a high-temperature resistant RFID tag according to another embodiment of the present invention. Referring to FIG. 3, in another embodiment of the present invention, the structure of the high-temperature resistant RFID tag is basically similar to the structure shown in FIG. 2b. The difference is that the protective structure layer 40 further includes an external thermal insulation layer 401 and an internal The heat insulation layer 403, and the outer heat insulation layer 401 has a first thickness, the inner heat insulation layer 403 has a second thickness, and both the outer heat insulation layer 401 and the inner heat insulation layer 403 can be the liquid coatings described above. The advantage of setting the protective structure layer 40 as two layers is that when the temperature rises to a certain high temperature, the external heat insulation layer 401 will rapidly expand, allowing air to flow in, so that the high temperature will not directly heat to the inner layer of the RFID chip 20, etc. Objects and have a cooling effect. However, after the external heat insulation layer 401 is burned and expanded, a part of the heat flow still enters the internal heat insulation layer 403 as the second layer. The inner heat-insulating layer 403 is a hard material that does not break even at high temperatures and has excellent heat-insulating characteristics. Therefore, when the protective structure layer 40 has a two-layer structure, not only the final temperature of the RFID die 20 body being heated is reduced, but also the RFID die 20 body is protected from the impact of foreign objects. The first thickness of the outer heat-insulating layer 401 and the second thickness of the inner heat-insulating layer 403 can be designed and adjusted according to the temperature of the use environment and the heat resistance of the RFID die 20; A thickness may be greater than the second thickness of the inner heat insulation layer 403 to achieve the best heat insulation effect.

The application mode of the high-temperature resistant RFID tag of the present invention will now be described. In one application of the present invention, the high-temperature resistant RFID tag can be applied to an automatic reading program for the funeral industry. For example, the high-temperature resistant RFID tag of the present invention is embedded in a bracelet worn by a deceased person or a coffin to be used by the deceased person. At the same time, the high-temperature resistant RFID tag stores relevant information of the deceased person. Information such as name, gender and other related information. When the deceased is going to enter the cremation process, the RFID reader is first used to read the high-temperature resistant RFID tag to confirm whether the deceased's identity is correct; after that, the deceased will enter the cremation process, and the temperature during cremation may It will reach a high temperature of 800 degrees C to 1000 degrees C, and must stay in this high temperature environment for 1 hour. At this time, the high temperature resistant RFID tag of the present invention can be protected by its special structural design and protective structural layer. After being left for a period of time and expanding and burning the external structural layer, the RFID chip as the core part of the high-temperature resistant RFID tag will not be damaged. Therefore, after the crematorium is cremated, the high-temperature resistant RFID tag of the present invention is retained along with the burned ashes. In this way, when the ashes are to be further loaded into the ashes, the remaining high-temperature resistant RFID tags can be read again by the RFID reading device to further confirm the identity of the deceased and avoid loading the ashes into the wrong ashes. The situation at the altar happened.

In another application of the present invention, a high-temperature resistant RFID tag can be applied to an automatic reading program for the steel industry. For example, the high-temperature resistant RFID tag of the present invention is embedded or attached to a steel furnace or other molds that need to contain high-temperature metal solutions. At the same time, the high-temperature resistant RFID tags store the steel furnace or the mold. Relevant information such as serial number, type of solution, etc. When the steel furnace or the mold is used, the high-temperature resistant RFID tag is first read by an RFID reading device to confirm the serial number of the steel furnace or the mold or the type of metal solution to be contained; after that, when the steel furnace or the mold is used, Before the mold contains the metal solution, and before going to the next production line production point, the high-temperature resistant RFID tag can be read again by the RFID reading device to further confirm whether the type of metal solution contained in the steel furnace or the mold is correct. The high-temperature resistant RFID tag of the present invention is not affected by the high temperature of the metal solution due to its special structure, and thus can automatically perform the automatic reading process.

In summary, the present invention successfully provides a RFID tag with high temperature resistance. Its special structure is to set a bare die in the form of an RFID die in a groove of a carrier, and the groove is connected to cover the concave. A cover body of the groove is hermetically sealed to prevent oxidation of the RFID crystal grains and enhance the heat insulation effect. Furthermore, the high-temperature-resistant RFID tag of the present invention further achieves external heat insulation and thermal insulation effects through a protective structural layer, so that the high-temperature-resistant RFID tag can stay in the high-temperature environment for more than 1 hour. The high-temperature-resistant RFID tag of the present invention enables industries that need to work in high-temperature environments to use RFID sensing technology to achieve intelligent sensing reading behavior.

The above are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change related to the present invention made under the same spirit of the invention Should still be included in the scope of the present invention.

1‧‧‧High temperature RFID tag

10‧‧‧ carrier

20‧‧‧RFID Chip

30‧‧‧ Cover

40‧‧‧Protection structure layer

101‧‧‧ groove

103‧‧‧ Antenna

105‧‧‧electrode contacts

201‧‧‧ connecting line

203‧‧‧Adhesive layer

401‧‧‧External insulation

403‧‧‧Insulation

1030‧‧‧ Coaxial Feeder

A‧‧‧Area

Those with ordinary knowledge in the art can better understand the various aspects of the present invention and its specific features and advantages after reading the following detailed description with reference to the accompanying drawings, wherein these drawings include: Figure 1a is an illustration A perspective perspective view of a high-temperature resistant RFID tag without a protective structure layer according to an embodiment of the present invention; FIG. 1b is a perspective perspective view illustrating a high-temperature-resistant RFID tag including a protective structure layer according to an embodiment of the present invention; A schematic cross-sectional side view of a high-temperature resistant RFID tag according to an embodiment of the present invention; FIG. 2b is an enlarged schematic view illustrating the structure of the A area of the high-temperature resistant RFID tag in FIG. 2a according to the present invention; A schematic top view of a high temperature resistant RFID tag with a structural layer; FIG. 2d is a schematic top view showing a high temperature resistant RFID tag including a protective structure layer according to an embodiment of the present invention; and FIG. 3 is a high temperature resistant illustrating another embodiment of the present invention An enlarged schematic diagram of the structure of an RFID tag.

Claims (8)

A high-temperature resistant RFID tag includes: a carrier including a groove, the groove including a plurality of electrode contacts, and a plurality of antennas disposed on a surface of the carrier, and the electrode contacts are connected to the antennas; An RFID die is disposed in the groove, and the RFID die is connected to the electrode contacts through a plurality of connecting lines; a cover body covers the groove; and a protective structure layer covers the The carrier, the antennas, and the cover. The protective structure layer includes an external thermal insulation layer and an internal thermal insulation layer. The external thermal insulation layer has a first thickness and the internal thermal insulation layer has a second thickness. The high-temperature resistant RFID tag according to item 1 of the scope of patent application, wherein the RFID die is in a bare crystal state, and the RFID die is disposed in the groove by an adhesive layer. The high-temperature resistant RFID tag according to item 2 of the scope of patent application, wherein the adhesive layer is a eutectic alloy. The high temperature resistant RFID tag according to item 3 of the patent application scope, wherein the eutectic alloy is one of a gold / silicon alloy or a gold / germanium alloy. The high-temperature resistant RFID tag according to item 1 of the scope of the patent application, wherein the outer heat-insulating layer and the inner heat-insulating layer are liquid coatings, and the liquid coating covers the carrier, the antennas, and the cover, and then The protective structure layer is cured and formed. The high-temperature resistant RFID tag according to item 1 of the scope of the patent application, wherein the cover and the groove are hermetically sealed. The high-temperature resistant RFID tag according to item 1 of the scope of patent application, wherein the material of the carrier and the cover is ceramic. The high-temperature resistant RFID tag according to item 1 of the scope of patent application, wherein the connecting wire is a gold wire.