TWI671395B - 化學機械研磨後配方及其使用方法 - Google Patents
化學機械研磨後配方及其使用方法 Download PDFInfo
- Publication number
- TWI671395B TWI671395B TW104102984A TW104102984A TWI671395B TW I671395 B TWI671395 B TW I671395B TW 104102984 A TW104102984 A TW 104102984A TW 104102984 A TW104102984 A TW 104102984A TW I671395 B TWI671395 B TW I671395B
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- cleaning composition
- hydroxide
- residues
- amine
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 100
- 239000000126 substance Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005498 polishing Methods 0.000 title abstract description 8
- 238000009472 formulation Methods 0.000 title description 2
- 238000004140 cleaning Methods 0.000 claims abstract description 81
- 238000004377 microelectronic Methods 0.000 claims abstract description 48
- 150000001412 amines Chemical class 0.000 claims abstract description 31
- 239000003344 environmental pollutant Substances 0.000 claims abstract description 11
- 231100000719 pollutant Toxicity 0.000 claims abstract description 11
- -1 hydroxide (Hydroxymethyl) fluorene Chemical compound 0.000 claims description 29
- 239000004094 surface-active agent Substances 0.000 claims description 23
- 239000000356 contaminant Substances 0.000 claims description 21
- 239000003002 pH adjusting agent Substances 0.000 claims description 21
- 238000005260 corrosion Methods 0.000 claims description 19
- 230000007797 corrosion Effects 0.000 claims description 19
- 239000000872 buffer Substances 0.000 claims description 18
- 239000008139 complexing agent Substances 0.000 claims description 18
- 239000003112 inhibitor Substances 0.000 claims description 18
- 239000002253 acid Substances 0.000 claims description 15
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 8
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- GFFGJBXGBJISGV-UHFFFAOYSA-N Adenine Chemical compound NC1=NC=NC2=C1N=CN2 GFFGJBXGBJISGV-UHFFFAOYSA-N 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 6
- 239000011877 solvent mixture Substances 0.000 claims description 6
- DFQPZDGUFQJANM-UHFFFAOYSA-M tetrabutylphosphanium;hydroxide Chemical compound [OH-].CCCC[P+](CCCC)(CCCC)CCCC DFQPZDGUFQJANM-UHFFFAOYSA-M 0.000 claims description 6
- OIRDTQYFTABQOQ-KQYNXXCUSA-N adenosine Chemical compound C1=NC=2C(N)=NC=NC=2N1[C@@H]1O[C@H](CO)[C@@H](O)[C@H]1O OIRDTQYFTABQOQ-KQYNXXCUSA-N 0.000 claims description 5
- 239000000539 dimer Substances 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- YGKHJWTVMIMEPQ-UHFFFAOYSA-N 1,2-propanedithiol Chemical compound CC(S)CS YGKHJWTVMIMEPQ-UHFFFAOYSA-N 0.000 claims description 4
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 4
- KOPFEFZSAMLEHK-UHFFFAOYSA-N 1h-pyrazole-5-carboxylic acid Chemical compound OC(=O)C=1C=CNN=1 KOPFEFZSAMLEHK-UHFFFAOYSA-N 0.000 claims description 4
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 claims description 4
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 4
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 4
- NYHBQMYGNKIUIF-UUOKFMHZSA-N Guanosine Chemical compound C1=NC=2C(=O)NC(N)=NC=2N1[C@@H]1O[C@H](CO)[C@@H](O)[C@H]1O NYHBQMYGNKIUIF-UUOKFMHZSA-N 0.000 claims description 4
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 claims description 4
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- POJWUDADGALRAB-UHFFFAOYSA-N allantoin Chemical compound NC(=O)NC1NC(=O)NC1=O POJWUDADGALRAB-UHFFFAOYSA-N 0.000 claims description 4
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 4
- 235000003704 aspartic acid Nutrition 0.000 claims description 4
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004327 boric acid Substances 0.000 claims description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 4
- RYYVLZVUVIJVGH-UHFFFAOYSA-N caffeine Chemical compound CN1C(=O)N(C)C(=O)C2=C1N=CN2C RYYVLZVUVIJVGH-UHFFFAOYSA-N 0.000 claims description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 4
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 claims description 4
- 235000018417 cysteine Nutrition 0.000 claims description 4
- OPTASPLRGRRNAP-UHFFFAOYSA-N cytosine Chemical compound NC=1C=CNC(=O)N=1 OPTASPLRGRRNAP-UHFFFAOYSA-N 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 4
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 claims description 4
- UYTPUPDQBNUYGX-UHFFFAOYSA-N guanine Chemical compound O=C1NC(N)=NC2=C1N=CN2 UYTPUPDQBNUYGX-UHFFFAOYSA-N 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- FDGQSTZJBFJUBT-UHFFFAOYSA-N hypoxanthine Chemical compound O=C1NC=NC2=C1NC=N2 FDGQSTZJBFJUBT-UHFFFAOYSA-N 0.000 claims description 4
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 4
- DRAVOWXCEBXPTN-UHFFFAOYSA-N isoguanine Chemical compound NC1=NC(=O)NC2=C1NC=N2 DRAVOWXCEBXPTN-UHFFFAOYSA-N 0.000 claims description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 4
- LXNHXLLTXMVWPM-UHFFFAOYSA-N pyridoxine Chemical compound CC1=NC=C(CO)C(CO)=C1O LXNHXLLTXMVWPM-UHFFFAOYSA-N 0.000 claims description 4
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical compound [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- YAPQBXQYLJRXSA-UHFFFAOYSA-N theobromine Chemical compound CN1C(=O)NC(=O)C2=C1N=CN2C YAPQBXQYLJRXSA-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 3
- 239000002126 C01EB10 - Adenosine Substances 0.000 claims description 3
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 claims description 3
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 claims description 3
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 claims description 3
- PYMYPHUHKUWMLA-LMVFSUKVSA-N Ribose Natural products OC[C@@H](O)[C@@H](O)[C@@H](O)C=O PYMYPHUHKUWMLA-LMVFSUKVSA-N 0.000 claims description 3
- 229960005305 adenosine Drugs 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- HMFHBZSHGGEWLO-UHFFFAOYSA-N alpha-D-Furanose-Ribose Natural products OCC1OC(O)C(O)C1O HMFHBZSHGGEWLO-UHFFFAOYSA-N 0.000 claims description 3
- 150000007942 carboxylates Chemical class 0.000 claims description 3
- WQABCVAJNWAXTE-UHFFFAOYSA-N dimercaprol Chemical compound OCC(S)CS WQABCVAJNWAXTE-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- PYIGXCSOLWAMGG-UHFFFAOYSA-M methyl(triphenyl)phosphanium;hydroxide Chemical compound [OH-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C)C1=CC=CC=C1 PYIGXCSOLWAMGG-UHFFFAOYSA-M 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 claims description 3
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 claims description 3
- QQTYPILXLJHNEJ-PIZZUKIDSA-N (2R,3R,4R,5R)-2-(6-aminopurin-9-yl)-5-(hydroxymethyl)-2,3,4-trimethyloxolane-3,4-diol Chemical compound C[C@@]1([C@]([C@@](O[C@@H]1CO)(N1C=NC=2C(N)=NC=NC12)C)(O)C)O QQTYPILXLJHNEJ-PIZZUKIDSA-N 0.000 claims description 2
- FPTVYEPOFQRUGD-JSDYZDKHSA-N (2R,3S,4R)-2-(hydroxymethyl)-5-purin-1-yloxolane-3,4-diol Chemical compound O[C@@H]1[C@H](O)[C@@H](CO)OC1N1C=C2N=CN=C2N=C1 FPTVYEPOFQRUGD-JSDYZDKHSA-N 0.000 claims description 2
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 claims description 2
- AJACDNCVEGIBNA-KQYNXXCUSA-N (2r,3r,4s,5r)-2-(6-amino-2-methoxypurin-9-yl)-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound C12=NC(OC)=NC(N)=C2N=CN1[C@@H]1O[C@H](CO)[C@@H](O)[C@H]1O AJACDNCVEGIBNA-KQYNXXCUSA-N 0.000 claims description 2
- AAWZDTNXLSGCEK-LNVDRNJUSA-N (3r,5r)-1,3,4,5-tetrahydroxycyclohexane-1-carboxylic acid Chemical compound O[C@@H]1CC(O)(C(O)=O)C[C@@H](O)C1O AAWZDTNXLSGCEK-LNVDRNJUSA-N 0.000 claims description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims description 2
- QUKGLNCXGVWCJX-UHFFFAOYSA-N 1,3,4-thiadiazol-2-amine Chemical compound NC1=NN=CS1 QUKGLNCXGVWCJX-UHFFFAOYSA-N 0.000 claims description 2
- RAIPHJJURHTUIC-UHFFFAOYSA-N 1,3-thiazol-2-amine Chemical compound NC1=NC=CS1 RAIPHJJURHTUIC-UHFFFAOYSA-N 0.000 claims description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- XMUIKZODBRYDCK-UHFFFAOYSA-N 2,3,4,5,6,9-hexahydro-1h-1,4,7-triazonine Chemical compound C1CNCC=NCCN1 XMUIKZODBRYDCK-UHFFFAOYSA-N 0.000 claims description 2
- JLVSRWOIZZXQAD-UHFFFAOYSA-N 2,3-disulfanylpropane-1-sulfonic acid Chemical compound OS(=O)(=O)CC(S)CS JLVSRWOIZZXQAD-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- OFEZSBMBBKLLBJ-UHFFFAOYSA-N 2-(6-aminopurin-9-yl)-5-(hydroxymethyl)oxolan-3-ol Chemical compound C1=NC=2C(N)=NC=NC=2N1C1OC(CO)CC1O OFEZSBMBBKLLBJ-UHFFFAOYSA-N 0.000 claims description 2
- XLJGIXLDEYIALO-UHFFFAOYSA-N 2-(carboxymethylamino)-4-hydroxybutanoic acid Chemical compound OCCC(C(O)=O)NCC(O)=O XLJGIXLDEYIALO-UHFFFAOYSA-N 0.000 claims description 2
- AJACDNCVEGIBNA-UHFFFAOYSA-N 2-Methoxyadenosine Natural products C12=NC(OC)=NC(N)=C2N=CN1C1OC(CO)C(O)C1O AJACDNCVEGIBNA-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- HZKMBJCDAXLMDN-UHFFFAOYSA-N 2-amino-1,3-thiazole-5-carbaldehyde Chemical compound NC1=NC=C(C=O)S1 HZKMBJCDAXLMDN-UHFFFAOYSA-N 0.000 claims description 2
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 claims description 2
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 claims description 2
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims description 2
- OCVLSHAVSIYKLI-UHFFFAOYSA-N 3h-1,3-thiazole-2-thione Chemical compound SC1=NC=CS1 OCVLSHAVSIYKLI-UHFFFAOYSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- IMBBXSASDSZJSX-UHFFFAOYSA-N 4-Carboxypyrazole Chemical compound OC(=O)C=1C=NNC=1 IMBBXSASDSZJSX-UHFFFAOYSA-N 0.000 claims description 2
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 claims description 2
- FYTLHYRDGXRYEY-UHFFFAOYSA-N 5-Methyl-3-pyrazolamine Chemical compound CC=1C=C(N)NN=1 FYTLHYRDGXRYEY-UHFFFAOYSA-N 0.000 claims description 2
- QZBGOTVBHYKUDS-UHFFFAOYSA-N 5-amino-1,2-dihydropyrazol-3-one Chemical compound NC1=CC(=O)NN1 QZBGOTVBHYKUDS-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- FPVUWZFFEGYCGB-UHFFFAOYSA-N 5-methyl-3h-1,3,4-thiadiazole-2-thione Chemical compound CC1=NN=C(S)S1 FPVUWZFFEGYCGB-UHFFFAOYSA-N 0.000 claims description 2
- 229930024421 Adenine Natural products 0.000 claims description 2
- POJWUDADGALRAB-PVQJCKRUSA-N Allantoin Natural products NC(=O)N[C@@H]1NC(=O)NC1=O POJWUDADGALRAB-PVQJCKRUSA-N 0.000 claims description 2
- 239000004475 Arginine Substances 0.000 claims description 2
- XNSPQPOQXWCGKC-UHFFFAOYSA-N C(C)(=O)O.C(C)(=O)O.C(C)(=O)O.[N] Chemical compound C(C)(=O)O.C(C)(=O)O.C(C)(=O)O.[N] XNSPQPOQXWCGKC-UHFFFAOYSA-N 0.000 claims description 2
- AAWZDTNXLSGCEK-UHFFFAOYSA-N Cordycepinsaeure Natural products OC1CC(O)(C(O)=O)CC(O)C1O AAWZDTNXLSGCEK-UHFFFAOYSA-N 0.000 claims description 2
- MIKUYHXYGGJMLM-GIMIYPNGSA-N Crotonoside Natural products C1=NC2=C(N)NC(=O)N=C2N1[C@H]1O[C@@H](CO)[C@H](O)[C@@H]1O MIKUYHXYGGJMLM-GIMIYPNGSA-N 0.000 claims description 2
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 2
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 claims description 2
- NYHBQMYGNKIUIF-UHFFFAOYSA-N D-guanosine Natural products C1=2NC(N)=NC(=O)C=2N=CN1C1OC(CO)C(O)C1O NYHBQMYGNKIUIF-UHFFFAOYSA-N 0.000 claims description 2
- HMFHBZSHGGEWLO-SOOFDHNKSA-N D-ribofuranose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@@H]1O HMFHBZSHGGEWLO-SOOFDHNKSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 2
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- UGQMRVRMYYASKQ-UHFFFAOYSA-N Hypoxanthine nucleoside Natural products OC1C(O)C(CO)OC1N1C(NC=NC2=O)=C2N=C1 UGQMRVRMYYASKQ-UHFFFAOYSA-N 0.000 claims description 2
- LPHGQDQBBGAPDZ-UHFFFAOYSA-N Isocaffeine Natural products CN1C(=O)N(C)C(=O)C2=C1N(C)C=N2 LPHGQDQBBGAPDZ-UHFFFAOYSA-N 0.000 claims description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims description 2
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 claims description 2
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims description 2
- ZDXPYRJPNDTMRX-VKHMYHEASA-N L-glutamine Chemical compound OC(=O)[C@@H](N)CCC(N)=O ZDXPYRJPNDTMRX-VKHMYHEASA-N 0.000 claims description 2
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 claims description 2
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 claims description 2
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 claims description 2
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 claims description 2
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 claims description 2
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 claims description 2
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 claims description 2
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 claims description 2
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 claims description 2
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 claims description 2
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004472 Lysine Substances 0.000 claims description 2
- WVGPGNPCZPYCLK-WOUKDFQISA-N N(6),N(6)-dimethyladenosine Chemical compound C1=NC=2C(N(C)C)=NC=NC=2N1[C@@H]1O[C@H](CO)[C@@H](O)[C@H]1O WVGPGNPCZPYCLK-WOUKDFQISA-N 0.000 claims description 2
- VQAYFKKCNSOZKM-IOSLPCCCSA-N N(6)-methyladenosine Chemical compound C1=NC=2C(NC)=NC=NC=2N1[C@@H]1O[C@H](CO)[C@@H](O)[C@H]1O VQAYFKKCNSOZKM-IOSLPCCCSA-N 0.000 claims description 2
- WVGPGNPCZPYCLK-UHFFFAOYSA-N N-Dimethyladenosine Natural products C1=NC=2C(N(C)C)=NC=NC=2N1C1OC(CO)C(O)C1O WVGPGNPCZPYCLK-UHFFFAOYSA-N 0.000 claims description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 claims description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 2
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 claims description 2
- AAWZDTNXLSGCEK-ZHQZDSKASA-N Quinic acid Natural products O[C@H]1CC(O)(C(O)=O)C[C@H](O)C1O AAWZDTNXLSGCEK-ZHQZDSKASA-N 0.000 claims description 2
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 claims description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 2
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical class OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 claims description 2
- 239000004473 Threonine Substances 0.000 claims description 2
- 229920004890 Triton X-100 Polymers 0.000 claims description 2
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 claims description 2
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 claims description 2
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 claims description 2
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 claims description 2
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims description 2
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 2
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 claims description 2
- 229960000643 adenine Drugs 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- 235000004279 alanine Nutrition 0.000 claims description 2
- 229960000458 allantoin Drugs 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 2
- 239000003125 aqueous solvent Substances 0.000 claims description 2
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 claims description 2
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 2
- 229960003237 betaine Drugs 0.000 claims description 2
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 claims description 2
- 229960001948 caffeine Drugs 0.000 claims description 2
- VJEONQKOZGKCAK-UHFFFAOYSA-N caffeine Natural products CN1C(=O)N(C)C(=O)C2=C1C=CN2C VJEONQKOZGKCAK-UHFFFAOYSA-N 0.000 claims description 2
- 229940104302 cytosine Drugs 0.000 claims description 2
- 229960001051 dimercaprol Drugs 0.000 claims description 2
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 claims description 2
- 150000002009 diols Chemical class 0.000 claims description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 2
- 229960000878 docusate sodium Drugs 0.000 claims description 2
- SVMUEEINWGBIPD-UHFFFAOYSA-N dodecylphosphonic acid Chemical compound CCCCCCCCCCCCP(O)(O)=O SVMUEEINWGBIPD-UHFFFAOYSA-N 0.000 claims description 2
- BJAJDJDODCWPNS-UHFFFAOYSA-N dotp Chemical compound O=C1N2CCOC2=NC2=C1SC=C2 BJAJDJDODCWPNS-UHFFFAOYSA-N 0.000 claims description 2
- SMSCVBBYKOFGCY-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;hydroxide Chemical compound [OH-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 SMSCVBBYKOFGCY-UHFFFAOYSA-M 0.000 claims description 2
- NEZRFXZYPAIZAD-UHFFFAOYSA-N ethylcyclobutane Chemical compound CCC1CCC1 NEZRFXZYPAIZAD-UHFFFAOYSA-N 0.000 claims description 2
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 239000004811 fluoropolymer Substances 0.000 claims description 2
- RIKMMFOAQPJVMX-UHFFFAOYSA-N fomepizole Chemical compound CC=1C=NNC=1 RIKMMFOAQPJVMX-UHFFFAOYSA-N 0.000 claims description 2
- 229960004285 fomepizole Drugs 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- 239000001530 fumaric acid Substances 0.000 claims description 2
- 235000011087 fumaric acid Nutrition 0.000 claims description 2
- 229940074391 gallic acid Drugs 0.000 claims description 2
- 235000004515 gallic acid Nutrition 0.000 claims description 2
- 239000000174 gluconic acid Substances 0.000 claims description 2
- 235000012208 gluconic acid Nutrition 0.000 claims description 2
- 239000008103 glucose Substances 0.000 claims description 2
- 235000013922 glutamic acid Nutrition 0.000 claims description 2
- 239000004220 glutamic acid Substances 0.000 claims description 2
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 claims description 2
- 229930182470 glycoside Natural products 0.000 claims description 2
- 229940029575 guanosine Drugs 0.000 claims description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 2
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 claims description 2
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 claims description 2
- 229960000310 isoleucine Drugs 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- DJQJFMSHHYAZJD-UHFFFAOYSA-N lidofenin Chemical compound CC1=CC=CC(C)=C1NC(=O)CN(CC(O)=O)CC(O)=O DJQJFMSHHYAZJD-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- 239000001630 malic acid Substances 0.000 claims description 2
- 235000011090 malic acid Nutrition 0.000 claims description 2
- IWYDHOAUDWTVEP-UHFFFAOYSA-N mandelic acid Chemical compound OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 claims description 2
- 229960002510 mandelic acid Drugs 0.000 claims description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims description 2
- 229930182817 methionine Natural products 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 2
- RUOPINZRYMFPBF-UHFFFAOYSA-N pentane-1,3-diol Chemical compound CCC(O)CCO RUOPINZRYMFPBF-UHFFFAOYSA-N 0.000 claims description 2
- GLOBUAZSRIOKLN-UHFFFAOYSA-N pentane-1,4-diol Chemical compound CC(O)CCCO GLOBUAZSRIOKLN-UHFFFAOYSA-N 0.000 claims description 2
- 239000010702 perfluoropolyether Substances 0.000 claims description 2
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 claims description 2
- 229920001983 poloxamer Polymers 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- 235000008160 pyridoxine Nutrition 0.000 claims description 2
- 239000011677 pyridoxine Substances 0.000 claims description 2
- MPNBXFXEMHPGTK-UHFFFAOYSA-N pyrimidine-4,5,6-triamine Chemical compound NC1=NC=NC(N)=C1N MPNBXFXEMHPGTK-UHFFFAOYSA-N 0.000 claims description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 2
- 239000000600 sorbitol Substances 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- ZOMVKCHODRHQEV-UHFFFAOYSA-M tetraethylphosphanium;hydroxide Chemical compound [OH-].CC[P+](CC)(CC)CC ZOMVKCHODRHQEV-UHFFFAOYSA-M 0.000 claims description 2
- CRUVUWATNULHFA-UHFFFAOYSA-M tetramethylphosphanium;hydroxide Chemical compound [OH-].C[P+](C)(C)C CRUVUWATNULHFA-UHFFFAOYSA-M 0.000 claims description 2
- OORMKVJAUGZYKP-UHFFFAOYSA-M tetrapropylphosphanium;hydroxide Chemical compound [OH-].CCC[P+](CCC)(CCC)CCC OORMKVJAUGZYKP-UHFFFAOYSA-M 0.000 claims description 2
- 229960004559 theobromine Drugs 0.000 claims description 2
- 229940116269 uric acid Drugs 0.000 claims description 2
- 239000004474 valine Substances 0.000 claims description 2
- 229940011671 vitamin b6 Drugs 0.000 claims description 2
- 229940075420 xanthine Drugs 0.000 claims description 2
- 239000000811 xylitol Substances 0.000 claims description 2
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims description 2
- 229960002675 xylitol Drugs 0.000 claims description 2
- 235000010447 xylitol Nutrition 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Polymers OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- BDJAEZRIGNCQBZ-UHFFFAOYSA-N methylcyclobutane Chemical compound CC1CCC1 BDJAEZRIGNCQBZ-UHFFFAOYSA-N 0.000 claims 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 claims 2
- CPRMKOQKXYSDML-UHFFFAOYSA-M rubidium hydroxide Chemical compound [OH-].[Rb+] CPRMKOQKXYSDML-UHFFFAOYSA-M 0.000 claims 2
- WYPUIKGYAWIUTP-UHFFFAOYSA-N 1,2-diethylpyrene Chemical compound C1=CC=C2C=CC3=C(CC)C(CC)=CC4=CC=C1C2=C43 WYPUIKGYAWIUTP-UHFFFAOYSA-N 0.000 claims 1
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 claims 1
- DZQNHNNOBZXRSR-UHFFFAOYSA-N 1,5,9-triazacyclododec-9-ene Chemical compound C1CNCCCN=CCCNC1 DZQNHNNOBZXRSR-UHFFFAOYSA-N 0.000 claims 1
- 229940043375 1,5-pentanediol Drugs 0.000 claims 1
- FMPJPCHSXGNEMD-UHFFFAOYSA-N 1-butylpyrazole Chemical compound CCCCN1C=CC=N1 FMPJPCHSXGNEMD-UHFFFAOYSA-N 0.000 claims 1
- JNYAEWCLZODPBN-UHFFFAOYSA-N 2-(1,2-dihydroxyethyl)oxolane-3,4-diol Polymers OCC(O)C1OCC(O)C1O JNYAEWCLZODPBN-UHFFFAOYSA-N 0.000 claims 1
- KXVSZAQJBQHRHE-UHFFFAOYSA-N 2-[1-(2-hydroxyethyl)-9h-fluoren-2-yl]ethanol Chemical compound C1=CC=C2C3=CC=C(CCO)C(CCO)=C3CC2=C1 KXVSZAQJBQHRHE-UHFFFAOYSA-N 0.000 claims 1
- ZDVXVYYCBTZEHO-UHFFFAOYSA-N 2-amino-5-ethyl-1,3-thiazole-4-carboxylic acid Chemical compound CCC=1SC(N)=NC=1C(O)=O ZDVXVYYCBTZEHO-UHFFFAOYSA-N 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- 125000000041 C6-C10 aryl group Chemical group 0.000 claims 1
- 235000021513 Cinchona Nutrition 0.000 claims 1
- 241000157855 Cinchona Species 0.000 claims 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims 1
- 229910052778 Plutonium Inorganic materials 0.000 claims 1
- 210000004907 gland Anatomy 0.000 claims 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 claims 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 claims 1
- CSNFMBGHUOSBFU-UHFFFAOYSA-N pyrimidine-2,4,5-triamine Chemical compound NC1=NC=C(N)C(N)=N1 CSNFMBGHUOSBFU-UHFFFAOYSA-N 0.000 claims 1
- 125000000548 ribosyl group Chemical class C1([C@H](O)[C@H](O)[C@H](O1)CO)* 0.000 claims 1
- 229920005573 silicon-containing polymer Polymers 0.000 claims 1
- JNYAEWCLZODPBN-CTQIIAAMSA-N sorbitan Polymers OCC(O)C1OCC(O)[C@@H]1O JNYAEWCLZODPBN-CTQIIAAMSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052802 copper Inorganic materials 0.000 abstract description 16
- 239000010949 copper Substances 0.000 abstract description 16
- 239000003989 dielectric material Substances 0.000 abstract description 9
- 150000003863 ammonium salts Chemical class 0.000 abstract description 4
- 239000002245 particle Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 238000004380 ashing Methods 0.000 description 12
- 238000005530 etching Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 239000002002 slurry Substances 0.000 description 9
- 239000006227 byproduct Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 125000001453 quaternary ammonium group Chemical group 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229920000620 organic polymer Polymers 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 4
- 239000006172 buffering agent Substances 0.000 description 4
- 239000007857 degradation product Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000000908 ammonium hydroxide Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001409 amidines Chemical class 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- BCVCDQYRUZGZTF-HKSFMPNISA-N (2R,3R,4R,5R)-5-(hydroxymethyl)-2,3,4-trimethyl-2-[6-(methylamino)purin-9-yl]oxolane-3,4-diol Chemical compound C[C@@]1([C@]([C@@](O[C@@H]1CO)(N1C=NC=2C(NC)=NC=NC12)C)(O)C)O BCVCDQYRUZGZTF-HKSFMPNISA-N 0.000 description 1
- IXDZFGATLNCIOI-NGJCXOISSA-N (3r,4r,5r)-3,4,5,6-tetrahydroxyhexan-2-one Chemical compound CC(=O)[C@H](O)[C@H](O)[C@H](O)CO IXDZFGATLNCIOI-NGJCXOISSA-N 0.000 description 1
- JOZSYOPADROCMP-UHFFFAOYSA-N 1,3-thiazol-2-ylmethanamine Chemical compound NCC1=NC=CS1 JOZSYOPADROCMP-UHFFFAOYSA-N 0.000 description 1
- NKIJBSVPDYIEAT-UHFFFAOYSA-N 1,4,7,10-tetrazacyclododec-10-ene Chemical compound C1CNCCN=CCNCCN1 NKIJBSVPDYIEAT-UHFFFAOYSA-N 0.000 description 1
- GGXQVNLZJSOZBN-UHFFFAOYSA-N 2,3,4-trimethoxy-5-(methoxymethyl)oxolane Chemical compound COCC1OC(OC)C(OC)C1OC GGXQVNLZJSOZBN-UHFFFAOYSA-N 0.000 description 1
- YTQQIHUQLOZOJI-UHFFFAOYSA-N 2,3-dihydro-1,2-thiazole Chemical compound C1NSC=C1 YTQQIHUQLOZOJI-UHFFFAOYSA-N 0.000 description 1
- YJTBHWXNEMGNDC-UHFFFAOYSA-N 2-amino-1,3-thiazole-5-carbonitrile Chemical compound NC1=NC=C(C#N)S1 YJTBHWXNEMGNDC-UHFFFAOYSA-N 0.000 description 1
- MWBWWFOAEOYUST-UHFFFAOYSA-N 2-aminopurine Chemical compound NC1=NC=C2N=CNC2=N1 MWBWWFOAEOYUST-UHFFFAOYSA-N 0.000 description 1
- JQRDRFSLARHBOX-UHFFFAOYSA-N 4-n,4-n-dimethylpyrimidine-4,5,6-triamine Chemical compound CN(C)C1=NC=NC(N)=C1N JQRDRFSLARHBOX-UHFFFAOYSA-N 0.000 description 1
- ZYRABNSYSYDHMR-UHFFFAOYSA-N 5-(6-aminopurin-9-yl)-2-(hydroxymethyl)-2-methyloxolane-3,4-diol Chemical compound OC1C(O)C(C)(CO)OC1N1C2=NC=NC(N)=C2N=C1 ZYRABNSYSYDHMR-UHFFFAOYSA-N 0.000 description 1
- CKOMXBHMKXXTNW-UHFFFAOYSA-N 6-methyladenine Chemical compound CNC1=NC=NC2=C1N=CN2 CKOMXBHMKXXTNW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- KRGOLPAUEFLYHJ-UHFFFAOYSA-N C1=CC=CC=C1.CC1=CC(C)=CC(C)=C1 Chemical group C1=CC=CC=C1.CC1=CC(C)=CC(C)=C1 KRGOLPAUEFLYHJ-UHFFFAOYSA-N 0.000 description 1
- VBJLWWAQYRUYIM-UHFFFAOYSA-N COCC1COC(C(C1O)O)O Chemical compound COCC1COC(C(C1O)O)O VBJLWWAQYRUYIM-UHFFFAOYSA-N 0.000 description 1
- UIKCJOIPWXIFQY-UHFFFAOYSA-N CP(=O)(O)OP(=O)(O)OP(=O)O Chemical compound CP(=O)(O)OP(=O)(O)OP(=O)O UIKCJOIPWXIFQY-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BVIAOQMSVZHOJM-UHFFFAOYSA-N N(6),N(6)-dimethyladenine Chemical compound CN(C)C1=NC=NC2=C1N=CN2 BVIAOQMSVZHOJM-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 150000003835 adenosine derivatives Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- LCUOIYYHNRBAFS-UHFFFAOYSA-N copper;sulfanylideneindium Chemical compound [Cu].[In]=S LCUOIYYHNRBAFS-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- HYPABJGVBDSCIT-UHFFFAOYSA-N cyclododecene Chemical compound C1CCCCCC=CCCCC1 HYPABJGVBDSCIT-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002338 glycosides Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- ULDUOODSZHJSKE-UHFFFAOYSA-N hydroxymethylphosphanium;hydroxide Chemical compound [OH-].OC[PH3+] ULDUOODSZHJSKE-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- HIQXJRBKNONWAH-UHFFFAOYSA-N methylidenephosphane Chemical compound P=C HIQXJRBKNONWAH-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 150000003212 purines Chemical class 0.000 description 1
- 150000003230 pyrimidines Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 150000003290 ribose derivatives Chemical class 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011885 synergistic combination Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- SFKTYEXKZXBQRQ-UHFFFAOYSA-J thorium(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Th+4] SFKTYEXKZXBQRQ-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本發明係關於一種用於自其上具有化學機械研磨(CMP)後殘留物及污染物之微電子裝置清除該等殘留物及污染物之清潔組成物及方法。該等清潔組成物實質上不含胺及含銨鹽。該組成物達成自微電子裝置之表面高度有效地清除CMP後殘留物及污染物質，而不會損壞低k介電材料或銅互連材料。
Description
本發明大致係關於用於自其上具有殘留物及/或污染物之微電子裝置清除該等物質之組成物。
微電子裝置晶圓被用來形成積體電路。微電子裝置晶圓包括其中經圖案化出用來沈積具有絕緣、導電或半導電性質之不同材料之區域的基板(諸如矽)。
為獲得準確的圖案化，必需將用於在基板上形成層的過剩材料移除。此外，為製造功能性及可靠的電路，應在後續加工之前製備平坦或平面的微電子晶圓表面。因此，需移除及/或研磨微電子裝置晶圓的特定表面。
化學機械研磨或平面化(「CMP」)係一種自微電子裝置晶圓之表面移除材料，並藉由偶合諸如磨蝕之物理過程與諸如氧化或鉗合之化學過程來研磨(更明確言之，平面化)表面的過程。CMP之最基本形式包括將漿液(例如，磨蝕及活性化學物質之溶液)施加至磨光微電子裝置晶圓之表面的研磨墊，以達成移除、平面化、及研磨過程。並不期望移除或研磨過程純粹包括物理或純粹包括化學作用，而係期望兩者的增效組合，以達成快速且均勻的移除。在積體電路之製造中，CMP漿液亦應能優先移除包含金屬及其他材料之
複合層的膜，以致可產生高度平面的表面供後續微影、或圖案化、蝕刻及薄膜加工用。
近來，銅逐漸被用於積體電路中之金屬互連體。在通常用於微電子裝置製造中之電路金屬化的銅鑲嵌製程中，必需經移除及平面化的層包括具有約1-1.5微米厚度之銅層及具有約0.05-0.15微米厚度之銅晶種層。此等銅層藉由一層阻障材料(通常約50-300埃(A)厚，其阻止銅擴散至氧化物介電材料中)與介電材料表面隔離。於研磨後獲得跨越晶圓表面之良好均勻度的一項關鍵係使用針對各材料具有正確移除選擇性的CMP漿液。
前述加工操作，包括晶圓基板表面製備、沈積、電鍍、蝕刻及化學機械研磨，需要不同清潔操作來確保微電子裝置產品不含污染物，否則其將會不利地影響產品功能，或甚至使其無法用於其預期功能。通常，此等污染物的顆粒係小於0.3微米。
在此方面的一個特定問題係於CMP加工後殘留於微電子裝置基板上的殘留物。該等殘留物包括CMP材料及腐蝕抑制劑化合物諸如苯并三唑(BTA)。若未經移除，則此等殘留物會導致損壞銅線或使銅金屬化嚴重變粗糙，以及導致CMP後塗覆層於裝置基板上之不良黏著。銅金屬化之嚴重粗糙化尤其成為問題，因過度粗糙的銅會導致產品微電子裝置之不良電效能。
微電子裝置製造常見之另一個會產生殘留物的過程涉及將經顯影光阻劑塗層之圖案轉移至可由硬光罩、層間介電質(ILD)、及蝕刻終止層組成之下方層的氣相電漿蝕刻。可包括存於基板上及存於電漿氣體中之化學元素的氣相電漿蝕刻後殘留物通常會沈積於後段製程(BEOL)結構上，及若未經移除的話，其會干擾
後續的矽化或接點形成。習知之清潔化學物質通常會損壞ILD，吸收至ILD之孔隙中，因而提高介電常數、及/或腐蝕金屬結構。
技藝中持續需要提供能有效地自基板移除殘留物(例如，CMP後殘留物、蝕刻後殘留物、及灰化後殘留物)的組成物及方法。該等組成物較先前技藝組成物更環保且可包括創新的組分，因此，可被視為係先前技藝之組成物的替代選擇。
本發明大致係關於一種用於自其上具有殘留物及/或污染物之微電子裝置清除該等殘留物及污染物之組成物及方法。本發明之清潔組成物實質上不含胺類及氫氧化四烷基銨。該殘留物可包括CMP後、蝕刻後、及/或灰化後殘留物。
在一態樣中，描述一種包含至少一種非胺pH調節劑/緩衝劑及至少一種溶劑合劑之清潔組成物。
在另一態樣中，描述一種自其上具有殘留物及污染物之微電子裝置移除該等殘留物及污染物之方法，該方法包括使微電子裝置與包含至少一種非胺pH調節劑/緩衝劑及至少一種溶劑合劑之清潔組成物接觸足夠的時間，以自微電子裝置至少部分清除該等殘留物及污染物。
其他態樣、特徵及優點將可由隨後之揭示內容及隨附之申請專利範圍而更完整明瞭。
本發明大致係關於適用於自其上具有殘留物及污染
物之微電子裝置移除該等物質之組成物。該等組成物尤其適用於移除CMP後、蝕刻後或灰化後殘留物。
為容易參考起見，「微電子裝置」係對應於經製造用於微電子、積體電路、或電腦晶片應用中之半導體基板、平板顯示器、相變記憶體裝置、太陽能面板及包括太陽能基板、光伏打元件、及微機電系統(MEMS)的其他產品。太陽能基板包括，但不限於，矽、非晶矽、多晶矽、單晶矽、CdTe、硒化銅銦、硫化銅銦、及砷化鎵/鎵。太陽能基板可為經摻雜或未經摻雜。應瞭解術語「微電子裝置」不具任何限制意味，且包括任何最終將成為微電子裝置或微電子組件的基板。
如本文所用之「殘留物」係相當於在微電子裝置之製造期間(包括，但不限於，電漿蝕刻、灰化、化學機械研磨、濕式蝕刻、及其組合)產生的顆粒。
如本文所用之「污染物」係相當於存在於CMP漿液中之化學物質、研磨漿液之反應副產物、存在於濕式蝕刻組成物中之化學物質、濕式蝕刻組成物之反應副產物、及任何其他作為CMP製程、濕式蝕刻、電漿蝕刻或電漿灰化製程之副產物的物質。
如本文所用之「CMP後殘留物」係相當於來自拋光漿液之顆粒(例如，含矽石顆粒)、存在於漿液中之化學物質、拋光漿液之反應副產物、富碳顆粒、研磨墊顆粒、刷卸載顆粒、設備構造材料顆粒、金屬、金屬氧化物、有機殘留物、及任何其他作為CMP製程之副產物的物質。如本文所定義，通常經研磨的「金屬」包括銅、鋁及鎢。
如本文所定義之「低k介電材料」係相當於任何在層
狀微電子裝置中使用作為介電材料的材料，其中該材料具有小於約3.5之介電常數。低k介電材料較佳包括低極性材料諸如含矽有機聚合物、含矽之有機/無機混合材料、有機矽酸鹽玻璃(OSG)、TEOS、氟化矽酸鹽玻璃(FSG)、二氧化矽、及摻碳氧化物(CDO)玻璃。應明瞭低k介電材料可具有不同密度及不同孔隙度。
如本文所定義，「錯合劑」包括熟悉技藝人士理解為錯合劑、鉗合劑及/或螯合劑的該等化合物。錯合劑將與待使用本文所述之組成物移除的金屬原子及/或金屬離子化學結合或以物理固持。
如本文所定義，術語「阻障材料」係相當於任何在技藝中用來密封金屬線(例如，銅互連體)，以使該金屬(例如，銅)之擴散至介電材料中減至最小的材料。較佳的阻障層材料包括鉭、鈦、釕、鉿、鎢、鈷、及其他耐火金屬及其氮化物及矽化物。
如本文所定義，「蝕刻後殘留物」係相當於在氣相電漿蝕刻製程(例如，BEOL雙重鑲嵌加工)、或濕式蝕刻製程後殘留的材料。蝕刻後殘留物之性質可為有機、有機金屬、有機矽、或無機，例如，含矽材料、碳基有機材料、及蝕刻氣體殘留物(諸如氧及氟)。
如本文所定義，本文所使用之「灰化後殘留物」係相當於在用來移除硬化光阻劑及/或底部抗反射塗層(BARC)材料之氧化或還原電漿灰化後殘留的材料。灰化後殘留物之性質可為有機、有機金屬、有機矽、或無機。
「實質上不含」在本文係定義為小於2重量%，較佳小於1重量%，更佳小於0.5重量%，及最佳小於0.1重量%。「不
含」係相當於0%。
如本文所使用之「約」係意指相當於所述值之±5%。
如本文所定義，「反應或降解產物」包括，但不限於，由於在表面處之催化作用、氧化、還原、與組成物組分之反應、或者其他聚合作用所形成之產物或副產物；由於物質或材料(例如，分子、化合物等)與其他物質或材料組合、與其他物質或材料交換組分、分解、重組、或以其他方式化學及/或物理改變之變化或轉變所形成之產物或副產物，包括前述反應、變化及/或轉變之任何前述或任何組合之中間產物或副產物。應明瞭反應或降解產物可具有較原始反應物更大或更小的莫耳質量。
如本文所用，「適用」於自其上具有殘留物及污染物之微電子裝置清除該等殘留物及污染物係相當於自該微電子裝置至少部分移除該等殘留物/污染物。清潔效力係藉由在微電子裝置上的物體減少來評定。舉例來說，可使用原子力顯微鏡來進行清潔前及清潔後分析。可將樣品上之顆粒登錄為一像數範圍。可應用直方圖(例如，Sigma Scan Pro)來過濾特定強度(例如，231-235)中之像素，且計算顆粒數目。顆粒減少可使用下式來計算：
值得注意地，清潔效力之測定方法僅係提供作為實例，而不意欲對其造成限制。或者，可將清潔效力視為經顆粒物質覆蓋之總表面的百分比。舉例來說，AFM可經程式化以執行z平面掃描，來識別高於一特定高度臨限值之相關形貌面積，然後再計算經該相關面積覆蓋之總表面面積。熟悉技藝人士當可輕易明瞭在清潔後經該相
關面積覆蓋的面積愈小，清潔組成物就愈有效。較佳地，使用文中所述之組成物自微電子裝置移除至少75%之殘留物/污染物，更佳至少90%，再更佳至少95%，及最佳移除至少99%之殘留物/污染物。
本文所述之組成物可以如更完整說明於下文之相當多樣的特定配方具體實施。
在所有此等組成物中，當參照包括下限零之重量百分比範圍論述組成物之特定組分時，當明瞭在組成物之各種特定具體例中可存在或不存在此等組分，且在存在此等組分之情況中，其可以基於其中使用此等組分之組成物之總重量計低至0.001重量百分比之濃度存在。
在第一態樣中，清潔組成物包含至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、視需要之至少一種錯合劑、視需要之至少一種界面活性劑、及視需要之至少一種腐蝕抑制劑。在一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、及至少一種溶劑合劑。在另一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、及至少一種錯合劑。在又另一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、及至少一種界面活性劑。在又另一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、及至少一種腐蝕抑制劑。在另一具體例中，清潔組成物包含
以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、至少一種錯合劑、及至少一種界面活性劑。在又另一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、至少一種錯合劑、及至少一種腐蝕抑制劑。在又另一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、視需要之至少一種界面活性劑、及至少一種腐蝕抑制劑。在另一具體例中，清潔組成物包含以下組分，由其所組成，或基本上由其所組成：至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、至少一種錯合劑、至少一種界面活性劑、及至少一種腐蝕抑制劑。
不管何種具體例，文中所述之清潔組成物皆實質上不含或不含胺及含銨鹽，例如四級銨鹼。此外，組成物在使用(例如，清潔化學物質)前較佳實質上不含或不含下列中之至少一者：氧化劑；含氟化物來源；研磨材料；交聯有機聚合物顆粒；及其組合。此外，清潔組成物不應固化形成聚合固體，例如光阻劑。關於本發明，「胺」係定義為至少一種一級、二級、或三級胺、氨、及/或氫氧化四級銨化合物(例如，氫氧化銨、氫氧化烷基銨、氫氧化烷基芳基銨等)，其限制條件為(i)醯胺基、(ii)同時包括羧酸基及胺基之物質、(iii)包括胺基之界面活性劑、及(iv)其中之胺基係取代基(例如，附接至芳基或雜環部分)的物質，不被視為根據此定義之「胺」。胺之化學式可以NR1R2R3表示，其中R1、R2及R3可彼此相同或不同且係選自由氫、直鏈或分支鏈C1-C6烷基(例如，甲基、乙基、丙
基、丁基、戊基、己基)、C6-C10芳基(例如，苄基)、直鏈或分支鏈C1-C6烷醇(例如，甲醇、乙醇、丙醇、丁醇、戊醇、己醇)、及其組合所組成之群，其限制條件為R1、R2及R3不可皆為氫。氫氧化四級銨化合物具有通式R1R2R3R4NOH，其中R1、R2、R3及R4係彼此相同或不同且係氫、C1-C6烷基(例如，甲基、乙基、丙基、丁基、戊基或己基)、及經取代或未經取代之C6-C10芳基(例如，苄基)；及烷醇胺。
該至少一種非胺pH調節劑/緩衝劑包括鏻離子且具有通式R1R2R3R4POH，其中R1、R2、R3及R4係彼此相同或不同且係氫、C1-C6烷基(例如，甲基、乙基、丙基、丁基、戊基或己基)、及經取代或未經取代之C6-C10芳基(例如，苄基)，例如，下列中之至少一者：氫氧化四丁基鏻(TBPH)、氫氧化四甲基鏻、氫氧化四乙基鏻、氫氧化四丙基鏻、氫氧化苄基三苯鏻、氫氧化甲基三苯鏻、氫氧化乙基三苯鏻、氫氧化N-丙基三苯鏻、氫氧化肆(羥甲基)鏻、及其組合。較佳地，該至少一種非胺pH調節劑/緩衝劑包括TBPH。除含鏻離子的pH調節劑外，亦可將氫氧化鉀、氫氧化銫、及氫氧化銣添加至清潔組成物。
該至少一種溶劑合劑包括水、多元醇、碸、或其組合中之至少一者，其中該多元醇可包括至少一種選自由下列所組成之群之物質：乙二醇、丙二醇、新戊二醇、甘油(亦稱為丙三醇)、二甘醇、二丙二醇、1,4-丁二醇、2,3-丁二醇、1,3-戊二醇、1,4-戊二醇、1,5-戊二醇、及其組合。該碸可包括至少一種選自由下列所組成之群之物質：四亞甲碸(環丁碸)、二甲碸、二乙碸、雙(2-羥乙基)碸、甲基環丁碸、乙基環丁碸、及其組合。或者，或除此之外，該
至少一種溶劑合劑可包括1,2-羥乙基吡咯啶酮。較佳地，該至少一種有機溶劑包括水、四亞甲碸、或其組合。
該錯合劑可包括下列中之至少一者：乙二胺四乙酸(EDTA)、1,2-環己烷二胺-N,N,N’,N’-四乙酸(CDTA)、4-(2-羥乙基)啉(HEM)、N-胺乙基哌苊(N-AEP)、甘胺酸、抗壞血酸、亞胺二乙酸(IDA)、2-(羥乙基)亞胺二乙酸(HIDA)、氮基三乙酸、丙胺酸、精胺酸、天冬醯胺酸、天門冬胺酸、半胱胺酸、麩胺酸、麩胺醯胺、組胺酸、異白胺酸、白胺酸、離胺酸、甲硫胺酸、苯基丙胺酸、脯胺酸、絲胺酸、蘇胺酸、色胺酸、酪胺酸、纈胺酸、五倍子酸、硼酸、乙酸、丙酮肟、丙烯酸、己二酸、甜菜鹼、二甲基乙二肟、甲酸、反丁烯二酸、葡萄糖酸、戊二酸、甘油酸、羥乙酸、乙醛酸、間苯二甲酸、衣康酸、乳酸、順丁烯二酸、順丁烯二酸酐、蘋果酸、丙二酸、苯乙醇酸、2,4-戊二酮、苯基乙酸、酞酸、脯胺酸、丙酸、鄰苯二酚、苯均四酸、金雞納酸(quinic acid)、山梨糖醇、琥珀酸、酒石酸、對苯二甲酸、偏苯三甲酸、對稱苯三甲酸、酪胺酸、木醣醇、1,5,9-三吖環十二烷-N,N’,N”-參(亞甲基膦酸)(DOTRP)、1,4,7,10-四吖環十二烷-N,N’,N”,N’”-肆(亞甲基膦酸)(DOTP)、氮基參(亞甲基)三膦酸、二伸乙三胺五(亞甲基膦酸)(DETAP)、胺基三(亞甲基膦酸)、1-羥亞乙基-1,1-二膦酸(HEDP)、雙(六亞甲基)三胺膦酸、1,4,7-三吖環壬烷-N,N’,N”-參(亞甲基膦酸)(NOTP)、二硫甘油(dimercaprol)、1,2-丙二硫醇、1,2-二巰丙烷、其鹽及衍生物、及其組合。較佳地，該至少一種錯合劑包括硼酸、HEDP、酒石酸、半胱胺酸、或其組合。當使用時，該硼酸可有利地協助緩衝作用。
該至少一種腐蝕抑制劑係經添加至清潔組成物中來
降低金屬(例如，銅、鋁)之腐蝕速率、以及增進清潔效能。涵蓋的腐蝕抑制劑包括，但不限於：正十二烷基膦酸、4-甲基吡唑、吡唑、2-胺基噻唑、2-胺基-1,3,4-噻二唑、5-胺基-1H-四唑、1,2,4-三唑、2-巰基苯并咪唑(MBI)、4-甲基-2-苯基咪唑、咪唑、喋呤、嘧啶、吡苊、胞嘧啶、嗒苊、1H-吡唑-3-羧酸、1H-吡唑-4-羧酸、3-胺基-5-羥基-1H-吡唑、3-胺基-5-甲基-1H-吡唑、3-胺基-5-第三丁基-1H-吡唑、2-胺基-甲基噻唑、2-巰基噻唑、2,5-二巰基-1,3,4-噻二唑、2-巰基-5-甲基-1,3,4-噻二唑、2-胺基噻唑-5-甲腈、2-胺基噻唑-5-甲醛、2-胺基噻唑-4-羧酸乙酯、其衍生物、及其組合。或者，或除此之外，腐蝕抑制劑可包含至少一種選自由下列所組成之群之嘌呤物質：核糖苷基嘌呤諸如N-核糖苷基嘌呤、腺苷、鳥苷、2-胺基嘌呤核糖苷、2-甲氧基腺苷、及其之甲基化或去氧衍生物，諸如N-甲基腺苷(C11H15N5O4)、N,N-二甲基腺苷(C12H17N5O4)、三甲基化腺苷(C13H19N5O4)、三甲基N-甲基腺苷(C14H21N5O4)、C-4’-甲基腺苷、及3-去氧腺苷；腺苷之降解產物及腺苷衍生物，包括，但不限於，腺嘌呤(C5H5N5)、甲基化腺嘌呤(例如，N-甲基-7H-嘌呤-6-胺，C6H7N5)、二甲基化腺嘌呤(例如，N,N-二甲基-7H-嘌呤-6-胺，C7H9N5)、N4,N4-二甲基嘧啶-4,5,6-三胺(C6H11N5)、4,5,6-三胺基嘧啶、尿囊素(C4H6N4O3)、羥基化C-O-O-C二聚物((C5H4N5O2)2)、C-C橋連二聚物((C5H4N5)2或(C5H4N5O)2)、核糖(C5H10O5)、甲基化核糖(例如，5-(甲氧甲基)四氫呋喃-2,3,4-三醇，C6H12O5)、四甲基化核糖(例如，2,3,4-三甲氧基-5-(甲氧甲基)四氫呋喃，C9H18O5)、及其他核糖衍生物諸如甲基化水解二核糖化合物；嘌呤-醣複合物，包括，但不限於，木糖、葡萄糖等；其他嘌呤化合物諸如嘌呤、鳥嘌
呤、次黃嘌呤、黃嘌呤、可可鹼、咖啡因、尿酸、及異鳥嘌呤、及其甲基化或去氧衍生物；三胺基嘧啶及其他經取代嘧啶諸如經胺基取代之嘧啶；任何化合物之二聚物、三聚物或聚合物、其之反應或降解產物、或衍生物；及其組合。
用於文中所述組成物中之說明性的界面活性劑包括，但不限於，兩性鹽、陽離子性界面活性劑、陰離子性界面活性劑、氟烷基界面活性劑、非離子性界面活性劑、及其組合，包括，但不限於，SURFONYL® 104、TRITON® CF-21、ZONYL® UR、ZONYL® FSO-100、ZONYL® FSN-100、3M Fluorad氟界面活性劑(即FC-4430及FC-4432)、二辛基磺基琥珀酸鹽、2,3-二巰基-1-丙磺酸鹽、十二烷基苯磺酸、聚乙二醇、聚丙二醇、聚乙二醇或聚丙二醇醚、羧酸鹽、R1苯磺酸或其鹽(其中R1係直鏈或分支鏈C8-C18烷基)、兩親性氟聚合物、聚乙二醇、聚丙二醇、聚乙二醇或聚丙二醇醚、羧酸鹽、十二烷基苯磺酸、聚丙烯酸酯聚合物、二壬苯基聚氧乙烯、聚矽氧或經改質之聚矽氧聚合物、炔屬二醇或經改質之炔屬二醇、烷基銨或經改質之烷基銨鹽，以及包含至少一種前述界面活性劑之組合、十二烷基硫酸鈉、兩性離子界面活性劑、氣溶膠-OT(AOT)及其氟化類似物、烷基銨、全氟聚醚界面活性劑、2-磺基琥珀酸酯鹽、基於磷酸鹽之界面活性劑、基於硫之界面活性劑、TRITON® X-100、Pluronic F0127、及基於乙醯乙酸酯之聚合物。
文中所述清潔組成物之pH係大於7，較佳在約8至約14之範圍內，更佳在約8.5至約11.5之範圍內。
應明瞭文中所述之清潔組成物可進一步包含殘留物及/或污染物。殘留物及污染物可溶解於清潔組成物中。或者，殘
留物及污染物可懸浮於清潔組成物中。殘留物較佳包括CMP後殘留物、蝕刻後殘留物、灰化後殘留物、污染物、或其組合。
不管本發明之具體例為何，若該至少一種非胺pH調節劑/緩衝劑包括鏻離子且該組成物進一步包括至少一種膦酸根離子、水、及至少一種界面活性劑，則該組成物必需進一步包括至少一種非膦酸根離子錯合劑、至少一種非膦酸鹽腐蝕抑制劑、至少一種非水溶劑合劑、或其任何組合。或者，若該至少一種非胺pH調節劑/緩衝劑包括鏻離子且該組成物進一步包括至少一種膦酸根離子、水、及至少一種界面活性劑，則該組成物必需進一步包括將氮原子引入至配方中之組分，其中該將氮原子引入至配方中之組分包括含氮酸、含氮鹼或任何其他會將氮原子引入至配方中之組分或化合物。或者，溶液之pH係大於7。
清潔組成物較佳係經調配成濃縮形式及在使用時或使用前方才用稀釋劑(例如，至少一種溶劑合劑)稀釋。濃縮的清潔組成物可調配如下，其中所有百分比係基於配方之總重量以重量計：
當存在時，濃縮物中之錯合劑、腐蝕抑制劑及界面活性劑之下限係約0.01重量%。
清潔組成物係經由簡單地添加各別成分及混合至均勻狀態而容易地調配得。此外，可輕易地將清潔組成物調配為在使
用點處或使用點之前混合的單一包裝配方或多份配方，例如，可將多份配方之個別份於工具處或於工具上游之儲槽中混合。各別成分的濃度可在組成物的特定倍數內寬廣地改變，即更稀或更濃，且當明瞭本文所述之組成物可變化及替代地包含與本文之揭示內容一致之成分的任何組合，由其所組成，或基本上由其所組成。
在一具體例中，提供可經稀釋用作清潔溶液之濃縮清潔組成物。濃縮清潔組成物或「濃縮物」有利地容許使用者(例如，CMP製程工程師)在使用點將濃縮物稀釋至期望濃度及pH。濃縮清潔組成物之稀釋可在約1：1至約2500：1之範圍內，較佳約5：1至約200：1，及最佳約10：1至約50：1，其中清潔組成物係在工具處或工具之前方才用至少一種溶劑合劑(例如，去離子水)稀釋。
清潔組成物可有用於包括，但不限於，蝕刻後殘留物移除、灰化後殘留物移除表面製備、電鍍後清潔及CMP後殘留物移除的應用。此外，涵蓋清潔組成物可有用於清潔及保護其他金屬(例如，含銅)產品，包括，但不限於，裝飾性金屬、金屬線接合、印刷電路板及其他使用金屬或金屬合金之電子封裝。
因此，另一態樣係關於一種套組，其包括存於一或多個容器中之一或多種適於形成本文所述之清潔組成物的組分。套組可包括用於在工廠或使用點處與至少一種溶劑合劑(例如，水)結合之存於一或多個容器中之至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、視需要之至少一種錯合劑、視需要之至少一種界面活性劑、及視需要之至少一種腐蝕抑制劑。套組之容器必需適於儲存及運送該等清潔組成物，例如，NOWPak®容器(Advanced Technology Materials,Inc.,Danbury,Conn.,USA)。套組容器較佳實
質上不含或不含胺及含銨鹽，例如四級銨鹼；氧化劑；含氟化物來源；研磨材料；交聯有機聚合物顆粒；及其組合。此外，清潔組成物之組分不應固化形成聚合固體。
當應用至微電子製造操作時，清潔組成物可有效用於自微電子裝置之表面清潔殘留物(例如，CMP後殘留物)及/或污染物。清潔組成物不會損壞低k介電材料或腐蝕裝置表面上的金屬互連體。清潔組成物較佳移除在殘留物移除前存在於裝置上之殘留物的至少85%，更佳至少90%，再更佳至少95%，及最佳至少99%。
在CMP後殘留物及污染物清潔應用中，清潔組成物可配合相當多樣之習知清潔工具諸如超音波震盪(megasonics)及刷洗使用，其包括，但不限於，Verteq單晶圓超音波震盪Goldfinger、OnTrak系統DDS(雙面洗滌器)、SEZ或其他單晶圓噴霧洗滌、Applied Materials Mirra-MesaTM/ReflexionTM/Reflexion LKTM、及Megasonic批式濕式台面系統。
在使用組成物於自其上具有CMP後殘留物、蝕刻後殘留物、灰化後殘留物及/或污染物之微電子裝置清除該等物質時，使稀釋後的清潔組成物與裝置在約20℃至約90℃範圍內之溫度下(較佳約20℃至約50℃)接觸約5秒至約10分鐘之時間(較佳約1秒至20分鐘，較佳約15秒至約5分鐘)。此等接觸時間及溫度係為說明性，在方法的廣泛實務中，可採用任何其他可有效於自裝置至少部分地清除殘留物(例如，CMP後殘留物)及/或污染物的適當時間及溫度條件。「至少部分地清除」及「實質移除」皆係相當於移除在殘留物移除前存在於裝置上之殘留物的至少85%，更佳至少90%，再更佳至少95%，及最佳至少99%。
於達成期望的清潔作用後，可輕易地將清潔組成物自其先前經施用的裝置移除，此可能係在本文所述組成物之指定最終應用中所需且有效。沖洗溶液較佳包括去離子水。其後可使用氮氣或旋轉乾燥循環乾燥裝置。
又另一態樣係關於根據本文所述方法製得之改良的微電子裝置，及含有該等微電子裝置之產品。
另一態樣係關於一種經再循環的清潔組成物，其中該清潔組成物可經再循環直至殘留物及/或污染物載入量達到清潔組成物所可容納之最大量為止，此係可由熟悉技藝人士輕易地決定。
又再一態樣係關於製造包含微電子裝置之物件的方法，該方法包括使用文中所述之清潔組成物，使微電子裝置與清潔組成物接觸足夠的時間，以自其上具有CMP後殘留物及污染物之微電子裝置清除該等殘留物及污染物，及將該微電子裝置併入至該物件中。
在另一態樣中，描述一種自其上具有CMP後殘留物及污染物之微電子裝置移除該等物質之方法，該方法包括：使用CMP漿液研磨微電子裝置；使微電子裝置與包含至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、視需要之至少一種錯合劑、視需要之至少一種界面活性劑、及視需要之至少一種腐蝕抑制劑之清潔組成物接觸足夠的時間，以自微電子裝置移除CMP後殘留物及污染物，而形成含有CMP後殘留物之組成物，其中該清潔組成物實質上不含或不含胺及含銨鹽，例如四級銨鹼；氧化劑；含氟化物來源；研磨材料；交聯
有機聚合物顆粒；及其組合；及使微電子裝置與含有CMP後殘留物之組成物持續接觸足夠的時間長度，以達成微電子裝置的實質清潔。
另一態樣係關於一種包含清潔組成物、微電子裝置晶圓、及選自由殘留物、污染物及其組合所組成之群之物質的製造物件，其中該清潔組成物包含至少一種非胺pH調節劑/緩衝劑、至少一種溶劑合劑、視需要之至少一種錯合劑、視需要之至少一種界面活性劑、及視需要之至少一種腐蝕抑制劑，其中該清潔組成物實質上不含或不含胺及含銨鹽，例如四級銨鹼；氧化劑；含氟化物來源；研磨材料；交聯有機聚合物顆粒；及其組合，及該殘留物包括CMP後殘留物、蝕刻後殘留物及灰化後殘留物中至少一者。
雖然本發明已參照說明具體例及特徵以不同方式揭示於文中，但當明瞭前文所述之具體例及特徵並非要限制本發明，且熟悉技藝人士當可基於文中之揭示內容明白其他的變化、修改及其他具體例。因此，本發明係應廣泛解釋為涵蓋在後文所述之申請專利範圍之精神及範疇內的所有此等變化、修改及替代具體例。
Claims (13)
- 一種清潔組成物，其包含至少一種非胺pH調節劑/緩衝劑及至少一種溶劑合劑，其中該至少一種非胺pH調節劑/緩衝劑的量為0.01重量%至10重量%且包括具有式R1R2R3R4POH之鏻物質，其中R1、R2、R3及R4係彼此相同或不同且係氫、C1-C6烷基、經取代之C6-C10芳基、及未經取代之C6-C10芳基，及其中該至少一種溶劑合劑的量為25重量%至99重量%且包括選自由下列所組成之群之物質：水、乙二醇、丙二醇、新戊二醇、甘油、二甘醇、二丙二醇、1,4-丁二醇、2,3-丁二醇、1,3-戊二醇、1,4-戊二醇、1,5-戊二醇、四亞甲碸(環丁碸)、二甲碸、二乙碸、雙(2-羥乙基)碸、甲基環丁碸、乙基環丁碸、1,2-羥乙基吡咯啶酮、及其組合。
- 如請求項1之清潔組成物，其中，該至少一種非胺pH調節劑/緩衝劑包括選自由下列所組成之群之物質：氫氧化四丁基鏻(TBPH)、氫氧化四甲基鏻、氫氧化四乙基鏻、氫氧化四丙基鏻、氫氧化苄基三苯鏻、氫氧化甲基三苯鏻、氫氧化乙基三苯鏻、氫氧化N-丙基三苯鏻、氫氧化肆(羥甲基)鏻、及其組合。
- 如請求項1之清潔組成物，其中，該至少一種非胺pH調節劑/緩衝劑包括氫氧化四丁基鏻。
- 如請求項1至3中任一項之清潔組成物，其進一步包括氫氧化鉀、氫氧化銫、或氫氧化銣。
- 如請求項1至3中任一項之清潔組成物，其進一步包含下列之至少一者：至少一種錯合劑，其量為0.01重量%至25重量%；至少一種界面活性劑，其量為0.01重量%至5重量%；及至少一種腐蝕抑制劑，其量為0.01重量%至5重量%。
- 如請求項5之清潔組成物，其包含該至少一種錯合劑，其中該至少一種錯合劑包括選自由下列所組成之群之物質：乙二胺四乙酸(EDTA)、1,2-環己烷二胺-N,N,N’,N’-四乙酸(CDTA)、4-(2-羥乙基)啉(HEM)、N-胺乙基哌苊(N-AEP)、甘胺酸、抗壞血酸、亞胺二乙酸(IDA)、2-(羥乙基)亞胺二乙酸(HIDA)、氮基三乙酸、丙胺酸、精胺酸、天冬醯胺酸、天門冬胺酸、半胱胺酸、麩胺酸、麩胺醯胺、組胺酸、異白胺酸、白胺酸、離胺酸、甲硫胺酸、苯基丙胺酸、脯胺酸、絲胺酸、蘇胺酸、色胺酸、酪胺酸、纈胺酸、五倍子酸、硼酸、乙酸、丙酮肟、丙烯酸、己二酸、甜菜鹼、二甲基乙二肟、甲酸、反丁烯二酸、葡萄糖酸、戊二酸、甘油酸、羥乙酸、乙醛酸、間苯二甲酸、衣康酸、乳酸、順丁烯二酸、順丁烯二酸酐、蘋果酸、丙二酸、苯乙醇酸、2,4-戊二酮、苯基乙酸、酞酸、丙酸、鄰苯二酚、苯均四酸、金雞納酸(quinic acid)、山梨糖醇、琥珀酸、酒石酸、對苯二甲酸、偏苯三甲酸、對稱苯三甲酸、木醣醇、1,5,9-三吖環十二烷-N,N’,N”-參(亞甲基膦酸)(DOTRP)、1,4,7,10-四吖環十二烷-N,N’,N”,N’”-肆(亞甲基膦酸)(DOTP)、氮基參(亞甲基)三膦酸、二伸乙三胺五(亞甲基膦酸)(DETAP)、胺基三(亞甲基膦酸)、1-羥亞乙基-1,1-二膦酸(HEDP)、雙(六亞甲基)三胺膦酸、1,4,7-三吖環壬烷-N,N’,N”-參(亞甲基膦酸)(NOTP)、二硫甘油(dimercaprol)、1,2-丙二硫醇、1,2-二巰丙烷、其鹽及衍生物、及其組合。
- 如請求項6之清潔組成物，其中該至少一種錯合劑包括選自由下列所組成之群之物質：HEDP、酒石酸、半胱胺酸、及其任何組合。
- 如請求項5之清潔組成物，其包含該至少一種腐蝕抑制劑，其中該至少一種腐蝕抑制劑包括選自由下列所組成之群之物質：正十二烷基膦酸、4-甲基吡唑、吡唑、2-胺基噻唑、2-胺基-1,3,4-噻二唑、5-胺基-1H-四唑、1,2,4-三唑、2-巰基苯并咪唑(MBI)、4-甲基-2-苯基咪唑、咪唑、喋呤、嘧啶、吡苊、胞嘧啶、嗒苊、1H-吡唑-3-羧酸、1H-吡唑-4-羧酸、3-胺基-5-羥基-1H-吡唑、3-胺基-5-甲基-1H-吡唑、3-胺基-5-第三丁基-1H-吡唑、2-胺基-甲基噻唑、2-巰基噻唑、2,5-二巰基-1,3,4-噻二唑、2-巰基-5-甲基-1,3,4-噻二唑、2-胺基噻唑-5-甲腈、2-胺基噻唑-5-甲醛、2-胺基噻唑-4-羧酸乙酯、N-核糖苷基嘌呤、腺苷、鳥苷、2-胺基嘌呤核糖苷、2-甲氧基腺苷、N-甲基腺苷(C11H15N5O4)、N,N-二甲基腺苷(C12H17N5O4)、三甲基化腺苷(C13H19N5O4)、三甲基N-甲基腺苷(C14H21N5O4)、C-4’-甲基腺苷、3-去氧腺苷；腺嘌呤(C5H5N5)、甲基化腺嘌呤、二甲基化腺嘌呤、N4,N4-二甲基嘧啶-4,5,6-三胺(C6H11N5)、4,5,6-三胺基嘧啶、尿囊素(C4H6N4O3)、羥基化C-O-O-C二聚物((C5H4N5O2)2)、C-C橋連二聚物((C5H4N5)2或(C5H4N5O)2)、核糖(C5H10O5)、甲基化核糖、四甲基化核糖、木糖、葡萄糖、嘌呤、鳥嘌呤、次黃嘌呤、黃嘌呤、可可鹼、咖啡因、尿酸、異鳥嘌呤、三胺基嘧啶、及其組合。
- 如請求項5之清潔組成物，其包含選自由下列所組成之群之該至少一種界面活性劑：SURFONYL® 104、TRITON® CF-21、TRITON® CF-10、TRITON® X-100、ZONYL® UR、ZONYL® FSO-100、ZONYL® FSN-100、3M Fluorad氟界面活性劑、二辛基磺基琥珀酸鹽、2,3-二巰基-1-丙磺酸鹽、聚乙二醇、聚丙二醇、聚乙二醇醚、聚丙二醇醚、羧酸鹽、烷基苯磺酸、兩親性氟聚合物、C8-C18烷基磷酸酯醚、烷基芳基膦酸、聚丙烯酸酯聚合物、二壬苯基聚氧乙烯、聚乙氧基化脫水山梨糖醇、脫水山梨糖醇、聚矽氧聚合物、經改質之聚矽氧聚合物、炔屬二醇、經改質之炔屬二醇、烷基銨鹽、經改質之烷基銨鹽、十二烷基硫酸鈉、全氟聚醚界面活性劑、2-磺基琥珀酸酯鹽、基於磷酸鹽之界面活性劑、基於硫之界面活性劑、基於乙醯乙酸酯之聚合物、Pluronic F0127、及其組合。
- 如請求項5之清潔組成物，其包含選自由下列所組成之群之該至少一種界面活性劑：經改質之聚矽氧聚合物、經改質之炔屬二醇、經改質之烷基銨鹽、及其組合。
- 如請求項1至3中任一項之清潔組成物，其中，pH係大於7。
- 如請求項1至3中任一項之清潔組成物，其中，若該組成物進一步包括至少一種膦酸根離子、水、及至少一種界面活性劑，則該組成物必需進一步包括至少一種非膦酸根離子錯合劑、至少一種非膦酸鹽腐蝕抑制劑、至少一種非水溶劑合劑、或其任何組合。
- 一種自其上具有殘留物及污染物之微電子裝置移除該等殘留物及污染物之方法，該方法包括使該微電子裝置與如請求項1之清潔組成物接觸足夠的時間以自該微電子裝置至少部分清除該等殘留物及污染物。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461933010P | 2014-01-29 | 2014-01-29 | |
| US61/933,010 | 2014-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201542808A TW201542808A (zh) | 2015-11-16 |
| TWI671395B true TWI671395B (zh) | 2019-09-11 |
Family
ID=53757685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104102984A TWI671395B (zh) | 2014-01-29 | 2015-01-29 | 化學機械研磨後配方及其使用方法 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI671395B (zh) |
| WO (1) | WO2015116679A1 (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6776125B2 (ja) | 2013-12-20 | 2020-10-28 | インテグリス・インコーポレーテッド | イオン注入レジストの除去のための非酸化性の強酸の使用 |
| WO2015116818A1 (en) | 2014-01-29 | 2015-08-06 | Advanced Technology Materials, Inc. | Post chemical mechanical polishing formulations and method of use |
| WO2015119925A1 (en) | 2014-02-05 | 2015-08-13 | Advanced Technology Materials, Inc. | Non-amine post-cmp compositions and method of use |
| CN107300839B (zh) * | 2017-07-25 | 2019-06-07 | 上海新阳半导体材料股份有限公司 | 一种含氟等离子刻蚀残留物清洗液、其制备方法和应用 |
| CN107229192B (zh) * | 2017-07-25 | 2019-05-10 | 上海新阳半导体材料股份有限公司 | 一种含氟等离子刻蚀残留物清洗液、其制备方法和应用 |
| CN107229194B (zh) * | 2017-07-25 | 2019-05-10 | 上海新阳半导体材料股份有限公司 | 一种含氟等离子刻蚀残留物清洗液、其制备方法和应用 |
| WO2022054762A1 (ja) * | 2020-09-09 | 2022-03-17 | ダイキン工業株式会社 | 被覆用組成物及び被覆物品 |
| CN114561020B (zh) * | 2022-02-28 | 2023-06-02 | 上海健康医学院 | 一种电化学传感器用金属有机骨架-Cu纳米材料及其制备方法与应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200728454A (en) * | 2005-11-08 | 2007-08-01 | Advanced Tech Materials | Formulations for removing copper-containing post-etch residue from microelectronic devices |
| TW201319246A (zh) * | 2011-08-22 | 2013-05-16 | Ekc Technology Inc | 用於清潔化學機械拋光後基板之組合物 |
| TW201343905A (zh) * | 2012-02-15 | 2013-11-01 | Advanced Tech Materials | 利用後段化學機械拋光移除之組成物及其使用方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6194366B1 (en) * | 1999-11-16 | 2001-02-27 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| US20070225186A1 (en) * | 2006-03-27 | 2007-09-27 | Matthew Fisher | Alkaline solutions for post CMP cleaning processes |
| US7919446B1 (en) * | 2007-12-28 | 2011-04-05 | Intermolecular, Inc. | Post-CMP cleaning compositions and methods of using same |
| US8754021B2 (en) * | 2009-02-27 | 2014-06-17 | Advanced Technology Materials, Inc. | Non-amine post-CMP composition and method of use |
-
2015
- 2015-01-28 WO PCT/US2015/013286 patent/WO2015116679A1/en active Application Filing
- 2015-01-29 TW TW104102984A patent/TWI671395B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200728454A (en) * | 2005-11-08 | 2007-08-01 | Advanced Tech Materials | Formulations for removing copper-containing post-etch residue from microelectronic devices |
| TW201319246A (zh) * | 2011-08-22 | 2013-05-16 | Ekc Technology Inc | 用於清潔化學機械拋光後基板之組合物 |
| TW201343905A (zh) * | 2012-02-15 | 2013-11-01 | Advanced Tech Materials | 利用後段化學機械拋光移除之組成物及其使用方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015116679A1 (en) | 2015-08-06 |
| TW201542808A (zh) | 2015-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI659098B (zh) | 化學機械研磨後配方及其使用方法 | |
| TWI671395B (zh) | 化學機械研磨後配方及其使用方法 | |
| JP6133959B2 (ja) | 銅の洗浄及び保護配合物 | |
| TWI726859B (zh) | 後化學機械拋光配方及使用之方法 | |
| JP5647517B2 (ja) | Ｃｍｐ後洗浄配合物用の新規な酸化防止剤 | |
| EP2768920A1 (en) | Non-amine post-cmp composition and method of use | |
| WO2013142250A1 (en) | Post-cmp formulation having improved barrier layer compatibility and cleaning performance | |
| WO2013138278A1 (en) | Copper cleaning and protection formulations |