TWI671003B - Heat disspation device and server using the same - Google Patents

Abstract

A server includes a heat sink and a heat generating module, and the heat sink is configured to dissipate heat from the heat generating module. The heat dissipating device comprises a tank body, an inlet pipe and an outlet pipe, wherein the tank body is for accommodating a cooling liquid and the heat generating module, and the cooling liquid enters the tank body through the water inlet pipe, the coolant The water outlet pipe is discharged from the casing. In this way, the coolant will circulate heat to the heat generating module of the server.

Description

Heat sink and server applying the heat sink

The invention relates to a heat sink and a server applying the heat sink.

With the rapid development of cloud computing and the high performance requirements of servers, the heat dissipation requirements for servers will also become higher and higher.

In the prior art, air cooling technology is generally used to dissipate the server. However, the conventional air cooling technology requires a large amount of space and cannot meet the heat dissipation requirement of the high-density power efficiency of the server.

In view of the above, it is necessary to provide a heat sink and a server to which the heat sink is applied.

a heat dissipating device for dissipating heat for a heat generating module, the heat dissipating device comprising: a box body for accommodating a cooling liquid and the heat generating module, the cooling liquid immersing the heat generating module; the water inlet pipe, the inlet a water pipe connected to the tank, the coolant entering the tank through the inlet pipe; and an outlet pipe connecting the tank, the coolant being discharged from the tank by the outlet pipe Discharged inside the box.

Further, the cooling liquid is a non-conductive insulating liquid.

Further, the two sides of the box are further provided with a sliding rail that interfaces with the standard cabinet.

A server includes a heat dissipating device and a heat generating module, wherein the heat dissipating device is configured to dissipate heat for the heat generating module, and the heat dissipating device comprises: a box body for accommodating a cooling liquid and the heat generating module, the cooling The liquid immersing the heat generating module; the water inlet pipe, the water inlet pipe is connected to the tank body, the coolant is introduced into the tank body through the water inlet pipe; and the water outlet pipe is connected to the tank body The coolant is discharged from the tank through the outlet pipe.

Further, the server further includes a motherboard, the motherboard is fixed in the casing, and the motherboard is provided with a slot that interfaces with the heating module.

Further, the heat generating module includes a casing, a circuit board and a gold finger, the circuit board is fixedly connected to the inside of the casing, and the gold finger is inserted into the slot.

Further, the heat generating module further includes a heat exchanger and a heat generating wafer, and the heat exchanger is in contact with the heat generating wafer for dissipating heat for the heat generating chip.

Further, the heating module is further provided with a handheld portion, and the handheld portion is fixedly connected to the housing.

Further, a surface of the casing is provided with a mesh to increase a contact area between the coolant and a casing of the heat generating module.

Further, the heat generating wafer is a central processing unit or a graphics processing unit.

The solution uses the inlet pipe and the outlet pipe of the heat sink to circulate the coolant to dissipate heat from the heat module immersed in the coolant. As such, the server will meet the heat dissipation requirements of the server's high density power usage.

100‧‧‧Server

10‧‧‧heating device

101‧‧‧ cabinet

102‧‧‧ Coolant

103‧‧‧ water inlet

104‧‧‧Outlet pipe

105‧‧‧Slide rails

20‧‧‧heating module

21‧‧‧ motherboard

22‧‧‧Slots

201‧‧‧ housing

202‧‧‧ boards

203‧‧‧ Gold Finger

204‧‧‧Base

205‧‧‧ heat exchanger

206‧‧‧Handheld Department

1 is a schematic diagram of a server in accordance with a preferred embodiment of the present invention.

2 is another schematic diagram of a server in accordance with a preferred embodiment of the present invention.

3 is a schematic view showing a part of the structure of the server shown in FIG. 1.

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when an element is referred to as being "electrically connected" to another element, it can be directly on the other element or the element can be present. When an element is considered to be "electrically connected" to another element, it can be a contact connection, for example, either a wire connection or a non-contact connection, for example, a non-contact coupling.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.

Referring to FIG. 1 , a preferred embodiment of the present invention provides a server 100 that includes a heat sink 10 and a plurality of heat generating modules 20 for dissipating heat from the plurality of heat generating modules 20 . The heat dissipating device 10 includes a box 101 for accommodating a cooling liquid 102 and the plurality of heat generating modules 20, and the cooling liquid 102 immerses the plurality of heat generating modules 20.

The heat sink 10 further includes an inlet pipe 103 and an outlet pipe 104.

Both the inlet pipe 103 and the outlet pipe 104 are connected to the casing 101. The coolant 102 enters the casing 101 through the inlet pipe 103, and the coolant 102 is discharged from the casing 101 by the outlet pipe 104. As such, the coolant 102 can cyclically dissipate heat from the heat generating module 20 of the server 100.

In the present embodiment, the cooling liquid 102 is a non-conductive insulating liquid, so that the heat generating module 20 immersed in the cooling liquid 102 does not cause a short circuit or the like during operation.

Both sides of the box 101 are also provided with slide rails 105 that interface with standard cabinets (not shown).

Referring to FIG. 2 and FIG. 3 , in the embodiment, the server 100 further includes a motherboard 21 , and the motherboard 21 is fixed in the casing 101 .

The motherboard 21 is provided with a plurality of slots 22, and the heat generating module 20 is docked with the slot 22 for inserting the heat generating module 20 on the motherboard 21. As such, the plurality of heat generating modules 20 and the motherboard 21 will be immersed in the cooling liquid 102.

When the motherboard 21 and the plurality of heat generating modules 20 are powered on, the plurality of heat generating modules 20 and the motherboard 21 are energized and begin to generate heat, and the cooling liquid 102 can be used for the plurality of heating modules. The heat generated by the group 20 and the motherboard 21 is dissipated.

Further, the heat generating module 20 includes a housing 201, a circuit board 202, and a gold finger 203. The circuit board 202 is fixedly connected to the inside of the housing 201, and each of the heat generating modules 20 is inserted into each of the slots 22 by the gold fingers 203.

In the embodiment, the heat generating module 20 further includes a heat exchanger 205 and a heat generating chip (not shown). The heat generating chip is fixedly connected to the circuit board 202 by the base 204. The heat exchanger 205 is in contact with the heat generating wafer for dissipating heat from the heat generating wafer.

The heating module 20 is further provided with a hand-held portion 206 that is fixedly coupled to the housing 201. Thus, the heat generating module 20 can be easily inserted and removed on the motherboard 21 by the hand portion 206.

In this embodiment, the surface of the housing 201 is further provided with a mesh hole (not shown), so that the contact area between the coolant 102 and the housing 201 of the heat generating module 20 can be increased, thereby further improving Cooling effect.

In this embodiment, the heat generating chip is a central processing unit (CPU). In another embodiment, the heat generating wafer may also be a graphics processing unit (GPU) or other high power chip.

In the server 100, the coolant 102 is circulated to dissipate heat to the heat generating module 20 by the water inlet pipe 103 and the water outlet pipe 104 of the casing 101 of the heat sink 10. Thus, the server 100 will satisfy the server. The heat dissipation requirement of high-density power efficiency.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

Claims (3)

The server includes a heat dissipating device and a heat generating module, wherein the heat dissipating device is configured to dissipate heat for the heat generating module, wherein the heat dissipating device comprises: a box body for accommodating the cooling liquid and the heat generating module, The cooling liquid immerses the heat generating module; the water inlet pipe, the water inlet pipe is connected to the tank body, the coolant is introduced into the tank body through the water inlet pipe; and the water outlet pipe is connected to the water pipe a casing, the coolant is discharged from the casing through the outlet pipe; wherein the server further includes a motherboard, the motherboard is fixed in the casing, and the motherboard is provided with a socket that is connected to the heat generating module, the heat generating module includes a casing, a circuit board, a gold finger, a heat exchanger, and a heat generating chip, wherein the circuit board is fixedly connected to the inside of the casing, and the gold finger and the The slot is inserted, the heat exchanger is in contact with the heat generating chip for dissipating heat for the heat generating chip, and the heat generating module is further provided with a handhold portion, and the handholding portion is fixed to the casing connection. The server of claim 1, wherein the surface of the casing is provided with a mesh to increase a contact area of the coolant with a casing of the heat generating module. The server of claim 2, wherein the heat generating wafer is a central processing unit or a graphics processing unit.