TWI668824B - Heat dissipating structure and electronic device using same - Google Patents

Abstract

A heat dissipation structure includes a casing, a capillary structure and a heat dissipating liquid, the casing is sealed to form a cavity, and the capillary structure and the heat dissipating liquid are accommodated in the cavity, and the heat dissipating liquid is used for The phase change during evaporation absorbs heat and dissipates heat by diffusion and condensation of the vaporized gas, and the capillary structure is used to guide the diffusion of the heat-dissipating liquid to the previous evaporation position. The present invention also provides an electronic device having a heat dissipation structure.

Description

Heat dissipation structure and electronic device having the same

The invention relates to a heat dissipation mechanism and an electronic device having the same.

At present, ultra-thin heat pipes are widely used in electronic equipment for better heat dissipation. However, the process of ultra-thin heat pipes is complicated and costly.

In view of this, it is necessary to provide a heat dissipation structure with a simple process.

The present invention also provides an electronic device having the heat dissipation structure.

A heat dissipation structure includes a casing, a capillary structure and a heat dissipating liquid, the casing is sealed to form a cavity, and the capillary structure and the heat dissipating liquid are accommodated in the cavity, and the heat dissipating liquid is used for The phase change during evaporation absorbs heat and dissipates heat by diffusion and condensation of the vaporized gas, and the capillary structure is used to guide the diffusion of the heat-dissipating liquid to the previous evaporation position.

An electronic device includes a heat dissipation structure.

In summary, the heat dissipation structure absorbs heat by utilizing a phase change of the heat dissipation liquid during evaporation and dissipates heat by diffusion and condensation of the vaporized gas. The capillary structure is configured to guide the diffusion and condensation of the heat dissipation liquid to a previous evaporation position to achieve a cyclic conversion of the gas-liquid two phases of the heat dissipation liquid. The heat dissipation structure has a simple manufacturing process, low manufacturing cost, and good heat dissipation effect.

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without the creative work are all within the scope of the present invention.

It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to another component or a central component can be present at the same time. When a component is considered to be "set to" another component, it can be placed directly on another component or possibly with a centered component.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to Figure 1, the present invention provides a heat dissipation structure 100. The heat dissipation structure 100 can be applied to an electronic device such as a mobile phone, a tablet computer, a watch, or the like to assist heat dissipation of each heat generating component (eg, a battery, a wafer, etc.) in the electronic device, thereby improving the running performance of the electronic device.

The heat dissipation structure 100 includes at least a housing 10 and a heat dissipation liquid 30.

In this embodiment, the housing 10 is made of a bendable material, such as plastic, rubber or other bendable metal material, but is not limited thereto, so as to form heat dissipation with bendability. Structure 100. The heat dissipation structure 100 can be applied to a flexible electronic device.

The housing 10 includes an upper housing 101 and a lower housing 103. The upper casing 101 and the lower casing 103 are oppositely disposed and sealed to form a cavity 105.

Further, the heat dissipation structure 100 further includes a connector 20 . The connector 20 is for connecting and sealing the upper case 101 and the lower case 103 to form the cavity 105.

Referring to FIG. 2 together, in the present embodiment, a waterproof glue is used as the connecting member 20 between the upper casing 101 and the lower casing 103. Specifically, a waterproof glue is used to dispense the edge of the lower casing 103 to bond the upper casing 101, thereby forming the sealed cavity 105.

Further, the heat dissipation structure 100 further includes a support member 40. In this embodiment, the support member 40 is disposed between the upper casing 101 and the lower casing 103 to strengthen the structural strength of the casing 10 to prevent the upper casing 101 and / or the lower casing 103 collapses and ruptures due to pressure. The support member 40 may be a waterproof glue, a copper pillar, a plastic bracket or the like.

In the present embodiment, a multi-point waterproof rubber is provided between the upper casing 101 and the lower casing 103 as the support member 40. A plurality of support members 40 are evenly spaced between the upper casing 101 and the lower casing 103. The waterproof rubber structure as the support member 40 may be, but not limited to, a columnar structure or a strip structure.

Referring to FIG. 2 again, in the embodiment, the plurality of support members 40 are arranged in two rows, and each row is arranged in a line. The support members 40 in each row are evenly spaced from each other, and the support members 40 between the adjacent rows are alternately arranged to strengthen the structural strength of the casing 10. Of course, in other embodiments, the plurality of supports 40 may also be arranged in other forms, such as a matrix arrangement or the like.

The heat dissipating liquid 30 is housed in the cavity 105. The heat dissipating liquid 30 can perform mutual conversion between the gas phase and the liquid phase at a certain temperature to realize the heat dissipation function of the heat dissipation structure 100. The heat dissipating liquid 30 absorbs heat by evaporation from a liquid phase to a gas phase by evaporation, and dissipates heat by diffusion of the evaporated gas in the cavity 105. At the same time, the vaporized gas diffuses into the lower temperature region in the cavity 105 to condense into the liquid phase heat dissipating liquid 30, which also has a heat dissipation effect.

In this embodiment, the heat dissipation liquid 30 is a non-conductive liquid. Thus, even if the heat dissipating liquid 30 is inadvertently leaked, the circuits and components inside the electronic device are not damaged.

Further, in the present embodiment, a solution having a boiling point lower than the operating temperature of the heat generating component, for example, an electronic liquid, is selected as the heat dissipating liquid 30 of the heat dissipating structure 100. In this way, the heat dissipating liquid 30 can be subjected to cyclic conversion of gas-liquid two phases at a temperature formed by the heat generating component without being in a vacuum environment.

The heat dissipation structure 100 further includes a capillary structure 50. The capillary structure 50 is adhered to the casing 10 by self-adhesiveness or an adhesive. In the present embodiment, the capillary structure 50 is received in the cavity 105 and disposed on at least one of the upper casing 101 and the lower casing 103. The support member 40 extends through the capillary structure 50 to support the upper casing 101 and the lower casing 103. The capillary structure 50 is used to guide the heat-dissipating liquid 30 after condensation condensation into the cavity 105 for backflow by capillary phenomenon. Preferably, the capillary structure 50 can be a foam.

In this embodiment, the working principle of the heat dissipation structure 100 will be described in detail by taking the capillary structure 50 on the lower casing 103 as an example.

Specifically, the evaporation end A of the heat dissipation structure 100 is disposed on the heat generating component in the electronic device, and the condensation end B of the heat dissipation structure 100 is disposed away from the heat generating component. Thus, when the electronic device is in operation, the heat generating component operates and dissipates heat, so that the heat dissipating liquid 30 disposed at the evaporation end A thereon absorbs heat energy and vaporizes, and the heat dissipating liquid 30 changes from a liquid phase to a gas phase, and the volume Expand to quickly fill the entire cavity 105. When the heat-dissipating liquid 30 of the gas phase contacts the relatively cold region of the condensing end B, the heat-dissipating liquid 30 condenses into a liquid phase and is absorbed by the capillary structure 50 of the condensing end B. At the same time, since the liquid-phase heat dissipating liquid 30 is evaporated from the capillary structure 50 at the evaporation end A to form suction, the heat-dissipating liquid 30 of the gas phase is condensed at the condensation end B and falls back to the capillary structure 50 at the condensation end B. In order to form the thrust, the two forces and capillary phenomena cause the heat dissipating liquid 30 condensed into a liquid phase to return to the evaporation end A along the capillary structure 50, so as to assist the heat generating component by the cyclic conversion of the gas-liquid two phases of the heat radiating liquid 30. Cooling.

In another embodiment, the heat dissipation structure 100 may not include the capillary structure 50. In this embodiment, the position of the electronic device can be adjusted so that the level of the condensation end B is higher than the evaporation end A, so that the heat dissipation liquid 30 of the liquid phase returns to the evaporation end under the action of its own gravity. A, the heat dissipation of the heat generating component is assisted by the cyclic conversion of the gas-liquid two phases of the heat sink 30.

In summary, the heat dissipation structure 100 uses a heat dissipation liquid 30 having a boiling point lower than the operating temperature of the heat generating component, so that the heat dissipation liquid 30 can generate gas at a temperature formed by the heat generating component without being in a vacuum environment. - Cyclic conversion of liquid two phases. At the same time, the manufacturing process of the heat dissipation structure 100 is also simplified and the production cost is reduced. In addition, the housing 10 of the heat dissipation structure 100 is also made of a bendable material to accommodate various flexible electronic devices.

The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to be limiting, and the present invention has been described in detail with reference to the preferred embodiments. Equivalents are substituted without departing from the spirit and essence of the technical solution of the present invention.

100‧‧‧heat dissipation structure

10‧‧‧shell

101‧‧‧Upper casing

103‧‧‧ Lower case

105‧‧‧ Cavity

20‧‧‧Connecting parts

30‧‧‧Solid fluid

40‧‧‧Support

50‧‧‧Capillary structure

A‧‧‧Evaporation end

B‧‧‧condensing end

1 is a cross-sectional view of a heat dissipation structure in accordance with a preferred embodiment of the present invention. 2 is a partial structural view of the heat dissipation structure shown in FIG. 1.

no.

Claims (8)

A heat dissipating structure comprising a casing, a capillary structure and a heat dissipating liquid, the heat dissipating structure being applied to a heat generating component in an electronic device, wherein the casing comprises an upper casing and a lower casing, and the upper casing and The lower casing is oppositely disposed and sealed to form a cavity, and the capillary structure and the heat dissipating liquid are accommodated in the cavity, and the capillary structure is adhered to the casing by self-adhesiveness or an adhesive The heat dissipating liquid is used for absorbing heat by phase change during evaporation and dissipating heat by diffusion and condensation of the evaporated gas, and the capillary structure is used for guiding the diffusion condensed heat to return to the previous evaporation position. The boiling point of the heat dissipating liquid is lower than the operating temperature of the heat generating component, and the cavity is in a non-vacuum state. The heat dissipation structure of claim 1, wherein the heat dissipation structure further comprises a connector that connects and seals the upper and lower casings to form the cavity. The heat dissipation structure of claim 1, wherein the heat dissipation structure further comprises a support member disposed between the upper casing and the lower casing to reinforce the casing. Structural strength. The heat dissipation structure of claim 1, wherein the capillary structure is disposed on at least one of the upper and lower casings. The heat dissipation structure according to claim 1, wherein the capillary structure is foam. The heat dissipation structure of claim 1, wherein the housing is made of a bendable material. The heat dissipation structure according to claim 1, wherein the heat dissipation liquid is a non-conductive liquid. An electronic device comprising the heat dissipation structure according to any one of claims 1 to 7.