TWI668797B - Deposition ring and chuck components - Google Patents
Deposition ring and chuck components Download PDFInfo
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- TWI668797B TWI668797B TW106145175A TW106145175A TWI668797B TW I668797 B TWI668797 B TW I668797B TW 106145175 A TW106145175 A TW 106145175A TW 106145175 A TW106145175 A TW 106145175A TW I668797 B TWI668797 B TW I668797B
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- ring
- annular body
- snap
- deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本申請揭露一種沉積環(50)及使用其的卡盤元件。沉積環(50)在卡盤元件中與壓環和基座配合使用,其包括:具有上表面(52)和下表面(53)的環形本體(51);形成於該上表面(52)的環形凹槽(55);其中,該沉積環(50)還包括用於卡接到該基座的卡接部(58)。通過將沉積環(50)卡接到基座,可以降低沉積環(50)的移位和脫落危險,增加沉積環(50)和卡盤元件的有效工作時間。 The present application discloses a deposition ring (50) and a chuck member using the same. A deposition ring (50) is used in the chuck member for use with the pressure ring and the base, comprising: an annular body (51) having an upper surface (52) and a lower surface (53); formed on the upper surface (52) An annular groove (55); wherein the deposition ring (50) further includes a snap portion (58) for snapping into the base. By snapping the deposition ring (50) to the pedestal, the risk of displacement and shedding of the deposition ring (50) can be reduced, increasing the effective working time of the deposition ring (50) and the chuck elements.
Description
本發明涉及一種沉積環及使用其的卡盤元件,尤其是一種用於積體電路製備的濺射裝置中的沉積環及卡盤元件。 The present invention relates to a deposition ring and a chuck member using the same, and more particularly to a deposition ring and a chuck member for use in a sputtering apparatus for integrated circuit fabrication.
在積體電路的製備程序中,需要採用物理氣相沉積(以下簡稱PVD)裝置完成沉積薄膜製程,常用的技術是磁控濺射方式,典型的濺射裝置如第1圖所示,該裝置具有反應腔體1、靶材4,絕緣材料2,絕緣材料2和靶材4中間形成腔室並充滿去離子水3。濺射時DC電源會施加偏壓至靶材4,使其相對於接地的反應腔體1成為負壓,以致氬氣放電而產生電漿,且負偏壓同時能將帶正電的氬離子吸引至靶材4。當氬離子的能量足夠高並在由旋轉的磁控管5形成的磁場作用下轟擊靶材4時,會使金屬原子逸出靶材4的表面,並通過擴散沉積在晶片10上,為避免汙染反應腔體1而設置壓環8。基座9設置在反應腔體1內,用於固定、支撐及傳送晶片10並實現溫度控制。為了避免晶片10在製程程序中出現移動或錯位現象,基座9往往使用高溫靜電卡盤結構。在進一步地,為防止汙染高溫靜電卡盤,又設置了沉積環11,用以保護靜電卡盤不被膜層物質汙染;當沉積環11經過噴砂等處理後,汙染物更容易附著到沉積環11上而不脫落,從而可保證製程的持久性;沉積環11另外的設計要求還有拆裝方便、易於更換、可定時清洗等。 In the preparation process of the integrated circuit, a physical vapor deposition (hereinafter referred to as PVD) device is required to complete the deposition film process, and a common technique is a magnetron sputtering method. A typical sputtering device is shown in FIG. The reaction chamber 1, the target 4, the insulating material 2, the insulating material 2 and the target 4 form a chamber and are filled with deionized water 3. During sputtering, the DC power source applies a bias voltage to the target 4, causing it to become a negative pressure with respect to the grounded reaction chamber 1, so that argon gas is discharged to generate plasma, and the negative bias voltage can simultaneously supply positively charged argon ions. Attracted to the target 4. When the energy of the argon ions is sufficiently high and bombards the target 4 under the action of the magnetic field formed by the rotating magnetron 5, the metal atoms escape the surface of the target 4 and are deposited on the wafer 10 by diffusion, in order to avoid A pressure ring 8 is provided to contaminate the reaction chamber 1. The susceptor 9 is disposed in the reaction chamber 1 for fixing, supporting and transferring the wafer 10 and achieving temperature control. In order to avoid the movement or misalignment of the wafer 10 during the process, the susceptor 9 tends to use a high temperature electrostatic chuck structure. Further, in order to prevent contamination of the high-temperature electrostatic chuck, a deposition ring 11 is provided to protect the electrostatic chuck from contamination by the film layer; when the deposition ring 11 is treated by sand blasting, the contaminant is more likely to adhere to the deposition ring 11 It does not fall off, so as to ensure the durability of the process; the additional design requirements of the deposition ring 11 are easy to assemble and disassemble, easy to replace, and can be cleaned regularly.
第2圖示出先前技術中用在濺射裝置中的一種靜電卡盤元件。其包括絕緣層201、基座202、沉積環203和壓環204。絕緣層201用來支援晶片, 基座202則用來支援絕緣層201,同時可以接入RF偏壓,也可實現控制晶片的溫度。 Fig. 2 shows an electrostatic chuck element used in a sputtering apparatus in the prior art. It includes an insulating layer 201, a susceptor 202, a deposition ring 203, and a pressure ring 204. The insulating layer 201 is used to support the wafer, The susceptor 202 is used to support the insulating layer 201, and can also be connected to an RF bias, and can also control the temperature of the wafer.
第3圖為第2圖在I處的放大圖。如第3圖所示,為防止沉積環203和壓環204之間產生黏連,壓環204上設置環形的凸起2041,這使得壓環204和沉積環203之間產生縫隙G。 Fig. 3 is an enlarged view of Fig. 2 at I. As shown in Fig. 3, in order to prevent adhesion between the deposition ring 203 and the pressure ring 204, an annular projection 2041 is provided on the pressure ring 204, which causes a gap G between the pressure ring 204 and the deposition ring 203.
第4圖和第5圖分別示出第2圖的沉積環203的局部截面圖和立體圖。如第4圖和第5圖所示,沉積環203底面是平面,直接落放在基座202上;而頂面形成有凹槽2031,凹槽2031內進行噴砂處理,以增大膜層粒子的沉積面積,防止產生顆粒汙染晶片,同時也延長了沉積環203的清洗週期。 4 and 5 show a partial cross-sectional view and a perspective view, respectively, of the deposition ring 203 of Fig. 2. As shown in FIG. 4 and FIG. 5, the bottom surface of the deposition ring 203 is a flat surface and directly falls on the susceptor 202; and the top surface is formed with a groove 2031, and the groove 2031 is sandblasted to increase the film particle. The deposition area prevents particle contamination of the wafer while also extending the cleaning cycle of the deposition ring 203.
儘管先前技術已經採用凸起2041來防止黏連,但是當濺射製程持續進行一段時間T後,壓環204和沉積環203之間隨著鍍制膜層厚度增加仍可能產生黏連。當壓環204被升起時,由於黏連現象的存在,沉積環203也容易被帶著升起來,導致沉積環203脫離基座202。此外,先前技術中的壓環204僅僅是落放在沉積環203上,無法確保二者同心,可能會導致製程結果偏移。 Although the prior art has employed the protrusions 2041 to prevent adhesion, when the sputtering process continues for a period of time T, adhesion between the pressure ring 204 and the deposition ring 203 may increase as the thickness of the plating film increases. When the pressure ring 204 is raised, the deposition ring 203 is also easily lifted by the presence of the adhesion phenomenon, causing the deposition ring 203 to be detached from the susceptor 202. In addition, the pressure ring 204 of the prior art merely falls on the deposition ring 203, and it is impossible to ensure that the two are concentric, which may cause the process result to shift.
本發明旨在至少解決先前技術中存在的技術問題之一,提供一種沉積環及使用其的卡盤元件,其至少能夠降低沉積環的移位和脫落危險。 The present invention is directed to at least one of the technical problems existing in the prior art, and provides a deposition ring and a chuck member using the same, which at least can reduce the risk of displacement and shedding of the deposition ring.
本發明實現上述目的的方案是提供一種沉積環,其在卡盤元件中與壓環和基座配合使用。該沉積環包括:具有上表面和下表面的環形本體;形成於該上表面的環形凹槽;其中,該沉積環還包括卡接部,該卡接部用於將該沉積環卡接到該基座上,以將該沉積環固定在該基座上。 SUMMARY OF THE INVENTION It is an object of the present invention to achieve the above object to provide a deposition ring for use with a pressure ring and a base in a chuck member. The deposition ring includes: an annular body having an upper surface and a lower surface; an annular groove formed on the upper surface; wherein the deposition ring further includes a snap portion for engaging the deposition ring to the On the base, the deposition ring is fixed to the base.
本發明實現上述目的的方案是提供一種卡盤元件,其包括壓環、基座,以及與該壓環和該基座配合使用的沉積環,該沉積環包括具有上表面和下表面的環形本體;以及形成於該上表面的環形凹槽;其中,該沉積環還包括用於將該沉積環卡接到該基座上的卡接部;該卡盤元件還包括卡扣件,該卡扣件包括與該基座相連的下側部、與該卡接部相卡接的上側部以及連接該下側部和該上側部的中間部。 SUMMARY OF THE INVENTION An object of the present invention to achieve the above object is to provide a chuck member including a pressure ring, a base, and a deposition ring for use with the pressure ring and the base, the deposition ring including an annular body having an upper surface and a lower surface And an annular groove formed on the upper surface; wherein the deposition ring further includes a snap portion for snapping the deposition ring to the base; the chuck member further includes a snap member, the buckle The member includes a lower side portion connected to the base, an upper side portion that is engaged with the engaging portion, and an intermediate portion that connects the lower side portion and the upper side portion.
通過將沉積環上卡接到基座,可以降低沉積環的移位和脫落危險,增加沉積環和卡盤元件的有效工作時間。 By snapping the deposition ring to the pedestal, the risk of displacement and shedding of the deposition ring can be reduced, increasing the effective working time of the deposition ring and chuck components.
1‧‧‧反應胺體 1‧‧‧Reactive amines
2‧‧‧絕緣材料 2‧‧‧Insulation materials
3‧‧‧去離子水 3‧‧‧Deionized water
4‧‧‧靶材 4‧‧‧ Target
5‧‧‧磁控管 5‧‧‧Magnetron
8、204、60‧‧‧壓環 8, 204, 60‧‧ ‧ pressure ring
9、202、40‧‧‧基座 9, 202, 40‧‧‧ base
10‧‧‧晶片 10‧‧‧ wafer
11、203、50‧‧‧沉積環 11, 203, 50‧ ‧ sedimentary ring
201‧‧‧絕緣層 201‧‧‧Insulation
2031‧‧‧凹槽 2031‧‧‧ Groove
2041‧‧‧凸起 2041‧‧‧ bump
51‧‧‧環形本體 51‧‧‧ ring body
52‧‧‧上表面 52‧‧‧ upper surface
53‧‧‧下表面 53‧‧‧ lower surface
55‧‧‧環形凹槽 55‧‧‧ annular groove
56‧‧‧凸起 56‧‧‧ bumps
57‧‧‧凹陷 57‧‧‧ dent
58‧‧‧卡接部 58‧‧‧ card joint
58A‧‧‧形通道 58A‧‧‧ Shape channel
58B‧‧‧形掛鉤 58B‧‧‧ Hook
58C‧‧‧鋸齒列 58C‧‧‧Sawtooth column
80、80B、80C‧‧‧卡扣件 80, 80B, 80C‧‧‧ card fasteners
801‧‧‧下側部 801‧‧‧ lower side
8011‧‧‧安裝孔 8011‧‧‧ mounting hole
802‧‧‧中間部 802‧‧‧Intermediate
803‧‧‧上側部 803‧‧‧ upper side
G‧‧‧縫隙 G‧‧‧ gap
P‧‧‧區域 P‧‧‧ area
參考附圖和說明書可以更好地理解本發明。附圖中的部件不一定按比例繪製,其用意僅在於闡明本發明的原理。在附圖中:第1圖為先前技術的一種濺射裝置的示意圖;第2圖為先前技術的一種靜電卡盤元件的示意圖;第3圖為先前技術的一種沉積環與壓環及基座相配合的示意圖;第4圖為第3圖所示沉積環的局部放大截面圖;第5圖為第3圖所示沉積環的立體圖;第6圖為根據本發明一個實施例的卡盤元件的截面圖,該卡盤元件包括基座、沉積環和壓環;第7圖為第6圖的局部放大圖,更清晰地示出沉積環與基座和壓環的配合;第8圖為第6圖所示沉積環在卡接部處的截面圖;第9A圖及第9B圖為根據一個實施例的沉積環及其卡接部的立體圖;第10圖和第11圖示出沉積環與卡扣件形成卡接的其他替代設計;第12圖為根據本發明一個實施例的卡盤元件的卡扣件的立體圖; 第13圖示出根據本發明一個實施例的卡扣件的安裝前狀態。 The invention may be better understood by reference to the drawings and specification. The components in the figures are not necessarily drawn to scale, and are intended to illustrate the principles of the invention. In the drawings: FIG. 1 is a schematic view of a sputtering apparatus of the prior art; FIG. 2 is a schematic view of an electrostatic chuck component of the prior art; and FIG. 3 is a deposition ring and a pressure ring and a base of the prior art. Fig. 4 is a partially enlarged cross-sectional view of the deposition ring shown in Fig. 3; Fig. 5 is a perspective view of the deposition ring shown in Fig. 3; and Fig. 6 is a chuck member according to an embodiment of the present invention. A cross-sectional view of the chuck member including a susceptor, a deposition ring, and a pressure ring; and FIG. 7 is a partially enlarged view of FIG. 6 to more clearly show the cooperation of the deposition ring with the susceptor and the pressure ring; Figure 6 is a cross-sectional view of the deposition ring at the snap portion; Figures 9A and 9B are perspective views of the deposition ring and its snap-in portion according to one embodiment; and Figures 10 and 11 show the deposition ring. Other alternative designs for engaging a snap member; Figure 12 is a perspective view of a snap member of a chuck member in accordance with one embodiment of the present invention; Fig. 13 is a view showing a pre-installation state of the snap member according to an embodiment of the present invention.
下面的說明涉及根據本發明的一個實例的卡盤元件,其中第6圖為根據本發明一個實施例的卡盤元件的截面圖,該卡盤元件包括基座40、沉積環50和壓環60;第7圖為第6圖中區域II的局部放大圖,其更清晰地示出沉積環50與基座40和壓環60的配合;第8圖為第6圖所示沉積環50在卡接部處的截面圖。如第6圖至第8圖所示,在該卡盤元件中,沉積環50與壓環60和基座40配合使用。沉積環50包括:具有上表面52和下表面53的環形本體51;形成於該上表面52的環形凹槽55;此外,該沉積環50還包括卡接部58,該卡接部58用於將該沉積環50卡接到該基座40上,以將該沉積環50固定在該基座40上。作為示例,該卡接部58的數量為兩個,且這兩個卡接部58可沿沉積環50的周向而設置在沉積環50的相對兩側(例如,第6圖中的左右兩側);或者,該卡接部58的數量為兩個以上,且沿環繞基座40的周向設置。 The following description relates to a chuck member according to an example of the present invention, wherein FIG. 6 is a cross-sectional view of a chuck member including a susceptor 40, a deposition ring 50, and a pressure ring 60, in accordance with one embodiment of the present invention. Figure 7 is a partial enlarged view of the area II in Figure 6, which more clearly shows the cooperation of the deposition ring 50 with the base 40 and the pressure ring 60; Figure 8 is the deposition ring 50 shown in Figure 6 on the card A cross-sectional view at the joint. As shown in Figures 6 through 8, in the chuck member, the deposition ring 50 is used in conjunction with the pressure ring 60 and the base 40. The deposition ring 50 includes: an annular body 51 having an upper surface 52 and a lower surface 53; an annular groove 55 formed in the upper surface 52; further, the deposition ring 50 further includes a snap portion 58 for the snap portion 58 The deposition ring 50 is snapped onto the base 40 to secure the deposition ring 50 to the base 40. As an example, the number of the engaging portions 58 is two, and the two engaging portions 58 may be disposed on opposite sides of the deposition ring 50 along the circumferential direction of the deposition ring 50 (for example, the left and right in FIG. 6 Sides; alternatively, the number of the engaging portions 58 is two or more, and is disposed along the circumference of the base 40.
由於沉積環50卡接到基座40,即使在沉積環50和壓環60有少許黏連情況發生時,壓環60的升起也不會將沉積環50帶起。由此,可以降低沉積環50移位和脫落的危險,延長沉積環50的工作時間,同時提高製程結果。 Since the deposition ring 50 is snapped onto the susceptor 40, the rise of the pressure ring 60 does not bring up the deposition ring 50 even when a slight adhesion of the deposition ring 50 and the pressure ring 60 occurs. Thereby, the risk of displacement and shedding of the deposition ring 50 can be reduced, the working time of the deposition ring 50 is prolonged, and the process results are improved.
仍參考第7圖和第8圖,較佳地,沉積環50還包括形成於該上表面52的凸起56,凸起56與該壓環60配合,例如,在該壓環60的下表面的與凸起56相對應的位置處設置朝向其上表面凹進的凹槽,借助凸起56與該凹槽的配合,使沉積環50和壓環60的位置同心設置。 Still referring to Figures 7 and 8, preferably, the deposition ring 50 further includes a projection 56 formed on the upper surface 52, the projection 56 mating with the pressure ring 60, for example, on the lower surface of the pressure ring 60. A recess recessed toward the upper surface thereof is provided at a position corresponding to the projection 56, and the position of the deposition ring 50 and the pressure ring 60 is concentrically arranged by the engagement of the projection 56 with the recess.
通過在沉積環50上增加凸起56,一方面可以使沉積環50和壓環60定位為同心,另一方面也阻礙顆粒進入到凸起56的徑向外側的沉積環50和壓環60之間的區域。另外,對於位於凸起56的徑向內側的沉積環50和壓環 60之間的縫隙,本發明採用縮減沉積環50的厚度的方式擴大了該處的縫隙寬度(即,該縫隙在圖中的垂直方向上的寬度),其實,縮減沉積環50的厚度也可以理解為增大凸起56在垂直方向上的高度。這樣,即使卡盤元件已經工作了一段時間T,在縫隙處積累的粒子厚度也不會達到使沉積環50與壓環60黏連的程度。 By adding protrusions 56 to the deposition ring 50, on the one hand the deposition ring 50 and the pressure ring 60 can be positioned concentric, and on the other hand the particles can be prevented from entering the deposition ring 50 and the pressure ring 60 radially outward of the protrusion 56. The area between. In addition, the deposition ring 50 and the pressure ring are located on the radially inner side of the protrusion 56. In the gap between 60, the present invention expands the gap width (i.e., the width of the slit in the vertical direction in the drawing) by reducing the thickness of the deposition ring 50. In fact, the thickness of the deposition ring 50 can be reduced. It is understood to increase the height of the projection 56 in the vertical direction. Thus, even if the chuck member has been operated for a period of time T, the thickness of the particles accumulated at the slit does not reach the extent that the deposition ring 50 is adhered to the pressure ring 60.
較佳地,根據本發明一個實施例,沉積環50還包括形成於該上表面52的位於該凸起56的徑向外側的凹陷57,該凹陷57與凸起56在沉積環50和壓環60之間形成迷宮結構,即,凹陷57與凸起56的設置使得沉積環50的上表面的高度參差錯落而形成迷宮結構,由此,阻礙濺射的粒子到達不期望的區域。 Preferably, in accordance with an embodiment of the present invention, the deposition ring 50 further includes a recess 57 formed on the upper surface 52 at a radially outer side of the protrusion 56, the recess 57 and the protrusion 56 being in the deposition ring 50 and the pressure ring A labyrinth structure is formed between 60, that is, the arrangement of the recesses 57 and the projections 56 causes the height of the upper surface of the deposition ring 50 to be staggered to form a labyrinth structure, thereby preventing the sputtered particles from reaching an undesired area.
請一併參考第7圖、第8圖、第9A圖和第9B圖,其中,第9A圖為根據一個實施例的沉積環及其卡接部的立體圖,第9B圖為第9A圖中的P區域的放大圖。較佳地,根據一個實施例,該卡接部58為形成於該環形本體51中的形通道58A,該形通道58A為一段連通在其起始端開口和終止端開口之間的管道,其沿垂直方向的剖面形狀類似於字母L沿垂直方向翻轉180度後得到的圖形,本申請中稱為“形”,其具體走向為:自位於環形本體51的下表面的起始端開口起向上延伸一段距離後再轉而朝向環形本體51的徑向外側延伸,直至到達位於環形本體51的外表面的終止端開口。 Please refer to FIG. 7 , FIG. 8 , FIG. 9A and FIG. 9B together, wherein FIG. 9A is a perspective view of a deposition ring and a snap portion thereof according to an embodiment, and FIG. 9B is a view of FIG. 9A. A magnified view of the P area. Preferably, the latching portion 58 is formed in the annular body 51 according to an embodiment. Shape channel 58A, the The shaped passage 58A is a section of a pipe communicating between the opening end and the end opening of the section, and the sectional shape in the vertical direction is similar to the figure obtained by flipping the letter L 180 degrees in the vertical direction, which is referred to as " The specific direction is that it extends upward from the opening end opening of the lower surface of the annular body 51 and then rotates toward the radially outer side of the annular body 51 until reaching the end of the outer surface of the annular body 51. End opening.
較佳地,該形通道58A的夾角為70°至85°,即,其水平段略微向下傾斜。這樣可以更容易卡住卡盤元件的與之配合的對應部件(即,第7圖的卡扣件80,後面將詳細描述)。 Preferably, the The angle of the shaped passage 58A is 70° to 85°, that is, the horizontal section thereof is slightly inclined downward. This makes it easier to catch the corresponding components of the chuck member that cooperate therewith (i.e., the snap member 80 of Fig. 7, which will be described later in detail).
需要指出的是,本實施例該形通道58A的水平段也可以不必延伸到環形本體51的外表面,即,不設置終止端開口,這樣,該形通道58A的走向為:自位於環形本體51的下表面起向上延伸一段距離後再轉而朝向 環形本體51的徑向外側延伸。此外,該形通道58A的水平段也可以由朝向環形本體51的徑向外側延伸變換為朝向環形本體51的徑向內側延伸,即,將該形通道58A在水平方向上翻轉180度,變成形通道。 It should be noted that this embodiment should The horizontal section of the shaped passage 58A may also not necessarily extend to the outer surface of the annular body 51, that is, the end opening is not provided, such that The shape of the shaped passage 58A is such that it extends upward from the lower surface of the annular body 51 and then rotates toward the radially outer side of the annular body 51. In addition, the The horizontal section of the shaped passage 58A may also be extended to extend radially outward of the annular body 51 to extend toward the radially inner side of the annular body 51, ie, The shaped passage 58A is turned 180 degrees in the horizontal direction and becomes Shaped channel.
作為卡接部58的另一個設計示例,如第10圖所示,該卡接部58為形成於該環形本體51下側的形掛鉤58B,該形掛鉤58B沿垂直方向的剖面形狀類似於字母L沿水平方向翻轉180度後得到的圖形,本申請中稱為“形”,其具體走向為:沿著該環形本體51的下側向下延伸一段距離後再轉而朝向環形本體51的徑向內側延伸,並能夠卡住對應的卡扣件80B。 As another design example of the engaging portion 58, as shown in FIG. 10, the engaging portion 58 is formed on the lower side of the annular body 51. Shape hook 58B, the The cross-sectional shape of the hook 58B in the vertical direction is similar to the figure obtained by flipping the letter L 180 degrees in the horizontal direction, which is referred to as " The specific direction is that it extends downward along the lower side of the annular body 51 and then rotates toward the radially inner side of the annular body 51, and can catch the corresponding snap member 80B.
較佳地,該形掛鉤58B的夾角為70°至85°,即,其水平段略微向上傾斜,具體地,其水平段中處於環形本體51的徑向外側的一端略低於處於環形本體51的徑向內側的一端。 Preferably, the The hook 58B has an included angle of 70° to 85°, that is, its horizontal section is slightly inclined upward, and specifically, the one end of the horizontal section at the radially outer side of the annular body 51 is slightly lower than the radially inner side of the annular body 51. One end.
作為卡接部58的另一個設計示例,如第11圖所示,該卡接部58為形成於該環形本體51下側的沿垂直方向排列的鋸齒列58C,該鋸齒列58C中至少部分鋸齒的走向被設置為自鋸齒末端向鋸齒齒尖傾斜向上,以便給予與之對應的卡扣件80C向上的支撐力,籍此卡住卡扣件80C。為了給卡扣件80C提供更大的支撐力,較佳地,將該鋸齒列中的全部鋸齒的走向均設置為自鋸齒末端向鋸齒齒尖傾斜向上。 As another design example of the engaging portion 58, as shown in FIG. 11, the engaging portion 58 is a sawtooth row 58C arranged in the vertical direction formed on the lower side of the annular body 51, and at least partially sawtooth in the sawtooth row 58C The direction of the serration is set to be inclined upward from the serrated end to the serrated tip so as to give the corresponding supporting force of the engaging member 80C upward, thereby engaging the engaging member 80C. In order to provide greater support to the catch member 80C, preferably all of the serrations in the array of serrations are oriented to be inclined from the end of the serration to the serrated tip.
因此,無論是通過形通道、形通道、形掛鉤、鋸齒列還是通過基於本揭露的教導能夠想到的其他設計,本發明的沉積環均可被卡接到基座上,而避免被黏連帶起。 So whether it is through Shape channel Shape channel Hooks, serrations, or other designs that can be conceived based on the teachings of the present disclosure, the deposition ring of the present invention can be snapped onto the pedestal to avoid being stuck.
本發明還提供一種卡盤元件,下面結合附圖對其進行詳細描述。 The present invention also provides a chuck member, which will be described in detail below with reference to the accompanying drawings.
參考第12圖,其為根據本發明一個實施例的卡盤元件的卡扣件的立體圖,並請一併參考第6圖至第8圖,描述根據本發明一個實施例的卡盤元件。該卡盤元件包括壓環60、基座40,以及與壓環60和基座40配合使用 的沉積環50,該沉積環50包括具有上表面52和下表面53的環形本體51;形成於該上表面52的環形凹槽55;其中,該沉積環50還包括至少兩個用於卡接到該基座40的卡接部58;該卡盤元件還包括卡扣件80,該卡扣件80包括與該基座40相連的下側部801、與該卡接部58卡接的上側部803以及連接該下側部801和該上側部803的中間部802。 Referring to Fig. 12, which is a perspective view of a catching member of a chuck member according to an embodiment of the present invention, and referring to Figs. 6 through 8 together, a chuck member according to an embodiment of the present invention will be described. The chuck member includes a pressure ring 60, a base 40, and is used in conjunction with the pressure ring 60 and the base 40. a deposition ring 50 comprising an annular body 51 having an upper surface 52 and a lower surface 53; an annular groove 55 formed in the upper surface 52; wherein the deposition ring 50 further comprises at least two for snapping a latching portion 58 to the base 40; the chuck member further includes a latching member 80, the latching member 80 includes a lower side portion 801 connected to the base 40, and an upper side that is engaged with the latching portion 58 The portion 803 and the intermediate portion 802 that connects the lower side portion 801 and the upper side portion 803.
如上所述,由於使用卡扣件80將沉積環50卡接到基座40,即使在壓環60和沉積環50二者之間有少許黏連情況發生時,壓環60的升起也不會將沉積環50帶起。由此,可以降低沉積環50移位和脫落的危險,並延長沉積環50的工作時間。 As described above, since the deposition ring 50 is snapped to the susceptor 40 using the snap member 80, even if a slight adhesion occurs between the pressure ring 60 and the deposition ring 50, the rise of the pressure ring 60 is not The deposition ring 50 will be brought up. Thereby, the risk of displacement and shedding of the deposition ring 50 can be reduced, and the working time of the deposition ring 50 can be prolonged.
較佳地,該沉積環50還包括形成於該上表面52的凸起56,且在該壓環60的下表面的與凸起56相對應的位置處設置朝向其上表面凹進的凹槽,凸起56與該凹槽的配合,使沉積環50和壓環60的位置同心設置。 Preferably, the deposition ring 50 further includes a protrusion 56 formed on the upper surface 52, and a recess recessed toward the upper surface thereof is provided at a position of the lower surface of the pressure ring 60 corresponding to the protrusion 56. The engagement of the projection 56 with the recess causes the locations of the deposition ring 50 and the pressure ring 60 to be concentrically disposed.
較佳地,沉積環50還包括形成於沉積環50上表面52的位於該凸起56的徑向外側的凹陷57,該凹陷57與形成在壓環60的下表面的凸起56配合,以在沉積環50和壓環60之間形成迷宮結構。 Preferably, the deposition ring 50 further includes a recess 57 formed on the radially outer side of the protrusion 56 formed on the upper surface 52 of the deposition ring 50, the recess 57 cooperating with the protrusion 56 formed on the lower surface of the pressure ring 60 to A labyrinth structure is formed between the deposition ring 50 and the pressure ring 60.
較佳地,卡接部58為形成於環形本體51中的形通道58A,該形通道58A的走向為:自位於環形本體51的下表面的起始端開口起向上延伸一段距離後再轉而朝向環形本體51的徑向外側延伸,直至到達位於環形本體51的外表面。且卡扣件80的中間部802沿垂直方向,該卡扣件80的上側部803能夠進入該形通道58A。 Preferably, the engaging portion 58 is formed in the annular body 51. Shape channel 58A, the The shape of the shaped passage 58A is such that it extends upward from the opening end opening of the lower surface of the annular body 51 and then rotates toward the radially outer side of the annular body 51 until reaching the outer surface of the annular body 51. And the intermediate portion 802 of the latching member 80 is in the vertical direction, and the upper side portion 803 of the latching member 80 can enter the Shape channel 58A.
參考第13圖,其示出根據本發明一個實施例的卡扣件的安裝前狀態。為了讓卡扣件80與沉積環50的形通道58A卡接,首先要按壓卡扣件80使其中間部802向徑向內側傾斜,以便進入形通道58A的垂直段;然後,待卡扣件80的上側部803到達適當位置後,解除按壓。在中間部802的 彈力作用下,卡扣件80的上側部803進入該形通道58A的水平段並卡住沉積環50,而達到第7圖所示的卡接狀態。 Referring to Fig. 13, there is shown a pre-installation state of the snap member in accordance with one embodiment of the present invention. In order to make the snap member 80 and the deposition ring 50 The shaped passage 58A is engaged, firstly pressing the snap member 80 so that the intermediate portion 802 is inclined radially inward to enter The vertical section of the shaped passage 58A; then, after the upper side portion 803 of the fastener 80 is brought into position, the pressing is released. Under the elastic force of the intermediate portion 802, the upper side portion 803 of the snap member 80 enters the The horizontal section of the shaped passage 58A catches the deposition ring 50 to reach the engaged state shown in Fig. 7.
較佳地,該形通道58A的夾角為70°至85°,即,其水平段略微向下傾斜。 Preferably, the The angle of the shaped passage 58A is 70° to 85°, that is, the horizontal section thereof is slightly inclined downward.
作為卡接部58A的替代設計的一個示例,如第10圖所示,該卡接部58為形成於該環形本體51下側的形掛鉤58B,該形掛鉤58B的走向為沿著該環形本體51的下側向下延伸一段距離後再轉而朝向環形本體51的徑向內側延伸,相應地,卡扣件80B的上側部具有容納該形掛鉤的條形開口。 As an example of an alternative design of the engaging portion 58A, as shown in FIG. 10, the engaging portion 58 is formed on the lower side of the annular body 51. Shape hook 58B, the The shape of the hook 58B extends downward along the lower side of the annular body 51 and then extends toward the radially inner side of the annular body 51. Accordingly, the upper side of the snap member 80B has the upper side. A strip-shaped opening with a hook.
較佳地,該形掛鉤58B的夾角為70°至85°,即,其水平段略微向上傾斜。 Preferably, the The hook 58B has an included angle of 70° to 85°, that is, its horizontal section is slightly inclined upward.
作為卡接部58A的替代設計的另一個示例,如第11圖所示,卡接部為形成與環形本體51下側的沿垂直方向排列的鋸齒列58C,該鋸齒列58C的鋸齒的上表面平行於水平面。相應地,卡扣件80C的上側部具有對應的鋸齒列,卡扣件80的鋸齒列能夠與卡接部58的鋸齒列58C卡合。 As another example of an alternative design of the engaging portion 58A, as shown in Fig. 11, the engaging portion is a sawtooth row 58C which is formed in a vertical direction with the lower side of the annular body 51, and the upper surface of the sawtooth of the sawtooth row 58C Parallel to the horizontal plane. Correspondingly, the upper side of the latching member 80C has a corresponding row of serrations, and the row of serrations of the latching member 80 can engage with the serrated row 58C of the latching portion 58.
儘管上述實施例中,均使用單獨的卡扣件來連接沉積環和基座,但本領域技術人員應該理解,也可以將卡扣件與沉積環和基座之一形成為一體,然後將卡扣件另一端卡接到另一方。 Although in the above embodiments, a separate snap member is used to connect the deposition ring and the base, it will be understood by those skilled in the art that the snap member may be integrally formed with one of the deposition ring and the base, and then the card The other end of the fastener is snapped to the other side.
仍參考第13圖,較佳地,卡扣件80的下側部801為弧形片,該弧形片的周向兩側具有安裝孔8011,通過該安裝孔8011,卡扣件80被可拆卸地安裝到基座40上。 Still referring to FIG. 13, preferably, the lower side portion 801 of the latching member 80 is a curved piece having a mounting hole 8011 on both sides of the circumferential direction, through which the latching member 80 is It is detachably mounted to the base 40.
這樣的弧形下側部設計,其形狀與基座40的局部輪廓貼合,當通過兩側的安裝孔安裝到基座40上以後,卡扣件50能被牢固地安裝到基座40上。 Such a curved lower side design has a shape that fits a partial contour of the base 40, and the locking member 50 can be securely mounted to the base 40 after being mounted to the base 40 through the mounting holes on both sides. .
另外,儘管第13圖中的卡扣件80是安裝到基座40上,然後卡接到沉積環50;可以想到,卡扣件也可以設計為安裝到沉積環上而卡接到基座上。此外,也可以使用銷釘結構來阻止沉積環由於黏連而被壓環帶起。 In addition, although the snap member 80 in Fig. 13 is mounted to the base 40 and then snapped onto the deposition ring 50; it is conceivable that the snap member can also be designed to be mounted to the deposition ring and snapped onto the base. . In addition, a pin structure can also be used to prevent the deposition ring from being pulled up by the pressure ring due to adhesion.
儘管已經揭露本發明的各種示例性實施例,但是本領域的普通技術人員將理解,在不偏離本發明的精神和保護範圍的情況下,可以做出將實現本發明的某些優勢的各種改變和改進。本領域的普通技術人員明顯理解,可以適當地替代執行相同功能的其他部件。應當注意,參考具體附圖說明的特徵可以與其他附圖的特徵組合起來,即使在未明確提及的情況下。 Although various exemplary embodiments of the invention have been disclosed, it will be understood by those skilled in the art And improvement. It will be apparent to those skilled in the art that other components that perform the same function can be suitably substituted. It should be noted that features illustrated with reference to the specific figures may be combined with features of other figures, even if not explicitly mentioned.
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TWI245810B (en) * | 2004-01-02 | 2005-12-21 | Promos Technologies Inc | Deposition ring and substrate support apparatus using the same |
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US9127362B2 (en) * | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US20090050272A1 (en) * | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers |
WO2012024061A2 (en) * | 2010-08-20 | 2012-02-23 | Applied Materials, Inc. | Extended life deposition ring |
CN207176067U (en) * | 2017-06-08 | 2018-04-03 | 北京北方华创微电子装备有限公司 | Deposition ring and chuck assembly |
-
2017
- 2017-06-08 CN CN201710430202.3A patent/CN109023287B/en active Active
- 2017-12-19 WO PCT/CN2017/117140 patent/WO2018223659A1/en active Application Filing
- 2017-12-21 TW TW106145175A patent/TWI668797B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200743683A (en) * | 2006-05-30 | 2007-12-01 | Applied Materials Inc | Ring assembly for substrate processing chamber |
Also Published As
Publication number | Publication date |
---|---|
TW201903953A (en) | 2019-01-16 |
CN109023287B (en) | 2024-05-17 |
WO2018223659A1 (en) | 2018-12-13 |
CN109023287A (en) | 2018-12-18 |
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