TWI667678B - Keyboard and cap structure manufacturing method thereof - Google Patents
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Abstract
一種鍵盤包含底板、複數個按鍵、鍵盤框架及可撓性遮罩。每一按鍵包含鍵帽及設置於底板與鍵帽之間之升降裝置以使鍵帽可相對於底板上下移動。鍵盤框架設置於底板上且每一按鍵穿設於鍵盤框架之穿孔結構中,使得每一鍵帽之頂面與穿孔結構之孔緣支撐面相距垂直間距以及使得每一鍵帽之側面與穿孔結構之孔壁面相距水平間距。可撓性遮罩覆蓋於按鍵上且固定於穿孔結構之孔緣支撐面上,可撓性遮罩之片體厚度小於水平間距與垂直間距。當鍵帽被按壓時,可撓性遮罩產生撓曲變形。當鍵帽被釋放時,撓曲變形之可撓性遮罩驅動鍵帽相對於底板回位。A keyboard includes a bottom plate, a plurality of keys, a keyboard frame, and a flexible cover. Each button includes a keycap and a lifting device disposed between the bottom plate and the keycap to move the keycap up and down relative to the bottom plate. The keyboard frame is disposed on the bottom plate and each button is disposed in the perforated structure of the keyboard frame such that a top surface of each of the keycaps is perpendicular to a hole supporting surface of the perforated structure and a side surface and a perforated structure of each keycap The wall surfaces of the holes are horizontally spaced apart. The flexible mask covers the button and is fixed on the edge supporting surface of the perforated structure. The thickness of the flexible mask is smaller than the horizontal spacing and the vertical spacing. When the keycap is pressed, the flexible mask produces flexural deformation. When the keycap is released, the flexibly deformable flexible mask drives the keycap back relative to the bottom plate.
Description
本發明關於一種鍵盤及其鍵帽結構製造方法,尤指一種利用可撓性遮罩之撓曲彈性驅動鍵帽回位之鍵盤及其鍵帽結構製造方法。The invention relates to a keyboard and a key cap structure manufacturing method thereof, in particular to a keyboard and a key cap structure manufacturing method thereof, which utilize a flexural elastic driving keycap of a flexible mask to return the key.
就目前個人電腦的使用習慣而言,鍵盤為不可或缺的輸入設備之一,用以輸入文字、符號或數字。不僅如此,舉凡日常生活所接觸的消費性電子產品或是工業界使用的大型加工設備,皆需設有按鍵結構作為輸入裝置,以操作上述之電子產品與加工設備。In terms of current personal computer usage habits, the keyboard is one of the indispensable input devices for entering text, symbols or numbers. Moreover, the consumer electronics products that are in contact with everyday life or the large-scale processing equipment used in the industry need to have a button structure as an input device to operate the above-mentioned electronic products and processing equipment.
常見的按鍵結構設計係將升降裝置設置於鍵帽與底板之間以使鍵帽可相對於底板上下移動且將彈性件抵接於鍵帽與底板之間,藉此,當使用者按壓鍵帽時,彈性件係可提供彈性回復力至鍵帽,使鍵帽可在使用者停止按壓時回復至按壓前之位置。然而,由於上述彈性件抵接於鍵帽與底板之間的配置係會導致其需要較大的高度空間,進一步地增加了按鍵的整體高度,因此不利於鍵盤薄型化的應用。The common button structure design is that the lifting device is disposed between the key cap and the bottom plate to move the key cap up and down relative to the bottom plate and abut the elastic member between the key cap and the bottom plate, thereby, when the user presses the key cap The elastic member can provide an elastic restoring force to the keycap, so that the keycap can return to the position before the pressing when the user stops pressing. However, since the above-mentioned elastic member abuts between the key cap and the bottom plate, it requires a large height space, which further increases the overall height of the button, and thus is disadvantageous for the application of the keyboard thinning.
本發明之目的在於提供一種利用可撓性遮罩之撓曲彈性驅動鍵帽回位之鍵盤及其鍵帽結構製造方法,藉以解決上述之問題。SUMMARY OF THE INVENTION It is an object of the present invention to provide a keyboard and a keycap structure manufacturing method for flexibly elastically driving a keycap to be returned by a flexible mask, thereby solving the above problems.
根據一實施例,本發明之鍵盤包含一底板、複數個按鍵、一鍵盤框架,以及一可撓性遮罩。該複數個按鍵設置於該底板上,每一按鍵包含一鍵帽以及一升降裝置。該升降裝置設置於該底板與該鍵帽之間,該鍵帽藉由該升降裝置可相對於該底板在一未按壓位置以及一按壓位置之間做上下移動。該鍵盤框架設置於該底板上且對應每一按鍵之位置形成有一穿孔結構,每一按鍵穿設於相對應之穿孔結構中,使得每一鍵帽之一頂面與該穿孔結構之一孔緣支撐面相距一垂直間距以及使得每一鍵帽之一側面與該穿孔結構之一孔壁面相距一水平間距。該可撓性遮其覆蓋於該複數個按鍵上且固定於每一穿孔結構之該孔緣支撐面上,該可撓性遮罩具有一片體厚度且於對應每一按鍵之該鍵帽之位置上形成有一突起覆蓋結構以覆蓋每一按鍵之該鍵帽,該片體厚度小於該水平間距且小於該垂直間距。當該鍵帽被按壓至該按壓位置時,該突起覆蓋結構對應該水平間距之一側臂部分產生撓曲變形。當該鍵帽被釋放時,撓曲變形之該側臂部分提供一回復彈力以驅動該鍵帽相對該底板向上移動回該未按壓位置。According to an embodiment, the keyboard of the present invention includes a bottom panel, a plurality of buttons, a keyboard frame, and a flexible mask. The plurality of buttons are disposed on the bottom plate, and each button includes a keycap and a lifting device. The lifting device is disposed between the bottom plate and the key cap, and the key cap is movable up and down between the unpressed position and the pressing position relative to the bottom plate by the lifting device. The keyboard frame is disposed on the bottom plate and defines a perforation structure corresponding to the position of each button, and each button is disposed in the corresponding perforated structure such that a top surface of each of the key caps and one of the perforated structures The support faces are spaced apart from each other by a vertical spacing and such that one of the sides of each of the keycaps is spaced a horizontal distance from the wall of one of the perforated structures. The flexible cover covers the plurality of buttons and is fixed to the edge supporting surface of each of the perforated structures, the flexible mask having a body thickness and corresponding to the key cap of each button A protrusion covering structure is formed on the cover to cover the key cap of each button, and the thickness of the sheet body is smaller than the horizontal spacing and smaller than the vertical spacing. When the keycap is pressed to the pressing position, the protrusion covering structure is flexibly deformed corresponding to one of the horizontal arm portions. When the keycap is released, the side arm portion of the flexure provides a resilient force to drive the keycap up relative to the bottom plate back to the undepressed position.
根據另一實施例,本發明之鍵帽結構製造方法包含提供形成有複數個穿孔結構之一鍵盤框架,以及將該鍵盤框架以及複數個鍵帽設置於一下模具中使得每一鍵帽位於相對應之穿孔結構上。每一鍵帽之一頂面與相對應之穿孔結構之一孔緣支撐面相距一垂直間距,且每一鍵帽之一側面與相對應之穿孔結構之一孔壁面相距一水平間距。本發明之鍵帽結構製造方法另包含將一膠合層塗佈於一可撓性遮罩面對該複數個鍵帽之一底面上或是塗佈於每一鍵帽之該頂面以及每一穿孔結構之該孔緣支撐面上,以及使用一上模具對該可撓性遮罩與設置於該下模具中之該鍵盤框架以及該複數個鍵帽進行熱壓成型,以在該可撓性遮罩上塑形出對應每一鍵帽之該突起覆蓋結構,且使得該膠合層貼合於每一穿孔結構之該孔緣支撐面以及每一鍵帽或是使得該膠合層貼合於每一穿孔結構之該孔緣支撐面與該可撓性遮罩之間以及貼合於每一鍵帽之該頂面與相對應之突起覆蓋結構之間。該可撓性遮罩具有一片體厚度,該片體厚度小於該水平間距且小於該垂直間距。當該鍵帽被按壓時,該突起覆蓋結構對應該水平間距之一側臂部分產生撓曲變形。當該鍵帽被釋放時,撓曲變形之該側臂部分提供一回復彈力以驅動該鍵帽回到原位。According to another embodiment, the method for manufacturing a key cap structure of the present invention comprises providing a keyboard frame formed with a plurality of perforated structures, and placing the keyboard frame and the plurality of key caps in a lower mold such that each key cap is located corresponding to each other The perforated structure. One of the top surfaces of each of the keycaps is spaced from the edge of the corresponding perforated structure by a vertical distance, and one of the sides of each of the keycaps is spaced from the wall of the corresponding perforated structure by a horizontal distance. The method for manufacturing the key cap structure of the present invention further comprises applying a glue layer to a flexible mask facing one of the bottom surfaces of the plurality of keycaps or coating the top surface of each of the keycaps and each The aperture supporting surface of the perforated structure, and the flexible mask and the keyboard frame disposed in the lower mold and the plurality of keycaps are thermoformed using an upper mold to be in the flexible Forming the protrusion covering structure corresponding to each key cap on the mask, and fitting the glue layer to the hole edge supporting surface of each perforation structure and each key cap or fitting the glue layer to each The edge supporting surface of a perforated structure is interposed between the flexible mask and the top surface of each of the keycaps and the corresponding protrusion covering structure. The flexible mask has a body thickness that is less than the horizontal spacing and less than the vertical spacing. When the keycap is pressed, the protrusion covering structure is flexibly deformed corresponding to one of the horizontal arm portions. When the keycap is released, the side arm portion of the flexural deformation provides a resilient force to drive the keycap back to its original position.
根據另一實施例,本發明之鍵帽結構製造方法包含提供形成有複數個穿孔結構之一鍵盤框架,以及將該鍵盤框架以及複數個鍵帽設置於一下模具中,使得每一鍵帽位於相對應之穿孔結構上。每一鍵帽之一頂面與相對應之穿孔結構之一孔緣支撐面相距一垂直間距,且每一鍵帽之一側面與相對應之穿孔結構之一孔壁面相距一水平間距。本發明之鍵帽結構製造方法另包含將一膠合層塗佈於一可撓性遮罩面對該複數個鍵帽之一底面上或是塗佈於每一鍵帽之該頂面以及每一穿孔結構之該孔緣支撐面上,以及對該可撓性遮罩與設置於該下模具中之該鍵盤框架以及該複數個鍵帽進行氣輔加熱成型以在該可撓性遮罩上塑形出對應每一鍵帽之該突起覆蓋結構,且使得該膠合層貼合於每一穿孔結構之該孔緣支撐面以及每一鍵帽,或是使得該膠合層貼合於每一穿孔結構之該孔緣支撐面與該可撓性遮罩之間以及貼合於每一鍵帽之該頂面與相對應之突起覆蓋結構之間。該可撓性遮罩具有一片體厚度,該片體厚度小於該水平間距且小於該垂直間距。當該鍵帽被按壓時,該突起覆蓋結構對應該水平間距之一側臂部分產生撓曲變形。當該鍵帽被釋放時,撓曲變形之該側臂部分提供一回復彈力以驅動該鍵帽回到原位。In accordance with another embodiment, a method of manufacturing a keycap structure of the present invention includes providing a keyboard frame formed with a plurality of perforated structures, and placing the keyboard frame and the plurality of keycaps in a lower mold such that each keycap is positioned Corresponding to the perforated structure. One of the top surfaces of each of the keycaps is spaced from the edge of the corresponding perforated structure by a vertical distance, and one of the sides of each of the keycaps is spaced from the wall of the corresponding perforated structure by a horizontal distance. The method for manufacturing the key cap structure of the present invention further comprises applying a glue layer to a flexible mask facing one of the bottom surfaces of the plurality of keycaps or coating the top surface of each of the keycaps and each The aperture supporting surface of the perforated structure, and the flexible mask and the keyboard frame disposed in the lower mold and the plurality of keycaps are gas-assisted by heating to form on the flexible mask Forming the protrusion covering structure corresponding to each key cap, and fitting the glue layer to the hole edge supporting surface of each perforated structure and each key cap, or bonding the glue layer to each perforated structure The edge supporting surface and the flexible mask are disposed between the top surface of each of the keycaps and the corresponding protrusion covering structure. The flexible mask has a body thickness that is less than the horizontal spacing and less than the vertical spacing. When the keycap is pressed, the protrusion covering structure is flexibly deformed corresponding to one of the horizontal arm portions. When the keycap is released, the side arm portion of the flexural deformation provides a resilient force to drive the keycap back to its original position.
透過上述設計,由於本發明係利用可撓性遮罩撓曲變形後所產生的彈力以作為鍵帽自動回位的驅動力而不需額外將具有一定結構高度的彈性件配置在鍵帽與底板之間,因此,本發明係可有效地解決先前技術中所提到的彈性件配置會增加按鍵整體高度的問題,以利於鍵盤薄型化的應用。Through the above design, since the present invention utilizes the elastic force generated by the flexural deformation of the flexible cover as the driving force for the automatic return of the key cap, it is not necessary to additionally arrange the elastic member having a certain structural height on the key cap and the bottom plate. Therefore, the present invention can effectively solve the problem that the elastic member configuration mentioned in the prior art increases the overall height of the button, thereby facilitating the application of the keyboard thinning.
關於本發明之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following embodiments and the accompanying drawings.
請參閱第1圖以及第2圖,第1圖根據本發明之一實施例所提供之鍵盤10之立體示意圖,第2圖為第1圖之鍵盤10沿著剖面線A-A之剖面簡示圖。鍵盤10包含底板12、複數個按鍵14、鍵盤框架16、可撓性遮罩18,以及膠合層20,複數個按鍵14係設置於底板12上以供使用者按壓而執行使用者所欲輸入之功能。需說明的是,鍵盤10係可較佳地應用在一般具有由上蓋與下殼體組成之開合機構之可攜式電子裝置上(如筆記型電腦或折疊式鍵盤裝置)以供使用者按壓而執行使用者所欲輸入之功能,但不以此為限。每一按鍵14包含鍵帽22以及升降裝置24,升降裝置24係設置於底板12與鍵帽22之間且可較佳地採用常見應用在鍵盤按鍵上的剪刀腳支撐機構設計(但不受此限,其亦可採用其他常見按鍵升降支撐設計,如磁吸按鍵設計等),藉此,鍵帽22係可經由升降裝置24相對於底板12上下移動。Referring to FIG. 1 and FIG. 2, FIG. 1 is a perspective view of a keyboard 10 according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the keyboard 10 of FIG. 1 along a section line A-A. The keyboard 10 includes a bottom plate 12, a plurality of buttons 14, a keyboard frame 16, a flexible cover 18, and a glue layer 20, and a plurality of buttons 14 are disposed on the bottom plate 12 for the user to press to perform the user's input. Features. It should be noted that the keyboard 10 can be preferably applied to a portable electronic device (such as a notebook computer or a folding keyboard device) generally having an opening and closing mechanism composed of an upper cover and a lower casing for the user to press. The function that the user wants to input is executed, but not limited thereto. Each button 14 includes a keycap 22 and a lifting device 24, and the lifting device 24 is disposed between the bottom plate 12 and the keycap 22 and can preferably be designed with a scissor foot support mechanism commonly used on keyboard keys (but not subject to this) Alternatively, other common button lift support designs, such as magnetic button design, etc., may be employed, whereby the key cap 22 is movable up and down relative to the bottom plate 12 via the lifting device 24.
以下係針對按鍵14與鍵盤框架16、可撓性遮罩18,以及膠合層20之接合製程進行詳細的描述,請參閱第2圖、第3圖以及第4圖,第3圖為根據本發明之一實施例所提出之鍵帽結構製造方法的流程圖,第4圖為搭配第3圖的製程示意圖。首先,執行步驟300,提供形成有複數個穿孔結構26的鍵盤框架16,且將鍵盤框架16以及複數個鍵帽22(第4圖中僅以二個簡示之)設置於下模具11中(如第4圖(a)所示),使得每一鍵帽22位於相對應之穿孔結構26上,其中如第2圖所示,每一鍵帽22之頂面28係與穿孔結構26之孔緣支撐面30相距垂直間距V,每一鍵帽22之側面32係與穿孔結構26之孔壁面34相距水平間距H。The following is a detailed description of the bonding process of the button 14 and the keyboard frame 16, the flexible mask 18, and the bonding layer 20, please refer to FIG. 2, FIG. 3 and FIG. 4, and FIG. 3 is a diagram according to the present invention. A flow chart of a method for manufacturing a key cap structure proposed in an embodiment, and FIG. 4 is a schematic view of a process in combination with FIG. First, step 300 is performed to provide a keyboard frame 16 formed with a plurality of perforated structures 26, and the keyboard frame 16 and a plurality of key caps 22 (only two of which are shown in FIG. 4) are disposed in the lower mold 11 ( As shown in Fig. 4(a), each keycap 22 is placed on a corresponding perforated structure 26, wherein as shown in Fig. 2, the top surface 28 of each keycap 22 is aligned with the perforated structure 26. The edge support faces 30 are spaced apart from each other by a vertical spacing V, and the side faces 32 of each of the keycaps 22 are spaced from the hole wall faces 34 of the perforated structure 26 by a horizontal spacing H.
接著,執行步驟302,將膠合層20塗佈於可撓性遮罩18面對複數個鍵帽22之底面36上,並且將已塗佈有膠合層20之可撓性遮罩18設置於上模具13與下模具11之間(如第4圖(b)所示)。在完成上述步驟後,執行步驟304,使用上模具13對可撓性遮罩18與設置於下模具11中之鍵盤框架16以及複數個鍵帽22進行熱壓成型,以在可撓性遮罩18上塑形出對應每一鍵帽22之突起覆蓋結構38,且使得膠合層20貼合於每一穿孔結構26之孔緣支撐面30以及每一鍵帽22(如第4圖(c)所示),進而完成可撓性遮罩18與按鍵14以及鍵盤框架16之接合製程以使鍵盤10具有膜片保護功能,至於針對上述熱壓成型製程的相關描述,其係常見於先前技術中,於此不再贅述。在此實施例中,可撓性遮罩18之片體厚度T係小於水平間距H以及垂直間距V,更進一步地,在實際應用中,水平間距H係可較佳地介於0.4mm至2mm之間,垂直間距V係可較佳地介於0.7mm至3mm之間,片體厚度T係可較佳地介於0.1mm至1mm之間,藉以確保突起覆蓋結構38對應水平間距H之側臂部分40能具有足夠的結構可撓性以隨著鍵帽22之向下移動而產生相對應的撓曲變形。Next, step 302 is performed to apply the glue layer 20 on the bottom surface 36 of the flexible cover 18 facing the plurality of keycaps 22, and the flexible mask 18 coated with the glue layer 20 is disposed on the upper surface. Between the mold 13 and the lower mold 11 (as shown in Fig. 4(b)). After the above steps are completed, step 304 is performed, and the flexible mask 18 and the keyboard frame 16 and the plurality of key caps 22 disposed in the lower mold 11 are thermoformed using the upper mold 13 to be in the flexible mask. The protrusion cover structure 38 corresponding to each of the key caps 22 is molded on the 18, and the glue layer 20 is attached to the hole edge support surface 30 of each of the perforated structures 26 and each of the keycaps 22 (as shown in FIG. 4(c) Illustrated), thereby completing the bonding process of the flexible mask 18 with the button 14 and the keyboard frame 16 to provide the diaphragm 10 with a diaphragm protection function. As for the related description of the above-described hot press forming process, it is common in the prior art. This will not be repeated here. In this embodiment, the sheet thickness T of the flexible mask 18 is smaller than the horizontal spacing H and the vertical spacing V. Further, in practical applications, the horizontal spacing H may preferably be between 0.4 mm and 2 mm. Between the vertical spacing V, preferably between 0.7 mm and 3 mm, the thickness T of the sheet may preferably be between 0.1 mm and 1 mm, thereby ensuring that the protrusion covering structure 38 corresponds to the side of the horizontal spacing H. The arm portion 40 can have sufficient structural flexibility to produce a corresponding flexural deformation as the keycap 22 moves downward.
如此一來,在將鍵帽22接合於升降裝置24以及將鍵盤框架16設置於底板12上之後,即可完成具有膜片保護功能之鍵盤10的組裝以供使用者按壓,也就是說,當鍵帽22被按壓時,突起覆蓋結構38對應水平間距H之側臂部分40係可產生撓曲變形,反之,當鍵帽22被釋放時,撓曲變形之側臂部分40係可提供回復彈力以驅動鍵帽22回到未被按壓之位置,從而產生鍵帽22可自動回位的功效,以便使用者進行後續的鍵帽按壓輸入操作。In this way, after the key cap 22 is joined to the lifting device 24 and the keyboard frame 16 is disposed on the bottom plate 12, the assembly of the keyboard 10 having the diaphragm protection function can be completed for the user to press, that is, when When the keycap 22 is pressed, the side arm portion 40 of the protrusion covering structure 38 corresponding to the horizontal spacing H can be flexibly deformed. Conversely, when the keycap 22 is released, the flexing and deforming side arm portion 40 can provide a resilient force. The drive keycap 22 is returned to the unpressed position, thereby producing the effect that the keycap 22 can be automatically returned for the user to perform subsequent keycap press input operations.
透過上述設計,由於本發明係利用可撓性遮罩撓曲變形後所產生的彈力以作為鍵帽自動回位的驅動力而不需額外將具有一定結構高度的彈性件配置在鍵帽與底板之間,因此,本發明係可有效地解決先前技術中所提到的彈性件配置會增加按鍵整體高度的問題,以利於鍵盤薄型化的應用。Through the above design, since the present invention utilizes the elastic force generated by the flexural deformation of the flexible cover as the driving force for the automatic return of the key cap, it is not necessary to additionally arrange the elastic member having a certain structural height on the key cap and the bottom plate. Therefore, the present invention can effectively solve the problem that the elastic member configuration mentioned in the prior art increases the overall height of the button, thereby facilitating the application of the keyboard thinning.
在實際應用中,膠合層之配置係可不限於上述實施例,舉例來說,請參閱第5圖,其為根據本發明另一實施例所提出之鍵帽結構製造方法的製程示意圖,在此實施例與上述實施例中所提到的元件具有相同編號者,代表其具有相似的結構或功能。首先,將鍵盤框架16以及複數個鍵帽22(第5圖中僅以二個簡示之)設置於下模具11中以使得每一鍵帽22位於相對應之穿孔結構26上,以及將膠合層20塗佈於每一鍵帽22之頂面28以及每一穿孔結構26之孔緣支撐面30上(如第5圖(a)所示),並且接著將可撓性遮罩18設置於上模具13與下模具11之間(如第5圖(b)所示)。In practical applications, the configuration of the glue layer is not limited to the above embodiment. For example, please refer to FIG. 5 , which is a schematic diagram of a process for manufacturing a key cap structure according to another embodiment of the present invention. The elements having the same reference numerals as those mentioned in the above embodiments represent similar structures or functions. First, the keyboard frame 16 and a plurality of key caps 22 (only two of which are shown in FIG. 5) are disposed in the lower mold 11 such that each keycap 22 is located on the corresponding perforated structure 26, and will be glued. A layer 20 is applied to the top surface 28 of each keycap 22 and the aperture edge support surface 30 of each perforated structure 26 (as shown in Figure 5(a)), and then the flexible mask 18 is placed over Between the upper mold 13 and the lower mold 11 (as shown in Fig. 5(b)).
在完成上述步驟後,使用上模具13對可撓性遮罩18與設置於下模具11中之鍵盤框架16以及複數個鍵帽22進行熱壓成型,以在可撓性遮罩18上塑形出對應每一鍵帽22之突起覆蓋結構38,且使得膠合層20貼合於每一穿孔結構26之孔緣支撐面30與可撓性遮罩18之間以及使得膠合層20貼合於每一鍵帽22之頂面28與相對應之突起覆蓋結構38之間(如第5圖(c)所示),進而完成可撓性遮罩18與按鍵14以及鍵盤框架16之接合製程。After the above steps are completed, the flexible mask 18 and the keyboard frame 16 and the plurality of key caps 22 disposed in the lower mold 11 are thermoformed using the upper mold 13 to shape the flexible mask 18 A protrusion covering structure 38 corresponding to each of the keycaps 22 is provided, and the glue layer 20 is adhered between the edge supporting surface 30 of each of the perforating structures 26 and the flexible mask 18 and the bonding layer 20 is attached to each The top surface 28 of the keycap 22 is disposed between the corresponding protrusion covering structure 38 (as shown in FIG. 5(c)), thereby completing the bonding process of the flexible mask 18 with the button 14 and the keyboard frame 16.
除此之外,可撓性遮罩之塑形製程係可不限於上述實施例所提及的熱壓成型,其亦可改採用氣輔加熱成型(gas-assisted heating molding),舉例來說,請參閱第6圖,其為根據本發明另一實施例所提出之鍵帽結構製造方法的製程示意圖,在此實施例與上述實施例中所提到的元件具有相同編號者,代表其具有相似的結構或功能。首先,將鍵盤框架16以及複數個鍵帽22(第6圖中僅以二個簡示之)設置於下模具11中以使得每一鍵帽22位於相對應之穿孔結構26上(如第6圖(a)所示),且將膠合層20塗佈於可撓性遮罩18面對複數個鍵帽22之底面36上,並接著將已塗佈有膠合層20之可撓性遮罩18設置於下模具11上方(如第6圖(b)所示),最後,對可撓性遮罩18與設置於下模具11中之鍵盤框架16以及複數個鍵帽22進行氣輔加熱成型,以在可撓性遮罩18上塑形出對應每一鍵帽22之突起覆蓋結構38,且使得膠合層20貼合於每一穿孔結構26之孔緣支撐面30以及每一鍵帽22(如第6圖(c)所示),進而完成可撓性遮罩18與按鍵14以及鍵盤框架16之接合製程。至於針對上述氣輔加熱成型的相關描述,其係常見於先前技術中,於此不再贅述。In addition, the shaping process of the flexible mask may not be limited to the hot press forming mentioned in the above embodiments, and it may also be modified by gas-assisted heating molding. For example, please 6 is a schematic diagram of a manufacturing process of a keycap structure according to another embodiment of the present invention. The embodiment has the same number as the components mentioned in the above embodiments, and has similarities. Structure or function. First, the keyboard frame 16 and a plurality of key caps 22 (only two of which are shown in FIG. 6) are disposed in the lower mold 11 such that each of the keycaps 22 is located on the corresponding perforated structure 26 (eg, the sixth Figure (a)), and the glue layer 20 is applied to the bottom surface 36 of the flexible cover 18 facing the plurality of keycaps 22, and then the flexible mask coated with the glue layer 20 is applied. 18 is disposed above the lower mold 11 (as shown in FIG. 6(b)). Finally, the flexible mask 18 and the keyboard frame 16 and the plurality of key caps 22 disposed in the lower mold 11 are gas-assistedly heated. To form a protrusion covering structure 38 corresponding to each of the keycaps 22 on the flexible mask 18, and to make the glue layer 20 adhere to the edge supporting surface 30 of each of the perforating structures 26 and each of the keycaps 22 (As shown in Fig. 6(c)), the bonding process of the flexible mask 18 with the button 14 and the keyboard frame 16 is completed. As for the related description of the gas-assisted thermoforming described above, it is common in the prior art and will not be described herein.
相似地,在上述氣輔加熱成型製程中,膠合層之配置亦可不限於如第6圖所示之貼合方式,舉例來說,請參閱第7圖,其為根據本發明另一實施例所提出之鍵帽結構製造方法的製程示意圖,在此實施例與上述實施例中所提到的元件具有相同編號者,代表其具有相似的結構或功能。首先,將鍵盤框架16以及複數個鍵帽22(第7圖中僅以二個簡示之)設置於下模具11中以使得每一鍵帽22位於相對應之穿孔結構26上,以及將膠合層20塗佈於每一鍵帽22之頂面28以及每一穿孔結構26之孔緣支撐面30上(如第7圖(a)所示),並且接著將可撓性遮罩18設置於下模具11上方(如第7圖(b)所示)。最後,對可撓性遮罩18與設置於下模具11中之鍵盤框架16以及複數個鍵帽22進行氣輔加熱成型,以在可撓性遮罩18上塑形出對應每一鍵帽22之突起覆蓋結構38,且使得膠合層20貼合於每一穿孔結構26之孔緣支撐面30與可撓性遮罩18之間以及使得膠合層20貼合於每一鍵帽22之頂面28與相對應之突起覆蓋結構38之間(如第7圖(c)所示),進而完成可撓性遮罩18與按鍵14以及鍵盤框架16之接合製程。Similarly, in the gas-assisted thermoforming process, the configuration of the bonding layer may not be limited to the bonding manner as shown in FIG. 6, for example, refer to FIG. 7, which is another embodiment according to the present invention. The schematic diagram of the manufacturing process of the proposed keycap structure manufacturing method, which has the same reference numerals as the components mentioned in the above embodiments, has a similar structure or function. First, the keyboard frame 16 and a plurality of keycaps 22 (only two of which are shown in FIG. 7) are disposed in the lower mold 11 such that each keycap 22 is located on the corresponding perforated structure 26, and will be glued. A layer 20 is applied to the top surface 28 of each of the keycaps 22 and the edge support surface 30 of each of the perforated structures 26 (as shown in Figure 7(a)), and then the flexible mask 18 is placed over Above the lower mold 11 (as shown in Fig. 7(b)). Finally, the flexible mask 18 and the keyboard frame 16 and the plurality of key caps 22 disposed in the lower mold 11 are gas-assisted and thermoformed to form a corresponding key cap 22 on the flexible mask 18. The protrusions cover the structure 38, and the glue layer 20 is adhered between the edge supporting surface 30 of each perforating structure 26 and the flexible mask 18 and the bonding layer 20 is attached to the top surface of each of the keycaps 22 28 is formed between the corresponding protrusion covering structure 38 (as shown in FIG. 7(c)), thereby completing the bonding process of the flexible mask 18 with the button 14 and the keyboard frame 16.
值得一提的是,在實際應用中,本發明係可採用將鍵帽拆件為鍵帽結合母件以及鍵帽貼合公件之設計,舉例來說,請參閱第8圖,其為根據本發明另一實施例所提出之鍵盤100之部分剖面簡示圖,在此實施例與上述實施例中所提到的元件具有相同編號者,代表其具有相似的結構或功能,其相關描述於此不再贅述。如第8圖所示,鍵盤100包含底板12、複數個按鍵102、鍵盤框架16、可撓性遮罩18,以及膠合層20,複數個按鍵102係設置於底板12上以供使用者按壓而執行使用者所欲輸入之功能,每一按鍵102包含鍵帽104以及升降裝置24,鍵帽104包含鍵帽貼合公件106以及鍵帽結合母件108,換句話說,在此實施例中,本發明係將鍵帽104拆件為鍵帽結合母件108以及鍵帽貼合公件106,以先分別完成鍵帽結合母件108與升降裝置24之間的組裝以及鍵帽貼合公件106與可撓性遮罩18之間的貼附固定,接著再將鍵帽貼合公件106疊合貼附在鍵帽結合母件108上以共同形成鍵盤100上可供使用者按壓之鍵帽104,進而有效地提升按鍵組裝便利性。至於針對鍵帽貼合公件106與可撓性遮罩18之間的貼附固定的相關描述,其係可參照上述鍵帽22與可撓性遮罩18之貼附固定設計類推,於此不再贅述。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 It is worth mentioning that, in practical applications, the present invention can adopt a design in which a keycap disassembling member is used as a keycap to bond a female member and a keycap to fit a male member. For example, refer to FIG. 8, which is based on A partial cross-sectional schematic view of a keyboard 100 according to another embodiment of the present invention, which has the same number as the elements mentioned in the above embodiments, and has similar structures or functions. This will not be repeated here. As shown in FIG. 8, the keyboard 100 includes a bottom plate 12, a plurality of buttons 102, a keyboard frame 16, a flexible cover 18, and a glue layer 20, and a plurality of buttons 102 are disposed on the bottom plate 12 for the user to press. Performing the function that the user desires to input, each button 102 includes a keycap 104 and a lifting device 24, and the keycap 104 includes a keycap fitting male member 106 and a keycap coupling female member 108, in other words, in this embodiment In the present invention, the keycap 104 is disassembled into a keycap coupling mother member 108 and a keycap fitting male member 106, so as to complete the assembly between the keycap coupling mother member 108 and the lifting device 24 and the keycap fitting. Attachment and fixing between the member 106 and the flexible mask 18, and then attaching the keycap fitting member 106 to the keycap coupling member 108 to form a keyboard 100 for the user to press. The key cap 104, thereby effectively improving the ease of button assembly. For the related description of the attachment and fixing between the keycap fitting member 106 and the flexible mask 18, reference may be made to the attachment and fixing design of the above-mentioned keycap 22 and the flexible mask 18, No longer. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
10、100‧‧‧鍵盤10, 100‧‧‧ keyboard
11‧‧‧下模具 11‧‧‧ Lower mold
12‧‧‧底板 12‧‧‧floor
13‧‧‧上模具 13‧‧‧Upper mold
14、102‧‧‧按鍵 14, 102‧‧‧ button
16‧‧‧鍵盤框架 16‧‧‧ keyboard frame
18‧‧‧可撓性遮罩 18‧‧‧Flexible mask
20‧‧‧膠合層 20‧‧ ‧ glue layer
22、104‧‧‧鍵帽 22, 104‧‧‧ keycap
24‧‧‧升降裝置 24‧‧‧ Lifting device
26‧‧‧穿孔結構 26‧‧‧Perforated structure
28‧‧‧頂面 28‧‧‧ top surface
30‧‧‧孔緣支撐面 30‧‧‧ hole edge support surface
32‧‧‧側面 32‧‧‧ side
34‧‧‧孔壁面 34‧‧‧ hole wall
36‧‧‧底面 36‧‧‧ bottom
38‧‧‧突起覆蓋結構 38‧‧‧Protruding cover structure
40‧‧‧側臂部分 40‧‧‧ side arm section
106‧‧‧鍵帽貼合公件 106‧‧‧Keycap fittings
108‧‧‧鍵帽結合母件 108‧‧‧Keycap combined with parent
V‧‧‧垂直間距 V‧‧‧ vertical spacing
H‧‧‧水平間距 H‧‧‧ horizontal spacing
T‧‧‧片體厚度 T‧‧‧Sheet thickness
300、302、304‧‧‧步驟 300, 302, 304‧ ‧ steps
第1圖根據本發明之一實施例所提供之鍵盤之立體示意圖。 第2圖為第1圖之鍵盤沿著剖面線A-A之剖面簡示圖。 第3圖為根據本發明之一實施例所提出之鍵帽結構製造方法的流程圖。 第4圖為搭配第3圖的製程示意圖。 第5圖為根據本發明另一實施例所提出之鍵帽結構製造方法的製程示意圖。 第6圖為根據本發明另一實施例所提出之鍵帽結構製造方法的製程示意圖。 第7圖為根據本發明另一實施例所提出之鍵帽結構製造方法的製程示意圖。 第8圖為根據本發明另一實施例所提出之鍵盤之部分剖面簡示圖。 1 is a perspective view of a keyboard provided in accordance with an embodiment of the present invention. Figure 2 is a schematic cross-sectional view of the keyboard of Figure 1 taken along section line A-A. 3 is a flow chart of a method of fabricating a keycap structure in accordance with an embodiment of the present invention. Figure 4 is a schematic diagram of the process with the third drawing. FIG. 5 is a schematic view showing the manufacturing process of the keycap structure according to another embodiment of the present invention. Fig. 6 is a schematic view showing the process of manufacturing a keycap structure according to another embodiment of the present invention. FIG. 7 is a schematic view showing a process of manufacturing a keycap structure according to another embodiment of the present invention. Figure 8 is a partial cross-sectional, schematic view of a keyboard in accordance with another embodiment of the present invention.
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Cited By (3)
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---|---|---|---|---|
CN111403211A (en) * | 2020-05-06 | 2020-07-10 | 光宝科技(常州)有限公司 | Keyboard frame and keyboard |
TWI720757B (en) * | 2019-12-23 | 2021-03-01 | 達方電子股份有限公司 | Waterproof film and keyboard thereof |
CN113410079A (en) * | 2020-03-17 | 2021-09-17 | 淮安达方电子有限公司 | Keyboard waterproof film and keyboard |
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US8927890B2 (en) * | 2011-03-07 | 2015-01-06 | Synaptics Incorporated | Capacitive keyswitch technologies |
TW201526056A (en) * | 2013-12-31 | 2015-07-01 | Chicony Electronics Co Ltd | Covering structure, input device, and manufacturing method of covering structure |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI720757B (en) * | 2019-12-23 | 2021-03-01 | 達方電子股份有限公司 | Waterproof film and keyboard thereof |
US11289288B2 (en) | 2019-12-23 | 2022-03-29 | Darfon Electronics Corp. | Waterproof film and keyboard thereof |
CN113410079A (en) * | 2020-03-17 | 2021-09-17 | 淮安达方电子有限公司 | Keyboard waterproof film and keyboard |
CN111403211A (en) * | 2020-05-06 | 2020-07-10 | 光宝科技(常州)有限公司 | Keyboard frame and keyboard |
CN111403211B (en) * | 2020-05-06 | 2022-03-11 | 光宝科技(常州)有限公司 | Keyboard frame and keyboard |
Also Published As
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TW202036622A (en) | 2020-10-01 |
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