TWI666293B - Surface-protective film for transparent conductive film, and transparent conductive film using the same - Google Patents
Surface-protective film for transparent conductive film, and transparent conductive film using the same Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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Abstract
本發明提供一種透明導電性膜用表面保護膜及使用表面保護膜的透明導電性膜,透明導電性膜用表面保護膜的黏合劑層維持表面的平滑性,即使貼合到透明導電性膜上也具有優異的處理性,在透明導電性膜的製造、加工製程中,起因於表面保護膜的外觀的缺陷不良得到改善,且在觸控面板用透明電極製造製程中的生產性良好。一種透明導電性膜用表面保護膜5,其使用於貼合到在一個面上形成有透明導電膜的樹脂膜的另一個面上,在基材膜1的單面上具有使用含有異氰酸酯類交聯劑和交聯觸媒的丙烯酸類黏合劑而疊層的黏合劑層2,黏合劑層在30℃下的儲存模數為4.0×105Pa以上,且所述黏合劑層的乾燥開始15分鐘後的所述黏合劑層的反應率K為75%以上。 The invention provides a surface protective film for a transparent conductive film and a transparent conductive film using the surface protective film. The adhesive layer of the surface protective film for a transparent conductive film maintains the smoothness of the surface, even if it is bonded to the transparent conductive film. It also has excellent handleability. In the manufacturing and processing processes of the transparent conductive film, defects due to the appearance of the surface protective film are improved, and the productivity in the manufacturing process of the transparent electrode for a touch panel is good. A surface protective film 5 for a transparent conductive film, which is used for bonding to the other surface of a resin film having a transparent conductive film formed on one surface, and having isocyanate-containing compounds on one surface of the base film 1 Adhesive layer 2 laminated with a cross-linking agent and an acrylic adhesive of a cross-linking catalyst. The storage modulus of the adhesive layer at 30 ° C. is 4.0 × 10 5 Pa or more, and drying of the adhesive layer begins 15 The reaction rate K of the adhesive layer after 75 minutes was 75% or more.
Description
本發明包含使用於貼合到在一個面上形成有透明導電膜的樹脂膜的另一個面上的透明導電性膜用表面保護膜及使用該表面保護膜的透明導電性膜。更詳細地說,本發明提供一種透明導電性膜用表面保護膜及使用表面保護膜的透明導電性膜,透明導電性膜用表面保護膜中,所形成的黏合劑層維持表面的平滑性,即使貼合到透明導電性膜上也具有優異的處理性,在透明導電性膜的製造、加工製程中,起因於表面保護膜的外觀的缺陷不良得到改善,且在觸控面板用透明電極製程中的生產性良好。 The present invention includes a surface protective film for a transparent conductive film used for bonding to a resin film having a transparent conductive film formed on one surface and a transparent conductive film using the surface protective film. More specifically, the present invention provides a surface protective film for a transparent conductive film and a transparent conductive film using the surface protective film. In the surface protective film for a transparent conductive film, the formed adhesive layer maintains surface smoothness. It has excellent handleability even if it is bonded to a transparent conductive film. In the manufacturing and processing processes of transparent conductive films, defects caused by the appearance of the surface protective film are improved, and in the process of manufacturing transparent electrodes for touch panels Good productivity.
一直以來,在觸控面板、電子紙、電磁波遮蔽材料、各種感測器、液晶面板、有機EL、太陽能電池等技術領域中,透明導電性膜(以下,有時也僅稱為“導電性膜”)被廣泛用於透明電極等的形成用途。此透明導電性膜在基材的一個面上形成有例如由ITO(銦錫氧化物化合物)、AZO或GZO(在ZnO(氧化鋅)中添加有鋁或鎵的化合物)等構成的透明導電膜。 In the technical fields such as touch panels, electronic paper, electromagnetic wave shielding materials, various sensors, liquid crystal panels, organic ELs, and solar cells, transparent conductive films (hereinafter, sometimes referred to simply as "conductive films" ") Is widely used for forming applications such as transparent electrodes. This transparent conductive film has a transparent conductive film made of, for example, ITO (indium tin oxide compound), AZO, or GZO (a compound in which aluminum or gallium is added to ZnO (zinc oxide)) on one surface of the substrate. .
另外,在觸控面板用透明電極的製程中,要經過多種加熱製程和試劑處理的製程,例如,對形成有由ITO、AZO或GZO等構成的透明導電膜的透明導電性膜進行退火處理的金屬氧化膜的結晶化製程、抗蝕劑的印刷製程、蝕刻處理製程、利用銀膠形成電路配線的製程、絕緣層的印刷製程、沖裁製程等。在這樣的透明電極的製造製程中,為了防止在透明導電性膜的形成有透明導電膜的面的相反側面上產生汙損、損傷,貼合透明導電性膜用表面保護膜來使用。 In addition, in the process of manufacturing transparent electrodes for touch panels, a variety of heating processes and reagent processing processes are required. For example, a transparent conductive film having a transparent conductive film made of ITO, AZO, or GZO is annealed. Crystallization process of metal oxide film, printing process of resist, etching process process, process of forming circuit wiring using silver glue, printing process of insulating layer, punching process, etc. In the manufacturing process of such a transparent electrode, a surface protective film for a transparent conductive film is bonded and used in order to prevent contamination or damage on the opposite side of the surface of the transparent conductive film on which the transparent conductive film is formed.
在透明電極的製造製程中,退火處理、利用銀膠的電路配線的形成等在約150℃左右的溫度下進行加熱處理,因此要求透明導電性膜用保護膜具有耐熱性。 In the manufacturing process of the transparent electrode, heat treatment is performed at a temperature of about 150 ° C. such as annealing treatment, formation of circuit wiring using silver glue, and the like. Therefore, the protective film for a transparent conductive film is required to have heat resistance.
關於在觸控面板用等的、透明電極的製造製程中使用的透明導電性膜用保護膜,提出了各種方案。例如,專利文獻1中提出了一種透明導電性膜用表面保護膜,其在由熔點為200℃以上的熱塑性樹脂膜構成的基材的單面上設置有黏合劑層。其與使用聚乙烯、聚丙烯等聚烯烴樹脂作為基材的透明導電性膜用表面保護膜相比,耐熱性較良好。 Various proposals have been made regarding a protective film for a transparent conductive film used in a manufacturing process of a transparent electrode such as a touch panel. For example, Patent Document 1 proposes a surface protective film for a transparent conductive film, in which an adhesive layer is provided on one surface of a substrate made of a thermoplastic resin film having a melting point of 200 ° C. or higher. Compared with a surface protective film for a transparent conductive film using a polyolefin resin such as polyethylene and polypropylene as a substrate, it has better heat resistance.
另外,專利文獻2中提出了一種透明導電性膜用表面保護膜的製造方法,其中,在含有聚對苯二甲酸乙二酯樹脂和/或聚萘二甲酸乙二酯樹脂的基材膜的單面上塗佈黏合劑後,以預定的溫度‧停留時間‧拉伸張力進行乾燥。透過該製造方法得到的透明導電性膜用表面保護膜在貼合到透明導電性膜上之後,即使經過加熱製程,也不會產生較大的捲曲(curl)。 In addition, Patent Document 2 proposes a method for producing a surface protective film for a transparent conductive film, in which a substrate film containing a polyethylene terephthalate resin and / or a polyethylene naphthalate resin is used. After the adhesive is applied on one side, it is dried at a predetermined temperature, residence time, and tensile tension. After the surface protective film for a transparent conductive film obtained by this manufacturing method is bonded to the transparent conductive film, even if it undergoes a heating process, a large curl does not occur.
專利文獻3中提出了帶有透明導電膜和保護膜的樹脂膜,其中,在樹脂膜的單面上設置透明導電膜,在與設置有該透明導電膜的面相反的樹脂膜面上設置保護膜,上述保護膜由第一膜和第二膜構成且從上述樹脂膜起依次設置上述第一膜和第二膜,第一膜在150℃下加熱30分鐘後的熱收縮率在MD和TD方向上均為0.5%以下,第二膜具有與上述帶有透明導電膜和保護膜的樹脂膜的線膨脹係數之差為40ppm/℃以下的線膨脹係數。若應用此發明,則能夠得到不會由觸控面板化等加工製程中的熱處理所致的尺寸變化和捲曲的透明導電膜。 Patent Document 3 proposes a resin film with a transparent conductive film and a protective film, wherein a transparent conductive film is provided on one side of the resin film, and a protection is provided on the resin film surface opposite to the surface on which the transparent conductive film is provided. Film, the protective film is composed of a first film and a second film, and the first film and the second film are sequentially arranged from the resin film, and the thermal shrinkage of the first film after heating at 150 ° C for 30 minutes is between MD and TD Both directions are 0.5% or less, and the second film has a linear expansion coefficient whose difference from the linear expansion coefficient of the above-mentioned resin film with a transparent conductive film and a protective film is 40 ppm / ° C or less. If this invention is applied, a transparent conductive film that does not have dimensional changes and curl caused by heat treatment in processing processes such as touch panel formation can be obtained.
另外,專利文獻4中提出了一種透明導電性膜用表面保護膜,其通過使用預定的厚度和抗彎曲性的剝離膜,使得表面保護膜的黏合劑層表面平滑,外觀的缺陷不良得到了改善。 In addition, Patent Document 4 proposes a surface protective film for a transparent conductive film. By using a release film having a predetermined thickness and a bending resistance, the surface of the adhesive layer of the surface protective film is smoothed, and defects in appearance are improved. .
專利文獻1:日本特開2003-170535號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2003-170535
專利文獻2:日本專利第4342775號公報 Patent Document 2: Japanese Patent No. 4342775
專利文獻3:日本特開平11-268168號公報 Patent Document 3: Japanese Patent Application Laid-Open No. 11-268168
專利文獻4:日本特開2013-226676號公報 Patent Document 4: Japanese Patent Application Publication No. 2013-226676
本發明提供與專利文獻4同樣地表面保護膜的黏合劑層維持表面的平滑性、外觀的缺陷不良得到改善的透明導 電性膜用表面保護膜。專利文獻4的表面保護膜的特徵在於使用了40℃下的抗彎曲性為0.30mN~40mN的剝離膜,但具有該抗彎曲性的膜存在厚度變厚、成本增高的問題。另外,在表面保護膜的製造時或者使用者使用表面保護膜時,根據所使用的加工機械的規格,表面保護膜的纏繞直徑有時受到限制。這種情況下,對於使用了基材厚度厚的剝離膜的表面保護膜而言,與使用了基材厚度較薄的剝離膜的表面保護膜相比,存在如下問題:以預定纏繞直徑捲起時的捲起長度變短,在觸控面板用透明電極製造製程中的生產性下降。 The present invention provides a transparent guide in which the adhesive layer of a surface protective film maintains the smoothness of the surface and the defect of the appearance is improved in the same manner as in Patent Document 4. Surface protective film for electrical film. The surface protection film of Patent Document 4 is characterized in that a peeling film having a bending resistance of 0.30 mN to 40 mN at 40 ° C is used. However, the film having this bending resistance has a problem that the thickness is increased and the cost is increased. In addition, when manufacturing a surface protection film or when a user uses a surface protection film, the winding diameter of the surface protection film may be limited depending on the specifications of the processing machine used. In this case, the surface protection film using a release film having a thick substrate has a problem that, compared with a surface protection film using a release film having a thin substrate, it is rolled up with a predetermined winding diameter. At this time, the roll-up length becomes shorter, and productivity in a manufacturing process of a transparent electrode for a touch panel decreases.
本發明是鑒於上述情況而完成的,其課題在於提供透明導電性膜用表面保護膜及使用表面保護膜的透明導電性膜,透明導電性膜用表面保護膜在從滾筒反繞的狀態下,透明導電性膜用表面保護膜的黏合劑層維持表面的平滑性,即使貼合到透明導電性膜上也具有優異的處理性,在透明導電性膜的製造‧加工製程中,起因於透明導電性膜用表面保護膜的外觀的缺陷不良得到改善,且在觸控面板用透明電極製程中的生產性良好。 The present invention has been made in view of the above-mentioned circumstances, and an object thereof is to provide a surface protective film for a transparent conductive film and a transparent conductive film using the surface protective film. The adhesive layer of the surface protective film for transparent conductive films maintains the smoothness of the surface, and has excellent handleability even when bonded to transparent conductive films. It is caused by transparent conductive during the manufacturing and processing of transparent conductive films. The defect of the external appearance of the surface protective film for sexual films is improved, and the productivity in a transparent electrode manufacturing process for a touch panel is good.
透明導電性膜用表面保護膜通過如下方法製造:在基材膜或剝離膜上塗佈黏合劑,在乾燥製程中使黏合劑中的溶劑蒸發後,貼合剝離膜或基材膜,並捲成滾筒形狀。本發明人進行了深入研究,結果發現,乾燥開始15分鐘後的黏合劑層的固化狀態與黏合劑層的表面的凹凸狀變形相關。進而發現,通過使用黏合劑層在乾燥開始後15分鐘以內發生固化的黏合 劑,即使在將基材厚度較薄的剝離膜用於透明導電性膜用表面保護膜的黏合劑層的貼合用途的情況下,也能夠抑制在上述黏合劑層的待貼合到被黏物上的表面產生凹凸的變形,從而完成了本發明。 A surface protective film for a transparent conductive film is produced by coating an adhesive on a base film or a release film, and evaporating a solvent in the adhesive during a drying process, and then attaching the release film or the base film to a roll. Into a roller shape. The inventors conducted intensive studies and found that the curing state of the adhesive layer 15 minutes after the start of drying is related to the uneven shape of the surface of the adhesive layer. It was further found that by using an adhesive layer, a cured adhesion occurred within 15 minutes after the start of drying. Agent, even when a release film having a thin base material is used for bonding an adhesive layer of a surface protective film for a transparent conductive film, it is possible to suppress the above-mentioned adhesive layer from being adhered to the adhesive layer. The surface of the object is deformed by unevenness, thereby completing the present invention.
在表面保護膜的製程中,通常在基材膜上塗佈黏合劑並使其乾燥而形成黏合劑層後,在捲筒狀態下進行熟化,但在此熟化期間中,會由於捲筒的捲緊等影響而產生剝離膜的變形。因此,在剝離膜變形後黏合劑層固化的情況下,剝離膜的表面形狀轉印到黏合劑層的表面,經過透明導電性薄膜的製造、加工製程時,這會成為透明導電性薄膜的外觀顯著變差的原因。 In the process of manufacturing a surface protection film, an adhesive is usually applied to a substrate film and dried to form an adhesive layer, and then the film is cured in a roll state. However, during this curing period, the Deformation of the release film occurs due to the short-term influence. Therefore, when the adhesive layer is cured after the release film is deformed, the surface shape of the release film is transferred to the surface of the adhesive layer. When the transparent conductive film is manufactured and processed, the transparent conductive film will have a significant appearance. Cause of deterioration.
本發明技術構思如下:在將透明導電性膜用表面保護膜以捲筒狀進行熟化的期間,在剝離膜發生變形之前進行黏合劑層的固化,由此,即使剝離膜發生變形,也可抑制黏合劑層的表面的變形,從而維持平滑性。 The technical idea of the present invention is as follows: during curing of the surface protective film for a transparent conductive film in a roll shape, curing of the adhesive layer is performed before the release film is deformed, so that even if the release film is deformed, it can be suppressed. The surface of the adhesive layer is deformed, thereby maintaining smoothness.
即,在將本發明所涉及的透明導電性膜用表面保護膜以捲筒狀進行熟化的期間,在貼合有剝離膜的黏合劑層受到剝離膜變形的牽引而變形之前,進行黏合劑層的固化,防止在貼合到被黏物上的黏合劑層的表面產生凹凸,從而維持平滑性。 That is, while the surface protective film for a transparent conductive film according to the present invention is cured in a roll shape, the adhesive layer is applied before the adhesive layer to which the release film is bonded is deformed and pulled by the deformation of the release film. Curing to prevent unevenness on the surface of the adhesive layer bonded to the adherend, thereby maintaining smoothness.
本發明人發現,通過測定黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率和老化(熟化)完成後的黏合劑層的儲存模數,能夠掌握黏合劑層的固化的進行狀態。更具體地說,如果黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率和老化(熟化)完成後的黏合劑層的儲存模數在預定的範圍內,則即使在 將基材厚度薄的剝離膜用於透明導電性膜用表面保護膜的黏合劑層的貼合用途的情況下,也能夠抑制在上述黏合劑層的待貼合到被黏物上的表面產生凹凸的變形。 The inventors have found that by measuring the reaction rate of the adhesive layer 15 minutes after the drying of the adhesive layer and the storage modulus of the adhesive layer after aging (aging) are completed, the progress of curing of the adhesive layer can be grasped. More specifically, if the reaction rate of the adhesive layer 15 minutes after the drying of the adhesive layer starts and the storage modulus of the adhesive layer after the aging (aging) is completed are within a predetermined range, When the release film with a thin substrate is used for bonding the adhesive layer of the surface protective film for a transparent conductive film, it is possible to suppress the occurrence of the surface of the adhesive layer to be adhered to the adherend. Deformation of bumps.
為了解決上述課題,本發明提供如下的透明導電性膜用表面保護膜。 In order to solve the above problems, the present invention provides the following surface protective film for a transparent conductive film.
一種透明導電性膜用表面保護膜,其使用於貼合到在一個面上形成有透明導電膜的樹脂膜的另一個面上,其特徵在於,上述透明導電性膜用表面保護膜具有在基材膜的單面上使用含有異氰酸酯類交聯劑和交聯觸媒的丙烯酸類黏合劑疊層得到的黏合劑層,所述黏合劑層在30℃下的儲存模數為4.0×105Pa以上,且所述黏合劑層的由下式表示的所述黏合劑層的乾燥開始15分鐘後的所述黏合劑層的反應率K為75%以上。 A surface protective film for a transparent conductive film, which is used for bonding to the other surface of a resin film having a transparent conductive film formed on one surface, wherein the surface protective film for a transparent conductive film has a substrate An adhesive layer obtained by laminating an acrylic adhesive containing an isocyanate crosslinking agent and a crosslinking catalyst on one side of the material film. The storage modulus of the adhesive layer at 30 ° C is 4.0 × 10 5 Pa Above, and the reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer of the adhesive layer represented by the following formula is 15 minutes or more.
反應率K(%)=(1-a/b)×100 Reaction rate K (%) = (1-a / b) × 100
(此處,a為所述黏合劑層的乾燥開始15分鐘後的所述黏合劑層的透過傅立葉轉換紅外吸光光度法得到的2270cm-1/1730cm-1的峰強度比,b為未固化時的所述黏合劑層的透過傅立葉轉換紅外吸光光度法得到的2270cm-1/1730cm-1的峰強度比) When (here, a is the peak intensity ratio of the drying start 1730cm through Fourier transform infrared light absorption of the adhesive layer 15 minutes after spectrophotometric determination 2270cm -1 / -1 of the adhesive layer, b uncured the adhesive layer transform infrared absorption peak intensity of 2270cm -1 / 1730cm -1 spectrophotometry ratio obtained through the Fourier)
另外,本發明提供一種透明導電性膜,其為將上述的透明導電性膜用表面保護膜貼合到在一個面上形成有透明導電膜的樹脂膜的另一個面上得到的透明導電性膜。 The present invention also provides a transparent conductive film, which is a transparent conductive film obtained by bonding the surface protective film for a transparent conductive film described above to the other surface of a resin film having the transparent conductive film formed on one surface. .
本發明提供一種透明導電性膜用表面保護膜及使用表面保護膜的透明導電性膜,本發明的透明導電性膜用表面 保護膜在從滾筒反繞的狀態下,所形成的黏合劑層維持表面的平滑性,即使貼合到透明導電性膜上也具有優異的處理性,在透明導電性膜的製造、加工製程中,起因於表面保護膜的外觀的缺陷不良得到改善,且在觸控面板用透明電極製造製程中生產性良好。 The invention provides a surface protective film for a transparent conductive film and a transparent conductive film using the surface protective film. The surface for a transparent conductive film of the invention In the state where the protective film is wound from the drum, the formed adhesive layer maintains the smoothness of the surface, and has excellent handleability even when bonded to a transparent conductive film. In the manufacturing process of the transparent conductive film, The defect caused by the appearance of the surface protection film is improved, and the productivity is good in the manufacturing process of the transparent electrode for a touch panel.
另外,近年來,隨著智慧手機等高功能便攜終端的殼體的薄型化,所使用的透明導電性膜的薄型化不斷進展。本發明的透明導電性膜用表面保護膜在觸控面板用透明電極的製造製程中,即使在貼合到薄型化的透明導電性膜上的狀態下經過加熱製程後,產生的捲曲也非常小。由此,能夠大幅改善觸控面板用透明電極的製造製程的作業性、生產效率。 In addition, in recent years, as the thickness of a housing of a high-function portable terminal such as a smartphone is reduced, the thickness of a transparent conductive film used has been continuously reduced. In the manufacturing process of the transparent electrode for a touch panel, the surface protective film for a transparent conductive film of the present invention has a very small curl even after being subjected to a heating process in a state of being bonded to a thin transparent conductive film. . This can significantly improve workability and production efficiency in the manufacturing process of the transparent electrode for a touch panel.
1‧‧‧基材膜 1‧‧‧ substrate film
2‧‧‧黏合劑層 2‧‧‧ Adhesive layer
3‧‧‧剝離膜 3‧‧‧ peeling film
4‧‧‧黏合膜 4‧‧‧ Adhesive film
5‧‧‧透明導電性膜用表面保護膜 5‧‧‧ Surface protective film for transparent conductive film
6‧‧‧樹脂膜 6‧‧‧ resin film
6a‧‧‧樹脂膜的一個面 6a‧‧‧One side of resin film
6b‧‧‧樹脂膜的另一個面 6b‧‧‧ the other side of the resin film
7‧‧‧透明導電膜 7‧‧‧ transparent conductive film
10‧‧‧透明導電性膜 10‧‧‧ transparent conductive film
11‧‧‧疊層膜 11‧‧‧ laminated film
21‧‧‧剝離膜的滾筒 21‧‧‧ roller for peeling film
22‧‧‧基材膜的滾筒 22‧‧‧ Roller for substrate film
23‧‧‧黏合劑塗佈裝置 23‧‧‧Adhesive coating device
24‧‧‧乾燥爐 24‧‧‧ Drying Furnace
25、26‧‧‧壓力滾輪 25, 26‧‧‧ Pressure roller
27‧‧‧透明導電性膜用表面保護膜的滾筒 27‧‧‧ Roller for surface protective film for transparent conductive film
【第1圖】為表示本發明的透明導電性膜用表面保護膜的一例的剖面圖。 FIG. 1 is a cross-sectional view showing an example of a surface protective film for a transparent conductive film of the present invention.
【第2圖】為表示將本發明的透明導電性膜用表面保護膜貼合到透明導電性膜上的例子的剖面圖。 FIG. 2 is a cross-sectional view showing an example in which the surface protective film for a transparent conductive film of the present invention is bonded to a transparent conductive film.
【第3圖】為表示本發明的透明導電性膜用表面保護膜的製造方法的一例的示意圖。 FIG. 3 is a schematic diagram showing an example of a method for producing a surface protective film for a transparent conductive film of the present invention.
以下,基於實施方式對本發明進行詳細說明。 Hereinafter, the present invention will be described in detail based on the embodiments.
第1圖為表示本發明的透明導電性膜用表面保護膜的一例的剖面圖。此透明導電性膜用表面保護膜5在透明的具有可撓性的基材膜1的單面上疊層有黏合劑層2。黏合劑層2之待貼合 至被黏附物的表面上,藉由已剝離處理的面,疊層著用以保護黏合劑層的表面之已剝離處理的剝離膜3。 FIG. 1 is a cross-sectional view showing an example of a surface protective film for a transparent conductive film of the present invention. The surface protective film 5 for a transparent conductive film has an adhesive layer 2 laminated on one surface of a transparent flexible substrate film 1. Adhesive layer 2 to be attached On the surface of the adherend, a release-treated peeling film 3 is laminated to protect the surface of the adhesive layer via the peeled surface.
作為基材膜1,使用透明的具有可撓性的塑膠膜。由此,能夠在將本發明的透明導電性膜用表面保護膜貼合黏合到在基材的一個面上形成有透明導電膜的透明導電性膜的另一個面上的狀態下直接進行導電性膜的外觀檢查。作為用作基材膜1的塑膠膜,較佳可以舉例如聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚間苯二甲酸乙二酯(polyethylene isophthalate)、聚對苯二甲酸丁二酯(polybutylene terephthalate)等聚酯膜。另外,除了聚酯膜以外,只要是具有所需的強度且具有光學適性的塑膠膜,則也可以使用其他樹脂種類的塑膠膜。基材膜1為未拉伸膜、單軸或雙軸延伸膜等,雖然沒有特別限制,但基材膜的加熱收縮率低的較佳。 As the base film 1, a transparent flexible plastic film is used. Accordingly, the surface conductive film for a transparent conductive film of the present invention can be directly adhered and bonded to the other surface of the transparent conductive film having the transparent conductive film formed on one surface of the substrate. Visual inspection of the film. As the plastic film used as the base film 1, preferred examples include polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, and polyethylene terephthalate. Polyester film such as polybutylene terephthalate. In addition, in addition to the polyester film, as long as it is a plastic film having the required strength and optical compatibility, other resin types of plastic films may be used. The base film 1 is an unstretched film, a uniaxially or biaxially stretched film, and the like. Although not particularly limited, it is preferred that the base film has a low heat shrinkage rate.
另外,本發明所涉及的透明導電性膜用表面保護膜的基材膜1的厚度沒有特別限制,根據所使用的透明導電性膜來選擇即可。在所使用的透明導電性膜厚至100μm以上的情況下,透明導電性膜本身的處理性不會太差,因此,表面保護膜主要著眼於對透明導電性膜的表面進行保護即可。因此,可以使用表面保護膜的基材膜1的厚度為25~75μm左右的表面保護膜。 The thickness of the base film 1 of the surface protective film for a transparent conductive film according to the present invention is not particularly limited, and it may be selected according to the transparent conductive film to be used. When the thickness of the transparent conductive film used is 100 μm or more, the handleability of the transparent conductive film itself is not too bad. Therefore, the surface protective film mainly focuses on protecting the surface of the transparent conductive film. Therefore, a surface protection film having a thickness of about 25 to 75 μm of the base film 1 of the surface protection film can be used.
另一方面,在所使用的透明導電性膜薄至50μm以下的情況下,透明導電性膜本身的處理性較差,因此,也要考慮表面保護膜的處理性,使用基材膜的厚度厚的透明導電性膜較佳。作為具體的基材膜的厚度,較佳的為100~188μm左右。 On the other hand, when the transparent conductive film used is as thin as 50 μm or less, the handleability of the transparent conductive film itself is poor. Therefore, the handleability of the surface protective film must also be considered. A transparent conductive film is preferred. The specific thickness of the substrate film is preferably about 100 to 188 μm.
另外,可以根據需要在基材膜1的疊層有黏合劑層2的面的相反側面上疊層以防止表面污垢為目的的防污層、抗靜電層、寡聚物防止層、防止損傷的硬塗層或者進行電暈放電處理、錨固塗佈(anchor coat)處理等易黏合性的處理。 In addition, if necessary, an antifouling layer, an antistatic layer, an oligomer prevention layer, or an anti-damage layer for preventing surface dirt can be laminated on the opposite side of the surface on which the adhesive layer 2 is laminated on the base film 1 A hard-coating layer, or an adhesion-prone treatment such as a corona discharge treatment or an anchor coat treatment.
本發明所涉及的透明導電性膜用表面保護膜的黏合劑層2較佳的為丙烯酸類黏合劑,其中,使用了異氰酸酯類交聯劑和交聯觸媒的丙烯酸類黏合劑較佳。透明導電性膜用表面保護膜對透明導電性膜進行保護的狀態下應用的,加熱處理前後黏合力的變化較小的黏合劑,則對於丙烯酸類黏合劑的組成沒有特別限定,可以使用公知的材料。 The adhesive layer 2 of the surface protective film for a transparent conductive film according to the present invention is preferably an acrylic adhesive, and among them, an acrylic adhesive using an isocyanate-based crosslinking agent and a crosslinking catalyst is preferred. Transparent conductive film A surface protective film is used in a state where the transparent conductive film is protected, and there is no particular limitation on the composition of the acrylic adhesive, and there is no particular limitation on the composition of the acrylic adhesive. material.
作為丙烯酸類黏合劑,較佳的為在(甲基)丙烯酸類聚合物(丙烯酸類樹脂組合物)中添加有交聯劑且需要添加有賦黏劑的黏合劑。(甲基)丙烯酸類聚合物通常為丙烯酸正丁酯、丙烯酸-2-乙基己酯、丙烯酸異辛酯、丙烯酸異壬酯等主要單體與丙烯腈、醋酸乙烯酯、甲基丙烯酸甲酯、丙烯酸乙酯等共聚單體、丙烯酸、甲基丙烯酸、丙烯酸羥乙酯、丙烯酸羥丁酯、縮水甘油甲基丙烯酸酯、N-羥甲基甲基丙烯醯胺等官能性單體共聚而成的聚合物。構成(甲基)丙烯酸類聚合物的單體組成較佳的(甲基)丙烯酸類單體為50%以上,(甲基)丙烯酸類單體也可以為100%。 As the acrylic adhesive, a (meth) acrylic polymer (acrylic resin composition) is preferably an adhesive in which a crosslinking agent is added and a tackifier is required to be added. (Meth) acrylic polymers are usually main monomers such as n-butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, isononyl acrylate, and acrylonitrile, vinyl acetate, and methyl methacrylate. Comonomers such as acrylic acid, ethyl acrylate, acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxybutyl acrylate, glycidyl methacrylate, N-methylolmethacrylamide, etc. Polymer. The (meth) acrylic monomer having a preferable monomer composition constituting the (meth) acrylic polymer is 50% or more, and the (meth) acrylic monomer may be 100%.
作為交聯劑,較佳的為異氰酸酯化合物,其中,在一分子中具有至少3個以上的異氰酸酯(NCO)基的多異氰酸酯化合物較佳。 As the crosslinking agent, an isocyanate compound is preferable, and among them, a polyisocyanate compound having at least three or more isocyanate (NCO) groups in one molecule is preferable.
多異氰酸酯化合物分為脂肪族類異氰酸酯、芳香族類異氰 酸酯、非環類異氰酸酯、脂肪環類異氰酸酯等,可以為任意一種。作為二官能的異氰酸酯化合物的具體例,可以舉例如六亞甲基二異氰酸酯(HDI)、異佛爾酮二異氰酸酯(IPDI)、三甲基六亞甲基二異氰酸酯(TMDI)等脂肪族類異氰酸酯化合物;二苯甲烷二異氰酸酯(methylene diphenyl diisocyanate,MDI)、苯二甲基二異氰酸酯(xylylene diisocyanate,XDI)、氫化苯二甲基二異氰酸酯(H6XDI)、聯鄰甲苯二異氰酸酯(o-tolidine Diisocyanate,TOID)、甲苯二異氰酸酯(TDI)等芳香族類異氰酸酯化合物。 The polyisocyanate compound is classified into an aliphatic isocyanate, an aromatic isocyanate, an acyclic isocyanate, an alicyclic isocyanate, and the like, and may be any one. Specific examples of the difunctional isocyanate compound include aliphatic isocyanates such as hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), and trimethylhexamethylene diisocyanate (TMDI). Compounds; methylene diphenyl diisocyanate (MDI), xylylene diisocyanate (XDI), hydrogenated xylylene diisocyanate (H6XDI), o- tolidine diisocyanate ( o- tolidine Diisocyanate, TOID), toluene diisocyanate (TDI) and other aromatic isocyanate compounds.
作為三官能以上的異氰酸酯化合物,可以舉出二異氰酸酯類(在一分子中具有2個NCO基的化合物)的縮二脲型改質物、三聚異氰酸酯型(isocyanurate)改質物;與三羥甲基丙烷(TMP)、甘油等三價以上的多元醇(在一分子中具有至少3個以上OH基的化合物)的加成物(多元醇改質物)等。 Examples of the trifunctional or higher isocyanate compound include biuret-type modifiers, isocyanurate-type modifiers of diisocyanates (compounds having two NCO groups in one molecule), and trimethylol groups. Adducts (polyol modifiers) of trivalent or higher polyhydric alcohols (compounds having at least 3 or more OH groups in one molecule) such as propane (TMP), glycerol, and the like.
交聯劑的添加量考慮(甲基)丙烯酸類聚合物的種類、聚合度、官能團量等來確定即可,雖然沒有特別限定,相對於(甲基)丙烯酸類聚合物100重量份,通常使交聯劑為0.5~10重量份左右。 The addition amount of the cross-linking agent may be determined in consideration of the type, degree of polymerization, functional group amount, and the like of the (meth) acrylic polymer. Although it is not particularly limited, it is usually made based on 100 parts by weight of the (meth) acrylic polymer The crosslinking agent is about 0.5 to 10 parts by weight.
另外,本發明所涉及的透明導電性膜用表面保護膜在以捲筒狀進行熟化的期間,需要在剝離膜變形之前使黏合劑層進行固化,因此,為了促進(甲基)丙烯酸類聚合物與交聯劑的交聯反應,添加交聯觸媒較佳。交聯觸媒只要是對(甲基)丙烯酸類聚合物與異氰酸酯系交聯劑的反應(交聯反應)起觸媒作用的物質即可,可以舉出三級胺等胺類化合物、有機錫化合 物、有機鉛化合物、有機鋅化合物、有機鐵化合物等的有機金屬化合物等。 In addition, the surface protective film for a transparent conductive film according to the present invention needs to cure the adhesive layer before the peeling film is deformed during curing in a roll shape. Therefore, in order to promote the (meth) acrylic polymer, For a crosslinking reaction with a crosslinking agent, it is preferable to add a crosslinking catalyst. The cross-linking catalyst may be any substance that acts as a catalyst for the reaction (cross-linking reaction) between the (meth) acrylic polymer and the isocyanate-based cross-linking agent. Examples include amine compounds such as tertiary amines, and organotin. Compound Compounds, organic lead compounds, organic zinc compounds, organic iron compounds and the like.
作為三級胺,可以舉出三烷基胺、N,N,N’,N’-四烷基二胺、N,N-二烷基氨基醇、三伸乙二胺、嗎福啉衍生物、哌嗪衍生物等。 Examples of the tertiary amine include trialkylamine, N, N, N ', N'-tetraalkyldiamine, N, N-dialkylamino alcohol, triethylenediamine, and morpholine derivatives , Piperazine derivatives and the like.
作為有機錫化合物,可以舉例如二烷基氧化錫、二烷基錫的脂肪酸鹽、亞錫的脂肪酸鹽等。 Examples of the organotin compound include dialkyltin oxide, fatty acid salts of dialkyltin, and fatty acid salts of stannous acid.
交聯觸媒的添加量考慮(甲基)丙烯酸類聚合物的種類、聚合度、官能基量、交聯觸媒的種類、添加量等來確定即可,雖然沒有特別限定,相對於丙烯酸類聚合物100重量份,通常為0.01~0.5重量份左右。 The addition amount of the cross-linking catalyst may be determined in consideration of the type of the (meth) acrylic polymer, the degree of polymerization, the amount of functional groups, the type of the cross-linking catalyst, and the amount of the cross-linking catalyst. Although not particularly limited, it is relative to acrylic 100 parts by weight of the polymer is usually about 0.01 to 0.5 parts by weight.
另外,為了抑制交聯劑配製後的黏合劑組合物的過度的黏度上升、凝膠化、延長黏合劑組合物的適用期,可以根據需要含有交聯延遲劑。 In addition, in order to suppress excessive viscosity increase, gelation, and prolong the pot life of the adhesive composition after the preparation of the crosslinking agent, a crosslinking delaying agent may be contained as necessary.
作為交聯延遲劑,可以舉出乙醯乙酸甲酯、乙醯乙酸乙酯、乙醯乙酸辛酯、乙醯乙酸油酯、乙醯乙酸月桂酯、乙醯乙酸硬脂酯等β-酮酸酯、乙醯丙酮、2,4-己二酮、苯甲醯丙酮等β-二酮。特別為選自由乙醯丙酮、乙醯乙酸乙酯組成的化合物組中的至少一種以上較佳。這些交聯延遲劑為酮-烯醇互變異構化合物,在以多異氰酸酯化合物作為交聯劑的黏合劑組合物中,通過封閉交聯劑所具有的異氰酸酯基,能夠抑制交聯劑配製後的黏合劑組合物的過度的黏度上升、凝膠化,能夠延長黏合劑組合物的適用期。 Examples of the crosslinking delaying agent include β-keto acids such as methyl ethyl acetate, ethyl ethyl acetate, octyl ethyl acetate, oleyl ethyl acetate, lauryl ethyl acetate, and stearyl ethyl acetate. Β-diketones such as esters, acetoacetone, 2,4-hexanedione, and benzophenone acetone. Particularly, at least one or more members selected from the group consisting of acetoacetone and acetoacetate are preferred. These crosslinking delaying agents are keto-enol tautomeric compounds. In a binder composition using a polyisocyanate compound as a crosslinking agent, by blocking the isocyanate group of the crosslinking agent, the cross-linking agent can be inhibited from being formulated. Excessive viscosity increase and gelation of the adhesive composition can extend the pot life of the adhesive composition.
交聯延遲劑的添加量雖然沒有特別限定,相對於(甲基)丙 烯酸類聚合物100重量份,通常添加1.0~5.0重量份左右。 Although the amount of the crosslinking delaying agent is not particularly limited, it is relative to (meth) acrylic acid. 100 parts by weight of the enoic acid polymer is usually added at about 1.0 to 5.0 parts by weight.
另外,可以根據需要在黏合劑中添加賦黏劑。作為賦黏劑,可以舉出松香類、苯井呋喃-茚類、萜烯類、石油類、酚類等。 In addition, a tackifier may be added to the adhesive as needed. Examples of the tackifier include rosin, benzofuran-indene, terpene, petroleum, and phenol.
另外,在本發明所涉及的透明導電性膜用表面保護膜的黏合劑層2中,可以依照需要混合抗靜電劑。作為抗靜電劑,較佳的為在(甲基)丙烯酸類聚合物中的分散性或與(甲基)丙烯酸類聚合物相容性良好的抗靜電劑。作為可使用的抗靜電劑,可以舉出表面活性劑類、離子液體、鹼金屬鹽、金屬氧化物、金屬微粒、導電性聚合物、碳、奈米碳管等。從透明性、與(甲基)丙烯酸類聚合物的親和性等角度出發,表面活性劑類、離子液體、鹼金屬鹽等較佳。抗靜電劑相對於黏合劑的添加量可以考慮抗靜電劑的種類、與基礎聚合物的相容性來適當確定。另外,考慮將本發明所涉及的透明導電性膜用表面保護膜從透明導電性膜剝離時的所需要的剝離靜電壓、被黏物的污染性、黏合力等來具體設定抗靜電劑的種類、添加量。 An antistatic agent may be mixed in the adhesive layer 2 of the surface protective film for a transparent conductive film according to the present invention as necessary. The antistatic agent is preferably an antistatic agent having good dispersibility in a (meth) acrylic polymer or compatibility with a (meth) acrylic polymer. Examples of the antistatic agent that can be used include surfactants, ionic liquids, alkali metal salts, metal oxides, metal particles, conductive polymers, carbon, and carbon nanotubes. From the viewpoints of transparency and affinity with a (meth) acrylic polymer, surfactants, ionic liquids, alkali metal salts, and the like are preferred. The amount of the antistatic agent added to the binder can be appropriately determined in consideration of the type of the antistatic agent and the compatibility with the base polymer. In addition, the type of the antistatic agent is specifically set in consideration of the peeling static voltage required for peeling the surface protective film for a transparent conductive film according to the present invention from the transparent conductive film, the contamination property of the adherend, and the adhesive force. Adding amount.
另外,本發明所涉及的透明導電性膜用表面保護膜的黏合劑層2的厚度雖然沒有特別限定,但例如為5~50μm左右的厚度較佳,進一步為5~30μm左右的厚度較佳。黏合劑層2的厚度超過50μm時,製造透明導電性膜用表面保護膜的成本增大,因此損害競爭力。黏合劑層2的厚度小於5μm時,存在如下問題:對透明導電性膜的密合性降低,或者,在將表面保護膜貼合到透明導電性膜上時混入有異物的情況下,透明導電性膜大幅變形。 The thickness of the adhesive layer 2 of the surface protective film for a transparent conductive film according to the present invention is not particularly limited, but is preferably about 5 to 50 μm, and more preferably about 5 to 30 μm. When the thickness of the adhesive layer 2 exceeds 50 μm, the cost of manufacturing a surface protective film for a transparent conductive film increases, and thus competitiveness is impaired. When the thickness of the adhesive layer 2 is less than 5 μm, there are problems in that the adhesiveness to the transparent conductive film is reduced, or when a foreign matter is mixed when the surface protective film is bonded to the transparent conductive film, the conductive is transparent. The sexual film is greatly deformed.
另外,本發明所涉及的透明導電性膜用表面保護膜的黏合劑層2較佳為對被黏物表面的剝離強度為0.05~0.5N/25mm左右的、具有輕度黏合性的微黏合劑層。通過製成具有這樣的微黏合劑層的透明導電性膜用表面保護膜,能夠得到容易從被黏物剝離的優異的操作性。 In addition, the adhesive layer 2 of the surface-protective film for a transparent conductive film according to the present invention is preferably a micro-adhesive having a slight adhesiveness with a peeling strength of about 0.05 to 0.5 N / 25 mm on the surface of the adherend. Floor. By forming a surface protective film for a transparent conductive film having such a micro-adhesive layer, it is possible to obtain excellent operability which is easy to peel from an adherend.
另外,本發明所涉及的透明導電性膜用表面保護膜的剝離膜3的材質沒有特別限定。作為可使用的剝離膜的材質,可以舉例如聚乙烯膜、聚丙烯膜、聚甲基戊烯膜等聚烯烴膜、在聚酯膜等膜的表面上使用聚矽氧烷系剝離劑等剝離劑實施了剝離處理的剝離膜、氟樹脂膜、聚醯亞胺膜等。另外,也可以為將複數膜使用黏合劑疊層而成的膜、在膜上熔融擠出樹脂並疊層而成的疊層膜。在這些單層膜或疊層膜上使用聚矽氧烷系剝離劑等剝離劑實施剝離處理,得到剝離膜。 The material of the release film 3 of the surface protective film for a transparent conductive film according to the present invention is not particularly limited. Examples of the material of the release film that can be used include polyolefin films such as polyethylene films, polypropylene films, and polymethylpentene films, and the use of polysiloxane-based release agents on the surface of films such as polyester films. A release film, a fluororesin film, a polyimide film, or the like subjected to a release treatment. In addition, it may be a film in which a plurality of films are laminated using an adhesive, or a laminated film in which a resin is melt-extruded on the film and laminated. These single-layer films or laminated films are subjected to a release treatment using a release agent such as a polysiloxane-based release agent to obtain a release film.
另外,本發明所涉及的透明導電性膜用表面保護膜的剝離膜3的厚度沒有特別限制,選擇易於使用的厚度的剝離膜即可。通常多為19μm~75μm左右的剝離膜。 The thickness of the release film 3 of the surface protective film for a transparent conductive film according to the present invention is not particularly limited, and a release film having a thickness that is easy to use may be selected. Usually, it is a release film of about 19 to 75 μm.
剝離膜3較厚時,在捲成捲筒狀的相同捲徑的滾筒中,透明導電性膜用表面保護膜的全長縮短、製造成本增加,因此,引導剝離膜3在適當的厚度。另外,剝離膜3較佳的為對單層聚酯膜進行剝離處理而得到的剝離膜、對使用黏合劑將聚酯膜多層疊層成的膜實施剝離處理而得到的剝離膜。 When the release film 3 is thick, the length of the surface protective film for a transparent conductive film is shortened in a roll having the same roll diameter as a roll, and the manufacturing cost is increased. Therefore, the release film 3 is guided to an appropriate thickness. The release film 3 is preferably a release film obtained by performing a release treatment on a single-layer polyester film, and a release film obtained by performing a release treatment on a film in which a polyester film is laminated in multiple layers using an adhesive.
另外,在基材膜1上依次疊層黏合劑層2和剝離膜3的方法通過公知的方法進行即可,沒有特別限定。具體地說,可以為在基材膜1上塗佈黏合劑層2並乾燥後貼合剝離膜3的方 法、在剝離膜3上塗佈黏合劑層2並乾燥後貼合基材膜1的方法等中的任意一種方法。 The method of sequentially laminating the adhesive layer 2 and the release film 3 on the base film 1 may be performed by a known method, and is not particularly limited. Specifically, it may be a method in which the adhesive layer 2 is coated on the base film 1 and the release film 3 is bonded after drying. Either a method, a method of applying the adhesive layer 2 on the release film 3, and a method of attaching the base film 1 after drying, and the like.
另外,在基材膜1上形成黏合劑層可以通過公知的方法進行。具體地說,可以採用逆向塗佈法、刮刀塗佈(comma coat)法、凹版印刷法、縫模塗佈法、梅爾棒塗佈(Mayer bar coat)法、氣刀塗佈法等公知的塗佈方法。 The formation of the adhesive layer on the base film 1 can be performed by a known method. Specifically, known methods such as a reverse coating method, a comma coat method, a gravure printing method, a slot die coating method, a Mayer bar coat method, and an air knife coating method can be used. Coating method.
另外,對剝離膜3實施剝離處理的方法通過公知的方法進行即可。具體地說,通過凹版印刷法、梅爾棒塗佈法、氣刀塗佈法等塗佈方法在剝離膜3的單面上塗佈剝離劑並通過加熱或紫外線照射等對剝離劑進行乾燥、固化即可。也可以根據需要對要進行剝離處理的膜預先進行電暈處理、電漿處理、錨固塗佈等使剝離劑對膜的密合性提高的預處理。 A method of applying a peeling treatment to the release film 3 may be performed by a known method. Specifically, a release agent is applied to one surface of the release film 3 by a coating method such as a gravure printing method, a Mel bar coating method, or an air knife coating method, and the release agent is dried by heating, ultraviolet irradiation, or the like, Just solidify. If necessary, the film to be subjected to the peeling treatment may be previously subjected to pretreatment such as corona treatment, plasma treatment, anchor coating or the like to improve the adhesiveness of the release agent to the film.
另外,第2圖為表示將本發明的透明導電性膜用表面保護膜貼合到透明導電性膜上而成的疊層膜11的一例的示意性構成圖。 In addition, FIG. 2 is a schematic configuration diagram showing an example of a laminated film 11 obtained by bonding the surface protective film for a transparent conductive film of the present invention to a transparent conductive film.
此疊層膜11為將黏合膜4利用其黏合劑層2貼合到透明導電性膜10的表面而成的疊層膜,該黏合膜4是從本發明的透明導電性膜用表面保護膜5上剝下剝離膜3而得到的。透明導電性膜10在樹脂膜6的一個面6a上形成有透明導電膜7。黏合膜4貼合在樹脂膜6的另一個面6b上。 This laminated film 11 is a laminated film in which an adhesive film 4 is adhered to the surface of a transparent conductive film 10 with its adhesive layer 2. The adhesive film 4 is a surface protective film for a transparent conductive film of the present invention. 5 is obtained by peeling the release film 3 from above. The transparent conductive film 10 has a transparent conductive film 7 formed on one surface 6 a of the resin film 6. The adhesive film 4 is bonded to the other surface 6 b of the resin film 6.
作為透明導電性膜10,可以舉例如形成有ITO、AZO或GZO等的透明導電膜的聚對苯二甲酸乙二酯(PET)膜、形成有ITO、AZO或GZO等的透明導電膜的環狀聚烯烴膜等。這樣的透明導電性膜在觸控面板、電子紙、電磁波遮蔽材料、各種感測器、 液晶面板、有機EL、太陽能電池等技術領域中廣泛用於透明電極等形成用途。 Examples of the transparent conductive film 10 include a polyethylene terephthalate (PET) film formed with a transparent conductive film such as ITO, AZO, or GZO, and a ring formed with a transparent conductive film such as ITO, AZO, or GZO. Like polyolefin film. Such transparent conductive films are used in touch panels, electronic paper, electromagnetic wave shielding materials, various sensors, In the technical fields such as liquid crystal panels, organic ELs, and solar cells, they are widely used for forming applications such as transparent electrodes.
本發明的透明導電性膜用表面保護膜發揮如下的優異效果:在觸控面板等的透明電極的製造製程中,能夠大幅改善作業性、生產效率,即使是薄型化的透明導電性膜,也不會使作業性、處理性降低。 The surface protective film for a transparent conductive film of the present invention exhibits the following excellent effects: In the manufacturing process of a transparent electrode such as a touch panel, workability and production efficiency can be greatly improved, and even a thin transparent conductive film can be used. Does not reduce workability and handling.
另外,第3圖為表示本發明的透明導電性膜用表面保護膜的製造方法的一例的示意圖。 Moreover, FIG. 3 is a schematic diagram which shows an example of the manufacturing method of the surface protection film for transparent conductive films of this invention.
從進行了剝離處理的剝離膜3捲繞而成的滾筒21和基材膜1捲繞而成的滾筒22上分別不斷放出剝離膜3和基材膜1。在基材膜1的一個面上,利用黏合劑塗佈裝置23塗佈黏合劑。將塗佈有黏合劑的基材膜1在乾燥爐24中乾燥,形成黏合膜4。使黏合膜4的形成有黏合劑層的面與剝離膜3的進行了剝離處理的面相對,使用壓力滾輪25、26進行壓接,得到透明導電性膜用表面保護膜5。將透明導電性膜用表面保護膜5捲起為滾筒27。通常,透明導電性膜用表面保護膜5的保存、運輸以滾筒27的狀態進行。在貼合到透明導電性膜10上時,透明導電性膜用表面保護膜5從滾筒27上反繞。 The release film 3 and the base film 1 are continuously discharged from the drum 21 where the release film 3 subjected to the peeling treatment is wound, and the drum 22 where the base film 1 is wound, respectively. An adhesive is applied to one surface of the base film 1 by an adhesive application device 23. The adhesive-coated substrate film 1 is dried in a drying furnace 24 to form an adhesive film 4. The surface of the pressure-sensitive adhesive film 4 on which the adhesive layer was formed was opposed to the surface of the release film 3 subjected to the peeling treatment, and pressure bonding was performed using pressure rollers 25 and 26 to obtain a surface protective film 5 for a transparent conductive film. The surface protective film 5 for a transparent conductive film is rolled up into a drum 27. Normally, the surface protective film 5 for a transparent conductive film is stored and transported in a state of a drum 27. When bonded to the transparent conductive film 10, the surface protective film 5 for a transparent conductive film is wound back from the drum 27.
以下,基於實施例進一步對本發明進行說明。 Hereinafter, the present invention will be further described based on examples.
(實施例1的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film of Example 1)
在厚度為25μm的雙軸延伸後的聚酯膜的單面上,通過梅爾棒法塗佈塗料,使乾燥後的聚矽氧烷膜的厚度為0.1μm,該塗料是將加成反應型聚矽氧烷(Toray Dow Corning製造,品名: SRX-211 100重量份中添加有鉑觸媒SRX-212 1重量份)用甲苯/乙酸乙酯1:1混合溶劑稀釋而得到的。進而,在溫度120℃的熱風循環式烘箱中進行1分鐘的乾燥、固化,得到實施例1的剝離膜。 On one side of the biaxially stretched polyester film having a thickness of 25 μm, a coating was applied by the Mel bar method so that the thickness of the dried polysiloxane film was 0.1 μm. The coating is an addition reaction type Polysiloxane (manufactured by Toray Dow Corning, product name: 100 parts by weight of SRX-211 was added with platinum catalyst SRX-212 (1 part by weight) and diluted with a toluene / ethyl acetate 1: 1 mixed solvent. Furthermore, it dried and solidified in the hot-air circulation type oven of 120 degreeC for 1 minute, and obtained the peeling film of Example 1.
另外,黏合劑層使用黏合劑組合物來形成,該黏合劑組合物為在丙烯酸-2-乙基己酯與丙烯酸-2-羥乙酯共聚合而成的固體含量為40%的丙烯酸類聚合物100重量份中添加HDI類交聯劑(日本聚氨酯工業公司製造,品名:CORONATE HX)4重量份、作為交聯觸媒的二月桂酸二丁基錫0.03重量份並混合而得到的黏合劑組合物。在厚度為125μm的聚對苯二甲酸乙二酯膜上塗佈上述黏合劑組合物,使乾燥後的黏合劑層的厚度為20μm,在溫度為130℃的熱風循環式烘箱中使黏合劑乾燥1分鐘。然後,將上述製作的實施例1的剝離膜的聚矽氧烷(silicone)處理面貼合疊層到黏合劑層的表面上,得到實施例1的透明導電性膜用表面保護膜。此樣品的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為92%。 In addition, the adhesive layer is formed using an adhesive composition, which is an acrylic polymer having a solid content of 40%, which is copolymerized with 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate. Adhesive composition obtained by adding 4 parts by weight of HDI-based cross-linking agent (manufactured by Japan Polyurethane Industry Co., Ltd., CORONATE HX) and 0.03 parts by weight of dibutyltin dilaurate as a cross-linking catalyst to 100 parts by weight of the product. . The adhesive composition was coated on a polyethylene terephthalate film having a thickness of 125 μm so that the thickness of the dried adhesive layer was 20 μm. The adhesive was dried in a hot air circulation oven at a temperature of 130 ° C. 1 minute. Then, the silicone- treated surface of the release film of Example 1 produced as described above was laminated on the surface of the adhesive layer to obtain a surface protective film for the transparent conductive film of Example 1. The reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer of this sample was 92%.
(實施例2的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film of Example 2)
除了使交聯劑的添加量相對於丙烯酸類聚合物100重量份為6重量份以外,以與實施例1同樣的方式,得到實施例2的透明導電性膜用表面保護膜。此樣品的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為82% A surface protective film for a transparent conductive film of Example 2 was obtained in the same manner as in Example 1 except that the amount of the crosslinking agent added was 6 parts by weight based on 100 parts by weight of the acrylic polymer. The reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer of this sample was 82%
(實施例3的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film in Example 3)
除了使黏合劑層的厚度為40μm以外,以與實施例1同樣的方式,得到實施例3的透明導電性膜用表面保護膜。此樣品的 黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為82%。 A surface protective film for a transparent conductive film of Example 3 was obtained in the same manner as in Example 1 except that the thickness of the adhesive layer was 40 μm. Of this sample The reaction rate K of the adhesive layer 15 minutes after the start of drying of the adhesive layer was 82%.
(實施例4的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film in Example 4)
除了使黏合劑層的乾燥溫度為120℃以外,以與實施例1同樣的方式,得到實施例4的透明導電性膜用表面保護膜。此樣品的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為77%。 A surface protective film for a transparent conductive film of Example 4 was obtained in the same manner as in Example 1 except that the drying temperature of the adhesive layer was 120 ° C. The reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer of this sample was 77%.
(比較例1的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film of Comparative Example 1)
除了使黏合劑層的乾燥溫度為100℃以外,以與實施例1同樣的方式,得到比較例1的透明導電性膜用表面保護膜。此樣品的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為56%。 A surface protective film for a transparent conductive film of Comparative Example 1 was obtained in the same manner as in Example 1 except that the drying temperature of the adhesive layer was set to 100 ° C. The reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer of this sample was 56%.
(比較例2的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film of Comparative Example 2)
除了使用在丙烯酸-2-乙基己酯、丙烯酸丁酯與丙烯酸-2-羥乙酯共聚而成的固體含量為40%的丙烯酸類聚合物100重量份中添加HDI類交聯劑(日本聚氨酯工業公司製造,品名:CORONATE HX)1重量份、作為交聯觸媒的二月桂酸二丁基錫0.03重量份並混合而得到的黏合劑組合物作為黏合劑組合物以外,以與實施例1同樣的方式,得到比較例2的透明導電性膜用表面保護膜。此樣品的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為90%。 In addition to the addition of HDI-based cross-linking agents (Japanese polyurethane (Product name: CORONATE HX) manufactured by Kogyo Co., Ltd. 1 part by weight and 0.03 parts by weight of dibutyltin dilaurate as a cross-linking catalyst were mixed and the adhesive composition was the same as Example 1 except that the adhesive composition was used as the adhesive composition Method to obtain a surface protective film for a transparent conductive film of Comparative Example 2. The reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer of this sample was 90%.
(比較例3的透明導電性膜用表面保護膜的製作) (Production of a surface protective film for a transparent conductive film of Comparative Example 3)
使交聯劑的添加量相對於丙烯酸類聚合物100重量份為2重量份以外,以與比較例2同樣的方式,得到比較例3的透明導電性膜用表面保護膜。此樣品的黏合劑層的乾燥開始15分鐘後 的黏合劑層的反應率K為74%。 A surface protective film for a transparent conductive film of Comparative Example 3 was obtained in the same manner as in Comparative Example 2 except that the amount of the crosslinking agent added was 2 parts by weight based on 100 parts by weight of the acrylic polymer. 15 minutes after the drying of the adhesive layer of this sample started The reaction rate K of the adhesive layer was 74%.
以下,示出評價試驗的方法和試驗結果。此處,使用“硬塗佈處理PET膜”作為透明導電性薄膜用基材(膜)的一例。 The evaluation method and test results are shown below. Here, as an example of a base material (film) for a transparent conductive film, a “hard-coated PET film” is used.
(反應率K的測定) (Measurement of reaction rate K)
在膜上塗佈黏合劑,在熱風循環式烘箱中將黏合劑中的溶劑乾燥後,在黏合劑層的表面上貼合剝離膜。將此樣品在23℃、50%RH環境下放置15分鐘後,將剝離膜剝離,透過傅立葉轉換紅外吸光光度法測定黏合劑層表面的紅外吸收光譜。測定歸屬於交聯劑的異氰酸酯(-N=C=O)的2270cm-1的峰強度與歸屬於黏合劑的(甲基)丙烯酸酯的C=O的1730cm-1的峰強度,計算出2270cm-1/1730cm-1的峰強度比,將其作為樣品的峰強度比(a)。 An adhesive is applied to the film, and the solvent in the adhesive is dried in a hot-air circulation type oven, and then a release film is attached to the surface of the adhesive layer. After this sample was left for 15 minutes at 23 ° C and 50% RH, the release film was peeled off, and the infrared absorption spectrum of the surface of the adhesive layer was measured by Fourier transform infrared absorption spectrometry. Determination attributable to the isocyanate crosslinking agent (-N = C = O) 2270cm -1 to a peak intensity attributed to the binder (meth) acrylate C = O peak intensity of 1730cm -1, 2270 cm calculated The peak intensity ratio of -1 / 1730 cm -1 was taken as the peak intensity ratio (a) of the sample.
以同樣的方式,未固化時的峰強度比如下求出:不在黏合劑中添加交聯觸媒,在80℃的熱風循環式烘箱中乾燥後,快速地(例如在1分鐘以內)測定樣品的黏合劑層的2270cm-1/1730cm-1的峰強度,將其作為未固化時的峰強度比(b)。透過下式求出反應率K。 In the same way, the peak intensity when uncured is obtained as follows: without adding a cross-linking catalyst to the adhesive, dried in a hot air circulation oven at 80 ° C, and quickly (for example, within 1 minute) of the sample peak intensity adhesive layer 2270cm -1 / 1730cm -1, and the peak intensity as uncured ratio (b). The reaction rate K was determined by the following formula.
反應率K(%)=(1-a/b)×100 Reaction rate K (%) = (1-a / b) × 100
(此處,a為樣品的黏合劑層的利用傅利葉變換紅外吸光光度法得到的2270cm-1/1730cm-1的峰強度比,b為未固化時的黏合劑層的透過傅立葉轉換紅外吸光光度法得到的2270cm-1/1730cm-1的峰強度比) (Here, a is the peak intensity ratio of 2270cm -1 / 1730cm -1 obtained by Fourier transform infrared absorption photometry of the adhesive layer of the sample, and b is the Fourier transform infrared absorption photometry of the adhesive layer when it is not cured. (The obtained peak intensity ratio of 2270cm -1 / 1730cm -1 )
(儲存模數的測定) (Measurement of storage modulus)
將實施例、比較例中得到的樣品在40℃的烘箱中熟化5天後,使用黏彈性測定裝置(ABM公司製造,動態黏彈性測定裝置Reogel-E4000)測定黏合劑層在30℃下的儲存模數。 After the samples obtained in the examples and comparative examples were aged in an oven at 40 ° C for 5 days, the storage of the adhesive layer at 30 ° C was measured using a viscoelasticity measuring device (manufactured by ABM Co., dynamic viscoelasticity measuring device Reogel-E4000). Modulus.
(透明導電性膜用表面保護膜的初始黏合力的測定) (Measurement of initial adhesion of surface protective film for transparent conductive film)
使用在厚度為50μm的雙軸延伸後的聚酯膜的單面上實施了硬塗佈處理的、也用於ITO膜的硬塗佈處理後的PET膜(KIMOTO公司製造,品名:KB膜#50G01)。將裁切為25mm寬的透明導電性膜用表面保護膜貼合到PET膜的實施了硬塗佈處理的表面上後,在23℃、50%RH的環境下保存1小時,製成初始黏合力的測定樣品。然後,使用拉伸試驗機,測定以300mm/分鐘的剝離速度沿180°的方向剝離透明導電性膜用表面保護膜時的強度,將其作為初始黏合力(N/25mm)。 A PET film (manufactured by KIMOTO Corporation, product name: KB film #) that has been hard-coated on one side of a biaxially stretched polyester film with a thickness of 50 μm and also used for ITO film is used. 50G01). A transparent protective film cut to a width of 25 mm was bonded to the surface of the hard-coated surface of the PET film with a surface protective film, and then stored in an environment of 23 ° C and 50% RH for 1 hour to make an initial adhesion. Force measurement sample. Then, using a tensile tester, the strength when the surface protective film for a transparent conductive film was peeled in a direction of 180 ° at a peeling speed of 300 mm / minute was measured, and this was used as the initial adhesive force (N / 25 mm).
測定裝置使用島津製作所公司製造的型號為EZ-L的小型桌上型試驗裝置。 As the measurement device, a small-sized desktop test device of the type EZ-L manufactured by Shimadzu Corporation was used.
<透明導電性膜用表面保護膜的加熱後黏合力的測定> <Measurement of Adhesion After Heating of Surface Protective Film for Transparent Conductive Film>
將裁切為25mm寬的透明導電性膜用表面保護膜貼合到PET膜的實施了硬塗佈處理的表面上後,在150℃環境下保存1小時,作為加熱後黏合力的測定樣品,除此以外,與初始黏合力的測定同樣地測定,將其作為加熱後黏合力(N/25mm)。 A transparent protective film cut to a width of 25 mm was bonded to a hard-coated surface of a PET film with a surface protective film, and then stored at 150 ° C for 1 hour as a sample for measuring adhesion after heating. Other than that, it measured similarly to the measurement of the initial adhesive force, and this was made into the adhesive force (N / 25mm) after heating.
測定裝置使用島津製作所公司製造的型號為EZ-L的小型桌上型試驗裝置。 As the measurement device, a small-sized desktop test device of the type EZ-L manufactured by Shimadzu Corporation was used.
(在硬塗佈處理PET膜上貼合透明導電性膜用表面 保護膜時的處理性的確認方法) (Laminating a transparent conductive film surface to a hard-coated PET film How to check the handleability at the time of protective film)
使用對透明導電性膜用表面保護膜進行了外觀檢查的樣品作為下述的透明導電性膜用表面保護膜。在硬塗佈處理後的PET膜(KIMOTO公司製造,品名:KB膜#50G01)的硬塗佈處理面上貼合透明導電性膜用表面保護膜,然後將疊層品切割為A4尺寸。拿住切割得到的樣品的4個角中的1個角,以膜面在空中扇動的方式前後往返振動20次。然後,通過目測確認硬塗佈處理PET膜有無彎折、變形。將硬塗佈處理PET膜上沒有彎折、變形的樣品評價為(○),將存在彎折或變形的樣品評價為(×)。 As a surface protective film for a transparent conductive film described below, a sample having a visual inspection of the surface protective film for a transparent conductive film was used. A surface protective film for a transparent conductive film was bonded to a hard-coated surface of a hard-coated PET film (manufactured by KIMOTO Co., Ltd .: KB film # 50G01), and the laminated product was cut to A4 size. Hold one of the four corners of the cut sample, and vibrate back and forth 20 times with the film surface fanning in the air. Then, it was visually confirmed that the hard-coated PET film was bent or deformed. A sample without bending or deformation on the hard-coated PET film was evaluated as (○), and a sample having bending or deformation was evaluated as (×).
(透明導電性膜用表面保護膜的外觀檢查的方法) (Method of visual inspection of surface protective film for transparent conductive film)
使用測試塗佈機製作透明導電性膜用表面保護膜的捲筒品(400mm寬×100m/卷),在40℃的烘箱中保溫5天,進行黏合劑的熟化。然後,通過目視對從捲筒品反繞後的透明導電性膜用表面保護膜的距邊緣50m的部位(距兩端大致等距離的位置)的樣品的外觀進行觀察。將黏合劑層的表面平滑的樣品評價為(○),將在黏合劑層的表面產生了弱凹凸的樣品評價為(△),將在黏合劑層的表面產生了強凹凸的樣品評價為(×)。 A rolled product (400 mm width × 100 m / roll) of a surface protective film for a transparent conductive film was produced using a test coater, and was held in an oven at 40 ° C. for 5 days to cure the adhesive. Then, the external appearance of a sample of a part (positions approximately equidistant from both ends) of the transparent protective film surface protective film 50 m away from the roll (a position approximately equidistant from both ends) after being wound from the roll was visually observed. A sample with a smooth surface of the adhesive layer was evaluated as (○), a sample having weak unevenness on the surface of the adhesive layer was evaluated as (△), and a sample having strong unevenness on the surface of the adhesive layer was evaluated as ( ×).
(硬塗佈處理膜的外觀檢查的方法) (Method for visual inspection of hard-coated film)
使用對透明導電性膜用表面保護膜進行了外觀檢查的樣品作為下述的透明導電性膜用表面保護膜。在硬塗佈處理PET膜(KIMOTO公司製造,品名:KB膜#50G01)的硬塗佈處理面上貼合透明導電性膜用表面保護膜,然後,在150℃下進行1小時的加熱處理。將透明導電性膜用表面保護膜剝離後,通過目視觀察硬塗佈處理PET膜的表面狀態。將硬塗佈處理PET膜的外 觀平滑的樣品評價為(○),將產生了凹凸狀弱變形的樣品評價為(△),將產生了凹凸狀強變形的樣品評價為(×)。 As a surface protective film for a transparent conductive film described below, a sample having a visual inspection of the surface protective film for a transparent conductive film was used. A surface protective film for a transparent conductive film was bonded to a hard-coated treatment surface of a hard-coated PET film (manufactured by KIMOTO, product name: KB film # 50G01), and then subjected to heat treatment at 150 ° C. for 1 hour. After peeling the surface protective film for a transparent conductive film, the surface state of the hard-coated PET film was visually observed. The outer surface of the hard-coated PET film Samples with apparent smoothness were evaluated as (○), samples with weak unevenness were evaluated as (Δ), and samples with strong uneven deformation were evaluated as (×).
將針對各個樣品的測定結果示於表1。表1中,「聚合物A」為實施例1中記載的丙烯酸類聚合物,「聚合物B」為比較例2中記載的丙烯酸類聚合物。另外,關於表1中的儲存模數的值,通過在E的前後記載尾數和指數的形式來表示,例如將4.0×105記為4.0E+05。 The measurement results for each sample are shown in Table 1. In Table 1, "Polymer A" is the acrylic polymer described in Example 1, and "Polymer B" is the acrylic polymer described in Comparative Example 2. In addition, the value of the storage modulus in Table 1 is represented by a format in which a mantissa and an index are described before and after E, and 4.0 × 10 5 is described as 4.0E + 05, for example.
由表1所示的測定結果作出如下判斷。 From the measurement results shown in Table 1, the following judgments were made.
實施例1~3中,透明導電性膜用表面保護膜中使用的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為82~92%,在加熱製程的前後黏合力的變化小,且黏合劑層表面的凹凸非常少(小)。使用了此表面保護膜的硬塗佈處理PET膜的外觀良 好。另外,將實施例1~3的透明導電性膜用表面保護膜貼合到硬塗佈處理PET膜上時的處理性也非常良好。 In Examples 1 to 3, the reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer used in the surface protective film for a transparent conductive film was 82 to 92%, and the change in adhesive force before and after the heating process Is small, and the unevenness on the surface of the adhesive layer is very small (small). Good appearance of the hard-coated PET film using this surface protection film it is good. In addition, when the surface protective film for a transparent conductive film of Examples 1 to 3 was bonded to a hard-coated PET film, the handleability was also very good.
關於實施例4,黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為77%,與實施例1~3相比,黏合劑層表面的凹凸稍稍增大。但是,黏合劑層表面的凹凸形狀不會轉印到硬塗佈處理PET膜上,得到了外觀良好的硬塗佈處理PET膜。 Regarding Example 4, the reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer was 77%, and the unevenness of the surface of the adhesive layer slightly increased compared with Examples 1 to 3. However, the uneven shape on the surface of the adhesive layer was not transferred to the hard-coated PET film, and a hard-coated PET film with good appearance was obtained.
另一方面,在比較例1中,透明導電性膜用表面保護膜中使用的黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為低至56%的值。此結果,比較例1的透明導電性膜用表面保護膜在黏合劑層的表面產生了凹凸,在對硬塗佈處理PET膜貼合而成的疊層品進行加熱處理時,黏合劑層的表面的凹凸形狀轉印到硬塗佈處理PET膜上,硬塗佈處理PET膜的外觀下降。 On the other hand, in Comparative Example 1, the reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer used in the surface protective film for a transparent conductive film was as low as 56%. As a result, the surface protective film for the transparent conductive film of Comparative Example 1 had unevenness on the surface of the adhesive layer. When the laminated product obtained by laminating the hard-coated PET film was subjected to heat treatment, The uneven shape of the surface is transferred to the hard-coated PET film, and the appearance of the hard-coated PET film is reduced.
另外,比較例2中,黏合劑層的儲存模數低至小於4.0×105Pa,而黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K顯示出高達90%的值。但是,比較例2的透明導電性膜用表面保護膜在黏合劑層的表面產生了凹凸,在對與硬塗佈處理PET膜貼合而成的疊層品進行加熱處理時,黏合劑層的表面的凹凸形狀轉印到硬塗佈處理PET膜上,硬塗佈處理PET膜的外觀下降。同樣,在比較例3中,黏合劑層的儲存模數低至小於4.0×105Pa,而黏合劑層的乾燥開始15分鐘後的黏合劑層的反應率K為74%。但是,比較例3的透明導電性膜用表面保護膜在黏合劑層的表面產生了凹凸,在對與硬塗佈處理PET膜貼合而成的疊層品進行加熱處理時,黏合劑層的表面的凹凸形狀轉印到 硬塗佈處理PET膜上,硬塗佈處理PET膜的外觀下降。 In addition, in Comparative Example 2, the storage modulus of the adhesive layer was as low as less than 4.0 × 10 5 Pa, and the reaction rate K of the adhesive layer 15 minutes after the start of drying of the adhesive layer showed a value as high as 90%. However, the surface protective film for a transparent conductive film of Comparative Example 2 had irregularities on the surface of the adhesive layer. When a laminated product laminated with a hard-coated PET film was subjected to heat treatment, The uneven shape of the surface is transferred to the hard-coated PET film, and the appearance of the hard-coated PET film is reduced. Similarly, in Comparative Example 3, the storage modulus of the adhesive layer was as low as less than 4.0 × 10 5 Pa, and the reaction rate K of the adhesive layer 15 minutes after the drying of the adhesive layer started was 74%. However, the surface protective film for a transparent conductive film of Comparative Example 3 had irregularities on the surface of the adhesive layer. When a laminated product laminated with a hard-coated PET film was subjected to heat treatment, The uneven shape of the surface is transferred to the hard-coated PET film, and the appearance of the hard-coated PET film is reduced.
本發明的透明導電性膜用表面保護膜在觸控面板用透明電極的製造製程中,即使在貼合到薄型化的透明導電性薄膜上的狀態下經過加熱製程後,產生的捲曲也非常小。由此,能夠大幅改善觸控面板用透明電極的製造製程的操作性、生產效率。另外,本發明的透明導電性膜用表面保護膜能夠作為在觸控面板、電子紙、電磁波遮蔽材料、各種感測器、液晶面板、有機EL、太陽能電池等技術領域中使用的、透明導電性薄膜的製造、加工用表面保護膜廣泛使用。 In the manufacturing process of the transparent electrode for a touch panel, the surface protective film for a transparent conductive film of the present invention has a very small curl even after being subjected to a heating process in a state of being bonded to a thin transparent conductive film. . This can significantly improve the operability and production efficiency of the manufacturing process of the transparent electrode for a touch panel. In addition, the surface protective film for a transparent conductive film of the present invention can be used as a transparent conductive material in the technical fields such as touch panels, electronic paper, electromagnetic wave shielding materials, various sensors, liquid crystal panels, organic EL, and solar cells. Surface protection films for the manufacture and processing of thin films are widely used.
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Publication number | Priority date | Publication date | Assignee | Title |
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Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5978276A (en) * | 1982-10-27 | 1984-05-07 | Yokohama Rubber Co Ltd:The | Fast-curing acrylic adhesive and preparation of same |
JP2970782B2 (en) | 1991-05-21 | 1999-11-02 | 三菱鉛筆株式会社 | Ink composition for ethanolic metallic color |
JPH11268168A (en) | 1998-03-24 | 1999-10-05 | Kanegafuchi Chem Ind Co Ltd | Plastic film with transparent conducting film and protective film |
JP2003170535A (en) | 2001-12-05 | 2003-06-17 | Nitto Denko Corp | Surface protecting film for transparent conducting film |
JP4342775B2 (en) | 2002-07-31 | 2009-10-14 | 日東電工株式会社 | Surface protective film for transparent conductive film, method for producing the same, and transparent conductive film with surface protective film |
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JP5968587B2 (en) * | 2010-10-21 | 2016-08-10 | 日東電工株式会社 | Optical adhesive sheet, optical film and display device |
JP2013079360A (en) * | 2011-09-20 | 2013-05-02 | Nitto Denko Corp | Peelable pressure-sensitive adhesive composition, peelable pressure-sensitive adhesive layer, and peelable pressure-sensitive adhesive sheet |
JP5820762B2 (en) * | 2012-04-24 | 2015-11-24 | 藤森工業株式会社 | Surface protective film for transparent conductive film and transparent conductive film using the same |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102816537A (en) * | 2011-06-10 | 2012-12-12 | 日东电工株式会社 | Carrier material for thin layer base material |
TW201430095A (en) * | 2012-12-10 | 2014-08-01 | Nitto Denko Corp | Dicing tape integrated adhesive sheet, method of manufacturing semiconductor device using dicing tape integrated adhesive sheet, and semiconductor device |
Also Published As
Publication number | Publication date |
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KR20160018347A (en) | 2016-02-17 |
KR101804227B1 (en) | 2017-12-04 |
TWI690583B (en) | 2020-04-11 |
KR101897475B1 (en) | 2018-09-12 |
CN106189892A (en) | 2016-12-07 |
JP2016036982A (en) | 2016-03-22 |
CN106189892B (en) | 2021-03-26 |
TW201610079A (en) | 2016-03-16 |
KR20170136470A (en) | 2017-12-11 |
TW201936834A (en) | 2019-09-16 |
JP6207087B2 (en) | 2017-10-04 |
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