TWI665956B - Casing and cover for electronic device - Google Patents
Casing and cover for electronic device Download PDFInfo
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- TWI665956B TWI665956B TW107117853A TW107117853A TWI665956B TW I665956 B TWI665956 B TW I665956B TW 107117853 A TW107117853 A TW 107117853A TW 107117853 A TW107117853 A TW 107117853A TW I665956 B TWI665956 B TW I665956B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Abstract
本發明提供一外殼,用於一電子裝置。此外殼包含一第一部分與一第二部分。第一部份具有至少一開口。第二部分包含至少一網狀區域。此網狀區域係可變形地連接第一部分,並覆蓋於開口。 The invention provides a casing for an electronic device. The outer shell includes a first portion and a second portion. The first part has at least one opening. The second part contains at least one mesh area. This mesh area is deformably connected to the first part and covers the opening.
Description
本發明係關於一外殼與一遮蓋,尤其是關於用於電子裝置之外殼與遮蓋。 The present invention relates to a casing and a cover, and more particularly to a casing and a cover for an electronic device.
因為電磁屏蔽(EMI)的考量與安全性的問題,一般電子裝置在散熱孔的設計和外殼材質的選擇上,都會受到相當大的限制。舉例來說,主機的機殼通常會使用金屬材質,機殼上也不宜開大孔。因此,電子裝置之外觀設計會受到相當程度的限制。 Because of electromagnetic shielding (EMI) considerations and safety issues, general electronic devices are subject to considerable restrictions on the design of heat dissipation holes and the choice of housing materials. For example, the casing of the mainframe is usually made of metal, and it is also inappropriate to make large holes in the casing. Therefore, the appearance design of the electronic device is restricted to a considerable degree.
本發明提供一用於電子裝置之外殼,除了電磁屏蔽之效果外,此外殼還可因應使用者之需求進行調整,提供多樣化的使用模式 The invention provides a casing for an electronic device. In addition to the effect of electromagnetic shielding, the casing can also be adjusted according to the needs of the user to provide a variety of use modes.
本發明提供一外殼,用於一電子裝置。此外殼包含一第一部分與一第二部分。第一部份具有至少一開口。第二部分包含至少一網狀區域。此網狀區域係可變形地連接第一部分,並覆蓋於開口。 The invention provides a casing for an electronic device. The outer shell includes a first portion and a second portion. The first part has at least one opening. The second part contains at least one mesh area. This mesh area is deformably connected to the first part and covers the opening.
本發明並提供一遮蓋,用於一電子裝置。 此電子裝置具有一殼體,且殼體具有至少一開口。此遮蓋包含一網狀區域,可變形地連接殼體,並覆蓋於開口。 The invention also provides a cover for an electronic device. The electronic device has a casing, and the casing has at least one opening. The cover includes a mesh area that is deformably connected to the shell and covers the opening.
傳統電子裝置之外殼僅具有電磁屏蔽與散熱之功能。相較之下,本發明所提供之外殼具有由透氣網狀結構構成之第二部分,除了可以提供電磁屏蔽之效果外,還可以選擇性地變形以形成開孔提升散熱效果。此網狀結構更可以由透光材料、半透明材料、透水性材料、彈性材料、可折疊材料、導電材料、防水材料或防塵材料等製作,以提供多樣化的使用模式。 The casing of the traditional electronic device only has the functions of electromagnetic shielding and heat dissipation. In contrast, the outer shell provided by the present invention has a second part composed of a breathable mesh structure. In addition to providing the effect of electromagnetic shielding, it can also be selectively deformed to form openings to improve the heat dissipation effect. The mesh structure can be made of light-transmitting materials, translucent materials, water-permeable materials, elastic materials, foldable materials, conductive materials, waterproof materials, or dust-proof materials to provide a variety of usage modes.
本發明所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。 The specific embodiments used in the present invention will be further described by the following embodiments and drawings.
100,200‧‧‧外殼 100,200‧‧‧shell
10‧‧‧電子裝置 10‧‧‧ electronic device
120,220‧‧‧第一部份 120,220‧‧‧Part I
140,240,140a,140b,140c,140d,140e,140f,140g,140h‧‧‧第二部分 140, 240, 140a, 140b, 140c, 140d, 140e, 140f, 140g, 140h
142f‧‧‧電源按鍵 142f‧‧‧Power button
130,230‧‧‧開孔 130,230‧‧‧opening
320‧‧‧主要殼體 320‧‧‧Main housing
340‧‧‧遮蓋 340‧‧‧cover
342‧‧‧進氣區域 342‧‧‧Air intake area
360‧‧‧感測元件 360‧‧‧sensing element
420‧‧‧網狀結構 420‧‧‧ mesh structure
440‧‧‧金屬線 440‧‧‧metal wire
第一A與一B圖係本發明之用於電子裝置之外殼之第一實施例之示意圖。 The first A and B diagrams are schematic diagrams of a first embodiment of a housing for an electronic device according to the present invention.
第二圖係本發明之用於電子裝置之外殼之第二實施例之示意圖。 The second diagram is a schematic diagram of a second embodiment of a casing for an electronic device according to the present invention.
第三A至三D圖係本發明之用於電子裝置之外殼之第三實施例之示意圖。 The third A to D diagrams are schematic diagrams of a third embodiment of a housing for an electronic device according to the present invention.
第四圖係本發明外殼之第二部分之構成材料之第一實施例之示意圖。 The fourth diagram is a schematic diagram of the first embodiment of the material constituting the second part of the casing of the present invention.
第五圖係本發明外殼之第二部分之構成材料之第二實施例之示意圖。 The fifth diagram is a schematic diagram of the second embodiment of the material constituting the second part of the casing of the present invention.
第六圖係本發明外殼之第二部分之構成材料之第三實施 例之示意圖。 The sixth figure is a schematic view of a third embodiment of the material constituting the second part of the casing of the present invention.
第七圖係本發明外殼之第二部分之構成材料之第四實施例之示意圖。 The seventh diagram is a schematic diagram of the fourth embodiment of the material constituting the second part of the casing of the present invention.
第八圖係本發明外殼之第二部分之構成材料之第五實施例之示意圖。 The eighth figure is a schematic view of a fifth embodiment of the material constituting the second part of the casing of the present invention.
第九A與九B圖係本發明外殼之第二部分之構成材料之第六實施例之示意圖。 Figures 9A and 9B are schematic diagrams of the sixth embodiment of the material constituting the second part of the casing of the present invention.
第十圖係本發明外殼之第二部分之構成材料之第七實施例之示意圖。 The tenth figure is a schematic view of a seventh embodiment of the material constituting the second part of the casing of the present invention.
第十一圖係本發明外殼之第二部分之構成材料之第八實施例之示意圖。 The eleventh figure is a schematic view of the eighth embodiment of the material constituting the second part of the casing of the present invention.
下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本發明的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本發明實施例的目的。 The specific embodiments of the present invention will be described in more detail below with reference to the schematic diagrams. The advantages and features of the invention will become clearer from the following description and the scope of the patent application. It should be noted that the drawings are all in a very simplified form and all use inaccurate proportions, which are only used to facilitate and clearly explain the purpose of the embodiments of the present invention.
第一A與一B圖係本發明之用於電子裝置之外殼100之第一實施例之示意圖。此電子裝置可以是桌上型電腦、筆記型電腦、平板電腦、路由器、主機板、顯示卡等。如圖中所示,此外殼100包括一第一部分120與一第二部分140。第一部分120朝向第二部分之一側具有一開口。第二部分140係連接至第一部分120以覆蓋此 開口。第二部分140係一透氣網狀(mesh)遮蓋,供電子裝置散熱之用。此透氣網狀遮蓋係可受壓變形,以選擇性地在第一部分120與第二部分140間形成一開孔130作為進氣孔。 The first A and B diagrams are schematic diagrams of a first embodiment of a housing 100 for an electronic device according to the present invention. The electronic device may be a desktop computer, a notebook computer, a tablet computer, a router, a motherboard, a display card, and the like. As shown in the figure, the casing 100 includes a first portion 120 and a second portion 140. The first portion 120 has an opening toward one side of the second portion. The second portion 140 is connected to the first portion 120 to cover the opening. The second part 140 is a breathable mesh cover for the purpose of dissipating heat from the electronic device. The breathable mesh cover can be deformed under pressure to selectively form an opening 130 as an air inlet hole between the first portion 120 and the second portion 140.
在本實施例中,第二部分140完全由透氣網狀結構構成,不過,本發明並不限於此。依據實際需求,在一實施例中,第二部分係包括至少一透氣網狀區域,供電子裝置散熱之用,而非完全由透氣網狀結構構成。 In this embodiment, the second portion 140 is entirely composed of a breathable mesh structure, but the present invention is not limited thereto. According to actual needs, in an embodiment, the second part includes at least one breathable mesh area, and the power supply device is used for heat dissipation, instead of being entirely composed of a breathable mesh structure.
在一實施例中,第一部分120係可拆卸地連接至第二部分140。不過,本發明並不限於此。此第二部分140亦可以固定於第一部分120。 In one embodiment, the first portion 120 is detachably connected to the second portion 140. However, the present invention is not limited to this. The second portion 140 may also be fixed to the first portion 120.
在一實施例中,如第一A圖所示,在正常運作模式下,例如文書處理或網站瀏覽等使用模式,第二部分120與第一部份140間並未產生開孔130,此時,電子裝置內部之熱量係透過第二部分140向外排除。如第一B圖所示,在需要較佳散熱效果之超頻模式下,可對第二部分140施壓使其向內凹陷變形形成開孔130。此開孔130可作為進氣之用以提升散熱效率,此開孔130係位於第一部分120與第二部分140之間。第二部分140(即網狀遮蓋)之變形程度與形式可視需要進行調整以提供所需之散熱效率。 In an embodiment, as shown in FIG. 1A, in a normal operation mode, such as a word processing or website browsing mode, there is no opening 130 between the second part 120 and the first part 140. At this time, The heat inside the electronic device is removed to the outside through the second part 140. As shown in FIG. 1B, in the overclocking mode that requires better heat dissipation effect, the second portion 140 may be pressed to deform and deform inward to form the opening 130. The opening 130 can be used as an air intake to improve heat dissipation efficiency. The opening 130 is located between the first portion 120 and the second portion 140. The deformation degree and form of the second part 140 (ie, the mesh cover) can be adjusted as needed to provide the required heat dissipation efficiency.
第二圖係本發明之用於電子裝置之外殼200之第二實施例之示意圖。此外殼包括第一部分220與第二部分240。本實施例與第一實施例之主要差異在於, 本實施例之第二部分240之網狀結構設計不同於第一實施例之第二部分140,因此,施壓於本實施例之第二部分240所形成之開孔230形狀也會不同於第一B圖之實施例。 The second figure is a schematic diagram of a second embodiment of a housing 200 for an electronic device according to the present invention. The outer shell includes a first portion 220 and a second portion 240. The main difference between this embodiment and the first embodiment is that the mesh structure design of the second part 240 of this embodiment is different from the second part 140 of the first embodiment, and therefore, pressure is applied to the second part of this embodiment The shape of the opening 230 formed by 240 will also be different from that of the first embodiment in FIG.
第三A至三D圖係本發明之用於電子裝置之外殼之第三實施例之示意圖。其中,第三B圖係對應於第三A圖之俯視示意圖。第三D圖係對應於第三C圖之俯視示意圖。如圖中所示,此外殼包含一第一部份與一第二部分。第一部分係此電子裝置10之主要殼體320,第二部分係一遮蓋340。此遮蓋340係由網狀(mesh)結構構成,並且係套接於電子裝置10之主要殼體320。此遮蓋340具有一進氣區域(air inlet)342,位於其鄰接於電子裝置10之主要殼體320處。此遮蓋340並可以多種連接模式連接至電子裝置10之主要殼體320,以符合使用者之需求。 The third A to D diagrams are schematic diagrams of a third embodiment of a housing for an electronic device according to the present invention. Among them, the third diagram B is a schematic plan view corresponding to the third diagram A. The third diagram D is a schematic plan view corresponding to the third diagram C. As shown in the figure, the casing includes a first part and a second part. The first part is a main casing 320 of the electronic device 10, and the second part is a cover 340. The cover 340 is composed of a mesh structure and is sleeved on the main casing 320 of the electronic device 10. The cover 340 has an air inlet 342 located adjacent to the main housing 320 of the electronic device 10. The cover 340 can be connected to the main casing 320 of the electronic device 10 in various connection modes to meet the needs of users.
在一實施例中,此遮蓋340包括至少一感測元件360。此感測元件360可視需要設置於遮蓋之不同位置。在一實施例中,如第三A與三B圖所示,在正常運作模式下,例如文書處理或網站瀏覽等使用模式,遮蓋340之末端係緊靠於於電子裝置之主要殼體320,遮蓋340上之進氣區域342處於收疊狀態。如第三C與三D圖所示,當遮蓋340向外移動,位於遮蓋340上的進氣區域342展開而容許氣體進入電子裝置內部,同時,感測元件360會被觸發而發送信號至電子裝置10。電子裝置10接收到此信號後,隨即切換至超頻(overclocking)模式。在一實施例中,此信號亦可用以觸發電子裝置10執行不同的散 熱設定或是其他執行設定。 In one embodiment, the cover 340 includes at least one sensing element 360. The sensing element 360 can be disposed at different positions of the cover as needed. In an embodiment, as shown in Figures 3A and 3B, in a normal operation mode, such as a word processing or website browsing mode, the end of the cover 340 abuts against the main housing 320 of the electronic device. The air intake region 342 on the cover 340 is in a collapsed state. As shown in Figures 3C and 3D, when the cover 340 moves outward, the air intake area 342 on the cover 340 expands to allow gas to enter the electronic device. At the same time, the sensing element 360 is triggered to send a signal to the electronic装置 10。 Device 10. After receiving the signal, the electronic device 10 then switches to an overclocking mode. In one embodiment, this signal can also be used to trigger the electronic device 10 to perform different heat dissipation settings or other execution settings.
第四圖係本發明外殼之第二部分之構成材料之第一實施例之示意圖。如圖中所示,構成第二部分140a之網狀區域之材料包括一電磁屏蔽材料,例如金屬材料,以提供電子裝置電磁屏蔽保護。 The fourth diagram is a schematic diagram of the first embodiment of the material constituting the second part of the casing of the present invention. As shown in the figure, the material constituting the meshed area of the second portion 140a includes an electromagnetic shielding material, such as a metal material, to provide electromagnetic shielding protection for electronic devices.
第五圖係本發明外殼之第二部分之構成材料之第二實施例之示意圖。如圖中所示,在一實施例中,構成第二部分140b之網狀區域之材料包括一透光材料(transparent material)或半透明材料(translucent material)。電子裝置可透過此網狀區域呈現資訊。在一實施例中,此第二部分140b之構成材料包括光擴散材料(light diffusion rmaterial)。電子裝置可利用此網狀結構呈現光指標(indicator light)。 The fifth diagram is a schematic diagram of the second embodiment of the material constituting the second part of the casing of the present invention. As shown in the figure, in one embodiment, the material forming the mesh region of the second portion 140b includes a transparent material or a translucent material. Electronic devices can present information through this mesh area. In one embodiment, a material of the second portion 140b includes a light diffusion material. The electronic device can use this mesh structure to display indicator light.
第六圖係本發明外殼之第二部分之構成材料之第三實施例之示意圖。在一實施例中,如圖中所示,構成第二部分140c之網狀區域之材料包括透水性材料(permeable material),例如紡織材料(textile material)。電子裝置可透過此網狀區域傳送或接收音訊。 The sixth diagram is a schematic diagram of the third embodiment of the material constituting the second part of the casing of the present invention. In an embodiment, as shown in the figure, the material constituting the mesh region of the second portion 140c includes a permeable material, such as a textile material. Electronic devices can send or receive audio through this mesh area.
第七圖係本發明外殼之第二部分之構成材料之第四實施例之示意圖。在一實施例中,如圖中所示,構成第二部分140d之網狀區域之材料包括彈性材料(flexible material),例如橡膠材料(rubber material)。此網狀區域可用以放置物品。 The seventh diagram is a schematic diagram of the fourth embodiment of the material constituting the second part of the casing of the present invention. In one embodiment, as shown in the figure, the material constituting the mesh region of the second portion 140d includes a flexible material, such as a rubber material. This mesh area can be used for items.
第八圖係本發明外殼之第二部分之構成材料之第五實施例之示意圖。在一實施例中,如圖中所 示。構成第二部分140e之材料包括可折疊材料。此第二部分140e可透過折疊增加其內部空間。 The eighth figure is a schematic view of a fifth embodiment of the material constituting the second part of the casing of the present invention. In one embodiment, as shown in the figure. The material constituting the second portion 140e includes a foldable material. The second portion 140e can be increased in its interior space by folding.
第九A與九B圖係本發明外殼之第二部分之構成材料之第六實施例之示意圖。在一實施例中,如圖中所示,構成第二部分140f之網狀區域之材料包括導電材料。電子裝置可將部分電子元件整合於網狀區域,如電源按鍵(power key)142f。在一實施例中,如第九B圖所示,可以在紡織材料構成之網狀結構420內加入金屬線440,如接地線,以形成此導電材料。 Figures 9A and 9B are schematic diagrams of the sixth embodiment of the material constituting the second part of the casing of the present invention. In one embodiment, as shown in the figure, the material constituting the mesh region of the second portion 140f includes a conductive material. The electronic device can integrate some electronic components in the mesh area, such as a power key 142f. In an embodiment, as shown in FIG. 9B, a metal wire 440, such as a ground wire, may be added to the mesh structure 420 made of a textile material to form the conductive material.
第十圖係本發明外殼之第二部分之構成材料之第七實施例之示意圖。在一實施例中,如圖中所示,構成第二部分140g之網狀區域之材料包括防水材料(waterproof material),如塑膠材料,以防止水氣進入。第十一圖係本發明外殼之第二部分之構成材料之第八實施例之示意圖。在一實施例中,如圖中所示,構成第二部分140h之網狀區域之材料包括防塵材料(dust-proof material)以防止灰塵進入。 The tenth figure is a schematic view of a seventh embodiment of the material constituting the second part of the casing of the present invention. In an embodiment, as shown in the figure, the material constituting the mesh region of the second portion 140g includes a waterproof material, such as a plastic material, to prevent water vapor from entering. The eleventh figure is a schematic view of the eighth embodiment of the material constituting the second part of the casing of the present invention. In one embodiment, as shown in the figure, the material constituting the mesh region of the second portion 140h includes dust-proof material to prevent dust from entering.
傳統電子裝置之外殼僅具有電磁屏蔽與散熱之功能。相較之下,本發明所提供之外殼具有由透氣網狀結構構成之第二部分,除了可以提供電磁屏蔽之效果外,還可以選擇性地變形以形成開孔提升散熱效果。此網狀結構更可以由透光材料、半透明材料、透水性材料、彈性材料、可折疊材料、導電材料、防水材料或防塵材料等製作,以提供多樣化的使用模式。 The casing of the traditional electronic device only has the functions of electromagnetic shielding and heat dissipation. In contrast, the outer shell provided by the present invention has a second part composed of a breathable mesh structure. In addition to providing the effect of electromagnetic shielding, it can also be selectively deformed to form openings to improve the heat dissipation effect. The mesh structure can be made of light-transmitting materials, translucent materials, water-permeable materials, elastic materials, foldable materials, conductive materials, waterproof materials, or dust-proof materials to provide a variety of usage modes.
上述僅為本發明較佳之實施例而已,並不 對本發明進行任何限制。任何所屬技術領域的技術人員,在不脫離本發明的技術手段的範圍內,對本發明揭露的技術手段和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本發明的技術手段的內容,仍屬於本發明的保護範圍之內。 The above are only preferred embodiments of the present invention, and do not limit the present invention in any way. Any person skilled in the art, without departing from the technical means of the present invention, make any equivalent replacement or modification to the technical means and technical contents disclosed in the present invention without departing from the technical means of the present invention. The content still falls within the protection scope of the present invention.
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TW107117853A TWI665956B (en) | 2017-07-11 | 2018-05-25 | Casing and cover for electronic device |
TW107117850A TW201909722A (en) | 2017-07-11 | 2018-05-25 | Electronic device and cover for electronic device |
TW107118276A TWI684394B (en) | 2017-07-11 | 2018-05-29 | Electronic device and belt-shaped cover therefor |
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TW107117850A TW201909722A (en) | 2017-07-11 | 2018-05-25 | Electronic device and cover for electronic device |
TW107118276A TWI684394B (en) | 2017-07-11 | 2018-05-29 | Electronic device and belt-shaped cover therefor |
TW107119002A TWI679526B (en) | 2017-07-11 | 2018-06-01 | Electronic device |
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Also Published As
Publication number | Publication date |
---|---|
CN109247004B (en) | 2020-12-25 |
CN109240433A (en) | 2019-01-18 |
TW201909722A (en) | 2019-03-01 |
TW201909716A (en) | 2019-03-01 |
CN109247004A (en) | 2019-01-18 |
TWI679526B (en) | 2019-12-11 |
CN109240433B (en) | 2021-09-21 |
TWI684394B (en) | 2020-02-01 |
CN109246964B (en) | 2020-12-29 |
TW201909723A (en) | 2019-03-01 |
CN109246944B (en) | 2020-12-25 |
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CN109246964A (en) | 2019-01-18 |
TW201908915A (en) | 2019-03-01 |
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