TWI665767B - A heatsink device to increase pulling force - Google Patents

Abstract

A heat sink device with increased drawing force is suitable for being adhered to a substrate using an adhesive, and includes a first body unit and a plurality of first drawing units. The first body unit includes a first body. Each first drawing unit includes a first through hole penetrating the first body, a first upper opening provided above the first through hole, and a first lower opening provided below the first through hole. And a first surrounding wall connecting the first upper opening and the first lower opening, the opening area of the first upper opening is larger than the first lower opening, and when the first lower surface of the first body is adhered to the substrate The adhesive can solidify after entering the first through hole from the first lower opening, and form a pulling force with the first surrounding wall, so that the first main body unit cannot easily fall off the substrate.

Description

Radiator device with increased pulling force

The present invention relates to a heat sink device, in particular to a heat sink device having an increased pulling force.

With the rapid progress of the semiconductor manufacturing process, the overall volume of existing semiconductor devices has gradually decreased and their performance has gradually improved. The heat generated during the operation of their semiconductor devices will increase due to the efficiency improvement. In order to avoid the semiconductor devices being burned due to the heat that cannot be ruled out. Bad, metal heat sinks will be pasted on the top of the semiconductor element to improve the heat dissipation effect of the semiconductor element.

Referring to FIG. 1, a conventional heat sink 10 is connected with an adhesive 11 and a substrate 12, and a thermally conductive material 13 is attached to a semiconductor wafer 14 to generate the semiconductor wafer 14 during operation. The heat is conducted to the outside through the heat sink 10 to maintain the temperature of the semiconductor wafer 14 during operation, so as to prevent the semiconductor wafer 14 from being burned due to the high temperature.

In addition, the International Automobile Promotion Group (IATF) and relevant national automobile industry associations (ANFIA, AIAG, CCFA, FIEV, SMMT, and VDA-QMC) established a global unified standard for future quality management system verification in the automotive industry. Established the technical specifications of ISO / TS16949, the purpose of which is to seek a unified supplier quality management system for the global automotive industry. The technical specifications of ISO / TS16949 apply to manufacturers of the entire automotive supply chain. The technical specifications include the scope of specifications for electronic products used in vehicles.

Continuing from the above, ISO / TS16949 technology regulates the use of automobiles because they are used in many environments, including extreme climates such as extreme heat, freezing, dryness and humidity, and extreme climate change. All parts must be of a higher standard than those used in general products to withstand harsh environmental changes, including the technical specifications for the adhesion of heat sinks in electronic parts, resulting in electronics manufactured by general semiconductor heat sink adhesion process technology. The product cannot pass the technical scope of high standard ISO / TS16949.

Therefore, how to improve the adhesion and drawing force between the heat sink and the semiconductor in order to meet the high standard technical specifications, so that the heat sink attached to the electronic product can withstand the harsh environmental changes and the external force and is not easy to pull from the semiconductor. Peeling off the wafer has become an urgent need for related industry players.

In view of this, an object of the present invention is to provide a heat sink device with increased drawing force, which is suitable for being adhered to a substrate using an adhesive, and includes a first main body unit and a plurality of first drawing units. The first body unit includes a first body having a first upper surface and a first lower surface.

The plurality of first drawing units are dispersedly disposed in the first body. Each first drawing unit includes a first through hole penetrating the first body, and a first upper opening provided on the first upper surface. A first lower opening provided on the first lower surface, and a first surrounding wall connecting the first upper opening and the first lower opening, and an opening area of the first upper opening is larger than the first lower opening When the first lower surface of the first body is adhered to the substrate, the adhesive can enter the first through hole through the first lower opening to solidify, and form a pulling force with the first surrounding wall, so that The first main body unit is not easily detached from the substrate.

Another technical means of the present invention is that the peripheral edge of the first surrounding wall is gradually enlarged from the first lower opening to the first upper opening.

Another technical means of the present invention is that each of the first drawing units further includes a rough surface disposed on the first surrounding wall.

Another technical means of the present invention is that the above-mentioned first through hole has a large-aperture portion connected to the first upper opening, a small-aperture portion connected to the first lower opening, and an intervening portion between the large-aperture portion and the Small aperture Shoulders.

Another technical means of the present invention is that the above-mentioned first through-hole further has a pull-proof protrusion extending from the shoulder to the center line of the first through-hole.

Another technical means of the present invention is that the above-mentioned first main body unit further includes a large opening hole disposed in the first main body and penetrating the first upper surface and the first lower surface.

Another technical means of the present invention is that an accommodating groove is formed on the first lower surface of the first body, and the plurality of first drawing units are disposed around the accommodating groove.

Another technical means of the present invention is that the above-mentioned heat sink device with increased pulling force further includes a second body unit, which includes an interval disposed above the first body and having a second upper surface and a second A second body on the lower surface and a connecting layer connecting the second lower surface and the first upper surface, and the outer periphery of the first body and the second body are aligned with each other.

Another technical means of the present invention is that the above-mentioned heat sink device with increased drawing force further includes a plurality of second drawing units, which are dispersedly disposed in the second body, and each second drawing unit includes a A second through hole penetrating through the second body, a second upper opening provided on the second upper surface, a second lower opening provided on the second lower surface, and a connection between the second upper opening and the first The second surrounding wall of the two lower openings has an opening area larger than that of the second lower opening.

Still another technical means of the present invention is that the above-mentioned heat sink device with increased pulling force further includes a third body unit, including a third body spaced above the first body, and a third body from the third body. The peripheral edge of the main body extends toward the substrate and is connected to the first main body. The outer peripheral edge of the third main body is not larger than the large opening.

A beneficial effect of the present invention is that a plurality of first drawing units are provided in a first body having a heat dissipation effect. When the semiconductor heat sink is adhered, the adhesive not only can adhere the first body to the substrate. If they are stuck together, the adhesive will also enter the first through hole through the first lower opening and stick together with the first surrounding wall, which can increase the adhesion between the first body and the substrate. The area of the first upper opening of a first drawing unit is larger than that of the first lower opening, so that the adhesive solidified in the first through hole and the first surrounding wall generate a pulling force with each other, so that the plural number can be provided. The first body of the first drawing unit can be tightly adhered to the substrate without falling easily, and is used to resist the harsh external environment changes and the drawing force.

A‧‧‧Adhesive

B‧‧‧ substrate

3‧‧‧first main unit

31‧‧‧first subject

311‧‧‧first upper surface

312‧‧‧First lower surface

313‧‧‧Receiving slot

32‧‧‧Large open hole

4‧‧‧The first drawing unit

41‧‧‧First through hole

410‧‧‧ Centerline

411‧‧‧Large aperture section

412‧‧‧Small Aperture

413‧‧‧Shoulder

414‧‧‧Anti-pulling convex

42‧‧‧First upper opening

43‧‧‧First lower opening

44‧‧‧ the first surrounding wall

45‧‧‧ rough surface

5‧‧‧Second main unit

51‧‧‧Second Subject

511‧‧‧second upper surface

512‧‧‧Second lower surface

52‧‧‧ Connection Layer

6‧‧‧second drawing unit

61‧‧‧Second through hole

62‧‧‧Second upper opening

63‧‧‧ Second lower opening

64‧‧‧Second Surrounding Wall

7‧‧‧ third main unit

71‧‧‧ third subject

72‧‧‧ connecting section

FIG. 1 is a schematic diagram illustrating a state in which a conventional heat sink is adhered to a substrate; FIG. 2 is a schematic diagram of a device illustrating a first preferred embodiment of the heat sink device having increased drawing force according to the present invention; FIG. 3 is A partial cross-sectional view illustrating a first drawing unit of one of the first preferred embodiments; FIG. 4 is a schematic diagram of a device illustrating a second preferred embodiment of a heat sink device having an increased drawing force according to the present invention; FIG. 5 It is a schematic cross-sectional view illustrating the first drawing unit of the second preferred embodiment; FIG. 6 is a schematic diagram of the device, illustrating a third preferred embodiment of the heat sink device with increased drawing force of the present invention; 7 is a schematic diagram illustrating the implementation of the third preferred embodiment; FIG. 8 is a partial cross-sectional view illustrating a fourth preferred embodiment of the heat sink device having an increased drawing force according to the present invention; FIG. 9 is a A schematic diagram illustrating the implementation of the fourth preferred embodiment; FIG. 10 is a schematic diagram of a device illustrating a fifth preferred embodiment of the heat sink device with increased drawing force according to the present invention; FIG. 11 is a partial cross-sectional view, Describe the fifth preferred implementation Example 1 of the first drawing unit; and FIG. 12 is a schematic diagram illustrating the implementation of the fifth preferred embodiment kind.

The features and technical contents of the related patent applications of the present invention will be clearly presented in the following detailed description of the five preferred embodiments with reference to the drawings.

It should be noted before detailed description that similar elements are represented by the same number. In addition, the semiconductor packaging process mentioned in the description can be used in Flip Chip Package (FC), Plastic Ball Grid Array Package (PBGA), Ball Grid Array (BGA), Sifang Various semiconductor packaging technologies such as Quad Flat Package (QFP), Quad Flat No-lead Package (QFN), and Chip Scale Package (CSP).

Referring to Figs. 2 and 3, a first preferred embodiment of a heat sink device with an increased pullout force according to the present invention is suitable for using an adhesive A to adhere to a substrate B, and the wafer above the substrate B can be used. The generated heat is conducted to the outside, and the tangent line aa in the figure is the section line of the first preferred embodiment. The heat sink device includes a first body unit 3 and a plurality of first drawing units 4. The first main body unit 3 includes a first main body 31 having a first upper surface 311 and a first lower surface 312.

The plurality of first drawing units 4 are dispersedly disposed in the first body 31. Each first drawing unit 4 includes a first through hole 41 penetrating the first body 31, and one is disposed on the first upper surface. A first upper opening 42 of 311, a first lower opening 43 provided on the first lower surface 312, and a first surrounding wall 44 connecting the first upper opening 42 and the first lower opening 43, and the first An opening area of an upper opening 42 is larger than the first lower opening 43, and a peripheral edge of the first surrounding wall 44 is gradually increased from the first lower opening 43 to the first upper opening 42.

In the first preferred embodiment, the plurality of first drawing units 4 are arranged in pairs opposite to each other along the periphery of the first body 31. The side frame is enclosed in a circle, so that when the first body 31 is adhered to the substrate B, the first lower surface 312 of the first body 31 can be adhered to the upper surface of the wafer so that the wafer can generate The heat is conducted to the outside. In actual implementation, the plurality of first drawing units 4 can be set according to actual conditions, and should not be limited to this.

Continuing from the above description, when the first lower surface 312 of the first body 31 is adhered to the substrate B, the adhesive A can enter the first through hole 41 through the first lower opening 43 and solidify, and then bond with the first A surrounding wall 44 forms a pulling force, so that the first main body unit 3 cannot be easily separated from the substrate B.

It is worth mentioning that the adhesive A adhered to the first surrounding wall 44 can not only increase the adhesion area with the first body 31 to improve adhesion, but also the periphery of the first through hole 41 is caused by The characteristic that the first lower opening 43 gradually increases toward the first upper opening 42 causes the adhesive A solidified in the first through hole 41 and the first surrounding wall 44 to form a pulling force to make the solidified adhesive A is not easy to fall off from the first lower opening 43. Compared with the traditional method of sticking a flat surface to the substrate B with the conventional heat sink, the present invention can indeed achieve the effects of improving the adhesion and increasing the drawing force.

Referring to FIGS. 4 and 5, a second preferred embodiment of a heat sink device with increased drawing force according to the present invention is substantially the same as the first preferred embodiment. To repeat, the difference is that the first body unit 3 further includes a large opening 32 provided in the first body 31 and penetrating the first upper surface 311 and the first lower surface 312, and each first pull The drawing unit 4 further includes a rough surface 45 disposed on the first surrounding wall 44.

In the second preferred embodiment, the plurality of first drawing units 4 are disposed in the first main body 31 in a distributed manner. When the first main body unit 3 is adhered to the substrate B, the opening is wide. The hole 32 can receive a wafer above the substrate B. In addition, the first drawing unit 4 of the second preferred embodiment can not only retain the same adhesive effect as that of the first preferred embodiment, but also the rough surface 45 provided on the first surrounding wall 44 can be further increased. The adhesion area between the adhesive A and the first body 31 is used to further improve the adhesion and the pulling force between the first body 31 and the substrate B.

Referring to FIGS. 6 and 7, a third preferred embodiment of a heat sink device with increased drawing force according to the present invention is shown. A tangent line bb in the figure is a section line of the third preferred embodiment. The third preferred embodiment It is substantially the same as the first preferred embodiment, and the same is not repeated here. The difference is that a receiving groove 313 is formed on the first lower surface 312 of the first body 31, so that the cross-sectional shape of the first body 31 It is formed in a ㄇ shape, and the plurality of first drawing units 4 are arranged around the accommodation groove 313. Preferably, the plurality of first drawing units 4 are framed in the first body 31 in a single arrangement. In practice, the plurality of first drawing units 4 can be set according to actual conditions, and should not be limited to this.

When the third preferred embodiment is adhered to the substrate B, when the adhesive A adheres the first lower surface 312 outside the accommodation groove 313 to the upper surface of the substrate B, the adhesive A will It enters the first through hole 41 through the first lower opening 43 and solidifies, and generates an adhesive force and a pulling force with the first surrounding wall 44 to prevent the first body unit 3 from falling off the substrate B easily. And the wafer above the substrate B is accommodated in the accommodation groove 313, and the upper surface of the wafer is adhered to the first lower surface 312 in the accommodation groove 313 to conduct the heat generated by the wafer. To the outside world.

Referring to FIGS. 8 and 9, there is shown a fourth preferred embodiment of a heat sink device with increased drawing force according to the present invention. The fourth preferred embodiment is substantially the same as the second preferred embodiment. To repeat, the difference is that the heat sink device further includes a second body unit 5 and a plurality of second drawing units 6.

The second main body unit 5 includes a second main body 51 spaced above the first main body 31 and having a second upper surface 511 and a second lower surface 512, and a second lower surface 512 connected to the first lower surface 512. One up The connection layer 52 on the surface 311 is aligned with the outer periphery of the first body 31 and the second body 51. Preferably, the material and characteristics of the connection layer 52 are the same as those of the adhesive A.

A plurality of second drawing units 6 are dispersedly disposed in the second body 51. Each second drawing unit 6 includes a second through hole 61 penetrating through the second body 51, and one is disposed on the second upper surface 511. A second upper opening 62, a second lower opening 63 provided on the second lower surface 512, and a second surrounding wall 64 connecting the second upper opening 62 and the second lower opening 63, the second upper opening The opening area of the opening 62 is larger than the second lower opening 63, and the peripheral edge of the second surrounding wall 64 is gradually increased from the second lower opening 63 to the second upper opening 62.

When the four preferred embodiments are adhered to the substrate B, the large opening hole 32 of the first main body unit 3 can receive the wafer above the substrate B, and the adhesive agent A solidified in the first through hole 41 is solidified. Not only the adhesion area with the first body 31 can be increased to increase the adhesive force, but also the peripheral edge of the first surrounding wall 44 is gradually enlarged from the first lower opening 43 to the first upper opening 42 to solidify. The adhesive A in the first through hole 41 generates a pulling force and is not easily detached from the first lower opening 43.

In addition, the plurality of second drawing units 6 also have the same effect as the first drawing unit 4. When the second body 51 is adhered to the first body 31 through the connection layer 52, the connection layer The material of 52 can be solidified into the second through-hole 61 through the second lower opening 63, and form an adhesive force and a drawing force with the second surrounding wall 64. The material of the connection layer 52 can be connected with the first Adhesives A in a through hole 41 contact and adhere to each other, so that the second body unit 5 is tightly adhered to the first body unit 3 and is not easy to fall off.

In the fourth preferred embodiment, the plurality of first and second drawing units 4, 6 are arranged in a pair of opposite directions, respectively, and form a circle along the inner frame of the periphery of the first and second bodies 31, 51. In actual implementation, the plurality of first and second drawing units 4, 6 can be set according to actual conditions, and should not be used as such. limit. When the first and second bodies 31 and 51 are adhered to the substrate B, the second lower surface 512 of the second body 51 may be adhered to the upper surface of the wafer so that the heat generated by the wafer is transmitted to external.

Referring to Figs. 10, 11, and 12, a fifth preferred embodiment of a heat sink device having an increased pullout force according to the present invention is shown. A tangent line cc in the figure is a section line of the third preferred embodiment. The embodiment is substantially the same as the second preferred embodiment, and the same is not repeated here. The difference is that the heat sink device further includes a third body unit 7.

The third main body unit 7 includes a third main body 71 spaced above the first main body 31 and a connecting section 72 extending from the periphery of the third main body 71 in the direction of the substrate B and connected to the first main body 31. The outer periphery of the third main body 71 is not larger than the large opening hole 32. Preferably, the first main body unit 3 and the third main body unit 7 are made of metal materials and are integrally formed. When the main body 31 is adhered to the substrate B, the lower surface of the third body 71 and the upper surface of the wafer are adhered together, so that the heat generated by the wafer can be conducted to the outside through the third body 71.

The first through-hole 41 has a large-aperture portion 411 connected to the first upper opening 42, a small-aperture portion 412 connected to the first lower opening 43, and a portion between the large-aperture portion 411 and the small-aperture portion 412. The shoulder portion 413 and a pull-proof protrusion 414 protruding from the shoulder portion 413 toward the center line 410 of the first through hole 41.

What the inventors want to state is that when the first lower surface 312 of the first body 31 is adhered to the substrate B, the adhesive A can enter the first through hole 41 through the first lower opening 43. Not only can the first surrounding wall 44 be adhered to each other to form an adhesive force, but also the setting of the large-aperture portion 411, the small-aperture portion 412, and the shoulder portion 413 can solidify the adhesion in the first through-hole 41 The agent A can generate a pulling force with the shoulder 413, and then cooperate with the adhesive A to surround and solidify the anti-pulling convex 414, so that the adhesive A and the first main body unit 3 can produce maximum adhesion. Force and pulling force, the heat sink device and the substrate B can be closely adhered Together, they can not only resist the harsh environmental changes of the outside world without falling off, but also resist the pulling force of the outside world without separation.

It can be known from the above description that the heat sink device with increased pulling force of the present invention does include the following advantages:

First, improve adhesion

In the semiconductor heat sink bonding process of the present invention, the adhesive A can not only adhere the first lower surface 312 to the upper surface of the substrate B, but also pass through the first lower openings of the plurality of first drawing units 4. 43 enters the first through hole 41 and is adhered to the first surrounding wall 44 to increase the adhesion area to improve the adhesion between the first body 31 and the substrate B.

Second, increase the pulling force

According to the present invention, the peripheral edge of the first upper opening 42 of each first drawing unit 4 is larger than the first lower opening 43. When the adhesive A enters the first through hole 41 through the first lower opening 43. During solidification, the solidified adhesive A and the first surrounding wall 44 or the shoulder 413 resist each other to increase the pulling force, so that the first body 31 can resist the pulling of the outside without separation.

Third, meet high product specifications

As mentioned above, the first main body unit 3 provided with the plurality of first drawing units 4 can indeed improve the adhesion and drawing force with the substrate B, so that the present invention can resist the harsh external environment changes and drawing Pulling force, sticking tightly to the substrate B is not easy to fall off, and can meet high product specifications.

In summary, the plurality of first drawing units 4 are provided in the first body 31 of the heat sink device with increased drawing force according to the present invention. When the first body 31 and the substrate B are adhered together, the adhesive A not only The first lower surface 312 and the upper surface of the substrate B are adhered together, and the first lower opening 43 is also entered into the first through hole 41 and adhered to the first surrounding wall 44 to increase the adhered area. To improve the adhesive force, and then the area of the first lower opening 43 of each first drawing unit 4 is smaller than the first upper opening 42 so that the adhesive A solidified in the first through-hole 41 can interact with the The first surrounding wall 44 resists each other and generates a pulling force, so that the heat sink device can be tightly adhered to the substrate B, which can not only resist the harsh external environment changes without falling off, but also resist external pulling. The pulling force without separation makes the present invention meet the technical scope of high-standard products, so it can indeed achieve the purpose of the present invention.

However, the above are only the five preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes made according to the scope of the patent application and the description of the invention, and Modifications are still within the scope of the invention patent.

Claims (8)

A heat sink device with increased drawing force is suitable for being adhered to a substrate using an adhesive and includes: a first body unit including a first body having a first upper surface and a first lower surface ; And a plurality of first drawing units, which are dispersedly disposed in the first body, each first drawing unit includes a first through hole penetrating through the first body, and a first hole provided on the first upper surface. An upper opening, a first lower opening disposed on the first lower surface, and a first surrounding wall connecting the first upper opening and the first lower opening, the opening area of the first upper opening is larger than the first opening A lower opening, when the first lower surface of the first body is stuck to the substrate, the adhesive can enter the first through hole through the first lower opening to solidify, and form a pulling force with the first surrounding wall, In order to prevent the first body unit from falling off the substrate, the first through hole has a large aperture portion connected to the first upper opening, a small aperture portion connected to the first lower opening, and a ring provided on the large aperture portion. The shoulder between the small aperture and the shoulder To the first through hole surrounding the protruding center line of pull-convex wall. According to the heat sink device with increased pulling force according to item 1 of the scope of the patent application, wherein the peripheral edge of the first surrounding wall gradually increases from the first lower opening to the first upper opening. According to item 1 of the scope of the patent application, the heat sink device with increased drawing force, wherein each first drawing unit further includes a rough surface disposed on the first surrounding wall. According to item 1 of the scope of the patent application, the heat sink device with increased drawing force, wherein the first body unit further includes a first body unit disposed in the first body and penetrating the first upper surface and the first lower surface. Large open hole. According to item 1 of the scope of patent application, the heat sink device with increased drawing force, wherein a receiving groove is formed on the first lower surface of the first body, and the plurality of first drawing units surround the receiving groove. Settings. According to item 4 of the scope of patent application, the heat sink device with increased pulling force further includes a second main body unit, which includes a second upper surface and a second lower surface spaced above the first main body. A second main body and a connecting layer connecting the second lower surface and the first upper surface, and the outer periphery of the first main body and the second main body are aligned. According to item 6 of the scope of the patent application, the heat sink device with increased drawing force further includes a plurality of second drawing units, which are dispersedly disposed in the second body, and each second drawing unit includes a through A second through hole of the second body, a second upper opening provided on the second upper surface, a second lower opening provided on the second lower surface, and a second upper opening and the second lower connection The second surrounding wall of the opening has an opening area larger than that of the second lower opening. According to item 4 of the scope of patent application, the heat sink device with increased pulling force further includes a third body unit, including a third body spaced above the first body, and a peripheral edge from the third body. A connecting section extending in the direction of the substrate and connected to the first body, the outer periphery of the third body is not larger than the large opening.