TWI662641B - Semiconductor manufacturing apparatus, air curtain device and method for protecting a semiconductor element - Google Patents

Abstract

A semiconductor manufacturing equipment includes a loading chamber, a clamping device, a driving mechanism, and an air curtain device. The loading chamber is configured to store one or more semiconductor elements. The holding device is configured to hold a semiconductor element. The driving mechanism is connected to the clamping device, and the driving mechanism is configured to drive the clamping device to transport at least one semiconductor device between the loading chamber and a processing chamber. The air curtain device is disposed on the clamping device, and the air curtain device is configured to provide an air flow to form an air curtain adjacent to a surface of the semiconductor device.

Description

Semiconductor manufacturing equipment, air curtain device, and method for protecting semiconductor element

The present invention relates to a semiconductor manufacturing equipment, and more particularly, to a semiconductor manufacturing equipment and a protection method using an air curtain to protect semiconductor elements.

In recent years, semiconductor integrated circuits have experienced exponential growth. With the development of integrated circuit materials and design technology, multiple generations of integrated circuits have been produced, each of which has smaller and more complex circuits than the previous generation. In the development of integrated circuits, when the geometric size (that is, the smallest component or line that can be produced in the process) is reduced, the functional density (that is, the number of interconnect devices per chip area) It usually increases. Generally speaking, such a reduced size process can provide the benefits of increasing production efficiency and reducing manufacturing costs. However, this reduced size process also increases the complexity of manufacturing and producing integrated circuits.

The integrated circuit is produced by processing a wafer through a series of semiconductor manufacturing equipments (referred to as manufacturing equipments). Each manufacturing machine usually executes an integrated circuit manufacturing job (also known as a manufacturing process) on a wafer according to a predefined or predetermined process recipe. process) or process), wherein the process program defines various parameters of the process. Integrated circuit manufacturing generally uses multiple manufacturing machines that require production and support to complete multiple processes, such as lithography, chemical vapor deposition (CVD), and physical gas. Phase vapor deposition (PVD) process, an etching process (Ionized Metal Plasma, IMP), and so on.

In semiconductor device manufacturing, the lithography process plays a very important role, which is used to form the specific patterns required on the semiconductor wafer. The basic steps of the lithography process include forming a photoresist layer on the surface of a semiconductor wafer, marking or exposing a pattern with a specific circuit layout on the photoresist layer, and removing the photoresist by supplying a developing solution to the photoresist layer. Unnecessary portions of the layer can be used to form a desired specific pattern on a semiconductor wafer.

Although the existing semiconductor manufacturing equipment can already meet the general purpose mentioned above, these semiconductor manufacturing equipment and lithography processes are still not satisfactory in all aspects.

An embodiment of the present invention provides a semiconductor manufacturing equipment including a loading chamber, a clamping device, a driving mechanism, and an air curtain device. The loading chamber is configured to store one or more semiconductor elements. The holding device is configured to hold a semiconductor element. The driving mechanism is connected to the clamping device, and the driving mechanism is configured to drive the clamping device to transport at least one semiconductor device between the loading chamber and a processing chamber. The air curtain device is disposed on the clamping device, and the air curtain device is configured to provide an air flow to form an air curtain adjacent to a surface of the semiconductor device.

An embodiment of the present invention further provides an air curtain device including an air-jet module and a gas supply source. The air-jet module includes a frame, a base, a first flow channel and a second flow channel. The base is movably disposed in the frame, and the base has a first opening and a second opening. The first flow channel is disposed in the base, and one end of the first flow channel is communicated with the first opening. The second flow channel is disposed in the base, one end of the second flow channel is connected to the second opening, and the other end of the second flow channel is connected to the first flow channel. The gas supply source is connected to the first flow channel and the second flow channel and is configured to provide a gas, wherein the gas system is ejected in a second direction through the second flow channel and the second opening, thereby generating a lifting force to drive the base toward a first direction It moves relative to the frame, and the gas system is ejected in a third direction through the first flow channel and the first opening. The first direction is substantially opposite to the second direction, and the third direction is different from the first direction and the second direction.

An embodiment of the present invention further provides a method for protecting a semiconductor device, which includes holding a semiconductor device with a clamping device for transferring from a loading chamber to a processing chamber and / or from the processing chamber to the loading chamber. In addition, the method for protecting a semiconductor element further includes providing an airflow on the clamping device when the semiconductor element is transferred between the loading chamber and the processing chamber to form an air curtain adjacent to a surface of the semiconductor element.

100‧‧‧Semiconductor manufacturing equipment

101‧‧‧ Loading chamber

1011‧‧‧Mask carrier

102‧‧‧Transmission Module

1021‧‧‧Control circuit

1023‧‧‧Drive mechanism

103‧‧‧Switch Module

104‧‧‧Transmission carrier

105‧‧‧process equipment

1051‧‧‧Wafer Carrier

105A‧‧‧lithographic chamber

105B‧‧‧Light source chamber

105C‧‧‧Valve

107‧‧‧control module

150‧‧‧Photomask transfer clamping device

152‧‧‧First side structure

1521‧‧‧Groove

1522‧‧‧ surface

154‧‧‧Second side structure

1541‧‧‧Groove

156‧‧‧Protection structure

200‧‧‧Mask

202‧‧‧ surface

250‧‧‧ light source

260‧‧‧Projection Optical Module

300‧‧‧Photomask carrier

400‧‧‧semiconductor wafer

500‧‧‧Air curtain device

502‧‧‧jet module

502A‧‧‧jet module

502B‧‧‧Air Jet Module

504‧‧‧Gas supply source

505‧‧‧gas tube

505A‧‧‧Gas tube

506‧‧‧Frame

5061‧‧‧Side

5062‧‧‧ bottom side

5063‧‧‧Top side

507‧‧‧Exhaust trough

508‧‧‧ base

5081‧‧‧Top cover

5082‧‧‧Connection Department

5082A‧‧‧Connection

5083‧‧‧ bottom

5084‧‧‧First opening

5084A‧‧‧First opening

5085‧‧‧Second opening

5086‧‧‧ Third opening

5087‧‧‧ fourth opening

508A‧‧‧Base

509‧‧‧ exhaust pipe

510‧‧‧Stretching element

512‧‧‧ suction module

512'‧‧‧ suction module

512A‧‧‧Suction module

512B‧‧‧Suction module

514‧‧‧Spring

600‧‧‧ Wafer Holding Device

602‧‧‧First side structure

604‧‧‧Second side structure

700‧‧‧ treatment chamber

702‧‧‧wafer stage

704‧‧‧ liquid supply device

7041‧‧‧Nozzle

706‧‧‧ bracket

708‧‧‧Mounting frame

7082‧‧‧Up Frame

7084‧‧‧ under frame

AF‧‧‧Airflow

FP1‧‧‧First runner

FP2‧‧‧Second runner

FP3‧‧‧Third runner

FP4‧‧‧Fourth runner

PT‧‧‧Particle

S100, S102‧‧‧ Operation

FIG. 1 is a schematic diagram of a semiconductor manufacturing apparatus according to some embodiments of the present invention.

FIG. 2 is a schematic diagram of a mask transmission clamping device and a gas supply source according to some embodiments of the present invention.

FIG. 3 is a schematic view of the mask transmission and clamping device, the mask, and the air-jet module according to the embodiment of FIG. 2 viewed in the Y-axis direction.

Fig. 4 is a schematic cross-sectional view taken along line A-A 'in Fig. 2 according to an embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of the gas injection module after receiving the gas from the gas supply source in FIG. 4 of the embodiment of the present invention.

FIG. 6 is a schematic diagram of a mask transmission and clamping device, a gas supply source, and an exhaust groove according to another embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view taken along line B-B 'in Fig. 6 according to an embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view of the suction module after receiving the gas from the gas supply source in FIG. 7 of the embodiment of the present invention.

FIG. 9 and FIG. 10 are schematic cross-sectional views of a suction module according to another embodiment of the present invention in different states.

FIG. 11 is a schematic diagram of a mask transmission clamping device, a mask, and a gas supply source according to another embodiment of the present invention.

FIG. 12 is a partial structural schematic diagram of the air jet module and the first side structure in FIG. 11 of the embodiment of the present invention

FIG. 13 is a schematic diagram of a wafer holding apparatus according to another embodiment of the present invention.

FIG. 14 is a schematic diagram of a processing chamber according to some embodiments of the present invention.

Fig. 15 is a schematic cross-sectional view taken along the line C-C 'in Fig. 14 according to an embodiment of the present invention.

FIG. 16 is a flowchart of a method for protecting a semiconductor device according to an embodiment of the present invention. Illustration.

The embodiments or examples disclosed below are used to illustrate or complete many different technical features of the present invention, and the specific examples of the described elements and configuration are used to simplify the description of the present invention, so that the disclosure can be more thorough and complete, The scope of this disclosure is fully conveyed to those skilled in the art. Of course, this disclosure can also be implemented in many different forms and is not limited to the embodiments described below.

The space-related terms used in the following, such as "below", "below", "lower", "above", "higher" and similar terms, are used to facilitate the description of illustrations The relationship between one element or feature and another element or feature. In addition to the orientations shown in the drawings, these spatially related terms are also intended to encompass different orientations of the device in use or operation. For example, the device may be turned to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used herein may be interpreted the same way. In addition, if a first feature is formed on or above a second feature in the embodiment, it means that it may include the case where the first feature is in direct contact with the second feature, or it may include additional features. It is formed between the first feature and the second feature, so that the first feature and the second feature are not in direct contact.

The same component numbers and / or words may be repeatedly used in the following different embodiments. These repetitions are for the purpose of simplification and clarity, and are not intended to limit the specific relationship between the different embodiments and / or structures discussed. In addition, in the drawings, the shape or thickness of the structure may be enlarged to simplify or facilitate labeling. It must be understood that elements not specifically illustrated or described may be used by those skilled in the art Various forms are known.

In the lithography process, for example, when exposure is to be performed, a robot arm in a semiconductor manufacturing machine takes a photo mask from a library and transports it to a chamber (light Cover level). Since the space (or chamber) during transportation is not completely dust-free and completely vacuum, during the transportation from the storage to the photomask level, particles or dust may fall on the photomask in the air. Therefore, during the subsequent exposure process, particles or dust can cause patterned defects on the wafer, thereby affecting the yield of the wafer.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a semiconductor manufacturing apparatus 100 according to some embodiments of the present invention. In some embodiments, the semiconductor manufacturing equipment 100 may include a loading chamber 101, a transmission module 102, a switching module 103, a transfer stage 104, a process device 105, and a control module 107. Elements of the semiconductor manufacturing apparatus 100 in FIG. 1 may be added or deleted, and the present invention is not limited to this embodiment. In some embodiments, the semiconductor manufacturing equipment 100 may be a lithography processing system, and the process device 105 may be a lithography device. The semiconductor manufacturing apparatus 100 is configured to use light emitted from a light source to expose a photoresist layer coated on a semiconductor wafer. The semiconductor manufacturing equipment 100 generally refers to a scanner operable to perform a lithographic exposure process using a corresponding light source and an exposure mode.

In some embodiments, the semiconductor manufacturing apparatus 100 may further include a semiconductor device (for example, a photomask 200). The semiconductor device is configured to perform an exposure process in the process device 105. The loading chamber 101 is configured to be illuminated by a light A mask carrier 1011 is loaded onto the transmission module 102 or unloaded onto the photomask carrier 1011 by the transmission module 102. In some embodiments, two photomask carriers 1011 can be placed in the loading chamber 101, but the number of photomask carriers 1011 that can be placed in the loading chamber 101 is not limited to this embodiment. In some embodiments, one of the two reticle carriers 1011 is configurable to load a reticle 200 to be transferred to the transfer module 102, and the other reticle carrier 1011 is configurable to load Another photomask 200 to be unloaded by the transmission module 102.

The transmission module 102 is configured to transport the photomask 200 between the loading chamber 101 and the switching module 103. In some embodiments, the transmission module 102 is disposed between the loading chamber 101 and the switching module 103. The transmission module 102 may include a control circuit 1021, a driving mechanism 1023, and a mask transmission clamping device. 150. The photomask transmission and clamping device 150 is connected to the driving mechanism 1023 and configured to clamp the photomask 200, and the control circuit 1021 is configured to generate an electronic signal to the driving mechanism 1023 to control the driving mechanism 1023 to transmit the photomask 200. In some embodiments, the driving mechanism 1023 may be a robot arm, and may be, for example, a six-axis robot manipulator configured to hold the photomask 200.

Furthermore, in some embodiments, the switching module 103 is configured to hold a photomask 200 to be moved into the transmission carrier 104 and to hold another photomask 200 removed from the transmission carrier 104. In addition, in some embodiments, the transmission stage 104 is configured to further transport the photomask 200 into the process device 105 to utilize ultraviolet (UV), deep ultraviolet (DUV), or extreme ultraviolet (UV). Light (extreme ultraviolet (EUV)) for the lithography process.

In some embodiments, as shown in FIG. 1, the control module 107 is configured to control operations of various devices and components in the semiconductor manufacturing apparatus 100. In some embodiments, the control module 107 may be a computer, and may communicate with various devices and components in the semiconductor manufacturing equipment 100 through a wire or a wireless communication network. For example, the control module 107 is electrically connected to the switching module 103 and the transmission carrier 104, so that the operations of the switching module 103 and the transmission carrier 104 can be controlled by the control module 107. In addition, in some embodiments, the control circuit 1021 and the control module 107 can also be integrated into a control unit.

In some embodiments, the control module 107 may include a processor and a storage circuit (the processor and the storage circuit are not shown in the figure). The storage circuit can be a random access memory (RAM), a flash memory, a read-only memory (ROM), and an erasable and programmable read-only memory (EPROM), Electronically-Erasable Programmable Read-Only Memory (EEPROM), register, hard disk, portable hard disk, compact disc read-only memory (Compact Disc Read- Only Memory (CD-ROM) or any other computer-readable storage media format known in the art. In addition, the storage circuit may store programs and related data configured to control various devices or components in the semiconductor manufacturing apparatus 100.

As shown in FIG. 1, the process device 105 may include a lithography chamber 105A (also referred to as a processing chamber) and a light source chamber 105B, and the lithography chamber 105A and the light source chamber 105B are permeable to a valve 105C. Connect with each other. The lithographic chamber 105A may include a mask carrier 300, a wafer carrier 1051, and a projection optical module 260 (also referred to as a projection optics box, POB)). The photomask carrier 300 is configured to receive and hold the photomask 200, and the wafer carrier 1051 is configured to receive and hold a semiconductor wafer 400.

In some embodiments, a light source 250 is disposed in the light source chamber 105B, and is configured to emit an extreme ultraviolet light. The extreme ultraviolet light passes through the valve 105C and is reflected on the semiconductor wafer 400 by the mask 200, so that the pattern on the mask 200 is engraved on the semiconductor wafer 400. The projection optical module 260 can be disposed on a moving path of extreme ultraviolet light. For example, in this embodiment, the projection optical module 260 can be disposed between the photomask 200 and the semiconductor wafer 400, but is not limited to the installation position of this embodiment.

Furthermore, the light source 250 is configured to generate radiation having a wavelength range between 1 nm and 100 nm. In a specific example, the light source 250 generates extreme ultraviolet light having a wavelength of about 13.5 nm. Therefore, the light source 250 may also be referred to as an extreme ultraviolet light source. In another embodiment, the projection optical module 260 may also be disposed between the mask 200 and the light source 250, and the light generated by the light source 250 is not limited to extreme ultraviolet light. For example, the light source 250 may also include, for example, an ultraviolet light source or a deep ultraviolet light source.

Please refer to FIG. 2. FIG. 2 is a schematic diagram of a mask transmission clamping device (also referred to as a clamping device) 150 and a gas supply source 504 according to some embodiments of the present invention. As shown in FIG. 2, the mask transmission clamping device 150 is configured to clamp a mask 200. In some embodiments, the mask transmission clamping device 150 may include a positioning portion 151 and two clamping structures (a first side structure 152 and a second side structure 154). The first side structure 152 and the second side structure 154 are configured to hold both sides of the mask 200, and the positioning portion 151 is configured to abut when the mask 200 is placed on the mask transmission clamping device 150. The photomask 200, so that the photomask 200 can be stably clamped by the first side structure 152 and the second side structure 154.

In addition, the mask transmission and clamping device 150 may further include two protection structures 156 respectively disposed on the outside of the first side structure 152 and the second side structure 154 so that the mask 200 is located between the two protection structures 156 . Therefore, during the process of transporting the photomask 200, the protective structure 156 can protect the photomask 200 to avoid damage caused by the photomask 200 colliding with other components in the semiconductor manufacturing equipment 100.

Furthermore, in some embodiments, the semiconductor manufacturing equipment 100 may include an air curtain device 500 disposed on the mask transmission clamping device 150. The air curtain device 500 may include one or more air-jet modules 502 and a gas supply source 504 . In the embodiment shown in FIG. 2, the air jet module 502 is disposed on the first side structure 152, but is not limited thereto. In other embodiments, the air jet module 502 may be disposed on the second side structure 154. on.

In some embodiments, the gas supply source 504 can provide a gas, such as a gas that does not affect the structure of the mask 200, such as nitrogen or argon, and the gas supply source 504 can be connected to the gas jet through one or more gas pipes 505. The module 502 is configured to provide a gas flow AF through the air-jet module 502, for example, from the first side structure 152 toward the second side structure 154 (in the X-axis direction) as shown in FIG. A plurality of air streams AF emitted from each air-jet module 502 constitute an air curtain, and the air curtain is adjacent to or close to a surface 202 of the mask 200.

Referring to FIG. 3 at the same time, FIG. 3 is a schematic view of the mask transfer clamping device 150, the mask 200, and the air-jet module 502 according to the embodiment of FIG. 2 viewed in the Y-axis direction. As shown in FIG. 3, the air jet module 502 can continuously provide airflow AF from one side above the mask 200 to the other side above the mask 200, so that during the process of transporting the mask 200, Dust or particulate PT will be blown away from the mask 200 by the airflow AF to prevent the particulate PT from attaching to the mask 200 and affecting subsequent processes. Yield. It can be understood that, because the air curtain formed by the airflow AF emitted from the plurality of air-jet modules 502 is adjacent to the surface 202 of the mask 200 (as shown in FIG. 3), even if the mask 200 was originally attached to the surface 202 There is dust or particulate PT, which can also be blown off the surface 202 by the airflow AF.

In addition, it is worth noting that since the photomask 200 may undergo thermal expansion and contraction due to environmental influences and cause structural deformation during the transportation of the semiconductor manufacturing equipment 100, in some embodiments, the first A heat exchanger (not shown) may be provided between the gas supply source 504 and the gas injection module 502 in FIG. 2, and the heat exchanger may be configured to control the temperature of the gas flowing into the gas injection module 502, for example, 22 Degree C. Therefore, the temperature of the airflow AF emitted by the air-jet module 502 can be maintained at a fixed temperature (for example, 22 degrees C), so that the photomask 200 adjacent to the airflow AF can also be maintained at a fixed temperature of about 22 degrees C during transportation. Therefore, the phenomenon of thermal expansion and contraction of the photomask 200 can be avoided, thereby affecting the accuracy of subsequent patterning.

Please refer to FIG. 4 and FIG. 5. FIG. 4 is a schematic cross-sectional view taken along line AA ′ in FIG. 2 according to the embodiment of the present invention. FIG. 5 is an air jet mold in FIG. Sectional schematic diagram after the group 502 receives the gas from the gas supply source 504. As shown in the figure, the first side structure 152 is formed with a groove 1521, and the air-jet module 502 is buried in the groove 1521 of the first side structure 152 of the mask transmission clamping device 150. In some embodiments, the air-jet module 502 includes a frame 506 and a base 508. The frame 506 is embedded in the recess 1521 of the first side structure 152, and the base 508 is opposite to the frame The manner in which the body 506 moves is set in the frame 506.

As shown in FIG. 4, the base 508 may have a top cover 5081, a The connecting portion 5082 and a bottom portion 5083. The connecting portion 5082 is configured to connect the top cover 5081 and the bottom portion 5083. In this embodiment, the connecting portion 5082 may be formed with a first opening 5084 facing the X-axis direction, and the bottom portion 5083 may be formed with two second openings 5085 facing the -Z axis direction. Furthermore, in this embodiment, the air-jet module 502 may further include a first flow path FP1 and two second flow paths FP2, which are disposed in the base 508. One end of the first flow channel FP1 is connected to the first opening 5084 and the other end is connected to the gas supply source 504 via the gas pipe 505. One end of the second flow channel FP2 is connected to the second opening 5085, and the other end of the second flow channel FP2 is connected to the first flow channel FP1.

When the gas is supplied by the gas supply source 504, the gas enters the first flow path FP1 and the second flow path FP2 through the gas pipe 505, and then the gas is ejected in a second direction (-Z axis direction) through the second opening 5085, that is, Spraying downwards in the direction shown by the arrow in FIG. 5 generates a lifting force to drive the base 508 to move in a first direction (Z-axis direction) relative to the frame 506 to the position shown in FIG. 5. When the connecting portion 5082 moves along the Z axis and is exposed by the groove 1521, the gas is ejected in a third direction (X axis direction) through the first flow path FP1 and the first opening 5084. In this embodiment, the first direction is substantially opposite to the second direction, and the third direction is different from the first direction and the second direction.

When the gas supply source 504 stops supplying gas, the base 508 moves in the second direction (-Z axis direction) due to gravity and returns to the position shown in FIG. 4. In some embodiments, the air-jet module 502 may further include one or more tensile elements 510 (elastic elements). As shown in FIG. 5, the tensile element 510 is disposed between the bottom 5083 of the base 508 and a bottom side 5062 of the frame 506. The stretching element 510 is configured to provide a stretching force to stop the supply of the gas supply source 504 When the gas is pulled, the base 508 is moved toward the frame 506 to return the base 508 to the frame 506.

It is worth noting that when the base 508 returns to the position in the frame 506 as shown in FIG. 4, the top cover 5081 of the base 508 is flush with the surface 1522 of the first side structure 152. Therefore, when the photomask 200 is placed in the photomask transfer holding device 150, the control module 107 can control the gas supply source 504 not to provide gas to the air-jet module 502, and the base 508 will not protrude from the surface 1522. In order to avoid the problem that the mask 200 collides with the base 508. After the photomask 200 is stably placed on the photomask transfer holding device 150, the control module 107 can control the gas supply source 504 to supply gas to the gas injection module 502.

Furthermore, in some embodiments, a track (such as a linear slide or a ball slide, not shown in the figure) may be provided between the bottom 5083 of the base 508 and the side 5061 of the frame 506 to make the base 508 can move relatively smoothly along the Z-axis direction relative to the frame 506.

In addition, in this embodiment, the first flow path FP1 and the second flow path FP2 are solid tubular bodies, which are buried in the base 508. In other embodiments, the first flow path FP1 and the second flow path FP2 may be directly It is formed in the base 508, for example, by injection molding.

Please refer to FIG. 6, which is a schematic diagram of a mask transmission clamping device 150, a gas supply source 504, and an exhaust groove 507 according to another embodiment of the present invention. This embodiment is similar to the embodiment in FIG. 2 except that the air curtain device 500 in this embodiment further includes a plurality of suction modules 512 and is disposed on the second side structure 154. The number and positions of the suction modules 512 correspond to the air-jet modules 502, and the number and positions are not limited to the embodiment in FIG. The suction module 512 is through The other gas pipe 505A is connected to the gas supply source 504, and the gas supply source 504 selectively supplies gas to the suction module 512. The air suction module 512 is configured to receive the air flow AF emitted by the air injection module 502, and exhausts the gas to the air exhaust groove 507 through an air exhaust pipe 509.

With the design of the embodiment in FIG. 6, the dust or particles located above the mask 200 can be received by the suction module 512 and discharged to the exhaust groove 507, so the possibility of particles falling on the mask 200 can be further reduced. Sex. In some embodiments, the exhaust groove 507 may be a groove in the semiconductor manufacturing apparatus 100. In another embodiment, the exhaust groove 507 may be an environment outside the semiconductor manufacturing apparatus 100.

It is worth noting that the plurality of air jet modules 502 in this embodiment can communicate with each other through a first communication pipe (not shown in the figure) provided in the first side structure 152. The lowermost gas injection module 502 in the figure is connected to a gas supply source 504 through a gas pipe 505. Similarly, the plurality of suction modules 512 can communicate with each other through a second communication pipe (not shown in the figure) provided in the second side structure 154, and finally the bottom suction in FIG. 6 The module 512 communicates with the exhaust groove 507 through the exhaust pipe 509.

In addition, in other embodiments, the air-jet module 502 and the air-intake module 512 can be arranged alternately. For example, the second, fourth, sixth, and eighth air-jet modules 502 on the first side structure 152 in FIG. 6 can be replaced with the air-intake module 512, and the second on the second side structure 154 The four, six, eight suction modules 512 can be replaced with air jet modules 502. The configuration of the air-jet module 502 and the air-intake module 512 can be adjusted or changed according to actual needs.

Fig. 7 is a view along the line B-B 'in Fig. 6 according to an embodiment of the present invention. Sectional schematic diagram, FIG. 8 is a schematic cross-sectional diagram of the air intake module 512 after receiving the gas from the gas supply source 504 in the seventh diagram of the embodiment of the present invention. Similar to the air-jet module 502, the air-intake module 512 also includes a frame 506 and a base 508. The frame 506 is buried in a groove 1541 of the second side structure 154, and the base 508 is opposite The movement of the frame 506 is set in the frame 506. In this embodiment, the connecting portion 5082 may be formed with a third opening 5086 facing the -X axis direction, and the bottom portion 5083 may be formed with two fourth openings 5087 facing the -Z axis direction. The air-jet module 502 may further include a third flow path FP3 and two fourth flow paths FP4, which are disposed in the base 508. One end of the third flow path FP3 is connected to the third opening 5086 and the other end is connected to the exhaust groove 507 via the exhaust pipe 509. One end of the fourth flow path FP4 is connected to the fourth opening 5087, and the other end of the fourth flow path FP4 is connected to the gas supply source 504 through the gas pipe 505A.

When the gas is supplied by the gas supply source 504, the gas enters the two fourth flow channels FP4 through the gas pipe 505A, and then the gas is ejected in the second direction (-Z axis direction) through the two fourth openings 5087, which is like The direction shown by the arrow in FIG. 8 is sprayed downward, thereby generating a lifting force to drive the base 508 in the first direction (Z-axis direction) relative to the frame 506 from the position in FIG. 7 to as shown in FIG. 8. Its location. When the connecting portion 5082 moves along the Z axis and is exposed by the groove 1541, the third opening 5086 can receive the airflow AF emitted from the corresponding jet module 502, and simultaneously transmit it to the exhaust groove 507 through the exhaust pipe 509 . It is worth noting that the bottom 5083 can be used as a stopper. When the base 508 is moved to the position shown in FIG. 8, the bottom 5083 will abut against the frame 506 to prevent the base 508 from detaching from the frame 506.

When the gas supply source 504 stops supplying gas, the base 508 will move in the second direction (-Z axis direction) due to gravity and return to the position shown in FIG. 7 position. In some embodiments, the suction module 512 may further include one or more springs 514 (elastic elements). As shown in FIG. 7, the spring 514 is disposed between the bottom 5083 of the base 508 and a top side 5063 of the frame 506. The spring 514 is configured to provide an elastic force to push the base 508 toward the frame 506 when the gas supply source 504 stops supplying gas, so that the base 508 returns to the frame 506.

With the design of the suction module 512 of this embodiment, when the gas supply source 504 supplies gas to the air-jet module 502 and the air-suction module 512, the air-jet module 502 and the air-suction module 512 can be driven together and The first side structure 152 and the second side structure 154 protrude from the first side structure 152 and the second side structure 154 respectively, and an air curtain is formed to prevent particles from falling onto the photomask 200.

Please refer to FIG. 9 and FIG. 10, which are schematic cross-sectional views of a suction module 512 ′ in different states according to another embodiment of the present invention. The structure of the suction module 512 'is similar to that of the suction module 512. The difference between the two is that the two fourth openings 5087 at the bottom 5083 of the suction module 512' are toward the top side 5063 of the frame 506 (along X Axis direction), and two stretching elements 510 are disposed between the bottom 5083 and the top side 5063 of the frame 506. In addition, the control module 107 is capable of controlling the gas supply source 504 to supply gas to the aforementioned gas injection module 502 and the suction module 512 'at different time points. For example, when the gas supply source 504 provides gas to the gas injection module 502, the gas supply source 504 does not provide gas to the suction module 512 'via the gas pipe 505A. Therefore, at this time, the tensile element 510 will pull the base 508 in the first direction (Z-axis direction) relative to the frame 506 from the position shown in FIG. 9 to the position shown in FIG. 10, so that the third opening 5086 is convenient. It can receive the air flow AF from the corresponding air-jet module 502 and transmit it to the exhaust tank 507 through the exhaust pipe 509 at the same time.

Conversely, when the gas supply source 504 stops supplying gas to the gas injection module 502 and supplies gas to the suction module 512 ', the gas will be ejected in the first direction (Z-axis direction) through the two fourth openings 5087, thereby generating a The thrust driving base 508 moves in the second direction (-Z axis direction) relative to the frame 506 from the position shown in FIG. 10 and returns to the position shown in FIG. 9.

Please refer to FIG. 11 and FIG. 12. FIG. 11 is a schematic diagram of a mask transmission and clamping device 150 and a gas supply source 504 according to another embodiment of the present invention. FIG. 12 is a diagram of FIG. 11 according to an embodiment of the present invention. A partial structural diagram of an air-jet module 502A and the first side structure 152. This embodiment is similar to the embodiment in FIG. 6 except that the air curtain device 500 in this embodiment includes an air-jet module 502A and an air-inhalation module 512A having a long structure, which are respectively disposed on the first side structure 152 And the second side structure 154, and the air jet module 502A and the air suction module 512A correspond to the shapes of the first side structure 152 and the second side structure 154, respectively. The internal structures of the air-jet module 502A and the air-intake module 512A in this embodiment are similar to the structures of the air-jet module 502 and the air-intake module 512 in the previous embodiment. For example, the cross-sectional view of the air-jet module 502A on the XZ plane may be similar to FIG. 4, and the cross-sectional view of the air-intake module 512A on the XZ plane may be similar to FIG. 7.

As shown in FIG. 12, the structure of the base 508A of the air-jet module 502A extends along the Y-axis direction. The connection part 5082A of the base 508A has a long first opening 5084A. When the gas supply source 504 supplies gas to the air-jet module 502A, the gas will pass through the second flow channel (not shown in the figure) in the bottom 5083A. Spraying toward the -Z axis to provide a lifting force moves the base 508 in the Z axis direction, and the gas also sprays airflow AF from the first opening 5084A in the X axis direction through the first flow channel (not shown in the figure). Similarly, the suction module 512A in FIG. 11 may also have An elongated third opening (not shown in the figure) is configured to receive the airflow AF from the suction module 512A, and then the gas is led out to the exhaust groove 507 through the exhaust pipe 509.

With the structural design of this embodiment, the air-jet module 502A can provide the airflow AF through the elongated first opening 5084A to form a tighter air curtain, thereby further increasing the ability of the air curtain device 500 to protect the photomask 200.

Please refer to FIG. 13, which is a schematic diagram of a wafer holding apparatus 600 according to another embodiment of the present invention. In this embodiment, the wafer holding device 600 is a holding device configured to hold the semiconductor wafer 400, and the wafer holding device 600 has a first side structure 602 and a second side structure 604. . In some embodiments, the first side structure 602 may be provided with an air-jet module 502B, which is similar in structure to the air-jet module 502A. The difference is that the air-jet module 502B can be made of a flexible metal or a flexible plastic material. Therefore, the air jet module 502A can correspond to the curved shape of the first side structure 602.

In addition, an air suction module 512B may be provided on the second side structure 604 and configured to receive the air flow AF emitted by the air jet module 502B. In this embodiment, the suction module 512B may also be made of a flexible metal or a flexible plastic material, so that the suction module 512B may correspond to the curved shape of the second side structure 604. As shown in FIG. 13, the air-jet module 502B can eject a sheet of airflow through a long strip opening (not shown in the figure) to form a tighter air curtain and provide a wider range of protection to the semiconductor wafer 400.

Please refer to FIGS. 14 and 15. FIG. 14 is a schematic diagram of a processing chamber 700 according to one of the embodiments of the present invention. FIG. 15 is a diagram along the line CC ′ in FIG. 14 according to the embodiment of the present invention. Schematic cross-section. In this embodiment, processing The processing chamber 700 may be another chamber (not shown in FIG. 1) in the semiconductor manufacturing apparatus 100. The processing chamber 700 may include a wafer carrier 702, a liquid supply device 704, and a support 706. A semiconductor wafer 400 is disposed on the wafer carrier 702, and is fixed to the wafer carrier 702 by, for example, an electrostatic adsorption method. In some embodiments, the liquid supply device 704 provides a photoresist or developer on the semiconductor wafer 400 via a nozzle 7041. When a photoresist or a developer is dropped on the semiconductor wafer 400, the wafer carrier 702 can drive the semiconductor wafer 400 to rotate, so that the photoresist or the developer is evenly coated on the semiconductor wafer 400.

It is worth noting that in this embodiment, a plurality of air-jet modules 502 may be provided on the bracket 706 to provide a plurality of airflows AF flowing through the semiconductor wafer 400 in the direction of the arrow in FIG. 14 toward the liquid supply device 704 One above the surface. Therefore, during the application of the photoresist or developer on the semiconductor wafer 400, the airflow AF can protect the semiconductor wafer 400 from dust or particles in the processing chamber 700 from falling onto the semiconductor wafer 400.

As shown in FIG. 15, the air jet module 502 is mounted on the bracket 706 through a mounting bracket 708. In this embodiment, the mounting bracket 708 may include an upper frame 7082 and a U-shaped lower frame 7084, and the upper frame 7082 can be fixed to the lower frame 7084 by a locking element 710 such as a screw, so that the mounting bracket 708 can be installed. On the bracket 706. In addition, the frame 506 of the air-jet module 502 can be fixedly disposed on the upper frame 7082, and is fixed to the upper frame 7082 by, for example, engaging or locking. Based on the design of the air jet module 502 and the mounting bracket 708, the air jet module 502 can be conveniently installed on a structure adjacent to the semiconductor element to provide airflow to protect the semiconductor element (such as a wafer or a photomask). The structure and shape of the mounting bracket 708 are not limited to this embodiment, and may be modified or changed according to the shape of the structure to be actually installed.

Please refer to FIG. 16, which is a flowchart of a method for protecting a semiconductor device (such as a photomask 200 or a semiconductor wafer 400) according to an embodiment of the present invention. In step S100, the driving mechanism 1023 drives a clamping device (such as a mask transfer clamping device 150) to clamp a semiconductor element for transfer from the loading chamber 101 to a processing chamber (such as a lithography chamber 105A). And / or transferred from the processing chamber to the loading chamber 101, wherein the loading chamber 101 may store a plurality of semiconductor elements (such as the photomask 200). Furthermore, in step S102, when the semiconductor device is transferred between the loading chamber 101 and the processing chamber, an air flow is provided on the clamping device to form an air curtain adjacent to or close to a surface of the semiconductor device, so as to avoid Dust or particles in the semiconductor manufacturing equipment 100 or the environment in which the semiconductor manufacturing equipment 100 is located fall on the semiconductor elements.

An embodiment of the present invention provides a semiconductor manufacturing apparatus 100 having a driving mechanism driving a clamping device to clamp a semiconductor element to transport the semiconductor element between a loading chamber and a processing chamber. Furthermore, during the process of transporting the semiconductor components, the semiconductor manufacturing equipment 100 may include an air curtain device 500. One of the air curtain devices 500 is an air-jet module which is disposed on the clamping device and located on one side of the semiconductor device. It is configured to provide an air flow to form an air curtain adjacent to a surface of the semiconductor element. Therefore, the dust or particles adjacent to the surface of the semiconductor element will be blown away from the semiconductor element by the airflow, thereby avoiding the dust or particles from adhering to the semiconductor element, thereby improving the yield of the semiconductor element.

In addition, in some embodiments, the air curtain device 500 may further include a suction module, which is disposed on the clamping device and located on the other side of the semiconductor device. The suction module can be configured to receive dust or particles adjacent to the surface of the semiconductor element and side-by-side to the exhaust groove 507, so that the dust or particles can be further reduced to the semiconductor On the body element.

The air curtain device 500 according to the embodiment of the present invention can be disposed on any device configured to carry a semiconductor element, so whether it is in the process of transporting the semiconductor element or processing the semiconductor element (such as coating a photoresist on a wafer) Agent), the air curtain device 500 can provide an air curtain to protect the semiconductor element to prevent dust or particles from falling on the semiconductor element. Therefore, based on the design of the air curtain device 500 in the embodiment of the present invention, the semiconductor manufacturing equipment 100 having the air curtain device 500 can effectively increase the manufacturing yield of semiconductor elements.

An embodiment of the present invention provides a semiconductor manufacturing equipment including a loading chamber, a clamping device, a driving mechanism, and an air curtain device. The loading chamber is configured to store one or more semiconductor elements. The holding device is configured to hold a semiconductor element. The driving mechanism is connected to the clamping device, and the driving mechanism is configured to drive the clamping device to transport at least one semiconductor device between the loading chamber and a processing chamber. The air curtain device is disposed on the clamping device, and the air curtain device is configured to provide an air flow to form an air curtain adjacent to a surface of the semiconductor device.

According to some embodiments, the clamping device has a first side structure and a second side structure, and the air curtain device includes at least one air-jet module, which is disposed on the first side structure and ejects airflow toward the second side structure.

According to some embodiments, the air curtain device further includes an air suction module, which is disposed on the second side structure and configured to receive the airflow ejected by the air jet module. The air-injection module and the air-intake module have an elongated structure corresponding to the shapes of the first side structure and the second side structure of the clamping device, respectively.

According to some embodiments, the air curtain device includes a plurality of air-jet modules and a plurality of air-intake modules, which are arranged in a staggered arrangement on the first side structure to And a second side structure, and the suction module is configured to receive the airflow sprayed by the air-jet module respectively.

According to some embodiments, the air-jet module has a frame, a base, a first flow channel and a second flow channel. The frame is buried in the clamping device. The base is movably disposed in the frame, and the base has a first opening and a second opening. The first flow channel is disposed in the base. One end of the first flow channel is connected to the first opening and the other end is connected to a gas supply source. The second flow channel is disposed in the base, one end of the second flow channel is connected to the second opening, and the other end of the second flow channel is connected to the first flow channel.

According to some embodiments, the air-jet module further includes an elastic element. The elastic element is disposed between a bottom of the base and the frame. The elastic element is configured to provide a tensile force to drive the base to move toward the frame.

According to some embodiments, the suction module has a frame, a base, a third flow channel and a fourth flow channel. The frame is buried in the clamping device. The base is movably disposed in the frame, and the base has a third opening and a fourth opening. The third flow channel is disposed in the base, and one end of the third flow channel is connected to the third opening, and the third opening is configured to receive the airflow ejected from the air-jet module. The fourth flow channel is disposed in the base. One end of the fourth flow channel is connected to the fourth opening, and the other end of the fourth flow channel is connected to a gas supply source.

According to some embodiments, the base includes a blocking portion, and the suction module further includes an elastic element disposed between the blocking portion and the frame.

An embodiment of the present invention further provides an air curtain device including an air-jet module and a gas supply source. The air-jet module includes a frame, a base, a first flow channel and a second flow channel. The base is mounted on the frame in a movable manner Inside, the base has a first opening and a second opening. The first flow channel is disposed in the base, and one end of the first flow channel is communicated with the first opening. The second flow channel is disposed in the base, one end of the second flow channel is connected to the second opening, and the other end of the second flow channel is connected to the first flow channel. The gas supply source is connected to the first flow channel and the second flow channel and is configured to provide a gas, wherein the gas system is ejected in a second direction through the second flow channel and the second opening, thereby generating a lifting force to drive the base toward a first direction It moves relative to the frame, and the gas system is ejected in a third direction through the first flow channel and the first opening. The first direction is substantially opposite to the second direction, and the third direction is different from the first direction and the second direction.

An embodiment of the present invention further provides a method for protecting a semiconductor device, which includes holding a semiconductor device with a clamping device for transferring from a loading chamber to a processing chamber and / or from the processing chamber to the loading chamber. In addition, the method for protecting a semiconductor element further includes providing an airflow on the clamping device when the semiconductor element is transferred between the loading chamber and the processing chamber to form an air curtain adjacent to a surface of the semiconductor element.

Although the embodiments and their advantages have been described in detail above, it should be understood that various changes, substitutions and modifications can be made to the present disclosure without departing from the spirit and scope of the present disclosure limited by the scope of the attached patent application. Furthermore, the scope of the application is not intended to be limited to the specific embodiments of the processes, machines, manufacturing, substances, tools, methods, and procedures described in the specification. As a person of ordinary skill in the art will readily understand from this disclosure, according to this disclosure, existing or to be developed in the future can be used to perform basically the same functions or implement the same as the corresponding embodiments described in this disclosure. The result of a process, machine, manufacturing, material composition, tool, method, or step. Therefore, the scope of the attached patent application These processes, machines, manufacturing, compositions, tools, methods or steps are intended to be within their scope. In addition, each patent application scope constitutes a separate embodiment, and the combination of different patent application scopes and embodiments is within the scope of this disclosure.

Claims (10)

A semiconductor manufacturing equipment includes: a loading chamber configured to store one or more semiconductor components; a clamping device configured to clamp the semiconductor component; a driving mechanism connected to the clamping device, the driving mechanism is configured To drive the clamping device to transport at least one semiconductor element between the loading chamber and a processing chamber; and an air curtain device disposed on the clamping device, the air curtain device is configured to provide an air flow to form An air curtain is adjacent to a surface of the semiconductor element. The semiconductor manufacturing equipment according to item 1 of the scope of patent application, wherein the clamping device has a first side structure and a second side structure, and the air curtain device includes at least one air-jet module and is disposed on the first The side structure emits the airflow toward the second side structure. The semiconductor manufacturing equipment according to item 2 of the scope of the patent application, wherein the air curtain device further includes an air suction module, which is arranged on the second side structure and configured to receive the air flow ejected by the air jet module; wherein the air jet The module and the suction module have an elongated structure corresponding to the shapes of the first side structure and the second side structure of the clamping device, respectively. The semiconductor manufacturing equipment according to item 2 of the scope of patent application, wherein the air curtain device includes a plurality of air-jet modules and a plurality of air-intake modules, and are arranged in a staggered arrangement on the first side structure and the second side Structure, and the suction modules are configured to respectively receive the airflow ejected by the air-jet modules. The semiconductor manufacturing equipment according to any one of claims 2 to 4, wherein the air-jet module has: a frame body embedded in the clamping device; and a base provided in a movable manner in the Within the frame, the base has a first opening and a second opening; a first flow channel is disposed in the base, one end of the first flow channel communicates with the first opening and the other end communicates with a gas supply A source; and a second flow path disposed in the base, one end of the second flow path is connected to the second opening, and the other end of the second flow path is connected to the first flow path. The semiconductor manufacturing equipment according to item 5 of the scope of patent application, wherein the air-jet module further includes: an elastic element disposed between a bottom of the base and the frame, and the elastic element is configured to provide stretching Force to drive the base toward the frame. The semiconductor manufacturing equipment according to any one of claims 3 to 4, wherein the suction module has: a frame body embedded in the clamping device; and a base provided in a movable manner Within the frame, the base has a third opening and a fourth opening; a third flow passage is disposed in the base, and one end of the third flow passage is communicated with the third opening, and the third The opening is configured to receive the airflow ejected from the air-jet module; and a fourth flow path is disposed in the base, one end of the fourth flow path communicates with the fourth opening, and the other end of the fourth flow path Connected to a gas supply source. The semiconductor manufacturing equipment according to item 7 of the scope of patent application, wherein the base includes a stopper, and the suction module further includes an elastic element disposed between the stopper and the frame. An air curtain device includes: an air-jet module including: a frame body; a base disposed in the frame in a movable manner, the base having a first opening and a second opening; a first flow channel Is disposed in the base, one end of the first flow channel communicates with the first opening; a second flow channel is disposed in the base, one end of the second flow channel communicates with the second opening, and the The other end of the second flow channel is connected to the first flow channel; and a gas supply source is connected to the first flow channel and the second flow channel, and is configured to provide a gas, wherein the gas system communicates with the flow channel through the second flow channel. The second opening is ejected in a second direction, thereby generating a lifting force to drive the base to move relative to the frame in a first direction, and the gas system is ejected in a third direction through the first flow channel and the first opening; The first direction is substantially opposite to the second direction, and the third direction is different from the first direction and the second direction. A method for protecting a semiconductor device, comprising: holding a semiconductor device by a holding device for transferring from a loading chamber to a processing chamber and / or from the processing chamber to the loading chamber; and when the When the semiconductor device is transported between the loading chamber and the processing chamber, an air flow is provided on an air curtain device disposed on the clamping device to form an air curtain adjacent to a surface of the semiconductor device.