TWI661176B - Three-dimensional measurement device, three-dimensional measurement method, and manufacturing method of substrate - Google Patents

Abstract

Provided is a method for improving the measurement accuracy of photometric stereo photography. Dimensional measurement device, etc.

The three-dimensional measuring device includes a height measuring unit and a three-dimensional shape measuring device. Fixed part and correction part. The height measurement unit is configured to measure a height or a height displacement of a predetermined position of a measurement object. The three-dimensional shape measurement unit is configured to measure the three-dimensional shape of the measurement object by a photometric stereography method. The correction unit is configured to correct data obtained by the three-dimensional shape measurement unit based on data obtained by the height measurement unit.

Description

Three-dimensional measurement device, three-dimensional measurement method, and manufacturing method of substrate Field of invention

This technology relates to a technology such as a three-dimensional measurement device for measuring a three-dimensional shape of a measurement object.

Background of the invention

Conventionally, there is a method for measuring a three-dimensional shape using a photometric stereo method (Photometric Stereo). In the photometric stereography method, first, the measurement object is irradiated with light in turn by three or more illuminations having different light irradiation directions. Each time the illumination is switched, the measurement object is imaged by the imaging unit. Next, based on three or more images obtained by the imaging unit, a normal direction at each point on the surface of the measurement target is obtained as a normal map.

Thereby, the measurement object can be measured in three dimensions. Among them, if there are three or more images captured by light with different irradiation directions on the measurement object, the three-dimensional shape of the measurement object can be measured using photometric stereography.

Patent Document 1 discloses an appearance inspection device for inspecting the appearance of a substrate on which a solder material is printed or a substrate on which electronic components are mounted using a photometric stereography method.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-237034

Summary of invention

Generally, when the photometric stereography method is applied, it is conditional that diffuse reflection (Lambertian reflectance) is performed on the measurement surface of the measurement object and that the shape changes linearly. The further the morphology of the measurement surface is from this condition, the greater the error in the measurement data caused by the photometric stereography method.

An object of the present technology is to provide a three-dimensional measurement device and the like that can improve the measurement accuracy using a photometric stereophotography method.

To achieve the above object, the three-dimensional measurement device of the present technology includes a height measurement section, a three-dimensional shape measurement section, and a correction section.

The height measurement unit is configured to measure a height or a height displacement of a predetermined position of a measurement object.

The three-dimensional shape measurement unit is configured to measure the three-dimensional shape of the measurement object by a photometric stereography method.

The correction unit is configured to correct data obtained by the three-dimensional shape measurement unit based on data obtained by the height measurement unit.

This three-dimensional measurement device is based on the high-accuracy data obtained by the height measurement unit, and compensates for the photometric stereo photography method. The data obtained by the measurement can improve the measurement accuracy by the photometric stereo method.

The three-dimensional shape measurement unit may include a photometric stereo image acquisition unit configured to use a camera element to measure an object including light that is individually irradiated by three or more light sources. An area of an object is photographed to obtain three or more images. Thereby, the measurement of the three-dimensional shape by the photometric stereography method can be performed.

The three-dimensional measurement device may further include an image processing unit.

The image acquisition unit may be configured to capture the measurement object including the measurement object by using the imaging element to capture the measurement object that is irradiated with light including an irradiation direction by the three or more light sources. image.

The image processing unit may be configured to capture a plurality of regions in the image including the measurement object obtained by the image acquisition unit. The image processing unit can divide an image including a measurement object into a plurality of regions, and can perform measurement by the height measurement unit and / or the three-dimensional shape measurement unit based on these regions, thereby improving measurement accuracy.

The height measurement unit may measure the height of the measurement object along a line crossing the plurality of regions obtained by the image processing unit. Among them, if there are more than two points as the measurement points, a line segment can be formed, and if there are more than three points as the measurement points, a surface can be formed, so the accuracy can be further improved.

The three-dimensional shape measurement unit may For each area captured by the image processing unit, the aforementioned three-dimensional shape is measured.

The correction unit may correct the data obtained by the three-dimensional shape measurement unit based on a difference between the data obtained by the height measurement unit and the data obtained by the three-dimensional shape measurement unit. With this, the correction unit can obtain an error between the data obtained by the height measurement unit and the data obtained by the three-dimensional shape measurement unit, and correct the error based on the error.

The correction unit may remove the difference from the data obtained by the three-dimensional shape measurement unit.

The height measurement unit may include a displacement meter. By using a displacement meter, the accuracy of measurement by the height measuring section is improved.

A three-dimensional measurement device according to another aspect of the present technology includes three or more light sources, an image sensor, a height measurement section, a three-dimensional shape measurement section, and a correction section.

Next, the imaging element is capable of capturing an object to be measured.

Next, the height measurement unit is configured to measure a height or a height displacement of a predetermined position of the measurement object.

Next, the three-dimensional shape measurement unit is configured to measure the three-dimensional shape of the measurement target by a photometric stereo photographic method using the three or more light sources and the imaging element. Next, the correction unit is configured to correct the data obtained by the three-dimensional shape measurement unit based on the data obtained by the height measurement unit.

The three-dimensional measurement device may further include: a holding portion that holds a substrate as the measurement object; and a support portion that is disposed. The holding portion integrally supports the imaging element and the three or more light sources; and a moving mechanism that relatively moves the holding portion and the supporting portion.

The three-dimensional measurement method of the present technique includes measuring a height or a height displacement of a predetermined position of a measurement object.

Next, the three-dimensional shape of the measurement object is measured by a photometric stereography method.

Next, based on the data obtained by measuring the height or the height displacement, the data obtained by measuring the three-dimensional shape is corrected.

The program used in this technology to perform three-dimensional measurement is to make the three-dimensional measurement device perform the following steps. These steps are a step of measuring the height or displacement of a predetermined position of the measurement object; a step of measuring the three-dimensional shape of the measurement object by a photometric stereo method; and Data, a step of correcting the data obtained by measuring the three-dimensional shape described above.

The manufacturing method of the substrate of the present technology is to include a component on a substrate, mount a component, or form a solder.

The height or the height displacement of a predetermined position of the component or the solder on the substrate is measured.

Next, the three-dimensional shape of the aforementioned part or welding material is measured by a photometric stereography method.

Next, based on the data obtained by measuring the height or the height displacement, the data obtained by measuring the three-dimensional shape is corrected.

As described above, with this technology, the measurement accuracy using the photometric stereo method can be improved.

However, the effects described herein are not necessarily limited, and may be any effects described in this disclosure.

1‧‧‧ substrate

3‧‧‧ alignment mark

10‧‧‧Transportation Department

11‧‧‧Guide

12‧‧‧foot

13‧‧‧ conveyor belt

15‧‧‧Control Department

16‧‧‧Image Processing Department

17‧‧‧Image Memory

20‧‧‧ spare

21‧‧‧spare board

22‧‧‧Support sales

30‧‧‧ camera unit

31‧‧‧ camera element

32‧‧‧Lighting Department

32a‧‧‧dome

32b‧‧‧lighting

33‧‧‧laser displacement meter

40‧‧‧ mobile agency

100‧‧‧Inspection device

PA‧‧‧Photographing area

P1‧‧‧Mounting surface

P2‧‧‧Electronic parts

FIG. 1 is a perspective view showing an inspection device to which a three-dimensional measurement device of the present technology is applied.

FIG. 2 is a view of the inspection device shown in FIG. 1 when viewed from a conveyance direction of a mounting substrate.

FIG. 3 is a schematic diagram of an imaging unit viewed in the Z direction.

FIG. 4 is a block diagram showing an electrical configuration of a functional inspection device.

FIG. 5 is a flowchart showing operations performed by the inspection device.

FIG. 6 shows an example of an imaging area obtained by an imaging element.

FIG. 7 is a diagram for explaining classification of regions in the image captured in step 106.

FIG. 8 shows the relationship between the measurement surface of the measurement object and the coordinate system of the space.

FIG. 9 is a graph showing data obtained using gradient field data calculated by a photometric stereo method.

FIG. 10 is a graph showing data obtained from corrected gradient field data.

Forms used to implement the invention

Hereinafter, embodiments of the present technology will be described with reference to the drawings.

1. Structure of inspection device to which three-dimensional measurement device is applied

1) Configuration of inspection device

FIG. 1 is a perspective view showing an inspection device to which a three-dimensional measurement device of the present technology is applied. FIG. 2 is a diagram of the inspection device 100 shown in FIG. 1 when viewed from the conveyance direction of the mounting substrate.

The inspection apparatus 100 is an apparatus that inspects a mounting state of an electronic component on a substrate after the electronic component is mounted on a substrate such as a mounting substrate by a mounting machine.

The inspection apparatus 100 includes a transfer unit 10 that transfers a substrate 1 in a transfer direction (X direction) and stops the transferred substrate 1 at a predetermined position. The inspection apparatus 100 is a backup unit 20 having a substrate 1 that is stopped at a stop target position by being supported from below.

The inspection device 100 includes an imaging unit 30 and a moving mechanism 40 that moves the imaging unit 30 in the X and Y directions. The imaging unit 30 includes an illumination unit 32 that irradiates light to the substrate 1 supported by the spare unit 20. And an imaging element 31 that images the substrate 1 irradiated with light.

The substrate 1 to be an inspection target obtained by the inspection device 100 has a rectangular shape in a plan view, for example. The substrate 1 is provided with a plurality of alignment marks 3 (see FIG. 1). FIG. 1 shows an example of a case where the alignment mark 3 is provided near the corner of the diagonal line of the substrate 1.

The transfer unit 10 includes two guides 11 that sandwich the substrate 1 on both sides and guide the substrate 1 in the transfer direction. Each guide 11 is a plate-shaped member having a shape elongated in the conveying direction of the substrate 1. A plurality of leg portions 12 are respectively provided below the guides 11 to support the guides 11 below. Each guide Reference numeral 11 denotes a base (not shown) mounted on the inspection apparatus 100 through the leg portion 12.

The backup unit 20 includes a backup plate 21 configured to be movable up and down, and a plurality of support pins 22 erected on the backup plate 21.

Conveyor belts 13 that can rotate forward and backward are provided on the inner side surfaces of each guide 11. The transfer unit 10 can drive the substrate 1 to a predetermined position (a position where the standby unit 20 is disposed) for carrying out inspection processing by the drive of the conveyor belt 13 or to carry out the substrate 1 after the inspection has been completed.

Each guide 11 is formed so that an upper end portion may be bent toward the inside. The upper end portion of the guide 11 is when the substrate 1 is moved upward by the standby portion 20, and the substrate 1 is abutted to the upper side, so that both sides of the substrate 1 can be clamped by the upper end portion and the standby portion 20. Thereby, the board | substrate 1 is hold | maintained, and the inspection process by the imaging unit 30 is performed in the hold | maintained state. At this time, the transfer section 10 or the standby section 20 functions as a “holding section” that holds a substrate.

FIG. 3 is a schematic diagram of the imaging unit 30 viewed in the Z direction. The illumination unit 32 of the imaging unit 30 includes a dome-shaped dome member 32a with an opening formed on the top thereof, and three or more illuminations (light sources) 32b arranged inside the dome member 32a. One illumination 32b is configured by, for example, one or a plurality of LEDs (Light Emitting Diodes). The illumination 32 b is provided, for example, eight, and is arranged on a circumference centered on the main optical axis (Z direction) of the imaging unit 30. The illuminations 32b are provided at regular angular intervals, for example.

The dome member 32 a functions as a “support section” that integrally supports the imaging element 31 and the plurality of illuminations 32 b.

The imaging element 31 is fixed on the upper side of the dome member 32 a of the lighting unit 32 at a position provided in the opening of the dome member 32 a, and is arranged so that its main optical axis is perpendicular to the inspection surface of the substrate 1. The imaging element 31 is an optical system including an CCD sensor (CCD: Charge Coupled Device), a CMOS sensor (CMOS: Complementary Metal Oxide Semiconductor), and an imaging system such as an imaging lens. .

The imaging element 31 images the alignment mark 3 on the substrate 1 or images the inspection surface of the substrate 1 according to the control of the control unit 15 described later. The imaging area of the imaging element 31 is formed to be, for example, about 35 mm × 35 mm. When the inspection surface of the substrate 1 is imaged by the imaging element 31, the imaging element 31 is moved in the X and Y axis directions by the moving mechanism 40, and the area on the substrate 1 that must be inspected is divided into a plurality of times Video. The imaging element 31 is used in the three-dimensional measurement of a measurement target to be described later, as described later.

In the example shown in the figure, the number of the imaging units 30 is one, but the number of the imaging units 30 may be two or more.

The inspection apparatus 100 includes a laser displacement meter 33 provided so as to be movable integrally with the imaging unit 30. For example, the laser displacement meter 33 is mounted on the side of the imaging element 31. The laser displacement meter 33 measures a height or a height displacement of a predetermined position of an electronic component as a measurement target on the substrate 1.

2) Electrical configuration of the inspection device

FIG. 4 is a block diagram showing the electrical configuration of the functional inspection device 100.

The inspection apparatus 100 includes a control unit 15, an image processing unit 16, and an image memory unit 17. The inspection device 100 includes the moving mechanism 40, a laser displacement meter 33, an imaging element 31, and an illumination unit 32.

The image processing unit 16 processes the image on the substrate 1 obtained by the imaging element 31 in accordance with the control performed by the control unit 15. The image storage unit 17 stores image data processed by the image processing unit 16.

The control unit 15 is provided with at least hardware such as a CPU (Central Processing Unit, Central Processing Unit), RAM (Random Access Memory, Random Access Memory), and ROM (Read Only Memory). Body elements. The control unit 15 can also use PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array), other ASIC (Application Specific Integrated Circuit) And other components to achieve.

The control unit 15 can turn on and off the plurality of illuminations 32b individually. The control unit 15 may light up at least one of the lightings 32b, for example, or may light up all eight lightings 32b at the same time.

2. Check the operation of the device

FIG. 5 is a flowchart showing operations performed by the inspection apparatus 100 as part of a method of manufacturing a substrate.

The control unit 15 moves the imaging unit 30 to the substrate 1 carried in by the carrying unit 10, and images the alignment marks on the substrate 1 by the imaging element 31. Thereby, the substrate 1 and the imaging unit 30 are relatively positioned (step 101). Thereby, it is decided that the seat to be unified in the system of the inspection apparatus 100 Superscript system.

The control unit 15 turns on the lights 32b one by one individually, and uses the imaging element 31 located at a certain position to take a picture of a predetermined area on the substrate 1 each time the lighting is switched (step 102).

The predetermined area (photographing area PA) is, as shown in FIG. 6, an area including, for example, one or more electronic components P2 to be measured, which is mounted on the mounting surface P1 of the substrate 1.

If there are a plurality of electronic parts to be measured, there may be a case where the imaging area PA is plural in response to this. Alternatively, the imaging element 31 may photograph one area including a plurality of electronic components P2 as one imaging area PA, and may also photograph the entire substrate 1 as one imaging area PA. That is, the imaging area PA can be appropriately set by the number, size, arrangement of the electronic components to be measured, and the viewing angle or resolution of the imaging element 31.

In step 102, the control unit 15 acquires images of eight imaging areas PA of the measurement object caused by light in eight different directions (step 103). For convenience of explanation, the plurality of images are referred to as "image A" below. The plurality of (8) images are used in calculations for three-dimensional shape determination by photometric stereography. At this time, the control unit 15 functions as a "photometric stereo image acquisition unit".

The control unit 15 transmits the captured image A to the image storage unit 17 through the image processing unit 16. The image A may be a color image or a grayscale image.

In addition, the control unit 15 is in a state where all the illuminations 32b are turned on, That is, in a state where the light in the irradiation direction including the eight illuminations 32b is irradiated on the measurement object, the measurement object is photographed using the imaging element 31 (step 104). Accordingly, the control unit 15 acquires one image of the imaging area PA including the measurement target (step 105). In this case, the control unit 15 functions as an "image acquisition unit". For the sake of convenience, this image is referred to as "Image B".

The image B is not necessarily an image obtained by the irradiation of all eight illuminations 32b, but may also be an image of a predetermined number of illuminations 32b among eight out of which is located at a point-symmetrical position centered on the optical axis. The resulting image is illuminated.

The control unit 15 stores the captured image B in the image storage unit 17 through the image processing unit 16. The image B may be a color image or a grayscale image, and it is preferable to form the same as those of the image A.

The control unit 15 analyzes the image B by the image processing unit 16. FIG. 6 is an example of an image (for example, image B) in which a predetermined area (shooting area PA) is displayed as described above. In this example, the electronic component P2 is a passive element such as a resistor. The image processing unit 16 extracts a plurality of regions from the image B by edge processing or the like based on the pixel values (brightness values) of the image B (step 106). The plurality of areas are areas that are distinguished by the materials of the objects located in the imaging area PA. That is, depending on the material, the reflectance of the illumination light and the reflection form of the reflection direction are different.

FIG. 7 is a diagram for explaining the classification of the regions obtained in step 106. The area (1) is the surface (mounting surface) P1 of the substrate 1, and the areas (2) and (4) are electrode portions of the electronic component P2, and the area (3) is a resin mounting body of the electronic component P2. unit.

Next, the control unit 15 controls the operation of the moving mechanism 40 to make the laser displacement meter supported by the imaging unit 30 traverse the captured areas (1) to (4). 33 moves.

The control unit 15 measures the height of the electronic component P2 from the mounting surface P1 using the laser displacement meter 33 while scanning the laser displacement meter 33 as described above (step 107). That is, the control unit 15 measures the height (ie, the height displacement) of the electronic component P2. At this time, the laser displacement meter 33 and the control unit 15 function as a "height measuring unit".

FIG. 8 shows the relationship between the measurement surface R of the measurement object and the coordinate system of the space. The control unit 15 generates a gradient field C (p, q) for each of these regions using the photometric stereo photography method for each of the regions captured in step 106 (step 108). p = δz / δx, q = δz / δy. At this time, at least the control unit 15 functions as a “three-dimensional shape measurement unit”.

Specifically, the control unit 15 uses the known relative position of each of the illuminations 32b and the irradiation direction obtained by the known each of the illuminations 32b, according to the brightness in each of the captured regions (1) to (4). For each of these areas, p = δz / δx and q = δz / δy are calculated. The measurement point is, for example, a line segment shown in FIG. 7 and is formed into at least one point (pixel) for each region.

The data of the gradient fields p and q obtained in step 108 indicates the shape of the electronic component P2 including the mounting surface P1. FIG. 9 is a graph showing data from the gradient fields p, q. The curved shape has a shape corresponding to each of the regions (1) to (4).

Next, the control unit 15 is based on the data obtained by the laser displacement meter 33. It is expected that the gradient fields p and q are corrected (step 109). At this time, the control unit 15 functions as a "correction unit". The measured data (pm, qm) obtained by the laser displacement meter 33 on the line shown in FIG. 7 that is divided for each area will be obtained, and the difference between the measured data (pm, qm) and the corresponding gradient field (p, q) The set of (error) persons is respectively (ep, eq) (refer to the following formula). n is the number of measurements, that is, the number of measurement points.

[Number 1] _{ep 1..n = p (x 1..n,} y 1..n) - pm (x 1..n, y 1..n) eq 1..n = q (x 1. _.n , y _1..n ) -qm ( x _1..n , y _1..n )

The approximate expressions calculated from the point sequences ep1..n and eq1..n are respectively set to e (x) and e (y), and the control unit 15 uses the following formula to perform the gradient field C (p, q). Correction. Let the corrected gradient fields be pf and qf. That is, the corrected gradient fields pf and qf are values representing the measurement data of the three-dimensional shape obtained by the photometric stereography method, and the values obtained by removing the above-mentioned errors.

[Number 2] pf ( x , y ) = p ( x , y ) -e ( x ) qf ( x , y ) = q ( x , y ) -e ( y )

An approximation method for obtaining the approximation formulas e (x) and e (y) is not particularly limited, but an average method, a bilinear method, or an n-th approximation (for example, a second-order approximation) can be applied.

The corrected gradient fields pf and qf are, for example, those shown in FIG. 10, and a curve in which height information is corrected compared with those shown in FIG. 9.

3. Conclusion

The inspection device 100 of this embodiment corrects the data obtained by the photometric stereophotography method based on the high-precision data obtained with the laser displacement meter 33, so that the measurement accuracy using the photometric stereophotography method can be improved. .

In particular, regions containing different plural kinds of materials have different reflectances respectively, so if photometric stereo photography is applied, high-precision data of three-dimensional shapes cannot be obtained. However, by using the high-precision data obtained with the laser displacement meter 33, even if the measurement object has different plural kinds of materials, the accuracy of the measurement data obtained by the photometric stereography method can be improved.

For example, compared with the method of measuring the three-dimensional shape by scanning the entire two-dimensional area using a one-dimensional laser displacement meter, the three-dimensional shape of the present embodiment can measure the three-dimensional shape at a high speed. In addition, since it is not necessary to use an expensive measuring device such as a two-dimensional laser displacement meter, the three-dimensional shape can be measured at low cost.

By applying the three-dimensional measurement method of the present technology to the inspection device 100, in addition to the inspection items obtained by the conventional inspection device 100, inspection by the three-dimensional shape measurement can also be performed. Therefore, a single inspection apparatus 100 can implement various inspection processes, and the reliability of a product can be improved.

4. Other embodiments

This technology is not limited to the embodiments described above, and various other embodiments can be realized.

The inspection device 100 of the above-mentioned embodiment is particularly one that inspects the state of the electronic components mounted on the substrate 1, but may be, for example, one that inspects the state of the solder material formed on the substrate 1. At this time, the inspection device for inspecting the state of the welding material may also use the data of the measurement of its three-dimensional shape to calculate the volume of the welding material.

The measurement object may be a passive element as described above, and this technique can be applied to various types that also include an active element.

Alternatively, the three-dimensional measurement device may be a device having a separate function of three-dimensional measurement, and the three-dimensional measurement device may be applied to the inspection device 100 instead of the three-dimensional measurement device. For example, this technology can also be applied to a three-dimensional measurement device used in the medical field or other industrial fields.

As shown in FIG. 7, the direction in which the laser displacement meter 33 is scanned is the X direction, but it may be a scanning direction including components in both the X and Y directions. Thereby, the number of measurement points can be increased, and the accuracy of calculation can be improved. Alternatively, scanning may be performed along a plurality of lines in one measurement object.

In the example shown in FIG. 6, the imaging area PA obtained by the imaging element 31 is an area including an image of one electronic component P2. However, for example, if the imaging area includes images of a plurality of electronic components, the control unit 15 may include an algorithm for scanning processing of a displacement meter corresponding to the relative arrangement, posture, or direction of the plurality of electronic components. Thereby, the time efficiency of inspection can be improved.

In the above embodiment, a laser displacement meter is used, but it may be a displacement meter using light interference, a displacement meter using ultrasonic waves, a contact type displacement meter, or the like. It is not limited to displacement meters, if there is, for example, light section method, etc. The sensor may be any device that can illuminate at least one-dimensional light onto a measurement object to detect the reflection state of the light.

The order of steps 102 (and 103) and 104 (and 105) shown in FIG. 5 may be reversed.

Alternatively, the steps 102 and 104 may be performed simultaneously while changing the wavelength of the illumination light. At this time, for example, the photography used to obtain the image A uses visible light, and the photography used to obtain the image B uses infrared light, so that these can be photographed simultaneously. In this case, the image pickup device must be provided with an image sensor capable of detecting light of these different wavelengths, respectively.

Alternatively, the image processing unit 16 may generate the image B by processing the image A obtained in step 102 (and 103). At this time, steps 104 and 105 are not required.

In the above-mentioned embodiment, the imaging unit is configured to move with respect to the substrate held by the transport unit 10, but the imaging unit may be fixed and the holding portion holding the substrate may be configured to move with respect to the imaging unit.

In the above-mentioned embodiment, the number of the illuminations 32b serving as the light source is eight, which may be at least three, or may be nine or more.

In the embodiment described above, the laser displacement meter 33 is integrally supported by the imaging unit 30, but the inspection device may be provided with a mechanism for moving these individual units.

In the above-mentioned embodiment, the height measuring section of the laser displacement meter 33 is a plurality of areas (1) to (4) crossing the electronic component to measure the height displacement. The height measurement unit may be, for example, at least 1 point for each of these areas. The height is not limited to the measurement method shown above.

Among the characteristic parts of each aspect described above, at least two characteristic parts may be combined.

This technology can also take the following configurations.

(1) A three-dimensional measurement device comprising: a height measurement unit configured to measure a height or a height displacement of a predetermined position of a measurement object; and a three-dimensional shape measurement unit configured to: The three-dimensional shape of the measurement object is measured by a photometric stereography method; and the correction unit is configured to correct the data obtained by the three-dimensional shape measurement unit based on the data obtained by the height measurement unit.

(2) The three-dimensional measurement device according to (1), wherein the three-dimensional shape measurement unit is a photometric stereo image acquisition unit, and is configured such that three or more image sensor element pairs are used. The light source individually irradiates the areas of the measurement object with light to capture three or more images.

(3) The three-dimensional measurement device according to (2), further comprising: an image acquisition unit configured to be irradiated with the imaging element pair including the light source including the three or more light sources The image of the measurement object is obtained by photographing the measurement object of the light in the irradiation direction; and an image processing unit configured to capture the measurement object including the measurement object obtained by the image acquisition unit Multiple regions within the image.

(4) The three-dimensional measurement device according to (3), wherein the height measurement unit measures a height of the measurement object along a line crossing the plurality of regions obtained by the image processing unit.

(5) The three-dimensional measurement device according to (3) or (4), wherein the three-dimensional shape measurement section measures the three-dimensional measurement for each area captured by the image processing section. Element shape.

(6) The three-dimensional measurement device according to any one of (1) to (5), wherein the correction unit is based on data obtained by the height measurement unit and data obtained by the three-dimensional shape measurement unit. The data obtained by the aforementioned three-dimensional shape measurement unit is corrected.

(7) The three-dimensional measurement device according to (6), wherein the correction unit is obtained from data obtained by the three-dimensional shape measurement unit, and the difference is removed.

(8) The three-dimensional measurement device according to any one of (1) to (7), wherein the height measurement unit includes a displacement meter.

(9) A three-dimensional measurement device including: three or more light sources; an imaging element that can photograph an object to be measured; and a height measuring unit that is configured to: The height or height displacement is measured; the three-dimensional shape measurement unit is configured to measure the three-dimensional shape of the measurement object by photometric stereo photography using the three or more light sources and the imaging element; and correction The part is configured to be obtained from the height measuring part described above. The data will be corrected based on the data obtained by the three-dimensional shape measurement section.

(10) The three-dimensional measurement device according to (9), further comprising: a holding portion that is a substrate for holding the measurement target; and a support portion that is integrally disposed on the holding portion. Ground to support the imaging element and the three or more light sources; and a moving mechanism that relatively moves the holding portion and the supporting portion.

(11) A three-dimensional measurement method for measuring a height or a height displacement of a predetermined position of a measurement object, and measuring a three-dimensional shape of the measurement object by a photometric stereo method, based on the height or the height The data obtained by the displacement measurement are corrected for the data obtained by the aforementioned three-dimensional shape measurement.

(12) A method for manufacturing a substrate, in which a component is mounted on a substrate or a solder material is formed, and a height or a displacement of a predetermined position of the component or the solder material on the substrate is measured, and a photometric stereography method is used, The three-dimensional shape of the part or welding material is measured, and the data obtained by measuring the three-dimensional shape is corrected based on the data obtained by measuring the height or height displacement.

Claims (10)

A three-dimensional measurement device includes a height measurement unit configured to measure a height or a height displacement of a predetermined position of a measurement object, and a three-dimensional shape measurement unit configured to measure the foregoing by a photometric stereo photography method. The three-dimensional shape of the measurement object; and a correction unit configured to correct the data obtained by the three-dimensional shape measurement unit based on the data obtained by the height measurement unit, and the three-dimensional shape measurement unit includes a photometric stereoscopic image The acquisition unit is configured to acquire three or more images by using an imaging element to photograph an area including a measurement object that is individually irradiated with light by three or more light sources, respectively. The three-dimensional measurement device further includes an image acquisition unit configured to use the imaging element to photograph the measurement object that is irradiated with light including an irradiation direction by the three or more light sources, whereby Obtaining an image including the measurement object; and an image processing unit configured to capture the image obtained by the image obtaining unit It said measuring comprises a plurality of regions within the image of the object. According to the three-dimensional measurement device of claim 1, wherein the height measurement unit measures a height of the measurement object along a line crossing the plurality of regions obtained by the image processing unit. According to the three-dimensional measurement device of claim 1, wherein the three-dimensional shape measurement unit measures the three-dimensional shape for each region captured by the image processing unit. For example, the three-dimensional measurement device of claim 1, wherein the correction unit is based on the difference between the data obtained by the height measurement unit and the data obtained by the three-dimensional shape measurement unit, Information is corrected. For example, the three-dimensional measurement device according to claim 4, wherein the correction unit removes the difference from the data obtained by the three-dimensional shape measurement unit. The three-dimensional measurement device according to claim 1 or 4, wherein the height measurement unit includes a displacement meter. A three-dimensional measurement device includes: three or more light sources; an imaging element capable of photographing a measurement object; and a height measurement unit configured to measure a height or a height displacement of a predetermined position of the measurement object A three-dimensional shape measurement unit configured to measure the three-dimensional shape of the measurement object by a photometric stereo method using the three or more light sources and the imaging element; and a correction unit configured to: The data obtained by the measurement unit is corrected by the data obtained by the three-dimensional shape measurement unit. The three-dimensional shape measurement unit includes a photometric stereo image acquisition unit. The photometric stereo image acquisition unit is configured by using an imaging element. The three-dimensional measurement device further includes an image acquisition unit configured to capture three or more images by photographing an area including a measurement object that is individually irradiated with light by three or more light sources. The image sensor is used to irradiate the light including the light in the irradiation direction by the three or more light sources. Given object was photographed, thereby obtaining an image including the object to be measured; and an image processing unit, configured to: retrieve the image acquisition a plurality of regions in an image of the object to be measured of the resulting unit comprises. For example, the three-dimensional measurement device of claim 7, further including: a holding portion for holding the substrate as the measurement target; a support portion arranged on the holding portion and integrally supporting the image pickup element and the three The above light source; and a moving mechanism for relatively moving the holding portion and the supporting portion. A three-dimensional measurement method is to measure the height or displacement of a predetermined position of a measurement object, determine the three-dimensional shape of the measurement object by a photometric stereography method, and obtain the measurement based on the measurement of the height or height displacement. The data is obtained by correcting the data obtained by measuring the three-dimensional shape. In the three-dimensional shape measurement, an image sensor is used for the measurement object including the measurement object that is individually irradiated with light by three or more light sources. Areas are photographed to obtain three or more images, and the imaging element is used to photograph the measurement object irradiated with light including the irradiation direction by the three or more light sources, thereby obtaining An image of the measurement object is obtained by capturing a plurality of regions in the obtained image including the measurement object. A method for manufacturing a substrate is to mount a component or form a solder on the substrate, use the component or the solder on the substrate as a measurement object, and measure the height or height displacement of a predetermined position of the measurement object. The three-dimensional shape of the measurement object is measured by a photometric stereography method, and the data obtained by measuring the three-dimensional shape is corrected based on the data obtained by measuring the height or height displacement. In the method, an imaging element is used to photograph an area including the measurement object that is individually irradiated with light by three or more light sources, thereby obtaining three or more images, and the imaging element pair is included by using The measurement object irradiated with light in the irradiation direction by the three or more light sources is photographed to obtain an image including the measurement object, and a plurality of the acquired images including the measurement object are captured. Areas.