TWI658026B - Biaryl derivative and medicine containing the same - Google Patents

Biaryl derivative and medicine containing the same Download PDF

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TWI658026B
TWI658026B TW106101537A TW106101537A TWI658026B TW I658026 B TWI658026 B TW I658026B TW 106101537 A TW106101537 A TW 106101537A TW 106101537 A TW106101537 A TW 106101537A TW I658026 B TWI658026 B TW I658026B
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dielectric ceramic
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ceramic body
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李建樺
陳瑞祥
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禾伸堂企業股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C04B35/462Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
    • C04B35/465Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
    • C04B35/468Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H01G4/1245Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Capacitors (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

本發明為有關一種耐瞬間高電壓之介電陶瓷體,該介電陶瓷體係包含第一主成份BaTiO3及第二主成份ABO3,二種主成份符合通式(100-x)BaTiO3-xABO3的配方比例(A=Sr、Sr、Ca;B=Zr、Ti),其中第二主成份ABO3較佳係SrZrO3或CaZrO3,並進一步添加至少一種副成份共同進行燒結,所形成之介電陶瓷體係含有正方晶及菱方晶同時共存之複合相結構,而此介電陶瓷體製成之電容器經測試後具有抵抗瞬間電位升冪所造成的介電破壞效果,且溫度電容表現亦符合EIA-X7R之電容器規範。 The invention relates to a dielectric ceramic body capable of withstanding transient high voltage. The dielectric ceramic system includes a first main component BaTiO 3 and a second main component ABO 3. The two main components conform to the general formula (100-x) BaTiO 3- The formula ratio of xABO 3 (A = Sr, Sr, Ca; B = Zr, Ti), wherein the second main component ABO 3 is preferably SrZrO 3 or CaZrO 3 , and further added with at least one secondary component for sintering to form The dielectric ceramic system contains a composite phase structure in which both tetragonal and rhombohedral crystals coexist. The capacitor made of this dielectric ceramic body has been tested to have a dielectric breakdown effect caused by instantaneous potential rise, and the performance of temperature capacitance It also meets the capacitor specifications of EIA-X7R.

Description

耐瞬間高電壓之介電陶瓷體 Dielectric ceramic body resistant to transient high voltage

本發明係提供一種耐瞬間高電壓之介電陶瓷體,該介電陶瓷體除了於卑金屬製程上具備抗氧化還原效果外,甚至能夠承受瞬間電位差變化的高電壓衝擊,且其製備而成的積層陶瓷電容器對於溫度也具有優異的電容穩定性,符合EIA-X7R之電容器規範。 The invention provides a dielectric ceramic body capable of withstanding transient high voltages. The dielectric ceramic body has an oxidation-reduction effect on a base metal process, and can even withstand high-voltage impact of transient potential difference changes. Multilayer ceramic capacitors also have excellent capacitance stability to temperature and meet EIA-X7R capacitor specifications.

按,美國電子工業協會(Electronic Industries Association,EIA)依據電容器不同使用範圍及電氣特性,將電容器歸納作ClassI溫度補償型電容及ClassⅡ中高介電值型電容(如第一圖所示)。若電容器歸類於CaseⅡ者,則具有相對較高介電常數(Dielectric constant,K),甚至能夠較輕易製作成高電容值的電容器。然而,任何一種電容器種類應用於電子元件迴路設計時,複雜電場訊號將會在電壓及電能量驅使下積極地干擾電子迴路上之各部件。因電容器具有良好絕緣特性及可承受高電壓波動之功能,故常在迴路中加裝電容器作為保護裝置來吸收這突發性之電子信號。具體而言,若觀察市售電容器產品,其產品承認書會記載此項電容器產品所能承受的電壓限制,但常見情況係縱使未超過承認書所記載電壓限制,電容器卻仍然持續發生故障失效,歸 納原因係市售電容器出廠時所測得之承諾耐電壓值與工作環境所產生瞬間電壓值彼此不同所致。以相同量測電壓為例,當瞬間升電壓速率非常迅速時,特別係使用直流電者,電容器存在於介電材料內的缺陷會受到瞬間高電場能量驅使作用繼而引發介電崩潰現象。 According to the American Electronics Industry Association (EIA), capacitors are classified as Class I temperature-compensated capacitors and Class II medium- and high-dielectric capacitors (as shown in the first figure) according to the different use ranges and electrical characteristics of capacitors. If the capacitor is classified as Case II, it has a relatively high dielectric constant (K), and can even be easily made into a capacitor with a high capacitance value. However, when any kind of capacitor is used in the design of electronic component circuits, complex electric field signals will actively interfere with components on the electronic circuit under the driving of voltage and electrical energy. Capacitors have good insulation characteristics and can withstand high voltage fluctuations, so capacitors are often installed in the circuit as a protection device to absorb this sudden electronic signal. Specifically, if you look at commercially available capacitor products, the product approval document will record the voltage limit that the capacitor product can withstand, but the common situation is that the capacitor continues to fail even if the voltage limit recorded in the approval document is not exceeded. Return The nano-cause is caused by the fact that the promised withstand voltage value measured at the time of shipment from the factory and the instantaneous voltage value generated by the working environment are different from each other. Taking the same measured voltage as an example, when the instantaneous voltage rise rate is very fast, especially those who use direct current, the defects existing in the dielectric material of the capacitor will be driven by the instantaneous high electric field energy and then cause the dielectric collapse phenomenon.

關於介電材料內的缺陷,無論係缺陷形式或缺陷濃度普遍均係受到材料組成及燒結製程的影響。例如:市售的積層陶瓷電容器產品,基於製造成本考量,許多製造商會選擇以卑金屬電極製程(Base-Metal-Electrode,BME)作生產。卑金屬電極成本便宜卻於製造程序容易發生燒結後氧空缺及自由電子等缺陷濃度增加的問題,縱使係透過還原氣氛燒結後的再氧化熱處理亦無法完全杜絕氧空缺及自由電子等缺陷,而這些缺陷會使市售積層陶瓷電容器產品降低絕緣特性,甚至造成產品可靠度下降。因此,習知技藝陸續發展出添加副成份來改善絕緣特性的問題,但材料內部所殘留的燒結後缺陷仍然無法完全克服,故對於瞬間高電壓或高能量的衝擊,例如:雷擊或突波,其所引發的電容器產品失效問題仍然苦無對策。再者,電容器可用於抗雷擊或抗突波者,常見係將複數個電容器彼此串聯起來,藉以共同強化電位急促升幂時的耐受能力,藉以彌補單體電容器本質上抗瞬間電壓能力的不足。然而,複數個電容器彼此串聯時,任一個單體電容器亦可能發生失效,繼而再次引發單體電容器彼此間某些程度的電流導通,故如何提高單體電容器耐瞬間高電壓的能力成為重要課題。 Regarding defects in dielectric materials, regardless of the defect form or defect concentration, they are generally affected by the material composition and sintering process. For example, commercially available multilayer ceramic capacitor products, based on manufacturing cost considerations, many manufacturers will choose to use Base-Metal-Electrode (BME) for production. Low-cost base electrodes are cheap, but in the manufacturing process, defects such as oxygen vacancies and free electrons increase after sintering. Even if the reoxidation heat treatment after sintering through a reducing atmosphere cannot completely eliminate defects such as oxygen vacancies and free electrons, these Defects will reduce the insulation characteristics of commercially available multilayer ceramic capacitor products, and even reduce the reliability of the product. Therefore, the conventional technique has gradually developed the problem of adding auxiliary components to improve the insulation characteristics, but the residual sintering defects inside the material still cannot be completely overcome. Therefore, for transient high voltage or high energy impacts, such as lightning strikes or surges, The failure of capacitor products caused by it still has no countermeasures. In addition, capacitors can be used for anti-lightning or anti-surge. Commonly, a plurality of capacitors are connected in series with each other to jointly strengthen the resistance ability when the potential is rapidly raised, so as to make up for the lack of the ability of the single capacitor to resist the transient voltage. . However, when a plurality of capacitors are connected in series, any single capacitor may also fail, and then cause some degree of current conduction between the single capacitors. Therefore, how to improve the ability of the single capacitors to withstand transient high voltage has become an important issue.

又,瞬間高電壓或高電場的衝擊亦可能造成電子迴路系統內環境溫度的急遽上升。如果電容器幸運地承受住瞬間高電壓的破壞或介 電崩潰,電容器亦可能耐受不住高溫對電容值的衰減影響,故真正要解決的課題應更進一步地涵括如何使電容值表現維持溫和或避免劇烈波動。然而,如前述美國電子工業協會對電容器分類的敘述,關於ClassI溫度補償型電容及ClassⅡ中高介電值型電容,其於本質架構、發展目的及方案設計初期就已經透露予本領域技術人員,任何電容器係沒有兩全其美的結果,所以倘若欲發展兼具高溫電容表現及抗瞬間電壓破壞能力的電容產品等於啟動一場嚴峻的產品跨界挑戰。 In addition, the impact of transient high voltage or high electric field may cause the ambient temperature in the electronic circuit system to rise sharply. If the capacitor is fortunate enough to withstand transient high voltage damage or dielectric If the capacitor collapses, the capacitor may not be able to withstand the damping effect of high temperature on the capacitor. Therefore, the issues to be solved should further include how to maintain the performance of the capacitor to be gentle or to avoid sharp fluctuations. However, as described in the previous description of capacitor classification by the American Electronics Industry Association, Class I temperature-compensated capacitors and Class II medium- and high-dielectric capacitors have been disclosed to those skilled in the art at the initial structure, development purpose, and scheme design stage. Any Capacitor systems do not have the best of both worlds, so if you want to develop a capacitor product that has both high temperature capacitor performance and resistance to transient voltage damage, it is equivalent to launching a severe product cross-border challenge.

近似之習知技藝,例如:日本專利特開2004-107200,其揭露一種可配合卑金屬製程的介電陶瓷組成物配方,該組成配方於燒結製程時將於晶界相中均勻地形成M4R6O(SiO4)6結晶析出物(M係選自鹼土族元素至少一種;R係選自稀土族元素至少一種),而它係提高抗電壓破壞及溫度特性的關鍵因素。又,數年後另發現有一習知技藝,例如:中華民國專利公開號第200846299號,其開始沿續前述日本專利特開2004-107200所揭露技術作進一步改良,先將M4R6O(SiO4)6複合氧化物改作成組成物原料之一,再透過其它副成份的特殊調合始進行燒結程序,此舉依據文獻記載可改善前述日本專利技術所製成的產品壽命不足及產品可靠度問題。然而,觀察前述各習知技藝有關M4R6O(SiO4)6複合氧化物的技術方案,唯一缺憾係這種含矽的氧化物由於析出物組成的本質特性,對於電容器整體的溫度電容變化表現僅能達到EIA-X5R規範水平,沒有辦法再更進一步地突破。換言之,習知技藝僅暗示此場嚴峻的產品跨界挑戰,從結晶析出物尋找方向或許係一種可行策略,但本領域技術人員得另外再尋找其它新種類結晶 析出物或新組成配方才能夠更進一步地去改善電容器產品。 Similar conventional techniques, for example, Japanese Patent Laid-Open No. 2004-107200, which discloses a dielectric ceramic composition formula that can be used in the base metal process. This composition formula will uniformly form M 4 in the grain boundary phase during the sintering process. R 6 O (SiO 4 ) 6 crystal precipitates (M is selected from at least one element of the alkaline earth group; R is selected from at least one element of the rare earth group), and it is a key factor for improving resistance to voltage breakdown and temperature characteristics. In addition, a few years later, there was another learned technique, such as: Republic of China Patent Publication No. 200846299, which began to further improve the technology disclosed in the aforementioned Japanese Patent Laid-Open No. 2004-107200. First, M 4 R 6 O ( The SiO 4 ) 6 composite oxide is converted into one of the raw materials of the composition, and then the sintering process is started through the special blending of other sub-components. This can improve the lack of product life and product reliability made by the aforementioned Japanese patent technology based on documentary records. problem. However, when observing the technical solutions of the M 4 R 6 O (SiO 4 ) 6 composite oxides of the above-mentioned conventional techniques, the only drawback is that the essential properties of this silicon-containing oxide due to the composition of the precipitate are important for the overall temperature and capacitance of the capacitor. The change performance can only reach the EIA-X5R specification level, and there is no way to make further breakthroughs. In other words, the know-how only hints at this severe product cross-border challenge. Finding directions from crystalline precipitates may be a feasible strategy, but those skilled in the art must find other new kinds of crystalline precipitates or new composition formulas in order to be able to be more effective. Further improve capacitor products.

是以,如何發展一種積層陶瓷電容器當承受瞬間高電壓或高能量所產生衝擊時,繼而不引發介電崩潰問題,即為從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to develop a multilayer ceramic capacitor that does not cause a dielectric breakdown problem when subjected to transient high-voltage or high-energy shocks, is the direction that related manufacturers in this industry are eager to study and improve.

故,發明人有鑑於上述之問題與缺失,乃搜集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種複合相結構的耐瞬間高電壓之介電陶瓷體。除了具有良好的耐高電壓能力外,更可以抵抗電能量或電位突然瞬間升冪所引發的介電崩潰現象,同時兼具有符合EIA-X7R電容器規範的溫度電容穩定性。 Therefore, in view of the above problems and deficiencies, the inventors have collected relevant information, assessed and considered from various parties, and based on years of experience accumulated in this industry, through continuous trial and error, began to design the resistance of this composite phase structure. Transient high voltage dielectric ceramic body. In addition to having good high voltage resistance, it can also resist dielectric collapse caused by sudden or instantaneous rise in electrical energy or potential. At the same time, it also has temperature capacitance stability in accordance with EIA-X7R capacitor specifications.

本發明係一種耐瞬間高電壓之介電陶瓷體,其組成係由複數種不同主成分及添加至少一種副成份所共同燒結形成,其中,二種主成份分別係第一主成分BaTiO3,第二主成分ABO3(A係選自Ba、Sr、Ca所組成元素群組之任一;B係選自Zr或Ti元素),且二種主成分的莫耳數符合通式(100-x)BaTiO3-xABO3的配方比例(x=0.1~30),其中該x係為莫耳比例,而所添加至少一種副成份另稱作第一副成份,例如:氧化鎂MgO或碳酸錳MnCO3。當燒結形成介電陶瓷體後,該介電陶瓷體經XRD晶體結構繞射偵測後發現係同時包含有正方晶(Tetragonal Crystal)及菱方晶(Orthorhombic Crystal)的複合式鈣鈦礦結構。簡言之,介電陶瓷體在特殊主成分及副成份的調合下,將燒結形成另 一種含有特殊繞射峰的複合相結構。 The invention is a dielectric ceramic body which is resistant to transient high voltage. Its composition is formed by sintering a plurality of different main components and adding at least one auxiliary component. Among them, the two main components are the first main component BaTiO 3 , respectively. Two main components ABO 3 (A is selected from the group of elements consisting of Ba, Sr, Ca; B is selected from the elements Zr or Ti), and the Mohr numbers of the two main components conform to the general formula (100-x ) BaTiO 3 -xABO 3 formula ratio (x = 0.1 ~ 30), where x is the mole ratio, and the added at least one secondary component is also called the first secondary component, such as magnesium oxide MgO or manganese carbonate MnCO 3 . After the dielectric ceramic body was formed by sintering, the dielectric ceramic body was detected by XRD crystal structure diffraction and found to be a composite perovskite structure containing both tetragonal crystal and Orthorhombic crystal. In short, the dielectric ceramic body is sintered to form another composite phase structure with a special diffraction peak under the blending of special main components and sub-components.

前述耐瞬間高電壓之介電陶瓷體,第二主成分ABO3較佳係SrZrO3或CaZrO3。當被製作成積層陶瓷電容器並進行不同電性測量時,如果進一步觀察兩種不同直流電升電壓速率200Vdc/s(所測得介電強度,簡稱BDV)及6000Vdc/s(所測得介電強度,簡稱BDVH)的測試結果,則可以發現介電陶瓷體內同時存在有正方晶及菱方晶時,電容器的絕緣電組特性有明顯提升,最特別係BDVH測試結果甚至顯示電容器具有耐瞬間高電壓的優異效果。另外,電性測量結果也顯示,隨著SrZrO3或CaZrO3的含量增加,介電損失數值有逐漸減小趨勢,此可以有效避免內能被轉變作熱能消耗,使電容器內部不致於瞬間發生溫度劇烈增加情況,繼而造成卑金屬內電極被燒毀或發生無法預期的熱衰竭現象。 In the aforementioned dielectric ceramic body capable of withstanding transient high voltage, the second main component ABO 3 is preferably SrZrO 3 or CaZrO 3 . When made into multilayer ceramic capacitors and performing different electrical measurements, if two different DC voltage rise rates of 200Vdc / s (measured dielectric strength, referred to as BDV) and 6000Vdc / s (measured dielectric strength) are further observed (Referred to as BDV H ) test results, it can be found that when there are both tetragonal and rhombohedral crystals in the dielectric ceramic, the insulation group characteristics of the capacitor are significantly improved. The most special BDV H test results even show that the capacitor has instant resistance. Excellent effect of high voltage. In addition, the electrical measurement results also show that as the content of SrZrO 3 or CaZrO 3 increases, the value of dielectric loss gradually decreases, which can effectively prevent the internal energy from being converted into heat energy consumption, so that the temperature inside the capacitor does not occur instantly. The situation increased sharply, which in turn caused the internal electrodes of the base metal to be burned or caused unexpected thermal failure.

前述耐瞬間高電壓之介電陶瓷體,第二主成分ABO3的莫耳數控制於0.1~30莫耳區間,較佳範圍係0.1~15莫耳。倘若超過30莫耳,則介電陶瓷體內的菱方晶會消失,繼而影響所期待的技術效果。 In the foregoing dielectric ceramic body capable of withstanding transient high voltage, the Mohr number of the second main component ABO 3 is controlled in the range of 0.1 to 30 Molar, and the preferred range is 0.1 to 15 Molar. If it exceeds 30 mols, the rhombohedral crystals in the dielectric ceramic will disappear, which will affect the expected technical effect.

前述耐瞬間高電壓之介電陶瓷體,其中,副成份係第一副成份時,第一副成份係選自MgO、ZnO、CuO、GeO、FeO、NiO、MnCO3或CoCO3所組成群組之任一。第一副成分所含之金屬離子係以受體摻雜方式去取代Ti4+或Zr4+,藉以達到提供抗還原氣氛的功效。 In the foregoing dielectric ceramic body capable of withstanding transient high voltage, when the secondary component is the first secondary component, the first secondary component is selected from the group consisting of MgO, ZnO, CuO, GeO, FeO, NiO, MnCO 3 or CoCO 3 Either. The metal ions contained in the first sub-component are substituted by Ti 4+ or Zr 4+ by acceptor doping, so as to achieve the effect of providing an anti-reduction atmosphere.

前述耐瞬間高電壓之介電陶瓷體,其中,副成份可以複包 含第二副成份,第二副成份係選自Y2O3、Ho2O3、Ga2O3、Cr2O3、Sc2O3、La2O3、Nd2O3、Pm2O3、Sm2O3、Eu2O3、Gd2O3、Dy2O3、Er2O3、Tm2O3及Yb2O3所組成的三價離子氧化物群組之任一。第二副成份能夠降低於還原氣氛燒結過程所產生的氧空缺,使絕緣電阻值及產品可靠度獲得提升。然而,當添加量過多時,介電常數可能發生降低,故不宜添加過多。更進一步地,另可以再添加第三副成份,第三副成分為含Si離子氧化物具有低熔點可作為燒結助劑使用,如BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3群組之任一。此能夠降低介電陶瓷體的燒結溫度並幫助離子擴散,同時亦可以透過高溫液相的物理作用去縮短粉體間距,藉以排除孔隙的形成。否則,燒結溫度過高,除了提高生產製造成本以外,甚至容易使電容器之內部電極造成破壞。 In the foregoing dielectric ceramic body capable of withstanding transient high voltage, the secondary component may further include a second secondary component, and the second secondary component is selected from the group consisting of Y 2 O 3 , Ho 2 O 3 , Ga 2 O 3 , Cr 2 O 3 , Sc 2 O 3 , La 2 O 3 , Nd 2 O 3 , Pm 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , Dy 2 O 3 , Er 2 O 3 , Tm 2 O 3 and Any of the trivalent ion oxide groups consisting of Yb 2 O 3 . The second sub-component can reduce the oxygen vacancies generated during the sintering process in a reducing atmosphere, which improves the insulation resistance value and product reliability. However, when the amount is too large, the dielectric constant may decrease, so it is not suitable to add too much. Furthermore, a third sub-component can be added. The third sub-component is a Si-containing oxide with a low melting point and can be used as a sintering aid, such as BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 ) SiO 3 group. Either. This can reduce the sintering temperature of the dielectric ceramic body and help ion diffusion. At the same time, it can also shorten the powder spacing through the physical action of the high-temperature liquid phase, thereby eliminating the formation of pores. Otherwise, the sintering temperature is too high, in addition to increasing the manufacturing cost, it is even easy to cause damage to the internal electrodes of the capacitor.

前述耐瞬間高電壓之介電陶瓷體,其中,任何一種副成份莫耳數係介於0.1~7.0莫耳,較佳範圍係0.1~3.0莫耳,理由係添加量過多時,可能會意外地造成TCC溫度電容曲線的穩定性發生偏離EIA-X7R規範的現象,故應特別留意。 In the foregoing dielectric ceramic body capable of withstanding transient high voltages, the Mohr number of any of the secondary components is between 0.1 and 7.0 Molar, and the preferred range is 0.1 to 3.0 Molar. The reason is that when the amount of addition is excessive, it may be unexpected. As a result, the stability of the TCC temperature capacitance curve deviates from the EIA-X7R specification, so special attention should be paid.

整體而言,本發明耐瞬間高壓之介電陶瓷體有以下優點: Overall, the dielectric ceramic body resistant to transient high voltages of the present invention has the following advantages:

(1)利用介電陶瓷體11製成的電容器1,係可耐受電位差短時間迅速升幂所引發的高電能量衝擊。 (1) The capacitor 1 made of the dielectric ceramic body 11 can withstand the high electric energy impact caused by the rapid rise of the potential difference in a short time.

(2)且介電陶瓷體11所製成陶瓷電容器1,可避免因瞬間雷擊或突波所造成介電崩潰現象,提升陶瓷電容器1的耐高壓性能。 (2) And the ceramic capacitor 1 made of the dielectric ceramic body 11 can avoid the dielectric breakdown phenomenon caused by instant lightning strike or surge, and improve the high voltage resistance performance of the ceramic capacitor 1.

(3)本發明製備之電容器1,可兼具抗瞬間電壓破壞及 符合EIA-X7R之電容器規範優點。 (3) The capacitor 1 prepared by the present invention can have both resistance to transient voltage damage and Compliant with EIA-X7R capacitor specification advantages.

(4)本發明介電陶瓷材料具有良好的抗還原燒結能力,可與BME製程匹配具有商業競爭力。 (4) The dielectric ceramic material of the present invention has a good resistance to reduction and sintering, and can be matched with the BME process and has commercial competitiveness.

1‧‧‧陶瓷電容器 1‧‧‧ceramic capacitor

11‧‧‧介電陶瓷體層 11‧‧‧ Dielectric ceramic body layer

12‧‧‧內電極層 12‧‧‧ Internal electrode layer

121、122‧‧‧內電極 121, 122‧‧‧ Internal electrode

13‧‧‧外部電極 13‧‧‧External electrode

第一圖 係習知美國電子工業協會電容器ClassⅡ規範圖表。 The first picture is a conventional Class II capacitor chart of the American Electronics Industry Association.

第二圖 係為本發明實施例之積層陶瓷電容器側視剖面圖。 The second figure is a side sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.

第三圖 係為本發明實施例之製備流程圖。 The third figure is a preparation flow chart of the embodiment of the present invention.

第四圖 係為本發明較佳實施例之電容量對於直流偏壓衰減示意圖。 The fourth figure is a schematic diagram of the capacitance versus DC bias attenuation of the preferred embodiment of the present invention.

第五圖 係為本發明較佳實施例之X-Ray繞射圖。 The fifth diagram is an X-Ray diffraction diagram of a preferred embodiment of the present invention.

第六圖 係為本發明實施例之組成成份及檢測數據(一)。 The sixth figure is the components and test data (1) of the embodiment of the present invention.

第七圖 係為本發明實施例之組成成份及檢測數據(二)。 The seventh diagram is the composition and test data (2) of the embodiment of the present invention.

為達成上述目的與功效,本發明所採用之技術手段及其構造、實施之方法等,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above-mentioned objects and effects, the technical means adopted by the present invention, its structure, and implementation methods are described in detail below with reference to the preferred embodiments of the present invention, whose features and functions are fully understood.

請參閱第二、三、四、五、六、七圖所示,係分別為本發明實施例之側視剖面圖、製備流程圖、較佳實施例之電容量對於直流偏壓衰減示意圖、X-Ray繞射圖、實施例之組成成分及檢測數據(一)及實施例之組成成分及檢測數據(二)。 Please refer to the second, third, fourth, fifth, sixth, and seventh figures, which are respectively a side cross-sectional view of the embodiment of the present invention, a preparation flowchart, and a schematic diagram of the capacitance versus DC bias attenuation of the preferred embodiment. -Ray diffraction pattern, constituent components and detection data of the embodiment (1) and constituent components and detection data of the embodiment (2).

依據圖二所示可以清楚看出,本發明耐瞬間高電壓之介電陶瓷體被製作成為實施例之積層陶瓷電容器1時,其介電陶瓷體層11的 組成成份係由複數種不同主成份及副成份燒結形成,其中,副成份係莫耳數介於0.1~7.0莫耳,而二種主要成份分別係第一主成份BaTiO3,第二主成份ABO3(A=Ca、Sr、Ba;B=Zr、Ti),其中,ABO3依據本發明之實施例係指SrZrO3或CaZrO3粉末,或SrZrO3及CaZrO3的粉末混合物,且二種主要成份的莫耳數符合通式(100-x)BaTiO3-xABO3的配方比例,x係介於0.1~30莫耳。當以XRD繞射儀對介電陶瓷體層11進行偵測,則發現介電陶瓷體層11係同時含有正方晶及菱方晶的複合相鈣鈦礦結構,實施例之繞射結果整理如圖五。依據圖五所示實施例之X-Ray晶體結構繞射分析圖譜(簡稱XRD),依據(100-x)BaTiO3-xABO3的配方通式所燒結形成的介電陶瓷材料系統,其中該x係為莫耳比例,相較於材料配方僅係單一主成分BaTiO3具有明顯晶體結構差異性。(100-x)BaTiO3-xABO3的介電陶瓷材料系統顯示有正方晶相BaTiO3及菱方晶相ABO3(A=Ca、Sr、Ba;B=Zr、Ti)的複合相結構,或另稱作雙相結構。 It can be clearly seen from FIG. 2 that when the dielectric ceramic body capable of withstanding transient high voltages of the present invention is made into the multilayer ceramic capacitor 1 of the embodiment, the composition of the dielectric ceramic body layer 11 is composed of a plurality of different main components and The secondary components are formed by sintering. Among them, the molar number of the secondary component ranges from 0.1 to 7.0 molar, and the two main components are the first main component BaTiO 3 and the second main component ABO 3 (A = Ca, Sr, Ba; (B = Zr, Ti), wherein ABO 3 according to the embodiment of the present invention refers to SrZrO 3 or CaZrO 3 powder, or a powder mixture of SrZrO 3 and CaZrO 3 , and the Mohr numbers of the two main components conform to the general formula (100 -x) The formula ratio of BaTiO 3 -xABO 3 , x is between 0.1 and 30 moles. When the dielectric ceramic body layer 11 was detected by an XRD diffractometer, it was found that the dielectric ceramic body layer 11 was a composite phase perovskite structure containing both tetragonal and rhombohedral crystals. The diffraction results of the embodiment are shown in Figure 5. . A dielectric ceramic material system sintered according to the X-Ray crystal structure diffraction analysis spectrum (XRD) of the embodiment shown in FIG. 5 according to the formula of (100-x) BaTiO 3 -xABO 3 , where x The ratio is Mohr. Compared with the material formula, which is only a single main component, BaTiO 3 has obvious crystal structure differences. The (100-x) BaTiO 3 -xABO 3 dielectric ceramic material system shows a composite phase structure of a tetragonal phase BaTiO 3 and a rhombohedral phase ABO 3 (A = Ca, Sr, Ba; B = Zr, Ti). Or alternatively called a two-phase structure.

進一步地,如果將各實施例製備成為積層陶瓷電容器並施以電性量測,則結果可依據各組成成份不同整理如第六圖及第七圖,其中,所謂電性量測包含:透過電感電容電阻量測儀(LCR meter)以頻率1kH以下及1Vrms進行TCC數值及損失因子(dielectric loss factor,DF)、以高電阻儀250Vdc量測絕緣電阻(insulation resistance,IR)、以不同升電壓速率200Vdc/s( 所測得介電強度,簡稱BDV)及6000Vdc/s(所測得介電強度,簡稱BDVH)量測耐瞬間電壓能力。 Further, if the embodiments are prepared as multilayer ceramic capacitors and subjected to electrical measurement, the results can be arranged according to the different components as shown in Figures 6 and 7, where the so-called electrical measurement includes: Capacitive resistance measuring instrument (LCR meter) performs TCC value and loss factor (DF) at a frequency of 1kH and 1Vrms, measures insulation resistance (IR) with a high resistance meter 250Vdc, and uses different voltage rising rates 200Vdc / s (the measured dielectric strength, referred to as BDV) and 6000Vdc / s (the measured dielectric strength, referred to as BDV H ) are used to measure the ability to withstand transient voltages.

請同時參照第六圖及第五圖的結果,當實施例同時存在有正方晶及菱方晶的複合式鈣鈦礦結構時,其所製備積層陶瓷電容器1,除了絕緣電阻特性有明顯提升外,再比較不同升電壓速率200Vdc/s及6000Vdc/s,所製備積層陶瓷電容器的BDVH結果甚至顯示出具有耐瞬間高電壓的效果,即所製備的積層陶瓷電容器1能夠發揮出抵抗瞬間升幂之高電壓或高電位所造成的破壞。具體而言,觀察第六圖所列實施例1~11,當介電陶瓷層11的第一副成份維持恆定時,隨著第二主成份莫耳數增加,BDV及BDVH得到不錯的數值結果。進一步地,再仔細觀察當中的實施例1~8,所製備積層陶瓷電容器於-55℃~125℃溫度區間的TCC溫度電容數值變化率皆維持於±15%範圍內,符合EIA-X7R規範。換言之,當實施例之介電陶瓷體內同時存在有正方晶及菱方晶的複合式鈣鈦礦結構,其所製備積層陶瓷電容器的產品特性非常優越,將兼具有耐瞬間高電壓及符合EIA-X7R高溫電容穩定的特性。 Please refer to the results of FIG. 6 and FIG. 5 at the same time. When a compound perovskite structure with a tetragonal crystal and a rhombohedral crystal exists in the embodiment at the same time, the multilayer ceramic capacitor 1 prepared therefrom has a significant improvement in insulation resistance characteristics Then, comparing the different rising voltage rates of 200Vdc / s and 6000Vdc / s, the BDV H results of the multilayer ceramic capacitors produced even show the effect of withstanding high transient voltage, that is, the multilayer ceramic capacitors 1 can exert resistance against instantaneous power rise. Damage caused by high voltage or high potential. Specifically, looking at Examples 1 to 11 listed in the sixth figure, when the first sub-component of the dielectric ceramic layer 11 is kept constant, as the Mohr number of the second main component increases, BDV and BDV H get good values. result. Further, carefully observe Examples 1 to 8 therein, the TCC temperature capacitance value change rate of the prepared multilayer ceramic capacitors in the temperature range of -55 ° C to 125 ° C is maintained within a range of ± 15%, which complies with the EIA-X7R specification. In other words, when the compound perovskite structure of tetragonal crystal and rhombohedral crystal exists in the dielectric ceramic body of the embodiment at the same time, the product characteristics of the multilayer ceramic capacitor prepared therefrom are very superior, and they will have both high transient voltage resistance and EIA compliance. -X7R high temperature capacitor stable characteristics.

又,實施例1~10也顯示,當介電陶瓷體層11內含有的複合式鈣鈦礦結構時,將具有抑制介電損失的效果,且隨著第二主成份SrZrO3或CaZrO3莫耳數增加,介電損失會越小。介電損失為一種能量轉換之形勢,而多數能量損失是以電能轉換熱能的形式。此外,介電損失是電場相位轉換所造成之損失總合(即為交流電場),此介電損失多寡與耐交流電壓能力成反比。而介電材料於交流電場下之破壞機制多為 熱能所造成之熱崩潰,故介電損失越低者耐交流電場能力愈佳。對積層陶瓷電器1而言,介電損失越大通常越容易使積層陶瓷電容器1的內部溫度劇烈增加,倘若內部溫度無法透過由銅或鎳所形成的外部電極13快速傳導至外界環境,則由卑金屬製成的內部電極121、122可能隨時會發生燒毀或熔化。此外,介電陶瓷體層11內所含有的複合式鈣鈦礦結構所提升的介電特性效果更不僅止於此,依據第四圖所列之實施例1、3、6、7、8、9、10及11,當維持副成份不變時,隨著第二主成份莫耳數增加,所製備積層陶瓷電容器1的電容值表現將提升對直流偏壓的抵抗效果。例如:當直流偏壓達到1.5V/um時,實施例1及實施例3已發生約-20.0%的電容變化率衰減,但實施例9、實施例10及實施例11的電容變化率衰減現象卻仍維持於-5.0%範圍內,尤其實施例11的電容變化率幾乎維持於0%不變。倘若觀察第四圖內各曲線趨勢,則當介電陶瓷體層11隨著第二主成份的增加,所製備積層陶瓷電容器1可以適用於更強的直流偏壓環境,對於電容值衰減具有良好抵抗效果。 Moreover, Examples 1 to 10 also show that when the composite perovskite structure contained in the dielectric ceramic body layer 11 has the effect of suppressing the dielectric loss, and as the second main component SrZrO 3 or CaZrO 3 Moore As the number increases, the dielectric loss will decrease. Dielectric loss is a situation of energy conversion, and most of the energy loss is in the form of electrical energy converted to thermal energy. In addition, the dielectric loss is the sum of the losses caused by the phase shift of the electric field (that is, the AC electric field). The amount of this dielectric loss is inversely proportional to the ability to withstand AC voltage. The destruction mechanism of dielectric materials under AC electric field is mostly thermal collapse caused by thermal energy, so the lower the dielectric loss, the better the ability to withstand the AC electric field. For multilayer ceramic appliances 1, the larger the dielectric loss, the easier it is usually to increase the internal temperature of the multilayer ceramic capacitor 1 sharply. If the internal temperature cannot be quickly conducted to the external environment through the external electrode 13 formed of copper or nickel, then The internal electrodes 121, 122 made of base metal may be burned or melted at any time. In addition, the effect of the improved dielectric properties of the composite perovskite structure contained in the dielectric ceramic body layer 11 does not stop there. According to the embodiments 1, 3, 6, 7, 8, 9 listed in the fourth figure , 10 and 11, when the secondary component is maintained, as the Mohr number of the second main component increases, the capacitance value performance of the prepared multilayer ceramic capacitor 1 will improve the resistance to the DC bias. For example, when the DC bias voltage reaches 1.5V / um, the capacitance change rate attenuation of about -20.0% has occurred in Embodiments 1 and 3, but the capacitance change rate attenuation phenomenon of Embodiments 9, 10 and 11 has occurred. However, it is still maintained in the range of -5.0%. In particular, the capacitance change rate of Example 11 is almost unchanged at 0%. If the trends of the curves in the fourth figure are observed, when the dielectric ceramic body layer 11 increases with the second main component, the multilayer ceramic capacitor 1 can be applied to a stronger DC bias environment and has a good resistance to the attenuation of the capacitance value. effect.

進一步地,為詳細敘述本發明之技術效果,將依據第六圖所列各實施例依序分析並敘述電性量測結果。首先,觀察第六圖各實施例的組成配方,當第二主成份介於0~30mol%時,於較低升壓速率200Vdc/s所量測到介電強度BDV可達到71~119Vdc/μm,此結果係相當好的耐電壓能力,尤其第二主成份含量介於3~11mol%時,介電強度BDV甚至高達100Vdc/μm以上。唯須提醒,實施例1的化學組成僅係單一種主成分BaTiO3並添加複數種副成份,在200Vdc/s的升壓速率條件具有110Vdc/μm,但當 升壓速率改提高至6000Vdc/s時,其介電強度卻只有27Vdc/μm,歸納原因係實施例1由於未添加任何第二主成份,致使XRD繞射峰只顯示單一種鈣鈦礦晶體結構,故無法發揮抵抗瞬間高電壓的技術效果。如果考慮雷擊或突波發生的情形,實施例1的特性會造成介電強度數值起伏變化過大,繼而容易衝擊電子迴路內各電子零組件間的協同作業並造成失效,故所製備成的電容器並非本發明所期待的可抵抗瞬間高電壓升幂的穩定電容器。反之,本發明所期待的可抵抗瞬間高電壓升幂的電容器,其介電陶瓷體層11係添加有至少0.1mole以上的第二主成分並於燒結後形成有正方晶及菱方晶的複合式鈣鈦礦結構。以實施例4及實施例7為例,因為其含有特定比例的第二主成分,燒結後將使介電陶瓷體層內部同時含有正方晶及菱方晶的存在,這種複合式鈣鈦礦結構對於BDV及BDVH介電強度的數值趨於和緩,顯示對於瞬間高電壓的突然衝擊將不致於發生過度起伏變化,且在複數種副成份作用下,其電容溫度變化亦符合EIA-X7R規範。無論係瞬間高電壓變化或高溫變化環境,從產品可靠性的角度作評比,它們都將係較穩定的電容器產品。 Further, in order to describe the technical effects of the present invention in detail, the electrical measurement results will be sequentially analyzed and described according to the embodiments listed in the sixth figure. First, observe the composition formula of each embodiment in the sixth figure. When the second main component is between 0 and 30 mol%, the dielectric strength BDV measured at a lower boost rate of 200 Vdc / s can reach 71 to 119 Vdc / μm. This result is quite good withstand voltage, especially when the content of the second main component is between 3 ~ 11mol%, the dielectric strength BDV is even higher than 100Vdc / μm. It should only be reminded that the chemical composition of Example 1 is only a single main component BaTiO 3 and a plurality of secondary components are added. The boosting rate condition at 200Vdc / s has 110Vdc / μm, but when the boosting rate is changed to 6000Vdc / s However, the dielectric strength is only 27Vdc / μm. The reason for this is that Example 1 did not add any second main component, so that the XRD diffraction peak showed only a single perovskite crystal structure. Technical effects. If the occurrence of a lightning strike or a surge is considered, the characteristics of Example 1 will cause the dielectric strength value to fluctuate too much, and then it will easily impact the cooperative operation between electronic components in the electronic circuit and cause failure. Therefore, the prepared capacitor is not The stable capacitor expected by the present invention is resistant to instantaneous high-voltage rise. On the other hand, the capacitor expected to resist instantaneous high-voltage rise in the present invention has a dielectric ceramic body layer 11 of which at least 0.1 mole of a second main component is added and a sintered and rhombohedral composite is formed. Perovskite structure. Taking Example 4 and Example 7 as an example, because it contains a second main component in a specific proportion, the sintering will cause the presence of both tetragonal and rhombohedral crystals in the dielectric ceramic body layer. This composite perovskite structure The values of the dielectric strength of BDV and BDV H tend to be milder, indicating that sudden shocks to high voltages will not cause excessive fluctuations, and the capacitance temperature changes also comply with EIA-X7R specifications under the action of multiple secondary components. Regardless of the momentary high voltage change or high temperature change environment, from the perspective of product reliability, they will all be more stable capacitor products.

又,依據第六圖所示各實施例結果進一步分析,當第二主成份含量介於5~15mole,所測得BDVH皆高於70Vdc/μm的結果,而此結果不侷限於第二主成份SrZrO3及CaZrO3兩者之間比例應維持於1:1的固定條件。例如:實施例12~21所示第二主成份總含量維持5mole時,任意改變SrZrO3/CaZrO3的比值介於0~1,結果仍可得到非常良好的耐瞬間電壓特性並同時符合EIA-X7R規範。然而,如果第二主成份中所添加的CaZrO3莫耳 數偏高,TCC溫度電容穩定性將開始變差。以實施例21為例,雖然具有良好BDVH特性,但高溫125℃時所測得TCC數值逼近EIA-X7R規範所要求的-15%臨界限。 Furthermore, according to the results of the examples shown in the sixth figure, when the content of the second main component is between 5 and 15 moles, the measured BDV H is higher than 70Vdc / μm, and this result is not limited to the second main component. The ratio between the components SrZrO 3 and CaZrO 3 should be maintained at a fixed condition of 1: 1. For example, when the total content of the second main component shown in Examples 12 to 21 is maintained at 5 moles, the ratio of SrZrO 3 / CaZrO 3 can be arbitrarily changed from 0 to 1. As a result, it can still obtain very good transient voltage resistance and meet EIA- X7R specification. However, if the CaZrO 3 mole number added to the second main component is too high, the TCC temperature capacitance stability will start to deteriorate. Taking Example 21 as an example, although it has good BDV H characteristics, the TCC value measured at a high temperature of 125 ° C. approaches the -15% critical limit required by the EIA-X7R specification.

請參照第七圖各實施例,第七圖係選擇實施例4所記載第一主成分及第二主成分之莫耳數為基礎並維持固定不變,再任意改變多種不同副成份的添加量及比例,目的係在複合式鈣鈦礦結構的穩定基礎下進一步再優化TCC溫度電容曲線在-55~125℃區間的變化率及調整絕緣電阻。以第一副成份MgO及MnCO3為例,其中,MgO對於穩定TCC溫度電容曲線在-55~125℃區間的變化率有較好的效果,具體結果如實施例22~28所示,隨著MgO添加量從0.5莫耳逐漸增加至7.0莫耳,125℃的電容值變化率於開始從-14.5%收斂至-6.6%。同時,隨著MgO添加量增加,絕緣電阻亦開始自66.9GΩ逐漸增加至100.9GΩ。另一種第一副成份MnCO3,具體如實施例29~33所示,隨著添加量增加,同樣具有改善溫度電容穩定性及提升絕緣電阻的效果。 Please refer to each embodiment in the seventh figure. The seventh figure is based on the Mohr numbers of the first main component and the second main component described in Example 4 and is kept constant. Then, the addition amount of various different sub-components is arbitrarily changed. And proportion, the purpose is to further optimize the TCC temperature-capacitance curve change rate and adjust the insulation resistance under the stable foundation of the composite perovskite structure. Take the first sub-components MgO and MnCO 3 as examples. Among them, MgO has a good effect on stabilizing the change rate of the TCC temperature-capacitance curve in the range of -55 ~ 125 ° C. The specific results are shown in Examples 22-28. The amount of MgO added gradually increased from 0.5 Moore to 7.0 Moore, and the rate of change in capacitance at 125 ° C converged from -14.5% to -6.6%. At the same time, as the amount of MgO added increased, the insulation resistance also gradually increased from 66.9GΩ to 100.9GΩ. Another first sub-component, MnCO 3 , is specifically shown in Examples 29 to 33. As the addition amount increases, it also has the effects of improving the stability of the temperature capacitor and the insulation resistance.

又,觀察第七圖所記載各實施例,其中,所添加之第二副成份Y2O3及Ho2O3等三價金屬離子氧化物,由於第二副成份通常可以降低還原氣氛燒結時所產生氧空缺,故隨著添加量增加,絕緣電阻亦有提高趨勢,具體如實施例31及實施例34~41所示。當Y2O3添加量為1mole時,絕緣電阻為68.7GΩ,隨著添加量依序提高至1.5、2、3及5mole時,絕緣電阻亦依序提升至68.6GΩ、82.3GΩ、124.4GΩ及149.4GΩ。因此,第二副成份添加量增 加將能夠大幅度地提高絕緣電阻特性,而且TCC電容溫度穩定性幾乎不致於發生太大波動,但添加量過多時另會造成介電常數降低,故組成調配上應予留意。另外,由實施例34及實施例39~41可知,Y2O3及Ho2O3等三價離子間發生原子彼此間置換的效果。 Also, observe the examples described in the seventh figure, in which the trivalent metal ion oxides such as the second sub-component Y 2 O 3 and Ho 2 O 3 are added, because the second sub-component can usually reduce the reducing atmosphere during sintering. The generated oxygen vacancy, so as the amount of addition increases, the insulation resistance also tends to increase, as shown in Example 31 and Examples 34 to 41. When the amount of Y 2 O 3 is 1 mole, the insulation resistance is 68.7 GΩ. As the amount of Y 2 O 3 is increased to 1.5, 2, 3, and 5 moles, the insulation resistance is also increased to 68.6 GΩ, 82.3 GΩ, 124.4 GΩ, and 149.4GΩ. Therefore, the increase in the amount of the second sub-component will greatly improve the insulation resistance characteristics, and the temperature stability of the TCC capacitor will hardly fluctuate too much. However, when the amount is too large, the dielectric constant will be lowered. Pay attention. In addition, from Example 34 and Examples 39 to 41, it can be seen that the effects of substitution of atoms between trivalent ions such as Y 2 O 3 and Ho 2 O 3 occur.

進一步地,再觀察第七圖所記載各實施例,其中,添加有第三副成份促進燒結,主要係選擇含有Si離子之氧化物,例如:(Ba0.6Ca0.4)SiO3。以實施例31及實施例42~45為例,如果組成配方只改變(Ba0.6Ca0.4)SiO3的添加量且持續介於0.5~2mole時,對於介電特性並不會發生任何明顯變化。然而,若添加量高達4mole時,則TCC溫度電容曲線的穩定性有逐漸降低趨勢,但仍可符合EIA-X7R規範,如實施例45所示。依據第七圖所列各實施例結果整體而言,無論添加任何一種副成份,適當應介於0.1~7.0莫耳,較佳係0.1~3.0莫耳,因為當添加量過多時,皆可能會意外造成TCC曲線穩定性逐漸偏離EIA-X7R規範或造成其它介電特性不良,故應特別留意。 Further, observe each of the embodiments described in the seventh figure, in which a third sub-component is added to promote sintering, and an oxide containing Si ions is mainly selected, for example: (Ba 0.6 Ca 0.4 ) SiO 3 . Taking Example 31 and Examples 42 to 45 as examples, if the composition formula only changes the addition amount of (Ba 0.6 Ca 0.4 ) SiO 3 and continues to be between 0.5 and 2 moles, there will not be any significant change in dielectric properties. However, if the added amount is as high as 4 mole, the stability of the TCC temperature-capacitance curve will gradually decrease, but it can still meet the EIA-X7R specification, as shown in Example 45. According to the results of the examples listed in the seventh figure, as a whole, no matter what kind of auxiliary component is added, it should be between 0.1 and 7.0 moles, and preferably 0.1 to 3.0 moles, because when the amount is too much, it may be Accidentally causes the stability of the TCC curve to gradually deviate from the EIA-X7R specification or cause other poor dielectric characteristics, so special attention should be paid.

請參酌第三圖,係本發明實施例之介電陶瓷體製備成型電容器方法,係可依據下列步驟流程進行,其中; Please refer to the third figure, which is a method for preparing a molded capacitor of a dielectric ceramic body according to an embodiment of the present invention, which can be performed according to the following steps and procedures, wherein:

(A01)添加主成份,可為二種主要成份,分別為第一主成份BaTiO3,第二主成份ABO3。及同時 (A01) Adding the main component can be two main components, namely the first main component BaTiO 3 and the second main component ABO 3 . And at the same time

(A02)添加至少一種副成份,係與主成份不同種類之副成份。 (A02) Add at least one secondary component, which is a different type of secondary component from the main component.

(A03)漿料製備,可添加甲苯、無水酒精、塑化劑、 黏結劑及分散劑等。 (A03) slurry preparation, toluene, anhydrous alcohol, plasticizer, Binders and dispersants.

(A04)刮刀成型製備生胚薄帶。 (A04) A doctor blade is used to prepare a green embryo thin band.

(A05)網印內電極層。 (A05) Screen printing internal electrode layer.

(A06)生胚製備,進行疊層、均壓、切割等。 (A06) Raw embryo preparation, lamination, pressure equalization, cutting and the like.

(A07)燒除有機質。 (A07) Organic matter was burned off.

(A08)還原氣氛燒結。 (A08) Sintering in a reducing atmosphere.

(A09)再氧化熱處理。 (A09) Reoxidation heat treatment.

(A10)製備外部電極。 (A10) An external electrode was prepared.

(A11)電性量測。 (A11) Electrical measurement.

前述步驟(A01)及(A02),其中,主成分及副成分粉末的製備方式係首先將BaCO3、CaCO3、SrCO3、TiO2、Zr2O5及SiO2以常見之固相合成法於高溫900℃~1300℃間煆燒成為BaTiO3、CaZrO3、SrZrO3、CaTiO3、SrTiO3及(Ba0.6Ca0.4)SiO3粉末。再將所有原料BaTiO3、CaZrO3、SrZrO3、CaTiO3、SrTiO3、(Ba0.6Ca0.4)SiO3、MgO、MnCO3、Y2O3、Ho2O3及Al2O3粉末依照第六圖及第七圖相對莫耳數比例均勻混合。 In the foregoing steps (A01) and (A02), the main component and auxiliary component powders are prepared by firstly synthesizing BaCO 3 , CaCO 3 , SrCO 3 , TiO 2 , Zr 2 O 5 and SiO 2 by common solid-phase synthesis methods. Sintering at a high temperature between 900 ° C and 1300 ° C turns into BaTiO 3 , CaZrO 3 , SrZrO 3 , CaTiO 3 , SrTiO 3 and (Ba 0.6 Ca 0.4 ) SiO 3 powder. Then all the raw materials BaTiO 3 , CaZrO 3 , SrZrO 3 , CaTiO 3 , SrTiO 3 , (Ba 0.6 Ca 0.4 ) SiO 3 , MgO, MnCO 3 , Y 2 O 3 , Ho 2 O 3 and Al 2 O 3 powders in accordance with the first The proportions of the sixth and seventh graphs are evenly mixed with respect to the molar number.

前述步驟(A03),混合各成分製備成陶瓷漿料,係將各相對比例配製的介電陶瓷配方粉末,再加入甲苯、無水酒精、塑化劑、黏結劑及分散劑後均勻混合。 In the foregoing step (A03), the components are mixed to prepare a ceramic slurry. The dielectric ceramic powders prepared in relative proportions are added, and toluene, anhydrous alcohol, a plasticizer, a binder, and a dispersant are added and mixed uniformly.

前述步驟(A04),以刮刀成型法製備成厚度25μm的陶瓷生胚薄帶。 In the foregoing step (A04), a ceramic green sheet with a thickness of 25 μm is prepared by a doctor blade method.

前述步驟(A05),網印內電極層係利用網印方式將商用銀(Ag)、鉑(Pb)、銅(Cu)或鎳(Ni)金屬漿料,以設計好的內電極圖案印於陶瓷生胚薄帶上。 In the aforementioned step (A05), the screen-printed internal electrode layer uses a screen-printing method to print commercial silver (Ag), platinum (Pb), copper (Cu) or nickel (Ni) metal paste with a designed internal electrode pattern on the screen. Ceramic green embryos on thin strips.

前述步驟(A06),生胚製備主要係指疊層、均壓及切割三個程序,將印製有內電極圖案的陶瓷生胚薄帶依序堆疊以後,再利用熱水均壓方式將各生胚薄帶壓縮緊密,並裁切製成原先設計好之積層陶瓷生胚。 In the aforementioned step (A06), the preparation of the green embryo mainly refers to three processes of lamination, equalization and cutting. After the ceramic green embryo thin strips printed with the internal electrode pattern are sequentially stacked, each of them is heated by hot water equalization. The raw embryo thin band is compressed tightly and cut into a multilayer ceramic raw embryo that was originally designed.

前述步驟(A07),燒除有機質係指將積層陶瓷生胚於純N2環境下,以330~500℃(升溫速率2℃/min)持溫6~20小時,使生胚中的各有機質完全燒除。 In the aforementioned step (A07), burning off the organic matter means that the multilayer ceramic green embryo is held in a pure N 2 environment at a temperature of 330 ~ 500 ° C (heating rate 2 ° C / min) for 6-20 hours to make each organic substance in the green embryo. Burn out completely.

前述步驟(A08),還原氣氛燒結係指將燒除有機質後的積層陶瓷生胚置於98%N2-2%H2與35℃飽和水蒸汽所組成的還原氣氛下,以1000~1400℃(升溫速率3℃/min)進行燒結程序並持溫2小時。 In the aforementioned step (A08), the reduction atmosphere sintering refers to placing the laminated ceramic green body after the organic matter has been burned out, and placed in a reducing atmosphere composed of 98% N 2 -2% H 2 and 35 ° C saturated water vapor at 1000 ~ 1400 ° C. (Heating rate: 3 ° C / min) The sintering procedure was performed and the temperature was maintained for 2 hours.

前述步驟(A09),再氧化熱處理係前述步驟的程序滿2小時以後,開始降低溫度至900℃~1050℃溫度區間內(降溫速率4℃/min)並於60ppm~150ppm氧壓或大氣氣氛中進行氧化熱處理,然後再緩緩降至室溫以得到積層陶瓷熟胚。 In the previous step (A09), the reoxidation heat treatment is performed after 2 hours of the previous step, and the temperature is lowered to a temperature range of 900 ° C to 1050 ° C (the cooling rate is 4 ° C / min) and the oxygen pressure is 60ppm to 150ppm or the atmosphere An oxidative heat treatment is performed, and then the temperature is gradually lowered to room temperature to obtain a laminated ceramic green body.

前述步驟(A10),製備外部電極係將外露出熟胚兩側之內電極端部披覆銀(Ag)、銅(Cu)、鎳(Ni)或錫(Sn)等電極糊狀漿料後,在純N2的氣氛下升溫至800℃~900℃之間(降溫速率15℃/min)再爐冷降至室溫,至此完成積層陶瓷電容器樣品 之製備。 In the foregoing step (A10), the external electrode system is prepared by coating electrode paste pastes such as silver (Ag), copper (Cu), nickel (Ni), or tin (Sn) on the inner electrode ends exposed on both sides of the mature embryo. In a pure N 2 atmosphere, the temperature was raised to 800 ° C. to 900 ° C. (the cooling rate was 15 ° C./min), and then the furnace was cooled down to room temperature to complete the preparation of the multilayer ceramic capacitor sample.

依據前述流程步驟,所製備本發明實施例之積層陶瓷電容器,如第七圖所示。積層陶瓷電容器1係包括複數層疊之介電陶瓷體層11、以及沿著各介電陶瓷體層11之表面間隔堆疊成型之複數內電極層12,且複數內電極層12可包括有複數內電極121、122並呈相互交錯排列,彼此之間係藉由介電陶瓷體層11隔開。積層陶瓷電容器1的二外側處分別製備成型外部電極13,而各外部電極13分別與內電極121、122連接導通,其中,當電性傳導至內電極121、122時即受介電體層11所阻隔繼而產生介電效果。內電極層12之複數內電極121、122係可分別為銀(Ag)、鉑(Pb)、銅(Cu)或鎳(Ni)等金屬材質所製成之內電極,而卑金屬製程多係選擇鎳(Ni)或銅(Cu)作為鎳內電極。外部電極13,則可分別為銅(Cu)、鎳(Ni)或錫(Sn)等金屬材質所製成之外電極。 According to the foregoing process steps, the multilayer ceramic capacitor according to the embodiment of the present invention is prepared, as shown in FIG. 7. The multilayer ceramic capacitor 1 includes a plurality of laminated dielectric ceramic body layers 11 and a plurality of internal electrode layers 12 stacked and spaced along the surface of each dielectric ceramic body layer 11. The plurality of internal electrode layers 12 may include a plurality of internal electrodes 121, 122 are arranged alternately with each other, and are separated from each other by the dielectric ceramic body layer 11. Formed external electrodes 13 are formed on the two outer sides of the multilayer ceramic capacitor 1, and each external electrode 13 is connected to the internal electrodes 121 and 122, respectively. Among them, when electrically conductive to the internal electrodes 121 and 122, the dielectric layer 11 is formed. The barrier then produces a dielectric effect. The plurality of internal electrodes 121 and 122 of the internal electrode layer 12 may be internal electrodes made of metal materials such as silver (Ag), platinum (Pb), copper (Cu), or nickel (Ni). Nickel (Ni) or copper (Cu) is selected as the nickel internal electrode. The external electrodes 13 may be external electrodes made of metal materials such as copper (Cu), nickel (Ni), or tin (Sn).

故,本發明為主要針對耐瞬間高電壓之介電陶瓷體進行設計,該介電陶瓷體係包含第一主成份BaTiO3及第二主成份ABO3,二種主成份符合通式(100-x)BaTiO3-xABO3的配方比例,且第二主成份ABO3,其中,A係選自Ba、Sr、Ca所組成元素群組之任一,B係選自Zr或Ti元素,第二主成份ABO3較佳係SrZrO3或CaZrO3,並進一步添加至少一種副成份共同進行燒結,所形成之介電陶瓷體係含有正方晶及菱方晶同時共存之複合相結構,可達到具有抵抗瞬間電位升冪所造成的介電破壞效果,同時溫度電容表現亦符合EIA-X7R之電容器規範。惟,以上所述僅為本發明之較佳實施例而 已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 Therefore, the present invention is mainly designed for a dielectric ceramic body resistant to transient high voltage. The dielectric ceramic system includes a first main component BaTiO 3 and a second main component ABO 3. The two main components conform to the general formula (100-x ) BaTiO 3 -xABO 3 formula ratio, and the second main component ABO 3 , wherein A is selected from any one of the element group consisting of Ba, Sr, Ca, B is selected from Zr or Ti, and the second main The component ABO 3 is preferably SrZrO 3 or CaZrO 3 , and further added with at least one secondary component for sintering. The formed dielectric ceramic system contains a complex phase structure in which tetragonal crystals and rhombohedral crystals coexist simultaneously, which can achieve resistance to instantaneous potential. The dielectric breakdown effect caused by power rise, and the performance of the temperature capacitor also meets the capacitor specifications of EIA-X7R. However, the above description is only the preferred embodiment of the present invention, and it does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be the same. It is included in the patent scope of the present invention and is incorporated by Chen Ming.

綜上所述,本發明上述瞬間耐高壓之陶瓷電容體於實際應用實施時,為確實能達到其功效及目的,故本發明誠為一實用性優異之研發,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦研發、創設,倘若 鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the above-mentioned instantaneous high-voltage-resistant ceramic capacitor body of the present invention is practically implemented in order to achieve its efficacy and purpose. Therefore, the present invention is a research and development with excellent practicability. In order to meet the application requirements of the invention patent, I filed an application in accordance with the law, and I hope that the trial committee will grant the case at an early date to protect the inventor's hard research and development and creation. If there is any suspicion in the jury of the Bureau, please follow the instructions of the letter, and the inventor will cooperate with all efforts and be honest.

Claims (18)

一種耐瞬間高電壓之介電陶瓷體,係包含第一主成份BaTiO3及第二主成份ABO3,其特徵在於:該二種主成份符合通式(100-x)BaTiO3-xABO3的配方比例(30≧x≧0.1,x係為莫耳比例;A係選自Ba、Sr、Ca所組成元素群組之任一;B係選自Zr或Ti元素),且進一步含有至少一種副成份,其中,該介電陶瓷體於X射線繞射分析上界定係含有正方晶鈣鈦礦及菱方晶鈣鈦礦的複合結構,該第二主成份含量係介於1.0~15.0莫耳。A dielectric ceramic body capable of withstanding transient high voltages, comprising a first main component BaTiO 3 and a second main component ABO 3 , characterized in that the two main components conform to the general formula (100-x) BaTiO 3 -xABO 3 Formula ratio (30 ≧ x ≧ 0.1, x is the mole ratio; A is selected from any of the element group consisting of Ba, Sr, Ca; B is selected from the elements Zr or Ti), and further contains at least one side The composition of the dielectric ceramic body is defined by X-ray diffraction analysis, which is a composite structure containing tetragonal perovskite and rhombohedral perovskite, and the content of the second main component is between 1.0 and 15.0 moles. 如申請專利範圍第1項所述耐瞬間高電壓之介電陶瓷體,其中第二主成份係SrZrO3或CaZrO3As described in item 1 of the scope of the patent application, a dielectric ceramic body capable of withstanding transient high voltages, wherein the second main component is SrZrO 3 or CaZrO 3 . 如申請專利範圍第1項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係第一副成份,且該副成份含量係介於0.1~7.0莫耳。As described in item 1 of the scope of the patent application, a dielectric ceramic body capable of withstanding transient high voltages, wherein the secondary component is the first secondary component, and the content of the secondary component is between 0.1 and 7.0 moles. 如申請專利範圍第3項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係選自MgO、ZnO、CuO、GeO、FeO及NiO所組成的群組。As described in item 3 of the scope of patent application, a dielectric ceramic body capable of withstanding transient high voltage, wherein the auxiliary component is selected from the group consisting of MgO, ZnO, CuO, GeO, FeO, and NiO. 如申請專利範圍第3項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係為MnCO3或CoCO3The dielectric ceramic body capable of withstanding transient high voltage as described in item 3 of the scope of patent application, wherein the secondary component is MnCO 3 or CoCO 3 . 如申請專利範圍第3項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第二副成份,且該第二副成份係選自Y2O3、Ho2O3、Ga2O3、Cr2O3、Sc2O3、La2O3、Nd2O3、Pm2O3、Sm2O3、Eu2O3、Gd2O3、Dy2O3、Er2O3、Tm2O3及Yb2O3所組成群組。As described in item 3 of the scope of the patent application, the dielectric ceramic body capable of withstanding transient high voltage further includes a second sub-component, and the second sub-component is selected from the group consisting of Y 2 O 3 , Ho 2 O 3 , and Ga 2 O. 3 , Cr 2 O 3 , Sc 2 O 3 , La 2 O 3 , Nd 2 O 3 , Pm 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , Dy 2 O 3 , Er 2 O 3 , a group consisting of Tm 2 O 3 and Yb 2 O 3 . 如申請專利範圍第6項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第三副成份,且該第三副成份係選自BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3所組成群組。As described in item 6 of the scope of the patent application, the dielectric ceramic body capable of withstanding transient high voltage further includes a third subcomponent, and the third subcomponent is selected from BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 ) SiO Group of 3 . 如申請專利範圍第3項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第二副成份,且該第二副成份係選自BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3所組成群組。As described in item 3 of the scope of patent application, the dielectric ceramic body capable of withstanding transient high voltage further includes a second sub-component, and the second sub-component is selected from BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 ) SiO Group of 3 . 如申請專利範圍第2至8項之任一項所述耐瞬間高電壓之介電陶瓷體,其中該任一種副成份含量係介於0.1~5.0莫耳。The dielectric ceramic body capable of withstanding transient high voltage as described in any one of items 2 to 8 of the scope of patent application, wherein the content of any one of the secondary components is between 0.1 and 5.0 mol. 一種耐瞬間高電壓之介電陶瓷體,係包含第一主成份BaTiO3及第二主成份ABO3,其特徵在於:該二種主成份符合通式(100-x)BaTiO3-xABO3的配方比例(30≧x≧0.1,x係莫耳比例;A係選自Ba、Sr、Ca所組成元素群組之任一;B係選自Zr或Ti元素),且進一步含有至少一種副成份,其中,該介電陶瓷體於X射線繞射分析上界定係含有正方晶鈣鈦礦及菱方晶鈣鈦礦的複合結構,且該副成份含量係介於0.1~7.0莫耳。A dielectric ceramic body capable of withstanding transient high voltages, comprising a first main component BaTiO 3 and a second main component ABO 3 , characterized in that the two main components conform to the general formula (100-x) BaTiO 3 -xABO 3 Formula ratio (30 ≧ x ≧ 0.1, x is the mole ratio; A is selected from any of the element group consisting of Ba, Sr, Ca; B is selected from the elements Zr or Ti), and further contains at least one secondary component Among them, the dielectric ceramic body is defined by X-ray diffraction analysis as a composite structure containing a tetragonal perovskite and a rhombohedral perovskite, and the content of the auxiliary component is between 0.1 and 7.0 mol. 如申請專利範圍第10項所述耐瞬間高電壓之介電陶瓷體,其中第二主成份係SrZrO3或CaZrO3As described in item 10 of the scope of the patent application, a dielectric ceramic body capable of withstanding transient high voltage, wherein the second main component is SrZrO 3 or CaZrO 3 . 如申請專利範圍第10項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係一種含有金屬元素的化合物。The dielectric ceramic body capable of withstanding transient high voltage as described in item 10 of the patent application scope, wherein the subsidiary component is a compound containing a metal element. 如申請專利範圍第12項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係選自MgO、ZnO、CuO、GeO、FeO及NiO所組成的群組。According to the instantaneous high-voltage-resistant dielectric ceramic body described in item 12 of the scope of the patent application, the auxiliary component is selected from the group consisting of MgO, ZnO, CuO, GeO, FeO, and NiO. 如申請專利範圍第12項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係為MnCO3或CoCO3The dielectric ceramic body capable of withstanding transient high voltage as described in item 12 of the scope of the patent application, wherein the secondary component is MnCO 3 or CoCO 3 . 如申請專利範圍第12項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第二副成份,且該第二副成份係選自Y2O3、Ho2O3、Ga2O3、Cr2O3、Sc2O3、La2O3、Nd2O3、Pm2O3、Sm2O3、Eu2O3、Gd2O3、Dy2O3、Er2O3、Tm2O3及Yb2O3所組成群組。The dielectric ceramic body capable of withstanding transient high voltage as described in item 12 of the patent application scope, further comprising a second sub-component, and the second sub-component is selected from the group consisting of Y 2 O 3 , Ho 2 O 3 , and Ga 2 O. 3 , Cr 2 O 3 , Sc 2 O 3 , La 2 O 3 , Nd 2 O 3 , Pm 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , Dy 2 O 3 , Er 2 O 3 , a group consisting of Tm 2 O 3 and Yb 2 O 3 . 如申請專利範圍第15項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第三副成份,且該第三副成份係選自BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3所組成群組。As described in item 15 of the scope of the patent application, the dielectric ceramic body capable of withstanding transient high voltage further includes a third sub-component, and the third sub-component is selected from BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 ) SiO Group of 3 . 如申請專利範圍第12項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第二副成份,且該第二副成份係選自BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3所組成群組。The dielectric ceramic body capable of withstanding transient high voltage as described in item 12 of the patent application scope, further comprising a second sub-component, and the second sub-component is selected from BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 ) SiO Group of 3 . 如申請專利範圍第11至17項之任一項所述耐瞬間高電壓之介電陶瓷體,其中該任一種副成份含量係介於0.1~5.0莫耳。According to any one of claims 11 to 17, the dielectric ceramic body capable of withstanding transient high voltages, wherein the content of any of these secondary components is between 0.1 and 5.0 mol.
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