TW201728556A - Dielectric ceramic body tolerant to instantaneous high voltage resisting dielectric damage caused by the instantaneous potential exponential increase - Google Patents

Dielectric ceramic body tolerant to instantaneous high voltage resisting dielectric damage caused by the instantaneous potential exponential increase Download PDF

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TW201728556A
TW201728556A TW106101537A TW106101537A TW201728556A TW 201728556 A TW201728556 A TW 201728556A TW 106101537 A TW106101537 A TW 106101537A TW 106101537 A TW106101537 A TW 106101537A TW 201728556 A TW201728556 A TW 201728556A
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ceramic body
dielectric ceramic
high voltage
dielectric
capacitor
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TWI658026B (en
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Jian-Hua Li
Jui-Hsiang Chen
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Holy Stone Enterprise Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C04B35/462Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
    • C04B35/465Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
    • C04B35/468Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H01G4/1245Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Abstract

The present invention relates to a dielectric ceramic body tolerant to instantaneous high voltage, the dielectric ceramic body comprises a first main component BaTiO3 and a second main component ABO3, both main components satisfy the ratio formulation (A=Sr, Sr, Ca; B=Zr, Ti) of the general formula (100-x)BaTiO3-xABO3, wherein the second main component ABO3 is preferably SrZrO3 or CaZrO3, and at least one sub-component is further added for co-sintering, the formed dielectric ceramic body is a composite phase structure comprising co-existent orthorhombic and rhombohedral crystals; a capacitor made of this dielectric ceramic body has the effect of resisting dielectric damage caused by the instantaneous potential exponential increase, and the temperature capacitance is in compliance with EIA-X7R capacitor specification.

Description

耐瞬間高電壓之介電陶瓷體 Instantaneous high voltage dielectric ceramic body

本發明係提供一種耐瞬間高電壓之介電陶瓷體,該介電陶瓷體除了於卑金屬製程上具備抗氧化還原效果外,甚至能夠承受瞬間電位差變化的高電壓衝擊,且其製備而成的積層陶瓷電容器對於溫度也具有優異的電容穩定性,符合EIA-X7R之電容器規範。 The invention provides a transient high voltage resistant dielectric ceramic body, which has the anti-oxidation-reduction effect on the bauxite process, and can even withstand the high voltage impact of instantaneous potential difference change, and is prepared by the same. Multilayer ceramic capacitors also have excellent capacitance stability for temperature and comply with EIA-X7R capacitor specifications.

按,美國電子工業協會(Electronic Industries Association,EIA)依據電容器不同使用範圍及電氣特性,將電容器歸納作ClassI溫度補償型電容及ClassⅡ中高介電值型電容(如第一圖所示)。若電容器歸類於CaseⅡ者,則具有相對較高介電常數(Dielectric constant,K),甚至能夠較輕易製作成高電容值的電容器。然而,任何一種電容器種類應用於電子元件迴路設計時,複雜電場訊號將會在電壓及電能量驅使下積極地干擾電子迴路上之各部件。因電容器具有良好絕緣特性及可承受高電壓波動之功能,故常在迴路中加裝電容器作為保護裝置來吸收這突發性之電子信號。具體而言,若觀察市售電容器產品,其產品承認書會記載此項電容器產品所能承受的電壓限制,但常見情況係縱使未超過承認書所記載電壓限制,電容器卻仍然持續發生故障失效,歸 納原因係市售電容器出廠時所測得之承諾耐電壓值與工作環境所產生瞬間電壓值彼此不同所致。以相同量測電壓為例,當瞬間升電壓速率非常迅速時,特別係使用直流電者,電容器存在於介電材料內的缺陷會受到瞬間高電場能量驅使作用繼而引發介電崩潰現象。 According to the Electronic Industries Association (EIA), capacitors are classified into ClassI temperature-compensated capacitors and Class II high-medium-capacity capacitors (as shown in the first figure) based on their different ranges of use and electrical characteristics. If the capacitor is classified as CaseII, it has a relatively high dielectric constant (K) and can even be easily fabricated into a capacitor with a high capacitance value. However, when any type of capacitor is used in the design of an electronic component circuit, the complex electric field signal will actively interfere with the components on the electronic circuit driven by voltage and electrical energy. Because capacitors have good insulation properties and can withstand high voltage fluctuations, capacitors are often added to the circuit as a protection device to absorb this sudden electronic signal. Specifically, if a commercially available capacitor product is observed, the product approval document will record the voltage limit that the capacitor product can withstand, but in common cases, even if the voltage limit described in the acknowledgment is not exceeded, the capacitor continues to fail. Return The reason is that the promised withstand voltage value measured at the time of shipment of the commercially available capacitor and the instantaneous voltage value generated by the working environment are different from each other. Taking the same measurement voltage as an example, when the instantaneous voltage rise rate is very rapid, especially when the DC current is used, the defects existing in the dielectric material of the capacitor are driven by the instantaneous high electric field energy to cause the dielectric collapse phenomenon.

關於介電材料內的缺陷,無論係缺陷形式或缺陷濃度普遍均係受到材料組成及燒結製程的影響。例如:市售的積層陶瓷電容器產品,基於製造成本考量,許多製造商會選擇以卑金屬電極製程(Base-Metal-Electrode,BME)作生產。卑金屬電極成本便宜卻於製造程序容易發生燒結後氧空缺及自由電子等缺陷濃度增加的問題,縱使係透過還原氣氛燒結後的再氧化熱處理亦無法完全杜絕氧空缺及自由電子等缺陷,而這些缺陷會使市售積層陶瓷電容器產品降低絕緣特性,甚至造成產品可靠度下降。因此,習知技藝陸續發展出添加副成份來改善絕緣特性的問題,但材料內部所殘留的燒結後缺陷仍然無法完全克服,故對於瞬間高電壓或高能量的衝擊,例如:雷擊或突波,其所引發的電容器產品失效問題仍然苦無對策。再者,電容器可用於抗雷擊或抗突波者,常見係將複數個電容器彼此串聯起來,藉以共同強化電位急促升幂時的耐受能力,藉以彌補單體電容器本質上抗瞬間電壓能力的不足。然而,複數個電容器彼此串聯時,任一個單體電容器亦可能發生失效,繼而再次引發單體電容器彼此間某些程度的電流導通,故如何提高單體電容器耐瞬間高電壓的能力成為重要課題。 Regarding defects in the dielectric material, regardless of the defect form or the defect concentration, it is generally affected by the material composition and the sintering process. For example, commercially available laminated ceramic capacitor products, based on manufacturing cost considerations, many manufacturers will choose to use the Base-Metal-Electrode (BME) for production. The low cost of the base metal electrode is a problem that the defect concentration of oxygen vacancies and free electrons increases after the sintering process is likely to occur in the manufacturing process, and even the reoxidation heat treatment after sintering through the reducing atmosphere cannot completely eliminate defects such as oxygen vacancies and free electrons. Defects can reduce the insulation properties of commercially available multilayer ceramic capacitor products and even reduce product reliability. Therefore, the prior art has gradually developed the problem of adding sub-components to improve the insulation properties, but the residual defects remaining inside the material cannot be completely overcome, so for transient high-voltage or high-energy shocks such as lightning strikes or surges, The failure of the capacitor product caused by it still suffers from no countermeasures. Furthermore, the capacitor can be used for lightning strike or anti-surge. It is common to connect a plurality of capacitors in series to each other, so as to jointly enhance the withstand capability of the potential rapid rise power, thereby making up for the insufficient resistance of the single capacitor to the instantaneous voltage capability. . However, when a plurality of capacitors are connected in series, any one of the single capacitors may fail, and then some current conduction between the individual capacitors is again induced. Therefore, how to improve the ability of the single capacitor to withstand transient high voltage becomes an important issue.

又,瞬間高電壓或高電場的衝擊亦可能造成電子迴路系統內環境溫度的急遽上升。如果電容器幸運地承受住瞬間高電壓的破壞或介 電崩潰,電容器亦可能耐受不住高溫對電容值的衰減影響,故真正要解決的課題應更進一步地涵括如何使電容值表現維持溫和或避免劇烈波動。然而,如前述美國電子工業協會對電容器分類的敘述,關於ClassI溫度補償型電容及ClassⅡ中高介電值型電容,其於本質架構、發展目的及方案設計初期就已經透露予本領域技術人員,任何電容器係沒有兩全其美的結果,所以倘若欲發展兼具高溫電容表現及抗瞬間電壓破壞能力的電容產品等於啟動一場嚴峻的產品跨界挑戰。 Moreover, the impact of an instantaneous high voltage or a high electric field may also cause a sudden increase in the ambient temperature in the electronic circuit system. If the capacitor is lucky enough to withstand the destruction of the instantaneous high voltage or In the event of electric breakdown, the capacitor may not be able to withstand the effect of high temperature on the attenuation of the capacitance value. Therefore, the problem to be solved should further include how to maintain the performance of the capacitor value to be mild or avoid violent fluctuations. However, as described above by the American Electronics Industry Association for the classification of capacitors, the Class I temperature-compensated capacitors and the Class II high-medium-value capacitors have been disclosed to those skilled in the art at the beginning of the intrinsic architecture, development goals, and scheme design. Capacitor systems do not have the best of both worlds, so if you want to develop a capacitor product that combines high-temperature capacitance performance with resistance to transient voltage damage, it is equivalent to launching a serious product cross-border challenge.

近似之習知技藝,例如:日本專利特開2004-107200,其揭露一種可配合卑金屬製程的介電陶瓷組成物配方,該組成配方於燒結製程時將於晶界相中均勻地形成M4R6O(SiO4)6結晶析出物(M係選自鹼土族元素至少一種;R係選自稀土族元素至少一種),而它係提高抗電壓破壞及溫度特性的關鍵因素。又,數年後另發現有一習知技藝,例如:中華民國專利公開號第200846299號,其開始沿續前述日本專利特開2004-107200所揭露技術作進一步改良,先將M4R6O(SiO4)6複合氧化物改作成組成物原料之一,再透過其它副成份的特殊調合始進行燒結程序,此舉依據文獻記載可改善前述日本專利技術所製成的產品壽命不足及產品可靠度問題。然而,觀察前述各習知技藝有關M4R6O(SiO4)6複合氧化物的技術方案,唯一缺憾係這種含矽的氧化物由於析出物組成的本質特性,對於電容器整體的溫度電容變化表現僅能達到EIA-X5R規範水平,沒有辦法再更進一步地突破。換言之,習知技藝僅暗示此場嚴峻的產品跨界挑戰,從結晶析出物尋找方向或許係一種可行策略,但本領域技術人員得另外再尋找其它新種類結晶 析出物或新組成配方才能夠更進一步地去改善電容器產品。 Approximate prior art, for example, Japanese Patent Laid-Open No. 2004-107200, which discloses a dielectric ceramic composition formulation which can be combined with a smelting metal process which uniformly forms M 4 in the grain boundary phase during the sintering process. R 6 O(SiO 4 ) 6 crystal precipitates (M is at least one selected from the group consisting of alkaline earth elements; R is selected from at least one of rare earth elements), and it is a key factor for improving resistance to voltage breakdown and temperature characteristics. Moreover, a few years later, another skill has been discovered, for example, the Republic of China Patent Publication No. 200846299, which is further improved by the technique disclosed in the aforementioned Japanese Patent Laid-Open No. 2004-107200, firstly, M 4 R 6 O ( The SiO 4 ) 6 composite oxide is converted into one of the constituent raw materials, and the sintering process is started by special blending of other auxiliary components. According to the literature, the product life shortage and product reliability of the aforementioned Japanese patent technology can be improved. problem. However, observing the above-mentioned prior art technical solutions for the M 4 R 6 O(SiO 4 ) 6 composite oxide, the only defect is the temperature and capacitance of the entire capacitor due to the essential characteristics of the precipitate-containing oxide due to the composition of the precipitate. The performance of the change can only reach the EIA-X5R standard level, there is no way to make further breakthroughs. In other words, the prior art only hints at the severe cross-border challenges of this product. It may be a feasible strategy to find the direction from the crystallized precipitates, but the skilled person in the field has to find another new type of crystal precipitate or new composition formula to be able to Further improve the capacitor product.

是以,如何發展一種積層陶瓷電容器當承受瞬間高電壓或高能量所產生衝擊時,繼而不引發介電崩潰問題,即為從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to develop a multilayer ceramic capacitor when subjected to the impact of instantaneous high voltage or high energy, without causing the dielectric collapse problem, is the direction that the relevant manufacturers engaged in this industry are eager to study and improve.

故,發明人有鑑於上述之問題與缺失,乃搜集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種複合相結構的耐瞬間高電壓之介電陶瓷體。除了具有良好的耐高電壓能力外,更可以抵抗電能量或電位突然瞬間升冪所引發的介電崩潰現象,同時兼具有符合EIA-X7R電容器規範的溫度電容穩定性。 Therefore, in view of the above problems and shortcomings, the inventors have collected relevant information, evaluated and considered through multiple parties, and have accumulated many years of experience in the industry to continuously design and resist the resistance of such composite phase structures. Instantaneous high voltage dielectric ceramic body. In addition to its good resistance to high voltage, it is also resistant to dielectric breakdown caused by sudden increase in power or potential, and has temperature and capacitance stability in accordance with EIA-X7R capacitor specifications.

本發明係一種耐瞬間高電壓之介電陶瓷體,其組成係由複數種不同主成分及添加至少一種副成份所共同燒結形成,其中,二種主成份分別係第一主成分BaTiO3,第二主成分ABO3(A係選自Ba、Sr、Ca所組成元素群組之任一;B係選自Zr或Ti元素),且二種主成分的莫耳數符合通式(100-x)BaTiO3-xABO3的配方比例(x=0.1~30),而所添加至少一種副成份另稱作第一副成份,例如:氧化鎂MgO或碳酸錳MnCO3。當燒結形成介電陶瓷體後,該介電陶瓷體經XRD晶體結構繞射偵測後發現係同時包含有正方晶(Tetragonal Crystal)及菱方晶(Orthorhombic Crystal)的複合式鈣鈦礦結構。簡言之,介電陶瓷體在特殊主成分及副成份的調合下,將燒結形成另一種含 有特殊繞射峰的複合相結構。 The invention relates to a transient high-voltage dielectric ceramic body, the composition of which is formed by a plurality of different main components and at least one auxiliary component being sintered together, wherein the two main components are respectively the first main component BaTiO 3 , The two main components ABO 3 (A is selected from any group of elements consisting of Ba, Sr, Ca; B is selected from Zr or Ti elements), and the molar numbers of the two main components are in accordance with the formula (100-x) The formulation ratio of BaTiO 3 -xABO 3 (x=0.1~30), and at least one accessory component added is also referred to as the first subcomponent, such as magnesium oxide MgO or manganese carbonate MnCO 3 . After sintering to form a dielectric ceramic body, the dielectric ceramic body is detected by XRD crystal structure diffraction and found to contain a composite perovskite structure of Tetragonal Crystal and Orthorhombic Crystal. In short, the dielectric ceramic body will be sintered to form another composite phase structure containing special diffraction peaks under the combination of special principal components and subcomponents.

前述耐瞬間高電壓之介電陶瓷體,第二主成分ABO3較佳係SrZrO3或CaZrO3。當被製作成積層陶瓷電容器並進行不同電性測量時,如果進一步觀察兩種不同直流電升電壓速率200Vdc/s(所測得介電強度,簡稱BDV)及6000Vdc/s(所測得介電強度,簡稱BDVH)的測試結果,則可以發現介電陶瓷體內同時存在有正方晶及菱方晶時,電容器的絕緣電組特性有明顯提升,最特別係BDVH測試結果甚至顯示電容器具有耐瞬間高電壓的優異效果。另外,電性測量結果也顯示,隨著SrZrO3或CaZrO3的含量增加,介電損失數值有逐漸減小趨勢,此可以有效避免內能被轉變作熱能消耗,使電容器內部不致於瞬間發生溫度劇烈增加情況,繼而造成卑金屬內電極被燒毀或發生無法預期的熱衰竭現象。 In the aforementioned transient high voltage dielectric ceramic body, the second main component ABO 3 is preferably SrZrO 3 or CaZrO 3 . When fabricated into a multilayer ceramic capacitor and subjected to different electrical measurements, if two different DC voltage rise rates of 200Vdc/s (differential measured dielectric strength, BDV for short) and 6000Vdc/s (measured dielectric strength) are further observed , abbreviated as BDV H ) test results, it can be found that the presence of tetragonal crystals and rhombohedral crystals in the dielectric ceramics, the capacitor's insulating group characteristics have been significantly improved, the most special BDV H test results even show that the capacitor has an instant resistance Excellent effect of high voltage. In addition, the electrical measurement results also show that as the content of SrZrO 3 or CaZrO 3 increases, the dielectric loss value gradually decreases, which can effectively prevent the internal energy from being converted into thermal energy consumption, so that the internal temperature of the capacitor does not occur instantaneously. A dramatic increase in the situation, which in turn causes the internal electrodes of the base metal to be burned or unpredictable heat exhaustion.

前述耐瞬間高電壓之介電陶瓷體,第二主成分ABO3的莫耳數控制於0.1~30莫耳區間,較佳範圍係0.1~15莫耳。倘若超過30莫耳,則介電陶瓷體內的菱方晶會消失,繼而影響所期待的技術效果。 In the above-mentioned instant high-voltage dielectric ceramic body, the number of moles of the second main component ABO 3 is controlled in the range of 0.1 to 30 mTorr, and the preferred range is 0.1 to 15 m. If it exceeds 30 m, the rhombohedral crystal in the dielectric ceramic body will disappear, which in turn affects the desired technical effect.

前述耐瞬間高電壓之介電陶瓷體,其中,副成份係第一副成份時,第一副成份係選自MgO、ZnO、CuO、GeO、FeO、NiO、MnCO3或CoCO3所組成群組之任一。第一副成分所含之金屬離子係以受體摻雜方式去取代Ti4+或Zr4+,藉以達到提供抗還原氣氛的功效。 The transient high voltage dielectric ceramic body, wherein the first component is selected from the group consisting of MgO, ZnO, CuO, GeO, FeO, NiO, MnCO 3 or CoCO 3 when the accessory component is the first component. Any one. The metal ions contained in the first subcomponent are substituted for Ti 4+ or Zr 4+ by acceptor doping, thereby providing an anti-reduction atmosphere.

前述耐瞬間高電壓之介電陶瓷體,其中,副成份可以複包 含第二副成份,第二副成份係選自GaO3、Cr2O3、Sc2O3、La2O3、Nd2O3、Pm2O3、Sm2O3、Eu2O3、Gd2O3、Dy2O3、Er2O3、Tm2O3及Yb2O3所組成的三價離子氧化物群組之任一。第二副成份能夠降低於還原氣氛燒結過程所產生的氧空缺,使絕緣電阻值及產品可靠度獲得提升。然而,當添加量過多時,介電常數可能發生降低,故不宜添加過多。更進一步地,另可以再添加第三副成份,第三副成分為含Si離子氧化物具有低熔點可作為燒結助劑使用,如BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3群組之任一。此能夠降低介電陶瓷體的燒結溫度並幫助離子擴散,同時亦可以透過高溫液相的物理作用去縮短粉體間距,藉以排除孔隙的形成。否則,燒結溫度過高,除了提高生產製造成本以外,甚至容易使電容器之內部電極造成破壞。 The transient high voltage dielectric ceramic body, wherein the auxiliary component may further comprise a second auxiliary component, and the second secondary component is selected from the group consisting of GaO 3 , Cr 2 O 3 , Sc 2 O 3 , La 2 O 3 , Nd 2 a trivalent ion oxide composed of O 3 , Pm 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , Dy 2 O 3 , Er 2 O 3 , Tm 2 O 3 and Yb 2 O 3 Any of the groups. The second subcomponent can reduce the oxygen vacancies generated during the sintering process of the reducing atmosphere, so that the insulation resistance value and product reliability are improved. However, when the amount added is too large, the dielectric constant may be lowered, so it is not preferable to add too much. Further, a third auxiliary component may be further added, and the third auxiliary component is a Si-containing oxide having a low melting point and can be used as a sintering aid, such as BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 )SiO 3 groups. Any one. This can reduce the sintering temperature of the dielectric ceramic body and help the ion diffusion, and can also shorten the powder spacing by the physical action of the high temperature liquid phase, thereby eliminating the formation of pores. Otherwise, the sintering temperature is too high, and in addition to increasing the manufacturing cost, it is even easy to cause damage to the internal electrodes of the capacitor.

前述耐瞬間高電壓之介電陶瓷體,其中,任何一種副成份莫耳數係介於0.1~7.0莫耳,較佳範圍係0.1~3.0莫耳,理由係添加量過多時,可能會意外地造成TCC溫度電容曲線的穩定性發生偏離EIA-X7R規範的現象,故應特別留意。 The above-mentioned instant high-voltage dielectric ceramic body, wherein any one of the sub-component molar numbers is between 0.1 and 7.0 m, and the preferred range is 0.1 to 3.0 m. When the amount is too large, the stability of the TCC temperature-capacitance curve may be unexpectedly deviated from the EIA-X7R specification, so special attention should be paid.

整體而言,本發明耐瞬間高壓之介電陶瓷體有以下優點: Overall, the dielectric ceramic body resistant to transient high voltage of the present invention has the following advantages:

(1)利用介電陶瓷體11製成的電容器1,係可耐受電位差短時間迅速升幂所引發的高電能量衝擊。 (1) The capacitor 1 made of the dielectric ceramic body 11 is capable of withstanding a high electric energy shock caused by a rapid rise in power potential for a short period of time.

(2)且介電陶瓷體11所製成陶瓷電容器1,可避免因瞬間雷擊或突波所造成介電崩潰現象,提升陶瓷電容器1的耐高壓性能。 (2) The ceramic capacitor 1 made of the dielectric ceramic body 11 can avoid dielectric breakdown caused by an instantaneous lightning strike or a surge, and improve the high voltage resistance of the ceramic capacitor 1.

(3)本發明製備之電容器1,可兼具抗瞬間電壓破壞及符合EIA-X7R之電容器規範優點。 (3) The capacitor 1 prepared by the invention can combine the advantages of resistance to transient voltage damage and capacitor specifications conforming to EIA-X7R.

(4)本發明介電陶瓷材料具有良好的抗還原燒結能力,可與BME製程匹配具有商業競爭力。 (4) The dielectric ceramic material of the present invention has good resistance to reduction and sintering, and is commercially competitive with the BME process.

1‧‧‧陶瓷電容器 1‧‧‧Ceramic capacitors

11‧‧‧介電陶瓷體層 11‧‧‧Dielectric ceramic body layer

12‧‧‧內電極層 12‧‧‧Internal electrode layer

121、122‧‧‧內電極 121, 122‧‧‧ internal electrodes

13‧‧‧外部電極 13‧‧‧External electrode

第一圖 係習知美國電子工業協會電容器ClassⅡ規範圖表。 The first figure is a chart of the American Electronic Industry Association capacitor Class II specification.

第二圖 係為本發明實施例之積層陶瓷電容器側視剖面圖。 The second drawing is a side sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.

第三圖 係為本發明實施例之製備流程圖。 The third figure is a preparation flow chart of an embodiment of the present invention.

第四圖 係為本發明較佳實施例之電容量對於直流偏壓衰減示意圖。 The fourth figure is a schematic diagram of the capacitance of the preferred embodiment of the present invention for DC bias attenuation.

第五圖 係為本發明較佳實施例之X-Ray繞射圖。 Figure 5 is an X-Ray diffraction pattern of a preferred embodiment of the invention.

第六圖 係為本發明實施例之組成成份及檢測數據(一)。 The sixth figure is the component and detection data (1) of the embodiment of the present invention.

第七圖 係為本發明實施例之組成成份及檢測數據(二)。 The seventh figure is the composition and detection data (2) of the embodiment of the present invention.

為達成上述目的與功效,本發明所採用之技術手段及其構造、實施之方法等,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above objects and effects, the technical means, the structure, the method of the implementation, and the like, which are used in the present invention, are described in detail in the preferred embodiments of the present invention.

請參閱第二、三、四、五、六、七圖所示,係分別為本發明實施例之側視剖面圖、製備流程圖、較佳實施例之電容量對於直流偏壓衰減示意圖、X-Ray繞射圖、實施例之組成成分及檢測數據(一)及實施例之組成成分及檢測數據(二)。 Please refer to the second, third, fourth, fifth, sixth and seventh figures, which are respectively a side cross-sectional view, a preparation flow chart, and a schematic diagram of the capacitance of the preferred embodiment for DC bias attenuation, X. - Ray diffraction pattern, composition of the examples and test data (1) and the composition of the examples and test data (2).

依據圖二所示可以清楚看出,本發明耐瞬間高電壓之介電陶瓷體被製作成為實施例之積層陶瓷電容器1時,其介電陶瓷體層11的組成成份係由複數種不同主成份及副成份燒結形成,其中,副成份係莫耳 數介於0.1~7.0莫耳,而二種主要成份分別係第一主成份BaTiO3,第二主成份ABO3(A=Ca、Sr、Ba;B=Zr、Ti),其中,ABO3依據本發明之實施例係指SrZrO3或CaZrO3粉末,或SrZrO3及CaZrO3的粉末混合物,且二種主要成份的莫耳數符合通式(100-x)BaTiO3-xABO3的配方比例,x係介於0.1~30莫耳。當以XRD繞射儀對介電陶瓷體層11進行偵測,則發現介電陶瓷體層11係同時含有正方晶及菱方晶的複合相鈣鈦礦結構,實施例之繞射結果整理如圖五。依據圖五所示實施例之X-Ray晶體結構繞射分析圖譜(簡稱XRD),依據(100-x)BaTiO3-xABO3的配方通示所燒結形成的介電陶瓷材料系統,相較於材料配方僅係單一主成分BaTiO3具有明顯晶體結構差異性。(100-x)BaTiO3-xABO3的介電陶瓷材料系統顯示有正方晶相BaTiO3及菱方晶相ABO3(A=Ca、Sr、Ba;B=Zr、Ti)的複合相結構,或另稱作雙相結構。 As can be clearly seen from FIG. 2, when the dielectric ceramic body resistant to transient high voltage of the present invention is fabricated as the multilayer ceramic capacitor 1 of the embodiment, the composition of the dielectric ceramic body layer 11 is composed of a plurality of different principal components and The subcomponents are sintered, wherein the subcomponents have a molar number of 0.1 to 7.0 m, and the two main components are the first main component BaTiO 3 and the second main component ABO 3 (A=Ca, Sr, Ba; B = Zr, Ti), wherein, means of ABO 3 SrZrO 3 or CaZrO 3 powder, or the powder mixture SrZrO 3 and CaZrO 3 according to an embodiment of the present invention, and two kinds of number of moles of the main component meet The formula ratio of the formula (100-x) BaTiO 3 -xABO 3 is such that the x series is between 0.1 and 30 m. When the dielectric ceramic body layer 11 is detected by an XRD diffractometer, it is found that the dielectric ceramic body layer 11 has a composite phase perovskite structure containing both tetragonal and rhombohedral crystals, and the diffraction results of the examples are as shown in FIG. . According to the X-Ray crystal structure diffraction analysis map (XRD) of the embodiment shown in FIG. 5, the dielectric ceramic material system formed by sintering according to the formula of (100-x) BaTiO 3 -xABO 3 is compared with The material formulation is only a single main component BaTiO 3 with obvious crystal structure difference. (100-x) BaTiO 3 -xABO 3 dielectric ceramic material system shows a composite phase structure of tetragonal phase BaTiO 3 and rhombohedral phase ABO 3 (A = Ca, Sr, Ba; B = Zr, Ti), Or otherwise called a two-phase structure.

進一步地,如果將各實施例製備成為積層陶瓷電容器並施以電性量測,則結果可依據各組成成份不同整理如第六圖及第七圖,其中,所謂電性量測包含:透過電感電容電阻量測儀(LCR meter)以頻率1kH以下及1Vrms進行TCC數值及損失因子(dielectric loss factor,DF)、以高電阻儀250Vdc量測絕緣電阻(insulation resistance,IR)、以不同升電壓速率200Vdc/s(所測得介電強度,簡稱BDV)及6000Vdc/s(所測得介電強度 ,簡稱BDVH)量測耐瞬間電壓能力。 Further, if the embodiments are prepared as a multilayer ceramic capacitor and subjected to electrical measurement, the results can be arranged according to different composition components, such as the sixth and seventh figures, wherein the electrical measurement includes: through the inductance The capacitance resistance measuring instrument (LCR meter) performs the TCC value and the loss factor (DF) with a frequency of 1kH or less and 1Vrms, and the insulation resistance (IR) with a high resistance meter of 250Vdc. 200Vdc/s (measured dielectric strength, referred to as BDV) and 6000Vdc/s (measured dielectric strength, referred to as BDV H ) are measured to withstand transient voltage capability.

請同時參照第六圖及第五圖的結果,當實施例同時存在有正方晶及菱方晶的複合式鈣鈦礦結構時,其所製備積層陶瓷電容器1,除了絕緣電阻特性有明顯提升外,再比較不同升電壓速率200Vdc/s及6000Vdc/s,所製備積層陶瓷電容器的BDVH結果甚至顯示出具有耐瞬間高電壓的效果,即所製備的積層陶瓷電容器1能夠發揮出抵抗瞬間升幂之高電壓或高電位所造成的破壞。具體而言,觀察第六圖所列實施例1~11,當介電陶瓷層11的第一副成份維持恆定時,隨著第二主成份莫耳數增加,BDV及BDVH得到不錯的數值結果。進一步地,再仔細觀察當中的實施例1~8,所製備積層陶瓷電容器於-55℃~125℃溫度區間的TCC溫度電容數值變化率皆維持於±15%範圍內,符合EIA-X7R規範。換言之,當實施例之介電陶瓷體內同時存在有正方晶及菱方晶的複合式鈣鈦礦結構,其所製備積層陶瓷電容器的產品特性非常優越,將兼具有耐瞬間高電壓及符合EIA-X7R高溫電容穩定的特性。 Please refer to the results of the sixth and fifth figures at the same time. When the composite perovskite structure of tetragonal and rhombohedral is present at the same time, the laminated ceramic capacitor 1 prepared by the composite ceramic capacitor 1 has a significant improvement in insulation resistance. Comparing the different voltage rates of 200Vdc/s and 6000Vdc/s, the BDV H result of the fabricated multilayer ceramic capacitor even shows the effect of resisting transient high voltage, that is, the prepared multilayer ceramic capacitor 1 can resist the instantaneous power. Damage caused by high voltage or high potential. Specifically, when observing Examples 1 to 11 listed in the sixth figure, when the first subcomponent of the dielectric ceramic layer 11 is kept constant, BDV and BDV H obtain good values as the number of moles of the second principal component increases. result. Further, after carefully observing the examples 1 to 8, the laminated ceramic capacitors were maintained at a temperature change rate of ±15% in the temperature range of -55 ° C to 125 ° C, which was in compliance with the EIA-X7R specification. In other words, when the dielectric ceramics of the embodiment have both a tetragonal and rhombohedral composite perovskite structure, the laminated ceramic capacitors have excellent product characteristics, and are resistant to transient high voltage and EIA-compliant. -X7R high temperature capacitor stability characteristics.

又,實施例1~10也顯示,當介電陶瓷體層11內含有的複合式鈣鈦礦結構時,將具有抑制介電損失的效果,且隨著第二主成份SrZrO3或CaZrO3莫耳數增加,介電損失會越小。介電損失為一種能量轉換之形勢,而多數能量損失是以電能轉換熱能的形式。此外,介電損失是電場相位轉換所造成之損失總合(即為交流電場),此介電損失多寡與耐交流電壓能力成反比。而介電材料於交流電場下之破壞機制多為熱能所造成之熱崩潰,故介電損失越低者耐交流電場能力愈佳。對積層陶 瓷電器1而言,介電損失越大通常越容易使積層陶瓷電容器1的內部溫度劇烈增加,倘若內部溫度無法透過由銅或鎳所形成的外部電極13快速傳導至外界環境,則由卑金屬製成的內部電極121、122可能隨時會發生燒毀或熔化。此外,介電陶瓷體層11內所含有的複合式鈣鈦礦結構所提升的介電特性效果更不僅止於此,依據第四圖所列之實施例1、3、6、7、8、9、10及11,當維持副成份不變時,隨著第二主成份莫耳數增加,所製備積層陶瓷電容器1的電容值表現將提升對直流偏壓的抵抗效果。例如:當直流偏壓達到1.5V/um時,實施例1及實施例3已發生約-20.0%的電容變化率衰減,但實施例9、實施例10及實施例11的電容變化率衰減現象卻仍維持於-5.0%範圍內,尤其實施例11的電容變化率幾乎維持於0%不變。倘若觀察第四圖內各曲線趨勢,則當介電陶瓷體層11隨著第二主成份的增加,所製備積層陶瓷電容器1可以適用於更強的直流偏壓環境,對於電容值衰減具有良好抵抗效果。 Further, Examples 1 to 10 also show that when the composite perovskite structure contained in the dielectric ceramic body layer 11 has an effect of suppressing dielectric loss, and with the second main component SrZrO 3 or CaZrO 3 Moule As the number increases, the dielectric loss will be smaller. Dielectric loss is a situation of energy conversion, and most energy losses are in the form of electrical energy conversion heat. In addition, the dielectric loss is the sum of the losses caused by the phase shift of the electric field (ie, the alternating electric field), and the dielectric loss is inversely proportional to the ability to withstand AC voltage. The destruction mechanism of the dielectric material under the alternating electric field is mostly the thermal collapse caused by the thermal energy, so the lower the dielectric loss, the better the resistance to the alternating electric field. For the laminated ceramics 1, the larger the dielectric loss, the more easily the internal temperature of the laminated ceramic capacitor 1 is drastically increased, and if the internal temperature cannot be rapidly transmitted to the external environment through the external electrode 13 formed of copper or nickel, The internal electrodes 121, 122 made of base metal may burn or melt at any time. In addition, the effect of the dielectric properties enhanced by the composite perovskite structure contained in the dielectric ceramic body layer 11 is not limited to this, according to the embodiments 1, 3, 6, 7, 8, and 9 listed in the fourth figure. 10 and 11, when the auxiliary component remains unchanged, as the number of moles of the second principal component increases, the capacitance value of the laminated ceramic capacitor 1 produced will increase the resistance to DC bias. For example, when the DC bias voltage reaches 1.5 V/um, the capacitance change rate attenuation of about -20.0% has occurred in the first embodiment and the third embodiment, but the capacitance changes of the embodiment 9, the embodiment 10, and the embodiment 11 are changed. The rate decay phenomenon is still maintained in the range of -5.0%, and in particular, the capacitance change rate of Embodiment 11 is maintained at almost 0%. If the trend of each curve in the fourth graph is observed, when the dielectric ceramic body layer 11 increases with the second main component, the laminated ceramic capacitor 1 can be applied to a stronger DC bias environment, and has good resistance to capacitance value attenuation. effect.

進一步地,為詳細敘述本發明之技術效果,將依據第六圖所列各實施例依序分析並敘述電性量測結果。首先,觀察第六圖各實施例的組成配方,當第二主成份介於0~30mol%時,於較低升壓速率200Vdc/s所量測到介電強度BDV可達到71~119Vdc/μm,此結果係相當好的耐電壓能力,尤其第二主成份含量介於3~11mol%時,介電強度BDV甚至高達100Vdc/μm以上。唯須提醒,實施例1的化學組成僅係單一種主成分BaTiO3並添加複數種副成份,在200Vdc/s的升壓速率條件具有110Vdc/μm,但當升壓速率改提高至6000Vdc/s時,其介電強度卻只有27Vdc /μm,歸納原因係實施例1由於未添加任何第二主成份,致使XRD繞射峰只顯示單一種鈣鈦礦晶體結構,故無法發揮抵抗瞬間高電壓的技術效果。如果考慮雷擊或突波發生的情形,實施例1的特性會造成介電強度數值起伏變化過大,繼而容易衝擊電子迴路內各電子零組件間的協同作業並造成失效,故所製備成的電容器並非本發明所期待的可抵抗瞬間高電壓升幂的穩定電容器。反之,本發明所期待的可抵抗瞬間高電壓升幂的電容器,其介電陶瓷體層11係添加有至少0.1mole以上的第二主成分並於燒結後形成有正方晶及菱方晶的複合式鈣鈦礦結構。以實施例4及實施例7為例,因為其含有特定比例的第二主成分,燒結後將使介電陶瓷體層內部同時含有正方晶及菱方晶的存在,這種複合式鈣鈦礦結構對於BDV及BDVH介電強度的數值趨於和緩,顯示對於瞬間高電壓的突然衝擊將不致於發生過度起伏變化,且在複數種副成份作用下,其電容溫度變化亦符合EIA-X7R規範。無論係瞬間高電壓變化或高溫變化環境,從產品可靠性的角度作評比,它們都將係較穩定的電容器產品。 Further, in order to describe in detail the technical effects of the present invention, the electrical measurement results will be analyzed and described in sequence according to the embodiments listed in the sixth figure. First, observe the composition formula of each embodiment in the sixth figure. When the second principal component is between 0 and 30 mol%, the dielectric strength BDV measured at a lower voltage increase rate of 200 Vdc/s can reach 71 to 119 Vdc/μm. This result is quite good withstand voltage capability, especially when the content of the second main component is between 3 and 11 mol%, and the dielectric strength BDV is even higher than 100 Vdc/μm. It should be reminded that the chemical composition of Example 1 is only a single main component of BaTiO 3 and a plurality of sub-components are added, which has 110 Vdc/μm at a boost rate of 200 Vdc/s, but the boost rate is increased to 6000 Vdc/s. At the same time, the dielectric strength is only 27Vdc /μm. The reason for the inductive method is that the XRD diffraction peak shows only a single perovskite crystal structure because it does not add any second main component, so it can not exert the resistance to instantaneous high voltage. Technical effects. If the situation of lightning strike or glitch occurs, the characteristics of Embodiment 1 may cause the variation of the dielectric strength value to be excessively large, and then it is easy to impact the cooperation between the electronic components in the electronic circuit and cause failure, so the prepared capacitor is not A stabilized capacitor that is expected to withstand transient high voltage rises as contemplated by the present invention. On the other hand, in the capacitor which is expected to resist the transient high voltage power, the dielectric ceramic body layer 11 is formed by adding a second main component of at least 0.1 mole or more and forming a composite of tetragonal and rhombohedral crystals after sintering. Perovskite structure. Taking Example 4 and Example 7 as an example, since it contains a specific proportion of the second main component, after sintering, the dielectric ceramic body layer contains both the presence of tetragonal and rhombohedral crystals, and the composite perovskite structure The values of the dielectric strength of BDV and BDV H tend to be gentle, indicating that the sudden impact of instantaneous high voltage will not cause excessive fluctuations, and the capacitance temperature changes under the action of a plurality of sub-components are also in compliance with the EIA-X7R specification. Regardless of the instantaneous high voltage change or high temperature change environment, they will be more stable capacitor products from the perspective of product reliability.

又,依據第六圖所示各實施例結果進一步分析,當第二主成份含量介於5~15mole,所測得BDVH皆高於70Vdc/μm的結果,而此結果不侷限於第二主成份SrZrO3及CaZrO3兩者之間比例應維持於1:1的固定條件。例如:實施例12~21所示第二主成份總含量維持5mole時,任意改變SrZrO3/CaZrO3的比值介於0~1,結果仍可得到非常良好的耐瞬間電壓特性並同時符合EIA-X7R規範。然而,如果第二主成份中所添加的CaZrO3莫耳數偏高,TCC溫度電容穩定性將開始變差。以實施例21為例,雖然具 有良好BDVH特性,但高溫125℃時所測得TCC數值逼近EIA-X7R規範所要求的-15%臨界限。 Further, according to the results of the examples shown in the sixth figure, when the second principal component content is between 5 and 15 moles, the measured BDV H is higher than 70 Vdc/μm, and the result is not limited to the second main. The ratio between the components SrZrO 3 and CaZrO 3 should be maintained at a fixed condition of 1:1. For example, when the total content of the second principal component is maintained at 5 moles in Examples 12 to 21, the ratio of SrZrO 3 /CaZrO 3 is arbitrarily changed from 0 to 1, and the result is still very good transient voltage resistance and EIA-compliant. X7R specification. However, if the number of CaZrO 3 moles added in the second principal component is too high, the TCC temperature capacitance stability will begin to deteriorate. Taking Example 21 as an example, although having good BDV H characteristics, the measured TCC value at a high temperature of 125 ° C approximates the -15% critical limit required by the EIA-X7R specification.

請參照第七圖各實施例,第七圖係選擇實施例4所記載第一主成分及第二主成分之莫耳數為基礎並維持固定不變,再任意改變多種不同副成份的添加量及比例,目的係在複合式鈣鈦礦結構的穩定基礎下進一步再優化TCC溫度電容曲線在-55~125℃區間的變化率及調整絕緣電阻。以第一副成份MgO及MnCO3為例,其中,MgO對於穩定TCC溫度電容曲線在-55~125℃區間的變化率有較好的效果,具體結果如實施例22~28所示,隨著MgO添加量從0.5莫耳逐漸增加至7.0莫耳,125℃的電容值變化率於開始從-14.5%收斂至-6.6%。同時,隨著MgO添加量增加,絕緣電阻亦開始自66.9GΩ逐漸增加至100.9GΩ。另一種第一副成份MnCO3,具體如實施例29~33所示,隨著添加量增加,同樣具有改善溫度電容穩定性及提升絕緣電阻的效果。 Referring to each embodiment of the seventh embodiment, the seventh figure selects the number of moles of the first principal component and the second principal component described in the fourth embodiment and maintains the fixed number, and then arbitrarily changes the addition amount of the plurality of different accessory components. And the ratio, the purpose is to further optimize the rate of change of TCC temperature capacitance curve in the range of -55 ~ 125 °C and adjust the insulation resistance under the stability of the composite perovskite structure. Taking the first subcomponents MgO and MnCO 3 as examples, among them, MgO has a good effect on the rate of change of the stable TCC temperature capacitance curve in the range of -55 to 125 °C, and the specific results are as shown in Examples 22-28. The amount of MgO added gradually increased from 0.5 mol to 7.0 mol, and the change rate of the capacitance value at 125 ° C converges from -14.5% to -6.6% at the beginning. At the same time, as the amount of MgO added increases, the insulation resistance also gradually increases from 66.9 GΩ to 100.9 GΩ. Another first subcomponent MnCO 3 , as shown in Examples 29 to 33, has the effect of improving temperature and capacitance stability and improving insulation resistance as the amount of addition increases.

又,觀察第七圖所記載各實施例,其中,所添加之第二副成份Y2O3及Ho2O3等三價金屬離子氧化物,由於第二通常可以降低還原氣氛燒結時所產生氧空缺,故隨著添加量增加,絕緣電阻亦有提高趨勢,具體如實施例31及實施例34~41所示。當Y2O3添加量為1mole時,絕緣電阻為68.7GΩ,隨著添加量依序提高至1.5、2、3及5mole時,絕緣電阻亦依序提升至68.6GΩ、82.3GΩ、124.4GΩ及149.4GΩ。因此,第二副成份添加量增加將能夠大幅度地提高絕緣電阻特性,而且TCC電容溫度穩定性幾乎不致於發 生太大波動,但添加量過多時另會造成介電常數降低,故組成調配上應予留意。另外,由實施例34及實施例39~41可知,Y2O3及Ho2O3等三價離子間發生原子彼此間置換的效果。 Further, each of the examples described in the seventh embodiment is observed, wherein the added trivalent metal ion oxide such as the second subcomponents Y 2 O 3 and Ho 2 O 3 is usually produced by lowering the sintering atmosphere in the reducing atmosphere. Oxygen vacancies, so as the amount of addition increases, the insulation resistance also tends to increase, as shown in Example 31 and Examples 34-41. When the amount of Y 2 O 3 added is 1 mole, the insulation resistance is 68.7 GΩ. When the addition amount is increased to 1.5, 2, 3 and 5 mole, the insulation resistance is also increased to 68.6 GΩ, 82. 3GΩ, 124.4GΩ and 149.4GΩ. Therefore, the addition of the second subcomponent increases the insulation resistance characteristics, and the temperature stability of the TCC capacitor hardly causes too much fluctuation, but when the amount of addition is too large, the dielectric constant is lowered, so the composition is adjusted. It should be noted. Further, from Example 34 and Examples 39 to 41, it is understood that an effect of replacing atoms between trivalent ions such as Y 2 O 3 and Ho 2 O 3 occurs.

進一步地,再觀察第七圖所記載各實施例,其中,添加有第三副成份促進燒結,主要係選擇含有Si離子之氧化物,例如:(Ba0.6Ca0.4)SiO3。以實施例31及實施例42~45為例,如果組成配方只改變(Ba0.6Ca0.4)SiO3的添加量且持續介於0.5~2mole時,對於介電特性並不會發生任何明顯變化。然而,若添加量高達4mole時,則TCC溫度電容曲線的穩定性有逐漸降低趨勢,但仍可符合EIA-X7R規範,如實施例45所示。依據第七圖所列各實施例結果整體而言,無論添加任何一種副成份,適當應介於0.1~7.0莫耳,較佳係0.1~3.0莫耳,因為當添加量過多時,皆可能會意外造成TCC曲線穩定性逐漸偏離EIA-X7R規範或造成其它介電特性不良,故應特別留意。 Further, each of the examples described in the seventh embodiment is further observed, in which a third subcomponent is added to promote sintering, and an oxide containing Si ions is mainly selected, for example, (Ba 0.6 Ca 0.4 )SiO 3 . Taking Example 31 and Examples 42 to 45 as an example, if the composition formula only changes the addition amount of (Ba 0.6 Ca 0.4 )SiO 3 and continues to be between 0.5 and 2 mole, the dielectric properties are not Any significant changes will occur. However, if the addition amount is as high as 4 mole, the stability of the TCC temperature capacitance curve gradually decreases, but still conforms to the EIA-X7R specification, as shown in Embodiment 45. According to the results of the various examples listed in the seventh figure, whether adding any one of the sub-components, it should be between 0.1 and 7.0 m, preferably 0.1 to 3.0 m, because when the amount is too large, Special attention may be paid to the fact that the stability of the TCC curve may gradually deviate from the EIA-X7R specification or cause other dielectric properties.

請參酌第三圖,係本發明實施例之介電陶瓷體製備成型電容器方法,係可依據下列步驟流程進行,其中: Referring to FIG. 3, a method for preparing a capacitor for a dielectric ceramic body according to an embodiment of the present invention may be performed according to the following steps, wherein:

(A01)添加主成份,可為二種主要成份,分別為第一主成份BaTiO3,第二主成份ABO3。及同時 (A01) adding a main component, which may be two main components, respectively being a first main component BaTiO 3 and a second main component ABO 3 . And simultaneously

(A02)添加至少一種副成份,係與主成份不同種類之副成份。 (A02) Adding at least one accessory component, which is a subcomponent different from the main component.

(A03)漿料製備,可添加甲苯、無水酒精、塑化劑、黏結劑及分散劑等。 (A03) Preparation of a slurry, which may be added with toluene, anhydrous alcohol, a plasticizer, a binder, a dispersant, and the like.

(A04)刮刀成型製備生胚薄帶。 (A04) Scraper forming a raw metal strip.

(A05)網印內電極層。 (A05) Screen printing internal electrode layer.

(A06)生胚製備,進行疊層、均壓、切割等。 (A06) Preparation of raw embryos, lamination, pressure equalization, cutting, and the like.

(A07)燒除有機質。 (A07) Burning off organic matter.

(A08)還原氣氛燒結。 (A08) Sintering in a reducing atmosphere.

(A09)再氧化熱處理。 (A09) Reoxidation heat treatment.

(A10)製備外部電極。 (A10) An external electrode was prepared.

(A11)電性量測。 (A11) Electrical measurement.

前述步驟(A01)及(A02),其中,主成分及副成分粉末的製備方式係首先將BaCO3、CaCO3、SrCO3、TiO2、Zr2O5及SiO2以常見之固相合成法於高溫900℃~1300℃間煆燒成為BaTiO3、CaZrO3、SrZrO3、CaTiO3、SrTiO3及(Ba0.6Ca0.4)SiO3粉末。再將所有原料BaTiO3、CaZrO3、SrZrO3、CaTiO3、SrTiO3、(Ba0.6Ca0.4)SiO3、MgO、MnCO3、Y2O3、Ho2O3及Al2O3粉末依照第六圖及第七圖相對莫耳數比例均勻混合。 The above steps (A01) and (A02), wherein the main component and the subcomponent powder are prepared by firstly using BaCO 3 , CaCO 3 , SrCO 3 , TiO 2 , Zr 2 O 5 and SiO 2 as common solid phase synthesis methods. It is calcined at a high temperature of 900 ° C to 1300 ° C to form BaTiO 3 , CaZrO 3 , SrZrO 3 , CaTiO 3 , SrTiO 3 and (Ba 0.6 Ca 0.4 ) SiO 3 powder. Then all the raw materials BaTiO 3 , CaZrO 3 , SrZrO 3 , CaTiO 3 , SrTiO 3 , (Ba 0.6 Ca 0.4 )SiO 3 , MgO, MnCO 3 , Y 2 O 3 , Ho 2 O 3 and Al 2 O 3 The powder is uniformly mixed according to the sixth and seventh figures relative to the molar ratio.

前述步驟(A03),混合各成分製備成陶瓷漿料,係將各相對比例配製的介電陶瓷配方粉末,再加入甲苯、無水酒精、塑化劑、黏結劑及分散劑後均勻混合。 In the foregoing step (A03), the components are mixed to prepare a ceramic slurry, and the dielectric ceramic powder prepared in each relative proportion is added to toluene, anhydrous alcohol, plasticizer, binder and dispersant, and then uniformly mixed.

前述步驟(A04),以刮刀成型法製備成厚度25μm的陶瓷生胚薄帶。 In the foregoing step (A04), a ceramic green embryo strip having a thickness of 25 μm was prepared by a doctor blade method.

前述步驟(A05),網印內電極層係利用網印方式將商 用銀(Ag)、鉑(Pb)、銅(Cu)或鎳(Ni)金屬漿料,以設計好的內電極圖案印於陶瓷生胚薄帶上。 In the foregoing step (A05), the screen inner electrode layer is printed by means of screen printing. A silver (Ag), platinum (Pb), copper (Cu) or nickel (Ni) metal paste is applied to the ceramic green foil strip with a designed internal electrode pattern.

前述步驟(A06),生胚製備主要係指疊層、均壓及切割三個程序,將印製有內電極圖案的陶瓷生胚薄帶依序堆疊以後,再利用熱水均壓方式將各生胚薄帶壓縮緊密,並裁切製成原先設計好之積層陶瓷生胚。 In the foregoing step (A06), the preparation of the raw embryo mainly refers to three processes of lamination, pressure equalization and cutting, and the ceramic green embryo strips printed with the internal electrode pattern are sequentially stacked, and then the hot water equalizing method is used. The raw embryonic strip is compressed tightly and cut into a previously designed laminated ceramic green embryo.

前述步驟(A07),燒除有機質係指將積層陶瓷生胚於純N2環境下,以330~500℃(升溫速率2℃/min)持溫6~20小時,使生胚中的各有機質完全燒除。 In the above step (A07), the organic matter is burned off, and the laminated ceramic green embryos are held in a pure N 2 atmosphere at a temperature of 330 to 500 ° C (heating rate 2 ° C / min) for 6 to 20 hours to make each organic matter in the green embryo. Completely burned out.

前述步驟(A08),還原氣氛燒結係指將燒除有機質後的積層陶瓷生胚置於98%N2-2%H2與35℃飽和水蒸汽所組成的還原氣氛下,以1000~1400℃(升溫速率3℃/min)進行燒結程序並持溫2小時。 In the foregoing step (A08), the reducing atmosphere sintering refers to placing the laminated ceramic green body after burning the organic matter in a reducing atmosphere consisting of 98% N 2 -2% H 2 and saturated water vapor of 35 ° C, at 1000 to 1400 ° C. (The heating rate was 3 ° C / min) The sintering procedure was carried out and the temperature was held for 2 hours.

前述步驟(A09),再氧化熱處理係前述步驟的程序滿2小時以後,開始降低溫度至900℃~1050℃溫度區間內(降溫速率4℃/min)並於60ppm~150ppm氧壓或大氣氣氛中進行氧化熱處理,然後再緩緩降至室溫以得到積層陶瓷熟胚。 In the foregoing step (A09), after the reoxidation heat treatment is completed for 2 hours, the temperature is lowered to a temperature range of 900 ° C to 1050 ° C (cooling rate 4 ° C / min) and in an oxygen pressure of 60 ppm to 150 ppm or an atmospheric atmosphere. An oxidative heat treatment is carried out, and then gradually lowered to room temperature to obtain a laminated ceramic cooked embryo.

前述步驟(A10),製備外部電極係將外露出熟胚兩側之內電極端部披覆銀(Ag)、銅(Cu)、鎳(Ni)或錫(Sn)等電極糊狀漿料後,在純N2的氣氛下升溫至800℃~900℃之間(降溫速率15℃/min)再爐冷降至室溫,至此完成積層陶瓷電容器樣品之製備。 In the foregoing step (A10), the external electrode system is prepared to expose the electrode paste on both sides of the mature embryo with an electrode paste slurry such as silver (Ag), copper (Cu), nickel (Ni) or tin (Sn). The temperature was raised to 800 ° C to 900 ° C in a pure N 2 atmosphere (cooling rate 15 ° C / min) and then cooled to room temperature, thereby completing the preparation of the laminated ceramic capacitor sample.

依據前述流程步驟,所製備本發明實施例之積層陶瓷電容器,如第七圖所示。積層陶瓷電容器1係包括複數層疊之介電陶瓷體層11、以及沿著各介電陶瓷體層11之表面間隔堆疊成型之複數內電極層12,且複數內電極層12可包括有複數內電極121、122並呈相互交錯排列,彼此之間係藉由介電陶瓷體層11隔開。積層陶瓷電容器1的二外側處分別製備成型外部電極13,而各外部電極13分別與內電極121、122連接導通,其中,當電性傳導至內電極121、122時即受介電體層11所阻隔繼而產生介電效果。內電極層12之複數內電極121、122係可分別為銀(Ag)、鉑(Pb)、銅(Cu)或鎳(Ni)等金屬材質所製成之內電極,而卑金屬製程多係選擇鎳(Ni)或銅(Cu)作為鎳內電極。外部電極13,則可分別為銅(Cu)、鎳(Ni)或錫(Sn)等金屬材質所製成之外電極。 According to the foregoing process steps, the multilayer ceramic capacitor of the embodiment of the present invention is prepared as shown in the seventh figure. The multilayer ceramic capacitor 1 includes a plurality of stacked dielectric ceramic body layers 11 and a plurality of internal electrode layers 12 stacked along the surface of each of the dielectric ceramic body layers 11, and the plurality of internal electrode layers 12 may include a plurality of internal electrodes 121, 122 are interdigitated and spaced apart from each other by a dielectric ceramic body layer 11. The outer electrodes 13 are respectively formed on the outer sides of the multilayer ceramic capacitors 1, and the external electrodes 13 are respectively connected to the inner electrodes 121 and 122, wherein the dielectric layers 11 are electrically conducted to the inner electrodes 121 and 122. The barrier then produces a dielectric effect. The plurality of internal electrodes 121 and 122 of the internal electrode layer 12 may be internal electrodes made of a metal such as silver (Ag), platinum (Pb), copper (Cu) or nickel (Ni), and the base metal process is multi-system. Nickel (Ni) or copper (Cu) is selected as the nickel internal electrode. The external electrodes 13 may be external electrodes made of a metal material such as copper (Cu), nickel (Ni) or tin (Sn).

故,本發明為主要針對耐瞬間高電壓之介電陶瓷體進行設計,該介電陶瓷體係包含第一主成份BaTiO3及第二主成份ABO3,二種主成份符合通式(100-x)BaTiO3-xABO3的配方比例,且第二主成份ABO3,其中,A係選自Ba、Sr、Ca所組成元素群組之任一,B係選自Zr或Ti元素,第二主成份ABO3較佳係SrZrO3或CaZrO3,並進一步添加至少一種副成份共同進行燒結,所形成之介電陶瓷體係含有正方晶及菱方晶同時共存之複合相結構,可達到具有抵抗瞬間電位升冪所造成的介電破壞效果,同時溫度電容表現亦符合EIA-X7R之電容器規範。惟,以上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內 容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 Therefore, the present invention is mainly designed for a dielectric ceramic body resistant to transient high voltage, the dielectric ceramic system comprising a first main component BaTiO 3 and a second main component ABO 3 , the two main components conform to the general formula (100-x a formulation ratio of BaTiO 3 -xABO 3 and a second main component ABO 3 , wherein the A is selected from any group consisting of Ba, Sr, and Ca, and the B is selected from the group consisting of Zr or Ti, and the second main component The component ABO 3 is preferably SrZrO 3 or CaZrO 3 , and further sintered by adding at least one accessory component, and the formed dielectric ceramic system contains a composite phase structure in which tetragonal crystal and rhombohedral crystal coexist at the same time, and can achieve resistance to transient potential The dielectric damage caused by the ascending power, while the temperature and capacitance performance also meets the capacitor specifications of the EIA-X7R. However, the above description is only the preferred embodiment of the present invention, and thus it is not intended to limit the scope of the present invention. Therefore, the simple modification and equivalent structural changes of the present specification and the drawings should be treated similarly. It is included in the scope of the patent of the present invention and is combined with Chen Ming.

綜上所述,本發明上述瞬間耐高壓之陶瓷電容體於實際應用實施時,為確實能達到其功效及目的,故本發明誠為一實用性優異之研發,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦研發、創設,倘若 鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the above-mentioned instant high-voltage resistant ceramic capacitor body can achieve its efficacy and purpose when implemented in practical applications, so the invention is an excellent research and development, and is an application requirement for the invention patent.提出 Submit an application in accordance with the law, and hope that the trial committee will grant this case as soon as possible to protect the inventor's hard work in research and development, and create a report. If there is any doubt in the trial committee, please do not hesitate to give instructions to the inventor, and the inventor will try his best to cooperate.

1‧‧‧積層陶瓷電容器 1‧‧‧Multilayer ceramic capacitors

11‧‧‧介電陶瓷體層 11‧‧‧Dielectric ceramic body layer

12‧‧‧內電極層 12‧‧‧Internal electrode layer

121、122‧‧‧內電極 121, 122‧‧‧ internal electrodes

13‧‧‧外部電極 13‧‧‧External electrode

Claims (10)

一種耐瞬間高電壓之介電陶瓷體,係包含第一主成份BaTiO3及第二主成份ABO3,其特徵在於:該二種主成份符合通式(100-x)BaTiO3-xABO3的配方比例(30≧x≧0.1;A係選自Ba、Sr、Ca所組成元素群組之任一;B係選自Zr或Ti元素),且進一步含有至少一種副成份,其中,該介電陶瓷體於X射線繞射分析上界定係含有正方晶鈣鈦礦及菱方晶鈣鈦礦的複合結構。 An instant high voltage resistant dielectric ceramic body comprising a first main component BaTiO 3 and a second main component ABO 3 , wherein the two main components conform to the general formula (100-x) BaTiO 3 -xABO 3 Formulation ratio (30≧x≧0.1; A is selected from any group of elements composed of Ba, Sr, Ca; B is selected from Zr or Ti elements), and further contains at least one accessory component, wherein The dielectric ceramic body defines a composite structure containing a tetragonal perovskite and a rhombohedral perovskite on X-ray diffraction analysis. 如申請專利範圍第1項所述耐瞬間高電壓之介電陶瓷體,其中該第二主成份含量係介於1.0~15.0莫耳。 The dielectric ceramic body resistant to transient high voltage according to claim 1, wherein the second principal component content is between 1.0 and 15.0 m. 如申請專利範圍第2項所述耐瞬間高電壓之介電陶瓷體,其中第二主成份係SrZrO3或CaZrO3The dielectric ceramic body resistant to transient high voltage according to claim 2, wherein the second main component is SrZrO 3 or CaZrO 3 . 如申請專利範圍第1項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係第一副成份,且該副成份含量係介於0.1~7.0莫耳。 The dielectric ceramic body resistant to transient high voltage according to claim 1, wherein the auxiliary component is a first subcomponent, and the subcomponent content is 0.1 to 7.0 m. 如申請專利範圍第4項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係選自MgO、ZnO、CuO、GeO、FeO及NiO所組成的群組。 The dielectric ceramic body resistant to transient high voltage according to claim 4, wherein the auxiliary component is selected from the group consisting of MgO, ZnO, CuO, GeO, FeO and NiO. 如申請專利範圍第4項所述耐瞬間高電壓之介電陶瓷體,其中該副成份係為MnCO3或CoCO3The dielectric ceramic body resistant to transient high voltage according to claim 4, wherein the auxiliary component is MnCO 3 or CoCO 3 . 如申請專利範圍第4項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第二副成份,且該第二副成份係選自GaO3、Cr2O3、Sc2O3、La2O3、Nd2O3、Pm2O3、Sm2O3、Eu2O3、 Gd2O3、Dy2O3、Er2O3、Tm2O3及Yb2O3所組成群組。 The dielectric ceramic body resistant to transient high voltage according to claim 4, further comprising a second subcomponent, wherein the second subcomponent is selected from the group consisting of GaO 3 , Cr 2 O 3 , Sc 2 O 3 , La 2 O 3 , Nd 2 O 3 , Pm 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , Dy 2 O 3 , Er 2 O 3 , Tm 2 O 3 and Yb 2 O 3 Form a group. 如申請專利範圍第7項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第三副成份,且該第三副成份係選自BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3所組成群組。 The dielectric ceramic body resistant to transient high voltage according to claim 7 , further comprising a third auxiliary component selected from the group consisting of BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 )SiO 3 groups. 如申請專利範圍第4項所述耐瞬間高電壓之介電陶瓷體,其中進一步包含有第二副成份,且該第二副成份係選自BaSiO3、CaSiO3及(Ba0.6Ca0.4)SiO3所組成群組。 The dielectric ceramic body resistant to transient high voltage according to claim 4, further comprising a second subcomponent selected from the group consisting of BaSiO 3 , CaSiO 3 and (Ba 0.6 Ca 0.4 )SiO 3 groups. 如申請專利範圍第2至9項之任一項所述耐瞬間高電壓之介電陶瓷體,其中該任一種副成份含量係介於0.1~5.0莫耳。 The transient high voltage dielectric ceramic body according to any one of claims 2 to 9, wherein any one of the subcomponent contents is between 0.1 and 5.0 m.
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