TWI656938B - Cutting apparatus and cutting method using the same - Google Patents

Abstract

The cutting equipment includes a conveying mechanism, a laser cutter and a grinding element. The conveying mechanism is used for conveying the optical film. The laser cutter is used to cut the optical film, and the cut optical film forms a cutting edge. The grinding element is used to grind the cutting edge.

Description

Cutting equipment and cutting method using same

The invention relates to a cutting device and a cutting method using the same, and more particularly to a cutting device with a grinding element and a cutting method using the same.

After cutting the traditional optical film, foreign matter such as filamentous chips will be generated on the cutting surface. This foreign body can affect product quality and even cause product defects.

Therefore, the present invention proposes a cutting device and a cutting method using the same, which can improve the aforementioned conventional problems.

According to an embodiment of the present invention, a cutting device is provided. The cutting equipment includes a conveying mechanism, a first laser cutter and a first grinding element. The conveying mechanism is used for conveying the optical film. The first laser cutter is used to cut the optical film, and the cut optical film forms a first cutting edge. The first grinding element is used for grinding the first cutting edge.

According to another embodiment of the present invention, a cutting method using a cutting device is proposed. The cutting method is used for cutting an optical film. The cutting equipment includes a conveying mechanism, a first laser cutter and a first grinding element. The cutting method includes the following steps. The conveying mechanism transmits the optical film; the first laser cutter cuts the optical film, wherein the cut optical film forms a first cutting edge; and the first grinding element grinds the first cutting edge .

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

10‧‧‧ Optical diaphragm

10s1‧‧‧First crop edge

10s1’‧‧‧first ground edge

10s2‧‧‧Second crop edge

10b‧‧‧ lower surface

10e 、 10e’‧‧‧outer side

10u‧‧‧upper surface

11, 12‧‧‧ side material

13‧‧‧The first optical film

14‧‧‧Second optical film

100, 200, 300, 400, 500, 600, 700, 800‧‧‧ cutting equipment

110‧‧‧ Conveying mechanism

111‧‧‧ Wheel

120‧‧‧The first laser cutter

130‧‧‧second laser cutter

135‧‧‧The third laser cutter

140‧‧‧first grinding element

141, 341‧‧‧ grinding wheels

142‧‧‧ Abrasives

141s‧‧‧outer surface

143, 343‧‧‧ mandrel

150‧‧‧Second grinding element

160‧‧‧First Drive

170‧‧‧Second Drive

260‧‧‧The first dust collection device

261‧‧‧The first dust cover

261a‧‧‧through hole

262‧‧‧The first transmission tube

263‧‧‧First suction element

264‧‧‧Filter

270‧‧‧Second dust collecting device

340‧‧‧first grinding element

341a‧‧‧accommodation hole

3431‧‧‧burst

350‧‧‧Second grinding element

360‧‧‧First elastic element

540, 640, 740‧‧‧ first cleaning device

541‧‧‧cleaning liquid supplier

541a, 741a, 742a

541b, 741b, 742b‧‧‧ Entrance

542‧‧‧Cleaning liquid absorber

5421‧‧‧First clamping section

5422‧‧‧Second clamping section

550‧‧‧Second cleaning device

641‧‧‧carrying parts

642‧‧‧ Catheter

643‧‧‧fluid control

740a‧‧‧Cleaning liquid supply group

740b‧‧‧Cleaning liquid recovery group

740c‧‧‧filter

741‧‧‧cleaning liquid supplier

742‧‧‧Cleaning liquid recovery device

880‧‧‧ Stability Agency

881‧‧‧ limit piece

8811‧‧‧First limit department

8812‧‧‧Second Limiting Department

882‧‧‧ support rod

D1, D11, D12‧‧‧ Conveying direction

E1‧‧‧Chip

F1‧‧‧ Power

L1‧‧‧Cleaning liquid

T1‧‧‧Turn the tangent direction

FIG. 1A is a schematic diagram of a cutting device according to an embodiment of the present invention.

FIG. 1B shows a partial top view of the cutting device of FIG. 1A.

Figure 1C shows a cross-sectional view before grinding of the optical film of Figure 1B.

Figure 1D shows a cross-sectional view of the optical film in Figure 1B after grinding.

FIG. 2A is a schematic diagram of a cutting device according to another embodiment of the present invention.

Figure 2B shows a partial house view of the cutting device of Figure 2A.

FIG. 3A is a schematic diagram of a cutting device according to another embodiment of the present invention.

Fig. 3B shows a partial top view of the cutting device of Fig. 3A.

FIG. 4A is a schematic diagram of a cutting device according to an embodiment of the present invention.

FIG. 4B shows a partial top view of the cutting device of FIG. 4A.

FIG. 5A is a schematic diagram of a cutting device according to an embodiment of the present invention.

Fig. 5B shows a partial top view of the cutting device of Fig. 4A.

FIG. 5C is a schematic perspective view of the first cleaning device in FIG. 5A.

FIG. 6 is a schematic diagram of a cutting device according to another embodiment of the present invention.

FIG. 7 is a schematic diagram of a cutting device according to another embodiment of the present invention.

FIG. 8 is a schematic diagram of a cutting device according to another embodiment of the present invention.

Please refer to FIGS. 1A to 1D. FIG. 1A shows a schematic diagram of a cutting device 100 according to an embodiment of the present invention. FIG. 1B shows a partial top view of the cutting device 100 in FIG. 1A. FIG. 1B is a cross-sectional view before grinding the optical film 10, and FIG. 1D is a cross-sectional view after grinding the optical film 10 of FIG. 1B.

The cutting device 100 is used for cutting the optical film 10. For example, the optical film 10 may be a single-layer or multi-layer film, such as a polarizer, retardation film, brightness enhancement film, or other optical gain, alignment, compensation, turning, orthogonal, diffusion, protection, Anti-stick, scratch-resistant, anti-glare, reflection suppression, high refractive index and other helpful films; polarizing plates, retardation films, etc. with a protective film attached to at least one side of the aforementioned polarizer; protective films, materials such as Selected from: cellulose resin, acrylic resin, amorphous polyolefin resin, polyester resin, polycarbonate resin, and combinations thereof, the disclosure is not limited to these films.

The cutting device 100 includes a conveying mechanism 110, a first laser cutter 120, a second laser cutter 130, a first grinding element 140, a second grinding element 150, The first driver 160 and the second driver 170.

The conveying mechanism 110 includes at least one roller 111 for conveying the optical film 10 to move in the conveying direction D1. The first laser cutter 120 and the second laser cutter 130 are used to cut the optical film 10. The first laser cutter 120 and the second laser cutter 130 make the cut optical film 10 into two opposite sides 11 and 12. The blanks 11 and 12 can be rolled up by a blank recovery mechanism, such as a take-up wheel (not shown). Alternatively, the side materials 11 and 12 can be collected by a dead weight into a recycling box (not shown).

The cut optical film 10 forms a first cutting edge 10s1 and a second cutting edge 10s2. The first grinding element 140 and the second grinding element 150 are used to grind the first cutting edge 10s1 and the second cutting edge 10s2, respectively, so as to remove the residue on the first cutting edge 10s1 and the second cutting edge 10s2. Chip particles to prevent these particles from affecting the optical film 10 and / or polluting the environment and process equipment.

The first grinding element 140 includes a grinding wheel 141 and a grinding member 142. The abrasive member 142 may include abrasive paper, abrasive wheels, abrasive wheels, cotton wheels, wool wheels, non-woven abrasive wheels, polishing wheels, fleece wheels, abrasive belts, structural abrasive belts, water abrasive paper, vegetable cloth, vegetable melon Cloth belt, abrasive disc, flexible abrasive disc, slice, abrasive cloth wheel, abrasive disc, cloth wheel, white cloth wheel, green cloth wheel, hemp wheel, green oil stick, white oil stick, blue stick, sponge grinding wheel, sea Cotton grit, polished sponge or sponge wheel. The grinding wheel 141 is, for example, a cylindrical wheel, but the embodiment of the present invention is not limited thereto. The grinding wheel 141 has an outer peripheral surface 141s, and the grinding member 142 can cover the outer peripheral surface 141s of the grinding wheel 141 to grind the optical film 10. In this embodiment, the grinding member 142 can be enclosed around the entire outer peripheral surface 141s so that the grinding wheel 141 can continuously grind to the first cutting edge 10s1 when the grinding wheel 141 rotates. In addition, for the abrasive part 142 as the sandpaper, the specifications of the sandpaper can be selected from 200 to 1200. The sandpaper number refers to the average number of meshes in a 1-inch square area, so as to distinguish the thickness, that is, in the same area, the smaller the number, the smaller the number of particles, the larger and rough the particles. On the contrary, the larger the number, the more particles in the same area, the smaller the particles.

In other embodiments, the first grinding element 140 may omit the grinding member 142. Under this design, the outer peripheral surface 141s of the grinding wheel 141 provides a surface roughness or grinding particles similar to or the same as the grinding member 142 to grind.剪 光 膜片 10。 Optics film 10. In addition, the second grinding element 150 has a structure similar to or the same as the first grinding element 140, and details are not described herein again. In another embodiment, if the second cutting edge 10s2 has no grinding requirement, the cutting device 100 may omit the second grinding element 150 and the second driver 170.

In an embodiment, the first grinding element 140 may be another laser light source.

As shown in FIG. 1C, the optical film 10 before cutting has an upper surface 10u and a lower surface 10b. The first cutting edge 10s1 includes an outer surface 10e, a portion of the upper surface 10u near the outer surface 10e, and a lower surface 10b near the outside. A part of the side surface 10e, wherein the outer side surface 10e extends obliquely from the upper surface 10u to the lower surface 10b. When the position of the first grinding element 140 is appropriately adjusted, the first grinding element 140 may interfere with the outer side surface 10e of the first cutting edge 10s1, but not interfere with the upper surface 10u. In this way, as shown in FIG. 1D, after grinding, the upper surface 10 u will not be ground, so the size of the optical film 10 will not be changed. In another embodiment, if allowed, the position of the first grinding element 140 may be adjusted to remove a portion of the upper surface 10u. Such as As shown in FIG. 1D, after grinding, the outer side surface 10e of the first cutting edge 10s1 and the sintered particles thereon are removed by the first grinding element 140, and the ground optical film 10 forms a new first The ground edge 10s1 'has a new outer side 10e'. The outer surface 10e 'is flatter than the outer surface 10e and has a finer surface roughness. By selecting the designation of the abrasive member 142 (when the abrasive member 142 is sandpaper), a first grinding edge 10s1 'with a desired surface roughness can be obtained.

As shown in FIGS. 1A and 1B, the first driver 160 is connected to the spindle 143 of the first grinding element 140, and can control the rotation speed and / or rotation direction of the first grinding element 140 according to the conveying speed of the conveying mechanism 110. For example, the conveying speed of the conveying mechanism 110 in the conveying direction D1 is directly proportional to the rotation speed (such as revolutions per minute (rpm)) of the first grinding element 140. That is, the faster the conveying speed of the conveying mechanism 110 in the conveying direction D1 (for example, the faster the rotation speed of the roller 111), the faster the first driver 160 controls the rotating speed of the first grinding element 140. In one embodiment, the first grinding element 140 may not rotate relative to the optical film 10. In this case, since the optical film 10 will move, there is still a relative rotational relationship between the optical film 10 and the first grinding element 140, and the first grinding element 140 can also grind the optical film 10. In another embodiment, the mandrel 143 of the first grinding element 140 is fixed (that is, the mandrel 143 belongs to a fixed rod or a ground rod in the cutting device 100), but the grinding wheel 141 is rotatably disposed on the mandrel 143. . In this case, the grinding wheel 141 is free to rotate relative to the mandrel 143 under the friction of the optical film 10 (the optical film 10 pushes the grinding wheel 141), and can also grind the optical film 10.

The first grinding element 140 does not rotate relative to the optical diaphragm 10 In this aspect, the first driver 160 may be selectively omitted. Similarly, in the embodiment where the grinding wheel 141 can rotate freely with respect to the mandrel 143, the first driver 160 can also be selectively omitted.

In this embodiment, the rotation tangential direction T1 of the first grinding element 140 and the conveying direction D1 of the optical film 10 are opposite to each other, so that the polishing efficiency can be increased. In another embodiment, the rotation tangential direction T1 of the first grinding element 140 and the conveying direction D1 of the optical film 10 may be the same.

In addition, the first grinding element 140 can also move in a vertical direction, which is substantially perpendicular to the conveying direction D1 of the optical film 10 or substantially the same direction as the extending direction of the mandrel 143 of the first grinding element 140. To increase the service life.

The second grinding element 150 has a structure similar to or the same as that of the first grinding element 140, and details are not described herein again. The relationship between the second grinding element 150 and the second cutting edge 10s2 is similar to or the same as the relationship between the first grinding element 140 and the first cutting edge 10s1, and details are not described herein again.

Please refer to FIGS. 2A and 2B. FIG. 2A illustrates a schematic diagram of a cutting device 200 according to another embodiment of the present invention, and FIG. 2B illustrates a partial view of the cutting device of FIG. 2A. The cutting device 200 includes a conveying mechanism 110, a first laser cutter 120, a second laser cutter 130, a first grinding element 140, a second grinding element 150, a first dust collecting device 260, and a second Dust collection device 270. The cutting device 200 has similar or identical features to the cutting device 100 except that the cutting device 200 further includes a dust collecting device.

As shown in FIGS. 2A and 2B, the first dust collection device 260 includes a first dust collection cover 261, a first transmission tube 262, a first air extraction element 263, and at least one filter 264. The first dust collecting cover 261 surrounds the first grinding element 140 to collect the chips E1 generated by the first grinding element 140 grinding the first cutting edge 10s1. The first dust collecting cover 261 has at least one through hole 261a. The first transmission pipe 262 connects the through hole 261 a and the first air extraction element 263. Under the suction of the first suction element 263, the chips E1 collected by the first dust collecting hood 261 are transmitted to the filter 264 through the through hole 261a and the first transfer pipe 262. The filter 264 can filter out the chips E1 to prevent the chips E1 from being transmitted to the first suction element 263, and further to prevent the chips E1 from adversely affecting the first suction element 263. As shown in the figure, the through hole 261a is located on the side wall of the first dust collecting cover 261 and is adjacent to the first cutting edge 10s1, so that the chip E1 generated during grinding can enter the through hole 261a along a short path, which can reduce the flying of the chip E1 The probability and quantity of leaving the first dust collecting hood 261.

The second dust collection device 270 has similar or identical features to the first dust collection device 260, and is not repeated here. The relationship between the second dust collection device 270 and the second grinding element 150 is similar or the same as the relationship between the first dust collection device 260 and the first grinding element 140, and details are not described herein again. In addition, the first dust collection device 260 and the second dust collection device 270 can share an air extraction element, such as the first air extraction element 263.

Please refer to FIGS. 3A to 3B. FIG. 3A illustrates a schematic view of a cutting device 300 according to another embodiment of the present invention, and FIG. 3B illustrates a partial top view of the cutting device 300 according to FIG. 3A. The cutting device 300 includes a conveying mechanism 110, a first laser cutter 120, a second laser cutter 130, a first grinding element 340, a second grinding element 350, a first elastic element 360, and a second elasticity. Component (not shown).

The first elastic element 360 is connected to the first grinding element 140 to provide a force F1 of the first grinding element 140 toward the first cutting edge 10s1. This force F1 can grind off the first cutting edge 10s1, so the action of manually adjusting the position of the first grinding element 140 can be omitted. In detail, when the position of the first grinding element 140 is manually adjusted to be inaccurate or the accuracy is difficult to control, the problem can be improved by the first elastic element 360. In addition, by selecting or designing the elastic coefficient of the first elastic element 360, the aforementioned force F1 can be obtained.

As shown in FIGS. 3A and 3B, the first grinding element 340 includes a grinding wheel 341, a grinding member 142, and a spindle 343. The grinding wheel 341 has an accommodation hole 341a. The mandrel 343 penetrates the accommodation hole 341a. The inner diameter of the accommodating hole 341a is larger than the outer diameter of the mandrel 343 to provide an allowable displacement gap between the mandrel 343 and the accommodating hole 341a. The first elastic element 360 connects the mandrel 343 and the grinding wheel 341 to provide the force F1 of the grinding wheel 341 to the optical film 10. There is an allowable displacement gap between the grinding wheel 341 and the mandrel 343, so that the grinding wheel 341 (or the grinding member 142) will not be interfered (such as blocked) by the mandrel 343 when it contacts the optical diaphragm 10, so as to avoid the force F1 because It is blocked by the mandrel 343 and lowered. Since the first elastic element 360 continuously provides the force F1 to the grinding wheel 341, the grinding wheel 341 continuously grinds the optical film 10. In an embodiment, the mandrel 343 is a fixed mandrel, that is, the mandrel 343 belongs to a fixed rod or a ground rod in the cutting device 300.

As shown in FIG. 3B, the mandrel 343 further includes a flange 3431, which is located below the grinding wheel 341 to carry the grinding wheel 341. In this way, the grinding wheel 341 can be prevented from disengaging from the mandrel 343.

The second elastic element has features similar to or the same as the first elastic element 360, and details are not described herein again. The relationship between the second elastic element and the second grinding element 150 is similar to or the same as the relationship between the second elastic element and the first grinding element 140, and details are not described herein again.

FIG. 4A illustrates a schematic diagram of a cutting device 400 according to an embodiment of the present invention, and FIG. 4B illustrates a partial top view of the cutting device 400 according to FIG. 4A.

The cutting device 400 is used for cutting the optical film 10. The cutting device 400 includes a conveying mechanism 110, a first laser cutter 120, a second laser cutter 130, a third laser cutter 135, and two grinding groups, where each grinding group includes a first The grinding element 140, the second grinding element 150, the first driver 160, and the second driver 170.

The first laser cutter 120, the second laser cutter 130, and the third laser cutter 135 are used to cut the optical film 10 into a first sub-optical film 13 and a second sub-optical film 14. The conveying mechanism 110 includes at least one roller 111 for transmitting the first sub-optical film 13 to move in the conveying direction D11, and the second sub-optical film 14 to move in the conveying direction D12. As shown in FIG. 4A, the two rollers 111 of the conveying mechanism 110 may be configured to have a height difference. The two-child optical film 14 interferes left and right or back and forth.

As shown in FIGS. 4A and 4B, one of the grinding groups can grind the edge of the first sub-optical diaphragm 13, and the other grinding group can grind the second sub-optical diaphragm. 14 of the edges. Since the first sub-optical film 13 and the second sub-optical film 14 are staggered up and down, one of the grinding groups does not interfere with the first sub-optical film 13 and the second sub-optical film 14 at the same time.

In another embodiment, according to the same or similar principles as described above, the cutting device 400 may include N laser cutters to cut the optical film 10 into N-1 sub-optical films. Correspondingly, the number of grinding groups is N-1, so as to grind N-1 sub-strip optical films, respectively. Here, N is a positive integer equal to or greater than 4.

Please refer to FIGS. 5A to 5C. FIG. 5A shows a schematic diagram of a cutting device 500 according to an embodiment of the present invention, FIG. 5B shows a partial top view of the cutting device 500 in FIG. 4A, and FIG. 5C shows FIG. 5A is a schematic perspective view of a first cleaning device 540.

The cutting device 500 is used for cutting the optical film 10. The cutting device 500 includes a conveying mechanism 110, a first laser cutter 120, a second laser cutter 130, a first cleaning device 540, and a second cleaning device 550.

The first cleaning device 540 is configured to clean the first cutting edge 10s1 of the cut optical film 10, such as the upper surface 10u, the lower surface 10b, and / or the outer side 10e of the first cutting edge 10s1, and the second cleaning The device 550 is configured to clean the second cutting edge 10s2 of the cut optical film 10, such as the upper surface 10u, the lower surface 10b, and / or the outer side surface 10e of the second cutting edge 10s2.

The structure of the second cleaning device 550 is the same as or similar to that of the first cleaning device 540. Taking the first cleaning device 540 as an example, the first cleaning device 540 includes a cleaning liquid supplier 541 and a cleaning liquid absorbing member 542. The cleaning liquid supplier 541 is used A cleaning liquid L1 is supplied to the cleaning liquid absorbing member 542. After the cleaning liquid absorbing member 542 absorbs the cleaning liquid L1, the first cutting edge 10s1 is cleaned with the cleaning liquid L1. The cleaning liquid supplier 541 has an outlet 541a. The cleaning liquid L1 in the cleaning liquid supplier 541 is supplied to the cleaning liquid absorbing member 542 through the outlet 541a, so that the cleaning liquid absorbing member 542 absorbs the cleaning liquid L1. During the cleaning process, the outlet 541a can be kept open, so that the cleaning liquid L1 is continuously supplied to the cleaning liquid absorber 542. In addition, although not shown in the drawings, the cleaning liquid supplier 541 and the cleaning liquid absorbing member 542 can be bound together by a strip structure, where the strip structure is, for example, a rubber band.

The foreign matter in the cut optical film 10 can be removed by washing with the washing liquid L1 absorbed by the washing liquid absorbing member 542. This foreign matter is, for example, sintered particles, chips, pen marks, marks, dust, and the like. In one embodiment, the cleaning liquid L1 is, for example, a liquid capable of removing foreign matter, such as water or a solvent, such as alcohol. As shown in FIG. 5C, the cleaning liquid supplier 541 has an inlet 541b, and the external cleaning liquid L1 can be replenished into the cleaning liquid supplier 541 through the inlet 541b. In another embodiment, when the cleaning liquid L1 is not to be replenished, the inlet 541b may be closed.

As shown in FIG. 5C, the cleaning liquid absorbing member 542 includes a first holding portion 5421 and a second holding portion 5422 connected to each other. The optical film 10 may be disposed between the first clamping portion 5421 and the second clamping portion 5422 to clean the upper surface 10u, the lower surface 10b, and / or the outer surface 10e of the first cutting edge 10s1 of the optical film 10 . In one embodiment, the cleaning liquid absorbing member 542 is, for example, a sponge or other element capable of absorbing the cleaning liquid.

In an embodiment, the cutting equipment of any of the foregoing embodiments may be simultaneously Including a cleaning device (such as the first cleaning device 540 and / or the second cleaning device 550) and a grinding element (such as the first grinding element 140 and / or the second grinding element 150), wherein the cleaning device is located at the Downstream. In one embodiment, the cleaning device and the grinding element may be located between two adjacent rollers together.

In summary, the cutting device includes at least one cleaning module to remove foreign objects from the cut optical film 10. The cleaning module is, for example, a grinding element (such as the first grinding element 140 and / or the second grinding element 150) or a cleaning device (such as the first cleaning device 540 and / or the second cleaning device 550).

Please refer to FIG. 6, which illustrates a schematic diagram of a cutting device 600 according to another embodiment of the present invention. The cutting device 600 is used for cutting the optical film 10. The cutting device 600 includes a conveying mechanism 110 (not shown), a first laser cutter 120 (not shown), a second laser cutter 130 (not shown), a first cleaning device 640, and a second Cleaning device (not shown).

The first cleaning device 640 is configured to clean the first cutting edge 10s1 of the cut optical film 10. The second cleaning device is used to clean the second cutting edge 10s2 of the cut optical film 10 (not shown in FIG. 6).

The second cleaning device has a structure similar to or the same as the first cleaning device 640. Taking the first cleaning device 640 as an example, the first cleaning device 640 includes a cleaning liquid supplier 541, a cleaning liquid absorbing member 542, a carrier 641, a duct 642, and a fluid control member 643. The cleaning solution supplier 541 and the cleaning solution absorber 542 are disposed on the carrier 641. The duct 642 connects the outlet 541a of the cleaning solution supplier 541 and the cleaning solution absorber 542, and allows the cleaning solution L1 in the cleaning solution supplier 541 to pass through the conduit 642. The cleaning liquid absorber 542 is provided.

In addition, the outlet 642a of the duct 642 may or may not be in contact with the cleaning liquid absorbing member 542, or may be inserted into the cleaning liquid absorbing member 542. The fluid control member 643 is connected to the outlet 541a of the cleaning liquid supplier 541 through the conduit 642 to allow the cleaning liquid L1 to flow toward the outlet 642a of the conduit 642. The fluid control member 643 can control the output amount and / or output interval time of the cleaning liquid L1, and then control the input amount and / or input interval time of the cleaning liquid L1 into the cleaning liquid absorber 542.

In an embodiment, the fluid control member 643 may be a pump, a control valve, or other fluid machinery capable of driving fluid movement. Although not shown, if necessary, the first cleaning device 640 may further include a controller to control the fluid control member 643.

Please refer to FIG. 7, which illustrates a schematic diagram of a cutting device 700 according to another embodiment of the present invention. The cutting device 700 is used to cut the optical film 10. The cutting device 700 includes a conveying mechanism 110 (not shown), a first laser cutter 120 (not shown), a second laser cutter 130 (not shown), a first cleaning device 740, and a second Cleaning device (not shown).

The first cleaning device 740 is configured to clean the first cutting edge 10s1 of the cut optical film 10. The second cleaning device is used to clean the second cutting edge 10s2 of the cut optical film 10 (not shown in FIG. 7).

The second cleaning device has a structure similar to or the same as the first cleaning device 740. Taking the first cleaning device 740 as an example, the first cleaning device 740 includes a cleaning liquid providing group 740a, a cleaning liquid recovery group 740b, a fluid control member 643, and a filter. 器 740c. The cleaning liquid providing group 740a includes a cleaning liquid absorbing member 542, a cleaning liquid supplier 741, and a carrier 641, and the cleaning liquid recovery group 740b includes a cleaning liquid absorbing member 542, a cleaning liquid recovering device 742, and a carrier 641.

For the cleaning liquid supply group 740 a, the cleaning liquid absorbing member 542 is disposed on the carrier 641. The cleaning liquid supplier 741 is disposed on the cleaning liquid absorber 542. The cleaning liquid supplier 741 has an outlet 741a and an inlet 741b. The cleaning liquid L1 in the cleaning liquid supplier 741 is supplied to the cleaning liquid absorbing member 542 through the outlet 741a, so that the cleaning liquid absorbing member 542 absorbs the cleaning liquid L1.

In the cleaning liquid recovery group 740b, the cleaning liquid absorber 542 is disposed on the carrier 641. The cleaning liquid recovery device 742 is disposed on the cleaning liquid absorber 542. The cleaning liquid recovery device 742 includes an outlet 742a and an inlet 742b. The cleaning liquid L1 absorbed by the cleaning liquid absorbing member 542 can flow back into the cleaning liquid recovery device 742 through the inlet 742b.

The cleaning liquid providing group 740a and the cleaning liquid recovery group 740b are sequentially arranged along the conveying direction D1 of the optical film 10, that is, the cleaning liquid providing group 740a is located upstream of the conveying direction D1, and the cleaning liquid recovery group 740b is located downstream of the conveying direction D1. In this way, after the optical film 10 is cleaned by the upstream cleaning liquid providing group 740a, the cleaning liquid L1 remaining on the optical film 10 can be recovered to the downstream cleaning liquid recovery group 740b.

The foreign matter remaining on the optical film 10 may flow to the cleaning liquid recovery device 742 with the cleaning liquid L1. As shown in FIG. 7, the filter 740 c is connected between the cleaning liquid supply group 740 a and the cleaning liquid recovery group 740 b. Filter 740c is connected to the cleaning liquid The outlet 742a of the group 740b is recovered to filter out foreign matter flowing from the outlet 742a, and the cleaning liquid L1 passing through the filter 740c becomes clean (that is, there is no foreign matter or less foreign matter). The fluid driver 643 connects the filter 740c and the inlet 741b of the cleaning solution supplier 741 to drive the clean (filtered) cleaning solution L1 back into the cleaning solution supplier 741 for recycling.

Please refer to FIG. 8, which illustrates a schematic diagram of a cutting device 800 according to another embodiment of the present invention. The cutting device 800 is used for cutting the optical film 10. The cutting device 800 includes a conveying mechanism 110 (not shown), a first laser cutter 120 (not shown), a second laser cutter 130 (not shown), and at least one stabilization mechanism 880.

The stabilization mechanism can maintain the position of the optical film 10. In this embodiment, at least one stabilization mechanism 880 is disposed on an edge of the first cutting edge 10s1 and / or the second cutting edge 10s2 of the optical film 10 to maintain the first cutting edge 10s1 and / or the second cutting edge The cutting edge 10s2 travels steadily. The stabilization mechanism 880 includes a limiting member 881 and a supporting rod 882. One end of the support rod 882 supports the limiting member 881, and the other end is configured on a carrier, such as a cutting table, a jig, or a floor. The limiting member 881 includes a first limiting portion 8811 and a second limiting portion 8812 which are oppositely disposed. The optical film 10 passes between the first limiting portion 8811 and the second limiting portion 8812, but may not keep contact with the first limiting portion 8811 and the second limiting portion 8812. When the optical film 10 is moved up or down, the optical film 10 is stopped (restricted) by the first limit portion 8811 and the second limit portion 8812, so that the optical film 10 and the reference surface (such as The relative distance between the ground or the desktop) remains stable. In one embodiment, the limiting member 881 is a U-shaped clip.

In addition, the stabilizing mechanism 880 can be arranged before the cutting of the optical film 10 The edge of the optical film 10 may be disposed on the edge of the optical film 10 after cutting. As long as the stable height of the optical film 10 can be maintained to facilitate cutting, grinding, or cleaning, the positioning position and / or specific structure of the stabilization mechanism 880 is not limited in the embodiment of the present invention.

The embodiment of the present invention further includes a cutting method using the aforementioned cutting device. Taking the cutting device 100 as an example, the cutting method using the cutting device 100 includes at least: the conveying mechanism 110 transmits the optical film 10; the first laser cutter 120 cuts the optical film 10, The optical film 10 forms a first cutting edge 10s1; and the first grinding element 140 grinds the first cutting edge 10s1. In addition, other cutting methods of the cutting device 100 have been described above, and will not be repeated here. In addition, the cutting methods of other cutting devices (such as 200, 300, and 400) are similar to or the same as those of the cutting device 100, and will not be repeated here.

The embodiment of the present invention further includes another cutting method using the foregoing cutting device. Taking the cutting device 500 as an example, the cutting method using the cutting device 500 includes at least: the transport mechanism 110 transmits the optical film 10; the cutter 540 cuts the optical film 10, and the cut optical film 10 is formed The first cutting edge 10s1; and the first cleaning device 540 cleans the first cutting edge 10s1. In addition, other cutting methods of the cutting device 500 have been described above, and are not repeated here. In addition, the cutting methods of other cutting equipment (such as 600, 700, and 800) are similar to or the same as those of the cutting equipment 500, and are not repeated here.

In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. because Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application.

Claims (16)

A cutting device is used for cutting an optical film and includes: a conveying mechanism for transmitting the optical film; a first laser cutter for cutting the optical film; The optical film forms a first cutting edge; and a first grinding element for grinding the first cutting edge. The cutting device according to item 1 of the patent application scope, wherein the cutting device further includes a second laser cutter, and the second laser cutter is further configured to cut the optical film. The optical film forms a second cutting edge, and the second cutting edge and the first cutting edge are opposite sides of the optical film after being cut. The cutting device further includes: a second A grinding element for grinding the second cutting edge. The cutting device according to item 1 of the scope of patent application, wherein the optical film before the cutting has an upper surface and a lower surface, and an outer side surface of the first cutting edge extends outward from the upper surface to The lower surface; the first grinding element interferes with the outer side of the first cutting edge, but does not interfere with the upper surface. The cutting device according to item 1 of the patent application scope further includes: an elastic element connected to the first grinding element, and configured to provide the first grinding element with a force toward the first cutting edge . The cutting device according to item 1 of the scope of patent application, further includes: a driver connected to a mandrel of the first grinding element, and controlling the rotation speed of the mandrel according to the conveying speed of the conveying mechanism. The cutting device according to item 1 of the scope of patent application, wherein the direction of the tangent of rotation of the first grinding element is the same as that of a transport direction of the optical film. The cutting device according to item 1 of the scope of patent application, wherein the tangential direction of rotation of the first grinding element is opposite to a conveying direction of the optical film. The cutting device according to item 1 of the patent application scope, wherein the first grinding element is configured to move in a vertical direction, and the vertical direction is substantially perpendicular to a conveying direction of the optical film. The cutting device according to item 1 of the patent application scope further includes: a dust collecting hood surrounding the first grinding element to collect chips generated by the first grinding element grinding the first cutting edge . The cutting device according to item 1 of the patent application scope, wherein the first grinding element includes: a grinding wheel having an outer peripheral surface; and a sandpaper covering the outer peripheral surface of the grinding wheel. The cutting equipment according to item 10 of the scope of patent application, wherein the sandpaper number is between 200 and 1200. The cutting device according to item 1 of the patent application scope, wherein the first grinding element includes: a grinding wheel having an accommodation hole; a mandrel penetrating the accommodation hole, and an outer diameter of the mandrel Smaller than the inner diameter of the accommodating hole; and an elastic element connecting the grinding wheel and the mandrel. The cutting device according to item 1 of the patent application scope, wherein the first grinding element comprises a fixed grinding wheel. The cutting device according to item 1 of the patent application scope, wherein the first grinding element includes a grinding wheel and a mandrel, the mandrel penetrates into the grinding wheel, and the grinding wheel is opposite to the mandrel system Free to rotate. The cutting device according to item 1 of the scope of patent application, further includes: a stabilization mechanism for maintaining the position of the optical film. A cutting method using a cutting device according to any one of claims 1 to 15 of the scope of patent application for cutting an optical film; the cutting method includes: the conveying mechanism transmits the optical film; The first laser cutter cuts the optical film, wherein the cut optical film forms a first cutting edge; and the first grinding element grinds the first cutting edge.