TWI656194B - Fluoride phosphor, method of manufacturing the same, and semiconductor light emitting device - Google Patents

Fluoride phosphor, method of manufacturing the same, and semiconductor light emitting device Download PDF

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TWI656194B
TWI656194B TW104117157A TW104117157A TWI656194B TW I656194 B TWI656194 B TW I656194B TW 104117157 A TW104117157 A TW 104117157A TW 104117157 A TW104117157 A TW 104117157A TW I656194 B TWI656194 B TW I656194B
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fluoride
phosphor
rare earth
cerium
fluoride phosphor
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TW201638300A (en
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小田喜勉
渡部純也
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日商根本特殊化學股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

本發明提供一種耐水性優異之紅色發光氟化物螢光體。 The present invention provides a red luminescent fluoride phosphor excellent in water resistance.

一種在以通式A2MF6:Mn表示之氟化物粒子之表面上至少具有稀土類元素氟化合物之氟化物螢光體。式中,M為由矽(Si)、鈦(Ti)及鍺(Ge)選出之至少一種金屬元素,A為由鈉(Na)及鉀(K)選出之至少一種鹼金屬元素。其成為耐水性提高,且長期安定性優異之螢光體及使用此之半導體發光裝置。 A fluoride phosphor having at least a rare earth element fluorine compound on the surface of a fluoride particle represented by the general formula A 2 MF 6 : Mn. In the formula, M is at least one metal element selected from cerium (Si), titanium (Ti), and cerium (Ge), and A is at least one alkali metal element selected from sodium (Na) and potassium (K). It is a phosphor which has improved water resistance and is excellent in long-term stability, and a semiconductor light-emitting device using the same.

Description

氟化物螢光體及其製造方法以及半導體發光裝置 Fluoride phosphor, method of manufacturing the same, and semiconductor light emitting device

本發明係關於氟化物螢光體及其製造方法。且本發明關於使用該氟化物螢光體之半導體發光裝置。 The present invention relates to a fluoride phosphor and a method of producing the same. Further, the present invention relates to a semiconductor light-emitting device using the fluoride phosphor.

過去以來,藉由使用吸收藍色系之光或紫外線,並經波長轉換成紅色或黃色或綠色等之長波長之可見光之螢光體,且組合該螢光體而獲得白色等可見光之手段為已知。 In the past, a light source that absorbs blue light or ultraviolet light and converts it into a long-wavelength visible light such as red or yellow or green, and combines the phosphor to obtain visible light such as white is A known.

短波長區域之可見光或紫外線之光源係使用半導體發光元件,例如氮化鎵系藍色發光二極體等。而且,與波長轉換材料的螢光體組合構成半導體發光裝置。該半導體發光裝置具有發出白色等可見光,且消耗電力小、壽命長之特徵,近年來作為影像顯示裝置或照明裝置等之發光源受到矚目。 As the light source of visible light or ultraviolet light in the short-wavelength region, a semiconductor light-emitting element such as a gallium nitride-based blue light-emitting diode or the like is used. Further, in combination with a phosphor of a wavelength converting material, a semiconductor light emitting device is constructed. This semiconductor light-emitting device has a feature of emitting visible light such as white, and has low power consumption and long life. In recent years, it has attracted attention as a light-emitting source such as an image display device or an illumination device.

獲得白色光之半導體發光裝置之構成已知有組合發出藍光之半導體發光元件、與使藍光經波長轉換而發出黃光之螢光體而構成,或組合發出藍光之半導體發光元件、使藍光經波長轉換而發出紅光之螢光體、與發出綠光之螢光 體而構成。且已知有組合能發出紫外線之半導體發光元件、及使紫外線經波長轉換而分別發出紅光、綠光、藍光之3種螢光體而構成。 A semiconductor light-emitting device that obtains white light is known to have a combination of a semiconductor light-emitting element that emits blue light and a phosphor that emits yellow light by wavelength conversion, or a combination of a semiconductor light-emitting element that emits blue light, and wavelength-converted blue light. a red-emitting phosphor and a green-emitting fluorescent Constructed as a body. Further, a semiconductor light-emitting device that emits ultraviolet light and three kinds of phosphors that emit ultraviolet light, green light, and blue light by wavelength conversion are known.

使用上述構成之半導體發光裝置作為影像顯 示裝置之發光源,例如液晶顯示器用之背光用途時,為了使色度座標上廣範圍之色彩效率良好地再現,各螢光體宜為高的發光亮度且伴隨色純度良好。再者,要求與液晶顯示器之彩色濾波器之組合之相符性,且要求發光波峰之半值寬較窄之螢光體。 Using the semiconductor light-emitting device constructed as described above as an image display When the light source of the display device is used for backlighting of a liquid crystal display, for example, in order to efficiently reproduce a wide range of colors on a chromaticity coordinate, each of the phosphors preferably has a high light emission luminance and is excellent in color purity. Furthermore, it is required to conform to the combination of the color filters of the liquid crystal display, and a phosphor having a narrow half-value width of the luminescence peak is required.

具有該等特徵之紅色發光螢光體已知為具有K2TiF6:Mn等組成之氟化物螢光體(參照例如專利文獻1)。此外,具有K2SiF6:Mn之組成之氟化物螢光體亦為已知(參照例如專利文獻2)。 A red-emitting phosphor having such a characteristic is known as a fluoride phosphor having a composition such as K 2 TiF 6 :Mn (see, for example, Patent Document 1). Further, a fluoride phosphor having a composition of K 2 SiF 6 : Mn is also known (see, for example, Patent Document 2).

上述氟化物螢光體由於發光波峰之半值寬窄且色純度亦高,故適合液晶顯示器之背光用途,且期望實用化。然而,上述氟化物螢光體之耐水性不足,具有長期之信賴性方面之課題。為解決該課題,已提案有例如於氟化物螢光體之表面形成鹼土類金屬氟化物之方法(參照專利文獻3),藉由該方法,耐水性之性能仍不足,而期望進而耐水性高之氟化物螢光體。 Since the above-mentioned fluoride phosphor has a narrow half value of light emission peak and high color purity, it is suitable for backlight use of a liquid crystal display, and is expected to be put into practical use. However, the above-mentioned fluoride phosphor has insufficient water resistance and has a long-term reliability problem. In order to solve this problem, for example, a method of forming an alkaline earth metal fluoride on the surface of a fluoride phosphor has been proposed (see Patent Document 3). With this method, water resistance is still insufficient, and it is desired to have high water resistance. Fluoride phosphor.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特表2009-528429號公報 [Patent Document 1] Japanese Patent Publication No. 2009-528429

〔專利文獻2〕日本特開2010-209311號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-209311

〔專利文獻3〕日本特開2015-044951號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2015-044951

本發明係鑑於上述氟化物螢光體之耐水性之問題而完成者,而提供一種具有更高耐水性之紅色發光氟化物螢光體。且,本發明提供長期安定性優異之半導體發光裝置。 The present invention has been made in view of the problem of the water resistance of the above-mentioned fluoride phosphor, and provides a red luminescent fluoride phosphor having higher water resistance. Further, the present invention provides a semiconductor light-emitting device excellent in long-term stability.

本發明人等檢討各種提高耐水性之手法之結果,發現以下揭示之氟化物螢光體、與其製造方法。 The present inventors reviewed the results of various methods for improving water resistance, and found a fluoride phosphor disclosed below and a method for producing the same.

第1發明之氟化物螢光體之特徵係在以通式A2MF6:Mn表示之氟化物粒子之表面上至少具有稀土類元素氟化合物。式中,M為由矽(Si)、鈦(Ti)及鍺(Ge)選出之至少一種金屬元素,A為由鈉(Na)及鉀(K)選出之至少一種鹼金屬元素。稀土類元素氟化合物較好係由鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、銩(Tm)、鐿(Yb)及鎦(Lu)選出之至少一種稀土類元素之氟化合物。藉由於氟化物粒子之表面具有稀土類元素氟化合物,而成為具有高的耐水性之氟化物螢光體。 The fluoride phosphor of the first aspect of the invention is characterized in that it has at least a rare earth element fluorine compound on the surface of the fluoride particles represented by the general formula A 2 MF 6 : Mn. In the formula, M is at least one metal element selected from cerium (Si), titanium (Ti), and cerium (Ge), and A is at least one alkali metal element selected from sodium (Na) and potassium (K). The rare earth element fluorine compound is preferably made of lanthanum (La), cerium (Ce), praseodymium (Pr), strontium (Nd), strontium (Sm), strontium (Eu), strontium (Gd), strontium (Tb), strontium. A fluorine compound of at least one rare earth element selected from (Dy), ruthenium (Ho), osmium (Tm), yttrium (Yb), and lanthanum (Lu). Fluoride phosphors having high water resistance are obtained by having a rare earth element fluorine compound on the surface of the fluoride particles.

第2發明之氟化物螢光體之製造方法之特徵為包含使以通式A2MF6:Mn表示之氟化物粒子與含稀土類元素離子之溶液及還原劑接觸,再於前述氟化物粒子之表面形成稀土類元素氟化合物之步驟。式中,M為由矽(Si)、鈦(Ti)及鍺(Ge)選出之至少一種金屬元素,A為由鈉(Na)及鉀(K)選出之至少一種鹼金屬元素。稀土類元素離子較好為由鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、銩(Tm)、鐿(Yb)及鎦(Lu)選出之至少一種稀土類元素之離子。藉由上述製造方法,可製造具有高的耐水性之氟化物螢光體。 The method for producing a fluoride phosphor according to the second aspect of the invention is characterized in that the fluoride particles represented by the general formula A 2 MF 6 : Mn are brought into contact with a solution containing a rare earth element ion and a reducing agent, and the fluoride particles are further contained. The step of forming a rare earth element fluorine compound on the surface. In the formula, M is at least one metal element selected from cerium (Si), titanium (Ti), and cerium (Ge), and A is at least one alkali metal element selected from sodium (Na) and potassium (K). The rare earth element ions are preferably composed of lanthanum (La), cerium (Ce), praseodymium (Pr), cerium (Nd), cerium (Sm), cerium (Eu), cerium (Gd), cerium (Tb), cerium ( An ion of at least one rare earth element selected from Dy), ruthenium (Ho), osmium (Tm), yttrium (Yb), and lanthanum (Lu). According to the above production method, a fluoride phosphor having high water resistance can be produced.

第3發明之半導體發光裝置之特徵係至少具備半導體發光元件、第1發明之氟化物螢光體或以第2發明之製造方法獲得之氟化物螢光體。藉由具備具有高的耐水性之氟化物螢光體,而成為紅光之發光波峰之半值寬窄且色純度亦高之光源,且長期安定性亦高,故成為適合液晶顯示器之背光用途等之優異的半導體發光裝置。 The semiconductor light-emitting device of the third aspect of the invention is characterized by comprising at least a semiconductor light-emitting device, a fluoride phosphor of the first invention, or a fluoride phosphor obtained by the method of the second invention. By having a fluoride phosphor having high water resistance, the light-emitting peak of red light has a half-value width and a high color purity, and has high long-term stability, so that it is suitable for backlight use of liquid crystal displays. An excellent semiconductor light emitting device.

依據本發明,可獲得耐水性高、長期安定性優異之紅色發光氟化物螢光體。且,可獲得紅色之色純度高,且長期安定性優異之半導體發光裝置。 According to the present invention, a red luminescent fluoride phosphor having high water resistance and excellent long-term stability can be obtained. Further, a semiconductor light-emitting device having high purity of red color and excellent long-term stability can be obtained.

11‧‧‧半導體發光元件 11‧‧‧Semiconductor light-emitting elements

12‧‧‧接著劑 12‧‧‧Adhesive

13a‧‧‧P型電極 13a‧‧‧P type electrode

14a‧‧‧N型電極 14a‧‧‧N type electrode

15a‧‧‧金屬線 15a‧‧‧Metal wire

15b‧‧‧金屬線 15b‧‧‧Metal wire

16‧‧‧印刷電路基板 16‧‧‧Printed circuit board

16a‧‧‧電極部 16a‧‧‧Electrode

16b‧‧‧電極部 16b‧‧‧Electrode

32‧‧‧模製樹脂 32‧‧‧Molded resin

圖1為本發明之實施例及比較例之氟化物螢光體之粉末X射線繞射圖形。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a powder X-ray diffraction pattern of a fluoride phosphor of Examples and Comparative Examples of the present invention.

圖2為顯示本發明之一實施形態之半導體發光裝置之剖面圖。 Figure 2 is a cross-sectional view showing a semiconductor light emitting device according to an embodiment of the present invention.

以下,說明製造氟化物螢光體之方法作為本 發明之一實施形態。該等製造方法為例示本發明之實施形態者,並非限制本發明。 Hereinafter, a method of manufacturing a fluoride phosphor will be described as An embodiment of the invention. These manufacturing methods are illustrative of the embodiments of the present invention and are not intended to limit the present invention.

本發明之螢光體之製造方法大致上包含螢光體芯粒子之製作步驟,及對所得螢光體芯粒子之表面處理步驟之兩步驟。 The method for producing a phosphor of the present invention roughly includes a step of producing a phosphor core particle and two steps of a surface treatment step of the obtained phosphor core particle.

(螢光體芯粒子之製作步驟) (Step of producing phosphor core particles)

本發明之氟化物螢光體之螢光體芯粒子為以A2MF6:Mn之式表示,式中,M為由矽(Si)、鈦(Ti)及鍺(Ge)選出之至少一種金屬元素,A為由鈉(Na)及鉀(K)選出之至少一種鹼金屬元素。該螢光體芯粒子係如下述般製作。亦即,在含氟化氫(HF)之液體介質中,藉由至少使含以M表示之金屬元素之氟化物、含錳(Mn)之氟化物及含以A表示之鹼金屬元素之氟化物反應而製作。例如,使含Mn之氟化物溶解於氫氟酸溶液中,再添加含以M表示之金屬元素之氟化物者作為第1 溶液,以使含以A表示之鹼金屬元素之氟化物溶解於氫氟酸溶液中而成者作為第2溶液。藉由將第2溶液例如滴加混合於第1溶液中,以過濾等分離所得沉澱物,經適當洗淨、乾燥,獲得目標之氟化物螢光體芯粒子。又,使各氟化物溶解之順序或組合並不限於上述之例。 The phosphor core particles of the fluoride phosphor of the present invention are represented by a formula of A 2 MF 6 : Mn, wherein M is at least one selected from the group consisting of ruthenium (Si), titanium (Ti), and ruthenium (Ge). The metal element, A, is at least one alkali metal element selected from sodium (Na) and potassium (K). The phosphor core particles were produced as follows. That is, in a liquid medium containing hydrogen fluoride (HF), at least a fluoride containing a metal element represented by M, a fluoride containing manganese (Mn), and a fluoride containing an alkali metal element represented by A are reacted. And making. For example, a fluorinated substance containing Mn is dissolved in a hydrofluoric acid solution, and a fluoride containing a metal element represented by M is added as a first solution to dissolve a fluoride containing an alkali metal element represented by A in hydrogen. The fluoro acid solution is used as the second solution. The second solution is, for example, added dropwise to the first solution, and the resulting precipitate is separated by filtration or the like, and washed and dried to obtain the desired fluoride phosphor core particles. Further, the order or combination in which the respective fluorides are dissolved is not limited to the above examples.

含Mn之氟化物可使用例如Na2MnF6或K2MnF6等。 含以M表示之金屬元素之氟化物在例如選擇Si作為M時,可使用H2SiF6、K2SiF6、Na2SiF6、(NH4)2SiF6等。 含以A表示之鹼金屬元素之氟化物可使用例如KF、KHF2、NaF、NaHF2等。 As the fluoride containing Mn, for example, Na 2 MnF 6 or K 2 MnF 6 or the like can be used. For the fluoride containing a metal element represented by M, for example, when Si is selected as M, H 2 SiF 6 , K 2 SiF 6 , Na 2 SiF 6 , (NH 4 ) 2 SiF 6 or the like can be used. For the fluoride containing the alkali metal element represented by A, for example, KF, KHF 2 , NaF, NaHF 2 or the like can be used.

各氟化物之使用量可使用與目標之氟化物螢光體芯粒子之組成相符之量。又,使用過量之鹼金屬元素進行反應亦較佳。 The amount of each fluoride used may be an amount corresponding to the composition of the target fluoride phosphor core particles. Further, it is also preferred to carry out the reaction using an excessive amount of an alkali metal element.

上述所得沉澱物之過濾後之洗淨可使用乙醇、水、丙酮、異丙醇等溶劑。乾燥只要使附著於沉澱物上之水分蒸發即可,可適當選擇乾燥溫度或乾燥時間等。 The above-mentioned precipitate obtained by filtration may be washed with a solvent such as ethanol, water, acetone or isopropyl alcohol. Drying is only required to evaporate the water adhering to the precipitate, and the drying temperature, drying time, and the like can be appropriately selected.

可與上述一起利用專利文獻2及專利文獻3中記載之氟化物螢光體芯粒子之製造方法。 A method for producing a fluoride phosphor core particle described in Patent Document 2 and Patent Document 3 can be used together with the above.

(氟化物螢光體芯粒子之表面處理步驟) (Surface treatment step of fluoride phosphor core particles)

使上述所得之氟化物螢光體芯粒子與至少含稀土類元素離子及還原劑之溶液接觸進行表面處理後,藉由洗淨、乾燥,獲得螢光體芯粒子之表面具有稀土類元素氟化合物之本發明之氟化物螢光體。 After the fluoride phosphor core particles obtained above are brought into contact with a solution containing at least a rare earth element ion and a reducing agent to be surface-treated, the surface of the phosphor core particles having a rare earth element fluorine compound is obtained by washing and drying. The fluoride phosphor of the present invention.

稀土類元素可選自鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、銩(Tm)、鐿(Yb)及鎦(Lu)等。該等稀土類元素之離子源可使用硝酸鹽(例如,La(NO3)3、Ce(NO3)3、Gd(NO3)3、Sm(NO3)3、Tb(NO3)3等)、乙酸鹽(例如,La(CH3CO2)3、Ce(CH3CO2)3、Pr(CH3CO2)3、Nd(CH3CO2)3、Eu(CH3CO2)3、Gd(CH3CO2)3、Ho(CH3CO2)3、Yb(CH3CO2)3、Lu(CH3CO2)3等)、氯化物(例如,LaCl3、CeCl3、PrCl3、NdCl3、SmCl3、EuCl3、GdCl3、DyCl3、TmCl3等)等。 The rare earth element may be selected from the group consisting of lanthanum (La), cerium (Ce), praseodymium (Pr), cerium (Nd), cerium (Sm), cerium (Eu), cerium (Gd), cerium (Tb), and dysprosium (Dy). , 鈥 (Ho), 銩 (Tm), 镱 (Yb) and 镏 (Lu). As the ion source of the rare earth elements, a nitrate (for example, La(NO 3 ) 3 , Ce(NO 3 ) 3 , Gd(NO 3 ) 3 , Sm(NO 3 ) 3 , Tb(NO 3 ) 3 , etc. may be used. ), acetate (for example, La(CH 3 CO 2 ) 3 , Ce(CH 3 CO 2 ) 3 , Pr(CH 3 CO 2 ) 3 , Nd(CH 3 CO 2 ) 3 , Eu(CH 3 CO 2 ) 3 , Gd(CH 3 CO 2 ) 3 , Ho(CH 3 CO 2 ) 3 , Yb(CH 3 CO 2 ) 3 , Lu(CH 3 CO 2 ) 3 , etc.), chloride (for example, LaCl 3 , CeCl 3 , PrCl 3 , NdCl 3 , SmCl 3 , EuCl 3 , GdCl 3 , DyCl 3 , TmCl 3 , etc.).

還原劑係用以抑制4價之錳(Mn4+)與水反應成為二氧化錳使粒子表面變黑,欲使4價之錳(Mn4+)還原成2價之錳(Mn2+)而添加。作為還原劑可在具有前述還原作用,且不對氟化物螢光體之母體造成影響之範圍內適當選擇。例如,可使用過氧化氫、草酸等。尤其,以過氧化氫較佳。 The reducing agent is used to inhibit the reaction of tetravalent manganese (Mn 4+ ) with water to form manganese dioxide to blacken the surface of the particles, and to reduce the manganese (Mn 4+ ) of tetravalent to manganese (Mn 2+ ) of divalent. And add. The reducing agent can be appropriately selected within the range having the aforementioned reducing action and not affecting the parent of the fluoride phosphor. For example, hydrogen peroxide, oxalic acid, or the like can be used. In particular, hydrogen peroxide is preferred.

該等係在使至少含稀土類元素離子與還原劑之處理液,與氟化物螢光體芯粒子以特定溫度、特定時間混合,使稀土類元素離子與粒子表面充分接觸後,經過濾,以乙醇或丙酮、異丙醇等溶劑洗淨,並乾燥,獲得目標之本發明之氟化物螢光體。又,上述處理液中未必需要一開始即添加還原劑。該情況下,在接觸稀土類元素離子後,添加還原劑,可除去因二氧化錳所致之粒子表面之著色。另一手段係接觸稀土類元素離子後,暫時過濾、乾燥後,以含 還原劑之溶液處理,可除去因二氧化錳所致之粒子表面之著色。 These are obtained by mixing a treatment liquid containing at least a rare earth element ion and a reducing agent with a fluoride phosphor core particle at a specific temperature and for a specific time to sufficiently contact the rare earth element ions with the surface of the particle, and then filtering The solvent such as ethanol or acetone or isopropyl alcohol is washed and dried to obtain the desired fluoride phosphor of the present invention. Further, it is not necessary to add a reducing agent from the beginning of the treatment liquid. In this case, after the rare earth element ions are contacted, a reducing agent is added to remove the coloration of the surface of the particles due to manganese dioxide. Another method is to contact the rare earth element ions, temporarily filter, dry, and then The solution treatment of the reducing agent removes the coloration of the surface of the particles due to manganese dioxide.

(半導體發光裝置) (semiconductor light emitting device)

接著,作為本發明之實施形態之一例係針對至少具備上述氟化物螢光體之半導體發光裝置之構成加以說明。本發明之半導體發光裝置並不限於以下之說明。 Next, a configuration of a semiconductor light-emitting device including at least the above-described fluoride phosphor will be described as an example of an embodiment of the present invention. The semiconductor light-emitting device of the present invention is not limited to the following description.

圖2為顯示本發明之一實施形態之半導體發光裝置之剖面圖。 Figure 2 is a cross-sectional view showing a semiconductor light emitting device according to an embodiment of the present invention.

該半導體發光裝置為例如在由具有耐熱性之玻璃環氧樹脂所成之長方體形狀之印刷電路基板16上利用由聚矽氧樹脂所成之接著劑12,而接著具有絕緣性基板之半導體發光元件11。設置於該半導體發光元件11之上面之P型電極13a與N型電極14a係藉由金屬線15a、15b,分別連接於印刷電路基板16上面之電極部16a、16b。該等電極部16a、16b係透過將印刷電路基板16之上面與下面連接之未圖式之剖面圓弧狀之貫穿孔,繞回到作為安裝面之印刷電路基板16之下面,且延伸至該安裝面之兩端部。又,上述印刷電路基板16亦可使用絕緣性薄膜。 The semiconductor light-emitting device is, for example, a semiconductor light-emitting element formed of a polyoxyxylene resin on a printed circuit board 16 having a rectangular parallelepiped shape made of a heat-resistant glass epoxy resin, and then an insulating substrate. 11. The P-type electrode 13a and the N-type electrode 14a provided on the upper surface of the semiconductor light-emitting device 11 are connected to the electrode portions 16a and 16b on the upper surface of the printed circuit board 16 by metal wires 15a and 15b, respectively. The electrode portions 16a and 16b are passed through a through hole having a circular arc shape in a cross-sectional shape in which the upper surface of the printed circuit board 16 and the lower surface are connected to each other, and are wound back to the lower surface of the printed circuit board 16 as a mounting surface, and extend to the bottom. Both ends of the mounting surface. Further, an insulating film may be used for the printed circuit board 16.

接著,以被覆上述半導體發光元件11全體之方式,使分散螢光體21之作為密封樹脂之例如透光性聚矽氧樹脂等模製樹脂32以形成如圖2所示之梯形剖面之方式成型於上述印刷電路基板16上,形成表面安裝型之半導體發光裝置。 Then, a molding resin 32 such as a translucent polyoxynoxy resin as a sealing resin of the dispersion phosphor 21 is formed so as to form a trapezoidal cross section as shown in FIG. 2 so as to cover the entire semiconductor light-emitting device 11 A surface mount type semiconductor light-emitting device is formed on the printed circuit board 16.

螢光體21為至少包含本發明一實施形態之紅 色發光之氟化物螢光體,進而除此之外亦可包含吸收藍色系之光或紫外光而發出綠色區域之光之其他綠色發光螢光體,例如β-SiAlON系螢光體,或各種原矽酸鹽系螢光體、具有綠色發光之石榴石(garnet)系螢光體等之混合物。該綠色發光螢光體之選擇可依據目標之半導體發光裝置之發光色適當選擇。 The phosphor 21 is at least including the red of an embodiment of the present invention. a color-emitting fluoride phosphor, and further comprising other green-emitting phosphors that absorb blue-based light or ultraviolet light to emit light in a green region, such as a β-SiAlON-based phosphor, or A mixture of various orthosilicate-based phosphors, garnet-based phosphors having green light emission, and the like. The selection of the green light-emitting phosphor can be appropriately selected depending on the light-emitting color of the target semiconductor light-emitting device.

本發明之半導體發光裝置並不限於上述構造,只要能使自半導體發光裝置11發出之近紫外線至藍色區域之光,利用至少包含本發明一實施形態之氟化物螢光體之螢光體21進行波長轉換,在使自半導體發光裝置11發出之光與自螢光體21發出之光混色,藉此發射出例如白色區域之光之半導體發光裝置即可。 The semiconductor light-emitting device of the present invention is not limited to the above-described structure, and a phosphor 21 containing at least a fluoride phosphor according to an embodiment of the present invention can be used as long as light from the near-ultraviolet light to the blue region emitted from the semiconductor light-emitting device 11 can be used. The wavelength conversion is performed, and a semiconductor light-emitting device that emits light such as a white region by mixing light emitted from the semiconductor light-emitting device 11 with light emitted from the phosphor 21 can be used.

接著,針對作為上述一實施形態之實施例之 本發明之氟化物螢光體與其特性加以說明。 Next, as an embodiment of the above embodiment The fluoride phosphor of the present invention and its characteristics will be described.

〔實施例1〕 [Example 1] (氟化物螢光體芯粒子之製作) (Production of Fluoride Fluorescent Core Particles)

製作以K2Si0.9F6:Mn0.1表示之氟化物螢光體芯粒子作為以A2MF6:Mn之式表示之氟化物螢光體芯粒子之一例。 A fluoride phosphor core particle represented by K 2 Si 0.9 F 6 :Mn 0.1 is produced as an example of a fluoride phosphor core particle represented by the formula of A 2 MF 6 : Mn.

秤量12.36g(以Mn計為0.05莫耳)之K2MnF6並添加於55質量%之HF水溶液900ml中並溶解後,再添加 99.12g(以Si計為0.45莫耳)之K2SiF6,經攪拌充分溶解,將其作為第1溶液。 Weighing 12.36 g (0.05 mol in terms of Mn) of K 2 MnF 6 and adding it to 900 ml of a 55 mass % HF aqueous solution and dissolving, then adding 99.12 g (0.45 m in terms of Si) of K 2 SiF 6 It was dissolved well by stirring, and this was made into the 1st solution.

且秤量39.1g(以K計為0.5莫耳)之KHF2並添加於另外之55質量%之HF水溶液100ml中,攪拌充分溶解後,將其作為第2溶液。 Further, 39.1 g (0.5 mol of K) of KHF 2 was weighed and added to 100 ml of another 5% by mass aqueous HF solution, and the mixture was sufficiently dissolved by stirring to obtain a second solution.

邊在室溫攪拌第1溶液,邊於其中逐次少量添加第2溶液並混合。藉由過濾分離回收所產生之沉澱,以異丙醇洗淨數次,在100℃乾燥2小時,獲得目標之以K2Si0.9F6:Mn0.1表示之氟化物螢光體芯粒子。 While stirring the first solution at room temperature, the second solution was added thereto in small portions and mixed. The precipitate produced by filtration separation was recovered by washing with isopropyl alcohol several times, and dried at 100 ° C for 2 hours to obtain a target fluoride phosphor core particle represented by K 2 Si 0.9 F 6 : Mn 0.1 .

(氟化物螢光體芯粒子之表面處理) (surface treatment of fluoride phosphor core particles)

以表1所示組成之饋入條件,製作各處理液。例如,表1中之實施例1-1系將硝酸鑭6水合物(La(NO3)3.6H2O)0.26g(以La計為0.006莫耳)添加於純水100ml中溶解,再添加3.4g之30%H2O2水溶液作為還原劑並攪拌製作處理液。接著,添加10g之上述所得之氟化物螢光體芯粒子,在室溫攪拌1小時。隨後,藉過濾分離回收經表面處理之螢光體,以異丙醇洗淨數次,在100℃乾燥1小時,獲得表面具有氟化鑭之本發明之氟化物螢光體。所得之氟化物螢光體設為實施例1-1。同樣地,使用實施例1-2至實施例1-21之饋入條件之處理液對上述所得之氟化物螢光體芯粒子進行表面處理,分別獲得實施例1-2至實施例1-21之氟化物螢光體。 Each treatment liquid was prepared under the feeding conditions of the composition shown in Table 1. For example, Example 1-1 in Table 1 is prepared by adding 0.26 g of cerium nitrate 6 hydrate (La(NO 3 ) 3 .6H 2 O) (0.006 mol in terms of La) to 100 ml of pure water, and then A treatment liquid was prepared by adding 3.4 g of a 30% aqueous solution of H 2 O 2 as a reducing agent and stirring. Next, 10 g of the above-obtained fluoride phosphor core particles were added, and the mixture was stirred at room temperature for 1 hour. Subsequently, the surface-treated phosphor was separated by filtration, washed with isopropyl alcohol several times, and dried at 100 ° C for 1 hour to obtain a fluoride phosphor of the present invention having fluorinated ruthenium on the surface. The obtained fluoride phosphor was designated as Example 1-1. Similarly, the fluoride phosphor core particles obtained above were subjected to surface treatment using the treatment liquids of the feeding conditions of Examples 1-2 to 1-21 to obtain Examples 1-2 to 1-21, respectively. Fluoride phosphor.

為比較用,將未處理之氟化物螢光體芯粒子作為比較 例1,將以相當於專利文獻3之實施例1之處理液之條件進行相同之表面處理獲得之氟化物螢光體作為比較例2。 For comparison, untreated fluoride phosphor core particles were compared In Example 1, a fluoride phosphor obtained by the same surface treatment as that of the treatment liquid of Example 1 of Patent Document 3 was used as Comparative Example 2.

接著,調查各氟化物螢光體試料之發光亮度特性。以發光波峰波長460nm之LED藍光激發,以亮度計(型號:LS-110 KONICA MINOLTA製)測定其發光亮 度,且以色彩亮度計(型號:CS-100A,KONICA MINOLTA製)測定發光色度x、y。此時,各亮度計之前段部分設置濾除500nm以下之波長之銳截濾光片(sharp cut filter)(型號:Y-50,HOYA CANDEO OPTRONICS公司製),去除激發光的藍光之影響。將比較例1設為100以相對亮度表示所得發光亮度,且與發光色度一起示於表2。 Next, the luminance characteristics of the respective fluoride phosphor samples were examined. It is excited by LED blue light having an emission peak wavelength of 460 nm, and its luminance is measured by a luminance meter (Model: LS-110 KONICA MINOLTA) The illuminance chromaticity x, y was measured by a color luminance meter (model: CS-100A, manufactured by KONICA MINOLTA). At this time, a sharp cut filter (Model: Y-50, manufactured by HOYA CANDEO OPTRONICS Co., Ltd.) which filters out wavelengths of 500 nm or less is provided in the front portion of each luminance meter to remove the influence of blue light of the excitation light. Comparative Example 1 was set to 100 to show the obtained light-emitting luminance with respect to the lightness, and is shown in Table 2 together with the light-emitting color.

接著,進行各氟化物螢光體試料之耐水性試驗。將氟化物螢光體2g倒入純水10ml中,混合後靜置1小時後,藉過濾分離回收,以異丙醇洗淨,且在100℃乾燥1小時。耐水試驗後之各試料之發光亮度與發光色度、及耐水性試驗前後之亮度維持率一起示於表2。 Next, the water resistance test of each fluoride phosphor sample was performed. 2 g of the fluoride phosphor was poured into 10 ml of pure water, and after allowing to stand for 1 hour, it was separated by filtration, washed with isopropyl alcohol, and dried at 100 ° C for 1 hour. The luminescent brightness of each sample after the water resistance test is shown in Table 2 together with the luminescent chromaticity and the brightness maintenance rate before and after the water resistance test.

由表2所示之結果,可知與比較例1及2比較,實施例1-1至實施例1-21之耐水性試驗後之亮度維持率為同等或提高至其以上。尤其使用鑭、鈰、鐠、銪、釓、鏑、鎦之稀土類元素時,顯示較佳之亮度維持率。 From the results shown in Table 2, it was found that the brightness maintenance ratios after the water resistance tests of Examples 1-1 to 1-21 were the same as or higher than those of Comparative Examples 1 and 2. In particular, when a rare earth element of ruthenium, osmium, iridium, osmium, iridium, osmium or iridium is used, a preferable brightness maintenance ratio is exhibited.

接著,針對改變處理液中之乙酸鑭濃度之實施例1-3、實施例1-5、實施例1-7及未處理之比較例1, 以X射線繞射裝置(型號:XRD-6100島津製作所製),使用Cu燈管進行粉末X射線繞射分析。其結果的粉末X射線繞射圖形示於圖1。圖1中之三角標記係表示ICDD#00-032-0483之LaF3之波峰位置。未處理之比較例1並無LaF3之波峰,可知與乙酸鑭濃度成比例顯示。由該圖1可了解實施例1-3、實施例1-5及實施例1-7之存在於氟化物螢光體表面之物質為LaF3Next, with respect to Example 1-3, Example 1-5, Example 1-7, and Untreated Comparative Example 1 in which the concentration of barium acetate in the treatment liquid was changed, an X-ray diffraction device (Model: XRD-6100 Shimadzu) was used. Prepared by the manufacturer, powder X-ray diffraction analysis was performed using a Cu tube. The resulting powder X-ray diffraction pattern is shown in Fig. 1. The triangular mark in Fig. 1 indicates the peak position of LaF 3 of ICDD #00-032-0483. The untreated Comparative Example 1 did not have a peak of LaF 3 and was found to be proportional to the concentration of cerium acetate. It can be understood from Fig. 1 that the substances present on the surface of the fluoride phosphor of Examples 1-3, 1-5 and Examples 1-7 are LaF 3 .

又,針對實施例1-5亦以EPMA實施元素映射。結果,試料表面確認有鑭元素之存在。 Further, element mapping is also performed in EPMA for Embodiments 1-5. As a result, the surface of the sample confirmed the presence of a lanthanum element.

如上述,本發明之氟化物螢光體由於於螢光體粒子之表面具有稀土類元素氟化合物,故能耐水性提高之紅色發光氟化物螢光體者。 As described above, the fluoride phosphor of the present invention has a rare earth element fluorine compound on the surface of the phosphor particles, so that the red light-emitting fluoride phosphor having improved water resistance can be used.

〔產業上之可利用性〕 [Industrial Applicability]

本發明之氟化物螢光體主要可利用作為光源用之波長轉換材料,但由於具有高的色純度,且發光波峰之半值寬窄,進而耐久性高,故尤其適用於液晶顯示器用之背光用途之光源用之螢光體。且本發明之半導體發光裝置由於具有高的色純度,且發光波峰之半值寬窄,進而長期安定性優異,故可適用於液晶顯示器用之背光用途之光源。 The fluoride phosphor of the present invention can be mainly used as a wavelength conversion material for a light source, but is particularly suitable for use in backlights for liquid crystal displays because of its high color purity, wide half-value of light-emitting peaks, and high durability. A phosphor for a light source. Further, since the semiconductor light-emitting device of the present invention has high color purity, and has a half-value width of a light-emitting peak, and is excellent in long-term stability, it can be applied to a light source for backlight use for liquid crystal displays.

Claims (5)

一種氟化物螢光體,其特徵係在以通式A2MF6:Mn表示之氟化物粒子之表面上至少具有稀土類元素氟化合物,其中稀土類元素氟化合物係由鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、銩(Tm)、鐿(Yb)及鎦(Lu)選出之至少一種稀土類元素之氟化合物,(式中,M為由矽(Si)、鈦(Ti)及鍺(Ge)選出之至少一種金屬元素,A為由鈉(Na)及鉀(K)選出之至少一種鹼金屬元素)。 A fluoride phosphor characterized by having at least a rare earth element fluorine compound on a surface of a fluoride particle represented by the general formula A 2 MF 6 : Mn, wherein the rare earth element fluorine compound is made of lanthanum (La) or lanthanum (Ce), 鐠 (Pr), 钕 (Nd), 钐 (Sm), 铕 (Eu), 釓 (Gd), 鋱 (Tb), 镝 (Dy), 鈥 (Ho), 銩 (Tm), 镱a fluorine compound of at least one rare earth element selected from (Yb) and lanthanum (Lu), wherein M is at least one metal element selected from the group consisting of yttrium (Si), titanium (Ti), and yttrium (Ge), and A is At least one alkali metal element selected from sodium (Na) and potassium (K). 如請求項1之氟化物螢光體,其中稀土類元素氟化合物係由氟化鑭(LaF3)、氟化鈰(CeF3)、氟化鐠(PrF3)、氟化釹(NdF3)、氟化釤(SmF3)、氟化銪(EuF3)、氟化釓(GdF3)、氟化鋱(TbF3)、氟化鏑(DyF3)、氟化鈥(HoF3)、氟化銩(TmF3)、氟化鐿(YbF3)及氟化鎦(LuF3)選出之至少一種。 The fluoride phosphor of claim 1, wherein the rare earth element fluorine compound is lanthanum fluoride (LaF 3 ), cesium fluoride (CeF 3 ), strontium fluoride (PrF 3 ), cesium fluoride (NdF 3 ) , samarium fluoride (SmF 3), europium fluoride (EuF 3), gadolinium fluoride (GdF 3), terbium fluoride (TbF 3), dysprosium fluoride (DyF 3), holmium fluoride (HoF 3), fluorine At least one selected from the group consisting of ruthenium (TmF 3 ), yttrium fluoride (YbF 3 ), and lanthanum fluoride (LuF 3 ). 一種氟化物螢光體之製造方法,其包含使以通式A2MF6:Mn表示之氟化物粒子與含稀土類元素離子之溶液及還原劑接觸,而於前述氟化物粒子之表面形成稀土類元素氟化合物之步驟,(式中,M為由矽(Si)、鈦(Ti)及鍺(Ge)選出之至少一種金屬元素,A為由鈉(Na)及鉀(K)選出之至少一種鹼金屬元素)。 A method for producing a fluoride phosphor comprising contacting a fluoride particle represented by the general formula A 2 MF 6 : Mn with a solution containing a rare earth element ion and a reducing agent to form a rare earth on the surface of the fluoride particle a step of classifying a fluorine compound, wherein M is at least one metal element selected from the group consisting of cerium (Si), titanium (Ti), and cerium (Ge), and A is at least selected from sodium (Na) and potassium (K). An alkali metal element). 如請求項3之氟化物螢光體之製造方法,其中稀土類元素離子包含由鑭(La)、鈰(Ce)、鐠(Pr)、釹(Nd)、釤(Sm)、銪(Eu)、釓(Gd)、鋱(Tb)、鏑(Dy)、鈥(Ho)、銩(Tm)、鐿(Yb)及鎦(Lu)選出之至少一種稀土類元素之離子。 The method for producing a fluoride phosphor according to claim 3, wherein the rare earth element ion comprises lanthanum (La), cerium (Ce), praseodymium (Pr), cerium (Nd), cerium (Sm), cerium (Eu). Ions of at least one rare earth element selected from the group consisting of Gd, Tb, Dy, Ho, Tm, Yb, and Lu. 一種半導體發光裝置,其特徵係至少具備半導體發光元件、如請求項1至2中任一項之氟化物螢光體或以如請求項3或4之製造方法獲得之氟化物螢光體。 A semiconductor light-emitting device characterized by comprising at least a semiconductor light-emitting element, a fluoride phosphor according to any one of claims 1 to 2, or a fluoride phosphor obtained by the production method of claim 3 or 4.
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