TWI652155B - Substrate, method for making the same, and housing having the same - Google Patents

Abstract

A method for processing a surface of a substrate, comprising the steps of: providing a mold comprising at least one molding surface, each molding surface being a non-smooth surface having a plurality of microstructures; and placing a substrate to be formed having defects on the surface Inside the mold, the surface of the substrate having the defect is opposed to one of the molding faces of the mold; and molding the substrate to transfer the microstructure on the molding surface to the substrate having defects a surface, and at least a portion of the microstructure overlaps the defect location. The invention also provides a substrate and a housing made from the substrate.

Description

Substrate and surface processing method thereof, and obtained shell

The present invention relates to a substrate and a method of processing the same, and a housing made of the substrate.

In the manufacturing process of a molding die such as a hot press forming die or a press forming die, it is usually necessary to grind the molding face of the die to a smooth state so that the substrate can form a smooth surface after molding. However, due to environmental dust or substrate characteristics, etc., it is easy to cause defects (such as pitting, cracks, etc.) on the surface of the substrate. Even if the molding surface of the mold is ground to a smooth state, the substrate cannot be guaranteed due to the presence of surface defects. A smooth surface is formed after molding. Thus, the use of such a substrate to prepare an outer casing of an electronic device will undoubtedly affect the appearance of the electronic device to a large extent.

In view of the above, it is necessary to provide a method for processing a substrate and a substrate surface, which can solve the above problems.

In addition, it is also necessary to provide a casing made of the above substrate.

The invention provides a method for processing a surface of a substrate, comprising the steps of: providing a mold comprising at least one molding surface, each molding surface being a non-smooth surface having a plurality of microstructures; and a molding base having defects on the surface a material placed in the mold, and the surface of the substrate having the defect is opposite to one of the molding surfaces of the mold; and molding the substrate to transfer the microstructure on the molding surface to the substrate A surface having a defect, and at least a portion of the microstructure overlaps the defect location.

The present invention also provides a substrate comprising at least one surface having defects, each surface further comprising a plurality of microstructures, and at least a portion of the microstructures overlapping the defect locations.

The present invention also provides a housing comprising a substrate, the substrate comprising at least one surface having defects, each surface further comprising a plurality of microstructures, and at least a portion of the microstructures and the defect locations overlapping.

Compared with the prior art, the surface processing method of the substrate of the present invention transfers the microstructure on the molding surface of the mold to the surface of the substrate having defects, so that the surface of the substrate having defects has a certain roughness, and therefore, Light will scatter on the surface so that the human eye cannot recognize the defects that the surface has.

S1~S4‧‧‧ substrate surface processing method

1 is a flow chart of a method for processing a surface of a substrate according to a preferred embodiment of the present invention.

Referring to FIG. 1 , a preferred embodiment of the present invention provides a method for processing a surface of a substrate, which includes the following steps:

Step S1: providing a mold comprising at least one molding surface, each molding surface being a non-smooth surface having a plurality of microstructures. The material of the mold may be selected from at least one of hexagonal boron nitride (HBN), cerium oxide (SiO2), aluminum oxide (Al2O3), and hexagonal layer carbon. In this embodiment, the microstructure on the molding surface can be obtained by processing the grinding rod, and the fineness of the grinding rod is changed according to the microstructure required on the surface of the substrate to be molded. Preferably, the grinding rod is The nuance is 400~800 mesh. More specifically, the material of the grinding rod may be selected from one of stainless steel, tungsten carbide, iron, and diamond.

Step S2: placing a substrate to be molded having a defect on the surface in the mold, and making the surface of the substrate having the defect opposite to one of the molding faces of the mold. The material of the substrate may be selected from at least one of glass, plastic, iron, stainless steel, aluminum, and magnesium aluminum alloy. The defects may be scratches, cracks, pitting, bubbles, and the like. The defect may be originally carried by the substrate, or may be formed during processing of the substrate.

In this embodiment, the surface of the substrate having defects includes a front surface of the substrate and a reverse surface corresponding to the front surface. Correspondingly, the mold includes two molding surfaces such that when the substrate is placed in the mold The front side and the back side of the substrate may be opposite to the two forming faces, respectively.

Step S3: molding the substrate such that the microstructure on the molding surface is transferred to the surface of the substrate having defects, and at least a portion of the microstructure overlaps the defect position. In the present embodiment, the surface roughness Rz of the substrate having defects and microstructures is 0.2 to 15 μm. In this embodiment, the The microstructure is distributed over the entire surface of the substrate that has defects. The substrate can be formed by hot press forming, press forming, or vacuum assisted molding.

It can be understood that since the microstructure on the molding surface is transferred to the surface of the substrate having defects, the surface of the substrate having defects has a certain roughness. Therefore, light will scatter on the surface, making it impossible for the human eye to recognize the defects that the surface has.

In this embodiment, the substrate surface processing method further includes the following steps:

Step S4: Subsequent processing is performed on the substrate on which the microstructure is formed. Wherein, the subsequent processing may include at least one of filming, printing, spraying, gluing, and surface strengthening. The surface strengthening may be surface heat treatment or surface chemical treatment or the like.

The present invention also provides a substrate prepared by the above-described substrate surface processing method, which can be applied to an electronic device (such as a smart phone or a tablet computer) or a housing of an in-vehicle electronic product. The substrate includes at least one surface having a defect. Each surface also includes a plurality of microstructures, and at least a portion of the microstructures overlap the defect locations. Wherein, the microstructure may be a plurality of prisms protruding from a surface of the substrate having defects or recessed relative to the surface.

It is to be understood by those skilled in the art that the above embodiments are only intended to illustrate the invention, and are not intended to limit the invention, as long as the scope of the invention is Changes and modifications are intended to fall within the scope of the invention.

Claims (10)

A method for processing a surface of a substrate, comprising the steps of: providing a mold comprising at least one molding surface, each molding surface being a non-smooth surface having a plurality of microstructures; and placing a substrate to be formed having defects on the surface Inside the mold, the surface of the substrate having the defect is opposed to one of the molding faces of the mold; and molding the substrate to transfer the microstructure on the molding surface to the substrate having defects a surface, and at least a portion of the microstructure overlaps the location of the defect on the surface. The method for processing a surface of a substrate according to claim 1, further comprising: performing subsequent processing on the substrate on which the microstructure is formed. The method of processing a substrate surface according to claim 2, wherein the subsequent processing comprises at least one of filming, printing, spraying, gluing, and surface strengthening. The substrate surface processing method according to claim 1, wherein the material of the mold is at least one selected from the group consisting of hexagonal boron nitride, cerium oxide, aluminum oxide, and hexagonal layer carbon. The method for processing a surface of a substrate according to claim 1, wherein the microstructure on the molding surface is obtained by processing a polishing rod, and the fineness of the polishing rod is 400 to 800 mesh. The substrate surface processing method according to claim 5, wherein the surface roughness Rz of the substrate having defects and microstructures is 0.2 to 15 μm. The method for processing a surface of a substrate according to claim 1, wherein the material of the substrate is at least one selected from the group consisting of glass, plastic, iron, stainless steel, aluminum, and magnesium alloy. The method of processing a substrate surface according to claim 1, wherein the surface of the substrate having a defect comprises a front surface of the substrate and a reverse surface corresponding to the front surface, the mold comprising two molding surfaces, such that When the substrate is placed in the mold, the front and back sides of the substrate are opposed to the two molding faces, respectively. A substrate comprising at least one surface having defects, each surface further comprising a plurality of microstructures, and at least a portion of the microstructures overlapping the locations of the defects on the surface. A housing comprising a substrate, wherein the substrate comprises at least one surface having defects, each surface further comprising a plurality of microstructures, and at least a portion of the microstructures and the defects are The positions on the surface overlap.