TWI650851B - Wafer level optical module and manufacturing method thereof - Google Patents

Abstract

A method for manufacturing a plurality of optical modules, each optical module including a first optical element (C1) and a second optical element (C2), the method includes the following steps a) providing a first substrate wafer (S1) A plurality of first optical elements (C1) exist on the top side of the first substrate wafer; b) providing a second substrate wafer (S2) having a material region, the material region is a continuously laterally defined region, and the first The materials of the two substrates exist in the material region, wherein a plurality of second optical elements (C2) exist in the material region; c) the lateral alignment of the first substrate wafer (S1) and the second substrate wafer (S2) is achieved , So that each first optical element (C1) exists in a laterally defined area that does not overlap the material area; d) interconnect the first substrate wafer and the second substrate wafer in a state of lateral alignment so that The top side of the first substrate wafer faces the first The bottom side of the two substrate wafer, and there is no further wafer between the first substrate wafer and the second substrate wafer.

In this way, the first and second optical elements may be placed particularly close to each other.

Description

Wafer-level optical module and manufacturing method thereof

The invention relates to the field of optical devices, and more precisely to the field of manufacture of optical or optoelectronic elements. More specifically, the present invention relates to an optical module, especially an opto-electronic module, and a manufacturing method thereof, and a wafer stack and a device including the module, and to the method and the module. usage of. The invention relates to an open clause method and device according to the scope of patent application.

Noun definition

"Active optical element": a light sensing or light emitting element. For example, photodiodes, image sensors, LEDs, OLEDs, and laser chips. Active optical elements may exist as a bare die or in a package, that is, as a packaged element.

"Passive optical element": An optical element that redirects light by refraction and / or diffraction and / or (internal and / or external) reflections, such as a lens, chirp, mirror, or optical system, where, The optical system is an optical element that may include mechanical elements such as an aperture stop, an image screen, and a stand. set.

"Photoelectric module": a component in which at least one active and at least one passive optical element are included.

"Copy": A technique by which a given structure or its negatives are reproduced. For example, etching, embossing (imprinting), casting, and molding.

"Wafer": An object that is generally dish-shaped or sheet-shaped, which extends in one direction (z direction or vertical direction or stacking direction) compared to its extension in the other two directions (x and y directions or lateral directions) ) Is small. Generally speaking, on a wafer, a plurality of similar structures or objects can be arranged or arranged therein, usually on a rectangular grid. The wafer may have openings or holes, and the wafer may even be free of material in a major portion of its lateral area. Wafers can have any lateral shape, with circles and rectangles being very common. Although in many cases wafers are understood to be made primarily of semiconductor materials, this is clearly not a limitation in this patent application. Accordingly, a wafer may be mainly made of, for example, a semiconductor material, a polymer material, a composite material including a metal and a polymer, or a polymer and a glass material. In particular, hardenable materials, such as thermal or ultraviolet curable polymers, are wafer materials of interest for use with the present invention.

"Horizontal": Refer to "Wafer".

"Vertical": Refer to "Wafer".

"Light": mostly electromagnetic radiation; especially infrared, visible, or ultraviolet light in the electromagnetic spectrum Part of electromagnetic radiation.

In WO 2013/010284 A2, an optical module and a manufacturing method thereof are presented. Inside the optical module, light travels substantially along a vertical path, that is, along the stacking direction of the substrates contained in the module. Accordingly, the optical elements existing in the module are vertically aligned.

From US 8 045 159 B2, optical devices are known, in which light travels along an angled path.

One of the objectives of the present invention is to create a new method for manufacturing an optical module, especially a wafer-level optical module. In addition, corresponding optical modules and wafer stacks should be provided with the use of devices and methods that include optical modules.

Another object of the present invention is to provide an optical module that is extremely small.

Another object of the present invention is to provide a method for mass-producing optical modules with particularly high accuracy, especially with particularly high lateral positioning accuracy.

Another object of the present invention is to provide a method for manufacturing optical modules in large quantities with a particularly high yield.

Another object of the present invention is to provide a method that makes it possible for the optical elements of the optical module to be positioned particularly close to each other.

Further objects are presented from the following examples and descriptions.

At least one of these aims is achieved, at least in part, by a device and method according to the scope of the present patent application.

In wafer-level manufacturing of optical modules, in most cases an optical path that travels vertically is provided, that is, along the stacking direction, and accordingly, for each module, the optical components are routed along The vertical lines are arranged one after the other. However, it may also be provided that the optical path travels in the module along an optical path that is inclined (at least partially) relative to the vertical direction.

Especially in the latter case, the two optical elements (first and second optical elements) of each module may have to be positioned in different regions in the lateral direction, and this may be achieved by making two optical elements (each Modules) exist on the same wafer (after singulation, and finally on the same substrate) to achieve. However, for example, considering the positioning tolerances (especially the lateral positioning tolerances) and / or the applied manufacturing method and / or if the optical elements should be particularly close to each other (laterally), the inventors believe that it is possible to do so Disadvantageous. Therefore, they believe that it is possible to distribute the first and second optical elements in such a manner that the first optical element exists on the first wafer and the second optical element exists on the second wafer or in the second wafer.

For example, in the case where each optical module should include a passive optical element as a second optical element, these elements can be manufactured very efficiently by wafer-level replication, especially by copying the passive optical element to the wafer On the wafer, they should remain inside the final optical module. Embossing can be a particularly suitable way to accomplish reproduction; using relief, all second optical elements to be placed on a wafer or a wafer can be manufactured in a single relief process. However, in order to achieve particularly small An optical module or a specific optical path (for example, an optical path or a section of an optical path encloses a relatively small non-zero angle with respect to the vertical direction) must be between the first and second optical elements in an optical module Provides a specific minimum lateral distance. This may be mainly the case, for example, because in order to make a second optical element by copying on a wafer on which the first optical element already exists, a preset minimum distance to the first optical element must be adhered to, and / Or the preset height restrictions for the first optical element must be observed. Conversely, in the case where the second optical element is manufactured by copying on the wafer before the first optical element exists on the wafer, a preset minimum distance to the second optical element must be observed in order to Place or make a first optical element on a circle.

When the first optical element exists on the first wafer and the second optical element exists on the second wafer, especially before the first and second wafers are interconnected, such problems can be solved or at least alleviated. . This can be achieved by placing pre-manufactured optical elements on individual wafers or by fabricating optical elements directly on individual wafers, for example, by copying, or by interacting with individual crystals. The optical elements are manufactured together (for example, using molding techniques).

In addition, it may be preferable to avoid conditions necessary for the first optical element to be used to process the second optical element (e.g., for attaching the second optical element to a wafer, or for use on a second wafer Or the conditions required to manufacture the second optical element with the second wafer), or to avoid the conditions required for the first optical element to be used to process the second wafer (e.g., to attach another wafer to Conditions required for the second wafer). And, conversely, it may be better to prevent the second optical element from being used for corresponding processing of the first optical element Conditions for the first wafer or first wafer. Corresponding processing steps may include the application of heat and / or the application of radiation like UV radiation.

Also in this case, it is possible to set the first and second wafers such that the first wafer carries the first optical element and the second wafer carries the second optical element, and the wafer is manufactured after that Stack to avoid potential problems.

Such first and second wafers are separately prepared in advance, and then, for example, by adhering them to each other through an adhesive (for example, epoxy resin), or by providing a form fit, for example, Snap fit while being interconnected. Generally, it will be provided that the top side of the first wafer not only faces the bottom side of the second wafer, but also that they can be as close to each other as possible due to the interconnection method. The top side of the first wafer usually faces the bottom side of the second wafer, and there may be no other components between them except the adhesive.

The advantage of providing a first wafer with a first optical element and independently providing a second wafer with a second optical element is that an improved yield can be obtained during the manufacturing process of the optical device. More specifically, the first and / or second wafer may be inspected or inspected before the first and second wafers are interconnected, and only predetermined (preset) parameters have been reached, that is, have sufficient Quality (e.g., exhibiting appropriate optical characteristics), such first and / or second wafers can be used. And, it may additionally or alternatively be provided that the second optical element is inspected or inspected before the first and second wafers are interconnected, and the first optical element is only mounted or manufactured on the first wafer Among the specific locations, this specific location is selected based on the results of inspection or inspection. example For example, the result of the inspection or inspection may be an indicator of these specific optical modules (or more specifically, the lateral position of these optical modules), which is applied to one or more first The two optical elements (that is, the second optical element is included in each optical module) reach a predetermined (preset) parameter, and the first optical element is attached to the first optical element only at a position associated with these specific optical modules. A wafer may be fabricated on the first wafer.

Furthermore, one or more conductor paths may exist on the top side or the top side of the first substrate, especially in a laterally defined area where the second optical element is present in the optical module. Since it may be difficult to use replication to create optical elements on a substrate with a conductor path, the provision of a second substrate may be advantageous, especially if the duplicated second optical element is present at the second substrate wafer or the second substrate On the wafer.

In specific applications, the first optical element is an active optical element, and the second optical element is a passive optical element. In this case, because the first wafer will typically be provided with electrical connections that extend vertically across it and may be, for example, a printed circuit board, and the second wafer typically does not require such characteristics and may be, for example, mainly composed of Glass or polymer wafers. The first and second wafers are usually different types of wafers.

The second wafer has many openings, such as through holes, to provide the space required for the first optical element when interconnecting the first and second wafers. When the first and second wafers are interconnected, the first optical element protrudes into or through the opening. Generally speaking, no material of the second wafer is present in a laterally defined area in which the first optical element is positioned. And usually, there is no An optical element that is present in or integrated with the second wafer exists in a laterally defined area in which the first optical element is positioned.

However, it may be provided that more optical elements (different from the first optical element) present on the first wafer are positioned in the laterally defined area in which the second optical element is positioned, especially in the first When the two optical elements are transmission optical elements. But this need not be the case and is only an option, and in particular, such more optical elements usually do not protrude from the top surface of the first wafer. They are integrated into or present on the first wafer and / or present on or attached to the bottom side of the first wafer (the bottom side is opposite to the top side).

The optical module may additionally include a third substrate and a spacer, and the spacer may be integrated into or separated from the third substrate. And according to this, for manufacturing, a third wafer, especially a third substrate wafer, will be provided, and a (separated) spacer wafer is also selectively provided. The spacer wafer (we will be referred to as the first spacer wafer) interconnects the third substrate wafer with the first and / or second wafer, and by this distance wafer, the third substrate wafer and the first and / or second wafers are interconnected. / Or The distance between the second wafers is determined. Now, we should more specifically refer to the first and second wafers as the first and second substrate wafers.

In many cases, a third optical element, such as a passive optical element, may be present on a third substrate wafer, for example, integrated into a third substrate wafer or attached to a third substrate wafer. Especially in this case, but also in other cases, the second optical element may be a reflective optical element.

The first and second substrate wafers are typically interconnected before the third substrate wafer is connected. However, it is also possible to interconnect the first, second and third substrate wafers simultaneously.

Also, there may be another wafer called a second spacer wafer, so that another wafer (second spacer) exists in each optical module. The second spacer wafer is continuous with the second substrate wafer, for example, is manufactured in the same process (such as a molding process), or is attached to the second spacer wafer, especially to The top side of the second spacer wafer. Spacers are not usually set to define the distance between two wafers (such as the first spacer is usually), but they are set to define or control the optical path in each optical module. For example, acts as one or more masks, baffles, or apertures.

As already indicated previously, the use of the two (directly) attached substrates or substrate wafers illustrated may make it possible to position the first and second optical elements particularly close to each other (in the lateral direction). In particular, they can be positioned closer together than if they might be on a single wafer, and / or compared to if the first and / or second optical components were possible before interconnecting the wafers. The fact that they are not present on the respective wafers or on the respective wafers may cause them to be positioned closer together.

Prior to interconnecting the wafers, it is also possible to remove (eg, cut away) portions of the material that are continuous with the corresponding first or (more specifically) second optical element. Such a material may be, for example, a material that is unavoidably manufactured when manufacturing individual optical elements (for example, using replication technology). This material removal can be achieved in a same process by removing material from the corresponding wafer, especially by removing material from the corresponding wafer to create an opening in the corresponding wafer. As such, this enables it to have first and second optical elements positioned particularly close to each other.

Yet another way to achieve the (laterally) close positions of the first and second optical elements is to construct a second substrate such that it provides undercuts above the top side of the first substrate (when the first and second substrates are Even time).

In addition, in order to have first and second optical elements that are particularly close to each other (usually in pairs), there should be no further objects between the corresponding first and second optical elements, such as those of optical modules Further components. In particular, in the space between the corresponding first and second optical elements, there should not be an optical element of the optical module and a component different from the substrate of the first and second substrates.

The characteristics of this method are as follows, among which various embodiments and improvements are also explained.

A method for manufacturing a plurality of optical modules, each optical module includes first and second optical elements, wherein the method includes the following steps a) providing a first substrate wafer, a plurality of first optical elements exist On the top side of the first substrate wafer; b) providing a second substrate wafer having a material region, the material region being a continuously laterally defined region in which the material of the second substrate exists, wherein a plurality of A second optical element is present in the material region; c) achieving lateral alignment of the first and second substrate wafers such that each first optical element is present in a laterally defined region that does not overlap the material region; d) Interconnect the first and second substrate wafers in a laterally aligned state so that the top side of the first substrate wafer faces the second substrate wafer Bottom side without further wafers between them.

As already explained above, this method can achieve various possible advantages and effects, especially by allowing the optical elements to exist on separate wafers before interconnecting the wafers.

It may be provided that no optical elements are present outside the material region on the second substrate wafer, more specifically: no optical elements are integrated into, or attached to, or, for example, mounted to, outside the material region The second substrate wafer.

Usually provided is a first optical element protruding from the top side.

Generally speaking, the first and second optical elements exist in (and contribute to) the optical path in the respective optical module, and the optical path usually includes at least one section inclined with respect to the vertical direction, especially among them The first and second optical elements exist in (and contribute to) the same such optical path in the respective optical module. However, the first and second optical elements may exist in different optical paths in the optical module.

A material area is a "continuous" laterally defined area, which means that it is a complete or single area and is not two or more separate (not interconnected) laterally defined areas.

Generally, the first optical element is nominally the same part.

In general, the second optical element is nominally the same part.

The method may include one or both of the following steps a1) providing a first substrate wafer having a plurality of first optical elements, for example, by manufacturing a plurality of first optical elements together with the first substrate wafer, Or make multiple on the first substrate wafer A first optical element, or attaching a plurality of first optical elements to a first substrate wafer; and b1) providing a second substrate wafer having a plurality of second optical elements, for example, by communicating with the first substrate wafer The plurality of second optical elements are manufactured together, or the plurality of second optical elements are manufactured on the first substrate wafer, or the plurality of second optical elements are attached to the first substrate wafer.

In one embodiment, the first optical element protrudes from the top side of the first substrate wafer beyond the top side of the second substrate wafer. In other words, the first optical element extends to a vertical height above the second substrate wafer.

In one embodiment, the second substrate wafer includes a plurality of open regions, which are laterally defined regions in which no material of the second substrate exists, and wherein each first optical element exists in these open regions. In one of the zones.

In general, each open area is laterally surrounded by a material area.

In an embodiment, the first optical element is respectively positioned laterally in one of the plurality of first regions, and the second optical element is positioned laterally in one of the plurality of second regions, respectively, wherein , No first region overlaps any second region. And more specifically, the optical element attached to or integrated into the second substrate wafer does not exist in one of these first regions.

In one embodiment, the second substrate wafer constitutes an integrally formed component. It may even be provided that the second substrate wafer and the second optical element together form a unitary component, for example, containing one or more compounds or A component consisting essentially of one or more polymers. This may be achieved, for example, by manufacturing both the second substrate wafer and the second optical element (e.g., by molding) in a replication process.

In one embodiment, the second substrate wafer and the plurality of protrusions protruding in a direction opposite to the direction from the bottom side of the second substrate wafer to the top side of the first substrate wafer are continuous (or Integrally formed).

These protrusions can act as spacers and usually exist in a laterally defined area, and this area does not overlap the laterally defined area in which the second optical element exists.

However, separate spacer wafers can also be provided.

In one embodiment, the method includes the following step g) providing a third substrate wafer, wherein a plurality of third optical elements are present on the third substrate wafer or the third substrate wafer, and / or the third substrate crystal The circle includes a plurality of laterally defined transparent regions; and h) a third substrate wafer is connected to the first substrate wafer and / or the second substrate wafer via a wafer called a first spacer wafer such that the second The substrate wafer is arranged between the first substrate wafer and the third substrate wafer, wherein the first spacer wafer and the third spacer wafer are selectively continuous (or integrally formed); wherein, the steps h) is performed after or simultaneously with step d).

In this case, the first spacer wafer is typically arranged between the first substrate wafer and the third substrate wafer, and may be more specifically arranged on the second substrate wafer. Between the plate wafer and the third substrate wafer.

The first spacer wafer may be continuous with the third substrate wafer, especially they may be continuous (constituting an integrally formed component), but it is also possible to provide the first spacer wafer and the third substrate wafer as separate components. , Especially separate components that have not been interconnected before step h) (but interconnects were established during step h)).

In one embodiment, the first optical element is an active optical element, and the second optical element is a passive optical element. In such a "hybrid" package or "hybrid" optical module (which also constitutes a photovoltaic module), the first substrate wafer is generally a printed circuit board, especially a type of print with electrical connections extending vertically across it Circuit board.

In one embodiment, the method includes the following steps: r) Copying the second optical element on the second substrate wafer.

The replication technology may enable the simultaneous creation of a plurality of optical elements on one wafer, for example, the simultaneous creation of all the second optical elements of the plurality of second optical elements on a second substrate wafer. This can be achieved using a single copy tool.

With step r), the second optical element can be simultaneously manufactured on or attached to the second substrate wafer, especially the top side of the second substrate wafer.

In general, step r) is performed before steps c) and d).

In one embodiment, the method includes the step of attaching a second optical element to a second substrate wafer. This can be achieved, for example, using pick and place in particular. The second optical element is usually attached to the top side of the second substrate wafer in this case.

Not only can the second optical element be mounted to the substrate wafer (for example, using a pick-and-place method), but the first optical element can also be attached to the first substrate wafer in this manner.

As already pointed out previously, this method may make it possible to have optical elements that are positioned (laterally) closer than in other cases. In the following, "other cases" are expressed in a more detailed manner, that is, by referring (trying) an alternative method of manufacturing such an optical module and the space requirements of the manufacturing process used.

In one embodiment, one of the first optical elements is manufactured together with the first substrate wafer in the first specific position and direction using the first process, or is fabricated on the first substrate wafer, or is Attach to the first substrate wafer, and one of the second optical elements is manufactured together with the second substrate wafer using the second process in the second specific position and direction, or is manufactured on the second substrate wafer On or attached to the second substrate wafer, and the first and second specific locations are laterally spaced very close to each other. The first and second processes create the first substrate wafer and the second substrate wafer. Space requirements after interconnection between circles, excluding at least one of the following conditions-using the first process in the first specific position and direction to manufacture one of the first optical elements together with the first substrate wafer, or the first One of the first optical elements is manufactured on the substrate wafer, or one of the first optical elements is attached to the first substrate wafer, and at the same time, the two processes and the second process are used in the second specific position and direction. Substrate wafer together manufacturing second One of the optical element, or on the second substrate producing wafer One of the second optical elements, or one of the second optical elements is attached to the second substrate wafer;-first manufactured together with the first substrate wafer in a first specific position and orientation using a first process One of the first optical elements, or one of the first optical elements manufactured on the first substrate wafer, or one of the first optical elements attached to the first substrate wafer, and then, in In the second specific position and direction, two processes are used to manufacture one of the second optical elements together with the second substrate wafer, or one of the second optical elements is manufactured on the second substrate wafer, or the second optical element is manufactured. One of the elements is attached to the second substrate wafer;-one of the second optical elements is manufactured together with the second substrate wafer using the two processes in the second specific position and direction, or the second substrate is crystallized Manufacture one of the second optical elements on the circle, or attach one of the second optical elements to the second substrate wafer, and then use the first process and the first substrate in the first specific position and direction Wafer manufacturing first light together One of the first optical element, one of the first optical element manufactured on the first substrate wafer, or one of the first optical element attached to the first substrate wafer.

In an oriented attempt to express this embodiment, it can be said that if a corresponding process is used, that is, tools, materials, and process parameters, the first and second optical elements are positioned (laterally) fairly close , So that until the corresponding optical element exists or is located thereon, The first and second substrate wafers can be interconnected. It is not excluded that different processes may be used to achieve this operation; but such different processes may be more time consuming, more expensive, or more complex, for example, processes with smaller tolerances.

The impossibility illustrated is due to the space requirements of the process. The process for creating or attaching an optical element has space requirements, that is, there must be a preset free space in the area where the element is created or attached, for example, for use by the tools used. For example, the first process may require so much space in the area of the first optical element that this space overlaps with the space occupied by the second optical element. And / or, conversely, the second process may require such a large space in the area of the second optical element, and this space overlaps with the space occupied by the first optical element.

The above-mentioned interconnection is established in a case where there are no first optical elements and / or a plurality of second optical elements existing on the first and second spacer wafers or the first and second spacer wafers, respectively; However, it may be achieved by other methods similar to those described in step d), especially with the top side of the first substrate wafer facing the bottom side of the second substrate wafer, and between the first substrate wafer and the second substrate wafer. There are no further wafers between the substrate wafers. In particular, the above-mentioned interconnections are established to occur when no first optical elements and / or second optical elements exist on the first and second spacer wafers or the first and second spacer wafers, respectively. Case.

As already pointed out previously, this method makes it possible to have the first and second optical elements positioned (laterally) closer to each other than in other cases. Here, the "other situation" is changed in other ways in the following Show in detail, that is, an alternative method of manufacturing similar optical modules (with first and second optical elements that exist on the same wafer or on the same wafer) by reference (try) , And reference to the space requirements of the manufacturing process used.

In one embodiment, one of the first optical elements is manufactured together with the first substrate wafer in the first specific position and direction using the first process, or is fabricated on the first substrate wafer, or is Attach to the first substrate wafer, and one of the second optical elements is manufactured together with the second substrate wafer using the second process in the second specific position and direction, or is manufactured on the second substrate wafer On or attached to the second substrate wafer, and wherein the first and second specific locations are laterally spaced very close to each other, the space requirements of the first and second processes exclude at least one of the following conditions-in One of the first optical element is manufactured in a position and direction corresponding to the first specific position and direction using a first process together with a single substrate wafer, or the first optical element is manufactured on the single substrate wafer One of the first optical elements, or one of the first optical elements is attached to the one single substrate wafer, and at the same time, the two processes and the one single To manufacture one of the second optical elements together, or to manufacture one of the second optical elements on the single substrate wafer, or to attach one of the second optical elements to the one A single substrate wafer;-first at a position and direction corresponding to the first specific position and direction In the first process, one of the first optical elements is manufactured together with a single substrate wafer, or one of the first optical elements is manufactured on the single substrate wafer. One of them is attached to the one single substrate wafer, and then, the second optical element is manufactured together with the one single substrate wafer using two processes in a position and direction corresponding to the second specific position and direction. One of them, or manufacturing one of the second optical elements on the single substrate wafer, or attaching one of the second optical elements to the single substrate wafer; One of the two positions and directions uses two processes to manufacture one of the second optical elements together with a single substrate wafer or one of the second optical elements on the single substrate wafer. Or attach one of the second optical elements to the single substrate wafer and then use the first system in a position and direction corresponding to the first specific position and direction Manufacturing one of the first optical elements with the single substrate wafer, or manufacturing one of the first optical elements on the single substrate wafer, or attaching one of the first optical elements To the single substrate wafer.

In an oriented attempt to express this embodiment, it can be said that if a corresponding process is used, that is, tools, materials, and process parameters, the first and second optical elements are positioned (laterally) fairly close , And even It is impossible to fabricate them on a single substrate wafer. It is not excluded that different processes may be used to achieve this operation; but such different processes may be more time consuming, more expensive, or more complex, for example, processes with smaller tolerances. This single substrate wafer is, to some extent, basically a reference for comparison reasons. It could, for example, be imagined as a (flat on both sides) wafer, and the optical element would be represented at the same distance in the lateral direction as it would on the first and second spacer wafers (and corresponding Location) and the same direction exist on a single wafer or on a single wafer. However, in order to enable the optical element to exist in the manner described above, if possible, one or more different processes will be necessary.

Regarding the impossibility of the space requirements attributable to the process, the same applies as described above.

In an embodiment, the lateral distance between a specific one of the plurality of first optical elements and a specific one of the plurality of second optical elements is less than 800 micrometers. In particular, one of the following situations applies :-The specific first optical element and the specific second optical element are both active optical elements, and wherein the lateral distance is less than 800 microns, especially less than 400 microns;-the specific first optical element and The specific second optical element is a duplicated passive optical element, and wherein the lateral distance is less than 800 microns, especially less than 500 microns;-the specific first optical element is an active optical element, and the specific The second optical element is a duplicated passive optical element, And, the lateral distance is less than 800 microns, especially less than 600 microns, and even less than 350 microns.

The method related to the first and second substrate wafers makes it possible to bring the first and second optical elements closer to 1 mm, for example, in wafer-level mass manufacturing, closer to 300 microns.

Distance is usually referred to as the (closest) edge-to-edge distance.

Active optical elements can be placed on a wafer, for example, using a pick-and-place method.

Replicated optical elements are manufactured using replication techniques (eg, molding or embossing).

In one embodiment, the second optical element is a duplicated optical element, and each second optical element is integrally formed with a surrounding portion that at least partially surrounds the corresponding optical element. In the process of manufacturing the corresponding second optical element Each surrounding portion is manufactured in the same copying process as applied. The method includes the following steps m) creating a plurality of openings in the second substrate wafer; wherein, by performing step m), each surrounding portion At least a portion of the part was removed.

In particular, the reproduced optical element may be a lens element.

It can be provided that all the second optical elements and all the surrounding parts are manufactured using a same replication process, for example, in a relief process.

In particular, the laterally defined areas mentioned in step c) Creating the opening, or the lateral extension of the opening, includes the laterally defined area mentioned in step c). In particular, the lateral extension of the opening may coincide with the aforementioned open area.

The method may include the step of manufacturing a second optical element using a replication technique. All the second optical elements and all the surrounding parts can be manufactured using a same replication process.

Step m) for this example is implemented using at least one of laser cutting, machining, micromachining, and drilling.

It may be provided that the section along the line that creates the opening (and which defines the opening) passes through the surrounding portion.

It should be noted that the “integrated” part (the whole part) can also be described as a continuous (complete) part, and a part made of the same material at least at its abutment.

The presence of the surrounding part can be attributed in particular to the manner in which the second optical element is manufactured, for example, when a replication process like a relief process is used to manufacture the second optical element.

In an optical module, the surrounding portion usually does not have or at least does not have the required optical functions.

In this embodiment (including step m)), the opening in the second substrate wafer is usually formed when the second optical element is built on the second substrate wafer, or is attached to the second substrate wafer, or located on the second substrate wafer. Two substrate wafers were created later.

However, in general, it is optionally provided that the second optical element is built on the second substrate wafer or attached to the second substrate wafer only after the opening in the second substrate wafer is created, Or located on the second substrate wafer.

In one embodiment, the conductor path exists on the top side of the first substrate wafer in the material region. More specifically, the conductor path may exist in a laterally defined area occupied by the second optical element.

This usually means the situation after step d), or the lateral alignment mentioned in step d).

Since replication on a conductor path may cause difficulties, this embodiment may be advantageous particularly if the second optical element is a duplicated optical element.

In an embodiment, in the lateral alignment mentioned in step d), the space between the first and second optical elements of the same optical module does not have any further parts or components of the optical module, at least A portion that is selectively present away from the second substrate wafer and / or an adhesive that is selectively present on the top side of the first substrate wafer.

In this way, the first and second optical elements can generally be positioned closer to each other than if some objects exist between the first and second optical elements.

In particular, it may be provided that there are no further optical elements between the first and second optical elements of the same optical module.

It may also be provided that between the first and second optical elements of the same optical module (in the space), there is no portion where there are more wafers.

In one embodiment, the second substrate wafer has a profile including a cutting line inclined with respect to a vertical direction.

In particular, it can be provided that the second substrate wafer and the first substrate crystal Undercuts are created between the top and side of the circle.

The vertical direction refers to a vertical direction defined by the second substrate.

The profile (in a plane containing a vertical plane) may be such that the lower edge (which is closer to the first substrate wafer and located on the bottom side of the second substrate wafer) than the upper edge (on the top side of the second substrate wafer) ) Protrudes less into the opening in the second substrate wafer.

This may make it possible to position the first and second optical elements very close to each other.

A singulation step (or dicing step) can be performed to obtain a separate (single) optical module from the wafer stack.

The purpose is to use the method described herein (refer to the above description in particular), to reduce the lateral distance between the first and second optical elements of an identical optical module, or to make an identical The lateral distance between the first and second optical elements of the optical module is less than using only a single wafer (on this single wafer, the first and second optical elements exist due to the corresponding process and are located in the corresponding Location and direction).

In other words, with the use of two substrate wafers, especially as described above, the optical elements can be (horizontally) as close to each other as possible, as if only on a single wafer (instead of the proposed two interconnected crystals) Circle) (provided no other techniques for attaching or manufacturing optical components are used on a single wafer).

Therefore, the method described can be used to achieve that the first and second optical elements of an identical optical module are positioned with a particularly small mutual distance, that is, less than that in a single wafer Used for first and second The distance that can be achieved in the case of both optical elements.

In addition, this distance may be smaller than that after the first and second substrate wafers are interconnected (refer to step d) above), the first and second optical elements are manufactured together with the first and second substrate wafers, respectively. , Or the distances in the case of being manufactured on the first and second substrate wafers, or being attached to the first and second substrate wafers, respectively.

The invention also includes an optical module.

The optical module includes-a first substrate having a top side on which the first optical element is present;-a second substrate having a bottom side; wherein the first substrate and the second substrate are interconnected such that the top of the first substrate The side faces the bottom side of the second substrate, and the second substrate is stacked on the first substrate in a direction called a vertical direction; wherein the second substrate has a material region in which the material of the second substrate exists And a second optical element exists in the material region; and-at least one open region is a laterally defined region in which no material of the second substrate exists; wherein the first optical element is Positioned laterally in the open area.

"Landscape" refers to the direction perpendicular to the vertical direction.

The second substrate is shaped in particular laterally to leave an open space for the first optical element.

The material region and the open region are generally used to complement the lateral region occupied by the first substrate and / or to complement the lateral region occupied by the optical module.

Generally, the second substrate has no more than a single continuous material region.

Generally, the second optical element is present on the second substrate, for example, on or in the second substrate. For example, the second optical element is mounted on a top side of the second substrate, wherein the top side is opposite to the bottom side of the second substrate; or, the second optical element is integrated into or attached to the second substrate, such as Is at least partially vertically positioned between the top and bottom sides of the second substrate.

The interconnection between the first substrate and the second substrate may be achieved, for example, by gluing or by providing a form-fitting connection.

In an embodiment, the first optical element is positioned laterally in the first region, and the second optical element is positioned laterally in the second region, wherein the first region and the second region do not overlap.

In an embodiment, the optical module further includes a third substrate and a first spacer, wherein the first spacer exists between the first substrate and the third substrate, and more specifically exists between the second substrate and the third substrate. Between, and wherein, the first spacer is selectively continuous with the third substrate, for example, integrally formed with the third substrate.

In an embodiment, the optical module includes a second spacer extending from a top side of the second substrate opposite to a bottom side of the second substrate to pointing toward the first substrate from a bottom side of the second substrate. In the direction of the top-side direction, wherein the second spacer is selectively continuous with the second substrate, In particular, it is formed integrally with the second substrate.

In one of the embodiments highlighted with reference to the last two, the second spacer is spaced a distance from the third substrate.

In an embodiment, no part or component of the optical module exists between the first and second optical elements, at least away from the selectively existing part of the second substrate, and / or away from the first selectively existing part. Adhesive on the top side of the substrate.

More specifically, it can be provided that no parts or components of the module exist between the first and second optical elements on the top side of the first substrate or on the top side of the second substrate; likewise except that it is possible to choose Except for adhesives that are present sexually.

The top side of the second substrate is opposite to the bottom side of the second substrate.

Similarly, it can also be said that there is no part or component of the optical module in the space between the first and second optical elements, except for the part or adhesive that may be used for the second substrate, in particular, the first and second In this space between the two optical elements, there are no optical module parts or components on the top side of the first substrate and the top side of the second substrate, except for the part or adhesive that may be used for the second substrate.

In particular, the “part or component of an optical module” described above may represent a part of a substrate of an optical module and / or another optical element of the optical module. The possibility that a possible adhesive is present between the first and second optical elements is not excluded.

The present invention also includes an optical module having the features of the corresponding method according to the present invention, and conversely, the present invention also includes a corresponding Method of optical module characteristics.

The present invention also includes wafer stacking. On the one hand, the wafer stack includes a plurality of optical modules according to the present invention; on the other hand: the wafer stack includes-a first substrate wafer, and a plurality of first optical elements exist in the first On the top side of the substrate wafer;-a second substrate wafer having a material region which is a continuously laterally defined region in which the material of the second substrate is present, wherein a plurality of second optical elements are present in this material Region; wherein the top side of the first substrate wafer faces the bottom side of the second substrate wafer, and there are no other wafers therebetween, and wherein each of the first optical elements exists in a region that does not overlap the material In a laterally defined area.

The invention also includes a wafer stack, which has the features of the corresponding method or the optical module according to the invention, and conversely, the invention also includes a method and the optical module, which have the features of the corresponding wafer stack according to the invention.

Further, the present invention includes a device including an optical module according to the present invention or an optical module manufactured using the method according to the present invention.

In one embodiment, the device further includes a printed circuit board, and the optical module is mounted on the printed circuit board.

In particular, the device may be at least one of the following:-a portable or mobile computing device;-a smartphone;-a tablet computer;-a digital reader; -Camera;-Digital camera;-Game controller;-Sensing device;-Sensor.

Further embodiments and advantages are presented from the dependent items and drawings of the patent application scope.

50‧‧‧ opening

55‧‧‧ opening

60‧‧‧surrounding

70‧‧‧cut line

77‧‧‧ Undercut

81‧‧‧Pick and place tools

82‧‧‧ Copy Tool

C1‧‧‧optical element

C1’‧‧‧Optical Element

C2‧‧‧optical element

C3‧‧‧optical element

C3’‧‧‧Optical element

d‧‧‧horizontal distance

M‧‧‧ Optical Module

P1‧‧‧spaced wafer

S1‧‧‧First substrate wafer

S2‧‧‧Second substrate wafer

S2’‧‧‧ mother material

S3‧‧‧ substrate wafer

Sx‧‧‧ Wafer

t1‧‧‧Transparent Department

t2‧‧‧Transparent Department

tx‧‧‧Transparent Department

W‧‧‧ Wafer Stack

Hereinafter, the present invention will be described in detail with examples and drawings included. The drawing schematically shows: FIG. 1 is a top view of a detail of a wafer stack including first and second substrate wafers; FIG. 2 is a side view of a portion of an optical module obtainable from the wafer stack of FIG. 1; 3 is a cross-sectional view of a portion of an optical module that can be obtained from the wafer stack of FIG. 1; FIG. 4 is a side view of the optical module that can be obtained from a wafer stack including the wafer stack of FIG. 1; A cross-sectional view of an optical module that can be obtained from a wafer stack including the wafer stack of FIG. 1; FIG. 6 is a top view of a detail of a wafer stack including first and second substrate wafers; Of the optical module obtained by stacking the wafers FIG. 8 is a side view of an optical module obtainable from a wafer stack including the wafer stack of FIG. 6; FIG. 9 is a view of an optical module obtainable from a wafer stack including the wafer stack of FIG. 6; Side view; FIG. 10 is a top view of a detail of a wafer stack including first and second substrate wafers; FIG. 11 is a side view of a portion of an optical module that can be obtained from the wafer stack of FIG. 10; Fig. 13 is a side view of an optical module obtained from a wafer stack including the wafer stack of Fig. 10; Fig. 13 is a side view of an optical module obtained from a wafer stack including the wafer stack of Fig. 10; A cross-sectional view of a portion of an optical module of a first and second substrate; FIG. 15 is a cross-sectional view of a portion of an optical module including a first and second substrate; FIG. 16 is an optical module including a first and second substrate 17 is a plan view of a portion of an optical module used to display space requirements; FIG. 18 is a cross-sectional view of a portion of a wafer stack used to display space requirements; and FIG. 19 is used to display space requirements. Cross section of a wafer stack FIG. 20 is a cross-sectional view of a portion of a wafer stack used to show space requirements; FIG. 21 is a cross-sectional view of a portion of a base material of a second substrate wafer having a second optical element manufactured thereon; 22 is a cross-sectional view of a portion of the second substrate wafer of FIG. 21 having a second optical element thereon, and is used to show the creation of an opening and a portion of a surrounding portion where the second optical element is removed at the same time; 22 is a sectional view of a portion of an optical module of a portion of a second substrate wafer on which a second optical element is manufactured; FIG. 24 is a sectional view of a portion of an optical module of a second substrate having an undercut groove Figures; the illustrated embodiments are for illustration only and should not limit the invention.

FIG. 1 schematically shows a top view of a detail of a wafer stack W including a first substrate wafer S1 and a second substrate wafer S2. FIG. 2 is a schematic side view of a portion of the optical module M that can be obtained from the wafer stack of FIG. 1. 3 is a schematic cross-sectional view of a portion of an optical module M that can be obtained from the wafer stack of FIG. 1. The approximate position of the cross section is indicated in FIG. 1 by dashed and hollow arrows.

The external arrows in Figures 1, 6, and 10 indicate the separation line, also known as the dicing line, which is also shown in the drawings.

The wafer portion in the optical module obtained by separating and stacking the wafers is referred to the number of each wafer. These wafer portions are also referred to as a substrate (in the case of a substrate wafer) or as a spacer (in the case of a spacer wafer).

On the wafer S1, there is an optical element C1, and on the wafer S2, there is an optical element C2. The wafers S1 and S2 are interconnected by, for example, attaching them to each other (for example, using an adhesive). The top surface of the wafer S1 faces the bottom surface of the wafer S2, and in the case shown, even contacts the bottom surface of the wafer S2, wherein an adhesive may exist between the wafer S1 and the wafer S2. In order to provide a space for the optical element C1, an opening 50 (especially, a through hole) is provided in the wafer S2. The optical element C1 (or at least a portion thereof) is laterally surrounded by the material of the wafer S2. The optical element C1 projects into the opening 50.

The wafers S1 and S2 may be individually manufactured, and before forming the wafer stack W including the wafers S1 and S2, respective optical elements C1 and C2 may be provided on the wafers S1 and S2, respectively.

FIG. 4 is a schematic side view of an optical module M obtainable from a wafer stack including the wafer stack W of FIG. 1. FIG. 5 is a schematic cross-sectional view of the optical module M of FIG. 4. In this case, before the wafer stack is separated into a plurality of optical modules M, two further wafers, that is, another substrate wafer S3 and a spacer wafer P1, are set (and stacked on the wafer S1). , S2). The substrate S3 generally includes at least one optical element C3, and in the examples of FIGS. 4 and 5, the substrate S3 includes two optical elements C3, C3 '.

The spacer wafer P1 extends vertically from the wafer S2 (more precisely, from the top side of the wafer S2) to the wafer S3 (more precisely, to the bottom side of the wafer S3), and thus defines the wafer S2 and The vertical distance between the wafers S3, wherein an adhesive may also be present.

Further, the spacer wafer P1 has an opening 55, or more specifically, a through hole, and an optical element C2 is present therein. More specifically, the optical element C2 (or at least a portion thereof) is laterally surrounded by the spacer wafer P1. An optical element C3 'is also present in the opening 55.

The optical path of the folded light can be defined by the optical elements C1, C2, C3, C3 '.

The optical element C1 may be, for example, a light detector such as a photodiode, or an image sensor.

The optical element C2 may be, for example, a mirror or a grating.

The optical element C3 may be, for example, a lens or a lens element.

The optical element C3 'may be, for example, a curved mirror or a curved grating.

It may be provided that no optical element exists on the side of one of these wafers, and this side is the outside of the optical module after being separated into a single optical module. In particular, for example, in the examples of FIGS. 4 and 5, the top side of the topmost wafer and the bottom side of the bottommost wafer of the wafers S1 and S3 may not have optical elements, respectively. For example, referring to FIGS. 4 and 5, the optical element C3 may be completely absent or may be disposed in the opening 55. Such an optical module may be particularly robust.

It should be noted that it can be provided that the housing of the optical module M is mainly or even completely established by the section of the wafer of the module, for example, By the substrate and / or spacer of the module. Such an optical module can be further hermetically sealed.

In the examples of FIGS. 4 and 5, the housing is substantially established by the sections of the wafers S1, S2, S3 and P1.

As shown in the examples of FIGS. 1 to 5, it can be provided that the wafer S2 extends through all the cutting lines and / or has an opening 5 (or an opening portion) only outside the separation line. For example, wafer S2 has openings only for optical elements existing on wafer S1, and these openings completely surround these optical elements laterally (such as optical element C1 in FIG. 1), especially in each optical module M.

Such a substrate S2 may have relatively high mechanical stability, but it includes a relatively large amount of material.

FIGS. 6 and 7 and FIGS. 10 and 11 show examples of the substrate wafer S2, which occupy a relatively small amount of space laterally and include a relatively small amount of material (compared to the example of FIG. 1).

FIG. 6 is a schematic top plan view of details of a wafer stack W including first and second substrate wafers S1, S2. FIG. 7 is a side view of a portion of the optical module M that can be obtained from the wafer stack of FIG. 6.

Compared to only one opening 50 per optical element, the wafer S2 of FIG. 6 has more openings. And only one of the openings 50 surrounds the optical element C1 and is not completely surrounded but only partially surrounded.

8 and 9 are schematic side views of an optical module obtainable from an optical stack including the optical stack of FIG. 6. Similar to the situation shown in FIG. 4, a spacer wafer P1 and a third substrate wafer S3 are provided.

Similar to the situation of FIG. 4, the spacer wafer P1 may be located on the substrate wafer S2 and extended to the wafer S3. However, considering the shape of the substrate S2, referring to FIG. 6, it may result in low mechanical stability. Therefore, the spacer wafer P1 is reliably on both the wafer S1 and the wafer S2, as shown in FIG. 8, or the spacer wafer P1 can only rest on the wafer S1, as shown in FIG.

FIG. 10 is a schematic top plan view of details of a wafer stack W including first and second substrate wafers S1, S2. FIG. 11 is a side view of a portion of an optical module that can be obtained from the wafer stack of FIG. 10.

12 and 13 are schematic side views of an optical module that can be obtained from an optical stack including the optical stack of FIG. 10. Similar to the situation shown in FIG. 4 and FIGS. 8 and 9, a spacer wafer P1 and a third substrate wafer S3 are provided.

Similar to the situation of FIG. 4, the spacer wafer P1 may be located on the substrate wafer S2 and extended to the wafer S3. However, considering the shape of the substrate S2, referring to FIG. 10, low mechanical stability may be caused. Therefore, the spacer wafer P1 is reliably on both the wafer S1 and the wafer S2, as shown in FIG. 12, or the spacer wafer P1 can only rest on the wafer S1 as shown in FIG.

14 to 16 schematically show cross-sectional views of portions of an optical module including first and second substrates S1, S2. These drawings should mainly show the different types and positions (positioning) of the optical elements C1, C2, and other possible features. The described features and characteristics may be applied or provided independently, that is, they do not necessarily have to be combined in the manner shown.

FIG. 14 shows the optical element C2 integrated into the substrate S2. Also shown is an optical element C2 present between the top and bottom surfaces of the substrate S2. In addition, FIG. 14 shows an example of the reflective optical element C2, which is, for example, Curved mirror.

In addition, FIG. 14 shows the optical element C1 extending or protruding through the opening 50 in the substrate S2.

FIG. 15 shows an example of the transmission optical element C1. The display optical element C1 is an example of a passive optical element (such as a displayed lens element).

In addition, FIG. 15 shows an example in which the substrate S1 has a transparent portion t1. The transparent portion t1 may be an opening or made of a transparent solid material such as glass or a transparent polymer.

FIG. 16 shows an example in which the substrate S1 has a transparent portion t1 and the wafer S2 has a transparent portion t2 aligned laterally.

FIG. 16 also shows an example of the transmission optical element C2. And it shows that the optical element C2 is an example of a passive optical element like a displayed lens element.

In addition, FIG. 16 shows an example of the possibility of providing another optical element C1 'on the substrate S1, especially on its bottom side.

FIG. 17 is a schematic top view of a part of an optical module for displaying space requirements. The second optical element C2 has a lateral distance d to the first optical element C1. By first providing first and second substrate wafers S1, S2 having first and second optical elements C1, C2, respectively, and then interconnecting the first and second substrate wafers S1, S2, the distance d can be achieved , Which is smaller than that when the first and / or second optical elements are manufactured with the respective wafers after the interconnecting wafers S1, S2, or are manufactured on the respective wafers, or are attached to the respective wafers The achievable distance. And, it is possible to achieve distance The distance d is smaller than the distance that can be achieved if the first and second optical elements are manufactured together with a single wafer, or are manufactured on a single wafer, or are attached to a single wafer.

This can be attributed to the space requirements of the process used. In FIG. 17, the dotted circles around the optical elements C1 and C2, respectively, very schematically illustrate such a space requirement, or more precisely, the lateral elements under such a space requirement. Space requirements may have a variety of three-dimensional shapes, for example, may be different sizes in different lateral directions, and may be different in different vertical planes.

The space requirements may be attributable, for example, to the tolerances of the individual processes and to the space occupied by the tools used in the individual processes.

The fact that the circles overlap in FIG. 17 indicates that when the wafers are interconnected, it is impossible to simultaneously place the optical elements C1 and C2 on their respective substrate wafers S1, S2. The fact that the circles overlap in FIG. 17 may be further regarded as an indication that the optical elements C1 and C2 cannot be arranged on a single substrate wafer at the same time.

18 to 20 are schematic cross-sectional views of a portion of a wafer stack W for explaining space requirements.

In FIGS. 18 to 20, it is assumed that a plurality of optical elements C1 are placed on a respective substrate wafer (S1 in FIG. 18 and FIG. 20 and Sx in FIG. 19) using a pick-and-place machine. On the respective substrate wafers (S2 in FIG. 18 and FIG. 20, Sx in FIG. 19), a plurality of optical elements C2 are manufactured using a replication technique (called embossing). The pick and place tool is shown as a dashed line with the number 81, and the copy tool is It is drawn in thin lines and labeled 82.

18 to 20 show continuous second optical elements C2 and a surrounding portion 60 that surrounds each second optical element C2 laterally. This surrounding portion 60 may be attributed to the manner in which the second optical element is manufactured, as can be inferred from the exemplary situation shown in FIGS. 18 to 20. The lateral distance d between the optical elements C1 and C2 is illustrated in FIGS. 18 to 20. In FIGS. 18 to 20, the provision of the surrounding portion 60 is optional, while in FIGS. 21 to 23 (refer to the following cases), it is not.

As is clear from FIG. 18, the tools 81 and 82 cannot be used simultaneously (on the interconnected wafers S1, S2). The space occupied by the tools 81 and 82 will overlap, making simultaneous use impossible. As can also be seen in FIG. 18, after the substrate wafer S1 has been interconnected to the wafer S2 and has been provided with the first optical element C1, it is impossible to use the tool 82. The space required by the tool 81 overlaps with the space occupied by the optical element C1, and is therefore impossible.

However, after the wafers S1 and S2 have been interconnected and the wafer S2 has been provided with the optical element C2, it is still possible to use the tool 81 to set the substrate S1 with the optical element C1. However, process tolerance (not shown in Figure 18) may also make this approach impossible.

However, it is possible to provide the wafer S1 with the optical element C1 and the wafer S2 with the optical element C2 first, and then interconnect the wafers to establish the illustrated wafer stack W.

FIG. 19 illustrates the use of a single (virtual-like) wafer referred to as Sx when explaining the proximity or distance of an optical element. Makes sense. The wafer Sx includes a transparent portion tx.

In the case where the first plan was to position the first and second optical elements C1 and C2 on a single wafer such as the illustrated wafer Sx, at least the optical element C1 shown in FIG. 19 In the case where the optical element C2 will be attached to the wafer Sx before it is processed, this issue may become impossible (provided that there is a process for optical elements)-among which process tolerances may also make this This treatment is impossible.

As is clear from Fig. 19, the "collision" between the tool 82 and the optical element C1 will preclude the case where the substrate Sx having the optical element C1 is first provided and then provided with the optical element C2. It is also impossible to provide a wafer Sx including both the optical elements C1 and C2.

Before interconnecting the wafers S1 and S2, using two initially separated wafers S1 and S2 provided with respective optical elements C1 and C2 can solve this problem, as can be inferred from FIG. 18.

FIG. 20 illustrates a possibility provided when wafers S1 and S2 are interconnected only after wafers S1 and S2 have been provided with respective optical elements C1 and C2 in a manner similar to FIG. 18.

In the example of FIG. 20, it is clear that it is not possible to set individual optical elements C1 and C2 to the wafer stack W including the wafers S1 and S2 or to set individual optical elements on the wafer stack W including the wafers S1 and S2 Element C1, C2.

Moreover, it is also impossible to set the optical element C1 after the optical element C2 has been set and the wafer stack W including the wafers S1 and S2 has been established. This is apparent from the fact that the tool 81 shown in FIG. 20 overlaps the optical element C2.

Even in the case shown in FIG. 20, the space occupied by the optical elements C1, C2 and the space occupied by the tools 81, 82 obviously do not exclude the reproduction of the optical element C2 (including its surroundings) on the wafer stack 60) possibility, in which the spacer C1 has been provided by the optical element C1, but it can be taken for granted that the wafer S2 is provided with the process tolerance of the replication process of the optical component C2 (not shown in FIG. 20) ) Also excludes this treatment.

However, the proposed processing method of interconnecting the wafers S1, S2 only after the optical elements C1, C2 have been placed on their respective wafers makes it possible to successfully manufacture the illustrated wafer stack (and Finally comes from the optical module of this wafer stack).

FIG. 21 is a schematic cross-sectional view of a portion of a precursor S2 'of a second substrate wafer having a second optical element S2 thereon. The second optical element C2 is continuous with the surrounding portion 60 that surrounds the second optical element C2 laterally. The surrounding portion 60 is not any optical element or at least does not have a required optical function.

As shown in FIG. 18, the surrounding portion 60 may be generated from the manner in which the optical element C2 is manufactured.

Since the surrounding portion 60 is exempt, it can be removed at least partially. This can allow positioning of the optical elements C1, C2 particularly close to each other laterally is possible.

The vertical dashed line in FIG. 21 shows that the material is simultaneously removed from the surrounding portion 60 and from the base material S2 ', for example, by cutting or laser cutting.

While the opening 50 is established in the base material S2 ', the surrounding portion may be At least a part of 60 is removed to obtain a substrate S2 as shown in FIG. 22.

With the opening 50 created in the substrate wafer S2, the wafer stack W can be formed by interconnecting the wafer S2 with the wafer S1 on which the optical element C1 exists. FIG. 23 is a schematic cross-sectional view of a portion of an optical module (ie, a portion of a wafer stack W) including a portion of a second substrate wafer S2 on which the second optical element C2 shown in FIG. 22 is manufactured.

FIG. 24 is a schematic cross-sectional view of a portion of an optical module having a second substrate S2 that establishes an undercut 77. As shown in the figure, the cutting line 70 visible in the outline may originate from the opening 50 created in the substrate wafer S2 and have a vertical angle. Such an opening with inclined sidewalls can be manufactured using, for example, micromachining or laser cutting.

This may be particularly useful in a case where the optical element C1 is tapered (reduced) in a direction from the first substrate S1 to the second substrate S2. This may be the case, for example, if the optical element C1 is manufactured using a replication technique as described above and / or has a surrounding portion 60 ′.

The provision of such undercut grooves 77 and / or corresponding cutting lines 70 may make it possible to have optical elements that are particularly close to each other (laterally).

It should be noted that in order to make the arrangement of the first and second optical elements as close to each other as possible, the space between the adjacent first and second optical elements of the optical module is empty, that is, except A part of the second substrate and / or an adhesive may exist beyond this, and there are no further parts or components of the optical module, as is the case in most of the illustrated examples. However, where the first and second optical elements may be sufficiently far apart, It is provided that another optical element, a part of another substrate, or a spacer of the optical module may exist in a space between adjacent first and second optical elements of the optical module.

Claims (35)

A method for manufacturing a plurality of optical modules, each of which includes a first optical element and a second optical element, the method includes the following steps: a) providing a first substrate wafer, a plurality of the first Optical elements are present on the top side of the first substrate wafer, wherein each of the first optical elements includes a photodetector; b) a second substrate wafer having a material region, the material region being continuous laterally A defined area in which the material of the second substrate wafer exists in the material area, wherein a plurality of the second optical elements exist in the material area, wherein each of the second optical elements includes a mirror or a grating; c) Achieving lateral alignment of the first substrate wafer and the second substrate wafer, so that each of the first optical elements exists in a laterally defined area that does not overlap the material area; d) in the laterally aligned state The first substrate wafer and the second substrate wafer are interconnected so that the top side surface of the first substrate wafer faces the bottom side of the second substrate wafer, and the first substrate wafer and the second substrate wafer Second substrate crystal No further wafer between. For example, the method of claim 1 in the patent scope, wherein the second substrate wafer includes a plurality of open areas, and the open areas are laterally defined areas in which the material of the second substrate wafer does not exist, and wherein Each of the first optical elements exists in one of the open areas. For example, the method of claiming a patent scope item 1, wherein each of the first optical elements is laterally positioned in one of the plurality of first regions, and each of the second optical elements is Positioned laterally within one of the plurality of second regions, wherein the first regions do not overlap with any of the second regions. The method of claim 1, wherein the second substrate wafer constitutes an integrally formed component. The method of claim 1, wherein the second substrate wafer has a plurality of protrusions continuously, and the plurality of protrusions are opposite to the first substrate wafer from the bottom side toward the first substrate wafer. The substrate wafer protrudes in a direction in which the top side is directed. For example, the method of claim 1 includes the following steps: e) providing a wafer as a second spacer wafer; and f) interconnecting the second substrate wafer with the second spacer wafer; wherein, step f) is performed before step d), during step d), or after step d), and after step d), the second substrate wafer is arranged between the first substrate wafer and the Between the second wafers. For example, the method of claim 1 includes the following step g) providing a third substrate wafer, wherein a plurality of third optical elements are present on or on the third substrate wafer, and / or the third substrate The wafer includes a plurality of laterally defined transparent regions; and h) connecting the third substrate wafer to the first substrate wafer and / or the second substrate wafer via a wafer called a first spacer wafer So that the second substrate wafer is arranged between the first substrate wafer and the third substrate wafer, wherein the first spacer wafer and the third substrate wafer are selectively continuous; wherein Step h) is performed after step d) or simultaneously with step d). The method according to item 7 of the patent application, wherein, after step h), the second substrate wafer exists between the first substrate wafer and the first spacer wafer, and wherein the first spacer wafer The circle extends vertically from the second substrate wafer to the third substrate wafer, so that the vertical distance between the second substrate wafer and the third substrate wafer is vertically extended by the first spaced wafer. Define. For example, the method of claim 1 in the patent scope, wherein the first optical elements are active optical elements, and the second optical elements are passive optical elements. For example, the method of applying for the first item of the patent scope includes the following steps: r) Copying the second optical elements on the second substrate wafer. The method of claim 1 includes the step of attaching the second optical elements to the second substrate wafer. For example, the method of claim 1 in the patent scope, wherein one of the first optical elements is manufactured together with the first substrate wafer in the first specific position and direction using the first process, or is manufactured in The first substrate wafer is attached to or attached to the first substrate wafer, and one of the second optical elements is in a second specific position and direction using a second process and the second substrate crystal. The circles are manufactured together, or are fabricated on the second substrate wafer, or are attached to the second substrate wafer, and wherein the first specific position and the second specific position are laterally adjacent to each other very closely. Space, the first process and the second process require space after the interconnection between the first substrate wafer and the second substrate wafer is established, excluding at least one of the following situations-at the first specific location and In the direction, the first process is used to manufacture one of the first optical elements together with the first substrate wafer, or to manufacture one of the first optical elements on the first substrate wafer, or to One of the first optical elements Received the first substrate wafer, and at the same time, using the two processes in the second specific position and direction to manufacture one of the second optical elements together with the second substrate wafer, or the second optical element Manufacture one of the second optical elements on a substrate wafer or attach one of the second optical elements to the second substrate wafer;-first use in the first specific position and orientation The first process manufactures one of the first optical elements with the first substrate wafer, or manufactures one of the first optical elements on the first substrate wafer, or One of an optical element is attached to the first substrate wafer, and then, the two processes are used in the second specific position and direction to manufacture one of the second optical elements together with the second substrate wafer. One of them, or manufacturing one of the second optical elements on the second substrate wafer, or attaching one of the second optical elements to the second substrate wafer; Using the two processes and the second in a second specific position and direction Plate wafers together to manufacture one of the second optical elements, or to manufacture one of the second optical elements on the second substrate wafer, or to attach one of the second optical elements Receiving the second substrate wafer, and then using the first process in the first specific position and direction to manufacture one of the first optical elements together with the first substrate wafer or the first optical element One of the first optical elements is manufactured on a substrate wafer, or one of the first optical elements is attached to the first substrate wafer. For example, the method of claim 1 in the patent scope, wherein one of the first optical elements is manufactured together with the first substrate wafer in the first specific position and direction using the first process, or is manufactured in The first substrate wafer is attached to or attached to the first substrate wafer, and one of the second optical elements is in a second specific position and direction using a second process and the second substrate crystal. The circles are manufactured together, or are fabricated on the second substrate wafer, or are attached to the second substrate wafer, and wherein the first specific position and the second specific position are laterally adjacent to each other very closely. Separately, the space requirements of the first process and the second process exclude at least one of the following conditions-using the first process in a position and direction corresponding to the first specific position and direction to manufacture the same with a single substrate wafer Waiting for one of the first optical elements, or manufacturing one of the first optical elements on the single substrate wafer, or attaching one of the first optical elements to the single substrate Wafer and same Using one of the two processes together with the one single substrate wafer in the position and direction corresponding to the second specific position and direction to manufacture one of the second optical elements or on the single substrate wafer Manufacture one of the second optical elements or attach one of the second optical elements to the single substrate wafer;-first in a position and direction corresponding to the first specific position and direction Using the first process together with a single substrate wafer to manufacture one of the first optical elements, or manufacturing one of the first optical elements on the single substrate wafer, or One of the first optical elements is attached to the single substrate wafer, and then the two processes and the single substrate wafer are used in a position and direction corresponding to a second specific position and direction. Manufacture one of the second optical elements together, or one of the second optical elements on the single substrate wafer, or attach one of the second optical elements To receive a single substrate wafer;-first use the two processes in a position and direction corresponding to the second specific position and direction to manufacture one of the second optical elements together with a single substrate wafer, Or one of the second optical elements is manufactured on the single substrate wafer, or one of the second optical elements is attached to the single substrate wafer, and then, The first process should be used in the position and direction of the first specific position and direction to manufacture one of the first optical elements together with the single substrate wafer, or to manufacture the one on the single substrate wafer. Wait for one of the first optical elements, or attach one of the first optical elements to the single substrate wafer. For example, the method of claim 1, wherein a lateral distance between a specific one of the plurality of first optical elements and a specific one of the plurality of second optical elements is less than 800 μm. If the method according to any one of the claims 1 to 14 is applied, wherein the second optical elements are duplicate optical elements, each of which is integrally formed with a surrounding portion that at least partially surrounds the corresponding optical element, In the process of manufacturing the corresponding second optical element, each surrounding portion is manufactured in the same replication process applied. The method includes the following steps: m) creating a plurality of openings in the second substrate wafer; By performing step m), at least part of each of the surrounding portions is removed. The method of claim 1, wherein the conductor path exists in the material region on the top side of the first substrate wafer. For example, the method of claim 1 in the patent scope, wherein in the laterally aligned state, there is no further part of the optical module in the space between the first and second optical elements of the same optical module Or, at least away from the selectively existing part of the second substrate wafer and / or away from the adhesive selectively existing on the top side of the first substrate wafer. The method of claim 1, wherein the second substrate wafer has a contour, and the contour has a cutting line inclined with respect to a vertical direction of the second substrate wafer. For example, the method of the first scope of the patent application is used to reduce the lateral distance between the first and second optical elements of an identical optical module, or to achieve the first and second optics of an identical optical module. Due to the corresponding processing and the corresponding position and direction, the lateral distance between the elements is smaller than the lateral distance that can be achieved using a single substrate wafer on which the first and second optical elements exist. An optical module comprising:-a first substrate wafer having a top side on which a first optical element exists, wherein the first optical element includes a light detector;-a second substrate wafer having a bottom side; Wherein, the first substrate wafer and the second substrate wafer are interconnected such that the top side surface of the first substrate wafer faces the bottom side of the second substrate wafer, and the second substrate wafer is at It is stacked on the first substrate wafer in a direction called a vertical direction; wherein the second substrate wafer has a material region which is laterally defined in which the material of the second substrate wafer exists. Region, and the second optical element exists therein, wherein the second optical element includes a mirror or a grating; and-at least one open region, which is laterally defined without the material of the second substrate wafer present therein Area; wherein the first optical element is positioned laterally within the open area. For example, the optical module of claim 20, wherein the first optical element is positioned laterally in the first region, and the second optical element is positioned laterally in the second region, wherein the first optical element The area and the second area do not overlap. For example, the optical module of claim 20, wherein the first optical element is arranged so that it extends vertically beyond the bottom side of the second substrate wafer. For example, the optical module of claim 20, wherein the first optical element is surrounded by a boundary between the material region and the open region. For example, the optical module of the 20th patent application scope further includes a third substrate wafer and a first spacer, wherein the first spacer exists between the first substrate wafer and the third substrate wafer, And, the first spacer is selectively continuous with the third substrate wafer. For example, the optical module according to any one of claims 20 to 24 includes a second spacer, and the second spacer is from the top of the second substrate wafer opposite to the bottom side of the second substrate wafer. The side extends into a direction opposite to the direction from the bottom side of the second substrate wafer to the top side of the first substrate wafer, wherein the second spacer is selectively connected to the second substrate. The wafer is continuous. For example, the optical module of the scope of application for patent No. 25 further includes a third substrate wafer and a first spacer, wherein the first spacer exists between the first substrate wafer and the third substrate wafer, And, the first spacer is selectively continuous with the third substrate wafer, and the second spacer is spaced apart from the third substrate wafer by a distance. For example, the optical module of claim 20, wherein at least one conductor path exists on the top side of the first substrate wafer in the material region. For example, the optical module of the scope of application for patent No. 20, wherein the component or part of the optical module does not exist between the first optical element and the second optical element, at least away from the selectivity of the second substrate wafer Ground portions and / or away from adhesives that are selectively present on the top side of the first substrate wafer. For example, the optical module of claim 20, wherein the second substrate wafer is constructed by establishing an undercut groove between the second substrate wafer and the top side of the first substrate wafer. For example, the optical module according to claim 20, wherein the lateral distance between the first optical element and the second optical element is less than 800 microns. A wafer stack includes a plurality of optical modules according to any one of claims 20-30. A wafer stack includes-a first substrate wafer, a plurality of first optical elements existing on a top side of the first substrate wafer, wherein each of the first optical elements includes a light detector;-a second substrate A wafer having a material region, the material region being a continuously laterally defined region in which material of the second substrate wafer exists, wherein a plurality of second optical elements exist in the material region, each of which The two optical elements include a mirror or a grating; wherein the top side of the first substrate wafer faces the bottom side of the second substrate wafer, and there is no further distance between the first substrate wafer and the second substrate wafer. And each of the first optical elements exists in a laterally defined area that does not overlap the material area. An electronic device includes an optical module such as any one of claims 20 to 30, or an optical module manufactured by a method such as any of claims 1 to 18. For example, the electronic device under the scope of patent application 33 further includes a printed circuit board, and the optical module is mounted on the printed circuit board. For example, the electronic device under the scope of patent application No. 33, wherein the device is at least one of the following devices-portable or mobile computing devices;-smart phones;-tablet computers;-digital readers;-camera devices;- Digital cameras;-game controllers;-sensing devices;-sensors.